Display device and manufacturing method thereof

Abstract

To suppress a damage of a rigid substrate when a connection part between a wire and a driving element part is crimped while achieving both flexibility of a display device and sealability of a display unit.SOLUTION: A display device 1 includes a resin substrate 10, a display element part 23 provided in a first region 31 on a surface of the resin substrate 10, a wire 21a provided in a second region 32 on the surface of the resin substrate 10, a driving element part 22 provided in a third region 33 on the surface of the resin substrate 10, and a glass substrate 11 including at least a fourth region 34 on a back surface of the resin substrate 10. The glass substrate 11 extends from the fourth region 34 to a fifth region 35 and a sixth region 36. A thickness d2 of a part of the glass substrate 11 that exists in the sixth region 36 is smaller than a thickness d1 of a part of the glass substrate 11 that exists in the fourth region 34. The glass substrate 11 may be absent in the sixth region 36.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a display device, and more particularly to a display device having a display unit provided on the front surface of a flexible substrate having a rigid substrate on the rear surface, and a manufacturing method thereof. [Background technology]

[0002] With the recent widespread use of portable information terminals and the like, there is a strong demand for thinner, lighter, and more robust display devices to be mounted on these terminals, etc. Furthermore, there has been a growing demand recently for display devices that are also highly flexible, and methods for manufacturing display devices that can meet this demand have been investigated.

[0003] For example, in order to realize a thinner, lighter, and more flexible display device, a manufacturing method for a display device has been considered in which a display element portion and the like are fabricated on a glass substrate, and then the glass substrate is polished to reduce the overall thickness of the glass substrate. Meanwhile, in order to realize a robust and flexible display device, a configuration using a resin substrate and a thin glass substrate as the substrate, or a configuration using only a resin substrate as the substrate, has been considered. Patent Document 1 discloses a manufacturing method for a display device in which thin-film transistors are first formed on a glass substrate, the entire glass substrate is removed, and then the thin-film transistors are transferred to the resin substrate. Patent Document 2 discloses a manufacturing method for a display device in which a resin substrate is formed on a glass substrate, a display element portion and the like are fabricated thereon, and then the resin substrate is separated from the glass substrate.

[0004] Generally, a display device includes a substrate, a display element section provided on the substrate, and a driving IC (Integrated Circuit) electrically connected to the display element section. Thin film transistors and the like are provided within the display element section. With this configuration, when a video signal from an external device is input to the display element section via the driving IC, the thin film transistors are driven in response to the video signal, and the display device displays an image.

[0005] To electrically connect the display element section and the driver IC, there are two methods: directly connecting the driver IC to the wiring electrically connected to the display element section, and connecting it via a flexible printed circuit (hereinafter referred to as FPC). The IC is electrically connected to the wiring drawn out from the display element section on the FPC. When connecting via the FPC, the output terminal of the driver IC is arranged on the FPC and is mounted on the FPC so as to be electrically connected to the wiring provided on the FPC. The output terminal of the FPC is then electrically connected to the wiring drawn out from the display element section on the substrate. In either connection method, an anisotropic conductive adhesive (hereinafter referred to as AC The method of connecting two terminals via ACF (called F) is used. By thermocompression bonding two terminals connected via ACF, an electrical connection can be established between the two terminals. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2002 / 084739 [Patent Document 2] Patent No. 4870156 Summary of the Invention [Problem to be solved by the invention]

[0007] As described above, in order to electrically connect the display element section and the drive element section, it is necessary to connect the wiring electrically connected to the display element section and the drive element section. Specifically, the connection section drawn out from the wiring and the output terminal of the drive element section or the output terminal of the FPC are connected on the substrate. In general, the connection is made by crimping the connection part. When a flexible substrate such as a resin substrate and a rigid substrate such as a thick glass substrate are used, pressure may be applied to the rigid substrate when the connection part is crimped. As a result, the rigid substrate may break or crack. In other words, the rigid substrate may be damaged, which may result in a decrease in the manufacturing yield of the display device.

[0008] On the other hand, in a display device having only a flexible substrate as a substrate, moisture in the air present outside the display element portion may permeate the flexible substrate, and the moisture may deteriorate the display element portion. That is, in a display device having only a flexible substrate as a substrate, the sealing property is insufficient, and therefore the display element portion may deteriorate.

[0009] The present disclosure achieves both flexibility of the display device and sealing performance of the display element section, while suppressing damage to the rigid substrate when the connection section between the wiring and the drive element section is pressure-bonded. [Means for solving the problem]

[0010] A display device according to one embodiment of the present disclosure comprises a flexible substrate, a display element unit provided in a first region on a surface of the flexible substrate, wiring provided in a second region on the surface of the flexible substrate different from the first region and electrically connected to the display element unit, a drive element unit electrically connected to the wiring in a third region on the surface of the flexible substrate different from the first and second regions, and a rigid substrate provided in a fourth region on a back surface of the flexible substrate opposite the first region of the flexible substrate and made of a material having a higher modulus of rigidity than the flexible substrate, wherein the rigid substrate extends from the fourth region to a portion of the fifth region on the back surface of the flexible substrate opposite the second region of the flexible substrate.

[0011] In addition, a display device according to another embodiment of the present disclosure comprises a flexible substrate, a display element unit provided in a first region on a surface of the flexible substrate, wiring provided in a second region on the surface of the flexible substrate different from the first region and electrically connected to the display element unit, a drive element unit electrically connected to the wiring in a third region on the surface of the flexible substrate different from the first and second regions, and a rigid substrate provided in a fourth region on the back surface of the flexible substrate opposite the first region of the flexible substrate and made of a material having a higher rigidity modulus than the flexible substrate, and a first adhesive layer is arranged between the rigid substrate and the flexible substrate.

