Sensor Device

Abstract

The purpose of the present invention is to improve the performance of a device that measures the water content in a medium.　A sensor device (200) according to the present invention comprises: sending antennas (221-223) that send a signal as electromagnetic waves; receiving antennas (231-233) that receive the electromagnetic waves which have been sent from the sending antennas and have passed through the medium; a measurement unit (312) that measures the electromagnetic waves which have propagated to the receiving antennas; and a sensor housing (305), and further comprising a sending substrate (321) that is an electronic substrate including a plurality of wiring layers and a receiving substrate (322) that is an electronic substrate including a plurality of wiring layers.　The sending substrate (321) includes a sending transmission path and sending exposed parts (330-332) that constitute parts of the sending antennas. The sending transmission path is formed with the wiring layers included in the sending substrate, is provided with a first shield layer and a first signal line that are superimposed, and is electrically connected to the measurement unit (312). The receiving substrate (322) includes a receiving transmission path and receiving exposed parts (333-335) that constitute parts of the receiving antennas. The receiving transmission path is formed with the wiring layers included in the receiving substrate, is provided with a second shield layer and a second signal line that are superimposed, and is electrically connected to the measurement unit (312).

Description

[Technical Field]

[0001] The present technology relates to a sensor device, and more particularly to a sensor device provided with a pair of probes. [Background technology]

[0002] Conventionally, devices and instruments for measuring the amount of moisture in a medium such as soil have been widely used in fields such as agriculture and environmental surveys. For example, a sensor device has been proposed that measures the amount of moisture in a medium based on the results of transmission and reception of electromagnetic waves propagating through the medium between a pair of probes (see, for example, Patent Document 1). Methods that use electromagnetic waves to measure moisture like this are called microwave methods. On the other hand, methods that convert the values of electrical resistance and capacitance into moisture amounts are called electrical resistance methods and electrical capacitance methods. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2018 / 0224382 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned sensor device uses microwaves to achieve faster measurement speeds compared to electrical resistance and capacitance methods. However, there is a risk that the performance of the device, such as the accuracy of moisture content measurement, may be reduced due to the influence of noise generated in the electromagnetic waves.

[0005] This technology was developed in light of these circumstances, and aims to improve the performance of devices that measure the moisture content of a medium. [Means for solving the problem]

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof provides a sensor device including a transmitting antenna that transmits a signal as an electromagnetic wave, a receiving antenna that receives the electromagnetic wave transmitted from the transmitting antenna and transmitted through a medium, a measurement unit that measures the electromagnetic wave propagated to the receiving antenna, and a sensor housing, and further including a transmitting substrate that is an electronic substrate having a plurality of wiring layers, and a receiving substrate that is also an electronic substrate having a plurality of wiring layers, or a first covering layer that covers the outer periphery of the transmitting substrate and is formed of an electromagnetic wave absorbing material in a part of the transmitting substrate, and The sensor housing further includes a second covering layer that covers the outer periphery of the transmitting substrate and is formed of an electromagnetic wave absorbing material, the sensor housing includes a transmitting probe housing that is a part of the sensor housing and houses the transmitting substrate, and a receiving probe housing that is another part of the sensor housing and houses the receiving substrate, the transmitting substrate includes a transmitting transmission path and a transmitting exposed portion that forms a part of the transmitting antenna, the transmitting transmission path is formed using a wiring layer provided on the transmitting substrate and is provided by overlapping a first shield layer and a first signal line. and is electrically connected to the measurement unit, the transmitting exposed portion is formed using a wiring layer provided on the transmitting board, is electrically connected to the first signal line, and is a conductor exposed from the first shielding layer or the first covering layer, the receiving board comprises a receiving transmission path and a receiving exposed portion constituting a part of the receiving antenna, the receiving transmission path is formed using a wiring layer provided on the receiving board, and comprises a second shielding layer and a second signal line superimposed thereon, and is electrically connected to the measurement unit, the receiving exposed portion is a conductor formed using a wiring layer provided on the receiving substrate, electrically connected to the second signal line, and exposed from the second shielding layer or the second covering layer, wherein each of the transmitting exposed portion and the receiving exposed portion has a size greater in both a second direction that is perpendicular to the first direction and parallel to the extension direction of the transmission line and a size greater in both a third direction that is perpendicular to the first and second directions than in a first direction that is the direction of the overlapping, and extends parallel to a plane determined by the second direction and the third direction,The sensor device is configured such that the transmitting transmission path and the transmitting exposed portion, which are formed using a wiring layer provided on the transmitting board, and the receiving transmission path and the receiving exposed portion, which are formed using a wiring layer provided on the receiving board, are arranged opposite each other so that the extending direction of the plane of the transmitting exposed portion and the extending direction of the plane of the receiving exposed portion are parallel, are arranged at positions spaced a predetermined distance apart, and are fixed in the extending direction and position within the sensor housing. This improves the accuracy of measuring moisture content.

[0007] In this first aspect, the exposed portion for transmission may be a transmitting element provided in the transmitting antenna, and the exposed portion for reception may be a receiving element provided in the receiving antenna, thereby providing an effect of transmitting and receiving signals between the antennas.

[0008] In addition, in the first aspect, in the transmitting probe housing, the distance from the center of the transmitting substrate to the housing edge in a direction perpendicular to the plane of the transmitting substrate may be shorter than the distance from the center of the transmitting substrate to the housing edge in a direction parallel to the plane of the transmitting substrate, and in the receiving probe housing, the distance from the center of the receiving substrate to the housing edge in a direction perpendicular to the plane of the receiving substrate may be shorter than the distance from the center of the receiving substrate to the housing edge in a direction parallel to the plane of the receiving substrate. This brings about an effect of further improving the accuracy of moisture measurement.

[0009] In addition, in this first aspect, a positioning portion for fixing the extending direction and the position of the transmitting board and the receiving board may be further provided, thereby providing an effect of fixing the position of the electronic board.

[0010] In addition, in this first aspect, the positioning portion may be fixed to the sensor housing and integrated with the sensor housing, thereby providing an effect that the position of the electronic board can be fixed.

[0011] In addition, in this first aspect, the sensor housing itself may have a structure including the positioning portion, thereby providing an effect of being able to fix the position of the electronic board.

[0012] In addition, in this first aspect, the extending directions and positions of the transmitting board and the receiving board may be fixed by abutting each of the transmitting board and the receiving board against the housing at at least two points, thereby providing an effect of fixing the positions of the electronic boards.

[0013] In addition, in this first aspect, the transmitting board and the receiving board may each have a structure in which their peripheries are hardened with resin, and the strength of the structure in which the periphery of the transmitting board is hardened with resin may be at least twice as strong as that of the transmitting board, and the strength of the structure in which the periphery of the receiving board is hardened with resin may be at least twice as strong as that of the receiving board, thereby providing the effect of being able to fix the position of the electronic board.

[0014] In addition, in this first aspect, the transmitting probe housing may be formed using an electromagnetic wave transparent material so that the strength of the housing is greater than that of the transmitting substrate, and the receiving probe housing may be formed using an electromagnetic wave transparent material so that the strength of the housing is greater than that of the receiving substrate, thereby preventing deformation of the substrate.

[0015] In addition, in the first aspect, the transmitting probe housing has a wall thickness of a portion of the housing that is larger than a wall thickness of another portion in a cross section perpendicular to the extending direction of the housing, The receiving probe housing may have a wall thickness in a portion of the housing that is greater than the wall thickness in another portion in a cross section perpendicular to the extending direction of the housing, thereby achieving the effect of setting the wall thickness to an appropriate value.

[0016] In addition, in this first aspect, in a cross section perpendicular to the extending direction of the transmitting probe housing, the thickness of the transmitting probe housing end portion located in a direction parallel to the transmitting substrate from the center of the substrate may be greater than the thickness of the transmitting probe housing located in a direction perpendicular to the transmitting substrate from the center of the transmitting substrate, and the thickness of the receiving probe housing end portion located in a direction parallel to the receiving substrate from the center of the receiving substrate in a cross section perpendicular to the extending direction of the receiving probe housing may be greater than the thickness of the receiving probe housing located in a direction perpendicular to the receiving substrate from the center of the receiving substrate. This brings about the effect that the thicknesses can be set to appropriate values.

[0017] In addition, in the first aspect, in a cross section perpendicular to the extending direction of the transmitting probe housing, the thickness of an end portion of the transmitting probe housing located in a direction perpendicular to the substrate from the center of the transmitting substrate may be greater at the end portion farther from the receiving substrate than at the end portion closer to the receiving substrate, and in a cross section perpendicular to the extending direction of the receiving probe housing, the thickness of an end portion of the receiving probe housing located in a direction perpendicular to the substrate from the center of the receiving substrate may be greater at the end portion farther from the transmitting substrate than at the end portion closer to the transmitting substrate. This brings about the effect of setting the thickness to an appropriate value.

[0018] In addition, in this first aspect, the transmitting substrate may include a plurality of vias connected to the first shielding layer, and a shielding structure formed by a row of the plurality of vias may be provided on a side of the first signal line, and the receiving substrate may include a plurality of vias connected to the second shielding layer, and a shielding structure formed by the row of the plurality of vias may be provided on a side of the second signal line, thereby providing an effect of reducing noise.

[0019] In addition, in this first aspect, the transmitting substrate includes a plurality of the transmitting antennas, The receiving board may include a plurality of the receiving antennas.

[0020] In addition, in the first aspect, in the transmitting board, the transmitting transmission lines connected to the plurality of transmitting antennas may be provided independently for each of the plurality of antennas, and in the receiving board, the receiving transmission lines connected to the plurality of receiving antennas may be provided independently for each of the plurality of antennas, thereby providing an effect of reducing noise.

