Substrate device and method

Abstract

The substrate support apparatus can include a monitoring device configured to monitor the position of a suction device of the plurality of suction devices. In some embodiments, a substrate packaging apparatus for packaging an inclined substrate stack can include a substrate support structure and a compaction device. In some embodiments, a method can include stacking a plurality of substrates to form an inclined substrate stack, imaging features of the inclined substrate stack, and using information from the imaging step to identify a characteristic of the inclined substrate stack. In some embodiments, the method can include stacking an additional substrate on the inclined substrate stack and identifying a characteristic of the inclined substrate stack with the substrate support apparatus engaging the additional substrate.

Description

Priority

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Patent Application No. 63 / 049,852, filed July 9, 2020, the entire disclosure of which is incorporated herein by reference. [Technical Field]

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to substrate devices and methods, and more particularly to substrate support devices and methods, and substrate packaging devices and methods. [Background technology]

[0003] It is known to store substrates as leaning stacks of substrates. Typically, leaning stacks of substrates are fabricated by stacking individual substrates one on top of the other until the stack is complete. In some embodiments, the leaning stacks of substrates may be packaged for shipping, storage, and / or handling. However, during the substrate stacking process, undesirable fanning may occur, causing one or more substrates in the leaning stack to become non-parallel to one or more other substrates in the stack, thereby causing the thickness of the leaning stack to differ from one location in the leaning stack to another location in the stack. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, there is a need to control the fanning of tilted substrate stacks, thereby maintaining all substrates in the tilted substrate stack in the proper position and / or protecting one or more substrates in the tilted substrate stack from damage due to excessive stress concentrations inherent in excessive fanning. [Means for solving the problem]

[0005] The following presents a simplified summary of the disclosure in order to provide a basic understanding of some embodiments that are described further below.

[0006] In some embodiments, the substrate support apparatus used to stack substrates into the tilted substrate stack can also be used to determine a property (e.g., fanning) of the tilted substrate stack. This dual functionality allows the substrate support apparatus to determine the property after each substrate is stacked into the tilted substrate stack. Thus, the property determination can be performed quickly and after each additional substrate is stacked.

[0007] In some embodiments, a compacting device can be used to stack substrates to form a tilted substrate stack while reducing fanning. In some embodiments, a single compaction cycle can be performed, which may be beneficial for reducing fanning while minimizing the time required to perform the compaction process. In further embodiments, the compaction process can include two compaction cycles, one after each substrate stack. Performing two compaction cycles can further reduce fanning compared to performing a single compaction cycle. Additionally, using a lower compaction pressure in each of the two compaction cycles can reduce the likelihood of stress fractures compared to performing a single compaction cycle at a higher compaction pressure.

[0008] In some embodiments, the substrate support apparatus may include a base and a plurality of suction devices, each of which may be movably mounted to the base, and the substrate support apparatus may further include a monitoring device configured to monitor a position of a suction device of the plurality of suction devices.

[0009] In some embodiments, the monitoring device is configured to monitor the relative position of the suction device with respect to the base.

[0010] In some embodiments, the monitoring device may include an ultrasonic sensor.

[0011] In some embodiments, the ultrasonic sensor may be fixedly attached to the base.

[0012] In some embodiments, each suction device of the plurality of suction devices can be movably mounted to the base for translational movement relative to the base in the adjustment direction.

[0013] In some embodiments, the plurality of suction devices may comprise a row of suction devices, each suction device of the row of suction devices being spaced apart from other suction devices of the row of suction devices along a row axis perpendicular to the adjustment direction.

[0014] In some embodiments, at least one suction device of the plurality of suction devices may be independently movable relative to at least one further suction device of the plurality of suction devices.

[0015] In some embodiments, a substrate packaging apparatus for packaging a tilted substrate stack can include a substrate support structure configured to support the tilted substrate stack. The substrate support structure can have a rear surface configured to support a major surface of a substrate in the tilted substrate stack. The substrate support structure can further have a lower surface extending away from the rear surface and configured to support a lower edge of a substrate in the tilted substrate stack. The substrate packaging apparatus can also include a compaction device having a compaction axis extending widthwise of the rear surface.

[0016] In some embodiments, the compaction device can comprise a plurality of actuators configured to apply a force along a compaction axis to the bottom of the tilted substrate stack.

[0017] In some embodiments, the compaction device can comprise a plurality of actuators configured to apply a varying force along a compaction axis to the bottom of the tilted substrate stack.

[0018] In some embodiments, at least one actuator of the plurality of actuators is capable of operating independently relative to at least one other actuator of the plurality of actuators.

[0019] In some embodiments, the compaction device can have a plurality of holes that communicate with the fluid pressure chamber.

[0020] In some embodiments, the method can include stacking a plurality of substrates on a substrate support structure to form a tilted substrate stack, and the method can further include imaging a feature of the tilted substrate stack and using information obtained from the imaging step to identify a property of the tilted substrate stack.

[0021] In some embodiments, the properties of the tilted substrate stack may include the fan-likeness of the tilted substrate stack.

[0022] In some embodiments, the method may further include stacking the additional substrate on the tilted substrate stack with the additional substrate supported by the substrate support apparatus, and compacting the tilted substrate stack by engaging the additional substrate with a compaction device.

[0023] In some embodiments, in compacting the tilted substrate stack, the compaction device can apply pressure along a compaction axis.

[0024] In some embodiments, the step of compacting the tilted substrate stack may position the compaction axis along the bottom of the tilted substrate stack.

[0025] In some embodiments, in the step of compacting the tilted substrate stack, the compaction device can apply a pressure to the additional substrate that varies along the compaction axis.

[0026] In some embodiments, in the step of compacting the tilted substrate stack, the compaction device may create a fluid cushion between the additional substrate and the compaction device.

[0027] In some embodiments, the compacting step can be performed while the substrate support apparatus is supporting additional substrates.

[0028] In some embodiments, the method may further include decoupling the substrate support from the additional substrate.

[0029] In some embodiments, the step of decoupling the substrate support from the additional substrate may occur during the step of compacting the tilted substrate stack with the compaction device.

[0030] In some embodiments, the method may further include detaching the compaction device from the additional substrate.

[0031] In some embodiments, the method may further include re-engaging an additional substrate with the compaction device.

[0032] In some embodiments, the method may include stacking an additional substrate on the tilted substrate stack with the substrate support apparatus engaged with the additional substrate, and may include identifying a characteristic of the tilted substrate stack with the substrate support apparatus with the additional substrate engaged with the substrate support apparatus.

[0033] In some embodiments, during the step of stacking an additional substrate into the tilted substrate stack, a plurality of suction devices of the substrate support apparatus may remain removably attached to the additional substrate.

[0034] In some embodiments, identifying the characteristic may include moving one suction device of the plurality of suction devices relative to other suction devices of the plurality of suction devices.

[0035] In some embodiments, identifying the characteristic may include monitoring the position of the one suction device.

[0036] In some embodiments, the position of one suction device can be monitored with an ultrasonic sensor.

[0037] In some embodiments, the method may further include pressing an additional substrate with a compaction device to compact the tilted substrate stack.

[0038] In some embodiments, compacting the tilted substrate stack can include applying pressure along a compaction axis to the additional substrate with a compaction device.

[0039] In some embodiments, the step of compacting the tilted substrate stack may position the compaction axis along the bottom of the tilted substrate stack.

[0040] In some embodiments, in the step of compacting the tilted substrate stack, the compaction device can apply a pressure to the additional substrate that varies along the compaction axis.

[0041] In some embodiments, in the step of compacting the tilted substrate stack, the compaction device may generate a fluid cushion between the tilted substrate stack and the compaction device.

[0042] In some embodiments, the compacting step can be performed while the substrate support apparatus is engaged with an additional substrate.

[0043] In some embodiments, the method may further include pausing the application of pressure by the compaction device to the additional substrate for a period of time, and then reapplying pressure along the compaction axis to the additional substrate with the compaction device.

[0044] In some embodiments, the method may include decoupling the substrate support apparatus from the additional substrate prior to the re-applying of pressure, and the re-applying of pressure may be performed with the substrate support apparatus decoupled from the additional substrate.

[0045] Additional features and advantages of the embodiments disclosed herein are set forth in the following detailed description. These additional features and advantages will be apparent to those skilled in the art, in part, from the description, or may be learned by practice of the embodiments described herein, including the following detailed description, claims, and accompanying drawings. It is to be understood that both the foregoing general description and the following detailed description present embodiments and are intended to provide an overview or framework for understanding the nature and features of the embodiments disclosed herein. In addition, the accompanying drawings are included to provide a further understanding and are incorporated into and constitute a part of this specification. The drawings illustrate various embodiments of the present disclosure and, together with the following detailed description, serve to explain the principles and operation of the various embodiments.

