paste

Abstract

A paste which contains a metal element-containing powder, an epoxy group-containing compound, and a curing agent, wherein the thermal weight loss rate after thermal curing at 180°C is 5% or less. This paste is suitable for use, for example, as a material for a magnetic core of an inductor, or as a material that fills up the space between conductors of a coil; and this paste is capable of easily forming a molded article that exhibits excellent insulating properties.

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a paste, and more particularly to a paste that can suppress deterioration in properties of a cured product after heat curing. [Background technology]

[0002] Materials containing metal powders with various physical properties are used depending on the characteristics required for industrial products. For example, materials containing magnetic powders are used in fields such as inductors, electromagnetic wave shields, and bonded magnets. In particular, in recent years, there has been an increasing demand for materials containing magnetic powder and resin, which have better moldability than sintered magnets. For example, Patent Documents 1 to 4 disclose magnetic powder pastes containing magnetic powder and resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-31786 [Patent Document 2] Japanese Patent Application Publication No. 8-273916 [Patent Document 3] Japanese Patent Application Publication No. 1-261897 [Patent Document 4] Japanese Patent Application Laid-Open No. 2014-127624 Summary of the Invention [Problem to be solved by the invention]

[0004] A metal powder paste (hereinafter sometimes referred to as "paste") containing a curable resin can be molded and cured to form a molded body (cured product) containing metal powder. Generally, to improve the strength, electrical conductivity, thermal conductivity, magnetic properties, and other properties of the molded body obtained after curing, it is necessary to increase the metal powder content in the paste and decrease the proportion of components other than the metal powder. However, as the metal powder content increases, the viscosity of the paste also increases, and fluidity tends to decrease. Therefore, a method of adjusting the viscosity by adding a volatile component such as an organic solvent to the paste is usually used.

[0005] However, for example, if the amount of organic solvent in the paste is large, a drying process is required after the paste is applied, and the evaporation of the organic solvent places an environmental burden. Furthermore, the evaporation of the organic solvent causes volume shrinkage, which can result in the substrate being exposed from part of the paste-coated surface. Furthermore, the use of organic solvents is likely to result in a deterioration in the properties of the cured product. For example, volume shrinkage due to the evaporation of the organic solvent causes stress and strain to accumulate inside the cured paste. Furthermore, when an organic solvent with a boiling point lower than the heating temperature used for curing is used, the organic solvent volatilizes during heating, which can easily cause voids to form in the cured product. The presence of voids in the cured product can easily result in a deterioration in properties such as the mechanical strength and magnetic properties of the cured product. On the other hand, when an organic solvent with a boiling point higher than the heating temperature used for curing is used, the organic solvent is less likely to volatilize during heating and remains in the cured product, which can easily result in a deterioration in product properties. In particular, residual organic solvent in the cured product can facilitate the migration of ionic components and the like in the cured product, which can easily result in a deterioration in electrical insulation properties (hereinafter referred to as insulation properties), such as insulation resistance and insulation reliability. For these reasons, there is a need for a metal powder paste that can reduce the amount of organic solvent used, suppress performance degradation due to volatile components such as organic solvents in the cured product after heat curing, and easily achieve properties such as excellent insulation. The coefficient of thermal expansion (CTE) of the cured metal powder paste is also an important characteristic. If the CTE of the cured metal powder paste differs greatly from the CTE of the surrounding materials to which the cured product is applied, the difference in expansion during heating can easily cause the cured product to warp, peel at the interface with the surrounding materials, or crack, resulting in other problems. Therefore, in the case of inductors, for example, because the CTE of copper coils and wiring board materials on which the inductor is mounted is low, it is desirable for the cured metal powder paste to have a low CTE to match these surrounding materials.

[0006] The present invention has been made in consideration of the above circumstances, and provides a metal powder paste that can suppress performance degradation due to volatile components such as organic solvents in the cured product after heat curing, and that can provide the cured product with excellent properties such as insulation. [Means for solving the problem]

[0007] That is, embodiments of the present invention relate to the following: However, the present invention is not limited to the following embodiments and includes various embodiments.

[0008] One embodiment relates to a paste containing a metal element-containing powder, an epoxy group-containing compound, and a curing agent, which has a thermal weight loss rate of 5% or less after heat curing at 180° C. In one embodiment, the paste contains a metal element-containing powder, an epoxy group-containing compound, and a curing agent, and preferably has a thermal weight loss rate of 5% or less after heat curing at 180° C., and a thermal expansion coefficient of the cured product of 40 ppm / ° C. or less.

[0009] In the above embodiment, the curing agent preferably includes at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent. The amine-based curing agent preferably includes an aromatic amine.

[0010] In the above embodiment, the epoxy group-containing compound preferably contains an epoxy resin that is liquid at 25°C.

[0011] In the above embodiment, the curing agent preferably includes a curing agent that is liquid at 25°C.

[0012] In the above embodiment, the content of the metal element-containing powder is preferably 70 mass % or more based on the total mass of the paste.

[0013] In the above embodiment, the metal element-containing powder preferably includes magnetic powder.

[0014] In the above embodiment, the viscosity of the paste at 25° C. is preferably 1 Pa·s or more and 600 Pa·s or less.

[0015] Another embodiment relates to the paste of the above embodiment used for screen printing. The disclosure of this application is related to subject matter described in International Application No. PCT / JP2020 / 45278, filed December 4, 2020, the entire disclosure of which is incorporated herein by reference. [Effects of the Invention]

[0016] According to an embodiment of the present invention, a metal powder paste can be provided that can reduce the amount of volatile components such as organic solvents used. As a result, it is possible to provide a metal powder paste that can suppress performance degradation due to volatile components such as organic solvents in a cured product after heat curing, and can easily obtain excellent properties such as insulating properties in the cured product. The metal powder paste of the above embodiment can easily obtain a cured product with a low CTE. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to the embodiments described below. In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in this specification, the upper limit or lower limit of a numerical range in one stage can be arbitrarily combined with the upper limit or lower limit of a numerical range in another stage. Unless otherwise specified, the materials exemplified in this specification can be used singly or in combination of two or more. In this specification, when a plurality of substances corresponding to each component are present in the composition, the content of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified.

[0018] <Paste> A paste according to one embodiment of the present invention includes a metal element-containing powder, an epoxy group-containing compound, and a curing agent, and can be cured by heat treatment. The paste of the above embodiment is characterized by the fact that the increase in viscosity associated with an increase in the amount of metal element-containing powder can be suppressed, and the content of volatile components such as organic solvents can be reduced, resulting in little loss in mass when a cured product is formed from the paste.

[0019] A paste containing fewer volatile components such as organic solvents has excellent heat resistance and suppresses deterioration of the properties of the cured product due to evaporation of volatile components during heating. More specifically, the paste of the above embodiment is characterized in that, when heated at 180°C to form a cured product, the thermal weight loss rate is 5% or less. The thermal weight loss rate is more preferably 3% or less, and even more preferably 2% or less. The thermal weight loss rate is most preferably 0%. The thermal weight loss rate can be calculated from measurements using a thermogravimetric differential thermal analyzer (TG-DTA). When the thermal weight loss rate of the paste is 5% or less, the cured product after heat curing of the paste can easily obtain desired properties such as insulation.

[0020] It is preferable that the coefficient of thermal expansion (CTE) of the cured paste be small compared to the CTE of the surrounding materials. In one embodiment, for example, when the paste is applied to an inductor or the like, the CTE of the cured paste is also low because the CTE of copper coils and wiring board materials is low. From this perspective, in one embodiment, the CTE of the cured paste is preferably 40 ppm / °C or less, more preferably 30 ppm / °C or less, and even more preferably 25 ppm / °C or less. When the CTE of the cured paste is 40 ppm / °C or less, defects such as warpage, peeling at the interface with surrounding materials, and cracking can be easily suppressed. The cured product of the paste may be obtained by molding the paste under the following curing conditions: maintaining the paste at 165°C and 2 MPa for 30 minutes under vacuum conditions, then heating it to 180°C and maintaining the temperature for 1 hour. When molding the cured product, preforming may be performed prior to the curing. Preforming can be performed, for example, by heating the paste to 100°C for 1 hour in a nitrogen atmosphere, subsequently heating it to 150°C, and then maintaining the temperature for 20 minutes. The CTE value refers to the linear thermal expansion coefficient in the region below the glass transition temperature, measured at a temperature range of 0 to 250°C and a heating rate of 10°C / min.

