adhesive tape

Abstract

To provide an adhesive tape that can be readily detected by an X-ray inspection apparatus.SOLUTION: An adhesive tape 1 includes: a substrate 2 having flexibility and stretching property; and an adhesive layer 3 provided to at least one surface of the substrate 2. The adhesive tape 1 includes tungsten-containing powder 4.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an adhesive tape. [Background technology]

[0002] For example, adhesive tapes used in bandages and the like have adhesiveness, flexibility, and stretchability, so they can be easily attached to an object, such as human skin, and they easily deform to follow the movement of the object, so they tend to maintain a relatively good adhesion to the object. However, even such adhesive tapes can lose their adhesive strength over time, causing them to peel off and fall off from the object. For example, when adhesive tapes are used in food factories that manufacture or process food, if they fall off from the object, they may become contaminated with the food.

[0003] In food factories that manufacture and process food, the contamination of food with foreign objects such as adhesive tape is an important issue that must be avoided due to hygiene concerns. Therefore, in food factories, the first priority is to prevent food contamination. However, even if food is contaminated with foreign objects, if the foreign objects can be detected before the food is shipped, the distribution of contaminated food can be prevented. From this perspective, Patent Document 1, for example, discloses an adhesive tape in which metal powder made of a magnetic material or the like is formed as part of its components, so that it can be easily detected even if it falls off the object to which it is attached and gets mixed into food. Even if part or all of the adhesive tape disclosed in Patent Document 1 gets mixed into food, it can be detected by a metal detector, taking advantage of the fact that the metal powder made of a magnetic material or the like reacts to metal detectors. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Publication No. 3-13304 Summary of the Invention [Problem to be solved by the invention]

[0005] Metal detectors have been widely used to detect foreign objects because they are low-cost and feasible, but in recent years, more and more companies have started to use more accurate X-ray inspection devices to more reliably detect foreign objects in food.

[0006] However, metal powder made of magnetic material or the like as disclosed in Patent Document 1 has low sensitivity to X-rays, and therefore needs to be contained in a large amount in the adhesive tape in order to be detected by an X-ray inspection device. The inclusion of a large amount of metal powder not only makes manufacturing difficult, but also makes the adhesive tape brittle, making it more susceptible to breakage during use.

[0007] The present invention has been made in view of the above-mentioned problems, and has an object to provide an adhesive tape that can be easily detected by an X-ray inspection device. [Means for solving the problem]

[0008] The adhesive tape of the present invention is an adhesive tape comprising a flexible and stretchable substrate and an adhesive layer provided on at least one surface of the substrate, wherein the adhesive tape contains tungsten-containing powder.

[0009] It is also preferable that a tungsten-containing layer containing tungsten-containing powder is provided on the surface of the substrate.

[0010] It is also preferable that the tungsten-containing layer is provided in a dispersed state on the surface of the substrate.

[0011] The substrate preferably contains tungsten-containing powder.

[0012] The pressure-sensitive adhesive layer preferably contains tungsten-containing powder.

[0013] In addition, it is preferable that the pressure-sensitive adhesive layer comprises a first pressure-sensitive adhesive layer provided on at least one surface of the substrate and containing the tungsten-containing powder, and a second pressure-sensitive adhesive layer provided on the surface of the first pressure-sensitive adhesive layer opposite the substrate and not containing the tungsten-containing powder. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide an adhesive tape that can be easily detected by an X-ray inspection device. [Brief explanation of the drawings]

