Photosensitive conductive paste, method for manufacturing multilayer electronic component, and multilayer electronic component

Abstract

To provide a photosensitive conductive paste that reduces the shrinkage percentage of an inner electrode during firing, improves the resolution during photolithographic patterning, and reduces the electrical resistance of the inner electrode after firing, a method for producing a multilayer electronic component, and a multilayer electronic component.SOLUTION: A photosensitive conductive paste includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is covered with a glass having a glass softening point (Ts) of 800°C or lower.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a photosensitive conductive paste, a method for manufacturing a multilayer electronic component, and a multilayer electronic component. [Background technology]

[0002] In recent years, multilayer electronic components such as multilayer ceramic circuit boards have been manufactured by forming internal electrodes using a photosensitive conductive paste. The internal electrodes are formed by patterning the photosensitive conductive paste and then firing it to sinter the conductive powder contained in the photosensitive conductive paste. Examples of photosensitive conductive pastes used in multilayer electronic components include those disclosed in Japanese Patent Laid-Open No. 2002-169274 (Patent Document 1) and Japanese Patent Laid-Open No. 2007-18884 (Patent Document 2).

[0003] Japanese Patent Application Laid-Open Publication No. 2002-169274 discloses a photosensitive conductive paste containing, as its main components, 40 to 80 wt% of a conductive powder, 3 to 20 wt% of a photopolymerizable compound, 10 wt% or less of a photopolymerization initiator, and 0.3 to 2.5 wt% of one or more non-conductive metal oxides. The non-conductive metal oxides are generally called "co-materials." Japanese Patent Application Laid-Open Publication No. 2002-169274 claims that the inclusion of the co-materials reduces the shrinkage of the internal electrodes during firing.

[0004] Japanese Patent Application Laid-Open No. 2007-18884 discloses a photosensitive conductive paste containing a first conductive powder obtained by an atomization method and having an average particle size of 5 μm or less, and a second conductive powder obtained by a wet reduction method and having an average particle size in the range of 0.2 to 2.0 μm, in a mass ratio within the range of 20 / 80≦(first conductive powder / second conductive powder)≦80 / 20. Japanese Patent Application Laid-Open No. 2007-18884 states that the inclusion of the first conductive powder with a relatively large average particle size reduces the shrinkage rate of the internal electrodes during firing. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-169274 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-18884 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the photosensitive conductive paste disclosed in JP 2002-169274 A reduces the shrinkage rate of the internal electrodes during firing, but contains a co-material that is a non-conductive metal oxide, which can increase the electrical resistance of the internal electrodes after firing. Also, the inclusion of the co-material increases the amount of powdery components, which can increase the scattering of light by the powdery components during photolithographic patterning, resulting in lower resolution than when the co-material is not included.

[0007] The photosensitive conductive paste disclosed in JP 2007-18884 A reduces the shrinkage rate of the internal electrodes during firing, but contains a second conductive powder with a relatively small average particle size, which can increase the surface area of ​​the conductive powder. As a result, during photolithographic patterning, light scattering on the surface of the conductive powder increases, sometimes resulting in reduced resolution.

[0008] Therefore, an object of the present disclosure is to provide a photosensitive conductive paste, a method for manufacturing a multilayer electronic component, and a multilayer electronic component that can reduce the shrinkage rate of internal electrodes during firing, improve resolution during photolithography patterning, and reduce the electrical resistance of the internal electrodes after firing. [Means for solving the problem]

[0009] In order to solve the above problems, a photosensitive conductive paste according to one embodiment of the present disclosure comprises: The composition includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent, The conductive powder is coated with glass having a glass softening point (Ts) of 800° C. or less.

[0010] According to the above-described embodiment, since the photosensitive conductive paste does not contain a co-material, the powdery components can be reduced compared to conventional photosensitive conductive pastes, thereby improving the resolution during photolithography patterning. Furthermore, since the conductive powder is coated with glass, sintering of the conductive powder is suppressed until the firing temperature reaches the glass softening point of the glass. This reduces the shrinkage of the internal electrodes during firing. Furthermore, when the firing temperature exceeds the glass softening point, sintering of the conductive powder is promoted by liquid phase sintering. This reduces the electrical resistance of the internal electrodes after firing compared to conventional techniques. Liquid phase sintering is a sintering mechanism in which a viscous liquid exists at the sintering temperature, and is a phenomenon in which the liquid wets the solid particles at the sintering temperature, promoting sintering. [Effects of the Invention]

[0011] According to the photosensitive conductive paste of one aspect of the present disclosure, it is possible to reduce the shrinkage rate of the internal electrodes during firing, improve the resolution during photolithographic patterning, and reduce the electrical resistance of the internal electrodes after firing. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view schematically showing a multilayer electronic component. [Figure 2] FIG. 1 is an exploded perspective view schematically illustrating a multilayer electronic component. [Figure 3] FIG. 2 is a cross-sectional view schematically showing a photosensitive conductive paste. [Figure 4] 10A and 10B are diagrams for explaining the effect of suppressing delamination and reducing the electrical resistance of the internal electrodes. DETAILED DESCRIPTION OF THE INVENTION

[0013] The photosensitive conductive paste, the method for manufacturing a multilayer electronic component, and the multilayer electronic component, which are one aspect of the present disclosure, will be described in detail below with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0014] (Overall structure of multilayer electronic components) FIG. 1 is a perspective view schematically showing a multilayer electronic component. FIG. 2 is an exploded perspective view schematically showing a multilayer electronic component. In FIG. 1, the element body is depicted as transparent to facilitate understanding of the structure, but it may be translucent or opaque. In FIG. 1, coils are omitted to facilitate understanding of the structure. In FIG. 2, external electrodes are omitted to facilitate visibility.

[0015] In the following, a multilayer coil component will be described as an example of a multilayer electronic component; however, the multilayer electronic component of the present disclosure is not limited to a multilayer coil component, and can be applied to various other multilayer electronic components such as a multilayer capacitor component and a multilayer LC composite component.

