Cooling of computer processing units

Abstract

Computer processing systems are cooled and other waste heat is extracted for space heating by providing a cooled dielectric liquid in the tank, which passes through an array of tubular housings to a manifold at the bottom of the tank, each tubular housing having an open upper and lower end and containing an array of circuit boards. The housings are contained within a partition sheet having an array of aligned openings in the housings that allow the liquid to pass through the manifold under little or no pressure, causing the liquid to flow through the housings by convection, stratifying and generating a layer of heated liquid above the open tops of the housings that can be removed to a heat exchanger. The liquid around the housings is not supplied by the manifold, and the power supplies for the circuit boards are contained within this body of liquid and are thereby cooled.

Description

[Technical Field]

[0001] The present invention relates to a computer processing unit, and in particular to an apparatus that includes a cooling tank to extract and utilize heat from the operation of the computer processing, keeping the unit cooled and allowing the heat to be transferred and utilized in another operation.

[0002] In this way, excess heat can be extracted and transferred to a heat exchanger, which allows the extracted heat to be used in many different areas, which may be: Commercial / industrial in-floor or geothermal hydronic heating systems greenhouse Agriculture Barn - Pig, Chicken and Dairy Heating hot water in larger industrial applications - car / truck washing Residential heating Grain drying Hemp drying / dehydration system Low Temperature Evaporation System Hemp industry, including heating and low-temperature dehydration Aquaculture equipment for heating water Underground mining operations - heating of tunnels Large swimming pool Including, but not limited to: [Background technology]

[0003] The device herein provides a unique device for space heating, which uses a computing chip as a substitute for a traditional heating element to create a regulated load resistance heater. The goal is to utilize lower commercial electricity rates and 100% renewable energy provided by electric utilities, particularly hydroelectric-based utilities, to perform two functions: first, to provide space heating, and second, to provide a means of cooling powerful computing for revenue-generating activities such as cryptocurrency mining or similar data processing.

[0004] In recent years, with the development of blockchain technology, it is now becoming clear that this new way of computing allows for more decentralized computing and offers greater possibilities for installing more robust and redundant data processing systems, simultaneously giving the ability to utilize all generated heat.

[0005] The present invention offers a space heating solution, particularly in colder climates. For example, many northern regions lack access to natural gas and are typically heated by electric boilers and / or fossil fuels. The present invention allows for a simple "quick-connect" option for efficient integration into existing hydronic systems. The boiler system can be installed as individual units or as a module containing multiple boilers to achieve the desired heat output. Boiler designs can be customized to any size, ranging from a single 20kW tank to a 400+kW system. The tank design allows it to be installed either standalone within existing infrastructure or housed in a containerized module.

[0006] Currently, traditional methods of cooling computers, servers, or mining rigs use air using high-volume fans, which creates significant issues with noise and dust control systems, corresponding to higher maintenance and installation costs. The system uses immersion cooling, which is not new in itself. However, the present invention allows for simplicity of installation and a very low cost per kilowatt. The tank design can also be adapted and modified, ensuring the system can keep up with the latest technologies entering the computing market. Summary of the Invention

[0007] According to the present invention there is provided a method for computer processing, said method comprising: providing a cooling liquid formed of a dielectric material into the tank; The tank includes a plurality of computer processing units, each computer processing unit being: an outer housing having a lower opening at a lower end and an upper opening at an upper end, the outer housing defining a closed peripheral wall between the upper and lower ends; at least one computer processing board supporting electrical components mounted within the outer housing that operate to perform computer processing operations while generating heat; the tank has a partition sheet therein, the partition sheet dividing the tank into a lower manifold below the partition sheet and a main portion of the tank above the sheet; The outer housing of each computer processing unit is The lower opening is located on the seat, and the peripheral wall is attached to the seat with the upper end separated from the partition sheet and standing upright in the tank, a plurality of liquid transfer opening devices in the sheet, each opening device associated with a respective one of the housings to allow liquid to enter the housing from the manifold and pass through the opening; introducing a cooling liquid into the manifold; positioning an upper surface of the liquid in the tank above an upper end of the outer housing; allowing the liquid to enter the outer housing through the opening arrangement, causing the liquid to rise within the housing by convection caused by heat within the housing, and allowing the liquid to exit the housing through the upper end into the tank; the liquid exiting the upper end of the housing forming a heated layer in the tank between the surface and the upper end; extracting the liquid from the formation; extracting heat from the extracted liquid to provide a heat supply and returning cooled liquid to the manifold.

