Assembly including an integrated circuit package and a heat sink element

Abstract

To provide a structure (100) including an integrated circuit package.SOLUTION: A structure includes an integrated circuit package (2). The integrated circuit package comprises a first side face (2a) including an interconnection element and a second side face (2b) at an opposite side of the first side face (2a). The integrated circuit package further comprises at least one antenna element (25), and a heat sink element (1) disposed on the second side face (2b) of the integrated circuit package (2). The heat sink element comprises at least one passage (10). The at least one passage (10) extends through the heat sink element (1). A first opening (13) of the at least one passage (10) is disposed on each antenna element (25) of the at least one antenna element. The at least one passage (10) is configured to increase a gain of each antenna element (25).SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates generally to cooling antenna elements and integrated circuits that include said antenna elements. [Background technology]

[0002] The use of high-performance devices is growing exponentially, and these devices often need to be able to transmit and receive signals via wireless communication links. Furthermore, 5G deployments have increased and continue to grow, increasing the use of antennas operating within the 1-30 GHz spectrum. As a result, the use of millimeter-wave antennas is rapidly increasing. Some solutions use antennas integrated with integrated circuit chips. The integrated circuit chips may be, for example, radio frequency chips using integrated fan-out wafer-level packaging (InFO-WLP) technology or similar packaging technologies. The transmission lines in such solutions typically use rectangular waveguides to transmit and receive signals to and from the antennas in the integrated circuit package. The primary challenge for the combination of InFO-WLP and integrated antennas has been reducing signal loss between the chip and the antenna feedline. Current technology challenges include the large form factor packaging and the need to cool the integrated circuit. Additionally, enabling antenna steering is critical. However, heat sinks increase the device's form factor and / or obstruct and / or block the device's antenna. Therefore, heat sinks often degrade the performance of the device's antenna.

[0003] Patent Document 1 discloses a microwave device including a semiconductor package that includes a microwave semiconductor chip and a waveguide associated with the semiconductor package. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Patent No. 9,583,811 Summary of the Invention [Problem to be solved by the invention]

[0005] It is important to provide an integrated circuit package including at least one antenna element that has a small form factor while still providing good antenna performance. Additionally, it is important to provide the ability to cool the integrated circuit without obstructing and / or blocking the at least one antenna element. [Means for solving the problem]

[0006] These objectives are met by providing an arrangement having the features in the independent claims. Preferred embodiments are defined in the dependent claims.

[0007] Thus, according to one aspect of the present invention, there is provided a structure including an integrated circuit package. The integrated circuit package may have a first side including an interconnect element and a second side opposite the first side. The integrated circuit package may further include at least one antenna element. The structure may include a heat sink element. The heat sink element may be disposed on the second side of the integrated circuit package. The heat sink element may include at least one passage. The at least one passage may extend through the heat sink element. A first opening of the at least one passage may be disposed in each of the at least one antenna elements. The at least one passage may be configured to increase the gain of the respective antenna element.

[0008] According to one aspect of the present invention, a heat sink element is provided. The heat sink element may be configured to be disposed on an integrated circuit package. The heat sink element may include at least one passageway. The passageway may extend through the heat sink element. The integrated circuit package may include at least one antenna element. A first opening of each passageway may be configured to be disposed in a respective one of the at least one antenna element. The at least one passageway may be configured to increase the gain of the at least one antenna element of the integrated circuit package. The size of the heat sink element may be increased while maintaining the size of the at least one passageway, thereby increasing cooling characteristics. The heat sink element may be connected to an auxiliary heat sink, thereby providing better cooling characteristics.

[0009] According to one aspect of the present invention, there is provided a system. The system may include an arrangement according to another aspect of the present invention. The system may further include a printed circuit board. The arrangement may be mounted to and / or on the printed circuit board. The arrangement may be soldered to the printed circuit board. The arrangement may provide a compact solution with a small footprint on the printed circuit board.

[0010] The integrated circuit package may include an embedded wafer-level ball grid array package (eWLB package). The integrated circuit package may include a die and a molding compound. The term "die" may refer to, for example, a chip or a chipset. The die may include a transceiver die. The integrated circuit package may include at least one molding compound layer. The integrated circuit package may include at least one dielectric layer. The at least one dielectric layer may be thinner than the at least one molding compound layer. The integrated circuit package may include at least one redistribution metal layer. The at least one dielectric layer may be disposed between at least two redistribution metal layers. The die and / or interconnect elements may be disposed in the dielectric layer. The at least two redistribution metal layers may be disposed to connect the die and the interconnect elements. The integrated circuit package may include a radio frequency integrated circuit (RFIC). The RFIC may be configured for 5G communications. The RFIC may be a 5G RFIC. The RFIC may be preferably a 20-45 GHz RFIC, more preferably a 24.25-29.5 GHz RFIC, or a 37.0-43.5 GHz RFIC, or most preferably a 28 GHz RFIC or a 39 GHz RFIC. The structure may be configured for custom premise equipment (CPE). The structure may be configured for a fixed wireless access link. The wireless access link may be, for example, 20-45 GHz, 24, 25-29.5 GHz, 37.0 GHz-43.5 GHz, or 28 GHz and / or 39 GHz. At least one metal layer may be accessed via an interconnection element.

