Sound Generator

Abstract

An acoustic generating unit according to one or more embodiments of the present specification includes a diaphragm, a magnetic circuit assembly, a coil, a support frame arranged to surround the magnetic circuit assembly, and a housing, the coil is connected to the diaphragm and at least a portion of which is located in a magnetic gap formed by the magnetic circuit assembly, the coil vibrates the diaphragm by passing current through it to generate sound, the diaphragm includes a main body region and an edge region surrounding the main body region, the support frame is connected to a portion of the edge region away from the main body region, a plurality of air vents are formed in the support frame, a decompression hole is provided in the housing, sound from the back side of the diaphragm is transmitted to the decompression hole through the plurality of air vents, the plurality of air vents include at least a first air vent and a second air vent, the distance from the center of the first air vent to the center of the decompression hole is greater than the distance from the center of the second air vent to the center of the decompression hole, and the area of ​​the first air vent is greater than the area of ​​the second air vent.

Description

[Technical Field]

[0001] The present specification relates to the field of acoustics, and in particular to acoustic generating units.

[0002] [Incorporated by reference] This application claims priority to a Chinese patent application having application number 202211336918.4 filed on October 28, 2022, and application number 202223239628.6 filed on December 1, 2022, and application number PCT / CN2022 / 144339 filed on December 30, 2022, the entire contents of which are incorporated herein by reference. [Background technology]

[0003] With the development of audio output technology, audio generating units (e.g., earphones) are widely used in people's daily lives, and by using them with electronic devices such as mobile phones and computers, users can enjoy a feast of hearing. The output performance of an audio generating unit has a significant impact on the user's comfort level. The structure of the diaphragm in an audio generating unit and the supporting structure cooperating with the diaphragm usually affect the output performance of the audio generating unit. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, it is necessary to provide a sound generating unit with high output performance. [Means for solving the problem]

[0005] An acoustic generating unit according to an embodiment of the present specification includes a diaphragm, a magnetic circuit assembly, a coil, a support frame surrounding the magnetic circuit assembly, and a housing, wherein the coil is connected to the diaphragm and at least a portion of the coil is located in a magnetic gap formed by the magnetic circuit assembly, and when current is applied to the coil, the diaphragm vibrates to generate sound, the diaphragm includes a main body region and an edge region surrounding the main body region, the support frame is connected to a portion of the edge region away from the main body region, a plurality of air vents are provided in the support frame, and pressure reduction holes are provided in the housing, and sound from the back of the diaphragm is transmitted to the pressure reduction holes through the plurality of air vents, the plurality of air vents including at least a first air vent and a second air vent, the distance from the center of the first air vent to the center of the pressure reduction hole is greater than the distance from the center of the second air vent to the center of the pressure reduction hole, and the area of ​​the first air vent is greater than the area of ​​the second air vent.

[0006] In some embodiments, the main body region includes a first inclined portion and a first connection portion connected to the coil, the first inclined portion being bonded to a portion of the edge region, and the first inclined portion being inclined in a direction away from the coil relative to the first connection portion.

[0007] In some embodiments, the edge region includes a second beveled portion, the second beveled portion being at least partially bonded to the first beveled portion.

[0008] In some embodiments, the second tapered portion is located on a side of the first tapered portion away from the coil.

[0009] In some embodiments, the edge region includes an arcuate portion, and the ratio of the height of the arcuate portion to the span of the arcuate portion is in the range of 0.35 to 0.4.

[0010] In some embodiments, the inclination angle of the first inclined portion relative to the first connecting portion is within a range of 5° to 30°, and the first connecting portion is perpendicular to the vibration direction of the vibrating membrane.

[0011] In some embodiments, the main body region includes a dome located at one end of the first connecting portion away from the first inclined portion, the span of the dome being in the range of 2 mm to 8 mm, and the height of the dome being in the range of 0.7 mm to 1.2 mm.

[0012] In some embodiments, the height to span ratio of the dome is in the range of 0.1 to 0.3.

[0013] In some embodiments, the frequency at which the high frequency splitting vibrations appear is 20 kHz or greater.

[0014] In some embodiments, the magnetic circuit assembly includes a housing member, and the distance from the bottom of the coil to the bottom of the housing member is in the range of 0.8 mm to 0.9 mm for an input voltage of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz.

[0015] In some embodiments, the acoustic generating unit further includes a support frame arranged to surround the magnetic circuit assembly, and a first portion of the support frame is connected to the second connection portion of the edge region.

[0016] In some embodiments, the second connection portion of the edge region is connected to the first portion of the support frame by a fixing ring.

[0017] In some embodiments, the thickness of the first portion connected to the edge region of the support frame is in the range of 0.3 mm to 3 mm, and the thickness of the first portion is the minimum distance in the vibration direction of the vibrating membrane between the connection area between the support frame and the edge region and the area of ​​the support frame that is directly bonded to the magnetic circuit assembly.

[0018] In some embodiments, a decompression hole is provided in the housing, a back cavity is formed between the decompression hole and a rear surface of the vibrating membrane, and the resonance frequency of the back cavity is 3.3 kHz or more.

[0019] In some embodiments, the volume of the back cavity is 60 mm 3 ~110mm 3 is within the range.

[0020] In some embodiments, the sound generating unit further includes a housing having a decompression hole, a plurality of ventilation holes are formed in the support frame, sound from the back of the diaphragm is transmitted to the decompression hole through the plurality of ventilation holes, and in the vibration direction of the diaphragm, the ratio of the total area of ​​the plurality of ventilation holes to the projected area of ​​the diaphragm is in the range of 0.008 to 0.3.

[0021] In some embodiments, the projected area of ​​the diaphragm in the direction of vibration of the diaphragm is 90 mm 2 ~560mm 2 and the total area of ​​the plurality of vent holes is within the range of 4.54 mm 2 ~12.96mm 2 is within the range.

[0022] In some embodiments, the sound generating unit further includes a housing, and a ratio of a projected area of ​​the diaphragm to a projected area of ​​the housing in a vibration direction of the diaphragm is 0.5 or more.

[0023] In some embodiments, the ratio of the projected area of ​​the diaphragm to the projected area of ​​the housing in the vibration direction of the diaphragm is in the range of 0.8 to 0.95.

[0024] In some embodiments, the diaphragm has a major axis dimension in the range of 13 mm to 25 mm and a minor axis dimension in the range of 4 mm to 13 mm.

[0025] In some embodiments, a plurality of ventilation holes are formed in the bottom wall of the housing member of the magnetic circuit assembly or in the side wall attached to the support frame.

[0026] In some embodiments, the dome is woven from interlaced carbon fibers, at least some of the carbon fibers interlacing at a first angle in the range of 45° to 90°.

[0027] In some embodiments, the thickness of the dome in the direction of vibration of the membrane is less than 80 μm.

[0028] In some embodiments, the minimum distance from the coil to the first tapered portion is greater than or equal to 0.3 mm.

[0029] In some embodiments, the magnetic circuit assembly includes a magnetically permeable plate and a magnet, the magnetically permeable plate is located between the magnet and the vibration membrane and is attached to the surface of the magnet, and the distance between the center of the coil and the center of the magnetically permeable plate in the vibration direction of the vibration membrane is less than 0.3 mm.

[0030] In some embodiments, the distance from the lowest point of the dome to the upper surface of the magnetically permeable plate in the direction of vibration of the diaphragm is greater than 0.8 mm.

[0031] In some embodiments, the magnetic circuit assembly includes a housing member, and the distance between the bottom of the coil and the bottom wall of the housing member in the vibration direction of the vibrating membrane is within a range of 0.2 mm to 4 mm.

[0032] In some embodiments, the distance between the coil and the sidewall of the housing member is in the range of 0.1 mm to 0.5 mm.

[0033] The present specification will be further illustrated by exemplary embodiments, which are not limiting and will be described in detail with reference to the drawings, in which like reference numerals refer to like structures. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. [Figure 2] 1 is an exemplary schematic wearing diagram of an open-type earphone according to some embodiments of the present disclosure. [Figure 3] 1 is an exemplary schematic wearing diagram of an open-type earphone according to some embodiments of the present disclosure. [Figure 4] FIG. 10 is an exemplary wearing diagram of another open-type earphone in accordance with some embodiments of the present disclosure. [Figure 5] 10 is an exemplary schematic distribution diagram of a cavity structure placed around one of the dual sound sources, according to some embodiments herein. FIG. [Figure 6] 1 is a schematic diagram of an exemplary internal structure of a sound-generating unit according to some embodiments herein. [Figure 7] 1 is an exemplary external view of a transducer according to some embodiments of the present disclosure. [Figure 8] FIG. 2 illustrates an exemplary exploded view of a transducer in accordance with some embodiments herein. [Figure 9] 1 is a diagram illustrating an example internal structure of a sound generating unit according to some embodiments of the present disclosure. [Figure 10] 1 is an exemplary structural diagram of a diaphragm according to some embodiments of the present disclosure. [Figure 11A] 1 is a schematic diagram of an exemplary high frequency bandwidth of an acoustic generating unit according to some embodiments herein. [Figure 11B] FIG. 2 is a schematic diagram of an exemplary carbon fiber weave structure according to some embodiments herein. [Figure 12] 10A-10C are schematic diagrams of the amplitude of an acoustic generator at different driving voltages according to some embodiments herein. [Figure 13] 1A-1C are exemplary structural diagrams of back cavities according to some embodiments herein. [Figure 14] 10A-10C illustrate frequency response curve diagrams of the back cavity corresponding to different thicknesses of the first portion, according to certain embodiments herein. [Figure 15] 10A-10C are frequency response curve diagrams of an acoustic generator at different driving voltages, according to some embodiments herein. [Figure 16] 1 is an exemplary schematic location diagram of a support frame, a first decompression hole, and a second decompression hole, according to some embodiments herein; [Figure 17] 10A-10C illustrate frequency response curves of a back cavity corresponding to different total areas of vent holes, according to certain embodiments herein. DETAILED DESCRIPTION OF THE INVENTION

[0035] In order to more clearly describe the technical means of the embodiments of the present specification, the drawings necessary for describing the embodiments will be briefly described below. Obviously, the drawings described below are only a part of the examples or embodiments of the present specification, and those skilled in the art can apply the present specification to other similar scenarios based on these drawings without any creative effort. Unless otherwise clear from the language environment or otherwise described, the same symbols in the drawings represent the same structures or operations.

[0036] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are ways of distinguishing between various assemblies, elements, components, parts, or structures at different levels, however, other terms may be used in place of the above terms if they achieve the same purpose.

[0037] As used in this specification and claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "containing" are intended to indicate only the inclusion of explicitly identified steps and elements; these steps and elements are not an exclusive list, and a method or apparatus may include other steps or elements.

[0038] It should be noted that in the description of this specification, the terms "first," "second," "third," "fourth," etc. are for descriptive purposes only and should not be understood as indicating or suggesting relative importance or implicitly indicating the quantity of the technical features indicated. Therefore, a feature qualified by "first," "second," "third," or "fourth" can explicitly or implicitly indicate the inclusion of at least one of the feature. In the description of this specification, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0039] In this specification, unless otherwise clearly specified or limited, the terms "connected," "fixed," etc. should be understood in a broad sense. For example, unless otherwise clearly limited, the term "connected" may mean a fixed connection, a detachable connection, or an integral connection, a mechanical connection, or an electrical connection, a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art will be able to understand the specific meanings of the above terms in this specification depending on the specific circumstances.

