Substrate handling device with adjustable joints

Abstract

To provide an adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing.SOLUTION: The adjustable joint allows adjustment of the pitch and roll of an attached link. Such adjustment may align a pickup surface of an end effector in a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows correction of deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and / or installation errors.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates generally to gas phase reactors and systems. More particularly, the present disclosure relates to systems and methods for substrate handling during substrate processing, and in particular to a substrate transport linkage with adjustable joints for high temperature applications. [Background technology]

[0002] Gas-phase reactors, such as chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and atomic layer deposition (ALD) reactors, can be used for a variety of applications, including depositing and etching materials on substrate surfaces (e.g., semiconductor wafers). For example, gas-phase reactors can be used to deposit and / or etch layers on substrates to form semiconductor devices, flat panel display devices, photovoltaic devices, microelectromechanical systems (MEMS), and the like.

[0003] A typical gas-phase reactor system includes a reactor with a reaction chamber, one or more precursor and / or reactant gas sources fluidly connected to the reaction chamber, one or more carrier and / or purge gas sources fluidly connected to the reaction chamber, a gas injection system for delivering gases (e.g., precursor / reactant gases and / or carrier / purge gases) to the reaction chamber, and an exhaust source fluidly connected to the reaction chamber. During processing, one or more substrates are placed into the reaction chamber using a substrate handling device (e.g., a linkage or robotic arm). Once placed in the reaction chamber, the substrates may be exposed to various precursor and / or reactant gases. After processing, the substrates are removed from the reaction chamber using the handling device. During such processing, care must be taken to avoid physical damage and particulate contamination to the substrates, which are extremely fragile and prone to contamination.

[0004] Various systems are known for handling substrates within gas-phase processing systems. The specific application or environment in which the substrate is to be lifted often determines the type of pickup device (e.g., end effector). One class of pickup device, known as a Bernoulli wand, is typically used in high-temperature applications. Bernoulli wands utilize a downward gas jet from the wand toward the substrate to create a low-pressure region above the wafer, thereby lifting the substrate. This has the advantage that the substrate does not need to physically contact the pickup wand. Such a Bernoulli wand is shown in U.S. Pat. No. 5,080,549 to Goodwin et al. Another type of wafer pickup device is a simple paddle, which relies on gravitational friction between the substrate support surface and the backside of the substrate. In one variation, the paddle is subjected to a vacuum to hold the substrate on the paddle.

[0005] While such mechanisms work relatively well for placing and removing substrates from reactors, the moving parts of such mechanisms can provide a source of particle contamination. Furthermore, as the reaction temperature within the reactor continues to increase, the links of the substrate transport device that support the pickup device (e.g., end effector) are susceptible to slight deflections (e.g., sagging) that can result in deviations in the substrate position during transport. Such deviations can result in damage to the substrate. Therefore, improved mechanisms and techniques for transporting substrates are desirable.

[0006] All descriptions, including descriptions of problems and solutions described in this section, are included in this disclosure solely for the purpose of providing a context for the disclosure and should not be construed as an admission that any or all of the descriptions were known or constitute prior art at the time the invention was made. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] U.S. Patent No. 5,080,549 Summary of the Invention [Means for solving the problem]

[0008] This Summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail below in the Detailed Description of Exemplary Embodiments of this Disclosure. This Summary is not necessarily intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0009] Various embodiments of the present disclosure are directed to an adjustable joint for insertion into a linkage of a substrate handler utilized in substrate processing. The adjustable joint allows for adjustment of the pitch and roll of one of the links attached to the adjustable joint. Such adjustment can align the pickup surface of the end effector with a desired plane. Once adjusted, the joint can be locked to maintain the desired orientation of the attached link. The adjustable joint allows for compensation for deflection of the pickup surface of the end effector relative to the desired pickup plane due to sag caused by, for example, high temperature use, mechanical tolerances, and / or installation errors.