[0021] The components of the paste will be specifically described below. (Powder containing metal elements) The metal element-containing powder may contain one type of metal element or two or more types of metal elements. The metal element-containing powder may be, for example, at least one type of powder selected from the group consisting of simple metals, alloys, and metal compounds. The metal element contained in the metal element-containing powder may be, for example, at least one type selected from the group consisting of base metal elements, noble metal elements, transition metal elements, and rare earth elements. The metal element may be, for example, at least one selected from the group consisting of iron (Fe), copper (Cu), titanium (Ti), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), niobium (Nb), aluminum (Al), tin (Sn), chromium (Cr), barium (Ba), strontium (Sr), lead (Pb), silver (Ag), praseodymium (Pr), neodymium (Nd), samarium (Sm), and dysprosium (Dy).

[0022] In one embodiment, the metal element-containing powder may be a single metal element or an alloy composed of two or more metal elements. The alloy may include at least one selected from the group consisting of a solid solution, a eutectic, and an intermetallic compound. The alloy may be, for example, a stainless steel such as an Fe-Cr alloy or an Fe-Ni-Cr alloy. Alternatively, the alloy may be a copper alloy such as a Cu-Sn alloy, a Cu-Sn-P alloy, a Cu-Ni alloy, or a Cu-Be alloy.

[0023] In one embodiment, the metal element-containing powder may be a powder of a metal compound containing the metal elements exemplified above and elements other than the metal elements. Examples of the elements other than the metal elements include at least one selected from the group consisting of carbon (C), oxygen (O), beryllium (Be), phosphorus (P), boron (B), and silicon (Si). The metal compound may be, for example, a metal oxide such as iron oxide. The metal compound may be a magnetic material containing a metal oxide as a main component and further containing and sintering metal elements such as cobalt, nickel, and manganese. Examples of the magnetic material include ferrite.

[0024] In one embodiment, the metal element-containing powder may be a powder of a magnetic material. The magnetic material may be a soft magnetic alloy or a ferromagnetic alloy. The powder of the magnetic material (hereinafter referred to as magnetic powder) may be, for example, at least one selected from the group consisting of an Fe-Si alloy, an Fe-Si-Al alloy (Sendust), an Fe-Ni alloy (Permalloy), an Fe-Cu-Ni alloy (Permalloy), an Fe-Co alloy (Permendur), an Fe-Cr-Si alloy (electromagnetic stainless steel), an Nd-Fe-B alloy (rare earth magnet), an Sm-Fe-N alloy (rare earth magnet), an Al-Ni-Co alloy (Alnico magnet), and a ferrite. The ferrite may be, for example, a spinel ferrite, a hexagonal ferrite, or a garnet ferrite. The metal element-containing powder may contain at least one selected from the group consisting of simple substances, alloys, and metal compounds of the exemplified metal elements.

[0025] In a preferred embodiment, the metal element-containing powder may contain at least one powder selected from the group consisting of elemental Fe and Fe-based alloys. The Fe-based alloy may be, for example, at least one selected from the group consisting of Fe-Si alloys, Fe-Si-Al alloys, Fe-Ni alloys, Fe-Cu-Ni alloys, Fe-Co alloys, Fe-Cr-Si alloys, Fe-Si-B alloys, and Fe-Si-BP-Nb-Cr alloys. The Fe-based alloy may be an amorphous Fe alloy. When the paste contains at least one powder of elemental Fe and an Fe-based alloy, a compact with excellent magnetic properties can be easily obtained. In particular, when the paste contains an amorphous Fe alloy powder, even better magnetic properties can be easily obtained.

[0026] Amorphous Fe alloy powder is an amorphous powder obtained by rapidly quenching an alloy in which the main component, Fe, is melted at high temperature together with other elements such as Si, and is also known as metallic glass. Amorphous Fe alloy powder can be produced by methods well known in the art. The Fe amorphous alloy powder can be commercially available. Examples include AW2-08 and KUAMET-6B2 manufactured by Epson Atmix Corporation, DAPMS3, DAPMS7, DAPMSA10, DAPPB, DAPPC, DAPMKV49, DAP410L, DAP430L, and DAPHYB series manufactured by Daido Steel Co., Ltd., and MH45D, MH28D, MH25D, and MH20D manufactured by Kobe Steel, Ltd. One of these Fe amorphous alloy powders may be used, or two or more may be used in combination.

[0027] The shape of each particle constituting the metal element-containing powder is not particularly limited. The individual particles may be, for example, spherical, oval, flat, plate-like, rod-like, or needle-like. From the viewpoint of the space factor of the metal element-containing particles in the cured paste and low viscosity of the paste, spherical particles are preferred. From the viewpoint of the thixotropy of the paste, a combination of flat particles and needle-like particles may be used.

[0028] The average particle size of the metal element-containing powder may be 0.05 to 200 μm, more preferably 0.5 to 100 μm, and even more preferably 1 to 50 μm. The "average particle size" described in this specification means the particle size at an integrated value of 50% (volume basis) in the particle size distribution. When the metal element-containing powder is coated as described below, the average particle size of the metal element-containing powder including the coating film may be within the above range.

[0029] In one embodiment, the paste may contain multiple types of metal element-containing powders with different average particle diameters (D50). For example, two or more types of metal element-containing powders with different average particle diameters may be used in combination. In this embodiment, gaps formed between metal element-containing powders with larger average particle diameters are easily filled with other metal element-containing powders with smaller average particle diameters. This makes it easy to increase the space factor of the metal element-containing powder in the cured paste. The particle size distribution of the metal element-containing powder is calculated, for example, based on weight measurement by sieving and analysis using a measuring device such as a laser diffraction / scattering device.

[0030] In one embodiment, the metal element-containing powder may have the entire or part of its surface coated with a surface treatment agent. The surface treatment agent may be, for example, an inorganic surface treatment agent such as an inorganic oxide, a phosphoric acid compound, a phosphate compound, or a silane coupling agent, an organic surface treatment agent such as montan wax, or a cured resin. The coupling agent described below may also be used as the surface treatment agent. In one embodiment, the surface of the metal-based magnetic powder, such as an Fe-based alloy, is preferably entirely or partially coated with an insulating material, such as silica, titania, calcium phosphate, montan wax, and cured epoxy resin.

[0031] In one embodiment, the metal element-containing powder may include a magnetic powder whose surface is coated with an insulating material (hereinafter referred to as "insulating-coated magnetic powder"). A paste containing the insulating-coated magnetic powder can easily provide a cured product with excellent magnetic properties and insulating properties. A paste containing the insulating-coated magnetic powder may include two or more types of insulating-coated magnetic powder, and the average particle diameters of the two or more types of insulating-coated magnetic powder may be the same as or different from each other. A paste containing the insulating-coated magnetic powder may further include, in addition to the insulating-coated magnetic powder, a magnetic powder that does not have an insulating coating (hereinafter referred to as "uncoated magnetic powder"). The average particle diameter of the uncoated magnetic powder may be the same as or different from the average particle diameter of the insulating-coated magnetic powder. For example, from the viewpoint of exhibiting insulating properties, it is preferable that the average particle diameter of the uncoated magnetic powder is smaller than the average particle diameter of the insulating-coated magnetic powder.

[0032] In one embodiment, the insulating coated magnetic powder may be an Fe amorphous alloy powder having an insulating coating. For example, "KUAMET9A4" manufactured by Epson Atmix Corporation (Fe-Si-B alloy, D50: 20 μm, with insulating coating) and "SAP-2C" manufactured by Shinto Kogyo Co., Ltd. (Fe-Si-BP-Nb-Cr alloy, D50: 2.2 μm, with insulating coating) can be suitably used. In one embodiment, it is preferable to use both in combination. For example, soft ferrite powder "BSN-125" manufactured by Toda Kogyo Co., Ltd. (Ni-Zn alloy, D50: 10 μm, without insulating coating) can be suitably used as the magnetic powder to be used in combination with the insulating coated Fe amorphous alloy powder.