[0046] These and other features, aspects and advantages will be better understood from the following detailed description when read in conjunction with the accompanying drawings, in which: [Brief explanation of the drawings]

[0047] [Figure 1]1 is a schematic diagram illustrating a substrate support apparatus placing a supported substrate onto a tilted substrate stack, according to aspects of the present disclosure. [Figure 2] FIG. 2 is a plan view showing a substrate to be placed on the tilted substrate stack of FIG. 1; [Figure 3] Schematic diagram illustrating the use of an imaging device to characterize tilted substrate stacks. [Figure 4] 1 is a schematic diagram illustrating another substrate support apparatus placing a supported substrate onto a tilted substrate stack, according to aspects of the present disclosure. [Figure 5] 5 is a schematic diagram of the base of the substrate support device as viewed from the direction of line 5-5 in FIGS. 1 and 4; [Figure 6] FIG. 5 is a schematic diagram illustrating the use of the substrate support apparatus shown in FIG. 4 to characterize a tilted substrate stack. [Figure 7] 5 is a schematic diagram illustrating the substrate support apparatus of FIG. 4 with the compaction device separated from the tilted substrate stack after the substrate it supports has been placed on the tilted substrate stack; [Figure 8] 8 is a schematic diagram illustrating the substrate support apparatus of FIG. 7 after a supported substrate has been placed on the tilted substrate stack, with a compaction device pressing the supported substrate to compact the tilted substrate stack. [Figure 9] 9 is a cross-sectional view taken along line 9-9 of FIG. 7, schematically illustrating the compaction device and the tilted substrate stack. [Figure 10] 10-10 cross-sectional view of FIG. 8, showing a compaction device and a tilted substrate stack. [Figure 11] 11 illustrates an embodiment of a process for compacting a tilted substrate stack with the compaction device shown in FIGS. 7-10. [Figure 12] 11 illustrates an embodiment of a process for compacting a tilted substrate stack with the compaction device shown in FIGS. 7-10. [Figure 13] 9 is a cross-sectional view taken along line 9-9 of FIG. 7, schematically illustrating another embodiment of a compaction device and a tilted substrate stack. [Figure 14] 14 is a cross-sectional view of the compaction device and tilted substrate stack shown in FIG. 8 taken along line 10-10. [Figure 15]15 is a partial front view of the compaction device shown in FIGS. 13 and 14 taken along line 15-15 of FIG. 13; [Figure 16] 16 is a cross-sectional view taken along line 16-16 in FIG. 15, schematically illustrating the compaction device shown in FIGS. 13 to 15. [Figure 17] Schematic showing the compaction device continuing to press the previously supported substrate on top of the tilted substrate stack while the substrate support apparatus is detached from the previously supported substrate. [Figure 18] 18 is a schematic diagram showing the tilted substrate stack of FIG. 17 in a compacted state after the compaction device has been separated from the tilted substrate stack. [Figure 19] A graph plotting the results of an experiment comparing the degree of fanning versus the number of substrates when stacking substrates to form an inclined substrate stack. [Figure 20] A graph plotting the results of an experiment comparing the degree of fanning versus the number of substrates when stacking substrates to form an inclined substrate stack. DETAILED DESCRIPTION OF THE INVENTION

[0048]

[0023] The embodiments will now be described in more detail with reference to the accompanying drawings, which illustrate exemplary embodiments. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts. It should be noted that this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0049] In some embodiments, a method for processing substrates in a substrate packaging process can be provided, which can monitor the status of a substrate stack and help improve the quality of the substrate stack. The substrates of the present disclosure can be glass substrates. However, the substrates of the present disclosure can also be made of substrate materials such as glass-ceramic substrates, ceramic substrates, and silicon substrates. In some embodiments, the substrates can be made of glass substrates of various compositions. Such glasses include, but are not limited to, soda-lime glass, borosilicate glass, aluminoborosilicate glass, alkali-containing glass, or alkali-free glass. In some embodiments, the glass substrates can be manufactured by separating the glass substrates from glass ribbons. The glass ribbons are manufactured using glass ribbon manufacturing equipment such as slot draw equipment, float bath equipment, downdraw equipment, updraw equipment, and press rolling equipment. The glass substrates can be suitable for further processing into desired applications, such as display applications. Glass substrates can be used in a wide variety of display applications, including liquid crystal displays (LCDs), electrophoretic displays (EPDs), organic light-emitting diode displays (OLEDs), and plasma display panels (PDPs). Glass substrates may need to be transported from one location to another. The transport of substrates (e.g., glass substrates) may be in the form of tilted substrate stacks, as described throughout this application. Optionally, an interleaf material may be placed between each substrate (e.g., glass substrate) to prevent contact and protect the clean surfaces of the substrates.

[0050] As shown in FIGS. 1 and 2, the substrate 101 (e.g., a glass substrate) can have a length "L" and a width "W" perpendicular to the length "L." As shown in FIG. 2, the substrate 101 can have a rectangular outer periphery, with the length "L" defined between two parallel edges 201 a, 201 b and the width "W" defined between two parallel side edges 203 a, 203 b. As shown, the extension direction of each edge 201 a, 201 b can be perpendicular to the extension direction of each side edge 203 a, 203 b. In some embodiments, the width "W" of the substrate 101 can be about 20 mm or more, such as about 50 mm or more, such as about 100 mm or more, such as about 500 mm or more, such as about 1000 mm or more, such as about 2000 mm or more, such as about 3000 mm or more, or such as about 4000 mm or more. However, in further embodiments, widths smaller or larger than the aforementioned widths are possible. For example, in some embodiments, the width "W" of the substrate 101 can be from about 20 mm to about 4000 mm, such as from about 50 mm to about 4000 mm, for example, from about 100 mm to about 4000 mm, for example, from about 500 mm to about 4000 mm, for example, from about 1000 mm to about 4000 mm, for example, from about 2000 mm to about 4000 mm, for example, from about 3000 mm to about 4000 mm, for example, from about 20 mm to about 3000 mm, for example, from about 50 mm to about 3000 mm, for example, from about 100 mm to about 3000 mm, for example, from about 500 mm to about 3000 mm, for example, from about 1000 mm to about 3000 mm, for example, from about 2000 mm to about 3000 mm, for example, from about 2000 mm to about 2500 mm, and all ranges and subranges therebetween.

[0051] Substrate 101 (e.g., a glass substrate) can have a first major surface 103 a and a second major surface 103 b. First major surface 103 a and second major surface 103 b face in opposite directions and define a thickness "T" (e.g., average thickness) of substrate 101. In some embodiments, thickness "T" of substrate 101 can be about 2 millimeters (mm) or less, about 1 millimeter or less, or about 0.5 millimeters or less, such as about 300 micrometers (μm) or less, about 200 micrometers or less, or about 100 micrometers or less. However, other thicknesses are possible in further embodiments. For example, in some embodiments, the thickness "T" of the substrate 101 can be from about 50 μm to about 750 μm, from about 100 μm to about 700 μm, from about 200 μm to about 600 μm, from about 300 μm to about 500 μm, from about 50 μm to about 500 μm, from about 50 μm to about 700 μm, from about 50 μm to about 600 μm, from about 50 μm to about 500 μm, from about 50 μm to about 400 μm, from about 50 μm to about 300 μm, from about 50 μm to about 200 μm, from about 50 μm to about 100 μm (including all ranges and subranges therebetween).

