Speaker device and electronic device

Abstract

A speaker device according to an embodiment of the present technology is provided with a speaker unit, a case part, and a heat-dissipating part. The speaker unit has a vibration plate. The case part forms a cavity on the opposite side of the speaker unit from the vibration plate, and houses the speaker unit such that the vibration plate is exposed. The heat-dissipating part is provided to the cavity and transfers heat from the speaker unit to the case part side.

Description

[Technical Field]

[0001] The present technology relates to a speaker device and an electronic device equipped with the speaker device. [Background technology]

[0002] Various electronic devices equipped with speakers have been developed in the past. For example, Patent Document 1 describes a foldable communication terminal equipped with a speaker. In this communication terminal, two terminal members are connected via a hinge. A speaker is provided in one of the terminal members. A cavity is formed inside the hinge. The speaker is positioned so as to be acoustically coupled with the cavity inside the hinge. This causes resonance between the speaker and the cavity, making it possible to improve the sound quality of the speaker (see, for example, paragraphs

[0031] ,

[0032] , and

[0034] , and Figure 1 of the specification of Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-527131 Summary of the Invention [Problem to be solved by the invention]

[0004] In this way, by providing a cavity to which the speaker is connected, it is possible to improve the sound quality of the speaker. However, it is also possible that the heat from the speaker will affect the sound quality. For example, in a configuration where the back surface of the speaker is exposed to dissipate heat, the cavity that resonates with the speaker is placed to the side of the speaker. In this case, the planar size of the entire speaker, including the cavity, increases, which may cause interference with other elements.

[0005] In view of the above circumstances, an object of the present technology is to provide a speaker device and an electronic device that can improve sound quality without increasing the planar size. [Means for solving the problem]

[0006] In order to achieve the above object, a speaker device according to an embodiment of the present technology includes a speaker unit, a case, and a heat dissipation unit. The speaker unit has a diaphragm. The case portion forms a cavity on the opposite side of the speaker unit from the diaphragm, and houses the speaker unit so that the diaphragm is exposed. The heat dissipation portion is provided in the cavity and transfers heat from the speaker unit to the case portion.

[0007] In this speaker device, the speaker unit is housed in a case with its diaphragm exposed. The case also has a cavity on the opposite side of the speaker unit's diaphragm. This cavity is provided with a heat dissipation section that transfers heat from the speaker unit to the case. This makes it possible to dissipate heat from the speaker unit using the cavity on the opposite side of the diaphragm, improving sound quality without increasing the flat surface size.

[0008] The speaker unit may include a voice coil that vibrates integrally with the diaphragm, a magnet that generates a magnetic field that acts on the voice coil, and a yoke that is provided on the opposite side of the diaphragm with the magnet interposed therebetween and to which the magnet is connected. In this case, the heat dissipation portion may thermally connect the yoke and the case portion.

[0009] The heat dissipation portion may have at least one spring made of a heat conductive material.

[0010] The at least one spring may be a leaf spring.

[0011] The at least one spring may include a plurality of springs arranged to press the speaker unit evenly against the case portion.

[0012] The case may further include a heat sink provided at a position facing the speaker unit across the cavity, and in this case, the heat sink may be connected to the heat sink.

[0013] The case may have a rear opening formed at a position facing the speaker unit across the cavity, and in this case, the heat sink may be disposed so as to cover the rear opening of the case.

[0014] The speaker device may be mounted on an electronic device, and in this case, the heat sink may have a connection portion that is connected to a main body of the electronic device.

[0015] The connection portion may be provided on the outside of the case portion.

[0016] The case portion may form another cavity that communicates with the cavity and extends to the side of the speaker unit.

[0017] The case portion may include a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity.

[0018] The front case may have a front opening that exposes the diaphragm, and a sealing member provided inside the front case to surround the front opening. In this case, the heat dissipation unit may be fixed to the rear case, and the speaker unit may be pressed against the sealing member.

[0019] The sealing member may be a waterproof seal.

[0020] An electronic device according to an embodiment of the present technology includes an output unit and a speaker device. The output unit outputs an audio signal. The speaker device includes a speaker unit having a diaphragm and vibrating the diaphragm in response to the audio signal, a case portion that forms a cavity on the opposite side of the speaker unit from the diaphragm and houses the speaker unit so that the diaphragm is exposed, and a heat dissipation portion that is provided in the cavity and conducts heat from the speaker unit to the case portion.

[0021] The electronic device may further include a display that displays an image. In this case, the speaker device may be disposed such that at least a portion of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a schematic diagram showing an external appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology; [Figure 2] FIG. 1 is a schematic diagram for explaining an overview of a speaker device. [Figure 3] FIG. 2 is a plan view showing a specific configuration example of the speaker device. [Figure 4] FIG. 4 is an exploded perspective view of the speaker device shown in FIG. [Figure 5] FIG. 4 is a cross-sectional view of the speaker device shown in FIG. [Figure 6] 1 is a schematic diagram illustrating an example of a cross-sectional configuration of a terminal device equipped with a speaker device. [Figure 7] FIG. 1 is a schematic diagram showing a speaker device as a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present technology will be described with reference to the drawings.

[0024] Fig. 1 is a schematic diagram showing the appearance of a terminal device equipped with a speaker device according to an embodiment of the present technology. The terminal device 100 shown in Fig. 1 is, for example, an electronic terminal that can be carried by a user. Examples of the terminal device 100 include mobile terminals such as smartphone terminals, tablet terminals, music playback devices, and electronic dictionaries. In addition, the terminal device 100 may be configured as a stationary device such as a PC (Personal Computer) or a smart speaker. In this embodiment, the terminal device 100 is an example of an electronic device.

[0025] The terminal device 100 includes a display 10 and a speaker device 30. The terminal device 100 also includes a communication device, a storage device, a controller, a battery, a camera sensor, and the like, all of which are not shown. The display 10 is a display device that displays images, and is provided on the front surface of the terminal device 100. The display 10 displays, for example, an image (such as an operation screen or video content) represented by an image signal output from the controller. The speaker device 30 is a device for reproducing audio, and is installed inside the main body of the terminal device 100. In Fig. 1, the speaker device 30 arranged inside the terminal device 100 is schematically illustrated using dotted lines. The speaker device 30 converts an audio signal output from, for example, a controller into audio and outputs the audio. This makes it possible to reproduce various audio contents. In this embodiment, the controller corresponds to an output unit that outputs an audio signal.