[0021] In this first aspect, the measurement circuit may select one of the plurality of transmitting antennas one by one in a predetermined order and control the selected transmitting antenna to transmit the electromagnetic wave, thereby providing an effect of measuring moisture amounts at a plurality of depths in sequence. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is an example of an overall view of a moisture measurement system according to a first embodiment of the present technology. [Figure 2] 1 is a block diagram showing a configuration example of a central processing unit according to a first embodiment of the present technology; [Figure 3] 1 is a block diagram showing a configuration example of a sensor device according to a first embodiment of the present technology; [Figure 4] 1 is an example of an overall view of a sensor device according to a first embodiment of the present technology; [Figure 5]1 is an example of an overall view of a sensor housing according to a first embodiment of the present technology. [Figure 6] 1 is an example of an overall view of a moisture measurement system in which the number of antennas is increased according to a first embodiment of the present technology; [Figure 7] 1 is an example of an overall view of a sensor device with an increased number of antennas according to a first embodiment of the present technology; [Figure 8] 1 is an example of an overall view of a sensor housing with an increased number of antennas according to a first embodiment of the present technology. [Figure 9] 1 is an example of an overall view of a moisture measurement system in which the number of antennas is reduced according to a first embodiment of the present technology; [Figure 10] 1 is an example of an overall view of a sensor device in which the number of antennas is reduced according to a first embodiment of the present technology; [Figure 11] 1 is an example of an overall view of a sensor housing in which the number of antennas is reduced according to the first embodiment of the present technology; [Figure 12] 1 is an example of an overall view of a moisture measurement system with a separated housing according to a first embodiment of the present technology. [Figure 13] 1 is an example of an overall view of a sensor device from which a housing is separated according to a first embodiment of the present technology. [Figure 14] 1 is an example of an overall view of a sensor housing from which the housing is separated according to a first embodiment of the present technology. [Figure 15] 1 is an example of an overall view of a moisture measurement system in which the housings are separated and a plurality of probe housings are provided for each sensor device according to a first embodiment of the present technology. [Figure 16] 1 is an example of an overall view of a sensor device in which a housing is separated and a plurality of probe housings are provided according to a first embodiment of the present technology. [Figure 17] 16 is a block diagram showing an example of a configuration of the sensor device of FIG. 15 according to the first embodiment of the present technology. FIG. [Figure 18] 10 is another example of an overall view of the sensor device from which the housing is separated according to the first embodiment of the present technology. [Figure 19]1 is an example of a cross-sectional view of a probe of a first structure when viewed from the front in the first embodiment of the present technology. [Figure 20] 10 is an example of a plan view of each layer in a probe housing of a first structure according to the first embodiment of the present technology; [Figure 21] 1 is an example of a cross-sectional view of a probe of a first structure as viewed from above in the first embodiment of the present technology. [Figure 22] 10 is another example of a cross-sectional view of the probe of the first structure when viewed from the front in the first embodiment of the present technology. [Figure 23] 10 is another example of a plan view of each layer in the probe housing of the first structure according to the first embodiment of the present technology. [Figure 24] 10 is another example of a cross-sectional view of the probe of the first structure as viewed from above in the first embodiment of the present technology. [Figure 25] 10 is an example of a cross-sectional view of a probe of a second structure as viewed from the front in the first embodiment of the present technology. [Figure 26] 10 is an example of a plan view of each layer in a probe housing of a second structure according to the first embodiment of the present technology. [Figure 27] 10 is an example of a cross-sectional view of a probe having a second structure as viewed from above in the first embodiment of the present technology. [Figure 28] 10 is another example of a cross-sectional view of the probe of the second structure when viewed from the front in the first embodiment of the present technology. [Figure 29] 10 is another example of a plan view of each layer in the probe housing of the second structure according to the first embodiment of the present technology. [Figure 30] 10 is another example of a cross-sectional view of the probe of the second structure as viewed from above in the first embodiment of the present technology. [Figure 31] 10 is an example of a cross-sectional view of a probe of a third structure as viewed from the front in the first embodiment of the present technology. [Figure 32] 10A and 10B are examples of plan views of layers in a probe housing of a third structure according to the first embodiment of the present technology; [Figure 33]10 is an example of a cross-sectional view of a probe having a third structure as viewed from above in the first embodiment of the present technology. [Figure 34] 10 is another example of a cross-sectional view of the probe of the third structure when viewed from the front in the first embodiment of the present technology. [Figure 35] 10 is another example of a plan view of each layer in the probe housing of the third structure according to the first embodiment of the present technology. [Figure 36] 10 is another example of a cross-sectional view of the probe having the third structure as viewed from above in the first embodiment of the present technology. [Figure 37] 10 is an example of a cross-sectional view of a probe having a fourth structure when viewed from the front in the first embodiment of the present technology. [Figure 38] 10A and 10B are examples of plan views of layers in a probe housing of a fourth structure according to the first embodiment of the present technology; [Figure 39] 10 is an example of a cross-sectional view of a probe having a fourth structure as viewed from above in the first embodiment of the present technology. [Figure 40] 10 is another example of a cross-sectional view of the probe of the fourth structure when viewed from the front in the first embodiment of the present technology. [Figure 41] 10A and 10B are plan views illustrating another example of layers in the probe housing of the fourth structure according to the first embodiment of the present technology. [Figure 42] 10 is another example of a cross-sectional view of the probe having the fourth structure as viewed from above in the first embodiment of the present technology. [Figure 43] 4A to 4C are diagrams illustrating an example of the shape of a transmitting antenna applied to a first structure according to the first embodiment of the present technology. [Figure 44] 10A to 10C are diagrams illustrating another example of the shape of a transmitting antenna applied to the first structure according to the first embodiment of the present technology. [Figure 45] FIG. 10 is a diagram illustrating an example of the shape of a transmitting antenna applied to a third structure according to the first embodiment of the present technology. [Figure 46] FIG. 10 is a diagram showing another example of the shape of a transmitting antenna applied to the third structure according to the first embodiment of the present technology. [Figure 47]FIG. 10 is a cross-sectional view seen from the front of a transmitting antenna applied to a third structure according to the first embodiment of the present technology. [Figure 48] FIG. 10 is an example of a cross-sectional view of a probe in which a slot of a fifth structure is formed when viewed from the front in the first embodiment of the present technology. [Figure 49] 10A and 10B are examples of plan views of layers in a probe housing of a fifth structure in which slots are formed according to the first embodiment of the present technology; [Figure 50] 10 is an example of a cross-sectional view of a probe of a fifth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. FIG. [Figure 51] 10 is another example of a cross-sectional view of the probe of the fifth structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 52] 10A and 10B are plan views of layers in a probe housing of a fifth structure in which slots are formed according to the first embodiment of the present technology; [Figure 53] 10 is another example of a cross-sectional view of the probe of the fifth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. [Figure 54] 10 is another example of a cross-sectional view of the probe of the fifth structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 55] 10A and 10B are plan views illustrating other examples of layers in the probe housing of the fifth structure in which slots are formed according to the first embodiment of the present technology. [Figure 56] 10 is another example of a cross-sectional view of the probe of the fifth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. [Figure 57] 10 is an example of a cross-sectional view of a probe of a sixth structure in which a slot is formed when viewed from the front according to the first embodiment of the present technology. FIG. [Figure 58] 10A and 10B are examples of plan views of layers in a probe housing of a sixth structure in which slots are formed according to the first embodiment of the present technology; [Figure 59] 10 is an example of a cross-sectional view of a probe of a sixth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. FIG. [Figure 60] 10 is another example of a cross-sectional view of the probe of the sixth structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 61] 10A and 10B are plan views illustrating another example of layers in the probe housing of the sixth structure in which slots are formed according to the first embodiment of the present technology. [Figure 62] 10 is another example of a cross-sectional view of the probe of the sixth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. [Figure 63] 10 is another example of a cross-sectional view of the probe of the sixth structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 64] 10A and 10B are plan views illustrating other examples of layers in the probe housing of the sixth structure in which slots are formed according to the first embodiment of the present technology. [Figure 65] 10 is another example of a cross-sectional view of the probe of the sixth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. [Figure 66] 10 is an example of a cross-sectional view of a probe of a seventh structure in which a slot is formed as viewed from above in the first embodiment of the present technology. FIG. [Figure 67] 10A and 10B are examples of plan views of layers in a probe housing of a seventh structure in which slots are formed according to the first embodiment of the present technology; [Figure 68] 13 is another example of a cross-sectional view of the probe of the seventh structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 69] 13 is an example of a cross-sectional view of a probe of an eighth structure in which a slot is formed as viewed from above in the first embodiment of the present technology. [Figure 70] 13A and 13B are examples of plan views of layers in a probe housing of an eighth structure in which slots are formed according to the first embodiment of the present technology. [Figure 71] 13 is another example of a cross-sectional view of the probe of the eighth structure in which a slot is formed when viewed from the front in the first embodiment of the present technology. [Figure 72]FIG. 10 is a diagram illustrating an example of the shape of a transmitting antenna applied to a fifth structure in which a slot is formed according to the first embodiment of the present technology. [Figure 73] FIG. 10 is a diagram illustrating an example of the shape of a transmitting antenna applied to a seventh structure in which a slot is formed according to the first embodiment of the present technology. [Figure 74] FIG. 10 is a diagram illustrating an example of the shape of a transmitting antenna applied to an eighth structure in which a slot is formed according to the first embodiment of the present technology. [Figure 75] 2A to 2C are diagrams for explaining the operation principle of the sensor device according to the first embodiment of the present technology. [Figure 76] 3 is a diagram showing an example of an angle formed between an antenna plane and a measurement unit substrate in the first embodiment of the present technology. FIG. [Figure 77] 3A to 3C are diagrams for explaining a method for connecting substrates together according to the first embodiment of the present technology. [Figure 78] 3 is an example of a detailed view of a substrate according to the first embodiment of the present technology. [Figure 79] 2A and 2B are an example of a detailed view and a cross-sectional view of a substrate according to the first embodiment of the present technology. [Figure 80] 3 is an example of a detailed diagram of a connection point according to the first embodiment of the present technology. [Figure 81] 3 is an example of a plan view of first to third layers in a substrate within a probe according to the first embodiment of the present technology; [Figure 82] 4A to 4C are examples of a plan view of a fourth layer and a fifth layer in a substrate within a probe and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 83] 1 is an example of a plan view of first to third layers in a substrate within a probe having no shield wiring according to a first embodiment of the present technology; [Figure 84] 10A and 10B are examples of a plan view of a fourth layer and a fifth layer in a substrate within a probe having no shield wiring and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 85] 1 is an example of a plan view of first to third layers in a substrate within a probe having three antennas according to the first embodiment of the present technology. [Figure 86] 10A and 10B are examples of a plan view of a fourth layer and a fifth layer in a substrate within a probe having three antennas and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 87] 10 is an example of a plan view of first to third layers in a substrate within a probe having no shield wiring and having three antennas according to the first embodiment of the present technology. [Figure 88] 10A and 10B are examples of a plan view of a fourth layer and a fifth layer in a substrate within a probe having no shield wiring and three antennas according to the first embodiment of the present technology, and a cross-sectional view of the substrate. [Figure 89] 4A to 4C are diagrams for explaining shielding by a via row according to the first embodiment of the present technology. [Figure 90] 1 is a diagram illustrating an example of a strip line according to a first embodiment of the present technology; [Figure 91] 2 is an example of a plan view of first to third layers among seven layers in a substrate within a probe according to the first embodiment of the present technology. [Figure 92] 3 is an example of a plan view of fourth to sixth layers among seven layers in a substrate within a probe according to the first embodiment of the present technology. [Figure 93] 10A and 10B are an example of a plan view of a seventh layer in a substrate within a probe and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 94] 2 is an example of a plan view of first to third layers among nine layers in a substrate within a probe according to the first embodiment of the present technology. [Figure 95] 1 is an example of a plan view of fourth to sixth layers among nine layers in a substrate within a probe according to a first embodiment of the present technology. [Figure 96] 3 is an example of a plan view of seventh to ninth layers among nine layers in a substrate within a probe according to the first embodiment of the present technology. [Figure 97] 2 is an example of a cross-sectional view of a nine-layer structure substrate in a probe according to the first embodiment of the present technology; [Figure 98] 1A and 1B are diagrams for explaining, from two perspectives, the influence of the width of the substrate in the probe and the cross-sectional area of the probe housing on the measurement of the amount of moisture in the first embodiment of the present technology; [Figure 99] 1 is an example of a plan view of first to third layers in a probe substrate in which slots are formed according to the first embodiment of the present technology; [Figure 100] 10A and 10B are an example of a plan view of a fourth layer and a fifth layer in a probe substrate in which a slot is formed and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 101] 10 is an example of a plan view of first to third layers in a probe substrate in which a slot is formed and shield wiring is eliminated according to the first embodiment of the present technology. [Figure 102] 10A and 10B are examples of a plan view of a fourth layer and a fifth layer in a probe substrate in which a slot is formed and a shield wiring is eliminated, and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 103] 1 is an example of a plan view of first to third layers in a probe substrate in which a slot is formed and three antennas are provided according to the first embodiment of the present technology. [Figure 104] 10A and 10B are examples of a plan view of a fourth layer and a fifth layer in a probe substrate in which a slot is formed and three antennas are provided, and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 105] 10 is an example of a plan view of first to third layers in a probe substrate in which a slot is formed, a shield wiring is eliminated, and three antennas are provided according to the first embodiment of the present technology. [Figure 106] 10A and 10B are examples of a plan view of the fourth and fifth layers in a probe substrate in which a slot is formed, a shield wiring is eliminated, and three antennas are provided, and a cross-sectional view of the substrate according to the first embodiment of the present technology. [Figure 107] 1 is an example of a plan view of first to third layers among seven layers in a probe substrate in which slots are formed according to the first embodiment of the present technology. [Figure 108] 10 is an example of a plan view of fourth to sixth layers out of seven layers in a probe substrate in which slots are formed according to the first embodiment of the present technology. [Figure 109] 10 is an example of a cross-sectional view of a seventh layer in a probe substrate in which a slot is formed and the substrate according to the first embodiment of the present technology. [Figure 110] 1 is an example of a plan view of first to third layers among nine layers in a probe substrate in which slots are formed according to the first embodiment of the present technology. [Figure 111] 10 is an example of a plan view of fourth to sixth layers out of nine layers in a probe substrate in which slots are formed according to the first embodiment of the present technology. [Figure 112] 1 is an example of a plan view of seventh to ninth layers out of nine layers in a probe substrate in which slots are formed according to the first embodiment of the present technology. [Figure 113] 1 is an example of a cross-sectional view of a nine-layer structure internal probe substrate in which a slot is formed according to the first embodiment of the present technology. [Figure 114] 5A to 5C are diagrams for supplementary explanation of the structure of a strip line according to the first embodiment of the present technology. [Figure 115] 3A to 3C are diagrams for explaining time-division driving of an antenna according to the first embodiment of the present technology. [Figure 116] FIG. 2 is a block diagram showing an example of the configuration of a sensor device in a first comparative example. [Figure 117] FIG. 10 is a block diagram showing an example of the configuration of a sensor device in a second comparative example. [Figure 118] 1 is a block diagram showing an example of the configuration of a sensor device that focuses on time-division driving of an antenna according to a first embodiment of the present technology; [Figure 119] 1 is a block diagram showing an example of the configuration of a sensor device in which a transmission switch and a reception switch are built into a transmitter and a receiver according to a first embodiment of the present technology. [Figure 120] 1 is a block diagram showing an example of a configuration of a sensor device 2 in which a switch is provided only on the receiving side according to a first embodiment of the present technology. [Figure 121] 4 is an example of a timing chart of time-division driving according to the first embodiment of the present technology. [Figure 122] 4 is an example of a timing chart showing the operation of each unit in the sensor device according to the first embodiment of the present technology. [Figure 123]10 is an example of a timing chart of time-division driving when the timing of signal processing is changed according to the first embodiment of the present technology. [Figure 124] 4 is an example of a timing chart showing operations of each unit in the sensor device when the timing of signal processing is changed according to the first embodiment of the present technology. [Figure 125] 10 is an example of a timing chart of time-division driving when the timing of signal processing and data transmission is changed according to the first embodiment of the present technology. [Figure 126] 4 is an example of a timing chart showing operations of each unit in the sensor device when the timing of signal processing and data transmission is changed according to the first embodiment of the present technology. [Figure 127] 10 is an example of a timing chart of time-division driving when the order of transmission and reception detection operations is changed in the first embodiment of the present technology. [Figure 128] 10 is an example of a timing chart showing operations of each unit in the sensor device when the order of transmission and reception detection operations is changed according to the first embodiment of the present technology. [Figure 129] 5A to 5C are diagrams illustrating examples of transmission signals for each antenna in control examples a, b, and c according to the first embodiment of the present technology. [Figure 130] FIG. 10 is a diagram illustrating an example of a transmission signal for each antenna in a control example d according to the first embodiment of the present technology. [Figure 131] 1A and 1B are diagrams illustrating an example of a sensor device having a thinned measurement unit housing according to a first embodiment of the present technology. [Figure 132] 1A and 1B are diagrams illustrating an example of a sensor device in which a measuring unit housing is thickened according to the first embodiment of the present technology. [Figure 133] 1A and 1B are diagrams illustrating an example of a sensor device in which a measuring unit housing is made thinner and a rain gutter is added according to the first embodiment of the present technology. [Figure 134] 1A and 1B are diagrams illustrating an example of a sensor device in which a measuring unit housing is thickened and a rain gutter is added according to the first embodiment of the present technology. [Figure 135] 5A to 5C are diagrams for explaining the strength of a probe housing according to the first embodiment of the present technology. [Figure 136] 1 is a block diagram showing an example of the configuration of a measurement circuit according to a first embodiment of the present technology; [Figure 137] 1 is a diagram illustrating an example of a configuration of a directional coupler according to a first embodiment of the present technology. [Figure 138] 1 is a circuit diagram showing an example configuration of a transmitter and a receiver according to a first embodiment of the present technology. [Figure 139] 2 is a block diagram showing a configuration example of a sensor control unit according to the first embodiment of the present technology. FIG. [Figure 140] 2 is a block diagram showing a configuration example of a signal processing unit in a central processing unit according to the first embodiment of the present technology. FIG. [Figure 141] 2A to 2C are diagrams for explaining propagation paths and transmission paths of electromagnetic waves and electric signals in the first embodiment of the present technology. [Figure 142] 4 is a graph showing an example of the relationship between the round-trip delay time and the propagation transmission time and the moisture content in the first embodiment of the present technology. [Figure 143] 4 is a graph showing an example of the relationship between propagation delay time and moisture content in the first embodiment of the present technology. [Figure 144] FIG. 10 is a block diagram showing another configuration example of the measurement circuit according to the first embodiment of the present technology. [Figure 145] FIG. 10 is a block diagram showing another configuration example of the sensor device according to the first embodiment of the present technology. [Figure 146] 4 is a flowchart showing an example of the operation of the moisture measurement system according to the first embodiment of the present technology. [Figure 147] 3 is a diagram illustrating an example of a covered portion of a radio wave absorber according to the first embodiment of the present technology. FIG. [Figure 148] FIG. 10 is a diagram showing a comparative example in which the electromagnetic wave absorbing portion is not covered. [Figure 149] 10A and 10B are diagrams illustrating an example in which one surface of a substrate in a probe is covered according to the first embodiment of the present technology. [Figure 150] 10A and 10B are diagrams illustrating an example in which the tip of the probe according to the first embodiment of the present technology is further covered. [Figure 151] 10A and 10B are diagrams illustrating an example in which only the tip is covered in the first embodiment of the present technology. [Figure 152] 10A and 10B are diagrams illustrating an example in which one surface and the tip of the substrate in the probe are covered according to the first embodiment of the present technology. [Figure 153] 3A to 3C are diagrams illustrating an example of the shape of a radio wave absorber according to the first embodiment of the present technology. [Fig. 154] 10A and 10B are diagrams illustrating an example of a sensor device using a flexible substrate according to a first modified example of the first embodiment of the present technology. [Figure 155] 10A to 10C are diagrams illustrating an example of a sensor device using a flexible substrate and a rigid substrate according to a first modified example of the first embodiment of the present technology. [Figure 156] FIG. 10 is a diagram illustrating an example of a sensor device when the number of antennas is increased according to a first modified example of the first embodiment of the present technology. [Figure 157] 10A and 10B are diagrams illustrating an example of a sensor device using a flexible substrate and a rigid substrate when the number of antennas is increased according to a first modified example of the first embodiment of the present technology. [Figure 158] 10 is a diagram illustrating an example of a sensor device in which a transmission line is wired for each antenna according to a first modified example of the first embodiment of the present technology. FIG. [Figure 159] 10 is a diagram showing an example of a sensor device in which a transmission path is wired for each antenna and which uses a flexible substrate and a rigid substrate according to a first modified example of the first embodiment of the present technology. FIG. [Figure 160] 10 is a diagram showing an example of a sensor device in which a substrate is disposed in a hard-shell sensor housing according to a first modified example of the first embodiment of the present technology. FIG. [Figure 161] 10 is a diagram showing an example of a sensor device in which the number of antennas is increased and a substrate is disposed inside a hard-shell sensor housing according to a first modified example of the first embodiment of the present technology. FIG. [Figure 162] 10A and 10B are diagrams illustrating an example of a sensor device according to a first modified example of the first embodiment of the present technology and a comparative example; [Figure 163]FIG. 10 is a diagram illustrating an example of a sensor device according to a third modified example of the first embodiment of the present technology. [Fig. 164] 10A and 10B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device according to a third modified example of the first embodiment of the present technology. [Figure 165] 10A and 10B are diagrams for explaining a method of accommodating a substrate in a third modified example of the first embodiment of the present technology. [Figure 166] 10A and 10B are diagrams for explaining another example of a method for accommodating a substrate in the third modified example of the first embodiment of the present technology. [Figure 167] 10A and 10B are views for explaining another example of a method for accommodating a substrate in the third modified example of the first embodiment of the present technology. [Figure 168] FIG. 10 is a diagram illustrating an example of a sensor device according to a fourth modified example of the first embodiment of the present technology. [Figure 169] 10A and 10B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device according to a fourth modified example of the first embodiment of the present technology. [Figure 170] 10A and 10B are diagrams for explaining a method of accommodating a substrate in a fourth modified example of the first embodiment of the present technology. [Figure 171] 10A and 10B are views for explaining another example of a method for accommodating a substrate in the fourth modified example of the first embodiment of the present technology. [Fig. 172] 13 is a diagram illustrating an example of a sensor device in which the position of a positioning unit is changed according to a fourth modified example of the first embodiment of the present technology. FIG. [Figure 173] 13A and 13B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device in which the position of a positioning portion is changed according to a fourth modified example of the first embodiment of the present technology. [Fig. 174] 10 is a diagram illustrating an example of a sensor device to which a positioning unit is added according to a fourth modified example of the first embodiment of the present technology. FIG. [Figure 175] 13A and 13B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device to which a positioning unit is added according to a fourth modified example of the first embodiment of the present technology. [Figure 176]10A and 10B are diagrams illustrating an example of a sensor device having a positioning portion with a different shape according to a fourth modified example of the first embodiment of the present technology. [Figure 177] 13A and 13B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device having a positioning portion with a different shape according to a fourth modified example of the first embodiment of the present technology. [Figure 178] 13A and 13B are diagrams for explaining a method of accommodating a substrate when the shape of a positioning portion is different in a fourth modified example of the first embodiment of the present technology. [Figure 179] 13A and 13B are views for explaining another example of a method for accommodating a substrate when the shape of the positioning portion is different in the fourth modified example of the first embodiment of the present technology. [Figure 180] FIG. 10 is a diagram illustrating an example of a sensor device with an extended frame according to a fourth modified example of the first embodiment of the present technology. [Figure 181] 13A and 13B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device in which a frame is extended according to a fourth modified example of the first embodiment of the present technology. [Figure 182] 13A and 13B are diagrams illustrating an example of a sensor device in which a positioning unit in a measurement unit housing is eliminated in a fourth modified example of the first embodiment of the present technology. [Figure 183] FIG. 10 is a diagram showing an example of a cross-sectional view of a sensor device in which a positioning unit in a measurement unit housing is eliminated in a fourth modified example of the first embodiment of the present technology. [Figure 184] 13 is a diagram illustrating an example of a sensor device to which a jig is added according to a fourth modified example of the first embodiment of the present technology. FIG. [Figure 185] 13A and 13B are diagrams illustrating an example of a top view and a cross-sectional view of a sensor device to which a jig is added according to a fourth modified example of the first embodiment of the present technology. [Figure 186] 13 is a diagram illustrating an example of a sensor device in which a substrate within a probe is abutted against a sensor housing according to a fourth modified example of the first embodiment of the present technology. FIG. [Figure 187] 13 is an example of a cross-sectional view of a sensor housing according to a fourth modified example of the first embodiment of the present technology. [Figure 188]FIG. 10 is a diagram illustrating an example of a sensor device filled with resin according to a fourth modified example of the first embodiment of the present technology. [Figure 189] 13A and 13B are examples of cross-sectional views of a probe housing 320 as viewed from above in a fourth modified example of the first embodiment of the present technology and a comparative example. [Figure 190] 13 is an example of a cross-sectional view of a probe housing as viewed from above in a fifth modified example of the first embodiment of the present technology. [Figure 191] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness in a direction parallel to the substrate in the probe is increased in both sides radiation according to a fifth modified example of the first embodiment of the present technology. [Figure 192] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness in a direction perpendicular to the substrate in the probe is increased in both sides radiation according to a fifth modified example of the first embodiment of the present technology. [Figure 193] 13 is another example of a cross-sectional view of a probe housing in which the thickness in a direction perpendicular to the substrate in the probe is increased in both-side radiation mode according to the fifth modified example of the first embodiment of the present technology. [Figure 194] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness is increased in a direction perpendicular to the substrate in the probe and on the outside, with double-sided radiation, according to a fifth modified example of the first embodiment of the present technology. [Figure 195] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness in a direction parallel to the substrate in the probe is increased with one-side radiation according to a fifth modified example of the first embodiment of the present technology. [Figure 196] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness in a direction perpendicular to the substrate in the probe is increased with one-side radiation according to a fifth modified example of the first embodiment of the present technology. [Figure 197] 13 is another example of a cross-sectional view of a probe housing in which the thickness in a direction perpendicular to the substrate in the probe is increased with one-side radiation according to the fifth modified example of the first embodiment of the present technology. [Figure 198] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness is increased in a direction perpendicular to the substrate in the probe and on the outside, with one-side radiation, according to a fifth modified example of the first embodiment of the present technology. [Figure 199]13A and 13B are diagrams for explaining an example of setting the thickness of a sensor housing in a fifth modified example of the first embodiment of the present technology. [Figure 200] FIG. 13 is a diagram illustrating a configuration example of a sensor device in which a transceiver is provided for each antenna according to a sixth modified example of the first embodiment of the present technology. [Figure 201] FIG. 13 is a diagram illustrating an example configuration of a sensor device including one transmitter and one receiver according to a sixth modified example of the first embodiment of the present technology. [Figure 202] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device having one receiver according to a sixth modified example of the first embodiment of the present technology. [Figure 203] FIG. 13 is a diagram illustrating an example configuration of a sensor device having one transmitter according to a sixth modified example of the first embodiment of the present technology. [Figure 204] FIG. 13 is a diagram illustrating another example of a sensor device having a plurality of transmitters according to the sixth modified example of the first embodiment of the present technology. [Figure 205] FIG. 13 is a block diagram showing an example configuration of a receiver according to a sixth modified example of the first embodiment of the present technology. [Figure 206] FIG. 13 is a diagram illustrating an example of frequency characteristics of a received signal in a sixth modified example of the first embodiment of the present technology. [Figure 207] 13 is an example of a timing chart of frequency division driving in a sixth modified example of the first embodiment of the present technology. [Figure 208] 13 is an example of a timing chart showing operations of each unit in a sensor device according to a sixth modified example of the first embodiment of the present technology. [Figure 209] 13 is an example of a timing chart of frequency division driving when the sweep period is shortened in the sixth modified example of the first embodiment of the present technology. [Figure 210] 13 is an example of a timing chart showing operations of each unit in a sensor device when a sweep period is shortened in a sixth modified example of the first embodiment of the present technology. [Figure 211] 13 is an example timing chart of frequency division driving in which two antennas have the same frequency according to a sixth modified example of the first embodiment of the present technology. [Figure 212] 13 is an example of a timing chart illustrating operations of each unit in a sensor device in which two antennas have the same frequency according to a sixth modified example of the first embodiment of the present technology. [Figure 213] FIG. 13 is a diagram showing an example of a cross-sectional view of a substrate in a probe according to a seventh modified example of the first embodiment of the present technology. [Figure 214] FIG. 13 is a diagram illustrating signal transmission paths for each antenna in a seventh modified example of the first embodiment of the present technology. [Figure 215] FIG. 13 is a diagram illustrating transmission paths of two systems of signals in a seventh modified example of the first embodiment of the present technology. [Figure 216] FIG. 13 is a diagram illustrating an example of a sensor device provided with a delay line according to a seventh modified example of the first embodiment of the present technology. [Figure 217] FIG. 13 is a diagram illustrating an example of the shape of a delay line in a seventh modified example of the first embodiment of the present technology. [Figure 218] FIG. 13 is a diagram showing another example of the shape of the delay line in the seventh modified example of the first embodiment of the present technology. [Figure 219] FIG. 13 is a diagram for explaining a method for setting the delay amount of a delay line in a seventh modified example of the first embodiment of the present technology. [Figure 220] FIG. 10 is a diagram illustrating an example of a sensor device according to a second embodiment of the present technology. [Figure 221] 10A and 10B are examples of cross-sectional views of sensor devices as viewed from above in a second embodiment of the present technology and a comparative example. [Figure 222] 10A and 10B are diagrams illustrating an example of covered locations of a radio wave absorber in the case of double-sided radiation according to a second embodiment of the present technology. [Figure 223] 10A and 10B are diagrams illustrating an example in which radiation is not covered with an electromagnetic wave absorbing portion in the case of double-sided radiation according to the second embodiment of the present technology. [Figure 224] 10 is a diagram illustrating an example of a covered portion of a radio wave absorber in one-sided radiation according to a second embodiment of the present technology. FIG. [Figure 225] 10A and 10B are diagrams illustrating an example in which one-sided radiation is not covered with an electromagnetic wave absorbing portion in the second embodiment of the present technology. [Figure 226] 10A and 10B are diagrams illustrating an example in which one side is covered when emitting radiation from one side according to the second embodiment of the present technology. [Figure 227] 10A and 10B are diagrams illustrating an example in which a transmission line and a tip are covered in the case of double-sided radiation according to the second embodiment of the present technology. [Figure 228] 10A and 10B are diagrams illustrating an example in which only the tip is covered in double-sided radiation according to the second embodiment of the present technology. [Figure 229] 10A and 10B are diagrams illustrating an example in which a transmission line and a tip are covered in the case of one-sided radiation according to the second embodiment of the present technology. [Figure 230] 10A and 10B are diagrams illustrating an example in which only the tip is covered when one-sided radiation is performed according to the second embodiment of the present technology. [Figure 231] 10A and 10B are diagrams illustrating an example in which a transmission line, one side, and a tip are covered in the case of one-sided radiation according to the second embodiment of the present technology. [Figure 232] 10 is a diagram illustrating an example of covered locations of a radio wave absorber when a plurality of double-side radiation antenna pairs are provided according to a second embodiment of the present technology. FIG. [Figure 233] 10 is a diagram illustrating another example of covered locations of a radio wave absorber when a plurality of double-side radiation antenna pairs are provided according to the second embodiment of the present technology. FIG. [Figure 234] 10A and 10B are diagrams illustrating an example in which a radio wave absorbing section is formed on a sensor housing according to a second embodiment of the present technology. [Figure 235] 10A and 10B are diagrams illustrating an example of the shape of a radio wave absorber according to a second embodiment of the present technology. [Figure 236] 10A to 10C are diagrams illustrating other examples of the shape of the radio wave absorber according to the second embodiment of the present technology. [Figure 237] 13 is a diagram illustrating an example of a sensor device provided with a slot-shaped antenna according to a first modified example of the second embodiment of the present technology. FIG. [Figure 238] 10A and 10B are diagrams illustrating a structure of a planar, slot-shaped, and laterally radiating antenna according to a first modified example of the second embodiment of the present technology. [Figure 239]10A and 10B are diagrams illustrating a structure of a planar, slot-shaped, and laterally radiating antenna according to a first modified example of the second embodiment of the present technology. [Figure 240] 10A and 10B are diagrams illustrating a structure of a planar, slot-shaped, and laterally radiating antenna according to a first modified example of the second embodiment of the present technology. [Figure 241] FIG. 10 is a diagram illustrating a configuration example of an electronic substrate according to a second modified example of the second embodiment of the present technology. [Figure 242] FIG. 10 is a diagram showing an example of a plan view of first to third layers out of five layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 243] 10A and 10B are diagrams showing an example of a plan view and a top view of a fourth layer and a fifth layer out of five layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 244] FIG. 10 is a diagram showing an example of a plan view of first to third layers out of seven layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 245] FIG. 10 is a diagram showing an example of a plan view of fourth to sixth layers out of seven layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 246] 10A and 10B are diagrams illustrating an example of a plan view and a top view of a seventh layer out of seven layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 247] FIG. 10 is a diagram showing an example of a plan view of first to third layers out of nine layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 248] FIG. 10 is a diagram showing an example of a plan view of fourth to sixth layers out of nine layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 249] FIG. 10 is a diagram showing an example of a plan view of seventh to ninth layers out of nine layers of an electronic substrate in a first modified example of a second embodiment of the present technology. [Figure 250] FIG. 10 is a diagram showing an example of a top view of an electronic substrate having a nine-layer structure according to a first modified example of the second embodiment of the present technology. [Figure 251]FIG. 10 is a diagram illustrating the width of a substrate in a first modified example of the second embodiment of the present technology. [Figure 252] 13 is a diagram illustrating an example of a sensor device in which a substrate within a probe is abutted against a sensor housing according to a second modified example of the second embodiment of the present technology. FIG. [Figure 253] 13 is an example of a cross-sectional view of a sensor housing according to a second modified example of the second embodiment of the present technology. [Figure 254] 13 is a diagram showing an example of a sensor device filled with resin in a third modified example of the second embodiment of the present technology. FIG. [Figure 255] 13 is an example of a cross-sectional view of a probe housing having a double-side radiation and an increased thickness in a direction parallel to an electronic substrate according to a fourth modified example of the second embodiment of the present technology. FIG. [Figure 256] 13 is an example of a cross-sectional view of a probe housing having a double-side radiation and an increased thickness in a direction perpendicular to an electronic substrate according to a fourth modified example of the second embodiment of the present technology. FIG. [Figure 257] 13 is another example of a cross-sectional view of a probe housing in which the thickness in the direction perpendicular to the electronic substrate is increased in both-side radiation mode according to the fourth modified example of the second embodiment of the present technology. [Figure 258] 13 is another example of a cross-sectional view of a probe housing in which the thickness in a direction parallel to an electronic substrate is increased in both-side radiation mode according to the fourth modified example of the second embodiment of the present technology. [Figure 259] 13 is an example of a cross-sectional view of a probe housing in which the thickness is increased in a direction perpendicular to an electronic board and on the outside, with double-sided radiation, according to a fourth modified example of the second embodiment of the present technology. [Figure 260] 13 is an example of a cross-sectional view of a probe housing having a double-side radiation and an increased thickness in a direction parallel to an electronic substrate according to a fourth modified example of the second embodiment of the present technology. FIG. [Figure 261] 13 is an example of a cross-sectional view of a probe housing having a double-side radiation and an increased thickness in a direction perpendicular to an electronic substrate according to a fourth modified example of the second embodiment of the present technology. FIG. [Figure 262] 13 is another example of a cross-sectional view of a probe housing in which the thickness in the direction perpendicular to the electronic substrate is increased in both-side radiation mode according to the fourth modified example of the second embodiment of the present technology. [Figure 263] 13 is another example of a cross-sectional view of a probe housing in which the thickness in a direction parallel to the electronic substrate is increased in both-side radiation mode according to the fourth modified example of the second embodiment of the present technology. [Figure 264] FIG. 13 is an example of a cross-sectional view of a probe housing in which the thickness is increased in a direction perpendicular to the substrate in the probe and on the outside, with double-sided radiation, according to a fourth modified example of the second embodiment of the present technology. [Figure 265] FIG. 10 is a diagram illustrating a configuration example of a sensor device according to a fifth modified example of the second embodiment of the present technology. [Figure 266] 13A to 13C are diagrams illustrating an example of a sensor device before and after connection of an electronic board according to a fifth modified example of the second embodiment of the present technology. [Figure 267] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device in which multiple pairs of antennas are provided for each probe according to a fifth modified example of the second embodiment of the present technology. [Figure 268] FIG. 13 is a diagram illustrating a configuration example of a sensor device in which each pair of probes has a different length according to a fifth modified example of the second embodiment of the present technology. [Figure 269] FIG. 13 is a diagram illustrating an example configuration of a sensor device in which a transmitting antenna is shared by a plurality of receiving antennas according to a fifth modified example of the second embodiment of the present technology. [Figure 270] 13 is a diagram illustrating a configuration example of a sensor device in which board surfaces of electronic boards face each other in a fifth modified example of the second embodiment of the present technology. FIG. [Fig. 271] FIG. 13 is a diagram illustrating an example configuration of a sensor device that measures a plurality of points arranged in a two-dimensional lattice pattern in a fifth modified example of the second embodiment of the present technology. [Fig. 272] FIG. 13 is a diagram illustrating a configuration example of a sensor device to which a spirit level is added according to a fifth modified example of the second embodiment of the present technology. [Fig. 273] 13 is a diagram illustrating a configuration example of a sensor device in which the transmission and reception directions of electromagnetic waves intersect according to a fifth modified example of the second embodiment of the present technology. FIG. [Fig. 274] FIG. 13 is a diagram for explaining an effect when the positions of the antennas are asymmetric in the sixth modified example of the second embodiment of the present technology. [Figure 275]FIG. 10 is a diagram illustrating an example of a configuration of a sensor device according to a sixth modified example of the second embodiment of the present technology. [Figure 276] FIG. 13 is a diagram showing a configuration example of a sensor device in which a quadrangular portion is a parallelogram according to a sixth modified example of the second embodiment of the present technology. [Figure 277] FIG. 13 is a diagram illustrating an example configuration of a sensor device in which the quadrangular portion is made rectangular and the transmission path lengths are the same on the transmitting side and the receiving side according to a sixth modified example of the second embodiment of the present technology. [Fig. 278] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device that measures a plurality of points according to a sixth modified example of the second embodiment of the present technology. [Figure 279] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device that measures two points by sharing an antenna in a sixth modified example of the second embodiment of the present technology. [Figure 280] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device that measures three or more points by sharing an antenna in a sixth modified example of the second embodiment of the present technology. [Figure 281] FIG. 13 is a diagram illustrating another example of a sensor device that measures two points by sharing an antenna in accordance with the sixth modified example of the second embodiment of the present technology. [Figure 282] FIG. 13 is a diagram illustrating another example of a sensor device that shares an antenna to measure three or more points in the sixth modified example of the second embodiment of the present technology. [Figure 283] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device in which the number of probes is increased according to a sixth modified example of the second embodiment of the present technology. [Fig. 284] FIG. 13 is a diagram illustrating an example of a configuration of a sensor device in which the number of probes and the number of antennas are increased according to a sixth modified example of the second embodiment of the present technology. [Figure 285] FIG. 10 is a diagram illustrating an example of a sensor device according to a third embodiment of the present technology. [Figure 286] 13A and 13B are examples of a cross-sectional view and a side view of an antenna according to a third embodiment of the present technology. [Figure 287] FIG. 11 is a diagram showing an example of a cross-sectional view of a coaxial cable according to a third embodiment of the present technology. [Figure 288] FIG. 11 is a diagram illustrating an example of a sensor device in which the number of antennas is reduced according to a third embodiment of the present technology. [Figure 289] 13A and 13B are examples of a cross-sectional view and a side view of an antenna when the number of antennas is reduced according to the third embodiment of the present technology. [Figure 290] FIG. 13 is a diagram showing an example of a cross-sectional view of a coaxial cable when the number of antennas is reduced according to the third embodiment of the present technology. [Figure 291] 10A and 10B are diagrams illustrating an example of a moisture measurement system according to a fourth embodiment of the present technology and a comparative example. [Figure 292] FIG. 13 is a diagram showing an example of a moisture measurement system in which a plurality of sensor devices are connected together according to a fourth embodiment of the present technology. [Figure 293] FIG. 13 is an example of a top view of a moisture measurement system in which a plurality of sensor devices are connected together according to a fourth embodiment of the present technology. [Fig. 294] FIG. 13 is a diagram showing an example of a moisture measurement system provided with a support member according to a fourth embodiment of the present technology. [Figure 295] 10 is a diagram showing an example of a moisture measurement system in which a plurality of sensor devices and a plurality of irrigation nozzle holders are connected in accordance with the fourth embodiment of the present technology. FIG. [Figure 296] FIG. 10 is a diagram showing an example of a moisture measurement system to which a watering tube holder is connected in the fourth embodiment of the present technology. [Figure 297] FIG. 10 is a diagram showing an example of a moisture measurement system that irrigates through an irrigation nozzle according to a fourth embodiment of the present technology. [Figure 298] FIG. 13 is a diagram showing an example of a moisture measurement system in which the arrangement direction of the probes is perpendicular to a line segment parallel to the connecting portion according to a fourth embodiment of the present technology. [Figure 299] 13A and 13B are diagrams illustrating an example of a front view and a side view of a sensor device according to a fifth embodiment of the present technology. [Figure 300] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device according to a fifth embodiment of the present technology. [Figure 301]13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonal to each other and a frame is provided according to a fifth embodiment of the present technology. [Figure 302] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonal to each other and a frame is provided according to a fifth embodiment of the present technology. [Figure 303] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonalized to each other according to a fifth embodiment of the present technology. [Figure 304] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonalized to each other according to a fifth embodiment of the present technology. [Figure 305] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonalized and a jig is provided according to a fifth embodiment of the present technology. [Figure 306] 13A and 13B are diagrams illustrating an example of a rear view and a cross-sectional view of a sensor device in which substrates are orthogonalized and a jig is provided according to a fifth embodiment of the present technology. [Figure 307] FIG. 20 is a diagram illustrating an example of a sensor device according to a sixth embodiment of the present technology. [Figure 308] 13 is a diagram showing an example of a sensor device in which the position of the main body is changed according to a sixth embodiment of the present technology. FIG. [Figure 309] 13A to 13C are diagrams illustrating an example of a sensor device according to a seventh embodiment of the present technology and a comparative example. [Figure 310] FIG. 22 is a diagram showing an example of a cross section of a sensor device according to a seventh embodiment of the present technology. [Figure 311] FIG. 20 is a diagram showing an example of a cross-sectional view of a sensor device according to a seventh embodiment of the present technology. [Figure 312] FIG. 23 is a diagram showing an example of a rectangular cross-sectional view of a sensor device according to a seventh embodiment of the present technology. [Figure 313] FIG. 23 is a diagram showing an example of a cross-sectional view of a sensor device having three probes according to a seventh embodiment of the present technology. [Figure 314] FIG. 23 is a diagram showing another example of a cross-sectional view of a sensor device having three probes according to the seventh embodiment of the present technology. [Figure 315] FIG. 23 is a diagram showing an example of a cross-sectional view of a sensor device having four probes according to a seventh embodiment of the present technology. [Figure 316] FIG. 22 is an example of a perspective view of a sensor device according to a seventh embodiment of the present technology. [Figure 317] 13 shows an example of a sensor device 200 in which a groove is provided in a spacer according to the seventh embodiment of the present technology. [Figure 318] 13A to 13C are diagrams illustrating examples of grooves in a spacer according to a seventh embodiment of the present technology. [Figure 319] 13A and 13B are diagrams illustrating an example of a sensor device according to a comparative example and an eighth embodiment of the present technology. [Figure 320] 13 is a diagram showing an example of a sensor device provided with a scale and a stopper according to an eighth embodiment of the present technology. FIG. [Figure 321] FIG. 23 is a diagram illustrating an example of the number of antennas on the transmitting side and the receiving side according to the eighth embodiment of the present technology. [Figure 322] FIG. 20 is a block diagram showing an example of the configuration of a signal processing unit in a central processing unit according to an eighth embodiment of the present technology. [Figure 323] 13 is a diagram showing an example of a sensor device provided with a memory and a stopper to which a plate-like member is attached according to an eighth embodiment of the present technology. FIG. [Figure 324] 13 is a diagram showing an example of a sensor device provided with a memory and a stopper to which a rectangular parallelepiped member is attached according to an eighth embodiment of the present technology. FIG. [Figure 325] FIG. 23 is a diagram showing an example of a sensor device in which a probe housing is not separated according to an eighth embodiment of the present technology. [Figure 326] FIG. 20 is a diagram for explaining a method for measuring the distance between antennas according to the eighth embodiment of the present technology. [Figure 327] 13A to 13C are diagrams illustrating an example of an insertion method of a sensor device according to a ninth embodiment of the present technology. [Figure 328] 13A to 13C are diagrams illustrating another example of the insertion method of the sensor device according to the ninth embodiment of the present technology. [Figure 329] FIG. 23 is a diagram illustrating an example of a sensor device according to a tenth embodiment of the present technology. [Figure 330] 23A and 23B are diagrams illustrating an example of a spiral member and a sensor housing according to a tenth embodiment of the present technology. [Figure 331] 23A to 23C are diagrams illustrating another example of a spiral member and a sensor housing according to the tenth embodiment of the present technology. [Figure 332] FIG. 23 is a diagram showing an example of a sensor device provided with a double helix probe according to a tenth embodiment of the present technology. [Figure 333] 23 is a diagram showing an example of a sensor device provided with a double-helix spiral member according to a tenth embodiment of the present technology. FIG. [Figure 334] 23A and 23B are diagrams illustrating an example of a double helix helical member and a sensor housing according to a tenth embodiment of the present technology. [Figure 335] 23 is a diagram showing an example of a positional relationship between a spiral member and an antenna in a tenth embodiment of the present technology. FIG. [Figure 336] 23 is an example of a cross-sectional view of a spiral member according to a tenth embodiment of the present technology. [Figure 337] FIG. 23 is a diagram showing an example of a sensor device including a shovel-shaped housing according to a tenth embodiment of the present technology. [Figure 338] FIG. 23 is a diagram showing an example of a shovel-shaped housing according to a tenth embodiment of the present technology. [Figure 339] FIG. 23 is a diagram showing an example of the shape of a handle according to a tenth embodiment of the present technology. [Figure 340] 23 is a diagram showing an example of a blade shape according to a tenth embodiment of the present technology. FIG. [Figure 341] FIG. 23 is a diagram showing an example of a sensor device to which a scaffolding member is added according to a tenth embodiment of the present technology. [Figure 342] FIG. 29 is a block diagram showing an example of a sensor device according to an eleventh embodiment of the present technology. [Figure 343] 23 is an example of a timing chart showing the operation of each part in the sensor device according to the eleventh embodiment of the present technology. [Figure 344]FIG. 23 is a diagram showing an example of a transmission waveform in an eleventh embodiment of the present technology. [Figure 345] FIG. 29 is a diagram showing an example of a transmission waveform when the transmission power is adjusted according to the moisture content in the eleventh embodiment of the present technology. [Figure 346] FIG. 29 is a diagram showing an example of a transmission waveform when the transmission power is adjusted in accordance with the moisture content and an error is output as necessary in the eleventh embodiment of the present technology. [Figure 347] FIG. 29 is a diagram illustrating an example of waveforms of transmission and reception signals in the eleventh embodiment of the present technology. [Figure 348] FIG. 29 is a diagram illustrating a configuration example of a sensor device according to a twelfth embodiment of the present technology. [Figure 349] 10 is a timing chart showing operations of each unit in the sensor device when the order of transmission and reception detection operations is changed according to the first embodiment of the present technology. [Figure 350] 153a to 153d are top views of a sensor device 200 when the radio wave absorbers shown in FIGS. 153a to 153d are applied to the radio wave absorbers provided in the sensor device shown in FIG. 147a as an example of application to a sensor device. [Figure 351] 6A to 6C are diagrams illustrating another example of the shape of the radio wave absorber according to the first embodiment of the present technology. [Figure 352] 6A to 6C are diagrams illustrating another example of the shape of the radio wave absorber according to the first embodiment of the present technology. [Figure 353] As an example of applying the radio wave absorbing sections shown in Figures 153a to 153d to a sensor device, these are top views (transparent views) of a sensor device when they are applied to the radio wave absorbing sections provided in the sensor device shown in Figure 222a. [Figure 354] FIG. 20 is a diagram showing an example of a cross section of a sensor device according to a seventh embodiment of the present technology. [Figure 355] FIG. 20 is a diagram showing an example of a cross section of a sensor device according to a seventh embodiment of the present technology. [Figure 356] FIG. 312 is a diagram showing the structure of a sensor device when a and c in FIG. 311 are combined. [Figure 357]FIG. 312 is a diagram showing the structure of a sensor device when b and c in FIG. 311 are combined. [Figure 358] FIG. 312 is a diagram showing the structure of a sensor device when d and f in FIG. 311 are combined. [Figure 359] FIG. 312 is a diagram showing the structure of a sensor device when e and f in FIG. 311 are combined. [Figure 360] FIG. 312 is a diagram showing the structure of a sensor device when g and h in FIG. 311 are combined. [Figure 361] FIG. 312 is a diagram showing the structure of a sensor device when i and j in FIG. 311 are combined. [Figure 362] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of a transmitting antenna according to a thirteenth embodiment of the present technology. [Figure 363] FIG. 29 is a diagram for explaining the principle of a transmitting antenna according to a thirteenth embodiment of the present technology. [Figure 364] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of another type of transmitting antenna according to the thirteenth embodiment of the present technology. [Figure 365] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of another type of transmitting antenna according to the thirteenth embodiment of the present technology. [Figure 366] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of another type of transmitting antenna according to the thirteenth embodiment of the present technology. [Figure 367] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of another type of transmitting antenna according to the thirteenth embodiment of the present technology. [Figure 368] 23A and 23B are an example of a cross-sectional view and a plan view showing an example of a configuration of another type of transmitting antenna according to the thirteenth embodiment of the present technology. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described in the following order. 1. First embodiment (example in which the measurement unit board and the probe internal board are connected perpendicularly) 2. Second embodiment (example in which an antenna is formed on one electronic board) 3. Third embodiment (example with cylindrical antenna) 4. Fourth embodiment (example of fixing the irrigation nozzle in an appropriate position) 5. Fifth embodiment (example without sensor housing) 6. Sixth embodiment (example of connecting a stem to a probe) 7. Seventh embodiment (example of adding a support or reinforcement) 8. Eighth embodiment (example of separating a pair of probe housings) 9. Ninth embodiment (example in which a guide is inserted before a sensor device is inserted) 10. Tenth embodiment (example including a spiral member and a shovel-shaped housing) 11. Eleventh embodiment (example of adjusting transmission power) 12. Twelfth embodiment (example in which the measurement unit board is positioned so that the direction of extension of the probe is perpendicular to the board plane) 13. Thirteenth embodiment (example in which part of the signal line in the split line is made thicker)

