Wearable device for non-invasive body temperature measurement

Abstract

A wearable device for noninvasively measuring a user's body temperature can include a housing, a first substrate coupled to the housing and having an opening, a second substrate coupled to the first substrate and configured to be secured to the user's skin, a mounting frame surrounded by the housing and the first substrate, a circuit board secured by the mounting frame, a temperature sensor coupled to the circuit board and configured to determine the user's body temperature, and a thermal conductivity probe secured by the mounting frame and positioned proximate to the first temperature sensor. The thermal conductivity probe extends at least partially through the opening in the first substrate and transmits thermal energy from a portion of the user's skin to the first temperature sensor.

Description

[Technical Field]

[0001] Incorporation by reference of any priority application This application is related to U.S. patent application Ser. No. 63 / 106,273, filed October 27, 2020, entitled "WEARABLE DEVICE FOR NONINVASIVE BODY TEMPERATURE MEASUREMENT," U.S. patent application Ser. No. 63 / 056,925, filed July 27, 2020, entitled "WEARABLE DEVICE FOR NONINVASIVE BODY TEMPERATURE MEASUREMENT," U.S. patent application Ser. No. 63 / 065,961, filed August 14, 2020, entitled "HEALTH SCREENING AND MONITORING SYSTEM," U.S. patent application Ser. No. 63 / 049,478, filed July 8, 2020, entitled "REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS," U.S. patent application Ser. No. 63 / 049,478, filed March 20, 2020, entitled "REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS," and U.S. patent application Ser. No. 63 / 056,925, filed July 27, 2020, entitled "WEARABLE DEVICE FOR NONINVASIVE BODY TEMPERATURE MEASUREMENT," and U.S. patent application Ser. No. 63 / 056,925, filed August 14, 2020, entitled "HEALTH SCREENING AND MONITORING SYSTEM," and U.S. patent application Ser. No. 63 / 049,478, filed July 8, 2020, entitled "REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS," and U.S. patent application Ser. 119(e) to U.S. patent application Ser. No. 62 / 992,808, entitled "OPIOID OVERDOSE MONITORING," filed March 20, 2020; U.S. patent application Ser. No. 62 / 992,779, entitled "OPIOID OVERDOSE MONITORING USER INTERFACE," filed March 20, 2020; and U.S. patent application Ser. No. 63 / 010,669, entitled "REMOTE PATIENT MANAGEMENT AND MONITORING," filed April 15, 2020. All of the above-mentioned applications are incorporated herein by reference in their entireties.

[0002] The present disclosure relates to devices, methods, and / or systems for monitoring physiological information of a subject. More specifically, the present disclosure describes, among other things, a wearable device for measuring the body temperature of a subject. [Background technology]

[0003] Core body temperature is an important vital sign used by clinicians to monitor and / or manage the physical condition of a subject (e.g., a patient). Core body temperature is the subject's internal temperature. Internal body temperature is typically maintained within a specific range so that the body can perform essential functions. Fluctuations in core body temperature may indicate a deterioration in the subject's physical condition and may adversely affect the body's ability to maintain critical life-sustaining functions. Despite the importance of core body temperature as a vital sign, several commonly used devices, methods, and / or systems for estimating core body temperature based on skin surface or peripheral measurements are lacking. Skin surface temperature is typically measured using single-point or heat flow measurement devices, and skin surface temperature can, in some cases, vary dramatically from core body temperature depending on, for example, the subject's physiology (e.g., skin thickness), the user's environment, perfusion, and / or other conditions. "Clinical temperature" measurements (typically obtained with a thermometer in a subject's periphery (e.g., in the subject's armpit, rectum, or under the subject's tongue)) do not represent a true measurement of internal body temperature, but are merely approximations. There is a great need for improved devices, methods, and systems for non-invasively measuring (continuously or periodically) and / or transmitting (e.g., wirelessly) a subject's core body temperature. Summary of the Invention [Problem to be solved by the invention]

[0004] Various implementations of the wearable devices disclosed herein provide improved devices, methods, and systems for noninvasively measuring (continuously or periodically) and / or transmitting (e.g., wirelessly) a subject's core body temperature. Various embodiments of the disclosed wearable devices can be comfortably worn by a user over an extended period of time (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 days) and are capable of monitoring (continuously or periodically) the user's core body temperature, alone or in combination with other physiological parameters, and transmitting (e.g., wirelessly) such physiological information to a separate device (e.g., a mobile device). Some embodiments of the disclosed wearable devices can be configured to be removed and reapplied / refastened to position the device at various locations on the user's body. Some embodiments of the disclosed wearable devices (or portions of such devices) can be disposable, which can reduce the risk of cross-contamination between multiple users. Some embodiments of the disclosed wearable devices (or portions of such devices) can be waterproof, thereby providing minimal disruption to a user's normal activities (e.g., showering). [Means for solving the problem]

[0005] A wearable device configured for noninvasive measurement of a user's body temperature may include a housing; a first substrate coupled to the housing and including an opening; a second substrate coupled to the first substrate and configured to be secured to the user's skin when the wearable device is in use; a mounting frame surrounded by the housing and the first substrate; a circuit board secured by the mounting frame; a first temperature sensor coupled to the circuit board and configured to determine the user's body temperature; and a thermally conductive probe secured by the mounting frame, positioned proximate to the first temperature sensor, and configured to extend at least partially through the opening in the first substrate, and further configured to transmit thermal energy from a portion of the user's skin to the first temperature sensor when the wearable device is in use. The wearable device may be configured to be secured to the user's skin and / or may be configured for continuous, noninvasive measurement of the user's body temperature. In some variations, the only type of physiological parameter measured and / or monitored by the wearable device is body temperature. In some variations, the only type of physiological parameter measured and / or monitored by the wearable device is body temperature. In some variations, the wearable device does not include an accelerometer, a gyroscope, a magnetometer, an oximetry sensor, a moisture sensor, an impedance sensor, an acoustic / respiration sensor, and / or an ECG sensor. In some variations, the first and second substrates are integrally formed with one another.

[0006] The circuit board may include a first surface, a second surface opposite the first surface, and one or more openings extending through the circuit board from the first surface to the second surface, the second surface being positioned closer to the second board than the first surface. The thermally conductive probe may be positioned adjacent to the one or more openings in the circuit board and the second surface. The first temperature sensor may be mounted on the first surface of the circuit board adjacent to the one or more openings in the circuit board. The one or more openings in the circuit board may be configured to allow the thermal energy to pass through the circuit board to the first temperature sensor. The one or more openings in the circuit board may be filled with a thermally conductive material. The one or more openings in the circuit board may be unfilled with a material. The one or more openings in the circuit board may include multiple openings. Each of the one or more openings in the circuit board may be circular. The first temperature sensor may be configured to determine the user's body temperature at one-minute intervals.

[0007] The wearable device may further include at least one thermally conductive material positioned between the one or more openings in the circuit board and the thermally conductive probe. The at least one thermally conductive material may include a first thermally conductive material and a second thermally conductive material, where the first thermally conductive material includes a thermal paste and the second thermally conductive material includes a metallic material. The thermal paste may include zinc oxide. The metallic material may include at least one of gold and copper.

[0008] When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the thermally conductive probe. In some variations, the thermally conductive probe does not contact a portion of the user's skin when the wearable device is secured to the user's skin during use. An axis extending along the height of the thermally conductive probe through the center of the cross section of the thermally conductive probe can be oriented perpendicular to the plane of the circuit board. The thermally conductive probe can include a width that is smaller than its height. The thermally conductive probe can include a first end, a second end opposite the first end, and a height extending between the first end and the second end, the second end being configured to apply pressure to a portion of the user's skin when the wearable device is secured to the user. When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the second end of the thermally conductive probe.

[0009] The mounting frame may include one or more posts, and the housing may include one or more cavities. Each of the one or more posts may be configured to secure within one of the one or more cavities. The one or more posts may include two posts positioned on opposite sides of the mounting frame, and the one or more cavities may include two cavities. The circuit board may include one or more notches along one or more sides of the circuit board, the one or more notches being sized and shaped to receive a portion of the one or more posts. The mounting frame may include a slot configured to receive and secure the thermal conductivity probe. The slot may be configured to surround a portion of a perimeter of a cross section of the thermal conductivity probe. The slot may be configured to surround less than the entire perimeter of a cross section of the thermal conductivity probe. The thermal conductivity probe may include a metallic material. The thermal conductivity probe may include aluminum. The thermal conductivity probe may be rigid.

[0010] The first substrate may include foam. The second substrate may include a fabric material and an adhesive material. The housing may include a main body portion and a rim portion extending around a periphery of the main body portion, and the wearable device may further include a third substrate, the third substrate including an opening configured to receive the main body portion of the housing, the third substrate coupled to the first substrate, and the rim portion of the housing secured between the first and third substrates. The wearable device may further include a release liner configured to removably secure to the second substrate.

[0011] The opening in the first substrate may be sized and shaped to correspond to the size and shape of the periphery of the cross-section of the thermal conductivity probe. The opening in the first substrate and the cross-section of the thermal conductivity probe may be circular.

[0012] The wearable device may further include a second temperature sensor coupled to the circuit board and spaced a first distance from the first temperature sensor, the second temperature sensor configured to measure an ambient temperature outside the interior of the housing. The wearable device may further include a thermally conductive material extending between the second temperature sensor and the interior surface of the housing, the thermally conductive material configured to transfer thermal energy of the ambient environment from the interior surface of the housing to the second temperature sensor. The second thermally conductive material may include a thermal putty configured to at least partially conform to the shape of a portion of the interior surface of the housing. The thermal putty may include a ceramic-filled silicone sheet.

[0013] The wearable device may further include a wireless transceiver coupled to the circuit board and configured to wirelessly transmit one or more signals via a wireless communication protocol in response to the determined body temperature. The wearable device may further include a third substrate positioned between the circuit board and the second substrate, the third substrate configured to reflect at least a portion of the one or more signals wirelessly transmitted from the wireless transceiver away from the user's skin when the wearable device is in use. The third substrate may include metalized polypropylene.

[0014] The wearable device may further include a near field communication (NFC) tag configured to communicate with an NFC reader of a separate computing device. The NFC tag may be fixed to an interior surface of the housing. The wearable device may further include a battery configured to provide power to the circuit board. The wearable device may further include a battery holder configured to couple the battery to the circuit board.

[0015] A wearable device configured for noninvasive measurement of a user's body temperature can include a housing; a circuit board; a temperature sensor coupled to the circuit board and configured to generate one or more signals in response to thermal energy from the user; a battery configured to provide power to the circuit board; and a mounting frame configured to secure the circuit board to the housing, the mounting frame including a first end and a second end opposite the first end, the second end positioned adjacent to the battery. The mounting frame, circuit board, temperature sensor, and battery can be at least partially enclosed by the housing. The second end of the mounting frame can be sized and shaped to match the size and shape of a portion of the battery, thereby maximizing the size of the battery within the housing of the wearable device.

[0016] The second end of the mounting frame may be sized and shaped to surround approximately half of the circumference of the battery. The second end of the mounting frame may be sized and shaped to surround less than half of the circumference of the battery. The battery may include a circular shape, and the second end of the mounting frame may at least partially include a semicircular shape configured to surround a portion of the circumference of the battery. The wearable device may further include a battery holder configured to couple the battery to a circuit board, the battery holder including opposing arms configured to electrically connect to electrical contacts on the circuit board. The mounting frame may include notches at corners of the second end, the notches configured to facilitate alignment of the battery holder and the mounting frame.

[0017] A wearable device configured for noninvasive measurement of a user's body temperature can include: a housing; a circuit board at least partially enclosed by the housing, the circuit board including a first surface, a second surface opposite the first surface, and at least one aperture extending through the circuit board from the first surface to the second surface; a first temperature sensor electrically coupled to the circuit board and positioned adjacent the first surface and the at least one aperture of the circuit board; a thermal conductivity probe including a first end and a second end opposite the first end, the first end positioned adjacent the second surface of the circuit board proximate the at least one aperture and aligned with the first temperature sensor; a mounting frame configured to secure the thermal conductivity probe and the circuit board to the housing; and one or more substrates operably connected to the housing and configured to be positioned adjacent to a user's skin when the wearable device is in use, at least one of the one or more substrates including an opening configured to allow at least a portion of the thermal conductivity probe to pass at least partially through the opening. The second end of the thermal conductivity probe may be configured to be positioned adjacent to a portion of the user's skin when the wearable device is secured to the user, and the thermal conductivity probe is configured to transmit the user's thermal energy to a first temperature sensor through at least one hole extending through the circuit board, and the first temperature sensor is configured to determine the user's body temperature based on the transmitted thermal energy.

[0018] The wearable device may further include a first thermally conductive material positioned between the first end of the thermally conductive probe and the first temperature sensor. The first thermally conductive material may include a thermal paste positioned between the first end of the thermally conductive probe and the second surface of the circuit board. The thermal paste may include zinc oxide. The wearable device may further include a second thermally conductive material positioned between the first end of the thermally conductive probe and the first temperature sensor. The first thermally conductive material may include a thermal paste positioned between the first end of the thermally conductive probe and the second surface of the circuit board. The second thermally conductive material may include a metallic material. The thermal paste may include zinc oxide. The metallic material may include at least one of gold and copper. At least one hole in the circuit board may be filled with a thermally conductive material. At least one hole in the circuit board may not be filled with a thermally conductive material. The at least one hole in the circuit board may include a plurality of holes. An axis extending through the center of a cross section of the thermal conductivity probe along its height may be oriented perpendicular to the plane of the circuit board. The one or more substrates may include a first substrate and a second substrate, the first substrate including the opening and coupled to the second substrate, the second substrate configured to be secured to a user's skin when the wearable device is in use. When the wearable device is secured to the user's skin via the second substrate, the second substrate may be positioned between the user's skin and the second end of the thermal conductivity probe. The second end of the thermal conductivity probe may be configured to apply pressure to a portion of the user's skin when the wearable device is secured to the user's skin via the second substrate. When the wearable device is secured to the user's skin via the second substrate, the second substrate may be positioned between the user's skin and the second end of the thermal conductivity probe. The housing may include a main body portion and a rim portion extending around a periphery of the main body portion.The wearable device may further include a third substrate, the third substrate including an opening configured to receive the main body portion of the housing. The third substrate may be coupled to the first substrate, and the rim portion of the housing may be secured between the first substrate and the third substrate. The mounting frame may include a slot configured to receive and secure the thermally conductive probe. The slot may be configured to surround a portion of the circumference of a cross section of the thermally conductive probe. The slot may be configured to surround less than the entire circumference of the cross section of the thermally conductive probe. The thermally conductive probe may include a metallic material. The thermally conductive probe may include aluminum. The thermally conductive probe may be rigid.

