Electronic Components

Abstract

To provide an electronic component which can be flexibly corresponded to a change in size of a ceramic element in an inner part, and has an excellent productivity.SOLUTION: An electronic component comprises: a case having a concave part and a case lower surface directed to the side opposite to an opening of the concave part; a ceramic element that is arranged on the case lower surface, and has a first main surface and a second main surface which are opposite each other, and has a first electrode part formed on the first main surface and a second electrode part formed on the second main surface; a first metal terminal containing a first mounting part that is arranged on the case lower surface and approximately parallel to the first main surface and the second main surface, and a first electrode connection part connected to the first electrode part; and a second metal terminal containing a second mounting part that is arranged on the case lower surface and approximately parallel to the first main surface and the second main surface, and a second electrode connection part connected to the second electrode part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic component used as a capacitor or the like. [Background technology]

[0002] Conventionally, capacitors and the like have been proposed that are configured by connecting metal terminals to a single-plate dielectric disk, and electronic components have also been proposed in which the periphery of such a dielectric disk is molded with an exterior material, making it suitable for surface mounting.

[0003] However, conventional surface-mount electronic components have the problem of a complicated assembly process, since they require a process of fixing a dielectric disk and metal terminals in a cavity for resin molding and then molding with an exterior material.Furthermore, since the molding die must be changed when the size of the dielectric disk changes, it is difficult to flexibly respond to changes in the size of the dielectric disk. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-196348 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and provides an electronic component that can flexibly accommodate changes in the size of the internal ceramic element and has good productivity. [Means for solving the problem]

[0006] In order to solve the above problems, the electronic component according to the present invention comprises: a case having a recess and a case bottom surface facing away from the opening of the recess; a ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface; a first metal terminal having a first mounting portion disposed on or adjacent to the case bottom surface and substantially parallel to the first main surface and the second main surface, and a first electrode connecting portion connected to the first electrode portion; The case has a second metal terminal having a second mounting portion arranged on the bottom surface of the case or adjacent to the bottom surface of the case and substantially parallel to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

[0007] The electronic component according to the present invention accommodates a ceramic element in a recess in a case, eliminating the need for a process of placing a ceramic element or the like in a cavity for resin molding and then molding it with an exterior material, resulting in good productivity.

[0008] Furthermore, for example, the electronic component according to the present invention may have a case cover that closes the opening, The first metal terminal may be inserted through a first gap formed between the case and the case cover, The second metal terminal may be inserted through a second gap separated from the first gap formed between the case and the case cover.

[0009] In such electronic components, the case cover can effectively protect components placed in the recess, such as ceramic elements. Furthermore, because the case cover forms a surface for attachment by a mounting machine or the like during surface mounting, such electronic components are suitable for surface mounting. Furthermore, the first metal terminal and the second metal terminal can be inserted through a gap formed between the case and the case cover, thereby effectively sealing the interior of the case. Furthermore, in the electronic component of the present invention, the gap in the recess of the case may be filled with a molded resin. In such a case, electronic components having a case cover have a wide range of molded resin options because the case cover prevents the molded resin from being exposed to the outside.

[0010] Furthermore, for example, the case cover may have a plurality of protrusions provided corresponding to the corners of the opening and inserted into the recesses.

[0011] A case cover having such a protrusion can be easily and accurately aligned with respect to the case, and can be firmly fixed to the case.

[0012] Furthermore, for example, the depth of the recess, which is the distance from the opening of the case to the bottom surface of the recess, may be greater than the thickness of the element, which is the distance between the first main surface and the second main surface.

[0013] In such electronic components, the entire ceramic element can be housed in the recess without being exposed through the opening of the recess. Furthermore, when a case cover is used, the shape of the case cover can be simplified. Furthermore, when a molding resin is filled in the recess, the entire ceramic element can be covered with the molding resin.

[0014] Also, for example, the ceramic element may have a first portion having the first main surface, the first electrode portion, and a first dielectric portion, and a second portion having the second main surface, the second electrode portion, and a second dielectric portion, and the first portion and the second portion may be connected via an intermediate electrode portion.

[0015] The ceramic element placed in the recess may be a single ceramic element, or may be a combination of multiple plate-like portions, such as a first portion and a second portion, and such an electronic component constitutes an electronic component in which a first dielectric portion and a second dielectric portion are connected in series.

[0016] Furthermore, for example, the ceramic element may have a first element portion and a second element portion each having the first main surface and the second main surface, The first element portion and the second element portion may be arranged so that the second main surfaces thereof face each other, the second electrode connection portion may be sandwiched between the second main surfaces of the first element portion and the second element portion so as to contact the second electrode portions of both the first element portion and the second element portion, The first electrode connection portion may have a first element connection portion connected to the first electrode portion of the first element portion, and a second element connection portion connected to the first electrode portion of the second element portion.

[0017] The ceramic element placed in the recess may be a single dielectric plate, or may be a combination of multiple dielectric plates, such as a first element portion and a second element portion, and such an electronic component constitutes an electronic component in which the first element portion and the second element portion are connected in parallel.

