Cable with cooling function, current transmission equipment and electric vehicle

Abstract

The present application provides a cable with cooling function, a current transmission device, and an electric vehicle, which belong to the field of current transmission, and the cable with cooling function includes a semiconductor cooling module, a conductor, and a control module, a cooling end of the semiconductor cooling module is provided on at least one side of the conductor to absorb heat dissipation of the conductor, and the semiconductor cooling module is electrically connected to the control module for controlling an electric signal supplied to the semiconductor cooling module. The cable with cooling function according to the present application has the advantages of simple structure, wide size application range, high performance reliability, no noise, and no refrigerant pollution.

Description

[Technical Field]

[0001] This application claims priority to a Chinese patent application filed on July 20, 2021, bearing application number 202110821578.3, entitled "Cable with Cooling Function, Current Transmission Device, and Electric Vehicle," the entire contents of which are incorporated herein in their entirety. This application further claims priority to a Chinese patent application filed on July 20, 2021, bearing application number 202121653535.0, entitled "Cable with Cooling Function, Current Transmission Device, and Electric Vehicle," the entire contents of which are incorporated herein in their entirety.

[0002] The present application relates to the field of electric current transmission, and in particular to cables with cooled functions, electric current transmission devices and electric vehicles. [Background technology]

[0003] Due to the global energy crisis and the increasingly serious impact of global warming, the new energy vehicle industry, like the electric vehicle industry, is developing vigorously. However, the long charging time of current electric vehicles is a bottleneck that limits the widespread use of electric vehicles. Currently, the current required for fast charging electric vehicles reaches 150A to 400A, and the high current causes high heat generation in the charging cable, which is also a major factor limiting the charging current of electric vehicles.

[0004] To solve this problem, first, it is urgently necessary to increase the cross-sectional area of ​​the cable to reduce heat generation in the cable, but this would significantly increase the cost of the cable, and second, it is necessary to use cooling technology to cool the cable.

[0005] Currently, liquid cooling and air cooling technologies are widely used to cool high-current charging cables. Liquid cooling technology has good cooling effects, but requires the addition of separate cooling lines, water pumps, and heat dissipation devices, resulting in a complex system structure, extremely high safety and stability requirements, and increased costs. Air cooling technology has issues such as limited installation size and space, low cooling efficiency, and excessive noise that can affect the overall vehicle NVH (noise, vibration, and harshness).

[0006] Therefore, in the field of electric current transmission, there is an urgent need for a cable with a cooling function that can quickly cool the cable, improve the charging current, and reduce the cross-sectional area of ​​the cable. Summary of the Invention [Problem to be solved by the invention]

[0007] The present application aims to solve the problems of complicated structure and high cost that exist in cooling conductors using liquid cooling technology in the prior art, and the problems of low cooling efficiency and high noise that exist in cooling conductors using air cooling technology. [Means for solving the problem]

[0008] In order to solve the above technical problems, a first aspect of the present application includes a semiconductor cooling module 101, a conductor 102, and a control module 103, wherein a cooling end of the semiconductor cooling module 101 is provided on at least one side of the conductor 102 and absorbs heat dissipation from the conductor 102, and the semiconductor cooling module 101 provides a cable with cooling function electrically connected to the control module 103 for controlling an electrical signal supplied to the semiconductor cooling module 101.

[0009] A second aspect of the present application provides a current transmission device that includes a cable 100 with cooling function described in any of the above-mentioned embodiments, a charging module 200, and a battery module 300, and that is connected to the charging module 200 and the battery module 300 at both ends of the cable 100 with cooling function, respectively, so as to conduct the electrical energy acquired by the charging module 200 to the battery module 300.

[0010] In a further embodiment of the present application, the control module 103 is connected to a charging module 200 for supplying electrical energy to said control module 103 .

[0011] A third aspect of the present application provides an electric vehicle including the current transmission device according to any of the previous embodiments. [Effects of the Invention]

[0012] The cooling cable, current transmission equipment, and electric vehicle according to the present application have a cooling layer structure consisting of a semiconductor cooling module attached to the side of a conductor, and the semiconductor cooling module is powered by a control module. When a high-voltage, large current flows through the conductor, the heat generated is absorbed by the semiconductor cooling module, thereby achieving the goal of reducing the temperature rise of the conductor. For a given conductor size, a larger current can be carried to meet temperature rise requirements. The cooling cable according to the present application has the advantage of a simple structure, since the semiconductor cooling module and control module alone can achieve conductor cooling. The cooling cable according to the present application has the advantage of a wide range of applicable sizes, since only the semiconductor cooling module is attached to the side of the conductor. The cooling cable according to the present application has the advantage of high performance reliability, no noise, and no refrigerant contamination, since the control module controls the supply of electrical signals to the semiconductor cooling module so that the semiconductor cooling module cools the conductor.

[0013] To make the above and other objects, features and advantages of the present invention clearer and more comprehensible, preferred embodiments will be described in detail below with reference to the accompanying drawings. [Brief explanation of the drawings]

[0014] In the following, in order to more clearly explain the technical solutions in the embodiments of the present application or the prior art, drawings necessary for describing the embodiments or the prior art will be briefly introduced. It should be apparent that the drawings in the following description are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without any creative efforts.

