Layered filter device

Abstract

To achieve a layered filter device that can be downsized.SOLUTION: A filter device 1 includes a layered body 50 including a plurality of dielectric layers 51-59 layered on top of each other and first to third resonators 10, 20, 30 integrated into the layered body 50. Each of the first to third resonators 10, 20, 30 includes a first conductor portion and a second conductor portion electrically connected to the first conductor portion and having a lower impedance than the first conductor portion. The first conductor portion and second conductor portion are arranged at different locations in a layered direction T.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a multilayer filter device having a resonator made of a distributed constant line. [Background technology]

[0002] One of the electronic components used in communication devices is a bandpass filter having a plurality of resonators. Each of the resonators is configured, for example, by a distributed constant line. The distributed constant line is configured to have a predetermined line length.

[0003] Patent Document 1 discloses a three-stage bandpass filter configured using three transmission line resonators. The transmission line resonators in Patent Document 1 are particularly stepped impedance resonators (hereinafter also referred to as SIRs). Patent Document 1 describes an SIR that includes a first transmission line, a second transmission line connected to one end of the first transmission line, and a third transmission line connected to the other end of the first transmission line. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2012 / 102385 Summary of the Invention [Problem to be solved by the invention]

[0005] Bandpass filters used in small communication devices are particularly required to be miniaturized, but in bandpass filters equipped with resonators made of distributed constant lines, the distributed constant lines that make up the resonators are an obstacle to miniaturization, making it difficult to miniaturize the bandpass filters.

[0006] Patent Document 1 describes a technique for miniaturizing an SIR by loading a capacitive element on a first transmission line. However, in the SIR of Patent Document 1, second and third transmission lines are connected to both ends of the first transmission line. Therefore, the technique described in Patent Document 1 has the problem that it is difficult to reduce the area required for placing the SIR.

[0007] The present invention has been made in view of the above problems, and an object of the present invention is to provide a multilayer filter device that can be made smaller. [Means for solving the problem]

[0008] The multilayer filter device of the present invention includes a laminate including a plurality of stacked dielectric layers, and at least one resonator integrated with the laminate. The at least one resonator includes a first conductor portion and a second conductor portion electrically connected to the first conductor portion and having a lower impedance than the first conductor portion. The first conductor portion and the second conductor portion are arranged at different positions in the stacking direction of the plurality of dielectric layers.

[0009] In the multilayer filter device of the present invention, each of the first conductor portion and the second conductor portion may be a distributed constant line.

[0010] The multilayer filter device of the present invention may further include at least one through-hole connecting the first conductor portion and the second conductor portion.

[0011] The multilayer filter device of the present invention may further include a plurality of terminals. In this case, the laminate may have a first surface and a second surface located at both ends in the stacking direction. The plurality of terminals may be disposed on the first surface. The second conductor portion may be disposed between the first conductor portion and the first surface in the stacking direction.

[0012] In the multilayer filter device of the present invention, the first conductor portion may include a plurality of portions that are orthogonal to the stacking direction and extend in a plurality of directions different from one another.

[0013] In the multilayer filter device of the present invention, the planar shape of the laminate when viewed from a direction parallel to the lamination direction may be elongated in one direction. In this case, the second conductor portion may be elongated in the longitudinal direction of the planar shape of the laminate. Alternatively, the second conductor portion may be elongated in a direction intersecting the longitudinal direction of the planar shape of the laminate.

[0014] In the multilayer filter device of the present invention, the at least one resonator may include a first resonator, a second resonator, and a third resonator arranged between the first resonator and the second resonator in the circuit configuration. In this case, the laminate may have a first side surface and a second side surface located at both ends in a direction perpendicular to the stacking direction. The first resonator may be arranged closer to the first side surface than the second side surface. The second resonator may be arranged closer to the second side surface than the first side surface.

[0015] Furthermore, at least a portion of the third resonator may be disposed between the first resonator and the second resonator when viewed from a direction parallel to the stacking direction.

[0016] Furthermore, the first conductor portion of the first resonator and the first conductor portion of the second resonator may be disposed at the same position in the stacking direction. The first conductor portion of the third resonator may be disposed at a different position in the stacking direction from the first conductor portions of the first resonator and the second resonator. In this case, a portion of the first conductor portion of the first resonator and a portion of the first conductor portion of the second resonator may overlap the first conductor portion of the third resonator when viewed from a direction parallel to the stacking direction.

[0017] Furthermore, the second conductor portion of the first resonator and the second conductor portion of the second resonator may be disposed at the same position in the stacking direction. The second conductor portion of the third resonator may be disposed at a different position in the stacking direction from the second conductor portions of the first resonator and the second resonator. In this case, a portion of the second conductor portion of the first resonator and a portion of the second conductor portion of the second resonator may overlap the second conductor portion of the third resonator when viewed from a direction parallel to the stacking direction.

[0018] Additionally, the first conductor portion of the third resonator may have an asymmetric shape.

[0019] Furthermore, the shape of the first conductor portion of the third resonator may be different from the shape of the first conductor portion of the first resonator and the shape of the first conductor portion of the second resonator, and the shape of the second conductor portion of the third resonator may be different from the shape of the second conductor portion of the first resonator and the shape of the second conductor portion of the second resonator.