[0008] Preferably, the upper ends are in a common plane that defines the lower part of the layer, improving the stratification of the liquid within the layer to extract the hottest areas of the tank. The depth of this zone can also be adjusted to accommodate different working fluid temperatures. The thicker the layer, the hotter the liquid.

[0009] Typically, the extracted liquid is returned to the manifold by a pump positioned to create a slight positive pressure, causing the liquid to flow substantially entirely through the housing by convection rather than positive flow. This again improves liquid stratification. No liquid enters the quiescent zone between the tubular housings, again allowing this area to concentrate heat in the stratified heated zone at the top of the tubular housings. The housing is preferably fully open at the top and bottom, allowing the peripheral walls to be fully open at each end, which creates the necessary flow through the housing.

[0010] That is, in one embodiment, the openings from the manifold through the divider sheet are located in the housings so that liquid enters only the housings and not between them, creating a quiescent zone.

[0011] In one embodiment, the openings each provide an array that is formed to match the interior shape of the housing to create a smooth flow upflow in the housing, so that, for example, if the housing is rectangular in cross section, the array is also rectangular and roughly matches the interior surface of the housing. For example, the array is formed by a series of parallel slots that extend roughly the same length as the dimension across the housing, although other arrays of holes can be used.

[0012] In one embodiment, the tank is dimensioned such that it includes housings arranged in rows and columns.

[0013] In one embodiment, the liquid is extracted through an opening on one side of the tank, which may be provided as a single opening connected to a single duct feeding a separate heat exchanger.

[0014] Preferably, the openings are located at a level above the top edge and below the top surface so as to extract only from the layer.

[0015] Preferably, the liquid can be a mineral oil, vegetable oil-based, or in some cases, a completely synthetic dielectric fluid. Preferably, the liquid is ---Density: near or within 0.92g / m3 (7.667 lbs / gal) ---Kinematic viscosity: 33-35mm 2 / s @ near or within 40°C, or 15cSt @ near or within 70°C, ---Dielectric breakdown: 2mm [kV] ≥ 35 (ASTM D6871) ---Boiling point: ≧360℃ ---Flash point: ≧265℃ (closed cup) ---Auto-ignition temperature: 401-404℃ (ASTM E659) ---Vapor pressure: near or within 0 PA @ ≦200℃ ---Thermal Conductivity: 0.15089 W / mK @ near or within 70℃ ---Specific heat: 2.3472 kJ / kgK @ near or within 70℃ It has one or more of the following characteristics:

[0016] Preferably, the dielectric liquid is selected with properties that result in very strong, layered temperature zones due to its inherent insulating properties.

[0017] Preferably, the dielectric liquid has properties that allow for maximum heat transfer, high working fluid temperatures (above 60 degrees Celsius) and efficient heat transfer.

[0018] Preferably, the flow of liquid to the manifold and through the housing is arranged so that the temperature of the bed is in the range of 10-60°C.

[0019] Preferably, the flow of liquid into the manifold and through the housing is arranged so that the temperature returning to the manifold is in the range of 30-85°C.

[0020] Preferably, each computer processing unit is associated with an adjacent power supply contained within a tank along with the associated housing, the power supply being located and cooled by the liquid between the housings without any flow from the manifold.

[0021] Preferably, the computer processing unit is shut down during peak demand situations.

[0022] Preferably, the computer processing unit is connected to a utility smart meter to help manage peak demand times.

[0023] Preferably, there is provided a U-shaped holder attached to the seat and arranged to hold the housing and the power supply supported upright.

