Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device

Abstract

To provide a novel resin composition that brings about a cured product having a low degree of roughness and favorable conductor adhesiveness, and a cured product, a sheet-like laminate material, a resin sheet, a printed wiring board and a semiconductor device obtained by using the resin composition.SOLUTION: A resin composition contains (A) naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1000 or more and epoxy equivalent of 350 g / eq. or more, (B) curing agent, and (C) inorganic filler, where the component (B) contains (B-1) active ester-based curing agent, and (B-2) curing agent other than active ester-based curing agent, the component (B-2) contains triazine skeleton-containing phenol-based curing agent, the content of the component (A) is 7.5 mass% or more and 75 mass% or less in the case where a resin component in the resin composition is 100 mass%, the content of the component (B) is 3 to 50 mass% in the case where a nonvolatile component in the resin composition is 100 mass%, and the content of the component (C) is 40 mass% or more in the case where a nonvolatile component in the resin composition is 100 mass%.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, and further to a cured product, a sheet-like laminate material, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition. [Background technology]

[0002] Patent Document 1 discloses a resin material containing an epoxy compound having a naphthalene skeleton, an inorganic filler, and a curing agent as a resin material for use in a multilayer printed wiring board. Such a resin material can be used to form an insulating layer in a multilayer printed wiring board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-055890 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention aims to provide a novel resin composition that provides a cured product having low roughness and good adhesion to conductors (hereinafter, "conductor adhesion"); and a cured product, a sheet-like laminate material, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition. [Means for solving the problem]

[0005] As a result of intensive research into solving the above problems, the present inventors have found that the above problems can be solved by using a resin composition having the following configuration, and have thus completed the present invention.

[0006] That is, the present invention includes the following. [1] (A) a naphthol aralkyl epoxy resin having a weight average molecular weight (Mw) of 1000 or more and an epoxy equivalent of 350 g / eq. or more; and (B) a curing agent. wherein the (B) curing agent comprises (B-1) an active ester curing agent. [2] The component (A) is represented by the following formula (A1): [ka] [In formula (A1), Ar1 represents an optionally substituted arylene group having 6 to 20 carbon atoms; each Ra represents independently a hydrogen atom, a monovalent group containing an epoxy group, or an alkyl group having 1 to 12 carbon atoms; at least one Ra represents a monovalent group containing an epoxy group and at least one Ra represents an alkyl group having 1 to 12 carbon atoms; Rb and Rc represent independently a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; Rd represents a hydrogen atom, a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; each R1 represents independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; n represents an integer of 2 to 50; mb represents an integer of 0 to 6; and mc represents an integer of 0 to 5.] The resin composition according to [1], comprising a compound represented by the formula: [3] The component (A) is represented by the following formula (A2): [ka] [In formula (A2), Ra and n are the same as Ra and n in formula (A1), respectively.] The resin composition according to [2], which contains a compound represented by the formula: [4] The resin composition according to [2] or [3], wherein n is 4 or more and at least two of Ra are alkyl groups having 1 to 6 carbon atoms. [5] The resin composition according to any one of [1] to [4], wherein the component (B) contains a curing agent other than the active ester-based curing agent (B-2). [6] The resin composition according to [5], wherein the content of the component (B-2) is less than the content of the component (B-1). [7] The resin composition according to any one of [1] to [6], wherein the content of the component (B-1) is 3 to 50 mass % when the total nonvolatile components in the resin composition is 100 mass %. [8] The resin composition according to any one of [1] to [7], wherein the content of component (A) is 5 to 70 mass % when the total nonvolatile components in the resin composition is 100 mass %. [9] The resin composition according to any one of [1] to [8], wherein the content of component (B) is 3 to 70 mass % when the total nonvolatile components in the resin composition is 100 mass %.

[10] The resin composition according to any one of [1] to [9], further comprising (C) an inorganic filler.

[11] The resin composition according to

[10] , wherein the content of component (C) is 40% by mass or more, assuming that the total amount of non-volatile components in the resin composition is 100% by mass.

[12] The resin composition according to any one of [1] to

[11] , wherein the glass transition temperature of the cured product is higher than 145°C.

[13] The resin composition according to any one of [1] to

[12] , wherein the cured product has a dielectric loss tangent of less than 0.005.

[14] The resin composition according to any one of [1] to

[13] , which is used for an insulating layer of a printed wiring board.

[15] A cured product of the resin composition according to any one of [1] to

[14] .

[16] A sheet-like laminate material containing the resin composition according to any one of [1] to

[14] .

[17] A resin sheet comprising a support and a resin composition layer formed on the support from the resin composition according to any one of [1] to

[14] .

[18] A printed wiring board having an insulating layer made of a cured product of the resin composition according to any one of [1] to

[14] .

[19] A semiconductor device comprising the printed wiring board according to

[18] . [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a novel resin composition that provides a cured product having low roughness and good adhesion to conductors; and a cured product, a sheet-like laminate material, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition.

[0008] The present invention will be described in detail below with reference to preferred embodiments thereof. However, the present invention is not limited to the following embodiments and examples, and can be implemented with any modifications within the scope of the claims of the present invention and their equivalents.

[0009] [Resin composition] The resin composition of the present invention is characterized by comprising (A) a naphthol aralkyl epoxy resin (hereinafter also referred to as "specific epoxy resin") having a weight-average molecular weight (Mw) of 1000 or more and an epoxy equivalent of 350 g / eq. or more, and (B) a curing agent, wherein the (B) curing agent contains (B-1) an active ester curing agent.

[0010] The resin composition of the present invention, which contains a specific epoxy resin and an active ester curing agent, produces a cured product with low roughness and good conductor adhesion. Furthermore, the cured product of the resin composition of the present invention also exhibits excellent properties, such as dielectric properties, heat resistance, and HAST resistance. Therefore, the resin composition of the present invention provides a cured product (insulating layer) with excellent properties, significantly contributing to meeting the recent demand for high functionality in printed wiring boards and semiconductor devices.

[0011] -(A) Specific epoxy resin- The resin composition of the present invention contains a specific epoxy resin as component (A). The specific epoxy resin is a naphthol aralkyl epoxy resin having a weight average molecular weight (Mw) and epoxy equivalent within a specific range. The specific epoxy resin may be used alone or in combination of two or more types in any ratio.

[0012] -Weight average molecular weight (Mw)- The weight-average molecular weight (Mw) of the specific epoxy resin is 1,000 or more. From the viewpoint of enhancing the intended effects of the present invention, the Mw of the specific epoxy resin is preferably 1,100 or more, more preferably 1,200 or more, and even more preferably 1,300 or more or 1,400 or more. The upper limit of the Mw of the specific epoxy resin is not particularly limited, but is usually 200,000 or less, and may be 150,000 or less, 100,000 or less, or 50,000 or less. From the viewpoint of improving the handleability of the resin composition, the Mw of the specific epoxy resin is preferably 15,000 or less, and may be 10,000 or less, 5,000 or less, or 4,000 or less. The Mw of the specific epoxy resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC). The weight-average molecular weight (Mw) of the specific epoxy resin can also be adjusted by removing low-molecular-weight components contained in commercially available products containing the specific epoxy resin.

[0013] -Epoxy equivalent- The epoxy equivalent of the specific epoxy resin is 350 g / eq. or more. From the viewpoint of enhancing the intended effects of the present invention, the epoxy equivalent of the specific epoxy resin is preferably 352 g / eq. or more, more preferably 354 g / eq. or more, and even more preferably 355 g / eq. or more or 356 g / eq. or more. The upper limit of the epoxy equivalent of the specific epoxy resin is not particularly limited, but is usually 1000 g / eq. or less, and may be 800 g / eq. or less, 700 g / eq. or less, or 500 g / eq. or less. The epoxy equivalent is the mass of a compound containing one equivalent of epoxy groups. This epoxy equivalent can be measured in accordance with JIS K7236.