[0015] [Figure 1] 1A and 1B are diagrams showing a bandage including an adhesive tape according to a first embodiment of the present invention, in which (a) is a bottom view of the bandage, and (b) is a cross-sectional view taken along line II in (a). [Figure 2] 1A and 1B are diagrams showing a bandage including an adhesive tape according to a second embodiment of the present invention, where (a) is a top view of the bandage, and (b) is a cross-sectional view taken along line II-II in (a). [Figure 3] FIG. 3 is a cross-sectional view of a bandage including an adhesive tape according to a third embodiment of the present invention. [Figure 4] FIG. 10 is a cross-sectional view of a bandage including an adhesive tape according to a fourth embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view of a bandage including an adhesive tape according to a fifth embodiment of the present invention. [Figure 6] FIG. 10 is a cross-sectional view of a bandage including an adhesive tape according to a sixth embodiment of the present invention. [Figure 7] FIG. 10 is a cross-sectional view of a bandage including an adhesive tape according to a seventh embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, pressure-sensitive adhesive tapes according to several embodiments of the present invention will be described with reference to the accompanying drawings. Figures 1 to 7 show adhesive bandages including pressure-sensitive adhesive tapes according to first to seventh embodiments of the present invention, respectively. However, these embodiments are merely illustrative, and the pressure-sensitive adhesive tape of the present invention is not limited to the following examples.

[0017] As shown in FIGS. 1 to 7 , the adhesive tapes 1 of the first to seventh embodiments comprise a flexible and stretchable substrate 2 and an adhesive layer 3 provided (directly or indirectly) on at least one surface of the substrate 2. The adhesive tape 1 is used by being attached to an object to be attached, such as human skin, by the adhesive layer 3 adhering to the object. As shown in the figures, the adhesive tape 1 can constitute a bandage B together with an absorbent pad P attached to the adhesive layer 3. By adhering the adhesive tape 1 to human skin, the absorbent pad P can be attached to a wound on the human skin in the bandage B. The adhesive tape 1 may be provided with multiple ventilation holes (not shown) to improve breathability. By providing multiple ventilation holes, the adhesive tape 1 can prevent the skin from becoming damp and humid. However, the adhesive tape 1 is not limited to being used as a component of a bandage B, as long as it is used by being attached to an object to be attached. For example, the adhesive tape 1 can be used for other purposes, such as taping to restrict joint movement in the human body. The adhesive tape 1 is particularly suitable for use in applications where it must be attached to an object, such as in food factories that manufacture or process food, where any detachment from the object must be detected by an X-ray inspection device.

[0018] The substrate 2 supports a pressure-sensitive adhesive layer 3 provided on at least one surface thereof, and is attached to an object via the pressure-sensitive adhesive layer 3. The substrate 2 is formed into a sheet-like shape using a film, a fabric such as a woven fabric, a knitted fabric, or a nonwoven fabric, or a combination thereof. The substrate 2 is formed to be flexible and stretchable, so that even when attached to an object that changes shape after attachment, such as human skin, it can easily deform to follow the change in shape of the object, and can maintain good adhesion to the object for a relatively long period of time.

[0019] The film used for the substrate 2 is not particularly limited, and films containing synthetic resins such as polyurethane, polyester, vinyl chloride, olefin, polycarbonate, polysulfine, polyphenylene sulfide, polyimide, and elastomer, and / or rubbers such as urethane rubber, silicone rubber, ethylene propylene rubber, nitrile rubber, hydrogenated nitrile rubber, styrene propylene rubber, and natural rubber can be used.

[0020] The fabric used for the substrate 2 is not particularly limited, and can be a nonwoven fabric, woven fabric or knitted fabric made of synthetic fibers such as polyester fiber, polyacrylic fiber, polyurethane fiber, nylon fiber or rayon fiber, and / or natural fibers such as wool, cotton, linen or silk.

[0021] The adhesive layer 3 adheres to an object to which it is to be attached, and attaches the base material 2 to the object to which it is to be attached. As shown in FIGS. 1 to 7, the adhesive layer 3 is provided continuously over the entire surface of the base material 2. However, the adhesive layer 3 may be provided partially or dispersedly on the surface of the base material 2 as long as it can attach the base material 2 to the object to which it is to be attached. The adhesive that constitutes the adhesive layer 3 is not particularly limited, and known adhesives such as natural rubber adhesives, synthetic rubber adhesives, acrylic adhesives, urethane adhesives, and silicone adhesives can be used.

