Method for manufacturing a smart ring and a smart ring manufactured by the method
The method addresses shape and size variability in smart ring production by using transparent thermosetting plastic and clear coating, enhancing customization and biosignal detection while reducing costs and time.
Patent Information
- Application Number
- JP2023551261
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-01-03
- Filing Date
- 2023-01-12
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2043-01-12
AI Technical Summary
Conventional smart ring manufacturing methods face challenges in efficiently producing rings with various shapes and sizes, require multiple molds and lengthy processes, and struggle with transparency adjustments and air bubble removal, leading to increased costs and reduced product quality.
A method involving outer cover processing, sensor/communication module fabrication, combination formation, inner molding, and sensing window creation, using transparent thermosetting plastic and clear coating to adjust transparency and remove air bubbles efficiently.
Enables production of smart rings with customizable shapes and sizes, improved transparency, and enhanced biosignal detection accuracy, while reducing time and costs by simplifying the manufacturing process and air bubble removal.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a smart ring, and more particularly to a method for manufacturing a smart ring that uses a sensor module to measure various physical activities and conditions, and a smart ring manufactured thereby. [Background technology]
[0002] As the average life expectancy of modern people increases, they are becoming more and more concerned about their health. This interest has led to the invention of devices that allow people to continuously manage their health on a daily basis, breaking away from the stereotype that they should only see a doctor when they are sick.
[0003] Many of the aforementioned devices, called wearable devices, emphasize portability and can be worn and carried freely like clothing, watches, or glasses. Examples of such wearable devices include smart glasses, smart watches, and ring-shaped wearable devices.
[0004] Among these, US Patent No. US9861314B2, which is prior art relating to a ring-shaped wearable device, discloses a wearable electronic device and a manufacturing method thereof.
[0005] This prior art discloses a molded body made of a moldable ceramic material including an inner surface, an outer surface, and at least one cavity disposed on the inner surface and having a depth, an electronic component disposed in the cavity and having a thickness smaller than the depth of the cavity, and a method for manufacturing a smart ring, which comprises forming an epoxy material coating along the inner surface of the smart ring to cover the electronic component and cavity on the inner surface of the body molded using a prior art molding device and molding method.
[0006] A smart ring manufactured according to the prior art manufacturing method using the above-mentioned prior art molding system embodies a predetermined inner shape and size of the smart ring according to the fixed shape and size of the inner surface of the already molded body.
[0007] Therefore, with conventional smart ring manufacturing methods, including prior art manufacturing methods, if it is necessary to change or relocate circuit components, form or relocate protrusions such as sensors on the inside surface of the smart ring, or change the inside shape and size of the smart ring in accordance with other design intents, a new body with a different inside shape and size must be newly molded, and multiple molding parts, such as molds for the molding device, and their settings must be prepared according to the different inside shapes and sizes. Therefore, conventional smart ring manufacturing methods, including prior art manufacturing methods, have the problem of being difficult to meet various requirements regarding the inside shape and size of the smart ring.
[0008] Furthermore, in order to realize smart rings with various shapes and sizes of inner surfaces using conventional smart ring manufacturing methods, including prior art manufacturing methods, the number of pieces of equipment, such as molds and coating devices, increases proportionally, and setting them up individually takes additional time, resulting in problems such as increased time and costs for developing and manufacturing smart rings of various shapes and sizes.
[0009] Furthermore, when molding an epoxy material along the inner surface of a smart ring using a conventional smart ring manufacturing method and molding device, including a prior art manufacturing method, the transparency of the inner surface of the smart ring is determined by the surface condition of the inner surface molding part of the molding device, and there are limitations to how much transparency can be adjusted, requiring a separate polishing process to polish the surface of the product, which can result in poor product quality and complicated manufacturing processes, resulting in inefficiencies.
[0010] Furthermore, when molding an epoxy material along the inner surface of a smart ring using the conventional molding device and molding method shown in Figure 11, the area of the epoxy injection section, which normally serves as an outlet for air bubbles generated in the injected epoxy, is small, which results in a problem that it takes a long time to remove the air bubbles or they cannot be removed sufficiently, resulting in a decrease in product quality. [Prior art documents] [Patent documents]
[0011] [Patent Document 1] US Patent Registration US9861314B2 (2018. 01. 09.) Summary of the Invention [Problem to be solved by the invention]
[0012] Therefore, the present invention aims to solve the above-mentioned problems of the prior art, meet various requirements regarding the inner shape and size of smart rings, and provide a new method for manufacturing smart rings that reduces the time and cost required for developing and manufacturing smart rings of various shapes and sizes, and a smart ring manufactured using this method.
[0013] In addition, depending on the embodiment, it is easy to adjust the transparency of the entire inner surface of the smart ring or a portion of the inner surface, thereby improving product quality in terms of transparency and streamlining the production process, and the object is to provide a new method for manufacturing smart rings and smart rings manufactured using this method.
[0014] In addition, depending on the embodiment, it is easy to adjust the transparency of the entire inner surface of the smart ring or a portion of the inner surface, so that by simply surface treating the inner surface, it is possible to precisely process the portion that passes the signal or light necessary for the sensor module to sense the biosignal of the smart ring user.This aims to provide a new method for manufacturing a smart ring, which can improve the accuracy of the sensor module's biosignal detection and streamline related production processes, and a smart ring manufactured using this method.