[0014] From the viewpoint of achieving the desired effects of the present invention, it is important that both the weight-average molecular weight (Mw) and the epoxy equivalent fall within the above-mentioned ranges. The effects of the present invention cannot be achieved if only one of the weight-average molecular weight (Mw) and the epoxy equivalent falls within the above-mentioned ranges. Therefore, the specific epoxy resin is a naphthol aralkyl-type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g / eq. or more. Thus, the specific epoxy resin contained in the resin composition of the present invention is characterized by a relatively large molecular weight and a specified lower limit for the epoxy equivalent.

[0015] The molecular structure of the specific epoxy resin will be described below.

[0016] The specific epoxy resin contains one or more naphthol aralkyl structures in the molecule, preferably two or more, more preferably three or more, and even more preferably four or more. The number of naphthol aralkyl structures contained in the molecule of the specific epoxy resin is not limited as long as the specific epoxy resin satisfies the above-mentioned weight average molecular weight (Mw) and epoxy equivalent.

[0017] In the specific epoxy resin, the naphthol hydroxyl group of the naphthol aralkyl structure preferably has its hydrogen atom substituted with a substituent (hereinafter also referred to as "substituent A") selected from the group consisting of a monovalent group containing an epoxy group and an alkyl group. Here, the monovalent group containing an epoxy group used as substituent A includes an epoxyalkyl group (the alkyl moiety preferably has 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably 1 or 2 carbon atoms), of which a glycidyl group is preferred. The alkyl group used as substituent A preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, even more preferably 1 to 3 carbon atoms, and particularly preferably 1 carbon atom (i.e., a methyl group). The alkyl group used as substituent A may be substituted, and examples of the substituent include a methyl group, an ethyl group, a propyl group, an n-butyl group, an n-hexyl group, and a cyclohexyl group.

[0018] When the total number of naphthol aralkyl structures contained in the specific epoxy resin is taken as 100%, preferably 50% or more, more preferably 60% or more, 70% or more, 75% or more, 80% or more, or 90% or more of the naphthol hydroxyl groups have their hydrogen atoms substituted with substituent A, and it is also possible for all (100%) of the naphthol hydroxyl groups to have their hydrogen atoms substituted with substituent A. The equivalent ratio of naphthol hydroxyl groups to substituent A (naphthol hydroxyl groups / substituent A) is preferably 1 or less, more preferably close to 0, and even more preferably 0.

[0019] In a preferred embodiment, at least one naphthol hydroxyl group (hydrogen atom thereof) in the naphthol aralkyl structure contained in the specific epoxy resin is substituted with a monovalent group containing an epoxy group, and at least one (preferably two or more) naphthol hydroxyl group (hydrogen atom thereof) in the naphthol aralkyl structure is substituted with an optionally substituted alkyl group.

[0020] In the specific epoxy resin, the naphthalene ring constituting the naphthol moiety of the naphthol aralkyl structure may or may not have a further substituent (hereinafter also referred to as "substituent B") at a position other than the hydroxyl group, in addition to a hydroxyl group (naphthol hydroxyl group) or a monovalent group in which the hydrogen atom of the hydroxyl group is substituted with substituent A. Examples of such substituent B include a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms. The alkyl group or aryl group used as substituent B may be substituted, and examples of the substituent (hereinafter also referred to as "substituent C") therefor include a methyl group, an ethyl group, a propyl group, an n-butyl group, an n-hexyl group, and a cyclohexyl group.

[0021] In the specific epoxy resin, the aralkyl portion of the naphthol aralkyl structure is formed by directly bonding an arylene group to two alkylene groups. The arylene group is preferably an optionally substituted arylene group having 6 to 20 carbon atoms. Specific examples of the arylene group include a phenylene group, a 1-naphthylene group, and a 2-naphthylene group. The substituent that the arylene group may have is preferably the above-mentioned Substituent B. The alkylene group is preferably an alkylene group having 1 to 12 carbon atoms. Such an alkylene group may or may not have a substituent. When the alkylene group has a substituent, the substituent is preferably the above-mentioned Substituent C.

[0022] In the naphthol moiety of the naphthol aralkyl structure, the naphthol hydroxyl group or the monovalent group in which its hydrogen atom is substituted with the substituent A is preferably located at the α-position of the naphthalene ring (i.e., the 1st, 4th, 5th, or 8th position). The substituent B that the naphthalene ring may further have is located at any position on the naphthalene ring relative to the naphthol hydroxyl group located at the α-position or the monovalent group in which its hydrogen atom is substituted with the substituent A.

[0023] The specific epoxy resin, i.e., component (A), is not particularly limited as long as it satisfies the above-mentioned ranges of weight average molecular weight (Mw) and epoxy equivalent, but is preferably The following formula (A1): [ka] [In formula (A1), Ar1 represents an optionally substituted arylene group having 6 to 20 carbon atoms; each Ra represents independently a hydrogen atom, a monovalent group containing an epoxy group, or an alkyl group having 1 to 6 carbon atoms; at least one Ra represents a monovalent group containing an epoxy group and at least one Ra represents an alkyl group having 1 to 12 carbon atoms; Rb and Rc represent independently a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; Rd represents a hydrogen atom, a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; each R1 represents independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; n represents an integer of 2 to 50; mb represents an integer of 0 to 6; and mc represents an integer of 0 to 5.] The compound includes a compound represented by the formula:

[0024] In formula (A1), Ar1 is an optionally substituted arylene group having 6 to 20 carbon atoms. Examples of the arylene group having 6 to 20 carbon atoms include a phenylene group, a 1-naphthylene group, and a 2-naphthylene group. The number of carbon atoms in the arylene group is preferably 6 to 14, more preferably 6 to 10, and typically 6 (i.e., a phenylene group).

[0025] Examples of the substituent that the arylene group may have include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and an aryl group having 1 to 10 carbon atoms, and among these, an alkyl group having 1 to 6 carbon atoms is preferred, and an alkyl group having 1 to 3 carbon atoms is more preferred. Examples of the aryl group include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.

[0026] In formula (A1), each Ra is independently a hydrogen atom, a monovalent group containing an epoxy group, or an alkyl group having 1 to 12 carbon atoms. However, in formula (A1), at least one Ra is a monovalent group containing an epoxy group, and at least one Ra is an alkyl group having 1 to 12 carbon atoms. When Ra is a monovalent group containing an epoxy group, examples of such a monovalent group include epoxyalkyl groups (the number of carbon atoms in the alkyl moiety is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 or 2), and among these, a glycidyl group is preferred. When Ra is an alkyl group, the number of carbon atoms is preferably 1 to 6, more preferably 1 to 3, and even more preferably 1 (i.e., a methyl group). When Ra is an alkyl group, it may be substituted, and the above-mentioned substituent C is suitable as the substituent. When the number n+1 of repeating units (naphthol aralkyl structures) contained in the compound represented by formula (A1) is taken as 100%, preferably 50% or more, more preferably 60% or more, 70% or more, 75% or more, 80% or more, or 90% or more of the naphthol hydroxyl groups have their hydrogen atoms substituted with substituents Ra, and the hydrogen atoms of all (100%) of the naphthol hydroxyl groups may be substituted with substituents Ra. The equivalent ratio of naphthol hydroxyl groups to substituents Ra (naphthol hydroxyl groups / substituents Ra) is preferably 1 or less, more preferably close to 0, and even more preferably 0.

[0027] In formula (A1), Rb and Rc are each independently a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms. When Rb or Rc is a monovalent group containing an epoxy group, examples of such a monovalent group include an epoxyalkyloxy group (the alkyl moiety preferably has 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, and even more preferably 1 or 2 carbon atoms), and among these, a glycidyloxy group is preferred. When Rb or Rc is an alkyl group, it preferably has 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1 carbon atom (i.e., a methyl group). When Rb or Rc is an aryl group, it preferably has 6 to 10 carbon atoms (e.g., a phenyl group, a 1-naphthyl group, a 2-naphthyl group), and even more preferably 6 carbon atoms. Rb and Rc are each independently an alkyl group having 1 to 12 carbon atoms, and more preferably a methyl group. When Rb or Rc is an alkyl group or an aryl group, it may be substituted, and the number of substituents may be one or more, and each independently is preferably the above-mentioned substituent C. Rb and Rc mean substituents directly bonded to the naphthalene ring.