[0022] As shown in FIGS. 1 to 7 , the adhesive tape 1 contains a tungsten-containing powder 4 that contains tungsten. Because the adhesive tape 1 contains the tungsten-containing powder 4, which has high sensitivity to X-rays, it can be more easily detected by an X-ray inspection device than adhesive tapes containing conventional iron-based magnetic powders. Therefore, even if the adhesive tape 1 falls off from an object to which it is attached in a food factory that manufactures or processes food, it can be easily detected by an X-ray inspection device, thereby preventing contamination of food. Furthermore, compared to conventional iron-based magnetic powders, even if the content of the tungsten-containing powder 4 is low, it can be detected by an X-ray inspection device, so the content of the tungsten-containing powder 4 can be kept low, and the breaking strength of the adhesive tape 1 can be maintained at a high level.

[0023] The tungsten-containing powder 4 is a powder (particle) containing tungsten, such as metallic tungsten powder, tungsten oxide (WO, etc.) powder, tungsten carbide powder, tungsten nitride powder, or a mixture thereof. Among these, metallic tungsten powder or tungsten oxide powder is preferably used. The size, shape, content, etc. of the tungsten-containing powder 4 are not particularly limited as long as it can be contained in the adhesive tape 1.

[0024] The particle size of the tungsten-containing powder 4 is not particularly limited and can be, for example, 0.1 to 50 μm. However, from the viewpoint of the dispersibility of the tungsten-containing powder 4 in the adhesive tape 1 and the breaking strength of the adhesive tape 1 containing the tungsten-containing powder 4, the particle size is preferably 0.4 to 10 μm, more preferably 0.6 to 4 μm, and even more preferably 1 to 3 μm.

[0025] The particle size distribution of the tungsten-containing powder 4 is not particularly limited, but in order to enhance the dispersibility of the tungsten-containing powder 4 within the adhesive tape 1, it is preferable that [(d90-d10) / d50], which is an index showing the spread of the particle size distribution determined by particle size distribution measurement using a laser diffraction method, be 2.0 or less. By setting the particle size distribution of the tungsten-containing powder 4 within the above range, the dispersibility of the tungsten-containing powder 4 within the adhesive tape 1 can be enhanced, and the processability of the adhesive tape 1 containing the tungsten-containing powder 4 can be improved. From this perspective, it is more preferable that [(d90-d10) / d50] of the tungsten-containing powder 4 be 1.6 or less, and even more preferably 1.2 or less.

[0026] The shape of the tungsten-containing powder 4 is not particularly limited, but is preferably substantially spherical in order to suppress secondary aggregation of the tungsten-containing powder 4 and improve dispersibility within the adhesive tape 1. By making the tungsten-containing powder 4 substantially spherical, adhesion between particles of tungsten-containing powder 4 is suppressed even if they come into contact with each other within the adhesive tape 1 during molding of the adhesive tape 1, and even if they do adhere, they tend to separate easily, so aggregation of the tungsten-containing powder 4 is suppressed and breakage of the adhesive tape 1 at the portions where the tungsten-containing powder 4 aggregates can be suppressed.

[0027] The content of tungsten-containing powder 4 contained in the adhesive tape 1 is not particularly limited and can be set appropriately within a range that can be detected by an X-ray inspection device. For example, the content of tungsten-containing powder 4 contained in the adhesive tape 1 is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. Furthermore, from the viewpoint of maintaining a high breaking strength of the adhesive tape 1, the content of tungsten-containing powder 4 contained in the adhesive tape 1 is preferably 40% by mass or less, and more preferably 25% by mass or less.