[0019] A wearable device configured for continuous and non-invasive measurement of a user's body temperature includes a housing; a circuit board at least partially enclosed by the housing, the circuit board including a first surface, a second surface opposite the first surface, and at least one aperture extending through the circuit board from the first surface to the second surface; a first temperature sensor electrically coupled to the circuit board and positioned adjacent the first surface and the at least one aperture of the circuit board; and a thermal conductivity probe including a first end and a second end opposite the first end, the first end positioned adjacent the second surface of the circuit board in proximity to the at least one aperture. The wearable physiological sensor may include a thermally conductive probe positioned on a first end of the probe and aligned with a first temperature sensor; a first thermally conductive material positioned between a first end of the probe and the first temperature sensor; a mounting frame configured to secure the thermally conductive probe and a circuit board to the housing; and one or more substrates operably connected to the housing and configured to be positioned proximate to a user's skin when the wearable physiological sensor is in use, at least one of the one or more substrates including an opening configured to allow at least a portion of the probe to pass therethrough. The second end of the thermally conductive probe may be positioned proximate to a portion of the user's skin when the wearable physiological sensor is secured to the user during use. The thermally conductive probe may be configured to transmit thermal energy from the user to the first temperature sensor, and the first temperature sensor may be configured to determine the user's body temperature based on the received thermal energy.

[0020] A wearable device configured for continuous and noninvasive measurement of a user's body temperature can include a housing, a circuit board at least partially enclosed by the housing, a first temperature sensor coupled to the circuit board, a thermal conductivity probe vertically aligned with the first temperature sensor and including a first end and a second end opposite the first end, the first end positioned closer to the circuit board than the second end, a mounting frame configured to at least partially secure the thermal conductivity probe and the circuit board to the housing, and one or more substrates coupled to the housing and configured to contact the user's skin when the wearable device is in use, the second end of the thermal conductivity probe being positioned proximate a portion of the skin when the one or more substrates are in contact with the user's skin. The thermal conductivity probe can be configured to transmit thermal energy of the user to the first temperature sensor, and the first temperature sensor can be configured to determine the user's body temperature based on the thermal energy.

[0021] For purposes of summarizing the present disclosure, certain aspects, advantages, and novel features have been discussed herein. It is to be understood that not necessarily all such aspects, advantages, or features may be embodied in any particular embodiment of the present disclosure, and that one of ordinary skill in the art will recognize from this disclosure myriad combinations of such aspects, advantages, or features.

[0022] Certain features of the present disclosure are described below with reference to the drawings. The illustrated embodiments are intended to illustrate, but not limit, the embodiments. Various features of different disclosed embodiments can be combined to form further embodiments, which are part of this disclosure. [Brief explanation of the drawings]

[0023] [Figure 1]FIG. 1 is a top perspective view of a wearable device according to an aspect of the present disclosure. [Figure 2A] FIG. 2 is a top perspective view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2B] FIG. 2 is a top perspective view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2C] FIG. 2 is a top view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2D] FIG. 2 is a bottom view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2E] FIG. 2 is a side view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2F] FIG. 2 is another side view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2G] FIG. 2 is a front view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2H] FIG. 2 is a rear view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 2I] FIG. 2 is a schematic block diagram of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 3A] FIG. 2 is a top exploded perspective view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 3B] FIG. 2 is an exploded perspective bottom view of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 4A] FIG. 2 is a top perspective view of a housing of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 4B] FIG. 2 is a bottom perspective view of a housing of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 5A] FIG. 2 is a top perspective view of a portion of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 5B] FIG. 2 is a bottom perspective view of a portion of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 5C] FIG. 5C is a top exploded perspective view of a portion of the wearable device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 5D] FIG. 5C is a bottom exploded perspective view of a portion of the wearable device of FIGS. 5A and 5B according to an embodiment of the present disclosure. [Figure 6A] FIG. 2 is a top perspective view of a mounting frame of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 6B] FIG. 6B is a top view of the mounting frame of FIG. 6A according to an embodiment of the present disclosure. [Figure 6C] FIG. 6B is a bottom view of the mounting frame of FIG. 6A according to an embodiment of the present disclosure. [Figure 7] 2D illustrates a cross section taken through a portion of the wearable device as shown in FIG. 2C, according to an embodiment of the present disclosure. [Figure 8A] FIG. 2 is a top perspective view of a portion of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 8B] FIG. 2 is a bottom perspective view of a portion of the wearable device of FIG. 1 according to an embodiment of the present disclosure. [Figure 8C] FIG. 8C is a top exploded perspective view of a portion of the wearable device of FIGS. 8A and 8B according to an embodiment of the present disclosure. [Figure 8D] FIG. 8C is a bottom exploded perspective view of a portion of the wearable device of FIGS. 8A and 8B according to an embodiment of the present disclosure. [Figure 9A] 8C-8D show various views of a portion of a probe of a portion of a wearable device shown in FIGS. 8C-8D, according to an embodiment of the present disclosure. [Figure 9B] 8C-8D show various views of a portion of a probe of a portion of a wearable device shown in FIGS. 8C-8D, according to an embodiment of the present disclosure. [Figure 10A] 8C-8D show various views of a portion of a probe of a portion of a wearable device shown in FIGS. 8C-8D, according to an embodiment of the present disclosure. [Figure 10B] 8C-8D show various views of a portion of a probe of a portion of a wearable device shown in FIGS. 8C-8D, according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0024] Various features and advantages of the present disclosure will now be described with reference to the accompanying figures. The following description is merely exemplary in nature and is in no way intended to limit the present disclosure, its application, or uses. The present disclosure extends beyond the specifically disclosed embodiments and / or uses, as well as obvious modifications and their equivalents. Thus, it is intended that the scope of the present disclosure should not be limited by any particular embodiments described below. Features of the illustrated embodiments can be modified, combined, removed, and / or substituted as will be apparent to those skilled in the art in light of the principles disclosed herein.

[0025] FIG. 1 illustrates a top perspective view of a wearable device 10 (which may also be referred to herein as a “physiological measurement device,” “physiological monitoring device,” “wearable physiological sensor,” or “wearable physiological device”) that can measure and / or monitor one or more physiological parameters of a subject, as discussed further below. The wearable device 10 can be secured to a portion of the subject's body, such as the torso, chest, back, arm, neck, leg, underarm (e.g., armpit), among other parts of the subject's body. The wearable device 10 can be secured (e.g., removably secured) to the subject's skin and can continuously and / or noninvasively measure the subject's temperature via one or more temperature sensors. Additionally, as discussed below, the wearable device 10 can wirelessly transmit the subject's temperature data to a separate device, either continuously or periodically. FIG. 7 (discussed in more detail below) illustrates a cross section taken through wearable device 10 when wearable device 10 is secured to a subject's skin. As illustrated in FIG. 7 and discussed further below, wearable device 10 can include thermally conductive probe 140 (or 240), which extends toward the subject's skin and transmits thermal energy from the skin in a direction toward a temperature sensor of wearable device 10 (e.g., temperature sensor 150a, discussed further below). As also discussed below, thermally conductive probe 140 (or thermally conductive probe 240) can contact and / or apply pressure to the subject's skin (e.g., indirectly via substrate 25), which can promote thermal transmittance. In some variations, thermally conductive probe 140 is not in contact with the subject's skin when wearable device 10 is secured to the subject. For example, when the wearable device 10 is secured to the subject, the substrate 25 may be positioned between the thermally conductive probe 140 and the subject's skin.

[0026] Figures 3A-3B illustrate exploded perspective views of wearable device 10. Figures 2A-2H illustrate various views of wearable device 10 without battery isolator 18 (see Figures 3A-3B) attached to best illustrate aspects of wearable device 10.

[0027] FIG. 2I illustrates an exemplary schematic block diagram of wearable device 10. As shown, wearable device 10 may include a processor 11, a storage device 12, a wireless transceiver 13, a battery 14, an information element 15, and / or one or more temperature sensors 16. Processor 11 may be configured to, among other things, process data, execute instructions to perform one or more functions, and / or control the operation of wearable device 10. For example, processor 11 may process physiological data obtained from wearable device 10 and execute instructions to perform functions related to storing and / or transmitting such physiological data. For example, processor 11 may process data received from one or more temperature sensors 16 and / or one or more other physiological parameter sensors 17 and execute instructions to perform functions related to storing and / or transmitting such received data.

[0028] Storage device 12 may include one or more memory devices for storing data, including, but not limited to, dynamic and / or static random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), and electrically erasable programmable read-only memory (EEPROM). Such stored data may be, for example, processed and / or unprocessed physiological data obtained from wearable device 10. Wireless transceiver 13 may be configured to enable wearable device 10 to wirelessly communicate with other devices, systems, and / or networks via communication protocols. Wireless transceiver 13 may be configured to use any of a variety of wireless communication protocols, such as, for example, Wi-Fi (802.11x), Bluetooth, ZigBee, Z-wave, cellular, infrared, RFID, satellite transmission, proprietary protocols, and combinations thereof.

[0029] Wearable device 10 may include a battery 14. Battery 14 may provide power for the hardware components of wearable device 10 described herein. Battery 14 may be, for example, battery 110, described in more detail below. Battery 14 may be, for example, a lithium battery. Additionally or alternatively, wearable device 10 may be configured to obtain power from a power source external to wearable device 10. For example, wearable device 10 may include or be configured to connect to a cable, which may itself connect to an external power source and provide power to wearable device 10.

[0030] Wearable device 10 may include information element 15. Information element 15 may be a memory storage element that stores in non-volatile memory information used to help maintain a standard of quality associated with wearable device 10. Illustratively, information element 15 may store information regarding whether wearable device 10 was previously activated and whether wearable device 10 was previously operational for an extended period of time (e.g., four hours). Information stored in information element 15 may be used, for example, to help detect improper reuse of wearable device 10.

[0031] 2I, the wearable device 10 may include one or more temperature sensors 16 that may continuously or periodically acquire temperature data of the subject. Advantageously, in some implementations, the processor 11 may compare temperature data from two or more temperature sensors 16 to more accurately determine the subject's core body temperature. In some variations, the wearable device 10 includes one or more temperature sensors 16 and also includes one or more other sensors 17 (e.g., one or more of an accelerometer, a gyroscope, a magnetometer, an oximetry sensor, a moisture sensor, an impedance sensor, an acoustic / respiration sensor, and / or an ECG sensor). In some variations, wearable device 10 includes one or more temperature sensors 16 and does not include an accelerometer, gyroscope, magnetometer, oximetry sensor, moisture sensor, impedance sensor, acoustic / respiration sensor, or ECG sensor, which can advantageously help conserve battery and processing power and preserve processing capability of wearable device 10 (where continuous or periodic core body temperature values ​​are determined and / or transmitted). In some variations, the only type of physiological parameter measured and / or monitored by wearable device 10 is body temperature. One or more temperature sensors 16 can be, for example, any of temperature sensors 150a, 150b, 150c, each of which is discussed in more detail below.

[0032] The processor 11 of the wearable device 10 may be configured to process the acquired physiological information. For example, the processor 11 may be configured to determine the user's core body temperature based on thermal energy acquired by one or more temperature sensors 16 of the wearable device 10. The wireless transceiver 13 may be configured to wirelessly transmit the processed physiological information (and / or the unprocessed physiological information) to a separate computing device (e.g., a patient monitor, a mobile device (e.g., an iOS or Android-enabled smartphone, tablet, laptop computer), a server, or other computing or processing device for display and / or further processing, among others). The computing device may be configured to store and / or further process the received physiological information, display information indicative of or derived from the received physiological information, and / or transmit information (including displays, alarms, warnings, and notifications) to a computing device or system (including a patient monitoring system associated with a hospital, a caregiver (e.g., a primary provider), or a user (e.g., an employer, school, friend, family member) with permission to access the subject's (e.g., patient) data). As another example, wireless transceiver 13 of wearable device 10 may be configured to wirelessly transmit processed or unprocessed acquired physiological information to a mobile phone, which may include one or more hardware processors configured to execute an application that generates a graphical user interface that displays information representing the processed or unprocessed physiological information acquired from wearable device 10. In some variations, wearable device 10 is configured to measure and / or monitor only one type of physiological parameter, which is body temperature.

[0033] 3A and 3B illustrate exploded views of wearable device 10. Wearable device 10 may include a housing 40 and one or more substrates (e.g., one or more of substrates 20, 25, 50, 60, 65, 70, etc.), which are described in more detail below. As described above, wearable device 10 may include a processor 11, a storage device 12, a wireless transceiver 13, a battery 14, an information element 15, and / or one or more temperature sensors 16. Processor 11, storage device 12, wireless transceiver 13, a battery 14, an information element 15, and / or one or more temperature sensors 16 may be attached to and / or coupled to a circuit layer of wearable device 10. The circuit layer may be surrounded or at least partially surrounded by housing 40 (and / or a portion of housing 40) and / or one or more of substrates 20, 25, 50, 60, 65, 70. The circuit layer may be positioned between or at least partially between the housing 40 (or a portion of the housing 40) and one or more of the substrates of the wearable device 10 (e.g., any of the substrates 20, 25, 50, 60, 65, 70, etc.). The circuit layer may be, for example, a circuit board (e.g., circuit board 105 illustrated in at least FIGS. 3A-3B, 5A-5D, 7, and 8A-8D, etc.). The circuit board 105 may be, for example, a printed circuit board. The battery 14 may be, for example, battery 110 illustrated in at least FIGS. 5A-5D and 8A-8D and described elsewhere herein. As shown, and as further discussed below, the battery 110 may be mechanically and / or electronically coupled to the circuit board 105, for example, via a battery holder 115.

[0034] The wearable device 10 may include a probe, which acts as a conduit for transmitting thermal energy from the subject to and / or toward one or more temperature sensors 16 of the wearable device 10. The probe may be rigid or flexible. The probe may include a thermally conductive material. For example, the probe may include a metallic material (e.g., aluminum, etc.). The probe may be probe 140 or probe 240, which are discussed in more detail below.

[0035] Wearable device 10 may include a mounting frame that secures one or more components of wearable device 10 to housing 40. The mounting frame may be, for example, mounting frame 130 shown in at least FIGS. 5A-5D and 8A-8D and discussed further below. Mounting frame 130 may secure circuit board 105 and / or probe 140 (or probe 240) to housing 40 and / or to one or more of boards 20, 25, 50, 60, 65, 70. When battery 110 is coupled to circuit board 105 via battery holder 115, as described below, mounting frame 130 may secure circuit board 105, battery holder 115, and battery 110 to housing 40 and / or to one or more of boards 20, 25, 50, 60, 65, 70.

[0036] 3A-3B and 5A-5D, circuit board 105, probe 140, mounting frame 130, battery 110, battery holder 115, and / or one or more temperature sensors (e.g., temperature sensors 150a, 150b, etc.) coupled to circuit board 105 may form an electronics assembly of wearable device 10, which is generally represented by the numeral "100" in FIGS. 3A-3B. Electronics assembly 100, and any or all of the above-listed components that may form electronics assembly 100, may be surrounded (or partially surrounded) by housing 40 (or a portion thereof) and one or more of substrates 20, 25, 50, 60, 65, 70. Electronics assembly 100, and any or all of the above-listed components that may form electronics assembly 100, may be positioned between or at least partially between housing 40 (or a portion of housing 40) and one or more of substrates 20, 25, 50, 60, 65, 70. The use of the phrase “electronics assembly” or reference numeral “100” in this disclosure is not intended to be limiting, but rather merely as a convenient way to refer to one or more components of wearable device 10 that may be enclosed by housing 40 and / or one or more of substrates 70, 25, 65, 50, 65, and / or 20.

