Monitoring method for substrate processing apparatus and substrate processing apparatus

Abstract

To provide a monitoring method for monitoring a monitoring object with higher accuracy and a substrate processing apparatus.SOLUTION: A monitoring method in a substrate processing apparatus includes a setup processing step, an imaging step, and a monitoring step. The setup processing step includes: a pre-imaging step S11 of making a camera generate a plurality of pre-photographed images corresponding to a plurality of irradiation modes while sequentially irradiating an imaging region including a monitoring object with illumination light in the plurality of irradiation modes; a pre-specifying step S12 of specifying a non-entity region showing at least one of a shadow of an object and a reflection image included in the pre-photographed image in the first irradiation mode on the basis of a difference between the plurality of pre-photographed images; and a storage step S13 of storing non-entity region data in a storage unit. In the imaging step after the setup processing step, the camera generates a monitoring photographed image while irradiating an imaging region with illumination light in the first irradiation mode. In the monitoring step, the monitoring object is monitored on the basis of a region excluding the non-entity region in the monitoring photographed image.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a monitoring method for a substrate processing apparatus and a substrate processing apparatus. [Background technology]

[0002] Conventionally, in manufacturing processes for semiconductor devices and the like, various processing liquids, such as pure water, photoresist liquid, and etching liquid, are supplied to substrates to perform various substrate processing processes, such as cleaning and resist coating. A widely used apparatus for performing substrate processing using these processing liquids is a substrate processing apparatus in which a substrate holder rotates the substrate in a horizontal position while ejecting the processing liquid from a nozzle onto the surface of the substrate. For example, the nozzle ejects the processing liquid from a processing position vertically opposite the center of the upper surface of the substrate. The processing liquid that lands in the center of the substrate spreads over the surface of the substrate due to centrifugal force caused by the rotation of the substrate. At this time, the processing liquid acts on the surface of the substrate, thereby processing the substrate.

[0003] In such substrate processing apparatuses, whether the nozzle position is appropriate is monitored. For example, in Patent Document 1, an imaging means such as a camera is provided to monitor the nozzle position.

[0004] In Patent Document 1, the camera is provided above the substrate holder. The camera captures an image of an imaging area including the substrate held by the substrate holder and the nozzle, and generates a captured image. In Patent Document 1, a reference image including the nozzle is set in advance, and the position of the nozzle is detected by matching the captured image captured by the camera with the reference image. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-173148 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to properly process a substrate, it is desirable to monitor more than just the nozzle.

[0007] For example, the substrate holding unit includes a disk-shaped spin base provided below the substrate, and a plurality of chuck pins arranged in a line in the circumferential direction along the periphery of the substrate on the upper surface of the spin base. The substrate holding unit can hold the substrate when the plurality of chuck pins move to a holding position where they abut against the periphery of the substrate, and the substrate is released from its hold when the plurality of chuck pins move to a release position away from the periphery of the substrate.

[0008] If an abnormality occurs and the chuck pins cannot move to the holding position, the substrate holder cannot hold the substrate normally.

[0009] Therefore, it is conceivable that a camera captures an image of an imaging area including the chuck pin, generates captured image data, and an image processing unit monitors the position of the chuck pin based on the captured image data.

[0010] However, the captured image data may include not only such monitored objects but also non-physical objects, such as shadows or reflected images of objects. A reflected image is, for example, an image reflected on the surface of a substrate. If such non-physical objects are adjacent to or overlap with the monitored objects in the captured image data, there is a problem that the monitoring accuracy is reduced.

[0011] Therefore, an object of the present disclosure is to provide a technology that can monitor a monitoring target with higher accuracy. [Means for solving the problem]

[0012] A first aspect is a monitoring method for a substrate processing apparatus, comprising: a pre-imaging step of sequentially irradiating an imaging area including an object to be monitored within a chamber that houses a substrate holder that holds a substrate with illumination light in a plurality of illumination modes while a camera sequentially images the imaging area to generate a plurality of pre-imaging image data corresponding to the plurality of illumination modes; a pre-identification step of identifying a non-substantial area that indicates at least one of a shadow and a reflected image of an object contained in the pre-imaging image data when the illumination light is irradiated in a first illumination mode based on differences between the plurality of pre-imaging image data; and a storage step of storing non-substantial area data that indicates the position and shape of the non-substantial area in a storage unit; an imaging step, after the setup processing step, of irradiating the imaging area with the illumination light in the first illumination mode while the camera images the imaging area to generate monitoring image data; and a monitoring step of monitoring the object to be monitored based on an area of ​​the monitoring image data excluding the non-substantial area indicated by the non-substantial area data stored in the storage unit.

[0013] A second aspect is a monitoring method for a substrate processing apparatus according to the first aspect, wherein the memory unit stores reference image data including a normal monitored object, and in the monitoring process, the monitored object is monitored based on a comparison between removed image data in which the non-substantial area has been removed from the monitoring capture image data and removed reference image data in which an area identical to the non-substantial area has been removed from the reference image data.

[0014] A third aspect is a monitoring method for a substrate processing apparatus, comprising: a pre-imaging step of sequentially irradiating an imaging area including a monitored object in a chamber that houses a substrate holding part that holds a substrate with illumination light in a plurality of illumination modes while a camera sequentially images the imaging area to generate a plurality of pre-imaging image data corresponding to the plurality of illumination modes; a pre-identification step of identifying a non-substantial area that indicates at least one of a shadow and a reflected image of an object included in the pre-imaging image data when the illumination light is irradiated in a first illumination mode based on differences between the plurality of pre-imaging image data; and a storage step of storing non-substantial area data that indicates the position and shape of the non-substantial area in a storage unit; an imaging step, after the setup processing step, of imaging the imaging area while irradiating the illumination light onto the imaging area in the first illumination mode to generate monitoring image data; and a monitoring step of monitoring the monitored object based on a comparison of the monitoring image data with reference image data that includes the monitored object in a normal state and does not include the same area as the non-substantial area indicated by the non-substantial area data stored in the storage unit.

[0015] A fourth aspect is a monitoring method for a substrate processing apparatus according to any one of the first to third aspects, wherein the plurality of irradiation aspects include an aspect in which the illumination light is irradiated onto the imaging area from different irradiation positions.

[0016] A fifth aspect is a monitoring method for a substrate processing apparatus according to any one of the first to fourth aspects, wherein the plurality of irradiation modes include a mode in which the illumination light having mutually different wavelength spectra is irradiated onto the imaging area.

[0017] A sixth aspect is a monitoring method for a substrate processing apparatus according to any one of the first to fifth aspects, wherein the plurality of irradiation modes include a mode in which the illumination light having different light intensities is irradiated onto the imaging area.

[0018] A seventh aspect is a monitoring method for a substrate processing apparatus according to any one of the first to sixth aspects, wherein in the pre-identification process, the non-substantial area is identified based on the difference between the pre-captured image data corresponding to the first irradiation aspect and the average image data of the multiple pre-captured image data.

[0019] An eighth aspect is a substrate processing apparatus comprising: a chamber; a substrate holding unit provided within the chamber for holding a substrate; an illumination unit for irradiating an imaging area including an object to be monitored within the chamber with illumination light; a camera for imaging the imaging area and generating captured image data; a memory unit for storing non-substantial area data indicating the position and shape of a non-substantial area that indicates at least one of a shadow and a reflected image of an object included in the captured image data; and a control unit for monitoring the object to be monitored based on an area of ​​the captured image data excluding the non-substantial area indicated by the non-substantial area data stored in the memory unit.

[0020] A ninth aspect is a substrate processing apparatus comprising: a chamber; a substrate holding unit disposed within the chamber for holding a substrate; an illumination unit for irradiating an imaging area including a monitored object within the chamber with illumination light; a camera for imaging the imaging area and generating captured image data; a memory unit for storing non-substantial area data indicating the position and shape of a non-substantial area that indicates at least one of a shadow and a reflected image of an object included in the captured image data; and a control unit for monitoring the monitored object based on a comparison with reference image data that includes the monitored object in its normal state and does not include an area identical to the non-substantial area indicated by the non-substantial area data stored in the memory unit. [Effects of the Invention]

[0021] According to the first, third, eighth and ninth aspects, it is possible to avoid the influence of the immaterial region and monitor the monitoring target with higher accuracy.

[0022] According to the second aspect, since the non-substantial regions are deleted from the monitoring captured image data and the reference image data, the influence of the non-substantial regions can be avoided when comparing the removed image data with the removed reference image data. As a result, the influence of the non-substantial regions can be avoided and the monitoring target can be monitored with higher accuracy.

[0023] According to the fourth aspect, the positions and shapes of the non-substantial regions differ among the plurality of pre-captured images, making it easy to identify the non-substantial regions.

[0024] According to the fifth aspect, there is no need to provide a plurality of illumination units or to move the illumination units.

[0025] According to the sixth aspect, there is no need to provide a plurality of illumination units or to move the illumination units, and an inexpensive light source can be used for the illumination units.

[0026] According to the seventh aspect, it is possible to identify an insubstantial region with higher accuracy. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus. [Figure 2] FIG. 2 is a plan view schematically illustrating an example of the configuration of a processing unit according to the first embodiment. [Figure 3] FIG. 2 is a longitudinal sectional view schematically showing an example of the configuration of a processing unit according to the first embodiment. [Figure 4] FIG. 2 is a functional block diagram illustrating an example of an internal configuration of a control unit. [Figure 5] 1 is a flowchart showing an example of a flow of substrate processing. [Figure 6] FIG. 2 is a diagram schematically illustrating an example of a captured image generated by a camera capturing an image of an imaging area. [Figure 7] 10 is a flowchart illustrating an example of a flowchart of a setup process. [Figure 8]10 is a flowchart showing a specific example of a pre-imaging step. [Figure 9] 7 is a diagram schematically illustrating an example of a captured image when illumination light is irradiated from an irradiation position different from that in FIG. 6. FIG. [Figure 10] 10 is a flowchart illustrating an example of a monitoring process. [Figure 11] FIG. 10 is a diagram schematically illustrating an example of a captured image generated in an imaging step. [Figure 12] 10 is a diagram showing an example of how a non-substantial region is deleted from a surveillance-captured image. [Figure 13] FIG. 2 is a diagram schematically illustrating an example of a captured image. [Figure 14] FIG. 2 is a diagram schematically illustrating an example of a captured image. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the drawings are schematic, and for the sake of convenience, components may be omitted or simplified as appropriate. Furthermore, the relative sizes and positions of components shown in the drawings are not necessarily accurately depicted and may be changed as appropriate.