[0020] Furthermore, the multilayer filter device of the present invention may further include a first stub-type resonator electrically connected to the first conductor portion of the first resonator, and a second stub-type resonator electrically connected to the first conductor portion of the second resonator. [Effects of the Invention]

[0021] In the multilayer filter device of the present invention, the first conductor portion of at least one resonator and the second conductor portion of at least one resonator are arranged at different positions in the stacking direction of the dielectric layers, thereby achieving an advantageous effect of realizing a multilayer filter device that can be miniaturized. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a circuit diagram showing a circuit configuration of a multilayer filter device according to a first embodiment of the present invention. [Figure 2]1 is a perspective view showing the appearance of a multilayer filter device according to a first embodiment of the present invention. [Figure 3] 1 is an explanatory diagram showing pattern-formed surfaces of first to third dielectric layers in a laminate of a multilayer filter device according to a first embodiment of the present invention. FIG. [Figure 4] 3 is an explanatory view showing the pattern-forming surfaces of the fourth to sixth dielectric layers in the laminate of the multilayer filter device according to the first embodiment of the present invention. FIG. [Figure 5] 3 is an explanatory view showing pattern-forming surfaces of seventh to ninth dielectric layers in the laminate of the multilayer filter device according to the first embodiment of the present invention. FIG. [Figure 6] 1 is a perspective view showing the inside of a laminate of a multilayer filter device according to a first embodiment of the present invention. [Figure 7] 1 is a perspective view showing a part of the inside of a laminate of a multilayer filter device according to a first embodiment of the present invention. [Figure 8] 1 is a perspective view showing a part of the inside of a laminate of a multilayer filter device according to a first embodiment of the present invention. [Figure 9] 3 is a characteristic diagram showing the pass attenuation characteristics of the multilayer filter device according to the first embodiment of the present invention. FIG. [Figure 10] FIG. 10 is a circuit diagram showing a circuit configuration of a multilayer filter device according to a second embodiment of the present invention. [Figure 11] 10 is an explanatory view showing a pattern-formed surface of a seventh dielectric layer in a laminate of a multilayer filter device according to a second embodiment of the present invention. FIG. [Figure 12] FIG. 10 is a perspective view showing the inside of a laminate of a multilayer filter device according to a second embodiment of the present invention. [Figure 13] FIG. 10 is a circuit diagram showing a circuit configuration of a multilayer filter device according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] [First embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the configuration of a multilayer filter device (hereinafter simply referred to as a filter device) 1 according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a circuit diagram showing the circuit configuration of the filter device 1. The filter device 1 is configured to function as a bandpass filter that selectively passes signals of frequencies within a predetermined passband.

[0024] The filter device 1 according to this embodiment includes at least one resonator. In particular, in this embodiment, the filter device 1 includes, as the at least one resonator, a first resonator 10, a second resonator 20, and a third resonator 30 arranged between the first resonator 10 and the second resonator 20 in terms of a circuit configuration. Note that in this application, the expression "in terms of a circuit configuration" is used to refer to an arrangement on a circuit diagram, not an arrangement in a physical configuration.

[0025] The first to third resonators 10, 20, and 30 are configured such that the first resonator 10 and the third resonator 30 are adjacent to each other in the circuit configuration and are electromagnetically coupled, and the second resonator 20 and the third resonator 30 are adjacent to each other in the circuit configuration and are electromagnetically coupled. In Fig. 1, the curve marked with symbol K13 represents the electric field coupling between the first resonator 10 and the third resonator 30, and the curve marked with symbol K23 represents the electric field coupling between the second resonator 20 and the third resonator 30.

[0026] Furthermore, the first resonator 10 is magnetically coupled to the second resonator 20, which is not adjacent to the first resonator 10 in terms of the circuit configuration. Such electromagnetic coupling between two resonators that are not adjacent to each other in terms of the circuit configuration is called cross-coupling. In Figure 1, the curve labeled K12 indicates the magnetic field coupling between the first resonator 10 and the second resonator 20.

[0027] The first resonator 10 includes a first conductor portion 11 and a second conductor portion 12 having an impedance smaller than that of the first conductor portion 11. The first conductor portion 11 and the second conductor portion 12 are electrically connected to each other. The first conductor portion 11 is connected to ground. Furthermore, each of the first conductor portion 11 and the second conductor portion 12 is a distributed constant line. In particular, in this embodiment, the first conductor portion 11 is a distributed constant line having a small width, and the second conductor portion 12 is a distributed constant line having a width larger than that of the first conductor portion 11.

[0028] The first resonator 10 further includes a third conductor portion 13 that electrically connects the first conductor portion 11 and the second conductor portion 12. The third conductor portion 13 may include a distributed constant line that is narrower in width than the distributed constant line that constitutes the second conductor portion 12. The width of the distributed constant line of the third conductor portion 13 may be the same as or different from the width of the distributed constant line that constitutes the first conductor portion 11.

[0029] The configuration of the second resonator 20 is basically the same as the configuration of the first resonator 10. That is, the second resonator 20 includes a first conductor portion 21 and a second conductor portion 22 having an impedance smaller than that of the first conductor portion 21. The first conductor portion 21 and the second conductor portion 22 are electrically connected to each other. The first conductor portion 21 is connected to ground. Furthermore, each of the first conductor portion 21 and the second conductor portion 22 is a distributed constant line. Particularly in this embodiment, the first conductor portion 21 is a distributed constant line having a small width, and the second conductor portion 22 is a distributed constant line having a width larger than that of the first conductor portion 21.

[0030] The second resonator 20 further includes a third conductor portion 23 that electrically connects the first conductor portion 21 and the second conductor portion 22. The third conductor portion 23 may include a distributed constant line that is narrower than the distributed constant line that constitutes the second conductor portion 22. The width of the distributed constant line of the third conductor portion 23 may be the same as or different from the width of the distributed constant line that constitutes the first conductor portion 21.

[0031] The third resonator 30 includes a first conductor portion 31 and a second conductor portion 32 having an impedance smaller than that of the first conductor portion 31. The first conductor portion 31 and the second conductor portion 32 are electrically connected to each other. The first conductor portion 31 is connected to ground. Each of the first conductor portion 31 and the second conductor portion 32 is a distributed constant line. In particular, in this embodiment, the first conductor portion 31 is a distributed constant line having a small width, and the second conductor portion 32 is a distributed constant line having a width larger than that of the first conductor portion 31.

[0032] The first to third resonators 10, 20, and 30 are all stepped impedance resonators configured with a narrow distributed constant line and a wide distributed constant line, and are all quarter-wave resonators with one end shorted and the other open.