[0028] In formula (A1), Rd represents a hydrogen atom, a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms. Preferably, Rd is the same as any of the groups represented by Rb, or a hydrogen atom. Furthermore, Rd is preferably a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, and more preferably a hydrogen atom. When Rd represents an alkyl group or an aryl group, it may be substituted, and the number of substituents may be one or more, and the above-mentioned substituent C is preferred. Furthermore, Rd represents a substituent directly bonded to the naphthalene ring.

[0029] In formula (A1), R1 is each independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. It is preferable that all of the multiple R1s are hydrogen atoms. When R1 is an alkyl group, it preferably has 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1. It is preferable that the two R1s, together with the carbon atom to which they are bonded, form an alkylene group having 1 to 3 carbon atoms, and specific examples of this are -CH2-, -CH(CH3)-, and -C(CH3)2-. When R1 is an alkyl group, it may be substituted, and the substituents may be one or more, and each independently is preferably the above-mentioned substituent C.

[0030] In formula (A1), n ​​is an integer of 2 to 50. There are no limitations on n as long as the weight average molecular weight (Mw) of component (A) as a whole falls within the above-mentioned range, but from the viewpoint of providing a cured product with excellent heat resistance, n is preferably an integer of 2 or greater, more preferably an integer of 3 or greater, and even more preferably an integer of 4 or greater. In one embodiment, n is 4 or greater, and at least two Ra in formula (A1) are alkyl groups having 1 to 6 carbon atoms.

[0031] In formula (A1), mb is an integer of 0 to 6. mb is preferably an integer of 0 to 3. In formula (A1), mc is an integer of 0 to 5. mc is preferably an integer of 0 to 2. The sum of mb and mc is preferably 7 or less or 6 or less, more preferably in the range of 0 to 5, and even more preferably in the range of 0 to 4. In one embodiment, both mb and mc are 0, and Rd is a hydrogen atom.

[0032] More preferably, the component (A) is a compound represented by the following formula (A2): [ka] [In formula (A2), Ra and n are the same as Ra and n in formula (A1), respectively.] In one embodiment, n is 4 or more, and at least two Ra in formula (A2) are alkyl groups having 1 to 6 carbon atoms.

[0033] The specific epoxy resin can be produced, for example, according to known methods. For example, a naphthol aralkyl resin is produced using naphthol as a material having phenolic hydroxyl groups, as described in JP 08-073570 A, and then, if necessary, some of the hydroxyl groups on the naphthalene ring are alkoxylated according to the method described in Japanese Patent No. 4465257 A. Alternatively, a commercially available naphthol aralkyl resin having a weight-average molecular weight of 1000 or more (e.g., "SN-4110V" manufactured by Nippon Steel Chemical & Material Co., Ltd.) can be used, and some or all of the remaining hydroxyl groups can be glycidylated, followed by purification as necessary. The specific epoxy resin may also be a commercially available product containing a compound represented by formula (A1) or (A2). An example of such a commercially available product is "ESN-4100V" manufactured by Nippon Steel Chemical & Material Co., Ltd. (methoxy group-containing naphthol aralkyl resin, epoxy equivalent: 360 g / eq., weight-average molecular weight (Mw): 1600).

[0034] The content of component (A) in the resin composition is not particularly limited, but from the viewpoint of enhancing the expected effects of the present invention, when the nonvolatile components in the resin composition are taken as 100% by mass, it is preferably 5% by mass or more, more preferably 7% by mass or more, even more preferably 10% by mass or more, and preferably 70% by mass or less, more preferably 65% ​​by mass or less, even more preferably 60% by mass or less or 50% by mass or less. Therefore, in a preferred embodiment, the content of component (A) is 5 to 70% by mass, when the nonvolatile components in the resin composition are taken as 100% by mass.

[0035] The content of component (A) in the resin composition is not particularly limited, but from the viewpoint of enhancing the expected effects of the present invention, when the resin component in the resin composition is taken as 100 mass%, it is preferably 7.5 mass% or more, more preferably 10 mass% or more, even more preferably 15 mass% or more, and is preferably 95 mass% or less, more preferably 85 mass% or less, even more preferably 80 mass% or less or 75 mass% or less. The resin component in the resin composition refers to the non-volatile components in the resin composition excluding the inorganic filler (C).

[0036] -(B) Hardener- The resin composition of the present invention contains a curing agent as component (B), which contains at least (B-1) an active ester curing agent. The (B) curing agent typically has the function of reacting with component (A) and epoxy resins other than component (A) to cure the resin composition. In addition to the active ester curing agent, the curing agent may also contain a curing agent other than (B-2) the active ester curing agent.

[0037] --(B-1) Active ester curing agent-- The resin composition of the present invention contains (B-1) an active ester curing agent. Typically, (B-1) an active ester curing agent can react with (B) an epoxy resin to cure the resin composition. (B-1) An active ester curing agent may be used alone or in combination of two or more types in any ratio.

[0038] As the (B-1) active ester curing agent, compounds having two or more highly reactive ester groups per molecule as reactive functional groups, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are generally preferred. The active ester curing agent is preferably one obtained by the condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound. From the viewpoint of producing a cured product with particularly excellent heat resistance, active ester curing agents obtained from a carboxylic acid compound and a hydroxy compound are preferred, and active ester curing agents obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound are more preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalene, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0039] Specifically, the (B-1) active ester curing agent is preferably a dicyclopentadiene-type active ester curing agent, a naphthalene-type active ester curing agent containing a naphthalene structure, an active ester curing agent containing an acetylated product of phenol novolac, or an active ester curing agent containing a benzoylated product of phenol novolac, and more preferably at least one selected from dicyclopentadiene-type active ester curing agents and naphthalene-type active ester curing agents. The dicyclopentadiene-type active ester curing agent is preferably an active ester curing agent containing a dicyclopentadiene diphenol structure. The "dicyclopentadiene diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0040] Commercially available products of (B-1) active ester curing agents include "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", and "HPC-8000H-65TM" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; and "EXB-8100L-65T", "EXB-8150-60T", and "EXB-8150-62" as active ester curing agents containing a naphthalene structure. Examples of such curing agents include "EXB-9416-70BK", "HPC-8150-60T", and "HPC-8150-62T" (manufactured by DIC Corporation); "EXB9401" (manufactured by DIC Corporation) as a phosphorus-containing active ester curing agent; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester curing agent which is an acetylated product of phenol novolac; "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) as active ester curing agents which are benzoylated products of phenol novolac; and "PC1300-02-65MA" (manufactured by Air Water Inc.) as an active ester curing agent containing a styryl group and a naphthalene structure.

[0041] The equivalent weight of the reactive functional group of the (B-1) active ester curing agent is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 450 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The equivalent weight of the reactive functional group is the mass of the compound per equivalent of the reactive functional group.

[0042] The content of component (B-1) in the resin composition is preferably 3% by mass or more, more preferably 4% by mass or more, and even more preferably 5% by mass or more, from the viewpoint of obtaining a cured product with excellent dielectric properties, where the total nonvolatile components in the resin composition is taken as 100% by mass. The upper limit depends on the total number of epoxy groups in the epoxy resin to be cured, but can be, for example, 50% by mass or less, 40% by mass or less, or 30% by mass or less. Thus, in a preferred embodiment, the content of component (B-1) is 3 to 50% by mass, where the total nonvolatile components in the resin composition is taken as 100% by mass.

[0043] The mass ratio of the (B-1) component to the (A) component ((B-1) component / (A) component) depends on the total number of functional groups, but may be, for example, 5% by mass or more, 10% by mass or more, 20% by mass or more, or 30% by mass or more, and 75% by mass or less, 70% by mass or less, or 65% by mass or less.

