Testing device and testing method

Abstract

To provide a new testing device that makes it possible to shorten a measurement time and avoid a failure that a test piece is not destroyed due to the insufficient movement distance of an indenter.SOLUTION: Provided is a testing device 200 comprising: a support unit 210 that supports an underside of a test piece (chip 23); a depression unit 226 which is provided with an indenter 204 for pressing the test piece supported by the support unit 210 and which moves up and down; a drive unit 240 for moving the depression unit 226 up and down; a load measurer 225 for measuring a load is generated when the test piece supported by the support unit 210 is pressed by the indenter 204; and a controller 1 for at least controlling the vertical movement of the depression unit 226. The controller 1 stops the movement of the indenter 204 when the measured value of the load measurer 225 changes from rise to fall after the indenter 204 started depressing the test piece.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a testing device and a testing method for measuring the strength of a test piece by breaking it. [Background technology]

[0002] Conventionally, there has been known an apparatus for measuring the flexural strength of a semiconductor device chip, as disclosed in, for example, Patent Document 1. Patent Document 1 discloses a testing apparatus that can measure the flexural strength easily and with high accuracy by picking up a chip from a wafer after dicing and automatically measuring the flexural strength.

[0003] This type of testing equipment is generally used to perform the three-point bending test specified in SEMI standard G86-0303. Specifically, the testing equipment is equipped with a load cell as a load measuring device, and the flexural strength of the test piece is calculated based on the load measured when the test piece is pressed with an indenter to break. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-94833 Summary of the Invention [Problem to be solved by the invention]

[0005] The testing device disclosed in Patent Document 1 presses the test piece with an indenter to destroy it. Therefore, the device is configured to move the indenter from above the test piece supported by a support unit to below the test piece. The distance the indenter moves is set with a sufficient margin to ensure that the test piece is destroyed.

[0006] However, the speed at which the indenter descends when the test piece is destroyed is slow, at 5 mm / min or less as specified in the SEMI standard. Therefore, if the indenter is allowed to move a sufficient distance, it takes a long time to complete the measurement.

[0007] On the other hand, if the moving distance of the indenter is insufficient, there is a risk that the test piece will not be broken reliably.

[0008] In view of the above problems, the present invention provides a novel testing device that can shorten the measurement time and avoid the problem of the test piece not being broken due to an insufficient movement distance of the indenter. [Means for solving the problem]

[0009] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0010] According to one aspect of the present invention, The test apparatus comprises a support unit that supports the underside of a test piece, a pressing unit that moves up and down and has an indenter that presses the test piece supported by the support unit, a drive mechanism that moves up and down the pressing unit, a load measuring instrument that measures the load generated when the indenter presses the test piece supported by the support unit, and a controller that controls the raising and lowering of at least the pressing unit, wherein the controller stops the movement of the indenter when the measurement value of the load measuring instrument changes from increasing to decreasing after the indenter starts pressing the test piece.

[0011] According to another aspect of the present invention, The controller stores a first control that stops the movement of the indenter when the measurement value of the load measuring instrument changes from increasing to decreasing after the indenter starts pressing the test piece, and a second control that stops the movement of the indenter when the measurement value of the load measuring instrument becomes zero, and the testing device is configured so that an operator can select either the first control or the second control.

[0012] According to another aspect of the present invention, The test method includes a supporting step of supporting the underside of the test piece with a supporting unit, a pressing step of pressing the test piece supported by the supporting unit with an indenter, a measuring step of measuring the load pressed by the indenter with a load measuring device as the pressing step begins, and a first stopping step of stopping the movement of the indenter when the measurement value of the load measuring device changes from increasing to decreasing during the measuring step.