[0029] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0030] Furthermore, in the following description, even if ordinal numbers such as "first" or "second" are used, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the ordering that may result from these ordinal numbers.

[0031] When expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) are used, unless otherwise specified, the expressions not only strictly represent the positional relationship but also represent a state in which there is a relative displacement in terms of angle or distance within a range in which tolerance or equivalent functionality is obtained. When expressions indicating an equal state (e.g., "identical," "equal," "homogeneous," etc.) are used, the expressions not only represent a state in which there is strict quantitative equality but also represent a state in which there is a difference in which tolerance or equivalent functionality is obtained, unless otherwise specified. When expressions indicating a shape (e.g., "rectangular shape" or "cylindrical shape," etc.) are used, the expressions not only represent a geometrically strict shape but also represent a shape with, for example, irregularities or chamfers within a range in which equivalent effects are obtained, unless otherwise specified. When the expressions "comprise," "include," "have," "includes," "includes," or "have" are used to describe one component, the expressions are not exclusive expressions that exclude the presence of other components. When the phrase "at least one of A, B, and C" is used, the phrase includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0032] <Overall configuration of substrate processing equipment> FIG. 1 is a plan view showing a schematic configuration example of a substrate processing apparatus 100. The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W to be processed one by one. The substrate processing apparatus 100 performs liquid processing on the substrates W using a chemical solution and a rinse solution such as pure water, and then performs a drying process. The substrate W is, for example, a semiconductor substrate having a disk shape. Examples of the chemical solution include a mixed solution (SC1) of ammonia and hydrogen peroxide, a mixed aqueous solution (SC2) of hydrochloric acid and hydrogen peroxide, or dilute hydrofluoric acid (DHF). In the following description, the chemical solution, rinse solution, organic solvent, etc. are collectively referred to as the "processing solution." It should be noted that the "processing solution" includes not only chemical solutions used in cleaning processes, but also chemical solutions for removing unnecessary films and chemical solutions for etching.

[0033] The substrate processing apparatus 100 includes a plurality of processing units 1, a load port LP, an indexer robot 102, a main transport robot 103, and a control unit 9.

[0034] The load port LP is an interface unit for loading and unloading substrates W between the substrate processing apparatus 100 and the outside. A container (also called a carrier) containing a plurality of unprocessed substrates W is loaded into the load port LP from the outside. The load port LP can hold a plurality of carriers. Each substrate W is removed from the carrier by the substrate processing apparatus 100, processed as described below, and then stored back in the carrier. The carrier containing the processed substrates W is then unloaded from the load port LP to the outside.

[0035] The indexer robot 102 transports the substrates W between each carrier held on the load port LP and the main transport robot 103. The main transport robot 103 transports the substrates W between each processing unit 1 and the indexer robot 102.

[0036] Each processing unit 1 performs liquid processing and drying processing on one substrate W. The substrate processing apparatus 100 according to this embodiment is provided with 12 processing units 1 of similar configuration. Specifically, four towers, each including three processing units 1 stacked vertically, are arranged around the main transport robot 103. FIG. 1 shows a schematic diagram of one of the processing units 1 stacked in three tiers. The number of processing units 1 in the substrate processing apparatus 100 is not limited to 12 and may be changed as appropriate.

[0037] The main transport robot 103 is installed in the center of four towers in which processing units 1 are stacked. The main transport robot 103 carries the substrates W to be processed received from the indexer robot 102 into each processing unit 1. The main transport robot 103 also carries out processed substrates W from each processing unit 1 and hands them over to the indexer robot 102. The control unit 9 controls the operation of each component of the substrate processing apparatus 100.

[0038] Hereinafter, one of the twelve processing units 1 installed in the substrate processing apparatus 100 will be described.

[0039] <Processing unit> Fig. 2 is a plan view schematically showing an example of the configuration of the processing unit 1 according to the first embodiment. Fig. 3 is a vertical cross-sectional view schematically showing an example of the configuration of the processing unit 1 according to the first embodiment.

[0040] In the example of FIGS. 2 and 3, the processing unit 1 includes a substrate holder 20, a first nozzle 30, a second nozzle 60, a third nozzle 65, a guard unit 40, a camera 70, and an illumination unit 71.

[0041] 2 and 3, the processing unit 1 also includes a chamber 10. The chamber 10 includes a sidewall 11 extending in the vertical direction, a ceiling wall 12 that closes the upper side of the space enclosed by the sidewall 11, and a floor wall 13 that closes the lower side. A processing space is formed in the space enclosed by the sidewall 11, the ceiling wall 12, and the floor wall 13. A loading / unloading port through which the main transport robot 103 loads and unloads the substrate W, and a shutter that opens and closes the loading / unloading port are provided in part of the sidewall 11 of the chamber 10 (all not shown). The chamber 10 houses a substrate holder 20, a first nozzle 30, a second nozzle 60, a third nozzle 65, and a guard unit 40.

[0042] 3, a fan filter unit (FFU) 14 is attached to the ceiling wall 12 of the chamber 10 to further purify the air in a clean room in which the substrate processing apparatus 100 is installed and supply the purified air to the processing space in the chamber 10. The fan filter unit 14 includes a fan and a filter (e.g., a HEPA (High Efficiency Particulate Air) filter) for taking in air from the clean room and sending it into the chamber 10, and forms a downflow of purified air in the processing space in the chamber 10. A punched plate with a large number of blow-out holes may be provided directly below the ceiling wall 12 to uniformly distribute the purified air supplied from the fan filter unit 14.

[0043] The substrate holder 20 holds the substrate W in a horizontal position (a position in which the normal is along the vertical direction) and rotates the substrate W around a rotation axis CX (see FIG. 3). The rotation axis CX is an axis that is along the vertical direction and passes through the center of the substrate W. The substrate holder 20 is also called a spin chuck. Note that FIG. 2 shows the substrate holder 20 in a state in which it is not holding a substrate W.

[0044] 2 and 3, the substrate holding unit 20 includes a disk-shaped spin base 21 that is arranged in a horizontal position. The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the substrate holding unit 20 (see FIG. 3). Thus, the spin base 21 has an upper surface 21a that faces the entire lower surface of the substrate W to be held in the vertical direction.

[0045] 2 and 3, a plurality of chuck pins 26 (four in this embodiment) are erected on the peripheral edge of the upper surface 21a of the spin base 21. The plurality of chuck pins 26 are arranged at equal intervals along a circumference corresponding to the peripheral edge of the circular substrate W. Each chuck pin 26 is provided so as to be drivable between a holding position in contact with the peripheral edge of the substrate W and an open position spaced apart from the peripheral edge of the substrate W. The plurality of chuck pins 26 are driven in conjunction with each other by a link mechanism (not shown) housed in the spin base 21. The substrate holder 20 can hold the substrate W in a horizontal position close to the upper surface 21a above the spin base 21 by stopping the plurality of chuck pins 26 at their respective holding positions (see FIG. 3), and can release the substrate W from its holding by stopping the plurality of chuck pins 26 at their respective open positions.

[0046] 3, the upper end of a rotation shaft 24 extending along the rotation axis CX is connected to the lower surface of the spin base 21. A spin motor 22 that rotates the rotation shaft 24 is provided below the spin base 21. The spin motor 22 rotates the rotation shaft 24 about the rotation axis CX, thereby rotating the spin base 21 within a horizontal plane. As a result, the substrate W held by the chuck pins 26 also rotates about the rotation axis CX.

[0047] 3, a cylindrical cover member 23 is provided to surround the periphery of the spin motor 22 and the rotation shaft 24. The lower end of the cover member 23 is fixed to the floor wall 13 of the chamber 10, and the upper end reaches directly below the spin base 21. In the example of FIG. 3, a flange-shaped member 25 is provided at the upper end of the cover member 23, which extends outward from the cover member 23 almost horizontally and then bends downward.

[0048] The first nozzle 30 ejects a processing liquid toward the substrate W to supply the processing liquid to the substrate W. In the example of FIG. 2, the first nozzle 30 is attached to the tip of a nozzle arm 32. The nozzle arm 32 extends horizontally, and its base end is connected to a nozzle support column 33. The nozzle support column 33 extends vertically and is rotatable about a vertical axis by an arm drive motor (not shown). As the nozzle support column 33 rotates, the first nozzle 30 moves in an arc between a nozzle processing position and a nozzle standby position in a space vertically above the substrate holder 20, as indicated by arrow AR34 in FIG. 2. The nozzle processing position is a position where the first nozzle 30 ejects a processing liquid onto the substrate W, e.g., a position vertically opposite the center of the substrate W. The nozzle standby position is a position where the first nozzle 30 does not eject a processing liquid onto the substrate W, e.g., a position radially outward from the periphery of the substrate W. The radial direction here refers to the radial direction about the rotation axis CX. Figure 2 shows the first nozzle 30 positioned at the nozzle standby position, and Figure 3 shows the first nozzle 30 positioned at the nozzle operating position.

[0049] 3, the first nozzle 30 is connected to a processing liquid supply source 36 via a supply pipe 34. The processing liquid supply source 36 includes a tank that stores the processing liquid. A valve 35 is provided on the supply pipe 34. When the valve 35 is opened, the processing liquid is supplied from the processing liquid supply source 36 through the supply pipe 34 to the first nozzle 30, and is then ejected from an ejection port formed in the lower end surface of the first nozzle 30. The first nozzle 30 may be configured to be supplied with a plurality of types of processing liquid (including at least pure water).

