Workpiece Recognition System

Abstract

To accurately recognize a workpiece which is processed by a processing machine, carried out to the outside, and supported by a support part.SOLUTION: A workpiece recognition system comprises: a support part 8 which is installed on the outside of a processing machine 6, and supports a workpiece including at least one of a product Wa obtained by cutting a plate material W by the processing machine 6 and remainder materials Wb, Wc; an illumination part 52 which is installed on one side with respect to the support part 8 in the horizontal direction and irradiates the support part 8 with light; imaging parts 53A, 53B which are installed in such a posture that optical axes AX1, AX2 face the support part 8 on the side opposite to the one side with respect to the support part 8 in the horizontal direction, and capture images including the workpiece supported by the support part 8; and a recognition part 54 which recognizes the workpiece supported by the support part 8 on the basis of the images captured by the imaging parts 53A, 53B.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a workpiece recognition system. Mu Regarding. [Background technology]

[0002] There is known a processing machine that uses a laser beam to cut a plate material into workpieces such as products and leftover material. In this processing machine, after processing with the laser beam, the workpiece is carried out of the processing machine onto an external support unit, and then transported from the support unit to another location. The workpiece recognition system in Patent Document 1 uses an imaging unit to capture an image of the workpiece (product) supported on the support unit, and based on the captured image, determines the type of product that a worker picks up from the support unit and instructs the worker where to sort the product. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2020-504696 Summary of the Invention [Problem to be solved by the invention]

[0004] In the workpiece recognition system of Patent Document 1, the position of the light source is not specified, so depending on the positional relationship between the imaging unit and the light source, there is a risk that the workpiece may not be accurately recognized in the image captured by the imaging unit.

[0005] The present invention provides a workpiece recognition system capable of accurately recognizing a workpiece that has been processed by a processing machine, carried out to the outside, and supported on a support portion. M The purpose is to provide. [Means for solving the problem]

[0006] The present invention one Aspects is a workpiece recognition system.The workpiece recognition system includes a support unit that is installed outside the processing machine and supports workpieces including at least one of a product obtained by cutting a plate material by the processing machine and a remaining material. The workpiece recognition system an illumination unit that is installed on one side of the support unit in the horizontal direction and irradiates the support unit with light; The workpiece recognition system an imaging unit that is installed on the opposite side of the support unit in the horizontal direction with its optical axis facing the support unit and captures an image including the workpiece supported by the support unit; The workpiece recognition system Based on the image captured by the imaging unit, Presence or absence of leftover materials Recognize Department Prepare. The workpiece recognition system includes a cleaning unit capable of removing residual material supported by the support unit from the support unit. The imaging unit is installed so that its optical axis faces the illumination unit or the vicinity of the illumination unit in a plan view. When the recognition unit recognizes the presence of residual material, the cleaning unit removes the residual material from the support unit. [Effects of the Invention]

[0008] According to the workpiece recognition system and workpiece recognition method of the above aspects, light is irradiated onto the support from one side, and an image including the workpiece supported on the support is captured from the opposite side, so that the workpiece on the support can be captured while reducing the influence of ambient light. Also, by configuring the imaging unit and the illumination unit as separate units and installing the illumination unit on the side of the support facing the imaging unit, it is possible to capture an image of a wide range of the support in a single capture, and the workpiece can be recognized with high accuracy.

[0009] In the workpiece recognition system of the above aspect, the support unit may have a plurality of arms extending longitudinally in a plan view and arranged parallel to one another, supporting the workpiece on the plurality of arms, and the imaging unit may be installed so that its optical axis intersects the longitudinal direction of the arms in a plan view. This configuration can prevent erroneous recognition from occurring when residual material or the like that falls between the plurality of arms is photographed by the imaging unit. In the workpiece recognition system of the above aspect, the imaging unit may be installed so that its optical axis faces the illumination unit or a vicinity of the illumination unit in a plan view. This configuration can reliably capture light reflected by the surface of the workpiece from light irradiated from the illumination unit. Furthermore, in the workpiece recognition system of the above aspect, the imaging unit may be attached via an imaging unit jig, which is capable of adjusting the horizontal position of the imaging unit, the vertical position of the imaging unit, the angle of the optical axis about an axis parallel to the vertical direction, and the angle of the optical axis about an axis parallel to the horizontal direction, relative to the support unit, and the illumination unit may be attached via an illumination unit jig, which is capable of adjusting the angle about an axis parallel to the horizontal direction, relative to the support unit. With this configuration, the orientation of the optical axis of the imaging unit (the attitude of the imaging unit) can be easily adjusted by the imaging unit jig, and further, the orientation of the illumination unit (the attitude of the illumination unit) can be easily adjusted by the illumination unit jig.

[0010] The workpiece recognition system of the above aspect may further include a memory unit that stores a reference image of a support unit without a workpiece placed thereon, and the recognition unit may recognize the workpiece supported by the support unit based on the image captured by the imaging unit and the reference image. According to this configuration, the workpiece supported by the support unit can be accurately recognized by comparing the image captured by the imaging unit with the reference image. The workpiece recognition system of the above aspect may further include multiple imaging units, the memory unit storing a reference image corresponding to each of the multiple imaging units, and the recognition unit making a judgment based on the multiple images captured by each of the multiple imaging units and the reference image corresponding to each of the multiple imaging units, and integrating the judgment results to recognize the workpiece supported by the support unit. According to this configuration, the use of the images captured by the multiple imaging units and the respective reference images allows for more accurate recognition of the workpiece supported by the support unit. According to the above aspect, the recognition unit may further recognize the presence or absence of remaining material supported by the support unit based on the image captured by the imaging unit. According to this configuration, the presence or absence of remaining material on the support unit can be easily recognized. Furthermore, the workpiece recognition system of the above aspect may further include a cleaning unit capable of removing residual material supported by the support unit from the support unit, and the cleaning unit may remove the residual material from the support unit when the recognition unit recognizes the presence of the residual material. With this configuration, if any residual material remains on the support unit, the residual material can be removed.