[0013] According to another aspect of the present invention, Instead of the first stopping step, in the measuring step, the movement of the indenter continues even after the measurement value of the load measuring instrument changes from increasing to decreasing, and a second stopping step is executed to stop the movement of the indenter when the measurement value of the load measuring instrument becomes zero. [Effects of the Invention]

[0014] The present invention has the following effects. That is, according to one aspect of the present invention, when the measurement value of the load measuring instrument changes from increasing to decreasing while the indenter is moving, the movement of the indenter is stopped as it is determined that the test piece has been broken. This minimizes the movement of the indenter and shortens the measurement time. Furthermore, by moving the indenter until the measurement value of the load measuring instrument changes from increasing to decreasing, it is possible to prevent the test piece from being broken due to insufficient movement of the indenter.

[0015] Furthermore, according to one aspect of the present invention, by executing the second control instead of the first control, it becomes possible to store the behavior of the test piece until it is completely divided and the load becomes zero. Furthermore, even in the case of the second control, the measurement can be terminated midway without moving the indenter to a distance that is sufficient to reliably destroy the test piece, thereby shortening the measurement time. [Brief explanation of the drawings]

[0016] [Figure 1]1 is a diagram showing the configuration of a pickup device equipped with a test device according to an embodiment of the present invention; [Figure 2] 1 is a diagram showing the configuration of a pickup device equipped with a test device according to an embodiment of the present invention; [Figure 3] FIG. 2 is a diagram illustrating the configuration of a wafer unit. [Figure 4] 1A and 1B are diagrams for explaining imaging of the top surface of a chip by a wafer imaging camera. [Figure 5] 10A and 10B are diagrams illustrating the pushing-up of a tip by a pushing-up mechanism. [Figure 6] FIG. 2 is a diagram illustrating an example of the configuration of a test device. [Figure 7] 1 is a flowchart showing the steps of a test method. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] 10 is a graph showing the relationship between time and the load measured by a load measuring instrument. [Figure 11] FIG. 10 is a diagram showing a situation in which the chip is completely separated and the measurement value of the load measuring instrument becomes zero. [Figure 12] 6 is a graph showing a case where the second movement control is performed. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 are diagrams showing the configuration of a pickup device 2 equipped with a test device 200 according to one embodiment of the present invention. In this way, the test device 200 may be attached to the pickup device 2, or may be configured as a stand-alone test device 200.

[0018] As shown in FIG. 1, the pickup device 2 includes a base 4 that supports each of the structural elements that make up the pickup device 2, and each of the elements is controlled by a controller 1.

[0019] 1, a cassette mounting table 5 is provided at one corner of the base 4, and a cassette 5a is mounted on the cassette mounting table 5. The cassette 5a contains, for example, a plurality of wafer units 11 shown in FIG.

[0020] 3, in the wafer unit 11, the back surface 13b of the wafer 13 is fixed to an annular frame 21 via tape 19, and the front surface 13a of the wafer 13 is exposed. Dividing points are formed on the wafer 13 by cutting or the like along intended dividing lines 17 extending in directions perpendicular to each other, and the wafer 13 is divided into a plurality of chips 23. A device 24 is formed on the front surface side of each chip 23.

[0021] An identification number for identifying each chip 23 is assigned to each chip 23 and stored in the controller 1 (FIG. 1). This identification number is assigned, for example, by calculating the number of chips from the wafer size, chip size, and images captured by the wafer imaging camera 60 (FIG. 1) input to the device, and based on, for example, the notch formed on the wafer. The flexural strength, which will be described later, and other information are stored in the controller 1 (FIG. 1) in association with this identification number. Note that the test to measure the flexural strength, which will be described later, may be performed on all chips or on only some of the chips.

[0022] 1, the wafer unit 11 is pulled out while being clamped by a clamp 22a on one side of the transport mechanism 20, and after being temporarily placed on the temporary placement mechanism 10, is transported to the frame holding mechanism 14 by a clamp 22b on the other side of the transport mechanism 20. The frame holding mechanism 14 comprises a frame support part 16 disposed on the lower side that moves up and down, and a frame pressing part 18 on the upper side, and the annular frame 21 of the wafer unit 11 is sandwiched and fixed between them. The frame pressing part 18 is provided with a notch 18a to allow the transport mechanism 20 to pass through.