[0011] The interconnection elements may include solder bumps. The solder bumps may be configured to connect to metal layers of the integrated circuit package. The solder bumps may be configured to be soldered to a printed circuit board. The solder bumps may include signal bumps and / or ground bumps. Additionally, the solder bumps may include stud bumps and / or dummy bumps, which may be configured to support the integrated circuit package when it is mounted / soldered to a printed circuit board.

[0012] At least one antenna element may be disposed within the integrated circuit package. The at least one antenna element may comprise at least one antenna-in-package. In other words, the term "at least one antenna element disposed within the integrated circuit package" means, for example, "at least one antenna-in-package." The at least one antenna element may be understood as, for example, at least one antenna array. One of the at least one antenna elements may comprise multiple antennas. Furthermore, one of the at least one antenna elements may comprise an antenna array. The multiple antennas may comprise any number of antennas, such as two, three, four, five, six, seven, eight, or more. For example, each antenna element may include an antenna array, where each antenna array may include, for example, a 1x2-8, 2x2-8, 3x2-8, or 4x2-8 antenna array. The integrated circuit package may include at least one grounded resonator strip. The at least one resonator strip may be disposed between two antenna elements and / or antennas. The at least one resonator strip may be configured to decouple the antenna and / or the antenna element. The at least one antenna element may be arranged in a plane.

[0013] At least one antenna element may be disposed in a fan-out region of the integrated circuit package. The fan-out region may be understood as a portion of the integrated circuit package including a molding compound. The fan-out region may be understood as a portion of the molding compound including at least one antenna element. The fan-out region may be understood as a portion of the integrated circuit package without a die. The die may have a size smaller than the size of the integrated circuit package. The molding compound may also be disposed on top of the die. A thickness of the molding compound in the fan-out region may be greater than a thickness of the molding compound on the die. The die may be disposed substantially at the center of the integrated circuit package. Thus, the fan-out region may be disposed around the die. In other words, the fan-out region may be disposed between the die and a side surface of the integrated circuit package. The at least one antenna element may be disposed between the molding compound and the dielectric layer. The at least one antenna element may be disposed within a redistribution layer.

[0014] At least one antenna element disposed within the fan-out region of the integrated circuit package can provide electromagnetic coupling from the fan-out region of the integrated circuit to the heat sink element, thereby eliminating the need for a (expensive) high frequency substrate.

[0015] The at least one antenna element may comprise at least one dipole antenna. Each leg of the at least one dipole antenna may be fed at the center of the at least one dipole antenna. Each leg may be provided with a separate signal line from the integrated circuit. This allows the phase and amplitude of the signal to each leg to be individually controlled, thereby achieving the required differential phase shift. The required differential phase shift may be 180 degrees. The differential phase shift may be implemented without the need for a balun and / or other passive phase shifting components.

[0016] The integrated circuit package may include at least two antenna elements. The integrated circuit package may include at least two dipole antennas. An open-ended resonator strip may be disposed between the at least two antenna elements and / or the at least two dipole antennas. The resonator strip may be connected to ground. The resonator strip may be configured to decouple the antenna elements and / or dipole antennas adjacent to the resonator strip. Each of the at least two antenna elements may be disposed on a respective side of the integrated circuit package. For example, a first antenna element may be disposed on the left side of the integrated circuit package when viewed from above, and a second antenna element may be disposed on the right side of the integrated circuit package when viewed from above. Note that the integrated circuit package is not limited to including a first antenna element and a second antenna element. The integrated circuit package may include any number of antenna elements, for example, three, four, five, six, or more. Note also that the term "antenna element" refers to, for example, an antenna array. An antenna array can comprise any number of antennas, such as, for example, one, two, three, four, five, six, seven, eight, or more. In addition, two antenna arrays may include different or equal numbers of antennas. As an example, at least one antenna element can comprise two antenna arrays, where the two antenna arrays can include equal or different numbers of antennas. By using at least two antenna elements, higher gain can be obtained.