[0018] Also, for example, the first metal terminal and the second metal terminal may be arranged on the underside of the case, and a recessed groove portion having a varying groove depth may be formed on the underside of the case, facing at least one of the first mounting portion and the second mounting portion. Furthermore, for example, the groove portion may be formed with a first groove in which the gap formed between the tip of the first mounting portion and the groove portion is wider than the gap formed between the base end of the first mounting portion, and a second groove in which the gap formed between the tip of the second mounting portion and the groove portion is wider than the gap formed between the base end of the second mounting portion.

[0019] In such an electronic component, after the ceramic element, first electrode connection portion, and second electrode connection portion are incorporated into the case, the first electrode portion and second electrode portion can be processed to arrange the first mounting portion and the second mounting portion, which are approximately parallel to the first main surface and the second main surface, on the underside of the case. This makes it possible to fix the first electrode portion and the second electrode portion to the ceramic element before fixing these components to the case. Therefore, in such an electronic component, the first mounting portion and the second mounting portion can be formed with high precision and the productivity is good. [Brief explanation of the drawings]

[0020] [Figure 1]FIG. 1 is a schematic perspective view of an electronic component according to a first embodiment of the present invention, viewed obliquely from above. [Figure 2] FIG. 2 is a schematic perspective view of the electronic component shown in FIG. 1, viewed obliquely from below. [Figure 3] FIG. 3 is a schematic perspective view showing the state inside the case of the electronic component shown in FIG. [Figure 4] 4 is a schematic perspective view showing a case and a second metal terminal in the electronic component shown in FIG. [Figure 5] FIG. 5 is a cross-sectional view of the electronic component shown in FIG. [Figure 6] FIG. 6 is a partial perspective view showing the lower surface of a case according to the first modified example. [Figure 7] FIG. 7 is a conceptual diagram showing the gap between the lower surface of the case and the mounting portion according to the first modified example. [Figure 8] FIG. 8 is a schematic perspective view of an electronic component according to a second embodiment of the present invention, viewed obliquely from above. [Figure 9] FIG. 9 is a schematic perspective view of an electronic component according to a third embodiment of the present invention, viewed obliquely from above. [Figure 10] FIG. 10 is a schematic perspective view of an electronic component according to a fourth embodiment of the present invention, viewed obliquely from above. [Figure 11] FIG. 11 is a schematic perspective view showing the state inside the case of the electronic component shown in FIG. [Figure 12] FIG. 12 is a plan view of the electronic component shown in FIG. 10 as viewed from above. [Figure 13] FIG. 13 is a conceptual diagram showing an example of a state in which the electronic component shown in FIG. 10 is used. [Figure 14] FIG. 14 is a schematic perspective view showing the state inside a case of an electronic component according to a second modified example of the present invention. [Figure 15] FIG. 15 is a schematic perspective view of an electronic component according to a fifth embodiment of the present invention, viewed obliquely from above. [Figure 16] FIG. 16 is a schematic perspective view showing the state inside the case of the electronic component shown in FIG. [Figure 17]FIG. 17 is a schematic perspective view of the electronic component shown in FIG. 15, viewed obliquely from below. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0022] First embodiment Fig. 1 is a schematic perspective view of an electronic component 10 according to a first embodiment of the present invention, viewed from diagonally above. As shown in Fig. 1, electronic component 10 has a case 20 and a case cover 60 that covers an opening 21a (see Fig. 3) of case 20. As shown in Fig. 3, which shows the parts of electronic component 10 other than case cover 60, electronic component 10 has a ceramic element 30 housed inside the case, a first metal terminal 40 connected to a first electrode portion 33 of ceramic element 30, and a second metal terminal 50 connected to a second electrode portion 34 of ceramic element 30.

[0023] 1, electronic component 10 has a substantially rectangular flat plate shape, but is not limited to this and may have a polygonal flat plate shape other than a rectangle, or may have a disk shape. As shown in Fig. 3, the side of electronic component 10 opposite the side on which case cover 60 is placed is the mounting surface that faces the substrate or the like to be mounted when electronic component 10 is mounted.

[0024] 3, case 20 has a recess 21, and ceramic element 30 and the like are housed inside recess 21. When viewed from the opening side of recess 21, recess 21 has a rectangular shape that is slightly smaller than the outer shape of case 20, and a substantially rectangular parallelepiped space is formed inside case 20. Opening 21a of recess 21 is formed in case 20 so as to open in a direction facing upward (the opposite side to the mounting surface) of electronic component 10.

[0025] Fig. 2 is a perspective view of electronic component 10 viewed obliquely from below. As shown in Fig. 2, case 20 has case bottom surface 22 facing the opposite direction from opening 21a of recess 21. First mounting portion 42 of first metal terminal 40 and second mounting portion 52 of second metal terminal 50 are arranged on case bottom surface 22.