[0015] Furthermore, it is an object of the present invention to provide a new method for manufacturing a smart ring that can shorten the time required to remove bubbles contained in the molding when forming the inner surface of the smart ring and can thoroughly remove the bubbles, and a smart ring manufactured using the same. [Means for solving the problem]
[0016] In order to achieve the above object, in one aspect, the present invention relates to a method for manufacturing a smart ring, which includes an outer cover processing step (S110) of processing an outer cover 100 having a ring shape of the smart ring and accommodating a sensor / communication module; a sensor / communication module fabrication step (S120) of fabricating a sensor / communication module 200 including a sensor module that senses a biosignal of a smart ring user; an outer cover and sensor / communication module combination fabrication step (S200) of accommodating the sensor / communication module 200 inside the ring shape of the outer cover 100 to form a ring-shaped outer cover and sensor / communication module combination; an inner molding step (S300) of creating an inner molding part 300 having a hole of a predetermined shape inside the ring-shaped outer cover and sensor / communication module combination; and a sensing window forming step (S400) of forming a sensing window on the inner surface of the inner molding part 300, which is a part that passes signals or light necessary for the sensor module to sense a biosignal of a smart ring user. The inner molding part processing step (S300) is characterized by filling the entire inner area of the ring-shaped combined body with a molding material, and then cutting a hole of a predetermined shape in the center of the filled molding material to generate the inner molding part 300.
[0017] Preferably, the molding material of the inner molding part 300 is a transparent thermosetting plastic.
[0018] Preferably, in the outer cover part processing step (S110), the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, and is processed to form a ring-shaped storage space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.
[0019] Here, in the sensor / communication module manufacturing step (S120), it is preferable to manufacture the sensor / communication module 200 in a ring shape that can be accommodated in the ring-shaped accommodation space by combining the components of the sensor / communication module 200.
[0020] Furthermore, preferably, the inner molding portion processing step (S300) includes a molding material injection / hardening step of injecting and hardening a molding material into the entire inner region of the ring-shaped combination of the outer cover portion and the sensor / communication module, and then removing the molding device; a horizontal cutting step of cutting molding material protrusions that protrude from one or more of the upper or lower surfaces of the ring-shaped combination of the sensor / communication module in which the hardened molding material has been filled in the entire inner region; and a vertical cutting step of machining a hole of a predetermined shape in the center of the filled molding material of the ring-shaped combination of the sensor / communication module in which the molding material has been filled in the entire inner region in which there are no protrusions.
[0021] Here, it is preferable to further include a rounded portion processing step of forming a rounded portion 320 by rounding at least one of the upper end and the lower end of the molded portion body 310 of the inner molded portion 300 .
[0022] Preferably, the sensing window forming process (S400) applies a clear coating with adjusted transparency to the entire inner surface of the inner molding part 300, forming a sensing window 330, which is a transparent or translucent part that allows the signal or light necessary for the position corresponding to the sensor module to pass through for sensing a biosignal.
[0023] Furthermore, preferably, the sensing window forming process (S400) applies a clear coating with adjusted transparency to the portion of the inner molding part 300 corresponding to the position of the sensor module, and forms a sensing window 330, which is a portion that passes the signal or light necessary to sense biological signals, corresponding to the clear-coated portion of the sensor module.
[0024] Here, the sensing window forming process (S400) preferably includes a masking process in which a masking member is attached to the portion of the smart ring to be processed that is not to be clear coated, a primer coating process in which a primer coating liquid is applied to the inner surface of the inner molding portion 300 where the clear coating is to be performed to form a primer layer, a process in which a clear coating liquid with adjusted transparency is applied to the dried primer layer to form a clear coating layer, and a drying and masking removal process in which the clear coating layer is dried and the masking member is removed.
[0025] Preferably, the molding device includes an outer lower frame 410, an inner lower frame 420 coupled to an upper portion of the outer lower frame 410 and into which a lower region of the combination of the outer cover unit 100 and the sensor / communication module 200 is inserted and coupled, an inner upper frame 430 disposed on an upper portion of the inner lower frame 420 and into which an upper region of the combination of the outer cover unit 100 and the sensor / communication module 200 is inserted and coupled, and which serves as an injection passage for a molding material, and an outer upper frame 440 disposed on an upper portion of the inner upper frame 430 and fixes the inner upper frame 430 so that it does not spread or separate. The outer cover unit 100 is a molding device. The inner lower frame 420 includes a position guide 140 that guides the inner lower frame 420 to be positioned at a set position of 400. A first position guide protrusion 423 is provided on an outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434, and a second position guide protrusion 434 is provided on an outer wall of the inner upper frame 430 on the same vertical line as the position guide 140 and the first position guide protrusion 423. During the molding material injection / curing process, the position of the outer cover part 100, the inner lower frame 420, and the inner upper frame 430 are guided using the position guide 140, the first position guide protrusion 423, and the second position guide protrusion 434.
[0026] In another aspect, the present invention relates to a smart ring, which includes an outer cover part 100 having a ring shape of the smart ring and accommodating a sensor / communication module; a sensor / communication module 200 accommodated in the outer cover part 100 and including a sensor module for detecting the biosignals of the smart ring user; and an inner molding part 300 having a hole of a predetermined shape into which the finger of the smart ring user fits, wherein the outer cover part 100 and the sensor / communication module 200 are combined to form a ring-shaped outer cover part and sensor / communication module combination, and the inner molding part 300 is formed by filling the entire inner area of the ring-shaped combination with a molding material, and then cutting and molding a hole of a predetermined shape in the center of the filled molding material.
[0027] Preferably, the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, forming a ring-shaped accommodation space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130, and the sensor / communication module 200 is accommodated and coupled in the ring-shaped space.
[0028] Here, it is preferable that the sensor / communication module 200 is manufactured in a ring shape corresponding to the ring-shaped receiving space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and is received and coupled in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.
[0029] Preferably, the sensor / communication module 200 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, 215c, the plurality of PCB assemblies 215a, 215b, 215c, one side of which is connected to the connection portion 212, a bending member 216 connecting the PCB assemblies 215a, 215b, 215c, and a connection member having one side of which is connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, 215c.
[0030] Furthermore, preferably, the outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be placed at a set position in the molding device 400 .
[0031] Additionally, the molding material forming the inner molded portion 300 is preferably a hardened, transparent thermosetting plastic.
[0032] Here, it is preferable that a sensing window 330, which is a part that passes through the signals or light necessary for the sensor module to sense the biosignals of the smart ring user, is formed on all or part of the wall surface of the hole created by cutting the inner surface of the inner molding part 300.