[0017] At least one of the at least two antenna elements may be a receive antenna element. At least one of the at least two antenna elements may be a transmit antenna element. The configuration may be configured to receive all signals through one of the at least two antenna elements. The configuration may be configured to transmit all signals through one of the at least two antenna elements. The integrated circuit package may include multiple antenna elements. For example, the integrated circuit package may include one, two, three, four, five, six, or more antenna elements. The configuration may be configured to receive all signals through any number of antenna elements and transmit all signals through the remaining antenna elements. Furthermore, the integrated circuit package may include antenna elements configured to transmit and receive signals. The integrated circuit package may include at least one transmit antenna element, at least one receive antenna element, and at least one antenna element configured to transmit and receive signals. Using (a) a dedicated antenna element for receiving signals and (a) a dedicated antenna element for transmitting signals may increase the efficiency of the configuration.

[0018] At least one of the two antenna elements may be disposed within a first fan-out region of the integrated circuit package. At least one of the two antenna elements may be disposed within a second fan-out region of the integrated circuit package. The first fan-out region may be separate from the second fan-out region. The fan-out region may include a first fan-out region and a second fan-out region. Furthermore, the fan-out region may include any number of fan-out regions, such as one, two, three, four, five, six, or more. The first fan-out region may be disposed between a first side of the die and a first side of the integrated circuit package. The second fan-out region may be disposed between a second side of the die and a second side of the integrated circuit package. The first side of the die may be disposed opposite the second side of the die. The first side of the integrated circuit package may be disposed opposite the second side of the integrated circuit package. A portion of the fan-out region disposed between the first fan-out region and the second fan-out region, or a portion thereof, may include a signal and / or ground path. The signal and / or ground paths may be configured to reduce mutual coupling between the antenna elements.

[0019] At least one antenna element disposed in the first fan-out region may be a receive antenna element. At least one antenna element disposed in the second fan-out region may be a transmit antenna element. Each antenna element disposed in the first fan-out region may be a receive antenna element. Each antenna element disposed in the second fan-out region may be a transmit antenna element. A passage through a heat sink element disposed in the first fan-out region, including a receive antenna element, may be understood as a passage for receiving a signal. A passage through a heat sink element disposed in the second fan-out region, including a transmit antenna element, may be understood as a passage for transmitting a signal. Disposing (a) the receive antenna element and (a) the transmit antenna element in different fan-out regions may increase decoupling, reduce interference, and / or increase performance of the at least two antenna elements. A heat sink element may be disposed between the first fan-out region and the second fan-out region, which may further increase decoupling, reduce interference, and / or increase performance of the at least two antenna elements.

[0020] At least one passage may be configured as a horn antenna. At least one passage may be configured as a waveguide horn. The shape of the passage may be understood, for example, as the shape of an antenna horn and / or the shape of a waveguide horn. The opening of the passage may be understood, for example, as the opening of a horn antenna and / or the opening of a waveguide horn. Each passage may be disposed in a respective antenna element. The term "respective" means, for example, one corresponding, one each, and / or one interrelated. The first opening of each passage may be disposed in a respective antenna element. Note that each antenna element may include multiple antennas and / or antenna arrays. The first opening may have a width substantially equal to the width of each antenna element. The first opening may have a length substantially equal to the length of each antenna element. The length and width of the antenna element may be parallel to the first and second sides of the integrated circuit package, respectively. Furthermore, the length and / or width of the antenna element may be understood as the length and / or width of a rectangle, where the rectangle is the smallest rectangle that can surround or enclose the antenna element. The passageway may have multiple passageway sides. For example, the passageway may have four passageway sides. Each passageway side may be disposed along a plane, where the plane may be disposed obliquely relative to the plane in which the first opening is disposed. The plane may be inclined outward from the first opening. The opposing plane may be inclined at an equal angle. The opposing plane may be inclined at an equal angle but in an opposite direction. The first opposing plane may be inclined at a first angle, and the second opposing plane may be inclined at a second angle. The first angle may be greater than the second angle.