[0026] As shown in FIG. 3, the ceramic element 30 is disposed in the recess 21 of the case 20. The ceramic element 30 has a first main surface 31a and a second main surface 31b facing each other and has a generally disc-shaped outer shape. However, the ceramic element 30 may have a shape other than a disc, such as an elliptical disk or a rectangular plate. The first main surface 31a and the second main surface 31b are the pair of surfaces with the largest areas of the ceramic element 30. Furthermore, in the description of the ceramic element 30 shown in FIG. 3, the one of the two main surfaces facing upward is referred to as the first main surface 31a and the one facing downward is referred to as the second main surface 31b. However, the downward-facing main surface may be referred to as the first main surface 31a and the upward-facing main surface may be referred to as the second main surface 31b.

[0027] As shown in FIG. 5, which is a cross-sectional view of the electronic component 10, the ceramic element 30 has a first electrode portion 33 formed on the first principal surface 31a, a second electrode portion 34 formed on the second principal surface 31b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. The material of the dielectric portion 35 is not particularly limited and may be a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. In FIG. 5, the case cover 60 is indicated by a virtual line (two-dot chain line). The ceramic element 30 is not limited to a capacitor in which the dielectric portion 35 is sandwiched between the first electrode portion 33 and the second electrode portion 34. For example, the ceramic element may be a varistor or thermistor in which a semiconductor ceramic is sandwiched between the first electrode portion 33 and the second electrode portion.

[0028] The materials for the first electrode portion 33 and the second electrode portion 34 are not particularly limited, and typically copper, copper alloys, nickel, nickel alloys, etc. are used, but silver, silver-palladium alloys, etc. can also be used. The thickness of the first electrode portion 33 and the second electrode portion 23 is not particularly limited, but is typically about 10 to 50 μm. The surfaces of the first and second electrode portions 33, 34 may be coated with at least one metal coating selected from Ni, Cu, Sn, etc.

[0029] As shown in FIG. 5, recess depth W2, which is the distance from opening 21a of case 20 to bottom surface 21c of recess 21 (see FIG. 4, etc.), is greater than element thickness W1, which is the distance from first main surface 31a to second main surface 31b of ceramic element 30. This allows electronic component 10 to accommodate ceramic element 30 in its entirety in recess 21 without a portion of ceramic element 30 being exposed through opening 21a of recess 21. Furthermore, such electronic component 10 allows the shape of case cover 60 to be simplified. Furthermore, when recess 21 is filled with molding resin, ceramic element 30 can be entirely covered with the molding resin.

[0030] 2 and 3, electronic component 10 has a pair of metal terminals 40, 50. First metal terminal 40 and second metal terminal 50 are spaced apart from each other and electrically insulated from each other in electronic component 10. First metal terminal 40 and second metal terminal 50 are formed, for example, by machining a conductive metal plate, but the method for forming metal terminals 40, 50 is not particularly limited.

[0031] 5, the first metal terminal 40 has a first mounting portion 42 disposed on the case bottom surface 22, a first electrode connecting portion 44 connected to the first electrode portion 33 of the ceramic element 30, and a first terminal arm portion 46 connecting the first mounting portion 42 and the first electrode connecting portion 44. The first electrode connecting portion 44 is housed in the recess 21 of the case 20, similar to the ceramic element 30.

[0032] 2, the first mounting portion 42 is disposed on one side of the case lower surface 22. As shown in FIG. 5, the first mounting portion 42 is substantially parallel to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0033] 3 and 5, a portion of the first terminal arm 46 of the first metal terminal 40 is disposed in the recess 21 of the case 20, and another portion is disposed outside the recess 21. That is, the first terminal arm 46 is inserted through a first gap 61 (see FIG. 5) formed between the case 20 and the case cover 60, and connects the first electrode connection portion 44 inside the recess 21 with the first mounting portion 42 outside the recess 21.

[0034] 5, the second metal terminal 50 has a second mounting portion 52 disposed on the case bottom surface 22, a second electrode connection portion 54 connected to the second electrode portion 34 of the ceramic element 30, and a second terminal arm portion 56 connecting the second mounting portion 52 and the second electrode connection portion 54. Similar to the first electrode connection portion 44, the second electrode connection portion 54 is housed in the recess 21 of the case 20. The second electrode connection portion 54 is disposed so as to be sandwiched from above and below between the bottom surface 21c of the recess 21 and the second main surface 31b of the ceramic element 30.

[0035] 2, the second mounting portion 52 is disposed on the other side of the case lower surface 22 at a distance from the first mounting portion 42. As shown in FIG. 5, the second mounting portion 52 is disposed on the same plane as the first mounting portion 42 and is substantially parallel to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0036] 4 and 5, a portion of the second terminal arm 56 of the second metal terminal 50 is disposed in the recess 21 of the case 20, and another portion is disposed outside the recess 21. That is, the second terminal arm 56 passes through a second gap 62 (see FIG. 5) formed between the case 20 and the case cover 60, and connects the second electrode connection portion 54 in the recess 21 with the second mounting portion 52 outside the recess 21.