[0024] <1. First embodiment> [Moisture measurement system configuration example] 1 is an example of an overall view of a moisture measurement system 100 according to a first embodiment of the present technology. This moisture measurement system 100 measures the amount of moisture contained in a medium M, and includes a central processing unit 150 and at least one sensor device such as a sensor device 200 or 201. The medium M may be, for example, soil for growing agricultural crops.

[0025] The sensor device 200 acquires data necessary for measuring moisture content as measurement data. The contents of the measurement data will be described later. The sensor device 200 transmits the measurement data to the central processing unit 150 via a communication path 110 (such as a wireless communication path). The configuration of the sensor device 201 is the same as that of the sensor device 200. The central processing unit 150 measures the moisture content using the measurement data. Note that the communication path 110 may be a wired communication path.

[0026] It should be noted that a plurality of central processing units 150 may be provided within the moisture measurement system 100.

[0027] A user applies a load to the sensor device 200 or 201 from above the soil and inserts it into the soil. The sensor device 200 or the like is used with at least the antenna portion (antenna 213 in FIG. 3 described later) of the sensor device 200 or the like exposed above the soil surface so that it can communicate with the central processing unit 150. The gray areas in the figure indicate the antennas (transmitting antennas 221 to 223 and receiving antennas 231 to 233 in FIG. 3 described later). Note that the antenna portion (antenna 213) may be buried in the soil at a depth that allows communication with the central processing unit 150.

[0028] The sensor devices 200 and 201 each include a pair of probes. The length of the probe is 5 to 200 centimeters (cm), and the probes are equipped with 1 to 40 antennas (described later). This allows moisture to be measured at multiple depths in the soil within a depth range of 5 to 200 centimeters (cm).

[0029] [Central processing unit configuration example] 2 is a block diagram showing an example configuration of the central processing unit 150 according to the first embodiment of the present technology. The central processing unit 150 includes a central control unit 151, an antenna 152, a central communication unit 153, a signal processing unit 154, a storage unit 155, and an output unit 156.

[0030] The central control unit 151 controls the entire central processing unit 150. The central communication unit 153 transmits information (e.g., instructions regarding measurement) to the sensor devices 200 and 201 via the antenna 152, and also receives measurement data from the sensor devices 200 and 201.

[0031] The signal processing unit 154 calculates the moisture content based on the measurement data. The storage unit 155 stores the moisture content measurement results, etc. The output unit 156 outputs the moisture content measurement results to a display device (not shown) or the like.

[0032] [Example of sensor device configuration] 3 is a block diagram showing an example configuration of a sensor device 200 according to the first embodiment of the present technology. The sensor device 200 includes a measurement circuit 210, a transmitting probe unit 220, and a receiving probe unit 230. The measurement circuit 210 includes a sensor control unit 211, a sensor communication unit 212, an antenna 213, a transmitter 214, a receiver 215, a transmitting switch 216, and a receiving switch 217.

[0033] A predetermined number of transmitting antennas, such as transmitting antennas 221 to 223, are provided in the transmitting probe unit 220. A predetermined number of receiving antennas, such as receiving antennas 231 to 233, are provided in the receiving probe unit 230.

[0034] The sensor control unit 211 controls each circuit in the measurement circuit 210. The transmission switch 216 selects one of the transmission antennas 221 to 223 under the control of the sensor control unit 211 and connects it to the transmitter 214. The reception switch 217 selects one of the reception antennas 231 to 233 under the control of the sensor control unit 211 and connects it to the receiver 215. The transmission antennas 221 to 223 are connected to the transmission switch 216 via transmission paths 218-1 to 218-3. The reception antennas 231 to 233 are connected to the reception switch 217 via transmission paths 219-1 to 219-3.

[0035] The transmitter 214 transmits an electrical signal of a predetermined frequency as a transmission signal via a selected transmission antenna. For example, a CW (Continuous Wave) wave is used as the incident wave in the transmission signal. This transmitter 214 transmits, for example, a frequency of 1 to 9 gigahertz (GHz). Within the frequency band, the transmission signal is transmitted by switching the frequency in steps of 50 megahertz (MHz).

[0036] The receiver 215 receives the transmitted wave via a selected receiving antenna. Here, the transmitted wave is an electromagnetic wave that has passed through the medium between the probes and has been converted into an electric signal by the receiving antenna.

[0037] The sensor communication unit 212 receives information (measurement-related instructions) sent from the central processing unit 150, and also transmits data indicating the reception results of the receiver 215 as measurement data to the central processing unit 150 via the antenna 213.

[0038] The configuration of the sensor device 201 is the same as that of the sensor device 200.

[0039] FIG. 4 is an example of an overall view of the sensor device 200 according to the first embodiment of the present technology. In the figure, "a" is a perspective view of the sensor device 200 as seen from above, with the side inserted into the soil facing downwards (in other words, a view in which the features of each part of the sensor device 200 as seen from above are superimposed). In the figure, "b" is a front view of the sensor device 200. In the figure, "c" is a perspective view of the sensor device 200 as seen from the side (in other words, a view in which the features of each part of the sensor device 200 as seen from the side are superimposed). Note that, hereinafter, the three-view drawings in this specification are perspective views (views in which the features of each part are superimposed), similar to FIG. 4, unless otherwise noted.

[0040] The sensor device 200 includes a sensor housing 305 with a pair of protrusions provided on the bottom. As will be described later, FIG. 5 is an example of an overall view of the sensor housing 305. The portion of the sensor housing 305 with the pair of protrusions is referred to as the probe housing 320 for convenience, and the remaining portion is referred to as the measurement unit housing 310 for convenience. The housing that houses the transmitting probe unit 220 is referred to as the probe housing 320a, and the housing that houses the receiving probe unit 230 is referred to as the probe housing 320b. Furthermore, the combination of the transmitting probe unit 220 and the probe housing 320a that houses it is referred to as the transmitting probe, and the combination of the receiving probe unit 230 and the probe housing 320b that houses it is referred to as the receiving probe.

[0041] A measurement unit board 311 is disposed within the measurement unit housing 310. The measurement unit board 311 is an electronic board (or, in other words, a wiring board) with multiple stacked wiring layers. A measurement circuit 210 is formed on this measurement unit board 311. Here, the measurement unit 312 in FIG. 4 represents the measurement circuit 210 in FIG. 3. In FIG. 3, the antenna 213 is included in the measurement circuit 210. On the other hand, in FIG. 4, the antenna 213 is disposed outside the measurement circuit 210, which represents a modified version of the measurement circuit 210 shown in FIG. 3. In FIG. 4, the antenna 213 may also be included in the measurement circuit 210. A battery 313, a connector 314, and a connector 315 are further connected to the measurement board 311. Note that the measurement unit 312 in FIG. 4 may be configured using one semiconductor device or multiple semiconductor devices. The measurement unit 312 and the connectors 314 and 315 are connected by strip lines including signal lines and shielding layers. In the figure, the three bold white lines represent the signal lines, and the bold black lines represent the shielding layers for convenience. In reality, a strip line is formed that shields the signal lines by placing shielding wiring between the signal lines and placing shielding layers above and below the signal lines in a direction perpendicular to the board plane, but the illustration in Figure 4 is simplified.

[0042] Inside the probe housing 320, there are arranged probe internal substrates 321 and 322, radio wave absorbers 341 to 346, and positioning units 351 and 352.

[0043] The probe internal substrate 321 is an electronic substrate (in other words, a wiring substrate) having multiple laminated wiring layers. The probe internal substrate 321 is formed with a connector 323, radiating elements 330 to 332, a shield layer 325, and multiple signal lines (not shown). Note that the probe internal substrate 321 has multiple shield layers. The radiating element 330 and the portion of the shield layer 325 exposed from the radio wave absorbing section 341 etc. function as one transmitting antenna 221. Similarly, the radiating elements 331 and 332 function as transmitting antennas 222 and 223. In the same figure, three transmitting antennas are arranged. The connector 323 and the radiating elements 330 to 332 provided in the transmitting antennas 221 to 223 are connected by independent transmission paths 218-1 to 218-3 for each transmitting antenna. These transmission paths are formed of striplines, with each of the multiple signal lines shielded in both the board parallel direction (left and right of the signal line) and the board perpendicular direction (top and bottom of the signal line) by a shield layer, shield wiring, or shield via formed on the probe internal board 321. Meanwhile, on the measurement unit board 311, the measurement unit 312 and the connector 314 are also connected by independent transmission paths for each transmitting antenna, and these transmission paths are formed of striplines using the signal lines and shield layers provided on the measurement unit board 311. As a result, the measurement unit 312 and all of the transmitting antennas provided on the sensor device 200 (in the example of FIGS. 3 and 4, transmitting antennas 221 to 223) are connected by independent transmission paths (particularly striplines) for each transmitting antenna.

[0044] The internal probe substrate 322 is also an electronic substrate (in other words, a wiring substrate) having multiple laminated wiring layers. The internal probe substrate 322 is formed with a connector 324, elements (receiving elements) 333 to 335, a shield layer 326, and multiple signal lines (not shown). The internal probe substrate 322 also has multiple shield layers. The element (receiving element) 333 and the portion of the shield layer 326 exposed from the radio wave absorbing section 344 function as a single receiving antenna 231. Similarly, the radiating elements 334 and 335 function as receiving antennas 232 and 233. In the figure, three receiving antennas are arranged. The connector 324 and the elements (receiving elements) 333 to 335 provided in the receiving antennas 231 to 233 are connected by independent transmission paths 219-1 to 219-3 for each receiving antenna. These transmission paths are formed as striplines, with each of the multiple signal lines shielded in both the board parallel direction (left and right of the signal line) and the board perpendicular direction (top and bottom of the signal line) by a shield layer, shield wiring, or shield via formed on the probe internal board 322. Meanwhile, on the measurement unit board 311, the measurement unit 312 and the connector 315 are connected by an independent transmission path for each receiving antenna, and these transmission paths are formed as striplines using the signal lines and shield layers provided on the measurement unit board 311. As a result, the measurement unit 312 and all of the receiving antennas provided on the sensor device 200 (in the example of FIGS. 3 and 4, receiving antennas 231 to 233) are connected by independent transmission paths (particularly striplines) for each transmitting antenna.

[0045] The portion including the probe housing 320a and the internal probe substrate 321 in Fig. 4 corresponds to the transmitting probe unit 220 in Fig. 3. The portion including the probe housing 320b and the internal probe substrate 322 in Fig. 4 corresponds to the receiving probe unit 230 in Fig. 3. A reinforcing portion 360 is provided between these probe units.

[0046] Hereinafter, the axis parallel to the direction in which sensor device 200 is inserted into the soil is referred to as the Y-axis. Probe housings 320a and 320b extend in the Y-axis direction. Internal probe substrates 321 and 322 also extend in the Y-axis direction. An axis parallel to a direction perpendicular to the Y-axis on a first plane including the center line of internal probe substrate 321 in the Y-axis direction and the center line of internal probe substrate 322 in the Y-axis direction is referred to as the X-axis. In sensor device 200 shown in FIG. 4, measurement unit substrate 311 extends on a second plane including a line parallel to the X-axis direction and a line parallel to the Y-axis direction. An axis perpendicular to the X-axis and Y-axis is referred to as the Z-axis. The first and second planes are planes perpendicular to the Z-axis.

[0047] As described above, the sensor device 200 is a device for measuring the amount of moisture in a medium based on the characteristics of electromagnetic waves propagated through the medium between the transmitting and receiving antennas.

[0048] Furthermore, the transmitting antenna and the receiving antenna are each planar, and are formed on an electronic board such as the probe internal boards 321 and 322. This configuration is hereinafter referred to as "element (1)." This allows for higher antenna processing accuracy and attachment accuracy, enabling accurate moisture measurement, compared to a configuration in which the antenna is formed as a separate component and then assembled to the electronic board (probe internal boards 321 and 322). Furthermore, the electronic board and antenna can be formed compactly, allowing for a smaller cross-section of the housing. As a result, unnecessary space within the housing is reduced, further enabling accurate moisture measurement. The effect of this will be described in detail later.

[0049] The transmitting antenna and receiving antenna are fixedly disposed within sensor housing 305 so that they face each other and are spaced a predetermined distance apart. This configuration in which the two antennas are fixedly disposed facing each other at a predetermined distance is hereinafter referred to as "element (2)." This improves antenna gain and sensitivity, enabling accurate moisture measurement, compared to configurations in which the planar antennas are not disposed facing each other or configurations in which the two antennas are not fixedly disposed at a predetermined distance apart.

[0050] Transmission lines 218-1 to 218-3 connecting measurement unit 312 provided on measurement unit board 311 to transmitting antennas 221 to 223, and transmission lines 219-1 to 219-3 connecting measurement unit 312 to receiving antennas 231 to 233, are formed using electronic boards (measurement unit board 311 and internal probe boards 321 and 322). This configuration is hereinafter referred to as "element (3)." This reduces the expansion and contraction of the transmission lines compared to a configuration in which the transmission lines are formed using coaxial cables, enabling accurate moisture measurement.

[0051] Sensor device 200 also includes measurement section board 311 and intra-probe boards 321 and 322 as electronic boards, with measurement section board 311 disposed orthogonal to intra-probe boards 321 and 322. More specifically, (1) measurement section board 311 is disposed parallel to the first plane, (2) intra-probe boards 321 and 322 are disposed opposite each other and orthogonal to the first plane, and (3) as a result, measurement section board 311 is disposed orthogonal to intra-probe boards 321 and 322. This configuration will be referred to as "element (4)" below.

[0052] Furthermore, sensor housing 305 includes probe housings 320a and 320b, with transmitting antennas arranged at multiple locations along the direction in which probe housing 320a extends, and receiving antennas arranged at multiple locations along the direction in which probe housing 320b extends. This configuration will be referred to as "element (5)" below.

[0053] The transmission paths include a plurality of transmission paths that individually connect the measurement unit 312 provided on the measurement unit board 311 to each of all of the transmitting antennas provided on the sensor device 200, and a plurality of transmission paths that individually connect the measurement unit 312 provided on the measurement unit board 311 to each of all of the receiving antennas provided on the sensor device 200. The measurement unit 312 provided on the measurement unit board 311 drives the multiple transmitting antennas and multiple receiving antennas in a time-division manner. This configuration will be referred to as "element (6)" hereinafter.

[0054] Furthermore, the transmission lines between the two orthogonally arranged substrates (i.e., between measurement unit substrate 311 and probe internal substrate 321, and between measurement unit substrate 311 and probe internal substrate 322) are connected via transmission lines including multiple shielded signal lines and that are more flexible than measurement unit substrates 311 and 312. This configuration is hereinafter referred to as "element (7)." This makes it possible to arrange multiple planar transmitting antennas and multiple planar receiving antennas facing each other. As a result, it becomes possible to accurately measure the moisture content of the entire soil located between the multiple transmitting and receiving antennas using high-gain transmitting and receiving antennas.

[0055] Furthermore, the probe housings 320a and 320b are made of an electromagnetically transparent material, and the strength of the probe housings 320a and 320b is greater than the strength of the electronic boards housed therein. This configuration will be referred to as "element (8)" below.

[0056] Furthermore, a transmitting antenna is formed in intra-probe substrate 321, and a receiving antenna is formed in intra-probe substrate 322. In these cross sections in a direction perpendicular to the extension direction (Y-axis direction) of probe housing 320a and intra-probe substrate 321, (1) the distance from the center of intra-probe substrate 321 to the housing end of probe housing 320a in a direction perpendicular to intra-probe substrate 321 is shorter than (2) the distance from the center of intra-probe substrate 321 to the housing end of probe housing 320a in a direction parallel to intra-probe substrate 321. Similarly, in these cross sections in a direction perpendicular to the extension direction (Y-axis direction) of probe housing 320b and intra-probe substrate 322, (1) the distance from the center of intra-probe substrate 322 to the housing end of probe housing 320b in a direction perpendicular to intra-probe substrate 322 is shorter than (2) the distance from the center of intra-probe substrate 322 to the housing end of probe housing 320b in a direction parallel to intra-probe substrate 322. This configuration will be referred to as "component (9)" below.

[0057] The sensor device 200 shown in the figure is formed using a material that absorbs electromagnetic waves and includes a transmitting transmission line covering portion that covers at least a portion of the "transmitting transmission line that connects the transmitting element (transmitting antenna) and the measuring unit," and a receiving transmission line covering portion that is formed using a material that absorbs electromagnetic waves and covers at least a portion of the "receiving transmission line that connects the receiving element (receiving antenna) and the measuring unit."

[0058] The transmitting probe unit includes the above-mentioned transmitting transmission line covering portion, and the receiving probe unit also includes the above-mentioned receiving transmission line covering portion.

[0059] The sensor housing 305 also includes a measurement unit housing 310 and a probe housing 320. Within the probe housing 320, the portion housing the transmitting antenna is a transmitting probe housing 320a, and the portion housing the receiving antenna is a receiving probe housing 320b. The transmitting probe housing 320a and the receiving probe housing 320b are fixed to the measurement unit housing 310 and integrated into one body. However, they can also be separated as described below.

[0060] Here, the sensor housing 305 may be formed in such a manner that the sensor housing 305 is formed in advance as a plurality of separate parts, and then these parts are fixed together to form an integrated unit. Alternatively, the sensor housing 305 may be formed in such a manner that the transmitting probe housing, the receiving probe housing, and the measuring unit housing 310 are integrated together at the time of forming these.

[0061] The sensor housing 305 is provided with a reinforcing portion 360 for improving the strength of the housing, but the reinforcing portion 360 may not be provided.

[0062] The reinforcing section 360 is connected to at least two of the transmitting probe housing 320a, the receiving probe housing 320b, and the measuring section housing 310. It may also be connected to all three of these.

[0063] The entire sensor housing 305 may be made of a material that transmits electromagnetic waves. Alternatively, at least the transmitting element (transmitting antenna) and the receiving element (receiving antenna) may be made of a material that transmits electromagnetic waves. The part closest to the antenna is made of a material that transmits electromagnetic waves, and the other parts At least a portion of the insulating layer 12 may be made of a material different from the above-mentioned materials.

[0064] Fig. 5 is an example of an overall view of the sensor housing 305 according to the first embodiment of the present technology. In the figure, "a" is a transparent view of the sensor housing 305 seen from above. In the figure, "b" is a front view of the sensor housing 305. In the figure, "c" is a cross-sectional view of the sensor housing 305. Of the sensor housing 305, the housing that houses the transmitting probe unit 220 is called probe housing 320a, and the housing that houses the receiving probe unit 230 is called probe housing 320b, and the reinforcing structure that is arranged between the probe housings 320a and 320b and that improves the strength of the probe housings 320a and 320b is called reinforcing section 360.

[0065] Not only the antenna portion where electromagnetic waves are transmitted and received, but also at least the portion of the housing containing the transmitting antenna and the transmitting transmission path, and the portion of the housing containing the receiving antenna and the receiving transmission path, are entirely made of an electromagnetic wave transparent material.

[0066] When inserted into the soil, the measurement unit housing 310 containing the measurement unit substrate is arranged upright relative to the soil (in other words, it is arranged extending in the direction of the first plane). More specifically, the thickness (size in the Z-axis direction) of this measurement unit housing 310 is smaller than both the width (size in the X-axis direction) and height (size in the Y-axis direction) of the measurement unit housing 310.

[0067] The sensor housing 305 including the reinforcing portion 360 is formed of an electromagnetic wave transparent material. Examples of the electromagnetic wave transparent material include polymeric materials, glass, and inorganic materials such as PTEF (PolyTEtraFluoroethylene). Examples of polymeric materials that can be used include PC (PolyCarbonate), PES (PolyEtherSulfone), PEEK (PolyEtherEtherKetone), and PSS (PolyStyrene Sulfonic acid). Other examples of polymeric materials that can be used include PMMA (PolyMethylMethAcrylate) and PET (PolyEthylene Terephthalate).

[0068] Fig. 6 is another example of the first embodiment of the present technology, and is an example of an overall view of a moisture measurement system 100 in which the lengths of the transmitting probes and receiving probes provided in sensor devices 200 and 201 are increased and the number of antennas arranged on the transmitting probes and receiving probes is increased compared to the moisture measurement system 100 shown in Fig. 1. The moisture measurement system 100 shown in Fig. 6 is different from the moisture measurement system 100 shown in Fig. 1 in that the lengths of the transmitting probes and receiving probes are increased and the number of antennas arranged on the transmitting probes and receiving probes is increased, and further, as will be described later with reference to Figs. 7 and 8, a reinforcing portion 361 that improves the strength of the transmitting probes and receiving probes is added, thereby making it possible to measure soil moisture more accurately over a wider area of the soil (particularly deeper in the soil) than the moisture measurement system 100 shown in Fig. 1.

[0069] FIG. 7 is an example of an overall view of the sensor device 200 provided in the moisture measurement system 100 shown in FIG. 6. Compared to the sensor device 200 shown in FIG. 4, the sensor device 200 shown in FIG. 7 has a longer transmitting probe and a receiving probe, a larger number of antennas arranged on the transmitting probe and the receiving probe, and an additional reinforcing portion 361 that improves the strength of the transmitting probe and the receiving probe. In the example shown in FIG. 7, elements 330 to 339 are provided, forming five transmitting antennas and five receiving antennas. Note that in FIG. 7 only, elements 330 to 334 represent radiating elements, and elements 335 to 339 represent receiving elements.

[0070] Fig. 8 is an example of an overall view of the sensor housing 305 provided in the sensor device 200 shown in Fig. 7. A reinforcing portion 361 is added to the lower portion of the probe housing 320 to improve the strength of the housing.

[0071] If the probe housing 320 is long and the soil is hard, when stress is applied to the sensor device 200 to insert it into the soil, the probe housing 320 may deform, and the distance between the transmitting antenna and the receiving antenna may become different from the designed distance. The addition of the reinforcing portion 361 reduces the possibility of such deformation. Also, if the soil is hard, when stress is applied to the sensor device 200 to insert it into the soil, there is a possibility that the measurement unit housing 310 and the probe housing 320 may break apart. The addition of the reinforcing portion 361 reduces the possibility of such breakage.

[0072] FIG. 9 is yet another example of the first embodiment of the present technology, and is an example of an overall diagram of a moisture measurement system 100 in which the number of antennas is reduced compared to the moisture measurement system 100 shown in FIG. 1 . As illustrated in the figure, the number of antennas of the sensor device 200 and the like can be reduced to one on each of the transmitting and receiving sides. Reducing the number of antennas allows the moisture content of soil to be measured using simpler components (a configuration with fewer parts). Furthermore, a means for driving multiple antennas is also unnecessary. In this case, components (5) and (6) are unnecessary. Furthermore, when there is only one transmitting antenna and one receiving antenna, the transmission path connection between two orthogonally arranged boards (i.e., between the measurement unit board 311 and the internal probe board 321, and between the measurement unit board 311 and the internal probe board 322) can be formed using a metal connector such as an SMA connector. In this case, component (7) is also unnecessary.

[0073] FIG. 10 is an example of an overall view of the sensor device 200 provided in the moisture measurement system 100 shown in FIG.

[0074] FIG. 11 is an example of an overall view of the sensor housing 305 provided in the sensor device 200 shown in FIG.

[0075] FIG. 12 is yet another example of the first embodiment of the present technology, showing an example of an overall view of the moisture measurement system 100 in which the housings of the sensor devices 200 and 201 are each separated into two. As shown in the figure, the measurement unit housing 310 and the probe housing 320 can also be separated. The transmission paths formed on the measurement unit board 311 and the transmission paths formed on the probe internal boards 321 and 322 are connected by cables (e.g., coaxial cables). The number of antennas on the probe housing 320 is one on the transmitting side and one on the receiving side. In this case, components (5) to (7) are unnecessary. Furthermore, if the measurement unit housing 310 and the probe housing 320 are disposed at positions separated from each other and the orientation of the measurement unit housing 310 with respect to the soil surface does not affect rainfall or watering on the soil between the probe housings 320a and 320b, which are the measurement targets for soil moisture measurement, component (4) is also unnecessary.

[0076] FIG. 13 is an example of an overall view of the sensor device 200 provided in the moisture measurement system 100 shown in FIG. 12. In this figure, there is one antenna on the transmitting side and one on the receiving side. Measurement unit housing 310 housing measurement unit substrate 311 forms a single independent housing. Furthermore, probe housing 320a housing probe internal substrate 320a on which transmitting antenna 330 is formed and probe housing 320b housing probe internal substrate 322 on which receiving antenna 331 is formed are connected to form a single independent probe housing 320. Probe housing 320 further includes a reinforcing portion 360.

[0077] FIG. 14 is an example of an overall view of the sensor housing 305 provided in the sensor device 200 shown in FIG.