[0040] Flowcharts are used herein to describe operations performed by systems according to embodiments of the present invention. It should be understood that the preceding and following operations are not necessarily performed in exact order. Instead, steps may be processed in reverse order or simultaneously. Also, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0041] FIG. 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. As shown in FIG. 1 , ear 100 may include ear canal 101, cavity of the concha 102, concha navicularis 103, triangular fossa 104, antihelix 105, scapha 106, helix 107, earlobe 108, and crus helicalis 109. In some embodiments, placement and stability of an acoustic device can be achieved through one or more regions of ear 100. In some embodiments, regions such as ear canal 101, cavity of the concha 102, concha navicularis 103, and triangular fossa 104 have certain depths and volumes in three-dimensional space, and can achieve the placement needs of an acoustic device. For example, an acoustic device (e.g., an in-ear earphone) may be placed in ear canal 101. In some embodiments, placement of an acoustic device can be achieved through regions of ear 100 other than ear canal 101. For example, the acoustic device can be placed in the concha scapula 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, and the helix 107, or a combination thereof. In some embodiments, the user's earlobe 108 may be further utilized to improve the comfort and reliability of the acoustic device. The placement of the acoustic device and sound propagation can be achieved through other parts of the ear 100 besides the ear canal 101, "opening" the user's ear canal 101 and reducing the impact of the acoustic device on the user's ear health. When a user wears the acoustic device on the road, the acoustic device does not block the user's ear canal 101, allowing the user to hear sounds from the acoustic device as well as sounds from the environment (e.g., horns, bicycle bells, voices of people around, traffic control, etc.), thereby reducing the likelihood of a traffic accident. For example, when a user wears the acoustic device, all or part of the structure of the acoustic device may be located anterior to the crus helix 109 (e.g., area J surrounded by a dashed line in FIG. 1 ). Also, for example, when a user is wearing an acoustic device, all or part of the structure of the acoustic device may contact the upper part of the ear canal 101 (e.g., at one or more locations such as the crus helix 109, the navicularis concha 103, the triangular fossa 104, the antihelix 105, the scapha 106, and the helix 107).Furthermore, for example, when a user is wearing an acoustic device, all or part of the structure of the acoustic device may be located within one or more parts of the ear (e.g., the concha cavity 102, the concha navicularis 103, and the triangular fossa 104, etc.) (e.g., areas M1 and M2 surrounded by dashed lines in Figure 1).

[0042] Furthermore, different users may have individual differences, resulting in differences in ear shape, size, and other dimensions. For ease of explanation and understanding, unless otherwise specified, this specification primarily uses an ear model having a "standard" shape and dimensions as a reference, and further describes the fitting method of an acoustic device to the ear model in different embodiments. For example, a simulator including a head and its (left and right) ears manufactured in accordance with ANSI:S3.36, S3.25, and IEC:60318-7 standards, such as GRAS KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, can be used as a reference for fitting an acoustic device, thereby representing the scenario in which most users normally wear an acoustic device. Taking GRAS KEMAR as an example, the ear simulator may be any of GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG. Taking HEAD Acoustics as an example, the ear simulator may be any of the HMS II.3, HMS II.3 LN, HMS II.3LN HEC, etc. In the examples herein, the measured data range is based on GRAS 45BC KEMAR. However, it should be understood that there may be differences between different head and ear models, and that for other models, there may be a ±10% variation in the relevant data range. By way of example only, the reference ear may be characterized in that the vertical axis dimension of the projection of the pinna onto the sagittal plane may be within the range of 49.5 mm to 74.3 mm, and the sagittal axis dimension of the projection of the pinna onto the sagittal plane may be within the range of 36.6 mm to 55 mm. The projection of the pinna onto the sagittal plane refers to the projection of the edge of the pinna onto the sagittal plane. The edge of the pinna includes at least the outer contour of the helix, the contour of the earlobe, the contour of the tragus, the intertragal notch, the antitragal apex, the antitragal helical notch, etc. Therefore, the terms "worn by a user," "in a worn state," and "in a worn state" in this application may refer to the acoustic device described in this application being worn on the ears of the simulator.Naturally, taking into account the individual differences between different users, the structure, shape, size, thickness, etc. of one or more parts of the ear 100 can be differentiated to suit ears of different shapes and dimensions, and these differentiated designs can be expressed to suit different ears by having different ranges of numerical values ​​for the characteristic parameters of one or more parts of the acoustic device (e.g., the sound generating unit, ear hook, etc. described below).

[0043] In fields such as medicine and anatomy, three basic cutting planes of the human body—the sagittal plane, the coronal plane, and the horizontal plane—and three basic axes—the sagittal axis, the coronal axis, and the vertical axis—can be defined. The sagittal plane is a cutting plane perpendicular to the ground along the front-to-back direction of the body, dividing the body into two parts, left and right. The coronal plane is a cutting plane perpendicular to the ground along the left-to-right direction of the body, dividing the body into two parts, front and back. The horizontal plane is a cutting plane parallel to the ground along the up-down direction of the body, dividing the body into two parts, top and bottom. Accordingly, the sagittal axis is an axis perpendicular to the coronal plane along the front-to-back direction of the body, the coronal axis is an axis perpendicular to the sagittal plane along the left-to-right direction of the body, and the vertical axis is an axis perpendicular to the horizontal plane along the up-down direction of the body. Furthermore, the term "anterior side of the ear" as used herein refers to the side of the ear along the sagittal axis and toward the face of the human body. When the ear of the simulator is viewed from the direction along the coronal axis of the human body, a schematic diagram of the anterior contour of the ear is obtained as shown in FIG. 1.

[0044] The above description of the ear 100 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, some structures of the acoustic device may block part or all of the ear canal 101. These changes and modifications still fall within the scope of protection of the present application.

[0045] FIG. 2 is an exemplary schematic view of an open-type earphone according to some embodiments of the present disclosure. FIG. 3 is an exemplary schematic view of an open-type earphone according to some embodiments of the present disclosure. FIG. 4 is an exemplary view of another open-type earphone according to some embodiments of the present disclosure. In some embodiments, the open-type earphone 10 may include, but is not limited to, air conduction earphones and bone conduction earphones. In some embodiments, the open-type earphone 10 may be combined with products such as glasses, headphones, a head-mounted display, and an AR / VR helmet. As shown in FIGS. 2 to 4 , the open-type earphone 10 may include a sound-generating unit 11 and an ear hook 12. In some embodiments, the open-type earphone 10 may be attached to a user's body (e.g., the head, neck, or upper torso of a human body) via the ear hook 12.

[0046] In some embodiments, when the open-type earphone 10 is worn, a first portion of the ear hook 12 is hooked between the user's auricle and head, and a second portion extends from the auricle away from the head and is connected to the sound-generating unit 11, securing the sound-generating unit 11 in a position near the ear canal without blocking the ear canal. In some embodiments, the ear hook 12 may have an arc-shaped structure that fits the user's auricle so as to be suspended from the user's upper auricle. In some embodiments, the ear hook 12 may have a clipping structure that fits the user's auricle so as to be clipped to the user's auricle. In some embodiments, the ear hook 12 may include, but is not limited to, a hook structure, an elastic band, or the like, to better secure the open-type earphone 10 to the user's body and prevent it from falling off during use.

[0047] In some embodiments, the sound-generating unit 11 may be worn on the user's body, and a transducer (e.g., transducer 112) may be provided within the sound-generating unit 11 to generate sound and input it to the user's ear 100. In some embodiments, the open-type earphone 10 may be combined with a product such as glasses, headphones, a head-mounted display, or an AR / VR helmet, and in this case, the sound-generating unit 11 may be worn near the user's ear 100 in a hanging or clamping manner. In some embodiments, the sound-generating unit 11 may be ring-shaped, elliptical, polygonal (regular or irregular), U-shaped, V-shaped, semicircular, or the like so that it can be worn directly on the user's ear 100.

[0048] As shown in FIGS. 1 and 2 , in some embodiments, when a user wears the open-type earphone 10, at least a portion of the sound-generating unit 11 may be located in the region J on the anterior side of the tragus of the user's ear 100 or in regions M1 and M2 within the pinna shown in FIG. 1 . Different wearing positions of the sound-generating unit 11 (11A, 11B, and 11C shown in FIG. 2 ) are exemplarily described below. Note that the anterior-lateral surface of the pinna referred to in the embodiments herein is the side away from the head along the coronal axis of the pinna, and correspondingly, the posterior-medial surface of the pinna is the side facing the human head along the coronal axis of the pinna. In some embodiments, the sound-generating unit 11 being located at 11A means that the sound-generating unit 11 is located on the side of the user's ear 100 facing the face region of the human body along the sagittal axis, i.e., the sound-generating unit 11 is located in the region J on the anterior side of the ear 100.

[0049] Furthermore, a transducer (e.g., transducer 112) may be provided inside the housing of the sound generating unit 11, and at least one sound emitting hole (e.g., sound emitting hole 111a, not shown in FIG. 2) may be provided in the housing (e.g., housing 111) of the sound generating unit 11. The sound emitting hole may be located on a side wall of the housing of the sound generating unit facing or close to the user's ear canal 101, and the transducer may output sound to the user's ear canal 101 through the sound emitting hole. A transducer is an element that can receive an electrical signal, convert it into an audio signal, and output it. In some embodiments, when classified according to frequency, the type of transducer 112 may include a low-frequency (e.g., 30 Hz to 150 Hz) speaker, a mid-low frequency (e.g., 150 Hz to 500 Hz) speaker, a mid-high frequency (e.g., 500 Hz to 5 kHz) speaker, a high frequency (e.g., 5 kHz to 16 kHz) speaker, or a wideband (e.g., 30 Hz to 16 kHz) speaker, or any combination thereof. Here, the terms low frequency, high frequency, etc., refer only to approximate frequency ranges, and may have different distinction methods in different application scenarios. For example, when a crossover frequency is determined, the low frequency refers to the frequency range below the crossover frequency, and the high frequency refers to the frequency range above the crossover frequency. The crossover frequency may be any value within the audible range of the human ear, such as 500 Hz, 600 Hz, 700 Hz, 800 Hz, or 1000 Hz.

[0050] In some embodiments, the transducer may include a diaphragm (e.g., diaphragm 1121). When the diaphragm vibrates, sound is emitted from the front and rear sides of the diaphragm, respectively. The cavity inside the housing of the sound generating unit 11 is divided by the diaphragm into at least a front cavity (e.g., front cavity 114) located in front of the diaphragm and a back cavity (e.g., back cavity 116) located behind the diaphragm, and the sound output hole is acoustically coupled to the front cavity. The diaphragm vibrates to vibrate the air in the front cavity, generating air-conducted sound, which is then propagated to the outside via the sound output hole. In some embodiments, the housing of the sound generating unit 11 may further include one or more decompression holes (e.g., a first decompression hole 111c and a second decompression hole 111d), which may be located on a side wall adjacent to or opposite to the side wall on the housing where the sound emission hole is located, and the decompression holes are acoustically coupled to the back cavity, so that as the diaphragm vibrates, the air in the back cavity vibrates to generate air-conducted sound, and the air-conducted sound generated in the back cavity may be transmitted to the outside through the decompression holes. For example, in some embodiments, the transducer in the sound generating unit 11 can output sound having a phase difference (e.g., opposite phase) through a sound emission hole and a decompression hole, and the sound emission hole may be located on a side wall of the housing of the sound generating unit 11 facing the user's ear canal 101, and the decompression hole may be located on a side of the housing of the sound generating unit 11 facing away from the user's ear canal 101. In this case, the housing functions as a baffle, increasing the difference in acoustic distance to the ear canal 101 between the sound emission hole and the decompression hole, thereby increasing the intensity of the sound in the ear canal 101 and reducing the volume of far-field sound leakage.

