Film forming apparatus, program, method for evaluating position detection accuracy, and method for manufacturing electronic device

Abstract

To evaluate position detection accuracy of a mark for alignment.SOLUTION: There is provided a deposition apparatus. Detection means executes detection processing for detecting a position of a substrate mark provided on a substrate, and a position of a mask mark provided on a mask. Positioning means executes relative positioning between the substrate and the mask based on a result of the detection processing by the detection means. Calculation means executes statistic processing to the result of multiple times of detection processing executed by the detection means in the state where the substrate and the mask are stood still.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus, a program, a method for evaluating position detection accuracy, and a method for manufacturing an electronic device. [Background technology]

[0002] In the manufacture of organic EL display devices (organic EL displays), alignment between the substrate and the mask is performed when a deposition material is deposited on the substrate using a deposition mask. The alignment between the substrate and the mask is sometimes performed using alignment marks formed on the substrate or the mask. Patent Document 1 discloses that deviations of the position and angle of the substrate from a reference are calculated from captured images of alignment marks formed on the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-010504 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned conventional techniques do not consider the accuracy of calculating deviations of the positions of the substrate and mask from a reference, or even the accuracy of detecting the positions of the substrate and mask used for the calculation. If this detection accuracy is low, the alignment accuracy between the substrate and the mask may be reduced. As a result, the deposition position of the deposition material on the substrate may vary, potentially resulting in a reduction in product quality. Therefore, it is necessary to understand the detection accuracy of the position of the alignment mark.

[0005] The present invention provides a technique for evaluating the detection accuracy of the position of an alignment mark. [Means for solving the problem]

[0006] According to the present invention, there are provided a detection means for executing a detection process for detecting the positions of substrate marks provided on a substrate and the positions of mask marks provided on a mask, a position adjustment means for adjusting the relative positions of the substrate and the mask based on the results of the detection process by the detection means, and a calculation means for performing statistical processing on the results of the detection process executed multiple times by the detection means while the substrate and the mask are kept stationary. an adjustment means for adjusting the detection means when the result of the statistical processing by the calculation means does not satisfy a standard; A film forming apparatus comprising: [Effects of the Invention]

[0007] According to the present invention, it is possible to evaluate the detection accuracy of the alignment mark position. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram illustrating a portion of a configuration of a manufacturing line for electronic devices according to an embodiment. [Figure 2] FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment. [Figure 3] FIG. 3 is a diagram showing an example of the hardware configuration of the film forming apparatus of FIG. 2. [Figure 4] 4(a) to 4(c) are plan views showing examples of the configuration of a mask and a substrate. [Figure 5] FIG. 2 is a diagram schematically illustrating an alignment process performed by a film forming apparatus. [Figure 6] 5A to 5C are diagrams illustrating an example of a fine alignment process. [Figure 7] 1A is a diagram illustrating an aspect of pattern matching for identifying the position of a mask fine mark, and FIG. 1B is a diagram showing an example of a model mark. [Figure 8] 10 is a flowchart showing an example of processing by a processing unit. [Figure 9] 10A and 10B are flowcharts showing an example of processing by a processing unit. [Figure 10] 10 is a flowchart showing an example of processing by a processing unit. [Figure 11](a) is an overall view of an organic EL display device, and (b) is a diagram showing the cross-sectional structure of one pixel. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention as claimed, and not all combinations of features described in the embodiments are necessarily essential to the invention. Two or more of the features described in the embodiments may be arbitrarily combined. Furthermore, the same reference numerals are used for the same or similar components, and redundant explanations will be omitted.

[0010] <1. Electronic device manufacturing line> 1 is a schematic diagram showing a part of the configuration of a manufacturing line for an electronic device according to one embodiment. The manufacturing line in FIG. 1 is used, for example, to manufacture display panels for organic EL display devices for smartphones. Substrates 100 are sequentially transported to a film-forming block 301, where an organic EL film is formed on the substrates 100.

[0011] The film formation block 301 includes a film formation apparatus 1 (described later) arranged around a transfer chamber 302 having an octagonal shape in a plan view. The film formation block 301 also includes multiple film formation chambers 303a-303d in which film formation processes are performed on substrates 100, and a mask storage chamber 305 in which masks are stored before and after use. The transfer chamber 302 includes a transfer robot 302a for transporting the substrates 100. The transfer robot 302a includes a hand for holding the substrates 100 and an articulated arm for moving the hand horizontally. In other words, the film formation block 301 is a cluster-type film formation unit in which multiple film formation chambers 303a-303d are arranged around the transfer robot 302a. In the following description, the film formation chambers 303a-303d may be referred to as film formation chambers 303 unless otherwise specified.

[0012] A buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed upstream and downstream of the film-forming block 301 in the transport direction (arrow direction) of the substrate 100, respectively. Each chamber is maintained in a vacuum state during the manufacturing process. Although only one film-forming block 301 is shown in FIG. 1, the manufacturing line according to this embodiment has multiple film-forming blocks 301, which are connected by a connecting device made up of the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308. The configuration of the connecting device is not limited to this, and may be, for example, composed of only the buffer chamber 306 or the delivery chamber 308.

[0013] The transport robot 302a transports the substrate 100 from the upstream delivery chamber 308 to the transport chamber 302, transports the substrate 100 between the film formation chambers 303, transports the mask between the mask storage chamber 305 and the film formation chamber 303, and transports the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0014] The buffer chamber 306 is a chamber for temporarily storing substrates 100 depending on the operating status of the production line. The buffer chamber 306 is provided with a multi-tiered substrate storage shelf (also called a cassette) that can store multiple substrates 100 while maintaining the substrates 100 in a horizontal position with their surfaces to be processed (surfaces to be film-formed) facing downward in the direction of gravity, and an elevator mechanism that raises and lowers the substrate storage shelf to align the stage for loading or unloading the substrates 100 with the transport position. This allows the buffer chamber 306 to temporarily store and retain multiple substrates 100.

[0015] The swirl chamber 307 is equipped with a device for changing the orientation of the substrate 100. In this embodiment, the swirl chamber 307 rotates the orientation of the substrate 100 by 180 degrees using a transfer robot provided in the swirl chamber 307. The transfer robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the delivery chamber 308, thereby swapping the front end and rear end of the substrate 100 in the transfer direction (arrow direction) between the buffer chamber 306 and the delivery chamber 308. This ensures that the orientation of the substrate 100 when carried into the film formation chamber 303 is the same in each film formation block 301, so that the scan direction of film formation on the substrate 100 and the orientation of the mask can be consistent in each film formation block 301. With this configuration, the orientation of the masks installed in the mask storage chambers 305 in each film formation block 301 can be consistent, simplifying mask management and improving usability.

[0016] The delivery chamber 308 is a chamber for delivering the substrate 100, which has been carried in by the device in the swirl chamber 307, to the transport robot 302a in the downstream film formation block 301. In this embodiment, as will be described later, the delivery chamber 308 performs alignment of the substrate 100 and measurement of the film thickness of the film formed on the substrate 100.

[0017] The control system of the production line includes a host device 300 that controls the entire line as a host computer, and controllers 14a-14d, 309, 310, and 311 that control each component, and these can communicate via a wired or wireless communication line 300a. The controllers 14a-14d are provided corresponding to the film formation chambers 303a-303d and control the film formation apparatus 1 described below. The controller 309 controls the transfer robot 302a. The controller 310 controls the transfer robot provided in the swirl chamber 307. The controller 311 controls the equipment that performs alignment and film thickness measurement in the delivery chamber 308. The host device 300 transmits information about the substrate 100 and instructions such as transfer timing to the controllers 14a-14d, 309, 310, and 311, and the controllers 14a-14d, 309, 310, and 311 control each component based on the received instructions. In the following description, the control devices 14a to 14d may be referred to as the control device 14 unless they are particularly distinguished from one another.