[0052] FIGS. 1 , 3 , 4 , 6-8 , 17 , and 18 illustrate embodiments of a substrate support rack 107 of an embodiment of a substrate packaging apparatus 105, 401 according to aspects of the present disclosure. The substrate support rack 107 can be configured to support a tilted stack 109 of substrates 101. The substrate support rack 107 can have a rear surface 111 configured to support a major surface 103 b of one substrate 101 in the tilted stack 109 of substrates 101. For example, in some embodiments, a rear plate 113 can have the rear surface 111 as shown. The rear plate 113 can be a continuous plate or a lattice of support members that defines the rear surface 111. The substrate support rack 107 can also have a bottom surface 115 extending away from the rear surface 111 and configured to support a bottom edge of a substrate 101 in the tilted stack 109 of substrates 101. For example, in some embodiments, a bottom plate 117 can have the bottom surface 115 as shown. The lower plate 117 can be comprised of a continuous grid of plates or support members that define the lower surface 115. As shown, the lower surface 115 can extend substantially 90° away from the rear surface 111. However, in further embodiments, the lower surface 115 can extend at other angles away from the rear surface 111. The rear plate 113 and / or the lower plate 117 can be comprised of a material capable of supporting the angled stack 109 of substrates 101, such as stainless steel, plastic, wood, or the like. As further shown in FIG. 1 , the rear surface 111 can extend at an angle "A" relative to the direction of gravity "G." The angle "A" can range from greater than 0° to about 60°, such as greater than 0° to about 45°, such as greater than 0° to about 30°, such as greater than 0° to 20°, such as greater than 0° to 20°, and all ranges and subranges therebetween. In further embodiments, angle "A" can range from about 10° to about 60°, such as from about 10° to about 45°, such as from about 10° to about 30°, such as from about 10° to about 20°, and all ranges and subranges therebetween. In further embodiments, angle "A" can range from about 20° to about 60°, such as from about 20° to about 45°, such as from about 20° to about 30°, and all ranges and subranges therebetween.For purposes of this application, a substrate stack is considered to be an "inclined substrate stack" when the major surfaces of the substrates in the substrate stack are oriented at one of the angles "A" above with respect to gravity "G." Thus, an inclined substrate stack supported by the substrate support rack 107 can be configured by stacking substrates with the rear surface 111 extending at an angle "A" within the above-mentioned range with respect to the direction of gravity "G." For example, the major surface of the rearmost substrate in the inclined substrate stack can be supported by the rear surface 111, and thus the major surface of the rearmost substrate can be supported in an orientation extending at an angle "A" within the above-mentioned range with respect to the direction of gravity "G," similar to the rear surface 111. As a result, at least the major surface of the rearmost substrate extends at an angle "A" within the above-mentioned range with respect to the direction of gravity "G," and therefore this substrate stack is considered to be an inclined substrate stack.

[0053] As shown, the stand 119 can be designed to support the rear surface 111 at a desired angle "A." For example, the stand 119 can support the relative position between the back plate 113 and the bottom plate 117, as well as support the mass of the back plate 113, the bottom plate 117, and the tilted stack 109 of substrates 101. In some embodiments, the stand 119 can have a support surface 120 that can rest on a horizontal surface such that the support surface 120 is perpendicular to the direction of gravity "G." In some embodiments, the angle "B" between the support surface 120 and the rear surface 111 can be considered to be equal to 90° minus the angle "A."

[0054] The substrate packaging apparatus 105 shown in FIG. 1 can include a substrate support apparatus 121. The substrate support apparatus 121 is configured to assist in building an angled stack 109 of substrates 101 on a substrate support rack 107. In some embodiments, the substrate support apparatus 121 can include a plurality of suction devices 123 attached to a base 125, as shown. FIG. 5 illustrates one embodiment of the base 125 from the direction of line 5-5 in FIG. 1. As shown, the base 125 can include parallel side rails 503 a, 503 b, which can support the suction devices 123 in each row. The parallel side rails 503 a, 503 b can be attached to a central rail 505, which can be manipulated by a robot 129 (see FIG. 1). In some embodiments, each suction device 123 can include a suction cup 127. The suction cups 127 can be disposed in communication with a fluid source, thereby controlling the suction associated with each suction cup 127 to selectively attach and detach the substrate 101 to the first major surface 103a. In some embodiments, a vacuum (e.g., from a negative pressure source) can be associated with one or more of the suction cups. The vacuum can be used to increase the adhesion force between the suction cup and the first major surface 103a. In further embodiments, the vacuum source can be adjustable to increase or decrease the adhesion force. In some embodiments, the fluid source can also include a positive pressure source to detach the substrate from the suction cup once it is properly positioned on the tilted substrate stack. In some embodiments, the fluid source (e.g., positive pressure source and / or negative pressure source) can apply the same positive pressure / vacuum force to all suction cups in each row, or the same positive pressure / vacuum force to all suction cups in all rows. In further embodiments, one or more suction cups can have a suction force that can act independently of the other suction cups.

[0055] In operation, the robot 129 can move the base 125 and corresponding suction device 123 to pick a substrate 101 for stacking. Picking of the substrate can occur while the conveyor is moving, or at a location where the substrate is separated from the ribbon after ribbon production, etc. To pick the substrate 101, the robot 129 can manipulate the base 125 to engage the suction cups 127 of the suction device 123 with the first major surface 103 a of the substrate 101. It will be appreciated that the suction cups 127 can be engaged adjacent the outer edges 203 a, 203 b (see FIG. 2 ) of the substrate to maintain a clean central portion of the major surface 103 a of the substrate 101. The robot can then move the substrate 101 to a position where it can be added to the tilted stack 109 of substrates 101 in a tilted orientation, as shown in FIG. 1 .

[0056] However, as a result of stacking multiple substrates 101, the tilted stack 109 may experience fanning. When fanning occurs, the maximum thickness "T1" of the tilted stack 109 in a direction perpendicular to the rear surface 111 at one location is greater than the minimum thickness "T2" of the tilted stack 109 in a direction perpendicular to the rear surface 111 at another location. As shown, the maximum thickness "T1" may be located in the middle of the tilted stack 109. However, the maximum thickness "T1" may also be located near or at the top of the tilted stack 109, or near or at the bottom of the tilted stack 109. Note that throughout this application, the difference between the maximum thickness "T1" and the minimum thickness "T2" is referred to as the degree of fanning.

[0057] In some embodiments, overall fanning may exist across the entire surface area of ​​the tilted substrate stack 109. In this case, the entire tilted substrate stack 109 has a maximum thickness "T1" and a minimum thickness "T2." The overall fanning of the tilted substrate stack 109 is then the difference between the maximum thickness "T1" and the minimum thickness "T2." In further embodiments, the lengthwise fanning may vary with position along the width "W" of the substrate 101. For example, if the lengthwise axis is defined as an axis extending linearly in the length "L" of the substrate 101 outside the tilted stack 109 of the substrate 101, then at a certain location along the width, lengthwise fanning may exist along the linear lengthwise axis extending through that location. In such an example, the longitudinal fanning at a given location in the width "W" direction is taken to be the difference between the maximum thickness "T1" on a linear longitudinal axis passing through that location and the minimum thickness "T2" on a linear longitudinal axis passing through that location.

[0058] 4 and 6-8 illustrate a substrate support apparatus 403 of a substrate packaging apparatus 401 according to a further embodiment. The substrate support apparatus 403 can include a base 125 (e.g., as shown and described with reference to FIG. 5 ) and a plurality of suction devices 405. Each suction device 405 of the plurality of suction devices 405 is movably mounted to the base 125. In some embodiments, each suction device 405 of the plurality of suction devices can be movably mounted to the base 125 for translational movement along an adjustment direction relative to the base 125. For example, as shown in FIG. 4 , each suction device 405 of the plurality of suction devices 405 can translate in a first adjustment direction 407 a to extend relative to the base 125 and / or translate in a second adjustment direction 407 b to retract relative to the base 125. As shown, in some embodiments, each suction device 405 can include a guide rod 409. The guide rod 409 is slidably mounted to the base 125 with a suction cup 127 disposed at one end thereof. Although not shown, in some embodiments, each suction device 405 may also include a biasing device (e.g., a compression spring). Each biasing device can bias the corresponding suction device 405 in the first adjustment direction 407a so that the corresponding suction device 405 is in the extended position shown in FIG.

[0059] As shown in FIG. 4, the substrate support apparatus 403 may further include a base. For example, the base 125 described above with reference to FIG. 5 may constitute the base of the substrate support apparatus 403 as viewed from the direction of line 5-5 in FIG. 4. The base 125 may include parallel side rails 503a, 503b, which may support suction devices 405 aligned in each suction device row. While two suction device rows are shown in the figure, in further embodiments, three or more suction device rows may be provided. For example, the base 125 may include three or more parallel side rails capable of supporting suction devices. In some embodiments, the plurality of suction devices 405 (see FIG. 4) may include a first row of suction devices 405. The suction devices 405 in the first row are arranged along a first row axis 501a of the first row. In some embodiments, the plurality of suction devices 405 may include a second row of suction devices 405. The second row of suction devices 405 is arranged along the second row axis 501b of the second row. Although not shown, in some embodiments, the multiple suction devices may include three or more rows of suction devices, with the suction devices in each row arranged along a corresponding row axis. As shown in FIG. 5 , each suction device 405 in the multiple suction devices 405 may be spaced apart from the other suction devices 405. For example, each suction device 405 may be located between a pair of adjacent suction devices 405. The row axes 501a, 501b may be perpendicular to the adjustment directions 407a, 407b of the suction devices 405. In some embodiments, the parallel side rails 503a, 503b may be attached to a central rail 505 that can be manipulated by the robot 129. Although two parallel side rails 503a, 503b are shown in the figure, in further embodiments, three or more parallel side rails may be provided (e.g., attached to central rail 505) that can be manipulated by robot 129. A row axis may be provided corresponding to each parallel side rail, and the suction devices in each row may be spaced apart along the corresponding row axis.In some embodiments, each suction device 405 can include a suction cup 127. The suction cup 127 can be disposed in communication with a fluid source, allowing for selective attachment and detachment to the first major surface 103 a of the substrate 101.