[0028] The tungsten-containing powder 4 may be contained throughout the entire pressure-sensitive adhesive tape 1, and the form in which it is contained is not particularly limited. For example, as in the first to third embodiments shown in Figures 1 to 3, a tungsten-containing layer 5 containing the tungsten-containing powder 4 may be provided on the surface of the substrate 2, as in the fourth embodiment shown in Figure 4, the tungsten-containing powder 4 may be contained in the substrate 2, or a combination thereof may be used as in the fifth embodiment shown in Figure 5. Furthermore, as in the sixth and seventh embodiments shown in Figures 6 and 7, the tungsten-containing powder 4 may be contained in the pressure-sensitive adhesive layer 3.

[0029] In the first to third embodiments in which the tungsten-containing layer 5 is provided on the surface of the substrate 2, for example, in the first and second embodiments shown in Figures 1 and 2, the pressure-sensitive adhesive layer 3 is provided on one surface of the substrate 2 (the upper surface in Figures 1(b) and 2(b)), and the tungsten-containing layer 5 is provided on the other surface of the substrate 2 (the lower surface in Figures 1(b) and 2(b)). In the third embodiment shown in Figure 3, the tungsten-containing layer 5 is provided on one surface of the substrate 2 between the substrate 2 and the pressure-sensitive adhesive layer 3. In this case, the pressure-sensitive adhesive layer 3 is indirectly provided on one surface of the substrate 2 via the tungsten-containing layer 5.

[0030] The tungsten-containing layer 5 may be formed by an aggregate of only the tungsten-containing powder 4, or may be formed by a matrix in which the tungsten-containing powder 4 is dispersed, as in the first to third embodiments shown in FIGS. 1 to 3. The tungsten-containing layer 5 may be formed continuously over the entire surface of the substrate 2, as in the first and third embodiments shown in FIGS. 1 and 3, or may be formed in a dispersed manner over the entire surface of the substrate 2, as in the second embodiment shown in FIG. 2. In the second embodiment shown in FIG. 2, the tungsten-containing layer 5 is provided in a dispersed manner over the surface of the substrate 2, thereby suppressing a decrease in the flexibility and stretchability of the substrate 2 due to the formation of the tungsten-containing layer 5 on the surface.

[0031] When tungsten-containing layer 5 is formed from an aggregate of only tungsten-containing powder 4, it can be formed, for example, by applying a volatile solution in which tungsten-containing powder 4 is dispersed to the surface of substrate 2 and volatilizing the volatile solution to deposit only tungsten-containing powder 4 on the surface of substrate 2. Alternatively, tungsten-containing layer 5 can be formed using a known film formation technique such as sputtering.

[0032] When tungsten-containing layer 5 is formed from a base material having tungsten-containing powder 4 dispersed therein, it can be formed by mixing tungsten-containing powder 4 with the base material and applying the mixture to the surface of substrate 2, or by mixing tungsten-containing powder 4 with the base material, forming a film, and adhering the film to the surface of substrate 2. As the base material, synthetic resin and / or rubber, synthetic fiber and / or natural fiber, or a combination thereof can be used.

[0033] More specifically, tungsten-containing layer 5 can be formed, for example, by applying a liquid obtained by mixing synthetic resin and / or rubber with tungsten-containing powder 4 to the surface of substrate 2 and drying the mixture. Alternatively, tungsten-containing layer 5 can be formed by spraying a liquid obtained by mixing synthetic resin and / or rubber with tungsten-containing powder 4 onto the surface of substrate 2 using an inkjet system. Alternatively, tungsten-containing layer 5 can be formed by forming a film of a mixture of synthetic resin and / or rubber with tungsten-containing powder 4 and adhering the film to the surface of substrate 2 by known bonding methods such as heat fusion or adhesives. Alternatively, tungsten-containing layer 5 can be formed by adhering a nonwoven, woven, or knitted fabric made of synthetic and / or natural fibers containing tungsten-containing powder 4 to the surface of substrate 2 by known bonding methods such as heat fusion or adhesives.