[0012] In addition, a display device according to another embodiment of the present disclosure comprises a flexible substrate, a display element unit provided in a first region on a surface of the flexible substrate, wiring provided in a second region on the surface of the flexible substrate different from the first region and electrically connected to the display element unit, a drive element unit electrically connected to the wiring in a third region on the surface of the flexible substrate different from the first and second regions, and a rigid substrate provided in a fourth region on a back surface of the flexible substrate opposite the first region of the flexible substrate and made of a material having a higher modulus of rigidity than the flexible substrate, wherein the rigid substrate does not extend to a sixth region on the back surface of the flexible substrate opposite the third region of the flexible substrate. [Effects of the Invention]

[0013] According to one aspect of the present disclosure, the rigid substrate is thin in the portion corresponding to the drive element unit, or the rigid substrate is not present in the portion corresponding to the drive element unit. Therefore, damage to the rigid substrate can be suppressed when a connection portion between the drive element unit and a connection portion drawn from the wiring is crimped to electrically connect the wiring and the drive element unit. Furthermore, according to one aspect of the present disclosure, the rigid substrate is thick in the portion corresponding to the display element unit, ensuring sealing of the display element unit. While achieving both flexibility of the display device and sealing of the display element unit, damage to the rigid substrate can be suppressed when the connection portion between the wiring and the drive element unit is crimped. As a result, a display device with good manufacturing yield and high storage stability can be provided. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic plan view showing a display device according to a first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view of the display device shown in FIG. [Figure 3] 2A and 2B are schematic diagrams showing a method for manufacturing the display device shown in FIG. 1, in which (a) shows a step of preparing a resin substrate having a glass layer on the back surface, (b) shows a step of forming a wiring metal layer, and (c) shows a step of forming a wiring layer. [Figure 4] 2A and 2B are schematic diagrams showing a method for manufacturing the display device shown in FIG. 1, in which (a) is a diagram showing a step of forming a display element portion, and (b) is a diagram showing a step of etching a glass layer. [Figure 5] 2A and 2B are schematic diagrams showing a method for manufacturing the display device shown in FIG. 1, in which FIG. 2A shows a step of forming a glass substrate on the back surface, and FIG. 2B shows a step of forming a driving element section, an adhesive layer, and a sealing layer. [Figure 6] 5A and 5B are schematic diagrams illustrating the step of forming a driving element unit in the manufacturing method of the display device shown in FIG. 1, in which (a) shows the driving element unit before its formation, and (b) shows the step of pressing the driving element unit. [Figure 7] 1A is a schematic cross-sectional view illustrating the effect of the display device according to the first embodiment shown in FIG. 1, and FIG. 1B is a schematic cross-sectional view illustrating the effect of the display device according to the comparative example. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a display device according to a second embodiment. [Figure 9] FIG. 10 is a schematic cross-sectional view showing a display device according to a third embodiment. [Figure 10] 10A and 10B are schematic diagrams showing a display device according to embodiment 4, in which (a) is a plan view of the display device before bending, (b) is a perspective view of the display device after bending as seen from the front side, and (c) is a perspective view of the display device after bending as seen from the back side. [Figure 11] FIG. 11 is a schematic cross-sectional view showing the display device shown in FIG. [Figure 12]FIG. 10 is a schematic cross-sectional view showing a display device according to a fifth embodiment. [Figure 13] FIG. 13 is a schematic cross-sectional view showing a display device according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] <Background to one aspect of the present invention> As described above, to electrically connect the display element unit and the drive element unit, it is necessary to connect the wiring electrically connected to the display element unit with the drive element unit. Specifically, a connection portion drawn from the wiring is generally connected to an output terminal of the drive element unit or an output terminal of an FPC on a substrate, and the connection portion is then crimped. Here, when a flexible substrate such as a resin substrate and a rigid substrate such as a thick glass substrate are used, pressure may be applied to the rigid substrate when the connection portion is crimped. As a result, there is a risk of breakage or cracks occurring in the rigid substrate. In other words, damage to the rigid substrate may reduce the manufacturing yield of display devices.

[0016] On the other hand, in a display device having only a flexible substrate as a substrate, moisture in the air present outside the display element unit may penetrate the flexible substrate, and the moisture may deteriorate the display element unit. That is, in a display device having only a flexible substrate as a substrate, the sealing property is insufficient, and therefore the display element unit may deteriorate. Based on the above circumstances, the present inventors have conceived one embodiment of the present disclosure, which will be described below.

[0017] <Summary of one aspect of the present disclosure> A display device according to one aspect of the present disclosure includes a flexible substrate, a display element unit provided in a first region on a surface of the flexible substrate, wiring provided in a second region on the surface of the flexible substrate that is different from the first region and electrically connected to the display element unit, a drive element unit electrically connected to the wiring in a third region on the surface of the flexible substrate that is different from the first and second regions, and a fourth region on a back surface of the flexible substrate that faces the first region of the flexible substrate. and a rigid substrate made of a material having a higher modulus of rigidity than the flexible substrate, wherein the rigid substrate is not present in a fifth region on the back surface of the flexible substrate facing the second region of the flexible substrate and a sixth region on the back surface of the flexible substrate facing the third region of the flexible substrate, or the rigid substrate extends from the fourth region to the fifth region and the sixth region, and the thickness of the portion of the rigid substrate present in the sixth region is thinner than the thickness of the portion of the rigid substrate present in the fourth region.

[0018] In a display device according to one aspect of the present disclosure, it is possible to achieve both flexibility of the display device and sealing properties of the display element section, while suppressing damage to the rigid substrate when crimping the connection portion between the wiring and the drive element section.

[0019] In another aspect of the display device according to the above aspect, the rigid substrate may be a glass substrate, and the flexible substrate may be a resin substrate. Also, the thickness of the portion of the rigid substrate (glass substrate) present in the fourth region may be greater than 1 μm and less than 200 μm.

[0020] According to the above-described alternative embodiment, by making the thickness of the glass substrate greater than 1 μm, the portion of the glass substrate present in the fourth region can prevent moisture from entering the display element section from the outside. Therefore, the sealing performance of the display element section can be ensured. Furthermore, by making the thickness of the glass substrate 200 μm or less, the glass substrate is less likely to break or crack even when the display device is bent.

[0021] In addition, in another aspect of the display device according to the above one aspect, the rigid substrate may extend from the fourth region to the fifth region and the sixth region, and the thickness of the portion of the rigid substrate existing in the sixth region may be greater than 0 μm and less than 1 μm.

[0022] According to the above-described another aspect, it is possible to prevent breakage or cracks from occurring in the glass substrate during the pressure bonding step of the drive element portion.

[0023] In another aspect of the display device according to the above aspect, the thickness of the rigid substrate in the entire fourth region may be greater than the thickness of the rigid substrate in the sixth region.

[0024] According to the above-mentioned alternative embodiment, the sealing performance in the display element section can be maintained better than in a display device in which a rigid substrate having a thickness equal to or less than that of the rigid substrate in the sixth region is arranged in part of the fourth region.