[0033] The content of the metal element-containing powder in the paste may be 70% by mass or more, based on the total mass of the paste. The content of the metal element-containing powder may be preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 94% by mass or more. When the content of the metal element-containing powder is 70% by mass or more, a molded product having excellent properties derived from the metal element-containing powder can be easily obtained. For example, when the metal element-containing powder is a magnetic powder, an inductor having excellent magnetic properties can be formed, and excellent mechanical strength can also be obtained.

[0034] The content of the metal element-containing powder in the paste is less than 100 mass % based on the total mass of the paste, and may be 99.9 mass % or less. From the viewpoint of the fluidity of the paste and the mechanical strength of the molded body, the content of the metal element-containing powder is preferably 99.8 mass % or less, more preferably 98 mass % or less, and even more preferably 96 mass % or less. In one embodiment, the content of the metal element-containing powder in the paste may be preferably 80 to 99.9 mass % or more, more preferably 90 to 99.8 mass % or more, and even more preferably 94 to 96 mass %, based on the total mass of the paste.

[0035] (Epoxy group-containing compound) The epoxy group-containing compound refers to a compound having one or more epoxy groups in the molecule, and may be in the form of a monomer, or an oligomer or polymer having structural units formed by polymerization of the monomer. The epoxy group-containing compound is cured by heat treatment and can function as a binder resin that binds the metal element-containing powder. An example of an epoxy group-containing compound is an oligomer or polymer having two or more epoxy groups in the molecule, which is generally known as an epoxy resin. Another example of an epoxy group-containing compound is a compound having one or more epoxy groups in the molecule but not containing a structural unit formed by polymerization (hereinafter referred to as an epoxy compound). Such an epoxy compound is generally known as a reactive diluent. The epoxy group-containing compound preferably includes at least one selected from the group consisting of an epoxy resin and an epoxy compound.

[0036] Examples of the epoxy resin include biphenyl-type epoxy resins, stilbene-type epoxy resins, diphenylmethane-type epoxy resins, sulfur-containing epoxy resins, novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, salicylaldehyde-type epoxy resins, naphthol- and phenol-copolymerized epoxy resins, epoxidized aralkyl-type phenolic resins, bisphenol-type epoxy resins, glycidyl ether-type epoxy resins of alcohols, glycidyl ether-type epoxy resins of paraxylylene and / or metaxylylene-modified phenolic resins, and glycidyl ether-type epoxy resins of terpene-modified phenolic resins. The epoxy resin may be at least one selected from the group consisting of diol ether-type epoxy resins, cyclopentadiene-type epoxy resins, glycidyl ether-type epoxy resins of polycyclic aromatic ring-modified phenolic resins, glycidyl ether-type epoxy resins of naphthalene ring-containing phenolic resins, glycidyl ester-type epoxy resins, glycidyl or methylglycidyl-type epoxy resins, alicyclic epoxy resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, and linear aliphatic epoxy resins obtained by oxidizing olefin bonds with a peracid such as peracetic acid. The epoxy resin may be in the form of liquid, semi-solid, or solid, or may be a mixture of these.

[0037] The molecular weight of the epoxy compound may be preferably 100 or more, more preferably 150 or more, and even more preferably 200 or more. When an epoxy compound having a molecular weight of 100 or more is used, volatilization before reaction with a curing agent can be suppressed by setting appropriate curing conditions. Furthermore, a low molecular weight can reduce the occurrence of defects such as a short distance between crosslinking points after reaction, making the cured product prone to cracking. On the other hand, the molecular weight of the epoxy compound may be preferably 700 or less, more preferably 500 or less, and even more preferably 300 or less. When an epoxy compound having a molecular weight of 700 or less is used, a viscosity suitable for use as a diluent can be easily obtained.

[0038] In one embodiment, the molecular weight of the epoxy compound is preferably in the range of 100 to 700, more preferably in the range of 150 to 500, and even more preferably in the range of 200 to 300. When an epoxy compound having a molecular weight in such a range is used, it becomes easy to adjust the viscosity of the paste. Unlike components such as organic solvents that volatilize when heated, epoxy compounds are cured when heated and are incorporated into the cured product. Therefore, when an epoxy compound is used, it contributes to adjusting the viscosity of the paste while also making it possible to suppress deterioration in the properties of the cured product.

[0039] The epoxy compound may contain one or more epoxy groups in the molecule, and may be, for example, at least one selected from the group consisting of n-butyl glycidyl ether, versatate glycidyl ether, styrene oxide, ethylhexyl glycidyl ether, phenyl glycidyl ether, butylphenyl glycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, diethylene glycol diglycidyl ether, and trimethylolpropane triglycidyl ether. The epoxy compound is preferably sufficiently purified to have a low content of ionic impurities. For example, the epoxy compound preferably has ionic impurities such as free Na ions and free Cl ions of 500 ppm or less.

[0040] The epoxy equivalent of the epoxy group-containing compound may be preferably 80 g / eq to 350 g / eq, more preferably 100 g / eq to 300 g / eq, and even more preferably 120 g / eq to 250 g / eq. When the epoxy equivalent is within the above range, the viscosity of the epoxy group-containing compound itself is low, making it easy to adjust the viscosity of the paste.

[0041] The epoxy group-containing compound preferably includes an epoxy group-containing compound that is liquid at 25°C. In this specification, "liquid at 25°C" means that the viscosity of the epoxy group-containing compound at 25°C is 200 Pa s or less. The viscosity is measured using an E-type viscometer under the following conditions: temperature: 25°C, rotor: SPP, and rotation speed: 2.5 rpm. As the E-type viscometer, for example, a TV-33 viscometer manufactured by Toki Sangyo Co., Ltd. can be used.

[0042] When an epoxy group-containing compound that is liquid at 25°C is used, the amount of volatile components, such as organic solvents, typically used to achieve fluidity can be significantly reduced. In one embodiment, a paste containing no organic solvent can be formed. Furthermore, the content of the metal element-containing powder can be easily increased while maintaining appropriate fluidity as a paste. From these perspectives, in one embodiment, the viscosity of the epoxy group-containing compound may be preferably 100 Pa·s or less, more preferably 50 Pa·s or less, and even more preferably 10 Pa·s or less. The viscosity of the epoxy group-containing compound may be greater than 0 Pa·s, and may be 0.001 Pa·s or more, or 0.01 Pa·s or more.

[0043] Among the epoxy group-containing compounds, the viscosity of the epoxy compound is preferably lower than that of the liquid epoxy resin in terms of adjusting the paste viscosity. The viscosity of the epoxy compound may be preferably 1 Pa·s or less, more preferably 0.5 Pa·s or less, and even more preferably 0.1 Pa·s or less. The viscosity of the epoxy compound may be greater than 0 Pa·s, and may be 0.001 Pa·s or more, or 0.01 Pa·s or more.

[0044] The epoxy group-containing compound that is liquid at 25°C may contain at least one selected from the group consisting of an epoxy resin that is liquid at 25°C (hereinafter referred to as a liquid epoxy resin) and an epoxy compound that is liquid at 25°C. Based on the total mass of the epoxy group-containing compound, the content of the liquid epoxy resin may be preferably 50 mass% or more, more preferably 70 mass% or more, and even more preferably 90 mass% or more, or may be 100 mass%. However, the content of the liquid epoxy resin is not limited to the above range.

[0045] The liquid epoxy resin may contain at least one liquid epoxy resin selected from, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD ​​type epoxy resin, bisphenol S type epoxy resin, naphthalenediol type epoxy resin, hydrogenated bisphenol A type epoxy resin, and aminoglycidyl ether type epoxy resin. Among these, it is preferable to use at least one of liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, and liquid aminoglycidyl ether type epoxy resin.

[0046] Liquid epoxy group-containing compounds are also available as commercial products. For example, they are sold by Nippon Steel Chemical Co., Ltd. as liquid bisphenol A epoxy resin and liquid bisphenol F epoxy resin. For example, a liquid bisphenol F epoxy resin with the product name "YDF-8170C" (epoxy equivalent weight 165, viscosity 1,000 to 1,500 mPa·s) can be suitably used. An example of an epoxy compound is the ADEKA GLYCIROL (product name) series manufactured by ADEKA Corporation. For example, a product with the product name "ADEKA GLYCIROL ED-503G" (epoxy equivalent weight 135, viscosity 15 mPa·s) can be suitably used.