[0037] As described above, wearable device 10 may be configured to communicate wirelessly with a separate computing device. For example, wearable device 10 may be configured to wirelessly transmit and / or receive information from a separate computing device. As another example, wearable device 10 may be configured to wirelessly transmit processed and / or unprocessed physiological information acquired by wearable device 10. As described above, wearable device 10 may include wireless transceiver 13. Wireless transceiver 13 may be coupled to circuit board 105 (e.g., mounted on a surface of circuit board 105). As described above, wireless transceiver 13 may be configured to use any of a variety of wireless protocols, such as, for example, Wi-Fi (802.11x), Bluetooth, ZigBee, Z-wave, cellular, infrared, RFID, satellite transmission, proprietary protocols, and combinations thereof.

[0038] Wearable device 10 may include near-field communication (NFC) functional capabilities (e.g., RFID) that may enable wearable device 10 to interact and / or communicate with a separate computing device. Such NFC functional capabilities may enable wearable device 10 to, among other things, verify or verify that it is and / or is comprised of authentic components; transfer data (e.g., physiological data acquired by wearable device 10); and determine the lifespan of wearable device 10. Wearable device 10 may include an RFID tag (e.g., in the form of a sticker, label, layer, and / or inlay) that emits radio frequencies and that can interact with an RFID reader of a separate computing device. For example, with reference to FIGS. 3A-3B, wearable device 10 may include an NFC tag 30 that can communicate and / or interact with an NFC reader of a separate computing device. NFC tag 30 can include a layer or inlay that can be secured to a portion of wearable device 10. For example, as discussed in more detail below, NFC tag 30 can be secured to a portion of housing 40 (e.g., to an interior surface of housing 40, etc.). NFC tag 30 can be secured to a portion of housing 40 such that when wearable device 10 is assembled (as shown in FIGS. 1-2H), NFC tag 30 is positioned at or near an upper portion of wearable device 10 (e.g., upper portion 41 a of housing 40, discussed below). Such positioning can advantageously facilitate communication between NFC tag 30 and an NFC reader of a separate computing device when brought into close proximity to one another. NFC tag 30 can be, for example, an active or passive RFID tag.The NFC tag 30 may enable an NFC reader in a separate device to register, track, and / or determine information about the wearable device 10 (e.g., date and / or place of manufacture, among other things).

[0039] The wearable device 10 may include a battery isolator, which may interrupt electrical communication between the battery 110 and one or more electrical contacts on the circuit board 105. For example, as shown in FIGS. 3A-3B , the wearable device 10 may include a battery isolator 18 (which may also be referred to as a “battery isolator tab”). The battery isolator 18 may be used to conserve battery power until the wearable device 10 is ready for use. The battery isolator 18 may be configured to interrupt the electrical connection between the battery 110 and the circuit board 105 until the battery isolator 18 is removed from the wearable device 10. The battery isolator 18 may be made of any material that is flexible enough to be slidably removed from its initial position and possesses sufficient dielectric properties to electrically isolate the battery 110 (or a portion thereof) from the circuit board 105. For example, the battery isolator 18 may be made of plastic, a polymer film, paper, foam, or a combination of such materials. The battery isolator 18 can extend through a slot in the housing 40 when the wearable device 10 is assembled. For example, the battery isolator 18 can extend through a slot 42 in the housing 40 discussed below with reference to FIGS. 4A-4B. With reference to FIGS. 3A-3B and 5B, an end of the battery isolator 18 can be positioned between electrical contacts on the bottom surface of the battery 110 and a portion of the battery holder 115 that is electrically connected to the circuit board 105. Such positioning can allow the battery isolator 18 to interrupt electrical communication between the battery 110 and the circuit board 105.In some variations, the battery isolator 18 is textured (e.g., at or near its end exterior to the housing 40) to provide a friction surface to assist a user in grasping and sliding the battery isolator 18 from its original assembled position. When the battery isolator 18 is removed, electrical communication between the battery 110 and the circuit board 105 is initiated, which can energize the electronic components of the wearable device 10.

[0040] 3A-3B and 4A-4B, the battery isolator 18 may be secured (e.g., partially secured) to a portion of the housing 40 by a securing tab 35 (see FIGS. 3A-3B). For example, the securing tab 35 may secure a portion of the battery isolator 18 to a rim portion 44 of the housing 40 (see FIGS. 4A-4B) and / or may position the battery isolator 18 with respect to the housing 40. The battery isolator 18 may be inserted through a slot in the housing 40 (e.g., slot 42 extending through the rim portion 44 of the housing 40). The securing tab 35 may secure a portion of the battery isolator 18 to the rim portion 44 of the housing 40 adjacent to the slot 42. For example, the securing tab 35 may secure the battery isolator 18 to the rim portion 44 over and / or around the slot 42. The securing tab 35 can be and / or can include, for example, adhesive tape on one or more sides of the securing tab 35. The securing tab 35 can maintain at least a portion of the battery isolator 18 in place (e.g., stationary) relative to the housing 40 until sufficient force is applied to the battery isolator 18 (which causes the securing tab 35 and / or the portion of the battery isolator 18 secured to the housing 40 by the securing tab 35 to “break free” (e.g., move). The securing tab 35 can help maintain the position of the ends of the battery isolator 18 relative to the wearable device 10. For example, the securing tab 35 can advantageously help maintain the position of a first end of the battery isolator 18 between the battery 110 and the portion of the battery holder 115 in electrical communication with the circuit board 105, and / or can help maintain the position of a second end of the battery isolator 18 outside of the housing 40 to facilitate visibility and / or gripping by the user.

[0041] Wearable device 10 may include one or more substrates that may be secured to other portions of wearable device 10 and / or that may allow wearable device 10 to be secured to a subject (e.g., to the subject's skin). For example, with reference to Figures 3A-3B, wearable device 10 may include one or more of substrates 20, 50, 60, 65, 25, and / or 70.

[0042] The substrate 20 may be configured to surround a portion of the housing 40. For example, the substrate 20 can include an opening 22 through which the housing 40 fits during assembly. The opening 22 can be sized and / or shaped to match the size and / or shape of a portion of the housing 40. For example, the opening 22 can be sized and / or shaped to match the size and / or shape of the main body portion 41 of the housing 40, which can be internal to and / or within the rim portion 44 of the housing 40. The substrate 50 can be positioned adjacent to (e.g., below) the housing 40 (or a portion thereof) and / or between the substrate 25 and the housing 40 (or a portion thereof). The substrates 20, 50 can sandwich a portion of the housing 40 therebetween. For example, the substrates 20, 50 can sandwich the rim portion 44 of the housing 40 when the wearable device 10 is assembled. Such a configuration can secure the housing 40 (and other components of the wearable device 10 connected directly or indirectly to the housing 40) to the substrates 20, 50, as well as to any other of the substrates 70, 25, 65, and / or 60 that may be incorporated into the wearable device 10. As illustrated in FIG. 3A , the substrates 20, 50 can have substantially similar shapes. For example, the substrates 20, 50 can have substantially matching perimeters. The substrates 20, 50 can be made from a foam material (e.g., white polyethylene, polyurethane, or reticulated polyurethane foam, to name a few). The substrates 20, 50 can be made from a medical-grade foam material.

[0043] 3A-3B and 5A-5B, substrate 50 can include opening 55 sized and / or shaped to match the size and / or shape of probe 140 or probe 240. For example, opening 55 can have a size and / or shape that matches the size and / or shape of a cross-sectional perimeter of probe 140 (or a portion of probe 140) or probe 240 (or a portion of probe 240). As discussed further below, this can advantageously allow a portion of probe 140 (or probe 240) to extend through at least a portion of opening 55 and be in closer proximity to a portion of the subject's skin surface when wearable device 10 is in use, which can allow probe 140 (or probe 240) to transmit thermal energy from the subject near, to, and / or toward one or more temperature sensors (e.g., temperature sensors 150a and / or 150c) of wearable device 10. Opening 55 can allow probe 140 (or a portion of probe 140) or probe 240 (or a portion of probe 240) to extend therethrough and contact and / or apply pressure to a portion of the subject's skin surface (directly or indirectly via substrate 25), which can also increase heat transfer. Opening 55 can extend through the thickness of substrate 50 and / or between opposing surfaces of substrate 50 (e.g., the top and bottom surfaces of substrate 50). Opening 55 can be spaced apart from the periphery of substrate 50. Substrate 50 can include a first end, a second end opposite the first end, and first and second sides, the first and second sides extending between and opposite one another. In such a configuration, opening 55 may be positioned closer to one of the first or second ends and / or may be positioned equidistant or non-equidistant from the first and second sides.

[0044] Any of the above-described substrates 20, 60, 50, 65, 25 may be integrally formed with one or more of each other. For example, in some variations, substrate 25 (described above) is integrally formed with substrate 50, substrate 60, and / or substrate 65. In some variations, wearable device 10 does not include substrate 65 and / or substrate 60. In some variations, wearable device 10 does not include substrate 25, but rather includes substrate 50, which can include the features and / or attributes described above with respect to substrate 25 (e.g., substrate 50 can be configured to secure (e.g., adhere) to a user's skin).

[0045] Wearable device 10 may include a substrate configured to contact a subject and / or to help secure (e.g., removably secure) wearable device 10 (or a portion thereof) to the subject. For example, with reference to FIGS. 3A-3B , wearable device 10 may include substrate 25, which may contact and / or secure to the subject's skin when wearable device 10 is in use. Substrate 25 may be the bottom-most of one or more substrates (and / or wearable device 10) when wearable device 10 is in use (e.g., after release liner 70 is removed). Substrate 25 may be or include a material configured to secure to a user's skin. Substrate 25 may include a material configured to enable removably securement of wearable device 10 to a user's skin. For example, substrate 25 may be coated with a highly adhesive, medical-grade adhesive that, when in contact with a subject's skin, is suitable for long-term monitoring (e.g., two or more days, e.g., three, four, five, six, seven, eight, nine, or ten days or more). Additionally or alternatively, substrate 25 can be or include a soft, comfortable, and / or breathable material. For example, substrate 25 can be or include a fabric (e.g., a nonwoven fabric having holes or openings, etc.). Substrate 25 can be a fabric and can include an adhesive material or layer (e.g., adhesive tape, etc.) on one or both surfaces of substrate 25. Such a configuration can allow wearable device 10 to be comfortably secured to the user's skin.

[0046] Wearable device 10 can include a substrate that is a release liner 70. Release liner 70 can be secured to one or more of the substrates described above (e.g., substrate 25, etc.) and can be removed prior to securing wearable device 10 to a user. For example, release liner 70 can be removed from substrate 25 prior to placing and / or securing wearable device 10 on the skin of a subject.

[0047] As mentioned above, wearable device 10 may include wireless transceiver 13, which is capable of transmitting data to (and / or receiving data from) a separate device via a wireless communication protocol. Advantageously, wearable device 10 may include one or more boards positioned between wireless transceiver 13 (and / or circuit board 105) and the subject's skin (when device 10 is in use) that reflect wireless signals transmitted from wireless transceiver 13 away from the subject's skin. Such a configuration may help, among other things, to amplify the emitted signal (e.g., away from the subject's skin), which may be important especially when the wireless communication protocol utilizes a relatively short range (e.g., a Bluetooth® wireless communication protocol).

[0048] 3A-3B, wearable device 10 can include substrate 60, which is configured to reflect such wireless signals transmitted from wireless transceiver 13 away from the subject's skin. Substrate 60 can be positioned between circuit board 105 (and the wireless transceiver mounted to circuit board 105) and substrate 50. Substrate 60 can be positioned between circuit board 105 (and the wireless transceiver mounted to circuit board 105) and any of substrates 50, 25, 65, and / or release liner 70. Substrate 60 can be adhered to a surface of substrate 50 and / or to one or more of battery 110, battery holder 115, and / or mounting frame 130 (see FIGS. 3B and 5B). 3A-3B, in some variations, substrate 60 is sized and / or shaped so as not to cover opening 55 in substrate 50, which may allow probe 140 (or probe 240) to extend through opening 44. Substrate 60 may be a polypropylene film (e.g., a metallized propylene film, etc.) that is configured to reflect wireless signals (e.g., transmitted via a Bluetooth® wireless communication protocol) away from the subject's skin when wearable device 10 is in use.

[0049] The wearable device 10 may include a substrate 65, which is positioned between the surface of the substrate 25 (or a portion of the surface of the substrate 25) and the surface of the substrate 50 (or a portion of the surface of the substrate 50). For example, the substrate 65 may be positioned between an opening 55 in the substrate 50 and the surface of the substrate 25. The substrate 65 may include an adhesive material configured to secure the substrate 50 (or a portion thereof) to the substrate 25 (or a portion thereof). The substrate 65 may be, for example, a polypropylene film. The substrate 65 may cover the opening 55 when secured to the substrate 50. When the end (e.g., bottom end) of the probe 140 (or the probe 240) extends through the opening 55 in the substrate 50, the substrate 65 may cover the end of the probe 140 (or the probe 240) and / or a “bulge” at and / or around the end, as shown in FIG. 7 , for example. Substrate 65 can advantageously cover opening 55 and prevent fluid (e.g., sweat) from entering through opening 55 toward the electrical components (e.g., circuit board 105) of wearable device 10 when in use. Such a configuration is particularly beneficial when substrate 25 is permeable (e.g., a fabric material) and sweat from the subject's skin is present around the periphery of probe 140 near opening 55.

[0050] One or more of substrates 60, 65, 25, or 70 can be transparent or translucent. For example, Figure 2D illustrates substrates 70, 25, 65 as being transparent, allowing probe 140 to be seen in Figure 2D. However, any or all of substrates 60, 65, 25, or 70 can be non-transparent.

[0051] Any or all of substrates 25, 50, 20 may be made from a material capable of providing thermal insulation and / or providing thermal conductivity. For example, when wearable device 10 is positioned on and / or secured (e.g., adhered) to a subject's skin surface, one or more of substrates 25, 50, 20 may act to insulate the skin surface at, around, and / or adjacent to points or regions where temperature is measured and / or where thermal energy is transmitted from the subject's skin surface to or near one or more temperature sensors of wearable device 10. For example, when wearable device 10 is positioned on and / or secured (e.g., adhered) to a subject's skin surface, substrate 25, 50, 20 can insulate the skin surface around opening 55 and / or around probe 140 (or probe 240), which can act as a conduit for thermal energy to flow from the skin surface to and / or toward one or more temperature sensors of wearable device 10 (e.g., temperature sensor 150a). In the human body, there is a natural heat flow between the core of the body and the skin surface because the core temperature is typically at a higher temperature than the temperature of the skin surface. Thus, heat flows from the core of the body to the skin. By insulating the skin surface at and around opening 55 and / or probe 140 (or probe 240) (thereby preventing heat from escaping), the temperature gradient between the core of the body and the skin surface is reduced. The skin temperature under the insulated area will rise until it reaches equilibrium with the warmest region under the insulation (i.e., the core), thereby approaching the core temperature. When equilibrium is reached, the skin temperature will equalize with the core temperature.One or more of substrates 25, 50, 20 can be in direct or indirect contact with the subject's skin around opening 55, probe 140 (or probe 240), and / or one or more temperature sensors of wearable device 10, and one or more of substrates 25, 50, 20 can possess thermally insulating properties. In some configurations, substrates 20 and / or 50 are made from a thermally insulating material including polyurethane foam, polystyrene foam, neoprene foam, neoprene rubber, polyester (Mylar), polytetrafluoroethylene (PTFE), silicone foam, silicone rubber, or the like, and substrate 25 is made from a fabric having an adhesive material configured to secure it to the subject's skin.