[0018] <2. Overview of the film deposition equipment> FIG. 2 is a schematic diagram of a film forming apparatus 1 according to one embodiment. The film forming apparatus 1 forms a film of a vapor deposition material on a substrate 100 by using a mask 101 to form a thin film of the vapor deposition material in a predetermined pattern. The material of the substrate 100 on which the film is formed in the film forming apparatus 1 can be selected from glass, resin, metal, and other materials. A glass substrate with a resin layer such as polyimide formed thereon is preferably used. Examples of vapor deposition materials include organic materials and inorganic materials (metals, metal oxides, and the like). The film forming apparatus 1 is applicable to manufacturing apparatuses for manufacturing electronic devices such as display devices (e.g., flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components, and is particularly applicable to manufacturing apparatuses for manufacturing organic EL panels. In the following description, an example is described in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition. However, the film formation method is not limited to this, and various film formation methods such as sputtering and CVD can also be applied. In each drawing, arrow Z indicates the vertical direction (the direction of gravity), and arrows X and Y indicate horizontal directions that are orthogonal to each other.

[0019] The film forming apparatus 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state. The internal space 3a of the vacuum chamber 3 is equipped with a substrate support unit 6 that supports the substrate 100 in a horizontal position, a mask table 5 that supports a mask 101, a film forming unit 4, and a plate unit 9. The mask 101 is a metal mask with an opening pattern corresponding to the thin film pattern to be formed on the substrate 100 and is fixed on the mask table 5. The mask 101 may be a mask having a structure in which a mask foil having a thickness of several micrometers to several tens of micrometers is welded to a frame-shaped mask frame. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a low thermal expansion coefficient, such as Invar. The film formation process is performed in a state where the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 are superimposed on each other.

[0020] The plate unit 9 includes a cooling plate 10 that cools the substrate 100 during film formation, and a magnetic plate 11 that magnetically attracts the mask 101 to bring the substrate 100 and the mask 101 into close contact with each other. The plate unit 9 is provided so as to be movable up and down in the Z direction by an elevating unit 13 that includes, for example, a ball screw mechanism or the like.

[0021] The film forming unit 4 is composed of a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, etc., and is an evaporation source that deposits an evaporation material onto the substrate 100. More specifically, in this embodiment, the film forming unit 4 is a linear evaporation source in which multiple nozzles (not shown) are arranged in the X direction, and evaporation material is discharged from each nozzle. The film forming unit 4 is moved back and forth in the Y direction (direction away from the connection part between the film forming chamber 303 and the transfer chamber 302) by an evaporation source moving mechanism (not shown).

[0022] The film forming apparatus 1 also includes an alignment device 2 that aligns the substrate 100 and the mask 101. Schematically, the alignment device 2 detects the positions of alignment marks formed on the substrate 100 and the mask 101 using a detection unit 17 (see FIG. 3) that is configured by a control device 14 and an imaging unit 16. Then, the alignment device 2 adjusts the relative positions of the substrate 100 and the mask 101 using a position adjustment unit 20 based on the detection results.

[0023] The alignment apparatus 2 includes an imaging unit 16 that constitutes a detection unit 17 and captures images of alignment marks used for aligning the substrate 100 and the mask 101. The imaging unit 16 includes cameras 160 and 161. In this embodiment, the film forming apparatus 1 performs two stages of alignment of the substrate 100 and the mask 101: rough alignment and fine alignment. The rough alignment is a rough adjustment of the positions of the substrate 100 and the mask 101, and the fine alignment is a more precise adjustment of the positions of the substrate 100 and the mask 101 than the rough alignment. However, the alignment mode is not limited to this, and for example, the film forming apparatus 1 may perform only fine alignment.

[0024] Camera 160 captures an image of an alignment mark for rough alignment, and camera 161 captures an image of an alignment mark for fine alignment. In this embodiment, detection unit 17 includes two cameras 160 and four cameras 161. Hereinafter, when the two cameras 160 are described separately, they may be referred to as cameras 1601 and 1602. Furthermore, when the four cameras 161 are described separately, they may be referred to as cameras 1611 to 1614. Furthermore, in the following description, camera 160 may be referred to as rough camera 160, and camera 161 may be referred to as fine camera 161. Note that the numbers of cameras 160 and 161 are merely examples and can be changed as appropriate.

[0025] The alignment device 2 includes a substrate support unit 6 that supports the peripheral edge of the substrate 100. The substrate support unit 6 includes a pair of base portions 62 that are spaced apart from each other in the X direction and extend in the Y direction, and a plurality of claw-shaped mounting portions 61 that protrude inward from the base portions 62. The mounting portions 61 are sometimes called "receiving claws" or "fingers." The multiple mounting portions 61 are arranged at intervals on each of the pair of base portions 62. The long side portions of the peripheral edge of the substrate 100 are placed on the mounting portions 61. The base portions 62 are suspended from a beam member 222 via a plurality of supports 64.

[0026] In this embodiment, the base portions 62 are spaced apart in the X direction and are not formed on the short side of the substrate 100, which prevents interference between the transfer robot 302a and the base portions 62 when the transfer robot 302a transfers the substrate to the placement unit 61. However, the base portion 62 may be a rectangular frame that surrounds the entire periphery of the substrate 100. This improves the efficiency of transport and transfer of the substrate 100. The base portion 62 may also be a rectangular frame with a partial cutout. By using a rectangular frame with a partial cutout, interference between the transfer robot 302a and the base portion 62 when the transfer robot 302a transfers the substrate to the placement unit 61 can be prevented, thereby improving the efficiency of transport and transfer of the substrate 100.

[0027] The substrate support unit 6 also includes a clamp unit 63. The clamp unit 63 includes a plurality of clamp portions 66. Each clamp portion 66 is provided corresponding to a corresponding placement portion 61, and the clamp portion 66 and the placement portion 61 can sandwich and hold the peripheral portion of the substrate 100. The clamp unit 63 includes, for example, an actuator for moving each clamp portion 66 toward and away from the substrate 100. As a support mode for the substrate 100, in addition to the mode in which the peripheral portion of the substrate 100 is sandwiched and held between the clamp portion 66 and the placement portion 61 as described above, it is also possible to employ a mode in which the substrate 100 is simply placed on the placement portion 61 without providing the clamp portion 66.

[0028] The alignment device 2 includes a position adjustment unit 20 that adjusts the relative position of the substrate 100, whose peripheral edge is supported by the substrate support unit 6, and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 on the XY plane based on images of alignment marks provided on the substrate 100 and the mask 101 captured by cameras 160 and 161. In this embodiment, the position of the mask 101 is fixed and the relative position is adjusted by displacing the substrate 100. However, the adjustment may be performed by displacing the mask 101, or both the substrate 100 and the mask 101 may be displaced. The position adjustment unit 20 may include, for example, a plurality of electric actuators employing ball screw mechanisms, which may be used to move the substrate support unit 6 in the XY directions and rotate it around the Z axis.

[0029] The alignment device 2 includes a contact / separation unit 22 that moves the substrate 100, whose peripheral edge is supported by the substrate support unit 6, closer to and farther away from the mask 101 in the thickness direction (Z direction) of the substrate 100 by raising and lowering the substrate support unit 6. In other words, the contact / separation unit 22 can move the substrate 100 and the mask 101 closer to each other in the direction in which they are superimposed. The contact / separation unit 22 may include, for example, an electric actuator employing a ball screw mechanism.

[0030] <3. Control configuration> Fig. 3 is a diagram showing an example of the hardware configuration of the film forming apparatus 1 shown in Fig. 2. Fig. 3 mainly shows the configuration related to the alignment of the substrate 100 and the mask 101. For example, the film forming apparatus 1 performs a predetermined operation based on instructions from a higher-level device 300, which is a host computer that controls the entire production line.