[0044] From the viewpoint of providing a cured product with excellent dielectric properties, the mass ratio of the (B-1) component to the (B) component ((B-1) component / (B) component) is preferably 50 mass% or more, more preferably 60 mass% or more, and even more preferably 70 mass% or more, with the upper limit being 100 mass%, and can be, for example, 98 mass% or less, 96 mass% or less, or 94 mass% or less.

[0045] --(B-2) Curing agents other than active ester-based curing agents-- Examples of curing agents other than the (B-2) active ester curing agent include phenolic curing agents, naphthol curing agents, benzoxazine curing agents, cyanate ester curing agents, carbodiimide curing agents, and acid anhydride curing agents. From the viewpoint of achieving the effects of the present invention more significantly, the (B-2) component preferably contains one or more of the following: phenolic curing agents, naphthol curing agents, cyanate ester curing agents, and carbodiimide curing agents; more preferably, it contains one or more of the following: phenolic curing agents and naphthol curing agents; and most preferably, it contains a phenolic curing agent. The (B-2) component may be used singly or in a combination of two or more in any ratio.

[0046] As the phenol-based curing agent and naphthol-based curing agent, a phenol-based curing agent having a novolac structure or a naphthol-based curing agent having a novolac structure is preferred from the viewpoint of heat resistance and water resistance. Furthermore, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferred, and a triazine skeleton-containing phenol-based curing agent is more preferred.

[0047] Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700," "MEH-7810," and "MEH-7851" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN-170," "SN-180," "SN-190," "SN-475," "SN-485," "SN-495," "SN-495V," "SN-375," and "SN-395" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; and "TD-2090," "LA-7052," "LA-7054," "LA-1356," "LA3018-50P," and "EXB-9500" manufactured by DIC Corporation.

[0048] Specific examples of benzoxazine curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemicals Corporation.

[0049] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; multifunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been triazine converted to a trimer), all of which are manufactured by Lonza Japan.

[0050] Specific examples of carbodiimide curing agents include "V-03" and "V-07" manufactured by Nisshinbo Chemical Inc.

[0051] The acid anhydride curing agent may be a curing agent having one or more acid anhydride groups in one molecule, and a curing agent having two or more acid anhydride groups in one molecule is preferred. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of acid anhydrides include biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins (copolymers of styrene and maleic acid). Commercially available acid anhydride curing agents include "HNA-100" and "MH-700" manufactured by New Japan Chemical Co., Ltd.

[0052] The content of the (B-2) component in the resin composition is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, from the viewpoint of obtaining a cured product with excellent dielectric properties, assuming that the non-volatile components in the resin composition are 100% by mass. The lower limit is 0% by mass (i.e., not contained), and is not particularly limited, but may be 2% by mass or more, 4% by mass or more, or 6% by mass or more. The content of the (B-2) component is preferably less than the content of the (B-1) component.

[0053] (B) The total number of reactive functional groups in component N b The total number N of epoxy groups contained in component (A) a Ratio to (N b :N aThe value of (N) is preferably within a specific range. The reactive functional group of component (B) generally refers to a group capable of reacting with an epoxy group, and includes groups that generate a group capable of reacting with an epoxy group upon heating or the like. Therefore, the reactive functional group includes the active ester group of component (B-1). The above ratio (N b :N a The value of "total number N" is preferably 0.2 or more, more preferably 0.3 or more, particularly preferably 0.4 or more, and is preferably 100 or less, more preferably 90 or less, particularly preferably 80 or less. b " is the total value obtained by dividing the mass of the non-volatile components of component (B) present in the resin composition by the equivalent weight of the reactive functional group. b :N a When the value of (B) is within the above range, the effects of the present invention can be significantly achieved. Therefore, in a preferred embodiment, the ratio of the total number of reactive functional groups in component (B) to the total number of epoxy groups in component (A) is 0.2 to 100.

[0054] The mass ratio of component (B) to component (A) (component (B) / component (A)) depends on the total number of functional groups, but may be, for example, 5% by mass or more, 10% by mass or more, 20% by mass or more, or 30% by mass or more, and 100% by mass or less, 90% by mass or less, or 80% by mass or less.

[0055] The content of component (B) in the resin composition is preferably 3% by mass or more, more preferably 4% by mass or more, and even more preferably 5% by mass or more, from the viewpoint of enhancing the intended effects of the present invention, where the total nonvolatile components in the resin composition is taken as 100% by mass. The upper limit depends on the total number of epoxy groups in the epoxy resin to be cured, but can be, for example, 70% by mass or less, 60% by mass or less, or 50% by mass or less. Therefore, in a preferred embodiment, the content of component (B-1) is 3 to 70% by mass, where the total nonvolatile components in the resin composition is taken as 100% by mass.

[0056] -(C)Inorganic filler- The resin composition of the present invention may further contain an inorganic filler as component (C). In addition, when the resin composition contains component (C), a cured product having excellent heat resistance (for example, glass transition temperature) can be obtained.

[0057] Examples of component (C) include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is preferred. Component (C) may be used alone or in combination of two or more.

[0058] Commercially available products of component (C) include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by Denka Company Limited; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.; and "DAW-03" and "FB-105FD" manufactured by Denka Company Limited.

[0059] The average particle size of component (C) is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less, 2 μm or less, 1 μm or less, or 0.7 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.07 μm or more, 0.1 μm or more, or 0.2 μm or more. The average particle size of component (C) can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture ultrasonically for 10 minutes. The measurement sample was measured using a laser diffraction particle size distribution analyzer, with blue and red light source wavelengths used, and the particle size distribution of the inorganic filler on a volume basis was measured using a flow cell system, and the average particle size was calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction particle size distribution analyzer is the "LA-960" manufactured by Horiba, Ltd.

[0060] The specific surface area of ​​component (C) is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, 3m 2 / g or more or 5m 2 The upper limit of the specific surface area is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 80m 2 / g or less, more preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area of ​​component (C) is determined in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Mountech Co., Ltd., "Macsorb HM-1210") and calculating the specific surface area using the BET multipoint method.

[0061] Component (C) is preferably surface-treated with an appropriate surface treatment agent. This surface treatment can enhance the moisture resistance and dispersibility of component (C). Examples of surface treatment agents include silane coupling agents such as vinyl silane coupling agents, epoxy silane coupling agents, styryl silane coupling agents, (meth)acrylic silane coupling agents, amino silane coupling agents, isocyanurate silane coupling agents, ureido silane coupling agents, mercapto silane coupling agents, isocyanate silane coupling agents, and acid anhydride silane coupling agents; non-silane coupling alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane; and silazane compounds. The surface treatment agents may be used alone or in combination of two or more.

[0062] Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd.

[0063] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2 to 5% by mass of the surface treatment agent.

[0064] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in the form of a sheet, it is more preferable that the melt viscosity is 1.0 mg / m 2 Preferably less than 0.8 mg / m 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred. The carbon amount per unit surface area of ​​component (C) can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. The supernatant is removed, the solid content is dried, and then the carbon amount per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. An "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used as the carbon analyzer.

[0065] From the viewpoint of enhancing the intended effects of the present invention, the content of component (C) in the resin composition is preferably 40% by mass or more, more preferably 45% by mass or more, and even more preferably 50% by mass or more or 55% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. The upper limit of the content of component (C) is not particularly limited and is determined depending on the contents of components (A) and (B). Therefore, in a preferred embodiment, the content of component (C) is 40% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition.

[0066] -(D)Thermoplastic resin- The resin composition of the present invention may further contain a thermoplastic resin as component (D).

[0067] Examples of component (D) include phenoxy resins, polyimide resins, polycarbonate resins, polyvinyl acetal resins, polyolefin resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polyetheretherketone resins, polystyrene resins, polyester resins, etc. Among these, from the viewpoint of obtaining a cured product with excellent dielectric properties, component (D) preferably contains one or more resins selected from phenoxy resins, polyimide resins, and polycarbonate resins, and more preferably contains one or more resins selected from phenoxy resins.