[0033] The impedance of each of the first conductor portions 11, 21, and 31 is, for example, in the range of 15 to 35 Ω. The impedance of each of the second conductor portions 12, 22, and 32 is, for example, in the range of 1 to 5 Ω. Here, in each of the first to third resonators 10, 20, and 30, 1st for the impedance of the conductor part Second The ratio of the impedances of the conductor parts is called the impedance ratio. In each of the first to third resonators 10, 20, and 30, the impedance ratio is smaller than 1. For example, the impedance ratio can be adjusted by adjusting the width of each of the distributed constant lines constituting the first conductor part and the distributed constant lines constituting the second conductor part. As the impedance ratio becomes smaller, the first conductor The width of the distributed constant line that makes up the second part becomes relatively small. conductor The width of the distributed constant line that constitutes this portion becomes relatively large.

[0034] The filter device 1 further includes a first port 2, a second port 3, and conductor portions 4 and 5. The first to third resonators 10, 20, and 30 are arranged between the first port 2 and the second port 3 in terms of the circuit configuration.

[0035] The conductor portion 4 electrically connects the first port 2 and the first resonator 10. One end of the conductor portion 4 is connected to the first port 2. The other end of the conductor portion 4 is connected to the first resonator 10 between the first conductor portion 11 and the third conductor portion 13.

[0036] The conductor portion 5 electrically connects the second port 3 and the second resonator 20. One end of the conductor portion 5 is connected to the second port 3. The other end of the conductor portion 5 is connected to the second resonator 20 between the first conductor portion 21 and the third conductor portion 23.

[0037] Next, other configurations of the filter device 1 will be described with reference to Fig. 2. Fig. 2 is a perspective view showing the appearance of the filter device 1.

[0038] The filter device 1 further includes a laminate 50. The laminate 50 includes a plurality of laminated dielectric layers, and a plurality of conductor layers and a plurality of through holes formed in the plurality of dielectric layers. The first to third resonators 10, 20, and 30 are integrated into the laminate 50. The first to third resonators 10, 20, and 30 are configured using a plurality of conductor layers.

[0039] The laminate 50 has a first surface 50A and a second surface 50B located at both ends in the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F are perpendicular to the first surface 50A and the second surface 50B.

[0040] Here, the X direction, Y direction, and Z direction are defined as shown in FIG. 2. The X direction, Y direction, and Z direction are perpendicular to each other. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. Furthermore, the direction opposite to the X direction is defined as the −X direction, the direction opposite to the Y direction is defined as the −Y direction, and the direction opposite to the Z direction is defined as the −Z direction.

[0041] As shown in FIG. 2, the first surface 50A is located at the end of the laminate 50 in the -Z direction. The first surface 50A is also the bottom surface of the laminate 50. The second surface 50B is located at the end of the laminate 50 in the Z direction. The second surface 50B is also the top surface of the laminate 50. The side surface 50C is located at the end of the laminate 50 in the -X direction. The side surface 50D is located at the end of the laminate 50 in the X direction. The side surface 50E is located at the end of the laminate 50 in the -Y direction. The side surface 50F is located at the end of the laminate 50 in the Y direction.

[0042] The planar shape of the laminate 50 when viewed from the Z direction, i.e., the shape of the first surface 50A or the second surface 50B, is a shape that is elongated in one direction. In particular, in this embodiment, the planar shape of the laminate 50 when viewed from the Z direction is a rectangle that is elongated in a direction parallel to the X direction.

[0043] The filter device 1 further includes a plurality of terminals 111, 112, 113, 114, 115, and 116 provided on the first surface 50A of the laminate 50. The terminal 111 extends in the Y direction near the side surface 50C. The terminal 112 extends in the Y direction near the side surface 50D. The terminals 113 to 116 are disposed between the terminals 111 and 112. The terminals 113 and 114 are lined up in this order in the X direction near the side surface 50E. The terminals 115 and 116 are lined up in this order in the X direction near the side surface 50F.

[0044] Terminal 111 corresponds to the first port 2, and terminal 112 corresponds to the second port 3. Therefore, the first and second ports 2 and 3 are provided on the first surface 50A of the laminate 50. Terminals 113 to 116 are connected to ground. Hereinafter, terminal 111 will also be referred to as the first terminal 111, terminal 112 will also be referred to as the second terminal 112, and terminals 113 to 116 will also be referred to as the ground terminals 113 to 116.

[0045] Next, an example of the plurality of dielectric layers and the plurality of conductor layers constituting the laminate 50 will be described with reference to Figures 3 to 5. In this example, the laminate 50 has nine laminated dielectric layers. Hereinafter, these nine dielectric layers will be referred to as the first to ninth dielectric layers, in order from the bottom up. The first to ninth dielectric layers will be denoted by reference numerals 51 to 59.

[0046] 3(a) shows the pattern-formed surface of the first dielectric layer 51. Terminals 111, 112, 113, 114, 115, and 116 are formed on the pattern-formed surface of the dielectric layer 51. Furthermore, through-holes 51T1, 51T2, 51T3, 51T4, 51T5, and 51T6 connected to the terminals 111, 112, 113, 114, 115, and 116, respectively, are formed in the dielectric layer 51.

[0047] 3(b) shows the pattern-formed surface of the second dielectric layer 52. A conductor layer 521 is formed on the pattern-formed surface of the dielectric layer 52. Through holes 52T1, 52T2, 52T3, 52T4, 52T5, and 52T6 are also formed in the dielectric layer 52. The through holes 51T1 and 51T2 formed in the dielectric layer 51 are connected to the through holes 52T1 and 52T2, respectively. The through holes 51T3 to 51T6 and the through holes 52T3 to 52T6 formed in the dielectric layer 51 are connected to the conductor layer 521.

[0048] 3(c) shows the pattern formation surface of the third dielectric layer 53. Conductor layers 531, 532, 533, and 534 are formed on the pattern formation surface of the dielectric layer 53. The conductor layer 532 is connected to the conductor layer 531. The conductor layer 534 is connected to the conductor layer 533. In FIG. 3(c), the boundary between the conductor layer 531 and the conductor layer 532 and the boundary between the conductor layer 533 and the conductor layer 534 are indicated by dotted lines.