[0011] In the workpiece recognition system of the above aspect, the recognition unit may recognize the position of the product supported on the support unit based on an image captured by the imaging unit. With this configuration, the position of the product on the support unit can be obtained by the recognition unit. In the workpiece recognition system of the above aspect, a transport unit may be provided that holds and transports the product on the support unit, and the transport unit may transport the product from the support unit based on the position of the product recognized by the recognition unit. With this configuration, the product on the support unit can be reliably transported by the transport unit. In the workpiece recognition system of the above aspect, a stocker for storing the plate materials and products may be provided, and the lighting unit may be attached to the stocker. With this configuration, the stocker can be used as a support for the lighting unit. In the workpiece recognition system of the above aspect, the imaging unit may be attached to the housing of the processing machine. With this configuration, the housing of the processing machine can be used as a support for the imaging unit. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view illustrating an example of a workpiece recognition system according to an embodiment. [Figure 2] 1 is a plan view illustrating an example of a workpiece recognition system according to an embodiment. [Figure 3] 1A and 1B show an example of a processing pallet and a lift device, in which FIG. 1A is a perspective view of a state in which a plate material is supported by the processing pallet, and FIG. 1B is a perspective view of a state in which the plate material is supported by the lift device. [Figure 4] FIG. 2 is a plan view showing the positional relationship between an illumination unit and an imaging unit. [Figure 5] FIG. 10 is a perspective view showing an example of a stocker to which an illumination unit is attached. [Figure 6] This is a view of the lighting unit and the jig for the lighting unit as seen from the +X side. [Figure 7] FIG. 10 is an enlarged view of the main part of the lighting jig as seen from the +X side. [Figure 8] This is a view of the lighting unit and the jig for the lighting unit as seen from the +Y side. [Figure 9] FIG. 10 is an enlarged view of the main part of the lighting jig as viewed from the +Y side. [Figure 10]FIG. 2 is a perspective view showing a processing machine and an imaging unit. [Figure 11] FIG. 2 is a perspective view of an imaging unit and a jig for the imaging unit. [Figure 12] FIG. 10 is a view of the imaging unit and the jig for the imaging unit as viewed from the -Y side. [Figure 13] FIG. 10 is a view of the imaging unit and the jig for the imaging unit as viewed from the +Z side. [Figure 14] (A) is a reference image corresponding to one imaging unit, and (B) is a reference image corresponding to another imaging unit. [Figure 15] (A) is an image of the lift device (support part) taken by one imaging unit, and (B) is an image of the lift device (support part) taken by another imaging unit. [Figure 16] (A) is the judgment result based on the reference image corresponding to one imaging unit and the image to be recognized as the workpiece, and (B) is the judgment result based on the reference image corresponding to another imaging unit and the image to be recognized as the workpiece. [Figure 17] FIG. 2 is a diagram illustrating an example of a cleaning unit. [Figure 18] 1 is a flowchart illustrating an example of a workpiece recognition method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the content described below. Furthermore, in order to explain the embodiments, the drawings are scaled appropriately, such as by enlarging or emphasizing certain parts, and the shape or dimensions may differ from those of the actual product. In each drawing, directions are explained using an XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is defined as the XY plane. In the XY plane, the direction in which the plate material W is conveyed from the laser processing machine 6 is referred to as the X direction, and the direction perpendicular to the X direction is referred to as the Y direction. Furthermore, the vertical direction perpendicular to the XY plane is referred to as the Z direction. The X, Y, and Z directions will be explained assuming that the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the arrow is the - direction.

[0014] Fig. 1 is a perspective view showing an example of a workpiece recognition system S according to an embodiment. Fig. 2 is a plan view showing an example of a workpiece recognition system S according to an embodiment. In this embodiment, the workpiece recognition system S is applied to a laser processing system 1. As shown in Figs. 1 and 2, the laser processing system 1 includes, in addition to the workpiece recognition system S, a stocker 2, a loader device 3, a gripper device 4, a processing pallet 5, a laser processing machine 6, a pallet changer 7, a lift device 8, and a control device 10.

[0015] The laser processing system 1 is provided with a storage area AR1 and a carry-in / out area AR2. The storage area AR1 is located on the +X side of the carry-in / out area AR2. The carry-in / out area AR2 is located on the +X side of the laser processing machine 6. The carry-in / out area AR2 is located between the laser processing machine 6 and the storage area AR1. The storage area AR1 stores, for example, plate materials W before processing and products Wa after the plate materials W have been laser processed. The plate materials W before processing are transported from the storage area AR1 to the carry-in / out area AR2. The plate materials W before processing are transported from the carry-in / out area AR2 to the laser processing machine 6, where they are laser processed by the laser processing machine 6.

[0016] The plate material W after laser processing is carried out from the laser processing machine 6 to the carry-in / out area AR2. The carry-in / out area AR2 also serves as an unloading area for unloading the product Wa from the plate material W after laser processing. In the carry-in / out area AR2, the plate material W after laser processing is separated into the product Wa and remaining materials (skeleton Wb and slag Wc). In this specification, the product Wa, skeleton Wb, and slag Wc are workpieces. The product Wa is transported to the storage area AR1, accumulated in the storage area AR1, and then carried out to the outside.

[0017] Next, each part of the laser processing system 1 will be described. The stocker 2 is arranged in the storage area AR1. The stocker 2 includes a plurality of storage shelves 11 and an elevator 12. The plurality of storage shelves 11 are arranged in the vertical direction (Z direction). The storage shelf 11 stores, for example, a material pallet (not shown) on which a plurality of unprocessed plate materials W are placed. The elevator 12 is raised and lowered by an elevator drive device 12a (see FIG. 5). The elevator 12 takes out the material pallet from the storage shelf 11 and raises and lowers this material pallet. In the storage area AR1, a temporary storage area AR3 is provided adjacent to the stocker 2 on the +Y side. The stocker 2 places the material pallet on which a plurality of unprocessed plate materials W are placed in the temporary storage area AR3. The unprocessed plate materials W are transported from the temporary storage area AR3 to the carry-in / out area AR2 by the loader device 3.

[0018] The unprocessed plate material W does not necessarily have to be stored in the stocker 2, but may be stored in a location other than the stocker 2. Furthermore, the unprocessed plate material W does not have to be transported to the carry-in / out area AR2 by the loader device 3. For example, the unprocessed plate material W may be transported to the carry-in / out area AR2 by a transport device other than the loader device 3, or manually by an operator.

[0019] The storage shelf 11 also stores product pallets 13 on which products Wa are accumulated. The elevator 12 removes the product pallets 13 from the storage shelf 11 and raises and lowers the product pallets 13. The stocker 2 places the product pallets 13 in the temporary storage area AR3. The laser-processed products Wa are transported from the carry-in / out area AR2 to the temporary storage area AR3 by the loader device 3. The laser processing machine 6, the processed pallet 5 that has been retracted from the laser processing machine 6, and the product pallet 13 placed in the temporary storage area AR3 are arranged side by side in the X direction. The products Wa are accumulated on the product pallets 13 in the temporary storage area AR3 by the loader device 3. The stocker 2 transfers the product pallets 13 on which the products Wa are accumulated from the temporary storage area AR3 to the storage shelf 11.

[0020] The loader device 3 is a transport unit that transports the plate material W or the product Wa. The loader device 3 includes a Y-rail 15, a traveling carriage 16 that can travel on the Y-rail 15, and a transfer device 17 that is provided on the traveling carriage 16. The Y-rail 15 extends in a direction (Y direction) that intersects with the movement direction (X direction) of the processing pallet 5. An X-rail 18 that extends in the X direction is provided on the upper part of the traveling carriage 16. The transfer device 17 is attached to the X-rail 18.