[0026] 2 is a schematic diagram for explaining an overview of the speaker device 30. The speaker device 30 has a speaker unit 31, a speaker case 32, and a heat dissipation section 33. The speaker device 30 is a box-shaped device in which the speaker unit 31 and the heat dissipation section 33 are housed inside the speaker case 32, forming a speaker box. In this embodiment, a description will be given of a sealed speaker configured mainly using a sealed speaker case 32. Note that the speaker device 30 may be configured as a speaker in which the speaker case 32 is provided with an opening.

[0027] The speaker device 30 is configured so that a diaphragm 34 provided on the speaker unit 31 is exposed from a speaker case 32. Hereinafter, the side of the speaker case 32 where the diaphragm 34 is exposed (the upper side in the drawing) will be referred to as the front side of the speaker device 30, and the side opposite to the side where the diaphragm 34 of the speaker case 32 is exposed (the lower side in the drawing) will be referred to as the rear side of the speaker device 30. Fig. 2 schematically shows a cross-sectional view of the speaker device 30 cut along the front-to-rear direction.

[0028] The speaker unit 31 is a unit that converts an electric signal (audio signal) into a sound wave (audio), and includes the above-mentioned diaphragm 34 and a unit body 35. The diaphragm 34 is a plate-like member that vibrates relative to the unit body 35. In the speaker unit 31, the vibration of the diaphragm 34 causes the air to vibrate and generates sound waves. In this embodiment, a flat plate-like member is used as the diaphragm 34. Unit body 35 is a structure configured as a drive mechanism that supports diaphragm 34 and vibrates diaphragm 34. Unit body 35 is provided with a voice coil connected to diaphragm 34, a magnetic circuit (magnet and yoke) that forms a magnetic field that acts on the voice coil, and the like (see FIG. 5). For example, a voice coil provided in the unit body 35 is driven in response to an audio signal, causing the diaphragm 34 to vibrate together with the voice coil. In this way, the speaker unit 31 vibrates the diaphragm 34 in response to the audio signal, thereby enabling the content of the audio signal to be output as sound.

[0029] 2, in this embodiment, the unit body 35 is configured to have a thin structure as a whole. The diaphragm 34 is arranged along one surface perpendicular to the thickness direction of the unit body 35. In the speaker unit 31, the side on which the diaphragm 34 is arranged is the front side, and the opposite side is the rear side. When viewed along the thickness direction of unit body 35, the planar shape of diaphragm 34 is set to fit inside the planar shape of unit body 35. Furthermore, on the front side of unit body 35, a connection area 36 that is connected to speaker case 32 is formed in an area surrounding diaphragm 34.

[0030] The speaker case 32 is a housing for the speaker device 30 and functions as an enclosure that houses the speaker case 32. The speaker case 32 houses the speaker unit 31 so that the diaphragm 34 is exposed. In this embodiment, a front opening 37 is provided on the front side of the speaker case 32. The shape and size of the front opening 37 are set so that the diaphragm 34 does not come into contact with the speaker case 32 and so that the unit body 35 does not penetrate through the front opening. In this case, as shown in FIG. 2 , the speaker unit 31 is fixed to the inner wall of the speaker case 32 so that the diaphragm 34 is exposed from the front opening 37 without coming into contact with the speaker case 32. Specifically, a connection region 36 formed on the front side of the unit body 35 is connected to an inner region of the speaker case 32 that surrounds the front opening 37.

[0031] The speaker case 32 forms a cavity 1 on the opposite side of the diaphragm 34 of the speaker unit 31. That is, the speaker case 32 houses the speaker unit 31 so that the cavity 1 is formed on the rear side of the speaker unit 31. Here, the cavity is a space (volume space) having a certain volume that is formed by being covered by the speaker case 32. The speaker case 32 is configured so that the inner wall of the speaker case 32 does not come into contact with the rear side of the speaker unit 31, for example. As a result, a cavity 1 is formed between the rear side of the speaker unit 31 and the inner wall of the speaker case 32. Hereinafter, the cavity 1 formed on the rear side of the speaker unit 31 will be referred to as a rear cavity 1a. In this embodiment, the speaker case 32 corresponds to a case portion.

[0032] The heat dissipation section 33 is a member provided in the rear cavity 1a and transfers heat from the speaker unit 31 to the speaker case 32. The heat dissipation section 33 is disposed within the rear cavity 1a and is, for example, thermally connected to the speaker unit 31 to release the heat to the speaker case 32. For example, the heat may be transferred directly to the speaker case 32, or to a heat dissipation member or the like disposed outside the speaker case 32.

[0033] The heat dissipation section 33 is made of a heat-conducting material such as metal that easily conducts heat. Specifically, at least one spring 38 made of a heat-conducting material is provided as the heat dissipation section 33. The spring 38 is arranged in a compressed state so that a repulsive force acts, for example, between the speaker unit 31 and the speaker case 32. This presses the heat dissipation section 33 (spring 38) against both the speaker unit 31 and the speaker case 32, making it possible to achieve good thermal contact.

[0034] In this way, by providing the rear cavity 1a in the speaker device 30, it is possible to sufficiently resonate the sound output from the speaker unit 31. This makes it possible to sufficiently improve the sound quality of the speaker device 30, particularly the reproduction capability of low frequencies. The rear cavity 1a is a cavity 1 provided in the thickness direction of the speaker device 30. Therefore, even if the rear cavity 1a is provided, the planar size of the speaker device 30 does not increase. Furthermore, by providing the heat dissipation section 33 in the rear cavity 1a, it becomes possible to efficiently dissipate heat from the speaker unit 31 to the speaker case 32 side, improving the heat dissipation capacity of the speaker device 30. This makes it possible to increase the power that can be input to the speaker unit 31, for example, and improve the reproducible sound pressure level. A more specific example of the configuration of the speaker device 30 will be described below.

[0035] FIG. 3 is a plan view showing a specific configuration example of the speaker device 30. As shown in FIG. Fig. 3A is a plan view of the speaker device 30 seen from the rear side. Fig. 3B is a plan view of the speaker device 30 seen from the rear side when attached to the terminal device 100. In Fig. 3A and Fig. 3B, the rear side of the drawing corresponds to the front side of the speaker device 30 where the diaphragm 34 is exposed. Hereinafter, the front-rear direction of the speaker device 30 will be referred to as the Z direction. Furthermore, directions perpendicular to each other on a plane perpendicular to the Z direction will be referred to as the X direction and the Y direction.

[0036] The X direction (left-right direction in the drawing) corresponds to the left-right direction of the speaker device 30. The Y direction (up-down direction in the drawing) corresponds to the up-down direction of the speaker device 30. The left-right and up-down directions of the speaker device 30 correspond to the left-right and up-down directions of the terminal device 100 when mounted on the terminal device 100. For example, the upper side in the drawing is the upper side of the speaker device 30 (terminal device 100). The right and left sides as viewed from the front side of the speaker device 30 (the side where the diaphragm 34 is provided) are referred to as the right and left sides of the speaker device 30 (terminal device 100). The terms upper, lower, left, right, front, rear, etc. regarding the speaker device 30 do not limit the position or arrangement in which the speaker device 30 is used.

