Sensor Module

The sensor module addresses indirect mechanical measurement issues by employing capacitance-based electrodes to directly measure drug volume, enhancing accuracy and reliability in automated drug delivery systems.

JP7725581B2Active Publication Date: 2025-08-19ANALOG DEVICES INC
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Patent Information

Application Number
JP2023524769
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-10-30
Filing Date
2021-10-27
Publication Date
2025-08-19
Estimated Expiration
2041-10-27

AI Technical Summary

Technical Problem

Current methods for monitoring drug delivery in automated systems rely on indirect mechanical measurements, which are prone to manufacturing issues and mechanical failures due to variations in tolerances and wear, leading to inaccurate drug volume measurements.

Method used

A sensor module utilizing a capacitance-based system with electrodes positioned around the container to directly measure the drug volume by correlating capacitance changes with the amount of substance present, using a housing body and substrate with embedded conductive layers and a spring latch mechanism for secure contact.

Benefits of technology

Provides accurate and reliable direct measurement of drug volume by minimizing mechanical interference, ensuring precise monitoring of drug delivery and remaining amounts.

✦ Generated by Eureka AI based on patent content.

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Abstract

A sensor module is disclosed. The sensor module may include a housing body disposed around a cavity sized and shaped to receive a container in which a substance is disposed when the sensor module is in its operational configuration. The sensor module may include a first electrode coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position of the housing body. The sensor module may include a second electrode coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position of the housing body opposite the first peripheral position. The cavity is disposed between the first and second electrodes when the housing body is in its operational configuration.
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Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 63 / 108127, filed October 30, 2020, which is related to U.S. Provisional Patent Application No. 62 / 988014, filed March 11, 2020, the entire contents of which are incorporated herein by reference in their entirety for all purposes.

[0002] The field relates to sensor modules, and in particular to sensor modules for measuring the volume of a drug in a drug delivery device. [Background technology]

[0003] In some automated drug delivery systems, a drive system automatically pushes the plunger of a drug-containing syringe to expel the drug from the syringe. Current methods for monitoring the amount of drug delivered and / or the amount of drug remaining in the syringe involve using an electromechanical transmission system to monitor the rotation of a drive shaft that pushes the plunger. This is an indirect measurement of the drug being delivered and is subject to manufacturing issues and mechanical failure. For example, failure or wear of the mechanical link between the motor, plunger rod, and stopper, which can result from variations in tolerances of the motor's rotation and transmission during manufacturing of the delivery system or after repeated use, can affect the measurement. Summary of the Invention [Means for solving the problem]

[0004] In one aspect, a sensor module is disclosed. The sensor module can include a housing body disposed around a cavity sized and shaped to receive a container in which a substance is disposed when the sensor module is in its operating configuration. The sensor module can include a first electrode coupled to or formed with the housing body. The first electrode is disposed at a first peripheral location of the housing body. The sensor module can include a second electrode coupled to or formed with the housing body. The second electrode is disposed at a second peripheral location of the housing body opposite the first peripheral location. The cavity is disposed between the first and second electrodes when the housing body is in its operating configuration.

[0005] In one embodiment, the first and second electrodes and the container form a capacitor. The sensor module can further include circuitry configured to measure a capacitance between the first and second electrodes. The measured capacitance can be correlated to an amount of substance in the container.

[0006] In one embodiment, the sensor module further includes at least one substrate coupled to the housing body, the at least one substrate including first and second electrodes, the first and second electrodes being at least partially embedded in an insulating material of the substrate.

[0007] The at least one substrate may include a single substrate.

[0008] The at least one substrate may be insert molded into the inner surface of the housing body such that the at least one substrate contacts and is mechanically attached to the inner surface.

[0009] The at least one substrate may include a first segment having a first electrode. The first segment may be bent or curved to be disposed around the exterior surface of the container. The at least one substrate may include a second segment having a second electrode. The second segment may be bent or curved to be disposed around the exterior surface of the container at a location opposite the first segment in the operational configuration of the sensor module.

[0010] The at least one substrate can include a plurality of patterned conductive layers at least partially embedded in an insulating material. The plurality of patterned conductive layers can include a first layer at a radially inner portion of the at least one substrate. The first layer can include first and second electrodes.

[0011] The first layer may be exposed on a radially inner surface of at least one of the substrates.

[0012] The plurality of patterned conductive layers can include a second layer disposed radially outward from the first layer, and the second layer can include first and second driven shields disposed radially opposite one another.