[0078] FIG. 15 is yet another example of the first embodiment of the present technology, and is an example of an overall view of a moisture measurement system 100 in which the housings of the sensor devices 200 and 201 are separated and multiple probe housings are provided for each sensor device. As illustrated in the figure, the sensor devices 200 and 201 each have multiple transmitting antennas and receiving antennas. Each of the sensor devices 200 and 201 has one transmitting antenna and one receiving antenna as a pair, and a probe housing is provided for each pair of antennas. As illustrated in the figure, each sensor device 200 is configured to have a measurement unit housing 310 and multiple probe housings such as probe housings 320, 320-1, and 320-2. Each probe housing has one antenna on the transmitting side and one antenna on the receiving side. In this case, components (4) and (7) are unnecessary.

[0079] Fig. 16 is an example of an overall view of the sensor device 200 provided in the moisture measurement system 100 shown in Fig. 15. In the case of this figure, there is one antenna on the transmitting side and one antenna on the receiving side.

[0080] Fig. 17 is a block diagram showing an example of the configuration of the sensor device 200 of Fig. 15. As shown in the figure, transmitting probe units 220-1 to 220-3 and receiving probe units 230-1 to 230-3 are arranged in three separate probe housings. Each of these three pairs of units is arranged with an antenna. For example, transmitting antennas 221 to 223 are arranged in the transmitting probe units 220-1 to 220-3, and receiving antennas 231 to 233 are arranged in the receiving probe units 230-1 to 230-3. These antennas are connected to the measurement circuit 210 via transmission paths that are independent of each other.

[0081] 18 is yet another example of the first embodiment of the present technology, and is another example of an overall view of a sensor device 200 that includes multiple transmitting antennas 330 to 332 and multiple receiving antennas (333 to 335), and in which a probe housing 320 that houses these antennas is separated from a measurement unit housing 310 that houses a measurement unit substrate 311. When the measurement unit housing 310 and the probe housing 320 are separated, the number of antennas can be three on the transmitting side and three on the receiving side. In this case, components (4) and (7) are unnecessary.

[0082] [Antenna configuration example] FIG. 19 shows an example of a front view (left view of FIG. 19) of the sensor device 200 according to the first embodiment of the present technology, and an example of a cross-sectional view (right view of FIG. 19) of a transmitting antenna 223 and its vicinity provided on a probe substrate 321 when the sensor device 200 is viewed from the front. This figure shows an example of a cross-sectional view of the transmitting antenna 223 and its vicinity when viewed from the Z-axis direction. In the right view of FIG. 19, the colored layers represent, from left to right, a radio wave absorber 251, a general solder resist 252, a conductive shielding layer 254, a conductive signal line 255, a conductive shielding layer 256, a solder resist 253, and the radio wave absorber 251. The uncolored layer between the shielding layer 254 and the signal line 255 and the uncolored layer between the shielding layer 254 and the signal line 255 represent insulators. Note that the solder resist and insulators transmit electromagnetic waves. The number of layers of an electronic substrate (wiring substrate) is usually determined by the number of conductive layers included in the substrate. For this reason, the board in the right diagram of Figure 19 is called a three-layer board. However, in this specification, focusing on the transmission and shielding of electromagnetic waves and the absorption of electromagnetic waves, the radio wave absorber 251, shield layer 254, signal line 255, shield layer 256, and radio wave absorber 251 may be referred to as the first layer, second layer, third layer, fourth layer, and fifth layer, respectively, for convenience. The cross-sectional views of transmitting antennas 221 and 222 are similar to that of transmitting antenna 223. If the direction from the transmitting side to the receiving side is taken as the right direction in the X-axis direction, the cross-sectional views of receiving antennas 231 to 233 are bilaterally symmetrical to transmitting antenna 223.

[0083] FIG. 20 is an example of a plan view of each layer of the transmitting antenna 223 and its vicinity, the cross section of which is shown in the right diagram of FIG. 19. The figure shows a plan view of each layer of the transmitting antenna 223 and its vicinity shown in the right diagram of FIG. 19, when viewed from the X-axis direction of the sensor device 200. In the figure, a is a plan view of the first layer: radio wave absorber 251 in the right diagram of FIG. 18. In the figure, b is a plan view of the second layer: shield layer 254. In the figure, c is a plan view of the third layer: signal line 255. In the figure, d is a plan view of the fourth layer: shield layer 256. In the figure, e is a plan view of the fifth layer: radio wave absorber 251. Also, a cross section taken along line A-A' is shown. The plan view corresponds to the cross-sectional view of FIG.

[0084] The second layer shown in FIG. 20b is the first wiring layer on which the shield layer 254 is wired. The third layer shown in FIG. 20c is the second wiring layer on which the linear signal line 255 is wired. The fourth layer shown in FIG. 20d is the third wiring layer on which the shield layer 256 is wired. The width of the signal line 255 in the Z-axis direction is Dz. The symbol of a square and its diagonal connected by a line segment in FIGS. 20b, 20c, and 20d indicates a via (reference numeral 257 in FIG. 21a) connecting the shield layer 254 shown in FIG. 20b and the shield layer 256 shown in FIG. 20d. In FIGS. 20b and 20d, the symbol indicates the position of the via 257 connecting the shield layer 254 and the shield layer 256. In FIG. 20c, the symbol indicates that the via 257 passes beside the signal line 255. The via 257 keeps the shield layer 254 and the shield layer 256 at the same potential. Of the two dotted lines shown in Fig. 20c, the dotted line closer to "A" in Fig. 20c is the outline of the radio wave absorber 251 shown in Fig. 20e projected onto Fig. 20c for the sake of convenience. The dotted line closer to "A'" in Fig. 20c is the outline of the shield layer 256 shown in Fig. 20d projected onto Fig. 20c. The dotted lines in Figures 20d and 20e are projections of the outline of the signal line 255 in Figure 20c onto Figures 20d and 20e for the sake of convenience.

[0085] 21 is an example of a cross-sectional view of the transmitting antenna 223 and its vicinity, as viewed from above, the cross-sectional view of which is shown in the right diagram of FIG. 19. The line a in FIG. 21 is cut along the line B-B' in FIG. 21b is a cross-sectional view taken along the line CC' in FIG. 20. FIG.

[0086] The cross section of the receiving probe is the same as that of the transmitting probe. The transmitting probe is covered with a radio wave absorbing material 251. This radio wave absorbing material 251 forms a radio wave absorbing section 341 and the like.

[0087] In addition, solder resists 252 and 253 are formed between both surfaces of the internal probe substrate 321 and the radio wave absorber 251. The internal probe substrate 321 is formed with a wiring layer on which a shield layer 254 is wired, a wiring layer on which a signal line 255 is wired, and a wiring layer on which a shield layer 256 is wired. As will be described later, the signal line 255 functions as a radiating element in the transmitting antenna. The thickness of the wiring layer on which the signal line 255 serving as the radiating element is wired is defined as Dx. A ground potential is supplied to the shield layers 254 and 256, and the signal line 255 transmits and radiates an AC signal (transmission signal), which is a transmission wave transmitted from the transmitting antenna. Hereinafter, the signal line 255 that transmits and radiates the transmission wave (transmission signal) may be referred to as a signal line layer. Furthermore, the portion of the signal line 255 that is particularly involved in radiating the transmission wave may be referred to as a radiating element. Applying this to a receiving antenna, the signal line 255 that receives and transmits the received wave (received signal) is sometimes called a signal line or signal line layer, and the part of the conductor 255 that is involved in receiving the electromagnetic wave (received wave or received signal) received by the receiving antenna is sometimes called a receiving element.

[0088] 19 to 21 , in an electronic board (intra-probe board) on which a signal line layer (signal line 255) is arranged, shield layers 254 and 256 are arranged on both the back side (the side on which shield layer 254 is arranged) and the front side (the side on which shield layer 256 is arranged) of the board with an insulator between them and the signal line layer. This structure forms a transmission line (strip line) in which both the back side and the front side of the signal line layer are shielded by the shield layers 254 and 256. This transmission line (transmission transmission line) is routed independently for each antenna in the intra-probe board 321, from all transmitting antennas provided in the intra-probe board to a connector 323. Similar transmission lines (receiving transmission lines) are routed independently for each antenna in the intra-probe board 322, from all receiving antennas provided in the intra-probe board to a connector 324.

[0089] 19 to 21, the first layer: rear-side electromagnetic wave absorber 251, the second layer: shield layer 254, the third layer: signal line layer (signal line 255), the fourth layer: shield layer 256, and the fifth layer: front-side electromagnetic wave absorber 251, which are related to the transmission, radiation (or reception), shielding, and absorption of electromagnetic waves, will be further described. In Figures 19 and 20, the direction approaching the source of the transmitted wave (the transmitter provided in the measurement unit) is referred to as the "source direction," and the direction moving away from the source is referred to as the "tip direction" or simply the "forward direction" for convenience. With regard to a receiving antenna, the direction approaching the destination (the receiver provided in the measurement unit) of the signal (received wave) received by the receiving antenna is referred to as the "destination direction," and the direction moving away from the destination is referred to as the "destination direction" or simply the "forward direction" for convenience. As illustrated in the right diagram of FIG. 19 and FIG. 20 , on the back side of the substrate within the probe, a portion of the shield layer 254 is exposed from the back side electromagnetic wave absorbing material 251 beyond the tip of the back side electromagnetic wave absorbing material 251. In other words, a portion of the shield layer 254 is exposed to space. (Note that in this specification, for convenience, a state in which a conductor is not provided with a member that shields or absorbs electromagnetic waves on its outside may be referred to as "the conductor being exposed to space.") Furthermore, on the front side of the substrate within the probe, a portion of the shield layer 256 is exposed from the front side electromagnetic wave absorbing material 251 beyond the tip of the front side electromagnetic wave absorbing material 251. In other words, a portion of the shield layer 256 is exposed to space. Furthermore, a portion of the signal line layer (signal line 255) is exposed from the shield layer 256 beyond the tip of the shield layer 256. In other words, a portion of the signal line layer is exposed to space. Of the signal line layer, the portion exposed from this shield layer 256 (portion exposed to space) functions as a radiating element that transmits a transmitted wave. (In the case of a receiving antenna, the portion of the signal line layer exposed from the shield layer 256 (portion exposed to space) functions as a receiving element that receives an electromagnetic wave (a transmitted wave propagating through a medium from the transmitting antenna, in other words, a received wave).) In the case of the transmitting antenna 223, this corresponds to the radiating element 332. (In the case of the receiving antenna 233, this corresponds to the receiving element 335.) On the surface where the radiating element extends and is exposed from the shield layer, the transmission wave is radiated most strongly in the direction perpendicular to this surface. This direction in which the transmission wave is radiated most strongly is called the "main radiation direction" or simply the "electromagnetic wave radiation direction." Furthermore, a part of the shield layer that is exposed from the electromagnetic wave absorber 251 (in other words, exposed to space) and is arranged in a direction that radiates electromagnetic waves more than the radiating element is called the "exposed shield part" or simply the "shield part." These exposed shield parts and the radiating element function as the transmitting antenna 223. Here, the length of the radiating element in the Y-axis direction is defined as Dy. Of the exposed shield parts exposed to space, the part that is arranged in an area that is the same length as or shorter than the length Dy of the radiating element from the line end of the exposed shield part toward the transmitter (the negative direction of the Y-axis in Figures 19 and 20) functions particularly effectively as part of the transmitting antenna 223. Therefore, in this specification, for convenience, a structure consisting of (1) a radiating element (a signal line layer exposed from the shield layer and exposed to space) and (2) a portion of the exposed shield portion exposed from the electromagnetic wave absorbing material and exposed to space, which is located in a region that is the same length as the radiating element or within a distance from the tip of the exposed shield portion toward the transmitter (the negative direction of the Y axis in Figures 19 and 20), may be referred to as a "transmitting antenna." The same applies to a receiving antenna. In this specification, a structure consisting of (1) a receiving element (a signal line layer exposed from the shield layer and exposed to space) and (2) a portion of the exposed shield portion exposed from the electromagnetic wave absorbing material and exposed to space, which is located in a region that is the same length as the receiving element or within a distance from the tip of the exposed shield portion toward the receiver (the negative direction of the Y axis in Figures 18 and 19), may be referred to as a "receiving antenna."

[0090] As illustrated in FIGS. 19 to 21, the planar transmitting antenna 223 includes a shield and a radiating element. The transmitting antenna 223 is formed using an electronic substrate (such as the probe internal substrate 321) with multiple wiring layers. The radiating element has a size Dz in a second direction (the width direction of the electronic substrate, the Z-axis direction in the figure) perpendicular to a first direction (the thickness direction of the electronic substrate, the X-axis direction in the figure) that is larger than the size Dx in the first direction. Furthermore, a size Dy in a third direction (the length direction of the electronic substrate, the Y-axis direction in the figure) perpendicular to both the first and second directions is larger than Dx. In this specification, when both Dz and Dy are larger than Dx for a radiating element included in a transmitting antenna, the transmitting antenna is defined as a "planar antenna" and a "planar transmitting antenna." A portion of the radiating element that extends on a plane defined by the second and third directions is defined as the "plane of the radiating element." Note that, with respect to a transmitting antenna, Dy may preferably be greater than both Dx and Dz. The same applies to a receiving antenna. Referring to FIGS. 19 to 21, the structure of a receiving antenna will be described. In a receiving element of the receiving antenna, the size Dz in a second direction (the width direction of the electronic board, the Z-axis direction in the figure) perpendicular to the first direction (the thickness direction of the electronic board, the X-axis direction in the figure) is greater than the size Dx in the first direction. Furthermore, the size Dy in a third direction (the length direction of the electronic board, the Y-axis direction in the figure) perpendicular to both the first and second directions is greater than Dx. In this specification, when both Dz and Dy are greater than Dx in a receiving element of a receiving antenna, the receiving antenna is defined as a "planar antenna" and a "planar receiving antenna." Furthermore, a portion of the receiving element that extends on the plane defined by the second and third directions is defined as the "plane of the receiving element." Regarding the receiving antenna, Dy may preferably be greater than both Dx and Dz.

[0091] 20 and 21, the periphery of a transmission line (the periphery of a cross section perpendicular to the extension direction of the transmission line) including signal line 255 to which a signal is applied and shield layer 256 to which a ground potential is applied is covered, surrounded, or wrapped with radio wave absorbing material 251. This radio wave absorbing material 251 extends along the extension direction of the transmission line (Y-axis direction), and an antenna (transmitting antenna or receiving antenna) is connected to the tip of the outer edge of the transmission line covered by radio wave absorbing material 251.

[0092] As shown in Fig. 19, the antenna is formed on an electronic substrate (such as probe internal substrate 321) that has at least three stacked wiring layers (first, second, and third wiring layers in this order from the back surface to the front surface). The antenna has signal line 255 to which a signal is applied, and shield layers 254 and 256 to which a ground potential is applied. Signal line 255 to which a signal is applied in the antenna is formed on the second wiring layer. Shield layer 254 is formed on the first wiring layer, and shield layer 256 is formed on the third wiring layer.

[0093] 20, when the shape of the signal line 255 formed in the second wiring layer is projected onto the third wiring layer, at least a part of the projection of the conductor 255 extends to an area where the shield layer 256 is not arranged. When the shape of the signal line 255 is projected onto the first wiring layer, the shield layer 254 of the first wiring layer is arranged at the position where the projection of the signal line 255 is arranged.

[0094] 19, electromagnetic waves are radiated from the planar transmitting antenna 223 toward the surface (to the right on the page, in the positive direction of the X-axis). An antenna in which electromagnetic waves are radiated from one side of the plane of the planar radiating element in this way is called a "single-sided radiation antenna," and in this specification, this is referred to as the "first structure" of the antenna. In the case of a receiving antenna, an antenna in which electromagnetic waves are received from one side of the plane of the planar receiving element is called a "single-sided reception antenna," and this type of receiving antenna corresponds to the first structure.

[0095] 22 is a cross-sectional view illustrating another example of the first structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front, similar to Fig. 4b. The drawing is an example of a cross-sectional view of the transmitting antenna 223 and its vicinity when viewed from the Z-axis direction.

[0096] FIG. 23 is a plan view of each layer of another example of the first structure, the cross section of which is shown in FIG.

[0097] FIG. 24 is a cross-sectional view of another example of the first structure, the cross-section of which is shown in FIG. 22, as viewed from above.

[0098] 22 to 24, (1) the first wiring layer (shield layer 254) to which a ground potential is applied extends beyond the radiating element (signal line 255), which is the same as the first structure. However, (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the radiating element using a second wiring layer that is part of the second wiring layer and is different from the radiating element and the signal line. And (3) the third wiring layer (shield layer 256) extends beyond the radiating element, avoiding the projection of the radiating element onto the third wiring layer (dotted line in FIG. 23d) and passing beside this projection, so as not to overlap with the radiating element. This shape has the effect of facilitating wiring of at least the shield layer 256 that applies a ground potential to the radiating element when a different transmitting antenna is placed beyond the transmitting antenna 223 shown in FIGS. 22 to 24. The same applies to the receiving antenna. While this structure is the same as the first structure in that (1) the first wiring layer (shield layer 254) to which a ground potential is applied extends beyond the receiving element (signal line 255), (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the receiving element using a second wiring layer that is part of the second wiring layer and is different from the receiving element and the signal line, and (3) the third wiring layer (shield layer 256) extends beyond the receiving element, avoiding the projection of the receiving element onto the third wiring layer (dotted line in FIG. 23d) and passing beside this projection so as not to overlap with the receiving element. This shape has the effect of facilitating wiring of at least the shield layer 256 that applies a ground potential to the receiving antenna 233 shown in FIGS. 22 to 24 when a different receiving antenna is placed beyond the receiving antenna.

[0099] Figure 25 is an example of a cross-sectional view of the second structure relating to the transmitting antenna 223 provided on the probe internal substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front, similar to Figure 4b.

[0100] FIG. 24 is an example of a plan view of each layer of the second structure, the cross section of which is shown in FIG.

[0101] FIG. 27 is an example of a cross-sectional view of the second structure, the cross-section of which is shown in FIG. 25, viewed from above.

[0102] As shown in Figures 25 and 26, in the second structure, when the shape of the signal line 255 formed on the second wiring layer to which a signal is applied is projected onto the first wiring layer arranged on the back side (leftward on the paper, in the negative direction of the X-axis), at least a portion of the projection of the signal line 255 extends into an area where no conductor 254 is arranged, as with the third wiring layer arranged on the front side (rightward on the paper, in the positive direction of the X-axis). Due to this shape, in the transmitting antenna 223 shown in Figure 25, electromagnetic waves are radiated from the planar transmitting antenna 223 in both the front side (rightward on the paper, in the positive direction of the X-axis) and the back side (leftward on the paper, in the negative direction of the X-axis). An antenna in which electromagnetic waves are radiated from both sides of the plane of the planar radiating element in this way is called a "dual-side radiation antenna," and this specification refers to this antenna as the "second structure." A transmitting antenna with this structure has the advantage of being able to radiate electromagnetic waves (transmitted waves) more efficiently than a transmitting antenna with the first structure. In the case of a receiving antenna, an antenna that receives electromagnetic waves from both sides of the plane of the planar receiving element is called a "double-sided receiving antenna," and this type of receiving antenna corresponds to the second structure. A receiving antenna with this structure has the effect of being able to receive electromagnetic waves (transmitted waves propagating through the medium from the transmitting antenna, in other words, received waves) more efficiently than a receiving antenna with the first structure.

[0103] 28 is a cross-sectional view illustrating another example of the second structure of the sensor device 200 according to the first embodiment of the present technology when viewed from the front, similar to Fig. 4b. This figure is an example of a cross-sectional view of the transmitting antenna 223 and its vicinity when viewed from the Z-axis direction.

[0104] FIG. 29 is a layer-by-layer plan view of another example of the second structure, the cross section of which is shown in FIG.

[0105] FIG. 230 is a cross-sectional view of another example of the second structure, the cross-section of which is shown in FIG. 28, as viewed from above.

[0106] In another example of the second structure illustrated in FIGS. 28 to 30, (1) the first wiring layer (shield layer 254) extends beyond the radiating element by passing beside the projection (dotted line in FIG. 29b) of the radiating element onto the first wiring layer so as not to overlap with the radiating element, (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the radiating element by using a second wiring layer that is a part of the second wiring layer and is different from the radiating element and the signal line, and (3) the third wiring layer (shield layer 256) extends beyond the radiating element by passing beside the projection (dotted line in FIG. 29d) of the radiating element onto the third wiring layer so as not to overlap with the radiating element. This shape has the advantage that, when a different transmitting antenna is placed beyond the transmitting antenna 223 shown in Figures 28 to 30, it is possible to easily wire at least the shield layers 254 and 256 that apply a ground potential to the transmitting antenna. The same applies to the receiving antenna. This structure differs from the second structure in the following points: (1) the first wiring layer (shield layer 254) extends beyond the receiving element, avoiding the projection of the receiving element onto the first wiring layer (dotted line in Figure 29b) and passing to the side of this projection so as not to overlap with the receiving element; (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the receiving element using a second wiring layer that is part of the second wiring layer and is different from the receiving element and signal line; and (3) the third wiring layer (shield layer 256) extends beyond the receiving element, avoiding the projection of the receiving element onto the third wiring layer (dotted line in Figure 29d) so as not to overlap with the receiving element, passing to the side of this projection. This shape has the advantage that when a different receiving antenna is placed beyond the receiving antenna 223 shown in Figures 28 to 30, it is easy to wire at least the shield layers 254 and 256 that apply ground potential to that antenna.

[0107] Figure 31 is an example of a cross-sectional view of the third structure relating to the transmitting antenna 223 provided on the probe internal substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front, similar to Figure 4b.

[0108] FIG. 32 is an example of a plan view of each layer of the third structure whose cross section is shown in FIG.

[0109] FIG. 33 is an example of a cross-sectional view of the third structure, the cross-section of which is shown in FIG. 31, viewed from above.

[0110] 31 and 32, in the third structure, (1) in the third wiring layer, which is the wiring layer closest to the surface (the rightmost side of the paper in FIG. 30, the most positive direction of the X-axis), a shield layer 256 is formed using a part of this third wiring layer. (2) Furthermore, a radiating element (conductor 258) is formed in a region beyond the shield layer 256 using a third wiring layer that is part of the third wiring layer and different from the shield layer 256. Then, a via is provided to connect the radiating element formed using the third wiring layer and the signal line 255 formed using the second wiring layer, thereby electrically connecting the radiating element and the signal line 255. In FIG. 31, the colored portion (hatched portion) between the radiating element and the signal line 255 represents this via. In Figure 32, the position of this via is indicated by a symbol formed by a square and its diagonal connected by a line segment, located within the radiating element in Figure 32d, and the same symbol as above, located within signal line 255 in Figure 32c. (3) Similar to the first structure, the first wiring layer (shield layer 254), which is the wiring layer located on the rearmost side (the rightmost side of the paper in Figure 31, the most negative direction on the X-axis) and to which ground potential is applied, extends further beyond the radiating element. Due to this shape, in the third structure, the radiating element is formed using the wiring layer (surface wiring layer) on the top surface of one side of the internal probe substrate 321 that forms the transmitting antenna, forming a one-sided radiation antenna exposed to space. Compared to the transmitting antenna of the first structure, the transmitting antenna of this structure has the effect of more efficiently radiating electromagnetic waves (transmitting waves). In the case of a receiving antenna, the receiving element is formed using the outermost wiring layer (surface wiring layer) on one side of the internal probe substrate 322 that forms the receiving antenna, and this is an antenna for one-sided reception, which is exposed to space, corresponds to the third structure. A receiving antenna with this structure has the effect of being able to receive electromagnetic waves (transmitted waves propagating through a medium from the transmitting antenna, in other words, received waves) more efficiently than a receiving antenna with the first structure.

[0111] Fig. 34 is a cross-sectional view illustrating another example of the third structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front, similar to Fig. 4b. The drawing is an example of a cross-sectional view of the transmitting antenna 223 and its vicinity when viewed from the Z-axis direction.

[0112] FIG. 35 is an example of a plan view of each layer of another example of the third structure, the cross section of which is shown in FIG.

[0113] FIG. 36 is an example of a cross-sectional view of another example of the third structure, the cross-section of which is shown in FIG. 34, as viewed from above.

[0114] 34 to 36, (1) the first wiring layer (shield layer 254) to which a ground potential is applied extends beyond the radiating element, which is the same as the third structure. However, (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the signal line using a second wiring layer that is part of the second wiring layer and is different from the signal line, and (3) the shield layer 256, of the shield layer 256 and radiating element formed using the third wiring layer, extends beyond the radiating element by passing beside the radiating element. This shape has the effect of facilitating wiring of at least the conductor 256 to apply a ground potential to the radiating element when a different transmitting antenna is placed beyond the transmitting antenna 223 shown in FIGS. 34 to 36. The same applies to the receiving antenna. While this structure is the same as the third structure in that (1) the first wiring layer (shield layer 254) to which a ground potential is applied extends further beyond the radiating element, (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the signal line using a second wiring layer that is part of the second wiring layer and different from the signal line, and (3) of the shield layer 256 and receiving element (conductor 258) formed using the third wiring layer, the shield layer 256 passes beside the receiving element and extends beyond the radiating element. This shape has the effect of facilitating wiring of at least the shield layer 256 that applies a ground potential to the receiving antenna 223 shown in Figures 34 to 36 when a different receiving antenna is placed beyond this.

[0115] Figure 37 is an example of a cross-sectional view of the fourth structure relating to the transmitting antenna 223 provided on the probe internal substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front as in Figure 4b.

[0116] FIG. 38 is an example of a plan view of each layer of the fourth structure whose cross section is shown in FIG.

[0117] FIG. 39 is an example of a cross-sectional view of the fourth structure, the cross-section of which is shown in FIG. 37, viewed from above.

[0118] 37 and 38, in the fourth structure, (1) as in the third structure, in the third wiring layer which is the wiring layer closest to the front surface (the rightmost wiring layer in FIG. 37, the most positive direction of the X-axis), a shield layer 256 is formed using a part of this third wiring layer. (2) Furthermore, as in the third structure, a radiating element is formed in a region beyond the shield layer 256 using a third wiring layer which is part of the third wiring layer and different from the shield layer 256. Then, a via is provided to connect the radiating element formed using the third wiring layer and the signal line 255 formed using the second wiring layer, thereby electrically connecting the radiating element and the signal line 255. (3) As in (1) above, in the first wiring layer which is the wiring layer closest to the back surface (the leftmost wiring layer in FIG. 37, the most negative direction of the X-axis), a shield layer 254 is formed using a part of this first wiring layer. (4) Furthermore, in the same manner as in (2) above, a radiating element (conductor 259) is formed in a region beyond the shield layer 254 using a first wiring layer that is part of the first wiring layer and different from the shield layer 254. A via is provided to connect the radiating element formed using the first wiring layer and the signal line 255 formed using the second wiring layer, thereby electrically connecting the radiating element and the signal line 255. Due to this configuration, in the fourth structure, the radiating element is formed using the outermost wiring layers (surface wiring layers) on both sides of the internal probe substrate 321 that forms the transmitting antenna, and this is exposed to space, forming a double-sided radiation antenna. A transmitting antenna with this structure has the advantage of being able to radiate electromagnetic waves (transmitted waves) more efficiently than any of the transmitting antennas of the first to third structures. In the case of a receiving antenna, a double-sided receiving antenna in which the receiving element is formed using the outermost wiring layers (surface wiring layers) on both sides of the internal probe substrate 322 that forms the receiving antenna, and this is exposed to space corresponds to the fourth structure. A receiving antenna with this structure has the advantage of being able to receive electromagnetic waves (transmitted waves propagating through the medium from the transmitting antenna, in other words, received waves) more efficiently than a receiving antenna with the first structure.

[0119] Fig. 40 is a cross-sectional view illustrating another example of the fourth structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front, similar to Fig. 4b. The drawing is an example of a cross-sectional view of the transmitting antenna 223 and its vicinity when viewed from the Z-axis direction.

[0120] FIG. 41 is an example of a plan view of each layer of another example of the fourth structure, the cross section of which is shown in FIG.

[0121] FIG. 42 is an example of a cross-sectional view of another example of the fourth structure, the cross-section of which is shown in FIG. 40, as viewed from above.