[0037] As described above, the speaker device 30 includes the speaker unit 31, the speaker case 32, and the heat dissipation unit 33. Of these, the speaker case 32 includes a front case 40 provided on the front side of the speaker device 30 and a rear case 41 provided on the rear side. FIG. 3A mainly shows rear case 41 of speaker case 32.

[0038] 3A, a first area 5a, a second area 5b, and a third area 5c are provided in speaker case 32 in this order from the top. These areas are areas that form spaces surrounded by both rear case 41 and front case 40. The first area 5a is an area that is substantially square in plan view, and is an area where the speaker unit 31, the rear cavity 1a, the heat dissipation section 33, etc. are provided.

[0039] The second area 5b is an area obtained by extending the first area 5a downward, with a width approximately the same as that of the first area 5a. The third area 5c is an area obtained by extending the second area 5b downward, with a width narrower than that of the second area 5a, and is disposed to the right side in the drawing (the left side of the speaker device 30). The second area 5b and the third area 5c are areas where a side cavity 1b, which will be described later, is provided (see FIG. 5).

[0040] In this embodiment, the speaker case 32 has a heat sink 43. Here, the heat sink 43 is configured as a part of the rear case 41. In Fig. 3A, the heat sink 43 fitted into the rear case 41 is visible in the first area 5a. Moreover, the heat sink 43 has a heat sink terminal 44. The heat sink terminal 44 is a terminal connected to the heat sink 43. In Fig. 3A, the heat sink terminal 44 is formed so as to protrude from the left side (the right side in the figure) of the speaker device 30. The configuration of the heat sink 43 will be described in detail later.

[0041] The front case 40 is provided with a fixed terminal 45 and an input terminal 46 . The fixed terminal 45 is, for example, a terminal for fixing the speaker device 30. In Fig. 3A, the fixed terminal 45 is formed to protrude from the right side of the speaker device 30 (the left side in the figure). Input terminal 46 is a terminal for inputting an audio signal to speaker unit 31. In Fig. 3A, input terminal 46 is arranged below third area 5c, towards the right side in the figure.

[0042] FIG. 4 is an exploded perspective view of the speaker device 30 shown in FIG. In FIG. 4, the front case 40, the speaker unit 31, the heat dissipation section 33, and the rear case 41 are shown in this order from the bottom. The front case 40 is provided with a front opening 37 for exposing the diaphragm 34 of the speaker unit 31. Here, the front opening 37 is formed as a substantially square hole.

[0043] The speaker unit 31 is a thin structure that is roughly square in plan view, and is connected to the inner wall of the front case 40 so that the diaphragm 34 is exposed. In FIG. 4, the rear surface (a yoke 57, described later) of the speaker unit 31 is visible. A heat dissipation unit 33 equipped with four springs is connected to this surface. Note that while FIG. 4 illustrates the heat dissipation unit 33 as a standalone unit, in reality the heat dissipation unit 33 is fixed to the rear case 41 (heat sink 43) in advance (see FIG. 5).

[0044] The rear case 41 is connected to the front case 40 by pressing the heat dissipation section 33 against the rear side of the speaker unit 31. For example, the front case 40 and the rear case 41 are configured to fit together. Alternatively, the front case 40 and the rear case 41 may be connected using screws, adhesive, or the like.

[0045] FIG. 5 is a cross-sectional view of the speaker device 30 shown in FIG. Fig. 5 shows a cross-sectional view of the speaker device 30 taken along line A-A' shown in Fig. 3. In Fig. 5, the right side of the figure corresponds to the upper side of the speaker device 30. The upper side of the figure corresponds to the front side of the speaker device 30, and the lower side of the figure corresponds to the rear side of the speaker device 30.

[0046] First, a description will be given of the speaker unit 31. The speaker unit 31 has a diaphragm 34, an edge film 47, a support portion 48, a coupling portion 49, a voice coil 50, and a magnetic circuit 51.

[0047] The diaphragm 34 is a flat-plate-shaped member. The planar shape of the diaphragm 34 can be any shape, such as a circle, a square, or a rectangle. When a rectangular diaphragm 34 is used, stress concentration can be avoided by rounding the corners. The diaphragm 34 can be made of a material such as a resin material, a metal material, a ceramic material, or a composite material that combines these materials. Additionally, the shape and material of the diaphragm 34 are not limited, and the diaphragm 34 may be configured appropriately depending on the application of the speaker device 30, etc.

[0048] Edge film 47 is a film disposed between diaphragm 34 and support portion 48 so as to surround the outer periphery of diaphragm 34. Edge film 47 has, for example, a semicircular cross-sectional shape, and connects diaphragm 34 to support portion 48 so as to allow diaphragm 34 to vibrate. A resin film or the like is typically used as edge film 47. Support portion 48 is an annular member that supports diaphragm 34 via edge film 47. The shape of the opening formed inside support portion 48 is set to, for example, substantially the same shape as the planar shape of front opening 37, and the shape of the outer periphery of support portion 48 is the planar shape of speaker unit 31. The front surface of support portion 48 forms connection area 36 that is connected to the inner wall of speaker case 32 (front case 40). The coupling portion 49 is a member that couples the magnetic circuit 51 and the support portion 48. The coupling portion 49 is configured, for example, in an annular shape, and couples the rear surface of the support portion 48 to a second upper plate 56b and a second magnet 55b of the magnetic circuit 51, which will be described later.

[0049] The voice coil 50 vibrates integrally with the diaphragm 34, causing the diaphragm 34 to vibrate in response to an audio signal. The voice coil 50 may have a bobbin or may be configured as a bobbinless coil. The voice coil 50 is connected to the rear side of the diaphragm 34 and is disposed so as to fit into an annular gap 52 formed between the first magnet 55a and the second magnet 55b of the magnetic circuit 51. Furthermore, a coil terminal (not shown) is provided on the voice coil 50. The coil terminal is connected to an input electrode of the speaker unit 31. The specific configuration of the voice coil 50 is not limited.

[0050] The magnetic circuit 51 includes a first magnet 55 a, a second magnet 55 b, a first upper plate 56 a, a second upper plate 56 b, and a yoke 57 . The first magnet 55a and the second magnet 55b are magnets that generate a magnetic field that acts on the voice coil. The first magnet 55a is a plate-shaped permanent magnet that is arranged inside the voice coil 50. The second magnet 55b is an annular permanent magnet that is arranged to surround the first magnet 55a. Note that the second magnet 55b may be a plurality of permanent magnets arranged in an annular shape. The first magnet 55a and the second magnet 55b are arranged across an annular gap 52. A magnetic field generated in this gap 52 acts on the voice coil 50.