[0047] The paste may further contain, in addition to the epoxy group-containing compound, other resins, which may include at least one selected from the group consisting of thermosetting resins (excluding epoxy resins) and thermoplastic resins. The thermosetting resin may be, for example, at least one selected from the group consisting of a phenolic resin, an acrylic resin, a polyimide resin, and a polyamide-imide resin. When a phenolic resin is used in addition to an epoxy group-containing compound, the phenolic resin can also function as a curing agent for the epoxy group-containing compound. The thermoplastic resin may be, for example, at least one selected from the group consisting of acrylic resin, polyethylene, polypropylene, polystyrene, polyvinyl chloride, and polyethylene terephthalate. The resin component may further contain a silicone resin in addition to the epoxy group-containing compound.

[0048] When the paste contains a resin other than the epoxy group-containing compound, the content of the other resin is preferably adjusted within a range that does not reduce the effect of the epoxy group-containing compound. For example, the content of the other resin may be preferably 50% by mass or less, more preferably 30% by mass or less, and even more preferably 10% by mass or less, based on the total mass of the resin in the paste. However, the content of the other resin is not limited to the above range. In one embodiment, the blending amounts of the epoxy group-containing compound and the other resin can be adjusted so that the viscosity of the mixture of the epoxy group-containing compound and the other resin is 50 Pa s or less at 25°C. The viscosity is measured using an E-type viscometer under the following conditions: temperature: 25°C, rotor: cone plate, cone angle: 1°34°C, and rotation speed: 2.5 rpm. As the E-type viscometer, for example, a TV-33 viscometer manufactured by Toki Sangyo Co., Ltd. can be used.

[0049] (hardening agent) The curing agent is not particularly limited, and may be any compound that can impart appropriate viscosity to the paste and react with the epoxy group of the epoxy group-containing compound to form a cured product. It may be a well-known curing agent that is generally used as a curing agent for epoxy resins. Usable curing agents include, for example, phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents.

[0050] Curing agents are classified into those that cure epoxy resins at temperatures ranging from low to room temperature, and heat-curing curing agents that cure epoxy resins when heated. Examples of curing agents that cure epoxy resins at temperatures ranging from low to room temperature include aliphatic polyamines, polyaminoamides, and polymercaptans. Examples of heat-curing curing agents include aromatic polyamines, acid anhydrides, phenol novolac resins, and dicyandiamide (DICY). When a curing agent that cures an epoxy resin in a temperature range from low temperature to room temperature is used, the glass transition temperature of the cured epoxy resin tends to be low and the cured epoxy resin tends to be soft. As a result, the molded article formed from the paste also tends to be soft. From the viewpoint of improving the heat resistance and mechanical strength of the molded article, it is preferable that the curing agent contains a heat-curing curing agent.

[0051] Among the heat-curing curing agents, it is preferable to use a curing agent that is liquid at 25° C., from the viewpoint of reducing the viscosity of the paste. As the liquid curing agent, for example, at least one selected from the group consisting of amine-based curing agents such as aliphatic or aromatic polyamines and aliphatic or aromatic amines, polymercaptans, acid anhydrides, and imidazole-based curing agents can be used. As long as the increase in viscosity of the paste can be suppressed, a curing agent that is solid at 25°C may be used, or a liquid curing agent and a solid curing agent may be used in combination. Examples of solid curing agents that can be used include dicyandiamide, tertiary amines, imidazole curing agents, and imidazoline curing agents. The solid curing agents exemplified above are polyfunctional or act catalytically, so that even a small amount can function satisfactorily.

[0052] In one embodiment, the curing agent preferably includes at least one selected from the group consisting of an amine-based curing agent, an imidazole-based curing agent, and an imidazoline-based curing agent. More preferably, the curing agent includes at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent. In one embodiment, the curing agent preferably includes at least an amine-based curing agent. Amine-based curing agents (more specifically, tertiary amines), imidazole-based curing agents, and imidazoline-based curing agents can also be used as curing accelerators in combination with other curing agents.

[0053] The amine curing agent may be a compound having at least two amino groups in the molecule, and includes at least one selected from the group consisting of aliphatic amines and aromatic amines. The aliphatic amine may be a compound having a linear or cyclic structure, and examples thereof include diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, methylcyclohexylamine, isophoronediamine, 4,4'-diamino-dicyclohexylmethane, and diazabicycloundecene. The aromatic amine may be a compound in which an amino group is substituted on an aromatic compound, and is particularly preferably a compound having a structure in which hydrogen atoms on a benzene ring are substituted with an amino group. Examples of the aromatic amine include benzyldimethylamine, tris(dimethylaminomethylphenol), metaphenylenediamine, benzyldimethylamine, 4,4'-diaminodiphenylmethane, 2-methylaniline, diaminodiphenylsulfone, polyamidoamine, an amine compound represented by the following formula (1), and an amine compound represented by the following formula (2). Although not particularly limited, when an amine-based curing agent is used, it tends to be easier to adjust the viscosity and the amount of weight loss on heat. In particular, when an aromatic amine is used, it tends to be easier to adjust the viscosity and the rate of weight loss on heat.

[0054] The imidazole curing agent is a compound having an imidazole skeleton, and may be an imidazole compound in which hydrogen atoms in the molecule are substituted with a substituent. In one embodiment, the imidazole curing agent may be a compound having an imidazole skeleton, such as an alkyl group-substituted imidazole. Examples of imidazole curing agents include imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole. In one embodiment, "Curezol 2E4MZ" (2-ethyl-4-methylimidazole) manufactured by Shikoku Chemicals Corporation can be suitably used. The imidazoline curing agent is a compound having an imidazoline skeleton, and may be an imidazoline compound in which hydrogen atoms in the molecule are substituted with a substituent. It may be a compound having an imidazoline skeleton, such as an alkyl group-substituted imidazoline. Examples of imidazoline curing agents include imidazoline, 2-methylimidazoline, and 2-ethylimidazoline.

[0055] From the viewpoints of compatibility with liquid epoxy resins and storage stability, it is preferable that the curing agent contains at least an aromatic amine. The aromatic ring of the aromatic amine may have a substituent other than an amino group. For example, it may have an alkyl group having 1 to 5 carbon atoms, or an alkyl group having 1 or 3 carbon atoms. The number of aromatic rings in the aromatic amine may be one or two or more. When the number of aromatic rings is two or more, the aromatic rings may be bonded to each other by a single bond or via a linking group such as an alkylene group.

[0056] In one embodiment, from the viewpoint of the viscosity of the paste, it is preferable that the curing agent contains a liquid aromatic amine. For example, at least one selected from the group consisting of a compound represented by the following formula (1) and a compound represented by the following formula (2) can be used. A compound represented by formula (2) in which the methyl group is replaced with an ethyl group can also be used. In one embodiment, a compound represented by formula (1) can be preferably used.

[0057] [ka]

[0058] [ka]

[0059] Liquid aromatic amines that can be used as curing agents are also commercially available, such as "Grade: jER Cure WA" (a compound represented by formula (1), 2,6-diamino-3,5-diethyltoluene) manufactured by Mitsubishi Chemical Corporation and "Kayahard AA" (3,3'-diethyl-4,4'-diaminodiphenylmethane) manufactured by Nippon Kayaku Co., Ltd.

[0060] Although not particularly limited, when at least one of the aromatic amines and imidazole-based compounds is used as the curing agent, a cured product with a lower CTE tends to be easily obtained compared to cured products obtained when other curing agents are used. From this perspective, in one embodiment, the curing agent preferably includes at least one selected from the group consisting of 2,6-diamino-3,5-diethyltoluene, 3,3'-dimethyl (or diethyl)-4,4'-diaminodiphenylmethane, and 2-ethyl-4-methylimidazole.

