Electroformed Blade

By integrating superabrasive grains and controlled fluororesin dispersion, the electroformed blade achieves enhanced mechanical strength and self-sharpening, addressing the strength issues of conventional blades for high-load machining.

JP7752482B2Active Publication Date: 2025-10-10TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
JP2021056612
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-30
Publication Date
2025-10-10
Estimated Expiration
2041-03-30

AI Technical Summary

Technical Problem

Conventional electroformed blades containing fluororesin in the metal plating phase suffer from reduced mechanical strength, leading to potential breakage and decreased straightness during high-load machining.

Method used

The electroformed blade incorporates superabrasive grains and a controlled dispersion of fluororesin filler within specific concentration and particle size ranges, enhancing mechanical strength and sliding properties.

Benefits of technology

The solution results in an electroformed blade with improved mechanical strength and self-sharpening capabilities, ensuring high-quality machining performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an electroformed blade which enables high-quality cutting.SOLUTION: An electroformed blade 1 is an annular thin plate-like electroformed blade, the electroformed blade including a metal plating phase 101, abrasive grains 102 which are dispersed in the metal plating phase and are harder than the metal plating phase, and a granular filler 103 which is dispersed in the metal plating phase and contains a fluorine resin. The abrasive grains contain ultra-abrasive grains of one or more selected from the group consisting of particles of natural diamond, particles of synthetic diamond, and particles of cubic boron nitride, a degree of concentration of the ultra-abrasive grains is 25 or more and 50 or less, a content of the filler is 10 vol.% or more and 40 vol.% or less with respect to the volume of the electroformed blade, and a maximum particle size of the filler is 10.0 μm or less.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present invention relates to an electroformed blade. [Background technology]

[0002] The electroformed blade has a circular shape and is attached via a flange to the spindle of a processing device that processes electronic and optical components. When the electroformed blade attached to the processing device rotates around its central axis, the cutting edge on the outer periphery cuts the electronic material. In recent years, high processing accuracy has been required in the manufacture of electronic materials, and the development of electroformed blades that enable high processing accuracy has been progressing.

[0003] Therefore, as shown in Patent Documents 1 and 2, for example, electroformed blades have been proposed in which a filler made of a fluororesin such as polytetrafluoroethylene is dispersed in a metal plating phase such as nickel, thereby reducing the abrasive grain retention force while maintaining the rigidity of the metal plating phase and promoting self-sharpening.

[0004] Patent Document 1 discloses an electroformed blade having a circular, thin blade body in which superabrasive grains and a filler made of fluororesin are dispersed in a metal plating phase whose main component is nickel, wherein the blade body has a co-deposited amount of the filler in the range of 10 to 30 vol%, a concentration of the superabrasive grains in the range of 25 to 50, and a hardness of the metal plating phase in the range of HV400 to 550.

[0005] Patent document 2 also discloses an electroformed blade having a circular plate-shaped blade body and a cutting edge formed on the outer peripheral edge of the blade body, wherein the blade body has a metal plating phase made of Ni-B, abrasive grains dispersed in the metal plating phase that are harder than the metal plating phase, and a filler dispersed in the metal plating phase that is made of fluororesin, and the ratio of the volume of the filler to the volume of the entire blade body is 10 to 30%. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-132705 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-116638 Summary of the Invention [Problem to be solved by the invention]

[0007] The electroformed blades described in Patent Documents 1 and 2 can improve machining accuracy by improving sliding properties due to the co-deposited fluororesin. However, the strength of the electroformed blades described in Patent Documents 1 and 2 is reduced by the fluororesin contained in the metal plating phase, and in high-load machining, the straightness of the blade may decrease or the electroformed blade may break, leaving room for improvement.

[0008] The present invention has been made in view of the above circumstances, and has as its object to provide an electroformed blade that can be machined to a high quality. [Means for solving the problem]

[0009] The present inventors conducted extensive research into electroformed blades containing fluororesin and found that conventional electroformed blades containing fluororesin have coarse fluororesin particles in the metal plating phase. The present inventors discovered that the coarse fluororesin particles reduce the mechanical strength of the electroformed blade, and that the mechanical strength of the electroformed blade can be improved by appropriately controlling the dispersion state of the fluororesin in the metal plating phase. They also found that by setting the dispersion state of the fluororesin, the co-deposited amount of fluororesin, and the concentration of abrasive grains within predetermined ranges, high sliding properties and strength can be achieved, resulting in an electroformed blade that can be processed with high quality.