[0050] The second nozzle 60 is attached to the tip of a nozzle arm 62, and the base end of the nozzle arm 62 is connected to a nozzle support column 63. A motor for driving the arm (not shown) rotates the nozzle support column 63, causing the second nozzle 60 to move in an arc in the space vertically above the substrate holding unit 20, as shown by arrow AR64. Similarly, the third nozzle 65 is attached to the tip of a nozzle arm 67, and the base end of the nozzle arm 67 is connected to a nozzle support column 68. A motor for driving the arm (not shown) rotates the nozzle support column 68, causing the third nozzle 65 to move in an arc in the space vertically above the substrate holding unit 20, as shown by arrow AR69.

[0051] Like the first nozzle 30, the second nozzle 60 and the third nozzle 65 are each connected to a processing liquid supply source (not shown) via a supply pipe (not shown). Each supply pipe is provided with a valve, and the supply / stop of the processing liquid is switched by opening and closing the valve. The number of nozzles provided in the processing unit 1 is not limited to three, and may be one or more.

[0052] During liquid processing, the processing unit 1 rotates the substrate W using the substrate holder 20 while ejecting the processing liquid from, for example, the first nozzle 30 toward the upper surface of the substrate W. The processing liquid that has landed on the upper surface of the substrate W spreads over the upper surface of the substrate W due to centrifugal force caused by the rotation and is scattered from the periphery of the substrate W. This liquid processing allows the upper surface of the substrate W to be treated in accordance with the type of processing liquid.

[0053] The guard section 40 is a member for receiving processing liquid splashed from the periphery of the substrate W. The guard section 40 has a cylindrical shape surrounding the substrate holding section 20 and includes, for example, multiple guards that can be raised and lowered independently of each other. The guards may also be called processing cups. In the example of FIG. 3, the multiple guards are an inner guard 41, a middle guard 42, and an outer guard 43. Each of the guards 41 to 43 surrounds the periphery of the substrate holding section 20 and has a shape that is approximately rotationally symmetrical with respect to the rotation axis CX.

[0054] In the example shown in FIG. 3 , the inner guard 41 integrally includes a bottom portion 44, an inner wall portion 45, an outer wall portion 46, a first guide portion 47, and a middle wall portion 48. The bottom portion 44 has an annular shape in a plan view. The inner wall portion 45 and the outer wall portion 46 have cylindrical shapes and are respectively provided on the inner and outer peripheral edges of the bottom portion 44. The first guide portion 47 has a cylindrical tubular portion 47a provided on the bottom portion 44 between the inner wall portion 45 and the outer wall portion 46 and extending vertically upward from the upper end of the tubular portion 47a and approaching the rotation axis CX as it extends vertically upward. The middle wall portion 48 has a cylindrical shape and is provided on the bottom portion 44 between the first guide portion 47 and the outer wall portion 46.

[0055] When the guards 41 to 43 are raised (see the imaginary lines in FIG. 3), the processing liquid splashed from the periphery of the substrate W is received by the inner peripheral surface of the first guide portion 47, flows down along the inner peripheral surface, and is received in the waste groove 49. The waste groove 49 is an annular groove formed by the inner wall portion 45, the first guide portion 47, and the bottom portion 44. A liquid exhaust mechanism (not shown) is connected to the waste groove 49 to discharge the processing liquid and to forcibly exhaust the air from the inside of the waste groove 49.

[0056] The middle guard 42 integrally includes a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52. The second guide portion 52 has a cylindrical tubular portion 52a and an inclined portion 52b that approaches the rotation axis CX as it extends vertically upward from the upper end of the tubular portion 52a. The inclined portion 52b is located vertically above the inclined portion 47b of the inner guard 41 and is arranged to overlap with the inclined portion 47b in the vertical direction. The tubular portion 52a is housed in an annular inner recovery groove 50. The inner recovery groove 50 is a groove formed by the first guide portion 47, the middle wall portion 48, and the bottom portion 44.

[0057] When only the guards 42 and 43 are raised, the processing liquid from the periphery of the substrate W is received by the inner peripheral surface of the second guide portion 52 , flows down along the inner peripheral surface, and is received in the inner recovery groove 50 .

[0058] The processing liquid separation wall 53 has a cylindrical shape, and its upper end is connected to the second guide part 52. The processing liquid separation wall 53 is housed in an annular outer recovery groove 51. The outer recovery groove 51 is a groove formed by the middle wall part 48, the outer wall part 46, and the bottom part 44.

[0059] The outer guard 43 is located outside the middle guard 42 and functions as a third guide section that guides the treatment liquid to the outer recovery groove 51. The outer guard 43 integrally includes a cylindrical portion 43a and an inclined portion 43b that approaches the rotation axis CX as it extends vertically upward from the upper end of the cylindrical portion 43a. The cylindrical portion 43a is housed within the outer recovery groove 51, and the inclined portion 43b is located vertically above the inclined portion 52b and is arranged to overlap the inclined portion 52b in the vertical direction.

[0060] When only the outer guard 43 is raised, the processing liquid from the periphery of the substrate W is received by the inner peripheral surface of the outer guard 43 , flows down along the inner peripheral surface, and is received in the outer recovery groove 51 .

[0061] The inner recovery groove 50 and the outer recovery groove 51 are connected to recovery mechanisms (both not shown) for recovering the processing liquid into a recovery tank provided outside the processing unit 1.

[0062] The guards 41 to 43 can be raised and lowered by a guard lifting mechanism 55. The guard lifting mechanism 55 raises and lowers the guards 41 to 43 between their respective guard processing positions and guard standby positions so that the guards 41 to 43 do not collide with each other. The guard processing position is a position where the upper edge of the target guard to be raised and lowered is above the upper surface of the substrate W, and the guard standby position is a position where the upper edge of the target guard is below the upper surface 21a of the spin base 21. The upper edge here refers to the annular portion that forms the upper opening of the target guard. In the example of FIG. 3, the guards 41 to 43 are located at the guard standby position. The guard lifting mechanism 55 includes, for example, a ball screw mechanism and a motor or an air cylinder.

[0063] The partition plate 15 is provided around the guard portion 40 to divide the inner space of the chamber 10 into upper and lower portions. The partition plate 15 may have through-holes and cutouts (not shown) that penetrate in the thickness direction, and in this embodiment, through-holes are formed to allow the nozzle support columns 33, 63, and 68 to pass through. The outer peripheral edge of the partition plate 15 is connected to the side wall 11 of the chamber 10. The inner peripheral edge of the partition plate 15 that surrounds the guard portion 40 is formed into a circular shape with a diameter larger than the outer diameter of the outer guard 43. Therefore, the partition plate 15 does not obstruct the raising and lowering of the outer guard 43.

[0064] In the example of Figure 3, an exhaust duct 18 is provided in part of the side wall 11 of the chamber 10, near the floor wall 13. The exhaust duct 18 is connected to an exhaust mechanism (not shown). Of the clean air that flows down inside the chamber 10, the air that passes between the guard part 40 and the partition plate 15 is exhausted to the outside of the apparatus through the exhaust duct 18.

[0065] The camera 70 is used to monitor the state of an object to be monitored within the chamber 10. The object to be monitored includes, for example, at least one of the substrate holder 20, the first nozzle 30, the second nozzle 60, the third nozzle 65, and the guard unit 40. The camera 70 captures an image of an imaging area including the object to be monitored, generates captured image data (hereinafter simply referred to as a captured image), and outputs the captured image to the control unit 9. The control unit 9 monitors the state of the object to be monitored based on the captured image, as will be described in detail later.

[0066] The camera 70 includes a solid-state imaging element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), and an optical system such as a lens. In the example of Fig. 3, the camera 70 is installed at an imaging position vertically above the substrate W held by the substrate holder 20. In the example of Fig. 3, the imaging position is set vertically above the partition plate 15 and radially outward from the guard part 40. The radial direction here refers to the radial direction with respect to the rotation axis CX.

[0067] In the example of FIG. 3, a recessed portion (hereinafter referred to as a recessed wall portion 111) for accommodating the camera 70 is formed in the side wall 11 of the chamber 10. The recessed wall portion 111 has a shape that is recessed outward relative to the rest of the side wall 11. The camera 70 is accommodated inside the recessed wall portion 111. In the example of FIG. 3, a transparent member 72 is provided in front of the camera 70 in the imaging direction. The transparent member 72 has high translucency for the wavelength of light detected by the camera 70. Therefore, the camera 70 can image the imaging region within the processing space through the transparent member 72. In other words, the transparent member 72 is provided between the camera 70 and the imaging region. The transmittance of the transparent member 72 in the detection wavelength range of the camera 70 is, for example, 60% or more, preferably 80% or more. The transparent member 72 is formed of a transparent material such as quartz glass. In the example of FIG. 3, the transparent member 72 has a plate-like shape and, together with the recessed wall portion 111 of the side wall 11, forms an accommodation space for the camera 70. By providing the transparent member 72, the camera 70 can be protected from the processing liquid in the processing space and volatile components of the processing liquid.

[0068] The imaging area of ​​the camera 70 includes, for example, a portion of the substrate holding part 20 and the guard part 40. In the example of Fig. 3, the camera 70 captures an image of the imaging area obliquely downward from the imaging position. In other words, the imaging direction of the camera 70 is inclined vertically downward from the horizontal direction.

[0069] In the example of FIG. 3, the illumination unit 71 is provided at a position vertically above the partition plate 15. As a specific example, the illumination unit 71 is also provided inside the recessed wall portion 111. The illumination unit 71 includes a light source such as a light-emitting diode, and irradiates the imaging area with illumination light. If the inside of the chamber 10 is a darkroom, the control unit 9 may control the illumination unit 71 so that the illumination unit 71 illuminates the imaging area when the camera 70 takes an image. The illumination light from the illumination unit 71 passes through the transparent member 72 and is irradiated into the processing space.