[0025] In another aspect of the display device according to the above aspect, the rigid substrate may extend from the fourth region to the fifth region and the sixth region, and the rigid substrate may have a tapered portion that is thinner toward the sixth region. Also, an end of the tapered portion of the rigid substrate that is closer to the fourth region may be located closer to an inner peripheral edge of the drive element unit than an outer peripheral edge of the display element unit.

[0026] According to the above aspect, the sealing performance of the display element portion can be further improved.

[0027] Furthermore, the rigid substrate may extend from the fourth region to the fifth and sixth regions, the display element portion may include an emitting layer made of an organic material and an element sealing layer surrounding the emitting layer, and the rigid substrate may have a tapered portion in the fourth region that is thinner toward the sixth region, and the end of the tapered portion farther from the sixth region may be located within the fourth region and outside the outer peripheral edge of the emitting layer.

[0028] According to the above-described another aspect, the region of the tapered portion where the thickness decreases is disposed outside the light-emitting layer which is easily affected by moisture and the like, thereby making it possible to suppress deterioration of the sealing property of the display device.

[0029] In another aspect of the display device according to the above aspect, the drive element unit may include a drive IC that supplies power to the display element unit, and the wiring may be connected to the drive IC. Also, the flexible substrate may have a bending portion in the fifth region, and the flexible substrate may be bent at the bending portion.

[0030] According to the above-described alternative embodiment, the driver element unit is configured with a circuit board and a driver IC, which increases the design freedom in terms of the location of the driver IC. For example, if the driver IC is provided on the outside of the circuit board (on the outer periphery of the display device), the circuit board can be bent to narrow the edges of the display device.

[0031] In addition, in another aspect of the display device according to the above one aspect, the thickness of the rigid substrate at the bending point may be thinner than the thickness of the rigid substrate in the fourth region, and thicker than the sum of the thickness of the rigid substrate in the fifth region and the thickness of the rigid substrate in the sixth region.

[0032] According to the above-described alternative embodiment, the display device can be made smaller and thinner.

[0033] In addition, in another aspect of the display device according to the above one aspect, the thickness of the rigid substrate at the bending point may be thinner than the sum of the thickness of the rigid substrate in the fourth region and the thickness of the rigid substrate in the sixth region.

[0034] According to the above-described another aspect, when the display device is bent, the thickness of the glass substrate at the bending portion can be reduced, thereby reducing the stress applied to the bending portion of the glass substrate, where the stress is greatest, and as a result, the sealing performance of the display element portion can be further improved.

[0035] Furthermore, a manufacturing method of a display device according to one embodiment of the present disclosure includes the steps of: forming a flexible substrate on a surface of a rigid substrate; forming a display element section in a first region of the surface of the flexible substrate; forming wiring electrically connected to the display element section in a second region of the surface of the flexible substrate different from the first region; pressing a connection region to electrically connect a drive element section and the wiring in a third region of the surface of the flexible substrate different from the first and second regions; and etching at least a portion of the rigid substrate, wherein in the etching step, etching is performed to remove all of the rigid substrate present in a sixth region of the back surface of the flexible substrate opposite the third region of the flexible substrate, or etching is performed to leave at least the rigid substrate present in a fourth region of the back surface of the flexible substrate opposite the first region of the flexible substrate and to reduce the thickness of the rigid substrate present in the sixth region of the back surface of the flexible substrate opposite the third region of the flexible substrate.

[0036] A manufacturing method for a display device according to one aspect of the present disclosure can achieve both flexibility of the display device and sealing properties of the display element section, while suppressing damage to the rigid substrate when crimping the connection portion between the wiring and the drive element section.

[0037] In another aspect of the method for manufacturing a display device according to the above aspect, the rigid substrate may be a glass substrate, and the flexible substrate may be a resin substrate. The thickness of the portion present in the fourth region may be greater than 1 μm and not greater than 200 μm.

[0038] According to the above-described alternative embodiment, by making the thickness of the glass substrate greater than 1 μm, the portion of the glass substrate present in the fourth region can prevent moisture from entering the display element section from the outside. Therefore, the sealing performance of the display element section can be ensured. Furthermore, by making the thickness of the glass substrate 200 μm or less, the glass substrate is less likely to break or crack even when the display device is bent.

[0039] In addition, in another aspect of the method for manufacturing a display device according to the above aspect, the etching step may be performed so that the thickness of the portion of the rigid substrate existing in the sixth region is greater than 0 μm and not more than 1 μm.

[0040] According to the above-described another aspect, it is possible to prevent breakage or cracks from occurring in the glass substrate during the pressure bonding step of the drive element portion.

[0041] In another aspect of the method for manufacturing a display device according to the above aspect, the thickness of the rigid substrate in the entire fourth region may be greater than the thickness of the rigid substrate in the sixth region.

[0042] According to the above-mentioned alternative embodiment, the sealing performance in the display element section can be maintained better than in a display device in which a rigid substrate having a thickness equal to or less than that of the rigid substrate in the sixth region is arranged in part of the fourth region.

[0043] In another aspect of the method for manufacturing a display device according to the above aspect, in the etching step, etching may be performed so that a recessed end of the rigid substrate formed by the etching is located within the fifth region. In the etching step, at least a portion of the rigid substrate present in the fifth region may be etched into a tapered shape such that the thickness decreases from the fourth region side to the sixth region side. In the etching step, etching may be performed so that a start point of the tapered shape is located closer to the inner peripheral edge of the drive element unit than the outer peripheral edge of the display element unit, and a finish point of the tapered shape is located closer to the inner peripheral edge of the drive element unit than the start point.

[0044] According to the above-described alternative embodiment, the thickness of the glass substrate in the sixth region is thinner than the thickness of the glass substrate in the fourth region, thereby making it possible to suppress damage and cracks in the glass substrate in the sixth region.

[0045] <First Embodiment> The display device according to the first embodiment of the present disclosure will be described in detail below with reference to FIGS.

[0046] 1. Overall structure FIG. 1 is a schematic plan view showing a display device according to embodiment 1. As shown in FIG. 1, display device 1 includes a flexible substrate 10, a display unit 20, wiring 21a, and a drive element unit 22. FIG. 2 is a schematic cross-sectional view of the display device shown in FIG. 1 taken along line II-II. As shown in FIG. 2, display device 1 includes, in addition to the configuration shown in FIG. 1, a rigid substrate 11, a connection unit 21b, an adhesive layer 24, and a sealing layer 25. Flexible substrate 10 may be any flexible substrate, and may be, for example, a resin substrate. Rigid substrate 11 may be any substrate with high rigidity, and may be, for example, a glass substrate. In embodiment 1, a resin substrate is used as flexible substrate 10, and a glass substrate is used as rigid substrate 11.