[0024] Preferably, the tank has a head zone that also acts as an expansion area to accommodate fluctuations in liquid level. This head zone should be kept free of any moisture and equipped to filter out moisture as well as particulate matter.

[0025] Preferably, the tank is completely sealed and vapor-tight. A pressure relief check valve set at 1-2 PSI is installed to prevent any overpressure that could cause damage.

[0026] Preferably, the computing rig or processor used can be submerged without any modifications other than removing or disabling any installed fans. All air cooling devices or particles can remain intact.

[0027] The goal was to develop a very simple and cost-effective tank system to cool computing rigs or chips using a dielectric fluid with some properties that allow for maximum heat transfer, high working fluid temperatures (above 60 degrees Celsius) and efficient heat transfer. There are minimal to no moving parts in the tank. The result is a design that operates with just one small circulation pump, using approximately 300 watts of power, to pump the working fluid (dielectric fluid) through the heat exchanger.

[0028] To achieve a system with no moving or overly complex parts, the key was to minimize the modifications required to a traditional air-cooled computing rig, including utilizing a factory-fabricated aluminum chassis and power supply. We designed a CPU aluminum chassis or special holder to support the chassis upright (vertically), and a power supply to power each unit.

[0029] Another aspect of the tank design is the baffle plate, which allows the cooling working fluid to collect in the tank's "cool zone," below the baffle plate, where a circulating pump creates a slight positive pressure. The baffle plate has many precisely cut slots that direct the fluid into the housing or "tube" of each computing rig. The amount and size of the slots are determined based on the viscosity of the fluid and the maximum temperature that can be tolerated before any damage occurs to the computing chips. This is typically a maximum of 85 degrees Celsius. The housing or "tube" acts as a chimney and can be customized to accommodate any type of computing motherboard.

[0030] The combination of the cooling flow of working fluid passing through the baffle plate slots and being directed into the body or tubes of the aluminum mining rig provides a very strong thermodynamic pumping or chimney effect that efficiently moves the cooling working fluid from under the baffle plate through the tube structure and past the computing board containing the processing chips, helping to remove the intense heat generated.

[0031] As it exits the mining rig body or tubes, the high temperature working fluid collects at the top of the tank area or "hot zone." Another interesting part of this invention is that we can efficiently remove the high temperature working fluid with only one port, reducing complex baffle designs and costly manifold systems. We use the natural tendency of dielectric fluids to induce very strong stratified temperature zones due to their inherent insulating properties.

[0032] The design also allows the power supply, which is suspended high in the holder, to use the temperature of the "neutral zone" to cool the power supply (see drawing). Because the power supply does not generate as much heat as the main computing board or chips, less working fluid is needed to circulate through the unit.

[0033] The system is designed with a full modulation and remote control interface for standalone operation, including in northern regions of Canada and the U.S. It can also be linked to utility smart meters to help manage peak demand. The system can be designed to shut down during peak demand conditions.

[0034] Current tank designs can be suitable for residential environments to large industrial environments. [Brief explanation of the drawings]

[0035] One embodiment of the present invention will now be described in conjunction with the accompanying drawings.

[0036] [Figure 1] 1 is an isometric view of a complete fixture including a cooling tank, heat exchanger, heating load, electrical connections, and connections to a power utility according to the present invention. FIG. [Figure 2] FIG. 2 is an isometric view of a processing unit and power supply attached to a mounting bracket for installation inside the tank of FIG. 1. [Figure 3]FIG. 3 is an elevational view of the processing unit, power supply, and bracket of FIG. 2. [Figure 4] FIG. 3 is a plan view of the processing unit, power supply, and bracket of FIG. 2. [Figure 5] 5 is a cross-sectional view taken along line 5-5 in FIG. 1 showing the interior of the tank. [Figure 6] 6 is a cross-sectional view taken along line 6-6 of FIG. 4 showing the liquid passing through the plate into the interior of the tubular housing.