[0052] As described above and shown in at least FIGS. 3A-3B, wearable device 10 can include a housing 40, which can surround, house, and / or protect various components of wearable device 10. FIGS. 4A and 4B illustrate top and bottom views, respectively, of housing 40. Housing 40 can be made from any material that can adequately protect the electronic components of wearable device 10. Housing 40 can be rigid or, alternatively, flexible. Housing 40 can be made from and / or include a thermoplastic and / or thermoset polymer. 4A , the housing 40 may have a main body portion 41, which may include (and / or may be defined by) a top portion 41a and one or more walls (or a single continuous wall portion) 41b extending outwardly from the top portion 41a and / or around the periphery of the top portion 41a (or a portion of the periphery of the top portion 41a). The main body portion 41 may include a height that may be defined by the height of the walls 41b. As described above, a portion of the housing 40 may be positioned within and / or extend through the opening 22 in the substrate 20. For example, the main body portion 41 may be positioned within and / or extend through the opening 22. The main body portion 41 may be sized and / or shaped to be received within and / or through the opening 22 in the substrate 20. Main body portion 41 may be sized and / or shaped to create a tight fit when positioned within opening 22 of substrate 20 .

[0053] As shown in FIGS. 4A-4B , the housing 40 can include a rim portion 44 that extends around a portion of the circumference of the main body portion 41. The rim portion 44 can extend around the entire circumference of the main body portion 41 or around a portion of the circumference of the main body portion 41. The rim portion 44 can be connected to and / or extend outward from the wall portion 41b. The rim portion 44 can be used to secure the housing 40 in place relative to one or more substrates of the wearable device 10. For example, as described above, the rim portion 44 can be positioned and / or sandwiched between the substrates 20, 50 when the wearable device 10 is assembled, which can allow the housing 40 to be secured to the aforementioned substrates 20, 50 and / or any other substrates 60, 65, 25, and / or 70.

[0054] Wearable device 10 may include one or more indicators configured to indicate the status of wearable device 10 (e.g., whether wearable device 10 is in an operational (“on”) mode, whether wearable device 10 is or has paired with a separate device, whether an error has been detected, and / or the power level of wearable device 10, etc.). For example, with reference to at least FIG. 5A , wearable device 10 may include emitter 133 configured to emit light of one or more wavelengths to indicate the status of wearable device 10. Emitter 133 may be coupled to circuit board 105. Emitter 133 may include one or more light-emitting diodes (LEDs). Emitter 133 may emit light of a particular color to indicate a particular status of wearable device 10. For example, the emitter 133 may emit a green light to indicate that the wearable device 10 is powered “on,” or may emit a red light to indicate that the wearable device 10 is “off.” The housing 40 may be configured to allow the light emitted from the emitter 133 to be visible from a location outside the interior of the housing 40. For example, the housing 40 (or a portion thereof, such as the main body portion 41) may include a transparent or translucent material that allows the light emitted from the emitter 133 to be visible from a location outside the interior of the housing 40. Additionally or alternatively, the housing 40 may include an opening or hole that allows the light emitted from the emitter 133 to pass through the housing 40. For example, as shown in FIGS. 4A-4B , the housing 40 may include a hole 46 that allows the light emitted from the emitter 133 to pass through the housing 40. The aperture 46 may be located on the main body portion 41 (eg, on the upper portion 41a of the main body portion 41 of the housing 40).However, hole 46 may be positioned in alternative locations (e.g., on and / or along wall 41 b of housing 40). Hole 46 may be aligned with emitter 133 to allow light emitted from emitter 133 to more easily pass through housing 40. For example, hole 46 may be vertically aligned (or at least partially vertically aligned) with emitter 133 to allow light from emitter 133 to pass through housing 40.

[0055] As previously discussed, the housing 40 can include a slot through which the battery isolator 18 can be inserted during assembly. As shown in at least FIGS. 4A-4B , the slot 42 can be positioned on and / or extend through the rim portion 44. However, the location of the slot 42 is not so limited. The slot 42 can be positioned on and / or extend through a different portion of the housing 40 (e.g., the main body portion 41 or a portion thereof).

[0056] 4B, the housing 40 may include one or more features that can help secure, align, and / or position the housing 40 relative to one or more other components of the wearable device 10. Such features may also aid in assembly of the wearable device 10. For example, the housing 40 may include one or more features that can secure, align, and / or position the housing 40 relative to the mounting frame 130 and / or the circuit board 105. With reference to FIGS. 4B and 5A-6B, the housing 40 may include one or more cavities 49a, 49b configured to receive, retain, and / or secure one or more posts 135a, 135b of the mounting frame 130. The housing 40 may include one or both of the cavities 49a, 49b, or none of the cavities 49a, 49b. The cavities 49a, 49b may be defined and / or formed by walls having, among other shapes, cylindrical shapes (see FIG. 4B). Such walls that may define and / or form the cavities 49a, 49b may extend from (e.g., perpendicularly from) an interior surface of the upper portion 41a of the housing 40. The cavities 49a, 49b may be positioned in or near the wall 41b of the housing 40. The cavities 49a, 49b may be positioned in or near opposing walls 41b or other portions of the housing 40. The cavities 49a, 49b may be sized and / or shaped to receive, retain, and / or secure one or more posts 135a, 135b of the mounting frame 130, preventing movement of the mounting frame 130 (and / or other components coupled to the mounting frame 130, such as the circuit board 105 and / or probes 140, 240, etc.) relative to the housing 40 and / or one or more substrates.The cavities 49a, 49b may be positioned opposite one another along a portion of the housing 40 (e.g., on or near opposite sides of the housing 40 (and / or main body portion 41)). Although the figures illustrate the housing 40 as having two cavities 49a, 49b, the housing 40 can have an alternative amount of cavities (e.g., fewer than two cavities 49a, 49b, more than two cavities 49a, 49b, etc.). The number of cavities 49a, 49b can correspond to the number of posts 135a, 135b on the mounting frame 130.

[0057] Continuing with reference to FIG. 4B , housing 40 may include a recess 43 (which may also be referred to as a “recessed portion”). Recess 43 may be positioned on a portion of main body portion 41 of housing 40 (e.g., on and / or along the interior surface of top portion 41 a of main body portion 41). Recess 43 may be aligned with one or more temperature sensors of wearable device 10, which may be mounted on circuit board 105. For example, with reference to FIGS. 3A-3B, 4B, 5A, and 7, recess 43 may be aligned (e.g., vertically aligned) with temperature sensor 150 a. Recess 43 may advantageously provide more spacing and / or distance between temperature sensor 150 a and housing 40 (e.g., top portion 41 a of housing 40, etc.) to prevent temperature sensor 150 a from being affected by the temperature of housing 40 and / or the ambient temperature surrounding housing 40 and / or wearable device 10. The recess 43 may be circular, among other shapes. The recess 43 may gradually transition from the inner surface of the upper portion 41a of the main body portion 41 at, near, and / or around the periphery of the recess 43 (see FIGS. 4B and 7). Referring to FIG. 7, the recess 43 may be recessed a given depth D1 from a portion of the inner surface of the housing 40 (e.g., the inner surface of the upper portion 41a). The depth D1 of the recess 43 may be smaller than the thickness T1 of the housing 40 or that portion (e.g., the thickness of the upper portion 41a of the housing 40). The recess 43 may be larger than the temperature sensor 150a. For example, the recess 43 may have a width, length, and / or diameter that is larger than the width, length, and / or diameter of the temperature sensor 150a (see FIG. 7).

[0058] As previously discussed, the wearable device 10 may include an NFC tag 30, which may enable the wearable device 10 to interact with a separate computing device (e.g., an NFC reader of the separate device, etc.). As previously discussed, the NFC tag 30 may be secured to a portion of the housing 40. Referring to FIG. 4B , the housing 40 may include an alignment feature 45, which is configured to align, position, hold, and / or secure the NFC tag 30. The alignment feature 45 may be positioned on an interior surface of the housing 40 (e.g., on the top portion 41 a of the main body portion 41, etc.). The alignment feature 45 may be formed by a protrusion 45 a, which extends outward from the interior surface of the housing 40 (e.g., the interior surface of the top portion 41 a of the housing 40, etc.), and which extends continuously or intermittently along a portion of such interior surface. The protrusion 45a can have a height that is less than the height of the wall 41b of the housing 40, for example. The alignment feature 45 can have a size and / or shape that matches the size and / or shape of the NFC tag 30. The alignment feature 45 can be configured to receive the NFC tag 30, for example, during assembly of the wearable device 10. The alignment feature 45 can include a rectangular shape when the NFC tag 30 includes a rectangular shape. However, other shapes are possible for the alignment feature 45 and / or the NFC tag 30. The alignment feature 45 can include a protrusion 45a that extends in a rectangular shape outward from and along the interior surface of the housing 40. In some variations, the recess 43 is recessed into the perimeter of the rectangular shape defined by the protrusion 45a.

[0059] The housing 40 can include one or more indicators configured to assist in positioning and / or installing the battery isolator 18 relative to the housing 40 during assembly of the wearable device 10. For example, as shown in FIG. 4B , the housing 40 can include one or more indicators 47 a, 47 b on a rim portion 44 of the housing 40. The indicators 47 a, 47 b can be straight and / or parallel lines and can be spaced apart from one another. During assembly, a portion of the battery isolator 18 can be installed through the slot 42 of the housing 40, and the width of the battery isolator 18 can be aligned with respect to the distance between the two indicators 47 a, 47 b. In some cases, the distance between the two indicators 47 a, 47 b can match the width of the battery isolator 18. In some cases, an end of the battery isolator 18 may be positioned between the two indicators 47 a, 47 b prior to removal of the battery isolator 18 from the housing 40 and / or wearable device 10. Such positioning can advantageously allow the battery isolator 18 to be properly positioned between the electrical contacts of the battery 110 and the battery holder 115, which can be in electrical communication with the circuit board 105. For example, such positioning can ensure that a portion of the battery isolator 18 is positioned between the prongs 115 c of the battery holder 115, which can be in a middle portion of the battery holder 115 between the two opposing arms 115 a, 115 b of the battery holder 115.

[0060] 5A-5D show different views of a portion of wearable device 10. As shown, wearable device 10 may include a circuit board 105, a battery 110, a battery holder 115, a mounting frame 130, and a probe 140. Circuit board 105 may mechanically support and electrically connect various electrical components of wearable device 10 to facilitate performance of various functions of wearable device 10. Such electrical components may include, but are not limited to, a processor 11, a storage device 12, a wireless transceiver 13, and one or more temperature sensors 16 (e.g., temperature sensors 150a, 150b, etc.). Circuit board 105 may be double-sided, having electronic components mounted on a first and / or second side or surface thereof. The circuit board 105 may include one or more electrical contacts 107, which may be electrically coupled (e.g., soldered) to (or a portion of) the battery holder 115. Although the figures illustrate the circuit board 105, which may be, for example, a rigid circuit board (e.g., a rigid printed circuit board, etc.), the wearable device 10 may alternatively include a flexible circuit that may electrically connect various electrical components of the wearable device 10.

[0061] Circuit board 105, or a portion thereof, may be sized and / or shaped to interact with mounting frame 130. For example, circuit board 105, or a portion thereof, may be sized and / or shaped to be secured, held, and / or positioned by and / or with respect to mounting frame 130. As discussed in more detail below, the size and / or shape of end 105a of circuit board 105 may be configured to fit within a slot defined by one or more walls of mounting frame 130. For example, end 105a of circuit board 105 may have a width that is sized to fit within a slot defined between walls 133c, 133d of mounting frame 130. Additionally, as discussed further below, the circuit board 105 can include one or more openings 111 sized and / or shaped to receive one or more posts 135 a, 135 b or a portion thereof (e.g., a portion of the periphery of the posts 135 a, 135 b, etc.). The openings 111 can be, for example, notches and can be positioned along a side or edge of the circuit board 105. The circuit board 105 can have an end 105 a and an end 105 b opposite the end 105 a. As shown in at least FIGS. 5C-5D , the end 105 b of the circuit board 105 can be curved. The curvature of the end 105 b can, for example, match the curvature of a portion of the battery 110 and / or the housing 40 (e.g., the main body portion 41 of the housing).

[0062] As illustrated in FIGS. 5A-5D , the battery holder 115 can be attached to electrical contacts 107 on two sides and / or edges of the circuit board 105. The battery holder 115 can form a support structure for the battery 110 and can hold the battery 110 in a stationary position relative to the circuit board 105. The battery holder 115 can be made of an electrically conductive material. The battery 110 can provide power to the hardware components of the wearable device 10 described herein. The battery 110 can be a coin cell battery (e.g., a lithium coin cell battery, etc.). The battery 110 can have a cathode on a first (top) side and an anode on a second (bottom) side opposite the first side. 5C , the battery holder 115 may include two opposing arms 115a, 115b, which may be electrically connected (e.g., soldered) to the electrical contacts 107 of the circuit board 105, and may include a prong 115c, which may contact the anode on the bottom side of the battery 110. The prong 115c may be biased and / or extend upward from a portion of the battery holder 115 to apply pressure to a portion of the battery 110 when the battery 110 is secured to the battery holder 115. During assembly and before use, a battery isolator 18 may be inserted between the anode of the battery 110 and the prong 115c to interrupt electrical contact between the battery 110 and the circuit board 105. 5D, the circuit board 105 can include electrical contacts 157 that are configured to contact the cathode on the top side of the battery 110. The electrical contacts 157 can be gold-plated copper pads.

[0063] As shown in at least FIGS. 5A-5D and as described above, wearable device 10 can include mounting frame 130. FIGS. 6A-6C illustrate various views of mounting frame 130. Mounting frame 130 can secure circuit board 105 (and electrical components mounted on circuit board 105) and / or probes 140 to housing 40 and / or mounting frame 130 can operably position circuit board 105 (and electrical components mounted on circuit board 105) and / or probes 140 in housing 40. Additionally, since battery holder 115 and battery 110 can be secured to circuit board 105 as described above, mounting frame 130 can secure battery 110 and / or battery holder 115 to housing 40.

