Probe board and probe card

Abstract

To provide a probe substrate capable of preventing fracture of a probe substrate body.SOLUTION: A probe substrate 17 is used for a probe card 11. The probe card 11 includes a main substrate part 12 having a circuit board 12a, and a bearing member 14 connected to the main substrate part 12. The probe substrate 17 includes a probe substrate body 13 having a first main surface S2a disposed opposite to the first main surface S1a of the circuit board 12a, and a stress relaxation film 18 disposed on the first main surface S2a of the probe substrate body 13 and bonded to the bearing member 14.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention provides a probe substrate. , and probe card Regarding. [Background technology]

[0002] As disclosed in Patent Document 1, a probe card is used to test the electrical characteristics of chips on a semiconductor wafer. The probe card has probes that contact electrodes of the chips on the semiconductor wafer. The probe card exchanges electrical signals between the chips on the semiconductor wafer and a tester device. One such probe card is known to include a main board portion having a circuit board, a probe board body to which the probes are connected, and a support member that supports the probe board body on the main board portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-200272 Summary of the Invention [Problem to be solved by the invention]

[0004] The probe substrate body of the above-mentioned probe card may be subjected to a tensile force from the support member connected to the probe substrate body, and in this case, there is a risk that the probe substrate body may be damaged due to the stress concentrated at the connection portion where the support member is connected to the probe substrate body.

[0005] An object of the present invention is to provide a probe substrate that can prevent damage to the probe substrate body. , and probe card The purpose is to provide [Means for solving the problem]

[0006] The probe substrate that solves the above problem is a probe substrate used in a probe card that includes a main substrate portion having a circuit board and a support member connected to the main substrate portion, and includes a probe substrate body having a main surface that is arranged to face the main surface of the circuit board, and a stress relaxation film that is provided on the main surface of the probe substrate body and adhered to the support member.

[0007] According to this configuration, when a tensile force is applied to the probe substrate from the support member of the probe card, the stress generated by the tensile force can be relieved by the stress relieving film. This reduces the stress concentrated on the probe substrate body. Therefore, even if a fine crack exists in the probe substrate body, the propagation of the crack can be suppressed.

[0008] In the above probe substrate, the probe substrate main body may be a glass ceramic substrate, and the stress relaxation film may be a synthetic resin film or a metal film. In the above probe substrate, the synthetic resin of the synthetic resin film may be at least one selected from polyimide resin, epoxy resin, acrylic resin, phenol resin, polycarbonate resin, urethane resin, and silicone resin.

[0009] In the probe substrate, the metal of the metal film may be at least one selected from Ni, Cu, and Au. In the above probe substrate, the composition of the glass ceramic may contain, in mass %, 20 to 70% of glass, 10 to 60% of Al2O3, and 20 to 70% of Zn2SiO4.

[0010] In the above probe substrate, the composition of the glass ceramic may contain, in mass %, 30 to 70% of glass and 30 to 70% of Al2O3. In the above probe substrate, the glass contained in the glass ceramic substrate may contain, in mass %, 50 to 80% of SiO2, 10 to 30% of B2O3, 1 to 10% of Li2O+Na2O+K2O, 5 to 30% of MgO+CaO+SrO+BaO, and 0 to 10% of TiO2.

[0011] In the probe substrate, the thickness of the stress relaxation film may be in the range of 1 μm or more and 100 μm or less. In the probe substrate, the stress relaxation film may be provided on the entire main surface of the probe substrate body.

[0012] In the above probe substrate, the stress relaxation film may be partially provided on the main surface of the probe substrate body in a manner corresponding to an adhesive portion that is to be adhered to the support member. [Effects of the Invention]

[0013] The present invention exhibits the effect of suppressing damage to the probe substrate body. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is an exploded cross-sectional view showing a probe card according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing a probe card. [Figure 3] 3 is an enlarged cross-sectional view of an area A in FIG. 2. FIG. [Figure 4] FIG. 10 is a cross-sectional view showing a probe substrate according to a modified example. [Figure 5] FIG. 10 is a perspective view partially showing a probe board and its mounting structure according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0015] An embodiment of a probe board and a probe card will be described below with reference to the drawings. Note that for the sake of convenience, some of the components may be exaggerated or simplified in the drawings. Furthermore, the dimensional ratios of the components may differ from the actual ratios.

[0016] <Overall configuration of the probe card> 1 and 2 is used to test the electrical characteristics of chips on a semiconductor wafer. The probe card 11 includes a main substrate portion 12 and a probe substrate body 13. The probe card 11 includes a plurality of probes P and a plurality of external electrodes (not shown).