[0037] The material of the first metal terminal 40 and the second metal terminal 50 is not particularly limited as long as it is a metallic material having electrical conductivity, and may be, for example, iron, nickel, copper, silver, or an alloy containing any of these. Furthermore, the surfaces of the first metal terminal 40 and the second metal terminal 50 may be coated with a metal coating of Ni, Sn, Cu, or the like.

[0038] 2, case cover 60 is disposed on the side of case 20 opposite case underside 22, and covers opening 21a of recess 21 shown in Figures 3 and 4. Case cover 60 has a rectangular, flat cover main body 63 that has substantially the same shape as case 20 when viewed from above, as shown in Figure 6, and a plurality of (four in this embodiment) protrusions 64 (see Figure 5) that protrude downward from the corners of cover main body 63.

[0039] In electronic component 10, case cover 60 seals recess 21, thereby effectively protecting components disposed in recess 21, such as ceramic element 30. The frame-shaped upper end of case 20 shown in FIG. 3 is connected to the underside of cover main body 63, and case cover 60 closes opening 21a of recess 21. However, between case cover 60 and case 20, a first gap 61 through which first metal terminal 40 is inserted and a second gap 62 through which second metal terminal 50 is inserted are formed.

[0040] 5, protrusions 64 of case cover 60 are provided corresponding to corners 21b (see FIG. 4) of opening 21a in case 20, and are inserted into recess 21 when case cover 60 covers opening 21a. Case cover 60 with protrusions 64 can be easily and accurately aligned with case 20, and can be firmly fixed to case 20.

[0041] Recess 21 of case 20 shown in Fig. 3 may be filled with a molding resin that fills gaps between the inner wall (including bottom surface 21c) of recess 21 and ceramic element 30 and metal terminals 40, 50. This can improve the strength and insulating properties of electronic component 10. However, recess 21 does not have to be filled with resin, and as shown in Fig. 3, gaps may be formed between the inner wall of recess 21 and ceramic element 30 and metal terminals 40, 50.

[0042] The case 20 and the case cover 60 can be manufactured by, for example, injection molding using resin, etc. However, the material of the case 20 and the case cover 60 is not limited to resin.

[0043] 1 to 5 can be manufactured by, for example, the following process. First, the ceramic element 30, the first metal terminal 40, and the second metal terminal 50 are prepared, and the first metal terminal 40 and the second metal terminal 50 are connected to the ceramic element 30. The connection between the ceramic element 30 and the first metal terminal 40 and the second metal terminal 50 can be performed using solder, a conductive adhesive, or the like.

[0044] The step of connecting the first metal terminal 40 and the second metal terminal 50 to the ceramic element 30 is performed with the mounting portions 42, 52 of the first metal terminal 40 and the second metal terminal 50 not bent. If the first metal terminal 40 and the second metal terminal 50 and the ceramic element 30 are integrated with each other with the mounting portions 42, 52 bent, it would be difficult to place the ceramic element 30 integrated with the metal terminals 40, 50 in the recess 21 of the case 20.

[0045] Next, the intermediate product in which the first metal terminal 40, the second metal terminal 50, and the ceramic element 30 are integrated is placed in the recess 21 of the case 20, and then the opening 21a is closed with the case cover 60. At this time, a molding resin is injected into the recess 21 before the opening 21a is closed with the case cover 60, and the molding resin is hardened after the case cover 60 is attached, thereby firmly fixing the case cover 60 and the case 20 together via the molding resin.

[0046] Finally, the tips of first metal terminal 40 and second metal terminal 50 exposed to the outside from recess 21 of case 20 are bent to form first mounting portion 42 and second mounting portion 52, thereby obtaining electronic component 10 shown in Fig. 1. In this way, electronic component 10 shown in Figs. 1 to 5 accommodates ceramic element 30 in recess 21 inside case 20, eliminating the need for a process of placing ceramic element 30, etc., in a cavity for resin molding and molding with an exterior material, and thus improving productivity.

[0047] Because electronic component 10 can accommodate ceramic element 30 and the like within case 20, it can flexibly accommodate changes in the size of ceramic element 30 as long as it fits within case 20. Furthermore, because first mounting portion 42 and second mounting portion 52 are parallel to first main surface 31a and second main surface 31b of ceramic element 30, electronic component 10 is advantageous in terms of reducing its height and is suitable for surface mounting.

[0048] The electronic component 10 according to the first embodiment described above is merely one embodiment of the present invention, and it goes without saying that the technical scope of the present invention includes many other embodiments and modifications. For example, Fig. 6 is a partial perspective view of a case 120 according to a modification, and the case 120 can be used in place of the case 20 of the electronic component according to the first embodiment.

[0049] As shown in Fig. 6, a second groove 122b is formed in the case lower surface 122 of the case 120 as a groove portion 122c that faces the second mounting portion 52 and has a varying depth. Fig. 7(a) is a partial cross-sectional view showing the periphery of the second mounting portion 52 in an electronic component that employs the case 120. As shown in Fig. 7(a), the second groove 122b formed in the case lower surface 122 is inclined with respect to the second mounting portion 52 so that a gap D3 formed between the second groove 122b and the tip end 152a of the second mounting portion 52 is wider than a gap D4 formed between the second groove 122b and the base end 152b of the second mounting portion 52.