[0033] Here, the sensing window 330 is preferably a portion of the inner surface of the inner molding part 300 where transparency is improved by a clear coating layer at a position corresponding to the sensor module.
[0034] Preferably, the sensor module includes an optical blood flow measurement sensor, and the sensing window 330 is a transparent or translucent portion having improved transparency by clear coating at positions corresponding to the positions of the light emitting unit and the light receiving unit of the optical blood flow measurement sensor as corresponding positions of the sensor module. [Effects of the Invention]
[0035] According to the present invention as described above, it is possible to provide a new method for manufacturing a smart ring that satisfies various requirements regarding the inner shape and size of the smart ring and reduces the time and cost required for developing and manufacturing smart rings of various shapes and sizes, and a smart ring manufactured through this method.
[0036] According to the new smart ring manufacturing method of the present invention, the entire inner ring area of the ring-shaped outer cover part 100 and the sensor / communication module 200 combination is filled with molding material, and then a hole of a predetermined shape is machined in the center of the filled molding material to create the inner molding part 300.Therefore, even without changing the molding equipment, it is possible to realize various inner shapes and sizes of smart rings through the inner molding part machining process, which includes a simple cutting process.
[0037] In addition, the new smart ring manufacturing method of the present invention and the smart ring manufactured thereby make it easy to adjust the transparency of the entire inner surface of the smart ring or only a portion of the inner surface, thereby improving the quality of the product related to transparency and streamlining the production process.
[0038] In some embodiments, by improving the transparency of all or part of the inner surface of the smart ring through surface treatment of the inner surface, such as clear coating, it is possible to precisely process the parts that allow the signals or light necessary for the sensor module to detect the smart user's biosignals to pass through, thereby improving the accuracy of the sensor module's biosignal detection and streamlining related production processes.
[0039] In addition, depending on the embodiment, the transparency and the area to which the transparency adjustment is applied can be precisely controlled by adjusting the composition of the clear coating liquid and masking to improve the transparency.
[0040] Furthermore, in the new smart ring manufacturing method of the present invention, the molding device that performs the molding member injection / hardening process of the inner molding part processing step (S300) has a wide injection hole 431a in the inner frame structure, which allows for a larger externally exposed area of the molding member. This provides a large area for air bubbles to escape when removing air bubbles that occur due to the use of the molding member material, making it easier to remove air bubbles and allowing for faster and more efficient air bubble removal compared to conventional molding devices that have small injection holes and small externally exposed areas. This has the effect of improving work efficiency and improving product quality related to transparency. [Brief explanation of the drawings]
[0041] [Figure 1] 1 is a flowchart of a method for manufacturing a smart ring according to one embodiment of the present invention. [Figure 2] 2 is a perspective view showing a smart ring according to an embodiment of the present invention manufactured by the method of FIG. 1. [Figure 3] 1. FIG. 3 is a perspective view showing another embodiment of a smart ring manufactured by the method of FIG. [Figure 4] FIG. 1 is an exploded perspective view illustrating the configuration of a smart ring according to an embodiment of the present invention, and an example of the component preparation process (S100) and the cover portion and sensor / communication module combination manufacturing process (S200). [Figure 5] 10A to 10C are diagrams for explaining an embodiment of the inner molding portion processing step (S300) of the present invention. [Figure 6] FIG. 10 is a diagram for explaining an embodiment of the sensing window forming step (S400) of the present invention. [Figure 7] FIG. 10 is a diagram for explaining another embodiment of the sensing window forming step (S400) of the present invention. [Figure 8] 1 is a perspective view schematically illustrating a molding device used to manufacture a smart ring according to an embodiment of the present invention. [Figure 9] FIG. 9 is an exploded perspective view of the molding device of FIG. 8. [Figure 10]FIG. 10 is a cross-sectional view of the molding device of FIG. [Figure 11] 1 is a diagram of a prior art molding apparatus. DETAILED DESCRIPTION OF THE INVENTION
[0042] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings, which are provided to enable those skilled in the art to practice the present invention.
[0043] It should be understood that the various embodiments of the present invention are different from one another, but are not necessarily mutually exclusive. For example, a particular shape, structure, or characteristic described herein in connection with one embodiment may be embodied in other embodiments without departing from the spirit or scope of the present invention.
[0044] Furthermore, it should be understood that the location or arrangement of individual components within each embodiment may be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly interpreted. Like reference numerals in the drawings refer to the same or similar functionality throughout the various aspects.
[0045] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification can be used in a manner commonly understood by a person having ordinary skill in the art to which the present invention belongs. Furthermore, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly defined otherwise.
[0046] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.
[0047] Fig. 1 is a flowchart of a method for manufacturing a smart ring according to an embodiment of the present invention, Fig. 2 is a perspective view showing a smart ring of one embodiment manufactured by the method of Fig. 1, and Fig. 3 is a perspective view showing a smart ring of another embodiment manufactured by the method of Fig. 1. Fig. 4 is an exploded perspective view for explaining the configuration of the smart ring of the embodiment of the present invention and an example of the component preparation step (S100) and the cover part and sensor / communication module combination manufacturing step (S200).
[0048] 1, the method for manufacturing the smart ring of the present invention includes a component preparation process (S100) including an outer cover processing process (S110) and a sensor / communication module fabrication process (S120), an outer cover and sensor / communication module assembly fabrication process (S200), an inner molded part processing process (S300), and a sensing window formation process (S400). After the sensing window formation process (S400) is completed, a conventional finishing process (S500) such as impurity removal and polishing is performed, completing the manufacturing method for the smart ring 1 of the present invention.
[0049] As shown in Figures 2 and 3, the sensor / communication module 200 includes a sensor module 214, and the portion of the inner surface of the inner molded part 300 corresponding to the position where the sensor module 214 is installed is made transparent, and a sensing window 330, which is a portion that passes through the signals or light necessary for the sensor module to sense the biosignals of the smart ring user, is formed on the inner surface of the inner molded part 300, in this method of manufacturing a smart ring 1.