[0031] The control device 14 includes a processing unit 141, a storage unit 142, and an I / F unit 143 (interface unit), which are connected to each other via a bus (not shown). The processing unit 141 is, for example, a CPU. The processing unit 141 controls the driving of the position adjustment unit 20 and various actuators 25 by executing a program stored in the storage unit 142. The storage unit 142 is, for example, a RAM, a ROM, a hard disk, etc., and stores various data in addition to the program executed by the processing unit 141. The I / F unit 143 relays the transmission and reception of signals between the processing unit 141 and an external device. The I / F unit 143 is, for example, composed of a communication I / F and an input / output I / F.

[0032] In this embodiment, as described above, the control device 14 and the imaging unit 16 constitute the detection unit 17 that can execute a detection process to detect the positions of the alignment marks provided on the substrate 100 and the mask 101. That is, the control device 14 performs an image recognition process using the captured image captured by the imaging unit 16, thereby detecting the positions, angles, etc. of the alignment marks provided on the substrate 100 and the mask 101.

[0033] The input unit 18 is a touch panel, hard keys, or the like, and receives input from a user. The display unit 19 is, for example, a liquid crystal display, or the like, and displays various information. The various actuators 25 may include actuators included in the above-mentioned lifting unit 13, position adjustment unit 20, or approach / separation unit 22.

[0034] <4. Substrate and mask> 4(a) to 4(c) are plan views showing configuration examples of the substrate 100 and the mask 101, with FIG. 4(a) showing the mask 101 alone, FIG. 4(b) showing the substrate 100 alone, and FIG. 4(c) showing the mask 101 and the substrate 100 superimposed on each other. In FIG. 4(c), imaging areas R1 to R6 indicate the imaging areas of cameras 1611 to 1614, 1601, and 1602, respectively. In addition, in FIGS. 4(a) to 4(c), each mark is shown exaggerated for ease of understanding, and therefore the relative size with respect to the substrate or mask differs from the actual size.

[0035] The mask 101 is used to deposit a deposition material onto the substrate 100 in a desired pattern. Apertures of a predetermined pattern are formed in the mask 101 in an area overlapping the substrate 100 (omitted in FIG. 4(a) and other figures), and by performing deposition with one surface of the substrate 100 covered with the mask 101, the deposition material is deposited onto the substrate 100 in a pattern corresponding to the openings. The mask 101 may have a structure in which a mask foil having a thickness of about several μm to several tens of μm is welded and fixed to a frame-shaped mask frame. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a low thermal expansion coefficient, such as Invar.

[0036] The mask 101 is also provided with mask marks 1011 and 1012 for rough alignment and mask marks 1013 to 1016 for fine alignment. The mask marks 1011 and 1012 are provided near the centers of the short sides of the mask 101, respectively, and are imaged by corresponding cameras 1601 and 1602. The mask marks 1013 to 1016 are provided near the corners of the mask 101, respectively, and are imaged by corresponding cameras 1611 to 1614. In the following description, the mask marks 1011 and 1012 may be collectively referred to as a mask rough mark 1017, and the mask marks 1013 to 1016 may be collectively referred to as a mask fine mark 1018. That is, the mask rough mark 1017 is imaged by the rough camera 160, and the mask fine mark 1018 is imaged by the fine camera 161.

[0037] The substrate 100 is a target on which a deposition material is deposited, and is a transparent member that transmits light to be detected by the imaging unit 16. When the substrate 100 is transferred into the vacuum chamber 3 by the transfer robot 302a, the position adjustment unit 20 adjusts the positions of the substrate 100 and the mask 101 while the substrate 100 is held by the substrate support unit 6. Furthermore, because the substrate 100 is transparent, the imaging unit 16 can capture images of the mask marks 1017 and 1018 even if the substrate 100 is placed between the mask 101 and the imaging unit 16.

[0038] The substrate 100 is provided with substrate marks 1001 and 1002 for rough alignment and substrate marks 1003 to 1006 for fine alignment. The substrate marks 1001 and 1002 are provided near the center of the short sides of the substrate 100, respectively, and are detected by the corresponding cameras 1601 and 1602. The substrate marks 1003 to 1006 are provided near the corners of the substrate 100, respectively, and are detected by the corresponding cameras 1611 to 1614. In the following description, the substrate marks 1001 and 1002 may be collectively referred to as substrate rough marks 1007, and the substrate marks 1003 to 1006 may be collectively referred to as substrate fine marks 1008. In other words, the substrate rough mark 1007 is detected by the rough camera 160, and the substrate fine mark 1008 is detected by the fine camera 161.

[0039] In this embodiment, the board marks 1007 (1001-1002) and 1008 (1003-1006) are respectively composed of position detection marks 1001a-1002a and 1003a-1006a and angle detection marks 1001b-1002b and 1003b-1006b. However, a configuration in which these are integrated, or a configuration in which only the positions of the board marks 1007 and 1008 are detected, may also be employed. Alternatively, the board fine mark 1008 may be composed of a position detection mark and an angle detection mark, and the board rough mark 1007 may be composed only of a position detection mark. In other words, one of the board marks 1007 and 1008 may be composed of a position detection mark and an angle detection mark, and the other may be composed only of a position detection mark.

[0040] In this embodiment, in rough alignment, the relative positions of the substrate 100 and the mask 101 are adjusted so that the positional relationship between the substrate rough marks 1007 and the corresponding mask rough marks 1017 satisfies a predetermined condition. In fine alignment, the relative positions of the substrate 100 and the mask 101 are adjusted so that the positional relationship between the substrate fine marks 1008 and the corresponding mask fine marks 1018 satisfies a predetermined condition.

[0041] <5. Overview of the alignment process> 5 is a diagram schematically illustrating an alignment process performed by the film forming apparatus 1. States ST1 and ST2 indicate states before alignment, state ST3 indicates a state in which rough alignment is being performed, and states ST4 to ST8 indicate states in which fine alignment is being performed.

[0042] State ST1 shows a state in which the substrate 100 has been carried into the vacuum chamber 3 by the transfer robot 302a. In this state, the substrate 100 is placed on the mounting portion 61, but the clamp portion 66 is spaced above the substrate 100. Therefore, the substrate 100 is not clamped. Furthermore, the center portion of the substrate 100 is bent due to its own weight.

[0043] State ST2 shows a state in which the substrate 100 is clamped between the mounting portion 61 and the clamp portion 66. Specifically, from state ST1, the actuator of the clamp unit 63 moves the clamp portion 66 downward, whereby the long side of the substrate 100 is clamped between the mounting portion 61 and the clamp portion 66.

[0044] State ST3 indicates a state in which rough alignment is being performed. Specifically, the processing unit 141 captures images of the substrate rough mark 1007 and the mask rough mark 1017 using the rough camera 160, and identifies the position and angle of each mark based on the captured image. Then, the processing unit 141 adjusts the position of the substrate 100 in the XY directions and the rotation angle θ around the Z axis using the position adjustment unit 20 based on the identified positions and angles of each mark. Note that after adjustment by the position adjustment unit 20, the rough camera 160 may again capture images of the substrate rough mark 1007 and the mask rough mark 1017, and if the positions and angles of each mark identified based on the captured images do not satisfy the conditions, the position adjustment unit 20 may again perform position adjustment.