[0070] The hardware configuration of the control unit 9 is the same as that of a general computer. That is, the control unit 9 is configured to include a data processing unit such as a CPU that performs various arithmetic processing, a non-temporary storage unit such as a ROM (Read Only Memory) that is a read-only memory that stores a basic program, and a temporary storage unit such as a RAM (Random Access Memory) that is a readable and writable memory that stores various information. When the CPU of the control unit 9 executes a predetermined processing program, the control unit 9 controls each operating mechanism of the substrate processing apparatus 100, and processing in the substrate processing apparatus 100 progresses. Note that the control unit 9 may be realized by a dedicated hardware circuit that does not require software to realize its functions.

[0071] 4 is a functional block diagram illustrating an example of the internal configuration of the control unit 9. As illustrated in FIG. 4, the control unit 9 includes an immaterial region identifying unit 91, a monitoring processing unit 92, and a processing control unit 93.

[0072] The non-substantial region identifying section 91 identifies a non-substantial region such as a shadow contained in a captured image. The non-substantial region identifying section 91 will be described in detail later.

[0073] The monitoring processing unit 92 monitors the state of the monitoring object based on the captured image. The monitoring processing unit 92 will also be described in detail later.

[0074] The process control unit 93 controls each component of the processing unit 1. More specifically, the process control unit 93 controls the spin motor 22, various valves such as the valve 35, arm drive motors that rotate each of the nozzle support columns 33, 63, and 68, the guard lifting mechanism 55, the fan filter unit 14, and the camera 70. The process control unit 93 controls these components in accordance with a predetermined procedure, thereby enabling the processing unit 1 to process the substrate W.

[0075] <An example of substrate processing flow> Here, an example of a specific flow of processing the substrate W will be briefly described. Fig. 5 is a flowchart showing an example of the flow of substrate processing. Initially, the guards 41 to 43 each stop at a guard standby position, and the nozzles 30, 60, 65 each stop at a nozzle standby position. Note that although the control unit 9 controls each component to perform a predetermined operation described below, the following description will focus on each component itself as the subject of the operation.

[0076] First, the main transport robot 103 loads an unprocessed substrate W into the processing unit 1, and the substrate holding part 20 holds the substrate W (step S1: loading and holding step). Initially, the guard part 40 is stopped at the guard standby position, so that collision between the hand of the main transport robot 103 and the guard part 40 can be avoided when the substrate W is loaded. When the substrate W is handed over to the substrate holding part 20, the multiple chuck pins 26 move to their respective holding positions, thereby holding the substrate W.

[0077] Next, the spin motor 22 starts rotating the substrate W (step S2: rotation start step). Specifically, the spin motor 22 rotates the spin base 21, thereby rotating the substrate W held by the substrate holder 20.

[0078] Next, the processing unit 1 performs various liquid treatments on the substrate W (step S3: liquid treatment step). For example, the processing unit 1 performs chemical liquid treatment. First, the guard lifting mechanism 55 raises one of the guards 41 to 43 that corresponds to the chemical liquid to the guard treatment position. The guard for the chemical liquid is not particularly limited, but may be, for example, the outer guard 43. In this case, the guard lifting mechanism 55 stops the inner guard 41 and the middle guard 42 at their respective guard standby positions, and raises the outer guard 43 to the guard treatment position.

[0079] Next, the processing unit 1 supplies the chemical liquid to the substrate W. Here, it is assumed that the first nozzle 30 supplies the processing liquid. Specifically, the arm drive motor moves the first nozzle 30 to the nozzle processing position, and the valve 35 opens to discharge the chemical liquid from the first nozzle 30 toward the substrate W. As a result, the chemical liquid spreads over the upper surface of the rotating substrate W and splashes from the periphery of the substrate W. At this time, the chemical liquid acts on the upper surface of the substrate W, and processing according to the chemical liquid (e.g., cleaning processing) is performed on the substrate W. The chemical liquid splashed from the periphery of the substrate W is received by the inner circumferential surface of the guard part 40 (e.g., outer guard 43). When the chemical liquid processing has been sufficiently performed, the processing unit 1 stops supplying the chemical liquid.

[0080] Next, the processing unit 1 performs a rinse process on the substrate W. The guard lifting mechanism 55 adjusts the lifted state of the guard part 40 as necessary. That is, if the guard for the rinse liquid is different from the guard for the chemical liquid, the guard lifting mechanism 55 moves the guard corresponding to the rinse liquid among the guards 41 to 43 to the guard processing position. The guard for the rinse liquid is not particularly limited, but may be the inner guard 41. In this case, the guard lifting mechanism 55 lifts the guards 41 to 43 to their respective guard processing positions.

[0081] Next, the first nozzle 30 ejects a rinse liquid toward the upper surface of the substrate W. The rinse liquid is, for example, pure water. The first rinse liquid spreads over the upper surface of the rotating substrate W, washing away the chemical liquid on the substrate W, and splashes from the periphery of the substrate W. The processing liquid (mainly the rinse liquid) splashed from the periphery of the substrate W is received by the inner circumferential surface of the guard portion 40 (for example, the inner guard 41). When the rinsing process has been sufficiently performed, the processing unit 1 stops supplying the rinse liquid.

[0082] If necessary, the processing unit 1 may supply a volatile rinse liquid such as highly volatile isopropyl alcohol to the substrate W. If the guard for the volatile rinse liquid is different from the guard for the rinse liquid described above, the guard lifting mechanism 55 may move the guard corresponding to the volatile rinse liquid among the guards 41 to 43 to the guard processing position. When the rinse process is completed, the first nozzle 30 moves to the nozzle standby position.

[0083] Next, the processing unit 1 performs a drying process on the substrate W (step S4: drying step). For example, the spin motor 22 increases the rotation speed of the substrate W to dry the substrate W (so-called spin drying). Even during the drying process, the processing liquid splashed from the periphery of the substrate W is received by the inner peripheral surface of the guard part 40. When the drying process has been sufficiently completed, the spin motor 22 stops the rotation of the substrate W.

[0084] Next, the guard lifting mechanism 55 lowers the guard portion 40 to the guard standby position (step S5: guard lowering step). That is, the guard lifting mechanism 55 lowers the guards 41 to 43 to their respective guard standby positions.

[0085] Next, the substrate holder 20 releases its hold on the substrate W, and the main transport robot 103 removes the processed substrate W from the processing unit 1 (step S6: hold release and unloading process). When the substrate W is unloaded, the guard part 40 is stopped at the guard standby position, so that collision between the hand of the main transport robot 103 and the guard part 40 can be avoided.

[0086] <Monitoring> The above components operate properly to process the substrate W. Conversely, if at least one of the above components does not operate properly, it may impair the processing of the substrate W. For example, if the chuck pins 26 cannot move to the holding position in the holding and carrying-in step, the substrate holding part 20 cannot hold the substrate W properly.

[0087] Therefore, the processing unit 1 monitors at least one of the above components as an object to be monitored, and monitors the state of the object to be monitored. In the following, a case will be described in which the processing unit 1 monitors the position of the chuck pin 26 of the substrate holder 20 as an object to be monitored.

[0088] <Incorporeal Realm: Shadow> Fig. 6 is a diagram schematically illustrating an example of a captured image generated by the camera 70 by capturing an image of the imaging region. In the example of Fig. 6, the entire top surface of the substrate W held by the substrate holding part 20 is included in the captured image. In other words, the camera 70 is installed so that the entire substrate W is included in the imaging region. Here, the camera 70 captures an image of the imaging region obliquely downward, and therefore the top surface of the substrate W, which is circular in plan view, has an elliptical shape in the captured image.

[0089] In the captured image of Fig. 6, the substrate holding part 20 holds the substrate W, and the guard part 40 is located at the guard standby position. That is, the multiple chuck pins 26 of the substrate holding part 20 are stopped at the holding position. The captured image of Fig. 6 is obtained, for example, in the holding and carrying-in step (step S1) when the substrate holding part 20 holds the substrate W, by the illumination part 71 irradiating the imaging area with illumination light, and the camera 70 capturing an image of the imaging area.

[0090] The captured image in FIG. 6 includes four chuck pins 26. For simplicity, the description will be given here focusing on the bottommost chuck pin 26 in the captured image. The captured image in FIG. 6 also includes the shadow of the chuck pin 26 cast by the illumination light. In FIG. 6, the region showing the shadow of the object (here, the shadow of the chuck pin 26 itself) is shown as an invisible region IR11. In the example of FIG. 6, the invisible region IR11 is located to the right of the chuck pin 26 and is adjacent to the chuck pin 26.

[0091] If the chuck pin 26 is black, the chuck pin 26 and its shadow will be the same color, making it difficult to distinguish the chuck pin 26 from its shadow in the captured image. In other words, it is difficult to grasp the shape of the chuck pin 26 in the captured image. If the control unit 9 monitors the position of the chuck pin 26 using such an insubstantial region IR11 as well, there is a risk that the monitoring accuracy will be reduced due to the influence of the insubstantial region IR11.

[0092] <Setup processing step> Therefore, in this embodiment, a setup process is performed before the monitoring process. This setup process is a process for identifying the non-substantial region IR11 in the captured image. The setup process is performed, for example, when the substrate processing apparatus 100 is not performing any processing on the substrate W, or more specifically, when the substrate processing apparatus 100 is installed.

[0093] FIG. 7 is a flowchart showing an example of a setup process. First, the illumination unit 71 sequentially irradiates the imaging area with illumination light in multiple irradiation modes, and the camera 70 sequentially captures images of the imaging area in each irradiation mode to generate multiple captured images corresponding to the multiple irradiation modes (step S11: pre-imaging process). The multiple irradiation modes referred to here include, for example, modes in which illumination light is irradiated onto the imaging area from different irradiation positions. That is, illumination light is irradiated onto the imaging area sequentially while changing the irradiation position, and the camera 70 captures an image of the imaging area each time. As a specific example, the camera 70 captures an image of the imaging area with illumination light irradiated from a first irradiation position, and then captures an image of the imaging area with illumination light irradiated from a second irradiation position different from the first irradiation position. This allows multiple captured images corresponding to the multiple irradiation positions to be obtained. Note that, hereinafter, the captured image generated in the setup process may be referred to as a pre-imaging image. This pre-imaging image is an abbreviation for pre-imaging image data.