[0015] [Figure 1] FIG. 1 shows a structural diagram of a cable with a cooling function according to an embodiment of the present invention. [Figure 2A] FIG. 2A shows a cross-sectional view of a cable with a cooling function according to an embodiment of the present application. [Figure 2B] FIG. 2B shows a cross-sectional view of a cable with a cooling function according to an embodiment of the present application. [Figure 3] FIG. 3 shows another cross-sectional view of the cable with cooling function according to the embodiment of the present application. [Figure 4] FIG. 4 shows a first circuit diagram of a cable with a cooling function according to an embodiment of the present application. [Figure 5] FIG. 5 shows a second circuit diagram of a cable with a cooling function according to an embodiment of the present application. [Figure 6] FIG. 6 shows a partially enlarged view of a cable with a cooling function according to an embodiment of the present invention. [Figure 7] FIG. 7 is a first flowchart illustrating a process of adjusting a control module to an electrical signal of a semiconductor cooling module according to an embodiment of the present application. [Figure 8] FIG. 8 is a second flowchart illustrating a process of adjusting a control module to an electrical signal of a semiconductor cooling module according to an embodiment of the present application. [Figure 9]FIG. 9 is a third flowchart illustrating a process of adjusting a control module to an electrical signal of a semiconductor cooling module according to an embodiment of the present application. [Figure 10] FIG. 10 is a cross-sectional view of a current transmission device according to an embodiment of the present invention. [Figure 11] FIG. 11 shows a structural diagram of a semiconductor cooling module according to an embodiment of the present invention. [Figure 12] FIG. 12 shows a structural diagram of a computer device according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application, and it is clear that the described embodiments are only some of the embodiments of the present application, and do not represent all of the embodiments. Based on the embodiments of the present application, all other embodiments that can be obtained by those skilled in the art without any creative efforts fall within the scope of protection of the present application. Although this specification provides the operational steps of the method described in the examples or flowcharts, more or fewer operational steps may be included based on ordinary or non-creative efforts. The order of the steps listed in the examples is merely one form of the order in which many steps may be performed, and does not represent the only order in which they may be performed. When an actual system or device product is implemented, it may be performed according to the order of the method shown in the examples or drawings, or may be performed in parallel.

[0017] The outline examples and their descriptions in the present application are for illustrating the present application but are not intended to limit the present application. Furthermore, elements / components with the same or similar reference numerals used in the drawings and embodiments are intended to represent the same or similar parts.

[0018] In the prior art, cooling of high-current conductors has mainly been achieved using liquid cooling and air cooling technologies. However, liquid cooling technologies require the addition of separate cooling lines, water pumps, heat dissipation devices, etc., resulting in problems such as a complex system structure, extremely high safety and stability requirements, and increased costs. Air cooling technologies have problems such as limited installation size and space, low cooling efficiency, and excessive noise generation that affects the NVH of the entire vehicle.

[0019] In order to solve the above technical problems, in one embodiment of the present application, a new type of cooling cable is provided, which has the advantages of simple structure, wide size applicability, high performance reliability, no noise, and no refrigerant contamination.

[0020] Specifically, as shown in Figures 1 and 5, the cable with cooling function includes a semiconductor cooling module 101, a conductor 102, and a control module 103, and the cooling end of the semiconductor cooling module 101 is provided on at least one side of the conductor 102 to absorb heat dissipation from the conductor 102. The semiconductor cooling module 101 is electrically connected to the control module 103 for controlling the electrical signals supplied to the semiconductor cooling module 101 .

[0021] Specifically, in principle, the semiconductor cooling module 101 is a heat transfer device. When a current flows through a thermocouple connecting one N-type semiconductor material and one P-type semiconductor material, heat transfer occurs between the two ends. The heat transfer from one end to the other creates a temperature difference, forming a hot end and a cold end. The semiconductor cooling module 101 described herein includes a cooling end and a hot end opposite the cooling end. The semiconductor cooling module 101 may be a conventional semiconductor cooling module or may be customized according to the size of the conductor. The semiconductor cooling module 101 may completely cover the conductor 102 or may cover only a portion of the conductor 102.

[0022] Since the amount of heat dissipation or absorption of the semiconductor cooling module 101 is determined by the amount of current, the semiconductor cooling module 101 described in the present application can control the electrical signals (including current signals and voltage signals) supplied to the semiconductor cooling module 101 using the control module 103, thereby achieving the effect of controlling the temperature rise of the conductor 102 and allowing the cable with cooling function to operate at a stable temperature.

[0023] The control module 103 supplies power to the semiconductor cooling module 101 (e.g., low-voltage 12V DC power), and the control module 103 controls the conduction of the connecting line between the control module 103 and the semiconductor cooling module 101, thereby realizing access control of the semiconductor cooling module 101. In specific implementation, the operator may set the control logic of the semiconductor cooling module 101 according to actual needs, for example, to access different semiconductor cooling modules 101 in different time intervals, or to access different semiconductor cooling modules 101 according to different electrical signals of the conductor 102. This application does not limit the control logic of the control module 103 for the electrical signals supplied to the semiconductor cooling module, and any logic that can realize control of the electrical signals falls within the protection scope of this application. The power supply and control method of the present invention simplifies the structure of the cable with cooling function, improves cooling efficiency, and avoids energy waste.

[0024] The control module 103 may be a central processing unit (CPU) or other programmable general-purpose or special-purpose microprocessor, digital signal processor (DSP), programmable control module, application specific integrated circuit (ASIC), or other similar element or combination of the above elements, and this application does not specifically limit the type, model number, etc. of the control module 103.

[0025] In some embodiments, to ensure that the semiconductor cooling module 101 is in full contact with the conductor 102, multiple semiconductor cooling modules 101 may be provided, and the sizes of the multiple semiconductor cooling modules 101 may be the same or different, specifically adjusted according to the size of the conductor.

[0026] In some embodiments, the external size of the semiconductor cooling module 101 can be a maximum size of 60 mm x 60 mm or more, a thickness of 4.1 mm or less, a maximum cooling power of 270 W, and a maximum temperature difference of 60°C or more in a single layer.

[0027] Furthermore, in order to enable accurate control of the temperature of each semiconductor cooling module 101, multiple semiconductor cooling modules 101 are connected in parallel and electrically connected to a control module 103, thereby allowing the power supply signal to each semiconductor cooling module 101 to be controlled independently.