[0016] 1 and 2, a multilayer electronic component 10 includes an element body 4, a coil 5 provided within the element body 4, and a first external electrode 6a and a second external electrode 6b provided on the element body 4. The coil 5 corresponds to the "internal electrodes" recited in the claims.

[0017] The shape of the element body 4 is not particularly limited, but in this embodiment, it is a substantially rectangular parallelepiped. The outer surface of the element body 4 has a first end face 41, a second end face 42 opposite the first end face 41, a first side face 43 connecting the first end face 41 and the second end face 42, a second side face 44 opposite the first side face 43, a bottom face 45 connecting the first end face 41, the second end face 42, the first side face 43, and the second side face 44, and a top face 46 opposite the bottom face 45 and connecting the first end face 41, the second end face 42, the first side face 43, and the second side face 44. The direction from the first end face 41 to the second end face 42 is the X direction, the direction from the first side face 43 to the second side face 44 is the Y direction, and the direction from the bottom face 45 to the top face 46 is the Z direction. Note that in this specification, the Z direction may also be referred to as the upper side.

[0018] The element body 4 is formed by stacking multiple insulating layers 40. The insulating material of the insulating layers 40 is not particularly limited, but may include, for example, borosilicate glass and an inorganic filler. The inorganic filler may be, for example, glass powder or a ceramic aggregate such as alumina. The stacking direction of the insulating layers 40 is parallel to the Z direction. That is, the insulating layers 40 are layered and extend across the XY plane. In the insulating layer 40 located between adjacent coil wirings 2 (described later), via holes 3 are provided at positions where the adjacent coil wirings 2 are connected. The via holes 3 penetrate the insulating layers 40 in the thickness direction (Z direction). In this application, "parallel" is not limited to a strict parallel relationship, but also includes a substantial parallel relationship, taking into account the range of realistic variation. Note that in the element body 4, the interfaces between the multiple insulating layers 40 may not be clearly defined due to firing or other processes.

[0019] The first external electrode 6a and the second external electrode 6b are made of a conductive material such as Ag, Cu, Au, or an alloy containing any of these as a main component. In this embodiment, the first external electrode 6a is provided continuously over the entire first end face 41 of the element body 4, the end of the first side face 43 facing the first end face 41, the end of the second side face 44 facing the first end face 41, the end of the bottom face 45 facing the first end face 41, and the end of the top face 46 facing the first end face 41. The second external electrode 6b is provided continuously over the entire second end face 42 of the element body 4, the end of the first side face 43 facing the second end face 42, the end of the second side face 44 facing the second end face 42, the end of the bottom face 45 facing the second end face 42, and the end of the top face 46 facing the second end face 42. In other words, each of the first external electrode 6a and the second external electrode 6b is a five-sided electrode. However, the present invention is not limited to this, and the first external electrode 6a may be, for example, an L-shaped electrode provided continuously on a part of the first end face 41 and a part of the bottom face 45. Similarly, the second external electrode 6b may be, for example, an L-shaped electrode provided continuously on a part of the second end face 42 and a part of the bottom face 45.

[0020] The coil 5 is a sintered body of a photosensitive conductive paste containing conductive powder such as Ag or Cu. The coil 5 is spirally wound along the lamination direction of the insulating layers 40. A first end 5a of the coil 5 is exposed from a first end surface 41 of the element body 4 and is connected to a first external electrode 6a. A second end 5b of the coil 5 is exposed from a second end surface 42 of the element body 4 and is connected to a second external electrode 6b.

[0021] The coil 5 is formed in a rectangular shape when viewed in the axial direction, but is not limited to this shape. The shape of the coil 5 may be, for example, a circle, an ellipse, a rectangle, or another polygon. The axial direction of the coil 5 is parallel to the Z direction, and the coil 5 is wound along the axial direction. The axis of the coil 5 refers to the central axis of the spiral shape of the coil 5.

[0022] The coil 5 has multiple coil wires 2 stacked along the axial direction and via wires (not shown) that extend along the axial direction and connect adjacent coil wires 2 in the axial direction. The multiple coil wires 2 are each wound along a plane, arranged side by side in the axial direction, and electrically connected in series to form a spiral.

[0023] The coil wiring 2 is wound on the main surface (XY plane) of the insulating layer 40, which is orthogonal to the axial direction. The number of turns of the coil wiring 2 is less than one, but may be one or more. The via wiring is provided in the via hole 3 of the insulating layer 40, and penetrates the insulating layer 40 in the thickness direction (Z direction). Adjacent coil wirings 2 in the stacking direction are electrically connected in series through the via wiring.

[0024] In such a multilayer electronic component 10, insulating layers 40 and patterned layers of photosensitive conductive paste are alternately stacked in multiple layers, and each of the multiple insulating layers 40 and multiple patterned layers of photosensitive conductive paste is sintered. As a result, the element body 4 is formed from the multiple insulating layers 40, and the coil 5 is formed from the multiple patterned layers of photosensitive conductive paste.

[0025] (Detailed composition of photosensitive conductive paste) Next, the detailed configuration of the photosensitive conductive paste used to form the coil 5 will be described. FIG. 3 is a cross-sectional view schematically showing the photosensitive conductive paste. Note that, although the photosensitive conductive paste used to form the coil 5 of the multilayer electronic component 10, which is a multilayer coil component, will be described below, the photosensitive conductive paste of the present disclosure is not limited to this and can be used to form internal electrodes of various multilayer electronic components such as multilayer capacitor components and multilayer LC composite components. For example, in the case of a multilayer capacitor component, the photosensitive conductive paste of the present disclosure can be used to form capacitor electrodes.