[0021] A heat sink element including at least one passage configured to be disposed over each antenna element can have a reduced form factor. The heat sink element can be disposed over a side or surface of an integrated circuit package including the at least one antenna element such that the heat sink element contacts a larger portion of the side or surface than other types of heat sink elements. By contacting a larger portion of the side or surface, the form factor of the heat sink element can be reduced while still providing high cooling capacity. The ability to contact a larger portion of the side or surface is due to the at least one passage in the heat sink element. The at least one passage may be configured to increase the gain of each at least one antenna element. The at least one passage may be configured as a horn antenna for each at least one antenna element. Other types of heat sink elements may contact only a small portion of an integrated circuit chip so as not to block or obstruct the antenna element of the integrated circuit chip. Therefore, to provide sufficient cooling capacity, other types of heat sinks must include pins and / or fins, which may require a lot of space. Additionally, other types of heat sink elements can be positioned to minimize obstruction or blocking of antenna elements. The heat sink element can instead increase the performance of at least one antenna element. The heat sink element can provide high cooling capacity while improving the performance of the at least one antenna element. Furthermore, the heat sink element can have a reduced form factor while providing high cooling capacity. The increased antenna performance provided by the at least one passage in the heat sink element may be further increased by matching the shape of the at least one passage to the at least one antenna element.

[0022] The heat sink element may have a top and a bottom. The first opening of each passage may be located at the bottom of the heat sink element. The second opening of each passage may be at least partially located at the top of the heat sink element. The second opening of each passage may be at least partially located on a side of the heat sink element. The second opening may be larger than the first opening. The second opening of each passage may be located at the top of the heat sink element. The side of the passage may extend from the first opening to the second opening. The second opening may include a width and a length. The length of the second opening may be larger than the width of the second opening. The first angle may define the length of the second opening. The second angle may define the length of the second opening. The second angle may define whether the second opening is located completely on the top of the heat sink element, or whether the second opening is located partially on the top of the heat sink element and partially on the side of the heat sink element. The second opening of the passage may extend along the entire length of the body of the heat sink element in a direction substantially parallel to the length of the body of the heat sink. The second openings can thereby divide the top of the heat sink into multiple sections. The number of sections can be equal to the number of passages plus one. The number of sections can have two side sections. Furthermore, the number of sections can have at least one middle section. The "middle section" can be understood as, for example, a ridge. The heat sink element can include a metal. The metal can be a metal with high heat transfer capacity.

[0023] The heat sink element may be disposed in contact with the second side of the integrated circuit package. The heat sink element may be disposed in contact with substantially the entire die along the second side of the integrated circuit package. An intermediate portion of the heat sink element may be in contact with the die. The heat sink element may be configured for thermal transport. The heat sink element may be configured for thermal transport of dissipated power and / or heat from the integrated circuit package.

[0024] The printed circuit board may include at least one reflecting element. The structure may be disposed on the at least one reflecting element. Each reflecting element may be disposed on a respective antenna element. The at least one reflecting element may include a metal layer. The metal layer may be disposed at a quarter-wavelength distance from the at least one antenna element. The term "quarter-wave distance" refers, for example, to a distance substantially equal to a quarter of the wavelength of a signal transmitted and / or received by the at least one antenna element. The metal layer may include a metallized back surface of the printed circuit board. Each of the at least one reflecting element may include vias. The vias may be disposed around the respective antenna elements. The vias may be disposed along the edges of a rectangle, which is the smallest rectangle that can surround or enclose the respective antenna elements. The structure and the printed circuit board may be disposed such that the vias and the respective antenna elements are aligned. The term "via" may refer, for example, to fencing.

[0025] This other aspect of the invention will now be described in more detail with reference to the accompanying drawings, in which embodiments of the invention are shown. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a schematic diagram of a heat sink element according to an exemplary embodiment of the present invention. [Figure 2] FIG. 2 diagrammatically shows a cross-sectional view of an integrated circuit package according to an exemplary embodiment of the present invention. [Figure 3] FIG. 3 shows a schematic cross-sectional view of a system according to an exemplary embodiment of the invention. [Figure 4] FIG. 4 shows a schematic perspective view of a system according to an exemplary embodiment of the invention. [Figure 5] FIG. 5 shows a schematic exploded view of a system according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0027] FIG. 1 illustrates a heat sink element 1 according to an exemplary embodiment of the present invention. The heat sink element 1 includes a body. The body has a length, a width, and a height. The length of the body is along an axis L, the width of the body is along an axis W, and the height of the body is along an axis H, with the axes L, W, and H being perpendicular to one another. The length of the body is greater than the width of the body. The width of the body is greater than the height of the body. The body has a top 11, 11a, a bottom 3, and four side surfaces 12a, 12b. The body has a substantially rectangular cuboid shape. The top 11, 11a, the bottom 3, and the four side surfaces 12a, 12b can be understood as the sides of the rectangular cuboid shape. The corners between the side surfaces 12a, 12b are rounded. The angles between the side surfaces 12a, 12b, the top 11, 11a, and the bottom 3 form approximately 90-degree angles. The four side surfaces 12a, 12b include two first side surfaces 12a and two second side surfaces 12b. The two first side surfaces 12a are opposite each other. The two second side surfaces 12b are opposite each other. The first side surfaces 12a are longer than the second side surfaces 12b. The first side surfaces 12a and the second side surfaces 12b have approximately the same height. The present invention is not limited to a heat sink element 1 having a rectangular cubic shape. For example, the heat sink element may have virtually any geometric shape. The shape of the passages 10 in the heat sink element 1 may be maintained regardless of the shape of the body of the heat sink element 1 (see FIG. 3).