[0013] The plurality of patterned conductive layers can include a third layer disposed radially outward from the second layer, and the third layer can include first and second outer shields disposed radially opposite one another.

[0014] At least one substrate can include a hinge segment extending between the first and second segments, the hinge segment rotatable between an operating configuration and a sensor module loading configuration that allows containers to be loaded into or unloaded from the sensor module.

[0015] The housing body can include a first angled or curved section coupled to or formed with the first segment, a second angled or curved section coupled to or formed with the second segment, and a spring latch mechanism connecting the first and second sections, which can bias the first and second electrodes into contact with the container in the operating configuration.

[0016] The insulating material may include multiple insulating layers.

[0017] In one embodiment, the sensor module further includes a transparent window in the housing body.

[0018] In one embodiment, at least one of the first and second electrodes extends in an arc around the cavity having an angle of less than 90°.

[0019] The arc around the cavity can have an angle in the range of 45° to 75°.

[0020] In one embodiment, the sensor module further comprises a container, the container comprising a vial or a syringe.

[0021] In one aspect, a sensor module is disclosed. The sensor module can include at least one substrate having one or more conductive layers including first and second electrodes at least partially embedded in an insulating material. The at least one substrate includes a first segment including the first electrode. The first segment is bent or curved to be disposed around an outer surface of a container in which a substance is disposed. The at least one substrate includes a second segment including the second electrode. The second segment is bent or curved to be disposed around the outer surface of the container at a location opposite the first segment in an operational configuration of the sensor module. The at least one substrate includes a hinge segment extending between the first and second segments. The hinge segment is rotatable between an operational configuration and a loaded configuration of the sensor module, which allows a container to be loaded into or unloaded from the sensor module.

[0022] In one embodiment, the sensor module further includes a housing body disposed around a cavity sized and shaped to receive the container, and the at least one substrate can be coupled to the housing body.

[0023] The housing body can include a first angled or curved section coupled to or formed with the first segment, a second angled or curved section coupled to or formed with the second segment, and a spring latch mechanism connecting the first and second sections, which can bias the first and second electrodes into contact with the container.

[0024] The at least one substrate may be insert molded into the inner surface of the housing body such that the at least one substrate contacts and is mechanically attached to the inner surface.

[0025] Embodiments of the present disclosure will now be described, by way of non-limiting example, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0026] [Figure 1] 1 illustrates a simplified schematic diagram showing a capacitive sensor. [Figure 2A] FIG. 1 is a schematic perspective view of an exemplary capacitive sensor. [Figure 2B] 2B is a schematic perspective view of the capacitance sensor as viewed from the opposite side to the side shown in FIG. 2A. FIG. [Figure 2C] FIG. 2C is a side view of a portion of the capacitive sensor of FIGS. 2A and 2B. [Figure 2D] FIG. 3 is a cross-sectional side view of a portion of the capacitance sensor of FIGS. 2A and 2B with a plunger rod. [Figure 2E] FIG. 2D is a cross-sectional side view of a portion of the capacitance sensor shown in FIG. 2C. [Figure 2F] FIG. 2E is a side cross-sectional view of a portion of the capacitance sensor shown in FIG. 2D. [Figure 3] FIG. 1 is a schematic perspective view of a sensor module according to an embodiment. [Figure 4A] FIG. 4 is a schematic top view of the sensor module of FIG. 3. [Figure 4B] FIG. 4 is a schematic cross-sectional side view of the sensor module of FIG. 3. [Figure 5] Fig. 5A is a schematic side view of the sensor module of Fig. 3. Fig. 5B is an enlarged view of a portion of the sensor module shown in Fig. 5A. Fig. 5C is a plan view of the sensor module 3 as viewed from one end of the sensor module of Fig. 3. Fig. 5D is a schematic side cross-sectional view of the sensor module of Fig. 3. [Figure 6] Figure 6A illustrates a step in a manufacturing process for manufacturing the sensor module of Figure 3. Figure 6B illustrates another step in the manufacturing process. Figure 6C illustrates another step in the manufacturing process. Figure 6D illustrates another step in the manufacturing process. DETAILED DESCRIPTION OF THE INVENTION

[0027] Various embodiments disclosed herein relate to a sensor module that utilizes a capacitance sensor to measure the amount of a substance (e.g., a liquid such as a drug) in a container (e.g., a drug delivery device such as a vial or syringe). As described in U.S. Provisional Patent Application No. 62 / 988,014, filed March 11, 2020, the capacitance sensor can directly measure the amount of a substance (e.g., a drug) in a drug delivery system.