[0021] Transfer device 17 includes an X movable body 19 movable along an X rail 18, a Z movable body 20 attached to X movable body 19, and an adsorption unit 21 attached to the lower end of Z movable body 20. X rail 18 is provided above temporary placement area AR3 and above carry-in / out area AR2. X movable body 19 is movable between temporary placement area AR3 and carry-in / out area AR2. Z movable body 20 is movable in the vertical direction (up and down direction) relative to X movable body 19 while holding adsorption unit 21. Adsorption unit 21 moves in the Y direction by traveling carriage 16, moves in the X direction by X movable body 19, and moves in the vertical direction by Z movable body 20.

[0022] The loader device 3, for example, adsorbs an unprocessed plate material W in the temporary storage area AR3 using the suction unit 21. The loader device 3 adsorbs and transports the plate material W in the temporary storage area AR3, and can place the plate material W on the processing pallet 5 in the carry-in / out area AR2. In the loader device 3, the X-moving body 19 moves in the -X direction with the unprocessed plate material W adsorbed by the suction unit 21, and transports the plate material W to the carry-in / out area AR2. The processing pallet 5 is previously placed in the carry-in / out area AR2. In the loader device 3, the traveling carriage 16 moves in the Y direction in the carry-in / out area AR2, and the plate material W adsorbed by the suction unit 21 is placed above the processing pallet 5. Next, the loader device 3 moves the Z-moving body 20 downward, and places the plate material W adsorbed by the suction unit 21 on the processing pallet 5.

[0023] The gripper device 4 is disposed above the processing pallet 5 on the +X side of the laser processing machine 6. The gripper device 4 is also movable in the Y direction and can be retracted from above the processing pallet 5. Although FIGS. 1 and 2 show a configuration in which the gripper device 4 is retracted to the +Y side of the processing pallet 5, the gripper device 4 may also be retracted to the -Y side of the processing pallet 5.

[0024] The gripper device 4 holds and carries out a skeleton Wb, which is a remaining material, from the processed plate material W placed on the processing pallet 5. The skeleton Wb is the outer frame of the processed plate material W and the portion connected to this outer frame. The gripper device 4 removes the skeleton Wb from the processed plate material W. The gripper device 4 has multiple gripping units 4a that grip the +Y side and the -Y side of the skeleton Wb. The multiple gripping units 4a are aligned in the X direction and are provided so that they can be raised and lowered. The gripper device 4 holds and carries out the skeleton Wb with the gripping units 4a from the processed plate material W lifted by the lift device 8. The gripper device 4 is provided separately from the loader device 3, and removes the skeleton Wb, for example, before the loader device 3 picks up the product Wa.

[0025] When performing the skeleton Wb removal operation, the gripper device 4 is positioned with respect to the plate material W so that the multiple gripping sections 4a are positioned above the plate material W near its outer periphery. In this state, the multiple gripping sections 4a descend to grip the skeleton Wb, and then ascend to remove (lift) the skeleton Wb from the plate material W. The gripper device 4, with the skeleton Wb gripped by the gripping sections 4a, moves to the -Y side above the residue recovery section 42 (see FIG. 1). The residue recovery section 42 is positioned on the -Y side of the processing pallet 5 retracted from the laser processing machine 6. When the multiple gripping sections 4a release their grip on the skeleton Wb, the skeleton Wb falls and is stored (placed) in the residue recovery section 42. That is, the residue recovery section 42 is positioned below the range within which the gripper device 4 can move, and the skeleton Wb that the gripper device 4 transports is placed in the residue recovery section 42.

[0026] After the skeleton Wb is removed, the product Wa and slag Wc remain on the arm 8b of the lift device 8. The loader device 3 picks up the product Wa using the suction unit 21 and transports it to the temporary storage area AR3 in the storage area AR1. A product pallet 13 is placed in the temporary storage area AR3 by the stocker 2, and the loader device 3 transfers one or more products Wa formed on the plate material W onto the product pallet 13 through one or more transfer processes. The slag Wc falls from the arm 8b of the lift device 8 and is discharged, but the slag Wc remaining on the arm 8b is removed from the arm 8b by a cleaning unit 23 (see Figure 17), which will be described later.

[0027] The processing pallet 5 can be moved in and out of the laser processing machine 6 with the plate material W placed on it. The processing pallet 5 is a support part that supports the plate material W before processing. The processing pallet 5 is also a support part that supports workpieces including at least one of a product Wa obtained by cutting the plate material W by the laser processing machine 6 and a remaining material (a skeleton Wb and a slug Wc). The processing pallet 5 transports the plate material W between the carry-in / out area AR2 and the laser processing machine 6. The processing pallet 5 is equipped with wheels that can move along rails 28. A pallet changer 7 is arranged in the carry-in / out area AR2, and the rails 28 extend from the laser processing machine 6 to the pallet changer 7.

[0028] The processing pallet 5 has a rectangular shape when viewed vertically. The processing pallet 5 includes a frame 5a and multiple support plates 5b. Each of the multiple support plates 5b is plate-shaped and is arranged upright relative to the frame 5a. The multiple support plates 5b extend in the Y direction and are arranged at predetermined intervals in the X direction. The multiple support plates 5b are arm portions that extend longitudinally in a plan view and are arranged parallel to each other. Each of the multiple support plates 5b has an upper end formed in a sawtooth shape. The multiple support plates 5b support the underside of the plate material W at multiple points (tips of the sawtooth). The processing pallet 5 is movable with the plate material W, including the product Wa cut by laser processing and remnants (skeletons Wb and slag Wc), placed on the multiple support plates 5b.

[0029] The laser processing machine (processing machine) 6 irradiates a laser beam onto an unprocessed plate material W placed on a processing pallet 5, thereby performing laser processing (cutting) on the plate material W. The laser processing machine 6 includes, for example, a laser head and a head drive unit. The laser head is connected to a laser light source via an optical fiber or other light transmitter and emits laser beam downward. The laser light source is a solid-state laser light source, such as a fiber laser, which produces laser beams with a higher heat density than carbon dioxide lasers. Therefore, the laser processing machine 6 using a fiber laser is capable of high-speed cutting. Laser processing may cause welding between the plate material W and the support plate 5b of the processing pallet 5, but because the support plate 5b supports the plate material W at multiple points, the welding between the support plate 5b and the plate material W can be reduced.

[0030] The pallet changer 7 is disposed on the +X side of the laser processing machine 6. The pallet changer 7 switches the processing pallets 5 that are carried in and out of the laser processing machine 6. The pallet changer 7 also delivers the processing pallets 5 to and from the laser processing machine 6. The pallet changer 7 transports the processing pallet 5 along the rails 28, for example, by pulling the processing pallet 5. For example, a hook connected to a wire is hung on the processing pallet 5, and the wire is wound around a drive unit to pull the processing pallet 5. The mechanism for moving the processing pallet 5 can be changed as appropriate, and for example, the processing pallet 5 may be self-propelled.