[0051] In some embodiments, the sound generating unit 11 may have a major axis direction Y and a minor axis direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The major axis direction Y may be defined as the direction having the largest extension dimension in the shape of a two-dimensional projection surface of the sound generating unit 11 (e.g., a projection onto a plane on which the outer surface of the sound generating unit 11 is located, or a projection onto a sagittal plane) (e.g., when the projection shape is rectangular or approximately rectangular, the major axis direction is the longitudinal direction of the rectangle or approximately rectangle), and the minor axis direction Z may be defined as the direction perpendicular to the major axis Y in the shape of the projection of the sound generating unit 11 onto the sagittal plane (e.g., when the projection shape is rectangular or approximately rectangular, the minor axis direction is the width direction of the rectangle or approximately rectangle). The thickness direction X may be defined as the direction perpendicular to the two-dimensional projection surface, and for example, coincides with the direction of the coronal axis, both of which face the left-right direction of the body. In some embodiments, when the sound-generating unit 11 is inclined in the worn state, the major axis direction Y and the minor axis direction Z are still parallel or approximately parallel to the sagittal plane. The major axis direction Y may form a certain angle with the direction of the sagittal axis, i.e., the major axis direction Y is also tilted accordingly. The minor axis direction Z may form a certain angle with the direction of the vertical axis, i.e., the minor axis direction Z is also tilted, as in the case of the sound-generating unit 11 worn on 11B shown in FIG. 2 and the case of the sound-generating unit 11 worn on 11B shown in FIG. 4. In some embodiments, the entire or partial structure of the sound-generating unit 11 may be inserted into the concha cavity, i.e., the projection of the sound-generating unit 11 onto the sagittal plane and the projection of the concha cavity onto the sagittal plane overlap. For specific details regarding the case of the sound-generating unit 11 worn on 11B, please refer to other contents of this specification, such as FIG. 3 and its related descriptions. In some embodiments, the sound generating unit 11 in the attached state may be in a horizontal state or an approximately horizontal state. For example, as in the situation in which the sound generating unit 11 is attached to 11C in FIG. 2 and as in the sound generating unit 11 shown in FIG. 3, the long axis direction Y may coincide with or approximately coincide with the direction of the sagittal axis, and both may be oriented in the front-to-back direction of the body, and the short axis direction Z may coincide with or approximately coincide with the direction of the vertical axis, and both may be oriented in the up-down direction of the body.Note that the sound generating unit 11 being in a substantially horizontal position when worn may mean that the angle between the longitudinal axis direction of the sound generating unit 11 and the sagittal axis shown in FIG. 2 is within a specific range (e.g., 20° or less). Furthermore, the wearing position of the sound generating unit 11 is not limited to 11A, 11B, and 11C shown in FIG. 2, and may be within region J, region M1, or region M2 shown in FIG. 1. For example, the entire or a part of the structure of the sound generating unit 11 may be located in region J surrounded by a dashed line in FIG. 1. Furthermore, for example, the entire or a part of the structure of the sound generating unit 11 may contact one or more parts of the external auditory canal 101, such as the crus helix 109, the navicular concha 103, the triangular fossa 104, the antihelix 105, the scapha 106, and the helix 107. Furthermore, for example, the entire or partial structure of the sound generating unit 11 may be located within a cavity formed by one or more parts of the ear 100 (e.g., the concha cavity 102, the concha navicularis 103, and the triangular fossa 104, etc.) (e.g., the region M1 including at least the concha navicularis 103 and the triangular fossa 104, and the region M2 including at least the concha cavity 102, surrounded by dashed lines in Figure 1).

[0052] In some embodiments, to improve the stability of the open-type earphone 10 when worn, the open-type earphone 10 can use one of the following methods or a combination thereof. For example, at least a portion of the ear hook 12 is installed as a contoured structure bonded to at least one of the back of the ear and the head, thereby increasing the contact area between the ear hook 12 and the ear and / or the head, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear. For example, at least a portion of the ear hook 12 is installed as an elastic structure that has a certain amount of deformation when worn, thereby increasing the positive pressure of the ear hook 12 against the ear and / or the head, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear. For example, at least a portion of the ear hook 12 is installed so as to abut against the head when worn and generate a reaction force that presses against the ear, thereby pressing the sound-generating unit 11 toward the front of the ear, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear. For example, the sound-generating unit 11 and the ear hook 12 are arranged to sandwich physiological parts such as the area where the antihelix is ​​located and the area where the concha is located from both the front and back of the ear when worn, thereby increasing the resistance to the open-type earphone 10 falling off from the ear. Furthermore, for example, the sound-generating unit 11 or the auxiliary structure connected to it is arranged so that at least a portion thereof is inserted into physiological parts such as the concha cavity, the navicularis concha, the triangular fossa, and the navicular fossa, thereby increasing the resistance to the open-type earphone 10 falling off from the ear.

[0053] The sound generating unit 11 may have a connection end CE connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. For example, as shown in FIG. 4 , the free end FE of the sound generating unit 11 may be inserted into the cavity of the concha when worn. Preferably, the sound generating unit 11 and the ear hook 12 are arranged to sandwich the ear region corresponding to the cavity of the concha from both the front and back of the ear region, thereby increasing the resistance of the open-type earphone 10 to falling off the ear and improving the stability of the open-type earphone 10 when worn. For example, the free end FE of the sound generating unit 11 is pressed into the cavity of the concha in the thickness direction X. Also, for example, the free end FE abuts against the cavity of the concha in the major axis direction Y and / or the minor axis direction Z (for example, abuts against the inner wall of the cavity of the concha that faces the free end FE). The free end FE of the sound generating unit 11 is an end of the sound generating unit 11 that is arranged opposite the fixed end connected to the ear hook 12. The sound generating unit 11 may have a regular or irregular structure. Here, the free end FE of the sound generating unit 11 will be described as an example to further explain the structure. For example, if the sound generating unit 11 has a rectangular parallelepiped structure, the end wall surface of the sound generating unit 11 is a plane. In this case, the free end FE of the sound generating unit 11 is an end side wall that is installed opposite the fixed end of the sound generating unit 11 connected to the ear hook 12. Furthermore, if the sound generating unit 11 has a spherical, ellipsoidal, or irregular structure, the free end FE of the sound generating unit 11 may be a specific region away from the fixed end obtained by cutting the sound generating unit 11 along the YZ plane (the plane formed by the minor axis direction Z and the major axis direction Y). In addition to being inserted into the cavity of the concha, when worn, the free end FE of the sound generating unit 11 may be orthogonally projected within the antihelix, or may be orthogonally projected within a position on either the left or right side of the head and in front of the ear along the sagittal axis of the human body. In other words, the ear hook 12 can support the sound generating unit 11 so that it can be attached to a position such as the cavity of the concha, the antihelix, or the front of the ear.

[0054] The open-type earphone 10 will be described in detail below by taking the open-type earphone 10 shown in Fig. 4 as an example. It should be noted that, provided that the corresponding acoustic principles are not violated, the structure and corresponding parameters of the open-type earphone 10 shown in Fig. 4 can also be applied to the other open-type earphones described above.

[0055] By inserting at least a portion of the sound-generating unit 11 into the cavity of the concha, it is possible to improve the listening volume at the listening position (especially the opening of the ear canal), especially the listening volume for mid-low frequencies, while still maintaining the effect of reducing the volume of sound leakage in the far field. Simply by way of illustrative example, when the entire or partial structure of the sound-generating unit 11 is inserted into the cavity of the concha, the sound-generating unit 11 and the cavity of the concha form a structure similar to a cavity (hereinafter abbreviated as a "similar cavity"). In the embodiments of the specification, the "similar cavity" may be understood as a semi-sealed structure surrounded by the sidewall of the sound-generating unit 11 and the cavity of the concha structure, and this semi-sealed structure does not completely seal and isolate the interior from the external environment, but has a leaking structure (e.g., an opening, a gap, a conduit, etc.) that acoustically communicates with the external environment. When a user wears the open-type earphone 10, one or more sound output holes may be provided on the housing of the sound-generating unit 11 close to or facing the user's ear canal, and one or more decompression holes may be provided on another side wall of the housing of the sound-generating unit 11 (for example, the side wall away from the user's ear canal), the sound output hole being acoustically coupled to the front cavity of the open-type earphone 10, and the decompression hole being acoustically coupled to the back cavity of the open-type earphone 10. For example, assuming that the sound-generating unit 11 includes one sound output hole and one decompression hole, the sound output from the sound output hole and the sound output from the decompression hole can be approximately regarded as two sound sources, and the sound waves of the two sound sources have opposite phases. The sound-generating unit 11 and the inner wall corresponding to the cavity of the concha form a similar cavity structure, and the sound source corresponding to the sound output hole is located inside the similar cavity structure, and the sound source corresponding to the decompression hole is located outside the similar cavity structure, forming the acoustic model shown in FIG.

[0056] 5 is an exemplary schematic distribution diagram of a cavity structure installed around one of the dual sound sources according to some embodiments of the present disclosure. As shown in FIG. 5, the similar cavity structure 502 may include a listening position and at least one sound source 501A. Here, "including" may indicate that at least one of the listening position and the sound source 501A is located inside the similar cavity structure 502, or that at least one of the listening position and the sound source 501A is located on the edge of the interior of the similar cavity structure 502. The listening position may be equivalent to the entrance of the ear canal, or may be an acoustic reference point of the ear, such as an ear reference point (ERP) or an ear-drum reference point (DRP), or may be an entrance structure that guides the listener. Because the sound source 501A is surrounded by the similar cavity structure 502, most of the radiated sound reaches the listening position by direct or reflected radiation. In contrast, without the similar cavity structure 502, most of the sound radiated from the sound source 501A would not reach the listening position. Therefore, by installing a cavity structure, the volume of the sound reaching the listening position can be significantly increased. At the same time, only a small portion of the anti-phase sound radiated from the anti-phase sound source 501B outside the similar cavity structure 502 enters the similar cavity structure 502 through the leakage structure 503 of the similar cavity structure 502. This corresponds to the generation of a secondary sound source 501B' in the leakage structure 503, and the intensity of the secondary sound source 501B' is significantly lower than that of the sound source 501B and also significantly lower than that of the sound source 501A. The sound generated by the secondary sound source 501B' has a weak effect of canceling out the sound generated by the sound source 501A inside the cavity, which can significantly increase the volume of the sound heard at the listening position. With respect to sound leakage, when sound source 501A radiates sound to the outside through cavity leakage structure 503, this is equivalent to secondary sound source 501A' being generated in leakage structure 503, and since almost all of the sound radiated from sound source 501A is output from leakage structure 503 and the structural scale of similar cavity structure 502 is far smaller (at least one order of magnitude smaller) than the spatial scale for evaluating sound leakage, the intensity of secondary sound source 501A' is considered to be equivalent to that of sound source 501A.The secondary sound source 501A' and the sound source 501B form a dual sound source in the external space, which cancels out and reduces sound leakage.

[0057] In a specific application scenario, the outer wall surface of the housing of the sound-generating unit 11 is usually flat or curved, and the contour of the user's concha 102 has an uneven structure. By inserting part or the entire structure of the sound-generating unit 11 into the concha, a similar cavity structure communicating with the outside is formed between the sound-generating unit 11 and the contour of the concha. Furthermore, by installing a sound emission hole in the housing of the sound-generating unit 11 at a position close to the edge of the concha 102 toward the opening of the user's ear canal, and installing a decompression hole in the sound-generating unit 11 at a position away from the opening of the ear canal, the acoustic model shown in Figure 5 can be constructed, which can increase the listening volume at the user's ear canal and reduce sound leakage in the far field when the user wears the open-type earphone 10.

[0058] FIG. 6 is a schematic diagram of an exemplary internal structure of a sound generating unit according to some embodiments of the present disclosure. As shown in FIG. 6 , in some embodiments, the sound generating unit 11 may include a transducer 112 and a housing 111 that accommodates the transducer 112. The transducer 112 may include a vibrating membrane 1121. A front cavity 114 located in front of the vibrating membrane 1121 and a back cavity 116 located behind the vibrating membrane 1121 may be formed between the vibrating membrane 1121 and the housing 111. The housing 111 may be provided with a sound emission hole 111a acoustically coupled to the front cavity 114 and a decompression hole (e.g., a first decompression hole 111c and a second decompression hole 111d not shown in FIG. 6 ) acoustically coupled to the back cavity 116. A connection frame 115 may be installed within the housing 111. The connecting frame 115 is provided with an acoustic passage 1151 for connecting the first decompression hole 111c and the back cavity 116, which facilitates communication between the back cavity 116 and the external environment, i.e., allows air to freely enter and exit the back cavity 116, thereby helping to reduce the resistance in the vibration process of the vibrating membrane of the transducer 112.

[0059] FIG. 7 is an exemplary external view of a transducer according to some embodiments of the present disclosure, and FIG. 8 is an exemplary exploded view of a transducer according to some embodiments of the present disclosure. As shown in FIGS. 7 and 8 , in some embodiments, the sound generating unit 11 may include a diaphragm 1121, a coil 1122, a support frame 1123, a terminal 1124, and a magnetic circuit assembly 1125. The support frame 1123 provides a mounting and fixing platform, and the sound generating unit 11 may be connected to the housing 111 via the support frame 1123. The terminal 1124 may be fixed to the support frame 1123 and used for circuit connection (e.g., connection of a lead wire, etc.). The coil 1122 is connected to the diaphragm 1121 and is located in a magnetic gap at least partially formed by the magnetic circuit assembly 1125. The magnetic circuit assembly 1125 generates an acting force in the energized coil 1122, thereby driving the diaphragm 1121 to generate mechanical vibrations, which then propagate through a medium such as air to generate sound. The magnetic circuit assembly 1125 may include a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. The magnetically permeable plate 11251 is positioned between the magnet 11252 and the vibration membrane 1121, and is attached to the surface of the magnet 11252.