[0026] 3, the photosensitive conductive paste 20 contains a conductive powder 21, a photosensitive organic component 22, and a dispersant (not shown). Specifically, the conductive powder 21 and the dispersant are contained in the photosensitive organic component 22. The conductive powder 21 is coated with glass 23 having a glass softening point (Ts) of 800°C or lower.

[0027] The conductive powder 21 is sintered during firing, and the sintered body becomes the conductor of the coil 5. There are no particular limitations on the type of conductive powder 21, but Ag powder or Cu powder is preferred in order to reduce the electrical resistance of the formed coil 5. The content of the conductive powder 21 coated with glass 23 relative to the photosensitive conductive paste 20 is preferably 65% ​​by weight or more and 90% by weight or less. From the perspective of suppressing shrinkage of the photosensitive conductive paste 20 during firing, the content of the conductive powder 21 coated with glass 23 relative to the photosensitive conductive paste 20 is more preferably 70% by weight or more and 85% by weight or less.

[0028] Although there are no particular limitations on the average particle size D50 (median diameter) of the conductive powder 21, it is preferable that the average particle size D50 of the conductive powder 21 be 1.0 μm or more and 5.0 μm or less from the viewpoint of forming a fine pattern of the coil 5. In this specification, the average particle size D50 is a value measured using a laser diffraction particle size distribution measuring device (MT3000 manufactured by Microtrack Bell).

[0029] The conductive powder 21 is preferably atomized Ag powder. This allows the conductive powder 21 to have a larger crystallite size than Ag powder produced by the wet reduction method, and reduces organic impurities. This reduces the electrical resistance of the formed coil 5. The average particle size D50 of the atomized Ag powder is preferably 1.0 μm or more and 5.0 μm or less. This allows the formation of a fine coil 5 pattern.

[0030] The glass 23 inhibits sintering of the conductive powder 21 in the firing temperature range up to the glass softening point (Ts) of the glass 23, while at the firing temperature range above the glass softening point (Ts) of the glass 23, causing a liquid phase sintering phenomenon to promote sintering of the conductive powder 21. The type of glass 23 is not particularly limited as long as the glass softening point (Ts) is 800°C or less. The glass 23 may be, for example, a SiO2-K2O-B2O3-based glass containing SiO2, B2O3, and K2O in a predetermined ratio. The content of the glass 23 is preferably 1.0 wt% or more, more preferably 5.0 wt% or more, relative to the conductive powder 21. The content of the glass 23 is preferably 20 wt% or less, more preferably 10 wt% or less, relative to the conductive powder 21.

[0031] It is preferable that the glass 23 completely covers the conductive powder 21 (i.e., a coverage of 100%), but complete coverage is not required. The coverage of the glass 23 relative to the surface area of ​​the conductive powder 21 is preferably 1.0% or more, and more preferably 50% or more. This more reliably suppresses the shrinkage of the internal electrodes during firing and reduces the electrical resistance of the coil 5. The coverage can be measured, for example, by observing a cross section of the photosensitive conductive paste 20 using an electron microscope.

[0032] The photosensitive conductive paste 20 may contain a metal resinate, which is a metal resinate containing a metal having a melting point higher than that of the conductive powder 21. Examples of metals contained in the metal resinate include Rh, Ni, Cu, Mn, and Zr. Examples of such metal resinates include metal octylates, naphthenates, 2-ethylhexane salts, sulfonates, metal mercaptides, and alkoxy metal compounds.

[0033] The photosensitive organic component 22 includes an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The content of the photosensitive organic component 22 is preferably 10% by weight or more, and more preferably 15% by weight or more, relative to the photosensitive conductive paste 20. The content of the photosensitive organic component 22 is preferably 30% by weight or less, and more preferably 20% by weight or less, relative to the photosensitive conductive paste 20.

[0034] The alkali-soluble polymer is neutralized with a basic compound and solubilized. The alkali-soluble polymer is removed, for example, during development using an alkaline developer, along with the uncured photopolymerizable monomer and the conductive powder 21. When the photopolymerizable monomer is polymerized by active energy rays, the alkali-soluble polymer present in the vicinity forms a film with the photopolymerizable monomer, forming, for example, part of the internal electrode pattern. This can further improve the adhesion of the internal electrode pattern to the insulating layer. The content of the alkali-soluble polymer is preferably 10% by weight or more, more preferably 20% by weight or more, relative to the photosensitive organic component 22. The content of the alkali-soluble polymer is preferably 50% by weight or less, more preferably 60% by weight or less, relative to the photosensitive organic component 22.

[0035] The alkali-soluble polymer has at least one acid group in a side chain. The acid group is typically a carboxy group. The alkali-soluble polymer includes a polymer chain having at least one of a carbon-carbon bond, an ether bond, a urea bond, an ester bond, and a urethane bond as a main chain. From the viewpoint of transparency, the main chain of the alkali-soluble polymer may include a polymer chain having a carbon-carbon bond.

[0036] An alkali-soluble polymer having at least one carboxy group in a side chain and a polymer chain having a carbon-carbon bond as a main chain can be obtained, for example, by copolymerizing an unsaturated carboxylic acid with an ethylenically unsaturated compound. A typical example of the alkali-soluble polymer is a carboxy group-containing acrylic polymer.

[0037] Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, vinylacetic acid, and dimers and anhydrides thereof.

[0038] Examples of ethylenically unsaturated compounds include acrylic acid esters such as methyl acrylate, ethyl acrylate, butyl acrylate, isobutyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, and isobornyl acrylate; methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, and isobornyl methacrylate; fumaric acid esters such as monoethyl fumarate; and styrene.

[0039] The carboxy group of the alkali-soluble polymer may be introduced after the main chain is formed, for example, by reacting a compound having an epoxy group in a side chain and the above-mentioned polymer chain with an unsaturated monocarboxylic acid, and then further reacting the compound with a saturated or unsaturated polycarboxylic acid anhydride.