[0049] Furthermore, through holes 53T1, 53T2, 53T3, 53T4, 53T5, and 53T6 are formed in the dielectric layer 53. The through holes 52T1 and 53T1 formed in the dielectric layer 52 are connected to the conductor layer 532. The through holes 52T2 and 53T2 formed in the dielectric layer 52 are connected to the conductor layer 534. The through holes 52T3 to 52T6 formed in the dielectric layer 52 are connected to the through holes 53T3 to 53T6, respectively.

[0050] 4(a) shows the pattern-formed surface of the fourth dielectric layer 54. A conductor layer 541 is formed on the pattern-formed surface of the dielectric layer 54. Through holes 54T1, 54T2, 54T3, 54T4, 54T5, 54T6, and 54T7 are also formed in the dielectric layer 54. The through holes 53T1 to 53T6 formed in the dielectric layer 53 are connected to the through holes 54T1 to 54T6, respectively. The through hole 54T7 is connected to the conductor layer 541.

[0051] 4(b) shows the pattern-formed surface of the fifth dielectric layer 55. A conductor layer 551 is formed on the pattern-formed surface of the dielectric layer 55. Through holes 55T1, 55T2, 55T7, and 55T8 are also formed in the dielectric layer 55. The through holes 54T1, 54T2, and 54T7 formed in the dielectric layer 54 are connected to the through holes 55T1, 55T2, and 55T7, respectively. The through holes 54T3 to 54T6 and the through hole 55T8 formed in the dielectric layer 54 are connected to the conductor layer 551.

[0052] 4(c) shows the patterned surface of the sixth dielectric layer 56. Through holes 56T1, 56T2, 56T7, and 56T8 are formed in the dielectric layer 56. The through holes 55T1, 55T2, 55T7, and 55T8 formed in the dielectric layer 55 are connected to the through holes 56T1, 56T2, 56T7, and 56T8, respectively.

[0053] FIG. 5(a) shows the pattern-forming surface of the seventh dielectric layer 57. Conductor layers 571 and 572 are formed on the pattern-forming surface of the dielectric layer 57. Each of the conductor layers 571 and 572 has a first end and a second end located opposite each other. The first end of the conductor layer 571 and the first end of the conductor layer 572 are connected to each other. In FIG. 5(a), the boundary between the conductor layer 571 and the conductor layer 572 is indicated by a dotted line. A through-hole 56T1 formed in the dielectric layer 56 is connected to a portion of the conductor layer 571 near its second end. A through-hole 56T2 formed in the dielectric layer 56 is connected to a portion of the conductor layer 572 near its second end.

[0054] Furthermore, through holes 57T7 and 57T8 are formed in the dielectric layer 57. The through hole 56T7 formed in the dielectric layer 56 is connected to the through hole 57T7. The through holes 56T8 and 57T8 formed in the dielectric layer 56 are connected to a portion of the conductor layer 571 near a first end and a portion of the conductor layer 572 near a first end.

[0055] 5(b) shows the pattern-forming surface of the eighth dielectric layer 58. A conductor layer 581 is formed on the pattern-forming surface of the dielectric layer 58. The conductor layer 581 has a first end and a second end located on opposite sides. A through-hole 57T7 formed in the dielectric layer 57 is connected to a portion of the conductor layer 581 near the first end.

[0056] Furthermore, a through hole 58T8 is formed in the dielectric layer 58. The through hole 57T8 formed in the dielectric layer 57 and the through hole 58T8 are connected to a portion of the conductor layer 581 in the vicinity of the second end.

[0057] 5(c) shows the pattern formation surface of the ninth dielectric layer 59. A conductor layer 591 is formed on the pattern formation surface of the dielectric layer 59. A through hole 58T8 formed in the dielectric layer 58 is connected to the conductor layer 591.

[0058] The laminate 50 shown in Figure 2 is formed by stacking the first to ninth dielectric layers 51 to 59 so that the pattern-forming surface of the first dielectric layer 51 becomes the first surface 50A of the laminate 50, and the surface of the ninth dielectric layer 59 opposite the pattern-forming surface becomes the second surface 50B of the laminate 50.

[0059] Fig. 6 shows the inside of a laminate 50 formed by stacking first to ninth dielectric layers 51 to 59. As shown in Fig. 6, inside the laminate 50, a plurality of conductor layers and a plurality of through holes shown in Figs. 3 to 5 are stacked.

[0060] The following describes the correspondence between the circuit components of the filter device 1 shown in Fig. 1 and the internal components of the laminate 50 shown in Figs. 3 to 5. First, the first resonator 10 will be described. The first conductor portion 11 is formed by a conductor layer 571. The second conductor portion 12 is formed by a conductor layer 531. The third conductor portion 13 is formed by a conductor layer 532.

[0061] The conductor layer 532 (third conductor portion 13) and through holes 53T1, 54T1, 55T1, and 56T1 connect the conductor layer 571 constituting the first conductor portion 11 to the conductor layer 531 constituting the second conductor portion 12. The conductor layer 571 constituting the first conductor portion 11 is connected to the ground terminals 113 to 116 via through holes 51T3 to 51T6, the conductor layer 521, through holes 52T3 to 52T6, 53T3 to 53T6, through holes 54T3 to 54T6, the conductor layer 551, and through holes 55T8 and 56T8.

[0062] Next, the second resonator 20 will be described. The first conductor portion 21 is formed by a conductor layer 572. The second conductor portion 22 is formed by a conductor layer 533. The third conductor portion 23 is formed by a conductor layer 534.