[0094] 8 is a flowchart showing a specific example of the above-mentioned pre-imaging step. First, an illumination mode is determined (step S111). Here, an illumination position is determined as the illumination mode. For example, the installation position of the illumination unit 71 adjacent to the camera 70 is adopted as the first illumination mode (i.e., the first illumination position). This illumination unit 71 is an illumination unit provided in the same accommodation space as the camera 70.

[0095] Next, the illumination unit 71 emits illumination light from the determined irradiation position (here, the first irradiation position), while the camera 70 captures an image of the imaging area to generate a pre-captured image (step S112). The camera 70 outputs the pre-captured image to the control unit 9. This pre-captured image is, for example, similar to the captured image in FIG.

[0096] Next, the control unit 9 or the operator determines whether a predetermined number of pre-captured images have been generated (step S113). If the predetermined number of pre-captured images have not yet been generated, the next illumination mode (here, illumination position) is determined (step S111). As a specific example, an illumination position different from the installation position of the illumination unit 71 adjacent to the camera 70 is adopted as the second illumination mode (second illumination position). In the example of FIG. 2, candidate illumination positions are indicated by the illumination unit 71 in virtual lines. In the example of FIG. 2, multiple illumination positions are set at approximately equal intervals around the imaging area so as to surround the imaging area in a plan view. Note that, in the setup process, the operator may sequentially attach a removable illumination unit 71 different from the illumination unit 71 adjacent to the camera 70 to each candidate illumination position. Alternatively, a fixed illumination unit 71 may be installed at the illumination position indicated by the virtual line in FIG. 2. Here, an illumination position near the nozzle support column 63 is adopted as the second illumination position.

[0097] Next, the illumination unit 71 irradiates the illumination light from the determined irradiation position (here, the second irradiation position), while the camera 70 captures an image of the imaging area to generate a pre-captured image (step S112). The camera 70 outputs this pre-captured image to the control unit 9. FIG. 9 is a diagram schematically illustrating an example of an image captured when illumination light is irradiated from an irradiation position (here, the second irradiation position) different from that of FIG. 6. In the example of FIG. 9, the area showing the shadow of the chuck pin 26 is shown as an invisible region IR12. Since the irradiation positions are different, the position and shape of the invisible region IR12 are different from the position and shape of the invisible region IR11. In the example of FIG. 6, the invisible region IR11 is located to the right of the chuck pin 26 and adjacent to the chuck pin 26, while in the example of FIG. 8, the invisible region IR12 is located to the left of the chuck pin 26 and adjacent to the chuck pin 26.

[0098] That is, while the positions and shapes of the actual objects such as the chuck pin 26 are almost the same between the captured images of FIG. 6 and FIG. 9 and do not depend on the irradiation position, the positions and shapes of the shadows of the chuck pin 26 are different.

[0099] Next, the control unit 9 or the operator determines whether a predetermined number of pre-captured images have been acquired (step S113). For simplicity, the predetermined number is assumed to be two. In this case, the pre-capture process ends. If the operator has attached a removable illumination unit 71, the illumination unit 71 may be removed after capturing images.

[0100] Next, the non-substantial region identifying unit 91 of the control unit 9 identifies a non-substantial region IR11 included in the pre-captured image when the illumination light is irradiated in the first irradiation mode, based on the differences between the multiple pre-captured images (step S12: pre-capture identification step). More specifically, the non-substantial region identifying unit 91 first generates differential image data (hereinafter simply referred to as a differential image) between the captured image of FIG. 6 and the captured image of FIG. 9. That is, the non-substantial region identifying unit 91 subtracts pixel values ​​at the same coordinates in the captured image of FIG. 6 and the captured image of FIG. 9 to generate a differential image. Since the entities such as the chuck pin 26 are substantially identical in the captured images of FIG. 6 and FIG. 9, the pixel values ​​of pixel groups representing the entities such as the chuck pin 26 in the differential image are substantially zero. On the other hand, since the shadows are different in the captured images of FIG. 6 and FIG. 9, the pixel values ​​of pixel groups in the non-substantial region IR11 and the non-substantial region IR12 in the differential image are values ​​other than zero. In the difference image, the positive and negative sign of the pixel values ​​in the non-substantial region IR11 is opposite to the positive and negative sign of the pixel values ​​in the non-substantial region IR12.

[0101] Therefore, the non-substantial region identifying unit 91 can identify the non-substantial region IR11 based on the difference image. If the pixel values ​​of the non-substantial region IR11 in the difference image are positive, the non-substantial region identifying unit 91 may, for example, compare each pixel in the difference image with a preset positive threshold value and identify a group of pixels having pixel values ​​greater than the threshold value as the non-substantial region IR11.

[0102] In the above example, two images are used as the predetermined number of images, but any number of images greater than or equal to three may be used. For example, FIG. 2 shows four irradiation positions (illumination units 71) surrounding the periphery of the imaging area at equal intervals (for example, 90-degree intervals). The camera 70 may sequentially irradiate the imaging area with illumination light from these irradiation positions, capturing an image of the imaging area each time. In this case, four pre-captured images corresponding to the four irradiation positions can be obtained. Since the irradiation positions are different from one another, the non-substantial areas showing shadows are different from one another in the four pre-captured images.

[0103] When three or more pre-captured images are acquired, the non-substantial region identifying unit 91 may identify the non-substantial region IR11 based on the difference between the pre-captured image corresponding to the first irradiation position and average image data of the multiple pre-captured images (hereinafter simply referred to as the average image). The average image is obtained by dividing the sum of pixel values ​​at the same coordinates by the number of pre-captured images. Therefore, although the average image includes all of the shadows in the multiple pre-captured images, the density of the shadows will be reduced. In other words, this average image can be made closer to an image that includes only objects without shadows.

[0104] In the difference image between the pre-captured image corresponding to the first irradiation position and the average image, the absolute values ​​of the pixel values ​​in areas other than the non-substantial region IR11 are small, and the absolute values ​​of the pixel values ​​in the non-substantial region IR11 are large. Therefore, the non-substantial region identifying unit 91 compares the absolute values ​​of the pixel values ​​in the difference image with a predetermined absolute threshold value for each pixel, and identifies a group of pixels having an absolute value greater than the absolute threshold value as the non-substantial region IR11.

[0105] In the difference image between the pre-captured image and the average image, the absolute values ​​of the pixel values ​​of non-substantial areas other than the non-substantial area IR11 can be reduced, so the non-substantial area identification unit 91 can identify the non-substantial area IR11 in the pre-captured image with higher accuracy.

[0106] Next, the control unit 9 stores non-substantial region data indicating the position and shape of the non-substantial region IR11 in the storage unit 94 (step S13: storage step). The storage unit 94 is, for example, a non-transitory memory. The non-substantial region data may be data indicating a group of pixels belonging to the non-substantial region IR11.

[0107] In this setup process, a non-substantial region IR11 in a captured image when irradiated with illumination light in the first irradiation mode is identified in advance, and non-substantial region data indicating the non-substantial region IR11 is stored in advance in the storage unit 94. The non-substantial region data stored in the storage unit 94 is used in the monitoring process, as described below.

[0108] <Monitoring process> Next, an example of the monitoring process will be described. Here, the monitoring processor 92 monitors the positions of the chuck pins 26 during processing of the substrate W.

[0109] FIG. 10 is a flowchart showing an example of the monitoring process. This monitoring process is performed after the setup process. First, the lighting unit 71 irradiates the imaging area with illumination light in the first irradiation mode, while the camera 70 captures the imaging area to generate a captured image (step S21: imaging process). This imaging process is performed, for example, after the control unit 9 outputs a control signal to the pin driving unit in the holding and carrying-in process (step S1) to move the chuck pins 26 to their holding positions. The camera 70 outputs the captured image to the control unit 9. FIG. 11 is a diagram schematically showing an example of a captured image generated in the imaging process. Note that, hereinafter, the captured image generated in the monitoring process may be referred to as a monitoring captured image. This monitoring captured image is an abbreviation for monitoring captured image data.

[0110] In the imaging process, the illumination unit 71 emits illumination light in a first illumination mode. As a specific example, the illumination light is emitted from the illumination unit 71 provided at the first illumination position adjacent to the camera 70. Therefore, as shown in FIG. 11 , an intangible region IR11 is included in the monitoring-captured image.

[0111] Next, the monitoring processing unit 92 monitors the position of the chuck pin 26 based on the region other than the non-substantial region IR11 in the monitoring captured image (step S22: monitoring process). In the example of FIG. 11, a pin determination region R1 is shown in the captured image. The pin determination region R1 is a region used to monitor the position of the chuck pin 26 and is set in advance. The pin determination region R1 is set to an area including at least a part of the chuck pin 26. Here, the chuck pin 26 includes a support base 261 and a pin 262 standing on the upper surface of the support base 261. As the support base 261 rotates, the pin 262 comes into contact with the periphery of the substrate W or moves away from the periphery of the substrate W. In other words, when the chuck pin 26 is located at the holding position, the pin 262 comes into contact with the periphery of the substrate W. The pin determination region R1 is set to include at least a part of the pin 262 when the chuck pin 26 is located at the holding position.

[0112] 11, the pin determination region R1 includes all of the pins 262, part of the support base 261, and part of the non-substantial region IR11. Although the example of Fig. 11 shows only the pin determination region R1 for one chuck pin 26, in practice, it is preferable to set a pin determination region R1 for each of the four chuck pins 26. For simplicity's sake, the following description will focus on the pin determination region R1 in Fig. 11.