[0060] In some embodiments, at least one suction device of the plurality of suction devices 405 can be independently movable relative to at least one additional suction device of the plurality of suction devices 405. For example, as at least one suction device 405 shown in FIG. 4 is moved in adjustment directions 407a, 407b, one or more of the remaining suction devices of the plurality of suction devices can remain stationary relative to the base 125. In some embodiments, each suction device can be independently movable (e.g., in adjustment directions 407a, 407b) relative to the remaining suction devices.

[0061] As shown in FIGS. 4 and 6-8 , the substrate support apparatus 403 may further include a monitoring device 411 configured to monitor the position of one of the plurality of suction devices 405. In some embodiments, the monitoring device 411 may be configured to monitor the relative position of the suction device 405 with respect to the base 125. For example, the monitoring device may be designed to monitor the relative position of the guide rod 409 with respect to the base 125. In some embodiments, the monitoring device may be designed to monitor the suction cups 127 of the suction device 405. Note that the suction cups 127 may be monitored directly or by monitoring the relative position of the guide rod 409 with respect to the base 125. In some embodiments, the monitoring device may include a proximity sensor capable of monitoring the relative position of the suction device 405 with respect to the base 125 without physical contact. However, a physical contact sensor may also be incorporated in accordance with aspects of the present disclosure. Examples of proximity sensors may include optical sensors (e.g., laser sensors), ultrasonic sensors, or other types of proximity sensors. As shown schematically in FIG. 4 , in some embodiments, the monitoring device 411 can include an ultrasonic sensor 413. The ultrasonic sensor 413 is configured to monitor the relative position of the suction device 405 with respect to the base 125 without requiring physical contact between the suction device 405 and the base 125. In some embodiments, a proximity sensor (e.g., the ultrasonic sensor 413) can be fixedly attached to the base 125 to monitor the relative position of a portion of the suction device 405 with respect to the base. In some embodiments, the end of the guide rod 409 can be provided with a flag 415 that extends across the sensing path of the proximity sensor. For example, as shown, ultrasonic wave 417a can travel to intersect with flag 415, which is positioned across the sensing path of the ultrasonic sensor 413. The reflected ultrasonic wave 417b is then reflected by flag 415 and detected by the ultrasonic sensor 413. The signal is then sent back to the processor 137 which can calculate the relative position of the flag portion 415 of the suction device 405 with respect to the base 125 .Although not shown, the ultrasonic sensor can be attached to a guide rod (for example, the end of the guide rod) and the base 125 can reflect ultrasonic waves. However, if the ultrasonic sensor is fixedly attached to the base 125, the communication path from the ultrasonic sensor 413 to the processor 137 can be supported by the base 125, thereby simplifying the device structure.

[0062] As shown, the monitoring device 411 can monitor the position of one or any of the plurality of suction devices. For example, as shown in FIG. 4, the monitoring device 411 can monitor the relative position of each of the plurality of suction devices 405 with respect to the base 125. For example, as shown, each of the plurality of suction devices 405 can be provided with a proximity sensor (e.g., an ultrasonic sensor). Providing a sensor (e.g., a proximity sensor) with each suction device 405 allows for independent tracking of each suction device in embodiments in which one or all of the suction devices 405 can move independently relative to one another.

[0063] In some embodiments, the substrate package apparatus 105, 401 may also be provided with a compaction device. For convenience of explanation, the embodiment of the substrate package apparatus 401 shown in FIGS. 4 and 6-18 will be described below as optionally including a compaction device 701 ( FIGS. 9-12 ), 1301 ( FIGS. 13-16 ). Although not shown, the substrate package apparatus 105 shown in FIGS. 1 and 3 may also include a compaction device 701, 1301 having similar or identical features and functions to the compaction devices 701, 1301, which will be described in more detail below. As shown in FIGS. 9 and 13 , the compaction device 701, 1301 may have a compaction axis 901 extending in the direction of the width “WR” of the rear surface 111. In some embodiments, the outer surface of the press member may include the compaction axis. As shown in FIGS. 9 and 13, the width "WR" of the rear surface 111 can be substantially the same as the width "W" of the substrate 101 (see FIG. 2). However, in further embodiments, the width "WR" of the rear surface 111 can be greater than or less than the width "W" of the substrate 101. Having the width "WR" of the rear surface 111 equal to or greater than the width "W" of the substrate 101 helps provide adequate support across the entire width of the substrate 101, thereby reducing stress concentrations and the likelihood of damage to the substrate 101. In some embodiments, the compaction shaft 901 can be configured as a substantially straight compaction shaft 901. For example, in some embodiments, the rear surface 111 can be configured as a substantially flat surface. In this configuration, the substantially straight compaction shaft 901 can help distribute compaction forces evenly across the width of the substrate 101 during the compaction process. In further embodiments, the rear surface 111 can be configured as a convex or concave surface. Such a convex or concave surface is achieved by curving a flat surface (represented by a straight line "111" in Figures 9 and 13) and would be represented by an arcuate line if depicted. Making the rear surface convex or concave can assist in bending the substrate stack into a curved shape that conforms to the convex or concave rear surface. Bending the substrates into a curved position can strengthen the substrates and / or help prevent substrate displacement from the rear surface 111.In embodiments where the rear surface 111 is concave or convex, the compaction axis 901 may be configured as a curved axis having a shape that matches the curvature of the convex or concave shape of the rear surface along the width "WR" of the rear surface.

[0064] In some embodiments, the compaction device can include at least one actuator. For example, as shown in FIG. 7 , the base member 703 of the compaction device can include at least one actuator configured to extend or retract a press member 705, 1305 that defines the compaction axis 901 of the compaction device 701, 1301. As shown, in some embodiments, the compaction device 701, 1301 can include an abutment device 904, 1304, which in turn can include a press member 705, 1305. In some embodiments, the actuator of the base member 703 can cause the abutment device 904, 1304 to extend in direction 707a and retract in direction 707b. In some embodiments, the directions 707a, 707b can be substantially perpendicular to the rear surface 111. In further embodiments, in addition to or instead of an actuator on the base member, the abutment device 904, 1304 can include one or more actuators 903 (see FIG. 9 ). The actuators 903 are configured to extend and retract the press members 705, 1305 in directions 707a, 707b relative to the support member 907. In some embodiments, as shown, the one or more actuators 903 can selectively extend the rod 902, and thus the press members 705, 1305 coupled to the rod 902, in direction 707a. As shown, in some embodiments, the compaction device 701, 1301 can include multiple actuators configured to apply a force along the compaction axis 901 to the bottom of the tilted stack 109 of the substrate 101.

[0065] As shown in FIGS. 9 and 13 , in some embodiments, one or more actuators 903 of the compaction device 701, 1301 can be comprised of a plurality of actuators 903. As shown, in some embodiments, the plurality of actuators 903 can be comprised of a row of actuators 903, where each actuator 903 is positioned next to an adjacent actuator or between two adjacent actuators, thereby forming a row of spaced-apart actuators. In some embodiments, each actuator of the plurality of actuators 903 is configured to apply a varying force along the compaction axis 901 to the bottom of the angled stack 109 of the substrate 101. However, in further embodiments, each actuator can apply the same force. Additionally or alternatively, in some embodiments, at least one or all of the plurality of actuators can operate dependently or independently of at least one other actuator (e.g., all of the other actuators). For example, if the press member is a single rigid press member, all of the actuators 903 can operate simultaneously and apply the same force to move the entire length of the press member in the extension and retraction directions 707a, 707b. In further embodiments, as shown in FIGS. 11 and 12, the press member 705 can be a flexible press member, where portions of the press member can move in the extension and retraction directions 707a, 707b relative to other portions of the press member. In yet other embodiments, the press member can be a segmented press member, where multiple segments of the press member are configured to move relative to one another. For example, as shown in FIG. 13, press member 1305 can include segments 1307a, 1307b, and 1307c that can move relative to one another in the extension and retraction directions 707a, 707b.