[0122] 40 to 42, this example differs from the fourth structure in the following points: (1) of the shield layer 254 and radiating element formed using the first wiring layer, the shield layer 254 passes beside the radiating element and extends beyond the radiating element; (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the signal line using a second wiring layer that is part of the second wiring layer and different from the signal line; and (3) of the shield layer 256 and radiating element formed using the third wiring layer, the shield layer 256 passes beside the radiating element and extends beyond the radiating element. This shape has the advantage that, when a different transmitting antenna is placed beyond the transmitting antenna 223 shown in FIGS. 40 to 42, it is possible to easily wire the shield layers 254 and 256 that apply a ground potential to at least the transmitting antenna. The same applies to the receiving antenna. This structure differs from the fourth structure in that (1) of the shield layer 254 and receiving element formed using the first wiring layer, the shield layer 254 passes beside the receiving element and extends beyond the receiving element, (2) a conductor 257 to which a ground potential is applied is formed in a region beyond the signal line using a second wiring layer that is part of the second wiring layer and different from the signal line, and (3) of the shield layer 256 and receiving element formed using the third wiring layer, the shield layer 256 passes beside the receiving element and extends beyond the radiating element. This shape has the advantage that, when a different receiving antenna is placed beyond the receiving antenna 223 shown in Figures 40 to 42, it is possible to easily wire the shield layers 254 and 256 that apply a ground potential to at least that antenna.

[0123] FIG. 43 is a diagram showing an example of the shape of a transmitting antenna 223 applied to the first structure in the first embodiment of the present technology. In the figure, the tip of the electromagnetic wave absorbing material 251 and the tip of the shielding layer are at the same position, and a signal line 255 (radiating element shown by a solid line) that provides a transmission wave (transmitting signal) is exposed further beyond these tips. In this way, the transmitting antenna 223 can also be configured so that the shielding layer 256 (shielding portion) is not exposed from the tip of the electromagnetic wave absorbing material 251. In this case, as illustrated in FIG. 43a, the signal line 255 (in other words, the radiating element shown by a solid line) exposed from the tip of the electromagnetic wave absorbing material 251 can be made the same width as the strip line (signal line 255) shown by a dotted line below the electromagnetic wave absorbing material 251. The direction perpendicular to the paper surface is the main radiation direction of the radio wave (X-axis direction). The shape of the receiving antenna 233 can also be the shape shown in FIG. 43a. In this case, the radiating element of the transmitting antenna 223 becomes the receiving element of the receiving antenna 233. By using this antenna facing the transmitting antenna and the receiving antenna, the gain of the antenna is improved.

[0124] As illustrated in FIG. 43 b, the width of the radiating element shown by the solid line can be made wider than the width of the stripline (signal line 255) shown by the dotted line. As illustrated in FIG. 43 c, a meandered radiating element can also be formed. As illustrated in FIG. 43 d, a spiral radiating element can also be formed. As illustrated in FIG. 43 e, a plurality of radiating elements wider than the width of the stripline (signal line 255) can also be formed. As illustrated in FIG. 43 f, a radiating element wider than the width of the stripline can be formed, and a slit can be provided at the connection point with the stripline.

[0125] The shapes of b to e in the figure can improve the gain in the main radiation direction more than in a in the figure. The shape of f in the figure can achieve better impedance matching than in b in the figure, allowing radio waves to be radiated more efficiently. The shape of the receiving antenna 233 can also be the shapes shown in Figures 43 a to f. In this case, the radiation element in the transmitting antenna 223 becomes the receiving element in the receiving antenna 233.

[0126] Fig. 44 is a diagram showing another example of the shape of the transmitting antenna 223 applied to the first structure according to the first embodiment of the present technology. Fig. 44a to f corresponds to Fig. 43a to f, in which the shield layer 256 (shield portion) is exposed from the tip of the electromagnetic wave absorbing material 251.

[0127] In a in Figure 44, high-frequency current also flows in the shielding layer in the main radiation direction, which becomes part of the antenna, resulting in a higher gain than in a in Figure 43. The shapes of b to e in Figure 44 can improve the gain in the main radiation direction more than in a in the same figure. The shape of f in the same figure can achieve better impedance matching than in b in the same figure, allowing for more efficient radiation of radio waves. The shape of the receiving antenna 233 can also be one shown in Figures 44a to 44f. In this case, the radiating element in the transmitting antenna 223 becomes the receiving element in the receiving antenna 233.

[0128] Moreover, the shapes of FIGS. 43 and 44 can also be applied to the second structure.

[0129] FIG. 45 is a diagram showing an example of the shape of a transmitting antenna 223 applied to the third structure according to the first embodiment of the present technology. In the figure, the tip of the electromagnetic wave absorbing material 251 and the tip of the shielding layer are at the same position, and a signal line 255 (radiating element) that provides a transmission wave (transmitting signal) is exposed further beyond these tips. In this way, the transmitting antenna 223 can also be configured so that the shielding layer 256 (shielding portion) is not exposed from the tip of the electromagnetic wave absorbing material 251. In this case, as illustrated in FIG. 45 a, the width of the radiating element can be made wider than the width of the stripline indicated by the dotted line. As illustrated in FIG. 45 b, a meander-structured radiating element can also be formed. As illustrated in FIG. 45 c, a spiral-shaped radiating element can also be formed. As illustrated in FIG. 45 d, multiple radiating elements wider than the width of the stripline can also be formed. As illustrated in FIG. 45 e, a radiating element wider than the width of the stripline (signal line 255) can be formed, and a slit can be provided at the connection portion with the stripline.

[0130] The shape a in FIG. 45 allows for better impedance matching than the shape a in FIG. 43, and allows for more efficient radio wave radiation. The shapes b to d in FIG. 45 allow for better gain in the main radiation direction than the shape a in the same figure. The shape e in the same figure allows for better impedance matching than the shape a in the same figure, and allows for more efficient radio wave radiation. The shape of the receiving antenna 233 can also be the shapes shown in FIGS. 45a to 45e. In this case, the radiating element in the transmitting antenna 223 becomes the receiving element in the receiving antenna 233.

[0131] Fig. 46 is a diagram showing another example of the shape of the transmitting antenna 223 applied to the third structure according to the first embodiment of the present technology. Fig. 46(a) to (e) correspond to Fig. 45(a) to (e) in which the shield layer 256 (shield portion) is exposed from the tip of the electromagnetic wave absorbing material 251.

[0132] In a in Figure 46, high-frequency current also flows in the shielding layer in the main radiation direction, which becomes part of the antenna, resulting in a higher gain than in a in Figure 45. The shapes of b to d in Figure 46 can improve the gain in the main radiation direction more than in a in the same figure. The shape of e in the same figure can achieve better impedance matching than in a in the same figure, allowing radio waves to be radiated more efficiently. The shape of the receiving antenna 233 can also be the shapes shown in Figures 46a to 46e. In this case, the radiating element in the transmitting antenna 223 becomes the receiving element in the receiving antenna 233.

[0133] Moreover, the shapes of FIGS. 45 and 46 can also be applied to the fourth structure.

[0134] Fig. 47 is a cross-sectional view of a transmitting antenna 233 applied to the third structure according to the first embodiment of the present technology, as seen from the front, similar to Fig. 4b. Fig. 47a corresponds to the cross-sectional view of Fig. 46a when seen from the front (Z-axis direction).

[0135] 47A, the radiating element (conductor 258) is formed using the surface layer of the intra-probe substrate 321. As shown in b in the same figure, the radiating element 258 can also be formed using the inner layer of the intra-probe substrate 321, rather than using the surface layer. When applied to the fourth structure, as shown in c in the same figure, both of the conductors 258 and 259 can also be formed using the inner layer.

[0136] Figure 48 is an example of a cross-sectional view of the fifth structure relating to the transmitting antenna 223 provided on the probe substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) as in Figure 4b.

[0137] FIG. 49 is an example of a plan view of each layer of the fifth structure, the cross section of which is shown in FIG.

[0138] FIG. 50 is an example of a cross-sectional view of the fifth structure, the cross-section of which is shown in FIG. 48, viewed from above.

[0139] The transmitting antenna 223 of the fifth structure shown in FIGS. 48 to 50 is obtained by changing the transmitting antenna 232 of the first structure shown in FIGS. 19 to 21 into a planar, slot-shaped antenna.

[0140] In the case of a transmitting antenna, the "planar and slot-shaped antenna" is a shielding layer that is exposed from the electromagnetic wave absorbing material 251 and exposed to space, and the shielding layer with slots (in the examples of Figures 48 to 50, the shielding layer 256) serves as the radiating element. The "planar and slot-shaped antenna" comprises this radiating element 256, a dielectric (or insulator), and a power feeding part (signal line 255 to which a signal is supplied) that is superimposed on the slot with the dielectric (or insulator) sandwiched between them and that crosses the slot. Similarly, in the case of a receiving antenna, the shielding layer that is exposed from the electromagnetic wave absorbing material 251 and exposed to space, and the shielding layer with slots (in the examples of Figures 48 to 50, the shielding layer 256) serves as the receiving element 256. The "planar and slot-shaped antenna" comprises this receiving element, a dielectric (or insulator), and a power feeding part (signal line 255 to which a signal is supplied) that is superimposed on the slot with the dielectric (or insulator) sandwiched between them and that crosses the slot.

[0141] In FIG. 48, the uncolored layer disposed between the signal line 255 and the shield layer 256 (radiating element 256) corresponds to the dielectric (or insulator).

[0142] 48 to 50, the planar, slot-shaped antenna is formed on an electronic substrate (such as the internal probe substrate 321) having multiple wiring layers. The size Dx of the radiating element (shield layer 256 having a slot) in a first direction (thickness direction of the electronic substrate, the X-axis direction in FIG. 50) (in other words, the size of the slot in the radiating element in the said direction) is larger than both the size Dz of the slot in a second direction (width direction of the electronic substrate, the Z-axis direction in FIG. 49) perpendicular to the first direction and the size Dy of the slot in a third direction (length direction in which the electronic substrate extends, the y-axis direction in FIG. 50) perpendicular to the first and second directions. In this specification, when both Dz and Dy are larger than Dx for a radiating element (shield layer 256 in the examples of FIGS. 48 to 50) provided in a transmitting antenna having a slot, this transmitting antenna is defined as a "planar, slot-shaped antenna" and a "planar, slot-shaped transmitting antenna." A part of the radiating element that extends on the plane defined by the second and third directions is defined as the "plane of the radiating element." Furthermore, the rectangular area defined by the slot width Dz and the slot length Dy shown in FIG. 49d is defined as the area of the transmitting antenna for convenience. The same applies to the receiving antenna. In this specification, for a receiving element (shield layer 256 in the examples of FIGS. 48 to 50) provided in a receiving antenna with a slot, if both Dz and Dy are larger than Dx, the receiving antenna is defined as a "planar and slot-shaped antenna" and a "planar and slot-shaped receiving antenna." Furthermore, a part of the receiving element that extends on the plane defined by the second and third directions is defined as the "plane of the receiving element." Furthermore, the rectangular area defined by the slot width Dz and the slot length Dy shown in FIG. 49d is defined as the area of the receiving antenna for convenience. It should be noted that, for the transmitting antenna and the receiving antenna, Dy may preferably be greater than both Dx and Dz.

[0143] 48 to 50, in the probe internal substrate on which the "planar and slot-shaped antenna" is formed, no slot is formed in the first wiring layer (shield layer 254) on the rearmost side (negative direction of the X-axis), and a slot is formed in the third wiring layer on the frontmost side (positive direction of the X-axis). With this shape, the planar and slot-shaped antenna of the fifth structure becomes a one-sided radiation antenna.

[0144] FIG. 51 is a cross-sectional view illustrating another example of the fifth structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) similarly to FIG. 4b.

[0145] FIG. 52 is an example of a plan view of each layer of another example of the fifth structure, the cross section of which is shown in FIG.

[0146] FIG. 53 is an example of a cross-sectional view of another example of the fifth structure, the cross-section of which is shown in FIG. 51, as viewed from above.

[0147] FIG. 54 is a cross-sectional view illustrating yet another example of the fifth structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) similarly to FIG. 4b.

[0148] FIG. 55 is an example of a plan view of each layer of yet another example of the fifth structure, the cross section of which is shown in FIG.

[0149] FIG. 56 is an example of a cross-sectional view of yet another example of the fifth structure, the cross-section of which is shown in FIG. 54, as viewed from above.

[0150] 51 to 53, as another example of the fifth structure, signal line 255 of a "planar and slot-shaped antenna" can be terminated by connecting it to ground via a resistor 260 of 50 ohms (Ω) or the like in a region beyond the slot of this antenna. Also, as another example of the fifth structure, as shown in FIGS. 54 to 56, signal line 255 of a "planar and slot-shaped antenna" can be terminated by connecting it to another antenna 261 in a region beyond the slot of this antenna.

[0151] Figure 57 is an example of a cross-sectional view of the sixth structure relating to the transmitting antenna 223 provided on the probe substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) as in Figure 4b.

[0152] FIG. 58 is an example of a plan view of each layer of the sixth structure whose cross section is shown in FIG.

[0153] FIG. 59 is an example of a cross-sectional view of the sixth structure, the cross-section of which is shown in FIG. 57, viewed from above.

[0154] The transmitting antenna 223 of the sixth structure shown in Figures 57 to 59 is obtained by modifying the planar and slotted antenna of the fifth structure shown in Figures 48 to 50 into a double-sided radiation antenna. When the "planar and slotted antenna" of the sixth structure is a transmitting antenna, it is a shield layer exposed from the electromagnetic wave absorbing material 251 and exposed to space, and the shield layer with slots (shield layers 256 and 254) serves as the radiation element. With this shape, the planar and slotted antenna of the sixth structure is a double-sided radiation antenna. The same is true for the receiving antenna. When the "planar and slotted antenna" of the sixth structure shown in Figures 57 to 59 is a receiving antenna, it is a shield layer exposed from the electromagnetic wave absorbing material 251 and exposed to space, and the shield layer with slots (shield layers 256 and 254) serves as the receiving element.

[0155] FIG. 60 is a cross-sectional view illustrating another example of the sixth structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) similarly to FIG. 4b.

[0156] FIG. 61 is an example of a plan view of each layer of another example of the sixth structure, the cross section of which is shown in FIG.

[0157] FIG. 62 is an example of a cross-sectional view of another example of the sixth structure, the cross-section of which is shown in FIG. 60, viewed from above.

[0158] FIG. 63 is a cross-sectional view illustrating yet another example of the sixth structure when the sensor device 200 according to the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) similarly to FIG. 4b.

[0159] FIG. 64 is an example of a plan view of each layer of yet another example of the sixth structure, the cross section of which is shown in FIG.

[0160] FIG. 65 is an example of a cross-sectional view of yet another example of the sixth structure, the cross-section of which is shown in FIG. 63, as viewed from above.

[0161] 60 to 62, as another example of the sixth structure, the signal line 255 of the "planar and slot-shaped antenna" can be terminated by connecting it to ground via a resistor 260 of 50 ohms (Ω) or the like in a region beyond the slot of the antenna. Also, as another example of the sixth structure, as shown in FIGS. 63 to 65, the signal line 255 of the "planar and slot-shaped antenna" can be terminated by connecting it to another antenna 261 in a region beyond the slot of the antenna.

[0162] Figure 66 is an example of a cross-sectional view of the seventh structure relating to the planar, slot-shaped transmitting antenna 223 and its vicinity provided on the probe internal substrate 321 when the sensor device 200 in the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) as in Figure 4b.

[0163] FIG. 67 is an example of a plan view of each layer of the seventh structure, the cross section of which is shown in FIG.

[0164] FIG. 68 is an example of a cross-sectional view of the seventh structure, the cross-section of which is shown in FIG. 66, viewed from above.

[0165] The planar, slot-shaped transmitting antenna 223 having the seventh structure shown in Figures 66 to 68 differs from the transmitting antenna 223 having the fifth structure in the following respects. That is, in the planar, slot-shaped transmitting antenna 223 having the seventh structure, the signal line 255 is connected to and terminated in a region beyond the point where the signal line 255 extending from the direction of the transmitter crosses a portion of the slot (in other words, the region beyond the point where the signal line 255 extending from the direction of the transmitter overlaps a portion of the slot) and in a region near the slot (more preferably, within the transmitting antenna region defined for convenience by a rectangular region defined by the slot width Dz and the slot length Dy) via a via hole indicated by diagonal lines in Figure 66 to a radiating element (shield layer 256) having a slot. By having this structure, the planar, slot-shaped antenna having the seventh structure has an increased current flowing from the signal line 255 across the slot to the radiating element 256 compared to the antenna having the fifth structure, allowing for efficient radiation of electromagnetic waves. The same applies to the receiving antenna. When the "planar and slot-shaped antenna" of the seventh structure shown in Figures 66 to 68 is a receiving antenna, the shielding layer exposed from the electromagnetic wave absorbing material 251 and exposed to space, and the shielding layer 256 with slots becomes the receiving element.

[0166] Figure 69 is an example of a cross-sectional view of the eighth structure relating to the transmitting antenna 223 provided on the probe substrate 321 and its vicinity when the sensor device 200 in the first embodiment of the present technology is viewed from the front (viewed from the Z-axis direction) as in Figure 4b.

[0167] FIG. 70 is an example of a plan view of each layer of the eighth structure, the cross section of which is shown in FIG.

[0168] FIG. 71 is an example of a cross-sectional view of the eighth structure, the cross-section of which is shown in FIG. 69, viewed from above.

[0169] The transmitting antenna 223 of the eighth structure shown in Figures 69 to 71 is a double-sided radiation antenna obtained by modifying the planar and slotted antenna of the seventh structure shown in Figures 66 to 68. In the case of a transmitting antenna, the "planar and slotted antenna" of the eighth structure is a shield layer exposed from the electromagnetic wave absorber 251 to the space, and the slotted shield layer (shield layers 256 and 254) serves as a radiation element. Furthermore, in a region beyond the point where the signal line 255 extending from the direction of the transmitter crosses a part of the slot (in other words, a region beyond the point where the signal line 255 extending from the direction of the transmitter overlaps a part of the slot), and in a region near the slot (more preferably, within the region of the transmitting antenna conveniently defined by a rectangular region determined by the slot width Dz and the slot length Dy), the signal line 255 is connected to and terminated at both of the slotted radiation elements (shield layers 256 and 254) via vias shown by diagonal lines in Figure 69. Due to this shape, the planar and slot-shaped antenna of the eighth structure becomes a double-sided radiation antenna. The same applies to the receiving antenna. When the "planar and slot-shaped antenna" of the eighth structure shown in Figures 69 to 71 is a receiving antenna, the shield layer exposed from the electromagnetic wave absorbing material 251 and exposed to space is the shield layer with slots (shield layers 256 and 254), which becomes the receiving element.

[0170] 72 is a diagram showing an example of the shape of a transmitting antenna applied to the fifth structure of the planar, slot-shaped antenna according to the first embodiment of the present technology. As illustrated in FIG. 72 a, in a shielding layer 256 exposed from an electromagnetic wave absorbing material 251, the entire region overlapping with a signal line 255 can be formed into a slot. As illustrated in FIG. 72 b, the line width of the signal line 255 exposed from the electromagnetic wave absorbing material 251 can be made larger than the width of the signal line 255 extending in the region where the electromagnetic wave absorbing material 251 is arranged, and the entire region overlapping with the wider signal line 255 in the shielding layer 256 can be formed into a slot. As illustrated in FIG. 72 c, the signal line 255 exposed from the electromagnetic wave absorbing material 251 can be formed into a meander structure, and the entire region overlapping with the meander-structured signal line 255 in the shielding layer 256 can be formed into a slot. As illustrated in d in the figure, the slot provided in the shielding layer 256 exposed from the electromagnetic wave absorbing material 251 can also be made to cross the signal line 255 exposed from the electromagnetic wave absorbing material 251. As illustrated in e in the figure, the slot provided in the shielding layer 256 exposed from the electromagnetic wave absorbing material 251 can also be made to cross the signal line 255 exposed from the electromagnetic wave absorbing material 251, and the slot can also be made to branch (for example, branch into a T-shape) in the area beyond which it crosses the signal line 255.

[0171] Shapes a and d in the figure make the direction perpendicular to the paper (X-axis direction) the main radiation direction of radio waves, improving the antenna gain. Shapes b and c in the figure make the radiation resistance greater than shape a in the figure, allowing radio waves to be radiated more efficiently. Shape e in the figure makes the radiation resistance greater than shape d in the figure, allowing radio waves to be radiated more efficiently.

[0172] The shape a in the figure can also be applied to the sixth structure of a planar, slot-shaped antenna. In this case, impedance matching is easier to achieve and radiation can be more efficiently achieved than when a in the figure is applied to the fifth structure.

[0173] Fig. 73 is a diagram showing an example of the shape of a transmitting antenna applied to the seventh structure of the planar, slot-shaped antenna according to the first embodiment of the present technology. Figs. 73a to 73e show examples in which the tip of the signal line 255 of Fig. 72a to 72e is terminated by connecting it to the radiation element (in other words, the slot is connected to the shield layer 256) via a via. Circles indicate vias. By providing this structure, the current flowing from the signal line 255 across the slot to the radiation element increases compared to the antenna shown in Fig. 72, allowing for efficient radiation of electromagnetic waves.

[0174] FIG. 74 is a diagram showing an example of the shape of a transmitting antenna applied to the eighth structure of the planar and slot-shaped antenna according to the first embodiment of the present technology. In FIG.

[0175] 75 is a diagram for explaining the operating principle of the sensor device 200 according to the first embodiment of the present technology and the effects brought about by the structure of the sensor device 200. As illustrated in FIG. 75 a, the sensor device 200 according to the present technology fixes the distance between the transmitting antenna 221 and the receiving antenna 231 to a predetermined distance d0. Focusing on the fact that the propagation time required for an electromagnetic wave to propagate this predetermined distance d0 increases in proportion to the amount of moisture in the medium between the transmitting antenna 221 and the receiving antenna 231, the propagation delay time Δt of the electromagnetic wave is measured to determine the amount of moisture.

[0176] In order to accurately measure moisture, as shown in Fig. 1B, the sensor device 200 is equipped with a high-gain, planar or planar and slit-shaped transmitting antenna 221 and receiving antenna 231. In order to improve the processing accuracy and positioning accuracy of these antennas and to keep the environment around the antenna and transmission path constant (for example, the size of the space around the antenna and transmission path, the distance from the antenna and transmission path to the housing, and the distance from the antenna and transmission path to the soil), the transmitting antenna and the transmission path connected to the transmitting antenna are formed using the same first electronic board (internal probe board 321), and the receiving antenna and the transmission path connected to the receiving antenna are formed using the same second electronic board (internal probe board 322).

[0177] Sensor device 200 has a novel structure so that, under the condition that the moisture content of the medium between the antennas is at a certain constant value, even if moisture content measurements are performed repeatedly, the measurement results will always be constant (in other words, so that the time it takes for an electromagnetic wave to propagate from a transmitting antenna to a receiving antenna and the magnitude of the propagating signal will always be constant even if measurements are performed repeatedly). That is, as shown in b in the figure, sensor device 200 has a transmitting antenna and a receiving antenna that are planar or planar and slot-shaped, and the planes of these antennas are opposed to each other, their orientations are fixed, and the positions of these antennas are fixed so that the distance between the transmitting antenna and the receiving antenna is always a predetermined distance.

[0178] Furthermore, a transmitting transmission line connected to the transmitting antenna and a receiving transmission line connected to the receiving antenna are connected to the measurement unit 312. The measurement unit 312 transmits transmitted waves to the transmitting antenna and receives received waves from the receiving antenna. The measurement unit board 311 equipped with the measurement unit 312 is orthogonal to the first electronic board and the second electronic board. The transmission line electrically extends between these orthogonal boards via a transmission line cable including multiple shielded signal lines and which is more flexible than the measurement unit board 311 and the internal probe boards 321 and 322.

[0179] Patent Document 1 does not describe a configuration in which the planes of the transmitting antenna and the receiving antenna are opposed to each other and their orientations are fixed.

[0180] On the other hand, in the field of wireless communication terminal devices, planar or planar and slot-shaped antennas are sometimes used. However, in wireless communication devices, the transmitter and receiver are generally housed in different housings, and therefore the distance between the transmitting antenna and the receiving antenna is not fixed, and the orientation of the transmitting antenna and the receiving antenna is not fixed either.

[0181] Patent Document 1 does not recognize the problem of accurately measuring moisture by opposing a planar transmitting antenna and a receiving antenna and fixing their orientation, nor does it motivate the combination of a structure in which a planar transmitting antenna and a receiving antenna are opposed to each other and their orientations are fixed.

[0182] The function of the present invention, which is capable of accurately measuring the propagation delay time of electromagnetic waves propagating over a predetermined distance and the amount of moisture in the medium through which they propagate, can only be achieved by fixing a planar or planar and slit-shaped transmitting antenna and a receiving antenna in a predetermined orientation, i.e., facing each other, and fixing these antennas at positions spaced a predetermined distance apart.

[0183] Furthermore, the effect of accurately measuring moisture by a configuration in which planar or planar and slit-shaped transmitting antennas and receiving antennas are fixed in a predetermined orientation, i.e., facing orientation, and these antennas are fixed at positions with a predetermined distance between them, can be obtained not only in the configurations shown in Figs. 4 and 74 in which the measurement unit substrate extends parallel to a plane defined by the X-axis and Y-axis, but also in the configuration of Fig. 348 in which the measurement unit substrate extends parallel to a plane defined by the X-axis and Z-axis. As another example of the first embodiment of the present technology, the direction in which the measurement unit substrate in the first embodiment of the present technology shown in Fig. 4 extends may be changed to extend parallel to a plane defined by the X-axis and Z-axis as shown in Fig. 348, and the measurement unit substrate, the transmitting probe substrate, and the receiving probe substrate may be housed in a single sensor housing as in Fig. 4.

[0184] Consider a comparative example in which the antenna is not formed within the electronic substrate (such as the substrate 321 within the probe), for example, an example in which the antenna is assembled using multiple components. Compared to this comparative example, in the sensor device 200, the antenna is formed within the electronic substrate, improving the processing accuracy of the antenna and enabling accurate moisture measurement. Furthermore, the volume of the antenna and the probe housing 320 provided in the sensor device 200 can be reduced. This reduces the amount of soil displaced by the probe housing 320 toward the soil to be measured when the probe housing 320 is inserted into the ground. By reducing the amount of soil displaced, changes in the state of the soil to be measured when the probe housing is inserted are suppressed, thereby enabling accurate measurement of the moisture content of the soil to be measured.

[0185] The angle that the transmitting antenna plane makes with respect to the measurement unit board and the angle that the receiving antenna plane makes with respect to the measurement unit board can be any angle between 0° and 90°.

[0186] 76 is a diagram showing an example of the angle formed between the antenna plane and the measurement unit board in the first embodiment of the present technology. As shown in FIG. 76 a, the angle formed between the antenna plane and the measurement unit board on both the transmitting side and the receiving side can be set to 90 degrees. As shown in FIG. 76 b, the angle formed between the antenna plane and the measurement unit board on both the transmitting side and the receiving side can also be set to 0 degrees.

[0187] As shown in Fig. 1c, the angle between the antenna plane and the measurement unit board on both the transmitting and receiving sides can be an angle other than 0 degrees or 90 degrees. As shown in Fig. 1d, the angle between the antenna plane and the measurement unit board on both the transmitting and receiving sides can be an angle other than 0 degrees or 90 degrees, with one angle being +α and the other being -α. Also, as shown in Fig. 1e and f, one angle on the transmitting and receiving sides can be 90 degrees and the other being 0 degrees.

[0188] Fig. 77 is a diagram for explaining a method of connecting the measurement unit substrate 311 and the probe internal substrates 321 and 322 provided in the sensor device 200 in the first embodiment of the present technology. In the figure, "a" is a diagram of the connection points between these substrates as seen from above the sensor device 200. "b" in the figure is a diagram of these substrates as seen from the front of the sensor device 200. "c" in the figure is a detailed diagram of these substrates as seen from the side (X-axis direction) of the sensor device 200. The configuration in the figure corresponds to component (7).

[0189] The transmission line connection section shown in Figure 77c electrically connects the transmission line in the measurement unit substrate 311 to the transmission line in the probe internal substrate 321 or 322. This transmission line connection section has the same number of signal lines as the number of antennas, and each of these signal lines is shielded. In this figure, a parallel cable is used as the transmission line connection section. In this parallel cable, shield lines are further wired on both sides of each signal line, and these are arranged side by side. For example, if there are three signal lines, four shield lines are wired and arranged side by side. Shield layers are respectively arranged above and below these arranged side by side signal lines and shield lines. The signal lines are shielded by the shield wiring between the signal lines and the shield layers above and below the signal lines. The outer periphery of the integrated structure including these signal lines, shield lines, and shield layers is covered with an insulating protective material. Note that the transmission line connection section can also use coaxial cables with the same number as the number of antennas.