[0064] Continuing with reference to FIGS. 6A-6C, the mounting frame 130 can have a first end 130a, a second end 130b opposite the first end 130a, a side 130c, and a side 130d opposite the side 130c. The mounting frame 130 can be sized and / or shaped to match the size and / or shape of the battery 110 or a portion thereof. For example, with reference to FIGS. 5A-5D and 6A-6C, the end 130a (or a portion of the end 130a) of the mounting frame 130 can be curved to match a portion of the periphery of the battery 110. The end 130a (or a portion of the end 130a) can include, among other shapes, a half-moon shape. The curvature of the end 130a can match or partially match the curvature of the battery 110 or a portion thereof. End 130a can be curved inward toward end 130b of mounting frame 130. The surface of end 130a facing away from end 130b can be, for example, concave. At least a portion of end 130 can be sized and / or shaped to surround a portion of battery 110 (e.g., a portion of the periphery of battery 110). For example, at least a portion of end 130 may be sized and / or shaped to encompass less than the entire circumference of battery 110, less than ½ of the circumference of battery 110, more than ⅛ of the circumference of battery 110, more than ⅔ of the circumference of battery 110, more than ⅔ of the circumference of battery 110, between ⅛ and 7 / 8 of the circumference of battery 110, between ⅛ and 6 / 8 of the circumference of battery 110, between ⅛ and 5 / 8 of the circumference of battery 110, between ⅛ and ½ of the circumference of battery 110, or approximately ½ of the circumference of battery 110, among other values ​​or ranges.

[0065] Advantageously, if end 130a is sized and / or shaped to match the size and / or shape of battery 110 (or a portion of battery 110) and / or if end 130a is sized and / or shaped to surround a portion of battery 110, as described above, such a configuration can allow wearable device 10 to have smaller dimensions while maximizing the size of battery 110. Minimizing the overall dimensions of wearable device 10 can improve the comfort and reduce the bulkiness of wearable device 10 when placed on a subject and / or when handled by a user. Additionally, maximizing the size of battery 110 in such a manner can allow wearable device 10 to have a longer useful life (e.g., 1 day or more, 2 days or more, 3 days or more, 4 days or more, 5 days or more, 6 days or more, or 7 days or more).

[0066] The mounting frame 130, or a portion thereof, may be sized and / or shaped to interact with, secure, hold, and / or position the circuit board 105. For example, the mounting frame 130 may include one or more posts 135a, 135b configured to fit within one or more openings 111 in the circuit board 105. With reference to FIGS. 5A-6B, the one or more posts 135a, 135b may fit within the space defined by the openings 111 in the circuit board 105. Although the figures illustrate the mounting frame 130 with two posts 135a, 135b, the mounting frame 130 may have an alternative amount of posts 135a, 135b. The mounting frame 130 can have one, two, three, four, five, six, or more posts 135a, 135b configured to interact with a corresponding number of openings 111 in the circuit board 105. One or more posts 135a, 135b may be positioned near or adjacent to a side 130c, 130d of the mounting frame 130, for example, if the circuit board 105 includes openings 111 on both sides and / or edges thereof. However, one or more posts 135a, 135b may be positioned in alternative locations. One or more posts 135a, 135b may be positioned closer to end 130a than end 130b of the mounting frame 130 (see FIG. 6B). One or more posts 135 a, 135 b may be at least partially retained within opening 111 and may limit or prevent movement of circuit board 105 relative to mounting frame 130 in one or more directions. For example, one or more posts 135 a, 135 b, when positioned within opening 111, may limit or prevent movement of circuit board 105 relative to mounting frame 130 in one or more directions along a plane of circuit board 105. Such a plane may extend along and / or be defined by one or more surfaces of circuit board 105 (e.g., opposing surfaces of circuit board 105).One or more posts 135a, 135b can have a size and / or shape that corresponds to the size and / or shape of opening 111 (or a portion thereof). For example, one or more posts 135a, 135b can have a cylindrical shape that allows them to be positioned within semicircular-shaped opening 111. One or more posts 135a, 135b can extend outward from surface 131a of mounting frame 130 (see FIGS. 6A-6B). For example, one or more posts 135a, 135b can extend transversely (e.g., perpendicularly) to surface 131a of mounting frame 130.

[0067] One or more posts 135 a, 135 b can be secured to a portion of housing 40, as described above. For example, one or more posts 135 a, 135 b can be sized and / or shaped to secure to and / or within one or more cavities 49 a, 49 b of housing 40. Thus, through interaction with one or more openings 111 in circuit board 105 and one or more cavities 49 a, 49 b of housing 40, one or more posts 135 a, 135 b can secure circuit board 105 (and components coupled thereto) and mounting frame 130 to housing 40. As discussed further below, if mounting frame 130 is configured to secure probe 140 (or probe 240), one or more posts 135 a, 135 b can additionally secure probe 140 (or probe 240) to housing 40. The fixation of the one or more posts 135a, 135b to the one or more cavities 49a, 49b can be, for example, a friction fit. As another example, the one or more posts 135a, 135b can include a smaller cross-section than the one or more cavities 49a, 49b, allowing the posts 135a, 135b to be received within the cavities 49a, 49b and reducing lateral movement of the mounting frame 130 and the housing 40 relative to one another, but also allowing the posts 135a, 135b to be more easily inserted into and / or removed from the cavities 49a, 49b (e.g., during assembly of the wearable device 10).

[0068] Mounting frame 130 may include alternative or additional features that facilitate interaction with, securing and / or retaining, and / or positioning circuit board 105. For example, mounting frame 130 may include one or more raised portions and / or one or more walls that may extend from surface 131 a of mounting frame 130 and retain a portion or portions of circuit board 105. For example, with reference to FIGS. 6A-6C , mounting frame 130 may include one or both raised portions 133 a, 133 b and / or one or both walls 133 c, 133 d. Raised portions 133 a, 133 b and / or walls 133 c, 133 d may be positioned near or adjacent end 130 b of mounting frame 130. Walls 133c, 133d may be spaced apart from one another by a distance sized to match a portion of circuit board 105. For example, walls 133c, 133d may be spaced apart from one another by width W1, which is sized to accommodate the width of end 105a of circuit board 105. End 105a may be smaller than the width of opposite end 105b of circuit board 105 and / or may be smaller than the width of another portion of circuit board 105 (see FIG. 5C ). Advantageously, such a configuration may allow end 105a of circuit board 105 to be retained between walls 133c, 133d and may limit or prevent movement of circuit board 105 relative to mounting frame 130 in one or more directions along the plane of circuit board 105 (and / or mounting frame 130). Such planes may extend along and / or be defined by one or more surfaces of circuit board 105 (e.g., opposing surfaces of circuit board 105). With reference to Figures 6A-6B and 5A, raised portions 133a, 133b may provide additional or alternative fixation between a portion of circuit board 105 (e.g., a portion of circuit board 105 between opening 111 and edge 105a) and mounting frame 130.Interaction between raised portions 133a, 133b, and / or wall 133c and edge 105a of circuit board 105 can limit or prevent rotation of circuit board 105 relative to mounting frame 130 (e.g., about an axis extending perpendicular to a surface of circuit board 105 (e.g., the top and / or bottom surface of circuit board 105)). Additionally or alternatively, interaction between one or more posts 135a, 135b and opening 111 in circuit board 105 can limit or prevent rotation of circuit board 105 relative to mounting frame 130 (e.g., about an axis extending perpendicular to a surface of circuit board 105 (e.g., the top and / or bottom surface of circuit board 105)).

[0069] As shown in at least FIGS. 6A-6C, one or both of sides 130c, 130d (or portions thereof) can be curved and / or rounded. For example, one or both surfaces of sides 130c, 130d can be convex. Alternatively, one or both of sides 130c, 130d can be straight. If mounting frame 130 includes one or more raised portions 133a, 133b, one or both of raised portions 133a, 133b can be adjacent to sides 130c, 130d and can be similarly curved as sides 130c, 130d (see FIG. 6B).

[0070] 6B, the mounting frame 130 can include one or both of notches 138a, 138b at the corners where the end 130a joins the sides 130c, 130d. The notches 138a, 138b can interact with the opposing arms 115a, 115b of the battery holder 115 to facilitate alignment, positioning, and / or engagement between the mounting frame 130 and the battery holder 115 (see FIGS. 5A-5B and 6B).

[0071] As discussed elsewhere herein and shown in at least FIGS. 5A-5D , the wearable device 10 can include a probe 140, which can be configured to transmit thermal energy from the subject to, toward, and / or near one or more temperature sensors of the wearable device 10. The mounting frame 130 can be configured to secure the probe 140 and / or operably position the probe 140 relative to the subject's skin. For example, the mounting frame 130 can include an opening sized and / or shaped to receive and / or secure the probe 140 or a portion thereof. The opening can extend through the thickness or depth of the mounting frame 130. The opening can be positioned adjacent to or near end 130 a, end 130 b, side 130 c, and / or 130 d. The opening can be a slot (e.g., slot 132 shown in at least FIGS. 5C-6C ). As shown, slot 132 may be positioned at and / or along end 130b of mounting frame 130. Slot 132 may be sized and / or shaped to receive and / or secure a portion of probe 140. For example, slot 132 may be shaped and / or sized to match the size and / or shape of a cross-section and / or a portion of the exterior surface or periphery of probe 140. Slot 132 may include a circular or partially circular shape, for example, when probe 140 has a cylindrical shape. Slot 132 may be positioned adjacent end 130b to allow probe 140 to be inserted into slot 132 along a direction transverse (e.g., perpendicular) to an axis extending through the center of slot 132. Additionally or alternatively, slot 132 may be sized, shaped, and / or positioned to allow probe 140 (or a portion thereof) to be inserted into slot 132 along a direction parallel to such an axis extending through the center of slot 132.The slot 132 may be sized and / or shaped to surround a portion of the probe 140. For example, the slot 132 may be sized and / or shaped to surround a portion of the cross-section and / or exterior surface or perimeter of the probe 140. For example, the mounting frame 130 and / or the slot 132 may be configured such that, when the probe 140 is secured to the mounting frame 130, the mounting frame 130 surrounds less than the entire circumference of the cross-section of the probe 140, more than one-quarter of the circumference of the cross-section of the probe 140, more than one-half of the circumference of the cross-section of the probe 140, more than three-quarters of the circumference of the cross-section of the probe 140, approximately one-half of the circumference of the cross-section of the probe 140, approximately three-quarters of the circumference of the cross-section of the probe 140, or any value therebetween, or any range bounded by any combination of these values, although values ​​and ranges outside of these values ​​or ranges may also be used in some cases.

[0072] As discussed in more detail below, the probe 140 can have a body portion 144 with a recessed portion 146, the recessed portion 146 having a cross-section that is smaller than the cross-section of the body portion 144 of the probe 140. The slot 132 can, for example, be sized and / or shaped to accommodate the size and / or shape of the recessed portion 146 of the probe 140. The slot 132 can have a depth (oriented vertically in the views of FIGS. 5C-5D) that is less than, equal to, or greater than the height (oriented vertically in the views of FIGS. 5C-5D) of the recessed portion 146 of the probe 140, extending along a portion of the height of the body portion 144 of the probe 140. With reference to FIGS. 6A-6C, the slot 132 can include one or more protrusions 139, the one or more protrusions 139 extending along the depth of the slot 132 (or a portion of the depth of the slot 132). For example, the slot 132 can include one, two, three, four, five, six, or more protrusions 139. The one or more protrusions 139 can be equidistantly or non-equidistantly spaced apart from one another along the length (or width) of the slot 132 (see FIGS. 6A-6C). The protrusions 139 can extend outward (e.g., perpendicularly) from a surface of the slot 132. The protrusions 139 can be rigid or, alternatively, can be non-rigid (e.g., flexible). The protrusions 139 can engage a portion of the probe 140 when the probe 140 is positioned in the slot 132. For example, the protrusions 139 can engage a recessed portion 146 of the probe 140 when the probe 140 is positioned in the slot 132. The slot 132 may secure the probe 140 with, for example, a friction fit and / or a snap fit engagement, or other type of engagement.

[0073] When probe 140 is secured in slot 132, probe 140 (and / or an axis extending through the center of probe 140) may be oriented transversely (e.g., perpendicularly) relative to the plane and / or surface of mounting frame 130. For example, when probe 140 is secured in slot 132, probe 140 may be oriented perpendicular to surface 131 a of mounting frame 130. Additionally or alternatively, when probe 140 is secured in slot 132 of mounting frame 130, probe 140 may be oriented perpendicular to circuit board 105 (and / or a surface or plane of circuit board 105). Such positioning can aid in probe 140 contacting and / or applying pressure to a portion of the subject's skin (whether directly or indirectly via substrates 65 and / or 25) and facilitating the transmission of thermal energy through probe 140 to and / or near other portions of wearable device 10 (e.g., toward temperature sensor 150a).

[0074] 6A-6B, the mounting frame 130 can include a recessed portion 137 that can be recessed from a surface 131 a of the mounting frame 130. The recessed portion 137 can be positioned proximate or adjacent to an end 130 b of the mounting frame 130. The recessed portion 137 can be positioned around the slot 132. The perimeter of the recessed portion 137 can be larger than the perimeter of the slot 132. The perimeter of the recessed portion 137 can be spaced outward from the perimeter of the slot 132 (see FIG. 6B). The recessed portion 137 can be recessed from the surface 131 a by a depth (oriented vertically in the views of FIGS. 5C-6A) that is sized to correspond to the height of a portion of the probe 140. For example, recessed portion 137 can be recessed from surface 131 a by a depth sized to correspond to the height of an upper portion 148 (oriented vertically in the views of FIGS. 5C-5D) of probe 140, which is discussed in more detail below. Such a configuration can allow the height of upper portion 148 of probe 140 to fit within the depth of recessed portion 137 when probe 140 is secured within slot 132.

[0075] As discussed elsewhere herein and illustrated in FIG. 7 , the wearable device 10 may include a probe 140, which may act as a conduit for transmitting thermal energy from the subject's skin to, toward, and / or near one or more temperature sensors of the wearable device 10. As shown in at least FIGS. 5C-5D , the probe 140 may include a first end 142 a, a second end 142 b opposite the first end 142 a, and a body portion 144. The probe 140 (and / or the body portion 144 of the probe 140) may include a height extending between the first end 142 a and the second end 142 b. The probe 140 may include various shapes and / or sizes. The probe 140 may include, among other things, a cylindrical shape. As shown, the body 144 may include a recessed portion 146 extending along a portion of the body 144 of the probe 140. The recessed portion 146 may be recessed from the outer surface of the body 144. The recessed portion 146 may assist in securing the probe 140 to and / or within the slot 132 of the mounting frame 130. For example, the height of the recessed portion 146 may be sized to correspond to the depth of the slot 132 of the mounting frame 130, allowing portions of the body 144 adjacent the recessed portion 146 to engage the top and bottom surfaces of the mounting frame (and / or the recessed portion 137 of the mounting frame 130) when the probe 140 is received therein. As mentioned above, the slot 132 may include one or more protrusions 139 along the width of the slot 132. The recessed depth of recessed portion 146 of probe 140 may be sized to fit the distance that one or more protrusions 139 extend outward from the surface of slot 132. Additionally or alternatively, the height of recessed portion 146 of probe 140 may be sized to fit the height of one or more protrusions 139.For example, one or more protrusions 139 can extend outward from the surface of slot 132 a given distance corresponding to the depth of recessed portion 146 (relative to the outer surface of body portion 144). As another example, one or more protrusions 139 can have a height that extends along the depth of slot 132 corresponding to the height of recessed portion 146. The height of recessed portion 146 can extend along a portion of the height of probe 140 ("vertically," given the orientation shown in FIGS. 5C-5D).