[0045] States ST4 and onward indicate states in which fine alignment is being performed. State ST4 indicates a state in which the substrate support unit 6 is lowered by the contact / separation unit 22, and the fine camera 161 is detecting the substrate fine marks 1008 and the mask fine marks 1018. Note that states ST5 and ST6 may be omitted if the positions and angles of each mark identified based on the captured images satisfy the conditions. Here, to improve the accuracy of position adjustment through alignment, it is necessary to improve the detection accuracy of each mark by the imaging unit 16. Therefore, it is preferable to use a camera capable of capturing images with high resolution as the fine camera 161 used in fine alignment, which requires high-precision position adjustment. However, increasing the camera resolution reduces the depth of field, so in order to simultaneously capture the marks formed on the substrate 100 and the mask 101, it is necessary to move the marks closer together along the optical axis of the fine camera 161. Therefore, in this embodiment, when detecting the substrate fine mark 1008 and the mask fine mark 1018 in fine alignment, the substrate 100 is brought closer to the mask 101 than when detecting the substrate rough mark 1007 and the mask rough mark 1017 in rough alignment. At this time, as shown in state ST4 in Figure 5, the substrate 100 may be in partial contact with the mask 101. Because the peripheral region of the substrate 100 is supported, the central portion of the substrate 100 is bent due to its own weight, and therefore, typically, only the central portion of the substrate 100 is in partial contact with the mask 101.

[0046] In rough alignment, the substrate 100 and the mask 101 are spaced apart from each other, as shown in state ST3 in FIG. 5 , and the substrate rough marks 1007 and the mask rough marks 1017 are detected and the positions of the substrate 100 and the mask 101 are adjusted. In rough alignment, by using a rough camera 160 with a relatively large depth of field, alignment can be performed while the substrate 100 and the mask 101 are spaced apart. In this embodiment, the rough alignment is performed to roughly adjust the positions of the substrate 100 and the mask 101 while they are spaced apart, and then fine alignment, which involves more precise position adjustment, is performed. As a result, when the substrate 100 and the mask 101 are brought close to each other and brought into contact with each other to detect the marks in fine alignment, the relative positions of the substrate 100 and the mask 101 have already been adjusted to some extent, so that the film pattern formed on the substrate 100 and the opening pattern of the mask 101 come into contact with each other in a state of being aligned to some extent. This makes it possible to reduce damage to the film formed on the substrate 100 due to contact between the substrate 100 and the mask 101. That is, by combining rough alignment, in which the substrate 100 and the mask 101 are roughly aligned while being spaced apart, with fine alignment, which includes a step of partially bringing the substrate 100 and the mask 101 into contact with each other, as in this embodiment, it is possible to achieve highly accurate alignment while reducing damage to the film formed on the substrate 100.

[0047] State ST5 shows a state in which the position of the substrate 100 is being adjusted based on the image captured by the camera 161. Specifically, after the contact / separation unit 22 raises the substrate support unit 6 to separate the substrate 100 from the mask 101, the position adjustment unit 20 adjusts the position of the substrate 100 in the XY directions and the rotation angle θ around the Z axis.

[0048] State ST6 shows a state in which the substrate 100 is again brought close to the mask 101, and the camera 161 captures images of the substrate fine marks 1008 and the mask fine marks 1018 while the substrate 100 is in contact with the mask 101. If the positions and angles of the marks identified based on the captured images satisfy the conditions, the process proceeds to state ST7; if the conditions are not satisfied, the process returns to state ST5.

[0049] State ST7 shows a state in which substrate 100 is placed on mask 101, and plate unit 9 is placed thereon. Specifically, substrate support unit 6 is lowered by contact / separation unit 22 to place substrate 100 on mask 101, and then cooling plate 10 is lowered by lifting unit 13 to bring plate unit 9 into contact with substrate 100.

[0050] State ST8 shows a state in which the camera 161 is performing final position confirmation. After the substrate 100 is sandwiched between the mask 101 and the cooling plate 10 in state ST7, the actuator of the clamp unit 63 moves the clamp portion 66 upward, separating the clamp portion 66 from the substrate 100 and releasing the clamped state of the long side of the substrate 100. The contact / separation unit 22 then lowers the substrate support unit 6, separating the placement portion 61, which had been in contact with the peripheral region of the substrate 100, from the substrate 100. As a result, the substrate 100 is separated from the substrate support unit 6 and is now sandwiched between the mask 101 and the plate unit 9. In this state, the fine camera 161 captures images of the substrate fine mark 1008 and the mask fine mark 1018 to check whether the positional relationship between them satisfies the conditions. If the positional relationship satisfies the conditions, the alignment of the substrate 100 and the mask 101 is completed. If the conditions are not met, the process returns to state ST5.

[0051] <6. Position adjustment in fine alignment> FIG. 6 is a diagram illustrating an example of a fine alignment process. The processing unit 141 acquires positions P1 to P4 of the multiple mask marks 1013 to 1016 provided on the mask 101 based on the images captured by each of the cameras 1611 to 1614. In this embodiment, the positions P1 to P4 are the center positions of the circular mask marks 1013 to 1016, respectively. In this embodiment, the storage unit 142 stores information linking a coordinate system (camera coordinate system) within the field of view of each of the cameras 1611 to 1614 with a coordinate system (world coordinate system) for the entire film forming apparatus 1. The processing unit 141 calculates the coordinates of the positions P1 to P4 of the mask marks 1013 to 1016 in each of the camera coordinate systems based on the images captured by each of the cameras 1611 to 1614. The processing unit 141 acquires the coordinates of the positions P1 to P4 of the multiple mask marks 1013 to 1016 in the world coordinate system from the information linking the camera coordinate system and the world coordinate system.

[0052] Furthermore, the processing unit 141 sets target positions T1 to T4 on the substrate 100 corresponding to the mask marks 1013 to 1016 from among the multiple substrate marks 1003 to 1006 provided on the substrate 100, respectively, based on the captured images of the cameras 1611 to 1614. Similar to the positions P1 to P4 of the mask marks 1013 to 1016, the target positions T1 to T4 are set using coordinates in the world coordinate system based on information linking the camera coordinate system with the world coordinate system. In this embodiment, the target positions T1 to T4 are set at positions inside the substrate 100 by a predetermined distance from the portions of the cross-shaped position detection marks 1003a to 1006a extending in the X direction. In FIG. 6, the distance between position P1 and target position T1 is indicated by distance L1. Similarly, the distances between positions P2 to P4 and target positions T2 to T4 are indicated by distances L2 to L4.

[0053] Then, the processing unit 141 adjusts the relative positions of the substrate 100 and the mask 101 using the position adjustment unit 20 based on the positions P1 to P4 of the multiple mask marks 1013 to 1016 and their corresponding target positions T1 to T4. As an example, the processing unit 141 first adjusts the position of the substrate 100 using the position adjustment unit 20 so that the center of gravity of the positions P1 to P4 coincides with the center of gravity of the target positions T1 to T4. Thereafter, the processing unit 141 rotates the substrate 100 using the position adjustment unit 20 while maintaining the state in which the center of gravity of the positions P1 to P4 coincides with the center of gravity of the target positions T1 to T4 so that the sum of squares of the distances L1 to L4 is minimized. Note that the alignment method described above is merely an example, and other well-known techniques may be applied.

[0054] <7. Acquiring alignment mark positions> The details of obtaining the alignment mark positions in alignment, particularly fine alignment, will be described below.

[0055] As described above, in alignment using the film forming apparatus 1, the detection unit 17, which is composed of the control device 14 and the imaging unit 16, detects the position of each alignment mark. In this embodiment, the detection of the position of the mask fine marks 1018 on the mask 101 is performed by a pattern matching method using model marks (model images) prepared to correspond to the mask fine marks 1018. Furthermore, the detection and position of the mask fine marks 1018 on the mask 101 are performed by normalized correlation pattern matching.

[0056] For example, the processing unit 141 checks whether there is an area in the image captured by the fine camera 161 that matches the prepared model mark, and if there is, identifies the position of the mask fine mark 1018 based on where that area is.

[0057] Fig. 7(a) is a diagram illustrating an aspect of pattern matching for identifying the position of the mask fine mark 1018. Fig. 7(a) shows an example in which an image captured by the camera 1611 is used. Fig. 7(b) is a diagram showing an example of the model mark 40.