[0113] As illustrated in FIG. 11 , a portion of the pin determination region R1 includes a portion of the non-substantial region IR11. Here, the monitoring processing unit 92 monitors the position of the chuck pin 26 by using a region of the monitoring-captured image (more specifically, the pin determination region R1) other than the non-substantial region IR11. As a specific example, the monitoring processing unit 92 first reads non-substantial region data from the storage unit 94. Then, the monitoring processing unit 92 deletes the non-substantial region IR11 indicated by the non-substantial region data from the pin determination region R1 to generate removed image data (hereinafter simply referred to as a removed image) DR1. FIG. 12 is a diagram showing an example of how the non-substantial region IR11 is deleted from the monitoring-captured image. Here, the position of the chuck pin 26 is monitored using the pin determination region R1, so FIG. 12 shows the pin determination region R1. The monitoring processing unit 92 deletes the non-substantial region IR11 from the pin determination region R1 to generate the removed image DR1. Here, deleting a region includes setting the pixel value of each pixel in the region to a specified value. For example, the monitoring processing unit 92 sets all pixel values ​​of pixels belonging to the non-substantial region IR11 in the pin determination region R1 to 0. In the example of Fig. 12, the deleted region is shown in black in the removed image DR1.

[0114] In this embodiment, the monitoring processing unit 92 also uses a reference image M1 to monitor the positions of the chuck pins 26. The reference image M1 is an image in which the chuck pins 26 are positioned in the normal holding positions, and is stored in advance in the storage unit 94. The reference image M1 is generated, for example, based on an image captured by the camera 70 when the camera 70 captures an image of the imaging area in a state in which the plurality of chuck pins 26 normally hold the substrate W. The reference image M1 is an image of the same area as the pin determination area R1.

[0115] When the chuck pin 26 is positioned correctly in the holding position, the similarity between the pin determination region R1 and the reference image M1 is high. On the other hand, when the chuck pin 26 is positioned in a position different from the holding position, the similarity between the pin determination region R1 and the reference image M1 decreases. Conversely, when the similarity is high, it can be determined that the chuck pin 26 is positioned correctly in the holding position, and when the similarity is low, it can be determined that an abnormality has occurred in the chuck pin 26.

[0116] However, if the pin determination region R1 includes the non-substantial region IR11, the non-substantial region IR11 may reduce the similarity even if the chuck pin 26 is located at the holding position. This reduces the accuracy of determining the position of the chuck pin 26 based on the similarity. In other words, the monitoring accuracy decreases.

[0117] Therefore, the monitoring processor 92 deletes the same area as the pin determination area R1 from the reference image M1 to generate deleted reference image data (hereinafter referred to as deleted reference image) DM1. In this deleted reference image DM1, the pixel values ​​of the pixels in the same area as the non-substantial area IR11 are set to the above-mentioned specified value (for example, zero). In the example of Fig. 11, the deleted area is also shown in black in the deleted reference image DM1.

[0118] The monitoring processor 92 monitors the position of the chuck pin 26 based on a comparison between the removed image DR1 and the removed reference image DM1. As a specific example, the monitoring processor 92 first calculates the similarity between the removed image DR1 and the removed reference image DM1. The similarity is not particularly limited, but may be any known similarity such as the sum of squared differences of pixel values, the sum of absolute differences of pixel values, normalized cross-correlation, or zero-mean normalized cross-correlation. Since all pixel values ​​within the non-substance region IR11 are the same as the specified values ​​in both the removed image DR1 and the removed reference image DM1, the difference between them is zero. In other words, the similarity is essentially calculated for regions other than the non-substance region IR11. In other words, the influence of the non-substance region IR11 can be avoided in the comparison between the removed image DR1 and the removed reference image DM1.

[0119] Next, the monitoring processor 92 compares the similarity with a predetermined pin threshold. The pin threshold is set in advance, for example, by simulation or experiment, and is recorded in the storage unit 94. When the similarity is equal to or greater than the pin threshold, the monitoring processor 92 determines that the chuck pin 26 is normally positioned at the holding position, and when the similarity is less than the pin threshold, the monitoring processor 92 determines that an abnormality has occurred in the chuck pin 26. When it is determined that an abnormality has occurred in the chuck pin 26, the controller 9 may interrupt the processing of the substrate W, or may cause a notification unit, such as a display (not shown), to notify the abnormality.

[0120] As described above, the monitoring processing unit 92 monitors the position of the chuck pin 26 without using pixel values ​​in the non-substantial region IR11 in the monitoring captured image. Therefore, the monitoring processing unit 92 can avoid the influence of the non-substantial region IR11 in the monitoring captured image and monitor the position of the chuck pin 26 with higher accuracy.

[0121] In the above example, in the setup process, the non-substantial region identifying unit 91 identifies the non-substantial region IR11 based on multiple pre-captured images. This allows the non-substantial region to be identified with higher accuracy than when the user manually identifies the non-substantial region by operating a user interface (not shown). This also reduces the burden on the user.

[0122] In the above example, multiple different illumination positions are used as multiple illumination modes in the setup process. In this case, the position and shape of the non-substantial region showing the shadow differs between the multiple pre-captured images. This makes it easier to make the non-substantial region IR11 visible in the difference image between the pre-captured images. In other words, the difference between the pixel value of the non-substantial region IR11 and the pixel values ​​of its surroundings can be made larger. Therefore, the non-substantial region identification unit 91 can identify the non-substantial region IR11 with higher accuracy.

[0123] <Irradiation mode: wavelength> The multiple irradiation modes are not necessarily limited to different irradiation positions, and may, for example, be different wavelength spectra of illumination light. In other words, the multiple irradiation modes include modes in which illumination light having different wavelength spectra is irradiated onto the imaging region. More specifically, in the pre-imaging step (step S11) of the setup processing step, the illumination unit 71 may sequentially irradiate the imaging region with illumination light having different wavelength spectra, and the camera 70 may capture an image of the imaging region each time. For simplicity, it is assumed here that only the illumination unit 71 adjacent to the camera 70 irradiates illumination light.

[0124] The illumination unit 71 may have multiple light sources that emit illumination light with different wavelength spectra. In this case, the illumination unit 71 can change the wavelength spectrum by switching the light source that emits the illumination light. Alternatively, the illumination unit 71 may include a single light source that can change the wavelength.

[0125] The illumination light emitted by the illumination unit 71 is reflected by an object (entity) in the imaging area, and the reflected light is incident on the light receiving surface of the camera 70. Because the light reflected from an entity such as the chuck pin 26 depends on the wavelength spectrum, the intensity of the light reflected from the entity differs depending on the wavelength of the illumination light. Therefore, in multiple pre-captured images corresponding to different wavelength spectra, the entity regions showing the entities differ from one another. As a specific example, when illumination light in the blue wavelength band is irradiated onto the imaging area, blue is the main component in the entity region of the pre-captured image. On the other hand, when illumination light in the red wavelength band is irradiated onto the imaging area, red is the main component in the entity region of the pre-captured image. In other words, the pixel values ​​in the entity regions differ from one another between the two pre-captured images.

[0126] On the other hand, shadows are almost independent of the wavelength spectrum of the illumination light. This is because shadows are areas where almost no reflected light occurs. Therefore, in multiple pre-captured images, the non-substantial regions IR11 representing shadows ideally coincide with each other. As a specific example, whether the imaging area is illuminated with illumination light in the blue wavelength band or with illumination light in the red wavelength band, the non-substantial region IR11 is black. In other words, the pixel values ​​of the non-substantial region IR11 in both pre-captured images are almost zero.

[0127] Therefore, the non-substantial region identifying unit 91 can identify the non-substantial region IR11 based on the differences between the multiple pre-captured images. For example, in the pre-identification step (step S12), the non-substantial region identifying unit 91 generates a difference image between the pre-captured image corresponding to red illumination light and the pre-captured image corresponding to blue illumination light. In the difference image, the pixel value of each pixel in the non-substantial region IR11 is approximately zero, while the pixel value of each pixel in the substantive region is a value other than zero. Therefore, the non-substantial region identifying unit 91 determines for each pixel in the difference image whether the absolute value of the pixel value is equal to or less than a predetermined threshold, and identifies a group of pixels whose absolute value is equal to or less than the threshold as the non-substantial region IR11.

[0128] Although the difference in the actual area becomes more noticeable if the camera 70 is a color camera, the camera 70 may also be a grayscale camera. Even in this case, the reflectance of the actual object differs for each wavelength, and therefore the actual area corresponding to different wavelength spectra will differ from one another.

[0129] According to this, since it is not necessary to irradiate illumination light from a plurality of irradiation positions, it is not necessary to provide a plurality of illumination units 71 or to move the illumination unit 71.

[0130] <Illumination mode: Light intensity> The illumination light may have different intensities as the multiple illumination modes. In other words, the multiple illumination modes include modes in which illumination light having different intensities is irradiated onto the imaging region. More specifically, in the pre-imaging step (step S11), the illumination unit 71 may sequentially irradiate the imaging region with illumination light at different intensities, and the camera 70 may capture an image of the imaging region each time. In this case, the illumination unit 71 includes a light source that irradiates illumination light at a variable light intensity.

[0131] The camera 70 receives light reflected from an object, and the amount of light reflected from an object such as the chuck pin 26 depends on the amount of illumination light. On the other hand, shadows hardly depend on the amount of light. Therefore, in multiple pre-captured images corresponding to different amounts of light, the object regions (especially brightness) showing the object differ from one another. As a specific example, when a larger amount of illumination light is irradiated onto the imaging area, the pixel values ​​in the object region of the pre-captured image take relatively large values. On the other hand, when a smaller amount of illumination light is irradiated onto the imaging area, the pixel values ​​in the object region take relatively small values. In other words, the pixel values ​​in the object region differ from one another between the two pre-captured images.

[0132] On the other hand, shadows are almost independent of the amount of illumination light. This is because shadows are areas where almost no reflected light occurs. Therefore, in multiple pre-captured images, the non-substantial regions IR11 representing shadows ideally coincide with each other. As a specific example, the non-substantial regions IR11 are black whether the imaging area is illuminated with a large amount of illumination light or a small amount of illumination light. In other words, the pixel values ​​of the non-substantial regions IR11 in both pre-captured images are almost zero.