[0010] In one arrangement, an adjustable linkage-type substrate handling device is disclosed. The device includes at least first and second links, each extending between a proximal end and a distal end. These links are typically elongated links having a longitudinal axis extending between their proximal and distal ends. Adjacent links are attached by a revolute joint, about which the links can rotate. In this arrangement, the distal end of the first link is attached to the proximal end of the second link via the revolute joint. The distal end of the linkage (e.g., the second link or the next link) can support an end effector. To provide adjustment to one of the links, an adjustable joint can be disposed between the end of one of the links and the revolute joint. The adjustable joint includes a first body connectable to the revolute joint and a second body connectable to one of the links, such as the proximal end of the second link. The adjustable joint body can be connected at a selected contact angle to adjust the pitch and / or roll of the link connected to the second body. Such adjustment can provide a desired alignment for the end effector. Once the contact angle is selected, the body can be fixedly connected to maintain this orientation.

[0011] In this arrangement, the first and second bodies of the adjustable joint include mating surfaces. The first body may include an adjustment surface, and the second body may include a contact surface. The adjustment surface abuts the contact surface when the bodies are rigidly connected. One or more adjusters (e.g., set screws) may selectively extend through the adjustment surfaces. When extending above the adjustment surfaces, the adjusters provide a gap between the adjustment surfaces and the contact surface when the first and second bodies are fixedly attached. That is, the contact angle between the first and second bodies can be adjusted based on the position of the adjusters relative to the adjustment surfaces. Such adjustment can be in a first axis and / or a second axis.

[0012] In another arrangement, a linkage-type substrate handling apparatus is disclosed that reduces the potential for substrate contamination. The apparatus includes at least a first link and a second link connected by a rotary joint having at least a first gear that transmits rotational motion from the first link to the second link. In the arrangement, a distal end of the first link is attached to a proximal end of the second link via the rotary joint. The distal end of the apparatus supports an end effector configured to engage and disengage a substrate (e.g., a semiconductor wafer). The end effector is spaced from all gearing of the substrate handling apparatus to reduce potential sources of particle contamination. In the arrangement, an edge (e.g., a proximal edge) of the end effector is at least 100 mm from any gearing of the substrate handler. In the arrangement, the end effector is at least 200 mm from any gearing of the substrate handler.

[0013] These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of certain embodiments, taken in conjunction with the accompanying drawings, and the present disclosure is not limited to any particular embodiments disclosed.

[0014] A more complete understanding of the exemplary embodiments of the present disclosure can be obtained by reference to the detailed description and claims when considered in conjunction with the following illustrative drawings. [Brief explanation of the drawings]

[0015] [Figure 1] 1 shows a reactor system. [Figure 2] 2A and 2B show the substrate handling device in retracted and extended positions, respectively. [Figure 3] 3A-3C show side views of a link-type substrate handler in undeflected, deflected, and compensated positions, respectively. [Figure 4A] 1 illustrates one embodiment of a dual arm substrate handler. [Figure 4B] 4B shows a partial cross-sectional view of the substrate handler of FIG. 4A. [Figure 5] 1 illustrates an exemplary embodiment of an adjustable joint according to the present disclosure. [Figure 6] 6A-6D show a first series of adjustments of the adjustable joint of FIG. [Figure 7] 7A and 7B show a second series of adjustments of the adjustable joint of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of the illustrated embodiments of the present disclosure.

[0017] The descriptions of exemplary embodiments provided below are merely exemplary and intended for purposes of explanation only, and the following descriptions are not intended to limit the scope of the disclosure or the claims. Moreover, the recitation of multiple embodiments having described features is not intended to exclude other embodiments having additional features or incorporating different combinations of the described features.

[0018] As used herein, "substrate" may refer to any material having a surface onto which a material can be deposited. The substrate may include a bulk material, such as silicon (e.g., single crystal silicon), or may include one or more layers overlying a bulk material. Additionally, the substrate may include various forms formed in or on at least a portion of the layers of the substrate.