[0061] The content of the curing agent in the paste is not particularly limited. It can be set in consideration of the ratio between the equivalent number of epoxy groups in the epoxy group-containing compound such as the epoxy resin and the equivalent number of active groups in the curing agent. For example, the ratio of the curing agent to 1 equivalent of the epoxy groups in the epoxy group-containing compound may be preferably 0.5 to 1.5 equivalents, more preferably 0.9 to 1.4 equivalents, and even more preferably 1.0 to 1.2 equivalents.

[0062] When the ratio of active groups in the curing agent is 0.5 equivalents or more, the amount of OH groups per unit weight of the epoxy resin after heat curing is reduced, thereby preventing a decrease in the curing rate of the epoxy resin. This also prevents a decrease in the glass transition temperature and elastic modulus of the cured product. Furthermore, it also prevents a decrease in the insulating reliability of the cured product due to unreacted resin components in the binder resin. On the other hand, when the ratio of active groups in the curing agent is 1.5 equivalents or less, it is possible to suppress a decrease in the mechanical strength of a molded body formed from the paste after heat curing. It is also possible to suppress a decrease in the insulating properties of the cured product due to unreacted curing agent. However, in the above embodiment, the ratio of active groups in the curing agent is not limited, and the effects of the present invention can be obtained even if it is outside the above range.

[0063] The paste may further contain a curing accelerator as needed. In one embodiment, the paste may contain a metal element-containing powder, an epoxy group-containing compound, a curing agent, and a curing accelerator. In another embodiment, the paste may further contain additives such as a coupling agent and a flame retardant in addition to the above components. Specific explanations are provided below.

[0064] (curing accelerator) The curing accelerator is not limited as long as it is a compound that can accelerate the curing reaction between the epoxy resin and the curing agent. Examples of curing accelerators include tertiary amines, imidazole-based curing accelerators, imidazoline-based curing accelerators, and phosphorus compounds. The compounds exemplified above as imidazole-based curing agents and imidazoline-based curing accelerators may be used as imidazole-based curing accelerators and imidazoline-based curing accelerators. Among liquid curing agents, when a liquid acid anhydride is used, it is preferable to use a curing accelerator in combination. The paste may contain one or more curing accelerators. The use of a curing accelerator improves the mechanical strength of a molded body formed from the paste and easily reduces the curing temperature of the paste.

[0065] The amount of the curing accelerator to be blended is not particularly limited as long as it is an amount that can achieve a curing acceleration effect. However, from the viewpoint of improving the curability and fluidity of the paste when absorbing moisture, the amount of the curing accelerator to be blended may preferably be 0.001 parts by mass or more per 100 parts by mass of the epoxy resin and curing agent combined. The amount of the curing accelerator to be blended may more preferably be 0.01 parts by mass or more, and even more preferably be 0.1 parts by mass or more. On the other hand, the amount of the curing accelerator to be blended may preferably be 5 parts by mass or less, more preferably be 4 parts by mass or less, and even more preferably be 3 parts by mass or less.

[0066] When the amount of the curing accelerator is 0.001 parts by mass or more, a sufficient curing acceleration effect can be easily obtained. When the amount of the curing accelerator is 5 parts by mass or less, excellent storage stability can be easily obtained in the paste. However, even if the amount and content of the curing accelerator are outside the above ranges, the effects of the present invention can be obtained.

[0067] (coupling agent) The use of a coupling agent improves the dispersibility of the metal element-containing powder in the paste and facilitates control of the paste viscosity. It also facilitates improving the adhesion between the binder resin and the metal element-containing powder. Furthermore, it facilitates improving the adhesion, flexibility, and mechanical strength of the cured product formed from the paste to the substrate. The coupling agent may be, for example, at least one selected from the group consisting of silane-based compounds (silane coupling agents), titanium-based compounds, aluminum compounds (aluminum chelates), and aluminum / zirconium-based compounds. The silane coupling agent may be, for example, at least one selected from the group consisting of epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, acid anhydride-based silane, and vinylsilane. Aminophenyl-based silane coupling agents are particularly preferred. The paste may contain at least one of the above coupling agents. The paste may contain two or more of the above coupling agents.

[0068] (Flame retardant) The paste may contain a flame retardant to improve the environmental safety, recyclability, moldability, and low cost of the paste. The flame retardant may be, for example, at least one selected from the group consisting of bromine-based flame retardants, phosphorus-based flame retardants, hydrated metal compound-based flame retardants, silicone-based flame retardants, nitrogen-containing compounds, hindered amine compounds, organometallic compounds, and aromatic engineering plastics. The paste may contain one or more of the flame retardants listed above.

[0069] The paste of the above embodiment may contain an organic solvent as needed. The organic solvent is not particularly limited. For example, an organic solvent capable of dissolving the binder resin can be used. The organic solvent may be, for example, at least one selected from the group consisting of acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, carbitol acetate, butyl carbitol acetate, cyclohexanone, and xylene. From the viewpoint of workability, the organic solvent is preferably liquid at room temperature (25°C). From the viewpoint of workability, the boiling point of the organic solvent is preferably 50°C or higher and 160°C or lower.

[0070] On the other hand, if the paste contains an organic solvent, a drying process is required after the paste is applied, resulting in an environmental burden due to volatile components. Furthermore, if the organic solvent has a boiling point lower than the heating temperature during curing, it may volatilize during heating, causing voids in the cured paste. Furthermore, if the organic solvent has a boiling point higher than the heating temperature during curing, the organic solvent may not volatilize during heating and may remain in the paste, degrading the properties of the cured product. For example, the presence of voids in the cured product can easily reduce properties such as mechanical strength and magnetic properties. Furthermore, particularly if the organic solvent remains in the cured product, ionic components and the like in the cured product can easily migrate, which can easily reduce insulation properties such as insulation resistance and insulation reliability.

[0071] From these viewpoints, when the paste of the above embodiment contains an organic solvent, the content thereof is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, based on the total mass of the paste. Most preferably, the paste is substantially free of organic solvents. In this specification, "substantially free" means that no organic solvents have been intentionally added to the paste. Therefore, the paste may contain, for example, an organic solvent that was used during the production of the resin and remains in the resin.

[0072] The paste of the above embodiment can be adjusted to an appropriate viscosity without using volatile components such as organic solvents, and has fluidity. In one embodiment, from the viewpoint of coatability, the viscosity of the paste may be preferably 1 Pa·s or more, more preferably 10 Pa·s or more, and even more preferably 100 Pa·s or more. By adjusting the viscosity to 1 Pa·s or more, dripping after coating can be suppressed and the pattern shape can be easily prevented from collapsing after printing. In addition, settling of the metal element-containing powder in the paste can be suppressed, and deterioration of coatability over time after stirring the paste can be easily improved. On the other hand, the viscosity of the paste may be preferably 600 Pa s or less, more preferably 400 Pa s or less, and even more preferably 200 Pa s or less. By adjusting the viscosity to 600 Pa s or less, the paste becomes fluid and good applicability can be easily obtained.

[0073] In one embodiment, when the paste is applied to screen printing, the viscosity of the paste may be preferably 10 Pa·s to 400 Pa·s, more preferably 50 Pa·s to 300 Pa·s, and even more preferably 100 Pa·s to 250 Pa·s. When the viscosity is adjusted to the above range, the problem of the paste not passing through the openings in the plate can be suppressed during screen printing. The viscosity of the paste can be freely adjusted by the structure and properties of the epoxy group-containing compound, the structure and properties of the curing agent, and the combination and compounding ratio thereof, as well as the structure and compounding ratio of additives such as a curing accelerator and a coupling agent. The paste may contain additives such as a viscosity modifier, a thixotropic agent, and a dispersion stabilizer.

[0074] The paste of the above embodiment can be easily adjusted to the viscosity within the above preferred range without substantially using an organic solvent, even when the content of the metal element-containing powder is increased. For example, a paste that exhibits a thermal weight loss rate of 5% or less after heat treatment at 180°C suppresses the deterioration of the performance of the cured product due to volatile components such as organic solvents, and can easily provide a molded product with excellent properties such as insulating properties.

[0075] (Method of preparing paste) The paste of the above embodiment can be prepared, for example, by uniformly stirring and kneading a metal element-containing powder and a binder resin containing at least an epoxy group-containing compound and a curing agent. The method of stirring and kneading is not particularly limited, and for example, a stirring blade, a planetary stirring type, a roll mill, a disk mill, or a ball mill can be used.

