Parts Inspection Equipment

Abstract

Provided is a component inspection device that suppresses a decrease in the accuracy of component inspection and a decrease in the processing amount of component inspection. A component inspection device 1 inspects components while conveying the components and comprises: a linear feeder 20 that conveys components by using vibration at a first frequency; a turntable 30 that conveys the components conveyed by the linear feeder 20; an inspection controller 70 that inspects components on the turntable 30; and a first sensor 61 that detects components on the turntable 30. The inspection controller 70 adjusts the first frequency of vibration of the linear feeder 20 on the basis of the interval between components on the turntable 30, the components detected by the first sensor 61.

Description

[Technical Field]

[0001] The present invention relates to a component inspection device. [Background technology]

[0002] There is a device that performs a visual inspection of surface-mounted electronic components (also called chip components) such as multilayer ceramic capacitors. Patent Document 1 discloses a visual inspection device as such a component inspection device. The visual inspection device disclosed in Patent Document 1 includes a linear feeder that transports electronic components, a turntable that rotates and transports the electronic components transported by the linear feeder, and multiple imaging devices that capture images of six sides of the electronic components on the turntable, and performs a visual inspection of the six sides of the electronic components while transporting them.

[0003] The visual inspection device disclosed in Patent Document 1 uses a linear feeder to transport electronic components using vibration, thereby charging the electronic components, and a turntable uses static electricity to electrostatically attract and rotate the electronic components for transport. The turntable's transport speed is faster than that of the linear feeder. This allows for spacing between electronic components on the turntable, enabling visual inspection of the end faces of the electronic components in the transport direction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-44579 Summary of the Invention [Problem to be solved by the invention]

[0005] In such component inspection devices, the spacing between electronic components on the turntable can fluctuate due to factors such as fluctuations in the turntable's conveying speed or component clogging in the linear feeder. If the spacing between electronic components becomes narrow, for example, the imaging device will be unable to capture images of the end faces of the electronic components, reducing the accuracy of the visual inspection of the electronic components. On the other hand, if the spacing between electronic components becomes wide, for example, the throughput of the visual inspection of the electronic components will decrease.

[0006] An object of the present invention is to provide a component inspection device that suppresses a decrease in component inspection accuracy and a decrease in component inspection throughput. [Means for solving the problem]

[0007] (1) A component inspection device according to the present invention inspects components while transporting them, and includes a linear feeder that transports the components by vibrating at a first frequency, a turntable that transports the components transported by the linear feeder, an inspection controller that inspects the components on the turntable, and a first sensor that detects the components on the turntable. The inspection controller adjusts the first frequency of vibration of the linear feeder based on the spacing between the components on the turntable detected by the first sensor.

[0008] (2) The component inspection device described in (1) may further include a first piezoelectric element that supplies vibration of the first frequency to the linear feeder, and the inspection controller may adjust the first frequency of vibration of the linear feeder by adjusting the voltage of the first piezoelectric element.

[0009] (3) In the component inspection device described in (1) or (2), the inspection controller may adjust the first frequency of vibration of the linear feeder so that the spacing between the components on the turntable approaches a first target value.

[0010] (4) In the component inspection device described in any one of (1) to (3), the inspection controller may calculate a plurality of inter-component distances for a plurality of the components on the turntable, calculate a median of the calculated inter-component distances, and adjust the first frequency of vibration of the linear feeder so that the calculated median approaches a first target value.

[0011] (5) The component inspection device described in any one of (1) to (4) may further include a ball feeder that transports the components to the linear feeder by vibrating at a second frequency, and a second sensor that detects the components on the linear feeder, and the inspection controller may adjust the second frequency of vibration of the ball feeder based on the occupancy rate of the components on the linear feeder detected by the second sensor.

[0012] (6) The component inspection device described in (5) may further include a second piezoelectric element that supplies vibration of the second frequency to the ball feeder, and the inspection controller may adjust the second frequency of vibration of the ball feeder by adjusting the voltage of the second piezoelectric element.

[0013] (7) In the component inspection device described in (5) or (6), the inspection controller may adjust the second frequency of vibration of the bowl feeder so that the occupancy rate of the components on the linear feeder is equal to or greater than a second target value.