[0051] The first upper plate 56a is a plate-like plate disposed in front of the first magnet 55a, and the second upper plate 56b is an annular plate disposed in front of the second magnet 55b. Of these, the second upper plate 56b is connected to, for example, the above-mentioned coupling portion 49. The yoke 57 is a plate-like member that is provided on the opposite side of the diaphragm 34 with the first magnet 55a and the second magnet 55b sandwiched therebetween, and to which the first magnet 55a and the second magnet 55b are connected. The yoke 57 is made of a metal material, and magnetically couples the first magnet 55a and the second magnet 55b to form the magnetic circuit 51. The rear surface of the yoke 57 is the surface of the speaker unit 31 opposite the diaphragm 34. Hereinafter, the rear surface of the yoke 57 may be referred to as the back surface 58 of the speaker unit 31.

[0052] Next, a description will be given of the speaker case 32. The speaker case 32 has a front case 40 and a rear case 41.

[0053] The front case 40 is a member (speaker case front) that constitutes the front side of the speaker case 32, and holds the speaker unit 31 so that the diaphragm 34 is exposed. 4 and 5, the front case 40 is a substantially flat plate-shaped member configured to cover the first area 5a, the second area 5b, and the third area 5c. The outer periphery of the front case 40 protrudes rearward to form a side wall. The front case 40 is made of, for example, a resin material.

[0054] The front case 40 has a front opening 37, a seal member 60, and a fitting groove 61. The front opening 37 is a hole that exposes the diaphragm 34. Here, a substantially square front opening is formed in the first area 5a (see FIG. 4). The planar size of the front opening 37 is set so that the diaphragm 34 and the edge film 47 that surrounds the diaphragm 34 are exposed in a planar view. The shape and size of the front opening 37 may be set appropriately depending on the configuration of the speaker unit 31 and the diaphragm 34, for example.

[0055] The sealing member 60 is a seal that connects the front case 40 and the speaker unit 31. The sealing member 60 is provided inside the front case 40 so as to surround the front opening 37. The sealing member 60 is typically an adhesive seal with adhesive surfaces on both sides. As shown in FIG. 5 , the speaker unit 31 is arranged so that the front surface (connection area 36) of the support portion 48 is adhered to the sealing member 60. In this way, the speaker unit 31 is adhesively fixed to the front case 40.

[0056] In this embodiment, a waterproof seal is used as the sealing member 60. By using the waterproof seal, it is possible to prevent water from entering through the front opening 37. As the waterproof seal, a waterproof adhesive seal made of a rubber material, a resin material, or the like is appropriately used. It should be noted that the sealing member 60 does not necessarily have to be configured as a waterproof seal, and the present technology is applicable even when a waterproof inner adhesive tape or the like is used.

[0057] The mating groove 61 is a groove into which the mating end 64 of the rear case 41 is fitted. The mating groove 61 is formed on the end face of the side wall of the front case 40 that protrudes to the rear side.

[0058] The rear case 41 is a component (speaker case rear) that constitutes the rear side of the speaker case 32, and is connected to the front case 40 to form a rear cavity 1a. For example, the rear case 41 is configured so that a certain volumetric space is formed behind the speaker unit 31. This volumetric space becomes the rear cavity 1a. Because the rear cavity 1a is a space disposed behind the speaker unit 31, providing the rear cavity 1a does not increase the planar size of the speaker device 30. Furthermore, providing the rear cavity 1a allows the sound of the speaker unit 31 to resonate, thereby improving the sound quality. This makes it possible to realize a speaker device 30 that has good sound quality despite being very compact in planar size.

[0059] 4 and 5, the rear case 41 is configured to cover the first area 5a, the second area 5b, and the third area 5c. Of these, a rear cavity 1a is formed in the first area 5a. Another cavity that extends below the speaker unit 31 (to the left in the figure) is formed in the second area 5b. A lid-like member that closes the cavity formed on the front case 40 side is provided in the third area 5c. The outer periphery of the rear case 41, together with the front case 40, forms a side wall.

[0060] The rear case 41 has a resin housing 62, a rear opening 63, a mating end 64, and a heat sink 43. The resin housing 62 and the heat sink 43 are typically molded integrally by insert molding or the like. The resin housing 62 is a member that constitutes the rear case 41 except for the heat sink 43, and is made of a resin material. The resin housing 62 has a rear opening 63 and a mating end 64. The rear opening 63 is formed at a position facing the speaker unit 31 across the rear cavity 1a. In the example shown in Figures 3 to 5, the rear opening 63 is formed in the center of the first area 5a and has approximately the same size as the speaker unit 31. The area surrounding the rear opening 63 of the resin housing 42 (rear case 41) is the area that is joined to the heat sink 43 by insert molding.

[0061] The heat sink 43 is a plate-shaped heat dissipation member that dissipates heat transmitted through the heat dissipation section 33. The heat sink 43 is provided at a position facing the speaker unit 31 across the rear cavity 1a. It is also possible to attach the heat sink 43 after the resin housing 62 is molded.

[0062] In this embodiment, the heat sink 43 is disposed so as to cover the rear opening 63 of the speaker case 32 (the resin housing 62 of the rear case 41). That is, the heat sink 43 functions as a lid that closes the rear opening 63. Therefore, the rear cavity 1a is a volume space formed between the heat sink 43 and the speaker unit 31. In this way, the heat sink 43 is configured as a part of the speaker case 32 (the rear case 41).

[0063] As shown in FIG. 5, the heat sink 43 has a generally flat plate shape and includes an attachment portion 66 and a coupling end 67 . The mounting portion 66 is a protrusion provided for mounting the heat dissipation portion 33. As shown in FIGS. 3 and 5, the mounting portion 66 is formed by deforming the heat dissipation plate 43 so that it protrudes from the front side (inside) of the heat dissipation plate 43. Two protrusions are formed on the heat dissipation plate 43 as the mounting portion 66. When viewed from the rear side (outside) of the heat dissipation plate 43, the mounting portion 66 appears as a concave depression. The joining end 67 is formed by bending the outer peripheral edge of the heat sink 43 forward. The joining end 67 is joined to the area surrounding the rear opening 63 of the plastic housing 62. This allows the plastic housing 62 and the heat sink 43 to fit together well.