[0050] Referring to Figures 2 and 3, the smart ring 1 manufactured by the manufacturing method of the smart ring 1 of the present invention basically comprises an outer cover part 100 having the ring shape of the smart ring and accommodating a sensor / communication module, a sensor / communication module 200 including a sensor module that detects the biosignals of the smart ring wearer, and an inner molded part 300 having a hole of a predetermined shape inside the combination of the ring-shaped outer cover part 100 and the sensor / communication module 200 into which the finger of the smart ring user fits.
[0051] The inner surface of the inner molding part 300 is formed with a sensing window, which is a portion that passes signals or light necessary for the sensor module 214 to sense the biosignals of the smart ring user.
[0052] In the embodiment of Figure 2, the entire inner molding part 300 is treated to be transparent, and a sensing window 330 is formed therein. In the embodiment of Figure 3, only a portion of the inner surface of the inner molding part 300 corresponding to the position of the sensor module 214 is treated to be transparent, and a sensing window 330 is formed therein.
[0053] 2 to 4, in the outer cover processing step (S110) of the component preparation step (S100), the outer cover 100 having a ring shape of a smart ring and accommodating a sensor / communication module is processed and manufactured. In this embodiment, the outer cover 100 may be made of a metal material such as titanium or medical stainless steel.
[0054] However, depending on the embodiment, the material is not limited to metal, and various materials such as ceramic, plastic, and wood can be used, and the processing method can be selected from known processing methods appropriate for the material.
[0055] 4, the detailed configuration of the outer cover part 100 processed in this embodiment will be described. The outer cover part 100 in this embodiment is made of a metal material such as titanium or medical stainless steel, and includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110. The outer cover body 110 is processed to form a ring-shaped receiving space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and the sensor / communication module 200 is received and coupled in the ring-shaped space.
[0056] In this embodiment, the outer cover part 100 further includes a position guide 140 that guides the outer cover body 110 to be positioned at a set position in the molding device 400, which will be described later. The position guide 140 of the outer cover part 100 guides the outer cover body 110 to be positioned at a set position in the molding device 400, thereby improving the accuracy and efficiency of the inner molding part processing process, reducing the reject rate and improving product quality.
[0057] The position guide 140 may be formed as a flat area on the outer wall of the outer cover body 110 as shown in FIG. 4, or may be formed as a groove or protrusion in addition to the flat area depending on the embodiment.
[0058] 2 to 4, in the sensor / communication module manufacturing step (S120) of the component preparation step 100, a sensor / communication module 200 including a sensor module for detecting a biosignal of a smart ring user is manufactured. In this embodiment, a plurality of PCB assemblies 215a, 215b, and 215c, each equipped with electronic circuits such as a sensor module 214, a battery, and other communication modules, are connected by a bending member 216.
[0059] In this embodiment, the sensor module 214 includes an optical blood flow measurement sensor, which can measure the blood flow information of the wearer of the smart ring, and through the blood flow information, biometric information such as heart rate and oxygen saturation can be measured.
[0060] Referring to FIG. 4, the detailed configuration of the sensor / communication module 200 manufactured in this embodiment may be configured with a sensing / communication unit 210 and a mounting unit 220, and may further include a bracket unit 230.
[0061] 4, the sensor / communication module 200 can be manufactured in a ring shape corresponding to the ring-shaped accommodation space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130 so that it can be simultaneously accommodated and coupled in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130. In the sensor / communication module manufacturing step (S120) of the component preparation step 100, each component described below is assembled and manufactured into a ring shape that can be accommodated in the ring-shaped accommodation space.
[0062] To this end, the sensing / communication unit 210 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, and 215c, a plurality of PCB assemblies 215a, 215b, and 215c, one side of which is connected to the connection portion 212, a bending member 216 connecting the PCB assemblies 215a, 215b, and 215c, and a connection member having one side connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, and 215c, and the plurality of PCB assemblies 215a, 215b, and 215c have a sensor module 214, a battery, a communication module, and other required electronic circuits disposed on the plurality of PCB assemblies 215a, 215b, and 215c. In this embodiment, the sensor module 214 is mounted on the central PCB assembly 215b and includes an optical blood flow measurement sensor that uses light to measure heart rate, oxygen saturation, etc. at a body part through which an artery passes, such as a fingertip.
[0063] In this embodiment, the bracket portion 230 is further included, which is coupled to the connection portion 212 and the connection member 213. The bracket portion 230 protects the multiple PCB assemblies 215 and the sensor module 214, battery, and communication module provided thereon, and enables the multiple PCB assemblies 215a, 215b, and 215c to be installed in accurate positions.
[0064] As shown in FIG. 4 , the mounting portion 220 of the sensor / communication module 200 includes an inner mounting member 221 attached to the inner wall of the sensing / communication portion 210 to protect the sensor modules 214, battery, communication modules and other required electronic circuits of the multiple PCB assemblies 215, a first mounting member 222 coupled to the connection portion 212 to connect the third body 233 of the bracket portion 230 to the connection portion 212, a second mounting member 223 attached to the outer wall of the base body 211 to attach the base body 211 to the inner wall of the outer cover body 110, and a third mounting member 224 coupled to the region of the connection member 213 to attach the second body 232 of the bracket portion 230 to the region of the connection member 213.
[0065] The bracket portion 230 of the sensor / communication module 200 is attached to the sensing / communication portion 210 by the mounting portion 220 described above, and can protect the sensor modules 214, batteries, communication modules and other necessary electronic circuits of the multiple PCB assemblies 215.
[0066] In this embodiment, the bracket part 230 is provided at a position corresponding to the plurality of PCB assemblies 215 as shown in FIG. 4, and includes a first body 231 having a first hole 231a in which a central first PCB assembly 215b having a sensor module 214 provided therein is disposed, a second body 232 having a second hole 232a in which a right second PCB assembly 215a is disposed therein, and a third body 233 having a third hole 233a in which a left third PCB assembly 215c is disposed therein.
[0067] In this embodiment, the overall outer wall shape of the bracket portion 230 may have a semicircular shape as shown in FIG.