[0014] (8) In the component inspection device described in (7), the second target value may be 95%. [Effects of the Invention]

[0015] According to the present invention, it is possible to suppress a decrease in the accuracy of component inspection and a decrease in the throughput of component inspection. [Brief explanation of the drawings]

[0016] [Figure 1]1 is a schematic plan view of an example of a component inspection device according to an embodiment of the present invention, viewed from above; [Figure 2] 2 is a schematic plan view showing an enlarged view of a portion II in the component inspection device shown in FIG. 1. [Figure 3] 2 is a schematic side view of the part inspection device shown in FIG. 1, as seen from the side, with a portion II enlarged. FIG. [Figure 4] FIG. 2 is a schematic perspective view of the exterior of the component. DETAILED DESCRIPTION OF THE INVENTION

[0017] An example of an embodiment of the present invention will be described below with reference to the accompanying drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0018] Fig. 1 is a schematic plan view of an example of a component inspection device according to this embodiment, seen from above, Fig. 2 is a schematic plan view enlarging part II of the component inspection device shown in Fig. 1, and Fig. 3 is a schematic side view of the component inspection device shown in Fig. 1, seen from the side, and is a schematic side view enlarging part II. An XY Cartesian coordinate system is shown in Figs. 1 to 3.

[0019] 1 to 3 is an apparatus that inspects and selects non-defective electronic components 3 while sequentially conveying them. The component inspection apparatus 1 includes a bowl feeder 10, a linear feeder 20, a turntable 30, a plurality of imaging devices 40, a discharge mechanism 50, a first sensor 61, a second sensor 62, a third sensor 63, and an inspection and selection controller 70.

[0020] The electronic component 3 is a surface-mount electronic component (also referred to as a chip component) such as a multilayer ceramic capacitor. As shown in Fig. 4, the electronic component 3 includes a laminate 3a in which multiple dielectric layers made of ceramic material and one or multiple conductor layers are stacked, and two external electrodes 3b disposed on each of the two end faces of the laminate 3a. The laminate 3a, i.e., the electronic component 3, is shaped like a rectangular parallelepiped and has two main surfaces TS1 and TS2 that face each other in the stacking direction, two side surfaces WS1 and WS2 that face each other in a width direction that intersects the stacking direction, and two end surfaces LS1 and LS2 that face each other in a length direction that intersects the stacking direction and the width direction.

[0021] The dimensions of the electronic component 3 are not particularly limited, but may be, for example, 3.2 mm to 0.1 mm in length, 1.6 mm to 0.05 mm in width, and 1.6 mm to 0.05 mm in stacking direction. Note that these dimensions may vary depending on the tolerance.

[0022] The electronic component 3 is not limited to the multilayer ceramic capacitor using the dielectric ceramic described above, but may be various other electronic components such as a piezoelectric component using a piezoelectric ceramic, a thermistor using a semiconductor ceramic, or an inductor using a magnetic ceramic.

[0023] As shown in FIGS. 1 to 3, the ball feeder 10 aligns and conveys a plurality of electronic components 3 supplied by, for example, a hopper. The hopper is a device that detects a shortage of electronic components 3 in the ball feeder 10 and automatically replenishes the ball feeder 10 with electronic components 3, thereby maintaining a constant number of electronic components 3 in the ball feeder 10. A sensor may be provided to detect the amount of electronic components 3 supplied to the ball feeder 10. As such a sensor, a third sensor 63 that detects electronic components 3 on the ball feeder 10, which will be described later, may be used.

[0024] Ball feeder 10 is provided with a vibration mechanism 12 that supplies vibrations of a second frequency to ball feeder 10. An example of vibration mechanism 12 is a piezoelectric element (second piezoelectric element) that generates vibrations of a frequency corresponding to a voltage. Ball feeder 10 has a circular outer shape. By using the vibrations of the second frequency, ball feeder 10 conveys electronic components 3 in a spiral alignment while causing them to move in a circular motion from the center of the circle outward.