[0063] The conductor layer 534 (third conductor portion 23) and through holes 53T2, 54T2, 55T2, and 56T2 connect the conductor layer 572 that constitutes the first conductor portion 21 to the conductor layer 533 that constitutes the second conductor portion 22. The conductor layer 572 that constitutes the first conductor portion 21 is connected to the ground terminals 113 to 116 via through holes 51T3 to 51T6, the conductor layer 521, through holes 52T3 to 52T6, 53T3 to 53T6, through holes 54T3 to 54T6, the conductor layer 551, and through holes 55T8 and 56T8.

[0064] Next, a description will be given of the third resonator 30. The first conductor portion 31 is formed by a conductor layer 581. The second conductor portion 32 is formed by a conductor layer 541.

[0065] The conductor layer 581 constituting the first conductor portion 31 is connected to the ground terminals 113 to 116 via through holes 51T3 to 51T6, the conductor layer 521, through holes 52T3 to 52T6, 53T3 to 53T6, through holes 54T3 to 54T6, the conductor layer 551 and through holes 55T8, 56T8, and 57T8.

[0066] Next, the conductor portions 4 and 5 will be described. The conductor portion 4 is composed of through holes 51T1 and 52T1. The through hole 51T1 is connected to the first terminal 111. The through hole 52T1 is connected to the conductor layer 532 that constitutes the third conductor portion 13, and is also connected to the conductor layer 571 that constitutes the first conductor portion 11 via through holes 53T1, 54T1, 55T1, and 56T1.

[0067] The conductor portion 5 is composed of through holes 51T2 and 52T2. The through hole 51T2 is connected to the second terminal 112. The through hole 52T2 is connected to the conductor layer 534 that constitutes the third conductor portion 23, and is also connected to the conductor layer 572 that constitutes the first conductor portion 21 via through holes 53T2, 54T2, 55T2, and 56T2.

[0068] Next, structural features of the filter device 1 according to this embodiment will be described with reference to Fig. 2 to Fig. 8. Fig. 7 and Fig. 8 are perspective views showing a part of the inside of the laminate 50. Fig. 7 mainly shows the multiple conductor layers and multiple through holes that constitute the first and second resonators 10 and 20. Fig. 8 mainly shows the multiple conductor layers and multiple through holes that constitute the third resonator 30.

[0069] The first resonator 10 is disposed in a region on the −X direction side of the laminate 50. That is, the first resonator 10 is disposed at a position closer to the side surface 50C than to the side surface 50D. As shown in FIG. 7, the first conductor portion 11 (conductor layer 571) and the second conductor portion 12 (conductor layer 531) of the first resonator 10 are disposed at different positions in the lamination direction T. The second conductor portion 12 is disposed between the first conductor portion 11 and the first surface 50A on which the multiple terminals 111 to 116 are disposed.

[0070] The first conductor portion 11 (conductor layer 571) includes a plurality of portions extending in a plurality of directions perpendicular to the stacking direction T. In this embodiment, in particular, the first conductor portion 11 (conductor layer 571) includes four portions extending in a direction parallel to the X direction and three portions extending in a direction parallel to the Y direction.

[0071] The second conductor portion 12 (conductor layer 531) has a shape that is long in a direction intersecting the longitudinal direction of the laminate 50. In this embodiment in particular, the second conductor portion 12 (conductor layer 531) has a rectangular shape that is long in a direction parallel to the Y direction.

[0072] The second resonator 20 is disposed in a region on the X-direction side of the laminate 50. That is, the second resonator 20 is disposed at a position closer to the side surface 50D than to the side surface 50C. As shown in FIG. 7, the first conductor portion 21 (conductor layer 572) and the second conductor portion 22 (conductor layer 533) of the second resonator 20 are disposed at different positions in the lamination direction T. The second conductor portion 22 is disposed between the first surface 50A, on which the plurality of terminals 111 to 116 are disposed, and the first conductor portion 21.

[0073] The first conductor portion 21 (conductor layer 572) includes a plurality of portions extending in a plurality of directions perpendicular to the stacking direction T. In this embodiment, in particular, the first conductor portion 21 (conductor layer 572) includes four portions extending in a direction parallel to the X direction and three portions extending in a direction parallel to the Y direction.

[0074] The second conductor portion 22 (conductor layer 533) has a shape that is long in a direction intersecting the longitudinal direction of the laminate 50. In this embodiment in particular, the second conductor portion 22 (conductor layer 533) has a rectangular shape that is long in a direction parallel to the Y direction.

[0075] When viewed from the Z direction, at least a portion of the third resonator 30 is disposed between the first resonator 10 and the second resonator 20. In particular, in this embodiment, a portion of the third resonator 30 is disposed between the first resonator 10 and the second resonator 20.

[0076] 8, the first conductor portion 31 (conductor layer 581) and the second conductor portion 32 (conductor layer 541) of the third resonator 30 are disposed at different positions in the stacking direction T. The second conductor portion 32 is disposed between the first conductor portion 31 and the first surface 50A on which the plurality of terminals 111 to 116 are disposed.

[0077] The first conductor portion 31 (conductor layer 581) includes a plurality of portions extending in a plurality of directions perpendicular to the stacking direction T. In this embodiment, in particular, the first conductor portion 31 (conductor layer 581) includes three portions extending in a direction parallel to the X direction and four portions extending in a direction parallel to the Y direction.

[0078] The first conductor portion 31 (conductor layer 581) has a shape that is asymmetric with respect to any XZ plane that intersects with the first conductor portion 31, and also has a shape that is asymmetric with respect to any YZ plane that intersects with the first conductor portion 31. Hereinafter, any XZ plane that intersects with the first conductor portion 31 will be referred to as a first virtual plane, and any YZ plane that intersects with the first conductor portion 31 will be referred to as a second virtual plane. The first virtual plane may intersect with the center of the laminate 50 in a direction parallel to the Y direction. The second virtual plane may intersect with the center of the laminate 50 in a direction parallel to the X direction.

[0079] The second conductor portion 32 (conductor layer 541) has a shape that is long in the longitudinal direction of the laminate 50. In this embodiment in particular, the second conductor portion 32 (conductor layer 541) has a rectangular shape that is long in the direction parallel to the X direction.