[0050] 7(b), which shows the periphery of the first mounting portion 42, in addition to the second groove 122b, a first groove 122a is formed on the case underside 122 of the case 120 as a groove portion 122c whose groove depth varies and faces the first mounting portion 42. The first groove 122a is inclined with respect to the first mounting portion 42 so that a gap D1 formed between the first groove 122a and the tip end 142a of the first mounting portion 42 is wider than a gap D2 formed between the first groove 122a and the base end 142b of the first mounting portion 42.

[0051] The first groove 122a and the second groove 122b formed in the case bottom surface 122 make it easy to impart an appropriate bending angle to the base ends 142b, 152b of the first and second mounting portions 42, 52, taking into account springback during bending during the manufacturing process described above. Therefore, in electronic components using such a case 120, the first mounting portion 42 and the second mounting portion 52 can be formed accurately and easily. Note that the groove 122c need only face at least one of the first mounting portion 42 and the second mounting portion 52, and is not limited to being separated into the first groove 122a and the second groove 122b. For example, the groove 122c may be a single continuous groove.

[0052] Second embodiment Fig. 8 is a schematic perspective view of electronic component 210 according to the second embodiment of the present invention. Fig. 8 shows a see-through view of the inside of case 220 of electronic component 210, with case 220 and case cover 260 shown in phantom lines.

[0053] As shown in FIG. 8, electronic component 210 differs from electronic component 10 shown in FIGS. 1 to 5 in that ceramic element 230 is configured by combining two single-plate dielectric elements, first portion 230a and second portion 230b. However, electronic component 210 is similar to electronic component 10 of the first embodiment in terms of case 220, case cover 260, first metal terminal 240, and second metal terminal 250 other than ceramic element 230, except that the dimensions in the depth direction, which is the direction from the opening of case 220 toward the bottom surface of recess 221, are different. In the description of electronic component 210, only the differences from electronic component 10 will be described, and the commonalities with electronic component 10 will be omitted.

[0054] 8, the ceramic element 230 of the electronic component 210 has a first portion 230a and a second portion 230b. The first portion 230a is disposed near the opening of the recess 221, and the second portion 230b is disposed near the bottom of the recess 221.

[0055] The first portion 230a has a first main surface 231a, a first electrode portion 233, and a first dielectric portion 235a. The first dielectric portion 235a constitutes a part of the dielectric portion 235 of the ceramic element 230. A first electrode connecting portion 244 of a first metal terminal 240 is connected to the first electrode portion 233, similar to the first electrode portion 33 shown in FIG.

[0056] The second portion 230b has a second main surface 231b, a second electrode portion 234, and a second dielectric portion 235b. The second dielectric portion 235b constitutes another part of the dielectric portion 235 of the ceramic element 230. The second electrode portion 234 is connected to a second electrode connecting portion 254 of a second metal terminal 250, similar to the second electrode portion 34 shown in FIG.

[0057] 8, the first portion 230a and the second portion 230b are in contact with each other via intermediate electrode portions 236 formed on the opposing surfaces thereof, and are electrically connected in series. As with the first electrode portion 233 and the second electrode portion 234, the intermediate electrode portion 236 may be made of copper, a copper alloy, nickel, a nickel alloy, silver, or an alloy of silver and palladium.

[0058] 8, the ceramic element 230 placed in the recess 221 is not a single plate like the electronic component 10, but is composed of a combination of multiple plate-shaped dielectrics 230a, 230b. Such electronic component 210 functions as a capacitor or the like in which a first dielectric portion 235a and a second dielectric portion 235b are connected in series. In addition, the electronic component 210 has similarities with the electronic component 10 and exhibits the same effects as the electronic component 10.

[0059] Third embodiment Fig. 9 is a schematic perspective view of an electronic component 310 according to a third embodiment of the present invention. Similar to electronic component 210 shown in Fig. 8, Fig. 9 shows the inside of case 320 of electronic component 310 in a see-through manner, with case 320 and case cover 360 indicated by virtual lines.

[0060] As shown in FIG. 9, electronic component 310 differs from electronic component 10 shown in FIGS. 1 to 5 in that ceramic element 330 is configured by combining two short-plate dielectric elements, first element portion 330a and second element portion 370a, and in that first metal terminal 340 and second metal terminal 350 have different shapes. However, electronic component 310 has case 320 and case cover 360 that are similar to case 20 and case cover 60 of electronic component 10 of the first embodiment, except that the dimensions in the depth direction, which is the direction from the opening of case 320 toward the bottom of recess 321, are different. In describing electronic component 310, only the differences from electronic component 10 will be described, and a description of the commonalities with electronic component 10 will be omitted.

[0061] 9, first element portion 330a of electronic component 310 is disposed near the opening of recess 321. First element portion 330a has first and second main surfaces 331a and 331b facing each other, and a dielectric portion 335, similar to ceramic element 30 of electronic component 10 shown in FIG. 3. Similarly to ceramic element 30, first element portion 330a of electronic component 310 has a first electrode portion formed on first main surface 331a and a second electrode portion formed on second main surface 331b.