[0064] As described with reference to FIG. 3A, the heat sink 43 has a heat dissipation terminal 44. The heat dissipation terminal 44 is a terminal connected to the main body of the terminal device 100 on which the speaker device 30 is mounted. As shown in Fig. 3A, the heat dissipation terminal 44 has a screw hole formed therein. The heat dissipation terminal 44 is formed integrally with the heat dissipation plate 43 and configured to pass through the inside of the rear case 41, penetrate the side wall, and protrude from the side surface of the rear case 41. In this way, the heat dissipation terminal 44 is provided on the outside of the rear case 41 (speaker case 32). In this embodiment, the heat dissipation terminal 44 corresponds to a connection portion that is connected to the main body of the electronic device.

[0065] 3B illustrates how the heat dissipation terminal 44 is connected to the main body of the terminal device 100. By providing the heat dissipation terminal 44 on the outside of the speaker case 32, connection to the terminal device 100 can be easily achieved. The heat dissipation terminal 44 may be provided inside or on the outer wall of the speaker case 32. For example, a through hole for screwing may be formed as the heat dissipation terminal in the portion covering the rear opening 63 of the heat dissipation plate 43. Alternatively, the heat dissipation terminal 44 may be formed along the side wall of the speaker case 32.

[0066] 5, another cavity 1 communicating with the rear cavity 1a is formed in the speaker case 32. Here, the cavity 1 is formed by the sidewall of the rear case 41 protruding into the second area 5b below (on the left side in the figure) the first area 5a in which the rear cavity 1a is formed. Furthermore, the cavity 1 is formed in the third area 5c below (on the left side in the figure) the second area 5b by a groove-like region formed inside the front case 40. These cavities 1 are side cavities 1b that extend from the rear cavity 1a not in the front-to-rear direction (thickness direction) when viewed from the speaker unit 31, but in a plane direction (to the side of the speaker unit 31) perpendicular to the front-to-rear direction.

[0067] In this way, the speaker case 32 forms a side cavity 1b that communicates with the rear cavity 1a and extends to the sides of the speaker unit 31. By providing the side cavity 1b, it is possible to increase the volume of the cavity portion of the speaker device 30 configured as a speaker box. This makes it possible to sufficiently improve the reproduction capability of bass and other sounds. The size and arrangement of the side cavity 1b are not limited, and the side cavity 1b may be provided to extend the rear cavity 1a in any direction, such as above, below, right, or left of the speaker unit 31. In this embodiment, the side cavity 1b corresponds to the other cavity.

[0068] Next, the heat dissipation section 33 will be described. The heat dissipation section 33 thermally connects the yoke 57 of the speaker unit 31 to the speaker case 32. This allows heat generated in the voice coil 50 and transferred to the yoke 57, for example, to be released to the speaker case 32 side. In this embodiment, heat dissipation section 33 is connected to heat dissipation plate 43 provided on rear case 41. As shown in Fig. 5, heat dissipation section 33 is configured to contact rear surface 58 of yoke 57 and the front (inner) surface of heat dissipation plate 43. This allows heat transmitted through heat dissipation section 33 to be transmitted to heat dissipation plate 43, making it possible to efficiently dissipate heat from speaker unit 31.

[0069] The heat dissipation portion 33 has a plurality of leaf spring portions 70 and a base portion 71 . The leaf spring portion 70 is a leaf spring formed by bending a plate-shaped heat-conducting member. The base portion 71 is a member that supports a plurality of leaf spring portions 70. The leaf spring portion 70 and the base portion 71 are typically formed integrally by bending a single member. For the leaf spring portion 70 and the base portion 71, a highly heat-conducting member with spring properties, such as phosphor bronze or a Corson alloy, is used. Alternatively, the heat dissipation portion 33 may be formed of a stainless steel or iron-based alloy, or the like.

[0070] The leaf spring portion 70 is formed by bending a long plate extending in one direction from a base portion 71 in the opposite direction at a bent portion 72 provided near the middle of the plate. The base portion connecting the long plate to the base portion 71 is also bent in the same direction as the bent portion 72 but at a smaller angle than the bent portion 72. This causes the long plate to become a leaf spring bent at two points, the base portion and the bent portion 72. The tip of the leaf spring portion 70 is also formed with a curved portion 73 that comes into contact with the back surface 58 of the yoke 57. The natural length of the leaf spring portion 70 (the distance from the base portion 71 to the curved portion 73) is set to be longer than the front-to-rear size of the rear cavity 1a, i.e., the distance from the back surface 58 of the yoke 57 to the front (inner) surface of the heat sink 43.

[0071] As shown in FIG. 4, the base portion 71 is a longitudinal member extending in one direction, to which a plurality of leaf spring portions 70 are connected. Specifically, four leaf spring portions 70 are connected to the base portion 71 in line symmetry with respect to the longitudinal direction. For example, pairs of leaf spring portions 70 are arranged in two locations along the longitudinal direction of the base portion 71. The pairs of leaf spring portions 70 are formed by bending a pair of long plates extending in opposite directions perpendicular to the longitudinal direction of the base portion 71. The base of each leaf spring portion 70 is bent so that the curved portions 73 are spaced apart at a fixed interval. The base portion 71 also has mounting holes 74 into which the mounting portions 66 of the heat sink 43 are inserted. In the example shown in Fig. 4, two mounting holes 74 are formed to match the positions where the pairs of leaf spring portions 70 are connected. The heat sink 43 is provided with mounting portions 66 that can be inserted into these mounting holes 74.

[0072] The heat dissipation unit 33 is fixed to the heat dissipation plate 43 by inserting the mounting holes 74 into the mounting portions 66 of the heat dissipation plate 43. Methods for fixing the heat dissipation unit 33 include welding and crimping. This allows for good thermal contact between the heat dissipation unit 33 and the heat dissipation plate 43, thereby enabling sufficient improvement in heat dissipation efficiency. Alternatively, screws or the like may be used to fix the heat dissipation unit 33.

[0073] When the rear case 41 is fitted into the front case 40, the heat dissipation section 33 fixed to the heat sink 43 comes into contact with the rear surface 58 of the yoke 57, and the leaf spring section 70 is compressed to the size of the rear cavity 1a. Therefore, the restoring force of the leaf spring section 70 acts on the rear surface 58 of the yoke 57 in a direction pushing it forward. As a result, the speaker unit 31 is pressed against the seal member 60 provided on the inner wall of the front case 40. In this way, the heat dissipation portion 33 is fixed to the rear case 41 (heat dissipation plate 43 ), and presses the speaker unit 31 against the sealing member 60 .