[0080] As shown in FIGS. 5(a) and 6, the first conductor portion 11 (conductor layer 571) of the first resonator 10 and the first conductor portion 21 (conductor layer 572) of the second resonator 20 are disposed at the same position in the stacking direction T. As shown in FIGS. 5(a), 5(b), and 6, the first conductor portion 31 (conductor layer 581) of the third resonator 30 is disposed at a position different from the first conductor portions 11 and 21 in the stacking direction T. Furthermore, a portion of the first conductor portion 11 and a portion of the first conductor portion 21 overlap the first conductor portion 31 when viewed from the Z direction. Furthermore, the shape of the first conductor portion 31 is different from the shapes of the first conductor portion 11 and the first conductor portion 21.

[0081] 3(c) and 6, the second conductor portion 12 (conductor layer 531) of the first resonator 10 and the second conductor portion 22 (conductor layer 533) of the second resonator 20 are disposed at the same position in the stacking direction T. As shown in FIG. 3(c), FIG. 4(a), and FIG. 6, the second conductor portion 32 (conductor layer 541) of the third resonator 30 is disposed at a position different from the second conductor portions 12 and 22 in the stacking direction T. Furthermore, a portion of the second conductor portion 12 and a portion of the second conductor portion 22 overlap the second conductor portion 32 when viewed from the Z direction. Furthermore, the shape of the second conductor portion 32 is different from the shapes of the second conductor portion 12 and the second conductor portion 22.

[0082] As described above, in the present embodiment, the first conductor portion 11 and the second conductor portion 12 of the first resonator 10 are arranged at different positions in the stacking direction T. This makes it possible to arrange the first conductor portion 11 and the second conductor portion 12 so that they overlap. This makes it possible to substantially reduce the area required to arrange the first resonator 10 compared to when the first conductor portion 11 and the second conductor portion 12 are formed on the same dielectric layer and arranged at the same position in the stacking direction T.

[0083] The above description of the first resonator 10 also applies to the second and third resonators 20 and 30. For these reasons, according to this embodiment, the filter device 1 can be made smaller in size.

[0084] Furthermore, in this embodiment, a part of the first conductor portion 11 of the first resonator 10 and a part of the first conductor portion 21 of the second resonator 20 overlap with the first conductor portion 31 of the third resonator 30 when viewed from the Z direction, and a part of the second conductor portion 12 of the first resonator 10 and a part of the second conductor portion 22 of the second resonator 20 overlap with the second conductor portion 32 of the third resonator 30 when viewed from the Z direction. This also makes it possible to miniaturize the filter device 1 according to this embodiment.

[0085] Furthermore, in this embodiment, each of the first conductor portions 11, 21, and 31 includes a plurality of portions extending in a plurality of directions different from one another. As a result, according to this embodiment, the area for arranging each of the first conductor portions 11, 21, and 31 can be substantially reduced compared to when each of the first conductor portions 11, 21, and 31 extends in one direction.

[0086] Furthermore, in this embodiment, the first conductor portion 31 has an asymmetric shape as described above. As a result, according to this embodiment, the interaction occurring between the first conductor portion 11 and the first conductor portion 31 can be made different from the interaction occurring between the first conductor portion 21 and the first conductor portion 31. This makes it possible to suppress spurious signals occurring in a frequency range higher than the passband, for example.

[0087] In the present embodiment, the conductor layer 591 is connected to the ground terminals 113 to 116 via the through holes 51T3 to 51T6, the conductor layer 521, the through holes 52T3 to 52T6, 53T3 to 53T6, the through holes 54T3 to 54T6, the conductor layer 551, and the through holes 55T8, 56T8, 57T8, and 58T8. The first to third resonators 10, 20, and 30 are disposed between the conductor layer 521 and the conductor layer 591. When viewed from the Z direction, the conductor layers 521 and 591 overlap the first to third resonators 10, 20, and 30, respectively. The conductor layers 521 and 591 function as shields.

[0088] Next, an example of the characteristics of the filter device 1 according to this embodiment will be shown. Fig. 9 is a characteristic diagram showing an example of the pass attenuation characteristics of the filter device 1. In Fig. 9, the horizontal axis represents frequency and the vertical axis represents attenuation. As shown in Fig. 9, the filter device 1 according to this embodiment functions as a band-pass filter. Fig. 9 shows an example in which the filter device 1 is designed so that the pass band is 2.3 to 3.3 GHz.

[0089] [Second embodiment] Next, a second embodiment of the present invention will be described with reference to Fig. 10 to Fig. 12. Fig. 10 is a circuit diagram showing the circuit configuration of a multilayer filter device according to this embodiment. Fig. 11 is an explanatory diagram showing the pattern formation surface of the seventh dielectric layer in this embodiment. Fig. 12 is a perspective view showing the inside of the laminate of the multilayer filter device according to this embodiment.

[0090] The filter device 1 according to this embodiment differs from the first embodiment in the following respects: The filter device 1 according to this embodiment includes a first stub-type resonator 91 electrically connected to the first conductor portion 11 of the first resonator 10, and a second stub-type resonator 92 electrically connected to the first conductor portion 21 of the second resonator 20. Each of the first and second stub-type resonators 91 and 92 is a distributed constant line.

[0091] The first stub-type resonator 91 is connected midway along the first conductor portion 11. In Fig. 10, the portion of the first conductor portion 11 that is located between the connection point with the first stub-type resonator 91 and the second conductor portion 12 in terms of the circuit configuration is indicated by reference numeral 11A, and the portion that is located between the connection point with the first stub-type resonator 91 and the ground in terms of the circuit configuration is indicated by reference numeral 11B.

[0092] The second stub-type resonator 92 is connected midway along the first conductor portion 21. In Fig. 10, the portion of the first conductor portion 21 that is located between the connection point with the second stub-type resonator 92 and the second conductor portion 22 in terms of the circuit configuration is indicated by reference numeral 21A, and the portion that is located between the connection point with the second stub-type resonator 92 and the ground in terms of the circuit configuration is indicated by reference numeral 21B.