[0025] The linear feeder 20 sequentially linearly conveys the plurality of electronic components 3 aligned and conveyed by the bowl feeder 10. The linear feeder 20 is provided with a vibration mechanism 22 that supplies vibration of a first frequency to the linear feeder 20. An example of the vibration mechanism 22 is a piezoelectric element (first piezoelectric element) that generates vibration of a frequency corresponding to a voltage. It is preferable that the linear feeder 20 is inclined with respect to the horizontal plane. The linear feeder 20 conveys the electronic components 3 by the vibration of the first frequency.

[0026] The linear feeder 20 is preferably made of a material such as SUS, etc. This allows the electronic components 3 to be charged when the linear feeder 20 conveys the electronic components 3 by vibration.

[0027] The turntable 30 sequentially rotates and conveys the plurality of electronic components 3 conveyed by the linear feeder 20. As shown in FIGS. 1 and 2, the turntable 30 has a guide mechanism 32 on the upstream side, which guides the electronic components 3 from the linear feeder 20 to a rotary conveyance locus 31. The turntable 30 conveys the electronic components 3 along the rotary conveyance locus 31.

[0028] 3, an electrostatic chucking mechanism 34 is preferably provided below the turntable 30. This allows the electrically charged electronic components 3 in the linear feeder 20 to be electrostatically attracted and transported.

[0029] The conveying speed of the turntable 30 is faster than the conveying speed of the linear feeder 20. This allows the electronic components 3 to be spaced apart, as shown in Figures 2 and 3, making it possible to inspect the appearance of the end faces of the electronic components 3.

[0030] The turntable 30 is made of a transparent material such as glass or resin, which allows for visual inspection of the back surface of the electronic component 3.

[0031] 1, the imaging device 40 is, for example, a camera. Six imaging devices 40 are provided along the rotational transfer path 31 of the turntable 30. The six imaging devices 40 capture images of six outer surfaces of the electronic component 3 on the turntable 30, namely, two main surfaces TS1 and TS2, two side surfaces WS1 and WS2, and two end surfaces LS1 and LS2. Each imaging device 40 may be provided with an illumination device that illuminates the imaging surface of the electronic component 3.

[0032] 1, the discharge mechanism 50 discharges non-defective products that have been selected by the inspection and sorting controller 70 (described later) based on the results of the appearance inspection, from the turntable 30 and stores them in a case or the like. The method for discharging non-defective products by the discharge mechanism 50 is not particularly limited, and examples include air blowing, air suction, physical contact extrusion, etc. For example, when a non-defective product is transported, the discharge mechanism 50, in accordance with a command from the inspection and sorting controller 70, blows air onto the non-defective product on the turntable 30, thereby discharging the non-defective product from the turntable 30 and storing it in a case or the like.

[0033] The first sensor 61 is provided on the turntable 30 and detects the electronic components 3 on the turntable 30. The first sensor 61 is not particularly limited, but since the turntable 30 is transparent as described above, a transmission type laser sensor may be used, for example. This allows the first sensor 61 to detect the intervals between the electronic components 3 transported by the turntable 30 at a constant speed.

[0034] The second sensor 62 is provided on the linear feeder 20 and detects the electronic components 3 on the linear feeder 20. The second sensor 62 is not particularly limited, but may be, for example, a laser displacement meter or a surface photoelectric sensor. When the electronic components 3 are relatively large, for example, when the width or stacking direction dimension is 0.8 mm or greater, a laser displacement meter is preferably used. The laser displacement meter can detect the height of the electronic components, thereby also detecting the orientation of the workpiece. On the other hand, when the electronic components 3 are relatively small, for example, when the width or stacking direction dimension is less than 0.8 mm, a surface photoelectric sensor is preferably used. The surface photoelectric sensor can prevent erroneous detection due to the miniaturization of the electronic components 3. The second sensor 62 detects the presence or absence of electronic components 3 on the linear feeder 20 at predetermined intervals. In this way, the second sensor 62 can detect the occupancy rate of the electronic components 3 on the linear feeder 20.

[0035] The third sensor 63 is provided on the bowl feeder 10 and detects the electronic components 3 on the bowl feeder 10. The third sensor 63 is not particularly limited, but like the second sensor 62, examples of the third sensor 63 include a laser displacement meter or a surface photoelectric sensor.