[0031] The lifting device 8 lifts the processed plate material W placed on the processing pallet 5 from the processing pallet 5. The lifting device 8 is a support unit that supports workpieces including at least one of the product Wa and the remaining material (skeleton Wb and slag Wc) formed by cutting the plate material W by the laser processing machine 6. The lifting device 8 is disposed directly below the processing pallet 5 that is disposed in the loading / unloading area AR2. The lifting device 8 can move up and down between a position below the processing pallet 5 and a position where it lifts the plate material W on the processing pallet 5.

[0032] FIG. 3 shows an example of a processing pallet 5 and a lifting device 8, where (A) is a perspective view of a state in which a plate material W is supported by the processing pallet 5, and (B) is a perspective view of a state in which the plate material W is supported by the lifting device 8. As shown in FIG. 3, the lifting device 8 includes a movable plate 8a and a plurality of arms 8b. The movable plate 8a is disposed directly below the processing pallet 5 when the processing pallet 5 is disposed in the loading / unloading area AR2 (see FIG. 1). The movable plate 8a is movable in the vertical direction by a driving device (not shown). The plurality of arms 8b are each provided on the upper surface of the movable plate 8a. The plurality of arms 8b extend in the longitudinal direction (Y-axis direction) in a plan view and are arranged in parallel to each other.

[0033] The arm 8b is, for example, plate-shaped and extends vertically upward from the upper surface of the movable plate 8a. The arm 8b may have a shape other than plate-shaped, for example, column-shaped. The dimensions and arrangement of the arm 8b are set so that it can be inserted between two adjacent support plates 5b on the processing pallet 5. The positions (heights) of the upper surfaces of the multiple arms 8b are uniform. When the lift device 8 rises from a position below the processing pallet 5 as shown in FIG. 3(A), the upper surfaces of the arms 8b protrude upward beyond the support plates 5b as shown in FIG. 3(B), and the plate material W is transferred from the processing pallet 5 to the lift device 8. In other words, the plate material W is supported by the lift device 8 (arm 8b). Note that, for example, suction portions may be provided on the upper surfaces of the multiple arms 8b. By suctioning the plate material W with these suction portions, problems such as the product Wa getting caught on the skeleton Wb and being lifted when the skeleton Wb is lifted by the gripper device 4 as described above can be prevented.

[0034] The loader device 3 can pick up multiple products Wa supported by the arm portion 8b all at once, or can pick them up individually. The loader device 3 may transfer the multiple products Wa that it has picked up all at once onto the product pallet 13, or may transfer each product Wa onto the product pallet 13 as it is picked up. When two or more types of products Wa are formed by processing one sheet material W, the loader device 3 may sort the products Wa by type and transfer each type of product Wa onto the product pallet 13.

[0035] The control device 10 controls the laser processing machine 6 in an integrated manner. The control device 10 controls the operation of each of the stocker 2, the loader device 3, the gripper device 4, the processing pallet 5, the laser processing machine 6, the pallet changer 7, and the lift device 8. The control device 10 controls the operation of each part, for example, by reading a predetermined program and data stored in a storage device (not shown), or based on a program and data sent from a higher-level control device. In this embodiment, the control device 10 is configured to include the recognition unit 54 of the workpiece recognition system S, but is not limited to this. For example, the control device 10 may be configured not to include the recognition unit 54. In this case, the recognition unit 54 of the workpiece recognition system S is provided separately from the control device 10.

[0036] The workpiece recognition system S recognizes the workpiece to be processed by the laser processing machine 6. As described above, the workpiece includes at least one of the product Wa and the remaining material (skeleton Wb and slag Wc) obtained by cutting the plate material W by the laser processing machine 6. Hereinafter, the term "workpiece" refers to at least one of the product Wa and the remaining material (skeleton Wb and slag Wc). As described above, the skeleton Wb is the outer frame and the portion connected to this outer frame of the plate material W after processing. The slag Wc is the portion of the plate material W other than the product Wa that is not connected to the skeleton Wb. As shown in FIGS. 1 and 2, the workpiece recognition system S includes an illumination unit 52, imaging units 53A and 53B, and a recognition unit 54. The workpiece recognition system S is also applied to the laser processing system 1. In other words, this workpiece recognition system S includes a stocker 2, a loader device (transport unit) 3, a processing pallet 5 as a support unit, and a lift device 8 as a support unit.

[0037] The lighting unit 52 is arranged on one side of the lift device 8 in the horizontal direction. In other words, the lighting unit 52 is arranged above the lift device 8 and on one side of the lift device 8 in plan view. The lighting unit 52 is also arranged on one side of the processing pallet 5 arranged in the loading / unloading area AR2. In this embodiment, the one side of the lift device 8 is the +X side of the lift device 8. The lighting unit 52 is arranged by being attached to the stocker 2. Details of the attachment part to the stocker 2 will be described later. The lighting unit 52 is arranged in an orientation (posture) such that it irradiates light over an area including the entire upper surface of the lift device 8. For example, an LED light is used as the lighting unit 52. The light irradiated from the lighting unit 52 is, for example, visible light.

[0038] Although one illumination unit 52 is used in this embodiment, two or more illumination units 52 may be used. The illumination unit 52 may be configured to continuously emit light or to emit light intermittently. The illumination unit 52 emits light that spreads to illuminate the entire upper surface of the lift device 8, but is not limited to this configuration. For example, the illumination unit 52 may be configured to emit light that spreads over a narrow range while changing the angle with respect to the lift device 8 in a planar view (scanning), thereby emitting light so as to illuminate the entire upper surface of the lift device 8 in a predetermined time cycle. In this case, the illumination unit 52 emits light for at least one cycle so as to cover the entire upper surface of the lift device 8 while the imaging units 53A and 53B are capturing images.

[0039] The imaging units 53A and 53B are arranged on the opposite side of one side of the lift device 8 in the horizontal direction. That is, the imaging units 53A and 53B are arranged above the lift device 8 and on the other side of the lift device 8 in a plan view. The imaging units 53A and 53B are also arranged on the opposite side of one side of the processing pallet 5 arranged in the loading / unloading area AR2. In this embodiment, the opposite side of one side of the lift device 8 is the -X side of the lift device 8. The imaging units 53A and 53B are arranged by being attached to the laser processing machine 6. Details of the attachment parts to the laser processing machine 6 will be described later. The imaging units 53A and 53B are arranged to be spaced apart in the Y direction. The imaging unit 53A is arranged on the +Y side in the Y direction, and the imaging unit 53B is arranged on the -Y side in the Y direction.