[0028] Furthermore, if the model numbers and power of multiple semiconductor cooling modules 101 are completely identical, the multiple semiconductor cooling modules 101 are connected in series and electrically connected to the control module 103 so that the power supply signals to each semiconductor cooling module 101 are identical.

[0029] The multiple semiconductor cooling modules 101 may be arranged on the side of the conductor 102 at a fixed distance (for example, 10 cm as shown in Figure 1, and the specific distance may be determined depending on the temperature rise situation of the semiconductor cooling modules 101), or may be arranged adjacent to the side of the conductor 102 (i.e., without any gaps), and the specific arrangement method may be determined depending on the temperature rise situation when the conductor 102 is operating.

[0030] To ensure the cooling effect, the ratio of the total area of ​​the cooling ends of semiconductor cooling module 101 to the area of ​​conductor 102 is in the range of 3% to 95%.

[0031] In order to verify the effect on the temperature rise of the conductor 102 of the range of the ratio of the total area of ​​the cooling end of the semiconductor cooling module 101 to the area of ​​the conductor 102, the inventor selected 13 cables with the same cross-sectional area, material, and length, passed the same current, and used the area ratio of the cooling end of the different semiconductor cooling modules 101 covering the conductor 102 to read the temperature rise value of each cable and recorded it in Table 1.

[0032] The experimental method was to conduct the same current through cables covering different semiconductor cooling modules 101 in a sealed environment, each covering a ratio of the total area of ​​the cooling end to the area of ​​the conductor 102. The temperatures before and after the current was applied were recorded, and the absolute value was calculated by subtracting the difference. In this example, a temperature rise of less than 50 K was considered a pass.

[0033] Table 1 shows the effect of the ratio of the total area of ​​the cooling end of different semiconductor cooling modules 101 to the area of ​​the conductor 102 on the temperature rise of the cable.

[0034] [Table 1]

[0035] As can be seen from Table 1 above, when the ratio of the total area of ​​the cooling ends of the semiconductor cooling module 101 to the area of ​​the conductor 102 is less than 3%, the temperature rise value of the cable is greater than the acceptable value. The larger the ratio of the covered area, the smaller the temperature rise value. However, during use of the cable, the joints at both ends and the intermediate bend area will inevitably not be covered by the semiconductor cooling module 101. Therefore, the inventors set the ratio of the total area of ​​the cooling ends of the semiconductor cooling module 101 to the area of ​​the conductor 102 to be 3% to 95%.

[0036] 2A, semiconductor cooling module 101 is fixed to conductor 102 with a thermally conductive adhesive, but in a specific implementation, semiconductor cooling module 101 may be fixed to conductor 102 using other methods, such as screws, and this application is not limited thereto. For work conditions requiring a high level of vibration, semiconductor cooling module 101 can be fixed by adding a separate fixing frame to improve vibration damping capability.

[0037] To improve heat dissipation efficiency, semiconductor cooling modules 101 are provided on both sides of the conductor 102. In a further embodiment, if the demand for cooling is high depending on the use of the conductor, multiple semiconductor cooling modules 101 can be stacked to achieve multi-stage cooling and further improve the cooling capacity. As shown in Figure 3, two layers of semiconductor cooling modules 101 can be provided on both sides of the conductor 102.

[0038] When a high voltage current flows through the cooling cable 100 of this embodiment, the heat generated is absorbed by the semiconductor cooling module 101 that surrounds the conductor 102, thereby achieving the purpose of reducing the temperature rise of the conductor. When the size of the conductor 102 is constant, it can carry a larger current and meet the temperature rise requirements.

[0039] 4, the cooled cable further includes a rectifier module 104 electrically connected between the control module 103 and the conductor 102, for rectifying the electrical energy harvested from the conductor 102 and converting the current in the conductor 102 into a power supply current for the control module 103. Because the current and voltage carried by the conductor 102 do not necessarily meet the power supply requirements of the control module 103 and the semiconductor cooling module 101, the current drawn from the conductor 102 must be further converted by the rectifier module into a current and voltage usable by the control module 103 and the semiconductor cooling module 101, in order to harvest electrical energy from the conductor 102.

[0040] In this embodiment, the installation of a power supply is omitted and power can be supplied to the control module via conductor 102, simplifying the circuit and reducing the number of lines supplying power to control module 103 and semiconductor cooling module 101, and also avoiding the occurrence of a situation in which semiconductor cooling module 101 cannot operate due to a lack of power supply from an external power source.

[0041] In a further embodiment of the present application, the cable with cooling function further includes at least one temperature detector provided on the conductor for detecting a temperature value of the conductor, and the control module is electrically connected to the temperature detector and adjusts the electrical signal supplied to the semiconductor cooling module 101 based on the temperature value detected by the temperature detector.

[0042] In a further embodiment of the present application, as shown in Figures 1, 5 and 6, the cooled cable further includes a plurality of temperature sensors 105 distributed on the conductor 102 to detect the temperature value of the conductor 102. In a specific implementation, the more temperature sensors 105 are arranged and the more uniformly they are distributed, the more the detected temperature will suit the actual situation. The control module 103 is electrically connected to the temperature detector 105 and adjusts the electrical signal provided to the semiconductor cooling module 101 based on the temperature value detected by the temperature detector 105 .

[0043] In some embodiments, the process by which the control module 103 adjusts the electrical signal supplied to the semiconductor cooling module 101 based on the temperature value detected by the temperature detector 105 includes the steps of calculating a difference value between the temperature value detected by the temperature detector 105 and a preset temperature rise value of the conductor 102, inputting the difference value into a PID control logic to obtain an electrical control signal for the semiconductor cooling module 101, and adjusting the electrical signal supplied to the semiconductor cooling module 101 based on the electrical control signal for the semiconductor cooling module 101, wherein the control parameters in the PID control logic are pre-adjusted based on the PID control index.