[0074] This makes it possible to strengthen the connection between the speaker unit 31 and the front case 40, for example. Furthermore, by pressing the leaf spring portion 70 against the speaker case 32, it becomes possible to significantly suppress unnecessary vibrations that occur in the speaker case 32 in accordance with the vibration of the diaphragm 34. This makes it possible to improve the sound quality of the speaker device 30. Furthermore, since energy consumption due to unnecessary vibrations is eliminated, it is possible to realize a speaker device 30 with good energy efficiency. Furthermore, in a waterproof speaker in which the seal member 60 is configured as a waterproof seal, pressure from the rear surface 58 improves the adhesion of the waterproof seal, making it possible to reduce waterproof defects.

[0075] As described above, the heat dissipation section 33 is provided with a plurality of leaf springs 70 arranged line-symmetrically. The position of the mounting section 66 of the heat dissipation plate 43 is set so that, for example, the midpoint of the two mounting holes 74 of the heat dissipation section 33 (i.e., the center point of the four leaf springs 70) coincides with the central axis of the voice coil of the speaker unit 31. This makes it possible to press the speaker unit 31 evenly against the front case 40 (sealing member 60). In this way, the plurality of leaf spring portions 70 are arranged so as to press the speaker unit 31 evenly against the speaker case 32 (front case 40).

[0076] This makes it possible to avoid, for example, a situation in which the force applied from the speaker unit 31 to the sealing member 60 is uneven. As a result, the connection between the speaker unit 31 and the front case 40 can be strengthened evenly around the entire periphery of the speaker unit 31. In particular, in waterproof speakers, it is possible to improve the adhesion of the waterproof seal evenly, making it possible to achieve high waterproof performance.

[0077] Here, the flow of heat generated in the speaker unit 31 will be described with reference to Figures 5 and 3B. In Figures 5 and 3B, the flow of heat is schematically shown using black arrows. In the speaker unit 31, for example, the voice coil 50 is the main heat source. The heat generated in the voice coil 50 is transmitted to the first magnet 55a and the second magnet 55b through the gap 52. The heat of each magnet is transmitted to the yoke 57.

[0078] Plate spring portion 70 of heat dissipation portion 33 is connected to the back surface of yoke 57. Heat from yoke 57 propagates from the tip (curved portion 73) of plate spring portion 70 to plate spring portion 70 and then to base portion 71. Base portion 71 is connected to heat dissipation plate 43, and heat from base portion 71 propagates to heat dissipation plate 43. Thus, in this embodiment, even though the back surface 58 side of yoke 57 is hollow (rear cavity 1), providing heat dissipation portion 33 makes it possible to absorb heat from speaker unit 31 from the back surface 58 side of yoke 57.

[0079] 3B, the heat propagated to the heat sink 43 is propagated from the heat dissipation terminal 44 to the main body of the terminal device 100. This allows the heat of the speaker unit 31 to be dissipated to the housing of the terminal device 100, which has a relatively large heat capacity. In this way, by providing the heat dissipation portion 33 and the heat dissipation plate 43, the effective heat capacity and heat dissipation area of the speaker unit 31 are significantly increased. As a result, the cooling efficiency of the speaker unit 31 is improved sufficiently, and it becomes possible to handle large current audio signals. As a result, it becomes possible to increase the sound pressure level and dynamic range, and it becomes possible to sufficiently improve the sound quality of the speaker device 30.

[0080] 6 is a schematic diagram showing an example of a cross-sectional configuration of a terminal device 100 equipped with a speaker device 30. Here, the speaker device 30 is equipped in the terminal device 100 so that the up-down and left-right directions of the speaker device 30 are the up-down and left-right directions of the terminal device 100. 6 is a schematic cross-sectional view of the terminal device 100 taken along the XZ plane. The right side of the drawing corresponds to the upper side of the terminal device 100 (speaker device 30). The upper side of the drawing corresponds to the front side of the terminal device 100 (speaker device 30).

[0081] The terminal device 100 includes a display 10 , a main body housing 11 , a front glass 12 , and a rear cover 13 . The main body housing 11 is a frame member of the terminal device 100 that supports the speaker device 30 and the display 10. In the example shown in Fig. 6, the main body housing 11 is schematically illustrated as including a plate-shaped internal frame 14 extending along the vertical direction of the terminal device 100, and an upper end frame 15 that is provided on the upper side of the terminal device 100 and connects to the internal frame 14.

[0082] The inner frame 14 is provided with a frame opening 16 having substantially the same shape as a front opening 37 of the speaker device 30. The speaker device 30 is connected to the rear side of the inner frame 14 via a seal member 17 so that the frame opening 16 and the front opening 37 overlap in a plan view. The seal member 17 is an annular adhesive seal configured to cover the entire periphery of the frame opening 16. As the seal member 17, for example, a waterproof seal is used.

[0083] The display 10 is disposed on the front surface of the inner frame 14. The front glass 12 is disposed on the front surface of the display 10. The front glass 12 functions as a touch surface on which a user performs touch operations. The rear cover 13 is a flat plate-shaped member that is arranged to cover the rear side of the terminal device 100. The rear cover 13 may be in contact with, for example, the rear surface of the speaker device 30 (heat sink 43). Alternatively, other elements or members may be provided between the rear cover 13 and the speaker device 30. The rear cover 13 may be, for example, a cover (rear glass) made of a glass member. Alternatively, the rear cover 13 may be made of a resin member or a metal member.

[0084] In the cross section shown in FIG. 6, the display 10 is configured so that the upper edge (right side in the drawing) of the display 10 does not reach the inner frame 14 on the upper frame 15 side. An opening window 20 is formed between the upper edge (right side in the drawing) of the front glass 12 and the upper frame 15. As a result, a space communicating with the frame opening 16 extends from the upper edge of the display 10 to the opening window 20. is formed.

[0085] For example, sound 3 (indicated by the white arrow in the figure) output from the speaker device 30 (diaphragm 34) passes through the front opening 37 of the speaker device 30 and the frame opening 16 of the inner frame 14, passes through the space formed above the display 10, and is output from the opening window 20. This makes it possible to output the sound of the speaker device 30 to the outside of the terminal device 100. The area where the opening window 20 and the like are provided may be configured by utilizing a notch or the like formed on the upper side of the display 10, for example.

[0086] In this way, in the terminal device 100, the speaker device 30 is arranged so that at least a part of the diaphragm 34 overlaps with the display 10 when viewed from a direction perpendicular to the display 10 (Z direction). As a result, the speaker device 30 is arranged on the back side of the display 10, which makes it possible to easily realize a terminal device 100 with a thin bezel.