[0066] In some embodiments, as shown in FIG. 10 , the press member 705 can be designed to physically contact the bottom of the substrate outside the tilted stack 109 of substrates 101 when applying a force to the bottom of the tilted stack 109 of substrates 101. In an alternative embodiment, as shown in FIG. 14 , the press member 1305 can be designed to apply a force to the bottom of the tilted stack 109 of substrates 101 without physically contacting the substrate outside the tilted stack 109 of substrates 101 by designing the press member 1305 to generate a fluid cushion 1401 and apply a force to the bottom of the substrate outside the tilted stack 109 of substrates 101. Applying a force without contact can prevent damage to the substrate that may occur if the press member physically contacts the substrate. As shown in FIGS. 15 and 16 , the compaction device can be configured with the press member 1305 having a plurality of holes 1501 in communication with a fluid pressure chamber 1601. As shown in FIG. 15 , the multiple holes 1501 can be spaced apart to form a hole pattern that achieves a desired fluid cushion configuration during use. Additionally, as shown in FIG. 16 , in some embodiments, the fluid pressure chamber 1601 can be comprised of multiple fluid pressure chambers. However, in further embodiments, a single fluid pressure chamber can be provided. Each pressure chamber 1601 can include one or more inlet ports 1602 for admitting pressurized fluid to the pressure chamber 1601. When multiple pressure chambers are provided, the pressurized fluid in each chamber can be adjusted relative to one another to provide a fluid cushion with varying characteristics along the length of the press member 1305. As shown in FIG. 16 , each segment 1307 a, 1307 b can include one or more pressure chambers, and the pressure chambers for each segment can be independently pressurized to apply a unique fluid cushion to each segment. Providing multiple holes 1501 per pressure chamber can also be beneficial for providing greater control over the characteristics of the fluid cushion (e.g., the pressure profile applied by the fluid cushion).

[0067] In some embodiments, the methods of the present disclosure may include stacking a plurality of substrates 101 on a substrate support structure (e.g., a substrate support rack 107) to form a tilted stack 109 of substrates 101. In some embodiments, a robot 129 may be provided. The robot 129 may pick individual substrates 101, such as glass substrates, from a location such as a conveyor belt, or may support the substrates as they are separated from a ribbon (e.g., a glass ribbon) in a ribbon (e.g., glass ribbon) formation process. The robot 129 may then manipulate the substrate into a proper orientation, where the substrate 101 supported by the substrate support apparatus 121 is substantially parallel to the rear surface 111 and / or the existing tilted stack 109, as shown in FIG. 1 . In some embodiments, the substrate 101 may be supported, moved, and stacked with other substrates in the tilted substrate stack 109, with a plurality of suction cups 127 removably attached to the substrate 101, as shown in FIG. 1 . In some embodiments, a negative pressure source can be placed in communication with the suction region of the suction cup to further strengthen and maintain the attachment of the suction cup to the substrate and prevent the suction cup from accidentally releasing from the substrate 101. Once the robot 129 has properly placed the currently supported substrate, the substrate can be released from the suction cup. For example, a positive pressure source can increase the pressure in the suction region of the suction cup to release the substrate from the suction cup at the appropriate location. The robot can then be retracted and removed from the vicinity of the tilted substrate stack 109, as shown in FIG.

[0068] In some embodiments, the method of the present disclosure can further include determining characteristics of the tilted stack of substrates 109 without contacting any of the substrates 101. For example, as shown in FIG. 3 , the robot 129 can first be moved out of the vicinity of the tilted stack of substrates 109. The imaging device 131 can then be used to image features of the substrates 101 (e.g., the outermost substrate), and the information obtained during imaging can be used to determine the characteristics of the tilted stack of substrates 109. In some embodiments, such characteristics of the tilted stack of substrates 101 can include the fanning of the tilted stack of substrates 109. In some embodiments, the fanning can include the overall fanning of the tilted stack of substrates 109. For example, the overall fanning can be the difference between the maximum thickness "T1" and the minimum thickness "T2" of the tilted stack of substrates 101 when they are not aligned on the same linear axis extending in the direction of the length "L." Thus, the overall fanning may comprise a single value related to the surface area of ​​the outermost major surface of the substrate. In further embodiments, the fanning may comprise a longitudinal fanning. The longitudinal fanning may comprise the difference between "T1" and "T2" when "T1" and "T2" are aligned on the same linear axis extending in the direction of the length "L." In such embodiments, the tilted stack 109 of the substrate 101 may comprise a longitudinal fanning at each location across the width of the tilted stack 109 of the substrate 101.

[0069] In one embodiment, the fanning can be determined by an imaging device 131, as shown in FIGS. 1 and 3 . In some embodiments, the imaging device 131 can include a digital image correlation device, as shown, which can include a light source 133 and a pair of cameras 135. One possible imaging device 131 is the ARAMIS digital image correlation device available from Trilion Quality Systems. The digital image correlation device can be designed to determine the three-dimensional positions of various markers associated with the outer surface of the tilted stack 109 of the substrate 101. In some embodiments, the markers can be reflective tabs attached to a major surface of the substrate 101. For example, referring to FIG. 2 , a plurality of markers 205 can be arranged in two rows 207 a, 207 b along linear axes 209 a, 209 b extending in the length “L” direction 211. In such an example, the imaging device 131 can determine the lengthwise fanning at two positions in the width “W” direction of the substrate 101. In some embodiments, the markers 205 can be provided on one or more of the substrates 101. In further embodiments, the substrates with markers 205 can be reused for repeated periodic measurements. For example, the substrate with markers 205 can be stacked by the substrate support device 121 to perform a fanning measurement. Once the imaging device 131 has completed the measurement, the substrate support device 121 can remove the substrate with markers 205, and continue stacking additional substrates as needed. Such measurements can be designed to perform fanning measurements after a selected number of substrates have been stacked (e.g., after 10, 20, 40, 60, etc.). Furthermore, while the substrates with markers can be composed of the same type of substrate as the substrates in the tilted substrate stack 109, in further embodiments, the substrates with markers 205 can be composed of a different material, possibly a more durable or less expensive material than the substrates stacked in the tilted stack 109 of substrates 101.

[0070] As shown in FIG. 3 , when substrates with markers 205 are placed in the stack, light 301 emitted from the illumination device 133 of the digital image correlation device is reflected by each marker 205 and can be detected by a pair of cameras 135 (not shown) spaced apart in the width direction "W." The reflected light received by the camera 135 is processed by a processor 137 to identify the positions of the markers 205 and output to an output device 303, such as a storage unit or display device, for digital storage or visual display of the data. As shown, the results of periodic measurements by the digital image correlation device can be displayed as a graph with the marker number on the vertical axis 305 and the thickness of the tilted stack 109 of substrates 101 on the horizontal axis 307. In the figure, the stack thickness at the final measurement shows a maximum thickness "T1" of approximately 46 at marker #5 and a minimum thickness "T2" of approximately 32 at marker #1, resulting in a lengthwise fanning of approximately 14 (i.e., 46-32) at the final measurement. In some embodiments, an alarm may be sounded when the fanning reaches a predetermined maximum allowable fanning. In further embodiments, the substrate support apparatus 121 may cease placing additional substrates 101 when the fanning reaches a predetermined maximum allowable fanning.

[0071] 4 and 6 illustrate additional embodiments for characterizing the tilted stack 109 of substrates 101. As shown, a substrate support 403 can be used to stack multiple substrates 101, and characterization can be performed as the next substrate is added to the tilted stack 109. For example, FIG. 4 illustrates an example of an additional substrate 101 being supported and engaged by the substrate support 403 and added to the tilted stack 109. In some embodiments, the first and second rows of suction cups 127 (see FIG. 5) can be selectively attached to portions of the major surface of the substrate 101 (e.g., the outer edges of the major surface). Engaging the outer edges helps maintain the cleanliness of the central portion of the major surface by preventing damage to the central portion due to imperfections such as rubbing by the suction cups 127. In some embodiments, the suction cups 127 can be disposed in communication with a fluid source, allowing the suction associated with each suction cup 127 to be controlled to selectively attach to and detach from the first major surface 103 a of the substrate 101. In some embodiments, a vacuum source can be associated with one or more of the suction cups. The vacuum source can be used to apply suction to increase adhesion between the suction cups and the first major surface 103a. In further embodiments, the vacuum source can be adjustable to increase or decrease adhesion. In some embodiments, the fluid source can also include a positive pressure source to detach the substrate from the suction cup once it is properly placed on the tilted substrate stack. In some embodiments, the fluid source (e.g., pressure source and / or vacuum source) can apply the same pressure / vacuum force to all suction cups in each row, or the same pressure / vacuum force to all suction cups in all rows. In further embodiments, one or more suction cups can have a suction force that can act independently of the other suction cups.