[0047] The display device 1 is a flexible organic electroluminescence (EL) display panel. It is a top emission type in which light from the display element section 23 is extracted from the opposite side of the resin substrate 10. A plurality of organic EL elements are arranged in the display section 20. Each component of the display device 1 will be specifically described below. 2.Each part configuration [Resin substrate 10] The resin substrate 10 is a resin film made of a flexible material. A first region 31, a second region 32, and a third region 33 exist on a front surface 10a of the resin substrate 10. A fourth region 34 corresponding to the first region 31, a fifth region 35 corresponding to the second region 32, and a sixth region 36 corresponding to the third region 33 exist on a back surface 10b of the resin substrate 10. A display unit 20 is provided in the first region 31, wiring 21a is provided in the second region 32, and a drive element unit 22 is provided in the third region 33.

[0048] The material of the resin substrate 10 is, for example, polyimide, but is not limited to this, and the material of the resin substrate 10 may be, for example, polyester, polyphenylene sulfide, polyamide, polyamideimide, polycarbonate, cyclic polyolefin, acrylic resin, etc.

[0049] [Glass substrate 11] The glass substrate 11 extends from a fourth region 34 on the rear surface 10b of the resin substrate 10 to a fifth region 35 and a sixth region 36. The dashed line in FIG. 1 indicates a boundary portion (concave end surface) 11b where the thickness of the glass substrate 11 changes. The thickness of the glass substrate 11 is thinner in an L-shaped region located outside the dashed line (toward the outer periphery of the display device 1). Returning to FIG. 2, the boundary portion 11b where the thickness of the glass substrate 11 changes has a stepped shape when the glass substrate 11 is viewed in cross section. A thickness d2 of the portion of the glass substrate 11 located in the sixth region 36 is thinner than a thickness d1 of the portion of the glass substrate 11 located in the fourth region 34. The thickness of the glass substrate 11 is d1 throughout the entire fourth region 34 of the glass substrate 11, which is thicker than the thickness d2 of the glass substrate 11 in the sixth region 36. The thickness d1 of the glass substrate 11 in the fourth region 34 does not necessarily have to be constant, as long as it is within a range of greater than 1 μm and less than 200 μm. Similarly, the thickness d2 of the glass substrate 11 in the sixth region 36 does not necessarily have to be constant, as long as it is within a range of greater than 0 μm and less than 1 μm. In this case, the thicknesses d1 and d2 of the glass substrate 11 are the average thicknesses of the portion in the fourth region 34 and the portion in the sixth region 36, respectively. The thickness d1 of the glass substrate 11 is, for example, greater than 1 μm and less than 200 μm. By making the thickness d1 of the glass substrate 11 greater than 1 μm, the portion of the glass substrate 11 in the fourth region 34 can prevent moisture from entering the display element section 23 from the outside. This ensures the sealing of the display element section 23. Furthermore, by making the thickness d1 of the glass substrate 11 200 μm or less, the glass substrate 11 is less likely to break or crack even when the display device 1 is bent. On the other hand, the thickness d2 of the glass substrate 11 is greater than 0 μm and equal to or less than 1 μm. If the thickness d2 of the glass substrate 11 is greater than 1 μm, there is a risk that the glass substrate 11 may break or crack during the process of pressing the drive element section 22. This will be described later.

[0050] The material of the glass substrate 11 is a material having a higher modulus of rigidity than the material of the resin substrate 10, such as alkali-free glass. However, the material of the glass substrate 11 is not limited to this, and may be soda glass, non-fluorescent glass, phosphate glass, borate glass, quartz, or the like.

[0051] [Display] The display element section 23 includes an organic EL element, a planarizing layer, and a TFT (Thin Film Transistor) layer. The organic EL element is disposed on the TFT layer via the planarizing layer.

[0052] An organic EL element comprises an anode, a light-emitting layer made of an organic material, a cathode, and an element sealing layer. Hereinafter, the region where the light-emitting layer is disposed is referred to as the "light-emitting region." The light-emitting region is a region where light is emitted from the outside. The anode, light-emitting layer, and cathode are covered with an element encapsulation layer to prevent deterioration due to moisture penetration. In other words, the light-emitting layer is surrounded by the element encapsulation layer. The element encapsulation layer is composed of an inorganic encapsulation layer primarily composed of an inorganic material and a resin encapsulation layer primarily composed of a resin material. In the display element unit 23, an inorganic encapsulation layer is disposed above the light-emitting region, and the periphery of the inorganic encapsulation layer is further covered with a resin encapsulation layer. Although not shown, as can be seen from FIG. 2, the outer peripheral edge of the inorganic encapsulation layer constituting the encapsulation layer 25 is located closer to the drive element unit 22 than the light-emitting region of the display element unit 23, and the outer peripheral edge of the resin encapsulation layer covering the periphery of the inorganic encapsulation layer is located closer to the drive element unit 22 than the outer peripheral edge of the inorganic encapsulation layer. Furthermore, the boundary portion 11b where the thickness of the glass substrate 11 changes is located closer to the drive element unit 22 than the outer peripheral edges of the display element unit 23 and the encapsulation layer 25. That is, the boundary portion 11b where the thickness of the glass substrate 11 changes is located in an area closer to the driving element section 22 than the light-emitting area of ​​the organic EL element.

[0053] The TFT layer includes elements such as thin-film transistors and capacitors, and an insulating layer. The thin-film transistors function to drive the organic EL elements. Wiring such as selection lines, power lines, and signal lines is connected to the electrodes that make up the thin-film transistors.

[0054] [Wiring layer 21] The wiring layer 21 is composed of wiring 21a and connection portions 21b. The wiring 21a is electrically connected to the organic EL elements in the display element portion 23. The material of the wiring layer 21 is, for example, copper (Cu). However, the material of the wiring layer is not limited to this and may be any conductive material such as a metal.

[0055] [Drive element section 22] The driving element section 22 is a member electrically connected to the wiring layer 21 and supplies power to the display element section 23. The driving element section 22 is composed of a driving IC. The driving IC is directly connected to the connection section 21b using an ACF (not shown). This connects the wiring 21a to the driving IC. When driving the display device 1, a video signal input from an external video device is input from the driving IC to the display element section 23 via the connection section 21b.