[0010] The present invention was made based on these findings, and the gist of the present invention is as follows. [1] An electroformed blade according to one embodiment of the present invention is a circular thin plate-shaped electroformed blade comprising a metal plating phase, abrasive grains dispersed in the metal plating phase that are harder than the metal plating phase, and granular filler dispersed in the metal plating phase and containing a fluororesin, wherein the abrasive grains contain superabrasive grains that are one or more types selected from the group consisting of natural diamond grains, synthetic diamond grains, and cubic boron nitride grains, the concentration of the superabrasive grains is 25 to 50, the content of the filler is 10 to 40 volume % relative to the volume of the electroformed blade, and the maximum particle size of the filler is 10.0 μm or less. [2] In the electroformed blade described in [1] above, the metal plating phase preferably has a Vickers hardness of 200 HV or more and 400 HV or less. [3] In the electroformed blade described in [1] or [2] above, it is preferable that the abrasive grains contain hexagonal boron nitride particles, and that the content of the hexagonal boron nitride particles relative to the volume of the electroformed blade is 1% by volume or more and 30% by volume or less. [4] In the electroplated blade described in any one of [1] to [3] above, it is preferable that the abrasive grains contain silicon carbide particles, and that the content of the silicon carbide particles relative to the volume of the electroplated blade is 1% by volume or more and 30% by volume or less. [Effects of the Invention]

[0011] The electroformed blade of the present invention enables high-quality machining. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a side view showing an electroformed blade according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing the AA section of FIG. [Figure 3] FIG. 3 is an enlarged schematic view of part B in FIG. 2. [Figure 4]10 is an example of an SEM image of the surface of the electroformed blade according to the embodiment. [Figure 5] 1 is an example of an SEM image of the surface of a conventional electroformed blade. DETAILED DESCRIPTION OF THE INVENTION

[0013] <Electroformed Blade 1> An electroformed blade 1 according to one embodiment of the present invention will be described below with reference to Figures 1 to 3. Figure 1 is a side view showing an electroformed blade 1 according to one embodiment of the present invention. Figure 2 is a cross-sectional view showing the AA cross section of Figure 1. Figure 3 is a schematic view showing an enlarged view of part B of Figure 2. Note that the dimensions and ratios of each component in the figures do not represent the actual dimensions and ratios of each component.

[0014] (Schematic configuration of electroformed blade 1) First, the schematic configuration of an electroformed blade 1 according to this embodiment will be described. As shown in Figure 1, the electroformed blade 1 according to this embodiment is in the form of a thin circular plate. In detail, the electroformed blade 1 has an outer surface 11 and an inner surface 12 that are concentrically arranged about a central axis O, and a through hole 13 is formed inside the inner surface 12, penetrating in a direction along the central axis O. In this specification, the direction along the central axis O of the electroformed blade 1 is referred to as the width direction.

[0015] The thickness (length in the width direction) of the electroformed blade 1 is not particularly limited and can be, for example, 0.01 mm to 5.0 mm, but from the viewpoint of the processing area of ​​the workpiece, it is preferably 0.20 mm or less, and more preferably 0.10 mm or less. On the other hand, from the viewpoint of ensuring mechanical strength, the thickness of the electroformed blade 1 is preferably 0.02 mm or more, and more preferably 0.05 mm or more.

[0016] 3, the electroformed blade 1 comprises a metal plating phase 101, abrasive grains 102 dispersed in the metal plating phase 101 and made of a material harder than the metal plating phase 101, and granular filler 103 containing a fluororesin dispersed in the metal plating phase 101. The metal plating phase 101, abrasive grains 102, and filler 103 are described in detail below.

[0017] (Metal Plating Phase 101) The metal plating phase 101 is a plating phase containing Ni, Co, Cu, Fe, Zn, or Sn as a main component. The metal plating phase 101 may be formed only of the above elements, or may contain any of the above elements plus other elements such as P, W, Mo, or B. The metal plating phase 101 may contain, for example, B (boron), with the balance being Ni and impurities. When the metal plating phase 101 contains B, the B content is 0.3 mass % or more and 1.0 mass % or less with respect to the total mass of the metal plating phase 101.

[0018] Impurities are substances that may be unintentionally mixed into the metal plating phase 101 during the manufacture of the electroformed blade 1, and are, for example, Na, K, S, or the like.

[0019] The Vickers hardness of the metal plating phase 101 is preferably 200 HV or more and 400 HV or less. When the Vickers hardness of the metal plating phase 101 is 200 HV or more, the mechanical strength of the electroformed blade 1 can be more reliably ensured. Therefore, the Vickers hardness of the metal plating phase 101 is preferably 200 HV or more. The Vickers hardness of the metal plating phase 101 is more preferably 300 HV or more. On the other hand, although there is no particular upper limit to the Vickers hardness of the metal plating phase 101, if the Vickers hardness of the metal plating phase 101 is 400 HV or less, spontaneous sharpening occurs while maintaining the mechanical strength of the electroformed blade 1, and the occurrence of chipping can be suppressed. Therefore, the Vickers hardness of the metal plating phase 101 is preferably 400 HV or less.