[0044] In specific implementation, the preset temperature rise value may be determined based on the application scenario of the conductor and the maximum temperature rise value that the conductor can withstand, and the present application does not limit the specific value thereof.

[0045] After the temperature control function is added to the cooling cable of this embodiment, the temperature can be detected in real time to control the heat absorption amount, realizing closed-loop control, and different temperature rise control can be performed on the conductor based on the current carrying capacity of the conductor under different conditions.

[0046] In one specific embodiment, as shown in FIG. 7 , when there are multiple temperature detectors 105, the control module 103 adjusting the electrical signal supplied to the semiconductor cooling module 101 based on the temperature value detected by the temperature detector 105 includes the following steps: Step 701: Based on the temperature values ​​detected by the temperature detector 105, the temperature distribution of the conductor 102 is calculated. In specific implementation, the temperature distribution of the conductor 102 may be established using B-spline interpolation, and in specific implementation, the temperature distribution of the conductor 102 may also be established using other modeling methods, and this application does not specifically limit the process of establishing the temperature distribution.

[0047] Step 702: Based on the temperature distribution of the conductor 102, a power supply signal to each semiconductor cooling module 101 in the conductor 102 is determined. In this step, the higher the temperature of a portion of the conductor 102, the stronger the power supply signal to the semiconductor cooling module 101 corresponding to that position. In specific implementation, the control module 103 can determine the power supply signal to each semiconductor cooling module 101 on the conductor 102 based on a preset temperature regulation logic (shown in Table 2).

[0048] Table 2 shows the correspondence between the temperature range of the conductor detected by the temperature detector and the power supply current of the control module.

[0049] [Table 2]

[0050] Step 703: Power is supplied to each semiconductor cooling module 101 in response to the power supply signal to each semiconductor cooling module 101.

[0051] In one embodiment of the present application, determining the power supply current of each of the semiconductor cooling modules 101 in the conductor 102 based on the temperature distribution of the conductor 102 in step 702 includes the following steps: Step 7021: Calculate a difference value distribution based on the temperature distribution of the conductor 102 and a preset temperature rise value of the conductor 102. Step 7022: Adjust the electrical signal supplied to the semiconductor cooling module 101 based on the difference value distribution. In a specific implementation, step 7022 includes inputting the difference value distribution into a PID control logic to obtain a control signal for the electrical signal of the semiconductor cooling module 101; and adjusting the electrical signal supplied to the semiconductor cooling module 101 based on the electrical control signal of the semiconductor cooling module 101, where the control parameters in the PID control logic are pre-adjusted based on the PID control index.

[0052] In a further embodiment of the present application, in order to adjust the electrical signal of the semiconductor cooling module 101 more accurately, the control module 103 is further electrically connected to the charging module 200 connected to the conductor 102, and obtains the charging / discharging current value and the charging time length, and adjusts the electrical signal supplied to the semiconductor cooling module 101 based on the charging / discharging current value, the charging time length, and the temperature value detected by the temperature detector.

[0053] Specifically, as shown in FIG. 8, the control module 103 adjusts the electrical signal supplied to the semiconductor cooling module based on the charge / discharge current value, the charging time length, and the temperature value detected by the temperature detector, including the following steps: Step 801: The amount of heat generated by the conductor is calculated based on the charge / discharge current value and the charging time length. In this step, Q=I 2 The heat generation amount of the conductor can be calculated by multiplying the heat generation amount by 1 / R by t, where Q is the heat generation amount of the conductor, I is the charge / discharge current value, t is the charging time length, and R is the resistance of the conductor.

[0054] Step 802: Based on the heat generation amount of the conductor and the material information of the conductor, the theoretical temperature rise value of the conductor is calculated. The calorific value of the conductor is the calorific value during charging and discharging. In this step, the theoretical temperature rise value of the conductor can be calculated by the following formula, which is obtained by fitting test data from a conductor temperature rise experiment.

number

[0055] where T w is the theoretical temperature rise value, Q is the heat generation amount of the conductor, t is the charging time length, A is the effective heat dissipation area, K T is the total heat dissipation coefficient of the conductor surface, A and K T is the material information of the conductor. The calculation of the theoretical temperature rise value of the conductor based on the heat generation amount of the conductor and the material information of the conductor can refer to the prior art, and is not further limited here.

[0056] Step 803: Calculate the actual temperature rise of the conductor based on the temperature value detected by the temperature detector and the theoretical temperature rise of the conductor. The execution process of this step first includes a step of determining a temperature rise correction coefficient based on the temperature value detected by the temperature detector. Specifically, if the temperature detected by the temperature detector is higher than the standard temperature value for calculating the temperature rise, the temperature correction coefficient is greater than 1, and the higher the temperature detected by the temperature detector, the larger the coefficient. If the temperature detected by the temperature detector is lower than the standard temperature value for calculating the temperature rise, the temperature correction coefficient is less than 1, and the lower the temperature detected by the temperature detector, the smaller the coefficient. The actual temperature rise value of the conductor is calculated using the following formula:

number

[0057] where T w is the theoretical temperature rise, K w is the temperature correction coefficient, and T is the actual temperature rise value.

[0058] Step 804: Adjust the electrical signal provided to the semiconductor cooling module based on the actual temperature rise of the conductor. In this embodiment, the electrical signal of the semiconductor cooling module 101 is adjusted based on the charge / discharge information, the temperature value from the temperature detector, and the actual temperature rise value predicted in advance, thereby enabling the temperature of the conductor to reach the operating temperature as quickly as possible, thereby improving the efficiency and accuracy of temperature control.