[0040] The alkali-soluble polymer may have an unsaturated bond, which may be introduced, for example, by adding a monomer having a polymerizable functional group (typically, an epoxy group) that is capable of reacting with a carboxyl group in a side chain of the alkali-soluble polymer.

[0041] The weight average molecular weight (Mw) of the alkali-soluble polymer may be 5,000 or more and 50,000 or less. The acid value of the alkali-soluble polymer may be 30 or more and 150 or less.

[0042] The photosensitive monomer reacts with the photopolymerization initiator to generate a monomer radical. The monomer radical polymerizes to generate a polymer. The content of the photosensitive monomer is preferably 10% by weight or more, more preferably 20% by weight or more, based on the photosensitive organic component 22. The content of the photosensitive monomer is preferably 50% by weight or less, more preferably 40% by weight or less, based on the photosensitive organic component 22.

[0043] The photosensitive monomer is not limited as long as it has at least one reactive group that undergoes a radical reaction. Examples of the radical reactive group include at least one selected from the group consisting of an acrylamide group, an acryloyl group, a methacryloyl group, an allyl group, a vinyl group, a styryl group, and a mercapto group. The photosensitive monomer may have at least one (meth)acryloyl group as the radical reactive group. The "(meth)acryloyl group" refers to an acryloyl group and / or a methacryloyl group.

[0044] Examples of photosensitive monomers having a (meth)acryloyl group include monofunctional (meth)acrylate monomers such as stearyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, tridecyl (meth)acrylate, caprolactone (meth)acrylate, and ethoxylated nonylphenol (meth)acrylate; tripropylene glycol di(meth)acrylate, and isocyanuric acid EO-modified di(meth)acrylate. Difunctional (meth)acrylate monomers such as acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, and propoxylated neopentyl glycol di(meth)acrylate; glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, and ethoxylated trimethylol Trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, propoxylated glyceryl tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, caprolactone-modified tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, hexanediol tri(meth)acrylate trifunctional (meth)acrylate monomers such as tripropylene glycol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, and EO-modified trimethylolpropane tri(meth)acrylate; tetrafunctional (meth)acrylate monomers such as pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, tripentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and ethoxylated pentaerythritol tetra(meth)acrylate;Examples of the methacrylate monomer include pentafunctional (meth)acrylate monomers such as dipentaerythritol penta(meth)acrylate, tripentaerythritol penta(meth)acrylate, and dipentaerythritol monohydroxypenta(meth)acrylate; hexafunctional (meth)acrylate monomers such as dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, and tripentaerythritol hexa(meth)acrylate; and heptafunctional or higher (meth)acrylate monomers such as tripentaerythritol hepta(meth)acrylate and tripentaerythritol octa(meth)acrylate.

[0045] The photosensitive monomer may be a trifunctional or higher (meth)acrylate monomer, a tetrafunctional or higher (meth)acrylate monomer, or a pentafunctional or higher (meth)acrylate monomer. The photosensitive monomer may be dipentaerythritol monohydroxypenta(meth)acrylate.

[0046] The photopolymerization initiator generates highly reactive radicals in response to active energy rays. The radicals add to the photosensitive monomer, causing an initiation reaction of the photosensitive monomer. The radicals are generated in a chain reaction, eventually producing a polymer derived from the photosensitive monomer. The content of the photopolymerization initiator is preferably 0.5% by weight or more, more preferably 1.0% by weight or more, based on the photosensitive organic component 22. The content of the photopolymerization initiator is preferably 10% by weight or less, more preferably 5.0% by weight or less, based on the photosensitive organic component 22.

[0047] Examples of the photopolymerization initiator include at least one selected from the group consisting of benzoin or benzoin ether compounds, alkylphenone compounds, benzophenone compounds, oxime ester compounds, acylphosphine oxide compounds, and α-ketoester compounds.

[0048] Examples of the benzoin or benzoin ether-based photopolymerization initiator include benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin phenyl ether, methylbenzoin, ethylbenzoin, and benzyl dimethyl ketal.

[0049] Examples of the alkylphenone-based photopolymerization initiator include an α-hydroxyalkylphenone-based compound and an α-aminoalkylphenone-based compound. Specific examples of α-aminoalkylphenone compounds include 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, and 2-methyl-2-morpholino(4-thiomethylphenyl)propan-1-one. Specific examples of α-hydroxyalkylphenone compounds include 2-hydroxy-2-methylpropiophenone, diethoxyacetophenone, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl] ... 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one, 1,1'-(oxybis(4,1-phenylene))bis(2-hydroxy)-2-methylpropan-1-one, 2,2-dimethoxy-2-phenylacetophenone, oligo{2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane}, 4-(2-acryloyl-oxyethoxy)phenyl-2-hydroxy-2-propyl ketone.

[0050] Examples of the benzophenone-based photopolymerization initiator include benzophenone, methylbenzophenone, benzoylbenzoic acid, methyl o-benzoylbenzoate, 2-n-butoxy-4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, 4-phenylbenzophenone, 4,4'-bisdiethylaminobenzophenone, 3,3'-dimethyl-4-methoxybenzophenone, (1-[4-(4-benzoylphenylsulfanyl)phenyl]-2-methyl-2-(4-methylphenylsulfonyl)propan-1-one, 4-(4-methylphenithio)benzophenone, methyl-o-benzoylbenzoate, 4,4'-dichlorobenzophenone, hydroxybenzophenone, Examples of the thioxanthone compounds include benzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, acrylated benzophenone, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 3,3'-dimethyl-4-methoxybenzophenone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, isopropylthioxanthone, and 2,4-dichlorothioxanthone; Michler's ketone, 4,4'-bisdiethylaminobenzophenone, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, and benzophenone derivative polymers.

[0051] Examples of the oxime ester photopolymerization initiator include 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime), and the like.

[0052] Examples of the acylphosphine oxide photopolymerization initiator include 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, and ethyl(2,4,6-trimethylbenzoyl)-phenylphosphineate.