[0060] FIG. 9 is an exemplary internal structural view of a sound generating unit according to some embodiments of the present disclosure, and FIG. 10 is an exemplary structural view of a diaphragm according to some embodiments of the present disclosure. The sound generating unit 11 includes a diaphragm 1121, a coil 1122, a support frame 1123, and a magnetic circuit assembly 1125. The support frame 1123 is installed to surround the diaphragm 1121, the coil 1122, and the magnetic circuit assembly 1125, and provides a mounting and fixing platform. The sound generating unit 11 may be connected to the housing 111 by the support frame 1123, and the coil 1122 is inserted into the magnetic circuit assembly 1125 and connected to the diaphragm 1121. The magnetic circuit assembly 1125 generates an acting force on the energized coil 1122, thereby driving the diaphragm 1121 to generate mechanical vibrations, and further generates sound by propagation through a medium such as air. The sound is output through a sound output hole. In some embodiments, the magnetic circuit assembly 1125 includes a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. The magnetically permeable plate 11251 and the magnet 11252 are connected to each other. The side of the magnet 11252 away from the magnetically permeable plate 11251 is attached to the bottom wall of the housing member 11253. A gap exists between the peripheral side of the magnet 11252 and the inner peripheral wall of the housing member 11253. In some embodiments, the outer peripheral wall of the housing member 11253 is connected and fixed to the support frame 1123. In some embodiments, both the housing member 11253 and the magnetically permeable plate 11251 may be made of a magnetically permeable material (e.g., iron). In some embodiments, the peripheral side of the vibrating membrane 1121 may be connected to the support frame 1123 by a fixing ring 1155. In some embodiments, the material of the fixing ring 1155 may include stainless steel or other metal materials to accommodate the manufacturing process of the vibrating membrane 1121. 8, the magnetic circuit assembly 1125 may include a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. Both the housing member 11253 and the magnetically permeable plate 11251 may be made of a magnetically permeable material (e.g., iron, etc.). In some embodiments, the housing member 11253 includes a housing bottom 11253a and a peripheral sidewall 11253b.The storage space is surrounded by the bottom 11253a and sidewalls 11253b of the storage member, and the magnetically permeable plate 11251 and the magnet 11252 are stored in the storage space. The magnetically permeable plate 11251 and the magnet 11252 are connected to each other, and the side of the magnet 11252 away from the magnetically permeable plate 11251 is attached to the bottom 11253a of the storage member, with a gap between the peripheral side of the magnet 11252 and the peripheral sidewall 11253b of the storage member 11253. In some embodiments, the coil 1122 may be inserted into the gap between the magnet 11252 and the sidewall 11253b.

[0061] In some embodiments, in the process of the vibrating membrane 1121 vibrating up and down, at least a portion of the coils 1122 are located in an area of ​​high magnetic flux density in the magnetic circuit assembly 1125, and in order to improve the magnetic field utilization efficiency of the magnetic circuit assembly 1125, the distance dd between the center point J of the coils 1122 and the center point K of the magnetic permeable plate 11251 in the vibration direction of the vibrating membrane 1121 is less than 0.3 mm. For example, the center point J of the coils 1122 and the center point K of the magnetic permeable plate 11251 may be located on approximately the same horizontal line, so that the magnetic circuit assembly 1125 generates a larger force on the coils 1122 and provides power for the vibration of the vibrating membrane 1121.

[0062] As shown in FIGS. 9 and 10 , in some embodiments, the vibrating membrane 1121 may include a main body region 11211 and an edge region 11212 surrounding the main body region 11211. In some embodiments, the main body region 11211 includes a first inclined portion 11211a and a first connecting portion 11211b connected to the coil 1122. As shown in FIG. 9 , the first connecting portion 11211b is used to connect the coil 1122, and the first connecting portion 11211b is arranged parallel to the minor axis direction Z and perpendicular to the vibration direction of the vibrating membrane. The first inclined portion 11211a is bonded to a portion of the edge region 11212. In some embodiments, the first inclined portion 11211a is inclined away from the coil 1122 relative to the first connecting portion 11211b. 9 and 10, the coil 1122 is located below the first connecting portion 11211b, and the first inclined portion 11211a is inclined upward (i.e., in a direction away from the coil 1122) relative to the first connecting portion 11211b. With the above-described arrangement, it is possible to prevent the adhesive used for bonding from overflowing onto the edge region 11212 when the coil 1122 is bonded to the diaphragm 1121, corroding the edge region 11212, and affecting the vibration performance of the diaphragm 1121.

[0063] In some embodiments, the magnetic circuit assembly 1125 mainly includes a magnetically permeable plate 11251, a magnet 11252, and a housing member 11253. The magnetically permeable plate 11251 and the magnet 11252 are connected to each other. The side of the magnet 11252 away from the magnetically permeable plate 11251 is attached to the bottom wall of the housing member 11253. There is a gap between the peripheral side of the magnet 11252 and the inner peripheral wall of the housing member 11253. The coil 1122 may be inserted into the gap between the magnet 11252 and the housing member 11253. If the distance between the coil 1122 and the side wall of the housing member 11253 is too large, the coil will not be located in an area of ​​high magnetic flux density of the magnetic circuit assembly 1125, thereby weakening the power provided from the magnetic circuit assembly 1125 to the vibrating membrane 1121. If the distance is too small, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, to avoid collision of the coil 1122 and ensure power provided from the magnetic field to the vibrating membrane 1121, in some embodiments, in the above-mentioned gap, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.1 mm to 0.25 mm, and the distance ww between the coil 1122 and the inner peripheral wall of the housing member 11253 may be 0.1 mm to 0.5 mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.12 mm to 0.24 mm, and the distance ww between the coil 1122 and the inner peripheral wall of the housing member 11253 may be 0.15 mm to 0.3 mm. In some embodiments, in the above-mentioned gap, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.17 mm to 0.21 mm, and the distance ww between the coil 1122 and the inner peripheral wall of the housing member 11253 may be 0.19 mm to 0.23 mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 may be 0.2 mm, and the distance ww between the coil 1122 and the inner peripheral wall of the housing member 11253 may be 0.2 mm.If the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 is too large, the overall volume of the sound generating unit 11 increases. If the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 in the vibration direction of the diaphragm 1121 is too small, there is a risk that the coil 1122 will collide with the housing member 11253. Therefore, to avoid the volume of the sound generating unit 11 being too large and to avoid the coil 1122 colliding with the housing member 11253, in some embodiments, the distance h3 between the coil 1122 and the bottom 11253a of the housing member 11253 (i.e., the distance between the end of the coil 1122 remote from the diaphragm 1121 and the bottom wall of the housing member 11253) may be 0.2 mm to 4 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be 0.6 mm to 3 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be between 1 mm and 2 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the housing member 11253 may be between 1.4 mm and 1.6 mm.

[0064] In some embodiments, the relative position of the coil 1122 and the magnetic circuit assembly 1125 can be changed by designing the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b, thereby approximately matching the thrust force received by the coil 1122 and further adjusting the low-frequency distortion of the sound generating unit 11, thereby enriching the low-frequency hearing sensation. In addition, the inclination angle β of the first inclined portion 11211a with respect to the first connecting portion 11211b can be designed to prevent the adhesive from overflowing into the edge region 11212 due to the coil 1122, corroding the edge region 11212, and affecting the vibration of the edge region 11212. As shown in FIG. 10, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b is the angle between the first inclined portion 11211a and the straight line on which the first connecting portion 11211b is located, in the direction away from the first connecting portion 11211b.

[0065] In some embodiments, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b may be in the range of 5° to 30° to reduce the degree of distortion of the sound generating unit 11 and avoid eroding the edge region 11212 and affecting the vibration of the edge region 11212. In some embodiments, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b may be in the range of 10° to 25° to further reduce the degree of distortion of the sound generating unit 11. For example, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b may be 15°. Furthermore, for example, the inclination angle β of the first inclined portion 11211a relative to the first connecting portion 11211b may be 22°.

[0066] In some embodiments, the minimum distance from the coil 1122 to the first inclined portion 11211a is 0.3 mm or more, i.e., the distance between the connection point between the first inclined portion 11211a and the first connection portion 11211b and the connection area between the coil 1122 and the first connection portion 11211b is 0.3 mm or more, thereby maintaining a safe distance between the edge region 11212 and the mounting position of the coil 1122 and preventing the adhesive for mounting the coil 1122 from overflowing onto the edge region 11212.

[0067] In some embodiments, the edge region 11212 includes a second inclined portion 11212a, and the second inclined portion 11212a is at least partially attached to the first inclined portion 11211a. The body region 11211 and the edge region 11212 are connected by the first inclined portion 11211a and the second inclined portion 11212a. In some embodiments, to simplify the attachment process, the first inclined portion 11211a and the second inclined portion 11212a may be connected by an adhesive. In some embodiments, to achieve the connection between the body region 11211 and the edge region 11212, the second inclined portion 11212a may be located on a side of the first inclined portion 11211a closer to the coil 1122. In some embodiments, the second inclined portion 11212a may be located on the side of the first inclined portion 11211a away from the coil 1122 to achieve connection between the main body region 11211 and the edge region 11212 and reduce corrosion of the edge region 11212 by adhesive when bonding the coil 1122.

[0068] Because the amplitude of the vibrating membrane 1121 is large at low frequencies, if the edge region 11212 has a planar structure, its deformation capacity is low, which affects the vibration amplitude of the vibrating membrane 1121. Therefore, in order to give the vibrating membrane 1121 excellent deformation capacity, in some embodiments, the edge region 11212 may include an arc-shaped portion 11212c.

[0069] In some embodiments, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c can affect the deformation capacity of the arc-shaped portion 11212c. The height of the arc-shaped portion 11212c is the distance between the highest point of the arc-shaped portion 11212c and the lowest point of the arc-shaped portion 11212c in the vibration direction of the vibrating membrane 1121. As shown in FIG. 10, the height of the arc-shaped portion 11212c is denoted as h1. The span of the arc-shaped portion 11212c is the maximum distance between two points on the arc-shaped portion 11212c. As shown in FIG. 10, the span of the arc-shaped portion 11212c is denoted as w1. If the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c is too small, the arc-shaped portion 11212c will have a too small protrusion, resulting in a shape that resembles a planar structure and potentially reduced deformation capacity. If the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c is too large, the arc-shaped portion 11212c will protrude too much, resulting in a large resistance when the vibrating membrane 1121 vibrates, which will affect the output of the sound generating unit 11. Therefore, in some embodiments, to provide the sound generating unit 11 with excellent output and low distortion, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be within a range of 0.35 to 0.4. In some embodiments, to further improve the output of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be within a range of 0.36 to 0.39. In some embodiments, to further reduce distortion of the sound generating unit 11, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be 0.37 to 0.38. For example, the ratio of the height h1 to the span w1 of the arc-shaped portion 11212c may be 0.38.

[0070] In some embodiments, the height h1 of the arcuate portion 11212c may be within a range of 0.5 mm to 0.7 mm. For example, the height h1 of the arcuate portion 11212c may be within a range of 0.55 mm to 0.65 mm. In some embodiments, the height h1 of the arcuate portion 11212c may be 0.6 mm. Taking into account dimensional tolerances, in some embodiments, the height h1 of the arcuate portion 11212c may be 0.6 mm ± 0.05 mm. In some embodiments, the span (width) w1 of the arcuate portion 11212c of the edge region 11212 may be less than twice the radius of curvature r1. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be within a range of 0.7 mm to 0.9 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be within a range of 0.75 mm to 0.88 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.8 mm to 0.83 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.2 mm to 1.7 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.3 mm to 1.65 mm. In some embodiments, the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.5 mm to 1.6 mm. In some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.82 mm, and the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.58 mm. Taking into account tolerances, in some embodiments, the radius of curvature r1 of the arcuate portion 11212c of the edge region 11212 may be 0.82 mm ± 0.05 mm, and the span w1 of the arcuate portion 11212c of the edge region 11212 may be 1.58 mm ± 0.1 mm.

[0071] In some embodiments, the edge region 11212 may include a wave-like structure consisting of multiple arc-shaped portions 11212c, with the orientation of any two adjacent arc-shaped portions 11212c being opposite. The wave-like structure can symmetrically balance the resistance to upward and downward vibrations of the vibrating membrane 1121, reduce distortion of the sound-generating unit 11, and improve the low-frequency output of the sound-generating unit 11. In some embodiments, the height-to-span ratio of each of the multiple arc-shaped portions 11212c may be the same as the height-to-span ratio of the single arc-shaped portion 11212c described above. In some embodiments, the height-to-span ratio of each of the multiple arc-shaped portions 11212c may be different. For example, in the radial direction of the vibrating membrane 1121, the height of each of the multiple arcuate portions 11212c may gradually decrease from the center to the edge of the vibrating membrane 1121, and the span of each arcuate portion 11212c is the same.