[0059] In a further embodiment of the present application, as shown in FIG. 9 , in order to enable the current regulation of the semiconductor cooling module 101 to have an automatic adjustment capability, adjusting the electrical signal supplied to the semiconductor cooling module 101 based on the actual temperature rise value of the conductor 102 as the above step 804 includes the following steps: Step 901: Calculate the difference between the actual temperature rise value of the conductor 102 and the preset temperature rise value of the conductor 102. Step 902: The difference value is input into the PID control logic to obtain the electrical control signal for the semiconductor cooling module 101. When this step is performed, an electrical control signal for the semiconductor cooling module 101 is generated only if there is a variation between the actual temperature rise value of the conductor 102 and the preset temperature rise value. If the actual temperature rise value of the conductor 102 is equal to the preset temperature rise value, the safety of the conductor 102 can be ensured by limiting the temperature of the conductor 102 to within the preset temperature rise value, and in this case, an electrical control signal for the semiconductor cooling module 101 is not generated. Here, the control parameters in the PID control logic are pre-adjusted based on the PID control indices. The PID control logic includes three parts: proportional control, integral control, and differential control. The PID control indices include rise time, overshoot amount, adjustment time, and steady-state error. The adjustment of the control parameters in the PID control logic can be referred to in the prior art, and will not be described in further detail here.

[0060] Step 903: Adjust the electrical signal supplied to the semiconductor cooling module 101 based on the electrical control signal of the semiconductor cooling module 101. In a further embodiment of the present application, in order to improve the accuracy of the temperature control of the conductor and make the calculated value more suitable for actual conditions, the control module 103 is further electrically connected to the environmental parameter detection module and the charging module 200 connected to the conductor, obtains environmental parameter information from the environmental parameter detection module, obtains charging / discharging current values ​​and charging time lengths from the charging module, and adjusts the electrical signal supplied to the semiconductor cooling module according to the environmental parameter information, the charging / discharging current values ​​and charging time lengths. In particular, the environmental parameter information includes, but is not limited to, environmental humidity, environmental temperature, environmental pressure, and the like.

[0061] Adjusting the electrical signal supplied to the semiconductor cooling module based on environmental parameter information, the charging / discharging current value and the charging time length includes the following steps. (1) Calculate the heat generation amount of the conductor based on the charge / discharge current value and the charging time length. (2) A theoretical temperature rise value of the conductor 102 is calculated based on the heat generation amount of the conductor and information on the material of the conductor. (3) Calculate the actual temperature rise value of the conductor 102 based on the environmental parameter information and the theoretical temperature rise value of the conductor 102. In this step, the execution process of this step first includes a step of determining a temperature rise correction coefficient based on environmental parameter information. Specifically, one correction coefficient is calculated for each environmental parameter information (the calculation process of each correction coefficient refers to the temperature correction coefficient described in the above-mentioned embodiment, and will not be described in further detail here), and all the correction coefficients corresponding to the environmental parameter information are weighted and added (shown in the following formula 1) or multiplied (shown in the following formula 2) to obtain a final correction coefficient, and the final correction coefficient is multiplied by the theoretical temperature rise value of the conductor 102 to calculate the actual temperature rise value of the conductor 102. K=a1×K w1 +···+a n ×K wn (Formula 1) K=a1×K w1 ××K wn (Formula 2) where K is the final correction coefficient, is the coefficient, and a1 a n is a known quantity determined according to the importance of the environmental parameter, a is a known quantity, i represents the ith environmental parameter, and K w1 ···K wn is the environmental parameter value. (4) adjusting the electrical signal supplied to the semiconductor cooling module 101 based on the actual temperature rise value of the conductor 102;

[0062] In a further embodiment of the present application, as shown in FIGS. 1, 6 and 10, the conductors connected to the control module 103 in the semiconductor cooling module 101 are provided in a low voltage harness 106. In this embodiment, the conductors connected to the control module 103 in the semiconductor cooling module 101 are provided in the low-voltage harness 106, thereby ensuring a clear line path, facilitating adjustment and replacement of the semiconductor cooling module, and also realizing safe isolation of the high and low voltage power supply systems.

[0063] In a further embodiment of the present application, as shown in FIG. 11, a semiconductor cooling module 101 includes an alumina substrate 1011, a waterproof protective layer 1012, a semiconductor P / N layer 1013, and a power interface 1014. An alumina substrate 1011, a waterproof protective layer 1012, and a semiconductor P / N layer 1013 are provided in this order. A power supply interface 1014 is electrically connected to the semiconductor P / N layer 1013. Alumina substrate 1011 constitutes the hot end, ie, the heat dissipation end, of semiconductor cooling module 101. Semiconductor P / N layer 1013 constitutes the cold end, ie, the heat absorption end, of semiconductor cooling module 101.

[0064] In this embodiment, the alumina substrate 1011 is used as the surface of the semiconductor cooling module, which improves thermal conductivity, speeds up heat conduction, shortens cooling time, has high strength, allows for flexible connection, and adheres well to the conductor, effectively absorbing surface stress at the bent portion of the conductor, making it less likely to be crushed during installation and use. A PN junction made of a special semiconductor material is used at the core of the semiconductor cooling module. When an electric current flows through a thermocouple connected to one N-type semiconductor material and one P-type semiconductor material, heat transfer occurs between the two ends. The heat transfer from one end to the other creates a temperature difference, forming a hot and cold end, i.e., cooling control can be achieved by controlling the DC current. The cooling rate of the semiconductor cooling module 101 is 0.05K / s to 5K / s.