[0056] 3. Manufacturing method of display device 1 Next, a method for manufacturing the display device 1 will be described with reference to the drawings. Figures 3(a) to 3(c), 4(a) to 4(b), and 5(a) to 5(b) are diagrams showing the steps of the method for manufacturing the display device shown in Figure 1.

[0057] 3(a), a resin substrate 10 having a glass layer 11a on the back surface is prepared. Specifically, the resin substrate 10 made of polyimide is formed on the glass layer 11a made of alkali-free glass.

[0058] 3(b), a wiring layer material 21c is laminated on the resin substrate 10. Specifically, for example, the wiring layer material 21c is laminated by sputtering so as to have a thickness of about several hundred nm.

[0059] 3(c), the wiring layer 21 is formed on the resin substrate 10. Specifically, a resist pattern is formed on the wiring layer material 21c by photolithography, and the wiring layer material 21c is etched using the resist as a mask, thereby forming the wiring layer 21.

[0060] 4(a), the display element section 23 is formed on the resin substrate 10. The display element section 23 is connected to the wiring layer 21. At the end of this process, a sealing layer is formed in the display element section 23.

[0061] Next, as shown in FIG. 4(b), the glass layer 11a is wet-etched using a resist 51 formed by photolithography so as to cover the glass layer 11a present in the fourth region 34 on the rear surface of the resin substrate 10 as a mask.

[0062] 5(a), the portions where the resist 51 was not formed are etched, and the thickness of these portions is reduced to form the glass substrate 11. As will be described later, the etching is performed so that the concave end surface 11b of the glass substrate 11 formed by the etching is located within the fifth region 35.

[0063] Furthermore, as shown in FIG. 5(b), the driving element section 22 is pressure-bonded to the connecting section 21b, and a sealing layer 25 is attached to the display element section 23 via an adhesive layer 24, thereby completing the display device 1.

[0064] The crimping of the driving element section 22 and the connecting section 21b will be described in detail below.

[0065] Figure 6(a) is a schematic diagram illustrating the process of forming a driving element unit in the display device shown in Figure 1, and shows the state before the driving element unit is formed, and Figure 6(b) shows the process of pressing the driving element unit.

[0066] The driving element section 22 and the connection section 21b are thermocompression bonded via an ACF (anisotropic conductive adhesive). The state before thermocompression bonding is shown in FIG. 6(a). Specifically, first, the connection section 21b is cleaned with acetone or the like. Next, ACF is attached to the connection section 21b, and after aligning the pressure bonding head 52 and the driving element section 22 as shown in FIG. 6(b), temporary compression bonding is performed. Thereafter, the connection section 21b and the driving element section 22 are fully compressed via the ACF. The fully compressed bonding is performed by pressing the driving element section 22 and the connection section 21b provided with the ACF while heating the driving element section 22. As a result, good adhesion and conductivity can be obtained between the connection section 21b and the driving element section 22.

[0067] 4.Effects In the display device 1 according to the first embodiment, breakage or cracks are unlikely to occur in the portion of the glass substrate 11 present in the sixth region 36 when the drive element section 22 is pressure-bonded. Even if a crack occurs in the portion of the glass substrate 11 present in the sixth region 36 when the drive element section 22 is pressure-bonded, it is unlikely to spread to the portion of the glass substrate 11 present in the fourth region 34. This effect will be described below with reference to FIGS. 7(a) and 7(b).

[0068] FIG. 7(a) is a schematic cross-sectional view illustrating the effect of the display device 1 according to the first embodiment. The thickness d2 of the glass substrate 11 in the sixth region 36 is greater than 0 μm and is 1 μm. On the other hand, FIG. 7(b) is a schematic cross-sectional view illustrating the effect of the display device 901 according to the comparative example. The thickness d902 of the glass substrate 11 in the sixth region 36 is greater than 1 μm.

[0069] When the pressure bonding head 52 presses the drive element section 22, stress is generated in the glass substrate 911 in the portion present in the sixth region 36 in the display device 901 according to the comparative example. In the display device 1, stress is also generated in the glass substrate 11 in the portion present in the sixth region 36, as in the display device 901. However, the stress generated in the glass substrate 911 in the portion present in the sixth region 36 is greater than the stress generated in the glass substrate 11 in the portion present in the sixth region 36. This is because the strain due to pressure is greater in the glass substrate 911 in the portion present in the sixth region 36, which has a thick thickness d902, than in the glass substrate 11 in the portion present in the sixth region 36, which has a thin thickness d2, and the tensile stress is greater. As a result, in the display device 901, the glass substrate 11 in the portion present in the sixth region 36 may break or crack. This causes The crack propagates to the portion of the glass substrate 11 present in the fourth region 34, and as a result, the sealing performance of the display element section 23 deteriorates.

[0070] In contrast, in the display device 1 according to the first embodiment, the thickness of the portion of the glass substrate 11 present in the sixth region is sufficiently thin, so that the glass substrate 11 is prevented from breaking or cracking even when pressed. Even if a crack occurs in the portion of the glass substrate 11 present in the sixth region 36, the tensile stress in the portion of the glass substrate 11 present in the sixth region 36 is suppressed, so that the crack is prevented from propagating to the portion of the glass substrate 11 present in the fourth region 34. As a result, a display device with good manufacturing yield and high storage stability can be provided.

[0071] Note that, in order to suppress damage such as cracks to the glass substrate 11 when bending stress is applied to the display device 1 according to the first embodiment, the thickness of the glass substrate 11 in the fifth region 35 may be thin. Furthermore, the thickness of the glass substrate 11 in the fifth region 35 may be the same as the thickness of the glass substrate 11 in the sixth region. This is because, as the difference between the thickness of the glass substrate 11 in the sixth region 36 and the thickness of the glass substrate 11 in the fourth region 34 and the fifth region 35 increases, damage such as cracks is more likely to occur in the portions of the glass substrate 11 where the thickness changes when bending stress is applied to the display device 1. In the display device 1 shown in FIG. 7(a), the portion of the glass substrate 11 in the sixth region 36 remains, thereby suppressing damage to the glass substrate 11 when bending stress is applied to the display device 1.

[0072] As described above, in the display device 1 according to the first embodiment, the thickness d2 of the glass substrate 11 in the portion present in the sixth region 36 is greater than 0 μm and equal to or less than 1 μm. As a result, the thickness d2 of the glass substrate 11 in the portion present in the sixth region 36 is thinner than the thickness d1 of the glass substrate in the fourth region 34. This makes it possible to ensure the sealing of the display element unit 23 while suppressing damage to the glass substrate 11 that occurs when connecting the drive element unit 22 to the connection portion 21b.