[0190] 78 is an example of a detailed diagram of the measurement unit substrate 311, the intra-probe substrate 321 or 322, and the transmission line connection portion provided in the sensor device 200 according to the first embodiment of the present technology. The intra-probe substrate shown in a in the figure is shown as seen from the outside. The intra-probe substrate shown in b in the figure is shown with a colored pattern representing the shape of its surface wiring layer, and the vias connected to the surface wiring layer and the shapes of the inner wiring layers are shown with dotted lines.

[0191] 79 is an example of a detailed diagram and a cross-sectional view of the measurement section substrate 311, the intra-probe substrate 321, and the transmission line connection section provided in the sensor device 200 according to the first embodiment of the present technology. In the figure, a shows a cross-sectional view of the intra-probe substrate 321 as viewed from above (Y-axis direction) the sensor device 200. In the figure, b shows a cross-sectional view of the intra-probe substrate 321 as viewed from the front (Z-axis direction) of the sensor device 200. In the figure, c shows the shape of the wiring of the intra-probe substrate 321 as viewed from the side (X-axis direction) of the sensor device 200. In the figure, c shows the intra-probe substrate described in (a) with a colored pattern representing the shape of its surface wiring layer, and the shapes of the vias connected to the surface wiring layer and the inner wiring layer are shown with dotted lines. The number of antennas is three.

[0192] FIG. 80 is an example of a detailed diagram of a transmission line connection section included in the sensor device 200 according to the first embodiment of the present technology. "a" in the figure is a diagram of the transmission line connection section when the sensor device 200 is viewed from above in the positive direction of the Y-axis. At the bottom of the figure, a cross-sectional view of a connector 323 connecting the transmission line connection section and the intra-probe substrate 321 as viewed from above, and a cross-sectional view of the intra-probe substrate 321 as viewed from above are shown. At the left side of the figure, a cross-sectional view of a connector 314 connecting the transmission line connection section and the measurement unit substrate 311 as viewed from above are shown. "b" in the figure is a diagram of the transmission line connection section when the sensor device 200 is viewed from below in the negative direction of the Y-axis. At the bottom of the figure, a cross-sectional view of a connector 323 connecting the transmission line connection section and the intra-probe substrate 321 as viewed from below, and a cross-sectional view of the intra-probe substrate 321 as viewed from below are shown. On the right side of the figure, a cross-sectional view of connector 314 connecting the transmission line connection part and measurement unit board 311 is shown as seen from below. "c" in the figure is a diagram of the transmission line connection part when sensor device 200 is viewed from the side in the positive direction of the X-axis. On the bottom side of the figure, a plan view of connector 323 connecting the transmission line connection part and probe internal board 321 is shown as seen from the side in the positive direction of the X-axis. On the left side of the figure, a cross-sectional view of connector 314 connecting the transmission line connection part and measurement unit board 311 is shown as seen from the side. In the figure, "d" is a diagram of the transmission line connection part and connector 314 that connects the transmission line connection part and measurement part substrate 311 when sensor device 200 is viewed from the back front side in the negative direction of the Z axis. At the bottom of the figure, there are shown a cross-sectional view of connector 323 that connects the transmission line connection part and probe internal substrate 321 when viewed from the back front side in the negative direction of the Z axis, and a cross-sectional view of the part that connects with connector 323 when probe internal substrate 321 is viewed from the back front side in the negative direction of the Z axis.

[0193] As illustrated in a to d in the figure, the transmission lines provided on two orthogonally arranged substrates (measurement section substrate 311 and probe internal substrate 321) are connected by a transmission line connection section that is more flexible than measurement section substrate 311 and probe internal substrate 321 and has multiple transmission lines.

[0194] 81 and 82 show an example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 81 and 82 shows the planar shape of the intra-probe substrate 321 having one antenna and a total of three wiring layers, where the transmission path to the antenna is composed of one signal line layer and two shield layers sandwiching the signal line layer. The example shown in FIGS. 81 and 82 also shows an example in which a shield wiring is arranged on the side of the signal line 255 using part of the same wiring layer as the signal line 255. "a" in FIG. 81 shows the planar shape of the solder resist 252 and the electromagnetic wave absorber 251 arranged on the outside of the first wiring layer. The solder resist 252 is shown with a colored pattern, and the outline of the electromagnetic wave absorber 251 is shown with a dotted line. "b" in FIG. 81 shows the planar shape of the first wiring layer (the shield layer 254 and the radiating element). 81c shows the second wiring layer (signal line) and shielding wiring (conductor 257) arranged on both sides of signal line 255 using part of the second wiring layer. A symbol arranged on shielding wiring 257, consisting of a square and a line connecting its diagonal, represents a via, and in particular, in FIG. 81c, a via that connects shield layer 254 and shielding wiring (conductor 257) and a via that connects shielding wiring and shield layer 256, which will be described later, are shown on the pattern of shielding wiring 257. Wa in the figure shows the width of intra-probe substrate 321. Wb shows the width of the shielding wiring, and Wc shows the distance between the ends of the shielding wiring.

[0195] 82a shows the planar shape of the third wiring layer (shield layer 256 and radiating element). 82b shows the planar shapes of solder resist 253 and electromagnetic wave absorbing material 251 arranged on the outside of the third wiring layer. Solder resist 253 is shown with a colored pattern, and the outline of electromagnetic wave absorbing material 251 is shown with a dotted line. 82c shows a cross-sectional view of intra-probe substrate 321 when cut along line A-A' of c in FIG. 81.

[0196] In the cross-sectional view of c in Fig. 82, from the bottom of the page, solder resist 252 and a first wiring layer (shield layer 254) are arranged, and on top of that, signal line 255 and shield wiring 257 on both sides thereof are arranged using a second wiring layer. On top of these, shield layer 256 and solder resist 253 are arranged. In the region where the transmission path of intra-probe substrate 321 is formed, electromagnetic wave absorbing material 251 (not shown) is arranged around this cross section.

[0197] 83 and 84 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 83 and 84 shows an intra-probe substrate 321 including one antenna and a transmission path to the antenna, which includes a total of three wiring layers, including one signal line layer sandwiched between two shield layers. The example shown in FIGS. 83 and 84 also shows an example in which vias extending from a shield layer 256 arranged above a signal line 255, passing along the sides of the signal line 255, to a shield layer 254 arranged below the signal line 255 are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255. "c" in FIG. 83 indicates the row of shielding vias. In the figure, a symbol consisting of a rectangle and a line connecting the diagonal of the rectangle, arranged on both sides of the signal line 255, represents a via. These vias that are not colored in the figure are not formed in the second wiring layer that is the same layer as the signal line 255, but rather are vias that extend from a layer above the signal line 255, passing beside the signal line 255, to a layer below the signal line 255. Planar shapes shown in Figures 83 and 84 other than c in Figure 83 are similar to those shown in Figures 81 and 82, so their explanation will be omitted. Note that c in Figure 84 is taken along the A-A' line of c in Figure 83. 83 is a cross-sectional view of the probe internal substrate 321 when cut along the line 8. Wa in Fig. 83 indicates the width of the probe internal substrate 321. Wb indicates the width of the shield via row, and Wc indicates the distance between the ends of the via row.

[0198] Next, the effect of the structure shown in c in FIG. 83 will be described. In the structure shown in c in FIG. 81 in which the sides of the signal line 255 are shielded using the shielding wiring, the signal line 255 and the shielding wiring are formed using the same wiring layer (second wiring layer). Therefore, when processing the second wiring layer to form the pattern of the signal line 255 and the pattern of the shielding wiring 257, the distance between the signal line 255 and the shielding wiring cannot be processed to be smaller than the minimum processing dimension of the pattern forming device. A distance at least equivalent to the minimum processing dimension of the pattern forming device must be provided between the two. In contrast, in the structure shown in c in FIG. 83 in which the sides of the signal line 255 are shielded using a row of shielding vias, the signal line 255 and the shielding vias extending from a layer above the signal line 255, passing beside the signal line 255, to a layer below the signal line 255 are formed using different wiring layers. In other words, the pattern of the signal line 255 is formed independently using the pattern forming device. The shielding vias are also formed independently using a pattern forming device in a layer above the signal line 255. Therefore, the distance between the signal line 255 and the vias passing beside the signal line 255 can be set to any value when designing the layout of these patterns. As a result, in the case of the structure shown in FIG. 83c, the distance between the signal line 255 and the row of shielding vias (shield wiring in the case of FIG. 81) can be made smaller than in the structure shown in FIG. 81c. As a result, the width of the intra-probe substrate 321 shown in FIGS. 83 and 84 can be made smaller than the width of the intra-probe substrate 321 shown in FIGS. 81 and 82. Furthermore, if the width of the intra-probe substrate can be made smaller, the cross-sectional area of the probe housing that houses it can be made smaller, resulting in the further effect of enabling accurate moisture measurement. This will be described in detail later.

[0199] 85 and 86 show yet another example of the planar shape of intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 85 and 86 shows intra-probe substrate 321 including n antennas (for example, n=3), and including a total of three wiring layers, in which the transmission path to the antennas is made up of one signal line layer and two shield layers sandwiching the signal line layer. In addition, the example shown in FIGS. 85 and 86 shows an example in which the side of signal line 255 is shielded using part of the same wiring layer as signal line 255. The roles of each layer shown in FIGS. 85 and 86 are the same as those in FIGS. 81 and 82, and therefore description thereof will be omitted.

[0200] In b of Figure 85, a shield layer 254 is formed using a part of the first wiring layer, and three radiating elements provided for three antennas are formed using other parts of the first wiring layer. c of Figure 85, like c of Figure 81, shows an example in which shield wiring is arranged on the side of the signal line 255 using a part of the same wiring layer as the signal line 255. In c of Figure 85, three signal lines 255 for connecting to the three radiating elements shown in b of Figure 85 are formed using a part of the second wiring layer. Furthermore, in order to shield the sides of each of these three signal lines 255, a total of four shield wirings 257 are formed between and outside these three signal lines using the same second wiring layer as the three signal lines 255. Note that c of Figure 86 is a cross section of line A-A' of c of Figure 85. 85 is a cross-sectional view of the internal probe substrate 321 taken along the line 85. Wa in Fig. 85 indicates the width of the internal probe substrate 321. Wb indicates the width of the shield layer, and Wc indicates the distance between the ends of the shield layer. Wd indicates the width of the two transmission lines and the three shield wirings.

[0201] 87 and 88 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 87 and 88 shows the intra-probe substrate 321 including n antennas (for example, n=3), and including a total of three wiring layers, in which the transmission paths to the antennas are made up of one signal line layer and two shield layers sandwiching the signal line layer. The example shown in FIGS. 87 and 88 also shows an example in which vias extending from a shield layer 256 arranged above a signal line 255, passing along the sides of the signal line 255, to a shield layer 254 arranged below the signal line 255 are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255. In FIG. 87 b, the shield layer 254 is formed using a part of the first wiring layer, and three radiating elements provided for three antennas are formed using the remaining parts of the first wiring layer. Fig. 87c shows an example in which rows of shielding vias are used to shield the sides of signal line 255, similar to Fig. 83c. In Fig. 87c, three signal lines 255 for connecting to the three radiating elements shown in Fig. 87b are formed using a part of the second wiring layer. In addition, in order to shield the sides of each of these three signal lines 255, a total of four rows of shielding vias are arranged between and outside these three signal lines. Note that c in Figure 88 is a profile taken along line A-A' of c in Figure 87. 87 is a cross-sectional view of the probe internal substrate 321. Wa in Fig. 87 indicates the width of the probe internal substrate 321. Wb indicates the width of the shield layer, and Wc indicates the distance between the shield layer ends. Wd indicates the width of the two transmission lines and the three shield via rows.

[0202] Next, the effect brought about by the structure shown in FIG. 87c will be described. As in c in Fig. 83, the three signal lines 255 and the four via rows shown in c in Fig. 87 are patterned separately (in other words, independently). As a result, the distance between the three signal lines 255 and the four via rows shown in c in Fig. 87 can be made smaller than the distance between the three signal lines 255 and the four shield wirings shown in c in Fig. 85. As a result, the width of the intra-probe substrate 321 shown in Figs. 87 and 88 can be made smaller than the width of the intra-probe substrate 321 shown in Figs. 85 and 86. Furthermore, if the width of the intra-probe substrate can be made smaller, the cross-sectional area of the probe housing that houses it can be made smaller, which brings about the additional effect of enabling accurate moisture measurement. This will be described in detail later.

[0203] Fig. 89 is a diagram for explaining shielding by a via array in the first embodiment of the present technology. In the figure, "a" indicates the first wiring layer, and "b" indicates the second wiring layer. "c" indicates the third wiring layer. In the second wiring layer, it is also possible to shield the signal line 255 by arranging a via array around the signal line 255 without providing a shielding wiring. Circles indicate vias. These vias reduce electrical coupling between transmission paths, making it possible to suppress radiation from unintended antenna openings (radiating elements), and enabling moisture to be measured with high accuracy.

[0204] Furthermore, the spacing between adjacent vias is preferably 1 / 10 or less of the wavelength of the center frequency of the electromagnetic wave, and more preferably 1 / 10 or less of the wavelength of the maximum frequency. For example, when the measurement frequency band is 1-9 GHz, the center frequency is 5 GHz, so the spacing between vias is preferably 6 mm or less, and the maximum frequency is 9 GHz, so the spacing is more preferably 3.3 mm or less.

[0205] FIG. 90 is a diagram illustrating an example of a stripline according to the first embodiment of the present technology. The diagram illustrates a cross-sectional view of a stripline formed, for example, on a wiring substrate within a probe. As illustrated in FIG. 90, the stripline may be vertically symmetrical, with shield layers 254 and 256 as the top and bottom surfaces. As illustrated in FIG. 90, the stripline may be vertically asymmetrical, that is, a stripline using wiring layers in which an electronic substrate having more than three wiring layers is used, and the distance from the layer on which the signal line 255 is formed to the layer on which the shield layer 254 is formed is different from the distance from the layer on which the signal line 255 is formed to the layer on which the shield layer 254 is formed. As illustrated in FIG. 90, the stripline may be vertically symmetrical, with shield wirings arranged on both sides of the signal line 255. As illustrated in FIG. 90, the stripline may be vertically asymmetrical, with shield wirings arranged on the sides of the signal line 255.

[0206] As shown in e in the figure, it may be a vertically symmetrical stripline with post walls. Here, the post walls refer to a row of vias arranged substantially parallel to the transmission line. The arrangement of the post walls reduces radiation from the board edge to the outside of the board and electrical coupling between adjacent lines. As shown in f in the figure, it may be a vertically asymmetrical stripline with post walls. As shown in g in the figure, it may be a vertically symmetrical stripline equipped with both post walls and shield wiring. As shown in h in the figure, it may be a vertically asymmetrical stripline equipped with both post walls and shield wiring.

[0207] The probe internal substrate 321 is typically a glass epoxy substrate based on FR-4, but it may also be a substrate based on modified polyphenylene ether (m-PPE) or polytetrafluoroethylene (PTFE) which have excellent high frequency characteristics. ) or the like. Furthermore, the probe internal substrate 321 may be a substrate using ceramics with a high dielectric constant, or a build-up substrate that combines multiple types of the above substrates. Furthermore, it may be a flexible substrate using flexible polyimide, polyester, polyethylene terephthalate, or the like, or it may be a rigid-flex substrate that combines a rigid substrate and a flexible substrate.

[0208] 91 to 93 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in Fig. 91 to 93 shows an example in which n (for example, n = 3) antennas are provided, and n transmission lines connected to the n antennas are formed in the intra-probe substrate 321 having a total of 2n-1 wiring layers, each consisting of n-1 signal line layers and n shield layers sandwiching the signal line layers. The example shown in Fig. 91 to 93 also shows an example in which vias extending from a shield layer arranged above the signal line 255, passing along the sides of the signal line 255, to a shield layer arranged below the signal line 255 are used, and the vias are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255.

[0209] In Fig. 91b, a shield layer 254 is formed using part of the first wiring layer, and three radiating elements 259 provided for three antennas are formed using other parts of the first wiring layer. Wa in Fig. 91 indicates the width of the intra-probe substrate 321. Wb indicates the width of the shield layer, and Wc indicates the distance between the ends of the shield layer. Wd indicates the width of one transmission line and two shield via rows.

[0210] In the example shown in Figures 91 to 93, the three signal lines connected to each of the three antennas are formed using two signal line layers (the second and fourth wiring layers) provided on a substrate having five wiring layers.

[0211] In the second wiring layer shown in FIG. 91c, (1) Of the three radiating elements shown in FIG. 91b, one signal line 255 is formed to connect to the first radiating element. (2) In order to connect the three radiating elements 259 arranged on one surface layer (first wiring layer) of the probe internal substrate 321 to the three radiating elements arranged on the other surface layer (fifth wiring layer) with the signal lines 255 for connecting them sandwiched between them, vias for connecting these radiating elements are formed directly below the second and third radiating elements to which the signal lines 255 are not connected in the second wiring layer. (3) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (4) In order to tightly connect the shield layer 254 formed using the first wiring layer to the shield layer 256 formed using the third and fifth wiring layers, rows of vias are also arranged near the outer edges of these shield layers.

[0212] On the other hand, in the fourth wiring layer shown in FIG. 92b, (1) Of the three radiating elements shown in b in Figure 91, the second and third radiating elements are not connected to the signal line 255 in the second wiring layer, and two signal lines 255 are formed to connect them. (2) In order to connect the three radiating elements 259 arranged on one surface layer (first wiring layer) of the probe internal substrate 321 to the three radiating elements arranged on the other surface layer (fifth wiring layer) with the signal line 255 for connecting them sandwiched between them, a via is formed directly below the first radiating element to which the signal line 255 is not connected in the fourth wiring layer for connecting to this radiating element. (3) In order to shield the sides of the signal lines 255 described in (1) above, rows of shielding vias are arranged on both sides of these signal lines. (4) In order to tightly connect the shield layer 254 formed using the first wiring layer to the shield layer 256 formed using the third and fifth wiring layers, rows of vias are also arranged near the outer edges of these shield layers.

[0213] Note that b in Figure 93 is a profile taken along line A-A' in c in Figure 91. FIG. 3 is a cross-sectional view of an internal substrate 321.

[0214] Next, the effects of the structures shown in Fig. 91c and Fig. 92b will be described. In the structures shown in these figures, the shielding via row shown in Fig. 87c is used to shield the sides of the signal line 255, thereby reducing the width of the intra-probe substrate 321. Compared to the structure shown in Fig. 87c, the structures shown in Fig. 91c and Fig. 92b use more signal line layers, thereby reducing the number of signal lines arranged in one signal line layer. This structure reduces the width of the intra-probe substrate 321 more than the structure shown in Fig. 87c.

[0215] 94 to 96 show yet another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in Fig. 94 to 96 shows an example in which n (for example, n = 3) antennas are provided, and n transmission lines connected to the n antennas are formed in the intra-probe substrate 321 having a total of 2n+1 wiring layers, each consisting of n signal line layers and n+1 shield layers sandwiching the signal line layers. The example shown in Fig. 94 to 96 also shows an example in which vias extending from a shield layer disposed above the signal line 255, passing along the sides of the signal line 255, to a shield layer disposed below the signal line 255 are used, and the vias are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255.

[0216] In b of Figure 94, a shielding layer 254 is formed using part of the first wiring layer, and three radiating elements 259 provided for three antennas are formed using other parts of the first wiring layer.

[0217] 94 to 96, three signal lines connected to three antennas, respectively, are formed using three signal line layers (the second, fourth, and sixth wiring layers) provided on a substrate having seven wiring layers. Wa in Fig. 91 indicates the width of the intra-probe substrate 321. Wb indicates the width of the shield layer, and Wc indicates the distance between the ends of the shield layer. Wd indicates the width of one transmission line and two shield via rows.

[0218] In the second wiring layer shown in FIG. 94c, (1) Of the three radiating elements shown in FIG. 94b, one signal line 255 is formed to connect to the first radiating element. (2) In order to connect the three radiating elements arranged on one surface layer (first wiring layer) of the probe internal substrate 321 to the three radiating elements arranged on the other surface layer (fifth wiring layer) with the signal line 255 for connecting each of them sandwiched therebetween, vias for connecting these radiating elements are formed directly below the second and third radiating elements to which the signal line 255 is not connected in the second wiring layer. (3) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (4) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0219] In the fourth wiring layer shown in FIG. 95b, (1) Of the three radiating elements shown in FIG. 94b, one signal line 255 is formed to connect to the second radiating element. (2) In order to connect the three radiating elements arranged on one surface layer (first wiring layer) of the probe internal substrate 321 to the three radiating elements arranged on the other surface layer (fifth wiring layer) with the signal line 255 for connecting each of them sandwiched therebetween, vias for connecting these radiating elements are formed directly below the first and third radiating elements to which the signal line 255 is not connected in the fourth wiring layer. (3) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (4) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0220] In the sixth wiring layer shown in FIG. 96a, (1) Of the three radiating elements shown in FIG. 94b, one signal line 255 is formed to connect to the third radiating element. (2) In order to connect the three radiating elements arranged on one surface layer (first wiring layer) of the probe internal substrate 321 to the three radiating elements arranged on the other surface layer (fifth wiring layer) with the signal lines 255 for connecting them sandwiched between them, vias for connecting these radiating elements are formed directly below the first and second radiating elements to which the signal lines 255 are not connected in the sixth wiring layer. (3) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (4) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0221] 97 shows the substrate in the probe cut along the line A-A' of c in FIG. 94. 321 is a cross-sectional view.

[0222] Next, the effects of the structures shown in Fig. 94c, Fig. 95b, and Fig. 96a will be described. In the structures shown in these figures, the shielding via row shown in Fig. 87c is used to shield the sides of the signal line 255, thereby reducing the width of the intra-probe substrate 321. Compared to the structure shown in Fig. 87c, the structures shown in Fig. 94c, Fig. 95b, and Fig. 96a use more signal line layers, thereby reducing the number of signal lines arranged in one signal line layer. This structure reduces the width of the intra-probe substrate 321 more than the structure shown in Fig. 87c.

[0223] The width of the probe internal substrate 321 shown in FIGS. 94 to 96 is the same as the width of the probe internal substrate 321 shown in FIGS. 91 to 93.

[0224] FIG. 98 is a diagram for explaining, from two perspectives, the influence of the width of the substrate within the probe and the cross-sectional area of the probe housing on the measurement of the amount of moisture in the first embodiment of the present technology.

[0225] [First viewpoint] In the figure, a, b, and c represent the sensor device 200 according to the first embodiment of the present technology. 10A and 10B are cross-sectional views of the transmitting probe housing 320a and the receiving probe housing 320b when viewed from above in the positive direction of the Y axis. The shape represents the transmitting probe substrate 321, and the ellipse arranged around it represents the transmitting probe housing 320a. The rectangle on the right represents the receiving probe substrate 322, and the ellipse arranged around it represents the receiving probe housing 320b. The white part inside the probe housing represents the space inside the probe housing. The colored part outside the probe housing represents the soil. In the figure, a, b, and c represent (1) three types of transmitting probe substrates 321 with different widths and receiving This figure explains how the ratio of the soil area in the area between the transmitting probe board 321 and the receiving probe board 322 changes depending on the width of the three types of probe boards when (2) the probe board 322 is housed in an elliptical transmitting probe housing 320a and a receiving probe housing 320b with a ratio of the length of the major axis to the minor axis of 2:1, and (3) the distance between the transmitting probe board 321 and the receiving probe board 322 is the same for all three types. Comparing a, b, and c in the figure, it is clear that the ratio of the soil area in the area between the transmitting probe board 321 and the receiving probe board 322 changes depending on the width of the three types of probe boards. The larger the width of the probe substrate, the smaller the proportion of soil in the region between the transmitting probe substrate 321 and the receiving probe substrate 322. The moisture measurement system 100 of the present invention measures the propagation delay time of the electromagnetic wave, focusing on the fact that the time required for electromagnetic waves to propagate from the transmitting antenna to the receiving antenna is linearly related to the soil moisture content, thereby determining the soil moisture content. Therefore, as the proportion of soil in the region between the transmitting probe substrate 321 and the receiving probe substrate 322 decreases, the relationship between the electromagnetic wave propagation delay time and the soil moisture content deviates from a linear relationship. This results in larger errors in the measurement results. Conversely, the smaller the width of the probe substrate, the larger the proportion of soil in the region between the transmitting probe substrate 321 and the receiving probe substrate 322. As a result, the relationship between the electromagnetic wave propagation delay time and the soil moisture content becomes closer to a linear relationship, reducing the error in the measurement results and enabling accurate measurement of the soil moisture content.

[0226] [Second viewpoint] In the figure, d, e, and f are diagrams in which the destinations of the soil displaced by the insertion of the transmitting probe housing 320a and the receiving probe housing 320b shown in a, b, and c of the figure are added. The darkly colored area (reference number 391) added to the periphery of the probe housing represents the area where the soil density has increased above the actual soil density being measured due to the displacement of the soil as a result of inserting the probe housing.

[0227] When the probe housing is inserted, the soil displaced by the insertion moves to the area where the soil density increases. Comparing d, e, and f in the same figure, the wider the probe substrate, the more the soil density increases. The width of the region is large. As a result, the wider the probe internal substrate, the larger the proportion of the region between the transmitting probe substrate 321 and the receiving probe substrate 322 where the soil density is high. When the soil density increases, the ease of water penetration and the surface area of the soil grain boundaries change, which changes the amount of water that the soil can hold. For this reason, the larger the proportion of the region where the soil density is high, the more the measurement result of the soil moisture content will deviate from the actual moisture content of the soil that is being measured. Conversely, the smaller the width of the substrate within the probe, the smaller the width of the region where the soil density is high. As a result, the smaller the width of the substrate within the probe, the smaller the proportion of the region where the soil density is high in the region between the transmitting probe substrate 321 and the receiving probe substrate 322. This makes the measurement result of the soil moisture content closer to the actual moisture content of the soil being measured. In other words, the soil moisture content can be measured accurately.

[0228] From both the first and second viewpoints, the smaller the width of the substrate within the probe, the more accurately a sensor device equipped with this within the probe housing can measure the moisture content of the sandbag. The sensor device 200 according to the first embodiment of the present technology includes: (1) By using a row of shielding vias as a structure for shielding the sides of the signal lines in the substrate within the probe, the width of the substrate within the probe can be reduced, which has the effect of accurately measuring the moisture content of the soil. (2) When the substrate within the probe is provided with multiple antennas and multiple signal lines for connecting to these multiple antennas, the width of the substrate within the probe can be reduced by using multiple wiring layers and forming at least one of the multiple signal lines on a different wiring layer, thereby achieving the effect of accurately measuring the moisture content of the soil.

[0229] 99 and 100 show another example of the planar shape of intra-probe substrate 321 according to the first embodiment of the present technology. The examples shown in Fig. 99 and 92 show the planar shape of intra-probe substrate 321 including one planar, slot-shaped antenna, and including a total of three wiring layers, in which the transmission path to the antenna is made up of one signal line layer and two shield layers sandwiching the signal line layer. In addition, the examples shown in Fig. 99 and 100 show an example in which a shield wiring is arranged to the side of signal line 255 using part of the same wiring layer as signal line 255.

[0230] 99a shows the planar shapes of the solder resist 252 and the electromagnetic wave absorber 251 arranged on the outside of the first wiring layer. The solder resist 252 is shown in a colored pattern, and the outline of the electromagnetic wave absorber 251 is shown by a dotted line. FIG. 99b shows the planar shape of the first wiring layer (the shield layer 254 with a slot, i.e., the radiating element 254). FIG. 99c shows the second wiring layer (the signal line 255 and the shield wiring 257 arranged on both sides of the signal line 255 using part of the second wiring layer). The symbols arranged on the shield wiring 257, each consisting of a square and a line connecting the diagonal, represent vias. In particular, FIG. 99c shows the vias connecting the shield layer 254 and the shield wiring, and the vias connecting the shield wiring and the shield layer 256 (described later), on the shield wiring pattern. In FIG. 99a, Wa indicates the width of the intra-probe substrate 321. Furthermore, Wb indicates the width of the shield wiring. We indicates the length from the slot to the shield wiring, and Wf indicates the length from the end of the signal line to the shield wiring.

[0231] 100a shows the planar shape of the third wiring layer (shield layer 256 with slots, i.e., radiating element 256). 100b shows the planar shapes of solder resist 253 and electromagnetic wave absorbing material 251 arranged on the outside of the third wiring layer. The solder resist 253 is shown as a colored pattern, and the outline of the electromagnetic wave absorbing material 251 is shown as a dotted line. 100c shows the planar shape of the section taken along line A-A' of c in FIG. 99. FIG. 10 is a cross-sectional view of an intra-lobe substrate 321.