[0065] In order to verify the effect of the cooling rate of the semiconductor cooling module 101 on the temperature rise of the conductor 102, the inventor selected 10 cables with the same cross-sectional area, material, and length, passed the same current, and cooled the cables using semiconductor cooling modules 101 with different cooling rates, read the temperature rise values ​​of each cable, and recorded them in Table 3.

[0066] The experiment was conducted in a sealed environment, with the same current passing through cables equipped with semiconductor cooling modules 101 of different cooling rates, and the temperatures before and after the current was passed were recorded, and the absolute value was calculated by subtracting the difference. In this example, a temperature rise of less than 50 K was considered acceptable.

[0067] Table 3 shows the effect of different cooling rates on the temperature rise of the cable of the semiconductor cooling module 101.

[0068] [Table 3]

[0069] As can be seen from Table 3 above, when the cooling rate of semiconductor cooling module 101 is less than 0.05 K / s, the temperature rise of the cable is greater than the acceptable value, and the higher the cooling rate of semiconductor cooling module 101, the smaller the temperature rise. However, when the cooling rate of semiconductor cooling module 101 is greater than 5 K / s, the heat generation amount of the cable itself and the power of semiconductor cooling module 101 affect the temperature rise, and although the reduction in temperature rise is not significant, the power of semiconductor cooling module 101 increases, which is not economical. Therefore, the inventors set the cooling rate of semiconductor cooling module 101 to 0.05 K / s to 5 K / s.

[0070] In a further embodiment of the present application, to ensure the safety of the conductor, an insulating protective layer 107 is provided around the conductor 102, and as shown in Figures 2A and 2B, the insulating protective layer 107 is provided between the conductor 102 and the semiconductor cooling module 101 or on the outer surface of the semiconductor cooling module 101.

[0071] In a further embodiment of the present application, the material of the insulating protective layer 107 is one or a combination of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene. Furthermore, in order to prevent the conductor from being burned down in a fire, a fire-resistant layer is further provided outside the insulating protective layer.

[0072] In a further embodiment of the present application, the cross section of the conductor 102 has a circular, elliptical, rectangular, polygonal, E-shaped, F-shaped, H-shaped, K-shaped, L-shaped, T-shaped, U-shaped, V-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, arched, or wavy structure, where the arched shape includes a semi-arched shape, an acute-angled arched shape, an obtuse-angled arched shape, etc. The cross-sectional shape of the conductor 102 can be designed in various shapes, allowing designers to select different cross sections of the conductor 102 according to the actual deployment environment, thereby reducing the volume of the cable, optimizing the assembly environment of the cable, and improving the safety of the cable.

[0073] In further embodiments of the present application, the material of the conductor 102 described herein may be one or a combination of metals, conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials. In a specific implementation, the conductor 102 described herein is made of copper, copper alloy, aluminum, or aluminum alloy. Electric vehicle cables require large-diameter conductors due to their high voltage and current requirements. Copper conductors, with their excellent conductivity and ductility, are preferred as cable conductors. However, as the price of copper continues to rise, the cost of using copper as a conductor becomes increasingly high. Therefore, people are beginning to seek alternatives to metallic copper to reduce costs. The content of metallic aluminum in the earth's crust is approximately 7.73%. After optimizing refining technology, aluminum is relatively cheap, lighter in weight than copper, and second only to copper in conductivity. Therefore, aluminum can partially replace copper in the electrical connection field. Therefore, substituting aluminum for copper is a development trend in the automotive electrical connection field.

[0074] In a further embodiment of the present application, in order to further improve the heat dissipation effect, the cable with cooling function further includes a heat dissipation device arranged on the outside of the semiconductor cooling module 101, and in specific implementation, the heat dissipation device may be close to the outer surface of the semiconductor cooling module 101 or may be in close contact with the outer surface of the semiconductor cooling module 101, and the specific details will be determined according to the type of heat dissipation device.

[0075] The heat dissipation devices described herein include, but are not limited to, fans, heat exchangers, liquid cooling devices, and heat dissipation fins, and the heat dissipation fins are preferably made of metal. Here, large devices such as fans, heat exchangers, and liquid cooling devices are located close to the semiconductor cooling module 101, and the heat dissipation fins are located in close contact with the semiconductor cooling module 101. In a further embodiment of the present invention, as shown in FIG. 5, there is further provided a current transmission device including the cable with cooling function 100 described in any of the previous embodiments, a charging module 200, and a battery module 300.

[0076] Both ends of the cable with cooling function 100 are connected to the charging module 200 and the battery module 300, respectively, so as to conduct the electrical energy acquired by the charging module 200 to the battery module 300.

[0077] In some embodiments, the charging module 200 described herein is a fast charging dock and the battery module 300 is a BMS (Battery management system) battery management module.

[0078] In a further embodiment of the present application, the control module 103 is also connected to a charging module 200, which supplies electrical energy to said control module 103.

[0079] In a further embodiment of the present application, there is further provided an electric vehicle including the current transmission device according to any of the previous embodiments.

[0080] In a further embodiment of the present application, the methods performed by the control module may be executed in a computing device, such as a central control device, which may include one or more processors 1304, such as one or more central processing units (CPUs), as shown in FIG. 12, and each processing unit may implement one or more hardware threads. The computing device 1302 may further include an optional memory 1306 for storing any type of information, such as code, settings, data, etc. Without limitation, for example, the memory 1306 may include any one or more combinations of any type of RAM, any type of ROM, flash memory device, hard disk, optical disk, etc. More generally, any memory may store information using any technology. Furthermore, any memory may retain information in a volatile or non-volatile manner. Furthermore, any memory may represent a fixed or removable component of the computing device 1302. In one case, when the processor 1304 executes associated instructions stored in any memory or combination of memories, the computing device 1302 may perform any operation of the associated instructions. The computing device 1302 further includes one or more drives 1308 for interworking with any memory, such as a hard disk drive, optical disk drive, or the like.