[0072] To restrain the vibrating membrane 1121 and prevent the coil 1122 from colliding with the magnetic circuit assembly 1125 when the vibrating membrane 1121 vibrates significantly, in some embodiments, the main body region 11211 may include an arched dome 11211c located at one end of the first connecting portion 11211b away from the first inclined portion 11211a, where the arched dome 11211c and the arc-shaped portion 11212c have the same arch direction, i.e., the arched dome 11211c protrudes toward the side away from the coil 1122. The arched dome 11211c can prevent the vibrating membrane 1121 from shaking when the vibrating membrane 1121 vibrates significantly and ensure that the coil 1122 does not collide with the magnetic circuit assembly 1125. At the same time, the arched dome 11211c also has high strength and rigidity, which can to some extent suppress the split vibration of the main body region 11211, thereby improving the high-frequency vibration characteristics of the transducer 112. Without a front cover, the aspect ratio (i.e., the ratio of height to span) of the dome increases, increasing the high-frequency bandwidth, but if the aspect ratio of the dome is too high, the degree of non-uniformity increases and the overall dimensions increase.

[0073] In some embodiments, the height h2 of the dome 11211c is related to the dimension of the dome 11211c in the arch extension direction (i.e., the span dimension w2). The height of the dome 11211c is the distance between the highest point of the dome 11211c and the lowest point of the dome 11211c (i.e., the end point connected to the first connection portion 11211b) in the vibration direction of the vibrating membrane 1121. As shown in FIG. 10, the height of the dome 11211c is h2. The span of the dome 11211c is the maximum distance between two points on the dome 11211c. As shown in FIG. 10, the span of the dome 11211c is w2. As the span dimension w2 of dome 11211c increases, the height h2 of dome 11211c also increases in order to maintain the arch structure of dome 11211c (e.g., to maintain the curvature corresponding to dome 11211c within a preset curvature range), which may result in the overall thickness dimension of transducer 112 becoming too large. Taking into consideration the overall thickness and structural design of transducer 112, in some embodiments, the preset curvature range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 0.5263 rad to 3.1416 rad. In some embodiments, the preset curvature range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 0.7869 rad to 3.1416 rad. In some embodiments, a preset radian range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 1.0526 rad to 3.1416 rad. In some embodiments, a preset radian range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 1.5789 rad to 3.1416 rad. In some embodiments, a preset radian range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 2.1053 rad to 3.1416 rad. In some embodiments, a preset radian range corresponding to dome 11211c of main body region 11211 of vibrating membrane 1121 may be 2.6316 rad to 3.1416 rad. In some embodiments, a width dimension w2 of dome 11211c of main body region 11211 may be 2 mm to 8 mm.In some embodiments, width dimension w2 of dome 11211c of body region 11211 may be 3 mm to 7 mm. In some embodiments, width dimension w2 of dome 11211c of body region 11211 may be 4 mm to 6 mm. In some embodiments, width dimension w2 of dome 11211c of body region 11211 may be 4.8 mm. In some embodiments, height h2 of dome 11211c of body region 11211 (i.e., the distance between the highest point and the lowest point of dome 11211c in the vibration direction of the diaphragm) may be in the range of 0.7 mm to 1.2 mm. In some embodiments, height h2 of dome 11211c of body region 11211 may be 0.9 mm to 1.1 mm. In some embodiments, height h2 of dome 11211c of body region 11211 may be 1 mm to 1.05 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm. In some embodiments, due to processing tolerances, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm±0.08 mm.

[0074] In some embodiments, the ratio of the height h2 to the span w2 of the dome 11211c may affect the overall dimensions of the sound generating unit 11 and the vibration of the vibrating membrane 1121. If the ratio of the height h2 to the span w2 of the dome 11211c is too small, the protrusion of the dome 11211c is too small, causing the shape of the dome 11211c to be close to a planar structure, reducing the strength and rigidity of the dome 11211c, making it more likely for split vibrations to occur in the dome 11211c and resulting in many peaks and valleys in the high frequency range, which may affect the high frequency vibration characteristics of the transducer 112. If the ratio of the height h2 to the span w2 of the dome 11211c is too large, the protrusion of the dome 11211c is too large, potentially causing the overall thickness dimension of the transducer 112 to be too large, increasing the degree of non-uniformity and the overall dimension. Therefore, in order to ensure that the entire sound generating unit 11 has an appropriate thickness dimension and to improve the high-frequency vibration characteristics of the sound generating unit 11, the ratio of the height h2 to the span w2 of the dome 11211c may be within a range of 0.1 to 0.6. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c may be within a range of 0.1 to 0.4. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c may be within a range of 0.1 to 0.3.

[0075] In some embodiments, taking into consideration structural strength, process implementation difficulties, and limitations on the overall thickness of the sound generating unit 11, and to ensure that the maximum amplitude of the vibrating membrane 1121 is met and that the vibrating membrane 1121 does not collide with the magnetically permeable plate 11251 during vibration, the distance hd in the vibration direction of the vibrating membrane from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 (distance hd shown in FIG. 9 ) may be greater than 0.8 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetically permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.85 mm to 0.95 mm, i.e., 0.9 mm ± 0.05 mm. 0.9 mm is a structural dimension, and 0.05 mm is a dimension with a tolerance range. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetic permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.86 mm to 0.93 mm. In some embodiments, the distance hd from the lowest point of the dome 11211c of the main body region 11211 of the vibrating membrane 1121 to the top of the magnetic permeable plate 11251 in the magnetic circuit assembly 1125 may be 0.88 mm to 0.92 mm.

[0076] 11A is a schematic diagram of an exemplary high-frequency bandwidth of a sound-generating unit according to some embodiments of the present disclosure. As shown in FIG. 11A, the frequency response curve of the sound-generating unit 11 has a first inflection point f0 in the low-frequency region, which is located around 300 Hz. f0 is related to the hardness and softness of the edge region 11212 of the vibrating membrane 1121 and the vibration weight (mainly the weight of the main body region 11211). The second inflection point f h is around 25kHz, and f h may be determined based on the overall trend of the frequency response curve. h From f = 25 kHz onwards, there are small local peaks in the curve, but the overall trend is downward. h The peak values ​​in the frequency band between 1 and 25 kHz (i.e., between 300 Hz and 25 kHz) are selected and the average value is taken, and the first reference line Lm , i.e., the upper line in FIG. 11A, and is lowered by 10 dB from this reference line to form a second line L n (the lower straight line in FIG. 11A), i.e., the selected bandwidth is 100 Hz to 45 kHz.

[0077] In some embodiments, the frequency of the high-frequency divided vibration of the vibrating membrane 1121 is proportional to E / ρ, where E is the Young's modulus of the vibrating membrane 1121 and ρ is the equivalent density of the vibrating membrane 1121. Therefore, the high-frequency bandwidth can be determined by E / ρ. When E is constant, the smaller the mass of the vibrating membrane 1121, the smaller the equivalent density ρ of the vibrating membrane 1121, the larger E / ρ, and the wider the high-frequency bandwidth. When ρ is constant, the larger the Young's modulus E of the vibrating membrane 1121, the larger E / ρ, and the higher the frequency of the high-frequency divided vibration of the vibrating membrane 1121, and the wider the high-frequency bandwidth.

[0078] In some embodiments, the high frequency split vibration region of the sound generating unit 11 is a region where the frequency response curve reaches the highest peak, then the frequency response drops sharply and peak values ​​and trough values ​​alternate. As shown in FIG. 11A, h After reaching the sound pressure level corresponding to f, the frequency response drops off rapidly, with alternating peaks and troughs. h The region to the right of is the high-frequency split vibration region. The frequency at which the corresponding curve reaches its highest peak is the frequency at which high-frequency split vibration appears (f shown in Figure 11A). h). In some embodiments, to avoid large variations in vibrations of different parts of the main body region 11211 and low high-frequency effectiveness, the frequency of the high-frequency split vibration of the main body region 11211 (dome 11211c) can be designed so that the vibrating membrane 1121 has a wide high-frequency bandwidth and the frequency of the high-frequency split vibration within the bandwidth can be reduced. In some embodiments, the frequency of the high-frequency split vibration of the dome 11211c can be 20 kHz or higher. For example, the frequency of the high-frequency split vibration of the dome 11211c can be 25 kHz or higher. In some embodiments, to ensure high output of the main body region 11211 in the effective frequency band, the mass of the main body region 11211 needs to be small, thereby reducing the difficulty of the main body region 11211 vibrating in the effective frequency band. Therefore, the material and structure of the main body region 11211 can be selected to have low density and high strength. Therefore, the Young's modulus of the dome 11211c can be 6 GPa or higher. In some embodiments, the Young's modulus of the dome 11211c may be in the range of 6 GPa to 7 GPa. For example, the Young's modulus of the dome 11211c may be 6.5 GPa. The Young's modulus of the dome 11211c may be measured by a static method or a dynamic method (e.g., a pulse excitation method, an acoustic resonance method, a sound velocity method, etc.).

[0079] In some embodiments, the main body region 11211 may be made of carbon fiber material. FIG. 11B is a schematic diagram of an exemplary carbon fiber weave structure according to some embodiments herein. Carbon fiber material has low density and high strength, which helps to attenuate higher-order modes of the speaker 112. In some embodiments, to further improve the strength of the main body region 11211 and reduce the equivalent density of the main body region 11211, the main body region 11211 may be woven with interlaced carbon fibers, where at least some of the carbon fibers interlace at a first angle. In some embodiments, the first angle is in the range of 45° to 90°. For example, when weaving multiple independent carbon fibers, the warp and weft may be interlaced at any angle, such as 45°, 60°, or 90°. As shown in FIG. 11B, multiple carbon fibers 112111 and multiple carbon fibers 112112 may be woven with an angle close to 90°. In some embodiments, because the carbon fibers are very thin, the plurality of carbon fibers 112111 and the plurality of carbon fibers 112112 may be laid at an angle close to 90° and connected by adhesive. In some embodiments, the main body region 11211 may include multiple layers (e.g., two layers, three layers, etc.) of interwoven carbon fibers. To facilitate interwoven carbon fiber weaving, in some embodiments, the length of a single carbon fiber is 5 mm or more. In some embodiments, the length of a single carbon fiber may be in the range of 5 mm to 10 mm. For example, the length of a single carbon fiber may be 7 mm. Because single carbon fibers are too thin, it is difficult and difficult to weave them one by one. In some embodiments, multiple carbon fibers may be laid and connected (e.g., connected by adhesive) to form multiple sets of carbon fibers, and the warp and weft threads intertwine between the multiple sets of carbon fibers.

[0080] In some embodiments, the thickness of body region 11211 can be designed to obtain a selected high frequency bandwidth using a highly smoothly aligned carbon fiber structure to reduce the weight of body region 11211. In some embodiments, the thickness of body region 11211 can be less than 80 μm. In some embodiments, the thickness of body region 11211 can be in the range of 10 μm to 60 μm. In some embodiments, the thickness of body region 11211 can be 25 μm.

[0081] FIG. 12 is a schematic diagram of the amplitude of the sound generating unit at different driving voltages according to some embodiments of the present disclosure. As shown in FIG. 12, the amplitudes at which the diaphragm 1121 of the transducer 112 vibrates in two opposite directions (positive and negative directions of the thickness direction X shown in FIG. 6, i.e., positive and negative directions of the ordinate axis in FIG. 12) are different at the same voltage. This is due to the asymmetry of the diaphragm 1121. In FIG. 12, the unit Vrms indicates the effective voltage value of a sinusoidal AC signal. For example, 0.7 Vrms indicates that the effective voltage value of the input sinusoidal AC signal is 0.7 V. As shown in FIG. 12, when the input voltage is in the range of 0.4 V to 0.7 V, the amplitude (approximately 0.8 mm) of the diaphragm 1121 vibrating downward (negative direction of the ordinate axis) is greater than the amplitude (approximately 0.6 mm) of the diaphragm 1121 vibrating upward (positive direction of the ordinate axis). When the vibrating membrane 1121 vibrates upward, it vibrates toward the front cavity 114, and when the vibrating membrane 1121 vibrates downward, it vibrates toward the back cavity 116 (toward the magnetic circuit assembly 1125). As shown in FIG. 12 , as the input voltage continues to increase (for example, from 0.7 V to 1 V), the amplitude change width of the vibrating membrane 1121 gradually decreases and finally approaches a threshold value, where the amplitude of the downward vibration of the vibrating membrane 1121 approaches a first threshold value (approximately 0.9 mm), and the amplitude of the upward vibration of the vibrating membrane 1121 approaches a second threshold value (approximately 0.8 mm). Because the amplitude of the downward vibration of the vibrating membrane 1121 is larger than the amplitude of the upward vibration, the amplitude of the vibrating membrane 1121 in this specification is the large downward vibration amplitude of the vibrating membrane 1121. In some embodiments, to prevent coil 1122 from colliding with magnetic circuit assembly 1125 when vibrating membrane 1121, the maximum amplitude of vibrating membrane 1121 may be designed not to exceed 0.8 mm, i.e., the amplitude of vibrating membrane 1121 may be in the range of 0 mm to 0.8 mm. In some embodiments, the amplitude of vibrating membrane 1121 may be in the range of 0 mm to 0.75 mm. In some embodiments, the amplitude of vibrating membrane 1121 may be in the range of 0 mm to 0.7 mm.