[0040] Each of the imaging units 53A and 53B has an angle of view that allows it to capture an image of the entire upper surface of the lift device 8. The imaging units 53A and 53B may capture still images or moving images. Each of the imaging units 53A and 53B is capable of capturing an image including the workpiece supported by the lift device 8. Each of the imaging units 53A and 53B is capable of capturing light from the lighting unit 52 reflected by the workpiece on the lift device 8. The distance between the imaging units 53A and 53B in the Y direction is set, for example, according to the length of the lift device 8 (arm 8b) in the Y direction. In other words, the distance between the imaging units 53A and 53B in the Y direction is set so that each of the imaging units 53A and 53B can capture reflected light from the workpiece from various edges of the upper surface of the lift device 8.

[0041] In this embodiment, two imaging units 53A and 53B are used, but this is not limiting. For example, one imaging unit or three or more imaging units may be used. Also, two illumination units 52 may be provided corresponding to the two imaging units 53A and 53B. In this case, the two imaging units 53A and 53B are disposed in positions corresponding to the respective illumination units 52, and light is irradiated from the different illumination units 52, and images of the light reflected by the workpiece on the lift device 8 are captured.

[0042] FIG. 4 is a plan view showing the positional relationship between the illumination unit 52 and the imaging units 53A and 53B. As shown in FIG. 4, the illumination unit 52 irradiates light within an illumination range IR that includes the entire upper surface of the lift device 8. The illumination unit 52 is positioned at or near the center of the lift device 8 in the Y direction, and irradiates light within the illumination range IR toward the lift device 8 from this position. The imaging units 53A and 53B are positioned facing the upper surface of the lift device 8. Furthermore, the imaging units 53A and 53B are installed in a position such that their optical axes AX1 and AX2 are directed toward the illumination unit 52 or the vicinity of the illumination unit 52 in a plan view. This configuration allows a wide range of the lift device 8 to be photographed in a single shot, enabling efficient and accurate recognition of the workpiece. Furthermore, light from the illumination unit 52 is reflected by the workpiece supported by the lift device 8, and the image of the workpiece based on the reflected light can be efficiently photographed by the imaging units 53A and 53B. Furthermore, since the imaging units 53A and 53B capture images when the amount of light reflected from the workpiece is large (high light intensity), the effects of external light (natural light, lighting inside the building, etc.) can be reduced, and the workpiece can be captured with high accuracy.

[0043] FIG. 5 is a perspective view showing an example of a stocker 2 to which an illumination unit 52 is attached. As shown in FIG. 5, the illumination unit 52 is attached via an illumination unit jig 55 to a beam 14b that spans two pillars 14a arranged on the +Y side of the stocker 2. Note that the illumination unit 52 is not limited to being attached to the beam 14b. For example, the illumination unit 52 may be attached to the pillar 14a on the -X side of the two pillars 14a on the +Y side. By attaching the illumination unit 52 to the stocker 2, the stocker 2 can be used as a support for the illumination unit 52. Note that the illumination unit 52 does not have to be attached to the stocker 2. For example, a dedicated support may be installed from the floor, and the illumination unit 52 may be attached to this support.

[0044] FIG. 6 is a view of the lighting unit 52 and the lighting unit jig 55 as viewed from the +X side. FIG. 7 is an enlarged view of the main parts of the lighting unit jig 55 as viewed from the +X side. FIG. 8 is a view of the lighting unit 52 and the lighting unit jig 55 as viewed from the +Y side. FIG. 9 is an enlarged view of the main parts of the lighting unit jig 55 as viewed from the +Y side. As shown in FIGS. 6 to 9, the lighting unit jig 55 can adjust the orientation of the lighting unit 52 relative to the lift device 8 within a range of angle θ1 (see FIG. 8) around an axis parallel to the horizontal direction (Y direction). In other words, the lighting unit jig 55 can adjust the orientation of the lighting unit 52 relative to the lift device 8 around an axis parallel to the Y direction. The lighting unit jig 55 includes a beam fixing member 55a, a bearing member 55b, a rotating member 55c, and a cover 55d.

[0045] The beam fixing member 55a is fixed to the beam portion 14b via fastening members such as bolts. The bearing member 55b is fixed to the +Z side of the beam fixing member 55a. The bearing member 55b has a shaft portion 55e. The shaft portion 55e is arranged parallel to the Y direction. The rotating member 55c is arranged inside the bearing member 55b. The rotating member 55c is arranged to be rotatable around an axis parallel to the Y direction, centered on the shaft portion 55e. The lighting unit 52 is attached to the rotating member 55c. The lighting unit 52 is rotatable integrally with the rotating member 55c around an axis parallel to the Y direction. Furthermore, the rotating member 55c is provided with a plurality of positioning holes 55f along the circumferential direction centered on the shaft portion 55e (see FIG. 9). Meanwhile, the bearing member 55b is provided with bolt holes 55g and 55h corresponding to the plurality of positioning holes 55f (see FIG. 9).

[0046] Cover 55d is disposed outside bearing member 55b and surrounds lighting unit 52. Cover 55d is attached to rotating member 55c. Cover 55d is rotatable integrally with rotating member 55c around an axis parallel to the Y direction. Cover 55d has notches 55k and 55l (see FIG. 9). Notches 55k and 55l are provided at positions corresponding to bolts 55i and 55j, respectively.

[0047] The illumination unit jig 55 rotates the pivoting member 55c around the shaft 55e, aligning two of the positioning holes 55f with the bolt holes 55g and 55h in the bearing member 55b. This adjusts the rotational position of the illumination unit 52. In this state, bolts 55i and 55j are inserted into the two positioning holes 55f, respectively, and fastened to the bolt holes 55g and 55h in the bearing member 55b, thereby fixing the rotational position of the pivoting member 55c. As a result, the illumination unit 52 is fixed within the range of angle θ1. The bolts 55i and 55j are inserted into the notches 55k and 55l in the cover 55d, and the cover 55d is held in place by tightening the bolts 55i and 55j.

[0048] In this way, by supporting the lighting unit 52 by the lighting unit jig 55, it is possible to easily adjust the orientation of the lighting unit 52 (the attitude of the lighting unit 52). As a result, it is possible to appropriately irradiate the light from the lighting unit 52 onto the upper surface of the lift device 8.

[0049] Although the above-described illumination unit jig 55 uses a plurality of positioning holes 55f to enable the illumination unit 52 to be adjusted stepwise within the range of angle θ1, the present invention is not limited to this configuration. For example, the positioning holes 55f may be arc-shaped elongated holes, and the rotating member 55c may be fixed at any rotational position within the range of angle θ1. In this configuration, the illumination unit 52 can be adjusted to any angle within the range of angle θ1. Furthermore, while the above-described illumination unit jig 55 adjusts the illumination unit 52 around an axis parallel to the Y direction, the present invention is not limited to this configuration. For example, the illumination unit jig 55 may be configured to adjust the posture of the illumination unit 52 not only about the angle around an axis parallel to the Y direction, but also about the angle around an axis parallel to the vertical direction, the position in the X direction, the position in the Y direction, and the position (height) in the vertical direction.