[0023] 1 and 2, the frame holding mechanism 14 is supported by a positioning mechanism 30 that controls the position of the frame holding mechanism 14. The positioning mechanism 30 includes an X-axis movement mechanism 32 that moves the frame holding mechanism 14 along the X-axis direction, and a Y-axis movement mechanism 42 that moves the frame holding mechanism 14 along the Y-axis direction. The X-axis movement mechanism 32 and the Y-axis movement mechanism 42 control the horizontal position of the frame holding mechanism 14.

[0024] The X-axis movement mechanism 32 has a pair of guide rails 34 arranged on the base 4 along the X-axis direction, a ball screw 36 arranged parallel to the pair of guide rails 34, and a pulse motor 38 provided at one end of the ball screw 36.

[0025] A moving block 40 is slidably disposed on the pair of guide rails 34. A nut portion (not shown) is provided on the underside (back side) of the moving block 40, and this nut portion is threadedly engaged with a ball screw 36. When the ball screw 36 is rotated by a pulse motor 38, the moving block 40 moves in the X-axis direction.

[0026] The Y-axis moving mechanism 42 has a pair of guide rails 44 arranged along the Y-axis direction on the moving block 40, a ball screw 46 arranged in parallel between the pair of guide rails 44, and a pulse motor 48 provided at one end of the ball screw 46.

[0027] 1, the frame holding mechanism 14 is slidably disposed on a pair of guide rails 44. A nut portion (not shown) is provided on a support portion 14f of the frame holding mechanism 14, and this nut portion is threadedly engaged with a ball screw 46. When the ball screw 46 is rotated by a pulse motor 48, the frame holding mechanism 14 moves in the Y-axis direction.

[0028] 1 and 2, the moving block 40 is configured in a plate shape, and an opening 41 that penetrates in the vertical direction is formed below the frame holding mechanism 14. This opening 41 allows the pushing-up mechanism 50, which will be described later, to push up from below.

[0029] A rectangular opening 4b is provided in the region between the pair of guide rails 36 in the base 4. A cylindrical push-up mechanism 50 is provided inside this opening 4b to push up the chips 23 (FIG. 3) included in the wafer 13 of the wafer unit 11 from the bottom side upward. The push-up mechanism 50 is connected to a lifting mechanism (not shown) formed of a motor or the like, and moves up and down along the Z-axis direction.

[0030] With the annular frame 21 of the wafer unit 11 fixed by the frame holding mechanism 14, the frame holding mechanism 14 is moved along the X-axis direction by the positioning mechanism 30, whereby the wafer unit 11 is positioned above the opening.

[0031] As shown in Figures 1, 2, and 4, a wafer imaging camera 60 is provided on the path along which the frame holding mechanism 14 is moved to above the push-up mechanism 50, as an imaging means for imaging the top surface of the wafer 13 (Figure 4) attached to the annular frame 21 fixed by the frame holding mechanism 14.

[0032] As shown in FIG. 4, the upper surface of the wafer 13 is imaged by the wafer imaging camera 60, and the position of each chip 23 is obtained based on the image.

[0033] As shown in Figures 1 and 2, the frame holding mechanism 14 positioned above the opening 4b is adjusted in position by the positioning mechanism 30 (Figures 1 and 2) to align the position of the chip 23 to be picked up directly above the push-up mechanism 50, as shown in Figure 5.

[0034] 5 is a diagram showing the wafer unit 11 arranged above the push-up mechanism 50, which pushes up a predetermined chip 23. The push-up mechanism 50 is configured to move up and down in the Z-axis direction, and has a suction part formed in a hollow cylindrical shape that constitutes an outer layer part, and a quadrangular pillar-shaped push-up part arranged inside the suction part, and peels the chip 23 from the upper surface of the tape 19 by sucking the lower surface of the tape 19 with the suction part and pushing up the inside of the tape 19 with the push-up part.

[0035] As shown in FIG. 5, a pickup mechanism 70 is positioned above the push-up mechanism 50 to pick up the pushed-up chip 23.