[0068] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenolacetophenone, novolac, biphenyl, fluorene, dicyclopentadiene, norbornene, naphthalene, anthracene, adamantane, terpene, and trimethylcyclohexane. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

[0069] Commercially available phenoxy resins include, for example, "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "YL7500BH30," "YX6954BH30," "YX7553," "YX7553BH30," "YL7769BH30," "YL6794," "YL7213," "YL7290," and "YL7482" manufactured by Mitsubishi Chemical Corporation.

[0070] The polyimide resin may be a resin having an imide structure. Polyimide resins are generally obtained by an imidization reaction between a diamine compound and an acid anhydride. Commercially available polyimide resins may be used, such as "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd.

[0071] Polycarbonate resins are resins having a carbonate structure. Examples of such resins include carbonate resins without reactive groups, hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, urethane group-containing carbonate resins, and epoxy group-containing carbonate resins. Here, the reactive group refers to a functional group that can react with other components, such as a hydroxy group, a phenolic hydroxyl group, a carboxy group, an acid anhydride group, an isocyanate group, a urethane group, or an epoxy group.

[0072] Commercially available polycarbonate resins can be used, including "FPC0220" and "FPC2136" manufactured by Mitsubishi Gas Chemical Company, "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090," "C-2090," and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd.

[0073] From the viewpoint of obtaining a cured product with even more excellent mechanical properties, the weight average molecular weight (Mw) of component (D) is preferably at least 5,000, more preferably at least 8,000, and even more preferably at least 10,000. There are no particular limitations on the upper limit of Mw, but it is preferably not more than 100,000, more preferably not more than 80,000, and even more preferably not more than 50,000. The Mw of component (D) can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0074] When the resin composition contains component (D), the content of component (D) in the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.5% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition, from the viewpoint of obtaining a cured product with even more excellent mechanical properties. The upper limit of the content of component (D) is not particularly limited as long as it does not excessively impair the effects of the present invention, but may be, for example, 60% by mass or less, 50% by mass or less, or 45% by mass or less. In one embodiment, the content of component (D) is less than the sum of the contents of components (A) and (B).

[0075] -(E) Curing accelerator- The resin composition of the present invention may further contain a curing accelerator as component (E). By including a curing accelerator in the resin composition (E), it is possible to efficiently adjust the curing time, etc. Examples of the curing accelerator as component (E) include amine-based curing accelerators, peroxide-based curing accelerators, phosphorus-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators, and typical examples thereof are amine-based curing accelerators and peroxide-based curing accelerators.

[0076] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine (DMAP), benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, 1,8-diazabicyclo[5,4,0]undecene-7,4-dimethylaminopyridine, and 2,4,6-tris(dimethylaminomethyl)phenol, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred. Examples of commercially available amine-based curing accelerators include "DMAP" manufactured by Wako Pure Chemical Industries, Ltd.

[0077] Examples of peroxide-based curing accelerators include peroxides such as t-butylcumyl peroxide, t-butyl peroxyacetate, α,α'-di(t-butylperoxy)diisopropylbenzene, t-butyl peroxylaurate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, and t-butyl peroxybenzoate.

[0078] Commercially available peroxide-based curing accelerators include, for example, "Perbutyl (registered trademark) C," "Perbutyl (registered trademark) A," "Perbutyl (registered trademark) P," "Perbutyl (registered trademark) L," "Perbutyl (registered trademark) O," "Perbutyl (registered trademark) ND," "Perbutyl (registered trademark) Z," "Perhexyl (registered trademark) D," "Percumyl (registered trademark) P," and "Percumyl (registered trademark) D," all manufactured by NOF Corporation.

[0079] When the resin composition contains the (E) component, the content of the (E) component is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, and even more preferably 0.05% by mass or more, and is preferably 1% by mass or less, more preferably 0.5% by mass or less, and even more preferably 0.3% by mass or less, based on 100% by mass of the non-volatile components in the resin composition.

[0080] -Other ingredients- In the present invention, the resin composition may further contain an epoxy resin other than the specific epoxy resin of component (A) in an amount that does not excessively inhibit the intended effects of the present invention.

[0081] Examples of epoxy resins include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexanedimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, and tetraphenylethane-type epoxy resins. Epoxy resins may be used alone or in combination of two or more.

[0082] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter referred to as "solid epoxy resins"). The resin composition for a resin sheet of the present invention may contain only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin.

[0083] Specific examples of liquid epoxy resins include "HP4032," "HP4032D," and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation; "828US," "jER828EL," "825," and "Epikote 828EL" (bisphenol A-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "630" and "630LSD" (glycidylamine-type epoxy resins) manufactured by Mitsubishi Chemical Corporation. ); "ZX1059" manufactured by Nippon Steel Chemical & Material Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" manufactured by Nagase ChemteX Corporation (glycidyl ester type epoxy resin); "Celloxide 2021P" manufactured by Daicel Corporation (alicyclic epoxy resin with an ester skeleton); "PB-3600" manufactured by Daicel Corporation (epoxy resin with a butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.

[0084] Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200HH", "HP-7200H", and "HP-7200" (dicyclopentadiene epoxy resins) manufactured by DIC Corporation. ene-type epoxy resins); DIC Corporation's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", and "HP6000" (naphthylene ether-type epoxy resins); Nippon Kayaku Co., Ltd.'s "EPPN-502H" (trisphenol-type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC7000L" (naphthol novolac-type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC3000H", "NC3000", and "NC3000L" ","NC3100" (biphenyl-type epoxy resin); "ESN475V" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN485" (naphthol novolac-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX4000HK" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; " Examples of epoxy resins include "YX8800" (anthracene-type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (solid bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation.

[0085] The epoxy equivalent of the epoxy resin is preferably 50 g / eq to 5000 g / eq, more preferably 50 g / eq to 3000 g / eq, even more preferably 80 g / eq to 2000 g / eq, and even more preferably 110 g / eq to 1000 g / eq. The epoxy equivalent is the mass of a compound containing one equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0086] The weight average molecular weight (Mw) of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500. The Mw of the epoxy resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0087] When the resin composition contains an epoxy resin, the content of the epoxy resin in the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, 1% by mass or more, or 1.5% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, or 3% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0088] The resin composition may further contain any additives. Examples of such additives include organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone-based antifoaming agents, acrylic-based antifoaming agents, fluorine-based antifoaming agents, and vinyl resin-based antifoaming agents; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion improvers such as urea silane; triazole-based adhesion promoters, tetrazole-based adhesion promoters, and triazine-based adhesion promoters. Examples of additives include adhesion promoters such as antioxidants; antioxidants such as hindered phenol antioxidants and hindered amine antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. These additives may be used alone or in combination. The content of each additive can be appropriately determined by those skilled in the art.

[0089] In addition to the nonvolatile components described above, the resin composition may further contain any organic solvent as a volatile component. Known organic solvents can be used appropriately, and the type is not particularly limited. Examples of organic solvents include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of suitable organic solvents include ether ester solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. These organic solvents may be used singly or in combination of two or more.

[0090] In the present invention, the resin composition can be produced, for example, by adding component (A) and component (B-1), and optionally components (B-2), (C), (D), and (E), an epoxy resin other than component (A), other additives, and an organic solvent, to any preparation vessel in any order and / or all at once and mixing them. The temperature can be appropriately set during the process of adding and mixing each component, and heating and / or cooling may be performed temporarily or throughout the process. During or after the process of adding and mixing, the resin composition may be stirred or shaken using a stirring or shaking device such as a mixer to uniformly disperse the components. Simultaneous with the stirring or shaking, degassing may be performed under low-pressure conditions, such as under vacuum.

[0091] As described above, the resin composition of the present invention, which contains the components (A) and (B-1) in combination, realizes a novel resin composition that provides a cured product with low roughness and good adhesion to conductors. Furthermore, the resin composition of the present invention can also provide a cured product with excellent properties such as low roughness and good adhesion to conductors, as well as excellent dielectric properties, heat resistance, and HAST resistance.