[0034] The synthetic resin and rubber contained in the base material that forms tungsten-containing layer 5 are not particularly limited, and examples thereof include synthetic resins such as polyurethane, polyester, vinyl chloride, olefin, polycarbonate, polysulfine, polyphenylene sulfide, polyimide, and elastomer, and rubbers such as urethane rubber, silicone rubber, ethylene propylene rubber, nitrile rubber, hydrogenated nitrile rubber, styrene propylene rubber, and natural rubber.

[0035] The synthetic fibers and natural fibers contained in the base material that forms tungsten-containing layer 5 are not particularly limited, and synthetic fibers such as polyester fibers, polyacrylic fibers, polyurethane fibers, nylon fibers, and rayon fibers, and natural fibers such as wool, cotton, linen, and silk can be used.

[0036] In a fourth embodiment (see FIG. 4 ) in which the base material 2 contains the tungsten-containing powder 4, the base material 2 may be impregnated with the tungsten-containing powder 4 from the surface of a pre-formed base material 2, or the base material 2 may be formed from a material containing the tungsten-containing powder 4 mixed therein, thereby causing the base material 2 to contain the tungsten-containing powder 4, or the base material 2 may be formed from a material containing the tungsten-containing powder 4 mixed therein, or the base material 2 may be impregnated with the tungsten-containing powder 4 by a combination of these methods.

[0037] One method for impregnating the surface of substrate 2 with tungsten-containing powder 4 is to apply a liquid containing tungsten-containing powder 4 to the surface of substrate 2, which is pre-formed as a nonwoven fabric, woven fabric, or knitted fabric made of synthetic fibers and / or natural fibers, thereby impregnating and fixing tungsten-containing powder 4 into the gaps between the synthetic fibers and / or natural fibers.

[0038] Methods for forming the substrate 2 from a mixture of the constituent materials of the substrate 2 and the tungsten-containing powder 4 include, for example, a method of forming the substrate 2 in the form of a film from a mixture obtained by mixing the constituent materials of the substrate 2, such as synthetic resin and / or rubber, with the tungsten-containing powder 4, and a method of forming the substrate 2 as a nonwoven fabric, woven fabric, or knitted fabric from synthetic fibers and / or natural fibers containing the tungsten-containing powder 4.

[0039] In a fifth embodiment (see FIG. 5 ) in which tungsten-containing powder 4 is contained in the base material 2 and a tungsten-containing layer 5 is provided on the surface of the base material 2, the tungsten-containing layer 5 described in the first to third embodiments is provided on the base material 2 described in the fourth embodiment, thereby forming an adhesive tape 1.

[0040] In the sixth and seventh embodiments in which the tungsten-containing layer 4 is included in the adhesive layer 3, for example, in the sixth embodiment shown in FIG. 6, the adhesive layer 3 containing the tungsten-containing powder 4 is provided as a single layer, while in the seventh embodiment shown in FIG. 7, the adhesive layer 3 is provided as a multi-layer including a layer 31 containing the tungsten-containing powder 4 and a layer 32 not containing the tungsten-containing powder 4. The adhesive layer 3 is formed from an inherently viscous material, which facilitates mixing of the tungsten-containing powder 4 and provides excellent processability after mixing. Therefore, by including the tungsten-containing powder 4 in the adhesive layer 3, the adhesive tape 1 can be manufactured more easily than when the tungsten-containing powder 4 is included in another component.

[0041] In the adhesive tape 1 of the sixth embodiment, as shown in Fig. 6, the adhesive layer 3 is provided on one surface (the upper surface in Fig. 6) of the substrate 2 as a single layer containing tungsten-containing powder 4. The method for forming the adhesive layer 3 is not particularly limited as long as it can contain the tungsten-containing powder 4. The adhesive layer 3 can be formed, for example, by providing an adhesive mixed with tungsten-containing powder 4 on one surface of the substrate 2, or by applying a liquid containing tungsten-containing powder 4 to an adhesive layer provided on one surface of the substrate 2, thereby impregnating the adhesive layer with the tungsten-containing powder 4.