[0058] The processing unit 141 compares image data (e.g., brightness data for each pixel) of an area R10 having the same size as the model mark 40 within the imaging area R1 of the camera 1611 with data (e.g., brightness data for each pixel) of the model mark 40, and calculates a correlation value between these images. The correlation value is, for example, a parameter value that indicates the degree to which the brightness data of all pixels of the model mark 40 and the area in the imaging area R1 match.

[0059] If the calculated correlation value exceeds a predetermined threshold and there is sufficient correlation, the processing unit 141 determines that an alignment mark corresponding to the model mark 40 exists in the position of the region R10 in the imaging region R1 where the correlation value was calculated. On the other hand, if the calculated correlation value is equal to or less than the predetermined threshold, that is, if the degree of match of the data is low, the processing unit 141 determines that an alignment mark corresponding to the model mark 40 does not exist in the position of the region R10 in the imaging region R1 where the correlation value was calculated.

[0060] The processing unit 141 repeatedly performs the same process while moving the position of the region R10, for example, by one pixel at a time on the XY plane, within the imaging region R1. If there is a position in the imaging region R10 where the correlation value with the model mark 40 exceeds a threshold, the processing unit 141 can identify the position of the region R10 where the correlation value is the largest as the position of the mask fine mark 1018. On the other hand, if the correlation value is equal to or less than the threshold at all positions where the correlation value is calculated, the processing unit 141 determines that the mask fine mark 1018 has not been detected. Note that the above-mentioned normalized correlation pattern matching method is merely an example, and any known method can be adopted as appropriate.

[0061] The data of the model mark 40 (for example, brightness data for each pixel) is stored in, for example, the storage unit 142. Furthermore, the storage unit 142 stores the 40 data of the corresponding model mark for each camera, for example, separately for the cameras 1611 to 1614.

[0062] Also, although the detection of the position of mask fine mark 1018 on mask 101 has been described here, the position of substrate fine mark 1008 on substrate 100 may be detected using a similar method.

[0063] Incidentally, when the detection unit 17 detects the position of the alignment mark on the substrate 100 or the mask 101 by image recognition of the image captured by the camera 161, the detection results may vary due to factors such as misalignment of the camera 161 installation position or focus. The variation in the detection results may result in an increase in alignment time or a decrease in alignment accuracy. Therefore, in this embodiment, the detection accuracy by the detection unit 17 is evaluated by the following process.

[0064] <8. Processing Example of Processing Unit 141> (Processing example 1) 8 is a flowchart showing an example of processing by the processing unit 141. This flowchart shows processing for fine alignment of the substrate 100 and the mask 101 (S101 to S105), and evaluation of the position detection accuracy by the detection unit 17 after the fine alignment (S106 to S111), as needed. In other words, this flowchart can be executed after rough alignment has been performed. This flowchart is realized, for example, by the processing unit 141 reading and executing a program stored in the storage unit 142.

[0065] In step S101 (hereinafter, each step will be simply referred to as S101, etc.), processing unit 141 executes a detection process using detection unit 17. The detection process is a process in which detection unit 17 detects the positions of substrate fine marks 1008 and mask fine marks 1018. As an example of the process, first, processing unit 141 controls camera 161 to capture images of substrate fine marks 1008 and mask fine marks 1018. Next, processing unit 141 identifies the positions of substrate fine marks 1008 and mask fine marks 1018 based on the images captured by camera 161. For example, processing unit 141 identifies the positions of substrate fine marks 1008 and mask fine marks 1018 using the method described in <7. Acquiring alignment mark positions>.

[0066] In S102, the processing unit 141 executes a position adjustment process. The position adjustment process is a process for adjusting the relative position between the substrate 100 and the mask 101. The processing unit 141 executes the position adjustment process by controlling the position adjustment unit 20, for example, by the method described in <6. Position Adjustment in Fine Alignment>.

[0067] In S103, processing unit 141 again executes the detection process by detection unit 17. Here, detection unit 17 detects the positions of substrate fine mark 1008 and mask fine mark 1018 after their positions have been adjusted by the process of S102.

[0068] In S104, the processing unit 141 executes an error determination process. The error determination process is a process for determining whether or not the positional or angular error between the substrate 100 and the mask 101 after alignment is within a reference value. For example, based on the result of the detection process in S103, the processing unit 141 may determine that the error is within the reference value if the distance and angle difference between the centers of gravity of the substrate 100 and the mask 101 are within the reference values.

[0069] S105 is a conditional branch based on the determination result of S104. If the processing unit 141 determines in S104 that the error is within the reference value, the processing unit 141 proceeds to S106, and if the processing unit 141 determines in S104 that the error is not within the reference value, the processing unit 141 returns to S102. That is, the processing unit 141 repeats steps S102 to S104 until the error in the position or angle of the substrate 100 and the mask 101 falls within the reference value. Note that if the processing unit 141 does not determine in S104 that the error is within the reference value even after repeating steps S102 to S104 a predetermined number of times, the processing unit 141 may notify the operator of an alignment error.

[0070] In S106, the processing unit 141 determines whether to perform an evaluation of the accuracy of position detection by the detection unit 17. For example, the processing unit 141 determines whether to perform the detection process of S108 multiple times depending on the processing status of the film forming apparatus 1. Fig. 9(a) is a flowchart showing an example of processing by the processing unit 141, and illustrates a specific example of processing in S106 of Fig. 8.

[0071] In S161, the processing unit 141 acquires information regarding the number of past alignment retry attempts. For example, the processing unit 141 acquires this information by reading it from the storage unit 142. In this embodiment, the storage unit 142 stores, as alignment operation history information, the detection results in the detection processes (S101, S103) and the determination results of the error determination process (S104) for each substrate 100. For example, the processing unit 141 acquires, as information regarding the number of alignment retry attempts, the average value of the number of retry attempts for a predetermined number of substrates 100 most recently, based on the determination result of the error determination process.

[0072] S162 is a conditional branch regarding the number of alignment retry attempts. If the number of alignment retry attempts satisfies the condition, the processing unit 141 proceeds to S163; if not, the processing unit 141 proceeds to S164. The condition here can be set appropriately, but for example, the processing unit 141 may determine that the number of retry attempts satisfies the condition if the average value of the number of retry attempts is equal to or less than a threshold value. In S163, the processing unit 141 determines not to perform accuracy evaluation, and returns to the flowchart of FIG. 8. In S164, the processing unit 141 determines to perform accuracy evaluation, and returns to the flowchart of FIG. 8.

[0073] When the average number of alignment retry attempts is equal to or less than a threshold, it is considered that the alignment is being performed with a certain level of accuracy. Therefore, in this embodiment, by determining to perform position detection accuracy evaluation when the number of alignment retry attempts does not satisfy the condition, it is possible to perform position detection accuracy evaluation when it is considered that the alignment accuracy has decreased.

[0074] Returning to the explanation of Fig. 8, S107 is a conditional branch regarding the determination result of S106. If the processing unit 141 determines in S106 that accuracy evaluation is to be performed, the processing unit 141 proceeds to S108, and if it determines that accuracy evaluation is not to be performed, the processing unit 141 ends the flowchart.

[0075] In S108, the processing unit 141 executes the detection process multiple times while the substrate 100 and the mask 101 are kept stationary. The processing unit 141 repeats the same detection process as S101 or S103 multiple times. The number of times the detection process is executed can be set appropriately, and may be, for example, 2 to 5,000 times, 2,000 to 4,000 times, or even 3,000 times. In this embodiment, the multiple detection processes are executed after the position adjustment unit 20 adjusts the positions of the substrate 100 and the mask 101.

[0076] In S109, the processing unit 141 performs statistical processing on the result of the detection processing in S108. For example, the processing unit 141 calculates the average value (μ), variance (σ2), standard deviation (σ), etc. of the distance between the centers of gravity of the substrate 100 and the mask 101. Furthermore, for example, the processing unit 141 may acquire the maximum or minimum value of the distance between the centers of gravity of the substrate 100 and the mask 101, or a value such as 2σ or 3σ of the standard deviation.