[0028] 1 illustrates a simplified schematic diagram showing a capacitance sensor 1. The capacitance sensor 1 may include a dielectric material 10 disposed between a first conductive plate 12 and a second conductive plate 14 that are spaced apart by a distance d. The capacitance (C) varies linearly with the plate geometry of the first conductive plate 12 and the second conductive plate 14, and the capacitance (C) of a capacitance sensor having the structure shown in FIG. 1 is calculated according to Equation 1: C=ε0×ε r ×A / d (formula 1)

[0029] In Equation 1, ε0 is the permittivity of free space (8.854 × 10 -12 Fm -1 ), ε is the relative static permittivity, A is the area of overlap between the first plate 12 and the second plate 14, and d is the distance between the first plate 12 and the second plate 14. In a multi-layer dielectric material containing three or more plates with two or more dielectric layers, a series capacitor can be formed. The capacitance (C) of such a series capacitor can be calculated by Equation 2: 1 / C 直列 =(1 / C1)+(1 / C2)…(1 / C n )(Formula 2)

[0030] FIG. 2A is a schematic perspective view of an exemplary capacitance sensor 2. FIG. 2B is a schematic perspective view of the capacitance sensor 2 as viewed from the opposite side to the side shown in FIG. 2A. FIG. 2C is a side view of a portion of the capacitance sensor 2 of FIGS. 2A and 2B. FIG. 2D is a cross-sectional side view of a portion of the capacitance sensor 2 of FIGS. 2A and 2B with a plunger rod. FIG. 2E is a cross-sectional side view of a portion of the capacitance sensor 2 shown in FIG. 2C. FIG. 2F is a cross-sectional side view of a portion of the capacitance sensor 2 shown in FIG. 2D.

[0031] The capacitance sensor 2 may include two electrodes (a first electrode 12 and a second electrode 14) positioned along a container 16 (e.g., a vial or syringe) used to deliver a substance 18, such as a drug. A portion 16 of the container is transparent to show the internal components of the capacitance sensor 2 in FIGS. 2C and 2D . For example, the electrodes 12, 14 may extend longitudinally along an outer surface 16a (e.g., an outer wall) of the container 16 and may be positioned along opposite sides of the container 16, forming a capacitor around the container 16. Because the capacitance between the two electrodes 12, 14 varies based on the amount of substance 18 (drug) remaining in the container 16, the capacitance measurement directly correlates to the amount of drug remaining. A conforming electrode shield prevents or eliminates external interference from noise sources proximate to the capacitance sensor 2. The two electrodes 12, 14 may create an electric field within the container 16 (e.g., a vial or syringe). The syringe and contents of the container 16 can act as a dielectric between the electrodes 12, 14. For example, if the container 16 does not contain a substance 18, air can be present in the container 16. The substance 18 can be pushed out of the container 16 by a plunger rod 20. A circuit can be connected to the capacitance sensor 2 to measure the amount (e.g., volume or mass) of the substance 18 in the container 16.

[0032] 3-5C illustrate various views of a capacitive sensor module 3 according to one embodiment. FIG. 3 is a schematic perspective view of the sensor module 3. FIG. 4A is a schematic top view of the sensor module 3. FIG. 4B is a schematic cross-sectional side view of the sensor module 3. FIG. 5A is a schematic side view of the sensor module 3. FIG. 5B is an enlarged view of a portion of the sensor module shown in FIG. 5A. FIG. 5C is a plan view of the sensor module 3 as viewed from one end of the sensor module 3. FIG. 5D is a schematic cross-sectional side view of the sensor module 3 without the housing body 34. FIGS. 6A-6D illustrate various steps in a manufacturing process for producing the sensor module 3.