[0053] Examples of the α-ketoester photopolymerization initiator include methylbenzoyl formate, 2-(2-oxo-2-phenylacetoxyethoxy)ethyl ester of oxyphenylacetic acid, and 2-(2-hydroxyethoxy)ethyl ester of oxyphenylacetic acid.

[0054] The photopolymerization initiator may be an alkylphenone compound, an α-aminoalkylphenone compound, or 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one.

[0055] The solvent is not particularly limited, and examples thereof include ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monoethylhexyl ether, propylene glycol monobutyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, propylene glycol monophenyl ether, ethyl acetate, butyl acetate, pentyl acetate, hexyl acetate, and cyclohexanol acetate. The content of the solvent is preferably 20% by weight or more, and more preferably 30% by weight or more, relative to the photosensitive organic component 22. The content of the solvent is preferably 60% by weight or less, and more preferably 50% by weight or less, relative to the photosensitive organic component 22. The photosensitive organic component 22 may further contain additives such as a sensitizer, an antifoaming agent, and an anti-settling agent.

[0056] The dispersant is not particularly limited, and may be, for example, a polycarboxylic acid-based polymer dispersant. The content of the dispersant is preferably 0.1% by weight or more, and more preferably 0.2% by weight or more, relative to the photosensitive conductive paste 20. The content of the dispersant is preferably 5.0% by weight or less, and more preferably 1.0% by weight or less, relative to the photosensitive conductive paste 20.

[0057] Since the photosensitive conductive paste 20 does not contain any co-materials, it can reduce powdery components compared to conventional photosensitive conductive pastes, thereby improving resolution during photolithography patterning. Furthermore, because the conductive powder 21 is coated with the glass 23, sintering of the conductive powder 21 is suppressed until the firing temperature reaches the glass softening point (Ts) of the glass 23. This reduces the shrinkage rate of the coil 5 (internal electrode) during firing. As a result, it is possible to suppress delamination, a structural defect that can occur between the coil 5 and the element body 4 during firing. Furthermore, when the firing temperature exceeds the glass softening point (Ts), sintering of the conductive powder 21 is promoted by liquid-phase sintering. This reduces the electrical resistance of the coil 5 after firing compared to conventional techniques.

[0058] Fig. 4 is a diagram illustrating the effect of suppressing delamination and reducing the electrical resistance of the internal electrodes. In Fig. 4, L1 shows the relationship between the firing temperature and shrinkage rate for the element body 4. L2 shows the relationship between the firing temperature and shrinkage rate for internal electrodes using a conventional photosensitive conductive paste with a co-agent added. L3 shows the relationship between the firing temperature and shrinkage rate for internal electrodes using the photosensitive conductive paste of the present disclosure. L4 shows the relationship between the firing temperature and shrinkage rate for internal electrodes using a photosensitive conductive paste not covered with glass 23.

[0059] As shown in L3, in the present disclosure, the conductive powder 21 is coated with the glass 23, so that shrinkage of the internal electrodes is suppressed until the firing temperature reaches the glass softening point (Ts) of the glass 23. Therefore, the difference between the shrinkage rate of the element body 4 and the shrinkage rate of the internal electrodes does not become excessively large, and delamination between the element body 4 and the internal electrodes can be suppressed. On the other hand, when the firing temperature exceeds the glass softening point (Ts) of the glass 23, shrinkage of the internal electrodes progresses. In other words, liquid phase sintering promotes sintering of the conductive powder 21. As a result, the electrical resistance of the internal electrodes is reduced compared to conventional methods. Note that when the firing temperature exceeds the glass softening point (Ts) of the glass 23, shrinkage also progresses in the element body 4, so delamination is suppressed even in this temperature range.

[0060] In contrast, as shown in L2, in the conventional technology, the addition of a co-agent suppresses the shrinkage of the internal electrodes during firing. However, in the conventional technology, the co-agent prevents the internal electrodes from shrinking even when the firing temperature is high, and the conductive powder does not sinter. As a result, the electrical resistance of the internal electrodes does not decrease sufficiently. Furthermore, as shown in L4, if the conductive powder 21 is not covered with glass 23, the internal electrodes shrink significantly immediately after firing begins, and the difference between the shrinkage rate of the element 4 and the shrinkage rate of the internal electrodes becomes excessively large. As a result, delamination may occur between the element 4 and the internal electrodes.

[0061] Preferably, the refractive index of the glass 23 is 1.60 or less. This configuration allows the refractive index of the glass 23 to be close to the refractive index of the photosensitive organic component 22. This makes it possible to suppress light scattering during photolithographic patterning of the photosensitive conductive paste 20, thereby further improving the resolution during photolithographic patterning.

[0062] Preferably, the glass softening point (Ts) of the glass 23 is 650° C. or more and 800° C. or less. According to this configuration, the electrical resistance of the coil 5 can be reduced, and the shrinkage rate of the coil 5 during firing can be further reduced.

[0063] Preferably, the glass 23 is SiO2: 15% by mass or more and 90% by mass or less, B2O3: 10% by mass or more and 50% by mass or less, Al2O3: 3% by mass or more and 15% by mass or less, KF: 10% by mass or more and 30% by mass or less, and At least one selected from the group consisting of Li2O, Na2O, and K2O is contained in an amount of 2% by mass to 20% by mass. This configuration reduces the electrical resistance of the coil 5, further reduces the shrinkage rate of the coil 5 during firing, and further improves the resolution during photolithographic patterning.

[0064] Preferably, the glass 23 has a glass softening point (Ts) of 550°C or higher and a refractive index of 1.60 or lower. This configuration can reduce the electrical resistance of the coil 5, further reduce the shrinkage rate of the coil 5 during firing, and further improve the resolution during photolithographic patterning.