[0062] Second element portion 370a of electronic component 310 is disposed near the bottom surface of recess 321. Similar to first element portion 330a, second element portion 370a has first main surface 371a, second main surface 371b, and dielectric portion 375, but is disposed in an orientation in which second main surface 371b faces upward (toward the opening side of the recess), opposite to first element portion 330a.

[0063] Therefore, the first element portion 330a and the second element portion 370a are arranged so that their second main surfaces 331b, 371b face each other. Similar to the ceramic element 30, the second element portion 370a of the electronic component 310 also has a first electrode portion formed on the first main surface 371a and a second electrode portion formed on the second main surface 371b.

[0064] The second metal terminal 350 of the electronic component 310 has a second electrode connection portion 354 sandwiched between the second main surfaces 331b, 371b of the first element portion 330a and the second element portion 370a so as to contact the second electrode portions of both the first element portion 330a and the second element portion 370a. In other words, the second electrode connection portion 354 is inserted between the first element portion 330a and the second element portion 370a. Other parts of the second metal terminal 350 are similar to those of the second metal terminal 50 (see FIG. 5) or the second metal terminal 250 (see FIG. 8).

[0065] The first metal terminal 340 of the electronic component 310 has a first electrode connection portion 344 having a first element connection portion 344a and a second element connection portion 344b branching from a first terminal arm portion 346 of the first metal terminal 340. The first element connection portion 344a connects to a first electrode portion formed on a first main surface 331a of the first element portion 330a. The second element connection portion 344b connects to a first electrode portion formed on a first main surface 371a of the second element portion 370a. Therefore, as shown in FIG. 9 , in the electronic component 310, the entire ceramic element 330 is sandwiched between the first element connection portion 344a and the second element connection portion 344b of the first metal terminal 340.

[0066] 9, the ceramic element 330 placed in the recess 321 is not a single plate like the electronic component 10, but is composed of a combination of multiple plate-like element portions 330a, 370a. Such an electronic component 310 functions as a capacitor or the like in which the dielectric portion 335 of the first element portion 330a and the dielectric portion 375 of the second element portion 370a are connected in parallel. In addition, the electronic component 310 has commonalities with the electronic component 10 and exhibits the same effects as the electronic component 10.

[0067] Furthermore, the first portion 230a, the second portion 230b, the first element portion 330a, and the second element portion 370a of the second and third embodiments can be made of a single-plate dielectric element similar to the ceramic element 30 of the first embodiment. Therefore, by preparing cases 20, 220, and 320 and metal terminals 30, 40, 230, 240, 330, and 340 of different shapes, electronic components 10, 210, and 310 with different characteristics can be manufactured using the same single-plate ceramic element 30.

[0068] Fourth embodiment FIG. 10 is a schematic perspective view of an electronic component 410 according to the fourth embodiment. As shown in FIG. 10, electronic component 410 differs from electronic component 10 shown in FIG. 1 in that an engagement protrusion 426 is formed on a first case side surface 424a of case 420, and an engagement groove 428 is formed on a second case side surface 424b of case 420. However, electronic component 410 is similar to electronic component 10 shown in FIG. 1, except that engagement protrusion 426 and engagement groove 428 are formed on case 420. In describing electronic component 410, only the differences from electronic component 10 will be described, and a description of the commonalities with electronic component 10 will be omitted.

[0069] 10, the first case side surface 424a on which the engagement protrusions 426 are formed is a surface perpendicular to the side surface on which the first metal terminals 40 are arranged. The engagement protrusions 426 are formed so as to protrude diagonally outward from the surface perpendicular to the mounting surface, etc. The engagement protrusions 426 are formed in two places on the first case side surface 424, spaced apart from each other.

[0070] Fig. 11 shows electronic component 410 shown in Fig. 10 with case cover 60 not shown. As shown in Fig. 11, case 420 has recess 421 formed therein, similar to case 20 shown in Fig. 3, and ceramic element 30, a portion of first metal terminal 40, and a portion of second metal terminal 50 are disposed in recess 421.

[0071] 11, case second side surface 424b on which engagement groove 428 is formed faces in the opposite direction from case first side surface 424a on which engagement protrusion 426 is formed. As shown in Fig. 13, engagement groove 428 can be engaged with engagement protrusion 426 of another electronic component 410. In other words, engagement protrusion 426 and engagement groove 428 have a mutually engaging concave-convex relationship.

[0072] 12, which is a plan view of electronic component 410 viewed from above, terminal arm portions of first metal terminal 40 and second metal terminal 50 are arranged on a pair of opposing side surfaces among the four side surfaces of case 420 of electronic component 410, which is substantially rectangular. In addition, engagement protrusion 426 and engagement groove portion 428 are formed on case first side surface 424a and case second side surface 424b, which are a pair of opposing side surfaces perpendicular to the side surfaces on which the terminal arm portions of these metal terminals 40, 50 are arranged.