[0042] In the adhesive tape 1 of the seventh embodiment, as shown in FIG. 7 , the adhesive layer 3 includes a first adhesive layer 31 containing tungsten-containing powder 4 and a second adhesive layer 32 not containing tungsten-containing powder 4. The first adhesive layer 31 is provided on at least one surface of the substrate 2, and the second adhesive layer 32 is provided on the surface of the first adhesive layer 31 opposite the substrate 2. As can be seen from FIG. 7 , the second adhesive layer 32 not containing tungsten-containing powder 4 is provided on the side of the adhesive layer 3 that will be attached to the target. By providing the second adhesive layer 32 not containing tungsten-containing powder 4 on the side that will be attached to the target, it is possible to reduce the influence of the tungsten-containing powder 4 on the target when the adhesive tape 1 is attached to the target. However, the first and second adhesive layers 31, 32 are not limited to the layering order shown in the figure, and may be layered in the reverse order to that shown in the example.

[0043] The method for forming the pressure-sensitive adhesive layer 3 in the seventh embodiment is not particularly limited as long as it is possible to laminate the first and second pressure-sensitive adhesive layers 31 and 32 on each other. The pressure-sensitive adhesive layer 3 may be formed, for example, by providing the first pressure-sensitive adhesive layer 31 on one surface of the base material 2 and then providing the second pressure-sensitive adhesive layer 32, or by laminating the first and second pressure-sensitive adhesive layers 31 and 32 on each other in advance and then providing them on one surface of the base material 2.

[0044] The adhesive that constitutes the first and second adhesive layers 31, 32 is not particularly limited, and known adhesives such as natural rubber-based adhesives, synthetic rubber-based adhesives, acrylic-based adhesives, urethane-based adhesives, and silicone-based adhesives can be used.

[0045] First adhesive layer 31 containing tungsten-containing powder 4 is not particularly limited, and can be formed, for example, by providing an adhesive mixed with tungsten-containing powder 4 on one side of substrate 2, or by applying a liquid containing tungsten-containing powder 4 to an adhesive layer provided on one side of substrate 2, thereby impregnating the adhesive layer with tungsten-containing powder 4.

[0046] The pressure-sensitive adhesive tapes 1 of the first to seventh embodiments described above can be configured independently or in combination with one another. [Explanation of symbols]

[0047] 1 adhesive tape 2 Base material 3. Adhesive layer 31 First adhesive layer 32 Second adhesive layer 4. Tungsten-containing powder 5. Tungsten-containing layer B. Bandage P Absorbent Pad

Claims

1. A flexible and stretchable substrate; a pressure-sensitive adhesive layer provided on at least one surface of the substrate; An adhesive tape comprising: The pressure-sensitive adhesive tape contains a tungsten-containing powder, the particle size of the tungsten-containing powder is 1 to 3 μm, and the index showing the spread of the particle size distribution of the tungsten-containing powder, [(d90−d10) / d50], is 2.0 or less.

2. 2. The adhesive tape according to claim 1, wherein a tungsten-containing layer containing tungsten-containing powder is provided on the surface of the substrate.

3. 3. The adhesive tape according to claim 2, wherein the tungsten-containing layer is dispersed on the surface of the substrate.

4. 4. The adhesive tape according to claim 1, wherein the substrate contains tungsten-containing powder.

5. 5. The adhesive tape according to claim 1, wherein the adhesive layer contains tungsten-containing powder.

6. The pressure-sensitive adhesive layer is a first pressure-sensitive adhesive layer provided on at least one surface of the base material and containing the tungsten-containing powder; a second adhesive layer provided on the surface of the first adhesive layer opposite to the substrate, the second adhesive layer not containing the tungsten-containing powder; The adhesive tape according to claim 5, further comprising:

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