[0020] The Vickers hardness of the metal plating phase 101 is measured in accordance with JIS Z 2244:2009, with a test force of 0.3 kgf and a test force holding time of 10 seconds, at five points on the metal plating phase 101 located 1 mm from the cutting edge side, and the average value is taken as the Vickers hardness of the metal plating phase 101.

[0021] (Abrasive 102) The abrasive grains 102 are dispersed in the metal plating phase 101 and are composed of a material harder than the metal plating phase 101. The abrasive grains 102 contain superabrasive grains that are one or more types selected from the group consisting of natural diamond particles, synthetic diamond particles, and cubic boron nitride (cBN) particles.

[0022] In the electroformed blade 1 according to this embodiment, the concentration of the superabrasive grains is 25 or more and 50 or less. The concentration is an index showing the proportion of the superabrasive grains contained in the volume of the electroformed blade 1, and more specifically, the proportion of the volume of the superabrasive grains to 1 / 4 of the volume of the electroformed blade 1. For example, if the content of the superabrasive grains is 25 volume % of the volume of the electroformed blade 1, the concentration is 100.

[0023] A concentration of 25 or more and 50 or less effectively promotes the self-sharpening action while improving the mechanical strength of the electroformed blade 1 and suppressing significant wear of the electroformed blade 1. As a result, the life of the electroformed blade 1 can be extended. If the concentration is less than 25, the effect of improving the mechanical strength of the electroformed blade 1 due to the dispersion of superabrasive grains is not obtained, and wear of the electroformed blade 1 progresses rapidly. Furthermore, if the concentration is less than 25, the amount of work required for processing the workpiece by the superabrasive grains cannot be secured, resulting in a decrease in sharpness and a decrease in processing quality. Therefore, the concentration of the superabrasive grains is 25 or more. The concentration of the superabrasive grains is preferably 30 or more. On the other hand, if the concentration of the superabrasive grains exceeds 50, the mechanical strength of the electroformed blade 1 becomes too high, the self-sharpening action becomes weak, and chipping becomes more likely. Therefore, the concentration of the superabrasive grains is 50 or less. The concentration of the superabrasive grains is preferably 45 or less.

[0024] The concentration is measured by component analysis using X-ray diffraction. Specifically, an X-ray peak is obtained using a Rigaku SmartLab fully automated multipurpose horizontal X-ray diffractometer under conditions of a tube voltage of 45 kV, a tube current of 200 mA, and a scan speed of 10° / min. The content of each component is calculated by the RIR (Reference Intensity Ratio) method using the maximum intensity of the peaks attributable to the components of the metal plating phase 101, the maximum intensity of the peaks attributable to the components of the abrasive grains 102, and the maximum intensity of the peaks attributable to the filler 103 in the obtained diffraction pattern. The calculated content of superabrasive grains is used as the concentration. When the metal plating phase 101 is composed of multiple elements, the maximum intensity of the peaks of each element is used.

[0025] The abrasive grains 102 further contain at least one of hexagonal boron nitride (hBN) particles or silicon carbide (SiC) particles, and the content of each of the hexagonal boron nitride particles and silicon carbide particles relative to the volume of the electroformed blade 1 is preferably 1% by volume or more and 30% by volume or less. If the abrasive grains 102 contain hBN, the sliding properties of the electroformed blade 1 are improved. Furthermore, if the abrasive grains 102 contain SiC, the strength of the electroformed blade 1 is improved. To achieve the above effect, the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 is preferably 1% by volume or more. Even if the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 exceeds 30% by volume, the above effect saturates. Therefore, the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 is preferably 30% by volume or less. The content of each of the hBN particles and SiC particles is more preferably 5% by volume or more relative to the electroformed blade 1. The content of each of the hBN particles and SiC particles is more preferably 20% by volume or less relative to the electroformed blade 1.

[0026] When only hBN particles are contained among the hBN particles and SiC particles, the content is preferably 1% by volume or more and 30% by volume or less of the electroformed blade 1. When only SiC particles are contained among the hBN particles and SiC particles, the content is preferably 1% by volume or more and 30% by volume or less of the electroformed blade 1.

[0027] The particles of each material that make up the abrasive grains 102 can be commercially available and are particles that essentially contain the respective components, but may also contain other components as impurities.

[0028] The content of hBN particles and SiC particles relative to the volume of the electroformed blade 1 is measured using a method similar to that for measuring the concentration.

[0029] The average particle size of the abrasive grains 102 is, for example, 1 μm or more and 100 μm or less.