[0036] As shown in Figure 2, the pickup mechanism 70 is equipped with a chip holder 76 (collet) that is capable of moving up and down in the Z-axis direction and that suction-holds the pushed-up chip, and is connected to a chip holder moving mechanism 80 that moves in the Y-axis direction.

[0037] 2, the chip holder 76 is provided at the tip of a horizontally extending arm 74 so as to be movable in the X-axis direction and the Z-axis direction. The rear end of the arm 74 is connected to a chip holder moving mechanism 80 via a moving base 72.

[0038] The pickup mechanism 70 is connected to a chip holder moving mechanism 80. The chip holder moving mechanism 80 includes a Y-axis moving mechanism 82 that moves the pickup mechanism 70 along the Y-axis direction, and a Z-axis moving mechanism 92 that moves the pickup mechanism 70 along the Z-axis direction. The Y-axis moving mechanism 82 and the Z-axis moving mechanism 92 control the positions of the chip holder 76 in the Y-axis and Z-axis directions.

[0039] The Y-axis movement mechanism 82 includes a pair of guide rails 84 arranged along the Y-axis direction. A ball screw 86 is arranged in parallel between the pair of guide rails 84, and a pulse motor 88 is connected to one end of the ball screw 86.

[0040] A movable block 90 is slidably mounted on a pair of guide rails 84, and a nut portion (not shown) of the movable block 90 is threaded onto a ball screw 86. Rotation of the ball screw 86 by a pulse motor 88 causes the movable block 90 to move in the Y-axis direction.

[0041] As shown in FIG. 2, the Z-axis movement mechanism 92 has a pair of guide rails 94 arranged along the Z-axis direction on the side of the moving block 90, a ball screw 96 arranged parallel to the pair of guide rails 94, and a pulse motor 98 provided at one end of the ball screw 96.

[0042] The movable base 72 of the pickup mechanism 70 is slidably mounted on a pair of guide rails 94, and the nut portion (not shown) of the movable base 72 is threaded onto a ball screw 96. Rotation of the ball screw 96 by a pulse motor 98 causes the movable base 72 to move in the Z-axis direction.

[0043] The pickup mechanism 70 configured as described above picks up the chip 23 pushed up by the push-up mechanism 50. An identification number is set to the chip 23 to be picked up, and the flexural strength and other information described below are linked to this identification number and stored in the controller 1 (FIG. 1).

[0044] 1, the back surface and side surfaces of the picked-up chip are observed by a chip observation mechanism 100. The chip observation mechanism 100 is configured to include a back surface observation mechanism 102 that observes the back surface of the chip and a side surface observation mechanism 112 that observes the side surface of the chip, and the back surface and side surfaces of the chip are imaged by each observation mechanism.

[0045] The chips observed by the chip observation mechanism 100 are stored in a chip storage tray 501 or transferred to a suitable testing device 200, where their flexural strength (bending strength) is measured.

[0046] Next, the configuration of the test apparatus 200 shown in FIG. 6 will be described. The testing device 200 is mainly composed of a support unit 210 that supports the chip 23 that serves as the test piece, a pressing unit 226 that moves up and down and is equipped with an indenter 204 that presses the chip 23 supported by the support unit 210, a drive unit 240 that moves up and down the pressing unit 226, and a load measuring instrument 225 that measures the load acting on the indenter 204.

[0047] To explain in detail below, the support unit 210 includes a pair of support bases 213 that support the chip 23. Each of the pair of support bases 213 is configured in a rectangular parallelepiped shape, with a gap 217 secured between them.

[0048] Support portions 215 each having a protruding ridge projecting upward are formed at opposing positions on the upper portions of the pair of support bases 213. Each support portion 215 is formed to extend in the Y-axis direction, and supports the chip 23 from below via the tape T.

[0049] The upper end of the support portion 215 is formed into a curved surface, and forms a fulcrum that supports the chip 23 via the tape T. Each support base 213 is configured to move in the X-axis direction by a drive mechanism (not shown), and the distance between the fulcrums of each support portion 215 is adjusted.