[0073] <Embodiment 2> 8 shows a schematic cross-sectional view of a display device 201 according to embodiment 2. Embodiment 2 differs from embodiment 1 in that the portion where the thickness of the glass substrate changes is tapered. Note that only the differences between the two will be described below, and the same reference numerals will be used to designate common components, and a description thereof will be omitted.

[0074] The thickness d2 of the portion of the glass substrate 211 present in the sixth region 36 is thinner than the thickness d1 of the portion of the glass substrate 211 present in the fourth region 34. The boundary portion where the thickness of the glass substrate 211 changes is a tapered portion 211b with a gradual change in thickness. In the tapered portion 211b, the thickness of the glass substrate 211 becomes thinner toward the sixth region 36. To manufacture the glass substrate 211 having the tapered portion 211b, the etching rate of the resist may be adjusted in the wet etching shown in FIG. 4(b). In this manner, at least a portion of the glass substrate 211 present in the fifth region 35 is etched into a tapered shape such that the thickness becomes thinner from the fourth region 34 side to the sixth region 36 side.

[0075] The start point of the tapered portion 211b, i.e., the end 211b1 closer to the fourth region 34, is located closer to the inner peripheral edge 22a of the drive element section 22 (i.e., closer to the sixth region 36) than the outer peripheral edge 40 of the display section 20 or the display element section 23. Furthermore, the end point of the tapered portion 211b, i.e., the end 211b2 farther from the fourth region 34, is located closer to the inner peripheral edge 22a of the drive element section 22 (i.e., closer to the sixth region 36) than the end 211b1. As a result, the thickness d2 of the glass substrate 211 in the sixth region 36 is smaller than the thickness d2 of the glass substrate 211 in the fourth region 34. As a result, damage and cracks in the portion of the glass substrate 211 existing in the sixth region 36 can be suppressed.

[0076] In the display device 201 according to the second embodiment, it is possible to make the change between the thickness d1 of the glass substrate 211 in the portion present in the fourth region 34 and the thickness d2 of the glass substrate 211 in the sixth region 36 gentle. This makes it possible to suppress damage to the glass substrate 211 and the propagation of cracks. This makes it possible to suppress the propagation of breaks and cracks in the portion of the glass substrate 211 present in the sixth region 36, and as a result, makes it possible to suppress cracks in the portion of the glass substrate 211 present in the fourth region 34. Therefore, in the display device 201 according to the second embodiment, it is possible to further improve the sealing performance of the display element section 23.

[0077] A preferred shape of the tapered portion will be described below.

[0078] The end point of the tapered portion 211b, i.e., the end 211b2 farther from the fourth region 34, may be located closer to the display element section 23 than the inner peripheral edge 22a of the drive element section 22. This makes the thickness of the glass substrate 211 present in the sixth region 36 uniform. This makes it possible to flatten the portion of the glass substrate 211 present in the sixth region 36, and therefore makes it possible to make uniform the pressure applied to the portion of the glass substrate 211 present in the sixth region 36 in the pressure-bonding step throughout the sixth region 36. As a result, it is possible to reduce variations in the adhesive strength and conductivity of the ACF.

[0079] Furthermore, the starting point of the tapered portion 211b, i.e., the end portion 211b1 closer to the fourth region 34, may be located closer to the drive element section 22 than the outer peripheral edge 23a of the display element section 23. This can further improve the sealing performance of the display element section 23. Note that the outer peripheral edge 23a of the display element section 23 refers to the outer peripheral edge of the sealing layer 25 that seals the organic EL elements.

[0080] Furthermore, when the display element unit 23 includes a light-emitting layer made of an organic material and an element sealing layer formed to surround the light-emitting layer, the following configuration may be used. The glass substrate 211 may have a tapered portion in the fourth region 34 that is thinner toward the sixth region 36, and the end of this tapered portion farther from the sixth region may be located within the fourth region 34, outside the outer peripheral edge of the light-emitting layer surrounded by the element sealing layer (toward the outer periphery of the display device 201). In particular, the starting point of the tapered portion 211b, i.e., the end 211b1 closer to the fourth region 34 (the end farther from the sixth region 36), may be located outside the outer peripheral edge of the light-emitting layer (light-emitting region) of the display element unit 23 surrounded by the element sealing layer (toward the outer periphery of the display device 201). This not only maintains good sealing performance in at least the light-emitting region, but also ensures a long horizontal width D1 of the tapered portion 211b. If the horizontal width D1 of the tapered portion 211b is long, the thickness of the glass substrate 211 changes gradually and gently, which can further prevent damage to the display device. Note that the number of tapered portions is not necessarily one, and two or more may be used.

[0081] <Third Embodiment> 9 shows a schematic cross-sectional view of a display device 301 according to embodiment 3. Embodiment 3 differs from embodiment 1 in that there is no glass substrate in the sixth region 36. Note that only the differences between the two will be described below, and the same reference numerals will be used to designate common components, and description thereof will be omitted.

[0082] In the display device 301 according to the third embodiment, the glass substrate 311 extends from the fourth region 34 to a part of the fifth region 35 on the display element section 23 side. Therefore, no pressure is applied to the glass substrate 311 when the drive element section 22 is pressure-bonded, and therefore no stress is generated within the glass substrate 311. Therefore, the glass substrate 311 can be prevented from breaking or cracking.

[0083] <Fourth Embodiment> 10(a) to 10(c) are schematic plan views of a display device 401 according to embodiment 4, and FIG. 11 is a schematic cross-sectional view taken along the dashed line XI-XI in FIG. 10(b). Embodiment 4 differs from embodiment 1 in that the display device is folded at a folding point provided in the fifth region 35. Note that only the differences between the two will be described below, and the same reference numerals will be used to designate common components, and a description thereof will be omitted.

[0084] When the display device 401 is folded at the positions of the two-dot chain lines α and β shown in FIG. 10(a), the display unit 20 appears on the front side as shown in FIG. 10(b), and the drive element unit 22 is disposed on the back side as shown in FIG. 10(c). The glass substrate 11 in the sixth region 36 is folded and stored. As shown in FIG. 11 (a cross-sectional view taken along line XI-XI in FIG. 10(b)), the resin substrate 10 is folded into a substantially U-shape in the fifth region 35, and the drive element unit 22 is disposed below the display element unit 23. That is, the glass substrate 11 in the sixth region 36 is disposed on the opposite side of the display element unit 23 with the resin substrate 10 and the glass substrate 11 in the fifth region 35 sandwiched therebetween. This prevents the drive element unit 22 from protruding outside the display device 401, thereby enabling the display device 401 to have narrower edges.