[0076] (Molded body) When forming a compact from the paste of the above embodiment, a B-stage compact may be produced by heating the paste to harden it. The B-stage compact may be further heated to harden the resin in the compact. Alternatively, a C-stage compact may be produced from the paste in one go. Depending on the composition or combination of the metal element-containing powders contained in the paste, various properties of the molded body, such as electromagnetic properties or thermal conductivity, can be freely controlled, and the molded body can be used for various industrial products or their raw materials. Industrial products manufactured using the paste may include, for example, automobiles, medical devices, electronic devices, electrical devices, information and communication devices, home appliances, audio equipment, and general industrial equipment. For example, a molded body (e.g., a sheet) formed from a paste containing magnetic powder such as an Fe-Si-Cr alloy or ferrite can be used as a raw material (e.g., a magnetic core) for inductors such as EMI filters. A paste containing permanent magnet powder can be used as a raw material for bonded magnets. A molded body (e.g., a sheet) formed from a paste containing iron powder and copper powder can be used as an electromagnetic wave shield. In one embodiment, a molded body (cured product) formed using the paste has a low CTE of 40 ppm / °C or less, making it suitable for use as an inductor. For example, when the cured product is applied to a peripheral material with a low CTE, such as a wiring board material, defects such as warpage, peeling at the interface with the peripheral material, and cracking caused by the difference in CTE can be easily suppressed, thereby improving reliability. [Example]

[0077] The present invention will be explained in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples in any way.

[0078] <Example 1-1> (1) Preparation of binder resin 40.00 g of liquid epoxy resin "ADEKA GLYCIROL ED-503G" manufactured by ADEKA Corporation and 13.33 g of hardener "jER Cure WA" (liquid aromatic amine) manufactured by Mitsubishi Chemical Corporation were weighed out, and these raw materials were placed in a 250 ml ointment container. All raw materials in the ointment container were stirred and kneaded using a rotary and revolutionary mixer to obtain a binder. The rotary and revolutionary mixer used was an "ARE-500" manufactured by Thinky Corporation. The stirring and kneading was carried out for 1 minute with the revolution speed of the rotary and revolutionary mixer set to 2000 rpm. After stirring the binder resin using a medicine spoon, the revolution speed of the rotary and revolutionary mixer was again set to 2000 rpm and the stirring and kneading was carried out for 1 minute to obtain binder resin I. (2) Preparation of paste 2.26 g of the binder resin I, 60.00 g of iron amorphous alloy powder "KUAMET 9A4" (Fe-Si-B alloy with insulating coating, D50: 20 μm) manufactured by Epson Atmix Corporation as metal element-containing powder (hereinafter referred to as metal powder), 13.17 g of metallic glass magnetic powder "SAP-2C" (Fe-Si-BP-Nb-Cr alloy with insulating coating, D50: 2.2 μm) manufactured by Shinto Kogyo Co., Ltd., and 0.22 g of silane coupling agent "KBM-573" manufactured by Shin-Etsu Silicones Co., Ltd. were weighed out, and these raw materials were placed in a 50 ml ointment container. The raw materials in the ointment container were stirred using a rotary stirrer at a revolution speed of 2000 rpm for 45 seconds. After stirring the raw materials in the ointment container using a medicine spoon, the raw materials were stirred twice using a rotary stirrer at a revolution speed of 2000 rpm for 45 seconds to prepare Paste 1-1. The metal powder content in the obtained paste 1-1 was 97% by mass. The metal powder content was calculated from m / (m+M), where "M" is the mass of non-volatile components (solid content) other than the metal powder contained in the paste, and "m" is the mass of the metal powder.

[0079] <Example 1-2> Paste 1-2 was prepared in the same manner as in Example 1-1, except that the blending amount of binder resin I was changed to 3.45 g. The content of metal powder in the obtained paste 1-2 was 95 mass %.

[0080] <Examples 1-3 to 1-6> Pastes 1-3 to 1-6 having the metal powder contents shown in Table 1 were prepared in the same manner as in Example 1-1, except that the blending amount of binder resin I was changed.

[0081] <Example 2-1> (1) Preparation of binder resin 40.00 g of the liquid epoxy resin "YDF-8170C" manufactured by Nippon Steel Chemical Co., Ltd. and 11.13 g of the hardener "jER Cure WA" (liquid aromatic amine) manufactured by Mitsubishi Chemical Corporation were weighed out. These were used as raw materials and placed in a 250 ml ointment container. All raw materials in the ointment container were stirred and kneaded using a rotary and revolutionary mixer to obtain a binder resin. The rotary and revolutionary mixer used was an "ARE-500" manufactured by Thinky Corporation. The stirring and kneading was carried out for 1 minute with the revolution speed of the rotary and revolutionary mixer set to 2000 rpm. After stirring the binder resin using a medicine spoon, the revolution speed of the rotary and revolutionary mixer was again set to 2000 rpm and the stirring and kneading was carried out for 1 minute to obtain binder resin II. (2) Preparation of paste 5.51 g of binder resin II was weighed out, and as metal powders, 60.00 g of iron amorphous alloy powder "KUAMET 9A4" (Fe-Si-B alloy with insulating coating, D50: 20 μm) manufactured by Epson Atmix Corporation, 13.17 g of metallic glass magnetic powder "SAP-2C" (Fe-Si-BP-Nb-Cr alloy with insulating coating, D50: 2.2 μm) manufactured by Shinto Kogyo Co., Ltd., and 0.22 g of silane coupling agent "KBM-573" manufactured by Shin-Etsu Silicones Co., Ltd. were weighed out. These raw materials were placed in a 50 ml ointment container. All raw materials in the ointment container were stirred and kneaded using a rotary stirrer at a revolution speed of 2000 rpm for 45 seconds. Next, the raw materials in the ointment container were stirred using a medicine spoon, and then stirred twice using a rotary stirrer at a revolution speed of 2000 rpm for 45 seconds to prepare Paste 2-1. The metal powder content in the obtained paste 2-1 was 93 mass %. The metal powder content was calculated from m / (m+M), where "M" is the mass of non-volatile components (solid content) other than the metal powder contained in the paste, and "m" is the mass of the metal powder.

[0082] <Examples 2-2 to 2-4> Pastes 2-2 to 2-4 having the metal powder contents shown in Table 1 were prepared in the same manner as in Example 2-1, except that the blending amount of binder resin II was changed.

[0083] Example 3 3 g of binder resin I prepared in the same manner as in Example 1-1 and 7 g of binder resin II prepared in the same manner as in Example 2-1 were weighed out, and these were placed in an ointment container and stirred and kneaded using a planetary stirrer in the same manner as in Example 1-1 to obtain binder resin I-II. Next, a paste 3 containing 94 mass % of metal powder was obtained in the same manner as in Example 2-1, except that binder resin I-II was used.

[0084] Example 4 0.86 g of solid epoxy resin "NC-3000-H" manufactured by Nippon Kayaku Co., Ltd. and 0.14 g of hardener "jER Cure WA" (liquid aromatic amine) manufactured by Mitsubishi Chemical Corporation were weighed out. These were placed in an ointment container and stirred and kneaded using a planetary stirrer in the same manner as in Example 1-1, to obtain binder resin III. Next, 7 g of the binder resin I prepared in the same manner as in Example 1 and 9 g of the binder resin III prepared previously were weighed out. These were placed in an ointment container and stirred and kneaded using a planetary stirrer in the same manner as in Example 1-1 to obtain binder resin I-III. Furthermore, paste 4 having a metal powder content of 94 mass % was obtained in the same manner as in Example 2-1, except that binder resin I-III was used.

[0085] <Example 5> 28.00 g of Nippon Steel Chemical's liquid epoxy resin "YDF-8170C" and 12.00 g of ADEKA Corporation's liquid epoxy resin "ADEKA Glycirol ED-503G" were weighed into a 100 ml ointment container. The mixture was stirred for 2 minutes at 2000 rpm using a rotary stirrer. The ingredients in the ointment container were stirred using a medicine spoon, and then again at 2000 rpm using a rotary stirrer for 2 minutes. 2.00 g of Shikoku Chemicals Corporation's liquid imidal curing agent "Curesol 2E4MZ" was added, and the mixture was stirred for 2 minutes at 2000 rpm using a rotary stirrer to prepare binder resin IV. Next, paste 5 having a metal powder content of 94 mass % was obtained in the same manner as in Example 2-1, except that the previously obtained binder resin IV was used.