[0028] The heat sink element 1 includes two connecting members 15. Each connecting member 15 has a rectangular cubic shape. The connecting members 15 are attached to the main body. The connecting members 15 are attached at the second side 12b. The width of the connecting members 15 is smaller than the width of the main body. The height of the connecting members 15 is smaller than the height of the main body. The height of the connecting members 15 is substantially half the height of the main body. The connecting members 15 are arranged so that their bottoms are flush with the bottom 3 of the main body. Each connecting member 15 has four vertical corners. The vertical corners of the connecting members 15 are arranged in a direction substantially parallel to the axis H, and two of the vertical corners of each connecting member 15 abut the main body. All vertical corners of the connecting members 15 are rounded. The vertical corners of the connecting members 15 abutting the main body are rounded toward the nearest corner of the main body. Each connecting member 15 includes a hole 15a. A hole 15a extends through each of the connecting members 15. The hole 15a extends through each of the connecting members 15 along a direction generally parallel to the axis H. A first section of each of the holes 15a extends from the bottom of the connecting member 15 toward the top of the connecting member 15. A second section of each of the holes 15a extends from the first section of the hole 15a to the top of the connecting member 15. The diameter of each of the second sections of the holes 15a is larger than the diameter of each of the first sections of the holes 15a, thereby forming a shelf-like portion inside each of the holes 15a. The holes 15a are configured to receive fastening means. The fastening means can be configured to fasten the heat sink element 1 to another device and / or an enclosure. The fastening means can include screws, bolts, and / or nails. The connecting members 15 include clasps configured to be inserted into corresponding receptacles in the body of the heat sink element 1. The clasps are secured by rivets.

[0029] The heat sink element 1 includes two passages 10. Each passage 10 extends through the body of the heat sink element 1. Each passage 10 includes a first opening 13. The first opening 13 is disposed on the bottom 3 of the body. Each first opening 13 has a rectangular shape. Each first opening 13 has four sides. Each side of the first opening is generally parallel to a respective side of the bottom 3 of the body. The first opening 13 is disposed at the center of the bottom 3 of the body relative to the length of the body. Each first opening 13 is disposed away from the center of the bottom 3 of the body relative to the width of the body. Each passage 10 includes a second opening 14. The second opening 14 is disposed along the top 11, 11a of the body and along a portion of the second side 12b of the body.

[0030] Each passage 10 includes four side surfaces 10a, 10b, which together with the first and second openings 13, 14 define the passage 10. Each side surface 10a, 10b extends from each side of the first opening 13 toward the second opening 14. Each side surface 10a, 10b is a flat surface. The four side surfaces 10a, 10b include two opposing first side surfaces 10a and two opposing second side surfaces 10b. Each first side surface 10a extends from the bottom 3, i.e., the first opening 13, and extends obliquely toward the respective first side surface 12a of the body and toward the top 11, 11a of the body. Each second side surface 10b extends in a direction toward the respective second side surface 12b of the body and toward the top 11, 11a of the body.

[0031] The extension direction of each side surface 10a, 10b of each passage 10 is determined by the relationship between the direction toward the respective side surface 12a, 12b of the body and the direction toward the top 11, 11a of the body, and this relationship defines an angle. For example, the side surfaces 10a, 10b of a passage that extend only toward the respective side surfaces 12a, 12b of the body can be understood to have an angle of substantially zero. Also, the side surfaces 10a, 10b of a passage that extend only toward the top 11, 11a of the body can be understood to have an angle of approximately 90 degrees. Furthermore, if the extension angles of all side surfaces of a passage are substantially 90 degrees, it can be understood that the first and second openings of the passage will have substantially the same size. The first side surface 10a of the passage 10 shown in FIG. 1 has an extension angle that is greater than the extension angle of the second side surface 10b of the passage 10. The second side 10b of the passage 10 extends such that each side of the second opening 14 is disposed on the second side 12b of the body. Each side of the second opening 14 is disposed at a height substantially equal to the height of the connecting member 15. However, the second side 10b of the passage may also extend such that they terminate at the tops 11, 11a.