[0077] S110 is a conditional branch for the statistical processing of S109. If the result of the statistical processing of S109 satisfies the criterion, the processing unit 141 ends the flowchart, and if the criterion is not satisfied, the processing unit 141 proceeds to processing of S111. The criterion here may be, for example, a value related to the variance (σ2), standard deviation (σ), 2σ, 3σ, etc. of the distance between the centers of gravity of the substrate 100 and the mask 101. In other words, the criterion here may be a value related to the variation in the distance between the centers of gravity of the substrate 100 and the mask 101.

[0078] In S111, the processing unit 141 executes a detection unit adjustment process, which is a process for adjusting the detection unit 17. In S108, the detection process is executed multiple times while the substrate 100 and the mask 101 are stationary. Therefore, if it is determined in S110 that the statistical results do not satisfy the criteria, there is a possibility that the variability in the detection results by the detection unit 17 has become large. Therefore, the processing unit 141 executes a process for executing an adjustment of the detection unit 17 to suppress the variability in the detection results. For example, the processing unit 141 displays a notification on the display unit 19 to prompt the operator to adjust the Z-direction position and focus of the camera 161. In addition, for example, the processing unit 141 executes size adjustment of the model mark 40 used for pattern matching. Thereafter, the processing unit 141 returns to S108. That is, the processing unit 141 repeats the detection process and statistical process multiple times until the result of the statistical process in S109 satisfies the criteria. Note that, if the statistical results do not satisfy the criteria even after repeating these processes a predetermined number of times, the processing unit 141 may notify the operator of an error.

[0079] According to this processing example, statistical processing is performed on the results of multiple detection processes, making it possible to evaluate the detection accuracy of the detection unit 17. Furthermore, since the detection unit 17 is adjusted according to the statistical results, it is possible to suppress a decrease in alignment accuracy due to a decrease in the detection accuracy of the position of the detection unit 17.

[0080] In this processing example, whether or not to evaluate the position detection accuracy of the detection unit 17 is determined based on the number of past alignment retry attempts. However, whether or not to perform the evaluation may also be determined based on the time required for past alignment. Alternatively, when a plurality of film formation chambers 303 each having a film formation apparatus 1 are arranged on a production line as shown in FIG. 1 , whether or not to perform the evaluation may be determined based on a comparison with the number of alignment retry attempts or the time required for the other film formation apparatuses 1. For example, the control device 14 acquires information regarding the number of alignment retry attempts from the other control devices 14. Then, the processing unit 141 of the control device 14 may determine to perform the evaluation when the average number of alignment retry attempts for a predetermined number of substrates 100 most recently is greater than the average number of average retry attempts of the other film formation apparatuses 1 by a certain percentage or more (e.g., twice or more).

[0081] In this processing example, if the conditional branch at S110 is judged as Yes, the flowchart ends. However, if the conditional branch at S110 is judged as Yes and the flowchart ends without going through step S111, it is determined in S106 that accuracy evaluation should be performed, but the statistical processing at S109 satisfies the criteria. In other words, in such a case, the alignment accuracy may be reduced due to factors other than the detection unit 17. Therefore, the processing unit 141 may display a notification on the display unit 19 that the alignment accuracy may be reduced due to factors other than the detection unit 17.

[0082] (Processing example 2) FIG. 9(b) is a flowchart showing a processing example of the processing unit 141. This flowchart shows a specific processing example of S106 in FIG. 8. In the manufacture of electronic devices, film formation may be performed on multiple substrates 100 (one lot's worth) using one mask 101. When the position adjustment unit 20 displaces the substrate 100 to adjust the position of the substrate 100 and the mask 101 as in this embodiment, the distance between the camera 161 and the mask 101 is kept constant while the same mask 101 is used. However, when the mask 101 is replaced, the distance between the camera 161 and the mask 101 changes, which may affect the position detection accuracy of the detection unit 17. Therefore, in this processing example, the position detection accuracy of the detection unit 17 is evaluated when the mask 101 is replaced during the manufacturing process of the electronic device.

[0083] In S261, the processing unit 141 acquires information about the substrate 100 that has been aligned in steps S101 to S105. For example, the processing unit 141 stores information about the substrate 100 that has been aligned in steps S101 to S105 by reading the information from the processing unit 141. In this embodiment, the storage unit 142 stores identification information and attribute information of the substrate 100 in association with each other as information about the substrate 100. The attribute information may include information such as whether the target substrate 100 is a production substrate 100 or a test substrate 100, or information about the order in which the target substrate 100 was carried into the film forming apparatus 1 within the same lot.

[0084] S262 is a conditional branch regarding the attributes of the substrate 100. If the substrate 100 for which information was acquired in S261 is the target substrate for accuracy evaluation, the processing unit 141 proceeds to S263; otherwise, the processing unit 141 proceeds to S264. The target substrate for accuracy evaluation can be set as appropriate. For example, it may be a test substrate for film formation evaluation, which evaluates the quality of film formation after replacing the mask 101. Alternatively, for example, the target substrate for accuracy evaluation may be a test substrate for detection accuracy evaluation, which is loaded after the test substrate for film formation evaluation to evaluate the detection accuracy of the position of the detection unit 17. Alternatively, for example, the target substrate for accuracy evaluation may be a production substrate 100 that is loaded into the film formation apparatus 1 first in the same lot. In S263, the processing unit 141 determines not to perform accuracy evaluation and returns to the flowchart of FIG. 8. In S264, the processing unit 141 determines to perform accuracy evaluation and returns to the flowchart of FIG. 8.

[0085] According to this processing example, when the mask 101 is replaced, the position detection accuracy by the detection unit 17 is evaluated, so that it is possible to evaluate a decrease in detection accuracy due to a change in the distance between the camera 161 and the mask 101 caused by the mask replacement.

[0086] As mentioned above, the target substrate for accuracy evaluation can be set as appropriate, but by using the test substrate for detection accuracy evaluation, which is carried into the film formation apparatus 1 after the test substrate for film formation evaluation, as the target substrate, it is possible to evaluate the position detection accuracy during film formation evaluation. This allows evaluation of the detection unit 17 to be performed without affecting the productivity of electronic devices.

[0087] On the other hand, by using a test substrate for film formation evaluation or a production substrate 100 that is first carried into the film formation apparatus 1 in the same lot as the target substrate, there is no need for a dedicated substrate 100 used for evaluating the detection accuracy of the position of the detection unit 17. Therefore, an increase in manufacturing costs can be suppressed.

[0088] (Processing example 3) 10 is a flowchart showing an example of processing by the processing unit 141. This flowchart shows an example of processing when the position detection accuracy by the detection unit 17 is evaluated for each camera 161. Hereinafter, steps that are the same as those in the flowchart of FIG. 8 are given the same reference numerals, and descriptions thereof will be omitted.

[0089] 4, each of the cameras 1611 to 1614 captures an image of a corresponding pair of the substrate fine mark 1008 and the mask fine mark 1018. In this processing example, statistical processing is performed on the results of the position detection processing by the detection unit 17 for each pair.

[0090] S101 to S108 are the same as those in the flowchart of FIG. In S309, the processing unit 141 performs statistical processing on the results of the multiple detection processes in S108 for each of the cameras 1611 to 1614. For example, the processing unit 141 calculates the average value (μ), variance (σ2), standard deviation (σ), etc. of the distances L1 to L4 (see FIG. 4) for each of the cameras 1611 to 1614. Furthermore, for example, the processing unit 141 may obtain the maximum or minimum value of the distances L1 to L4, or values ​​such as 2σ or 3σ for the standard deviation.