[0092] In one embodiment, a cured product of the resin composition of the present invention is characterized by good adhesion to a conductor. For example, the plating peel strength measured by the method described in the section "Evaluation of Adhesion to Conductor" below can be 0.40 kgf / cm or more, 0.42 kgf / cm or more, or 0.44 kgf / cm or more. The upper limit is naturally determined depending on the composition of the resin composition, etc.

[0093] In one embodiment, the cured product of the resin composition of the present invention is characterized by low roughness. For example, the arithmetic mean roughness (Ra) measured by the method described in the section "Evaluation of Low Roughness" below can be less than 150 nm, 100 nm or less, 80 nm or less, or 60 nm or less. The lower limit is naturally determined depending on the composition of the resin composition, etc.

[0094] In one embodiment, the cured product of the resin composition of the present invention tends to exhibit excellent dielectric properties. For example, the value of the dielectric tangent (Df) measured by the method described in the <Evaluation of Dielectric Properties> column to be described later can be less than 0.0050, 0.0045 or less, or 0.0042 or less. Therefore, in a preferred embodiment, a resin composition is provided in which the value of the dielectric tangent of the cured product is less than 0.005.

[0095] In one embodiment, the cured product of the resin composition of the present invention tends to exhibit excellent heat resistance. For example, the glass transition temperature (TMA method) measured by the method described in the <Evaluation of Heat Resistance> column to be described later can be more than 145 °C, 145 °C or higher, 150 °C or higher, 155 °C or higher, or 157 °C or higher. The upper limit is naturally determined according to the composition of the resin composition and the like. Therefore, in a preferred embodiment, a resin composition is provided in which the glass transition temperature of the cured product is more than 145 °C. In a more preferred embodiment, a resin composition is provided in which the value of the dielectric tangent of the cured product is less than 0.005 and the glass transition temperature of the cured product is more than 145 °C.

[0096] In one embodiment, the cured product of the resin composition of the present invention tends to exhibit excellent HAST resistance. For example, the difference in copper foil peel strength (P1 - P0) before and after HAST resistance measured by the method described in the <Evaluation of HAST Resistance> column to be described later can be less than 0.50 kgf / cm, 0.45 kgf / cm or less, or 0.42 kgf / cm or less. For example, the copper foil peel strength P0 after HAST resistance measured by the method described in the <Evaluation of HAST Resistance> column to be described later can be 0.10 kgf / cm or higher, 0.15 kgf / cm or higher, 0.20 kgf / cm or higher, or 0.25 kgf / cm or higher.

[0097] The resin composition of the present invention can be suitably used as a resin composition for insulating purposes, particularly as a resin composition for forming an insulating layer. Specifically, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (a resin composition for an insulating layer of a printed wiring board), and more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (a resin composition for an insulating interlayer of a printed wiring board). Since the resin composition of the present invention provides an insulating layer with good component embedding properties, it can also be suitably used when the printed wiring board is a circuit board with built-in components. The resin composition of the present invention can also be suitably used as a resin composition for forming an insulating layer on which a conductor layer (including a rewiring layer) is provided (a resin composition for an insulating layer for forming a conductor layer). The resin composition of the present invention can also be used in a wide range of applications requiring a resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor encapsulants, hole-filling resins, and component-embedding resins.

[0098] [Resin sheet] The resin composition of the present invention can be used by applying it in the form of a varnish, but industrially it is generally preferred to use it in the form of a sheet-like laminate material containing the resin composition.

[0099] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0100] In one embodiment, the resin sheet comprises a support and a layer of a resin composition (hereinafter simply referred to as a "resin composition layer") provided on the support, and is characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0101] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of thinning the printed wiring board and providing a cured product of the resin composition with excellent insulating properties even when the cured product is thin. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more, 10 μm or more, etc.

[0102] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0103] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0104] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0105] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment. Alternatively, a support having a release layer on the surface to be bonded to the resin composition layer may be used as the support. Examples of the release agent used in the release layer of the support having a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available products may be used as the support having a release layer, such as "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Uni-Peel" manufactured by Unitika Limited, which are PET films having a release layer primarily composed of an alkyd resin-based release agent.

[0106] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0107] The support may also be a metal foil with a support substrate, which is a thin metal foil with a peelable support substrate attached thereto. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer provided on the support substrate, and a metal foil provided on the release layer. When a metal foil with a support substrate is used as the support, the resin composition layer is provided on the metal foil.

[0108] In the metal foil with a supporting substrate, the material of the supporting substrate is not particularly limited, but examples thereof include copper foil, aluminum foil, stainless steel foil, titanium foil, copper alloy foil, etc. When copper foil is used as the supporting substrate, it may be electrolytic copper foil or rolled copper foil. Furthermore, the release layer is not particularly limited as long as it allows the metal foil to be released from the supporting substrate, and examples thereof include an alloy layer of an element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, and P; an organic coating, etc.

[0109] In the metal foil with a supporting substrate, the material of the metal foil is preferably, for example, copper foil or copper alloy foil.

[0110] In the metal foil with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm. The thickness of the metal foil may be, for example, in the range of 0.1 μm to 10 μm.

[0111] In one embodiment, the resin sheet may further include an optional layer, if necessary. Examples of such optional layers include a protective film provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

[0112] The resin sheet can be produced, for example, by preparing a liquid resin composition as is or a resin varnish by dissolving the resin composition in an organic solvent, applying this onto a support using a die coater or the like, and then drying to form a resin composition layer.

[0113] The organic solvent may be the same as the organic solvent described as a component of the resin composition. The organic solvent may be used alone or in combination of two or more.

[0114] Drying may be carried out by known methods such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is carried out so that the content of organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0115] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0116] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0117] The sheet-like fiber substrate used for the prepreg is not particularly limited, and commonly used prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited. It is usually 10 μm or more.

[0118] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0119] The thickness of the prepreg may be in the same range as that of the resin composition layer in the resin sheet described above.

[0120] The sheet-like laminate material of the present invention can be suitably used for forming an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used for forming an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board).

[0121] [Printed wiring board] The printed wiring board of the present invention includes an insulating layer made of a cured product of the resin composition of the present invention.

[0122] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., thermally curing) the resin composition layer to form an insulating layer.

[0123] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be referred to as an "inner layer circuit board." Furthermore, the "inner layer substrate" of the present invention also includes intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0124] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). The thermocompression bonding member may be pressed directly onto the resin sheet, or may be pressed via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0125] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination may be carried out under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0126] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0127] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0128] The support may be removed between step (I) and step (II), or after step (II). When a metal foil is used as the support, the conductor layer may be formed using the metal foil without peeling off the support. When a metal foil with a supporting substrate is used as the support, the supporting substrate (and the release layer) may be peeled off. Then, the conductor layer can be formed using the metal foil.

[0129] In step (II), the resin composition layer is cured (for example, by heat curing) to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions typically employed for forming insulating layers for printed wiring boards may be used.

[0130] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120° C. to 250° C., more preferably 150° C. to 240° C., and even more preferably 180° C. to 230° C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0131] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0132] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0133] In another embodiment, the printed wiring board of the present invention can be produced using the above-mentioned prepreg. The production method is basically the same as when a resin sheet is used.

[0134] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0135] Step (IV) is a step of roughening the insulating layer. Typically, smear removal is also performed in this step (IV). The roughening treatment procedure and conditions are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0136] The swelling liquid used in the roughening treatment is not particularly limited, but examples thereof include alkaline solutions and surfactant solutions, and is preferably an alkaline solution, with sodium hydroxide solution and potassium hydroxide solution being more preferred. Commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be carried out by, for example, immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. To keep the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0137] The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0138] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Securigant P" manufactured by Atotech Japan.

[0139] Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the standpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0140] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0141] The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0142] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0143] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using a conventionally known technique such as a semi-additive method or a full-additive method. From the viewpoint of ease of production, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by a semi-additive method will be described below.

[0144] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0145] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The resin composition layer and the metal foil may be laminated by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventionally known technique such as a subtractive method or a modified semi-additive method.

[0146] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0147] Alternatively, when a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the conductor layer may be formed using the metal foil, as described above.