[0087] As described above, the speaker device 30 has the rear cavity 1a, so the thickness of the speaker device 30 is greater than the thickness of the speaker unit 31 alone. On the other hand, the heat dissipation part 33 such as a leaf spring provided in the rear cavity 1a has a sufficiently small volume and does not occupy the rear cavity 1a. Therefore, even if the thickness of the rear cavity 1a is set to be thin, it is possible to ensure a sufficient volume space. In this way, by using the present technology, it is possible to provide a speaker device 30 that is thick enough to be placed behind the display 10, has a sufficiently compact planar size, and has good sound quality.

[0088] As described above, in the speaker device 30 according to this embodiment, the speaker unit 31 is housed in the speaker case 32 with the diaphragm 34 exposed. The speaker case 32 also forms a rear cavity 1a on the side opposite the diaphragm 34 of the speaker unit 31. This rear cavity 1a is provided with a heat dissipation section 33 that transfers heat from the speaker unit 31 to the speaker case 32 side. This makes it possible to dissipate heat from the speaker unit 31 using the rear cavity 1a on the side opposite the diaphragm 34, and makes it possible to improve sound quality without increasing the planar size.

[0089] FIG. 7 is a schematic diagram showing a speaker device as a comparative example. Fig. 7A is a plan view of the speaker device 150 as seen from the rear side, and Fig. 7B is a cross-sectional view of the speaker device 150 taken along line BB' shown in Fig. 7A. In speaker device 150, speaker case 152 is configured so that the rear side (the rear surface of the yoke) of speaker unit 151 is exposed. A graphite sheet 153 for heat dissipation is attached to the rear side of speaker unit 151.

[0090] In this way, with a configuration in which the rear side of the speaker unit 151 is exposed, it is not possible to increase the box volume in the thickness direction (front-rear direction). For this reason, as shown in FIG. 7B, it is necessary to ensure volume by expanding the cavity 1 to the sides (vertical and horizontal directions) of the speaker unit 151. As a result, the planar size of the speaker device 150 increases, which may reduce the degree of freedom in device layout. In addition, it is necessary to seal the periphery of the speaker unit 151 using adhesive or the like, which may complicate the manufacturing process. Furthermore, graphite sheet 153 is required just for heat dissipation, which may increase the cost of the device. Another possible method is to dissipate heat through the air by placing a metal plate or the like on the side of speaker unit 151 where diaphragm 154 is provided. However, because this method uses air as a medium, it is thought that the cooling efficiency is lower than a method in which the heat of speaker unit 151 is directly released.

[0091] In the speaker device 30 according to this embodiment, a rear cavity 1a is formed on the opposite side of the diaphragm 34 of the speaker unit 31. Furthermore, a heat dissipation section 33 provided in the rear cavity 1a transfers heat from the speaker unit 31 to the speaker case 32. This improves the heat dissipation capacity, thereby increasing the input power that can be input to the voice coil 50. As a result, the sound pressure level, dynamic range, etc. of the speaker device 30 can be sufficiently improved.

[0092] Furthermore, since the speaker device 30 does not need to expose the rear side of the speaker unit 31 (the rear surface 58 of the yoke 57), it is possible to ensure volume in the thickness direction. This makes it possible to realize a device with high bass and other reproducing capabilities and a compact planar size. It also makes it possible to improve the degree of freedom in device layout.

[0093] A spring member such as a leaf spring is used as the heat dissipation portion 33. In this case, the space occupied by the heat dissipation portion 33 is very small, and it is possible to minimize the effect on sound quality (volume effect) that accompanies the reduction in the volume of the rear cavity 1a. Furthermore, by pressing the speaker unit 31 with a spring, vibration of the speaker unit 31 is reduced, making it possible to improve sound quality. In the case of a waterproof speaker, applying pressure from the back improves the adhesion of the waterproof double-sided tape, making it possible to reduce waterproof defects and improve waterproof performance.

[0094] 5 and other figures, the yoke 57 is an independent metal within the sealed container. In this embodiment, a metal heat dissipation section 33 is connected to the yoke 57. This makes it possible to release high potential to GND even when static electricity or the like is generated, thereby improving ESD (Electrostatic Discharge) performance.

[0095] <Other embodiments> The present technology is not limited to the above-described embodiments, and various other embodiments can be realized.

[0096] Although the above description has been given of a thin speaker unit having a flat diaphragm, the shape of the diaphragm and the shape of the speaker unit are not limited. For example, a dome-shaped, cone-shaped, horn-shaped, or other diaphragm may be used. The planar shape of the diaphragm may be set to any shape, such as round, oval, or rectangular. The speaker unit does not necessarily need to be thin, and a speaker unit that matches the type of speaker may be used.

[0097] In the above, an example has been described in which a leaf spring is mainly used as the heat dissipation portion. For example, a coil spring or the like may be provided instead of the leaf spring. Furthermore, the number of springs used as the heat dissipation portion is not limited, and the heat dissipation portion may be configured using, for example, a single spring. The heat dissipation section may be made of any suitable heat-conductive material. For example, a metal wire or conductive sheet may be used to connect the speaker unit and the case through the rear cavity. Alternatively, a conductive sponge may be used as the heat dissipation section.

[0098] Although the heat sink is configured as part of the speaker case (rear case), it may also be provided as an independent component. In this case, it is possible to configure a rear case that does not have an opening on the rear side and place the heat sink inside the rear case. Alternatively, it is also possible to connect the heat sink to a heat sink placed on the outside of the rear case through a hole opened in the rear case.

[0099] It is also possible to combine at least two of the features of the present technology described above. That is, the various features described in each embodiment may be arbitrarily combined without distinction between the embodiments. Furthermore, the various effects described above are merely examples and are not limiting, and other effects may also be achieved.

[0100] In this disclosure, the terms "same," "equal," "orthogonal," etc. are concepts that include "substantially the same," "substantially equal," "substantially orthogonal," etc. For example, they also include states that fall within a predetermined range (e.g., a range of ±10%) based on "completely the same," "completely equal," "completely orthogonal," etc.