[0091] S310 is a conditional branch for the statistical processing of S309. If the result of the statistical processing of S109 shows that all cameras 1611 to 1614 satisfy the criterion, the processing unit 141 ends the flowchart, and if the criterion is not satisfied, the processing unit 141 proceeds to the processing of S312. The criterion here may be, for example, a value related to the variance (σ2), standard deviation (σ), 2σ, 3σ, etc. of the distances L1 to L4. In other words, the criterion here may be a value related to the variation of the distances L1 to L4.

[0092] S312 is also a conditional branch for the statistical processing of S309. If a predetermined number of cameras 161 satisfy the criteria as a result of the statistical processing of S109, processing unit 141 proceeds to S313, otherwise proceeds to S311. For example, processing unit 141 may proceed to S313 if three of the four cameras 1611 to 1614 satisfy the criteria.

[0093] In S313, the processing unit 141 changes the cameras 161 used for alignment. For example, if it is determined in S312 that three cameras 161 satisfy the criteria, the processing unit 141 changes the cameras 161 used for alignment from the four cameras 1611 to 1614 to the three cameras 161 that are determined to satisfy the criteria. Thereafter, the processing unit 141 ends the flowchart.

[0094] For example, when the cameras 161 used for alignment are changed from cameras 1611-1614 to cameras 1611-1613, the processing unit 141 may adjust the positions of the substrate 100 and the mask 101 so that the centers of gravity of positions P1-P3 coincide with the centers of gravity of target positions T1-T3. Then, the processing unit 141 may rotate the substrate 100 using the position adjustment unit 20 while maintaining the state in which the centers of gravity of positions P1-P3 coincide with the centers of gravity of target positions T1-T3 so that the sum of squares of distances L1-L3 is minimized. Note that the described method is merely an example, and other known techniques may be applied.

[0095] In S311, the processing unit 141 executes a detection unit adjustment process, which is a process for adjusting the detection unit 17. In this processing example, the processing unit 141 displays on the display unit 19 a notice prompting adjustment of the camera 161, which is determined not to satisfy the criteria in S312, among the cameras 1611 to 1614. Thereafter, the processing unit 141 ends the flowchart.

[0096] According to this processing example, statistical processing is performed on the results of the detection processing for each of the cameras 1611 to 1614, so if there is a possibility that the detection accuracy of the detection unit 17 has decreased, it can be determined which camera 161 is causing this. Furthermore, in this processing example, alignment after evaluation of the detection accuracy of the detection unit 17 is performed based on the camera 161 that was determined to satisfy the criteria in S312. Therefore, even if there is a camera 161 that does not satisfy the criteria, it is possible to perform alignment while eliminating the possibility of a decrease in accuracy due to that camera 161.

[0097] In this processing example, statistical processing is performed on the distances L1 to L4 for each of the cameras 1611 to 1614, but the items that are the subject of statistical processing are not limited. For example, the processing unit 141 may calculate the recognition rate of the board fine mark 1008 or the mask fine mark 1018 for each of the cameras 1611 to 1614. In this case, the criterion in S310 may be whether the recognition rate of each mark is equal to or greater than a threshold value. Alternatively, the coordinates of the positions P1 to P4 and the target positions T1 to T4 (see FIG. 6) may be the subject of statistical processing.

[0098] The processes described in each processing example can be combined as appropriate. For example, the detection unit adjustment process may be performed when at least one of the results of statistical processing of the distance between the centers of gravity of the substrate 100 and the mask 101 and the distances L1 to L4 does not satisfy a standard. Alternatively, the accuracy evaluation in S106 may be performed by executing the flowcharts shown in Figures 9(a) and 9(b) in series or in parallel, and the accuracy evaluation may be performed when it is determined in either flowchart that the accuracy evaluation should be performed. That is, the accuracy evaluation of the detection unit 17 may be performed every time the mask 101 is replaced, and the accuracy evaluation of the detection unit 17 may be performed again when the number of realignments within the same lot increases.

[0099] 9. Electronic Device Manufacturing Methods Next, an example of a method for manufacturing an electronic device will be described. Below, as an example of an electronic device, the configuration and manufacturing method of an organic EL display device will be illustrated. In this example, the film formation block 301 illustrated in FIG. 1 is provided in, for example, three locations on the manufacturing line.

[0100] First, the organic EL display device to be manufactured will be described. Fig. 11(a) is an overall view of an organic EL display device 50, and Fig. 11(b) is a diagram showing the cross-sectional structure of one pixel.

[0101] 11(a), a plurality of pixels 52, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 51 of an organic EL display device 50. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

[0102] The term "pixel" as used herein refers to the smallest unit capable of displaying a desired color in the display region 51. In the case of a color organic EL display device, a pixel 52 is configured by a combination of multiple sub-pixels, each of which is a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, each of which emits light differently from one another. The pixel 52 is often configured by a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. The sub-pixels that make up the pixel 52 may be a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element, for example.

[0103] 11(b) is a partial cross-sectional schematic diagram taken along line AB in FIG. 11(a). A pixel 52 has, on a substrate 100, a plurality of subpixels each composed of an organic EL element including a first electrode (anode) 54, a hole transport layer 55, any one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58. Of these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0104] 11(b), the hole transport layer 55 may be formed as a common layer across the plurality of sub-pixel regions, and the red layer 56R, green layer 56G, and blue layer 56B may be formed thereon separately for each sub-pixel region, and the electron transport layer 57 and second electrode 58 may be further formed thereon as a common layer across the plurality of sub-pixel regions.

[0105] In order to prevent short circuits between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0106] 11(b), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but they may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. Furthermore, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 may be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

[0107] Each of the red layer 56R, green layer 56G, and blue layer 56B may be formed of a single light-emitting layer or may be formed by laminating multiple layers. For example, the red layer 56R may be formed of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole-transporting layer or an electron-blocking layer. Alternatively, the lower layer may be a red light-emitting layer and the upper layer being an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this manner, the light-emitting position in the light-emitting layer can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

[0108] Although the example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G or the blue layer 56B. The number of layers may be two or more. Furthermore, layers of different materials may be stacked, such as a light-emitting layer and an electron-blocking layer, or layers of the same material may be stacked, such as two or more light-emitting layers.

[0109] Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R is made up of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are made up of a single light-emitting layer.

[0110] First, a substrate 100 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 100 is not particularly limited, and it can be made of glass, plastic, metal, or the like. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 100.

[0111] A resin layer such as acrylic or polyimide is coated by bar coating or spin coating on the substrate 100 on which the first electrode 54 is formed, and the resin layer is patterned by lithography so as to form an opening in the area where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region where the light-emitting element actually emits light. In this embodiment, the large substrate is processed up to the formation of the insulating layer 59, and after the insulating layer 59 is formed, a dividing step is carried out to divide the substrate 100.

[0112] The substrate 100 with the patterned insulating layer 59 is carried into the first film-forming chamber 303, and the hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display area. The hole transport layer 55 is formed using a mask in which openings are formed for each display area 51, which will ultimately become the panel portion of each organic EL display device.

[0113] Next, the substrate 100 on which the hole transport layer 55 has been formed is carried into the second film formation chamber 303. The substrate 100 and a mask are aligned, and the substrate is placed on the mask. A red layer 56R is then formed on the hole transport layer 55 in the portion of the substrate 100 where the red-emitting elements will be arranged (regions where red subpixels will be formed). The mask used in the second film formation chamber is a high-definition mask with openings formed only in the regions that will become red subpixels among the regions on the substrate 100 that will become subpixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the regions that will become red subpixels among the regions on the substrate 100 that will become subpixels. In other words, the red layer 56R is selectively formed in the regions that will become red subpixels, but not in the regions that will become blue or green subpixels among the regions on the substrate 100 that will become subpixels.