[0032] Each passage 10 can be understood as a horn antenna. Each horn antenna may be configured for a respective antenna element. The side surfaces 10a, 10b of the passage can be understood as the side surfaces of the horn antenna. The horn antenna includes a metallic waveguide extending outward. The side surfaces 10a, 10b of the passage 10 can include a metallic waveguide extending outward from the horn antenna.

[0033] The length of the second opening 14 is greater than the width of the second opening 14. The extension direction of the side surfaces 10a, 10b of the passage may be configured to increase the gain of each antenna element disposed in each first opening 13. The passage 10 may have a gradual transition structure that may enable waves from each of the at least one antenna element disposed in the first opening of the passage to be radiated into space more efficiently. The passage 10 may be understood as tapering from its first opening 13 to its second opening 14. The taper of the passage 10 may gradually change impedance along the length of the passage 10, thereby enabling waves to be radiated into space more efficiently. The passage 10 may minimize wave reflections. The passage 10 may project waves into a narrower beam than would be possible if each passage 10 were not disposed in at least one antenna element. The extension direction of the side surfaces 10a, 10b of the passage may be configured to enable beam steering of the antenna element disposed in each of the first openings 13.

[0034] The top portion 11, 11a of the main body has two side portions 11a and a middle portion 11a. The middle portion 11a can be understood as a ridge portion. The ridge portion runs between the two passages. The side portions 11a and the middle portion 11a have a length equal to the length of the main body. The two side portions 11 have substantially equal widths. The width of each side portion 11 is greater than the width of the middle portion 11a. However, it should be understood that this is purely exemplary. For example, the middle portion 11a can have a width greater than the width of each side portion 11. Also, for example, the middle portion 11 need not be provided. In such an example, the second opening 14 of the passage 10 would share one side.

[0035] FIG. 2 schematically illustrates a cross-sectional view of an integrated circuit package 2 according to an exemplary embodiment of the present invention. The integrated circuit package 2 includes a first side 2a and a second side 2b. The first side 2a and the second side 2b are opposite each other. The integrated circuit package includes two antenna elements 25. It should be understood that each antenna element 25 may include multiple antennas and / or antenna arrays. The first side 2a includes bumps 26a and 26b. The bumps 26a and 26b include interconnection elements 26a. The bumps 26a and 26b also include dummy bumps 26b. The integrated circuit package 2 includes three passivation layers. The passivation layers extend along the length and width of the integrated circuit package 2. The integrated circuit package 2 includes a die 21. One of the passivation layers includes a first side 2a. The die 21 is disposed on the passivation layer opposite the first side 2a. The integrated circuit package 2 includes a mold compound and includes a mold compound section 22. The mold compound 22 is disposed on a side of the die 21. The mold compound section 22 is a portion of the mold compound that includes at least one antenna element 25. The mold compound is disposed on top of a passivation layer opposite the first side 2a and around the die 21. The top of the die 21 is exposed. The mold compound does not cover the top of the die 21. However, it should be understood that the mold compound may also be disposed on the die 21. The die 21 and mold compound include a second side 2b. The integrated circuit package 2 includes two redistribution layers. One of the redistribution layers connects the interconnect element 26a to the die. The other redistribution layer includes two antenna elements 25. The redistribution layer is disposed between the passivation layers.

[0036] FIG. 3 diagrammatically illustrates a cross-sectional view of a system 500 according to an exemplary embodiment of the present invention. It should be noted that FIG. 3 includes features, elements, and / or functions as shown in FIGS. 1 and 2 and described in the associated text. Accordingly, reference may be made to those figures and their associated descriptions for a better understanding. The system 500 includes a component 100 and a printed circuit board 5. The printed circuit board 5 has a first side and a second side. The component 100 includes an integrated circuit package 2 and a heat sink element 1. The component 100 is disposed on the second side of the printed circuit board 5. The component 100 is disposed on the second side of the printed circuit board 5 such that the first side 2 a of the integrated circuit package 2 and the bottom of the heat sink element 1 are disposed on the second side of the printed circuit board 5.

[0037] In FIG. 3, the heat sink element 1 is shown to be arranged around the integrated circuit package 2. The heat sink element 1 shown in FIG. 3 includes a socket 16. The socket 16 is arranged on the bottom of the heat sink element 1. The size of the socket 16 is substantially equal to the size of the integrated circuit package 2. The first opening 13 of the heat sink element 1 can be understood to be arranged within and / or at the position of the socket 16. The bottom of the heat sink 1 can include the surface of the socket 16. The integrated circuit package 2 is arranged inside the socket 16 of the heat sink element 1 so that the first side 2a of the integrated circuit package 2 and a portion of the bottom of the heat sink element 1 surrounding the integrated circuit package 2 are substantially flush with each other. Another portion of the bottom of the heat sink element 11 covers and / or abuts the die 21 of the integrated circuit package 2.