[0082] In some embodiments, within an amplitude range of 0 mm to 0.8 mm, the difference in amplitude between the two opposite vibration directions (i.e., upward and downward vibrations) of the vibrating membrane 1121 may be less than 0.05 mm, thereby reducing the degree of distortion of the transducer 112. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude between the two opposite vibration directions (i.e., upward and downward vibrations) of the vibrating membrane 1121 may be less than 0.04 mm. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude between the two opposite vibration directions (i.e., upward and downward vibrations) of the vibrating membrane 1121 may be less than 0.03 mm.

[0083] 8 and 9, in some embodiments, the support frame 1123 is installed to surround the magnetic circuit assembly 1125. As shown in Fig. 9, in the vibration direction of the vibrating membrane, the support frame 1123 may include a first portion 112311, a second portion 11232, and a third portion 11233. The first portion 112311 is a portion between the highest point D of the connection area between the support frame 1123 and the vibrating membrane 1121 and the highest point of the connection area between the support frame 1123 and the housing member 11253 in the vibration direction of the vibrating membrane 1121. The second portion 11232 is a region in which vent holes are formed in the support frame 1123. As shown in FIG. 9, the second portion 11232 is a portion between the highest point of the connection region between the support frame 1123 and the housing member 11253 and the side wall on which the bottom of the vent hole of the support frame 1123 is located (i.e., toward the bottom 11253a of the housing member 11253) in the vibration direction of the vibrating membrane 1121. The third portion 11233 is a portion between the side wall on which the bottom of the vent hole of the support frame 1123 is located and the bottom of the support frame 1123 closer to the magnetic circuit assembly 1125 (i.e., closer to the bottom 11253a of the housing member 11253). As shown in FIG. 10, a second connection portion 11212b for connecting the support frame 1123 is provided at one end of the edge region 11212 away from the main body region 11211. The second connecting portion 11212b is arranged parallel to the short axis direction Z and perpendicular to the vibration direction of the vibrating membrane. In some embodiments, the first portion 112311 of the support frame 1123 is connected to the second connecting portion 11212b of the edge region 11212. In some embodiments, the second connecting portion 11212b of the edge region 11212 is connected to the first portion 112311 of the support frame 1123 by a fixing ring 1155, thereby realizing fixation between the vibrating membrane 1121 and the support frame 1123.

[0084] 13 is an exemplary structural diagram of a partial structure of a back cavity according to some embodiments of the present disclosure. As shown in FIGS. 6 and 13, in some embodiments, a connecting frame 115 may be installed in the housing 111, and a second acoustic cavity may be surrounded by the connecting frame 115 and the support frame 1123 of the transducer 112, and the second acoustic cavity may function as the back cavity 116. The back cavity 116 is separated from other structures (e.g., a main control circuit board, etc.) in the housing 111, which helps to improve the acoustic expressiveness of the sound-generating unit 11. A decompression hole (e.g., a first decompression hole 111c and / or a second decompression hole 111d) is provided in the housing 111, and an acoustic passage 1151 is provided in the connecting frame 115 to connect the decompression hole and the back cavity 116, facilitating communication between the back cavity 116 and the external environment, i.e., air can freely enter and exit the back cavity 116, thereby helping to reduce the resistance in the vibration process of the vibrating membrane 1121 of the transducer 112.

[0085] In some embodiments, the cross section of the back cavity 116 may be composed of two perpendicular sides and one curved side, and the two end points of the curved side may be connected to form a cross section (e.g., cross section ABC) that is approximately triangular. The hypotenuse AC is formed by a line connecting the two end points formed by the contact between the curved surface formed on the connection frame 115 and the two straight sides of the support frame 1123. In some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 in the vibration direction of the vibrating membrane 1121 can affect the volume of the back cavity 116. If the thickness h4 of the first portion 112311 is increased, the volume of the back cavity 116 decreases if the volume of the entire sound generating unit 11 remains unchanged. Accordingly, if the thickness h4 of the first portion 112311 is decreased, the volume of the back cavity 116 increases. In some embodiments, the thickness of the first portion 112311 of the support frame 1123 can affect the volume of the back cavity 116, thereby affecting the resonant frequency of the back cavity 116. In some embodiments, the back cavity 116 may be a cavity configured on the rear side of the vibrating membrane, in which case, if the thickness h4 of the first portion 112311 of the support frame 1123 increases, the volume of the back cavity 116 increases if the volume of the entire sound-generating unit 11 remains unchanged, and correspondingly, if the thickness h4 of the first portion 112311 decreases, the volume of the back cavity 116 decreases.

[0086] In some embodiments, the combination of the back cavity 116 and the decompression holes (e.g., the first decompression hole 111c and / or the second decompression hole 111d) installed in the housing 111 can be considered as a Helmholtz resonant cavity model. The back cavity 116 can function as the cavity of the Helmholtz resonant cavity model, and the decompression holes can function as the neck of the Helmholtz resonant cavity model. In this case, the resonant frequency of the Helmholtz resonant cavity model is the resonant frequency f2 of the back cavity 116. In the Helmholtz resonant cavity model, the volume of the cavity (e.g., the back cavity 116) can affect the resonant frequency f of the cavity (e.g., the back cavity 116), and the specific relationship is as shown in Equation (1).

[0087]

number

[0088] where c represents the speed of sound, S represents the cross-sectional area of ​​the neck (e.g., decompression hole), V represents the volume of the cavity (e.g., back cavity 116), and L represents the depth of the neck (e.g., decompression hole).

[0089] As can be seen from equation (1), if the cross-sectional area S of the decompression hole (e.g., the first decompression hole 111c and / or the second decompression hole 111d) and the depth L of the decompression hole do not change, as the volume of the back cavity 116 increases, the resonant frequency f2 of the back cavity 116 decreases, i.e., moves to a lower frequency.

[0090] 14 is a frequency response curve diagram of the back cavity corresponding to different thicknesses of the first portion 112311 according to some embodiments of the present disclosure. As can be seen from FIG. 14, as the thickness h4 of the first portion 112311 of the support frame 1123 gradually increases from 0.3 mm to 3 mm, the volume of the back cavity 116 gradually increases, the resonance peak of the back cavity 116 gradually moves to lower frequencies, and the flat range of the frequency response curve decreases, which affects the output performance of the sound-generating unit 11.

[0091] If the thickness h4 of the first portion 112311 is too small, the amplitude of the vibrating membrane 1121 is limited by the support frame 1123. If the thickness h4 of the first portion 112311 is too large, the overall dimensions of the sound generating unit 11 become too large, the resonance peak of the back cavity 116 shifts to lower frequencies, and the range of the flat region of the frequency response curve of the back cavity 116 decreases, affecting the sound quality of the sound generating unit 11. The thickness of the first portion 112311 is the minimum distance in the vibration direction of the vibrating membrane 1121 between the connection region between the support frame 1123 and the edge region 11212 and the region directly bonded to the magnetic circuit assembly 1125.

[0092] In some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 may be in the range of 0.3 mm to 3 mm to provide the sound-generating unit 11 with high low-frequency output and to increase the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.5 mm to 2 mm to further improve the low-frequency output of the sound-generating unit 11. In some embodiments, the thickness h4 of the first portion 112311 may be in the range of 0.8 mm to 1 mm to further increase the flat region of the frequency response curve of the back cavity 116. In some embodiments, the thickness h4 of the first portion 112311 may be 0.9 mm, in which case the resonance peak of the back cavity 116 is near 6.1 kHz, the sound-generating unit 11 has excellent low-frequency output, and the frequency response curve of the back cavity 116 has a wide flat region.

[0093] In some embodiments, the weight of the transducer 112 is primarily related to the support frame 1123 and the magnetic circuit assembly 1125, with the weight of the magnetic circuit assembly 1125 accounting for a large proportion. In some embodiments, if the material of the support frame 1123 remains unchanged, an increase in the weight of the support frame 1123 may mean an increase in the dimensions of the support frame 1123, which may correspond to an increase in the area of ​​the diaphragm 1121. In some embodiments, an increase in the weight of the magnetic circuit assembly 1125 increases the magnetic induction strength near the coil 1122, which increases the driving force generated on the coil and the amplitude of the diaphragm 1121, resulting in higher sensitivity and better low-frequency performance for the transducer 112. However, if the weight of the transducer 112 is too large, the weight of the sound-generating unit 11 becomes too large, which affects the wearing stability and comfort of the open-type earphone 10.

[0094] Considering the two types of wearing situations—at least a portion of the sound generating unit 11 covering the antihelix region as shown in FIG. 3 and the entire or partial sound generating unit 11 inserted into the cavity of the concha as shown in FIG. 4—the volume of sound heard by the ear 100 increases (corresponding to higher sound generation efficiency). Therefore, the weight of the transducer 112 can be reduced by, for example, reducing the dimensions of the diaphragm 1121 or the weight of the magnetic circuit assembly 1125. This allows the transducer 112 to have high sensitivity and low-frequency output, while providing the open-type earphone 10 with high wearing stability and comfort. In some embodiments, the weight of the transducer 112 may be in the range of 1.1 g to 3.3 g. In some embodiments, the weight of the transducer 112 may be in the range of 1.5 g to 3 g to further improve the sensitivity and low-frequency output of the transducer 112. In some embodiments, the weight of the transducer 112 may be in the range of 2 g to 2.5 g to further improve the wearing stability and comfort of the open-type earphone 10. In some embodiments, the weight of the transducer 112 may be 2.2 g.

[0095] FIG. 15 is a frequency response curve diagram of the sound generating unit at different driving voltages according to some embodiments of the present disclosure. The surface of the diaphragm of speaker 112 is directly facing a measurement microphone at a distance of 4 mm. A voltage in the range of 0.1 V to 0.7 V is applied to speaker 112. The measurement frequency range is set to 20 Hz to 20,000 Hz. The frequency response curves (shown in FIG. 15) of speaker 112 at different driving voltages are obtained. As shown in FIGS. 12 and 15, when the input voltage is in the range of 0.1 V to 0.7 V and the frequency is in the range of 20 Hz to 6.1 kHz, the amplitude of diaphragm 1121 is in the range of 0 mm to 0.8 mm. In this case, to prevent coil 1122 from contacting bottom 11253 a of the housing member during vibration, distance h3 (shown in FIG. 9) between the bottom of coil 1122 and bottom 11253 a of the housing member may be greater than 0.8 mm. In some embodiments, to reduce the size of the sound-generating unit 11 and improve user comfort when worn, the distance h3 (shown in FIG. 9) between the bottom of the coil 1122 and the bottom 11253a of the housing member may be 0.9 mm or less. Therefore, for an input voltage of 0.1 V to 0.7 V and a frequency range of 20 Hz to 6.1 kHz, the distance h3 (shown in FIG. 9) from the bottom of the coil 1122 to the bottom 11253a of the housing member may be in the range of 0.8 mm to 0.9 mm.

[0096] As shown in Fig. 15, as the input voltage gradually increases from 100 mV to 700 mV, the output of sound generating unit 11 gradually increases, gradually increasing the sensitivity, but the frequency of the resonance peak remains almost constant and is located around 6.1 kHz. Considering the two types of wearing conditions—where at least a portion of sound generating unit 11 covers the antihelical region as shown in Fig. 3 above, and where all or a portion of sound generating unit 11 is inserted into the cavity of the concha as shown in Fig. 4—combinedly, sound generating unit 11 has high sensitivity by controlling the distance h3 (shown in Fig. 9) from the bottom of coil 1122 to bottom 11253a of the housing member within a range of 0.8 mm to 0.9 mm. As shown in Fig. 15, when the input voltage is 100 mV to 700 mV, the sound pressure level (SPL) of sound generating unit 11 at a frequency of 1 kHz is within a range of 85 dB to 103 dB.