[0076] As mentioned above, the wearable device 10 may include one or more temperature sensors. FIGS. 5A, 5C, and 5D illustrate a temperature sensor 150a positioned on a first surface of the circuit board 105. When the probe 140 is secured to the mounting frame 130, the probe 140 may be aligned with and / or positioned proximate to the temperature sensor 150a. For example, with reference to FIGS. 5A-5B, when the probe 140 is secured to the mounting frame 130 (e.g., in the slot 132), the probe 140 may be vertically aligned with the temperature sensor 150a. For example, an axis extending through the center of the probe 140 may extend through the temperature sensor 150a, and such axis may be perpendicular to the surface or plane of the circuit board 105. When the probe 140 is secured to the mounting frame 130 (e.g., in the slot 132), the end 142 a of the probe 140 may be positioned near or adjacent to a surface (e.g., the bottom surface) of the circuit board 105 that is proximate to the temperature sensor 150 a. As another example, when the probe 140 is secured to the mounting frame 130 (e.g., in the slot 132), the end 142 a of the probe 140 may be positioned adjacent to a first surface (e.g., the bottom surface) of the circuit board 105, the temperature sensor 150 a may be positioned adjacent to a second surface (e.g., the top surface) of the circuit board 105, and the probe 140 and the temperature sensor 150 a may be aligned. As another example, when the probe 140 is secured to the mounting frame 130 (e.g., in the slot 132), the circuit board 105 may be positioned between the probe 140 and the temperature sensor 150 a.

[0077] The wearable device 10 may include a thermally conductive material and / or layer between the end 142a of the probe 140 and the surface of the circuit board 105. For example, with reference to FIGS. 5C-5D, the wearable device 10 may include thermal paste 173 positioned between the end 142a of the probe 140 and the surface of the circuit board 105 (e.g., the bottom surface of the circuit board 105, given the orientation shown in FIGS. 5C-5D). The thermal paste 173 may be aligned (e.g., vertically aligned) with the probe 140 and / or temperature sensor 150a. The thermal paste 173 may include, for example, zinc oxide. The thermal paste 173 may be silicone-free. The thermal paste 173 may include, among other shapes, a circular shape. For example, the thermal paste 173 may be in the form of a disk. The thermal paste 173 can conform to the shape of the probe 140 and / or can deform when positioned between the circuit board 105 and the probe 140. The thermal paste 173 can reduce or prevent an air gap between the end 142a of the probe 140 and the circuit board 105, thus increasing the thermal transmittance.

[0078] 5D , the circuit board 105 can include one or more openings 159 extending through the circuit board 105. For example, the one or more openings 159 can extend through the thickness of the circuit board 105 and / or between opposing surfaces (e.g., top and bottom surfaces) of the circuit board 105. The one or more openings 159 can be positioned adjacent to the temperature sensor 150a, the thermal paste 173, and / or the probe 140 (e.g., the end 142a of the probe 140). The one or more openings 159 can allow thermal energy to flow from the probe 140 and / or the thermal paste 173 through the circuit board 105 to the temperature sensor 150a. In such a configuration, the one or more openings 159 can provide a pathway by which such thermal energy can flow from the probe 140 and / or the thermal paste 173 through the circuit board 105 to the temperature sensor 150a. The circuit board 150 can include one, two, three, four, five, six, seven, eight, nine, or ten or more openings 159. The circuit board 150 can include, for example, between one and twenty openings 159, between one and ten openings 159, or between one and five openings 159. The circuit board 105 can include a plurality of openings 159, for example, three or more, four or more, five or more, six or more, seven or more, eight or more, or nine or more openings 159. The circuit board 105 can include a plurality of openings 159 arranged in an array and / or pattern. For example, the circuit board 105 can include a plurality of openings 159 arranged in an array having a rectangular shape (see FIG. 5D ), a square shape, or a circular shape, among others. The plurality of openings 159 can, in some cases, be spaced equidistant from one another.

[0079] When such openings 159 are arranged in an array, the dimensions of the array can correspond to the dimensions of the probe 140 to ensure that thermal energy flowing through the end 142a of the probe 140 is efficiently transported through the circuit board 105 to the temperature sensor 150a. For example, if the probe 140 has a circular cross-section, the circuit board 105 can include a plurality of openings 159 arranged in a circular array having a diameter less than, equal to, or greater than the diameter of the circular cross-section of the probe 140. As another example, if the probe 140 has a circular cross-section, the circuit board 105 can include a plurality of openings 159 arranged in a non-circular array (e.g., a square or rectangular array), where the length and / or width dimensions of the non-circular array are less than, equal to, or greater than the diameter of the circular cross-section of the probe 140. As another example, if the probe 140 has a cross-section having a length and a width, the length and / or width of the array of multiple openings 159 can be less than, equal to, or greater than such length and / or width of the cross-section of the probe 140.

[0080] In some variations, one or more openings 159 include (e.g., are filled with) a thermally conductive material (e.g., gold and / or copper, etc.) to increase the rate of thermal transmission through the circuit board 105. When the wearable device 10 is assembled, the one or more openings 159 (and / or an array formed by the plurality of openings 159) can align with the temperature sensor 150 a, the thermal paste 173, the probe 140 (e.g., an axis extending through the height of the probe 140), the slot 132 in the mounting frame 130, and / or the opening 55 in the substrate 50. In some implementations, an axis extending through the center of the array defined by the plurality of openings 159 can align with the temperature sensor 150 a, the thermal paste 173, the probe 140 (e.g., an axis extending through the height of the probe 140), the slot 132 in the mounting frame 130, and / or the opening 55 in the substrate 50. Each of the one or more openings 159 may be smaller than the openings 55 in the substrate 50 and / or may be smaller than the slots 132 in the mounting frame 130, each of which is discussed elsewhere herein. When the circuit board 105 includes a plurality of openings 159 arranged in an array, the region or area defining and / or forming the perimeter of such array may be smaller than the openings 55 in the substrate 50 and / or may be smaller than the slots 132 in the mounting frame 130.

[0081] 5C-5D , thermal paste 173 may be positioned between one or more openings 159 in circuit board 105 and thermally conductive probe 140. Thermal paste 173 may be positioned between a surface of circuit board 105 and thermally conductive probe 140. Thermal paste 173 may be positioned between end 142 a of thermally conductive probe 140 and a surface of circuit board 105. Thermal paste 173 may be positioned between end 142 a of thermally conductive probe 140 and one or more openings 159 in circuit board 105.

[0082] 5D , the wearable device 10 may include a thermally conductive pad 155 positioned adjacent to one or more openings 159 and a surface (e.g., a bottom surface) of the circuit board 105. The thermally conductive pad 155 may be positioned between the one or more openings 159 and the thermal paste 173 and / or the probe 140. The thermally conductive pad 155 may increase the thermal conductivity of thermal energy from the probe 140 and the thermal paste 173 to the one or more openings 159, through the circuit board 105, and to the temperature sensor 150a. The thermally conductive pad 155 may be made of metal. For example, the thermally conductive pad 155 may include gold and / or copper.

[0083] 7 illustrates a cross-sectional view taken along a portion of the assembly diagram of wearable device 10 shown in FIG. 2C when placed adjacent to a subject's skin. As shown, when probe 140 is secured to mounting frame 130 (e.g., in slot 132), and when mounting frame 130 is secured to housing 40, end 142b of probe 140 can be positioned adjacent to the subject's skin. Also, as shown, when wearable device 10 is placed on and / or secured to the subject, probe 140 can apply pressure to and / or press against a portion of the subject's skin. If wearable device 10 includes substrate 65 and / or 25 coupled to housing 40 (e.g., via securing to substrate 50), substrate 65, 25 can be positioned between end 142b of probe 140 and the subject's skin when wearable device 10 is secured to a user. As previously discussed, substrate 50 (which may include foam) may include opening 55, which is sized and / or shaped to allow a portion of probe 140 to extend therethrough.

[0084] In some implementations, the probe 140 extends through the opening 55 beyond the surface of the substrate 50 (e.g., the “bottom” surface of the substrate 50) by a distance equal to or greater than approximately 0.01 inch, approximately 0.02 inch, approximately 0.03 inch, approximately 0.04 inch, approximately 0.05 inch, approximately 0.06 inch, approximately 0.07 inch, approximately 0.08 inch, approximately 0.09 inch, approximately 0.1 inch, approximately 0.2 inch, approximately 0.3 inch, approximately 0.4 inch, or approximately 0.5 inch, or any value or range between any of these values, or any value or range bounded by any combination of these values. In some implementations, the probe 140 extends through the opening 55 beyond the surface of the substrate 50 (e.g., the “bottom” surface of the substrate 50) a distance of between approximately 0.01 inches and approximately 0.5 inches, e.g., between approximately 0.02 inches and approximately 0.4 inches, between approximately 0.03 inches and approximately 0.3 inches, between approximately 0.04 inches and approximately 0.2 inches, between approximately 0.05 inches and approximately 0.1 inches, between approximately 0.06 inches and approximately 0.09 inches, between approximately 0.07 inches and approximately 0.08 inches, between approximately 0.05 inches and approximately 0.2 inches, or between approximately 0.09 inches and approximately 0.2 inches, or any value or range between any of these values ​​or ranges, or any value or range bounded by any combination of these values. Alternatively, in some implementations, the probes 140 do not extend beyond the bottom surface of the substrate 50. For example, in some implementations, the probes 140 extend through the openings 55 but terminate at the bottom surface of the substrate 50, with the plane of the ends 142b of the probes 140 being generally parallel to the plane of the bottom surface of the substrate 50.

[0085] When the wearable device 10 is assembled and placed and / or secured to the subject's skin, with the end 142b of the probe 140 extending through the opening 55 of the substrate 50, the substrate 65 and / or the substrate 25 may be positioned between the surface of the subject's skin and the end 142b of the probe 140. Thus, in such a configuration, the probe 140 (e.g., the end 142b of the probe 140) may indirectly contact a portion of the subject's skin. As described above, the substrate 65 covers the opening 55 and the end 142b of the probe 140 and may prevent fluid (e.g., sweat) from entering the interior of the housing 40 through the opening 55 (e.g., to and / or toward the electrical components of the wearable device 10). As discussed above, the substrate 25 may include a thermally conductive material and / or may be configured to allow thermal energy to pass from the subject's skin to the end 142b of the probe 140. As also discussed above, any of substrates 25, 65, 50, and / or 20 may advantageously insulate a portion of the subject's skin. When a portion of probe 140 is positioned through opening 55 (e.g., end 142b passing through opening 55 in substrate 50), substrates 25, 20, 65, and / or 50 may insulate a portion of the subject's skin around and / or beneath end 142b of probe 140, which may allow probe 140 to transmit thermal energy indicative of the subject's core body temperature, as previously discussed.

[0086] The probe 140 may include a thermally conductive material that allows the probe 140 to transmit and / or act as a conduit for the subject's thermal energy. Thus, thermal energy from the subject's skin may pass through the substrates 25 and / or 65 and the probe 140. As mentioned above, the probe 140 may include, for example, aluminum, among other thermally conductive materials. As also discussed above, the probe 140 may be rigid, which may allow the probe 140 to apply pressure to a portion of the subject's skin. Such application of pressure to a portion of the subject's skin may allow the probe 140 to better accept thermal energy from the subject. For example, the probe 140 may be non-compressible and / or non-extensible (e.g., non-compressible and / or non-extensible relative to a longitudinal axis extending along the height of the probe 140). As another example, the probe 140 may be non-compressible and / or non-extensible relative to a longitudinal axis extending through the center of the cross section of the probe 140 .

[0087] 7, end 142a of probe 140 may be positioned adjacent a first surface of circuit board 105 (e.g., the “bottom” surface of circuit board 105), and temperature sensor 150a may be positioned adjacent a second surface of circuit board 105 (e.g., the “top” surface of circuit board 105). As discussed above, thermal paste 173 may be positioned between end 142a of probe 140 and circuit board 150. As discussed above, thermally conductive pad 155 may be positioned between one or more openings 159 in circuit board 105 and thermal paste 173 and / or probe 140. The one or more openings 159 may allow thermal energy to pass through circuit board 105 to temperature sensor 150a.

[0088] When thermal energy is transmitted to temperature sensor 150a, temperature sensor 150a can determine the subject's body temperature and / or generate one or more signals in response to the thermal energy and transmit them to processor 11 of wearable device 10. Temperature sensor 150a can be or include, for example, a thermocouple and / or a thermistor. Temperature sensor 150a can be a chip electrically and mechanically coupled to circuit board 105. Temperature sensor 150a can be configured to generate one or more signals in response to the detected thermal energy, determine the body temperature, and / or transmit such generated signal(s) and / or such determined body temperature to processor 11 of wearable device 10 continuously and / or intermittently. For example, temperature sensor 150a may be configured to generate one or more signals in response to detected thermal energy, determine a body temperature, and / or transmit such generated signal(s) and / or such determined body temperature every 0.5 seconds, 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, or other intervals.

[0089] In addition to temperature sensor 150a, wearable device 10 may include one or more additional temperature sensors. For example, referring to FIG. 5C , wearable device 10 may include temperature sensor 150b. Like temperature sensor 150a, temperature sensor 150b may be electrically and / or mechanically coupled to circuit board 105. Temperature sensor 150b may be spaced apart from temperature sensor 150a. Temperature sensor 150b may be used, for example, to detect the temperature within the interior of housing 40 and / or the temperature proximate to circuit board 105. Temperature sensor 150b may be used to measure the ambient temperature (e.g., the temperature outside the interior of housing 40).

[0090] In some implementations, the temperature sensor 150b is surrounded by a material to isolate the temperature sensor 150b from nearby electrical components and / or to prevent the temperature sensor 150b from being thermally affected by the temperature inside the housing 40, allowing the temperature sensor 150b to better measure the ambient temperature outside the housing 40. For example, with reference to FIGS. 5A and 5C, the wearable device 10 can include a thermal putty 120, which can be positioned around and / or adjacent to the temperature sensor 150b. The thermal putty 120 can be positioned between the temperature sensor 150b and the interior surface of the top portion 41a of the housing 40 (see FIGS. 5A, 5C, and 4B). For example, the thermal putty 120 can extend outward (e.g., “upward,” given the views shown in FIGS. 5A and 5C ) from the surface of the circuit board 105 around the temperature sensor 150b to the interior surface of the upper portion 41a of the housing 40. Advantageously, the thermal putty 120 can transmit thermal energy from the surface of the housing 40 (which is in thermal contact with the ambient environment) to the temperature sensor 150b. The thermal putty 120 can deform and / or conform to the shape of a portion of the interior surface of the upper portion 41a of the housing 40 to better facilitate the transfer of thermal energy from the interior surface (and the ambient environment) to the temperature sensor 150b. The temperature sensor 150b can be configured to generate one or more signals based on thermal energy received, whether from the interior of the housing 40 or from the ambient environment (e.g., via the thermal putty 120). The thermal putty 120 can be, for example, a ceramic-filled silicone sheet.