[0037] Reference characters in the drawings indicate corresponding parts in the different drawings. DETAILED DESCRIPTION OF THE INVENTION

[0038] The apparatus herein provides a tank (10) containing a cooling liquid (11) for cooling a plurality of circuit boards (12) and transferring heat therefrom to a load (13). The cooling liquid (11) is extracted from the tank through an outlet (14), passes through a heat exchanger (16), and returns to the tank through a return (15). A pump (17) is provided in circuit through the heat exchanger to induce flow in the liquid and generate low pressure at the return (15).

[0039] The tank comprises a rectangular parallelepiped with four upright sides (18), a top cover (19), and a base (20). This forms a closed container, and the tank has a head zone above the liquid level (11A) and below the top (19), which also acts as an expansion area to accommodate fluctuations in the liquid level. The head zone is kept free of any moisture by an extractor and a filter system (21) that filters not only the liquid but also any moisture particulate matter. The tank is therefore sealed and vapor-tight.

[0040] The liquid in the tank filling the area between the base (20) and the top layer (11A) acts as a cooling liquid made of a suitable dielectric material having the properties defined above.

[0041] The tank supports a superstructure (22) attached to end brackets (23) that connect the superstructure to the ends of the tank. The superstructure provides a rectangular housing containing the electronics necessary to control the operation of the circuit boards and communications necessary to operate the system. It includes a communications system (24) for communication with a power utility (25) that provides the power required for the processing system.

[0042] The tank (10) contains a plurality of computer processing units (30) arranged in an array of rows and columns within the tank. Each unit (30) includes an exterior tubular housing (31) defined by four rectangular sides (32) extending from a lower surface (33) to an upper surface (34). The upper and lower surfaces are generally open so that the housing forms a tubular duct through which liquid can pass freely from the lower surface to the upper surface. The housing is a conventional housing structure supplied by many computer processing suppliers, and typically, the processing boards (12) within the housing are cooled by airflow generated by fans at one or both ends of the housing. The fans are removed so that the existing housing, including the existing boards, is immediately cooled by the liquid. The housing thus defines a lower opening at the lower end, an upper opening at the upper end, and a closed peripheral wall between the upper and lower ends.

[0043] The computer processing boards supporting the electrical components mounted within the housing are arranged as parallel boards at spaced locations across the housing. These operate to perform computer processing operations in a conventional manner while generating heat. As is well known, the amount of processing power required for various high-intensity processing operations generates high levels of heat that must be removed, sufficient to cause significant space heating, especially in cold climates.

[0044] Each computer processing unit is associated with an adjacent power supply (35) in the form of a generally rectangular parallelepiped containing the conventional components of the processing unit (30). A seat-mounted, L-shaped holder bracket (36) is provided and arranged to hold the housing and the power supply upright. The bracket includes a horizontal base plate (37) that extends across the lower end (33) of the housing (31). An upright plate (38) connected to the base at its top end (36A) supports the power supply on its inner surface so that it is positioned adjacent to the housing (31), with both held generally parallel and slightly spaced apart. A connector (35A) runs from the power supply through the tank to an outlet gland (not shown) and to the superstructure control system.

[0045] The bracket (36) has a base (37) and an opening (37A) that exposes the lower end (12A) of the substrate (12) for allowing cooling liquid to enter the tubular housing (31) through the base (37). The opening is generally rectangular, with edges (37C) parallel to the sidewalls (32). However, triangular flanges (37B) are located at the corners for mounting similar flanges to the lower end (33) that is attached to the base (37). Thus, the housing (31) and the substrate (12) therein are mounted to the base (37), and the power supply (35) is mounted to a plate (38) that allows both to be mounted in columns and rows within the tank, as shown in FIG. 5.

[0046] The rectangular tank has a partition sheet (40) in the tank (10) parallel to the base (20), said partition sheet (40) dividing the tank into a lower manifold (41) below the partition sheet (40) and in the base (20) and the main part of the tank (42) above the sheet (40).

[0047] Brackets (36) are secured to the bottom sheets (40) of the rows and columns, so that the outer housing (31) of each computer processing unit is The opening at the lower end (33) is positioned on the sheet (40), and the peripheral wall (32) is attached to the sheet (40) in an upright position in the tank up to the upper end (34) away from the partition sheet (40). .