[0017] The main board portion 12 of the probe card 11 has a circuit board 12a which serves as the main board of the probe card 11. The circuit board 12a is, for example, a disk-shaped printed wiring board. The circuit board 12a can be made of a well-known resin board, ceramic board, or the like. The circuit board 12a has a first main surface S1a facing the probe board body 13 and a second main surface S1b opposite to the first main surface S1a.

[0018] Each probe P of the probe card 11 is arranged corresponding to an electrode of a chip on the semiconductor wafer. The probe substrate body 13 has probe electrodes (not shown). The multiple probes P are connected to the multiple probe electrodes of the probe substrate body 13, respectively. Any metal material can be used as the probe material, and examples of such metal materials include palladium alloy, beryllium copper alloy, and tungsten alloy.

[0019] A plurality of external electrodes (not shown) of the probe card 11 are provided on the outer periphery of the second main surface S1b of the circuit board 12a. The above-mentioned plurality of probes P are electrically connected to the external electrodes of the circuit board 12a through the probe board body 13. The circuit board 12a is mounted on a tester device (not shown). The plurality of external electrodes of the circuit board 12a are electrically connected to the tester device.

[0020] The main board unit 12 of this embodiment has a reinforcing plate 12b for suppressing deformation of the circuit board 12a. The reinforcing plate 12b is attached to the second main surface S1b side of the circuit board 12a. The reinforcing plate 12b is preferably made of a material that is more rigid than the circuit board 12a. The reinforcing plate 12b can be made of a metal material such as stainless steel, for example.

[0021] The probe substrate body 13 has a first main surface S2a arranged to face the first main surface S1a of the circuit board 12a. The above-mentioned multiple probes P are provided on a second main surface S2b of the probe substrate body 13 opposite the first main surface S2a. That is, the second main surface S2b of the probe substrate body 13 has the above-mentioned multiple probe electrodes. The planar shape of the probe substrate body 13 can be, for example, a circular shape, a rectangular shape, or the like.

[0022] The probe substrate main body 13 is a wiring substrate that converts the wiring pitch, and is sometimes called a space transformer (ST) substrate. More specifically, the pitch of the multiple probe electrodes on the probe substrate main body 13 is narrower than the pitch of the multiple external electrodes on the circuit board 12a. In other words, by including the probe substrate main body 13 in the probe card 11, the multiple probes P can be arranged at a narrower pitch.

[0023] As described above, the tester device connected to the circuit board 12a of the probe card 11 measures the electrical characteristics of the chip by exchanging electrical signals with the chip. Based on the measurement results of the electrical characteristics of the chip, the tester device can determine whether the chip is good or bad.

[0024] <Probe board body mounting structure> The probe card 11 includes a support member 14 that supports a probe substrate main body 13. The support member 14 is connected to the main substrate portion 12. The support member 14 of this embodiment has a shaft portion 14a and a first end portion 14b and a second end portion 14c that are opposite ends of the shaft portion 14a. The shaft portion 14a of the support member 14 is disposed so as to penetrate the main substrate portion 12, and the first end portion 14b of the support member 14 is engaged with a reinforcing plate 12b of the main substrate portion 12. Examples of materials for the support member 14 include metal materials, resin materials, and ceramic materials.

[0025] As shown in FIGS. 1 to 3, the probe card 11 includes a stress relaxation layer 15 that is provided between the first main surface S2a of the probe substrate body 13 and the support member 14 and is bonded to the support member 14. The stress relaxation layer 15 of this embodiment includes a first stress relaxation layer 15a and a second stress relaxation layer 15b. The second stress relaxation layer 15b is disposed between the first stress relaxation layer 15a and the support member 14. The second stress relaxation layer 15b improves the adhesiveness between the stress relaxation layer 15 and the support member 14.

[0026] The stress relaxation layer 15 may be made of, for example, a material having a lower Young's modulus E than the material constituting the probe substrate body 13. From the viewpoint of further enhancing the stress relaxation effect, the Young's modulus E of the material constituting the stress relaxation layer 15 is preferably 200 [GPa] or less. From the viewpoint of suppressing excessive deformation of the stress relaxation layer 15, the Young's modulus E of the material constituting the stress relaxation layer 15 is preferably 2 [GPa] or more.

[0027] The linear expansion coefficient α of the material constituting the stress relaxation layer 15 is preferably in the range of 10 ppm / K to 25 ppm / K within the temperature range of -40°C to 125°C, for example.