[0019] Furthermore, in this disclosure, any two variables can constitute a workable range for that variable, and any stated range may include or exclude the endpoints. Furthermore, any value of a stated variable (whether or not it is indicated as "about") refers to an exact or approximate value, including equivalents, and may refer to an average, median, representative value, or majority, etc. Furthermore, in this disclosure, the terms "comprise," "comprised of," and "having" independently refer, in some embodiments, to "typically or broadly include," "comprise," "consist essentially of," or "consist." In this disclosure, any defined meaning does not necessarily exclude, in some embodiments, the ordinary and customary meaning.

[0020] Referring now to the figures, Figure 1 shows an exemplary reactor system 100. The reactor system 100 can be used for a variety of applications, such as chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), clean processes, etch processes, etc. In one exemplary embodiment, the system is an epitaxial reactor system, although unless otherwise stated, the embodiment and the present disclosure are not limited thereto.

[0021] In the illustrated example, reactor system 100 includes a reactor 102 having four separate reaction chambers 104a-d. In this embodiment, a first substrate handler 110 (e.g., a linkage or robotic arm) is used to move substrates (e.g., semiconductor wafers) from one or more cassettes 112 to an intermediate loading station 114. The cassettes 112 (e.g., front-opening unified pods "FOUPs") may each hold multiple substrates and engage a loading station for loading the cassettes into system 100. A second substrate handler 120 is then used to move the substrates from the intermediate loading station 114 to the reaction chambers 104a-d. In the system of FIG. 1, four substrates may be processed simultaneously. However, it will be understood that the system may be configured to process more or fewer substrates (e.g., a single substrate). System 100 may further include a gas injection and purge system (not shown) fluidly coupled to the processing station and reaction chamber 102 and / or a heating system (not shown) for raising the temperature within the processing station to a desired processing temperature. In one embodiment, the heating system may be constructed and arranged to maintain a temperature between 20 and 2000°C. Additionally, the system may include a pressure system (not shown) constructed and arranged to reach and / or maintain a pressure within the reaction chamber and / or processing station between 0.001 and 700 Torr. Additionally, system 100 may include a controller (not shown) configured to control operation of the system.

[0022] In the illustrated embodiment, the substrate handler 120 disposed within the reaction chamber 102 is a controllable arm having a first link 122 and a second link 124 connected via a first revolute joint or joint 126 about which the link may rotate. More specifically, the distal end of the first link 122 connects to the proximal end of the second link 124. The proximal end of the first link 122 is coupled to a base member 128 via a second revolute joint or joint 130. The free or distal end of the second link 124 supports a substrate pickup device or end effector 132. In one embodiment, the end effector 132 is a Bernoulli wand. A Bernoulli wand utilizes a gas jet ejecting downward from the wand toward the underlying substrate to create a region of low pressure above the wafer, thereby lifting the substrate. However, it will be understood that the present disclosure is not limited to any particular end effector. The rotary joints 126, 130 allow the substrate handler 120 to extend and retract as shown in Figures 2A and 2B, respectively. The rotary joints may have various bearings, shafts, gears, and / or actuators that affect the extension and retraction of the substrate handler to a desired position.

[0023] As shown in the exemplary embodiment of FIG. 1 , one substrate handler 120 is positioned within the reaction chamber 102. Such placement within the reaction chamber 102 exposes the substrate handler 120 to the high temperatures necessary for substrate processing. By way of example, some epitaxial reactor systems operate continuously at temperatures exceeding 500°C or even 700°C. At such high temperatures, the substrate handler 120 may experience undesirable deflection or sagging between its base end and its distal end that supports the end effector. Alternatively, mechanical tolerances and / or installation errors may result in undesirable deflection. This is illustrated in FIGS. 3A and 3B , which show simplified side views of the substrate handler 120 in an extended position. The base or proximal end of the first link 122 is connected to a base member 128 by a second rotary coupling 130. The first and second links 122, 124, connected by a first rotational joint 126, are cantilevered from a base member 128 that supports an end effector 132 at the distal end of the second link 124. FIG. 3A shows the substrate handler 120 without flexure. In an arrangement with no flexure along the length of the substrate handler 120, the pickup surface (e.g., bottom surface) of the end effector 132 is aligned with the desired pickup plane A-A'. That is, the generally planar bottom surface of the end effector 132 is disposed substantially within the reference plane A-A'. Otherwise, without flexure, the vertical position and / or tilt of the end effector is in a desired position that allows for accurate engagement and placement of the substrate.