[0048] To allow cooling liquid to pass from the manifold 41 to each housing 32, a plurality of liquid transfer aperture devices 44 are provided in the sheet, each aperture device 44 associated with a respective one of the housings 31 to allow liquid to enter the housing 31 from the manifold 41 and pass into the housing through opening 37A. As liquid enters the manifold through return 15 and expands in the manifold, there are aperture devices 44 for passage into the housing. As shown, aperture devices 44 include rows of parallel, spaced-apart slots 44A, 44B, and 44C that form an area generally corresponding to the area of ​​opening 37A, such that the slots are of a length corresponding to the width of the housing 31.

[0049] The depth of the liquid is positioned so that the upper surface (11A) of the liquid in the tank is below the top wall (19) and above the upper end (35) of the outer housing (31).

[0050] Liquid thus acts to enter the outer housing through opening devices 44, each of which provides an array shaped to match the interior shape of the housing, creating a smooth flow upward in the housing, causing it to rise within the housing by convection currents caused by heat within the housing, and exit the housing through top end 34 into tank 10. This causes the liquid to exit top end 34 of the housing forming a heated layer 11B in the tank between surface 11A and top end 34.

[0051] The liquid in the heated layer (11B) is extracted through an outlet (14) located entirely within the layered layer, thereby ensuring that substantially only the heated layered layer is removed.

[0052] The upper ends (34) all lie in a common plane that defines the lower portion of layer (11B), as shown in Figure 6. The extracted liquid is returned to the manifold by a pump positioned to create a slight positive pressure, thereby causing the liquid to flow substantially entirely through the housing (31) by convection.

[0053] As explained above, opening device (44) is located in housing (31) so that liquid only enters housing (31) and does not enter between the housings where the power supply is sufficiently cooled only by having stationary liquid between the housings and where little cooling is required since any heated liquid will rise to stratified layer (11B).

[0054] The dielectric liquid is selected for its properties that result in very strong stratified temperature zones due to its inherent insulating properties, allowing for maximum heat transfer, high working fluid temperatures (above 50 degrees Celsius) and efficient heat transfer.

Claims

1. 1. A method for computer processing, said method comprising: providing a cooling liquid formed of a dielectric material into the tank; the tank includes a plurality of computer processing units; each of the plurality of computer processing units comprises an outer housing having a lower opening at a lower end of the computer processing unit and an upper opening at an upper end of the computer processing unit, the outer housing defining a closed peripheral wall of the computer processing unit between the upper end of the computer processing unit and the lower end of the computer processing unit; each of the plurality of computer processing units includes electrical components mounted within the outer housing of the computer processing unit that operate to perform computer processing operations while generating heat; the tank has a partition sheet therein, the partition sheet dividing the tank into a lower manifold below the partition sheet and a main portion of the tank above the partition sheet; the outer housing of each computer processing unit is attached to the divider sheet in the tank with the lower opening of the computer processing unit positioned on the divider sheet and the peripheral wall of the computer processing unit positioned upright in the tank with the upper end of the computer processing unit spaced from the divider sheet in the tank; a plurality of liquid transfer opening devices in the partition sheet in the tank, each of the liquid transfer opening devices associated with a respective one of the outer housings of the plurality of computer processing units to allow the cooling liquid to enter the outer housing of the computer processing unit from the lower manifold of the tank and pass through the lower opening of the computer processing unit; introducing the cooling liquid into the lower manifold of the tank; positioning an upper surface of the cooling liquid in the tank above an upper edge of the outer housing of the computer processing unit; allowing the cooling liquid to enter the outer housing of the computer processing unit through the liquid transfer opening device in the partition sheet, causing the cooling liquid to rise within the outer housing by convection caused by heat within the outer housing, and causing the cooling liquid to exit the outer housing through the top end of the computer processing unit and into the tank; the cooling liquid exiting the top end of the outer housing of the computer processing unit so as to form a heated layer within the tank between the top surface of the cooling liquid and the top end of the outer housing of the computer processing unit; extracting the cooling liquid from the heated layer; extracting heat from the extracted cooling liquid to provide a heat supply and returning the cooling liquid to the lower manifold of the tank when the cooling liquid has cooled.