[0073] As shown in Fig. 13, electronic component 410 allows a plurality of electronic components 410 to be integrally connected by engaging each other's engagement protrusions 426 with their respective engagement grooves 428. By connecting such electronic components 410 as shown in Fig. 13, when transporting the connected plurality of electronic components 410 to a mounting board or the like using a mounting machine, the plurality of connected electronic components 410 can be transported at once, thereby improving mounting efficiency. In addition, electronic component 410 has similarities with electronic component 10 and provides the same effects as electronic component 10.

[0074] Although the present invention has been described above using a number of embodiments, the technical scope of the present invention is not limited to the above-described embodiments and examples, and the present invention naturally includes many other embodiments and modifications. The shapes of the components shown in the embodiments are merely examples, and can be changed to other shapes that have similar functions.

[0075] Fig. 14 is a diagram showing the shape of a first metal terminal 540 according to a second modified example, and is a perspective view showing a state in which a case cover of an electronic component having the first metal terminal 540 has been removed. As shown in Fig. 14, the first metal terminal 540 branches from one first electrode connection portion 544 into two first terminal arms 546a, 546b and two first mounting portions 542a, 542b. Therefore, a total of three terminals appear on the case bottom surface 22 of the electronic component shown in Fig. 14: two first mounting portions 542a, 542b and one second mounting portion 52 (see Fig. 2).

[0076] As such, the mounting portions arranged on the case underside 22 are not limited to the combination of the first mounting portion 42 and the second mounting portion 52 as shown in Fig. 2. For example, by employing a first metal terminal 540 as shown in Fig. 14 instead of the first metal terminal 40 shown in Fig. 2, the electronic component may have three mounting portions 542a, 542b, 52 arranged on the case underside 22. An electronic component having three mounting portions 542a, 542b, 52 has good installation stability when placed in the mounting position and during reflow.

[0077] Fifth embodiment 15 and 17 are schematic perspective views of an electronic component 610 according to a fifth embodiment of the present invention. FIG. 15 is a perspective view of the electronic component 610 as viewed from the case cover 60 side, and FIG. 17 is a perspective view of the electronic component 610 as viewed from the case bottom surface 22 side. The electronic component 610 is similar to the electronic component 10 shown in FIG. 1 and other figures, except that the shapes of the first metal terminals 640 and the second metal terminals 650 are different from those of the electronic component 10 according to the first embodiment. The following description of the electronic component 610 will focus on the differences from the electronic component 10, and will omit a description of the commonalities with the electronic component 10.

[0078] Fig. 16 is a perspective view showing the electronic component 610 shown in Fig. 15 except for the case cover 60. As shown in Fig. 16, the ceramic element 30 is housed in the recess 21 of the case 20, similar to the electronic component 10 shown in Fig. 3.

[0079] As shown in FIGS. 16 and 17 , an electronic component 610 has a pair of metal terminals 640, 650. The first metal terminal 640 has a first mounting portion 642 disposed adjacent to the case bottom surface 22, a first electrode connecting portion 44 connected to the first electrode portion of the ceramic element 30, and a first terminal arm 46 connecting the first mounting portion 642 and the first electrode connecting portion 44. The first electrode connecting portion 44 is joined to the first electrode portion of the ceramic element 30 via a joining material 677 such as solder or a conductive adhesive. The first electrode connecting portion 44 and the first terminal arm 46 of the first metal terminal 640 shown in FIG. 17 are similar to the first electrode connecting portion 44 and the first terminal arm 46 of the first metal terminal 40 shown in FIG. 3 .

[0080] 2 and 17, the first mounting portion 642 of the first metal terminal 640 is different from the first mounting portion 42 of the first metal terminal 40 shown in Fig. 2 in that it is not disposed on the case lower surface 22 but is disposed adjacent to the case lower surface 22. That is, the tip 642a of the first mounting portion 642 extends in a direction away from the case lower surface 22 with respect to the base end 642b of the first mounting portion 642.

[0081] The first mounting portion 642 is disposed on approximately the same plane as the case lower surface 22, or is disposed below the case lower surface 22. Similar to the mounting portion 42 shown in FIG. 2, the first mounting portion 642 is approximately parallel to the first main surface 31 a and the second main surface 31 b (see FIG. 5) of the ceramic element 30.

[0082] 16 has a second mounting portion 652 disposed adjacent to the case lower surface 22, a second electrode connecting portion 54 connected to the second electrode portion of the ceramic element 30, and a second terminal arm 56 connecting the second mounting portion 652 and the second electrode connecting portion 54. The second electrode connecting portion 54 and the second terminal arm 56 of the second metal terminal 650 shown in FIG. 17 are similar to the second electrode connecting portion 54 and the second terminal arm 56 of the second metal terminal 50 shown in FIG. 3.

[0083] 17 , the second mounting portion 652 of the second metal terminal 650 is disposed adjacent to the case lower surface 22, similar to the first mounting portion 642. That is, the second mounting portion 652 is disposed adjacent to the case lower surface 22 on the side opposite to the side adjacent to the first mounting portion 642. A tip end 652a of the second mounting portion 652 extends in a direction away from the case lower surface 22 relative to a base end 652b of the second mounting portion 652.