[0081] The computing device 1302 may further include an input / output module 1310 (I / O) for accepting various inputs (via input devices 1312) and providing various outputs (via output devices 1314). One particular output mechanism may include a presentation device 1316 and an associated graphical user interface 1318 (GUI). In other embodiments, the computing device 1302 may not include the input / output module 1310 (I / O), the input devices 1312, and the output devices 1314, but may simply be a single computing device in a network. The computing device 1302 may further include one or more network interfaces 1320 for exchanging data with other devices via one or more communication links 1322. One or more communication buses 1324 couple the above-mentioned components.

[0082] The communications link 1322 may be implemented in any manner, for example, by a local area network, a wide area network (e.g., the Internet), a point-to-point connection, etc., or any combination thereof. The communications link 1322 may include any combination of hardwired links, wireless links, routers, gateway functions, name servers, etc., conforming to any protocol or combination of protocols.

[0083] Corresponding to the methods of Figures 7 to 9, an embodiment of the present application further provides a computer-readable storage medium having a computer program stored therein, the computer program causing the steps of the above method to be performed when executed by a processor.

[0084] An embodiment of the present application further provides computer-readable instructions, wherein when a processor executes the instructions, the program causes the processor to perform the method as illustrated in FIGS.

[0085] It should be understood that in various embodiments of the present application, the magnitude of the numbers of the above processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not be any limitation on the implementation process of the embodiments of the present application.

[0086] It should be further understood that in the embodiments of the present application, the term "and / or" is merely used to describe the relationship between related objects, and represents three possible relationships. For example, in the case of A and / or B, three cases can be represented: "A exists alone," "A and B exist simultaneously," and "B exists alone." In addition, the character " / " in the present application generally represents an "or" relationship between the related objects before and after it.

[0087] As will be appreciated by those skilled in the art, each exemplary unit and algorithm step described in conjunction with the embodiments disclosed herein can be realized in electronic hardware, computer software, or a combination of both. To clearly explain the compatibility of hardware and software, the above description has generally described each exemplary configuration and step by function. Whether these functions are implemented in the form of hardware or software depends on the specific application and design constraints of the technical means. Those skilled in the art may implement the described functions using different methods for each specific application, but such implementation should not be considered as departing from the scope of the present application.

[0088] As can be clearly understood by those skilled in the art, for convenience and brevity of explanation, the specific operating processes of the systems, devices and units described above can be referred to the corresponding processes in the aforementioned method embodiments, and will not be further described here. In some embodiments of the present application, it should be understood that the disclosed system, device, and method may be realized in other ways. For example, the device embodiments described above are merely schematic, and the division of the units is merely a division of logical functions. In actual implementation, other division methods may be used. For example, multiple units or components may be combined or integrated into other systems, or some features may be omitted or not implemented. Furthermore, the couplings or direct couplings or communication connections between the devices shown or discussed may be indirect couplings or communication connections via some interfaces, devices, or units, and may be electrical, mechanical, or other forms of connection.

[0089] The units described as separate components may or may not be physically separated, and the components described as units may or may not be physical units, i.e., they may be located in one place or distributed among multiple network units, some or all of which may be selected according to actual needs to achieve the objectives of the technical solutions of the embodiments of the present application.

[0090] Furthermore, each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist physically independently, or two or more units may be integrated into one unit. The above-mentioned integrated units may be realized in the form of hardware or in the form of a software functional unit.

[0091] The above-mentioned integrated units may be realized in the form of software functional units and stored in a computer-readable storage medium when sold or used as an independent product. Based on this understanding, the essential or conventional part of the technical solution of the present application, or all or part of the technical solution, may be embodied in the form of a software product, and the computer software product is stored in a storage medium and includes some instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application. The storage medium includes various media capable of storing program code, such as a USB disk, a removable hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0092] Although the present application has used specific examples to explain the principles and embodiments of the present application, the explanation of the above examples is merely intended to facilitate understanding of the method and concept of the present application, and those skilled in the art will likely find modifications in the specific embodiments and scope of application based on the concept of the present application. Therefore, the contents of this specification should not be construed as limiting the present application. [Explanation of symbols]

[0093] 100 Cooled Cable 101 Semiconductor cooling module 102 Conductor 103 Control Module 104 Rectification Module 105 Temperature detector 106 Low voltage harness 107 Insulating protective layer 200 Charging Module 300 Battery Module 1011 alumina substrate 1012 waterproof protective layer 1013 Semiconductor P / N layer 1014 Power Interface 1302 Computer equipment 1304 processor 1306 memory 1308 Drive mechanism 1310 Input / Output Module 1312 Input Devices 1314 Output Devices 1316 Presentation equipment 1318 Graphical User Interface 1320 Network Interface 1322 Communication Links 1324 communication bus

Claims

1. a semiconductor cooling module (101), a conductor (102), a control module (103), and at least one temperature detector (105); The cooling end of the semiconductor cooling module (101) is provided on at least one side of the conductor (102) and absorbs heat dissipation from the conductor (102); The semiconductor cooling module (101) is electrically connected to the control module (103) for controlling an electrical signal supplied to the semiconductor cooling module (101); the at least one temperature detector (105) is provided on the conductor (102) and detects a temperature value of the conductor (102); The control module (103) is electrically connected to the temperature detector (105) and adjusts the electrical signal supplied to the semiconductor cooling module (101) based on the temperature value detected by the temperature detector (105); The control module (103) is further electrically connected to a charging module (200) connected to the conductor (102), acquires charging / discharging current values ​​and charging time length, and adjusts the electrical signal supplied to the semiconductor cooling module (101) based on the charging / discharging current value, the charging time length, and the temperature value detected by the temperature detector (105).