[0148] Furthermore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer for forming a rewiring layer (resin composition for forming a rewiring layer) and as a resin composition for encapsulating a semiconductor chip (resin composition for encapsulating a semiconductor chip) when manufacturing a semiconductor chip package. Techniques for manufacturing semiconductor chip packages using resin compositions (resin sheets) are widely known in the art, and the resin composition and resin sheet of the present invention can be applied to any of these methods and techniques.

[0149] [Semiconductor Devices] The semiconductor device of the present invention includes an insulating layer made of a cured product of the resin composition layer of the present invention. The semiconductor device of the present invention can be produced using the printed wiring board or semiconductor package of the present invention.

[0150] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0151] The present invention will be described in more detail below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Unless otherwise specified, the temperature and pressure conditions are room temperature (25°C) and atmospheric pressure (1 atm).

[0152] Examples 1 and 2 and Comparative Examples 1 and 2 Examples and comparative examples of resin compositions containing a component selected from component (A) and component (B) are shown below.

[0153] [Example 1] (1) Preparation of resin composition 40 parts of an active ester curing agent b1a (DIC Corporation's "HPC-8000L-65TM" (an active ester curing agent containing a dicyclopentadiene-type diphenol structure), non-volatile content: 65 mass%, functional group equivalent: 281 g / eq.) as component (B-1), 5 parts of a curing agent b2 other than an active ester curing agent (DIC Corporation's "LA-3018-50P" (a triazine skeleton-containing cresol novolac curing agent), functional group equivalent (hydroxyl group equivalent): 151 g / eq., non-volatile content: 50 mass% (2-methoxypropanol solution)) as component (B-2), and 5 parts of a thermoplastic resin d (Mitsubishi Chemical Corporation's "YX 7553BH30" (phenoxy resin), 5 parts of non-volatile components: 30% by mass (1:1 solution of cyclohexanone: methyl ethyl ketone (MEK)), 50 parts of naphthol aralkyl epoxy resin a1 ("ESN-4100V" (naphthol aralkyl resin) manufactured by Nippon Steel Chemical & Material Co., Ltd., epoxy equivalent: 360 g / eq., weight average molecular weight (Mw): 1600) as component (A), 50 parts of inorganic filler c (spherical silica "SO-C2" manufactured by Admatechs Co., Ltd., surface-treated with amine-based silane coupling agent "KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) as component (C), 2 210 parts of ethanol (1 / g) and 0.1 parts of curing accelerator e (DMAP (4-dimethylaminopyridine; amine curing accelerator) manufactured by Wako Pure Chemical Industries, Ltd.) as component (E) were uniformly dispersed using a mixer to obtain a resin composition (non-volatile components: 93.6% by mass) containing components (A) to (E).

[0154] (2) Preparation of resin sheet A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The resin compositions obtained in the Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. Thereafter, the resin composition was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A including a support and a resin composition layer. (3) Evaluation Resin sheet A was used for the evaluation described below.

[0155] [Example 2] 1) A resin composition was prepared in the same manner as in Example 1, except that 40 parts of active ester curing agent b1a as component (B-1) was replaced with 35 parts of active ester curing agent b1b ("HPC-8150-62T" (active ester curing agent containing a naphthalene structure) manufactured by DIC Corporation, non-volatile components: 62 mass% (toluene solution), functional group equivalent: 233 g / eq.), and the amount of inorganic filler c as component (C) was changed from 210 parts to 200 parts. A resin composition was prepared, a resin sheet A was produced, and an evaluation was performed using the resin sheet A.

[0156] [Comparative Example 1] A resin composition was prepared in the same manner as in Example 1, except that 1) 50 parts of naphthol aralkyl epoxy resin a' ("ESN-475V" (naphthol aralkyl resin), manufactured by Nippon Steel Chemical & Material Co., Ltd., epoxy equivalent: 325 g / eq., weight-average molecular weight (Mw): 660) was used as component (A') instead of naphthol aralkyl epoxy resin a1 as component (A), 2) the amount of active ester curing agent b1a as component (B-1) was changed from 40 parts to 45 parts, and 3) the amount of inorganic filler c as component (C) was changed from 210 parts to 220 parts. A resin composition was prepared, a resin sheet A was produced, and an evaluation was performed using the resin sheet A.

[0157] Comparative Example 2 1) A resin composition was prepared in the same manner as in Comparative Example 1, except that 40 parts of active ester curing agent b1b was used instead of 45 parts of active ester curing agent b1a as component (B-1), and the amount of inorganic filler c as component (C) was changed from 220 parts to 210 parts. Resin sheet A was then produced and evaluation was performed using resin sheet A.

[0158] Next, various measurement and evaluation methods will be explained.

[0159] <Evaluation of dielectric properties - Measurement of dielectric dissipation factor (Df)> The resin sheet A obtained in each of the examples and comparative examples was cured in an oven at 190°C for 90 minutes. The support was peeled off from the resin sheet A taken out of the oven to obtain a cured resin composition layer. The cured product was cut into a length of 80 mm and a width of 2 mm to be used as a cured product for evaluation.

[0160] For each cured product for evaluation, the dielectric loss tangent (Df value) was measured by the cavity resonance perturbation method using an Agilent Technologies HP8362B at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on two test pieces, and the average was calculated.

[0161] <Evaluation of heat resistance - Measurement of glass transition temperature (Tg)> Resin sheet A obtained in the examples and comparative examples was cured in an oven at 190°C for 90 minutes and then peeled off from the support to obtain a cured film. This cured film was cut into a length of 20 mm and a width of 6 mm to prepare an evaluation sample. The glass transition temperature (Tg) of each evaluation sample was measured using a TMA device manufactured by Rigaku Corporation at a heating rate of 5°C / min from 25°C to 250°C. The same test piece was measured twice, and the second value was recorded.

[0162] <Evaluation of low roughness - Measurement of arithmetic mean roughness (Ra)> (1) Preparation of inner layer board Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed on it were etched 1 μm deep with a microetching agent (MEC "CZ8101") to roughen the copper surface.

[0163] (2) Lamination of resin sheet A Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700"), resin sheet A was laminated onto both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0164] (3) Thermal curing of the resin composition layer The inner layer substrate laminated with resin sheet A was then placed in an oven at 130°C and heated for 30 minutes, and then transferred to an oven at 170°C and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. The support was then peeled off to obtain a cured substrate having the insulating layer, inner layer substrate, and insulating layer in this order.

[0165] (4) Roughening treatment The cured substrate was subjected to a desmear treatment as a roughening treatment, which was the following wet desmear treatment.

[0166] (wet desmear treatment) The cured substrate was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P," an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 5 minutes, then in an oxidizing solution (Atotech Japan's "Concentrate Compact CP," an aqueous solution of approximately 6% potassium permanganate and 4% sodium hydroxide) at 80°C for 20 minutes, then in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P," an aqueous sulfuric acid solution) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes.

[0167] (5) Measurement of the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment The arithmetic mean roughness (Ra) of the surface of the insulating layer of the cured substrate after roughening treatment (hereinafter also referred to as "cured substrate B") was determined by the numerical value obtained with a non-contact surface roughness meter (WYKO NT3300 manufactured by Bruker) in VSI mode and a measurement range of 121 μm × 92 μm with a 50-fold lens. Measurement was performed by obtaining the average value of 10 points each.

[0168] <Evaluation of conductor adhesion - Measurement of plating peel strength -> (1) Formation of copper-plated conductor layer According to the semi-additive method, a conductor layer was formed on the roughened surface of the insulating layer of the cured substrate B obtained during the evaluation of the surface roughness. That is, the cured substrate B was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. Next, after annealing treatment by heating at 150°C for 30 minutes, an etching resist was formed, and patterning was performed by etching. Thereafter, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 25 μm, and annealing treatment was performed at 190°C for 60 minutes. The obtained substrate is referred to as "evaluation substrate C".