[0084] The second mounting portion 652 is disposed on approximately the same plane as the first mounting portion 642. Similar to the second mounting portion 52 shown in FIG. 2, the second mounting portion 652 is approximately parallel to the first main surface 31a and the second main surface 31b (see FIG. 5) of the ceramic element 30.

[0085] As shown in FIGS. 15 to 17 , mounting portions 642, 652 of first metal terminals 640 and second metal terminals 650 of electronic component 610 may be disposed adjacent to case underside 22 so as not to overlap case underside 22 when viewed from above. Such electronic component 652 is advantageous in terms of stability during mounting and ease of processing of first metal terminals 640 and second metal terminals 650. On the other hand, an arrangement in which mounting portions 42, 52 of first metal terminals 40 and second metal terminals 50 of electronic component 10 according to the first embodiment overlap case underside 22 when viewed from above has the advantage of reducing the mounting area of electronic component 10. Furthermore, electronic component 610 has similarities with electronic component 10, providing similar effects to electronic component 10. [Explanation of symbols]

[0086] 10, 210, 310, 410, 610...Electronic components 20, 220, 320, 420…case 21, 221, 321, 421...recesses 21a...Aperture 21b...Corner 21c…Bottom surface 22, 122...Bottom of the case 122a...first groove 122b…Second groove 424a…First side of case 424b…Second side of the case 426…Engagement protrusion 428...Engagement groove portion 30, 230, 330...ceramic elements 230a…first part 230b…Second part 330a...first element portion 370a...second element section 31a, 231a, 331a, 371a...first main surface 33, 233...first electrode part 31b, 231b, 331b, 371b...2nd principal surface 34, 234...Second electrode part 35, 235, 335, 375...Dielectric part 235a...first dielectric portion 235b...second dielectric section 236…Intermediate electrode section W1: Element thickness W2: Recess depth 40, 240, 340, 540...1st metal terminal 42, 542a, 542b...First mounting section 142a, 152a...tip 142b, 152b...Proximal end 44, 244, 344, 544...First electrode connection part 344a...first element connection part 344b...Second element connection part 46, 546a, 546b...1st terminal arm 50, 250, 350…Second metal terminal 52...Second mounting section 54, 254, 354...Second electrode connection part 56…Second terminal arm 60, 260, 360...Case cover 61...First gap 62...Second gap 63...Cover body 64...Protrusion

Claims

1. a case having a recess and a case bottom surface facing away from the opening of the recess; a ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion disposed on the bottom surface of the case or adjacent to the bottom surface of the case and substantially parallel to the first main surface and the second main surface, and a first electrode connecting portion connected to the first electrode portion; a second metal terminal including a second mounting portion disposed on the lower surface of the case or adjacent to the lower surface of the case and substantially parallel to the first main surface and the second main surface, and a second electrode connecting portion connected to the second electrode portion; the first metal terminal has a first terminal arm portion connecting the first mounting portion and the first electrode connection portion, the second metal terminal has a second terminal arm portion connecting the second mounting portion and the second electrode connecting portion, the first metal terminal extends from the first terminal arm along the first main surface to a side surface of the case on the same plane; the second metal terminal extends from the second terminal arm along the inner side surface of the case and the bottom surface of the recess, The electronic component has a portion of the second metal terminal extending to the bottom surface of the recess sandwiched between the bottom surface and the second main surface.

2. a case cover that closes the opening, the first metal terminal is inserted through a first gap formed between the case and the case cover; The electronic component according to claim 1 , wherein the second metal terminal is inserted through a second gap formed between the case and the case cover, the second gap being spaced apart from the first gap.

3. The electronic component according to claim 2 , wherein the case cover has a plurality of protrusions provided at corners of the opening and inserted into the recesses.

4. 4. The electronic component according to claim 1, wherein the depth of the recess, which is the distance from the opening of the case to the bottom surface of the recess, is greater than the thickness of the element, which is the distance between the first main surface and the second main surface.

5. The ceramic element is a first portion having the first main surface, the first electrode portion, and a first dielectric portion; and a second portion having the second main surface, the second electrode portion, and a second dielectric portion, 5. The electronic component according to claim 1, wherein the first portion and the second portion are connected via an intermediate electrode portion.

6. the first mounting portion of the first metal terminal and the second mounting portion of the second metal terminal are disposed on a lower surface of the case, 6. The electronic component according to claim 1, wherein a recessed groove portion, the recessed groove portion having a varying depth, is formed on the lower surface of the case and faces at least one of the first mounting portion and the second mounting portion.

7. 7. The electronic component according to claim 6, wherein the groove portion has a first groove in which a gap formed between the tip of the first mounting portion and the first groove is wider than a gap formed between the base end of the first mounting portion, and a second groove in which a gap formed between the tip of the second mounting portion and the second groove is wider than a gap formed between the base end of the second mounting portion.

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