[0028] 1 and 2, the probe card 11 includes a holding member 16 that holds the outer periphery of the probe substrate body 13 on the main substrate portion 12. The holding member 16 includes a holding portion body 16a having a support surface that supports the outer periphery on the second main surface S2b of the probe substrate body 13, and an attachment member 16b that attaches the holding portion body 16a to the main substrate portion 12. The attachment member 16b in this embodiment is a screw member that penetrates the main substrate portion 12 and screws into the holding portion body 16a. Note that the attachment member 16b may be, for example, a bolt and nut, or a rivet. The probe substrate body 13 and the circuit board 12a are electrically connected by relay connection pins (not shown).

[0029] <Probe board> Next, we will explain the probe substrate including the above-mentioned probe substrate main body 13. By bonding this probe substrate to the above-mentioned support member 14 using an adhesive, it is possible to arrange a stress relaxation layer 15 between the support member 14 and the probe substrate main body 13.

[0030] As shown in FIG. 1, the probe substrate 17 includes a probe substrate main body 13 and a stress relaxation film 18 provided on the first main surface S2a of the probe substrate main body 13. The probe substrate body 13 is, for example, a glass ceramic substrate. Glass ceramic contains glass and ceramic. An example of glass ceramic is low temperature co-fired ceramics (LTCC).

[0031] The glass preferably contains, in mass %, 50-80% SiO2, 10-30% B2O3, 1-10% Li2O+Na2O+K2O, 5-30% MgO+CaO+SrO+BaO, and 0-10% TiO2 as a glass composition, and more preferably contains 60-80% SiO2, 10-30% B2O3, 1-5% Li2O+Na2O+K2O, 5-20% MgO+CaO+SrO+BaO, and 0.1-3% TiO2. The glass composition may also contain, in mass %, 0.1-3% ZrO2 as another oxide.

[0032] Examples of ceramics include Zn2SiO4 (willemite), Al2O3 (alumina), cordierite, AlN (aluminum nitride), zirconium phosphate compounds, ZrSiO4 (zircon), ZrO2 (zirconia), TiO2 (titanium oxide), tin oxide (SnO2), β-quartz solid solution, β-eucryptite, β-spodumene, etc. One or more types of ceramics can be used.

[0033] The composition of the glass ceramics, in mass %, preferably contains 20 to 70% glass, 10 to 60% Al2O3, and 20 to 70% Zn2SiO4, more preferably 30 to 60% glass, 15 to 45% Al2O3, and 25 to 55% Zn2SiO4, and even more preferably 35 to 50% glass, 20 to 35% Al2O3, and 30 to 45% Zn2SiO4.

[0034] The glass ceramic may have a composition that does not contain Zn2SiO4. The glass ceramic preferably contains, in mass %, 30 to 70% glass and 30 to 70% Al2O3, more preferably 40 to 60% glass and 40 to 60% Al2O3, and even more preferably 45 to 55% glass and 45 to 55% Al2O3.

[0035] The probe substrate body 13 can be obtained by a well-known method of forming a circuit pattern using a ceramic green sheet, for example. The stress relaxation film 18 of the probe substrate 17 is adhered to the support member 14 of the probe card 11. The stress relaxation film 18 of this embodiment is adhered to the support member 14 by an adhesive layer 19 disposed between the stress relaxation film 18 and the support member 14.

[0036] The stress relaxation film 18 becomes the first stress relaxation layer 15a of the probe card 11. The stress relaxation film 18 of this embodiment is partially provided on the first main surface S2a of the probe substrate body 13, corresponding to an adhesive portion to be adhered to the support member 14.

[0037] The stress relaxation film 18 is preferably a synthetic resin film or a metal film. Examples of the synthetic resin for the synthetic resin film include at least one selected from polyimide resins, epoxy resins, acrylic resins, phenolic resins, polycarbonate resins, urethane resins, and silicone resins.

[0038] The synthetic resin film can be provided on the probe substrate body 13, for example, by a coating method in which a synthetic resin coating material is coated on the probe substrate body 13, or by a method in which a synthetic resin film obtained by separately forming a film is bonded.

[0039] The metal of the metal film may be at least one selected from the group consisting of Ni (nickel), Cu (copper), and Au (gold). The metal film may be provided on the probe substrate body 13 by, for example, a sputtering method, a plating method, a method of bonding a metal foil, or the like.

[0040] The thickness of the stress relaxation film 18, that is, the first stress relaxation layer 15a, is preferably in the range of 1 μm or more and 100 μm or less. The adhesive layer 19 becomes the second stress relaxation layer 15b of the probe card 11. The adhesive layer 19 can be formed by disposing an adhesive between the support member 14 and the stress relaxation film 18 and curing the adhesive. For example, if the stress relaxation film 18 is made of a polyimide-based resin, an epoxy resin-based adhesive can be used as the adhesive. That is, for example, the material of the first stress relaxation layer 15a may be a polyimide-based resin, and the material of the second stress relaxation layer 15b may be an epoxy-based resin. The thickness of the adhesive layer 19, i.e., the thickness of the second stress relaxation layer 15b, is preferably in the range of 1 μm or more and 100 μm or less.