[0114] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber 303, and then the blue layer 56B is formed in the fourth film formation chamber 303. After the formation of the red layer 56R, green layer 56G, and blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation chamber 303. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

[0115] The substrate on which the layers up to the electron transport layer 57 have been formed is moved to the sixth film formation chamber 303, where the second electrode 58 is formed. In this embodiment, each layer is formed by vacuum deposition in the first to sixth film formation chambers 303. However, the present invention is not limited to this, and for example, the second electrode 58 in the sixth film formation chamber 303 may be formed by sputtering. Thereafter, the substrate on which the layers up to the second electrode 58 have been formed is moved to a sealing device, where the protective layer 60 is formed by plasma CVD (sealing step), thereby completing the organic EL display device 50. Note that although the protective layer 60 is formed by the CVD method here, the method is not limited thereto, and the protective layer 60 may also be formed by the ALD method or the inkjet method.

[0116] Here, the films are formed in the first to sixth film formation chambers 303 using masks in which openings corresponding to the patterns of the respective layers to be formed are formed. When forming the films, the relative positions of the substrate 100 and the mask are adjusted (aligned), and then the substrate 100 is placed on the mask and film formation is performed. Here, the alignment process performed in each film formation chamber is performed in the same manner as the alignment process described above.

[0117] <10. Other embodiments> In the above embodiment, the position detection accuracy by the detection unit 17 is evaluated after fine alignment of the substrate 100 and the mask 101, but other configurations can also be adopted. Specifically, if the fine alignment substrate marks 1003 to 1006 and the fine alignment mask marks 1013 to 1016 are located in the imaging regions R1 to R4, respectively, the above-mentioned detection process (S108) and statistical process (S109) can be performed multiple times. Therefore, the processing unit 141 may evaluate the position detection accuracy by the detection unit 17 before rough alignment or between rough alignment and fine alignment, etc.

[0118] The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program. It can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0119] The invention is not limited to the above-described embodiment, and various modifications and variations are possible within the scope of the gist of the invention. [Explanation of symbols]

[0120] 1: film forming device, 2: alignment device, 14: control device, 17: detection unit, 20: position adjustment unit, 141: processing section

Claims

1. a detection means for executing a detection process for detecting the positions of a substrate mark provided on the substrate and the positions of a mask mark provided on the mask; a position adjusting means for adjusting the relative positions of the substrate and the mask based on the result of the detection process by the detecting means; a calculation means for performing statistical processing on results of the detection process performed multiple times by the detection means while the substrate and the mask are kept stationary; and an adjustment means for adjusting the detection means when the result of the statistical processing by the calculation means does not satisfy a standard. A film forming apparatus characterized by:

2. 2. The film forming apparatus according to claim 1, the results are results of the detection process performed multiple times by the detection means after the position adjustment by the position adjustment means; A film forming apparatus characterized by:

3. 3. The film forming apparatus according to claim 1, a determination unit that determines whether or not to execute the detection process multiple times depending on the processing status of the film forming apparatus; A film forming apparatus characterized by:

4. 3. The film forming apparatus according to claim 1, a determining unit that determines whether or not to execute the detection process multiple times in accordance with information about the number of times alignment has been performed by the detecting unit and the position adjusting unit, A film forming apparatus characterized by:

5. 3. The film forming apparatus according to claim 1, the film forming apparatus forms films on a plurality of the substrates using one of the masks; the film forming apparatus further includes a determination unit that determines to execute the detection process multiple times when the mask is replaced. A film forming apparatus characterized by:

6. 3. The film forming apparatus according to claim 1, the film forming apparatus performs film formation on the test substrate carried into the film forming apparatus after the mask replacement, and evaluates a film formation result on the test substrate; the film forming apparatus further includes a determination unit that determines that the detection process is to be performed multiple times on the substrate that is carried into the film forming apparatus after the test substrate. A film forming apparatus characterized by:

7. 7. The film forming apparatus according to claim 1, the adjustment means does not adjust the detection means when the result of the statistical processing satisfies a criterion; A film forming apparatus characterized by:

8. 8. The film forming apparatus according to claim 1, The detection means includes an imaging means for imaging the substrate mark and the mask mark. The adjustment is an adjustment of the position of the imaging means. A film forming apparatus characterized by:

9. The film forming apparatus according to any one of claims 1 to 7, The detection means includes an imaging means for imaging the substrate mark and the mask mark. The adjustment is an adjustment of the focus of the imaging means. A film forming apparatus characterized by:

10. 8. The film forming apparatus according to claim 1, The detection means an imaging means for imaging the board mark and the mask mark; an identification means for identifying the positions of the board mark and the mask mark by pattern matching using the image captured by the imaging means and a model mark, the adjustment is an adjustment of the model mark; A film forming apparatus characterized by:

11. 8. The film forming apparatus according to claim 1, the substrate includes a plurality of the substrate marks; the mask includes a plurality of mask marks respectively corresponding to the plurality of substrate marks; The detection means a plurality of imaging means for respectively imaging a plurality of sets of the substrate marks and the mask marks corresponding to each other; and an identification unit that identifies the positions of the board marks and the mask marks that constitute the set by using the images captured by each of the plurality of imaging units. A film forming apparatus characterized by:

12. The film forming apparatus according to claim 11, the statistical processing is performed for each of the sets; the position adjustment means performs the position adjustment without using the identification result of the identification means for the pair for which the result of the statistical processing does not satisfy a criterion. A film forming apparatus characterized by:

13. 13. The film forming apparatus according to claim 1, a substrate holding means for holding the substrate; a mask holding means for holding the mask, the substrate holding means and the mask holding means are maintained in a stationary state from when one of the plurality of detection processes is performed by the detection means until when another of the detection processes is performed. A film forming apparatus characterized by:

14. 14. The film forming apparatus according to claim 1, the statistical processing includes a process of calculating some or all of an average value, a variance, a standard deviation, a maximum value, and a minimum value for the positions of the substrate marks, the positions of the mask marks, and positions calculated based on at least one of the positions of the substrate marks and the positions of the mask marks, or for relative positions or relative distances therebetween; A film forming apparatus characterized by:

15. a detection means for executing a detection process for detecting the positions of a substrate mark provided on the substrate and the positions of a mask mark provided on the mask; a position adjusting unit that adjusts the relative positions of the substrate and the mask based on the result of the detection process by the detecting unit, a calculation means for performing statistical processing on the results of the detection processing performed multiple times by the detection means while the substrate and the mask are kept stationary; an adjustment means for adjusting the detection means when the result of the statistical processing by the calculation means does not satisfy a standard; A program to function as a

16. a detection means for executing a detection process for detecting the positions of a substrate mark provided on the substrate and the positions of a mask mark provided on the mask; a position adjusting unit that adjusts the positions of the substrate and the mask based on a result of the detection process by the detecting unit, performing the detection process a plurality of times by the detection means while the substrate and the mask are kept stationary; and performing statistical processing on the results of the plurality of detection processes. A method for evaluating position detection accuracy.

17. a step of evaluating the accuracy of position detection of the substrate mark and the mask mark by the method for evaluating position detection accuracy according to claim 16; performing the position adjustment of the substrate and the mask by the position adjustment means; and depositing a film on the substrate through the mask whose position has been adjusted.

1. A method for manufacturing an electronic device comprising the steps of:

18. a detection means for executing a detection process for detecting the positions of a substrate mark provided on the substrate and the positions of a mask mark provided on the mask; a position adjusting unit that adjusts the positions of the substrate and the mask based on a result of the detection process by the detecting unit, performing the detection process a plurality of times by the detection means while the substrate and the mask are kept stationary; performing statistical processing on the results of the multiple detection processes; and if the result of the statistical processing does not satisfy a standard, performing an adjustment of the detection means. A method for adjusting a film forming apparatus.

19. adjusting a film deposition apparatus by the method for adjusting a film deposition apparatus according to claim 18; performing the position adjustment of the substrate and the mask by the position adjustment means; and depositing a film on the substrate through the mask whose position has been adjusted.

1. A method for manufacturing an electronic device comprising the steps of:

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