[0068] The outer cover part and sensor / communication module combination manufacturing process (S200) accommodates the sensor / communication module 200 inside the ring shape of the processed outer cover part 100 to form a ring-shaped combination, and in this embodiment, the accommodated sensor / communication module 200 is attached and fixed to the inner wall of the outer cover body 110 via the second attachment member 223 of the attachment part 220 of the sensor / communication module 200.
[0069] The inner molded portion processing step (S300) creates an inner molded portion 300 having a hole of a preset shape inside the ring-shaped combined body, into which the finger of the smart ring user fits.
[0070] The inner molding part processing step (S300) of the present invention is carried out in a novel manner by filling the entire inner area of the ring-shaped combination of the outer cover part and the sensor / communication module with molding material, and then cutting a hole of a predetermined shape in the center of the filled molding material to generate the inner molding part 300.
[0071] The inner molding part 300 is manufactured by molding a molding member made of a transparent material, which can be clear coated to increase transparency after molding to create a coated transparent or translucent part.
[0072] As a transparent molding member, a transparent thermosetting plastic such as a transparent hard epoxy can be used.
[0073] FIG. 5 is a diagram for explaining an embodiment of the inner molded portion processing step (S300) of the present invention.
[0074] Referring to Figure 5, the inner molding part processing process (S300) of this embodiment includes a molding material injection / hardening process in which a molding material is injected into the entire inner area of the ring-shaped combination of the outer cover part and the sensor / communication module using the molding device of the embodiment of the present invention shown in Figures 8 to 10, the molding material is hardened, and the molding device is removed.
[0075] After the molding material injection / hardening process is performed, a ring-shaped sensor / communication module combination is obtained in which the entire inner region is filled with hardened molding material, as shown in Figure 5(a).Subsequently, a horizontal cutting process is performed to cut off the molding material protrusions that protrude from one or more of the top or bottom surfaces of the ring-shaped sensor / communication module combination in which the entire inner region is filled with hardened molding material.
[0076] As a result of carrying out the horizontal cutting process, a ring-shaped combined sensor / communication module is obtained, in which the entire inner area without protrusions is filled with the hardened molding material, as shown in Figure 5(b).
[0077] Next, a vertical cutting process is performed to machine a hole of a predetermined shape in the center of the filled molding material of the ring-shaped combination of the sensor / communication module, in which the molding material has been filled in the entire inner area free of protrusions.
[0078] As a result of the vertical cutting step, an inner molded portion body 310 having an inner vertical surface is formed as shown in FIG. 5(c).
[0079] Then, a rounded portion processing step is performed in which at least one of the upper end and the lower end of the molded portion body 310 is rounded to form the rounded portion 320.
[0080] As a result of the execution of the rounded portion processing step, an inner molded portion 300 consisting of a molded portion body 310 and a rounded portion 320 as shown in FIG. 5(d) is formed.
[0081] The horizontal cutting step, vertical cutting step, and rounding step can be performed by CNC machining.
[0082] The sensing window forming process (S400) is a process of forming a sensing window, which is a portion that transmits signals or light necessary for the sensor module to sense the biosignals of the smart ring user, on the inner surface of the inner molding part 300. This is a process of processing all or part of the inner surface of the inner molding part 300, i.e., the wall surface of the hole created by cutting, to allow the transmission of signals or light.
[0083] In this embodiment, a clear coating layer is formed on all or part of the inner surface of the inner molding part 300, which is the processed cut surface of the hardened transparent material molding member, to improve transparency, thereby allowing the transmission of signals or light transmitted and received by the sensor module, and forming a part optimized for the transmission of signals and light.
[0084] In the present invention, a clear coating with adjusted transparency is applied to all or part of the inner surface of the inner molding part 300, and the position of the sensor module, i.e., if an optical blood flow measurement sensor is included, the position corresponding to the positions of the light emitting part and the light receiving part of the optical blood flow measurement sensor is clear coated, and a transparent or translucent part with increased transparency is generated as the sensing window 330.
[0085] In the present invention, the areas to which the clear coating is applied can be adjusted by selectively masking the areas that will not be clear coated before clear coating. Therefore, the coated transparent or translucent area can be easily clear coated in the desired position and range to increase transparency, thereby creating a sensing window (330).
[0086] In addition, the transparency of the clear-coated portion can be adjusted by adjusting the type and composition ratio of various known clear coating liquids, so that a transparent or translucent sensing window 330 with transparency optimized for the characteristics of the sensor module can be produced.
[0087] The sensing window formation process (S400) includes a masking process in which a masking member is attached to the portion of the smart ring to be processed that will not be clear coated; a primer coating process in which a primer coating liquid is applied to the inner surface of the inner molding portion 300 where the clear coating will be applied to form a primer layer; a process in which a clear coating liquid with adjusted transparency is applied to the dried primer layer to form a clear coating layer; and a drying and masking removal process in which the clear coating layer is dried and the masking member is removed.The area to be clear coated can be adjusted by adjusting the range and shape of the masking depending on the embodiment.
[0088] FIG. 6 is a diagram for explaining one embodiment of the sensing window forming step (S400) of the present invention, and FIG. 7 is a diagram for explaining another embodiment of the sensing window forming step (S400) of the present invention.
[0089] In the sensing window forming step (S400) of the embodiment of Fig. 6, a clear coating with controlled transparency is applied to the entire inner surface of the inner molding part 300 to form the sensing window 330, which is a transparent or semi-transparent part that passes a signal or light necessary for sensing a biosignal at a position corresponding to the sensor module. In this embodiment, the sensing window 330 of the embodiment of Fig. 2 is formed.
[0090] Referring to Figure 6, the sensing window formation process (S400) of this embodiment includes a masking process in which a masking member is attached to the outer cover portion, which is the portion of the smart ring to be processed (Figure 6(a)) that will not be clear coated; a primer coating process in which a primer coating liquid is applied to the entire inner surface of the inner molded portion 300 where the clear coating will be applied, i.e., the surface of the molded portion body 310 and the rounded portion 320, to form a primer layer; a process in which a clear coating liquid with adjusted transparency is applied to the dried primer layer to form a clear coating layer; and a drying and masking removal process in which the clear coating layer is dried and the masking member is removed.