[0072] In operation, the robot 129 can move the base 125 and corresponding suction device 405 to pick a substrate 101 for stacking. Picking of the substrate can occur while the conveyor is moving, or at a location where the substrate is separated from the ribbon after ribbon production, etc. To pick the substrate 101, the robot 129 can manipulate the base 125 to engage the suction cups 127 of the suction device 405 with the first major surface 103 a of the substrate 101. It will be appreciated that the suction cups 127 can be engaged adjacent the outer edges 203 a, 203 b of the substrate to maintain a clean central portion of the major surface 103 a of the substrate 101. The robot can then move the substrate 101 to a position where it can be added to the tilted stack 109 of substrates 101 in a tilted orientation, as shown in FIG. 4 .

[0073] As shown in FIG. 6 , the substrate support apparatus 403 can identify the characteristics of the tilted substrate stack 109 while engaged with the additional substrate 101 after the additional substrate 101 has been loaded and before the additional substrate 101 is removed from the substrate support apparatus 403. As described above, the plurality of suction devices 405 of the substrate support apparatus 403 can remain removably attached to the additional substrate as it is being stacked into the tilted substrate stack. As shown in FIG. 4 , the robot 129 can first move the substrate support apparatus 403 in direction 402. Then, in some embodiments, each suction device of the plurality of suction devices 405 can move in a first adjustment direction 407 a or a second adjustment direction 407 b relative to one or more other suction devices of the plurality of suction devices 405 and relative to the base 125. Thus, the suction devices 405 can independently move relative to each other and relative to the base 125 to conform the supporting additional substrates 101 to the shape of the outermost substrates stacked in the tilted substrate stack 109. In practice, each suction device 405 can be biased in an elongated direction (e.g., by a compression spring). This allows the suction device to compress and conform the supporting additional substrates 101 to the shape of the outermost substrate in the substrate stack. As shown schematically in FIG. 6 , at “T1,” the thickness of the tilted stack 109 of substrates 101 increases, so the corresponding suction device 405 moves in the second adjustment direction 407b, thereby retracting the corresponding suction cup 127 toward the base 125. When the suction device 405 moves in the second adjustment direction 407b, the corresponding guide rod 409 moves the corresponding flag 415 in the second adjustment direction 407b, moving it away from the base 125. In some embodiments, a sensor, such as the illustrated ultrasonic sensor 413, can monitor the position of the suction device 405. For example, as shown in FIG. 4, ultrasonic waves 417a emitted from the ultrasonic sensor 413 can bounce off the flag 415 and return to the ultrasonic sensor 413 as reflected ultrasonic waves 417b, which can be detected by the ultrasonic sensor 413.The signal is then sent back to the processor 137, which can calculate the relative position of the flag portion 415 of the suction device 405 with respect to the base 125. In this manner, the position of each suction device 405 can be monitored to identify a corresponding characteristic (e.g., fanning). In some embodiments, the position of the suction device 405 can be relayed to an output device 303, such as a storage unit or display device as described above, for example, digital storage of the data or visual display of the data. In some embodiments, an alarm can be sounded when the fanning reaches a predetermined maximum allowable fanning. In further embodiments, the substrate support apparatus 403 can cease placing additional substrates 101 when the fanning reaches a predetermined maximum allowable fanning.

[0074] In some embodiments, the determination of a characteristic (e.g., fanning) of the tilted substrate stack 109 can be performed using either the imaging device 131 shown in FIG. 1 or the monitoring device 411 shown in FIG. 4. However, in some embodiments, the monitoring device 411 can monitor the substrate 101 each time a substrate 101 is added to the tilted substrate stack 109, thereby eliminating the need for a marked substrate 205 to be placed on the stack for periodic monitoring. Thus, the monitoring device 411 can provide continuous feedback, allowing for rapid detection of fanning before it becomes a problem, while avoiding the process interruptions and additional costs associated with introducing a marked substrate 205 specifically for proper periodic inspection.

[0075] Additionally, the methods of the present disclosure may further utilize a compaction device designed to reduce fanning of the tilted substrate stack. In some embodiments, the compaction device of the present disclosure may be used in combination with the imaging device 131 shown in Figures 1-3. In a further embodiment, the compaction device of the present disclosure may be used in combination with the substrate support apparatus 403 and monitoring device 411 shown in Figure 4.

[0076] The following describes an embodiment in which the compaction devices 701, 1301 are used in combination with the substrate support apparatus 403 and monitoring device 411 shown in Figure 4. It should be understood that the compaction devices 701, 1301 can be used in combination with the imaging device 131 shown in Figures 1 to 3 in a similar or identical manner to the description below. Referring to Figure 7, the substrate support apparatus 403 can load an additional substrate 101 onto the tilted stack 109 of substrates 101, which is engaged and supported by the suction device 405. When the additional substrate 101 is loaded, the actuator of the base member 703 can extend the abutment devices 904, 1304 in direction 707a, as shown in Figures 7 and 9, to move the press members 705, 1305 closer to the tilted stack 109 of substrates 101. 10, one or more actuators 903 can use rods 902 to move press members 705, 1305 in a direction 707a to press the substrate 101 engaged and supported by the substrate support device 403 with the press members 705, 1305, thereby applying a force to the substrate 101. As shown in FIGS. 8 and 10, the force applied by the press members 705, 1305 acts to compact the tilted stack 109 of the substrate 101.

[0077] 8, the substrates 101 can be pressed against the pressing members 705, 1305 of the compaction device 701, 1301 to compact the tilted stack 109 of substrates 101 while the substrates 101 remain engaged with and / or supported by the substrate support apparatus 403. Although not shown, in some alternative embodiments, the pressing members 705, 1305 of the compaction device 701, 1301 may contact the currently supported substrate only after the substrate support apparatus 403 has been decoupled from the substrate. However, decoupling the substrate support apparatus 403 from the substrate while the tilted substrate stack is being compacted by the compaction device can aid in removing the substrate support apparatus 403 from the tilted substrate stack while avoiding accidentally pulling one or more substrates off the tilted substrate stack when removing the substrate support apparatus. In effect, the pressing members 705, 1305 act to hold the supported substrates in place while the substrate support 403 is pulled away from the tilted stack 109 of substrates 101, thereby maintaining compaction and reducing accidental fanning of the substrate support 403 as it is pulled away from contact with the tilted stack of substrates 101. Figure 17 shows an embodiment in which the pressing members 705 of the compaction device 701, 1301 continue to press against the substrates outside the tilted stack 109 of substrates 101 as the substrate support 403 is pulled away.

[0078] FIG. 18 illustrates the compaction device 701, 1301 being released from the outer substrate of the tilted stack 109 of substrates 101. In some embodiments, the process includes performing one compaction cycle, in which the outer substrate of the stack is pressed once by the compaction device 701, 1301. After releasing the compaction device 701, 1301 (see FIG. 18), the substrate support apparatus 403 can then load an additional substrate onto the tilted stack 109 of substrates 101 and proceed as described above, performing one compaction cycle to compact the tilted stack 109 of substrates 101 again by the compaction device 701, 1301. The process then continues until a predetermined number of substrates have been stacked or a predetermined maximum fanning degree has been detected, indicating a complete stack.

[0079] In alternative embodiments, a substrate placed on the tilted substrate stack may be subjected to more than one compaction cycle. For example, after the pressing members 705, 1305 of the compaction device 701, 1301 have disengaged from a substrate outside the tilted stack 109 of substrates 101, the pressing members 705, 1305 may be extended again in the direction 707a as shown in Figure 17 to re-engage the pressing members 705, 1305 with the same substrate outside the stack for a second compaction cycle. In some embodiments, the method involves applying pressure to a substrate outside the tilted stack 109 of substrates 101 with the press members 705, 1305 of the compaction device 701, 1301 for a period of time to compact the tilted stack 109 of substrates 101, then restoring the compaction device 701, 1301 to apply pressure to the substrate for a period of time (e.g., by retracting the press members 705, 1305 as shown in FIG. 18 ), after which the compaction device 701, 1301 can again apply pressure to the same substrate along the compaction axis 901 (as shown in FIG. 17 ). In some embodiments, the substrate support apparatus can be decoupled from the outer substrate before this reapplication of pressure, and the pressure can be reapplication with the substrate support apparatus decoupled from the additional substrate (see, e.g., FIG. 17 ). In alternative embodiments, the substrate support apparatus can remain engaged with the outer substrate through two or more compaction cycles (see, e.g., FIG. 8 ).