[0050] A pressing unit 226 is disposed above the support unit 210. The pressing unit 226 presses the chip 23, which serves as a test piece and is supported by the support unit 210, and measures the load applied to the indenter 204 of the pressing unit 226 when pressing the chip 23.

[0051] The pressing unit 226 includes a moving unit 228 that is moved up and down by a driving unit 240. A cylindrical first support member 227 is connected to the bottom of the moving unit 228, and a load measuring device 225 such as a load cell is fixed to the bottom of the first support member 227. The load measured by the load measuring device 225 is stored by the controller 1.

[0052] A clamping member 239 is connected to the lower part of the load measuring device 225 via a cylindrical second support member 229. The clamping member 239 is formed in a generally gate-like shape when viewed from the front, and an indenter 204 for pressing the chip 23 is fixed between a pair of clamping surfaces facing each other.

[0053] The indenter 204 is made of a plate-like member having a width in the same direction as the Y-axis direction along which the support portion 215 of the support unit 210 extends. The tip (lower end) of the indenter 204 is formed in a tapered, approximately V-shape that narrows in width in the X-axis direction toward the bottom. The tip of the indenter 204 is formed in a rounded shape (R-shape). The shape of the indenter 204 is not particularly limited.

[0054] A drive unit 240 that moves the pressing unit 226 in the vertical direction (Z-axis direction, up and down direction) is provided on the rear side (back side) of the pressing unit 226. The drive unit 240 includes a support structure 242 that forms a vertical surface, and a pair of guide rails 244 are fixed at a predetermined interval along the Z-axis direction on the front side (surface side) of the support structure 242.

[0055] A ball screw 246 is disposed between the pair of guide rails 244 in parallel with the pair of guide rails 244 , and a pulse motor 248 is connected to one end of the ball screw 246 .

[0056] The rear side of the moving unit 228 is slidably mounted on a pair of guide rails 244, and the rear side of the moving unit 228 is screwed onto a ball screw 246 via a connecting portion (not shown).

[0057] When the ball screw 246 is rotated by the pulse motor 248 , the moving unit 228 moves in the Z-axis direction along the guide rail 244 , and the indenter 204 moves relatively closer to and away from the support unit 210 .

[0058] The moving unit 228 is provided with a scale reading unit 221 for reading the graduations of the scale 222 and detecting the height position in the Z-axis direction of the moving unit 228. The controller 1 can identify the position of the tip of the indenter 204 based on the position of the scale reading unit 221.

[0059] Next, a test method using the above-described device configuration will be described. FIG. 7 is a flowchart showing an example of a test method, and each step shown in this flowchart will be explained below in order.

[0060] <Preparation steps> 6, as a preparation step, the thickness of the chip 23, which is the test piece, is stored in advance in the controller 1. Also, alignment (setup) is performed to define the relative positional relationship in the height direction between the tip of the indenter 204 and the apex (upper end) of the support part 215.

[0061] The controller 1 also includes a timer and a storage unit for acquiring the graphs shown in Fig. 10 and Fig. 12. The controller 1 is also configured to be able to select, by an operator's setting, either a first control that executes a first stopping step, which will be described later, or a second control that executes a second stopping step.

[0062] <Support Step> 8, this is a step in which the lower surface side of the chip 23 is supported by the support unit 210. In this state, the lower surface side of the chip 23 is supported by a pair of support parts 215.

[0063] <Pressing step> As shown in FIG. 9, this is a step in which the chip 23 supported by the support unit 210 is pressed by the indenter 204.

[0064] 6, the controller 1 drives the pulse motor 248 to lower the entire pressing unit 226. At this time, for example, as shown in FIG. 8, while the tip of the indenter 204 moves a distance H3, that is, while moving a distance H3 obtained by subtracting the thickness d of the chip and a margin distance H2 from the distance H1 from the origin position H0 of the indenter 204 to the upper end of the support part 215 of the support unit 210, the tip moves at a lowering speed of 0.1 mm / s, for example.

