Substrate, liquid ejection head, and liquid ejection device

Abstract

To provide a substrate which can efficiently obtain a temperature of a heating element mounted on a film, and to provide a liquid discharge head and a liquid discharge device.SOLUTION: A substrate according to an embodiment includes: a film substrate; a multilayer substrate; a solid pattern; and a thermistor. A heating element is mounted on the film substrate. The multilayer substrate has: a first layer which is connected with the film substrate and having a through hole formed; and a second layer laminated on the first layer. The solid pattern is provided between the first layer and the second layer. The solid pattern is formed of a metallic material. The thermistor is provided on the multilayer substrate and connected to the solid pattern through the through hole.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] FIELD Embodiments of the present invention relate to a substrate, a liquid ejection head, and a liquid ejection apparatus. [Background technology]

[0002] Conventionally, custom ICs on a board are mounted on a film, such as COF. Since ICs are heat-generating elements, they tend to generate heat or may become abnormally hot when they malfunction. Therefore, there is a demand for monitoring the temperature of ICs mounted on film. However, because it is not possible to mount thermistors on film, a technology is known in which thermistors are mounted on a separate board.

[0003] However, this technology has the problem that it is not possible to accurately measure the temperature of an IC due to factors such as the physical distance between the thermistor and the IC whose temperature is being monitored. Therefore, there is a need for a method to efficiently obtain the temperature of a heat-generating element such as an IC mounted on a film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-161787 Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by the present invention is to provide a substrate, a liquid ejection head, and a liquid ejection device that can efficiently acquire the temperature of a heating element mounted on a film. [Means for solving the problem]

[0006] The substrate of the embodiment includes a film substrate, a multilayer substrate, a solid pattern, and a thermistor. A heating element is mounted on the film substrate. The multilayer substrate has a first layer to which the film substrate is connected and in which a through hole is formed, and a second layer laminated on the first layer. The solid pattern is provided between the first layer and the second layer. The solid pattern is made of a metal material. A thermistor is provided on the multilayer substrate and connected to the solid pattern via the through hole. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is an explanatory diagram showing the configuration of a liquid ejection device according to an embodiment. [Figure 2] FIG. 1 is a block diagram showing the configuration of a liquid ejection apparatus according to an embodiment. [Figure 3] FIG. 1 is a perspective view showing a configuration of a liquid ejection head according to an embodiment. [Figure 4] FIG. 2 is a perspective view schematically showing the configuration of a substrate according to the embodiment. [Figure 5] FIG. 2 is a side view schematically showing the configuration of a substrate according to an embodiment. [Figure 6] FIG. 10 is an explanatory diagram showing the configuration of a liquid ejection device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] The substrate 26, liquid ejection head 10, and liquid ejection device 1 according to the embodiment will be described below with reference to FIGS. 1 to 5. FIG. 1 is an explanatory diagram showing the configuration of the liquid ejection device 1 according to the embodiment, and FIG. 2 is a block diagram showing the configuration of the liquid ejection device 1. FIG. 3 is a perspective view showing the configuration of the liquid ejection head 10 used in the liquid ejection device 1. FIG. 4 is a perspective view showing a schematic configuration of the substrate 26 used in the liquid ejection head 10, and FIG. 5 is a side view showing a schematic configuration of the substrate 26. Note that in each drawing, the configuration is enlarged, reduced, or omitted as appropriate for ease of explanation.

[0009] 1 and 2, the liquid ejection device 1 includes, for example, a liquid ejection head 10, a liquid supply device 11, an interface 17, and a control board 18. The liquid ejection device 1 is, for example, an image forming device such as an inkjet recording device that ejects ink as a liquid. The liquid ejection device 1 may also be an inspection device used for shipping inspections such as operation confirmation tests and performance tests of the liquid ejection head 10 that are conducted after the liquid ejection head 10 is manufactured. The liquid ejection device 1 may also be configured to include multiple liquid ejection heads 10 and multiple liquid supply devices 11 that are capable of ejecting different inks.

[0010] The liquid ejection device 1 includes, for example, a transport device that moves the recording medium in a transport path that includes a printing position facing the liquid ejection head 10, a maintenance device that performs maintenance on the liquid ejection head 10, and various sensors and adjustment devices.