[0091] As a result, as shown in FIG. 6(e), the portion of the entire inner surface of the inner molding part 300 that has been made transparent or semi-transparent by the clear coating, corresponding to the position of the sensor module, is formed as a sensing window 330.
[0092] 7, the sensing window forming step (S400) involves applying a clear coating with controlled transparency only to a portion of the inner molding part 300 corresponding to the position of the sensor module, and forming the sensing window 330, which is a portion that passes signals or light required to sense biosignals, in the clear-coated portion corresponding to the sensor module. In this embodiment, the sensing window 330 of the embodiment of FIG. 3 is formed.
[0093] Referring to Figure 7, the sensing window formation process (S400) of this embodiment includes a masking process in which a masking material is attached to the outer cover portion and the portion of the inner molded portion 300 corresponding to the position of the sensor module, which are the portions of the smart ring to be processed in Figure 7(a), that are not to be clear coated; a primer coating process in which a primer coating liquid is applied to the surface of the inner molded portion 300 where the clear coating is to be performed to form a primer layer; a process in which a clear coating liquid with adjusted transparency is applied to the dried primer layer to form a clear coating layer; and a drying and masking removal process in which the clear coating layer is dried and the masking material is removed.
[0094] As a result, only the portion of the inner molding part 300 that is made transparent or semi-transparent by the clear coating and corresponds to the position of the sensor module is formed as a sensing window 330, as shown in FIG. 7(e).
[0095] In this example, various paints can be used as the primer coating, and in this example, the product names Eureka Primer #152 or UVILUX PRIMER #100-3 (NY) can be used.
[0096] For clear coating, the desired level of transparency can be achieved by adjusting the mixing ratio of the luminous paint and non-luminous paint to adjust the ratio of luminous paint to non-luminous paint to 10:0 for complete transparency, or by adjusting the ratio of luminous paint to non-luminous paint to 5:5 for semi-transparency.
[0097] In this embodiment, the luminous paint may be selected from the product name HNP-UTT #3003(P) CLEAR, whose main component is acrylic polyol resin, or the product name HNP-UVT #6011 CLEAR, whose main component is modified acrylic oligomers, or the product name Ubichem CVM890SH Top Coat Oil Light (Improved), whose main component is reactive monomers, and the non-luminous paint may be selected from the product name HNP-UTT #3003(P) MATT, whose main component is acrylic polyol resin, or the product name HNP-UTT #3003(P) CLEAR, whose main component is acrylic polyol resin.
[0098] Before the masking process, a static elimination process is performed to neutralize the static electricity charged on the outer cover part 100 using ions, i.e., to consume the accumulated static electricity using ions, thereby removing foreign matter such as dust from the surface of the outer cover part 100.
[0099] In order to carry out the molding material injection / hardening process of the inner molding part processing step (S300) of the new smart ring manufacturing method of the present invention described above, a molding device according to one embodiment of the present invention described below, which is different from the conventional molding device of Figure 11, has been developed and used.
[0100] FIG. 8 is a perspective view schematically showing a molding apparatus used to manufacture a smart ring according to an embodiment of the present invention, FIG. 9 is an exploded perspective view of the molding apparatus of FIG. 8, and FIG. 10 is a cross-sectional view of the molding apparatus of FIG. 8.
[0101] 8 to 10, the molding device 400 used in the inner molding part processing step (S300) of the smart ring manufacturing method of the present invention includes an outer lower frame 410, an inner lower frame 420 that is connected to the upper part of the outer lower frame 410 and into which the lower region of the combination of the outer cover part 100 and the sensor / communication module 200 described above is inserted and connected, an inner upper frame 430 that is arranged on the upper part of the inner lower frame 420 and into which the upper region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and connected and serves as an injection passage for the molding material, and an outer upper frame 440 that is arranged on the upper part of the inner upper frame 430 and fixes the inner upper frame 430 to prevent it from spreading or separating.
[0102] A first position guide protrusion 423 is provided on the outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434, and a second position guide protrusion 434 is provided on the outer wall of the inner upper frame 430 on the same vertical line as the position guide 140 and the first position guide protrusion 423, which guides the joining positions of the outer cover part 100, the inner lower frame 420 and the inner upper frame 430 during the molding material injection / curing process.
[0103] 8 to 10, the outer lower frame 410 has an outer lower groove 411 on the upper surface thereof as shown in Fig. 9, and an inner lower flange 421 of the inner lower frame 420 can be fitted into the outer lower groove 411. As a result, the inner lower frame 420 can be fixed without spreading or separating during the molding operation.
[0104] In this embodiment, the outer lower frame 410 may be made of a material including steel, stainless steel, or a plastic material, which may also be applied to the inner lower frame 420 .
[0105] The inner lower frame 420 may be fitted into the outer lower groove 411 of the outer lower frame 410 to support the lower region of the combination of the outer cover part 100 and the sensor / communication module 200 .
[0106] In this embodiment, as shown in Figures 9 and 10, an inner lower flange 421 is provided at the bottom of the inner lower frame 420, and this inner lower flange 421 can be detachably fitted and coupled to the outer lower groove 411.
[0107] In addition, in this embodiment, an inner groove 422 is provided on the upper surface of the inner lower frame 420, as shown in Figures 9 and 10, and the lower region of the combination of the outer cover part 100 and the sensor / communication module 200 can be fitted into this inner groove 422.
[0108] Furthermore, in this embodiment, a first position guide protrusion 423 may be provided on the outer wall of the inner lower frame 420, as shown in Fig. 9. In this embodiment, the first position guide protrusion 423 is provided on the same vertical line as the position guide 140 of the outer cover part 100 and the second position guide protrusion 434 of the inner upper frame 430, as shown in Fig. 9, and can conveniently guide the coupling position of the outer cover part 100 and the inner upper frame 430.