[0065] After the indenter 204 reaches the height position H3, it is lowered at a slower descent speed of, for example, 10 μm / s until the tip of the indenter 204 reaches the tip 23. Here, by changing the speed at the height position H3, that is, by lowering at a relatively fast descent speed up to the height position H3, it is possible to improve the throughput of the test. Alternatively, it may be possible to lower the indenter 204 from the origin position H0 at a relatively slow descent speed of 10 μm / s.

[0066] <Measurement steps> As shown in FIG. 9, when the pressing step starts, the load applied by the indenter 204 is measured by the load measuring device 225 .

[0067] As shown in Fig. 9, when the tip of the indenter 204 reaches the tip 23, a reaction force F is generated in the tip 23, and a load acts on the indenter 204. This load is measured by the load measuring device 225 (Fig. 6), and data such as the change line G1 shown in Fig. 10 is obtained. In the graph of Fig. 10, the horizontal axis represents time and the vertical axis represents the load measured by the load measuring device 225. The controller 1 obtains and stores the load, for example, every 5 ms.

[0068] <First stopping step> In the measurement step, when the measurement value of the load measuring device 225 changes from an increase to a decrease, the movement of the indenter 204 is stopped (first control).

[0069] 10 shows a case where a change point P1 appears at time T1, where the measurement value of the load measuring device 225 changes from increasing to decreasing. When the controller 1 (FIG. 6) detects such a change in the measurement value, it stops the movement of the indenter 204.

[0070] In this way, when the measurement value of the load measuring device 225 changes from increasing to decreasing (change point P1), it is determined that damage has occurred in the tip 23, and the movement of the indenter 204 is stopped (first stopping step). This damage may occur when one or more layers in the laminated structure constituting the tip 23 are damaged, or may occur when the tip 23 is completely broken into multiple pieces 23a, as shown in FIG.

[0071] In this case, when the load applied to the indenter 204 decreases, the movement of the indenter 204 can be stopped immediately, thereby shortening the measurement time.

[0072] Furthermore, when the measurement value of this load measuring instrument 225 changes from an increase to a decrease, it is assumed that so-called initial fracture has occurred, and the flexural strength (the flexural strength by three-point bending according to SEMI standard G86-0303) can be calculated based on the measurement value at the time of this initial fracture. This flexural strength is used, for example, when setting the processing conditions for back grinding of the wafer.

[0073] 9, the bending strength can be obtained by calculating the bending stress value σ. Specifically, as shown in FIG. 9, when the maximum value of the load applied to the indenter 204 is W [N], the distance between the upper ends of the pair of support portions 215 is L [mm], the width of the tip 23 (the length of the tip 23 in the direction perpendicular to the line connecting the pair of support portions 215 (Y-axis direction)) is b [mm], and the thickness of the tip 23 is h [mm], the bending stress value σ=3WL / 2bh 2 This becomes:

[0074] Furthermore, the controller 1 may acquire the load every 5 ms, for example, and use the load K1 at a certain measurement time T1 as a reference. When the load Kx at a subsequent measurement time is greater than the load K1 by a predetermined value Ka, it is determined that a break has occurred and the movement of the indenter 204 may be stopped. This allows the measurement to continue without stopping the descent of the indenter when the load only slightly decreases, and the measurement can be continued until, for example, a significant break occurs. The predetermined value Ka can be set by the operator, for example, to 5% to 10% of the load K1.

[0075] <Second stopping step> This second stop step (second control) is executed at the discretion of the operator in place of the first stop step (first control), and makes it possible to memorize the behavior until the chip is completely separated and the load becomes zero.

[0076] Specifically, in the measurement step, the movement of the indenter 204 continues even after the measurement value of the load measuring instrument 225 changes from increasing to decreasing, and the movement of the indenter 204 is stopped when the tip 23 is completely divided and the measurement value of the load measuring instrument 225 becomes zero, as shown in Figure 11.

[0077] 12, a change point P4 appears at time T2, the chip breaks completely, and the load on the indenter 204 becomes zero. Then, by lowering the indenter 204 until time T2 when change point P4 occurs, each of change points P2 and P3 leading up to change point P4 can be recorded, and the behavior of the chip until it breaks completely can be analyzed.