[0097] As can be seen from the above, in some embodiments, the thickness h4 of the first portion 112311 of the support frame 1123 is in the range of 0.3 mm to 3 mm. When the thickness h4 of the first portion 112311 increases to 3 mm, the resonant frequency f2 of the corresponding back cavity 116 decreases to 3.3 kHz, reducing the flat region and affecting the sound quality. In some embodiments, to increase the flat region and improve the sound quality of the sound generating unit 11, the thickness h4 of the first portion 112311 may be less than 3 mm, and the resonant frequency f2 of the back cavity 116 may be 3.3 kHz or higher. In some embodiments, to further improve the sound quality of the sound generating unit 11, the resonant frequency f2 of the back cavity 116 may be 3.5 kHz or higher. In some embodiments, to further improve the sound quality of the sound generating unit 11, the resonant frequency f2 of the back cavity 116 may be 4 kHz or higher. In some embodiments, to further improve the sound quality of the sound-generating unit 11, the resonant frequency f2 of the back cavity 116 may be 6 kHz or higher.

[0098] In some embodiments, according to equation (1), the volume of the back cavity 116 can affect the resonant frequency f2 of the back cavity 116. The volume of the back cavity 116 is affected by the thickness h4 of the first portion 112311 of the support frame 1123. Based on the range of values ​​of the thickness h4 of the first portion 112311 and the range of values ​​of the resonant frequency f2 of the back cavity 116, the range of values ​​of the volume of the back cavity 116 can be determined. In some embodiments, the volume of the back cavity 116 is 60 mm 3 ~110mm 3 may be.

[0099] 16 is an exemplary schematic location diagram of a support frame, a first decompression hole, and a second decompression hole according to some embodiments of the present disclosure. As shown in FIG. 16, in some embodiments, a plurality of air vents 11231 are formed in the support frame 1123. The provision of the air vents 11231 allows sound from the back of the diaphragm 1121 to be transmitted to the back cavity 116 and the decompression holes through the plurality of air vents 11231 and then propagated to the outside, providing a good path for sound to radiate to both sides of the diaphragm 1121.

[0100] In some embodiments, the plurality of vent holes 11231 may be designed asymmetrically to better balance the airflow and the air pressure within the back cavity 116. For example, the plurality of vent holes 11231 may be arranged asymmetrically around the short axis of the support frame 1123. Specifically, a first vent hole 11231a and a second vent hole 11231b are formed in the support frame 1123. As shown in FIG. 16 , the distance La between the center of the first vent hole 11231a and the center of the second decompression hole 111d is greater than the distance Lb between the center of the second vent hole 11231b and the center of the second decompression hole 111d. In some embodiments, the area of ​​the first vent hole 11231a is larger than the area of ​​the second vent hole 11231b to balance the air pressure in the back cavity 116 because the air pressure in the back cavity 116 is higher at locations farther from the second decompression hole 111d. That is, to balance the air pressure in the back cavity 116, the area of ​​the vent hole is smaller the closer to the second decompression hole 111d (or the first decompression hole 111c) and the area of ​​the vent hole is larger the farther from the second decompression hole 111d (or the first decompression hole 111c). The distance between the vent hole 11231 and the decompression hole is the distance between the center of the vent hole 11231 and the center of the corresponding decompression hole. As used herein, the center of the vent hole or decompression hole is the geometric center of the pore-like structure.

[0101] In the back cavity 116, the air pressure is high at positions far from the first decompression hole 111c and / or the second decompression hole 111d, so the area of ​​the air vent 11231 can be set large. In the positions close to the first decompression hole 111c and / or the second decompression hole 111d, the air pressure is low, so the area of ​​the air vent 11231 can be set small. Even if the areas of the multiple air vents 11231 are the same, the air pressure is high at positions far from the first decompression hole 111c and / or the second decompression hole 111d in the back cavity 116, and the area of ​​the air vent 11231 is small. Therefore, the air pressure in the back cavity 116 cannot be well balanced, and the air resistance experienced by the diaphragm 1121 when vibrating there is large. Similarly, the resistance experienced by the diaphragm 1121 when vibrating is small at positions close to the first decompression hole 111c and / or the second decompression hole 111d in the back cavity 116. This causes the force that vibrating membrane 1121 receives to be non-uniform, resulting in unstable vibration of vibrating membrane 1121. Therefore, by adjusting the area of ​​air hole 11231, the low-frequency vibration of sound generating unit 11 can be made more stable.

[0102] In some embodiments, the air vents 11231 can balance the air pressure within the back cavity 116, which affects the uniformity of the air resistance experienced by the vibrating membrane 1121 when it vibrates. Therefore, the total area of ​​the air vents 11231 can affect the output performance of the sound generating unit 11. The ratio of the total area of ​​the multiple air vents 11231 to the projected area of ​​the vibrating membrane 1121 in the vibration direction can affect the air resistance experienced by the vibrating membrane 1121 when it vibrates. If the ratio of the total area of ​​the multiple air vents 11231 to the projected area of ​​the vibrating membrane 1121 in the vibration direction is too small, the air pressure within the back cavity 116 increases, which increases the air resistance experienced by the vibrating membrane 1121 when it vibrates, affecting the low-frequency output performance of the vibrating membrane 1121. After the ratio of the total area of ​​the plurality of vents 11231 to the projected area in the vibration direction of the vibrating membrane 1121 reaches a certain threshold, further increasing the ratio reduces the change in the influence of the air in the back cavity 116 on the vibration of the vibrating membrane 1121 and affects the structural strength of the support frame. Therefore, in some embodiments, to ensure uniform and low air resistance when the vibrating membrane 1121 vibrates and excellent output performance of the sound generating unit 11, the ratio of the total area of ​​the plurality of vents 11231 to the projected area in the vibration direction of the vibrating membrane 1121 may be in the range of 0.008 to 0.3. In some embodiments, to further reduce the air resistance when the vibrating membrane 1121 vibrates, the ratio of the total area of ​​the plurality of vents 11231 to the projected area in the vibration direction of the vibrating membrane 1121 may be in the range of 0.1 to 0.25. In some embodiments, in order to further reduce the air resistance experienced when the vibrating membrane 1121 vibrates, the ratio of the total area of ​​the multiple air vents 11231 to the projected area of ​​the vibrating membrane 1121 in the vibration direction may be in the range of 0.11 to 0.23.

[0103] FIG. 17 shows frequency response curves of the back cavity corresponding to different total areas of the vent holes according to some embodiments of the present disclosure. Different total areas of the vent holes 11231 can be achieved by blocking the vent holes 11231 with rubber clay. By placing the surface of the diaphragm of the speaker 112 directly facing the measurement microphone at a distance of 4 mm, applying a voltage of 0.4 V to the speaker 112, and setting the measurement frequency range to 20 Hz to 20,000 Hz, the frequency response curves (shown in FIG. 17) for different vent hole areas of the speaker 112 can be obtained. 2 means that the ventilation holes 11231 are completely blocked, i.e., no holes are formed in the support frame. As shown in FIG. 17, the total area of ​​the ventilation holes 11231 is 0 mm 2 to 4.54 mm 2 As the total area of ​​the vent holes 11231 gradually increases to 4.54 mm, the frequency response curve of the back cavity 116 gradually moves upward in the low frequency (e.g., 100 Hz to 1000 Hz) region, i.e., the low frequency response of the back cavity 116 gradually increases. 2 from 12.96 mm 2 The change in the low frequency response of the back cavity 116 is not obvious during the process of gradually increasing the total area of ​​the vent holes 11231 to a constant area (e.g., 4.54 mm 2 ), the effect of the air in the back cavity 116 on the vibration of the vibrating membrane 1121 gradually weakens in low-frequency vibrations, so even if the total area of ​​the air vents 11231 is further increased, the effect on the frequency response curve of the back cavity 116 in the low-frequency range is not significant.

[0104] As shown in Figure 17, the total area of ​​the ventilation hole 11231 is 0 mm 2 from 12.96 mm 2 As the area of ​​the vent holes 11231 increases to 4.54 mm, the resonance peak of the back cavity 116 gradually shifts to higher frequencies, and the frequency response curve in the low frequency range (e.g., 100 Hz to 1000 Hz) gradually flattens. In some embodiments, to provide the back cavity 116 with excellent low frequency response, the total area of ​​the vent holes 11231 is set to 4.54 mm. 2 ~12.96mm2 In some embodiments, to provide good low frequency response in the back cavity 116, the total area of ​​the vent holes 11231 may be in the range of 5 mm 2 ~11mm 2 In some embodiments, to provide good low frequency response in the back cavity 116, the total area of ​​the vent holes 11231 may be in the range of 7 mm 2 ~10mm 2 In some embodiments, to provide good low frequency response in the back cavity 116, the total area of ​​the vent holes 11231 may be in the range of 8 mm 2 ~10mm 2 may be in the range of

[0105] In some embodiments, in order to improve structural strength, multiple ventilation holes 11231 may be formed in the support frame 1123, and reinforcing ribs may be formed at the connections between the multiple ventilation holes 11231. In some embodiments, when the total area of ​​the ventilation holes 11231 is filled, the number of ventilation holes 11231 may be set to only one in order to simplify the process of forming the holes.

[0106] In some embodiments, multiple vent holes may also be formed in the bottom 11253a or sidewall 11253b of the housing member 11253 of the magnetic circuit assembly 1125. Sound at the back of the diaphragm 1121 may be transmitted to the back cavity 116 and the decompression holes through the multiple vent holes, and the vent holes provide a good passage for sound to radiate to both sides of the diaphragm 1121.

[0107] In some embodiments, the projected area of ​​the vibrating membrane 1121 in the vibration direction affects the amount of air pushed by the vibrating membrane 1121 when it vibrates, which affects the efficiency with which the vibrating membrane 1121 vibrates to generate sound, and affects the sound output effect of the sound generating unit 11. If the projected area of ​​the vibrating membrane 1121 in the vibration direction is too small, the amount of air pushed by the vibrating membrane 1121 when it vibrates is small, resulting in a low sound output effect of the sound generating unit 11. If the projected area of ​​the vibrating membrane 1121 in the vibration direction is too large, the dimensions of the support frame 1123 become too large, which increases the weight of the support frame 1123 and increases the weight of the sound generating unit 11, which affects the structure and weight of the sound generating unit 11 and affects the comfort and stability of wearing the sound generating unit 11. 3 , where at least a portion of the sound generating unit 11 covers the antihelix region, and FIG. 4 , where all or a portion of the sound generating unit 11 is inserted into the cavity of the concha, the sound volume heard by the ear 100 increases (corresponding to higher sound emission efficiency), so the dimensions of the diaphragm 1121 do not need to be too large. In some embodiments, the sound emission hole 111 a is provided on a side wall of the housing 111 of the sound generating unit 11 that is close to the user's ear, the sound emission hole 111 a is provided on the front side of the diaphragm 1121 and communicates with the front cavity 114, the vibration direction of the diaphragm 1121 is the thickness direction X of the sound generating unit 11 or is approximately equivalent thereto, the projected area of ​​the diaphragm 1121 in the vibration direction is the thickness direction X of the sound generating unit 11 or is approximately equivalent thereto, and the projected area of ​​the diaphragm 1121 in the vibration direction affects the projected area of ​​the sound generating unit 11 in the sagittal plane of the user. The overlap ratio between the projection area of ​​the sound generating unit 11 onto the sagittal plane of the user and the projection area of ​​the concha cavity onto the sagittal plane affects the similar cavity structure formed when the sound generating unit 11 is inserted into the concha cavity, thereby affecting the acoustic output effect of the sound generating unit 11. Furthermore, the major and minor axis dimensions of the vibrating membrane 1121 can affect the major and minor axis dimensions of the projection of the sound generating unit 11 onto the sagittal plane.

[0108] In some embodiments, taking into consideration two situations in which at least a part of the sound generating unit 11 shown in FIG. 3 covers the antihelix region and the whole or a part of the sound generating unit 11 shown in FIG. 4 is inserted into the cavity of the concha, the sound generating unit 11 has an excellent acoustic output, and the projection of the sound generating unit 11 onto the sagittal plane has an appropriate area or the sound generating unit 11 has an appropriate thickness, the projection area of ​​the diaphragm 1121 in the vibration direction is set to 90 mm 2 ~560mm 2 Preferably, the projected area of ​​the vibrating membrane 1121 in the vibration direction is 120 mm 2 ~300mm 2 More preferably, the projected area of ​​the vibrating membrane 1121 in the vibration direction is 150 mm 2 ~200mm 2 may be.