[0036] The inspection and selection controller 70 controls the entire component inspection apparatus 1. Specifically, the inspection and selection controller 70 performs a visual inspection of the electronic components 3 on the turntable 30 based on the imaging results from the imaging device 40, and selects non-defective and defective components based on the results of the visual inspection.

[0037] The inspection and sorting controller 70 also controls the discharge of non-defective products by the discharge mechanism 50. For example, the inspection and sorting controller 70 calculates the timing for discharging non-defective products from the discharge mechanism 50 based on information such as the conveying speed (or rotation speed, and length or radius of the rotational conveying trajectory) of the turntable 30 and the position of the imaging device 40 on the turntable 30, and issues a command to the discharge mechanism 50.

[0038] Furthermore, the inspection and sorting controller 70 adjusts the first frequency of vibration of the linear feeder 20 based on the interval between the electronic components 3 on the turntable 30 detected by the first sensor 61. For example, the inspection and sorting controller 70 adjusts the voltage of the first piezoelectric element in the vibration mechanism 22 of the linear feeder 20.

[0039] For example, the inspection and sorting controller 70 adjusts the first frequency of vibration of the linear feeder 20 so that the detected interval between the electronic components 3 on the turntable 30 approaches a first target value. More specifically, the inspection and sorting controller 70 calculates multiple inter-component distances (e.g., 99 components) for the multiple electronic components 3 (e.g., 100 components) detected on the turntable 30, and calculates the median of the calculated distances. The inspection and sorting controller 70 adjusts the first frequency of vibration of the linear feeder 20 so that the calculated median approaches the first target value.

[0040] In this way, the median of multiple inter-component distances is used as the adjustment parameter, rather than the average value of multiple inter-component distances, which allows the spacing between electronic components to be adjusted without relying on values ​​that are extremely out of range.

[0041] The first target value for the spacing of the electronic components 3 on the turntable 30 may be determined based on the dimensions of the electronic components 3, the conveying speed of the turntable 30, the imaging speed capability of the imaging device 40, the discharge processing capability of the discharge mechanism 50, etc.

[0042] In an adjustment when the spacing between electronic components 3 on the turntable 30, for example, the median of the distances between multiple components, is smaller than the first target value, the inspection and sorting controller 70 reduces the first frequency of vibration of the linear feeder 20. This reduces the vibration of the linear feeder 20, and the amount of material fed from the linear feeder 20 to the turntable 30 decreases. As a result, the spacing between electronic components 3 on the turntable 30, for example, the median of the distances between multiple components, increases, approaches the first target value, and is maintained at that value.

[0043] On the other hand, when the interval between electronic components 3 on the turntable 30, for example, the median of the distances between multiple components, is larger than the first target value, the inspection and sorting controller 70 increases the first frequency of vibration of the linear feeder 20. This increases the vibration of the linear feeder 20, and increases the amount of material supplied from the linear feeder 20 to the turntable 30. As a result, the interval between electronic components 3 on the turntable 30, for example, the median of the distances between multiple components, decreases, and is maintained close to the first target value.

[0044] Furthermore, the inspection and sorting controller 70 adjusts the second frequency of vibration of the ball feeder 10 based on the occupancy rate of the electronic components 3 on the linear feeder 20 detected by the second sensor 62. For example, the inspection and sorting controller 70 adjusts the voltage of the second piezoelectric element in the vibration mechanism 12 of the ball feeder 10.

[0045] For example, the inspection and sorting controller 70 calculates the occupancy rate of the electronic components 3 on the linear feeder 20 relative to the detected overall dimension of the linear feeder 20 in the conveying direction. The inspection and sorting controller 70 adjusts the second frequency of vibration of the bowl feeder 10 so as to maintain a state in which the calculated occupancy rate is equal to or greater than a second target value. The second target value for the occupancy rate of the electronic components 3 on the linear feeder 20 is, for example, 95%.

[0046] In an adjustment when the proportion of electronic components 3 on linear feeder 20 is smaller than the second target value, inspection and sorting controller 70 increases the second frequency of vibration of ball feeder 10. This increases the vibration of ball feeder 10, and increases the amount of electronic components fed from ball feeder 10 to linear feeder 20. As a result, the proportion of electronic components 3 on linear feeder 20 increases and is maintained at or above the second target value.