[0038] The cross section of Figure 3 shows the heat sink element 1 with two passages 10, each with two first sides 10a. The cross section of Figure 3 does not show the second sides 10b of the passages 10 (not shown; see, for example, Figure 1). However, it should be understood that the passages 10 include second sides 10b. The first sides 10a of each passage extend from a respective first opening 13 toward the top 11, 11a of the heat sink element 1. Each first opening 13 is disposed in a respective mold compound section 22. Each mold compound section 22 can include at least one antenna element 25.

[0039] The printed circuit board 5 includes two reflecting elements 6. Each reflecting element 6 is disposed relative to at least one antenna element 25. Each reflecting element 6 is disposed relative to a respective at least one antenna element 25 and a respective first opening 13. The reflecting elements 6 may include a metal layer 6a. Each reflecting element 6 may include a metal layer 6a. The metal layer 6a is disposed at a quarter wavelength distance from a respective at least one antenna element 25. The reflecting elements 6 include vias 6b. The vias 6b of each reflecting element 6 are disposed around the periphery in a shape having substantially the same shape as each molding compound section 22. The vias 6b can be understood as fencing.

[0040] FIG. 4 schematically illustrates a perspective view of a system 500 according to an exemplary embodiment of the present invention. It should be noted that FIG. 4 includes features, elements, and / or functions as shown in FIGS. 1-3 and described in the associated text. Therefore, reference may be made to those figures and their associated descriptions for a better understanding. FIG. 4 illustrates the system 500. The system 500 comprises a component 100 and a printed circuit board 5. The component 100 includes a heat sink element 1 and an integrated circuit package 2. The component 100 is mounted on the printed circuit board 5. The perspective view of the system 500 shows the system 500 from above, revealing the top portions 11, 11a of the heat sink element 1. FIG. 4 also illustrates the fan-out region 22 of the integrated circuit package 2, which is located in the first opening 13 of the heat sink element 1. The passage 10 of the heat sink element 11 is shown extending from the first opening 13 toward the second opening 14. The second openings 14 extend along the tops 11, 11a and along the tops of the side surfaces 12b (not shown; see e.g., FIG. 1 ) of the heat sink element 1. The structure 100 is attached to the center of the printed circuit board 5. The width of the body of the heat sink element 1 is substantially equal to the width of the printed circuit board 5. The structure 100 is attached to the printed circuit board 5 such that each first opening 13 and its respective fan-out region 22 is attached to the top of a reflective element 6 (not shown; see e.g., FIG. 3 or FIG. 5 ) of the printed circuit board 5. The connecting members 15 of the heat sink element 1 extend outside the printed circuit board 5. The connecting members 15 can be configured to attach the system 500 to, for example, an auxiliary device, an auxiliary heat sink element, and / or an enclosure.

[0041] FIG. 5 schematically illustrates an exploded view of a system 500 according to an exemplary embodiment of the present invention. It should be noted that FIG. 5 includes the features, elements, and / or functions as shown in FIGS. 1 through 4 and described in the associated portions of the specification. Therefore, reference may be made to those figures and their associated descriptions for a better understanding. FIG. 5 illustrates a system 500. The system 500 includes a heat sink element 1, an integrated circuit package 2, and a printed circuit board 5. The exploded view of FIG. 5 illustrates the heat sink element 1 disposed above the integrated circuit package 2 and the integrated circuit package 2 disposed above the printed circuit board 5.

[0042] The heat sink 1 includes a socket 16. The socket 16 is configured to receive the integrated circuit package 2. The integrated circuit package 2 includes a die 21 and two fan-out regions 22. Each of the fan-out regions 22 includes at least one antenna element. The integrated circuit package 2 is configured to be inserted into the socket 16 such that each fan-out region 22 including at least one antenna element is positioned in a respective first opening 13 of the heat sink element 1.