[0024] In configurations where deflection exists due to high temperatures or other mechanical misalignment, the pickup surface of the end effector 132 may become misaligned with the desired pickup plane A-A'. As an example, high temperatures can result in drooping of the distal end of the substrate handler 120. This is shown in FIG. 3B. As shown, in high-temperature applications, the rotational joints between the links may allow some movement between these components. Alternatively or additionally, the cantilever links themselves may deflect slightly at such high temperatures (e.g., under gravity). This can result in a displacement of the planar pickup surface B-B' of the end effector 132 relative to the desired pickup plane A-A'. That is, the generally planar pickup surface of the end effector 132 may be displaced (e.g., vertically and / or tilted) relative to the reference plane A-A'. Such a displacement can impair the accuracy with which the end effector engages and releases the substrate. Otherwise, the end effector 132 may become misaligned from its desired position, potentially causing damage to the substrate during substrate processing.

[0025] To account for such displacements, the present disclosure incorporates an adjustable joint 150 with at least one of the links 122, 124 of the substrate handler 120. The adjustable joint allows for the orientation of one of the links to be adjusted to a desired orientation (e.g., pitch and roll), at which time the adjustable joint can be locked to maintain that orientation. In one embodiment shown in FIG. 3C , the adjustable joint 150 is disposed between and connects the second link 124 to the first link 122. More specifically, the body 152 of the adjustable joint 150 is attached to a first rotation joint 126 supported by the distal end of the first link 122. That is, a proximal portion of the joint body 152 engages with the rotation joint 126, while a distal portion of the joint body 152 is configured to engage with the proximal end 142 of the second link 124. As discussed more fully below, the joint 150 allows for the height of the distal end 144 of the second link 124 to be adjusted. That is, the joint 150 allows for adjustment of the "pitch" of the second link 124 along its longitudinal axis C-C', which extends between the proximal end 142 and the distal end 144. Additionally, the joint 150 allows for adjustment of the angular orientation of the second link 124 about its longitudinal axis C-C'. Alternatively, the joint allows for adjustment of the "roll" of the second link 124. Incorporating the adjustable joint 150 into the substrate handler 120 allows for alignment of the generally planar pickup surface of the end effector 132 with a desired pickup plane A-A'.

[0026] In the embodiment shown in FIG. 3C , the adjustable joint 150 adjusts the distal end 144 of the second link 124 upward, and optionally about the longitudinal axis C-C′ of the second link 124, to align the pickup surface of the end effector 132 with the desired pickup plane A-A′. That is, FIG. 3C shows the substrate handler 120 in a corrected position. Such adjustment allows for a so-called “negative displacement,” in which the end effector pickup surface is initially displaced below the desired pickup plane. Notably, the adjustable joint may also allow for correction of a “positive displacement” (not shown), in which the end effector pickup surface is displaced above the desired pickup plane. During operation, the amount of positive or negative displacement can be measured and corrected during initial setup of the substrate handler. Alternatively, the positive or negative displacement can be measured and corrected after the substrate handler is deployed.