[0050] FIG. 10 is a perspective view showing the laser processing machine 6 and the imaging unit 53. The imaging units 53A and 53B are attached to the laser processing machine 6 via an imaging unit jig 56. The laser processing machine 6 has a frame unit 6a at the end on the +X side as part of its housing. The frame unit 6a forms the loading and unloading openings for the processing pallet 5 in the laser processing machine 6. The imaging units 53A and 53B are attached to the upper end of the frame unit 6a of the laser processing machine 6. The imaging units 53A and 53B may be attached to a portion of the laser processing machine 6 other than the frame unit 6a. By attaching the imaging units 53A and 53B to the housing (frame unit 6a) of the laser processing machine 6, the housing of the laser processing machine 6 can be used as a support for the imaging units 53A and 53B. The imaging units 53A and 53B do not have to be attached to the housing of the laser processing machine 6. For example, dedicated columns may be provided on the floor, and the imaging units 53A and 53B may be attached to the columns.

[0051] FIG. 11 is a perspective view of the imaging unit 53 and the imaging unit jig 56. FIG. 12 is a view of the imaging unit 53 and the imaging unit jig 56 viewed from the -Y side. FIG. 13 is a view of the imaging unit 53 and the imaging unit jig 56 viewed from the +Z side. As shown in FIGS. 11 to 13, the imaging unit jig 56 is capable of adjusting the horizontal position, vertical position, angle of the optical axis about an axis parallel to the vertical direction, and angle of the optical axis about an axis parallel to the horizontal direction of the imaging units 53A and 53B relative to the lift device 8. Note that while FIGS. 11 to 13 show the imaging unit jig 56 for the imaging unit 53A, the imaging unit jig 56 for the imaging unit 53B has a similar configuration.

[0052] The imaging unit jig 56 has a frame fixing member 56a, a first sliding member 56b, a second sliding member 56c, and an imaging unit fixing member 56d. The frame fixing member 56a is fixed to the frame unit 6a with fastening members such as bolts. The frame fixing member 56a has a guide hole 56e along the Y direction. The first sliding member 56b is attached to the frame fixing member 56a so as to be movable in the Y direction along the guide hole 56e. The position of the first sliding member 56b in the Y direction can be fixed by clamping the frame fixing member 56a with a bolt 56f. The first sliding member 56b has a guide hole 56g along the vertical direction.

[0053] The second slide member 56c is attached to the first slide member 56b so as to be movable in the vertical direction along the guide hole 56g. The second slide member 56c can be fixed in its vertical position by clamping the first slide member 56b with bolts 56h and 56i. The second slide member 56c has a guide hole 56j extending in the circumferential direction centered on the bolt 56h (see FIG. 12). The second slide member 56c is provided so as to be rotatable about an axis parallel to the Y direction centered on the bolt 56h. The bolt 56i is inserted through the guide hole 56j and the guide hole 56g of the first slide member 56b, clamping and fixing both the first slide member 56b and the second slide member 56c. The imaging unit fixing member 56d is attached to the second slide member 56c. The imaging unit 53A is fixed to the imaging unit fixing member 56d. Therefore, by rotating the second slide member 56c around an axis parallel to the Y direction, centered on the bolt 56h, the optical axis AX1 of the imaging unit 53A can be adjusted within the range of angle θ2 (see FIG. 12).

[0054] The imaging unit fixing member 56d is rotatable around an axis parallel to the vertical direction, centered on a shaft 56l attached to the second sliding member 56c. The second sliding member 56c has two guide holes 56m extending in the circumferential direction, centered on the shaft 56l (see FIG. 13). The imaging unit fixing member 56d is fixed to the second sliding member 56c by two bolts 56n passing through the two guide holes 56m, respectively. The bolts 56n, inserted through the guide holes 56m, sandwich and fix both the second sliding member 56c and the imaging unit fixing member 56d. As described above, the imaging unit 53A is fixed to the imaging unit fixing member 56d. Therefore, by rotating the imaging unit fixing member 56d around an axis parallel to the vertical direction, centered on the shaft 56l, the optical axis AX1 of the imaging unit 53A can be adjusted within the range of angle θ3 (see FIG. 13).

[0055] In this way, by supporting the imaging unit 53A (53B) by the imaging unit jig 56, the orientation of the optical axis AX1 (AX2) of the imaging unit 53A (53B) (the attitude of the imaging unit 53A) can be easily adjusted. In other words, by adjusting the orientations of the optical axes AX1, AX2 of the imaging units 53A, 53B so as to capture light irradiated from the illumination unit 52 and reflected by the workpiece, the imaging units 53A, 53B can accurately capture images of the workpiece. Note that, although the imaging unit jig 56 described above is movable in the Y direction in the horizontal direction, the present invention is not limited to this configuration. For example, the imaging unit jig 56 may be configured to be movable in both the Y direction and the X direction.

[0056] The recognition unit 54 recognizes the workpiece supported by the lift device 8 based on the images captured by the imaging units 53A and 53B. That is, the recognition unit 54 recognizes the product Wa and the slag Wc from the images captured by the imaging units 53A and 53B. The recognition unit 54 may also recognize the skeleton Wb. As shown in FIGS. 1 and 2, the recognition unit 54 has a memory unit 57. For example, the recognition unit 54 may recognize the workpiece by extracting portions of the images captured by the imaging units 53A and 53B where the amount of light is greater than a predetermined threshold (portions with high light intensity). Furthermore, the recognition unit 54 may recognize the workpiece by pattern matching from the images captured by the imaging units 53A and 53B based on previously acquired shape information (e.g., design information) about the workpiece. The shape information about the workpiece may be stored in the memory unit 57 or may be acquired by receiving it from a higher-level control device.

[0057] Furthermore, the recognition unit 54 may recognize the workpiece by comparing a reference image acquired in advance with the image captured by the imaging units 53A and 53B. The reference image is an image obtained by capturing an image of the lift device 8 without a workpiece placed thereon by the imaging units 53A and 53B. The memory unit 57 stores the reference image. When two imaging units 53A and 53B are provided, the memory unit 57 stores a reference image corresponding to each of the imaging units 53A and 53B. In this way, by recognizing the workpiece using the reference image, the workpiece can be recognized with high accuracy.