[0065] Preferably, the multilayer electronic component 10 includes an element body 4 containing borosilicate glass and an inorganic filler, and a coil 5 that is provided within the element body 4 and is a sintered body of the photosensitive conductive paste 20. This configuration makes it possible to obtain a multilayer electronic component 10 that has a desired shape, has a coil 5 with low electrical resistance, and is suppressed from suffering from structural defects that may occur due to shrinkage of the coil 5 during firing.

[0066] Preferably, the coil 5 contains glass 23, Glass 23 is SiO2: 15% by mass or more and 90% by mass or less, B2O3: 10% by mass or more and 50% by mass or less, Al2O3: 3% by mass or more and 15% by mass or less, KF: 10% by mass or more and 30% by mass or less, and The composition contains 2% by mass or more and 20% by mass or less of at least one selected from the group consisting of Li2O, Na2O, and KO. This configuration makes it possible to obtain a multilayer electronic component 10 having a desired shape, a coil 5 with even lower electrical resistance, and in which structural defects that may occur due to shrinkage of the coil 5 during firing are further suppressed.

[0067] (Manufacturing method for multilayer electronic components) Next, a method for manufacturing the multilayer electronic component 10 will be described. The method for manufacturing the multilayer electronic component 10 includes the steps of: laminating the photosensitive conductive paste 20 on the insulating layer 40; sintering the photosensitive conductive paste 20 and the insulating layer 40 at a firing temperature equal to or higher than the glass softening point (Ts); A coil 5 (internal electrode) is formed from the photosensitive conductive paste 20, The element body 4 is formed from the insulating layer 40, A coil 5 is provided within the element body 4 .

[0068] According to the above manufacturing method, it is possible to reduce the shrinkage rate of the coil 5 during firing, improve the resolution during photolithographic patterning, and reduce the electrical resistance of the coil 5 after firing.

[0069] Preferably, in the sintering step, a portion of the glass 23 is enclosed within the coil 5. With this configuration, the linear expansion coefficient of the coil 5 and the linear expansion coefficient of the element body 4 can be made closer to each other.

[0070] An example of a method for manufacturing a multilayer electronic component 10 using the photosensitive conductive paste 20 of the present disclosure will now be described in detail.

[0071] As shown in Fig. 2, a photosensitive glass paste serving as a photosensitive insulating paste is screen-printed onto a support film such as a PET film, dried, and then exposed to light. This process is repeated several times to obtain an insulating layer (glass layer) 40 of a predetermined thickness (e.g., about 100 µm). Note that the support film is omitted from Fig. 2.

[0072] Photosensitive insulating pastes such as photosensitive glass pastes contain an insulating inorganic component and a photosensitive organic component. The photosensitive glass paste contains, for example, glass powder and ceramic aggregate (inorganic filler) as the insulating inorganic component, and contains, for example, an alkali-soluble polymer, a photosensitive monomer, and a photopolymerization initiator as the photosensitive organic component. The photosensitive organic component may also contain other components such as a solvent, an organic dye, and an antifoaming agent.

[0073] The type of glass powder contained in the photosensitive insulating paste is not particularly limited, but for example, SiO2-B2O3-K2O glass containing SiO2, B2O3, and K2O in a predetermined ratio can be used. Two or more types of glass powders can be mixed and used. The average particle size of the glass powder is not particularly limited, but is preferably 0.1 μm or more and 5.0 μm or less.

[0074] The type of ceramic aggregate contained in the photosensitive insulating paste is not particularly limited, but alumina, for example, can be used. Two or more types of ceramic aggregates may be mixed and used. The average particle size of the ceramic aggregate is not particularly limited, but is preferably 0.1 μm or more and 5.0 μm or less.

[0075] The insulating layer 40 may be produced by laminating green sheets that have been formed into sheets in advance.

[0076] The photosensitive conductive paste of the present disclosure is screen-printed onto the insulating layer 40 to a film thickness of approximately 5 μm or more and 10 μm or less, and after drying, the photosensitive conductive paste is selectively exposed to light and developed to form the first layer of coil wiring 2.

[0077] Photosensitive glass paste is screen-printed over the entire surface of the first-layer coil wiring 2 to a thickness of about 15 μm, and then dried. Next, the photosensitive glass paste is selectively exposed to light and developed to form via holes 3 at predetermined locations in the insulating layer 40 formed on the first-layer coil wiring 2.

[0078] The photosensitive conductive paste of the present disclosure is again screen-printed over the entire surface to a film thickness of approximately 5 μm or more and 10 μm or less, and after drying, the photosensitive conductive paste is selectively exposed and developed to form the second layer of coil wiring 2.

[0079] Then, the insulating layers 40 and the coil wiring 2 are repeatedly stacked until the desired number of layers is obtained.

[0080] Furthermore, the entire surface printing of the photosensitive glass paste, drying, and entire surface exposure are repeated as many times as necessary to form an insulating layer 40 on the top layer of coil wiring 2. This results in a laminated structure formed by interlayer connection of the coil wiring 2 through the via holes 3.

[0081] The resulting laminated structure is divided into chip shapes using a dicer, and then the support film, such as a PET film, is separated. The photosensitive conductive paste is then fired at a temperature equal to or higher than the glass softening point of the glass that coats the conductive powder in the photosensitive conductive paste. This firing sinters the photosensitive conductive paste, forming coil 5. Furthermore, insulating layer 40 is sintered, forming element body 4. By firing at a temperature equal to or higher than the glass softening point, some of the glass that coated the conductive powder is expelled into the element body, but some remains embedded within coil 5.

[0082] The first external electrode 6a and the second external electrode 6b are formed on the fired laminate. Furthermore, a plating layer having a single layer or a multilayer structure may be applied to the outer surfaces of the first external electrode 6a and the second external electrode 6b by electrolytic plating, electroless plating, or the like.

[0083] As a result of the above, the multilayer electronic component 10 shown in FIG. 1 is obtained.