[0033] The capacitive sensor module 3 can be configured to measure the amount of a substance 18 (e.g., a liquid such as a medication) in a container 26 (e.g., a vial or syringe). As shown, the sensor module 3 can include a housing body 34 disposed around a cavity 30 sized and shaped to receive the container 26 in which the substance 18 is disposed when the sensor module 3 is in its operational configuration. When the sensor module 3 is not in its operational configuration, no substance 18 can be disposed in the container 26, and the container 26 can be empty (e.g., filled with air). The substance 18 can be pushed out of the container 16 by a plunger rod 20. A first electrode 32 can be coupled to or formed with the housing body 34. The first electrode 32 can be disposed at a first peripheral (e.g., circumferential) location 36 of the housing body 34. A second electrode 38 can be coupled to or formed with the housing body 34. The second electrode 38 can be disposed at a second peripheral (e.g., circumferential) location 40 of the housing body 34 opposite the first peripheral location 36. At least one of the first electrode 32 and the second electrode 38 can extend in an arc around the cavity 30 having an angle of less than 90°. The arc around the cavity 30 can have an angle in the range of 45° to 75°.

[0034] The cavity 30 (and container 26) can be disposed between the first electrode 32 and the second electrode 38 in the operating configuration of the housing body 34. In the operating configuration, the container 26 can be disposed and secured in the cavity 30, and the first electrode 32 and the second electrode 38 and the container 26 can form a capacitor. The sensor module 3 can further include circuitry (not shown) configured to measure the capacitance between the first and second electrodes. The measured capacitance can be correlated to the amount of substance 18 in the container 26.

[0035] The sensor module 3 may include at least one substrate 44 coupled to the housing body 34. The substrate 44 may comprise a package substrate having a conductive layer, such as a flexible package substrate, at least partially embedded in an insulating material (see FIG. 5D). In the illustrated embodiment, the at least one substrate comprises only a single substrate having a plurality of patterned segments. In other embodiments, the at least one substrate may comprise multiple substrates connected together. The at least one substrate 44 may include a first electrode 32 and a second electrode 38, which may be at least partially embedded in the insulating material of the substrate 44. In some embodiments, the at least one substrate 44 may comprise a connector portion 45. The connector portion 45 may include a plurality of contacts configured to provide electrical communication between the sensor module 3 and an external device or substrate. For example, the plurality of contacts may include input / output contacts.

[0036] The at least one substrate 44 can be insert molded into the inner surface 35 of the housing body 34, which can include a polymer or plastic such as acrylonitrile butadiene styrene (ABS). The resulting molded structure can be formed such that the at least one substrate 44 contacts and is mechanically attached to the inner surface 35 of the housing body 34. In the illustrated embodiment, the at least one substrate 44 can include a first segment 44a comprising the first electrode 32 and a second segment 44b comprising the second electrode 38. The first segment 44a can be bent or curved to be disposed around the outer surface 26a of the container 26 at a location opposite the first segment 44a in the operational configuration of the sensor module 3. In the illustrated embodiment, the first segment 44a and the second segment 44b of the substrate 44 can be deformed into a curved profile that is generally circular. In other embodiments, the curved profile can be elliptical or otherwise include curved sections. In still other embodiments, for example, in embodiments in which the container 26 has a polygonal (e.g., rectangular, etc.) cross section, the first segment 44a and the second segment 44b can be bent to conform to the angled outer surface 26a of the container 26. In the illustrated embodiment, the substrate 44 can comprise a flexible substrate including one or more conductors at least partially embedded in an insulating material.

[0037] Referring to FIG. 5D , at least one substrate 44 can include multiple patterned conductive layers at least partially embedded in an insulating material. The insulating material can comprise one insulating layer or multiple insulating layers. The multiple patterned conductive layers can include a first layer on a radially inner portion of the at least one substrate. The first layer can include a first electrode 32 and a second electrode 38. In some embodiments, the first layer can be exposed on a radially inner surface of the at least one substrate 44 and can be configured to directly contact the outer surface 26 a of the container 26. The multiple patterned conductive layers can further include a second layer disposed radially outward from the first layer. The second layer can include a first driven shield 46 and a second driven shield 48 disposed radially opposite each other. The multiple patterned conductive layers can include a third layer disposed radially outward from the second layer. The third layer may include a first outer shield 50 and a second outer shield 52 disposed radially opposite one another.

[0038] 6B, at least one substrate 44 can include a hinge segment 44c extending between a first segment 44a and a second segment 44b. The hinge segment 44c can be rotatable between an operating configuration and a loaded configuration of the sensor module 3, in which the container 26 can be loaded into or removed from the sensor module 3. The housing body 34 can include a first angled or curved section 34a coupled to or formed with the first segment 44a and a second angled or curved section 34b coupled to or formed with the second segment 44b.