[0093] Furthermore, in the present embodiment, the laminate 50 includes a dielectric layer 157 shown in FIG. 11 instead of the seventh dielectric layer 57 in the first embodiment. Similar to the dielectric layer 57, conductor layers 571 and 572 are formed on the pattern formation surface of the dielectric layer 157. Further, conductor layers 573 and 574 are formed on the pattern formation surface of the dielectric layer 157. The conductor layer 573 is connected midway to the conductor layer 571. The conductor layer 574 is connected midway to the conductor layer 572. In FIG. 11, the boundary between the conductor layer 571 and the conductor layer 573 and the boundary between the conductor layer 572 and the conductor layer 574 are indicated by dotted lines.

[0094] The first stub-type resonator 91 is composed of a conductor layer 572. The second stub-type resonator 92 is composed of a conductor layer 574. The shapes of the conductor layer 572 and the conductor layer 574 may be the same as or different from each other. In the example shown in Fig. 11, the shapes of the conductor layer 572 and the conductor layer 574 are different from each other.

[0095] The first and second stub-type resonators 91 and 92 are used to control spurious signals that occur in a frequency range higher than the passband. Each of the first and second stub-type resonators 91 and 92 may be an open stub with one end open, or a short stub with one end connected to ground.

[0096] Other configurations, actions, and effects of this embodiment are the same as those of the first embodiment.

[0097] [Third embodiment] Next, a third embodiment of the present invention will be described with reference to Fig. 13. Fig. 13 is a circuit diagram showing the circuit configuration of a multilayer filter device according to this embodiment.

[0098] The filter device 1 according to this embodiment differs from the second embodiment in the following respects. The filter device 1 according to this embodiment includes a fourth resonator 40. The fourth resonator 40 is disposed between the second resonator 20 and the third resonator 30 in terms of the circuit configuration. In this embodiment, the first to fourth resonators 10, 20, 30, and 40 are configured such that the first resonator 10 and the third resonator 30 are adjacent to each other and electromagnetically coupled in terms of the circuit configuration, the third resonator 30 and the fourth resonator 40 are adjacent to each other and electromagnetically coupled in terms of the circuit configuration, and the second resonator 20 and the fourth resonator 40 are adjacent to each other and electromagnetically coupled in terms of the circuit configuration. In FIG. 13, the curve marked with symbol K13 represents the electric field coupling between the first resonator 10 and the third resonator 30, the curve marked with symbol K34 represents the magnetic field coupling between the third resonator 30 and the fourth resonator 40, and the curve marked with symbol K24 represents the electric field coupling between the second resonator 20 and the fourth resonator 40.

[0099] The configuration of the fourth resonator 40 is basically the same as the configuration of the third resonator 30. That is, the fourth resonator 40 includes a first conductor portion 41 and a second conductor portion 42 having an impedance smaller than that of the first conductor portion 41. The first conductor portion 41 and the second conductor portion 42 are electrically connected to each other. The first conductor portion 41 is connected to ground. Furthermore, each of the first conductor portion 41 and the second conductor portion 42 is a distributed constant line. Particularly in this embodiment, the first conductor portion 41 is a distributed constant line having a small width, and the second conductor portion 42 is a distributed constant line having a width larger than that of the first conductor portion 41.

[0100] The fourth resonator 40, like the first to third resonators 10, 20, and 30, is a stepped impedance resonator configured by a narrow distributed constant line and a wide distributed constant line.

[0101] Although not shown, the first conductor portion 41 and the second conductor portion 42 of the fourth resonator 40 are arranged at different positions in the stacking direction T, similar to the first conductor portion 31 and the second conductor portion 32 of the third resonator 30. The first conductor portion 31 and the first conductor portion 41 may be arranged at the same position in the stacking direction T, or may be arranged at different positions in the stacking direction T. Similarly, the second conductor portion 32 and the second conductor portion 42 may be arranged at the same position in the stacking direction T, or may be arranged at different positions in the stacking direction T.

[0102] In this embodiment, at least a part of the third resonator 30 and at least a part of the fourth resonator 40 are disposed between the first resonator 10 and the second resonator 20 when viewed from the Z direction (see FIG. 2).

[0103] In this embodiment, a part of the first conductor portion 11 of the first resonator 10 may overlap the first conductor portion 31 of the third resonator 30 when viewed from the Z direction. In this case, a part of the first conductor portion 21 of the second resonator 20 may overlap the first conductor portion 41 of the fourth resonator 40 when viewed from the Z direction.

[0104] In this embodiment, a portion of the second conductor portion 12 of the first resonator 10 may overlap the second conductor portion 32 of the third resonator 30 when viewed from the Z direction. In this case, a portion of the second conductor portion 22 of the second resonator 20 may overlap the second conductor portion 42 of the fourth resonator 40 when viewed from the Z direction.

[0105] The filter device 1 according to this embodiment further includes a third stub-type resonator 93 electrically connected to the first conductor portion 31 of the third resonator 30, and a fourth stub-type resonator 94 electrically connected to the first conductor portion 41 of the fourth resonator 40. Each of the third and fourth stub-type resonators 93 and 94 is a distributed constant line.

[0106] The third stub-type resonator 93 is connected midway along the first conductor portion 31. In Fig. 13, the portion of the first conductor portion 31 that is located between the connection point with the third stub-type resonator 93 and the second conductor portion 32 in terms of the circuit configuration is indicated by reference numeral 31A, and the portion that is located between the connection point with the third stub-type resonator 93 and ground in terms of the circuit configuration is indicated by reference numeral 31B.

[0107] The fourth stub-type resonator 94 is connected midway along the first conductor portion 41. In Fig. 13, the portion of the first conductor portion 41 that is located between the connection point with the fourth stub-type resonator 94 and the second conductor portion 42 in terms of the circuit configuration is indicated by reference numeral 41A, and the portion that is located between the connection point with the fourth stub-type resonator 94 and ground in terms of the circuit configuration is indicated by reference numeral 41B.