[0043] The integrated circuit package 2 shown in FIG. 5 includes a die 21 and two antenna elements 25 disposed in each fan-out region 22. The die 21 includes a transceiver chip. The die 21 has a rectangular shape. The die 21 is disposed at the center of the integrated circuit package 2. The sides of the die 21 are substantially parallel to the sides of the integrated circuit package 2. Each of the two antenna elements 25 is coupled to a side of the die 21, with the two antenna elements 25 being coupled to opposite sides of the die 21. Each antenna element 25 shown in FIG. 5 includes four dipole antennas 26. The four dipole antennas 26 of each antenna element 25 are aligned with each other. The four dipole antennas 26 of each antenna element 25 are spaced equal distances from adjacent dipole antennas 26 of each antenna element 25. Each antenna element 25 includes a grounded, open-ended resonator strip 27. Each resonator strip 27 is disposed between two dipole antennas 26 disposed midway between the four dipole antennas 26 of each antenna element 25. The resonator strip 27 is configured to decouple two dipole antennas 26 located intermediate the four dipole antennas 26 of each antenna element 25. One of the two antenna elements 25 located in one of the two fan-out regions 22 is configured to receive signals, and the other of the two antenna elements 25 located in the other fan-out region 22 is configured to transmit signals. Regions of the integrated circuit package 2 between the fan-out regions 22 and adjacent to the sides to which the antenna elements 25 are not coupled include signal and / or ground paths (not shown). The signal and / or ground paths are configured to decouple the two antenna elements 25.

[0044] The printed circuit board 5 includes two reflective elements 6. The heat sink element 1 and the integrated circuit package 2 are configured to be mounted on the printed circuit board 5 such that each first opening 13 of the heat sink element 1 and each first opening 13 of each fan-out region 22 including at least one antenna element 25 of the printed circuit board 2 are positioned above each reflective element 6.

[0045] Those skilled in the art will recognize that the present invention is not limited to the preferred embodiments described above, but on the contrary, many modifications and variations are possible within the scope of the appended claims.

Claims

1. an integrated circuit package (2) having a first side (2a) including an interconnection element (26a), a second side (2b) opposite the first side (2a), and at least one antenna element (25); a heat sink element (1) disposed on the second side (2b) of the integrated circuit package (2), the heat sink element having at least one passage (10), the at least one passage (10) extends through the heat sink element (1), and a first opening (13) of the at least one passage (10) is disposed in each antenna element (25) of the at least one antenna element; the at least one passage (10) is configured to increase the gain of the respective antenna element (25); A construct (100).

2. 2. The arrangement of claim 1, wherein the antenna element (25) is disposed within the integrated circuit package (2).

3. 3. The arrangement of claim 1 or 2, wherein the at least one antenna element (25) is located within a fan-out region (22) of an integrated circuit package (2).

4. Arrangement according to any one of claims 1 to 3, wherein the integrated circuit package (2) comprises at least two antenna elements (25).

5. 5. The arrangement according to claim 4, wherein at least one of the at least two antenna elements (25) is a receiving antenna element and at least one of the at least two antenna elements (25) is a transmitting antenna element.

6. At least one of the two antenna elements (25) is disposed within a first fan-out region (22) of the integrated circuit package (2); At least one of the two antenna elements (25) is disposed within a second fan-out region (22) of the integrated circuit package (2); 6. The structure of claim 4 or 5, wherein the first fan-out region (22) is separate from the second fan-out region (22).

7. 7. The arrangement of claim 6, wherein at least one antenna element (25) located in the first fan-out region (22) is a receive antenna element and at least one antenna element (25) located in the second fan-out region (22) is a transmit antenna element.

8. An arrangement according to any one of the preceding claims, wherein the at least one antenna element (25) comprises at least one dipole antenna (26).

9. The arrangement of any one of claims 1 to 8, wherein the integrated circuit package (2) comprises an embedded wafer level ball grid array package.

10. An arrangement according to any one of the preceding claims, wherein the at least one passage (10) is configured as a horn antenna.

11. A heat sink element (1) configured to be disposed on an integrated circuit package (2), the heat sink element (1) including at least one passage (10) extending therethrough; The integrated circuit package (2) includes at least one antenna element (25); the first opening (13) of each passage is configured to be positioned at a respective antenna element of the at least one antenna element (25); The heat sink element (1), wherein the at least one passage (10) is configured to increase the gain of the at least one antenna element (25) of the integrated circuit package (2).

12. The heat sink element (1) comprises a top portion (11, 11a) and a bottom portion (3), the first opening (13) of each passage (10) is located at the bottom (3) of the heat sink element (1); 12. A heat sink element according to claim 11, wherein the second opening (14) of each passage (10) is at least partially located in the top portion (11, 11a) of the heat sink element (1).

13. 13. The heat sink element according to claim 12, wherein the second opening (14) of each passage (10) is at least partially arranged in a side surface (12b) of the heat sink element (1).

14. 14. A heat sink element according to claim 12 or 13, wherein the second opening (14) is larger than the first opening (13).

15. A construction (100) according to claim 1 and a printed circuit board (5), The structure (100) is mounted on the printed circuit board (5), forming a system (500).

16. The printed circuit board (5) includes at least one reflective element (6), The system of claim 15, wherein the structure (100) is disposed on the at least one reflecting element (6).

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