[0011] The liquid ejection head 10 ejects, for example, ink as a liquid. The liquid ejection head 10 is connected to a liquid supply device 11, and ink is supplied to the liquid ejection head 10 from the liquid supply device 11. The liquid ejection head 10 may be, for example, a non-circulation type head in which ink is supplied from the liquid supply device 11, or may be a circulation type head in which ink circulates between the liquid ejection head 10 and the liquid supply device 11.

[0012] The liquid ejection head 10 ejects ink to form a desired image on a recording medium placed opposite it.

[0013] As shown in FIG. 3, the liquid ejection head 10 includes a manifold 21, a nozzle plate 22 having a plurality of nozzles formed therein, an actuator section 23, a supply pipe 24, a recovery pipe 25, a substrate 26, and a thermistor 27 which is a temperature sensor.

[0014] Manifold 21 has a supply flow path formed therein that supplies ink supplied from liquid supply device 11 to actuator portion 23, and a supply flow path for ink that passes through actuator portion 23 and is discharged to liquid supply device 11. Note that, for example, if liquid supply device 11 is configured to have a temperature adjustment device that adjusts the temperature of actuator portion 23 and ink with temperature adjustment water, manifold 21 may be provided with a flow path for temperature adjustment water.

[0015] The nozzle plate 22 is formed, for example, in the shape of a rectangular plate, and is fixed to the actuator portion 23. The nozzle plate 22 has a plurality of nozzle rows, each of which has a plurality of nozzles arranged in one direction.

[0016] The actuator unit 23 is disposed opposite the printing surface of the nozzle plate 22. The actuator unit 23 is fixed to the manifold 21. A predetermined flow path is formed inside the actuator unit 23, for example, including a plurality of pressure chambers communicating with the nozzles of the nozzle plate 22 and a common chamber communicating with the plurality of pressure chambers. The actuator unit 23 includes actuators 231 facing each pressure chamber. The actuator 231 may be configured, for example, to have a piezoelectric element with grooves formed therein that form the pressure chambers, or may be configured to have a vibration plate that forms the pressure chambers and a piezoelectric element that displaces the vibration plate. For example, the piezoelectric element is made of a piezoelectric ceramic material such as PZT (lead zirconate titanate). The actuator 231 has electrodes formed on the piezoelectric element, and these electrodes are electrically connected to the substrate 26. Various configurations can be applied to the actuator 231 as long as it is electrically connected to the substrate 26 and driven by a drive signal output from the substrate 26.

[0017] The supply pipe 24 and the recovery pipe 25 are provided in, for example, the manifold 21. The supply pipe 24 and the recovery pipe 25 are connected to the liquid supply device 11. The supply pipe 24 and the recovery pipe 25 include a pipe made of metal or other thermally conductive material and a tube covering the outer surface of the pipe, such as a PTFE tube. The manifold 21, the actuator unit 23, the supply pipe 24, and the recovery pipe 25 form a flow path within the liquid ejection head 10 for the ink supplied from the liquid supply device 11.

[0018] 1, the substrate 26 is connected to the actuator 231 of the actuator section 23. The substrate 26 is also connected to the control substrate 18 via a harness 31 or the like. For example, one or more substrates 26 are provided for one actuator 231. In the example of the liquid ejection head 10 of this embodiment shown in FIG. 3, four nozzle rows are provided, four actuators 231 are provided corresponding to each nozzle row, and four substrates 26 are provided corresponding to each actuator 231.

[0019] One end of the substrate 26 is connected to the actuator 231 of the actuator unit 23, and the other end is connected to the control board 18 via a harness 31. As shown in Figures 3 to 5, the substrate 26 includes, for example, a wiring film 261, a driver IC 262 mounted on the wiring film 261, and a multilayer substrate 263 mounted on the wiring film 261.

[0020] The substrate 26 drives the actuator 231 by applying a drive voltage generated by a driver IC 262 to the actuator 231, thereby increasing or decreasing the volume of the pressure chamber and causing droplets to be ejected from the nozzle.

[0021] The wiring film 261 is a film substrate having a wiring pattern formed in a film shape and made of a metal material with high thermal conductivity, such as copper. The wiring film 261 is, for example, a COF (Chip on Film) on which a driver IC 262 is mounted. For example, one or more wiring films 261 are provided for one actuator 231. In this embodiment, an example will be described in which one wiring film 261 is provided for one actuator 231.

[0022] The driver IC 262 is electrically connected to the wiring pattern formed in the pressure chamber via the wiring film 261. The driver IC 262 is a heat generating element that generates heat. The driver IC 262 is mounted on the outer surface of the wiring film 261, for example.