[0108] The third and fourth stub-type resonators 93 and 94 are used to control spurious components that occur in a frequency range higher than the passband. Each of the third and fourth stub-type resonators 93 and 94 may be an open stub with one end open, or a short stub with one end connected to ground.

[0109] Other configurations, actions, and effects of this embodiment are the same as those of the second embodiment.

[0110] The present invention is not limited to the above-described embodiments and can be modified in various ways. For example, the number and configuration of resonators are not limited to those described in the embodiments, and may be any number that satisfies the scope of the claims. The number of resonators may be one, two, five or more. [Explanation of symbols]

[0111] 1...filter device, 2...first port, 3...second port, 4, 5...conductor portion, 10...first resonator, 11...first conductor portion, 12...second conductor portion, 13...third conductor portion, 20...second resonator, 21...first conductor portion, 22...second conductor portion, 23...third conductor portion, 30...third resonator, 31...first conductor portion, 32...second conductor portion, 50...laminated body, 50A...first surface, 50B...second surface, 50C to 50F...side surface, 111...first terminal, 112...second terminal, 113 to 116...ground terminals.

Claims

1. a laminate including a plurality of stacked dielectric layers; at least one resonator integrated into said stack; a conductor layer integrated with the laminate and connected to ground, the at least one resonator includes a first conductor portion and a second conductor portion electrically connected to the first conductor portion and having a lower impedance than the first conductor portion; the first conductor portion and the second conductor portion are disposed at different positions in a stacking direction of the plurality of dielectric layers, The multilayer filter device according to claim 1, wherein the conductor layer is disposed between the first conductor portion and the second conductor portion in the stacking direction.

2. 2. The multilayer filter device according to claim 1, wherein each of the first conductor portion and the second conductor portion is a distributed constant line.

3. 3. The multilayer filter device according to claim 1, further comprising at least one through hole connecting said first conductor portion and said second conductor portion.

4. Further, the device has a plurality of terminals, the laminate has a first surface and a second surface located at both ends in the stacking direction, the plurality of terminals are disposed on the first surface; 4. The multilayer filter device according to claim 1, wherein the second conductor portion is disposed between the first conductor portion and the first surface in the stacking direction.

5. 5. The multilayer filter device according to claim 1, wherein the first conductor portion includes a plurality of portions that extend in a plurality of directions that are perpendicular to the stacking direction and different from one another.

6. the at least one resonator is a plurality of resonators; The planar shape of the laminate when viewed from one direction parallel to the stacking direction is a shape that is elongated in one direction, 6. The multilayer filter device according to claim 1, wherein the plurality of resonators include a resonator in which the second conductor portion has a shape that is long in the longitudinal direction of the planar shape of the laminate.

7. the at least one resonator is a plurality of resonators; The planar shape of the laminate when viewed from one direction parallel to the stacking direction is a shape that is elongated in one direction, 6. The multilayer filter device according to claim 1, wherein the plurality of resonators include a resonator in which the shape of the second conductor portion is elongated in a direction intersecting with the longitudinal direction of the planar shape of the laminate.

8. 6. The multilayer filter device according to claim 1, wherein the at least one resonator includes a first resonator, a second resonator, and a third resonator arranged between the first resonator and the second resonator in a circuit configuration.

9. the laminate has a first side surface and a second side surface located at both ends in a direction perpendicular to the stacking direction, the first resonator is disposed closer to the first side surface than to the second side surface; 9. The multilayer filter device according to claim 8, wherein the second resonator is disposed closer to the second side surface than to the first side surface.

10. 10. The multilayer filter device according to claim 8, wherein at least a portion of the third resonator is disposed between the first resonator and the second resonator when viewed from a direction parallel to the stacking direction.

11. the first conductor portion of the first resonator and the first conductor portion of the second resonator are disposed at the same position in the stacking direction, 11. The multilayer filter device according to claim 8, wherein the first conductor portion of the third resonator is arranged at a position different from the first conductor portions of the first resonator and the second resonator in the stacking direction.

12. 12. The multilayer filter device according to claim 11, wherein a part of the first conductor portion of the first resonator and a part of the first conductor portion of the second resonator overlap with the first conductor portion of the third resonator when viewed from one direction parallel to the stacking direction.

13. the second conductor portion of the first resonator and the second conductor portion of the second resonator are disposed at the same position in the stacking direction, 13. The multilayer filter device according to claim 8, wherein the second conductor portion of the third resonator is arranged at a position different from the second conductor portions of the first resonator and the second resonator in the stacking direction.

14. 14. The multilayer filter device according to claim 13, wherein a part of the second conductor portion of the first resonator and a part of the second conductor portion of the second resonator overlap with the second conductor portion of the third resonator when viewed from one direction parallel to the stacking direction.

15. 15. The multilayer filter device according to claim 8, wherein the first conductor portion of the third resonator has a shape that is asymmetric with respect to imaginary planes that intersect with the first conductor portion of the third resonator and are parallel to both a first direction parallel to the stacking direction and a second direction orthogonal to the first direction.

16. The planar shape of the laminate when viewed from one direction parallel to the stacking direction is a shape that is elongated in one direction, a shape of the first conductor portion of the third resonator is different from a shape of the first conductor portion of the first resonator and a shape of the first conductor portion of the second resonator; the second conductor portion of the third resonator has a shape that is long in a longitudinal direction of a planar shape of the laminate, 16. The multilayer filter device according to claim 8, wherein the second conductor portion of the first resonator and the second conductor portion of the second resonator are shaped to be elongated in a direction intersecting with the longitudinal direction of the planar shape of the laminate.

17. a first stub-type resonator electrically connected to the first conductor portion of the first resonator; 17. The multilayer filter device according to claim 8, further comprising a second stub-type resonator electrically connected to the first conductor portion of the second resonator.

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