[0058] Fig. 14(A) is a reference image corresponding to the imaging unit 53A, and Fig. 14(B) is a reference image corresponding to the imaging unit 53B. The reference images of Figs. 14(A) and (B) were taken when the upper end of the arm 8b of the lift device 8 protruded upward beyond the support plate 5b of the processing pallet 5. As shown in Figs. 14(A) and (B), in the workpiece recognition system S, the lift device 8 without a workpiece placed thereon is photographed by the imaging units 53A and 53B, and the image is stored in the memory unit 57 as a reference image. Fig. 15(A) is an image of the lift device 8 to be subjected to workpiece recognition photographed by the imaging unit 53A, and Fig. 15(B) is an image of the lift device 8 photographed by the imaging unit 53B. 15(A) and (B) show a state in which the upper end of the arm 8b of the lift device 8 protrudes upward beyond the support plate 5b of the processing pallet 5, and a workpiece is supported on the upper end of the arm 8b. The images taken by the imaging units 53A and 53B are acquired by the recognition unit 54 and stored in the memory unit 57.

[0059] The recognition unit 54 recognizes the workpiece supported by the lift device 8 based on the images of the workpiece to be recognized captured by the imaging units 53A and 53B and the respective reference images stored in the memory unit 57. The recognition unit 54 generates a determination image (determination result) regarding the presence or absence of a workpiece based on, for example, the difference between the images of the workpiece to be recognized captured by the imaging units 53A and 53B and the respective reference images. FIG. 16(A) is a determination image based on the reference image corresponding to the imaging unit 53A and the image of the workpiece to be recognized, and FIG. 16(B) is a determination result based on the reference image corresponding to the imaging unit 53B and the image of the workpiece to be recognized. As shown in FIGS. 16(A) and 16(B), each determination image includes an image of the workpiece. The white areas shown in FIGS. 16(A) and 16(B) are not present in the reference image but are present in the captured images. Therefore, the recognition unit 54 can recognize the white areas as the workpiece.

[0060] The recognition unit 54 may also recognize the workpiece supported by the lift device 8 by integrating the two determination images. That is, the recognition unit 54 may recognize the workpiece supported by the lift device 8 by integrating the determination result based on the reference image corresponding to the imaging unit 53A and the image to be recognized as the workpiece, and the determination result based on the reference image corresponding to the imaging unit 53B and the image to be recognized as the workpiece. For example, a workpiece that is not captured by the imaging unit 53B (low light intensity) may be captured by the imaging unit 53A (high light intensity). In FIG. 16(B), the uppermost white portion is lighter in color, and a workpiece at the edge of the lift device 8 may not be recognized (extracted) from the image even when compared with the reference image. In this way, even if a workpiece is captured in one determination image but not in the other, the recognition unit 54 may recognize the workpiece by integrating the determination results corresponding to the two imaging units 53A and 53B to recognize the workpiece. This makes it possible to recognize a workpiece that could not be recognized from the determination result corresponding to one imaging unit 53A (or imaging unit 53B).

[0061] The workpiece recognition system S may also include a cleaning unit 23 capable of removing residual material supported by the lift device 8 from the lift device 8. FIG. 17 illustrates an example of the cleaning unit 23. When the recognition unit 54 recognizes the presence of residual material (slug Wc) supported by the lift device 8, the cleaning unit 23 removes the residual material from the lift device 8. When a workpiece is adsorbed on the upper surface of the arm 8b of the lift device 8, the slug Wc may remain on the arm 8b after the product Wa is transported from the lift device 8. If the slug Wc remains on the arm 8b, when the next plate material W is lifted by the arm 8b, the plate material W may be partially lifted, causing the product Wa to move away from the skeleton Wb. In such a case, the recognition unit 54 recognizes the slug Wc on the lift device 8, allowing the cleaning unit 23 to remove the slag Wc from the lift device 8 and the next plate material W to be properly lifted by the arm 8b.

[0062] The cleaning unit 23 is provided, for example, above the lift device 8 in the loading / unloading area AR2. As shown in FIG. 17, the cleaning unit 23 has a brush unit 23a extending downward and is moved in the X direction by a drive unit (not shown). When the recognition unit 54 recognizes a slag Wc supported by the lift device 8, the cleaning unit 23 moves in the X direction, drops the slag Wc remaining on the arms 8b between the arms 8b, and removes it from the arms 8b.

[0063] The recognition unit 54 only needs to confirm whether or not slag We is present on the lift device 8, and therefore does not need to perform processing such as pattern matching on the images captured by the imaging units 53A and 53B. For example, the recognition unit 54 simply needs to compare the image with a reference image and confirm the presence of white areas (areas with high light intensity) in the image. As a result, the processing burden on the recognition unit 54 can be reduced. Furthermore, the recognition unit 54 may again capture an image of the lift device 8 using the imaging units 53A and 53B after the cleaning unit 23 has operated to confirm whether or not slag We remains on the arm 8b. Furthermore, the cleaning unit 23 may be provided on the underside of the suction unit 21 of the loader device 3, and may be configured to remove the slag We from the arm 8b with the brush unit 23a by moving the suction unit 21.

[0064] The recognition unit 54 may also recognize the position of the product Wa supported by the lift device 8 based on images captured by the imaging units 53A and 53B. The recognition unit 54 may, for example, recognize the position of the product Wa by pattern matching the images captured by the imaging units 53A and 53B. The position of the product Wa includes, for example, the coordinate position on the XY plane of a specific position of the product Wa (such as the position of one corner) and the rotational position of the product Wa. The position of the product Wa may be supplied to the loader device 3 and used as a target position when picking up the product Wa from the lift device 8. By having the recognition unit 54 recognize the position of the product Wa in this way, the product Wa can be transported by the loader device 3 even if the product Wa is displaced from its designed position on the lift device 8.

[0065] Furthermore, the recognition unit 54 may recognize the position of the skeleton Wb supported by the lift device 8 based on images captured by the imaging units 53A and 53B. The recognition unit 54 may recognize the position of the skeleton Wb, for example, by extracting white portions or pattern matching based on the images captured by the imaging units 53A and 53B. The position of the skeleton Wb may be supplied to the gripper device 4 and used as a target position when lifting the skeleton Wb from the plate material W after laser processing. In this way, by the recognition unit 54 recognizing the position of the skeleton Wb, the skeleton Wb can be lifted from the plate material W by the gripper device 4 even if the plate material W is displaced from its predetermined position on the lift device 8.

[0066] Next, a workpiece recognition method according to an embodiment will be described based on the operation of the workpiece recognition system S described above. FIG. 18 is a flowchart illustrating an example of the workpiece recognition method according to the embodiment. As shown in FIG. 18, the lift device 8 receives and supports the workpiece, which includes at least one of a product Wa and a remaining material (skeleton Wb and slag Wc) obtained by cutting a plate material W using the laser processing machine 6 (step S01). Next, the gripper device 4 ejects the skeleton Wb from above the lift device 8 (step S02). Next, the illumination unit 52 irradiates the lift device 8 with light from one side (-X side) of the lift device 8 in the horizontal direction (step S03). Next, the imaging units 53A and 53B capture an image including the workpiece supported by the lift device 8 from the opposite side (+X side) of the lift device 8 in the horizontal direction (step S04).