[0023] One driver IC 262 is provided for one wiring film 261. Note that a plurality of driver ICs 262 may be provided to drive one actuator 231, and these plurality of driver ICs 262 may be provided on one wiring film 261 to form a driver IC row.

[0024] The multilayer substrate 263 is a head substrate connected to the driver IC 262. The multilayer substrate 263 is, for example, a printed wiring board. The multilayer substrate 263 is a PWA (Printing Wiring Assembly) on which various electronic components and connectors are mounted. The multilayer substrate 263 is formed in a rectangular plate shape, and one end of the wiring film 261 is mounted on one side of one of the main surfaces. The mounting area B of the multilayer substrate 263, where the wiring film 261 is mounted, is formed in a rectangular shape that is long in one direction along the extension direction of one side of the multilayer substrate 263. The multilayer substrate 263 also has a solid pattern 265 provided therein and a through-hole 266 continuous with the solid pattern 265. The multilayer substrate 263 also has a first connector 267 mounted on a part of its outer surface.

[0025] The solid pattern 265 is, for example, a pattern made of a metal material with high thermal conductivity, such as copper. The solid pattern 265 is, for example, formed in a rectangular shape with a predetermined length and width inside the multilayer substrate 263. The solid pattern 265 is provided on the multilayer substrate 263 for heat propagation, which transmits heat from the driver IC 262 that has been transmitted from the wiring film 261 to the substrate layer 30 to the through-hole 266.

[0026] The solid pattern 265 is provided, for example, opposite a mounting area B provided on the multilayer substrate 263, across the outermost substrate layer 30 of the plurality of substrate layers 30 constituting the multilayer substrate 263. The solid pattern 265 is formed between the opposing main surfaces of two outer substrate layers 30 of the plurality of substrate layers 30.

[0027] For example, the solid pattern 265 is formed in the same shape as the mounting area B and is arranged at a position where they overlap in the stacking direction of the multiple substrate layers 30. In other words, the shape and area of ​​the solid pattern 265 are the same as or approximately the same as those of the mounting area B, and the mounting area B and the solid pattern 265 are arranged side by side in the stacking direction of the multiple substrate layers 30, sandwiching the outermost substrate layer 30 therebetween. As a specific example, the solid pattern 265 is arranged on the main surface of the substrate layer 30 immediately below the substrate layer 30 on which the mounting area B is provided, in an area facing the mounting area B in the stacking direction of the multiple substrate layers 30.

[0028] The through-hole 266 has, on its inner surface, a metal film formed by plating or the like from a metal material with high thermal conductivity, such as copper. The through-hole 266 is continuous with the solid pattern 265. More specifically, the metal film of the through-hole 266 is continuous with the solid pattern 265. For example, the metal film of the through-hole 266 and the solid pattern 265 are formed of the same material.

[0029] One end of the harness 31 for connecting the control board 18 and the multilayer board 263 is inserted into the first connector 267. The first connector 267 fixes one end of the harness 31.

[0030] A specific example of the multilayer substrate 263 of this embodiment will be described below. As shown in FIGS. 4 and 5, the multilayer substrate 263 has, for example, a plurality of substrate layers 30. In this embodiment, the multilayer substrate 263 is formed by stacking six substrate layers 30. The plurality of substrate layers 30 are formed, for example, from the same material. The substrate layers 30 are preferably made of, for example, a material with high thermal conductivity. In the following description, the layer on which the wiring film 261 of the multilayer substrate 263 is mounted is referred to as the first substrate layer (first layer) 301, and the following description will be given with the layers listed in order from the stacking direction as the first substrate layer 301, the second substrate layer (second layer) 302, the third substrate layer 303, the fourth substrate layer 304, the fifth substrate layer 305, and the sixth substrate layer 306.

[0031] 5, the first substrate layer 301 to the sixth substrate layer 306 are, for example, bonded together. For example, a wiring pattern is formed on each of the first substrate layer 301 to the sixth substrate layer 306. The first substrate layer 301 and the sixth substrate layer 306 are the outermost layers of the multilayer substrate 263. The first substrate layer 301 has a mounting area B for the wiring film 261 on its outer surface. Here, the outer surface of the first substrate layer 301 refers to the main surface of the first substrate layer 301 opposite to the main surface of the first substrate layer 301 that is bonded to the second substrate layer 302. A through hole 266 is formed in the first substrate layer 301, connecting both main surfaces.