[0232] In the cross-sectional view of c in Fig. 100, a first wiring layer (shield layer 254) is arranged at the bottom of the paper, and on top of that, a signal line and shield wiring on both sides thereof are arranged using a second wiring layer. On top of these, a shield layer 256 is arranged. In the region where the transmission path of intra-probe substrate 321 is formed, solder resist is arranged above and below this cross section, and electromagnetic wave absorbing material 251 is arranged around the periphery of the cross section.

[0233] 101 and 102 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 101 and 102 shows an intra-probe substrate 321 including one planar, slot-shaped antenna, and a transmission path to the antenna including three wiring layers in total, consisting of one signal line layer sandwiched between two shield layers. The example shown in FIGS. 101 and 102 also shows an example in which vias extending from a shield layer 256 arranged above a signal line 255, passing along the sides of the signal line 255, to a shield layer 254 arranged below the signal line 255 are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255. "c" in FIG. 101 indicates the row of shielding vias. In the figure, a symbol consisting of a rectangle and a line connecting the diagonal of the rectangle, arranged on both sides of the signal line 255, represents a via. 103. The vias not shown in the figure are not formed in the second wiring layer, which is the same layer as the signal line 255, but rather are vias that extend from a layer above the signal line 255, passing beside the signal line 255, to a layer below the signal line 255. The planar shapes shown in Figures 101 and 102 other than c in Figure 101 are similar to those shown in Figures 99 and 100, and therefore their explanation will be omitted. Note that c in Figure 102 is a cross-sectional view of the intra-probe substrate 321 when the slot antenna portion is cut in the structure shown in Figures 102 and 103.

[0234] Next, the effect of the structure shown in c in FIG. 101 will be described. The planar shape shown in c in FIG. 101 has a structure that shields the sides of the signal line 255 using a row of shielding vias, similar to c in FIG. 83. This allows the distance between the signal line 255 and the row of shielding vias (shielding wiring in the case of FIG. 99) to be smaller than in the structure shown in c in FIG. 99. As a result, the width of the intra-probe substrate 321 shown in FIGS. 101 and 102 can be made smaller than the width of the intra-probe substrate 321 shown in FIGS. 99 and 100. Furthermore, if the width of the intra-probe substrate can be made smaller, the cross-sectional area of the probe housing that houses it can be made smaller, thereby providing a further effect that moisture can be measured accurately. Details of this are as described with reference to FIG. 98. In FIG. 101, Wa indicates the width of the intra-probe substrate 321. Wb indicates the width of the shielding via row. We indicates the length from the slot to the shielding via row, and Wf indicates the length from the end of the signal line to the shielding via row.

[0235] 103 and 104 show yet another example of the planar shape of intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in FIGS. 103 and 104 shows intra-probe substrate 321 including n (for example, n=3) planar, slot-shaped antennas, and including a total of three wiring layers, in which a transmission path to the antenna is made up of one signal line layer and two shield layers sandwiching the signal line layer. The example shown in FIGS. 103 and 104 also shows an example in which the sides of signal line 255 are shielded using part of the same wiring layer as signal line 255. The roles of the layers shown in FIGS. 103 and 104 are the same as those in FIGS. 99 and 100, and therefore description thereof will be omitted.

[0236] FIG. 103b shows a planar shape in which three slots of a planar, slot-shaped antenna are arranged using the first wiring layer (shield layer 254 with slots, ie, radiation element 254).

[0237] 103c shows an example in which, similar to c in FIG. 99, shield wiring is arranged on the side of the signal line 255 using part of the same wiring layer as the signal line 255. In c in FIG. 103, three signal lines 255 for intersecting with the three slots shown in b in FIG. 101 are formed using part of the second wiring layer. In addition, in order to shield the sides of each of these three signal lines 255, a total of four shield wirings are formed between and outside these three signal lines using the same second wiring layer as the three signal lines 255. Note that c in FIG. 104 shows a profile when cut along line A-A' in c in FIG. 103. 103 is a cross-sectional view of the intra-probe substrate 321. Wa in Fig. 103 indicates the width of the intra-probe substrate 321. We indicates the length from the slot to the signal line, and Wf indicates the length from the end of the signal line to the shield line. Wg indicates the width of the two signal lines and three shield lines.

[0238] 105 and 106 show another example of the planar shape of intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in Fig. 105 and 106 shows intra-probe substrate 321 including n (for example, n = 3) planar, slot-shaped antennas, and including a total of three wiring layers, where the transmission path to the antennas is made up of one signal line layer and two shield layers sandwiching the signal line layer. The example shown in Fig. 105 and 106 also shows an example in which vias extending from shield layer 256 arranged above signal line 255 to shield layer 254 arranged below signal line 255, passing along the sides of signal line 255, are arranged in a row along signal line 255, thereby shielding the sides of signal line 255.

[0239] In Figure 105, b indicates a planar shape in which three slots for a planar, slot-shaped antenna are arranged using the first wiring layer (shield layer 254 with slots, i.e., radiating element). Wa in Figure 105 indicates the width of the intra-probe substrate 321. We indicates the length from the slot to the shield via row, and Wf indicates the length from the end of the signal line to the shield wiring. Wg indicates the width of the two signal lines and three shield via rows.

[0240] FIG. 105c shows an example in which the sides of the signal line 255 are shielded using rows of shielding vias, similar to FIG. 101c. In FIG. 105c, three signal lines 255 for crossing the three radiating elements shown in FIG. 105b are formed using part of the second wiring layer. In addition, in order to shield the sides of each of these three signal lines 255, a total of four rows of shielding vias are arranged between and outside these three signal lines. Note that FIG. 106c is a cross-sectional view of the intra-probe substrate 321 when cut along line A-A' in FIG. 105c.

[0241] Next, the effect of the structure shown in FIG. 105c will be described. As in FIG. 101c, the three signal lines 255 and the four via rows shown in FIG. 105c are patterned separately (in other words, independently). As a result, the distance between the three signal lines 255 and the four via rows shown in FIG. 105c can be made smaller than the distance between the three signal lines 255 and the four shield wiring lines shown in FIG. 103c. As a result, the width of the intra-probe substrate 321 shown in FIGS. 105 and 106 can be made smaller than the width of the intra-probe substrate 321 shown in FIGS. 103 and 104. Furthermore, if the width of the intra-probe substrate can be made smaller, the cross-sectional area of the probe housing that houses it can be made smaller, which brings about the further effect of enabling accurate moisture measurement. Details of this are as described with reference to FIG. 98.

[0242] 107 to 109 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in Fig. 107 to 109 shows an example in which n (for example, n = 3) planar, slot-shaped antennas are provided, and n transmission lines that intersect with the slots of the n antennas are formed in the intra-probe substrate 321 that has a total of 2n-1 wiring layers, each consisting of n-1 signal line layers and n shield layers sandwiching the signal line layers. The example shown in Fig. 107 to 109 also shows an example in which vias extending from a shield layer disposed above the signal line 255, passing along the sides of the signal line 255, to a shield layer disposed below the signal line 255 are used, and the vias are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255.

[0243] 107b shows a planar shape in which three slots for a planar, slot-shaped antenna are arranged using a first wiring layer (shield layer 254 with slots, i.e., radiating element). In FIG. 108a, a planar shape in which three slots for a planar, slot-shaped antenna are arranged using a third wiring layer (shield layer 256-1 with slots, i.e., radiating element 256-1). In FIG. 108c, a planar shape in which three slots for a planar, slot-shaped antenna are arranged using a fifth wiring layer (shield layer 256-2 with slots, i.e., radiating element 256-2). In FIG. 107, Wa indicates the width of the intra-probe substrate 321. Furthermore, We indicates the length from the slot to the shield via row, and Wf indicates the length from the end of the signal line to the shield wiring. Wg indicates the width of one signal line and two shield via rows.

[0244] In the example shown in Figures 107 to 109, the three signal lines that cross each of the three antennas are formed using two signal line layers (the second and fourth wiring layers) provided on a substrate having five wiring layers.

[0245] In the second wiring layer shown in FIG. 107c, (1) Of the three slots shown in FIG. 107b, one signal line 255 is formed to cross the first slot. (2) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (3) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third and fifth wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0246] On the other hand, in the fourth wiring layer shown in FIG. 108b, (1) Of the three slots shown in b in Figure 107, no signal lines 255 are arranged in the second wiring layer to cross the slots, but two signal lines 255 are formed in the second and third slots to cross these slots. (2) In order to shield the sides of the signal lines 255 described in (1) above, rows of shielding vias are arranged on both sides of these signal lines. (3) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third and fifth wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0247] Note that b in FIG. 109 is a cross section taken along line A-A' of c in FIG. 107. FIG. 10 is a cross-sectional view of the probe internal substrate 321.

[0248] Next, the effects of the structures shown in c in Fig. 107 and b in Fig. 108 will be described. In the structures shown in these figures, the shielding via row shown in c in Fig. 101 is used to shield the sides of the signal line 255, thereby reducing the width of the intra-probe substrate 321. Compared to the structure shown in c in Fig. 105, the structures shown in c in Fig. 107 and b in Fig. 108 use more signal line layers, thereby reducing the number of signal lines arranged in one signal line layer. This structure reduces the width of the intra-probe substrate 321 more than the structure shown in c in Fig. 105.

[0249] 110 to 113 show another example of the planar shape of the intra-probe substrate 321 according to the first embodiment of the present technology. The example shown in Fig. 110 to 112 shows an example in which n (for example, n = 3) planar slot-type antennas are provided, and n transmission lines that cross the n antennas are formed in the intra-probe substrate 321 that has a total of 2n+1 wiring layers, each consisting of n signal line layers and n+1 shield layers sandwiching the signal line layers. The example shown in Fig. 110 to 112 also shows an example in which vias extending from a shield layer arranged above the signal line 255, passing along the sides of the signal line 255, to a shield layer arranged below the signal line 255 are used, and the vias are arranged in a row along the signal line 255, thereby shielding the sides of the signal line 255.

[0250] 110, "b" shows a planar shape in which three planar, slot-shaped antenna slots are arranged using a first wiring layer (shield layer 254-1 with slots, i.e., radiating elements). FIG. 111, "a" shows a planar shape in which three planar, slot-shaped antenna slots are arranged using a third wiring layer (shield layer 254-2 with slots, i.e., radiating elements). FIG. 111, "c" shows a planar shape in which three planar, slot-shaped antenna slots are arranged using a fifth wiring layer (shield layer 256-1 with slots, i.e., radiating elements). FIG. 112, "b" shows a planar shape in which three planar, slot-shaped antenna slots are arranged using a seventh wiring layer (shield layer 256-2 with slots, i.e., radiating elements). In FIG. 110, "Wa" indicates the width of the intra-probe substrate 321. Furthermore, "We" indicates the length from the slot to the shield via row, and "Wf" indicates the length from the end of the signal line to the shield wiring. Wg indicates the width of one signal line and two shield via rows.

[0251] In the example shown in Figures 110 to 112, the three signal lines that cross each of the three antennas are formed using three signal line layers (the second, fourth, and sixth wiring layers) provided on a substrate having seven wiring layers.

[0252] In the second wiring layer shown in FIG. 110c, (1) Of the three slots shown in FIG. 110b, one signal line 255 is formed to cross the first slot. (2) In order to shield the sides of the signal line 255 described in (1) above, rows of shielding vias are arranged on both sides of this signal line. (3) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0253] On the other hand, in the fourth wiring layer shown in FIG. 111b, (1) Of the three slots shown in b in Figure 111, no signal lines 255 are arranged in the second wiring layer to intersect with the slots. Of the second and third slots, two signal lines 255 are formed in the second slot to intersect with it. (2) In order to shield the sides of the signal lines 255 described in (1) above, rows of shielding vias are arranged on both sides of these signal lines. (3) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0254] Furthermore, in the sixth wiring layer shown in a in FIG. (1) Of the three slots shown in b in Figure 111, no signal lines 255 are arranged in the second and fourth wiring layers to intersect with the slots, but for the third slot, two signal lines 255 are formed to intersect with it. (2) In order to shield the sides of the signal lines 255 described in (1) above, rows of shielding vias are arranged on both sides of these signal lines. (3) In order to tightly connect the shielding layer formed using the first wiring layer to the shielding layers formed using the third, fifth, and seventh wiring layers, rows of vias are also arranged near the outer edges of these shielding layers.

[0255] FIG. 113 shows the inside of the probe when cut along the line A-A' of c in FIG. 110. FIG. 3 is a cross-sectional view of a substrate 321.

[0256] Next, the effects of the structures shown in c in Fig. 110, b in Fig. 111, and a in Fig. 112 will be described. In the structures shown in these figures, the shielding via row shown in c in Fig. 101 is used to shield the sides of the signal line 255, thereby reducing the width of the intra-probe substrate 321. Compared to the structure shown in c in Fig. 105, the structures shown in c in Fig. 110, b in Fig. 111, and a in Fig. 112 use more signal line layers, thereby reducing the number of signal lines arranged in one signal line layer. This structure reduces the width of the intra-probe substrate 321 more than the structure shown in c in Fig. 105.

[0257] The width of the probe internal substrate 321 shown in FIGS. 110 to 113 is the same as the width of the probe internal substrate 321 shown in FIGS.

[0258] 114 is a diagram for explaining a cross-sectional structure of a substrate in an area where a connector 323 (and 324) used to connect the intra-probe substrate 321 and a transmission line connection section is arranged in the intra-probe substrate 321 (and 322) provided in the first embodiment of the present technology, and the structure of a transmission line used in that area. In the intra-probe substrate 321, the transmission line connecting the transmitting antenna 223 and the like provided on this substrate to the connector 323 is formed using a strip line, as described above. Meanwhile, in the area where the connector 323 is arranged, the signal line 255 arranged in the inner layer of the intra-probe substrate 321 needs to be drawn out to the surface layer of the substrate in order to electrically connect the signal line 255 arranged in the inner layer of the intra-probe substrate 321 to the transmission line connection section via the connector 323 using a strip line. The signal line 255 drawn out to the surface layer of the intra-probe substrate 321 can have the transmission line structure shown in a, b, or c in the same figure. More specifically, as shown in FIG. 1A, a microstrip line can be used in which a signal line 255 that transmits a signal is arranged on the surface layer and a shield layer 256 is arranged on the inner layer. As shown in FIG. 1B, a coplanar line can be used in which the signal line 255 and the shield wiring are arranged on the surface layer. As shown in FIG. 1C, a coplanar line can be used in which the signal line 255 is arranged on the surface layer and the shield wiring 257 and the shield layer 256 are arranged on the surface and inner layers.

[0259] Also, in the same figure, d and e are diagrams for explaining the cross-sectional structure of the substrate in the region where the connector 323 (and 324) used to connect the probe internal substrate 321 and the transmission line connection portion is arranged. In d in the same figure, the region labeled "transmission line" represents a strip line extending to the transmitting antenna. The structure shown to the left of the strip line represents a structure in which a signal line 255 formed in the inner layer of the substrate is drawn to the surface layer of the substrate through a via extending in the vertical direction of the paper. Shielding vias connecting the shield layers 254 and 256 are arranged around the via connected to the signal line 255. This shields the periphery of the via connected to the signal line 255. In the same figure, reference numeral 311 represents a transmission line connection portion that makes electrical contact with the signal line 255 arranged on the surface layer. 2. In the figure, "e" shows a structure in which a shielding layer 254 or shield wiring is further disposed on the surface layer of the substrate, and a CAN-shield (or shielding case) is further disposed to cover the periphery of the transmission line drawn out to the surface layer. It is even better if the CAN-shield is connected to the shielding layer and given a ground potential. The CAN-shield can reduce the radiation of electromagnetic waves from the transmission line on the surface layer to the outside, or the reception of electromagnetic waves (noise) from the outside to the transmission line on the surface layer. If the substrate has multiple transmission lines, the multiple signal lines 255 drawn out to the surface layer may be parallel-shielded with multiple shield wirings 257 disposed on the surface layer. It is preferable that the length of the microstrip line on the surface layer be as short as possible.

[0260] [Example of time-division driving of antenna] FIG. 115 is a diagram for explaining that the moisture content of soil is measured by performing a time-division scanning operation using a plurality of antennas provided in the sensor device 200 according to the first embodiment of the present technology.

[0261] The sensor device 200 shown in Figure 115 is a view seen from the front (viewed from the Z-axis direction), similar to Figure 4b. As an example, the sensor device 200 shown in Figure 115 has three transmitting antennas and three receiving antennas. Of these three transmitting antennas and three receiving antennas, one transmitting antenna and the one receiving antenna located closest to this transmitting antenna form a combination of transmitting antenna and receiving antenna suitable for measuring moisture content. In this specification, this combination of transmitting antenna and receiving antenna suitable for measuring moisture content may be referred to as a "transmitting / receiving antenna pair."

[0262] 115a to 115e includes three pairs of transmitting and receiving antennas. More specifically, the sensor device 200 includes (1) a first pair of transmitting and receiving antennas consisting of a transmitting antenna 221 and a receiving antenna 231, (2) a second pair of transmitting and receiving antennas consisting of a transmitting antenna 222 and a receiving antenna 232, and (3) a third pair of transmitting and receiving antennas consisting of a transmitting antenna 223 and a receiving antenna 233.

[0263] Here, we will explain the interval between one of the multiple transmit-receive antenna pairs and an adjacent transmit-receive antenna pair (in other words, the interval between two adjacent transmit-receive antenna pairs) included in the multiple transmit-receive antenna pairs included in the sensor device 200. In this explanation, it is assumed that when measuring the moisture content of soil, all of the transmit antennas included in all of the transmit-receive antenna pairs included in the sensor device 200 simultaneously operate to emit electromagnetic waves, and all of the receive antennas included in all of the transmit-receive antenna pairs simultaneously operate to receive electromagnetic waves.

[0264] Generally, when radiating electromagnetic waves from a planar antenna, it is difficult to radiate the electromagnetic waves with high directivity only in a direction perpendicular to the plane of the antenna, and in reality, the waves end up being radiated with a certain degree of spread.

[0265] [Problem 1] When the distance between two adjacent transmit-receive antenna pairs is small, for example, there is a possibility that part of the electromagnetic waves radiated from the transmitting antenna of the second transmit-receive antenna pair may be received by the receiving antenna of the first transmit-receive antenna pair. In this case, the receiving antenna of the first transmit-receive antenna pair will receive a mixture of the electromagnetic waves radiated from the transmitting antenna (desired transmitting antenna) of the first transmit-receive antenna pair and part of the electromagnetic waves radiated from the transmitting antenna (undesired transmitting antenna) of the second transmit-receive antenna pair. In other words, interference occurs. When such interference occurs, errors may occur in the soil moisture measurement results, which is a problem.

[0266] [Second problem] The greater the distance between two adjacent pairs of transmitting and receiving antennas, the more the interference is reduced. This reduces the error in the soil moisture measurement results. However, if the distance between two adjacent pairs of transmitting and receiving antennas is too large, the problem arises that the moisture content of only a small portion of the soil where the sensor device 200 is placed can be measured.

[0267] [Conditions for the first problem to occur] Here, let us consider the circumstances under which the first problem occurs. Several methods have been proposed for measuring soil moisture content. However, when measuring the moisture content of soil using a system equipped with multiple transmitting antennas and multiple receiving antennas, and when these antennas are operated simultaneously, electromagnetic waves are received not only from the desired antenna but also from undesired antennas, resulting in errors in the reception results. This first problem is fundamentally a problem caused by the radiation range (or directivity) of the electromagnetic waves emitted from the transmitting antennas. Therefore, the first problem is a problem specific to a sensor device that has a transmitting antenna and a receiving antenna and measures the amount of moisture in a medium placed between these antennas by transmitting and receiving electromagnetic waves between these antennas.

[0268] [Methods to solve the first and second problems] In order to simultaneously solve these two problems, that is, (1) to increase the density of points at which moisture content is measured in the soil in which sensor device 200 is placed (in other words, to measure moisture content at as many points as possible in the soil in which sensor device 200 is placed), and (2) to reduce errors contained in the measurement results, sensor device 200 of the present invention measures the moisture content of the soil by scanning multiple antennas provided therein in a time-division manner. Therefore, sensor device 200 is equipped with a configuration for performing scanning operations on multiple antennas provided therein in a time-division manner, and measurement unit 312 provided in sensor device 200 controls the scanning operations of the multiple antennas in a time-division manner to measure the moisture content between the antennas. To briefly outline the operation of performing a time-division scan operation of the sensor device 200 to measure (time-division scan measurement operation), (1) from among the multiple transmit-receive antenna pairs provided in the sensor device 200, one transmit-receive antenna pair is selected in a predetermined order, and an operation to measure the moisture content of the soil (measurement operation, for example, an operation to transmit electromagnetic waves from the transmit antenna for measurement, an operation to receive the transmitted electromagnetic waves with a receive antenna and detect them with a receiver in the measurement unit, or an operation to perform a transmission operation and a detection operation and determine the moisture content of the soil from the detection results) is performed. Then, (2) the measurement operation is performed in each transmit-receive antenna pair in turn until the measurement operation has been performed and the results obtained for all predetermined transmit-receive antenna pairs. This is an overview of time-division scan measurement. The details are explained below.

[0269] [Time-division scan measurement operation] The operation of measuring the moisture content of soil by scanning a plurality of antennas provided in the sensor device 200 in a time-division manner will be described with reference to a to e in FIG.

[0270] As shown in the diagram at a, the sensor device 200 wakes up when it receives a moisture measurement instruction at timing 1. As shown in the diagram at b, at timing 2, the sensor device 200 performs moisture measurement using the first pair of transmitting and receiving antennas.

[0271] Next, as shown in c in the figure, the sensor device 200 performs moisture measurement using the second pair of transmitting and receiving antennas at timing 3. As shown in d in the figure, the sensor device 200 performs moisture measurement using the third pair of transmitting and receiving antennas at timing 4.

[0272] As shown in the figure at e, the sensor device 200 transmits the measurement results of all antennas at timing 5. After that, the sensor device 200 transitions to sleep mode. As shown in the figure, the sensor device 200 uses one pair of transmitting and receiving antennas, and performs moisture measurements for each of the multiple pairs of antennas in turn, while dividing the measurement time periods. Ultimately, moisture measurement results can be obtained over the entire soil area where the multiple antennas are located. This control corresponds to the time-division scan measurement drive of component (6). [Hardware configuration for time-division scan measurement]

[0273] Here, as hardware configurations for performing time-division scan measurement, we consider a configuration (Figure 3) that has multiple transmission paths that individually connect the measurement unit board 311 in component (6) to each of the multiple transmitting antennas, and a first comparative example (Figure 116) that does not have multiple transmission paths that individually connect the measurement unit board 311 to each of the multiple receiving antennas.

[0274] 116 is a block diagram showing a configuration example of a sensor device in Comparative Example 1. In the first comparative example, one transmission line is branched into multiple lines on both the transmitting and receiving sides, and these lines are connected to multiple antennas.

[0275] In this first comparative example, because the transmission path has multiple branches, signal reflection occurs at the tips of the multiple branches, causing noise and reducing the accuracy of soil moisture measurement. Furthermore, by arranging a switch for each of the multiple antennas arranged in the housing, the volume of the probe housing that houses them becomes larger than the volume of the probe housing 320 of the present invention. As a result, when the probe housing of the moisture sensor device is inserted into the soil, the probe housing displaces more soil, which then adds to the soil in the measurement target area, causing the soil density in the measurement target area to be higher than the actual soil density. This also reduces the accuracy of soil moisture measurement.

[0276] Next, a second comparative example will be considered in which the transmission switch 216 and the reception switch 217 are not provided.

[0277] 117 is a block diagram showing a configuration example of a sensor device in Comparative Example 2. In the second comparative example, a transmitter or receiver is provided on measurement unit substrate 311 for each antenna on the transmitting and receiving sides.

[0278] In this second comparative example, it is necessary to provide multiple transmitters and receivers so that the number of each is the same as the number of antennas provided in the sensor device. This requires a larger area for the measurement unit board 311 than when there is only one set of transmitter and receiver, and the length of the transmission path on the measurement unit board 311 connecting them to the antennas must also be longer. As a result, when one set of transmitter and receiver on the board is operated, the second comparative example, which has a longer transmission path, inevitably consumes more power.

[0279] Furthermore, in the second comparative example, the increased area of measurement unit substrate 311 inevitably increases the size of measurement unit housing 310 that houses measurement unit substrate 311. In this case, for example, if a crosswind hits the sensor device, there is a higher possibility that sensor housing 305 will break at the boundary between measurement unit housing 310 exposed to the crosswind and probe housing 320 buried in the soil.

[0280] Furthermore, in the second comparative example, the area of the measurement unit substrate 311 is increased, which can cause problems such as the measurement unit housing 310 blocking water sprayed from the side by a sprinkler, or blocking sunlight from reaching the plant or adjacent plants when the plant is short in the early stages of growth.

[0281] The sensor device 200 of the present invention has the following configuration, illustrated in Fig. 3, as hardware for performing time-division scan measurement and for preventing the above-described problems that occur in the first and second comparative examples. Specifically, (1) for each of the transmitting antennas 221 to 223 provided in the sensor device 200, an independent transmission transmission line 218-1 to 218-3 is provided, connecting each transmitting antenna to the measurement circuit 210, so that only one transmitting antenna can be selected to operate. This results in multiple transmission transmission lines. (2) Between the transmitter 214 and the multiple transmission transmission lines 218-1 to 218-3, a transmission switch 216 is provided as a device for selecting one transmitting antenna and transmission transmission line from among all of the transmitting antennas 221 to 223 provided in the sensor device 200 and the transmission transmission lines 218-1 to 218-3 connected thereto. (3) In order to select only one receiving antenna to operate for all receiving antennas 231 to 233 provided in sensor device 200, receiving transmission paths 219-1 to 219-3 are provided independently for each receiving antenna, connecting each receiving antenna to measurement circuit 210. This provides multiple receiving transmission paths. (4) A receiving switch 217 is provided between receiver 215 and multiple receiving transmission paths 219-1 to 219-3 as a device for selecting one receiving antenna and receiving transmission path from all receiving antennas 221 to 223 provided in sensor device 200 and receiving transmission paths 219-1 to 219-3 connected thereto.

[0282] FIG. 118 is a block diagram showing a simplified configuration example of the sensor device 200 according to the first embodiment of the present technology illustrated in FIG. 3, focusing on time-division driving of the antenna.

[0283] The sensor device 200 is equipped with a transmission switch 216 and a reception switch 217, and the sensor control unit 211 controls them in a time-division manner to select one transmission path for both transmission and reception, thereby enabling the selection of an antenna in the desired depth direction.

[0284] As already explained with reference to measuring circuit 210 in Fig. 3 and measuring unit 312 in Fig. 4, measuring unit 312 in Fig. 4 and measuring circuit 210 including sensor control unit 211, transmitter 214, transmission switch 216, receiver 215, and reception switch 217 may be configured with one semiconductor device or may be configured using multiple semiconductor devices. In other words, sensor control unit 211, transmitter 214, transmission switch 216, receiver 215, and reception switch 217 in Fig. 118, which is a simplified version of Fig. 3, may also be configured with one semiconductor device or may be configured using multiple semiconductor devices.

[0285] FIG. 119 is a block diagram showing a configuration example in which the transmission switch 216 and the reception switch 217 are built into the transmitter 214 and the receiver 215, respectively, as another configuration example of the sensor device 200 according to the first embodiment of the present technology. As illustrated in a in the figure, the transmission switch 216 can be provided in the transmitter 214, and the reception switch 217 can be provided in the receiver 215. Here, the transmitter 214 and the receiver 215 refer to, for example, a transmitter IC (Integrated Circuit), a receiver IC, a transmitter module, and a receiver module. In other words, a in the figure is one example in which the measurement circuit 210 and the measurement unit 312 are configured using multiple semiconductor devices. In addition, a in the figure is an example in which the sensor control unit 211, the transmitter 214, and the receiver 215 are configured using different semiconductor devices. In addition, a in the figure is an example in which the sensor control unit 211, the transmission switch 216, and the reception switch 217 are configured using different semiconductor devices. As shown in FIG. 1B, instead of the transmitter 214 and the receiver 215, a transceiver 214-4 having those functions can be provided. Also, instead of the transmission switch 216 and the reception switch 217, a switch 216-1 having those functions can be provided, and the switch 216-1 can be built into the transceiver 214-4. In other words, FIG. 1B is another example in which the measurement circuit 210 and the measurement unit 312 are configured using multiple semiconductor devices. Also, FIG. 1B is an example in which the sensor control unit 211 and the transceiver 214-4 are configured using different semiconductor devices. Also, FIG. 1B is an example in which the sensor control unit 211 and the switch 216-1 are configured using different semiconductor devices.