[0039] The spring latch mechanism 54 can removably connect the first section 34a and the second section 34b of the housing body 34. As shown, for example, in FIG. 5B , the spring latch mechanism 54 can be peripherally (e.g., circumferentially) disposed opposite the hinge segment 44c. The spring latch mechanism 54 can serve as a latch to removably couple the first section 34a and the second section 34b of the housing body 34 and secure the container 26 within the cavity 30 in the operative configuration. The spring latch mechanism 54 can bias the first electrode 32 and the second electrode 38 into contact with the container 26 in the operative configuration. In some embodiments, the spring latch mechanism 54 can be radially biased. In some embodiments, the spring latch mechanism 54 can alternatively or additionally be circumferentially biased. Other types of spring mechanisms can be used to provide compliance for the housing body 34 and secure the electrodes 32, 38 to the container 26 in the operative configuration.

[0040] The spring latch mechanism 54 may include one or more latches 54a (e.g., two, three, or more latches) formed in or with the housing body 34. The latches 54a may include protrusions that extend from and may be formed with the housing body 34. The latches 54a may include a serpentine shape or other profile that provides a spring-like force to securely secure the housing body 34 to the container 26 in the operative configuration. The first and second sections 34a, 34b of the housing body 34 may each include a complementary shaped portion of the latch 54a that may cooperate to secure the first and second sections 34a, 34b together in the operative configuration. Beneficially, the latches 54a may be flexible to accommodate containers having various diameters, but may exert a resilient spring force to urge the first and second electrodes 32, 38 inward, thereby maintaining contact with the outer wall 26a of the container 26 in the operating configuration, which may improve the accuracy of the capacitance measurements. The latches 54a may be spaced along the length of the housing body 34 to define transparent windows 68 in the housing body 34. The transparent windows 68 may allow a user to view the substance 18 within the container 26. The latches 54a may be unlatched after use to place the sensor module 3 in the loaded configuration, and the container 26 may be removed from the sensor module 3. Another container may be loaded into the housing body 34, or the container 26 may be refilled with substance 18, and the latches 54a may be relatched for further measurements in the operating configuration.

[0041] In some embodiments, the manufacturing process for producing the sensor module 3 can begin with providing at least one substrate 44, as shown in Figure 6A. The at least one substrate 44 can include a first segment 44a, a second segment 44b, and a hinge segment 44c. The at least one substrate 44 can include a flexible packaging substrate having a conductive layer at least partially embedded in an insulating material.

[0042] 6B, at least one substrate 44 can be insert molded onto the inner surface 35 of the housing body 34. A first segment 44a and a second segment 44b of the at least one substrate 44 can be disposed in a first section 44a and a second section 34b of the housing body 34, respectively. The first section 44a and the second section 34b can be coupled via a hinge segment 44c. The at least one substrate 44 can at least partially conform to the shape of the housing body 34.

[0043] 6C, the hinge segment 44c of at least one substrate 44 can be bent to move the second section 34b over the first section 44a, thereby defining the cavity 30 between the first section 44a and the second section 44b. A spring latch mechanism 54 can connect the first section 34a and the second section 34b of the housing body 34. The spring latch mechanism 54 can serve as a latch to releasably couple the first section 34a and the second section 34b of the housing body 34.

[0044] 6D, a container 26 (such as a vial or syringe) can be provided containing a substance (e.g., a medication) therein. A cavity 30 defined at least in part by the housing body 34 can receive the container 26 in the operational configuration of the sensor module 3. In some embodiments, the substance in the container 26 can be viewed through a window provided between latches 54a of the spring latch mechanism 54.

[0045] While disclosed in the context of certain embodiments and examples, it will be understood by those skilled in the art that the invention extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses, as well as obvious modifications and equivalents thereof. In addition, while certain variations have been shown and described in detail, other modifications within the scope of the present disclosure will be readily apparent to those skilled in the art based on this disclosure. It is also contemplated that various combinations or subcombinations of specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another to form varying modes of the disclosed invention. Accordingly, it is intended that the scope of the invention disclosed herein should not be limited by the specific disclosed embodiments described above, but should be determined solely by a fair reading of the following aspects.