[0109] Taking into consideration the two situations, namely, that at least a portion of the sound generating unit 11 shown in FIG. 3 covers the antihelix region, and that the whole or a portion of the sound generating unit 11 shown in FIG. 4 is inserted into the cavity of the concha, in order to improve the acoustic output performance of the sound generating unit 11 by making the vibrating membrane 1121 have as large an area as possible within the limited dimensions of the sound generating unit 11, in some embodiments, when the vibration direction of the vibrating membrane 1121 is parallel to the thickness direction X of the sound generating unit 11, the ratio of the projection area of ​​the vibrating membrane 1121 in the vibration direction of the vibrating membrane (i.e., the projection area of ​​the vibrating membrane 1121 on the sagittal plane) to the projection area of ​​the housing 111 in the vibration direction of the vibrating membrane (i.e., the projection area of ​​the housing 111 on the sagittal plane) may be 0.5 or more. In some embodiments, in order to increase the area of ​​the vibrating membrane 1121 as large as possible within the limited dimensions of the sound generating unit 11 and thereby improve the sound output performance of the sound generating unit 11, the ratio of the projected area of ​​the vibrating membrane 1121 in the vibration direction of the vibrating membrane to the projected area of ​​the housing 111 in the vibration direction of the vibrating membrane may be 0.8 or more. In some embodiments, in order to increase the area of ​​the vibrating membrane 1121 as large as possible and thereby improve the sound output performance of the sound generating unit 11, the ratio of the projected area of ​​the vibrating membrane 1121 in the vibration direction of the vibrating membrane to the projected area of ​​the housing 111 in the vibration direction of the vibrating membrane may be in the range of 0.8 to 0.95.

[0110] In some embodiments, in combination with the wearing method in which at least a part of the sound generating unit 11 covers the antihelix region as shown in FIG. 3, the long axis dimension of the diaphragm 1121 may be in the range of 13 mm to 25 mm, and the short axis dimension of the diaphragm may be in the range of 4 mm to 13 mm. In combination with the wearing method in which the whole or a part of the sound generating unit 11 is inserted into the cavity of the concha as shown in FIG. 4, the short axis dimension of the diaphragm 1121 may be in the range of 4 mm to 13 mm, in order to facilitate the whole or a part of the sound generating unit 11 being inserted into the cavity of the concha to form an effective similar cavity. Based on the above short axis dimension, the projected area of ​​the diaphragm 1121 (for example, the projected area of ​​the diaphragm 1121 in the vibration direction) is 52 mm. 2 ~325mm 2Based on the above (the dimensions are within the range of 13 mm to 25 mm), it is further determined that the major axis dimension of diaphragm 1121 is within the range of 13 mm to 25 mm. For example, the major axis dimension of diaphragm 1121 may be within the range of 15 mm to 20 mm, and the minor axis dimension of diaphragm may be within the range of 5 mm to 10 mm. Also, for example, the major axis dimension of diaphragm 1121 may be within the range of 17 mm to 18 mm, and the minor axis dimension of diaphragm may be within the range of 7 mm to 8 mm.

[0111] Although the basic concepts have been described above, it will be apparent to those skilled in the art that the above detailed disclosure is merely illustrative and does not limit the present application. Although not expressly described herein, those skilled in the art may make various changes, improvements, and modifications to the present application. These changes, improvements, and modifications are intended to be suggested by the present application and therefore remain within the spirit and scope of the exemplary embodiments of the present application.

[0112] Furthermore, certain terms are used herein to describe embodiments of the present application. For example, "one embodiment," "one embodiment," and / or "some embodiments" refer to particular features, structures, or characteristics associated with at least one embodiment of the present application. Therefore, it is emphasized and understood that references to "one embodiment" or "one embodiment" or "one alternative embodiment" more than once in various parts of this specification do not necessarily all refer to the same embodiment. Furthermore, particular features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

[0113] Moreover, as will be appreciated by those skilled in the art, aspects of the present application may be illustrated and described in several patentable classes or contexts, including any new and useful process, machine, manufacture, or combination of matter, or any new and useful improvement thereto. Accordingly, aspects of the present application may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. Such hardware or software may be referred to as a "data block," "module," "engine," "unit," "assembly," or "system." Aspects of the present application may also take the form of a computer program product embodied in one or more computer-readable medium(s) containing computer-readable program code.

[0114] The computer storage medium may include a propagated data signal, propagated in baseband or as part of a carrier wave, for carrying computer program code. The propagated signal may take various forms, such as an electromagnetic signal, an optical signal, or a suitable combination. The computer storage medium may be any computer-readable medium other than a computer-readable storage medium, which can be coupled to an instruction execution system, device, or apparatus to achieve communication, propagation, or transmission of a program used therein. The program code on the computer storage medium may be propagated via any suitable medium, including wireless, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0115] Computer program code necessary for the operation of portions of this application may be coded in one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc.; traditional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, etc.; dynamic programming languages ​​such as Python, Ruby, and Groovy, or other programming languages. The program code may run entirely on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or processing device. In the latter case, the remote computer may be connected to the user's computer by any form of network, such as a local area network (LAN) or wide area network (WAN), connected to an external computer (e.g., via the Internet), in a cloud computing environment, or used as a service, such as Software as a Service (SaaS).

[0116] Furthermore, unless expressly stated in the claims, the enumerated order, use of alphanumeric characters, or use of other designations of processing elements or sequences described herein does not limit the order of procedures and methods herein. While the above disclosure has set forth through various examples what are presently believed to be various useful embodiments of the invention, it should be understood that such details are merely illustrative, and that the appended claims are not limited to only the disclosed embodiments, but on the contrary, are intended to cover all modifications and equivalent combinations within the spirit and scope of the embodiments herein. For example, the system assembly described above may be implemented by a hardware device, or may be implemented as a software-only solution, e.g., by installing the described system on an existing server or mobile device.

[0117] Similarly, in the foregoing description of embodiments of the present application, various features may be grouped together in a single embodiment, drawing, or description for the purpose of simplifying the description of the present disclosure and facilitating an understanding of one or more embodiments of the present invention. However, this method of disclosure should not be interpreted as reflecting an intention that the present subject matter requires more features than are recited in each claim. Rather, claimed subject matter may comprise less than all features of a single foregoing disclosed embodiment.

[0118] In some examples, numbers describing the number of components and attributes are used; it should be understood that the numbers describing such examples are, in some instances, modified by the modifiers "about," "approximately," or "generally." Unless otherwise specified, "about," "approximately," or "substantially" indicates that a variation of ±20% from the value described by the number is permitted. Accordingly, in some implementations, all numerical parameters used in the specification and claims are approximations that may vary depending on the characteristics required for a particular embodiment. In some embodiments, numerical parameters should be calculated taking into account the number of significant digits specified and ordinary rounding techniques should be applied. While in some embodiments, the numerical ranges and parameters used to determine ranges are approximations, in specific embodiments, such numerical values ​​are set as precisely as possible.

[0119] All patents, patent applications, published patent applications, and other materials, such as papers, books, specifications, publications, and documents, referenced in this application are incorporated herein by reference in their entirety, except for prosecution history documents that are inconsistent with or inconsistent with the content of this application and documents that may have a limiting effect on the broadest scope of the claims of this application (now or later related to this application). Furthermore, if the explanations, definitions, and / or term usage in the accompanying materials of this application are inconsistent with or inconsistent with the content set forth in this application, the explanations, definitions, and / or term usage in this application shall control.

[0120] Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the present embodiments. Other variations may be within the scope of the present application. Thus, by way of example, and not of limitation, alternative configurations of the present embodiments may be considered consistent with the teachings of the present application. Accordingly, the present embodiments are not limited to the embodiments expressly introduced and described herein. [Explanation of symbols]

[0121] 11 Sound generating unit 112 Transducer 11211 Body area 11212 Edge Area 1122 Coil 1123 Support Frame 1124 terminal 1125 Magnetic Circuit Assembly 11251 Magnetic permeable plate 11252 Magnet 11253 Storage components 1155 fixing ring 111 Housing 111a Sound emission hole 111c First decompression hole 111d Second decompression hole 114 Front cavity 115 Connection Frame 1151 Acoustic Corridor 116 Back Cavity 12 ear hooks

Claims

1. A diaphragm; The magnetic circuit assembly includes a magnetic circuit assembly, a coil, a support frame surrounding the magnetic circuit assembly, and a housing. The coil is connected to the diaphragm, and at least a portion of the coil is located in a magnetic gap formed by the magnetic circuit assembly. When energized, the coil vibrates the diaphragm to generate sound. The diaphragm includes a main body region and an edge region surrounding the main body region. the support frame is connected to a portion of the edge region that is spaced apart from the main body region, and a plurality of ventilation holes are formed in the support frame; a decompression hole is provided in the housing, sound from the back surface of the diaphragm is transmitted to the decompression hole through the plurality of air vents, the plurality of air vents include at least a first air vent and a second air vent, the distance from the center of the first air vent to the center of the decompression hole is greater than the distance from the center of the second air vent to the center of the decompression hole, and the area of ​​the first air vent is greater than the area of ​​the second air vent.

2. 2. The sound generating unit according to claim 1, wherein a ratio of a total area of ​​the plurality of air holes to a projected area of ​​the vibration membrane is within a range of 0.008 to 0.

3.

3. In the vibration direction of the diaphragm, the projected area of ​​the diaphragm is 90 mm ２ ~560mm ２ and the total area of ​​the plurality of vent holes is within the range of 4.54 mm ２ ~12.96mm ２ The sound generating unit according to claim 2, characterized in that the sound generating unit has a frequency within a range of 100 kHz to 100 kHz.

4. 2. The sound generating unit of claim 1, wherein the main body region includes a first inclined portion and a first connection portion connected to the coil, the first inclined portion being bonded to a portion of the edge region, and the first inclined portion being inclined in a direction away from the coil relative to the first connection portion.

5. 5. The sound generating unit according to claim 4, wherein the edge region includes an arcuate portion, and the ratio of the height of the arcuate portion to the span of the arcuate portion is in the range of 0.35 to 0.

4.

6. The sound generating unit of claim 4, characterized in that the inclination angle of the first inclined portion relative to the first connecting portion is within a range of 5° to 30°, and the first connecting portion is perpendicular to the vibration direction of the vibrating membrane.

7. 5. The sound generating unit of claim 4, wherein the main body region includes a dome located at one end of the first connecting portion away from the first inclined portion, the dome having a span in the range of 2 mm to 8 mm and a height in the range of 0.7 mm to 1.2 mm.

8. 8. The sound generating unit according to claim 7, wherein the ratio of the height to the span of the dome is in the range of 0.1 to 0.

3.

9. 5. The sound generating unit according to claim 4, wherein the minimum distance from the coil to the first inclined portion is 0.3 mm or more.

10. 2. The sound generating unit according to claim 1, wherein the first portion of the support frame is connected to the second connection portion of the edge region.

11. 2. The sound generating unit according to claim 1, wherein the pressure reducing hole is provided in the housing, a back cavity is formed between the pressure reducing hole and the back surface of the vibration membrane, and a resonance frequency of the back cavity is 3.3 kHz or more.

12. 2. The sound generating unit according to claim 1, wherein a ratio of a projected area of ​​the diaphragm to a projected area of ​​the housing in a vibration direction of the diaphragm is 0.5 or more.

13. 2. The sound generating unit according to claim 1, wherein the magnetic circuit assembly includes a housing member, and a plurality of ventilation holes are formed in a bottom wall of the housing member of the magnetic circuit assembly or in a side wall attached to the support frame.

14. 2. The sound generating unit of claim 1, wherein the magnetic circuit assembly includes a magnetically permeable plate and a magnet, the magnetically permeable plate is positioned between the magnet and the vibration membrane and is attached to a surface of the magnet, and the distance between the center of the coil and the center of the magnetically permeable plate in the vibration direction of the vibration membrane is less than 0.3 mm.

15. 2. The sound generating unit of claim 1, wherein the magnetic circuit assembly includes a housing member, and the distance between the bottom of the coil and the bottom wall of the housing member in the vibration direction of the vibration membrane is within a range of 0.2 mm to 4 mm.

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