[0091] Temperature sensor 150b may be configured to generate one or more signals in response to detected thermal energy, determine a temperature, and / or continuously and / or intermittently transmit such generated signal(s) and / or such determined temperature to processor 11 of wearable device 10. For example, temperature sensor 150b may be configured to generate one or more signals in response to detected thermal energy, determine a temperature, and / or transmit such generated signal(s) and / or such determined temperature every 0.5 seconds, 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, or other intervals. Such generated signal(s), determined temperature(s), and / or transmission of such generated signal(s) and / or determined temperature(s) may be simultaneous or asynchronous with the generated signal(s), determined body temperature(s), and / or transmitted signal(s) and / or determined body temperature(s) from temperature sensor 150a.

[0092] Advantageously, incorporating both temperature sensors 150a, 150b can enable wearable device 10 to more accurately determine the user's core body temperature. For example, processor 11 can utilize the temperature data from temperature sensor 150b to adjust or "correct" the temperature data received from first temperature sensor 150a to more accurately determine the subject's core body temperature. For example, processor 11 can compare the temperature data received from both temperature sensors 150a, 150b and determine a corrected body temperature based on such comparison. Processor 11 can apply a weighting factor to one or both of the temperature data received from temperature sensors 150a, 150b and / or otherwise compare such received data to determine a corrected body temperature.

[0093] As mentioned above, and with continued reference to FIG. 7 , the housing 40 may include a recess 43, which is recessed from a portion of the interior surface of the housing 40 (e.g., the interior surface of the upper portion 41 a), by a depth D1, where the depth D1 is less than a thickness T1 of the housing 40 (e.g., the thickness of the upper portion 41 a of the housing 40). The recess 43, depth D1, and thickness T1 are illustrated in FIG. 7 . As mentioned above, the recess 43 may advantageously provide more spacing and / or distance between the temperature sensor 150 a and the housing 40 (e.g., the upper portion 41 a of the housing 40), preventing the temperature sensor 150 a from being affected by the temperature of the housing 40 and / or the ambient temperature surrounding the housing 40 and / or the wearable device 10.

[0094] 8A-8D illustrate alternative designs for an electronics assembly 200 that may be incorporated into the wearable device 10. The electronics assembly 200 may be similar in some or many respects to the electronics assembly 100 described above. More specifically, some or many of the components that may form and / or be part of the electronics assembly 100 described above may also form and / or be part of the electronics assembly 200. For example, the electronics assembly 200 may be formed from a circuit board 105, a battery 110, a battery holder 115, a mounting frame 130, a temperature sensor 150a, a thermal putty 120, a temperature sensor 150b, thermal paste 173, a thermally conductive pad 155, one or more openings 159, and / or an emitter 133, along with one or more other components discussed below with reference to FIGS. 8A-10B. Accordingly, the discussion above with reference to any or all of these and / or other components described above is equally applicable to electronics assembly 200 and the components that may form electronics assembly 200. As noted above, the use of the phrase "electronics assembly" or reference numeral "200" in this disclosure is not intended to be limiting, but rather merely as a way to refer to, for example, one or more components of wearable device 10 (which may be surrounded by housing 40 and / or one or more of substrates 70, 25, 65, 50, 65, and / or 20).

[0095] Figures 8A-8D illustrate alternative designs for probe 240. Figures 8A-8B illustrate an assembled view in which probe 240 is secured to mounting frame 130 (and other components of wearable device 10), and Figures 8C-8D illustrate exploded views of probe 240 along with other components of wearable device 10. Figures 8A-8D also illustrate flexible circuit 230 and temperature sensor 150c, which may be coupled to a portion of flexible circuit 230. The flexible circuit 230 may include a first end or portion 232 and a second end or portion 234, where the first end or portion 232 may be coupled to the temperature sensor 150a and / or the circuit board 105 proximate a first surface of the circuit board 105 (e.g., the “top” surface of the circuit board 105), and the second end or portion 234 may be coupled to and / or support the temperature sensor 150c. The flexible circuit 230 may include a stem 236, where the stem 236 may be connected to the first and second portions (or ends) 232, 234 of the flexible circuit 230.

[0096] Similar to that discussed with respect to probe 140, probe 240 can be rigid. For example, probe 240 can be non-compressible and / or non-extensible (e.g., non-compressible and / or non-extensible with respect to a longitudinal axis extending along the height of probe 240). As another example, probe 240 can be non-compressible and / or non-extensible with respect to a longitudinal axis extending through the center of a cross-section of probe 240.

[0097] 9A-10B together illustrate a probe 240. The probe 240 can include a receiver 260 (FIGS. 9A-9B) and an insert 250 (FIGS. 10A-10B), where the insert 250 is configured to be received within a portion of the receiver 260 (which may also be referred to as a "housing 260"). The insert 250 can include a first end 252, a second end 254 opposite the first end 252, a body portion 258, and a head portion 256. The body portion 258 can include, among other things, a cylindrical shape. The head portion 256 of the insert 250 can flare outward around a portion of the body portion 258. The head portion 256 of the insert 250 can be tapered. The head portion 256 of the insert 250 can extend around a portion of the circumference of the body portion 258 and / or can be positioned at or near the end 252. The head portion 256 can have an increasing cross-section from the region where the head portion 256 connects to the body portion 258 to the end 252. The head portion 256 can have a frusto-conical shape, as illustrated in FIGS. 10A-10B. As discussed below, the body portion 258 can be sized and / or shaped to fit within the cavity 268 of the receiver 260. As also discussed below, the head portion 256 can be sized and / or shaped to fit within the tapered recess 265 of the receiver 260.

[0098] The receiver 260 can include a first end 260a, a second end 260b opposite the first end, and a body portion 262. The receiver 260 can include a head portion 264, which extends outward from the body portion 262 and / or has a cross-section larger than that of the body portion 262. The head portion 264 can be positioned at or near the end 260a of the receiver 260. The body portion 262 can be cylindrical, for example, similar to the shape of the body portion of the probe 140, among other shapes. The head portion 264 can be sized and / or shaped to fit within the recessed portion 137 of the mounting frame 130 described above with reference to FIGS. 6A-6C. The head portion 264 can include, for example, a square or rectangular shape, and the head portion 264 can have rounded corners. The height (or thickness) of the head portion 264 may be sized to match the depth of the recessed portion 137 of the mounting frame 130, allowing the head portion 264 to fit within the space defined by the recessed portion 137. Such a configuration may allow the receiver 260 (and probe 240) to be at least partially secured to the mounting frame 130. Similar to the body portion 144 of the probe 140, the body portion 262 of the receiver 260 may be sized and / or shaped to fit within the slot 132 of the mounting frame 130. Thus, the discussion above with reference to securing and / or positioning the probe 140 within the slot 132 of the mounting frame 130 is equally applicable to the probe 240 (and receiver 260).

[0099] The receiver 260 can include a protrusion 269 that extends outward from a portion of the surface of the body portion 262 (see FIGS. 9A-9B). The protrusion 269 can extend outward from the surface of the body portion 262 and can have a flat or planar end that can provide a flat surface against which the stem 236 of the flexible circuit 230 can rest and / or contact, which can aid in the alignment and / or positioning of the stem 236 and flexible circuit 230 relative to the receiver 260 and probe 240. The protrusion 269 can be, for example, circular or another shape.

[0100] The receiver 260 may include a cavity 268 that extends through a portion of the height of the receiver 260 (e.g., the body portion 262). The cavity 268 may extend along an axis that is aligned with the height of the receiver 260 and / or that extends through the center of the cross section of the receiver 260. The receiver 260 may additionally include an opening 266 that is positioned along the outer surface of the body portion 262. The opening 266 may extend inward from the outer surface of the body portion 262 toward the interior of the body portion 262. The opening 266 may merge with and / or join the cavity 268 within the interior of the body portion 262. An axis extending through opening 266 (e.g., the center of opening 266) can be transverse (e.g., perpendicular) to an axis extending through cavity 268 (e.g., the center of cavity 268). Opening 266 can be positioned proximate end 260b of receiver 260. Opening 266 can be positioned closer to end 260b than to end 260a of receiver 260.

[0101] The cavity 268 may be sized and / or shaped to receive the insert 250 or a portion thereof. For example, the cavity 268 may be sized and / or shaped to receive the body portion 258 of the insert 250. The cavity 258 may be, for example, cylindrical, among other shapes. The head portion 264 of the receiver 260 may include a tapered recess 265 around the cavity 268. The tapered recess 265 may be sized and / or shaped to receive the head portion 256 of the insert 250 such that the end 252 of the insert 250 seats “flush” (e.g., on the same plane) with the surface of the end 260 a and / or head portion 264 of the receiver 260 when the body portion 258 is positioned in the cavity 268.

[0102] 8C-8D, temperature sensor 150c can be coupled to end 234 of flexible circuit 230, which can be positioned within opening 266 of receiver 260. Insert 250 can be positioned within cavity 268 of receiver 260 such that end 254 of insert 250 is positioned proximate or adjacent (e.g., above) temperature sensor 150c. For example, when insert 250 is positioned within cavity 268 of receiver 260, end 254 of insert 250 can contact temperature sensor 150c. When probe 240 is secured to mounting frame 130 (e.g., via securing receiver 260 within slot 132 of mounting frame 130), probe 240 can transmit thermal energy from the subject in a manner similar to probe 140 described above. For example, end 260b of probe 240 may be positioned adjacent to the subject's skin when wearable device 10 is secured to the subject. Similar to end 142b of probe 140, end 260b may contact, apply pressure to, and / or press into the subject's skin (e.g., indirectly via substrate 25 and / or 65). If wearable device 10 includes one or more of substrates 25 and / or 65, substrate 25 and / or 65 may be positioned between end 260b of probe 240 and the subject's skin when wearable device 10 is secured to or placed on the subject's skin. Probe 240 or a portion thereof (e.g., receptacle 260 and / or insert 250, etc.) may include a thermally conductive material similar to that described with reference to probe 140. For example, the probe 240 or portions thereof (eg, the receiver 260 and / or the insert 250, etc.) can include a metallic material (eg, aluminum, etc.).

[0103] Similar to what was discussed with reference to probe 140, a portion of probe 240 (e.g., a portion of receptacle 260) may be positioned through opening 55 in substrate 50. The discussion above with reference to the extent to which probe 140 may extend through opening 55 and / or beyond the surface of substrate 50 is equally applicable to probe 240. In such a configuration, when a portion of substrate 25 and / or 65 is secured to the subject's skin around probe 240, end 260b may apply pressure to and / or press into the portion of the skin, which may enable probe 240 to better transmit thermal energy from within the skin. Thermal energy from the skin surface (which may be insulated and / or isolated by one or more of substrates 25, 50, 65 and / or 20) may be transmitted through end 260b to temperature sensor 150c positioned in opening 266. Temperature sensor 150c may determine the subject's body temperature and / or may generate and transmit one or more signals in response to detected thermal energy to processor 11 (e.g., via flexible circuit 230). Thermal energy from the subject's skin surface may also be transmitted from end 260b through receptacle 260 and / or insert 250 to temperature sensor 150a. Such transmitted thermal energy may be transmitted through thermal paste 173, through thermally conductive pad 155, and through one or more openings 159 in circuit board 105, similar to that described above with reference to FIG. 5D.

[0104] Temperature sensor 150c may be configured to generate one or more signals in response to detected thermal energy, determine a body temperature, and / or transmit such generated signal(s) and / or such determined body temperature continuously and / or intermittently to processor 11 of wearable device 10. For example, temperature sensor 150c may be configured to generate one or more signals in response to detected thermal energy, determine a body temperature, and / or transmit such generated signal(s) and / or such determined temperature every 0.5 seconds, 1 second, 2 seconds, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minutes, 3 minutes, 4 minutes, 5 minutes, or other intervals. Such temperature data may be measured and / or transmitted simultaneously or asynchronously with the temperature data measured and / or transmitted by temperature sensors 150a and / or 150b discussed elsewhere herein.

[0105] Incorporating both temperature sensors 150a and 150c can advantageously provide a more robust measurement of core body temperature. As shown, temperature sensor 150c may be aligned (e.g., vertically aligned) with temperature sensor 150a and spaced apart from temperature sensor 150a along an axis extending parallel to the height of probe 240. Like temperature sensor 150a, temperature sensor 150c may be spaced apart from temperature sensor 150b. Because temperature sensor 150c is positioned closer to the subject's skin surface and closer to the end 260b of the probe than temperature sensor 150a, the difference or gradient of the detected temperature values ​​from sensors 150a, 150c may be used by processor 11 for comparison purposes. Additionally, if wearable device 10 includes all of temperature sensors 150 a, 150 b, and 150 c, processor 11 may determine the subject's core body temperature based on a comparison of the temperature data measured by each of temperature sensors 150 a, 150 b, and 150 c. Processor 11 may apply a weighting factor to any or all of the temperature data received from temperature sensors 150 a, 150 b, and 150 c and / or may otherwise compare such received data to determine a corrected body temperature.

[0106] The various devices, methods, and / or systems described above can be used to monitor physiological information of a subject. For example, as described above, wearable device 10 can be used to, among other things, measure a subject's temperature over time. As described above, wearable device 10 can be configured to communicate wirelessly (e.g., via wearable device 10's wireless transceiver 13) with a separate computing device (e.g., a patient monitor and / or a mobile device (e.g., a smartphone)). Wearable device 10 can, among other things, wirelessly transmit physiological data (e.g., temperature data, etc.) over time (continuously or periodically) to such a separate computing device for display. As also discussed above, wearable device 10 can wirelessly transmit processed or unprocessed acquired physiological information to a mobile phone (for example), which can include one or more hardware processors configured to execute an application that generates a graphical user interface that displays information representing the processed or unprocessed physiological information acquired from wearable device 10. Such a graphical user interface may, among other things, display continuous and / or periodic measurements obtained from the wearable device 10, display and / or issue various types of alerts, and display physiological trend information (e.g., temperature trends).Features or aspects displayed by such a graphical user interface may include, but are not limited to, a splash screen, onboarding, device setup, instructions (e.g., both visual / graphical and textual) for securing the wearable device 10 to the subject and / or pairing the wearable device 10 to a separate computing device, temperature data and / or trending dashboards, user scenarios, notes (e.g., medication notes and reminders, and other user activity notes), temperature trending data and information, user settings and profiles, app settings, and alerts and push notifications.

[0107] Any and all of the wearable devices discussed herein may be utilized in systems and / or methods for monitoring and managing the health status, exposure level, and / or risk status of one or more users related to various infectious diseases or illnesses, such as those described in co-pending U.S. patent application Ser. No. 17 / 206,794 (corresponding to Attorney Docket No. MAS.1371A), entitled "HEALTH MONITORING SYSTEM FOR LIMITING THE SPREAD OF AN INFECTION IN AN ORGANIZATION," filed March 19, 2021, which is incorporated herein by reference in its entirety.