[0080] 19 and 20 are graphs plotting the results of experiments comparing fanning (shown on the vertical Y-axis (e.g., in millimeters)) against the number of substrates (shown on the horizontal X-axis) in a tilted substrate stack. FIG. 19 shows the results of two experiments in which 330 substrates were stacked to form a tilted substrate stack. In these experiments, packaging performance was measured periodically after a certain number of substrates had been stacked. Graph 1901 shows the results of an experiment in which no compaction was performed, and graph 1903 shows the results of an experiment in which 1 square inch (approximately 645.2 mm) of compaction was applied to the bottom of the tilted substrate stack after each substrate was stacked. 21903) with no compaction (see graph 1901). As shown, comparing the stack with one compaction cycle (see graph 1903) with the stack with no compaction (see graph 1901), the single compaction cycle significantly reduced the fanning from over 7 millimeters (mm) to less than 4 mm.

[0081] Figure 20 shows the results of two experiments in which 110 substrates were stacked to form a tilted substrate stack. In these experiments, packaging performance was measured periodically after a certain number of substrates had been stacked. Graph 2001 shows the results of measuring the packaging performance by adding 1 square inch (approximately 645.2 mm) to the bottom of the tilted substrate stack after each substrate was stacked. 2 Graph 2003 shows the results of an experiment where a compaction cycle was performed with 30 pounds (207 kilopascals) applied per square inch (approximately 645.2 mm) of pressure applied to the bottom of the tilted substrate stack. 2 Two compaction cycles were performed, each applying 10 pounds (69 kilopascals) per 1000 sq m (12.5 sq ft) with a five second wait between compaction cycles. As shown in the figure, when comparing stacking after two compaction cycles (see graph 2003) with stacking after one compaction cycle (see graph 2001), stacking after two compaction cycles significantly reduced the fanning from 12 mm to approximately 6 mm.

[0082] Therefore, as shown in Figure 19, the bottom of the tilted stack is 1 square inch (approximately 645.2 mm 2A single compaction cycle applying 30 pounds (207 kilopascals) of pressure per slanted stack can reduce fanning compared to stacking without any compaction cycles. Furthermore, as shown in FIG. 20, two compaction cycles applying one-third of that pressure to the bottom of the tilted stack can further improve performance. In some embodiments, a single compaction cycle can be employed when it is desired to quickly build a substrate stack while improving fanning. Furthermore, two compaction cycles using lower pressures, one after each substrate in the tilted substrate stack, can further reduce fanning and reduce the risk of stress fractures during compaction, although this may increase the fabrication time of the substrate stack.

[0083] As mentioned above, one compaction cycle involves using a press member to compress 1 square inch (approximately 645.2 mm) of material into the tilted substrate stack. 2 ) can be applied, but in some embodiments, this pressure is applied to 1 / 2 inch (approximately 645.2 mm 2 ) to about 80 pounds (552 kilopascals) per square inch (approximately 645.2 mm ). 2 ) per square inch (approximately 645.2 mm). Also, as mentioned above, in each of the two compaction cycles, a press member is used to press the tilted substrate stack to a pressure of approximately 20 pounds (138 kilopascals) to approximately 40 pounds (276 kilopascals) per square inch (approximately 645.2 mm). 2 ) can be applied, but in some embodiments, this pressure is applied to 10 pounds per square inch (approximately 645.2 mm 2 ) to about 20 pounds (138 kilopascals) per square inch (approximately 645.2 mm ). 2) can be about 8 pounds (55 kilopascals) to about 12 pounds (83 kilopascals).

[0084] In some embodiments, the compaction axis 901 can be an axis extending along the outer surface of the press member 705, 1305. In further embodiments, the outer surface of the press member 705, 1305 can include the compaction axis 901, and compacting the tilted stack 109 of substrates 101 includes applying pressure along the compaction axis 901 to the substrates supported by the substrate support apparatus 403 with the compaction device 701, 1301. As shown in FIGS. 7 and 8 , when compacting the tilted stack 109 of substrates 101, the compaction axis 901 can be positioned along the bottom of the tilted stack of substrates 109. In some embodiments, this bottom of the tilted stack of substrates 109 can occupy the lower 50%, 40%, 30%, 20%, or 10% of the length “L” of the tilted stack 109 of substrates 101. Although not shown, the compaction axis 901 can also be located at the center or top of the tilted stack of substrates 109. In yet other embodiments, multiple press members may be provided at the bottom, middle, and / or top of the tilted substrate stack 109 .

[0085] In some embodiments, when compacting the tilted substrate stack, the compaction device can apply a substantially constant pressure along the length of the compaction axis. For example, as shown in FIG. 9 , in some embodiments, all of the actuators 903 can apply a substantially uniform force in the extension direction 707a to the press member 705, simultaneously engaging the entire outer surface of the press member 705 with the outer surfaces of the substrates 101 outside the tilted stack 109 (e.g., along the entire width “W” of the tilted substrate stack 109). As shown in FIG. 10 , the press member 705 can maintain a substantially constant compaction pressure along the width “W” of the tilted substrate stack 109, thereby providing uniform packaging along the width “W” of the tilted stack 109. In some embodiments, the press member 705 can be substantially rigid, allowing the portions of the press member 705 between the rods 902 to apply a uniform pressure to the other portions. In some embodiments, the press member 705 can include a material such as plastic or metal.

[0086] In some embodiments, when compacting the tilted substrate stack, the compaction device can apply varying pressure to the additional substrates along the compaction axis 901. For example, in some embodiments, the press member 705 can be flexible or segmented, allowing outer portions of the press member 705 to engage the outer substrates at different times. For example, as shown in FIGS. 11 and 12, the press member 705 can begin contacting one side edge of the outer substrate and then continue to sequentially engage the outer substrates across the width "W" until it reaches the other side edge. In alternative embodiments, the press member 705 can first engage a middle portion of the outer substrate and then continue to sequentially engage increasing portions of the outer substrates in opposite directions toward both sides of the outer substrate. This can squeeze gas (e.g., air) out of the stack, preventing pockets of gas that could trap gas within the stack and reducing fanning. In some embodiments, once engagement is complete, a constant pressure may be maintained across the width "W" of the tilted substrate stack 109 to uniformly compact the tilted stack 109.

[0087] In some embodiments, the method can include compacting without directly contacting the press member with the outer substrate. For example, as shown in FIG. 15 , the press member 1305 can have a plurality of holes 1501 designed to provide a fluid cushion between the press member 1305 and the outer substrate. In operation, gas (e.g., compressed air) can be introduced into the fluid pressure chamber 1601 through an inlet port. The fluid pressure chamber 1601 can then provide a uniform flow of compressed gas through the holes 1501, which are in fluid communication with the fluid pressure chamber. As shown, in some embodiments, the press member 1305 can include a plurality of segments 1307 a, 1307 b, and 1307 c. In some embodiments, each segment 1307 a, 1307 b, and 1307 c can be similarly constructed; however, in further embodiments, the segments can be differently constructed. Furthermore, while the figures show multiple segments, in further embodiments, a single segment can be provided. However, by providing multiple segments, the pressure in each pressure chamber 1601 of each segment can be controlled independently, allowing the flow rate of the pressurized gas passing through the holes 1501 to vary for each segment, thereby generating air cushions with different profiles for each segment. Providing multiple segments also allows each segment 1307a, 1307b, and 1307c to move independently in direction 707a, thereby allowing the pressing member 1305 to sequentially engage the outer substrates (e.g., to avoid gas trapping and excessive fanning). As shown in FIG. 14 , when compacting the tilted stack 109 of substrates 101, the pressing member 1305 can generate a fluid cushion 1401 (e.g., an air cushion) between the tilted stack 109 of substrates 101 and the pressing member 1305 of the compaction device 1301. In some embodiments, the fluid cushion 1401 can help apply a force against the tilted stack 109 of substrates 101 without actually making mechanical contact with any of the substrates.

[0088] While various embodiments have been described in detail above with reference to illustrative examples, it should be understood that the disclosure should not be considered limited thereto, and that numerous variations and combinations of the disclosed features can be made without departing from the scope of the appended claims.

[0089] Preferred embodiments of the present invention will be described below in detail.

[0090] Embodiment 1 A base and a plurality of suction devices, each suction device movably mounted to the base; a monitoring device configured to monitor the position of a suction device of the plurality of suction devices; A substrate support device comprising:

[0091] Embodiment 2 2. The substrate support apparatus of embodiment 1, wherein the monitoring device is configured to monitor the relative position of the suction device with respect to the base.