[0084] The present disclosure is not limited to the above-described embodiments, and design modifications are possible within the scope of the present disclosure.

[0085] (Example) The present disclosure will be described in more detail below with reference to examples. However, the present disclosure is not limited to the following examples, and it is of course possible to make appropriate modifications within the scope applicable to the above and below-described aims, and all such modifications are included within the technical scope of the present disclosure.

[0086] (1) Preparation of photosensitive conductive paste The raw materials were blended in the proportions shown in Table 1 and thoroughly mixed to obtain a photosensitive resin as the photosensitive organic component.

[0087] [Table 1]

[0088] A photosensitive conductive paste for forming internal electrodes was obtained by mixing glass-coated conductive powder with other ingredients in the proportions shown in Table 2 and thoroughly mixing the mixture using a triple roll mill. The conductive powder used was Ag powder with an average particle size D50 of 2.0 μm.

[0089] [Table 2]

[0090] Table 3 shows a list of the glass materials used to coat the conductive powder. The coated glass components can be identified by elemental analysis such as powder fluorescence spectroscopy, ICP, and SEM-WDX. The glass softening point of the identified glass component was measured by preparing a glass frit sample of the same composition and measuring the viscosity coefficient η = 10 using a Littleton viscometer. 7 The refractive index of glass can also be measured from a glass frit sample using the minimum deviation method.

[0091] Methods for coating conductive powder with glass include the sol-gel method, spray coating, mechanofusion, chemical vapor deposition (CVD), atomic layer deposition (ALD), etc. Glass-coated conductive powder obtained by each method under conditions that allow the formation of a glass component layer of the desired thickness can be used in the paste.

[0092] [Table 3]

[0093] As comparative examples, a conventional photosensitive conductive paste containing Ag powder that was not coated with glass, and a conventional photosensitive conductive paste containing Ag powder that was not coated with glass and the metal oxide Al2O3 (common material) were prepared.

[0094] (2) Preparation and measurement of resistivity evaluation samples The photosensitive conductive paste prepared by the above method was screen-printed onto an alumina substrate to a thickness of 10 μm to 20 μm, dried, and then exposed to light through a photomask bearing a wiring pattern. The resulting wiring pattern was then fired at 900°C to create electrode wiring for resistance measurement. The resistance, line width, line length, and film thickness of the resulting wiring sample were measured. The resistivity was calculated based on the Ag volume, which was calculated by subtracting the glass volume from the calculated wiring volume. Resistivity values ​​of 2.2 μΩ·cm or less were rated as ◯ (good, acceptable), 1.9 μΩ·cm or less as ◎ (better, acceptable), and values ​​above 2.2 Ω·cm as × (failure).

[0095] (3) Preparation and measurement of firing shrinkage evaluation samples The photosensitive conductive paste prepared by the above method was printed on a smooth substrate using a screen with a dot pattern and then dried. The volume of the resulting paste dot pattern was calculated using a laser displacement meter. These dot patterns were then heat-treated at 500°C and 700°C. The volume of the dot pattern of the sample heat-treated at each temperature was again calculated using the laser displacement meter. Based on the volume values ​​before and after heat treatment, the percentage volume reduction due to heat treatment was calculated, and this value was taken as the firing shrinkage.

[0096] If the photosensitive conductive paste has a large shrinkage rate at 500°C and 700°C, when it is used as an internal electrode for a multilayer coil component, the shrinkage behavior will differ significantly from that of the base material, making it more likely to cause delamination. Therefore, it is preferable that the shrinkage rate at each temperature be as small as possible. A shrinkage rate of less than 20% at 500°C was rated as ⊚ (pass, better), a rate of 20% or more but less than 30% was rated as ◯ (pass, good), and a rate of 30% or more was rated x (fail). A shrinkage rate of less than 30% at 700°C was rated as ⊚ (pass, better), a rate of 30% or more but less than 40% was rated as ◯ (pass, good), and a rate of 40% or more was rated x (fail).

[0097] (4) Resolution evaluation The photosensitive conductive paste was screen-printed onto an alumina substrate and then dried at 60°C for 30 minutes to form a 10 μm-thick photosensitive conductive paste film. Next, the substrate was irradiated with light from an ultra-high pressure mercury lamp (manufactured by Ushio Inc.) at 1000 mJ / cm through a photomask with a linear pattern of L / S = 25 / 25 μm. 2 The photosensitive conductive paste film was subjected to a mask exposure process by irradiating it with light at 405 nm, and then developed with an aqueous triethanolamine solution. (4-1) Patterning ability Those that were formed without residue or skipped lines were rated as "○ (pass)", and those that had skipped lines were rated as "× (fail)". (4-2) Line thickness When the line width of the patterned wiring was measured using a confocal microscope (Optelics, manufactured by Lasertec Corporation) and the value was taken as X, the line thickness was calculated as X-25. The smaller the line thickness, the closer the wiring dimensions to the opening width of the photomask, which is preferable. In this specification, the ability to form a desired shape with high precision using the above-mentioned photolithography method may be referred to as having excellent resolution.

[0098] The measurement results are shown in Table 4. Compared to the comparative example, in the example using glass-coated conductive powder, the sintering-suppressing effect of Ag was observed up to the temperature at which the glass was sufficiently softened, thereby mitigating electrode shrinkage during firing. Furthermore, after the glass softening process begins, the sintering-promoting effect of the conductive powder (liquid-phase sintering) was observed, resulting in lower electrode resistance after firing compared to compositions containing co-materials such as metal oxides. Furthermore, in the example, the specific surface area of ​​the Ag powder and the powder components did not increase, improving photolithography patterning properties. Regarding the characteristics of the coating glass component, a glass softening point Ts in the range of 600°C to less than 800°C was found to be favorable in terms of firing shrinkage and resistivity, and a low refractive index of 1.60 or less was even more preferable in terms of line thickening during photolithography. The photosensitive conductive paste of the present disclosure was found to achieve a good balance of high wiring formation accuracy, low resistivity, and suppression of delamination after firing when applied to internal electrodes for electronic components.