[0032] A solid pattern 265 is formed between the first substrate layer 301 and the second substrate layer 302. In other words, the solid pattern 265 is formed on the opposing main surface of one of the first substrate layer 301 and the second substrate layer 302. In this embodiment, the second substrate layer 302 has the solid pattern 265 on the main surface of the second substrate layer 302 that faces the first substrate layer 301.

[0033] The substrate 26 includes a wiring film 261, a driver IC 262, and a multi-layer substrate 263, and constitutes a head driving circuit (driving circuit) that drives the liquid ejection head 10.

[0034] The thermistor 27 is a temperature sensor and is provided on the substrate 26 near the through-hole 266.

[0035] Thermistor 27 is a chip component and is directly mounted on substrate 26. Thermistor 27 detects the temperature of the metal film in through-hole 266. Thermistor 27 is electrically connected to first connector 267 by a wiring pattern. Thermistor 27 outputs a signal corresponding to the detected temperature to control board 18 via harness 31 connected to first connector 267.

[0036] The harness 31 is, for example, a flexible, strip-shaped wiring board having a certain width. The harness 31 is a so-called flexible cable. The harness 31 includes a plurality of signal lines that are a wiring pattern extending along the longitudinal direction of the harness 31. The harness 31 is, for example, an FPC (Flexible Printed Circuit).

[0037] The liquid supply device 11 includes, for example, an ink tank 14 , a pipeline 15 , and a pump 16 .

[0038] The ink tank 14 is a liquid storage unit that stores liquid such as ink to be supplied to the liquid ejection head 10. The ink tank 14 is connected to the liquid ejection head 10 via a conduit 15. The ink tank 14 is equipped with a temperature control device that is composed of, for example, heat dissipation fins, a heater, a heat exchange module, etc. The temperature control device heats or cools the ink in the ink tank 14 to adjust the temperature of the ink.

[0039] The conduit 15 forms a flow path that passes through the liquid ejection head 10 and the ink tank 14. The conduit 15 includes a pipe or a tube.

[0040] The pump 16 is provided in the conduit 15. The pump 16 supplies liquid to the secondary side, thereby supplying liquid from the ink tank 14 to the liquid ejection head 10 via the conduit 15. The pump 16 is, for example, a piezoelectric pump. The pump 16 is connected to a drive circuit by wiring and is controlled by a processor 35 provided on a control board 18. The pump 16 sends the liquid in the conduit 15 to the liquid ejection head 10 via a filter.

[0041] The interface 17 includes a power supply 171, a display device 172, and an input device 173. The interface 17 is connected to the processor 35 as a control unit. When a user operates the input device 173, the interface 17 issues various operation instructions to the processor 35. The interface 17 also displays various information and images on the display device under the control of the processor 35 on the control board 18, for example.

[0042] 2, the control board 18 includes a processor 35, which is a control unit that controls the operation of each unit, a memory 36 that stores programs and various data, and an AD conversion unit 37, which is a circuit that converts analog data (voltage values) into digital data (bit data). The control board 18 also includes control circuits and drive circuits that control and drive each element.

[0043] The control board 18 also includes a second connector 41 mounted at a predetermined location. The second connector 41 receives the other end of the harness 31 for connection to the board 26 and secures it in place.

[0044] The processor 35 includes, for example, a CPU (Central Processing Unit) and corresponds to the central part of the control unit. The processor 35 controls each part of the liquid ejection device 1 to realize various functions of the liquid ejection device 1 in accordance with an operating system and application programs.

[0045] The processor 35 controls a head drive circuit configured by a driver IC 262 of the liquid ejection head 10. The processor 35 is connected to various drive mechanisms and controls the operation of each part of the liquid ejection device 1 via each control circuit and each drive circuit, such as the AD conversion unit 37, the liquid ejection head 10, and the head power supply circuit. The processor 35 also executes control processing based on a control program pre-recorded in the memory 36. For example, the processor 35 controls the printing operation by controlling the operation of the liquid ejection head 10 and the pump 16. The processor 35 applies a drive voltage to the electrodes of the actuator 231 via the driver IC 262. When a drive voltage is applied to the electrodes, the actuator deforms and ejects liquid in the pressure chamber from the nozzle.

[0046] Furthermore, processor 35 performs error determination processing for temperature abnormalities and error management processing when an error is determined, based on the signal output from thermistor 27 and an error determination threshold value previously recorded in memory 36. For example, as part of the error management processing, processor 35 outputs a signal to display information about temperature abnormalities on display device 172 of interface 17.