[0169] (2) Measurement of plating peel strength The measurement of the plating peel strength of the evaluation substrate C was performed in accordance with Japanese Industrial Standard (JIS C6481). Specifically, a cut was made in the conductor layer of the evaluation substrate C in a portion with a width of 10 mm and a length of 100 mm, one end of this was peeled off and grasped with a gripping tool, and the load (kgf / cm) when peeling 35 mm vertically at a speed of 50 mm / min at room temperature was measured to obtain the peel strength (plating peel strength). A tensile testing machine ("AC-50C-SL" manufactured by TSE) was used for the measurement.

[0170] <Evaluation of HAST resistance - Measurement of copper plating peel strength before and after HAST test -> (1) Pretreatment of copper foil The shiny surface of the "3EC-III" (electrolytic copper foil, 35 μm) made by Mitsui Mining & Smelting Co., Ltd. was immersed in a micro-etching agent ("CZ8101" made by Meck Co., Ltd.) to roughen the copper surface (Ra value = 1 μm), and then rust prevention treatment (CL8300) was applied. This copper foil is called CZ copper foil. Furthermore, it was heat-treated in an oven at 130 °C for 30 minutes.

[0171] (2) Lamination of Copper Foil and Formation of Insulating Layer An inner layer substrate laminated with resin sheet A was prepared in the same manner as in Test Example 1. Then, the supports on both sides were peeled off from the substrate, and both resin composition layers were exposed. Onto these resin composition layers, the treated surface of the CZ copper foil of "3EC-III" was laminated under the same conditions as the lamination of resin sheet A in Test Example 1. And then, the resin composition layer was cured under the curing conditions of 190 °C for 90 minutes to form an insulating layer, thereby producing a sample.

[0172] (3) Measurement of Copper Foil Peel Strength (Adhesion to Substrate) The produced sample was cut into small pieces of 150×30 mm. A cut was made in the copper foil part of the small piece with a width of 10 mm and a length of 100 mm using a cutter, and one end of the copper foil was peeled off and grasped with a gripping tool ("AC-50C-SL" made by TSE Co., Ltd.), and the load [kgf / cm (N / cm)] when peeling 35 mm vertically at a speed of 50 mm / min at room temperature was measured in accordance with JIS C6481 using an Instron universal testing machine.

[0173] <Evaluation of HAST Resistance - Measurement of Copper Foil Peel Strength before and after HAST Test-> (1) Production of Sample The shiny surface of an electrolytic copper foil ("3EC-III" made by Mitsui Mining & Smelting Co., Ltd., thickness 35 μm) was immersed in a micro-etching agent ("CZ-8101" made by Meck Co., Ltd.) to roughen the copper surface (Ra value = 1 μm), and then rust prevention treatment was performed using a rust prevention solution ("CL8300" made by Meck Co., Ltd.). The obtained copper foil is called CZ copper foil. Furthermore, it was heat-treated in an oven at 130 °C for 30 minutes.

[0174] A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed thereon was prepared as an inner layer circuit board. Next, resin sheet A was laminated on both sides of the inner layer circuit board using a batch-type vacuum pressure laminator (Meiki Seisakusho "MVLP-500") so that the resin composition layer was bonded to the inner layer circuit board. Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 100°C and a pressure of 0.74 MPa for 30 seconds. After lamination, the support was peeled off. The treated side of the CZ copper foil was laminated on the exposed resin composition layer under the same conditions as above. The resin composition layer was then cured at 190°C for 90 minutes to form an insulating layer, producing a sample with a CZ copper foil / insulating layer / inner layer circuit board / insulating layer / CZ copper foil structure.

[0175] (2) Measurement of copper foil peel strength P0 before high temperature and high humidity environmental test (HAST) The prepared sample was cut into small pieces measuring 150 x 30 mm. A 10 mm wide, 100 mm long cut was made in the copper foil portion of the small piece using a cutter, and one end of the copper foil in the longitudinal direction was peeled off and gripped with a gripper (TSE "AC-50C-SL"). The load when 35 mm was peeled off vertically at room temperature at a rate of 50 mm / min using an Instron universal testing machine was measured in accordance with JIS C6481. The load measured in this way is referred to as the "copper foil peel strength P0."

[0176] (3) Measurement of copper foil peel strength P1 after high temperature and high humidity environmental test (HAST) The prepared samples were cut into 150 x 30 mm pieces. A 10 mm wide, 100 mm long cut was made in the copper foil portion of each piece using a cutter. A 100-hour high-temperature, high-humidity environmental test was performed using a highly accelerated life tester (Kusumoto Chemicals, "PM422") at 130°C and 85% RH for 100 hours. One end of the copper foil was then peeled off and gripped with a gripper (TSE, "AC-50C-SL"), and the load measured at room temperature in accordance with JIS C6481 was measured using an Instron universal testing machine to peel 35 mm vertically at a rate of 50 mm / min. This measured load is referred to as the "copper foil peel strength P1."

[0177] The results of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1.

[0178] [Table 1]

Claims

1. (A) a naphthol aralkyl epoxy resin having a weight average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g / eq. or more; (B) a curing agent; (C) an inorganic filler; A resin composition comprising: The resin composition contains or does not contain any epoxy resin other than component (A), The component (B) contains (B-1) an active ester curing agent and (B-2) a curing agent other than the active ester curing agent, The component (B-2) contains a triazine skeleton-containing phenolic curing agent, The content of the component (A) is 7.5% by mass or more and 75% by mass or less, when the resin component in the resin composition is 100% by mass, the content of epoxy resins other than component (A) is 10% by mass or less, relative to 100% by mass of the nonvolatile components in the resin composition; The content of the (B) component is 3 to 50% by mass, relative to 100% by mass of the nonvolatile components in the resin composition; A resin composition, wherein the content of component (C) is 40% by mass or more, based on 100% by mass of nonvolatile components in the resin composition.

2. The component (A) is represented by the following formula (A1): 【Chemical 1】 [In formula (A1), Ar1 represents an optionally substituted arylene group having 6 to 20 carbon atoms; each Ra represents independently a hydrogen atom, a monovalent group containing an epoxy group, or an alkyl group having 1 to 12 carbon atoms; at least one Ra represents a monovalent group containing an epoxy group and at least one Ra represents an alkyl group having 1 to 12 carbon atoms; Rb and Rc represent independently a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; Rd represents a hydrogen atom, a monovalent group containing an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; each R1 represents independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; n represents an integer from 2 to 50; mb represents an integer from 0 to 6; and mc represents an integer from 0 to 5.] The resin composition according to claim 1, comprising a compound represented by the formula:

3. The component (A) is represented by the following formula (A2): 【Chemistry 2】 [In formula (A2), Ra and n are the same as Ra and n in formula (A1), respectively.] The resin composition according to claim 2, comprising a compound represented by the formula:

4. 4. The resin composition according to claim 2, wherein n is 4 or more and at least two of Ra are alkyl groups having 1 to 6 carbon atoms.

5. The resin composition according to any one of claims 1 to 4, wherein the content of the component (B-2) is less than the content of the component (B-1).

6. The resin composition according to any one of claims 1 to 5, wherein the content of the component (B-1) is 3 to 40 mass% when the total amount of non-volatile components in the resin composition is 100 mass%.

7. The resin composition according to any one of claims 1 to 6, wherein the content of the component (A) is 5 to 50 mass% when the total amount of non-volatile components in the resin composition is 100 mass%.

8. The resin composition according to any one of claims 1 to 7, wherein the glass transition temperature of the cured product is higher than 145°C.

9. The resin composition according to any one of claims 1 to 8, wherein the cured product has a dielectric loss tangent value of less than 0.

005.

10. The resin composition according to any one of claims 1 to 9, which is used for an insulating layer of a printed wiring board.

11. A cured product of the resin composition according to any one of claims 1 to 10.

12. A sheet-like laminate material comprising the resin composition according to any one of claims 1 to 10.

13. A resin sheet comprising: a support; and a resin composition layer formed from the resin composition according to any one of claims 1 to 10 provided on the support.

14. A printed wiring board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 10.

15. A semiconductor device comprising the printed wiring board according to claim 14.

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