[0086] Example 6 Binder Resin V was prepared by changing the curing agent in the preparation of Binder Resin IV in Example 5 to 13.08 g of 4,4'-diaminodiphenylmethane manufactured by Tokyo Chemical Industry Co., Ltd. Next, a paste 6 having a metal powder content of 94 mass % was obtained in the same manner as in Example 2-1, except that the binder resin V obtained earlier was used.

[0087] Example 7 In the preparation of binder resin IV in Example 5, the curing agent was changed to 6.44 g of triethylenetetramine manufactured by Tokyo Chemical Industry Co., Ltd., to prepare binder resin VI. Next, paste 7 having a metal powder content of 94 mass % was obtained in the same manner as in Example 2-1, except that the previously obtained binder resin VI was used.

[0088] Example 8 In the preparation of binder resin IV in Example 5, the curing agent was changed to 10.82 g of isophoronediamine manufactured by Tokyo Chemical Industry Co., Ltd., to prepare binder resin VII. Next, a paste 8 containing 94 mass % of metal powder was obtained in the same manner as in Example 2-1, except that the previously obtained binder resin VII was used.

[0089] Example 9 In the preparation of binder resin IV in Example 5, the curing agent was changed to 2.00 g of trisdimethylaminomethylphenol manufactured by Tokyo Chemical Industry Co., Ltd., to prepare binder resin VIII. Next, a paste 9 containing 94 mass % of metal powder was obtained in the same manner as in Example 2-1, except that the previously obtained binder resin VIII was used.

[0090] Example 10 In the preparation of binder resin IV in Example 5, the curing agent was changed to 8.97 g of metaphenylenediamine manufactured by Tokyo Chemical Industry Co., Ltd., to prepare binder resin IX. Next, a paste 10 containing 94 mass % of metal powder was obtained in the same manner as in Example 2-1, except that the previously obtained binder resin IX was used.

[0091] Example 11 In Example 5, 60.00 g of "KUAMET 9A4" (Fe-Si-B alloy with insulating coating, D50: 20 μm) manufactured by Epson Atmix Corporation and 13.17 g of "BSN-125" (Ni-Zn soft ferrite powder without insulating coating, D50: 10 μm) manufactured by Toda Kogyo Co., Ltd. were used as metal powder. Except for this, all procedures were the same as in Example 5 to obtain a paste 11 having a metal powder content of 94 mass%.

[0092] <Comparative Example 1> (1) Preparation of binder resin X Weighed out 71.37 g of "Teisan Resin HTR-860-P3" (a cyclohexanone solution containing 12.6 wt% acrylic resin) manufactured by Nagase ChemteX Corporation, 15.00 g of solid epoxy resin "NC-3000-H" manufactured by Nippon Kayaku Co., Ltd., 6.00 g of hardener "HP850N" (phenol novolac resin) manufactured by Showa Denko Materials Co., Ltd. (formerly Hitachi Chemical Co., Ltd.), 0.15 g of hardener accelerator "2E4MZ" manufactured by Shikoku Chemical Industry Co., Ltd., and 21.30 g of "cyclohexanone" manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. These raw materials were placed in a 250 ml ointment container. Binder resin varnish X was obtained by stirring and kneading all the raw materials in the ointment container using a rotary and revolutionary mixer. The rotary and revolutionary mixer used was an "ARE-500" manufactured by Thinky Corporation. The revolution speed of the rotary and revolutionary mixer was set to 2000 rpm, and the stirring and kneading was carried out twice over 20 minutes. The NV (non-volatile content) of the obtained binder resin varnish X was 26.49% by mass. The components of binder resin varnish X excluding the organic solvent (cyclohexanone, etc.) constitute binder resin X. (2) Preparation of paste 8.54 g of binder resin varnish X was weighed out, and as metal powders, 60.00 g of "KUAMET 9A4" (Fe-Si-B alloy with insulating coating, D50: 20 μm) manufactured by Epson Atmix Corporation, 13.17 g of "SAP-2C" (Fe-Si-BP-Nb-Cr alloy with insulating coating, D50: 2.2 μm) manufactured by Shinto Kogyo Co., Ltd., and 0.22 g of silane coupling agent "KBM-573" manufactured by Shin-Etsu Silicones Co., Ltd. were weighed out. These raw materials were placed in a 50 ml ointment container. All ingredients in the ointment container were mixed and kneaded using a rotary mixer at a revolution speed of 2000 rpm for 45 seconds. Then, the ingredients in the ointment container were mixed using a medicine spoon. Furthermore, paste 12 was prepared by stirring twice using the rotary mixer at a revolution speed of 2000 rpm for 45 seconds. The metal powder content was 97 mass % based on the total solid content of the obtained paste 12. The metal powder content was calculated from m / (m+M), where "M" is the mass of non-volatile components (solid content) other than the metal powder contained in paste 12, and "m" is the mass of the metal powder.

[0093] <Comparative Example 2> Paste 13 containing 84 mass % of metal powder was prepared in the same manner as in Comparative Example 1, except that the blending amount of binder resin varnish X was changed.

[0094] <2> Paste characterization The pastes obtained in the examples and comparative examples were evaluated for various properties according to the methods described below. <Viscosity evaluation> The viscosity of each paste obtained in the Examples and Comparative Examples was measured using a TV-33 viscometer manufactured by Toki Sangyo Co., Ltd. under conditions of a temperature of 25°C, a rotor of SPP, and a rotation speed of 2.5 rpm. The measured values ​​were evaluated according to the following criteria. The results are shown in Table 1. When screen printing is considered, good coatability can be easily obtained with categories 2, 3, and 4. Of these, category 3 is the most preferable. (viscosity classification) 1: Viscosity less than 1 Pa·s 2: Viscosity is 1 Pa·s or more and 10 Pa·s or less 3: Viscosity is 10 Pa·s or more and 400 Pa·s or less 4: Viscosity is 400 Pa·s or more and 600 Pa·s or less 5: Viscosity exceeds 600 Pa·s

[0095] <Thermogravimetric reduction rate> The thermal weight loss of the paste was measured using a thermogravimetric differential scanning calorimeter (TG-DSC) "NEXTA STA200RV" manufactured by Hitachi High-Tech Science Corporation. Specifically, 15 mg of paste was heated from 25°C to 100°C at a rate of 10°C / min in a nitrogen atmosphere and held at 100°C for 1 hour. The paste was then heated from 100°C to 180°C at a rate of 3°C / min and held at 180°C for 1 hour, after which the thermal weight loss was measured. The thermal weight loss rate is calculated as the percentage (reduction rate) of the weight loss of the paste after heating at 180°C, with the weight of the paste (before heating) at 25°C as the reference (100%). The thermal weight loss rate can be used to evaluate the content of volatile components in the paste. If the thermal weight loss rate of the paste meets the following criteria of "AA," "A," or "B," it can be said that the paste has a low content of volatile components and is good. The results are shown in Table 1. (Evaluation criteria) AA: Thermogravimetric reduction rate is 0% or more and 1.0% or less A: Thermal weight loss rate is greater than 1.0% and less than 3.0% B: Thermal weight loss rate is greater than 3.0% and less than 5.0% C: Thermal weight loss rate is greater than 5.0%