[0041] <Function of the probe board> Next, the function of the probe substrate 17 will be described. In the probe substrate 17, the stress relaxation film 18 provided on the first main surface S2a of the probe substrate body 13 is adhered to the support member 14 of the probe card 11. With this configuration, when a tensile force is applied to the probe substrate 17 from the support member 14 of the probe card 11, the stress generated by the tensile force can be relaxed by the stress relaxation film 18. This makes it possible to reduce the stress concentrated on the probe substrate body 13. Therefore, for example, even if a fine crack exists in the probe substrate body 13, the propagation of the crack can be suppressed.

[0042] Next, an example of analysis performed by simulation will be described to explain the effect of reducing the stress concentrated on the probe substrate body 13. The simulation was performed using analysis software (Cybernet Systems Co., Ltd., product name: ANSYS Mechanical 2020R2).

[0043] (Analysis example 1) In analysis example 1, the material of the stress relaxation film 18 was polyimide (Young's modulus E: 2.5 [GPa], linear expansion coefficient α: 20 [ppm / K], and thickness t of the stress relaxation film 18: 10 [μm]). In analysis example 1, a model of the probe substrate 17 was set up in which this stress relaxation film 18 was provided on a glass ceramic substrate, which is the probe substrate main body 13. In analysis example 1, for this model, the stress generated in the glass ceramic substrate when the support member 14 bonded to the stress relaxation film 18 was pulled under predetermined conditions was analyzed. This analysis was performed under the following conditions for pulling the support member 14: 2200 N, 20°C (condition 1), 300 N, -30°C (condition 2), and 300 N, 115°C (condition 3). The analysis results of the stress in analysis example 1 are shown in Table 1.

[0044] (Analysis examples 2~8) In analysis examples 2 to 8, stress analysis was performed by changing the stress relaxation film 18 as shown in Table 1. Note that the composite material used for the stress relaxation film 18 in analysis example 8 was assumed to have the Young's modulus E of nickel and the linear expansion coefficient α of copper. The stress analysis results in analysis examples 2 to 8 are shown in Table 1.

[0045] (Analysis example 9) In analysis example 9, the stress relaxation film 18 was omitted, and the stress generated in the glass ceramic substrate when the tensile force exerted by the support member 14 directly on the glass ceramic substrate was analyzed. The analysis results of the stress in analysis example 9 are shown in Table 1.

[0046] [Table 1] As shown in Table 1, the stress values ​​in Analysis Examples 1 to 8 were lower than the stress value in Analysis Example 9. Furthermore, the results of Analysis Examples 1 to 4 show that the stress value decreases as the dimension of the thickness t of the stress relaxation film 18 increases.

[0047] Next, the operation and effects of this embodiment will be described. (1) The probe board 17 includes a probe board body 13 having a first main surface S2a arranged to face the first main surface S1a of the circuit board 12a of the probe card 11. The probe board 17 includes a stress relaxation film 18 provided on the first main surface S2a of the probe board body 13 and bonded to the support member 14. With this configuration, as described above, it is possible to reduce the stress concentrated on the probe board body 13. Therefore, it is possible to prevent damage to the probe board body 13.

[0048] (2) The stress relaxation film 18 of the probe substrate 17 is provided partially on the first main surface S2a of the probe substrate body 13, corresponding to the bonding portion that is bonded to the support member 14. In this case, for example, it is possible to reduce the material of the stress relaxation film 18.

[0049] (3) In the probe card 11, the stress relaxation layer 15 includes a first stress relaxation layer 15a and a second stress relaxation layer 15b. The second stress relaxation layer 15b is disposed between the first stress relaxation layer 15a and the support member 14, and enhances adhesion to the support member 14. In this case, the thickness of the stress relaxation layer 15 can be increased by the second stress relaxation layer 15b, which enhances adhesion between the support member 14 and the stress relaxation layer 15. This further reduces the stress concentrated on the probe substrate main body 13. Therefore, it becomes possible to further suppress damage to the probe substrate main body 13.

[0050] <Example of change> The above embodiment can be modified as follows: The above embodiment and the following modifications can be combined with each other within the scope of technical compatibility.

[0051] The number of stress relaxation films 18 on the probe substrate 17 may be different from the number of support members 14. For example, the stress relaxation film 18 may be provided in a strip shape, and multiple support members 14 may be attached to the stress relaxation film 18.