[0286] Fig. 120 is a block diagram showing a configuration example of the sensor device 200 in which a switch is provided only on the receiving side, as yet another configuration example of the sensor device 200 according to the first embodiment of the present technology. As illustrated in Fig. 120 a, a configuration without a transmission switch 216 is also possible. In Fig. 120 a, the sensor control unit 211, the transmitter 214, the receiver 215, and the reception switch 217 can be configured as a single semiconductor device, or can be configured as different semiconductor devices. As illustrated in Fig. 120 b, the transmission switch 216 is not provided, and the reception switch 217 can be provided in the receiver 215. In Fig. 120 b, the sensor control unit 211, the transmitter 214, and the receiver 215 can be configured as a single semiconductor device, or can be configured as different semiconductor devices.

[0287] As illustrated in Figures 119 and 120, by incorporating a switch, space can be saved compared to Figure 118. In Figure 120, the switch is provided only on the receiving side, making the configuration simpler than in Figure 119 and further saving space. Note that although the sensor device 200 illustrated in Figure 120 cannot avoid interference during measurement as explained above, it does have the effect of reducing the size of the device.

[0288] FIG. 121 is an example of a timing chart of time-division driving according to the first embodiment of the present technology.

[0289] FIG. 122 is an example of a timing chart showing the operation of each part in the sensor device 200.

[0290] As illustrated in FIGS. 121 and 122, the sensor device 200 sleeps for a pre-scheduled period and then wakes up. The transmit switch 216 and the receive switch 217 select one antenna from multiple antennas in a time-division manner. The transmitter 214 and the receiver 215 perform measurement transmission / reception detection operations for each of the frequencies used for measurement, changing the frequency used for measurement in a stepwise manner over time, using the selected antenna. The transmission / reception detection operations include signal transmission, reception, and detection, AD conversion of the complex amplitude resulting from the detection, and storing the conversion results in memory. The memory is provided, for example, within the measurement unit board 311. Note that, to perform one detection operation, it is desirable to transmit the electromagnetic wave to be detected from the transmitting antenna to the receiving antenna over multiple periods. In other words, it is desirable to transmit multiple periods of electromagnetic wave from the transmitting antenna in one transmission / reception detection operation and detect them using the measurement circuit 210.

[0291] Although details will be described later, the purpose of performing measurements by changing the frequency will be briefly explained here. After performing the above-mentioned transmission and reception detection operation (in other words, transmitting, receiving, and detecting a signal, performing AD conversion of the complex amplitude that is the detection result, and storing the conversion result in memory), the moisture measurement system 100 in the first embodiment of the present technology calculates a reflection coefficient and a transmission coefficient (described later) from the detection result (complex amplitude), performs an inverse Fourier transform on these to obtain an impulse response, obtains a delay time based on this, and further obtains the moisture content based on this. To obtain one impulse response, the moisture measurement system 100 performs transmission and reception detection operations at a plurality of frequencies. This is the purpose of performing measurements by changing the frequency, as described with reference to FIG. 121.

[0292] After the sensor device 200 has completed the above operations for all frequencies to be measured using one pair of transmitting and receiving antennas, it performs the above operations in a time-division manner for each of the remaining pairs of transmitting and receiving antennas. The transmitting and receiving antenna pairs are selected in a predetermined order. This order may be selected according to the order in which the antennas are arranged, or any other order may be predetermined.

[0293] After the above operations have been performed for all pairs of transmitting and receiving antennas, the sensor control unit 211 performs signal processing for each pair of transmitting and receiving antennas. This signal processing involves, for example, calculating a reflection coefficient and a transmission coefficient from the detection results (complex amplitude) at each frequency, performing an inverse Fourier transform on these to obtain an impulse response, and then calculating a delay time based on this.

[0294] After completing the signal processing for all the pairs of transmitting and receiving antennas, the sensor communication unit 212 wirelessly transmits the signal processing result data for all the pairs of transmitting and receiving antennas all at once to the central processing unit.

[0295] Based on the received results, the central processing unit 150 calculates the amount of moisture in the soil for each pair of transmitting and receiving antennas. After completing the wireless transmission, the sensor device 200 goes to sleep again for a pre-scheduled period of time.

[0296] Instead of the central processing unit 150, the sensor device 200 may calculate the soil moisture content for each pair of transmitting and receiving antennas and transmit the calculation results to the central processing unit 150. The order of switching on the transmitting side and the receiving side may be simultaneous, or the transmitting side may be switched first, or the receiving side may be switched first. The method of changing the frequency in a stepped manner may be in an ascending or descending direction, or the order of the frequencies may be reversed to change them discontinuously or in any predetermined order.

[0297] In addition, in order to improve the accuracy of the measurement (to improve the reproducibility of the measurement results), the above-mentioned measurement transmission and reception detection operation performed at one measurement frequency for one transmission and reception antenna pair may be repeated multiple times (for example, 100 times).

[0298] For example, if an operation is repeated 100 times at each measurement frequency of each antenna, the sensor device 200 performs the transmission / reception detection operation 100 times at the first frequency of the first transmission / reception antenna pair, and then performs the transmission / reception detection operation 100 times at the second frequency of the first transmission / reception antenna pair. After completing the repeated operations at each of the remaining frequencies for the first transmission / reception antenna pair, the above repeated operations may be performed for each of the remaining transmission / reception antenna pairs. Note that the order in which the operations are performed does not have to be limited to the above, as long as the operation results can be obtained for each measurement frequency of each transmission / reception antenna pair for a predetermined number of repetitions.

[0299] The control example in FIGS. 121 and 122 is referred to as control example a.

[0300] FIG. 123 is an example of a timing chart of time-division driving when the timing of signal processing is changed according to the first embodiment of the present technology.

[0301] FIG. 124 is an example of a timing chart showing the operation of each unit in the sensor device when the timing of signal processing is changed according to the first embodiment of the present technology.

[0302] As shown in Figures 123 and 124, the timing of signal processing can also be changed. In this control example b, the sensor control unit 211 performs signal processing every time a series of transmission and reception detection operations at multiple frequencies is completed. This makes it possible to reduce the amount of detection result data that needs to be stored in order to perform the above signal processing compared to control example a.

[0303] Specifically, when a sensor device has n pairs of transmit and receive antennas, the memory size can be reduced to 1 / n. Furthermore, the number of times that data is wirelessly transmitted (described later) can be reduced to 1 / n of that in Control Example C. This reduces the number of times that processing is performed before and after transmitting payload data in each wireless transmission to 1 / n, and the power consumption required for this processing is also reduced to 1 / n of that in Control Example C (described later).

[0304] FIG. 125 is an example of a timing chart of time-division driving when the timing of signal processing and data transmission is changed according to the first embodiment of the present technology.

[0305] FIG. 126 is an example of a timing chart showing the operation of each unit in the sensor device when the timing of signal processing and data transmission is changed according to the first embodiment of the present technology.

[0306] As illustrated in Figures 125 and 126, the timing of signal processing and data transmission can also be changed. In this control example c, the sensor communication unit 212 wirelessly transmits the obtained data each time all transmission and reception detection operations at a series of frequencies and the subsequent signal processing are completed for each transmission and reception antenna pair. This reduces the amount of data resulting from signal processing that needs to be stored for wireless transmission compared to control example b. Specifically, if a sensor device has n transmission and reception antenna pairs, the memory size for storing the data resulting from the signal processing can be 1 / n of that in control example b.

[0307] FIG. 127 is an example of a timing chart of time-division driving when the order of transmission and reception detection operations is changed in the first embodiment of the present technology.

[0308] FIG. 128 is an example of a timing chart showing the operation of each unit in the sensor device when the order of the transmission and reception detection operations is changed according to the first embodiment of the present technology.

[0309] As shown in Figures 127 and 128, the order of transmission and reception detection operations can also be changed. In this control example d, the transmitter 214 and receiver 215 change the frequency in stages, and for each frequency the transmission switch 216 and reception switch 217 select all transmission and reception antenna pairs in sequence. This reduces the amount of data resulting from signal processing that needs to be stored for wireless transmission compared to control example b. Specifically, if a sensor device has n transmission and reception antenna pairs, the memory size for storing the data resulting from signal processing can be 1 / n of that in control example b.

[0310] The difference between the operation of control example d described with reference to Figures 127 and 128, i.e., "the operation in which the transmitter 214 and the receiver 215 change the frequency in stages, and for each frequency the transmission switch 216 and the reception switch 217 select all transmission and reception antenna pairs in sequence to perform transmission and reception detection operations," and the operation of control example a described above will be explained by comparing the two.

[0311] As explained above, the operation of the control example a shown in FIGS. 121 and 122 is as follows: (1) Using one pair of transmitting and receiving antennas, "the operation of transmitting and detecting electromagnetic waves in turn at each of the frequencies to be measured while changing the frequency of the electromagnetic waves (transmitting and receiving detection operation)" is performed. (2) After the above operation is completed for one pair of transmitting and receiving antennas, for each of the remaining pairs of transmitting and receiving antennas used for measurement among the multiple pairs of transmitting and receiving antennas provided in the sensor device 200, "the operation of transmitting and receiving electromagnetic waves in turn at each of all frequencies to be measured while changing the frequency of the electromagnetic waves" is performed.

[0312] In contrast, the operation of the control example d shown in FIGS. 127 and 128 is as described above. (1) At one frequency, "while switching the transmitting and receiving antenna pair for transmitting and receiving electromagnetic waves, an operation of transmitting and detecting electromagnetic waves in turn at each of all transmitting and receiving antenna pairs used for measurement among the multiple transmitting and receiving antenna pairs provided in the sensor device 200 (transmitting and receiving detection operation)" is performed; (2) After completing the above operation at one frequency, for each of the remaining frequencies, "while switching between transmitting and receiving antenna pairs, the sensor device 200 sequentially receives, receives, and detects electromagnetic waves at each of all transmitting and receiving antenna pairs that are used for measurement among the multiple transmitting and receiving antenna pairs provided in the sensor device 200."

[0313] As an example of control example d, the example shown in FIG. 127 is (i) switching the transmitting and receiving antenna pairs that transmit and receive electromagnetic waves using the first frequency, and sequentially performing the transmitting and receiving operation of the electromagnetic waves in each of all transmitting and receiving antenna pairs that perform measurement among the multiple transmitting and receiving antenna pairs provided in the sensor device 200; (ii) after completing the above operation using the first frequency, switching the transmitting and receiving antenna pair that transmits and receives the electromagnetic waves using the second frequency, sequentially performing the transmitting and receiving operation of the electromagnetic waves in each of all transmitting and receiving antenna pairs that perform the above measurement; (iii) after completing the above operation using the second frequency, switching the transmitting and receiving antenna pair that transmits and receives the electromagnetic waves using a third frequency, and performing the transmitting and receiving detection operation of the electromagnetic waves in turn for each of all transmitting and receiving antenna pairs that perform the above measurement; (iv) After completing the above operation using the third frequency, the same operation as above is performed for the remaining frequencies used for measurement, i.e., while switching the transmitting and receiving antenna pairs for transmitting and receiving electromagnetic waves, the transmitting and receiving and detecting operation of the electromagnetic waves is repeated in order for each of the transmitting and receiving antenna pairs for performing measurement among the multiple transmitting and receiving antenna pairs provided in the sensor device 200; (v) after completing the transmission and reception detection operation of the electromagnetic waves for all the frequencies used for the measurement for each of the pairs of transmission and reception antennas used for the measurement, signal processing is performed on the results obtained by the transmission and reception detection operation, and data of the signal processing results is transmitted. This shows an example in which the operation is as follows. This operation can also be expressed as a timing chart showing the operation of each unit in the sensor device, as shown in Fig. 349. Fig. 349 is a timing chart showing the operation of each unit in the sensor device when the order of transmission and reception detection operations in the first embodiment of the present technology is changed, and shows the operations (i) to (v) above.

[0314] Furthermore, when comparing the number of times the transmitter switches the frequency of the transmission signal from the startup to the sleep of the sensor device 200, control example d has the fewest number of frequency switches among control examples a to d. Compared with control examples a, b, and c, control example d has the fewest number of frequency switches of the PLL (Phase Locked Loop) in the transmitter 214 from the startup to the sleep of the sensor device 200. This minimizes the total time required for switching, thereby shortening the measurement time and reducing power consumption. Normally, the frequency switching time of a PLL is about 100 microseconds (μs), and the switching time of the transmit switch 216 is about 100 nanoseconds (ns). If the number of channels is 161 and the number of antennas is 3, the time required for switching between control examples a, b, and c can be calculated using the following formula: 161×3×100μs+50ns×3=0.048s...Formula 1

[0315] On the other hand, the time involved in switching in control example d is calculated by the following formula. 161×1×100μs+50ns×161×3=0.016s…Formula 2

[0316] From equations 1 and 2, the time involved in switching is reduced to about one-third.

[0317] FIG. 129 shows control examples a, b, and c for each antenna according to the first embodiment of the present technology. 1 is a diagram illustrating an example of a transmission signal (for each pair of transmitting and receiving antennas). As illustrated in the diagram, the first antenna (transmitting antenna 221) transmits signals of frequencies f1 to f N Then, the second antenna (transmitting antenna 222) outputs the transmit signals of frequencies f1 to f N Then, the third antenna (transmitting antenna 223) outputs the transmission signals of frequencies f1 to f N The transmission signals are output in sequence.

[0318] Fig. 130 is a diagram showing an example of a transmission signal for each antenna (each pair of transmitting and receiving antennas) in control example d according to the first embodiment of the present technology. As shown in the diagram, the first to third antennas output a transmission signal of frequency f1 in turn, and then the first to third antennas output a transmission signal of frequency f2 in turn. Hereinafter, the frequency f N The same control is executed until

[0319] [Example of chassis configuration] Fig. 131 is a diagram showing another example of the sensor device 200 according to the first embodiment of the present technology. Comparing the sensor device 200 shown in Fig. 4 with the sensor device 200 shown in Fig. 131, the former (Fig. 4) is provided with a battery inside the measurement unit housing 310, while the latter (Fig. 131) is not provided with a battery inside the measurement unit housing 310, and is configured to supply power from outside the sensor device 200 or to have the sensor device 200 itself generate power using a solar cell or the like.

[0320] 131, the measurement unit substrate 311 is positioned so that its dimensions in the X-axis and Y-axis directions are greater than its dimension in the Z-axis direction. In other words, it is positioned so that its largest surface extends perpendicular to the ground. In terms of its relationship with the two probe housings 320 of the sensor device 200, the measurement unit substrate 311 is positioned so that its largest surface is parallel to a plane including two line segments: the center line of the transmitting probe housing 320a, which indicates the extension direction of the transmitting probe housing 320a, and the center line of the receiving probe housing 320b, which indicates the extension direction of the receiving probe housing 320b.

[0321] 131, the measurement unit housing 310 that houses the measurement unit board 311 is also positioned so that its dimensions in the X-axis and Y-axis directions are greater than its dimension in the Z-axis direction. In other words, the measurement unit housing 310 is positioned so that its largest surface extends perpendicular to the ground. In terms of its relationship with the two probe housings 320 of the sensor device 200, the measurement unit housing 310 is positioned so that its largest surface is parallel to a plane that includes two line segments: the center line of the transmitting probe housing 320a that indicates the extension direction of the transmitting probe housing 320a, and the center line of the receiving probe housing 320b that indicates the extension direction of the receiving probe housing 320b.

[0322] The sensor device 200 shown in Figure 131 has this arrangement structure, which has the effect that rainfall and water sprayed from above the sensor device 200 can easily reach the soil located between the two probe housings 320 and whose moisture content is to be measured (in other words, the soil is more likely to become the same as if the sensor device were not placed therein), compared to a configuration that does not have this arrangement structure.

[0323] FIG. 132 is a simplified diagram illustrating an example of the sensor device 200 depicted in FIG. 4 according to the first embodiment of the present technology.

[0324] 4, the sensor device 200 shown in Fig. 132 has a configuration in which a battery is provided inside the measurement unit housing 310. Therefore, the sensor device 200 shown in Fig. 132 has a measurement unit housing 310 that is larger in size in the Z-axis direction than the sensor device 200 shown in Fig. 131.

[0325] 132, the measurement unit substrate 311 is also positioned so that its dimensions in the X-axis and Y-axis directions are greater than its dimension in the Z-axis direction. In other words, it is positioned so that its largest surface extends perpendicular to the ground. In terms of its relationship with the two probe housings 320 of the sensor device 200, the measurement unit substrate 311 is positioned so that its largest surface is parallel to a plane including two line segments: the center line of the transmitting probe housing 320a, which indicates the extension direction of the transmitting probe housing 320a, and the center line of the receiving probe housing 320b, which indicates the extension direction of the receiving probe housing 320b.

[0326] 132, the measurement unit housing 310 is positioned so that its dimensions in the X-axis and Y-axis directions are larger than its dimension in the Z-axis direction. In other words, the measurement unit housing 310 is positioned so that its largest surface extends perpendicular to the ground. In terms of the relationship with the two probe housings 320 of the sensor device 200, the measurement unit housing 310 is positioned so that its largest surface is parallel to a plane including two line segments: the center line of the transmitting probe housing 320a, which indicates the extension direction of the transmitting probe housing 320a, and the center line of the receiving probe housing 320b, which indicates the extension direction of the receiving probe housing 320b.

[0327] The sensor device 200 shown in Figure 132 has this arrangement structure, which has the effect that rainfall and water sprayed from above the sensor device 200 can easily reach the soil located between the two probe housings 320 and whose moisture content is to be measured (in other words, the soil is more likely to become the same as if the sensor device were not placed therein), compared to a configuration that does not have this arrangement structure.

[0328] 133 and 134 are diagrams showing an example of a sensor device 200 that is based on the sensor device 200 shown in FIGS. 131 and 132 and that adds gutters to the sensor device 200. As shown in FIGS. 133 and 134, gutters 362 to 364 that drain rainwater and sprinkled water to the outside can also be added. The gutters 362 are provided at the bottom of the measurement unit housing 310, and gutters 363 and 364 are provided at the top of the probe housing 320. This makes it possible for the measurement unit housing 310 to collect rainwater and sprinkled water that splashes in from the side and reduce the amount of it flowing into the interface between the probe and the soil.

[0329] FIG. 135 is a diagram for explaining the strength of the probe housing 320 included in the sensor device 200 according to the first embodiment of the present technology.

[0330] In the figure, "a" shows the state before deformation when one end of probe housing 320 is fixed and a constant load is applied to the other end. "b" in the figure shows the state of probe housing 320 after deformation. "c" in the figure shows the state before deformation when one end of internal probe substrate 321 is fixed and a constant load is applied to the other end. "d" in the figure shows the state of internal probe substrate 321 after deformation. The strength of internal probe substrate 322 is the same as that of internal probe substrate 321.

[0331] The strength of probe housing 320 is higher than that of probe internal substrates 321 and 322. Here, "high strength" means that when one end of probe housing 320 is fixed and a certain load is applied to the other end, the deformation amount of the housing is smaller than the deformation amount of probe internal substrate 321 when one end of probe internal substrate 321 is fixed and a certain load is applied to the other end, as exemplified in the figure.

[0332] In this way, the sensor device 200 of the present invention: (1) A sensor device comprising a transmitting probe housing 320a containing a transmitting antenna (e.g., 223) that transmits electromagnetic waves, and a receiving probe housing 320b containing a receiving antenna (e.g., 233) that receives the electromagnetic waves, and which measures the propagation characteristics of the electromagnetic waves transmitted from the transmitting antenna and received by the receiving antenna, thereby measuring the amount of moisture in a medium, (2) Both the transmitting probe housing 320a and the receiving probe housing 320b are formed from a material (electromagnetic wave transparent material) that transmits the electromagnetic waves transmitted from the transmitting antenna and the electromagnetic waves received by the receiving antenna; (3) The strength of the transmitting probe housing 320a and the receiving probe housing 320b made of the electromagnetic wave transparent material is made higher than the strength of the electronic board (wiring board) housed inside these housings. Equipped with.

[0333] By being equipped with this structure, the sensor device 200 of the present invention prevents "the probe housing from deforming when inserted into the soil, which in turn deforms the electronic board housed inside the housing, which in turn changes the distance between the transmitting antenna and receiving antenna formed on this electronic board from the specified value, which in turn causes an error in the moisture content measurement results," thereby achieving the effect of enabling accurate moisture measurement.

[0334] [Method for measuring moisture content] 136 is a block diagram showing an example configuration of a measurement circuit 210 according to the first embodiment of the present technology. The measurement circuit 210 includes a directional coupler 410, a transmitter 420, an incident wave receiver 430, a reflected wave receiver 440, a transmitted wave receiver 450, a sensor control unit 470, a sensor communication unit 212, and an antenna 213. As the measurement circuit 210, for example, a vector network analyzer is used.

[0335] Transmitter 420 in Fig. 136 corresponds to transmitter 214 in Fig. 3. Furthermore, incident wave receiver 430, reflected wave receiver 440, and transmitted wave receiver 450 correspond to receiver 215 in Fig. 3. Sensor control unit 470 corresponds to sensor control unit 211 in Fig. 3. Directional coupler 410 is omitted in Fig. 3.

[0336] The directional coupler 410 separates the electrical signal transmitted through the transmitting transmission lines 229-1 to 229-3 into an incident wave and a reflected wave. The incident wave is the wave of the electrical signal transmitted by the transmitter 420, and the reflected wave is the incide...

Claims

1. a transmitting antenna that transmits a signal as an electromagnetic wave, a receiving antenna that receives the electromagnetic wave that has been transmitted from the transmitting antenna and transmitted through a medium, a measuring unit that measures the electromagnetic wave that has propagated to the receiving antenna, and a sensor housing; The device further includes a transmitting substrate, which is an electronic substrate having a plurality of wiring layers, and a receiving substrate, which is an electronic substrate having a plurality of wiring layers, Alternatively, the antenna may further include a first covering layer that covers the outer periphery of a portion of the transmitting substrate and is made of an electromagnetic wave absorbing material, and a second covering layer that covers the outer periphery of a portion of the receiving substrate and is made of an electromagnetic wave absorbing material, the sensor housing includes a transmitting probe housing that is a part of the sensor housing and that houses the transmitting board, and a receiving probe housing that is another part of the sensor housing and that houses the receiving board, the transmitting substrate includes a transmitting transmission path and a transmitting exposed portion that constitutes a part of the transmitting antenna, the transmission path is formed using a wiring layer provided on the transmission board, includes a first shield layer and a first signal line superposed on each other, and is electrically connected to the measurement unit; the transmission exposed portion is formed using a wiring layer provided on the transmission board, is electrically connected to the first signal line, and is a conductor exposed from the first shield layer or the first covering layer; the receiving substrate includes a receiving transmission path and a receiving exposed portion that constitutes a part of the receiving antenna, the receiving transmission path is formed using a wiring layer provided on the receiving substrate, includes a second shield layer and a second signal line superimposed thereon, and is electrically connected to the measuring unit; the receiving exposed portion is formed using a wiring layer provided on the receiving substrate, is electrically connected to the second signal line, and is a conductor exposed from the second shield layer or the second covering layer; each of the transmitting exposed portion and the receiving exposed portion has a size greater in both a second direction that is orthogonal to the first direction and parallel to the extension direction of the transmission line, and a third direction that is orthogonal to the first and second directions, than in a first direction that is the direction of the superposition, and extends parallel to a plane determined by the second direction and the third direction; The sensor device further comprises: the transmitting transmission path and the transmitting exposed portion, which are formed using a wiring layer provided on the transmitting board; and the receiving transmission path and the receiving exposed portion, which are formed using a wiring layer provided on the receiving board; the transmitting exposed portion and the receiving exposed portion are arranged opposite each other so that the extension direction of the plane of the transmitting exposed portion and the extension direction of the plane of the receiving exposed portion are parallel; the transmitting exposed portion and the receiving exposed portion are arranged at positions spaced a predetermined distance apart; and the extension direction and position are fixed within the sensor housing.

2. The transmitting exposed portion is a transmitting element provided in the transmitting antenna, and the receiving exposed portion is a receiving element provided in the receiving antenna. The sensor device according to claim 1 .

3. In the transmitting probe housing, The distance from the center of the transmitting substrate to the housing end of the transmitting probe housing in a direction perpendicular to the plane of the transmitting substrate is: a distance in a direction parallel to the plane of the transmitting substrate and smaller than the distance from the center of the transmitting substrate to the housing end of the transmitting probe housing; In the receiving probe housing, The distance from the center of the receiving substrate to the housing edge of the receiving probe housing in a direction perpendicular to the plane of the receiving substrate is: a direction parallel to the plane of the receiving substrate and smaller than the distance from the center of the receiving substrate to the housing end of the receiving probe housing; The sensor device according to claim 1 .

4. The transmitting substrate and the receiving substrate are further provided with a positioning portion for fixing the extending direction and the position of the transmitting substrate and the receiving substrate. The sensor device according to claim 1 .

5. The positioning portion is fixed to the sensor housing and is integrated with the sensor housing. The sensor device according to claim 4.

6. The sensor housing itself is structured to include the positioning portion. The sensor device according to claim 4.

7. The transmitting board and the receiving board are each abutted against the housing at at least two points, thereby fixing the extending direction and the position of the transmitting board and the receiving board. The sensor device according to claim 1 .

8. The transmitting substrate and the receiving substrate each have a structure in which their peripheries are hardened with resin, The strength of the structure in which the periphery of the transmitting substrate is hardened with resin is at least twice as strong as the transmitting substrate, and the strength of the structure in which the periphery of the receiving substrate is hardened with resin is at least twice as strong as the receiving substrate. The sensor device according to claim 1 .

9. the transmitting probe housing is formed using an electromagnetic wave transparent material so that the strength of the housing is greater than the strength of the transmitting substrate; The receiving probe housing is formed using an electromagnetic wave transparent material so that the strength of the housing is greater than the strength of the receiving substrate. The sensor device according to claim 1 .

10. the transmitting probe housing has a wall thickness in a portion of the housing that is greater than a wall thickness in another portion in a cross section perpendicular to the extending direction of the housing; The receiving probe housing has a wall thickness in a portion of the housing that is greater than the wall thickness in another portion in a cross section perpendicular to the extending direction of the housing. The sensor device according to claim 1 .

11. In a cross section perpendicular to the extending direction of the transmitting probe housing, the thickness of the end of the transmitting probe housing located in a direction parallel to the substrate from the center of the transmitting substrate is larger than the thickness of the transmitting probe housing located in a direction perpendicular to the substrate from the center of the transmitting substrate, In a cross section perpendicular to the extending direction of the receiving probe housing, the thickness of the receiving probe housing end located in a direction parallel to the receiving substrate from the center of the receiving substrate is greater than the thickness of the receiving probe housing located in a direction perpendicular to the receiving substrate from the center of the receiving substrate. The sensor device according to claim 10.

12. In a cross section perpendicular to the extending direction of the transmitting probe housing, the thickness of an end portion of the transmitting probe housing located in a direction perpendicular to the substrate from the center of the transmitting substrate is greater at the end portion located farther from the receiving substrate than at the end portion located closer to the receiving substrate; In a cross section perpendicular to the extending direction of the receiving probe housing, the thickness of the end of the receiving probe housing located from the center of the receiving substrate in a direction perpendicular to the substrate is greater at the end located farther from the transmitting substrate than at the end located closer to the transmitting substrate. The sensor device according to claim 10.

13. In the transmitting substrate, a plurality of vias connected to the first shield layer; a shield structure formed by the row of the plurality of vias on a side of the first signal line; In the receiving substrate, a plurality of vias connected to the second shield layer; a shield structure formed by the row of the plurality of vias on the side of the second signal line; The sensor device according to claim 1 .

14. the transmitting board includes a plurality of the transmitting antennas, The receiving board includes a plurality of the receiving antennas. The sensor device according to claim 1 .

15. In the transmitting board, the transmitting transmission lines connected to the plurality of transmitting antennas are provided independently for each of the plurality of antennas, In the receiving board, the receiving transmission lines connected to the plurality of receiving antennas are provided independently for each of the plurality of antennas. The sensor device according to claim 1 .

16. The measurement unit selects the transmitting antennas one by one from the plurality of transmitting antennas in a predetermined order and controls the transmitting antennas to transmit the electromagnetic waves. The sensor device according to claim 15.

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