[0101] The present technology can also be configured as follows. (1) a speaker unit having a diaphragm; a case portion that forms a cavity on the opposite side of the diaphragm of the speaker unit and houses the speaker unit so that the diaphragm is exposed; a heat dissipation portion provided in the cavity and configured to transfer heat from the speaker unit to the case portion; A speaker device comprising: (2) The speaker device according to (1), the speaker unit includes a voice coil that vibrates integrally with the diaphragm, a magnet that generates a magnetic field that acts on the voice coil, and a yoke that is provided on the opposite side of the magnet from the diaphragm and to which the magnet is connected, The heat dissipation portion thermally connects the yoke and the case portion. Speaker device. (3) The speaker device according to (1) or (2), The heat dissipation portion has at least one spring made of a heat conductive material. Speaker device. (4) The speaker device according to (3), The at least one spring is a leaf spring. Speaker device. (5) The speaker device according to (3) or (4), The at least one spring includes a plurality of springs arranged to evenly press the speaker unit against the case portion. Speaker device. (6) A speaker device according to any one of (1) to (5), the case further includes a heat sink provided at a position facing the speaker unit across the cavity, The heat dissipation portion is connected to the heat dissipation plate. Speaker device. (7) The speaker device according to (6), the case portion has a rear opening formed at a position facing the speaker unit across the cavity, The heat sink is disposed so as to cover the rear opening of the case. Speaker device. (8) The speaker device according to (6) or (7), The speaker device is mounted on an electronic device, The heat sink has a connection portion that is connected to the main body of the electronic device. Speaker device. (9) The speaker device according to (8), The connection portion is provided on the outside of the case portion. Speaker device. (10) A speaker device according to any one of (1) to (9), The case portion forms another cavity that communicates with the cavity and extends to the side of the speaker unit. Speaker device. (11) A speaker device according to any one of (1) to (10), The case portion has a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity. Speaker device. (12) The speaker device according to (11), the front case has a front opening that exposes the diaphragm, and a seal member provided inside the front case so as to surround the front opening, The heat dissipation unit is fixed to the rear case and presses the speaker unit against the sealing member. Speaker device. (13) The speaker device according to (12), The sealing member is a waterproof seal. Speaker device. (14) an output unit for outputting an audio signal; a speaker unit having a diaphragm and vibrating the diaphragm in response to the audio signal; a case portion that forms a cavity on the opposite side of the diaphragm of the speaker unit and houses the speaker unit so that the diaphragm is exposed; a heat dissipation section provided in the cavity for conducting heat from the speaker unit to the case section; a speaker device having the An electronic device comprising: (15) The electronic device according to (14), further comprising: A display for displaying an image is provided, The speaker device is disposed so that at least a portion of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display. electronic equipment. [Explanation of symbols]

[0102] 1...Cavity 1a…back cavity 1b…lateral cavity 3...Audio 10. Display 30...Speaker device 31...Speaker unit 32...Speaker case 33…Heat radiation part 34...Diaphragm 37...Front opening 40...Front case 41...Rear case 43...Heat sink 44...Heat dissipation terminal 60...Sealing member 63...Rear opening 70...Leaf spring part 100...Terminal device

Claims

1. a speaker unit having a diaphragm; a case portion that forms a cavity on the opposite side of the diaphragm of the speaker unit and houses the speaker unit so that the diaphragm is exposed; a heat dissipation portion provided in the cavity and configured to transfer heat from the speaker unit to the case portion; Equipped with The speaker unit has a voice coil that vibrates integrally with the diaphragm, and a magnetic circuit that generates a magnetic field that acts on the voice coil, the case portion defines a thickness direction perpendicular to the diaphragm and defines the cavity such that the length of the cavity in the thickness direction is greater than the length of the magnetic circuit in the thickness direction; the heat dissipation section has a longitudinal member that serves as a heat conduction path between the speaker unit and the case section, the longitudinal member is a V-shaped leaf spring formed by bending a long spring member made of a heat conductive material at a bending portion, and the longitudinal member is at least one leaf spring disposed in the cavity such that the bending portion does not come into contact with either the speaker unit or the case portion; When the leaf spring is disposed in the cavity, the length of the leaf spring in a direction perpendicular to the thickness direction is greater than the length of the cavity in the thickness direction. Speaker device.

2. 2. The speaker device according to claim 1, the magnetic circuit includes a magnet that generates a magnetic field that acts on the voice coil, and a yoke that is disposed on the opposite side of the magnet from the diaphragm and to which the magnet is connected; The heat dissipation portion thermally connects the yoke and the case portion. Speaker device.

3. 2. The speaker device according to claim 1, The at least one leaf spring includes a plurality of leaf springs arranged to evenly press the speaker unit against the case portion. Speaker device.

4. 2. The speaker device according to claim 1, the case further includes a heat sink provided at a position facing the speaker unit across the cavity, The heat dissipation portion is connected to the heat dissipation plate. Speaker device.

5. 5. The speaker device according to claim 4, the case portion has a rear opening formed at a position facing the speaker unit across the cavity, The heat sink is disposed so as to cover the rear opening of the case. Speaker device.

6. 5. The speaker device according to claim 4, The speaker device is mounted on an electronic device, The heat sink has a connection portion that is connected to the main body of the electronic device. Speaker device.

7. 7. The speaker device according to claim 6, The connection portion is provided on the outside of the case portion. Speaker device.

8. 2. The speaker device according to claim 1, The case portion forms another cavity that communicates with the cavity and extends to the side of the speaker unit. Speaker device.

9. 2. The speaker device according to claim 1, The case portion has a front case that holds the speaker unit so that the diaphragm is exposed, and a rear case that is connected to the front case and forms the cavity. Speaker device.

10. 10. The speaker device according to claim 9, the front case has a front opening that exposes the diaphragm, and a seal member provided inside the front case so as to surround the front opening, The heat dissipation unit is fixed to the rear case and presses the speaker unit against the sealing member. Speaker device.

11. 11. The speaker device according to claim 10, The sealing member is a waterproof seal. Speaker device.

12. an output section for outputting an audio signal; a speaker unit having a diaphragm and vibrating the diaphragm in response to the audio signal; a case portion that forms a cavity on the opposite side of the diaphragm of the speaker unit and houses the speaker unit so that the diaphragm is exposed; a heat dissipation section provided in the cavity for conducting heat from the speaker unit to the case section; a speaker device having the Equipped with The speaker unit has a voice coil that vibrates integrally with the diaphragm, and a magnetic circuit that generates a magnetic field that acts on the voice coil, the case portion defines a thickness direction perpendicular to the diaphragm and defines the cavity such that the length of the cavity in the thickness direction is greater than the length of the magnetic circuit in the thickness direction; the heat dissipation section has a longitudinal member that serves as a heat conduction path between the speaker unit and the case section, the longitudinal member is a V-shaped leaf spring formed by bending a long spring member made of a heat conductive material at a bending portion, and the longitudinal member is at least one leaf spring disposed in the cavity such that the bending portion does not come into contact with either the speaker unit or the case portion; When the leaf spring is disposed in the cavity, the length of the leaf spring in a direction perpendicular to the thickness direction is greater than the length of the cavity in the thickness direction. electronic equipment.

13. The electronic device according to claim 12, further comprising: A display for displaying an image is provided, The speaker device is disposed so that at least a portion of the diaphragm overlaps with the display when viewed from a direction perpendicular to the display. electronic equipment.

Images