[0027] FIG. 4A illustrates another embodiment of a linkage-type substrate handler. More specifically, a dual-arm substrate handler 220. The substrate handler includes a linkage including a first pair of first links 222a, 222b, each having a proximal end connected to a base member 228 via a rotary connection. The distal ends of the first pair of first links 222a, 222b are connected to a gear module 270 via first and second rotary joints 226a, 226b, respectively. The first and second rotary joints 226a, 226b are attached to the proximal ends of a second pair of second links 224a, 224b, respectively, via a pair of adjustable joints 250a, 250b. As shown, the adjustable joints 250a, 250b are connected to the proximal ends of the second pair of second links 224a, 224b. As discussed further herein, each adjustable joint 250a or 250b allows for adjustment of the pitch and / or roll of the second link 224a or 224b connected to the adjustable joint. The distal ends of the second pair of links 224a, 224b are connected to the third link 240 via a pair of rotational bearings 242a, 242b. As shown, the second links 224a, 224b are attached at first and second spaced locations along the length of the proximal portion of the third link 240. The distal end of the third link 240 supports the end effector 232. As mentioned above, the end effector may be a Bernoulli wand; however, this is not a requirement. The substrate handler 220 may further include various gas conduits 260 extending from the base 228 to the end effector 232. These gas conduits may be external to the links. Alternatively, the gas conduits may extend through the interior of one or more links and pass through the center of one or more rotational connections. Such gas lines can provide airflow to control the lifting and release of the substrate. For example, the gas lines can provide airflow through the end effector 232 when utilizing a Bernoulli wand. Additionally, such gas lines 260 can provide purge gas as well as provide vacuum to the end effector.

[0028] The links are driven by a shaft 230 connected to the proximal end of one of the first links. That is, one of the first links is a drive bar 222a connected to a base member 228 via the shaft 230. The shaft 230 is fixedly connected to the proximal end of the drive bar 222a, passes through the base member 228, and can be rotated by an actuator (e.g., a motor; not shown). Such rotation imparts motion to the substrate handler. The other link 222b is attached to the base member 228 by a rotation bearing 234. When the shaft 230 rotates the adjuster bar 222a, the distal end of the drive bar 222a imparts motion onto a gear module 270 via a first rotation coupling 226a. In the illustrated embodiment, the lower ends of the first and second rotation couplings 226a, 226b are connected to the distal ends of the links 222a, 222b. As best seen in the partial cross-sectional view of FIG. 4B, the first and second rotary joints 226a, 226b further include a pair of mesh gears 236a, 236b. In this arrangement, motion imparted by the drive bar 222a, which may be fixedly attached to the shaft of the first rotary joint 226a, results in rotation of the gears about their respective rotational axes. One of the gears 236b has a counter-rotation center so that the upper ends (discharge ends) of the rotary joints 226a, 226b rotate in a common direction (e.g., clockwise or counterclockwise). As shown in FIG. 4A, the upper ends of the first and second rotary joints 226a, 226b connect to first and second adjustable joints 250a, 250b, respectively. Thus, when the shaft 230 rotates the drive bar 222a, the first pair of links 222a, 222b rotate simultaneously, imparting a common rotation to the first and second rotary joints 226a, 226b. These revolute joints 226a, 226b simultaneously rotate the second pair of second links 224a, 224b via adjustable joints 250a, 250b. The second links 224a, 224b impart rotation of the third link 240 about a vertical axis (not shown) disposed between a pair of revolute bearings 242a, 242b that attach the distal ends of the second links 224a, 224b to the third link 240. Similarly, the end effector 232, which is fixedly connected to the third link 240, rotates about the vertical axis between the revolute bearings 242a, 242b.In operation, the substrate handler 220 is configured to move the end effector 232 between predetermined lifting and release positions.

[0029] 2A-3B, the substrate handler is susceptible to undesired deflection due to, for example, thermal sag and / or mechanical misalignment. To allow for adjustment of the pickup surface of the end effector 232 with a desired pickup or release plane, the substrate handler utilizes adjustable joints 250a, 250b that connect the second links 224a, 224b to the first links 222a, 222b via rotational joints 226a, 226b.