2. The cable with cooling function according to claim 1, characterized in that a plurality of the semiconductor cooling modules (101) are provided, and the plurality of the semiconductor cooling modules (101) are connected in parallel and connected to the control module (103).

3. The cable with cooling function according to claim 1, characterized in that a plurality of the semiconductor cooling modules (101) are provided, and the plurality of semiconductor cooling modules (101) are connected in series and connected to the control module (103).

4. 3. The cable with cooling function according to claim 2, wherein a plurality of the semiconductor cooling modules (101) are provided on at least one side of the conductor (102) at predetermined intervals.

5. A cable with cooling function as described in Claim 3, characterized in that the multiple semiconductor cooling modules (101) are arranged on at least one side of the conductor (102) at a predetermined distance apart.

6. The cable with cooling function described in claim 1, characterized in that the ratio of the total area of ​​the cooling ends of the semiconductor cooling module (101) to the area of ​​the conductor (102) ranges from 3% to 95%.

7. 2. The cable with cooling function according to claim 1, further comprising a rectification module (104) electrically connected between the control module (103) and the conductor (102) for rectifying and processing the electrical energy obtained from the conductor (102).

8. When there are a plurality of temperature detectors (105), adjusting the electrical signal supplied to the semiconductor cooling module (101) based on the temperature value detected by the temperature detector (105); Calculating a temperature distribution of the conductor (102) based on the temperature value detected by the temperature detector (105); determining a power supply signal to each of the semiconductor cooling modules (101) provided on the conductor (102) based on the temperature distribution of the conductor (102); 2. The cable with cooling function according to claim 1, further comprising: supplying power to each of the semiconductor cooling modules (101) in response to a power supply signal to each of the semiconductor cooling modules (101).

9. The control module (103) adjusts the electrical signal supplied to the semiconductor cooling module (101) based on the charge / discharge current value, the charging time length, and the temperature value detected by the temperature detector (105). Calculating the amount of heat generated by the conductor based on the charge / discharge current value and the charging time length; Calculating a theoretical temperature rise value of the conductor (102) based on the heat generation amount of the conductor and material information of the conductor (102); Calculating an actual temperature rise value of the conductor (102) based on the temperature value detected by the temperature detector (105) and a theoretical temperature rise value of the conductor (102); and adjusting the electrical signal supplied to the semiconductor cooling module (101) based on an actual temperature rise of the conductor (102).

10. adjusting the electrical signal supplied to the semiconductor cooling module (101) based on the actual temperature rise of the conductor (102); Calculating a difference between an actual temperature rise value of the conductor (102) and a preset temperature rise value of the conductor (102); inputting the difference value into a PID control logic to obtain an electrical control signal for the semiconductor cooling module (101); and adjusting the electrical signal supplied to the semiconductor cooling module (101) based on the electrical control signal of the semiconductor cooling module (101); 10. The cable with cooling function according to claim 9, wherein a control parameter in the PID control logic is adjusted in advance based on a PID control index.

11. The cooling function cable of claim 1, characterized in that the control module (103) is further electrically connected to an environmental parameter detection module and a charging module (200) connected to the conductor (102), acquires environmental parameter information from the environmental parameter detection module, acquires charging / discharging current values ​​and charging time length from the charging module (200), and adjusts the electrical signal supplied to the semiconductor cooling module (101) based on the environmental parameter information, the charging / discharging current values ​​and the charging time length.

12. 2. The cable with cooling function according to claim 1, wherein a conductor connected to the control module (103) of the semiconductor cooling module (101) is provided in a low-voltage harness (106).

13. The semiconductor cooling module (101) includes an alumina substrate (1011), a waterproof protective layer (1012), a semiconductor P / N layer (1013), and a power supply interface (1014); The alumina substrate (1011), the waterproof protective layer (1012), and the semiconductor P / N layer (1013) are provided in this order, 2. The cooled cable of claim 1, wherein the power interface (1014) is electrically connected to a semiconductor P / N layer (1013).

14. The cable with cooling function according to claim 13, characterized in that the cooling rate of the semiconductor cooling module (101) is 0.05 K / s to 5 K / s.

15. The cable with cooling function according to claim 1, further comprising an insulating protective layer (107) provided between the conductor (102) and the semiconductor cooling module (101) or on the outer surface of the semiconductor cooling module (101).

16. The cable with cooling function described in claim 15, characterized in that the material of the insulating protective layer (107) is one or a combination of several of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, and polyethylene.

17. 2. The cooled cable according to claim 1, wherein the cross section of the conductor (102) has a circular, elliptical, rectangular, polygonal, E-shaped, F-shaped, H-shaped, K-shaped, L-shaped, T-shaped, U-shaped, V-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, arched, or wavy structure.

18. The cable with cooling function described in claim 1, characterized in that the material of the conductor (102) is one or a combination of several of metal, conductive ceramic, carbon-containing conductor, solid electrolyte, mixed conductor, and conductive polymer material.

19. 19. The cable with cooling function according to claim 18, wherein the material of the conductor (102) is copper, a copper alloy, aluminum, or an aluminum alloy.

20. The cable with cooling function according to claim 1, further comprising a heat dissipation device disposed outside the semiconductor cooling module (101).

21. A cooling system including the cable (100) with cooling function according to any one of claims 1 to 20, a charging module (200), and a battery module (300), A current transmission device characterized in that both ends of the cable with cooling function (100) are connected to the charging module (200) and the battery module (300), respectively, so as to conduct electrical energy acquired by the charging module (200) to the battery module (300).

22. 22. The current transmission device according to claim 21, wherein the control module (103) is connected to a charging module (200) for supplying electrical energy to the control module (103).

23. An electric vehicle comprising the current transmission device according to claim 21.

24. An electric vehicle comprising the current transmission device described in claim 22.

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