[0052] 4, the stress relaxation film 18 of the probe substrate 17 can be provided on the entire first main surface S2a of the probe substrate body 13. When the material of this stress relaxation film 18 is a synthetic resin such as a polyimide resin, the stress relaxation film 18 can be easily provided by, for example, spin coating a synthetic resin coating material.

[0053] The stress relaxation film 18 of the probe substrate 17 is adhered to the support member 14 by an adhesive layer 19, but the adhesive layer 19 can be omitted. That is, for example, if the stress relaxation film 18 is a synthetic resin film, the stress relaxation film 18 can be adhered to the support member 14 without using the adhesive layer 19. Note that examples of methods for adhering the stress relaxation film 18 to the support member 14 include a method of welding the stress relaxation film 18 to the support member 14 and a method utilizing a curing reaction of the stress relaxation film 18.

[0054] The end face shape of the second end 14c of the support member 14 is not particularly limited, and examples of the end face shape include a circle and a polygon. Furthermore, as shown in Fig. 5, the end face shape of the second end 14c of the support member 14 may be a frame shape. Furthermore, the stress relaxation film 18 of the probe substrate 17 may also be changed according to the end face shape of the second end 14c of the support member 14.

[0055] The number of support members 14 may be plural or may be single. The technical ideas that can be understood from the above-described embodiment and modified examples will be described. (Appendix 1) One aspect of the probe card that solves the above problem is a probe card that includes a main board portion having a circuit board, a probe board body having a main surface arranged to face the main surface of the circuit board, and a support member connected to the main board portion, and includes a stress relaxation layer that is provided between the main surface of the probe board body and the support member and is adhered to the support member.

[0056] (Note 2) In the above probe card, the stress relaxation layer may include a first stress relaxation layer and a second stress relaxation layer disposed between the first stress relaxation layer and the support member and enhancing adhesion to the support member. This configuration allows the thickness of the stress relaxation layer to be increased by the second stress relaxation layer enhancing adhesion between the support member and the stress relaxation layer. This further reduces stress concentration on the probe substrate body. [Explanation of symbols]

[0057] 11...Probe card 12...Main board section 12a...Circuit board 13...Probe board body 14...Support member 17...Probe board 18...Stress relaxation film

Claims

1. A probe board used in a probe card including a main board portion having a circuit board and a support member connected to the main board portion, a probe substrate body having a main surface arranged to face the main surface of the circuit board; a stress relaxation film provided on the main surface of the probe substrate body and bonded to the support member, the stress relaxation film is adhered to the support member by an adhesive layer disposed between the stress relaxation film and the support member, the stress relaxation film is a polyimide-based resin film, The probe substrate, wherein the adhesive layer is made of an epoxy resin.

2. 2. The probe substrate according to claim 1, wherein the probe substrate body is a glass ceramic substrate.

3. The composition of the glass ceramics is, in mass %, glass: 20 to 70%, Al ２ O ３ : 10 to 60%, and Zn ２ SiO ４ 3. The probe substrate according to claim 2, containing 20 to 70% of:

4. The composition of the glass ceramics is, in mass %, glass: 30 to 70%, and Al ２ O ３ 3. The probe substrate according to claim 2, containing 30 to 70% of:

5. The glass contained in the glass ceramic substrate has a glass composition of SiO in mass %. ２ : 50-80%, B ２ O ３ :10~30%, Li ２ O + Na ２ O+K ２ O: 1 to 10%, MgO + CaO + SrO + BaO: 5 to 30%, and TiO ２ 5. The probe substrate according to claim 2, wherein the content of the polyisocyanate is 0 to 10%.

6. 6. The probe substrate according to claim 1, wherein the stress relaxation film has a thickness in the range of 1 [mu]m or more and 100 [mu]m or less.

7. The probe board according to claim 1 , wherein the stress relaxation film is provided on the entire main surface of the probe board body.

8. The probe substrate according to claim 1 , wherein the stress relaxation film is provided on a portion of the main surface of the probe substrate body corresponding to the adhesive layer that adheres the support member.

9. A main board portion having a circuit board; a probe substrate body having a main surface arranged to face the main surface of the circuit board; a support member connected to the main substrate portion, a stress relaxation layer provided between the main surface of the probe substrate body and the support member and bonded to the support member; the stress relaxation layer includes a first stress relaxation layer and a second stress relaxation layer disposed between the first stress relaxation layer and the support member, the second stress relaxation layer enhancing adhesion to the support member; the first stress relaxation layer is a polyimide-based resin layer, The probe card, wherein the second stress relaxation layer is an epoxy-based resin layer.

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