[0099] Specifically, in Examples 1 to 6, which used a photosensitive conductive paste containing glass-coated conductive powder, it was found that firing shrinkage was small and delamination could be suppressed at both 500°C and 700°C firing temperatures. Furthermore, in Examples 1 to 6, the resistivity after firing was low, and both patternability and line thickening were good, indicating that resolution during photolithography patterning could be improved. In particular, in Examples 1 to 4, in which the glass softening point Ts was 650°C or higher and 800°C or lower, it was found that shrinkage could be further suppressed even at a firing temperature of 700°C while reducing the resistivity after firing, thereby further suppressing the occurrence of delamination. Furthermore, in Examples 1 to 5, in which the glass refractive index was 1.60 or lower, line thickening was 12 μm or less, indicating that resolution during photolithography patterning could be further improved.

[0100] In contrast, in Comparative Example 1, although the resistivity after firing was good, the conductive powder was not coated with glass, and therefore the firing shrinkage was large at firing temperatures of both 500° C. and 700° C. In Comparative Example 2, although the firing shrinkage was small at firing temperatures of both 500° C. and 700° C. due to the co-material, the resistivity was large and the patterning ability was poor.

[0101] [Table 4]

[0102] <1> The composition includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent, The photosensitive conductive paste, wherein the conductive powder is coated with glass having a glass softening point (Ts) of 800°C or less. <2> The refractive index of the glass is 1.60 or less. <1> The photosensitive conductive paste according to claim 1. <3> The glass softening point (Ts) is 650°C or higher and 800°C or lower. <1> or <2> The photosensitive conductive paste according to claim 1. <4> The glass softening point (Ts) is 550°C or higher, The refractive index of the glass is 1.60 or less. <1> or <2> The photosensitive conductive paste according to claim 1. <5> The conductive powder is atomized Ag powder. <1> from <4> 10. The photosensitive conductive paste according to claim 9, wherein the photosensitive conductive paste is a photosensitive conductive paste. <6> The atomized Ag powder has an average particle size D50 of 1.0 μm or more and 5.0 μm or less. <5> The photosensitive conductive paste according to claim 1. <7> <1> from <6> a step of laminating the photosensitive conductive paste according to any one of the above on an insulating layer; sintering the photosensitive conductive paste and the insulating layer at a firing temperature equal to or higher than the glass softening point (Ts); forming an internal electrode from the photosensitive conductive paste; forming an element body from the insulating layer; The method for manufacturing a multilayer electronic component includes providing the internal electrodes within the element body. <8> In the sintering step, a part of the glass is included in the internal electrode. <7> A method for producing the multilayer electronic component according to claim 1. <9> an element containing borosilicate glass and an inorganic filler; provided within the element body, <1> from <6> and an internal electrode which is a sintered body of the photosensitive conductive paste according to any one of the above items. <10> the internal electrode includes the glass therein; The glass is SiO2: 15% by mass or more and 90% by mass or less, B2O3: 10% by mass or more and 50% by mass or less, Al2O3: 3% by mass or more and 15% by mass or less, KF: 10% by mass or more and 30% by mass or less, and At least one selected from the group consisting of Li2O, Na2O, and K2O: 2% by mass or more and 20% by mass or less; <9> The multilayer electronic component according to claim 1. [Explanation of symbols]

[0103] 2 Coil wiring 3. Beer Hall 4 Base 5 coils 5a 1st end 5b 2nd end 6a 1st external electrode 6b 2nd external electrode 10 Multilayer electronic components 20 Photosensitive conductive paste 21 Conductive powder 22 Photosensitive organic components 23 Glass 40 insulating layer 41, 42 1st end face, 2nd end face 43, 44 1st side, 2nd side 45 bottom 46 Top

Claims

1. A conductive powder comprising Ag or Cu, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent, the conductive powder is coated with glass having a glass softening point (Ts) of 650°C or higher and 800°C or lower; A photosensitive conductive paste, wherein the coverage of the glass with respect to the surface area of ​​the conductive powder is 50% or more.

2. 2. The photosensitive conductive paste according to claim 1, wherein the refractive index of said glass is 1.60 or less.

3. The glass softening point (Ts) is 550°C or higher, 2. The photosensitive conductive paste according to claim 1, wherein the refractive index of said glass is 1.60 or less.

4. 3. The photosensitive conductive paste according to claim 1, wherein the conductive powder is atomized Ag powder.

5. 5. The photosensitive conductive paste according to claim 4, wherein the atomized Ag powder has an average particle size D50 of 1.0 μm or more and 5.0 μm or less.

6. A step of laminating the photosensitive conductive paste according to claim 1 or 2 on an insulating layer; sintering the photosensitive conductive paste and the insulating layer at a firing temperature equal to or higher than the glass softening point (Ts); forming an internal electrode from the photosensitive conductive paste; forming an element body from the insulating layer; The method for manufacturing a multilayer electronic component includes providing the internal electrodes within the element body.

7. The method for producing a multilayer electronic component according to claim 6 , wherein in the sintering step, a part of the glass is enclosed in the internal electrodes.

8. an element containing borosilicate glass and an inorganic filler; 3. A multilayer electronic component comprising: an internal electrode provided within the base body and comprising a sintered body of the photosensitive conductive paste according to claim 1.

9. the internal electrode includes the glass therein; The glass is SiO2: 15% by mass or more and 90% by mass or less, B2O3: 10% by mass or more and 50% by mass or less, Al2O3: 3% by mass or more and 15% by mass or less, KF: 10% by mass or more and 30% by mass or less, and 9. The multilayer electronic component according to claim 8, comprising at least one selected from the group consisting of Li2O, Na2O, and K2O: 2% by mass or more and 20% by mass or less.

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