[0085] The thickness d6 of the glass substrate 11 at the point where the driving element section 22 is bent (the position of the two-dotted lines α and β shown in Figure 10(a)) is thinner than the thickness d1 of the glass substrate 11 in the fourth region 34, and is thicker than the sum of the thickness d2 of the glass substrate 11 in the fifth region 35 and the thickness d2 of the glass substrate 11 in the sixth region 36.

[0086] According to the above configuration, the glass substrate 11 present in the sixth region 36 is folded and stored, so that the display device 401 can be made smaller and thinner.

[0087] <Fifth Embodiment> 12 is a schematic cross-sectional view of a display device 501 according to embodiment 5. Embodiment 5 differs from embodiment 4 in that the boundary portion between the glass substrates at different thicknesses is tapered rather than stepped. Note that only the differences between the two will be described below, and the same reference numerals will be used to designate common components, and a description thereof will be omitted.

[0088] In the display device 501 according to the fifth embodiment, the boundary between different thicknesses of the glass substrate 511 forms a tapered portion 511b. Given that the glass substrate 511 has one end 511c1 of a bent portion and the other end 511c2 of the bent portion, the start position 511b1 of the tapered shape is located farther from the outer peripheral edge 40 of the display unit 20, on which the display element unit 23 is formed, than the one end 511c1 of the bent portion. Furthermore, the end position 511b2 of the tapered shape is located farther from the outer peripheral edge 40 of the display unit 20, on which the display element unit 23 is formed, than the taper start position 511b1. This allows the bent portion α of the glass substrate 511 to be located in a region where the thickness of the glass substrate 511 is thinner. Therefore, even when the display device 501 is bent at the bent portion α, the glass substrate 511 is less likely to break or crack. This improves the sealing performance of the display element unit 23.

[0089] 12, the thickness d5 of the glass substrate at the bending point α is thinner than the sum of the thickness d4 of the glass substrate 511 in the fourth region 34 and the thickness d3 of the glass substrate 511 in the sixth region 36. This allows the thickness of the glass substrate 511 at the bending point α to be thinner when the display device 501 is bent, thereby reducing the stress applied to the bending point α of the glass substrate 511, which is the area where the stress is greatest in the glass substrate 511. As a result, the sealing performance of the display element section 23 can be further improved.

[0090] <Sixth Embodiment> A schematic cross-sectional view of a display device 601 according to the sixth embodiment is shown in Fig. 13. The sixth embodiment differs from the above-mentioned embodiments in that the driving element section is a flexible printed circuit (FPC) board on which a driving IC is mounted. The differences between the two are described below. The same reference numerals will be used for common components and the description thereof will be omitted.

[0091] In a display device 601 according to the sixth embodiment, a driving element section is composed of an FPC 622 and a driving IC (not shown). The FPC 622 includes a base film 622a, connection wiring 622b, and a cover film 622c. The connection section 21b and the FPC 622 are connected by pressure bonding via an ACF (anisotropic conductive adhesive) 661. This connects the wiring 21a to the FPC 622. An adhesive layer 662 is laminated above the pressure-bonded region between the connection section 21b and the FPC 622. An adhesive layer 663 is also provided so as to cover the glass substrate 11, the resin substrate 10, the ACF 661, etc. The driving element section does not include the ACF 661.

[0092] In this configuration, a driving IC (not shown) and wiring 21a are connected via an FPC 622. When connecting via an FPC, the output terminal of the driving IC is disposed on the FPC and is mounted on the FPC so as to be electrically connected to the wiring provided on the FPC. The output terminal of the FPC is then electrically connected on the FPC to wiring 21a drawn out from the display element unit 23.

[0093] In this way, by configuring the drive element unit with the FPC 622 and the drive IC, the degree of freedom in design is improved regarding the location of the drive IC. For example, if the drive IC is provided outside the FPC 622 (on the outer periphery of the display device 601), the FPC 622 can be bent to narrow the edges of the display device 601.

[0094] <Modification> The display device according to one aspect of the present disclosure is not limited to the configurations shown in the above-described embodiments. Modifications will be specifically described below.

[0095] (display device) In the above-described embodiments, the display device is of a top emission type, but is not limited to this and may be of a bottom emission type.

[0096] In the fourth embodiment, the display device is folded back at the folding portion, but this is not limiting and the display device may be folded at any angle. The folding angle can be determined appropriately according to the product specifications.

[0097] (rigid substrate) In the above-described embodiments, the rigid substrate is a glass substrate, but the rigid substrate is not limited to this and may be made of a material having a higher rigidity than the flexible substrate, such as ceramics or alumina.

[0098] In addition, in the above-described embodiments, wet etching is used to thin the rigid substrate, but other methods such as dry etching and polishing may also be used.

[0099] Furthermore, in the above-described embodiments, the thickness of the rigid substrate is thin in the L-shaped region located outside the dashed line shown in Fig. 1. However, this is not limiting, and it is sufficient that the thickness of the rigid substrate is thin at least in the portion located in the sixth region 36.

[0100] (Flexible board) In the above-described embodiments, the flexible substrate is a resin substrate, but is not limited to this. For example, the flexible substrate may be a fiber-reinforced plastic substrate containing glass fiber or carbon fiber, or an organic-inorganic composite resin substrate containing an inorganic filler such as silica or zeolite.

[0101] Although the flexible substrate is shown to be composed of only one layer, the present invention is not limited to this, and a gas barrier layer may be provided on the flexible substrate to improve sealing performance. Materials for the gas barrier layer include, for example, silicon nitride, silicon oxide, silicon oxynitride, silicon carbonate, etc., as well as metals such as aluminum, germanium, zirconium, hafnium, molybdenum, tungsten, chromium, silver, copper, and titanium, and thin films of oxides of these metals.

[0102] In the above-described embodiments, the rigid substrate and the flexible substrate are in direct contact with each other, but this is not limiting, and an adhesive layer may be disposed between the rigid substrate and the flexible substrate. In this case, examples of materials for the adhesive layer include silicone resin, acrylic resin, and polyimide resin.