Claims

1. A sensor module, a housing body disposed about a cavity sized and shaped to receive a container in which a substance is disposed when the sensor module is in an operative configuration; at least one substrate coupled to the housing body, a plurality of patterned conductive layers at least partially embedded in an insulating material, the plurality of patterned conductive layers comprising: a first layer at a radially inner portion of the at least one substrate; a second layer disposed radially outward from the first layer; and a third layer disposed radially outward from the second layer; Including, The first layer comprises: a first electrode coupled to or formed with the housing body and disposed at a first peripheral location of the housing body; a second electrode coupled to or formed with the housing body and disposed at a second peripheral location of the housing body opposite the first peripheral location; the first electrode and the second electrode are at least partially embedded in an insulating material of the substrate; the second layer includes a first driven shield and a second driven shield disposed radially opposite each other; the third layer includes a first outer shield and a second outer shield disposed radially opposite each other; at least one substrate; the cavity is disposed between the first electrode and the second electrode in the operating configuration of the housing body; The first electrode, the second electrode, and the container form a capacitor, and the sensor module further comprises circuitry configured to measure a capacitance between the first electrode and the second electrode, the measured capacitance correlating with an amount of the substance in the container.

2. The sensor module of claim 1 , wherein the at least one substrate comprises a single substrate.

3. The sensor module of claim 1 , wherein the at least one substrate is insert molded into the inner surface of the housing body such that the at least one substrate contacts and is mechanically attached to the inner surface.

4. the at least one substrate is a first segment comprising the first electrode, the first segment being bent or curved to be disposed around an outer surface of the container; a second segment comprising the second electrode, the second segment being bent or curved so as to be disposed around the outer surface of the container at a location opposite the first segment in the operational configuration of the sensor module.

5. The sensor module of claim 4 , wherein the first layer is exposed on a radially inner surface of the at least one substrate.

6. 5. The sensor module of claim 4, wherein the at least one substrate comprises a hinge segment extending between the first segment and the second segment, the hinge segment being rotatable between an operating configuration of the sensor module and a loading configuration of the sensor module that loads or unloads the container into or from the sensor module.

7. 5. The sensor module of claim 4, wherein the housing body comprises an angled or curved first section coupled to or formed with the first segment, an angled or curved second section coupled to or formed with the second segment, and a spring latch mechanism for connecting the first and second sections, the spring latch mechanism being biased to bring the first and second electrodes into contact with the container in an operational configuration of the sensor module.

8. The sensor module of claim 1 , wherein the insulating material comprises multiple insulating layers.

9. The sensor module according to claim 1 , further comprising a transparent window in the housing body.

10. The sensor module of claim 1 , wherein at least one of the first electrode and the second electrode extends in an arc around the cavity having an angle of less than 90°.

11. The sensor module of claim 10, wherein the arc around the cavity has an angle in the range of 45° to 75°.

12. The sensor module of claim 1 , further comprising a container, the container comprising a vial or a syringe.

13. A sensor module, a housing body disposed about a cavity sized and shaped to receive a container in which a substance is to be disposed; at least one substrate; the at least one substrate is a first segment that is bent or curved to be disposed around an exterior surface of the container; a second segment that is bent or curved to be disposed around the exterior surface of the container at a location opposite the first segment in an operational configuration of the sensor module; and a hinge segment extending between the first segment and the second segment, the hinge segment being rotatable between an operating configuration of the sensor module and a loading configuration of the sensor module for loading or unloading the container into or from the sensor module; a plurality of patterned conductive layers at least partially embedded in an insulating material; the plurality of patterned conductive layers comprises a first layer on a radially inner portion of the at least one substrate, a second layer disposed radially outward from the first layer, and a third layer disposed radially outward from the second layer; Including, The first layer comprises: a first electrode coupled to or formed with the housing body and disposed at a first peripheral location of the housing body; a second electrode coupled to or formed with the housing body and disposed at a second peripheral location of the housing body opposite the first peripheral location; the first electrode and the second electrode are at least partially embedded in an insulating material of the substrate; the second layer includes a first driven shield and a second driven shield disposed radially opposite each other; the third layer includes a first outer shield and a second outer shield disposed radially opposite one another; The first electrode, the second electrode, and the container form a capacitor, and the sensor module further comprises circuitry configured to measure a capacitance between the first electrode and the second electrode, the measured capacitance correlating with an amount of the substance in the container.

14. A sensor module as described in claim 13, wherein the at least one substrate is bonded to the housing body.

15. 15. The sensor module of claim 14, wherein the housing body comprises: an angled or curved first section coupled to or formed with the first segment; an angled or curved second section coupled to or formed with the second segment; and a spring latch mechanism for connecting the first and second sections, the spring latch mechanism biased to bring the first and second electrodes into contact with the container.

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