[0092] Embodiment 3 3. The substrate support apparatus of embodiment 1 or 2, wherein the monitoring device comprises an ultrasonic sensor.

[0093] Embodiment 4 4. The substrate support apparatus of embodiment 3, wherein the ultrasonic sensor is fixedly attached to the base.

[0094] Embodiment 5 5. The substrate support apparatus according to any one of embodiments 1 to 4, wherein each of the plurality of suction devices is movably attached to the base so as to translate relative to the base in an adjustment direction.

[0095] Embodiment 6 the plurality of suction devices comprises an array of suction devices; 6. A substrate support apparatus as described in embodiment 5, wherein each suction device in the suction device row is spaced apart from other suction devices in the suction device row along a row axis perpendicular to the adjustment direction.

[0096] Embodiment 7 7. A substrate support apparatus according to embodiment 5 or 6, wherein at least one suction device of the plurality of suction devices is independently movable relative to at least one further suction device of the plurality of suction devices.

[0097] Embodiment 8 1. A substrate packaging apparatus for packaging a tilted substrate stack, comprising: a substrate support structure configured to support the tilted substrate stack, the substrate support structure having a rear surface configured to support a major surface of a substrate in the tilted substrate stack, and a lower surface extending away from the rear surface and configured to support a lower edge of the substrate in the tilted substrate stack; a compaction device having a compaction axis extending in the width direction of the rear surface; A substrate package device comprising:

[0098] Embodiment 9 9. The substrate packaging apparatus of embodiment 8, wherein the compaction device comprises a plurality of actuators configured to apply force along the compaction axis to the bottom of the tilted substrate stack.

[0099] Embodiment 10 9. The substrate packaging apparatus of embodiment 8, wherein the compaction device comprises a plurality of actuators configured to apply a varying force along the compaction axis to the bottom of the tilted substrate stack.

[0100] Embodiment 11 11. The substrate package apparatus of embodiment 9 or 10, wherein at least one actuator of the plurality of actuators operates independently of at least one other actuator of the plurality of actuators.

[0101] Embodiment 12 9. The substrate packaging apparatus of embodiment 8, wherein the compaction device has a plurality of holes communicating with a fluid pressure chamber.

[0102] Embodiment 13 stacking a plurality of substrates on a substrate support structure to form a tilted substrate stack; imaging a feature of the tilted substrate stack; using information obtained from the imaging step to identify characteristics of the tilted substrate stack; A method comprising:

[0103] Embodiment 14 14. The method of embodiment 13, wherein the property of the tilted substrate stack comprises a fan-likeness of the tilted substrate stack.

[0104] Embodiment 15 stacking an additional substrate on the tilted substrate stack while the additional substrate is supported by a substrate support apparatus; 15. The method of embodiment 13 or 14, further comprising compacting the tilted substrate stack by engaging the additional substrate with a compaction device.

[0105] Embodiment 16 16. The method of embodiment 15, wherein in compacting the tilted substrate stack, the compaction device applies pressure along a compaction axis.

[0106] Embodiment 17 17. The method of claim 16, wherein in the step of compacting the tilted substrate stack, the compaction axis is positioned along a bottom of the tilted substrate stack.

[0107] Embodiment 18 18. The method of claim 16 or 17, wherein in compacting the tilted substrate stack, the compaction device applies a pressure to the additional substrate that varies along the compaction axis.

[0108] Embodiment 19 19. The method of any one of embodiments 15 to 18, wherein in the step of compacting the tilted substrate stack, the compaction device generates a fluid cushion between the additional substrate and the compaction device.

[0109] Embodiment 20 20. The method of any one of embodiments 15 to 19, wherein the compacting step is performed while the substrate support apparatus supports the additional substrate.

[0110] Embodiment 21 21. The method according to any one of embodiments 15 to 20, further comprising the step of detaching the substrate support apparatus from the additional substrate.

[0111] Embodiment 22 22. The method of embodiment 21, wherein the step of decoupling the substrate support apparatus from the additional substrate occurs during the step of compacting the tilted substrate stack with the compaction device.

[0112] Embodiment 23 23. The method of any one of embodiments 15-22, further comprising detaching the compaction device from the additional substrate.

[0113] Embodiment 24 24. The method of embodiment 23, further comprising re-engaging the additional substrate with the compaction device.

[0114] Embodiment 25 stacking the additional substrate on the tilted substrate stack with the substrate support device engaged with the additional substrate; identifying a characteristic of the tilted substrate stack with the substrate support apparatus while the additional substrate is engaged with the substrate support apparatus; A method comprising:

[0115] Embodiment 26 26. The method of embodiment 25, wherein in the step of stacking the additional substrates onto the tilted substrate stack, a plurality of suction devices of the substrate support apparatus are removably attached to the additional substrates.

[0116] Embodiment 27 27. The method of embodiment 26, wherein the step of identifying the characteristic comprises the step of moving one suction device of the plurality of suction devices relative to other suction devices of the plurality of suction devices.

[0117] Embodiment 28 28. The method of embodiment 27, wherein the step of identifying the characteristic comprises the step of monitoring the position of the one suction device.

[0118] Embodiment 29 29. The method of embodiment 28, wherein the position of the one suction device is monitored with an ultrasonic sensor.

[0119] Embodiment 30 30. The method of any one of embodiments 25-29, further comprising pressing the additional substrate with a compaction device to compact the tilted substrate stack.

[0120] Embodiment 31 31. The method of embodiment 30, wherein compacting the tilted substrate stack comprises applying pressure to the additional substrate with the compaction device along a compaction axis.

[0121] Embodiment 32 32. The method of claim 31, wherein in the step of compacting the tilted substrate stack, the compaction axis is positioned along a bottom of the tilted substrate stack.

[0122] Embodiment 33 33. The method of claim 31 or 32, wherein in compacting the tilted substrate stack, the compaction device applies a pressure to the additional substrate that varies along the compaction axis.

[0123] Embodiment 34 34. The method according to any one of embodiments 30 to 33, wherein in the step of compacting the tilted substrate stack, the compaction device generates a fluid cushion between the tilted substrate stack and the compaction device.

[0124] Embodiment 35 35. The method of any one of embodiments 30-34, wherein the compacting step is performed while the substrate support apparatus is engaged with the additional substrate.

[0125] Embodiment 36 pausing the application of pressure by the compaction device to the additional substrate for a period of time; 36. The method of any one of embodiments 30 to 35, further comprising the step of thereafter reapplying pressure along the compaction axis to the additional substrate with the compaction device.

[0126] Embodiment 37 and further comprising the step of decoupling the substrate support apparatus from the additional substrate before the step of reapplying pressure; 37. The method of embodiment 36, wherein the step of reapplying pressure is performed while the substrate support apparatus is detached from the additional substrate. [Explanation of symbols]

[0127] 101 Substrate 103a first principal surface 103b second principal surface 105, 401 Substrate packaging device 107 PCB support rack 109 tilted board stack 111 Rear 113 Rear plate 115 Bottom surface 117 Lower plate 119 Stand 120 Support surface 121, 403 Substrate support device 123, 405 Suction devices 125 Base 127 Sucker 129 Robot 131 Imaging device 133 Lighting Devices 135 Camera 137 processors 205 Marker 303 Output Devices 407a First adjustment direction 407b Second adjustment direction 409 Guide Rod 411 Surveillance Devices 413 Ultrasonic Sensor 415 Hatabe 503a, 503b side rails 505 Center Rail 701, 1301 Compaction Devices 703 Base member 705, 1305 Pressed parts 901 Compaction axis 902 Rod 903 Actuator 904, 1304 Contact device 1307a, 1307b, 1307c Segments of press members 1401 Fluid Cushion 1501 hole 1601 Fluid Pressure Chamber 1602 Inlet Port

Claims

1. A substrate support apparatus for stacking individual substrates one by one onto a substrate support structure to form an inclined substrate stack, the substrate support apparatus comprising: A base and a plurality of suction devices movably attached to the base for sucking the substrate; a monitoring device configured to monitor any position of a suction device of the plurality of suction devices; A substrate support apparatus wherein any position of each of the suction devices is monitored to identify characteristics including fanning of the tilted substrate stack.

2. The substrate support apparatus of claim 1 , wherein the monitoring device is configured to monitor a relative position of the suction device with respect to the base.

3. The substrate support apparatus of claim 1 or 2, wherein each of the plurality of suction devices is movably attached to the base so as to translate relative to the base in an adjustment direction.

4. A substrate support device as described in any one of claims 1 to 3, wherein the base has two side rails extending along the outer edge of the substrate, and the suction devices are arranged spaced apart from each other along the column axis of each side rail.

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