[0103] (Display) In the above-described embodiments, the organic EL element is configured with an anode, a light-emitting layer, and a cathode. However, the organic EL element may further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.

[0104] (wiring) In the above-described embodiments, the wiring and the connection portion are integrally formed, but this is not limiting, and the wiring and the connection portion may be electrically connected to separate members. Furthermore, the connection between the wiring and the drive element portion is not limited to ACF, and may be made using NCF (non-conductive film). Note that the method of connecting the drive element portion and the connection portion may be a method other than crimping.

[0105] (Drive element part) In addition to the configuration of the above embodiment, the driving element section may be covered with a separate protective film.

[0106] (others) In the above-described embodiment, the glass layer is thinned after the display unit is formed, but this is not limiting. The glass layer may be thinned before the drive element unit is pressed and bonded, for example, before the display unit is formed.

[0107] Although a display device according to one aspect of the present disclosure and a manufacturing method thereof have been described above, the present disclosure is not limited to the above-described embodiments except for the essential characteristic components thereof. For example, the present disclosure also includes embodiments obtained by applying various modifications to the embodiments that would occur to a person skilled in the art, and embodiments realized by arbitrarily combining the components and functions of the embodiments within the scope of the present disclosure. [Industrial Applicability]

[0108] The display device and manufacturing method thereof according to the present disclosure can be suitably used for flexible displays constituting displays mounted on portable information terminals and the like, and for manufacturing methods thereof. [Explanation of symbols]

[0109] 1,201,301,401,501,601 Display device 10 Resin substrate (flexible substrate) 10a surface 10b back side 11,211,311,511 Glass substrate (rigid substrate) 21a Wiring 21b Connection 22 Drive element section 23 Display element section 31 First area 32 Second area 33 Third area 34 4th area 35 5th area 36 Area 6 211b, 511b Tapered section

Claims

1. a flexible substrate; a display element portion provided in a first region on a surface of the flexible substrate; a wiring provided in a second region different from the first region on the surface of the flexible substrate and electrically connected to the display element portion; a driving element section electrically connected to the wiring in a third region different from the first region and the second region on the surface of the flexible substrate; a rigid substrate provided in a fourth region on the rear surface of the flexible substrate opposite the first region of the flexible substrate, the rigid substrate being made of a material with a higher modulus of rigidity than the flexible substrate; Equipped with the flexible substrate is bent in a fifth region on a rear surface facing the second region, The rigid substrate extends from the fourth region to the fifth region, and in the fifth region, a step is provided on a second surface opposite to a first surface facing the flexible substrate, and a second thickness of a portion of the rigid substrate that is closer to the bending position is thinner than a first thickness of a portion of the flexible substrate that is farther from the bending position. Display device.

2. a flexible substrate; a display element portion provided in a first region on a surface of the flexible substrate; a wiring provided in a second region different from the first region on the surface of the flexible substrate and electrically connected to the display element portion; a driving element section electrically connected to the wiring in a third region different from the first region and the second region on the surface of the flexible substrate; a rigid substrate provided in a fourth region on the rear surface of the flexible substrate opposite the first region of the flexible substrate, the rigid substrate being made of a material with a higher modulus of rigidity than the flexible substrate; Equipped with the flexible substrate is bent in a fifth region on a rear surface facing the second region, The rigid substrate extends from the fourth region to the fifth region, and the rigid substrate has a tapered portion on a second surface opposite to a first surface facing the flexible substrate in the fifth region, the tapered portion having a thickness that decreases toward a bending portion of the flexible substrate. Display device.

3. The end position of the tapered portion is located farther from the outer peripheral edge of the display portion on which the display element portion is formed than the start position of the tapered portion. The display device according to claim 2.

4. The rigid substrate includes a bent portion bent along the bent flexible substrate in the fifth region, The start position of the tapered portion is located farther from the outer peripheral edge of the display portion on which the display element portion is formed than one end of the bent portion. The display device according to claim 2 or 3.

5. The curvature of the bent portion of the flexible substrate is maximized at one point. The third region is hidden behind the first region and / or the second region in a plan view by the second region having a maximum bending curvature at one point. The display device according to claim 1.

6. forming a flexible substrate on a surface of a rigid substrate; forming a display element portion in a first region on a surface of the flexible substrate; forming wiring electrically connected to the display element section in a second region different from the first region on the surface of the flexible substrate; pressing a connection region on a surface of the flexible substrate, the connection region being different from the first and second regions, to electrically connect the driving element section and the wiring; Etching at least a portion of the rigid substrate; and the flexible substrate is bent in a fifth region on a rear surface facing the second region, In the etching step, The rigid substrate extends from a fourth region to a fifth region on the rear surface of the flexible substrate, the fourth region facing the first region of the flexible substrate, and a second thickness of a portion of the rigid substrate located closer to the bending position is made thinner than a first thickness of a portion of the flexible substrate located farther from the bending position, across a step provided on a second surface opposite to the first surface facing the flexible substrate in the fifth region. A method for manufacturing a display device.

7. forming a flexible substrate on a surface of a rigid substrate; forming a display element portion in a first region on a surface of the flexible substrate; forming wiring electrically connected to the display element section in a second region different from the first region on the surface of the flexible substrate; pressing a connection region on a surface of the flexible substrate, the connection region being different from the first and second regions, to electrically connect the driving element section and the wiring; Etching at least a portion of the rigid substrate; and the flexible substrate is bent in a fifth region on a rear surface facing the second region, In the etching step, The rigid substrate extends from a fourth region to a fifth region on the rear surface of the flexible substrate, the fourth region facing the first region of the flexible substrate, and a tapered portion having a thickness that decreases toward a bending portion of the flexible substrate is provided on a second surface of the rigid substrate opposite to a first surface facing the flexible substrate in the fifth region. A method for manufacturing a display device.

8. The end position of the tapered portion is located farther from the outer peripheral edge of the display portion on which the display element portion is formed than the start position of the tapered portion. The method for manufacturing the display device according to claim 7.

9. The rigid substrate includes a folded portion that is bent along the bent flexible substrate in the fifth region, The start position of the tapered portion is located farther from the outer peripheral edge of the display portion on which the display element portion is formed than one end of the bent portion. The method for manufacturing a display device according to claim 7 or 8.

10. The curvature of the bent portion of the flexible substrate is maximized at one point. The third region is hidden behind the first region and / or the second region in a plan view by the bending curvature of the second region being maximized at one point. The method for manufacturing a display device according to claim 6 .

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