[0067] Next, the recognition unit 54 recognizes the position of the product Wa supported by the lift device 8 based on the images captured by the imaging units 53A and 53B (step S05). In step S05, the recognition unit 54 may make a judgment based on the images captured by the imaging units 53A and 53B and the reference image stored in the memory unit 57, and recognize the position of the product Wa supported by the lift device 8 based on the judgment result.

[0068] Next, the loader device 3 transports the product Wa from the lift device 8 (step S06). In step S06, the loader device 3 may be driven based on the recognized position of the product Wa to transport the product Wa from the lift device 8.

[0069] Next, the imaging units 53A and 53B are caused to photograph the top of the lift device 8 (step S07). Based on the image photographed by the imaging unit 53, it is determined whether or not there is slag Wc supported by the lift device 8 (step S08). In step S08, the recognition unit 54 makes a determination based on the image photographed by the imaging unit 53 and a reference image stored in the memory unit 57, and may determine the presence or absence of slag Wc by recognizing the slag Wc supported by the lift device 8 based on the determination result.

[0070] If the recognition unit 54 determines that the slag Wc is present on the lift device 8 (Yes in step S08), the cleaning unit 23 removes the slag Wc from the lift device 8 (step S09). This ends the series of processes. On the other hand, if the recognition unit 54 determines that the slag Wc is not present on the lift device 8 (No in step S08), this ends the series of processes. Note that, although steps S08 and S09 are described in the workpiece recognition method described above, these steps S08 and S09 do not necessarily have to be executed.

[0071] As described above, according to the workpiece recognition system S and the workpiece recognition method of the embodiment, light is irradiated onto the lift device 8 from one side of the lift device 8, and an image including the workpiece supported by the lift device 8 is captured from the opposite side of the lift device 8, so that the workpiece on the lift device 8 can be captured with the influence of ambient light reduced. Also, by configuring the imaging units 53A, 53B and the lighting unit 52 as separate units and installing the lighting unit 52 on the side of the lift device 8 opposite the imaging unit 53, a wide range of the lift device 8 can be captured in one capture, and the workpiece can be recognized with high accuracy.

[0072] Although the embodiments have been described above, the technical scope of the present invention is not limited to the scope described in the above embodiments. One or more of the requirements described in the above embodiments may be omitted. Furthermore, the requirements described in the above embodiments may be combined as appropriate. Furthermore, it will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. Such modifications and improvements are also within the technical scope of the present invention. Furthermore, the execution order of the processes shown in the claims, specification, and drawings may be arbitrary, as long as the output of a previous process is not used in a subsequent process. For convenience, the use of terms such as "first," "continue," and "next" in the operational flow described in the claims, specification, and drawings does not necessarily mean that the processes must be performed in this order.

[0073] In the above-described embodiment, the imaging units 53A and 53B capture images of the workpieces on the lift device 8, but the present invention is not limited to this. For example, the imaging units 53A and 53B may capture images of the workpieces on the processing pallet 5. Even in this case, the workpiece recognition system S can accurately recognize the workpieces on the processing pallet 5, as in the above-described embodiment. [Explanation of symbols]

[0074] AX1, AX2....Optical axis S···Workpiece Recognition System W...Plate material Wa...Product (workpiece) Wb...Skeleton (remnants, workpiece) Wc...Slag (residue material, workpiece) 1. Laser processing system 2. Stocker 3. Loader device (transport unit) 4. Gripper device 5. Processing pallet (support part) 6. Laser processing machine (processing machine) 6a Frame part (housing) 8. Lift device (support part) 8b...Arm 10. Control device 23...Cleaning Department 52 Lighting section 53A, 53B: Imaging unit 54...Recognition section 55 Lighting jig 56 Imaging unit jig 57...Storage section

Claims

1. a support unit that is installed outside the processing machine and supports a workpiece including at least one of a product obtained by cutting a plate material by the processing machine and a remaining material; an illumination unit that is installed on one side of the support unit in the horizontal direction and that irradiates the support unit with light; an imaging unit that is installed on the opposite side of the one side of the support unit in a horizontal direction with an optical axis facing the support unit, and that captures an image including the workpiece supported by the support unit; a recognition unit that recognizes whether or not the remaining material is supported by the support unit based on the image captured by the imaging unit; a cleaning unit capable of removing the residual material supported by the support unit from above the support unit, the imaging unit is installed so that the optical axis faces the illumination unit or a vicinity of the illumination unit in a plan view, The cleaning unit removes the remaining material from the support unit when the recognition unit recognizes the presence of the remaining material.

2. the support unit has a plurality of arms extending in a longitudinal direction in a plan view and arranged parallel to each other, and the workpiece is supported on the plurality of arms; The workpiece recognition system according to claim 1 , wherein the imaging unit is installed so that the optical axis intersects with the longitudinal direction of the arm in a plan view.

3. the imaging unit is attached via an imaging unit jig, the imaging unit jig is capable of adjusting, with respect to the support part, a horizontal position of the imaging unit, a vertical position of the imaging unit, an angle of the optical axis around an axis parallel to the vertical direction, and an angle of the optical axis around an axis parallel to the horizontal direction; the lighting unit is attached via a lighting unit jig, 3. The workpiece recognition system according to claim 1, wherein the angle of the illumination jig relative to the support is adjustable around an axis parallel to the horizontal direction.

4. a storage unit that stores a reference image obtained by capturing an image of the support unit without the workpiece placed thereon; The workpiece recognition system according to claim 1 , wherein the recognition unit recognizes the workpiece supported by the support unit based on the image captured by the imaging unit and the reference image.

5. A plurality of the imaging units are provided, the storage unit stores the reference image corresponding to each of the plurality of imaging units; 5. The workpiece recognition system according to claim 4, wherein the recognition unit makes a judgment based on a plurality of images captured by each of the plurality of imaging units and the reference image corresponding to each of the plurality of imaging units, and integrates the judgment results to recognize the workpiece supported by the support unit.

6. The workpiece recognition system according to claim 1 , wherein the recognition unit recognizes a position of the product supported by the support unit based on an image captured by the imaging unit.

7. a conveying unit that holds and conveys the product on the support unit, The workpiece recognition system according to claim 6 , wherein the transport unit transports the product from the support unit based on the position of the product recognized by the recognition unit.

8. a stocker for storing the plate material and the product; The workpiece recognition system according to claim 1 , wherein the illumination unit is attached to the stocker.

9. The workpiece recognition system according to claim 1 , wherein the imaging unit is attached to a housing of the processing machine.

Images