[0047] However, if the supply of electronic components 3 from the hopper is insufficient, there is a possibility that the vibration of the ball feeder 10 will be excessively strong. Therefore, if the occupation ratio of electronic components 3 on the linear feeder 20 falls below a predetermined value (for example, below 80%), the inspection and sorting controller 70 predicts that the supply of electronic components 3 from the hopper has ended and there are no electronic components 3 left on the ball feeder 10, so the inspection and sorting controller 70 may stop the vibration of the ball feeder 10.

[0048] Alternatively, the inspection and sorting controller 70 may stop the vibration of the ball feeder 10 when, based on the detection result of the third sensor 63, no electronic components 3 are detected on the ball feeder 10 for a predetermined time (e.g., 1 second) or more, i.e., when the supply of electronic components from the hopper has finished.

[0049] The inspection and sorting controller 70 is configured with an arithmetic processor such as a PLC (Programmable Logic Controller), a DSP (Digital Signal Processor), or an FPGA (Field-Programmable Gate Array). The various functions of the inspection and sorting controller 70 are realized by executing predetermined software (programs) stored in a storage unit, for example. The various functions of the inspection and sorting controller 70 may be realized by a combination of hardware and software, or may be realized only by hardware (electronic circuits).

[0050] The storage unit in the inspection and sorting controller 70 is a rewritable memory such as an EEPROM. The storage unit stores predetermined software (programs) for executing various functions of the sorting controller. The storage unit also stores various setting values ​​input from, for example, an external device. The various setting values ​​include information regarding the conveying speed of the linear feeder 20, the conveying speed of the turntable 30 (or the rotation speed and the length or radius of the rotational conveying path), the position of the imaging device 40, and the position of the discharge mechanism 50, as well as criteria for determining whether a product is good or bad.

[0051] In such a component inspection apparatus 1, the spacing between electronic components 3 on the turntable 30 may vary due to factors such as fluctuations in the conveying speed of the turntable 30 or component clogging in the linear feeder 20. If the spacing between electronic components 3 becomes narrower, for example, the imaging device 40 may not be able to capture images of the end faces of the electronic components 3, resulting in a decrease in the accuracy of the visual inspection of the electronic components 3. On the other hand, if the spacing between electronic components 3 becomes wider, for example, the throughput of the visual inspection of the electronic components 3 may decrease.

[0052] In this regard, according to the component inspection device 1 of this embodiment, the inspection and sorting controller 70 adjusts the first frequency of vibration of the linear feeder 20 based on the spacing between the electronic components 3 on the turntable 30 detected by the first sensor 61. Specifically, the inspection and sorting controller 70 adjusts the first frequency of vibration of the linear feeder so that the spacing between the electronic components 3 on the turntable 30 approaches a first target value, i.e., is maintained at the target value. This prevents the spacing between the electronic components 3 from narrowing, for example, preventing the imaging device 40 from capturing images of the end faces of the electronic components 3, and thus prevents a decrease in the accuracy of the visual inspection of the electronic components 3. It also prevents the spacing between the electronic components 3 from widening, for example, preventing a decrease in the throughput of the visual inspection of the electronic components 3.

[0053] In order to suppress fluctuations in the spacing between the electronic components 3 on the turntable 30, it is also possible to adjust the conveying speed of the turntable 30. However, when determining the conveying speed of the turntable 30, various parameters such as the imaging speed capability of the imaging device 40 and the discharge processing capability of the discharge mechanism 50 must be taken into consideration. Therefore, the adjustable range of the conveying speed of the turntable 30 is substantially narrow, making it practically difficult to adjust the conveying speed of the turntable 30. From this perspective, it is useful to maintain the spacing between the electronic components 3 on the turntable 30 at a target value by adjusting the first frequency of the vibration of the linear feeder 20, i.e., adjusting the vibration of the linear feeder 20 and adjusting the amount of electronic components 3 supplied from the linear feeder 20 to the turntable 30, as in this embodiment.