[0109] In this embodiment, the inner lower frame 420 may be made of a material containing silicon so that the inner lower frame 420 can be easily separated from the outer lower frame 410 after the molding member hardens by adhering closely to the surface of the outer lower frame 410 so that the resin does not flow out and contaminate the outer lower frame 410 when the molding member containing transparent hard epoxy is poured in. In this embodiment, the silicon may have a hardness of 60 to 70 degrees.
[0110] The inner upper frame 430 supports the upper region of the combination of the outer cover part 100 and the sensor / communication module 200, and allows a molding material to be injected into the inside of the outer cover part 100.
[0111] 9 and 10, the inner upper frame 430 in this embodiment includes an injection post 431 provided at the top as an injection passage for the molding material, an injection position protrusion 432 provided on the inner wall of the injection post 431 to guide the upper injection height of the molding material filled inside the injection post 431, an inner upper flange 433, 120 provided at the bottom of the inner upper frame 430 to be fitted into the outer upper groove 441 of the outer upper frame 440, and a second position guide protrusion 434 provided on the outer wall of the inner upper frame 430, aligned vertically with the position guide 140 and the first position guide protrusion 423, for conveniently guiding the joining position of the inner upper frame 430.
[0112] 9 and 10, the injection post 431 is provided with an injection hole 431a through which the molding material can be injected into the outer cover part 100 to which the sensor / communication module 200 is coupled and then hardened. Also, in this embodiment, a post guide 431b is provided on the outer wall of the injection post 431 as shown in FIG. 9, and the post guide 431b can be provided on the same vertical line as the second position guide protrusion 434, the position guide 140, and the first position guide protrusion 423.
[0113] As shown in FIG. 9, the outer upper frame 440 is detachably fitted and coupled to the inner upper flange 433 via the outer upper groove 441, thereby preventing the inner upper frame 430 from spreading or separating during molding.
[0114] 11, the molding apparatus 400 of this embodiment has an inner frame structure that is molded throughout, and the wider injection hole 431a provides a larger exposed area for the molding members. This allows for easier removal of air bubbles that may be generated by the material of the molding members. Furthermore, compared to the conventional molding apparatus with a smaller injection hole and a smaller exposed area, the molding apparatus 400 can remove air bubbles more quickly and efficiently. This improves work efficiency and product quality, particularly in terms of transparency.
[0115] The molding material injection / hardening process of the inner molding portion processing step (S300) can be performed by first injecting a molding material containing epoxy into the combination of the outer cover part 100 and the sensor / communication module 200 using the molding device 400 of the above embodiment, and then hardening the molding material. Once the epoxy has hardened, the components of the molding device 400 can be removed to obtain the combination of the outer cover part 100 and the sensor / communication module 200 filled with the hardened epoxy molding material as the molding material, as shown in Figure 5(a). Subsequently, the inner molding portion processing step (S300) is completed through the inner molding portion processing step (S300) described with reference to Figures 5 and 6.
[0116] Meanwhile, the smart ring 1 of this embodiment manufactured by the above-mentioned method includes, as shown in Figures 2 and 3, an outer cover part 100 having a ring shape of a smart ring and accommodating a sensor / communication module, a sensor / communication module 200 accommodated in the outer cover part 100 and including a sensor module that detects the biosignals of the smart ring user, and an inner molding part 300 having a hole of a predetermined shape into which the finger of the smart ring user fits. The outer cover part 100 and the sensor / communication module 200 are combined to form a ring-shaped outer cover part and sensor / communication module combination, and the inner molding part 300 is formed by filling the entire inner area of the ring-shaped combination with molding material and then cutting and forming a hole of a predetermined shape in the center of the filled molding material.
[0117] Referring to FIG. 4, the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, forming a ring-shaped receiving space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130, and the sensor / communication module 200 can be received and coupled in the ring-shaped space.
[0118] Here, the sensor / communication module 200 is manufactured in a ring shape corresponding to the ring-shaped receiving space surrounded by the inner surfaces of the upper flange 120 and the lower flange 130, and is received and coupled in the ring-shaped space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.
[0119] In this embodiment, the sensor / communication module 200 includes a base body 211 having a semicircular shape, a connection portion 212 having a semicircular shape and thinner than the base body 211, one side of which is connected to the base body 211 and the other side of which is connected to a plurality of PCB assemblies 215a, 215b, and 215c, a plurality of PCB assemblies 215a, 215b, and 215c, one side of which is connected to the connection portion 212, a bending member 216 connecting the PCB assemblies 215a, 215b, and 215c, and a connection member having one side connected to the base body 211 and the other side of which is connected to the plurality of PCB assemblies 215a, 215b, and 215c.
[0120] In addition, the outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be positioned at a set position in the molding device 400 .
[0121] Furthermore, the molding material forming the inner molded portion 300 is a hardened, transparent thermosetting plastic.
[0122] Here, a sensing window 330, which is a part that passes through the signal or light necessary for the sensor module to sense the biosignal of the smart ring user, can be formed on all or part of the wall surface of the hole created by cutting the inner surface of the inner molding part 300.
[0123] Here, the sensing window 330 may be a portion of the inner surface of the inner molding part 300 whose transparency is improved by a clear coating layer at a position corresponding to the sensor module, and the sensor module may have an optical blood flow measurement sensor, and the sensing window 330 may be a transparent or translucent portion whose transparency is improved by clear coating at a position corresponding to the positions of the light emitting part and the light receiving part of the optical blood flow measurement sensor, which is the corresponding position of the sensor module.