[0096] <Insulation resistance> Eight sheets of polyimide tape (125 μm thick) manufactured by Uniontape were stacked and attached to copper foil to create a 7 cm square frame. The paste was poured into the frame, and the paste layer was heated at 100°C in a nitrogen atmosphere for 1 hour. After that, the temperature was raised to 150°C, and the temperature was maintained for 20 minutes. Next, another copper foil was placed on top of the paste layer, and the paste layer was maintained at 165°C and 2 MPa for 30 minutes under vacuum conditions using a vacuum press (manual hydraulic vacuum heating press, 1A31, manufactured by Imoto Machinery Co., Ltd.) The temperature was then raised to 180°C, and the temperature was maintained for 1 hour to harden the paste layer. Next, the copper foils on both the top and bottom surfaces were peeled off to obtain a sample plate made of the cured paste. The film thickness of the sample plate (cured paste) was 1 mm. The volume resistivity of the sample plate was calculated from the sheet resistance measured with a four-point needle sheet resistance meter and the film thickness determined with a micrometer. The insulation resistance (insulation properties) was evaluated according to the following criteria. The results are shown in Table 1. If the following criteria are met, the insulation properties are good. (Evaluation criteria) A: Volume resistivity is 1.0 x 10 12 μΩ cm or more B: Volume resistivity is 1.0 x 1011 μΩ cm or more, 1.0×10 12 Less than μΩ·cm C: Volume resistivity is 10 11 Less than μΩ·cm

[0097] (Evaluation of insulation reliability) Using a metal squeegee manufactured by Taku Giken Co., Ltd., the pastes obtained in the Examples and Comparative Examples were applied to a comb-shaped wiring substrate having a line and space pattern of 200 μm / 200 μm, using a polyimide tape thickness as a spacer. The paste layer was then heated in a nitrogen atmosphere at 100°C for 1 hour. The paste was then cured by increasing the temperature from room temperature to 180°C over 50 minutes under vacuum conditions in a reduced-pressure dryer (Yamato Scientific Co., Ltd., square-type constant-temperature vacuum dryer, DP32) and maintaining the temperature for 60 minutes, thereby forming a 100 μm-thick cured layer (insulating magnetic layer) on the wiring substrate. The wiring substrate having the cured material layer obtained as described above was used as a sample to measure the initial insulation resistance value and the insulation resistance value after an insulation resistance migration test. In the migration test, the sample was left for 500 hours under conditions of a temperature of 85°C, humidity of 85%, and an applied voltage of 12 V. The initial insulation resistance is 10 6 For five samples with an insulation resistance of 10 Ω or more after the migration test, 6 The percentage of samples with a resistance of 0.1Ω or more was examined to evaluate the insulation reliability between the wiring. Specifically, the insulation reliability was evaluated according to the following criteria. The results are shown in Table 1. If the following criteria are met, the insulation reliability is considered good. (Evaluation criteria) A: Insulation resistance value 10 6 5 out of 5 samples had a rate of Ω or higher B: Insulation resistance value 10 6 The percentage of Ω or higher was 4 out of 5 samples. C: Insulation resistance value 10 6 The percentage of samples with Ω or higher is 3 or less out of 5 samples

[0098] <Coefficient of thermal expansion (CTE)> Eight sheets of polyimide tape (125 μm thick) manufactured by Uniontape were stacked and attached to copper foil, creating a 7 cm square frame. The paste of the example was poured into the frame and preformed to obtain a paste layer. Preforming was performed by heating the paste at 100°C for 1 hour in a nitrogen atmosphere, then increasing the temperature to 150°C, maintaining the temperature, and heating for 20 minutes. Next, copper foil was placed on top of the paste layer, and the paste was maintained at 165°C and 2 MPa for 30 minutes under vacuum conditions using a vacuum press (manual hydraulic vacuum heating press, 1A31, manufactured by Imoto Machinery Co., Ltd.). The temperature was then increased to 180°C, and the temperature was maintained for 1 hour to harden the paste layer (film thickness 1 mm). On the other hand, since the paste of the comparative example contained an organic solvent, it was tested as follows. First, the paste was bar-coated onto the release-treated surface of a PET film using an applicator and heated at 120°C for 20 minutes to form a dried paste layer approximately 50 μm thick. This paste layer was peeled from the PET film and preformed into a 7 cm square, approximately 1.2 mm thick sheet by stacking or vacuum laminating. Next, eight sheets of polyimide tape (125 μm thick) manufactured by Uniontape were stacked and attached to copper foil to form a 7 cm square rectangular frame. The preformed paste layer was placed inside the frame, covered with copper foil, and maintained at 165°C and 2 MPa for 30 minutes using a vacuum press (manual hydraulic vacuum heating press, 1A31, manufactured by Imoto Machinery Co., Ltd.). Next, the temperature was raised to 180°C, and the temperature was maintained for 1 hour to harden the paste layer (film thickness 1 mm). Next, the copper foils on both the top and bottom surfaces of the cured paste layer were peeled off to obtain sample plates made of the cured pastes of the Examples and Comparative Examples. Sample pieces measuring 10 mm square were cut out from these sample plates. The CTE (coefficient of thermal expansion) of the sample pieces was measured using a TMA (a thermomechanical analyzer, TMA-Q400, manufactured by TA Instruments). The measurement was performed in the temperature range of 0 to 250°C at a heating rate of 10°C / min, and the linear expansion coefficient α1 (ppm / °C) in the region below the glass transition temperature was calculated. The CTE was evaluated based on the obtained α1 value according to the following criteria. The results are shown in Table 1. The CTE is considered good when the following criteria are met: "AA," "A," or "B." (Evaluation criteria) AA: α1 is 25 ppm / ℃ or less A: α1 exceeds 25 ppm / ℃ and is 30 ppm / ℃ or less B: α1 exceeds 30 ppm / ℃ and is 40 ppm / ℃ or less C: α1 exceeds 40 ppm / ℃

[0099] [Table 1]

[0100] As shown in Table 1, all of the pastes of the examples had a thermal weight loss rate of 5% or less, and the cured product exhibited excellent insulation resistance and insulation reliability. Furthermore, all of the pastes of the examples had a thermal weight loss rate of 5% or less, and although they contained a small amount of volatile components such as organic solvents (they were essentially free of organic solvents), they maintained a moderate fluidity and exhibited excellent application properties. Furthermore, all of the pastes of the examples were also favorable in terms of CTE.

[0101] On the other hand, the comparative pastes all had thermal weight loss rates exceeding 5%, resulting in poor insulation resistance and insulation reliability. The comparative pastes contained a large amount of organic solvent, which likely remained in the cured product even after heat curing, making them prone to short circuits in insulation reliability tests. While the reason for the low CTE achieved in the cured products of the examples is unclear, it is presumed that the thermal weight loss rate of the paste and the use of the curing agent are at least related. As seen in the examples and comparative examples, the use of aromatic amines or imidazoles as curing agents tends to result in better CTE results than cured products obtained using other curing agents. Generally, the thermal expansion coefficient is high when a liquid evaporates or when a gas becomes hot. However, the paste of the present invention is thought to have achieved a low CTE because organic solvents are less likely to remain in the cured product and voids due to volatile components are less likely to form.

[0102] From the above results, it can be seen that by forming a paste containing a metal element-containing powder, an epoxy group-containing compound, and a curing agent, and having a thermal weight loss rate of 5% or less after heat curing, it is possible to realize a paste that can form a cured product with excellent properties such as insulation. [Industrial Applicability]

[0103] A paste according to one embodiment of the present invention can be suitably used, for example, as a material for the magnetic core of an inductor or as a material for filling the spaces between the conductors of a coil, and can easily provide a molded product with excellent insulating properties.

Claims

1. A paste containing a metal element-containing powder including an Fe amorphous alloy powder having an insulating coating, an epoxy group-containing compound, and a curing agent, the insulating coated Fe amorphous alloy powder contains at least one alloy selected from the group consisting of an Fe—Si—B based alloy and an Fe—Si—B—P—Nb—Cr based alloy, and the content of the metal element-containing powder is 90 to 96 mass% based on the total mass of the paste; The epoxy group-containing compound includes an epoxy group-containing compound that is liquid at 25°C, the curing agent comprises at least one selected from the group consisting of 2,6-diamino-3,5-diethyltoluene, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 2-ethyl-4-methylimidazole; A paste having a thermal weight loss rate of 5% or less after heat curing at 180°C.

2. The paste of claim 1 further comprising a coupling agent.

3. 3. The paste according to claim 1, wherein the viscosity at 25°C is 1 Pa·s or more and 600 Pa·s or less.

4. The paste according to any one of claims 1 to 3, wherein the cured product has a thermal expansion coefficient of 40 ppm / °C or less.

5. The paste according to any one of claims 1 to 4, which is used for screen printing.

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