2. The method of claim 1 , wherein the upper ends of the outer housings lie in a common plane that defines a lower portion of the heated layer.

3. 3. The method of claim 1, wherein the extracted cooling liquid is returned to the lower manifold by a pump.

4. The method of claim 3 , wherein the pump is positioned to create a slight positive pressure such that the cooling liquid is forced through the outer housing substantially entirely by convection.

5. The method of any one of claims 1 to 4, wherein the liquid transfer opening device is located below the outer housings such that the cooling liquid enters only into the outer housings and not between the outer housings.

6. 6. The method of claim 1, wherein each of the liquid transfer opening devices is provided with an array configured to match the internal shape of the outer housing to generate a smooth flow rise in the outer housing.

7. The method of claim 6 , wherein the outer housing is rectangular in cross section and the array is rectangular.

8. 8. The method of claim 6 or 7, wherein the array is formed by a series of parallel slots.

9. The method of any one of claims 1 to 8, wherein the outer housings are arranged in rows and columns.

10. 10. The method of any one of claims 1 to 9, wherein the cooling liquid is extracted through an outlet on one side of the tank.

11. The method of claim 10 , wherein the outlet is positioned at a height above the top end of the outer housing and below the top surface of the cooling liquid such that the cooling liquid is extracted only from the heated layer.

12. 12. The method of any one of claims 1 to 11, wherein the cooling liquid is mineral oil.

13. The cooling liquid is Density: near or within 0.92 g / m3 (7.667 lbs / gal) Kinematic viscosity: 33-35mm ２ / s @ near or within 40°C, or 15 cSt @ near or within 70°C Dielectric breakdown: 2 mm [kV] ≥ 35 (ASTM D6871) Boiling point: ≧360℃ Flash point: ≧265℃ (closed cup) Auto-ignition temperature: 401-404°C (ASTM E659) Vapor pressure: near or within 0 PA @ ≦200°C Thermal Conductivity: 0.15089 W / mK @ near or in the range of 70°C Specific heat: 2.3472 kJ / kgK @ near or in the range of 70°C 13. The method of claim 1, wherein the method has one or more of the following characteristics:

14. The method described in claim 13, wherein the cooling liquid is selected with properties that result in very strong stratified temperature zones due to its inherent insulating properties.

15. The method described in claim 13, wherein the cooling liquid has properties that allow maximum heat transfer, high working fluid temperatures (above 50 degrees Celsius) and efficient heat transfer.

16. 16. The method of any one of claims 1 to 15, wherein the flow of cooling liquid to the lower manifold and through the outer housing is arranged such that the temperature of the heated layer is in the range of 10-60°C.

17. 17. The method of any one of claims 1 to 16, wherein the flow of cooling liquid to the lower manifold and through the outer housing is arranged such that the temperature returned to the lower manifold is in the range of 30-85°C.

18. 18. The method of any one of claims 1 to 17, wherein each computer processing unit is associated with an adjacent power supply contained within the tank along an associated outer housing, the power supply being located and cooled by the cooling liquid between the outer housings without any flow from the lower manifold.

19. 19. The method of any one of claims 1 to 18, wherein the computer processing unit is shut down during peak demand situations.

20. 20. The method of any one of claims 1 to 19, wherein the computer processing unit is connected to a utility smart meter that helps manage peak demand times.

21. 20. The method of claim 18, further comprising providing a U-shaped holder attached to the divider sheet and positioned to hold the outer housing and the power supply in an upright position.

22. 21. The method of any one of claims 1 to 20, wherein the tank has a head zone above the cooling liquid that also acts as an expansion area to accommodate fluctuations in liquid level.

23. 23. The method of claim 22, wherein the head zone is kept free of any moisture and includes a filter system that filters out moisture as well as particulate matter.

24. 23. The method of claim 22, wherein the tank is sealed and vapor-tight.

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