[0133] Therefore, the non-substantial region identifying unit 91 can identify the non-substantial region IR11 based on the differences between the multiple pre-captured images. For example, in the pre-identification step (step S12), the non-substantial region identifying unit 91 generates a difference image between a pre-captured image corresponding to a high light intensity and a pre-captured image corresponding to a low light intensity. In the difference image, the pixel value of each pixel in the non-substantial region IR11 is approximately zero, while the pixel value of each pixel in the substantial region is a value other than zero. Therefore, the non-substantial region identifying unit 91 determines for each pixel in the difference image whether the absolute value of the pixel value is equal to or less than a predetermined threshold, and identifies a group of pixels whose absolute value is equal to or less than the threshold as the non-substantial region IR11.

[0134] This eliminates the need to irradiate illumination light from multiple irradiation positions, eliminating the need to provide multiple illumination units 71 or to move the illumination unit 71. Furthermore, the light intensity of the light source can usually be adjusted by adjusting the power supplied to the light source. This means that no special light source is required for the illumination unit 71, and an inexpensive light source can be used.

[0135] <Incorporeal area: Shadows other than the monitored object> The above example has been described using the non-substantial region IR11, which represents the shadow of the chuck pin 26 itself, which is an example of the monitored object. However, the shadow of an object other than the monitored object may be formed around the monitored object. For example, the shadow of any of the first nozzle 30, the second nozzle 60, the third nozzle 65, or the nozzle arms 32, 62, and 67 may be formed around the chuck pin 26. As a specific example, the second nozzle 60 may stop at a bevel processing position vertically facing the peripheral edge of the substrate W. In the example of FIG. 2, the second nozzle 60 and the nozzle arm 62, which stop at the bevel processing position, are shown by imaginary lines. In this case, the shadow of the second nozzle 60 or the nozzle arm 62 may be cast near the right chuck pin 26. Therefore, the captured image generated by the camera 70 capturing an image of the imaging area also includes a non-substantial region representing a shadow near the chuck pin 26. If such a shadow is included in the pin determination region R1 of the captured image, the monitoring accuracy of the chuck pin 26 may also be reduced.

[0136] Therefore, in the setup processing step, the non-substantial region identifying unit 91 may identify such non-substantial regions that show the shadow of another object. As a specific example, in the pre-imaging step (step S11), with the second nozzle 60 positioned at the bevel processing position, the camera 70 images the imaging region in each of a plurality of irradiation modes including the first irradiation mode, and generates a plurality of pre-imaging images.

[0137] Next, in a pre-identification step (step S12), the non-substantial region identification unit 91 identifies a non-substantial region showing a shadow in the pre-captured image corresponding to the first illumination mode, based on the multiple pre-captured images. This step also identifies a non-substantial region showing the shadow of an object other than the monitored object. Then, in a storage step (step S13), the non-substantial region identification unit 91 stores non-substantial region data showing the identified non-substantial region in the storage unit 94.

[0138] In an imaging step (step S21) of the monitoring process, the camera 70 captures an image of the imaging area to generate a monitoring captured image while the illumination unit 71 is irradiating the imaging area with illumination light in a first irradiation mode. In the next monitoring step (step S22), the monitoring processing unit 92 identifies a non-entity area based on the non-entity area data stored in the storage unit 94, and monitors the state of the monitoring target based on the area of ​​the monitoring captured image excluding the non-entity area. In other words, the monitoring processing unit 92 monitors the state of the monitoring target without using the non-entity area.

[0139] This makes it possible to suppress the influence of a shadow of an object other than the monitored object that is formed around the monitored object, thereby monitoring the state of the monitored object with higher accuracy.

[0140] Furthermore, if the object other than the monitored object is a moving object such as the second nozzle 60, the position and shape of the shadow may change depending on the position of the moving object. In this case, in the setup processing step, an insubstantial region may be identified depending on the position of the moving object, and insubstantial region data corresponding to the position of the moving object may be stored in the storage unit 94. Then, in the imaging processing, the insubstantial region data corresponding to the position of the moving object may be read from the storage unit 94, and the monitored object may be monitored without using the insubstantial region indicated by the insubstantial region data.

[0141] <Incorporeal Region: Reflection> Fig. 13 is a diagram schematically showing an example of a captured image. In the captured image of Fig. 13, the first nozzle 30 is located at the nozzle processing position, and a reflected image of the first nozzle 30 is captured on the upper surface of the substrate W. Such a reflected image does not actually exist on the upper surface of the substrate W, and like a shadow, can be a factor in reducing monitoring accuracy.

[0142] Therefore, the control unit 9 identifies in advance the non-substantial area IR2 that shows the reflected image in the captured image, and monitors the state of the monitored object based on the area excluding the non-substantial area IR2. In other words, the control unit 9 monitors the state of the monitored object without using the non-substantial area IR2.

[0143] <Setup processing step> An example of the setup process is similar to that shown in FIG. 7 . That is, in the pre-imaging process (step S11), illumination light is sequentially applied to the imaging area in a plurality of illumination modes, and the camera 70 captures an image of the imaging area in each of the illumination modes. For example, when illumination light is applied with a small amount of light, the brightness of both the first nozzle 30 and the reflected image decreases. When illumination light is applied with a large amount of light, the brightness of both the first nozzle 30 and the reflected image increases. The brightness of the first nozzle 30 depends on the reflectance of the first nozzle 30, whereas the brightness of the reflected image depends not only on the reflectance of the first nozzle 30 but also on the reflectance of the upper surface of the substrate W. Therefore, the amount of change in brightness differs between the first nozzle 30 and the reflected image. Therefore, the non-substantial region identifying unit 91 can identify the non-substantial region IR2 based on the difference between the pre-imaging image acquired under a large amount of illumination light and the pre-imaging image acquired under a small amount of illumination light. For example, in the pre-identification step (step S12), the non-substantial region identification unit 91 may generate a difference image between both pre-captured images and identify a group of pixels in the difference image whose pixel values ​​are within a predetermined range as the non-substantial region IR12. Then, in the storage step (step S13), the non-substantial region identification unit 91 stores the non-substantial region data in the storage unit 94.

[0144] <Monitoring process: nozzle position> Next, an example of the monitoring process will be described. Here, a case where the position of the first nozzle 30 is monitored will be described. If the first nozzle 30 can be moved appropriately to the nozzle processing position, the processing liquid can be supplied to the substrate W at an appropriate position. However, if the first nozzle 30 cannot be moved to the nozzle processing position, problems may occur in the processing of the substrate W. Therefore, the position of the first nozzle 30 is monitored.

[0145] An example of the monitoring process is the same as that shown in Fig. 10. That is, in the imaging step (step S21), the camera 70 captures an image of the imaging area. As a more specific example, the imaging step is performed after the control unit 9 gives a control signal to the arm drive motor in the liquid processing step (step S3). If the arm drive motor can move the first nozzle 30 to the nozzle processing position, the first nozzle 30 will be located at the nozzle processing position in the monitoring captured image.

[0146] Next, in the monitoring step (step S22), the monitoring processing unit 92 reads out a reference image M2 from the storage unit 94. The reference image M2 is an image having a size smaller than the captured image, as illustrated in FIG. 13. The reference image M2 includes the tip of the first nozzle 30. Such a reference image M2 can be obtained, for example, as follows: With the first nozzle 30 positioned at the nozzle processing position, the camera 70 captures an image of the captured area to generate a captured image. The control unit 9 then generates the reference image M2 by cropping a portion of the captured image that includes the tip of the first nozzle 30. In this embodiment, the control unit 9 generates the reference image M2 so that a reflected image of the first nozzle 30 is not included. Specifically, the control unit 9 can determine the position and shape of the non-substantial region IR2 based on the non-substantial region data stored in the storage unit 94, and therefore sets the reference image M2 to avoid this non-substantial region IR2. In the example of FIG. 13, the bottom side of the reference image M2 is recessed in a shape similar to the contour of the upper part of the non-substantial region IR2. It should be noted that the reference image M2 does not necessarily have to include the non-substantial region IR2, and the bottom side of the reference image M2 does not necessarily have to have a concave shape.

[0147] Next, the monitoring processing unit 92 monitors the position of the first nozzle 30 by comparing the monitoring image captured by the camera 70 with the reference image M2. More specifically, the monitoring processing unit 92 first detects the position of the first nozzle 30 by matching the monitoring image with the reference image M2. The matching process includes, for example, template matching. As a specific example, the monitoring processing unit 92 scans the monitoring image with the reference image M2, and detects the position where the similarity between the reference image M2 and each partial region in the monitoring image is highest as the position of the first nozzle 30. The similarity is not particularly limited, and may be, for example, a known similarity such as the sum of squares of pixel value differences, the sum of absolute values ​​of pixel value differences, normalized cross-correlation, or zero-mean normalized cross-correlation.

[0148] The monitoring processor 92 may determine whether the difference between the detected position of the first nozzle 30 and the target position (i.e., the normal nozzle processing position) is equal to or less than a predetermined position threshold. The position threshold is set in advance, for example, through simulation or experiment, and stored in the storage unit 94. The monitoring processor 92 may determine that the position of the first nozzle 30 is normal when the difference is equal to or less than the position threshold, and may determine that an abnormality has occurred in the position of the first nozzle 30 when the difference is greater than the position threshold.

[0149] As described above, the monitoring processor 92 monitors the position of the first nozzle 30 based on a comparison between the reference image M2, which does not include the non-substantial region IR2, and the monitoring captured image. Therefore, the monitoring processor 92 can avoid the influence of the non-substantial region IR2 and monitor the position of the first nozzle 30 with higher accuracy.