[0047] The memory 36 is, for example, a non-volatile memory, and is mounted on the control board 18. The memory 36 stores various control programs and operating conditions as information necessary for controlling the ink circulation operation, ink supply operation, temperature management, liquid surface management, pressure management, voltage control of the power supply required for controlling the liquid ejection head 10, and the like.

[0048] According to the substrate 26, liquid ejection head 10, and liquid ejection device 1 configured as described above, the wiring film 261 is mounted in a mounting area B on the outer surface of the outermost substrate layer 30 (first substrate layer 301) of the multilayer substrate 263. Furthermore, a solid pattern 265 is provided between the outermost substrate layer 30 (first substrate layer 301) of the multilayer substrate 263, in which the mounting area B is provided, and the substrate layer 30 adjacent to the outermost layer (second substrate layer 302). A through-hole 266 formed in the outermost substrate layer 30 is connected to the solid pattern 265. Therefore, it is possible to detect the temperature of the driver IC 262 by detecting the temperature of the through-hole 266 with the thermistor 27.

[0049] To give a specific example, first, the driver IC 262 may generate heat depending on the driving conditions because it generates and outputs waveforms. Furthermore, the driver IC 262 may generate heat not only when it generates and outputs waveforms under normal conditions, but also when an abnormality occurs, such as when the driver IC 262 malfunctions.

[0050] In particular, when the driver IC 262 is mounted on the wiring film 261, there is a problem in that the thermistor 27 cannot be mounted on the wiring film 261. Furthermore, when the driver IC 262 is coated with silicone or the like and the heat is dissipated to a heat sink or the like in order to dissipate heat from the driver IC 262, it is not possible to attach the thermistor 27 directly to the driver IC 262, or this would result in increased costs. Furthermore, when mounting the wiring film 261 on the surface of the multilayer substrate 263 (the outer surface of the first substrate layer 301), it is necessary to provide mounted components such as terminals, wiring patterns, and electronic components, etc., and therefore it is difficult to provide a solid pattern on the surface of the multilayer substrate 263.

[0051] However, in the substrate 26 of this embodiment, a solid pattern 265 facing the mounting area B of the wiring film 261 is provided between a first substrate layer 301, which is the surface layer of the multilayer substrate 263, and a second substrate layer 302 joined to the first substrate layer 301, and the through-hole 266 of the first substrate layer 301 is connected to the solid pattern 265. This allows the thermistor 27 to detect heat transmitted from the driver IC 262 through the wiring pattern of the wiring film 261, the substrate layer 30, the solid pattern 265, and the through-hole 266. Therefore, the liquid ejection device 1 using the substrate 26 can efficiently detect the temperature of the driver IC 262 with the thermistor 27. Furthermore, because the thermistor 27 detects heat transmitted from the driver IC 262 to the through-hole 266, the liquid ejection device 1 can improve the accuracy of the measured temperature of the driver IC 262.

[0052] This allows the liquid ejection device 1 to constantly monitor the temperature of the driver IC 262 using the control board 18. That is, the liquid ejection device 1 can measure the temperature of the driver IC 262 using the thermistor 27 mounted on the multilayer board 263 to which the driver IC 262 is connected, without mounting the thermistor 27 on the wiring film 261 on which the driver IC 262 is mounted. Furthermore, the liquid ejection device 1 can grasp the condition of the driver IC 262 via the thermistor 27 when the driver IC 262 is not dissipating heat well or when the driver IC 262 is generating abnormal heat.

[0053] Furthermore, by providing the solid pattern 265 between the first substrate layer 301 and the second substrate layer 302, which are the outermost layers, it is possible to minimize the physical distance from the driver IC 262 to the through-hole 266 where the thermistor 27 detects the temperature. Furthermore, the solid pattern 265 is provided on the substrate 26 in an area facing the mounting area B of the wiring film 261 provided on the outer surface of the first substrate layer 301 (the surface of the multilayer substrate 263). This makes it easier to transfer heat from the driver IC 262 that has traveled through the wiring film 261 to the solid pattern 265, and also makes it possible to minimize the heat capacity of the solid pattern 265. This allows the substrate to improve responsiveness to the heat of the heated driver IC 262 at the through-hole 266 where the heat is detected by the thermistor 27.