[0030] FIG. 5 shows an exploded perspective view of one of adjustable joints 250a or 250b (hereinafter, 250) and one of the corresponding second links 224a or 224b (hereinafter, 224). The illustrated adjustable joint 250 includes two main components that collectively allow the joint to adjust the pitch and / or roll of the distal end 246 of the link 244. Specifically, the joint 250 includes a first body connectable to a rotary joint and a second body connectable to a link. The first and second bodies are configured to rigidly connect to one another along mating surfaces. The interface between these mating surfaces can be adjusted to adjust the contact angle therebetween, preferably in at least two axes. Through such adjustment, the pitch and / or roll of the attached link can be adjusted. The first body or tilt plate 252 has an adjustment surface 256 configured to engage a substantially planar contact surface 257 (e.g., top surface) of the second body or base plate 258. The tilt plate 252 of the joint 250 has a first end 254 configured to attach to one of the rotary joints. In the illustrated embodiment, this first end 254 includes a circular recess with one or more fastener openings, allowing the tilt plate 252 to be fixedly attached to the upper end (e.g., shaft) of the rotary joint. The second end of the tilt plate 252 includes an adjustment surface 256. In the illustrated embodiment, the tilt plate 252 is generally L-shaped between its first and second ends. However, it will be understood that the shape may vary based on the desired application and / or substrate handler configuration. The base plate 258 is attached to the proximal end of the link 224 via a connector 262.

[0031] The adjustment surface 256 of the tilt plate 252 and the contact surface 257 of the base plate 258 each include a plurality of apertures. More specifically, a first set of fastener apertures 266a extends through the adjustment surface 256 of the tilt plate 252. A matching set of fastener apertures 266b extends through the contact surface of the base plate 258. More specifically, these fastener apertures extend through the tilt plate 262 and the base plate 258. Fasteners, such as bolts 272, may extend through the matching set of fastener apertures to firmly affix the adjustment surface 256 of the tilt plate 252 to the contact surface 257 of the base plate 258. In addition to the fastener apertures, two adjustment apertures 264 extend through the adjustment surface 256 of the tilt plate 252. The adjustment apertures 264 are configured to receive two threaded set screws 268. The adjustment opening 264 is internally threaded to allow the set screw 268 to be advanced to a desired position relative to the adjustment surface 256. The base plate 258 does not have any mating adjustment openings. Therefore, the tip of any set screw that advances through the adjustment opening 264 beyond (e.g., upward) the adjustment surface 256 of the tilt plate 252 will engage the upper surface of the base plate 258 when the tilt plate 252 and base plate 258 are connected. The placement of the tip of the set screw 268 between the adjustment surface 256 and the contact surface 257 adjusts the angular interface (e.g., contact angle) therebetween.

[0032] 6A-6D each show a partial cross-sectional view of the joint 250 taken through one of the adjustment openings 264. As shown, the tilt plate 252 may first be positioned above the base plate 258 to align the fastener openings 266a, 266b. See FIG. 6A. The tilt plate 252 may then be advanced to contact the adjustment surface 256 against the contact surface 257 of the base plate 258. One or more threaded bolts 272 may pass through the aligned fastener openings, engage a mating connector (e.g., a threaded nut), and be tightened to securely affix the tilt plate 252 to the base plate 258. See FIG. 6B. Once securely affixed, the adjustable joint 250 is locked and no longer allows movement during use of the substrate handler. In the illustrated embodiment, the set screw 268 is advanced (e.g., upward) beyond the surface of the adjustment surface 256 to align the base plate 258 to an intermediate position such that the contact angle between at least a portion of the adjustment surface and the contact surface is essentially zero. This is indicated by the dotted reference line in FIG. 6B . In such an arrangement, the connector 262 attached to the base plate 258 and any links attached to the connector 262 can be held in an intermediate pitch position (e.g., level) when the bolt 272 is tightened. If adjustment is desired, the set screw 268 can be further advanced or retracted before tightening the bolt 272. As shown in FIG. 6C , advancing the set screw 268 beyond the intermediate position results in a change (e.g., an increase) in the contact angle of the connection between the adjustment surface 256 and the contact surface 257, as indicated by the two dotted reference lines in FIG. 6C . This adjustment tilts the base plate 258, the connector 262, and any connected links upward when the base plate 256 and the tilt plate 252 are rigidly connected. This increases the pitch of the distal ends of the connected links. As shown in Figure 6D, retracting the set screw below the intermediate position results in a change (e.g., a decrease) in the contact angle of the connection between adjustment surface 256 and contact surface 257, as shown by the two dotted reference lines in Figure 6D. This tilts the base plate, connector 262, and any connected links downward, thereby decreasing the pitch of the distal ends of the connected links.6B-6D, adjustment of the set screw allows adjustment of the generally planar contact surface of the base plate along a first axis. While the adjustment surface 256 of the tilt plate 252 is shown as having two angled planes that increase and decrease the pitch of the attached link, it will be understood that the adjustment surface may be formed from a single plane. In such an arrangement, the adjustable joint may be limited to increasing the pitch of the attached link (e.g., to address droop) by, for example, advancing the set screw beyond the single planar adjustment surface.