[0150] <Monitoring process: nozzle discharge status> Fig. 14 is a diagram schematically showing an example of a captured image. In the captured image of Fig. 14, the first nozzle 30 is discharging the processing liquid in the form of a liquid column, and a reflected image of an object other than the first nozzle 30 is captured on the upper surface of the substrate W. In Fig. 14, an unsubstantiated region IR3 indicating the reflected image is schematically shown as an ellipse. Such a reflected image does not exist as a tangible object on the upper surface of the substrate W, and like a shadow, can be a factor in reducing monitoring accuracy.

[0151] Therefore, the control unit 9 identifies in advance an unsubstantial region IR3 that shows a reflected image in the captured image, and monitors the state of the monitored object based on the region excluding the unsubstantial region IR3. In other words, the control unit 9 monitors the state of the monitored object without using the unsubstantial region IR3.

[0152] <Setup processing step> An example of the setup process is the same as the setup process for monitoring the position of the first nozzle 30. By this setup process, non-substantial region data indicating the non-substantial region IR3 is stored in the storage unit 94.

[0153] <Monitoring process: nozzle discharge status> Next, an example of the monitoring process will be described. Here, a case where the discharge state of the first nozzle 30 is monitored will be described. If the discharge of the processing liquid from the first nozzle 30 can be switched on and off at the appropriate timing, the first nozzle 30 can supply the processing liquid to the substrate W for the appropriate discharge time. On the other hand, if the discharge of the processing liquid cannot be switched on and off at the appropriate timing, the first nozzle 30 cannot supply the processing liquid to the substrate W for the appropriate discharge time, which may cause problems in processing the substrate W. Therefore, the discharge state of the first nozzle 30 is monitored to identify the discharge start timing at which the discharge is switched from stopped to discharge and the discharge stop timing at which the discharge is switched from stopped to discharge. This makes it possible to determine the discharge time from the discharge start timing to the discharge stop timing.

[0154] An example of the monitoring process is the same as that shown in Fig. 10. That is, in an imaging step (step S21), camera 70 images the imaging area. As a more specific example, in the liquid treatment step (step S3), the imaging step is repeatedly performed from the timing before control unit 9 outputs an open signal to valve 35 to the timing after control unit 9 outputs a close signal to valve 35.

[0155] 14, a discharge determination region R3 is set in the monitor-captured image. The discharge determination region R3 is set so as to include the liquid column of processing liquid discharged from the first nozzle 30. As a specific example, the upper edge of the discharge determination region R3 is set below the lower end of the first nozzle 30, and the lower edge of the discharge determination region R3 is set above the position where the liquid column of processing liquid lands on the upper surface of the substrate W. Furthermore, the lateral width of the discharge determination region R3 is set wider than the width of the liquid column of processing liquid. In the example of FIG. 14, this discharge determination region R3 includes a part of the non-substantial region IR2.

[0156] In the monitoring step (step S22), the monitoring processor 92 monitors the discharge status of the first nozzle 30 based on an area (i.e., a removed image) obtained by removing the non-substantial area IR2 from the discharge determination area R3 of the monitored image. For example, the monitoring processor 92 determines whether the sum of pixel values ​​of the removed image is within a predetermined range. The predetermined range is, for example, the range of values ​​that the sum of pixel values ​​of the removed image takes when a liquid column of treatment liquid is being discharged from the first nozzle 30, and is set in advance through simulation or experiment. When the sum of pixel values ​​of the removed image is within the predetermined range, the monitoring processor 92 determines that treatment liquid is being discharged from the first nozzle 30, and when the sum is outside the predetermined range, the monitoring processor 92 determines that discharge of treatment liquid from the first nozzle 30 has stopped.

[0157] As described above, the monitoring processor 92 monitors the discharge state of the first nozzle 30 based on the region of the discharge determination region R3 excluding the non-substantial region IR2. Therefore, the monitoring processor 92 can avoid the influence of the non-substantial region IR2 and monitor the discharge state of the first nozzle 30 with higher accuracy.

[0158] The camera 70 repeatedly captures images of the imaging area (monitoring process), and the monitoring processor 92 determines the discharge state each time (monitoring process). The monitoring processor 92 identifies the discharge start timing when the discharge state switches from discharge stop to discharge and the discharge stop timing when the discharge state switches from discharge to discharge stop, and calculates the discharge time from the discharge start timing to the discharge stop timing. The monitoring processor 92 determines whether the difference between the discharge time and the target discharge time is equal to or less than a predetermined time threshold. The time threshold is set in advance, for example, by simulation or experiment, and stored in the memory unit 94. The monitoring processor 92 determines that the discharge time is normal when the difference is equal to or less than the time threshold, and determines that an abnormality has occurred with respect to the discharge of the first nozzle 30 when the difference is greater than the time threshold.

[0159] As described above, the monitoring method for the substrate processing apparatus 100 and the substrate processing apparatus 100 have been described in detail. However, the above description is merely an example in all respects and is not intended to be limiting. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in the above embodiments and variations can be combined or omitted as appropriate as long as they are not mutually inconsistent.

[0160] For example, in the above example, the non-substantial area is identified by the control unit 9, but the user may use a user interface (not shown) to input non-substantial area data indicating the non-substantial area into the control unit 9, and the control unit 9 may store the non-substantial area data in the memory unit 94. [Explanation of symbols]

[0161] 10 chambers 100 Substrate processing apparatus 20 Board holding part 26 Monitoring object (chuck pin) 30 Monitoring object (first nozzle) 60 Monitoring object (second nozzle) 68 Monitoring object (third nozzle) 70 Camera 71 Lighting Department 94 Memory section S11 Pre-imaging process (step) S12 Pre-identification process (step) S13 Storage step S21 Imaging process (step) S22 Monitoring process (step) RI11, RI12, IR2 Non-entity Area W substrate

Claims

1. a pre-imaging step of sequentially irradiating an imaging area including a monitoring target in a chamber accommodating a substrate holder for holding a substrate with illumination light in a plurality of irradiation modes, and sequentially imaging the imaging area with a camera to generate a plurality of pre-imaging image data corresponding to the plurality of irradiation modes; a pre-identification step of identifying an insubstantial region indicating at least one of a shadow and a reflected image of an object included in the pre-captured image data when the illumination light is irradiated in a first illumination mode, based on a difference between the plurality of pre-captured image data; a storage step of storing non-substantial region data indicating the position and shape of the non-substantial region in a storage unit; a setup process including: an imaging step of, after the setup processing step, imaging the imaging area with the camera while irradiating the imaging area with the illumination light in the first illumination mode, and generating monitoring captured image data; a monitoring step of monitoring the monitored object based on an area of ​​the monitoring captured image data excluding the non-substantial area indicated by the non-substantial area data stored in the storage unit; A monitoring method for a substrate processing apparatus, comprising:

2. 2. A monitoring method for a substrate processing apparatus according to claim 1, comprising: The storage unit stores reference image data including the normal monitored object, In the monitoring step, the object to be monitored is monitored based on a comparison between removed image data obtained by removing the non-substantial region from the monitoring captured image data and removed reference image data obtained by removing an area identical to the non-substantial region from the reference image data.

3. a pre-imaging step of sequentially irradiating an imaging area including a monitoring target in a chamber accommodating a substrate holder for holding a substrate with illumination light in a plurality of irradiation modes, and sequentially imaging the imaging area with a camera to generate a plurality of pre-imaging image data corresponding to the plurality of irradiation modes; a pre-identification step of identifying an insubstantial region indicating at least one of a shadow and a reflected image of an object included in the pre-captured image data when the illumination light is irradiated in a first illumination mode, based on a difference between the plurality of pre-captured image data; a storage step of storing non-substantial region data indicating the position and shape of the non-substantial region in a storage unit; a setup process including: an imaging step of imaging the imaging area while irradiating the imaging area with the illumination light in the first irradiation mode, after the setup processing step, to generate monitoring captured image data; a monitoring step of monitoring the monitored object based on a comparison between the monitoring-captured image data and reference image data that includes the monitored object in a normal state and does not include an area identical to the non-substantial area indicated by the non-substantial area data stored in the storage unit; A monitoring method for a substrate processing apparatus, comprising:

4. 4. A monitoring method for a substrate processing apparatus according to claim 1, comprising: The plurality of irradiation modes include modes in which the illumination light is irradiated onto the imaging region from different irradiation positions.

5. 5. A monitoring method for a substrate processing apparatus according to claim 1, comprising: The plurality of irradiation modes include modes in which the illumination light having mutually different wavelength spectra is irradiated onto the imaging region.

6. 6. A monitoring method for a substrate processing apparatus according to claim 1, comprising: The plurality of irradiation modes include modes in which the illumination light having different light intensities is irradiated onto the imaging region.

7. 7. A monitoring method for a substrate processing apparatus according to claim 1, comprising: A monitoring method for a substrate processing apparatus, wherein in the pre-identification process, the non-substantial area is identified based on the difference between the pre-captured image data corresponding to the first irradiation mode and average image data of the plurality of pre-captured image data.

8. A chamber; a substrate holder provided in the chamber and configured to hold a substrate; an illumination unit that irradiates an imaging area including a monitoring target in the chamber with illumination light; a camera that captures an image of the imaging area and generates captured image data; a storage unit that stores non-substantial region data that indicates the position and shape of a non-substantial region that indicates at least one of a shadow and a reflected image of an object included in the captured image data; a control unit that monitors the monitoring object based on an area of ​​the captured image data excluding the non-substantial area indicated by the non-substantial area data stored in the storage unit; A substrate processing apparatus comprising:

9. A chamber; a substrate holder provided in the chamber and configured to hold a substrate; an illumination unit that irradiates an imaging area including a monitoring target in the chamber with illumination light; a camera that captures an image of the imaging area and generates captured image data; a storage unit that stores non-substantial region data that indicates the position and shape of a non-substantial region that indicates at least one of a shadow and a reflected image of an object included in the captured image data; a control unit that monitors the monitored object based on a comparison between the captured image data and reference image data that includes the monitored object in a normal state and does not include an area identical to the non-substantial area indicated by the non-substantial area data stored in the storage unit; A substrate processing apparatus comprising:

Images