[0054] However, if the first frequency of vibration of the linear feeder 20 is adjusted, i.e., the vibration of the linear feeder 20 is adjusted, and the amount of electronic components 3 supplied from the linear feeder 20 to the turntable 30 is increased, there is a possibility that there will be a shortage of electronic components 3 on the linear feeder 20.

[0055] In this regard, according to the component inspection device 1 of this embodiment, the inspection and sorting controller 70 adjusts the second frequency of vibration of the bowl feeder 10 based on the occupancy rate of the electronic components 3 on the linear feeder 20 detected by the second sensor 62. Specifically, the inspection and sorting controller 70 adjusts the second frequency of vibration of the bowl feeder 10 so that the occupancy rate of the electronic components 3 on the linear feeder 20 is maintained at a second target value or higher (e.g., 95% or higher). This makes it possible to prevent a shortage of electronic components 3 on the linear feeder 20 even if the supply amount of electronic components 3 from the linear feeder 20 to the turntable 30 is increased.

[0056] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and various modifications and variations are possible. In the above-described embodiments, a component inspection apparatus 1 that performs visual inspection of electronic components has been illustrated. However, the features of the present invention are not limited to this and can be applied to component inspection apparatuses that perform various types of inspection of electronic components. In this case, for example, the component inspection apparatus 1 may include at least one inspection device 40 instead of multiple imaging devices 40. Examples of the inspection device 40 include various inspection devices that acquire feature quantities of the electronic components 3 on the turntable 30. For example, the inspection device 40 may include a probe that measures the electrical characteristics (feature quantities) of the electronic components 3. In this case, the inspection and sorting controller 70 may inspect and sort the electronic components 3 based on the feature quantities acquired by the inspection device 40. [Explanation of symbols]

[0057] 1. Parts inspection equipment 3. Electronic Components 10 Bowl Feeder 12 Vibration mechanism 20 Linear Feeder 22 Vibration mechanism 30 Turntable 31 Rotational transport path 32 Guide mechanism 34 Electrostatic adsorption mechanism 40 Imaging device (inspection device) 50 Ejection mechanism 61 First Sensor 62 Second Sensor 63 Third Sensor 70 Inspection and sorting controller (inspection controller)

Claims

1. A part inspection device that inspects parts while transporting them, a linear feeder that conveys the parts by vibrating at a first frequency; a turntable that conveys the parts conveyed by the linear feeder; an inspection controller that inspects the components on the turntable; a first sensor for detecting the component on the turntable; Equipped with the inspection controller adjusts the first frequency of vibration of the linear feeder based on the spacing of the parts on the turntable detected by the first sensor. Parts inspection equipment.

2. a first piezoelectric element that supplies vibration of the first frequency to the linear feeder; the inspection controller adjusts the first frequency of vibration of the linear feeder by adjusting a voltage of the first piezoelectric element; The component inspection device according to claim 1 .

3. 3. The component inspection device according to claim 1, wherein the inspection controller adjusts the first frequency of vibration of the linear feeder so that the spacing between the components on the turntable approaches a first target value.

4. The inspection controller calculating a plurality of inter-component distances for a plurality of the components on the turntable, and calculating a median of the calculated inter-component distances; adjusting the first frequency of vibration of the linear feeder so that the calculated median value approaches a first target value; 3. The component inspection device according to claim 1 or 2.

5. a bowl feeder that conveys the parts to the linear feeder by vibration at a second frequency; a second sensor for detecting the component on the linear feeder; Further provided with the inspection controller adjusts the second frequency of vibration of the bowl feeder based on the occupancy rate of the components on the linear feeder detected by the second sensor.

3. The component inspection device according to claim 1 or 2.

6. a second piezoelectric element that supplies vibration of the second frequency to the bowl feeder; the inspection controller adjusts the second frequency of vibration of the bowl feeder by adjusting the voltage of the second piezoelectric element.

6. The component inspection device according to claim 5.

7. 6. The component inspection device according to claim 5, wherein the inspection controller adjusts the second frequency of vibration of the bowl feeder so that the occupancy rate of the components on the linear feeder is equal to or greater than a second target value.

8. 8. The component inspection apparatus of claim 7, wherein the second target value is 95%.

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