[0033] In addition to increasing or decreasing the pitch of the attached link along its longitudinal axis between its proximal and distal ends, the joint 250 can also adjust the roll of the attached link about its longitudinal axis. This is illustrated in FIGS. 7A and 7B, which show partial cross-sectional views taken through two adjustment openings 264. As illustrated in FIG. 7A, when two set screws 268 are advanced equally through the adjustment surfaces 256 of the tilt plate 252, the base plate 258 can be substantially horizontal (e.g., midway), as illustrated by the reference line aligned with the contact surface 257 of the base plate 258 and the adjustment surfaces 256 of the tilt plate 252. If roll about the longitudinal axis of the attached link is desired, the set screws 268 can be advanced unequal amounts through the adjustment surfaces 256 of the tilt plate 252, which, when locked, tilts the base plate secured to the tilt plate 252. Tilting the base plate rotates the connector and connected links. In the illustrated embodiment of Figures 7A and 7B, adjustment of the set screws allows adjustment of the generally planar contact surface of the base plate along a second axis substantially transverse to the first axis adjustment illustrated in Figures 6B-6D. It will be further understood that the two set screws can be adjusted to obtain a desired tilt of the end effector pickup surface. In the embodiment of Figure 4A, the first and second adjustable joints can be independently adjusted to provide a desired positioning of the end effector pickup surface.

[0034] In addition to the ability to adjust the end effector pickup surface, the proposed substrate handler offers another useful benefit. Namely, the proposed link-type substrate handler eliminates any gearing from the end effector side of the link. That is, meshes of interlocking gears can generate particles during movement that can contaminate substrates during processing. To reduce or eliminate this potential contamination source, any movable (e.g., rotary) connections near the end effector do not include any interlocking gears. As illustrated in FIGS. 4A and 4B, the substrate handler is configured to utilize a single set of gears 236a, 236b on rotary joints 226a, 226b that connect the first set of links 222a, 222b to the second set of links 224a, 224b via an adjustable joint. In the proposed embodiment, the only connection of the second link 224a, 224b to the third link 240 (i.e., near the end effector) is via two rotary bearings 242a, 242b. These rotational bearings 242a, 242b enable rotational movement between the second links 224a, 224b and the distal end of the third link 240. In one embodiment, these rotational bearings include inner and outer rings with silicon nitride ceramic balls between them. The ceramic balls have four contact points on the rings to allow for flawless rotation without shaft deformation or dislocation. This rotational bearing configuration achieves improved performance related to particle issues because the ceramic balls do not introduce metal contamination. This means that there are no gears or other similar devices near the end effector 232 that could be a source of particle contamination. In one embodiment, there are no gear-type components within at least 100 mm of the end effector 232. In a further embodiment, there are no gear-type components within at least 200 mm of the end effector. Alternatively, there may be no gear-type components within a distance of the end effector that is at least half the maximum cross-sectional dimension of the end effector. In another embodiment, there may be no gear-type components within a distance at least equal to the maximum cross-sectional dimension of the end effector.