[0124] Therefore, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications and variations should be included in the scope of the claims of the present invention. [Explanation of symbols]
[0125] 1: Smart Ring 100: Outer cover 110: Outer cover body 120: Upper flange 130: Lower flange 140: Location Guide 200: Sensor / Communication Module 210: Sensing / Communication Department 211: Base body 212: Connection 213: Connection member 214: Sensor module 215: PCB Assembly 216: Bending parts 220: Mounting part 221: Inner mounting member 222: First mounting member 223: Second mounting member 224: Third mounting member 230: Bracket part 231: First Body 231a: 1st Hall 232: Second Body 232a: 2nd hall 233: Third Body 233a: 3rd Hall 300:Inner molding part 310: Molded body 320: Rounding section 330: Sensing window 400: Molding equipment 410: Outer lower frame 411: Outer lower groove 420: Inner lower frame 421: Inner lower flange 422: Inner groove 423: First position guide protrusion 430: Inner upper frame 431: Injection post 431a: Injection hole 431b: Post Guide 432: Injection position protrusion 433: Inner upper flange 434: Second position guide protrusion 440: Outer upper frame 441: Outside upper groove
Claims
1. In the manufacturing method of the smart ring, an outer cover part processing step (S110) of processing and manufacturing an outer cover part 100 having a ring shape of the smart ring and accommodating a sensor / communication module; a sensor / communication module manufacturing process (S120) for manufacturing a sensor / communication module 200 including a sensor module for detecting a biosignal of a smart ring user; an outer cover part and sensor / communication module combination fabrication step (S200) of accommodating the sensor / communication module 200 inside the ring-shaped outer cover part 100 to form a ring-shaped outer cover part and sensor / communication module combination; An inner molding part processing step (S300) for generating an inner molding part 300 having a hole of a predetermined shape into which a finger of a smart ring user fits inside the ring-shaped outer cover part and the sensor / communication module combination; and a sensing window forming step (S400) for forming a sensing window on the inner surface of the inner molding part 300, the sensing window being a part through which a signal or light necessary for the sensor module to sense the biosignal of the smart ring user passes; The inner molding part processing step (S300) is a method for manufacturing a smart ring, characterized in that a molding material is filled into the entire inner area of the ring-shaped combined body, and then a hole of a predetermined shape is cut in the center of the filled molding material to generate the inner molding part 300.
2. In claim 1, A method for manufacturing a smart ring, wherein the molding material of the inner molding part 300 is a transparent thermosetting plastic.
3. In claim 1, The outer cover part processing step (S110) is a method for manufacturing a smart ring, characterized in that the outer cover part 100 includes a ring-shaped outer cover body 110, an upper flange 120 provided at the upper end of the outer cover body 110, and a lower flange 130 provided at the lower end of the outer cover body 110, and is processed to form a ring-shaped storage space surrounded by the inner surfaces of the outer cover body 110, the upper flange 120, and the lower flange 130.
4. In claim 3, The sensor / communication module manufacturing process (S120) is a method for manufacturing a smart ring, characterized in that each component of the sensor / communication module 200 is combined to form a ring shape that can be accommodated in the ring-shaped accommodation space.
5. In claim 1, The inner molding part processing process (S300) is a molding material injection / hardening process in which a molding material is injected into the entire inner region of the ring-shaped combination of the outer cover part and the sensor / communication module, hardened, and then the molding device is removed; A horizontal cutting process for cutting molding material protrusions that protrude from one or more of the upper and lower surfaces of the ring-shaped combination of the sensor / communication module, the entire inner region of which is filled with the hardened molding material; and A method for manufacturing a smart ring, comprising a vertical cutting process for machining a hole of a predetermined shape in the center of a filled molding material of a ring-shaped combination of a sensor / communication module, the entire inner area of which is free of protrusions, filled with molding material.
6. In claim 5, The method for manufacturing a smart ring further includes a rounding process for forming a rounded portion 320 by rounding at least one of the upper end and the lower end of the molded portion body 310 of the inner molded portion 300.
7. In claim 2, The sensing window forming process (S400) is a method for manufacturing a smart ring, characterized by applying a clear coating with adjusted transparency to the entire inner surface of the inner molding part 300, and forming a sensing window 330, which is a transparent or translucent part that allows the signal or light necessary for the part corresponding to the position of the sensor module to pass through and detect biological signals.
8. In claim 2, The sensing window forming process (S400) is a method for manufacturing a smart ring, characterized in that a clear coating with adjusted transparency is applied to the portion of the inner molding part 300 corresponding to the position of the sensor module, and the corresponding portion of the clear-coated sensor module forms a sensing window 330, which is a part that passes the signal or light necessary to sense biological signals.
9. In claim 7 or 8, The sensing window forming step (S400) includes: A method for manufacturing a smart ring, comprising: a masking process for attaching a masking member to a portion of the smart ring to be processed that will not be clear coated; a primer coating process for applying a primer coating liquid to the inner surface of the inner molding portion 300 where the clear coating will be applied to form a primer layer; a process for applying a clear coating liquid with adjusted transparency to the dried primer layer to form a clear coating layer; and a drying and masking removal process for drying the clear coating layer and removing the masking member.
10. In claim 5, The molding device includes an outer lower frame 410, an inner lower frame 420 coupled to an upper portion of the outer lower frame 410 and into which a lower region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, an inner upper frame 430 disposed on an upper portion of the inner lower frame 420 and into which an upper region of the combination of the outer cover part 100 and the sensor / communication module 200 is inserted and coupled, and which serves as an injection passage for a molding member, and an outer upper frame 440 disposed on an upper portion of the inner upper frame 430 and fixes the inner upper frame 430 so that it does not spread or separate. The outer cover part 100 includes a position guide 140 for guiding the outer cover part 100 to be positioned at a set position in the molding device 400. A first position guide protrusion 423 is provided on the outer wall of the inner lower frame 420 on the same vertical line as the position guide 140 and the second position guide protrusion 434. A second position guide protrusion 434 is provided on the outer wall of the inner upper frame 430 on the same vertical line as the position guide 140 and the first position guide protrusion 423, A method for manufacturing a smart ring, characterized in that during the molding material injection / hardening process, the position guide 140, the first position guide protrusion 423, and the second position guide protrusion 434 are used to guide the joining positions of the outer cover part 100, the inner lower frame 420, and the inner upper frame 430.
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