[0108] Any and all of the wearable devices discussed herein may be utilized in systems and / or methods for remote patient care and monitoring of one or more users related to various infections or diseases, such as those described in co-pending U.S. patent application Ser. No. 63 / 049478 (corresponding to Attorney Docket No. MAS.1330A1), entitled "REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS," filed March 19, 2021, which is incorporated herein by reference in its entirety.

[0109] Additional Considerations and Terminology Although the present invention has been disclosed in the context of certain preferred embodiments, it should be understood that the particular advantages, features, and aspects of the systems, devices, and methods may be realized in various other embodiments. Additionally, it is contemplated that the various aspects and features described herein may be practiced separately, combined together, or substituted for one another, and that various combinations and subcombinations of features and aspects may be made and still fall within the scope of the invention. Moreover, the systems and devices described above need not include all of the modules and functions described in the preferred embodiments.

[0110] Conditional language used herein (e.g., "can," "could," "might," "may," and "for example," among others) is generally intended to convey that certain features, elements, and / or steps are optional, unless specifically stated otherwise or understood otherwise within the context as used. Thus, such conditional language is generally not intended to imply that features, elements, and / or steps are required in any manner, or that one or more embodiments necessarily include logic for determining whether those features, elements, and / or steps are included or should always be performed, with or without other input or prompting. Terms such as "comprising," "including," and "having" are synonymous and used inclusively in an open-ended manner and do not exclude additional elements, features, acts, operations, etc. Also, the term "or" is used in its inclusive sense (not its exclusive sense), for example, when used to connect a list of elements, the term "or" means one, some, or all of the elements in the list. Further, as used herein, the term "respective," in addition to having its ordinary meaning, can refer to any subset of the set of elements to which the term "respective" applies.

[0111] Connecting language such as the phrase "at least one of X, Y, and Z," unless specifically stated otherwise, is understood in conjunction with the context as commonly used to convey that an item, term, etc. can be either X, Y, or Z. Thus, such connective language is generally not intended to imply that a particular embodiment requires the presence of at least one of X, at least one of Y, and at least one of Z.

[0112] As used herein, degree language (e.g., the terms "approximately," "about," "generally," and "substantially," as used herein) refers to a value, amount, or characteristic near a stated value, amount, or characteristic that still performs a desired function or achieves a desired result. For example, the terms "approximately," "about," "generally," and "substantially" can refer to an amount that is within less than 10%, less than 5%, less than 1%, less than 0.1%, and less than 0.01% of the stated amount. As another example, in certain embodiments, the terms "generally parallel" and "substantially parallel" refer to a value, amount, or characteristic that deviates from exact parallelism by an angle less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree. As another example, in certain embodiments, the terms "generally perpendicular" and "substantially perpendicular" refer to a value, amount, or characteristic that deviates from exact perpendicular by an angle less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree.

[0113] While specific embodiments and examples have been described herein, it will be understood by those skilled in the art that many aspects of the systems and devices shown and described in this disclosure can be differently combined and / or modified to form further embodiments or acceptable examples. All such modifications and variations are intended to be included herein within the scope of the present disclosure. A wide variety of designs and approaches are possible. No feature, structure, or step disclosed herein is required or essential.

[0114] Any methods disclosed herein do not have to be performed in the order described. The methods disclosed herein may include specific actions performed by a practitioner, but they may also include, explicitly or implicitly, any third-party instruction of those actions.

[0115] The methods and tasks described herein may be performed by a computer system and may be fully automated. A computer system, in some cases, may include multiple individual computers or computing devices (e.g., physical servers, workstations, storage arrays, cloud computing resources, etc.), which communicate and interoperate over a network to perform the described functions. Each such computing device typically includes a processor (or multiple processors) that executes program instructions or modules stored in memory or other non-transitory computer-readable storage media or devices (e.g., solid-state storage devices, disk drives, etc.). Various functions disclosed herein may be embodied in such program instructions and / or implemented in the computer system's application-specific circuitry (e.g., ASIC or FPGA). When a computer system includes multiple computing devices, these devices may, but need not, be co-located. The results of the disclosed methods and tasks may be persistently stored by transforming a physical storage device (e.g., solid-state memory chip and / or magnetic disk, etc.) into a different state. The computer system may be a cloud-based computing system whose processing resources are shared by multiple separate business entities or other users.

[0116] Depending on the embodiment, certain acts, events, or functions of a process or algorithm described herein may be performed in a different sequence, added, combined, or omitted entirely (e.g., not all described acts or events may be required to practice an algorithm). Moreover, in particular embodiments, acts or events may be performed not sequentially but simultaneously, for example, through multi-threaded processing, interrupt processing, or multiple processors or processor cores, or on other parallel architectures.

[0117] The various illustrative logic blocks, modules, routines, and algorithm steps that may be described in connection with the disclosure herein may be implemented as electronic hardware (e.g., ASIC or FPGA devices), computer software running on general-purpose computer hardware, or a combination of both. The various illustrative components, blocks, and steps may be described herein generally in terms of their functionality. Whether such functionality is implemented as dedicated hardware or as software running on general-purpose hardware depends on the particular application and design constraints imposed on the overall system. The described functionality may be implemented in various ways for each particular application, and such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0118] Moreover, the various illustrative logic blocks and modules that may be described in connection with the disclosure herein may be implemented or performed by a machine (e.g., a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein, etc.). A general-purpose processor may be a microprocessor, but in alternative examples, the processor may be a controller, microcontroller, or state machine, or combinations thereof, etc. A processor may include electrical circuitry configured to process computer-executable instructions. A processor may include an FPGA or other programmable device that performs logical operations without processing computer-executable instructions. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration, etc.). Although described herein primarily with reference to digital technology, a processor may also include primarily analog components. For example, some or all of the rendering techniques described herein may be implemented in analog circuitry or in mixed analog and digital circuitry. The computing environment can include any type of computer system, including, but not limited to, computer systems based on microprocessors, mainframe computers, digital signal processors, portable computing devices, device controllers, or computational engines within appliances, to name a few.

[0119] Elements of any method, process, routine, or algorithm described in connection with the disclosure herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, a hard disk, a removable disk, a CD-ROM, or any other form of non-transitory computer-readable storage medium. An exemplary storage medium may be coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.

[0120] While the above detailed description illustrates, describes, and points out novel features, it will be understood that various omissions, substitutions, and changes in the form and details of the illustrated devices or algorithms may be made without departing from the spirit of the disclosure. As will be recognized, certain portions of the description herein may be embodied in a form that does not provide all of the features and benefits described herein, because some features may be used or practiced separately from others. The scope of the specific embodiments disclosed herein is indicated by the appended claims, rather than by the foregoing description. All changes that come within the meaning and range of equivalency of the claims are intended to be embraced within their scope. [Explanation of symbols]

[0121] 10. Wearable Devices 11 processors 12 Storage Devices 13 Wireless Transceiver 14 Battery 15 Information Elements 16 One or more temperature sensors 17 Other physiological parameter sensors 18 Battery Isolator 20 PCB 22 Opening 25 boards 30 NFC tags 35 Fixing tab 40 Housing 41 Main body 41a Upper part 41b Wall section 42 slots 43 Recess 44 Rim section 45 Alignment Features 45a Protrusion 46 Hole 47a Indicator 47b indicator 49a cavity 49b cavity 50 boards 55 Opening 60 boards 65 boards 70 boards 100 Electronic Equipment Assembly 105 Circuit Board 105a End 105b End 107 Electrical contact 110 Battery 111 Opening 115 Battery Holder 115a Arm 115b Arm 115c prongs 120 Thermal Putty 130 Mounting Frame 130a first end 130b second end 130c side 130d side 131a surface 132 slots 133 Emitter 133a Raised area 133b Raised area 133c wall 133d wall 135a Post 135b Post 137 Depressed part 138a Notch 138b Notch 139 Protrusion 140 probes 142a first end 142b second end 144 Main body 146 Concave part 148 Upper part 150a temperature sensor 150b temperature sensor 150c temperature sensor 155 Thermally Conductive Pad 157 Electrical contact 159 Opening 173 Thermal Paste 200 Electronic Equipment Assembly 230 Flexible Circuit 232 First end or portion 234 Second end or portion 236 Stem 240 probes 250 inserts 252 First End 254 Second End 256 Head 258 Main body 260 Receptor 260a first end 260b second end 262 Main body 264 Head 265 Tapered recess 266 Opening 268 Cavity 269 ​​Protrusion D1 depth T1 Thickness W1 width

Claims

1. 1. A wearable device configured for non-invasive measurement of a user's body temperature, comprising: Housing and; a first substrate coupled to the housing and including an opening; a second substrate covering the opening in the first substrate and at least a portion of the first substrate and configured to be secured to a user's skin when the wearable device is in use; a mounting frame surrounded by the housing and the first substrate; a circuit board secured by the mounting frame, the circuit board including a first surface, a second surface, and at least one opening extending through the circuit board between the first surface and the second surface; a first temperature sensor mounted on the first surface of the circuit board and configured to determine a body temperature of the user; a thermal conductivity probe secured by the mounting frame and having a first end and a second end opposite the first end, the first end being positioned adjacent the second surface of the circuit board and the at least one opening, the thermal conductivity probe configured to extend at least partially through the opening in the first board, and further configured to transfer thermal energy from the user's skin to the at least one opening in the circuit board and to the first temperature sensor when the wearable device is in use; Including, The wearable device is configured such that the second substrate is positioned between the thermally conductive probe and the user's skin when the wearable device is in use.

2. The wearable device of claim 1 , wherein the first temperature sensor is mounted on the first surface of the circuit board adjacent to at least one of the openings in the circuit board.

3. The wearable device of claim 2 , wherein the at least one opening in the circuit board is filled with a thermally conductive material.

4. The wearable device of claim 2 , wherein the opening in the circuit board includes a plurality of openings.

5. the mounting frame including a slot configured to receive and secure the thermal conductivity probe; The wearable device of claim 1 , wherein the slot is configured to surround less than the entire perimeter of a cross section of the thermally conductive probe.

6. The wearable device of claim 1 , wherein the thermally conductive probe is rigid.

7. 10. The wearable device of claim 1, wherein the opening in the first substrate is sized and shaped to correspond to the size and shape of a periphery of a cross section of the thermally conductive probe.

8. The wearable device of claim 1 , wherein the wearable device is configured to wirelessly transmit one or more body temperature values ​​of the user to another computing device.

9. 1. A wearable device configured for non-invasive measurement of a user's body temperature, comprising: Housing and; a circuit board at least partially enclosed by the housing, the circuit board including a first surface, a second surface opposite the first surface, and at least one hole extending through the circuit board from the first surface to the second surface; a first temperature sensor electrically connected to the circuit board and positioned adjacent the first surface and the at least one aperture of the circuit board; a thermal conductivity probe including a first end and a second end opposite the first end, the first end positioned adjacent the second surface of the circuit board proximate at least one of the holes and aligned with the first temperature sensor; a mounting frame configured to secure the thermal conductivity probe and the circuit board to the housing; a first substrate coupled to the housing, the first substrate including an opening configured to receive the second end of the thermal conductivity probe; a second substrate coupled to the first substrate, the second substrate covering the opening of the first substrate and the second end of the thermally conductive probe and configured to be secured to the skin of a user; and Equipped with A wearable device, wherein when the wearable device is in use, the thermal conductivity probe is configured to receive thermal energy from the user's skin and transfer the thermal energy to the first temperature sensor through at least one of the holes in the circuit board.

10. 1. A wearable device configured for non-invasive measurement of a user's body temperature, comprising: Housing and; one or more substrates configured to be coupled to the housing and configured to be secured to the skin of a user; a circuit board at least partially surrounded by the housing, the circuit board including a first surface, a second surface, and at least one opening; a temperature sensor coupled to the circuit board adjacent the first surface and adjacent the at least one opening; a thermal conductivity probe including a first end and a second end opposite the first end, the first end disposed adjacent the second surface and the at least one opening, the second end covered by at least a portion of the one or more substrates and configured to be positioned proximate to a user's skin when the wearable device is in use, the thermal conductivity probe further configured to transfer thermal energy from the user's skin through the at least one opening to the temperature sensor when the wearable device is in use; A wearable device comprising:

11. The wearable device of claim 10 , wherein an axis extending through a center of a cross section of the thermal conductivity probe and along a height of the thermal conductivity probe is oriented perpendicular to the plane of the circuit board.

12. a first thermally conductive material positioned adjacent the first end of the thermal conductivity probe, the first thermally conductive material comprising a thermal paste, the thermal paste comprising zinc oxide; a second thermally conductive material positioned adjacent to at least one of the openings extending through the circuit board and between the thermal paste and the second surface of the circuit board, the second thermally conductive material including a metallic material, the metallic material including at least one of gold and copper; The wearable device of claim 10, comprising:

13. The wearable device of claim 10 , further comprising a mounting frame configured to secure the thermally conductive probe and the circuit board to the housing.

14. The wearable device of claim 13 , wherein the mounting frame includes a slot configured to receive and secure the thermally conductive probe.

15. The wearable device of claim 12 , wherein the thermally conductive probe is rigid.

16. 11. The wearable device of claim 10, wherein the one or more substrates comprise a first substrate and a second substrate, the first substrate comprising a foam and the second substrate comprising an adhesive material.

17. the temperature sensor is a first temperature sensor of the wearable device; the wearable device further comprises a processor and a second temperature sensor spaced apart from the first temperature sensor; the first temperature sensor and the second temperature sensor are configured to send one or more signals to the processor in response to detected thermal energy; 11. The wearable device of claim 10, wherein the processor is configured to determine one or more body temperature values ​​of the user based on the one or more signals received from the first temperature sensor and the second temperature sensor.

18. 18. The wearable device of claim 17, wherein the second temperature sensor is coupled to the circuit board proximate the first surface.

19. The wearable device of claim 10 , wherein the opening comprises a plurality of openings.

20. The wearable device of claim 10 , wherein the thermally conductive probe has a cylindrical shape.

21. The wearable device of claim 10 , wherein at least one of the openings is filled with a thermally conductive material.

22. A wearable device configured for non-invasive measurement of a user's body temperature, comprising: Housing and; one or more substrates configured to secure the housing to the user's skin; a circuit board at least partially surrounded by the housing, the circuit board including a first surface, a second surface, and one or more openings extending through a thickness of the circuit board and the first and second surfaces; a temperature sensor coupled to the first surface and configured to cover one or more of the openings; a thermal conductivity probe including a first end and a second end opposite the first end, the first end disposed adjacent the second surface and a bottom of the at least one opening, the second end covered by at least a portion of the one or more substrates and configured to be positioned proximate to a user's skin when the wearable device is in use, the thermal conductivity probe further configured to transfer thermal energy from the user's skin through the at least one opening to the temperature sensor when the wearable device is in use; A wearable device comprising:

23. A wearable device as described in claim 22, comprising a thermally conductive material positioned between the first end of the thermally conductive probe and the second surface of the circuit board.

24. The wearable device of claim 23, wherein the thermally conductive material includes thermal paste.

25. The wearable device of claim 22, wherein at least one of the openings is filled with a thermally conductive material.

26. A wearable device as described in claim 24, wherein the thermal paste contains zinc oxide.

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