[0035] While exemplary embodiments of the present disclosure are described herein, it should be understood that the present disclosure is not limited thereto. For example, while a substrate handler apparatus having one or more adjustable joints is described with reference to various specific configurations, the present disclosure is not necessarily limited to these examples. Various changes, modifications, and improvements can be made to the systems and methods described herein without departing from the spirit and scope of the present disclosure.

[0036] The subject matter of the present disclosure includes all novel and non-obvious combinations and subcombinations of the various systems, components, and configurations, as well as other features, functions, operations, and / or properties disclosed herein, and any and all equivalents thereof.

Claims

1. A linkage-type substrate handling device, comprising: a first link extending between the proximal end and the distal end; a second link extending between the proximal end and the distal end; a revolute joint disposed between a distal end of the first link and a proximal end of the second link, the first link and the second link being configured to rotate about the revolute joint; An adjustable joint, a first body connected to the rotary joint; and an adjustable joint including a second body connected to a proximal end of the second link, wherein the first body and the second body are rigidly connectable at a contact angle selected to adjust the pitch or roll of the second link about a longitudinal axis extending between the proximal and distal ends of the second link; an end effector supported by a distal end of the second link; the first body includes an adjustment surface and the second body includes a contact surface, the adjustment surface being positioned against the contact surface when the first body and the second body are rigidly connected; The first body is at least a first adjustment opening through the adjustment surface, the first adjustment opening being internally threaded; and the apparatus further comprising a first set screw disposed within the first adjustment aperture, the first set screw configured to advance and retract through the first adjustment aperture to selectively position a tip of the first set screw above or below the adjustment surface.

2. 2. The device of claim 1, wherein the distance of the tip of the first set screw on the adjustment surface adjusts the contact angle between the adjustment surface and the contact surface in a first axis when the first body and the second body are rigidly connected.

3. The first body is at least a second adjustment opening through the adjustment surface, the second adjustment opening being internally threaded; and 10. The apparatus of claim 1, further comprising a second set screw disposed within the second adjustment opening, the second set screw configured to advance and retract through the first adjustment opening to selectively position a tip of the second set screw above or below the adjustment surface.

4. 4. The device of claim 3, wherein the distance between the tips of the first and second set screws on the adjustment surface adjusts the contact angle between the adjustment surface and the contact surface in two axes when the first body and the second body are rigidly connected.

5. The device of claim 1 , wherein the contact surface is a flat surface.

6. The apparatus of claim 5 , wherein the conditioning surface comprises a first planar surface and a second planar surface disposed at an angle.

7. The device of claim 1 further comprising a plurality of fasteners connecting the first body to the second body.

8. 2. The apparatus of claim 1, wherein the first link comprises a pair of generally parallel first links, the second link comprises a pair of generally parallel second links, the revolute joint comprises a first revolute joint and a second revolute joint, and the adjustable joint comprises a first adjustable joint and a second adjustable joint.

9. The apparatus of claim 1 , wherein the revolute joint includes at least a first gear that transfers motion from the first link to the second link.

10. 10. The apparatus of claim 9, wherein the end effector supported by the distal end of the second link is spaced at least 200 mm from any gear.

11. 1. An adjustable joint configured for insertion into a linkage of a substrate handling apparatus, comprising: a first body having a first end configured to attach to one of the revolute joint and the elongate link, the first body having an adjustment surface; a second body having a first end configured to attach to the other of the revolute joint and the elongate link, the second body having a contact surface, the adjustment surface disposed against the contact surface when the first body and the second body are rigidly connected; at least a first set screw disposed within a first adjustment opening extending through the adjustment surface, the first set screw configured to advance and retract through the first adjustment opening to selectively position a tip of the first set screw above or below the adjustment surface; a distance of the tip of the first set screw on the adjustment surface adjusts a contact angle between the adjustment surface and the contact surface in at least a first axis when the first body and the second body are rigidly connected; The adjustable joint, wherein the contact surface is a flat surface and the adjustment surface has at least a first flat surface and a second flat surface.

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