[0054] The substrate 26 of the liquid ejection device 1 according to the embodiment described above has a multilayer substrate 263 provided with a through-hole 266 for detecting temperature with a thermistor 27, and a solid pattern 265 for temperature propagation, which faces a mounting area B of a wiring film 261 provided on the surface of the multilayer substrate 263 via the substrate layer 30, is connected to the through-hole 266. This allows the substrate 26, liquid ejection head 10, and liquid ejection device 1 to efficiently detect the temperature of the driver IC 262 using the thermistor 27 provided on the surface of the multilayer substrate 263.

[0055] Note that the embodiment is not limited to the above-described configuration. For example, in the above-described example, a configuration in which one wiring film 261 and one driver IC 262 are provided for one actuator 231 has been described, but the present invention is not limited to this. For example, as in another embodiment shown in FIG. 6, the substrate 26 of the liquid ejection head 10 may be configured to have multiple wiring films 261 and multiple driver ICs 262 for one actuator 231. In the example shown in FIG. 6, the substrate 26 has two wiring films 261 and two driver ICs 262 for one actuator 231. In such a substrate 26, the number of mounting areas B for the wiring films 261 provided on the multilayer substrate 263 is the same as the number of wiring films 261. In the example shown in FIG. 6, the mounting areas B are provided in two locations on the multilayer substrate 263. In this way, the substrate 26 may be configured to have the same number of mounting areas B, solid patterns 265, through holes 266, and thermistors 27 as the number of wiring films 261.

[0056] Furthermore, in the above example, the multilayer substrate 263 has been described as having six substrate layers 30, but the present invention is not limited to this and may have two or more substrate layers 30. Furthermore, in the above example, the solid pattern 265 is provided on the second substrate layer 302, but the present invention is not limited to this and may be provided on the first substrate layer 301. However, since the solid pattern 265 is provided to detect the temperature of the driver IC 262, it is preferable that the solid pattern 265 be provided between the outermost substrate layer 30 on which the mounting region B of the wiring film 261 provided on the multilayer substrate 263 is provided and the substrate layer 30 immediately below the outermost substrate layer 30.

[0057] In the above example, the liquid ejection device 1, the liquid ejection head 10, and the substrate 26 are used in an inspection device and an inkjet recording device, but the invention is not limited to this and can also be used in, for example, 3D printers, industrial manufacturing machines, and medical applications. The substrate 26 can also be used in various devices as long as it is configured to detect the temperature of a heating element mounted on a film.

[0058] The substrate, liquid ejection head, and liquid ejection device according to each embodiment configured as described above can efficiently detect the temperature of the driver IC using a thermistor provided on the surface of the multilayer substrate on which through holes and solid patterns are formed.

[0059] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0060] 1...liquid ejection device, 10...liquid ejection head, 11...liquid supply device, 14...ink tank, 15...pipe line, 16...pump, 17...interface, 18...control board, 21...manifold, 22...nozzle plate, 23...actuator section, 24...supply pipe, 25...recovery pipe, 26...substrate, 27...thermistor, 30...substrate layer, 31...harness, 35...processor, 36...memory, 37...AD conversion section, 41...second connector 171...power supply, 172...display device, 173...input device, 231...actuator, 261...wiring film, 262...driver IC (heat generating element), 263...multilayer substrate, 265...solid pattern, 266...through hole, 267...first connector, 301...first substrate layer (first layer), 302...second substrate layer, (second layer) 303...third substrate layer, 304...fourth substrate layer, 305...fifth substrate layer, 306...sixth substrate layer, B...mounting area.

Claims

1. a film substrate on which a heating element is mounted; a multilayer substrate having a first layer to which the film substrate is connected and in which a through hole is formed, and a second layer laminated on the first layer; a solid pattern formed of a metal material and provided between the first layer and the second layer; a thermistor provided on the multilayer substrate and connected to the solid pattern via the through hole.

2. The substrate of claim 1 , wherein the solid pattern is formed on the second layer.

3. The substrate described in claim 1 or claim 2, wherein the solid pattern has the same shape as the mounting area of ​​the film substrate mounted on the first layer and is arranged alongside the mounting area in the stacking direction of the first layer and the second layer.

4. A substrate according to any one of claims 1 to 3; an actuator to which the substrate is connected; A liquid ejection head comprising:

5. The liquid ejection head according to claim 4; a control board connected to the board and the thermistor; A liquid ejection device comprising:

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