[0078] Furthermore, the change points P2 and P3 become more pronounced when devices are formed on the chip, and therefore the second control can be particularly suitably employed when measuring the die strength when devices are formed on the chip.

[0079] Furthermore, by performing the second stopping step, when the load on the indenter 204 becomes zero, the movement of the indenter 204 can be immediately stopped and the test can be completed, thereby shortening the measurement time.

[0080] As explained above, first, as shown in Fig. 10, when the measurement value of the load measuring instrument changes from increasing to decreasing while the indenter is moving, it is determined that the test piece has been broken and the movement of the indenter is stopped. This makes it possible to minimize the movement of the indenter and shorten the measurement time. Furthermore, by moving the indenter until the measurement value of the load measuring instrument changes from increasing to decreasing, it is possible to prevent the risk of the test piece not being broken due to insufficient movement of the indenter.

[0081] 12, by executing the second control instead of the first control, it becomes possible to store the behavior of the test piece until it is completely divided and the load becomes zero. Even in the case of the second control, the measurement can be terminated midway without moving the indenter to a distance that allows a sufficient margin for surely destroying the test piece, thereby shortening the measurement time. [Explanation of symbols]

[0082] 23 chips 200 Test Equipment 204 Indenter 210 Support Unit 213 Support stand 215 Support part 217 Gap 221 Scale reading unit 222 scale 225 Load Measuring Instrument 226 Pressing unit 228 Mobile Unit 239 Clamping member 240 drive unit 242 Support structure 244 Guide Rail 246 Ball screw 248 Pulse motor P1 change point G1 Change Line K load Ka specified value

Claims

1. a support unit that supports the lower surface side of the test piece; a pressing unit that moves up and down and includes an indenter that presses the test piece supported by the support unit; a drive mechanism for raising and lowering the pressing unit; a load measuring instrument that measures a load generated when the indenter presses the test piece supported by the support unit; A testing device comprising: a controller that controls at least the elevation of the pressing unit; The controller The indenter starts to descend from an origin position away from the test piece, After the indenter starts to press the test piece, The device is configured to be able to stop the movement of the indenter when the measurement value of the load measuring device changes from increasing to decreasing. Test equipment.

2. A testing device as described in claim 1, characterized in that the indenter presses against the test piece to destroy it.

3. The controller includes: After the indenter starts to press the test piece, a first control that stops the movement of the indenter when the measurement value of the load measuring instrument changes from increasing to decreasing; a second control for stopping the movement of the indenter when the measurement value of the load measuring instrument becomes zero; An operator is configured to be able to select either the first control or the second control.

3. The test device according to claim 1 or 2.

4. The controller The lowering speed of the indenter before the indenter starts to press the test piece can be set to different lowering speeds depending on the distance to the test piece.

4. The test device according to claim 1, wherein the test device is a test device for detecting a temperature difference between the test area and the test area.

5. a supporting step for supporting the lower surface side of the test piece with a supporting unit; a pressing step of lowering an indenter from an origin position away from the test piece and pressing the test piece supported by the support unit with the indenter; a measuring step of measuring the load applied by the indenter with a load measuring device at the start of the pressing step; a first stopping step of stopping the movement of the indenter when the measurement value of the load measuring instrument changes from increasing to decreasing in the measuring step.

6. A test method as described in Claim 5, characterized in that the indenter presses against the test piece to destroy it.

7. Instead of the first stopping step, In the measuring step, the movement of the indenter is continued even after the measured value of the load measuring instrument changes from increasing to decreasing, and a second stopping step is executed in which the movement of the indenter is stopped when the measured value of the load measuring instrument becomes zero.

7. The test method according to claim 5 or 6.

8. The descending speed of the indenter before the indenter starts to press the test piece is varied depending on the distance to the test piece.

8. The test method according to claim 5, wherein the test is performed in a manner similar to that described in claim 5.

Images