[0030] The average particle size of the abrasive grains 102 refers to a particle size calculated by the following method. That is, the volume-average particle size measured using a laser diffraction particle size distribution analyzer is taken as the average particle size of the abrasive grains 102. Specifically, a Microtrac laser diffraction / scattering analyzer MT3300EXII-SDC is used, and a sample is placed in water (25°C, pH 7). The transmittance of the measurement sample is set to transparent, the particle refractive index is 1.81, and the particle shape is aspherical. The average particle size is measured using a volume-based particle size distribution. The solvent refractive index is set to 1.333, the measurement time is 30 seconds, and the average value of two measurements is taken as the measured value.

[0031] The abrasive grains 102 are dispersed in the metal plating phase 101. The dispersion state of the abrasive grains 102 may be the same as the dispersion state of the abrasive grains 102 in an electroformed blade manufactured by a known manufacturing method.

[0032] (Filler 103) The filler 103 is a granular fluororesin dispersed in the metal plating phase 101. The fluororesin improves the sliding properties of the electroformed blade 1. The fluororesin used for the filler 103 is preferably polytetrafluoroethylene (PTFE). The filler 103 is essentially made of a fluororesin, but may contain impurities contained in the fluororesin that is the raw material for the filler 103. Known fluororesins other than PTFE may also be used as the filler 103.

[0033] The filler 103 is contained in an amount of 10% by volume or more and 40% by volume or less relative to the volume of the electroformed blade 1. Hereinafter, the ratio of the volume of the filler 103 to the volume of the electroformed blade 1 will be referred to as the eutectoid amount (content) of the filler 103. If the eutectoid amount of the filler 103 is less than 10% by volume, the self-sharpening effect resulting from the eutectoid of the filler 103 will be difficult to achieve, and chipping will be more likely to occur in the workpiece. Therefore, the eutectoid amount of the filler 103 is 10% by volume or more. The eutectoid amount of the filler 103 is preferably 20% by volume or more, and more preferably 25% by volume or more. On the other hand, if the eutectoid amount of the filler 103 exceeds 40% by volume, the electroformed blade 1 will become embrittled, and the mechanical strength of the electroformed blade 1 will not be ensured. Therefore, the eutectoid amount of the filler 103 is 40% by volume or less. The co-deposited amount of the filler 103 is preferably 35% by volume or less, and more preferably 30% by volume or less.

[0034] The amount of co-deposition is measured in the same manner as the concentration measurement method.

[0035] Here, the dispersion state of the filler 103 in the metal plating phase 101 will be described with reference to Figures 4 and 5. Figure 4 is an example of an SEM image of the surface of an electroformed blade according to this embodiment. Figure 5 is an example of an SEM image of the surface of a conventional electroformed blade. In the electroformed blade according to this embodiment, the filler 103 is dispersed in the metal plating phase 101 as shown in Figure 4, and coarse agglomerates with a maximum particle size of 10.0 µm or more are not generated. In contrast, Figure 5 shows the presence of coarse agglomerates due to the filler agglomeration. In conventional electroformed blades using PTFE as a filler, the presence of PTFE agglomerates is presumed to be the starting point for fracture of the electroformed blade.

[0036] Therefore, the maximum particle size of the filler 103 is 10.0 μm or less. Because the filler 103 is softer than the metal plating phase 101 and the abrasive grains 102, if coarse fillers 103 are present in the electroformed blade 1, the electroformed blade 1 is more likely to break from the coarse fillers 103. If the maximum particle size of the filler 103 is 10.0 μm or less, breakage of the electroformed blade 1 from the fillers 103 is suppressed. Therefore, the maximum particle size of the filler 103 is 10.0 μm or less. The maximum particle size of the filler 103 is preferably 5 μm or less, and more preferably 1 μm or less. On the other hand, if fine fillers 103 are dispersed in the metal plating phase 101, the local load on the electroformed blade 1 when machining the workpiece is reduced. Therefore, there is no particular lower limit on the maximum particle size of the filler 103. However, the maximum particle size of the filler 103 in the electroformed blade 1 according to this embodiment may be, for example, 0.5 μm or more, or 0.2 μm or more.

[0037] Here, a method for measuring the maximum particle size of the filler 103 will be described. Using a scanning electron microscope (SEM), images are taken at a position 1 mm from the cutting edge of the electroformed blade 1 at a magnification of 500x and at 2 mm intervals, covering a total of 10 fields of view. For each image, the circle-equivalent diameter based on the area of ​​the filler 103 is calculated, and the maximum particle size is calculated. A digital microscope VHX-D500 manufactured by Keyence Corporation is used to calculate the circle-equivalent diameter. The filler 103 is identified in the SEM image by the following method. That is, the metal plating phase 101, the abrasive grains 102, and the filler 103 can be distinguished by color and shape. In detail, the metal plating phase 101 is displayed brightly because it is conductive, whereas the abrasive grains 102 and the filler 103 are displayed darkly because they are not conductive, and therefore the metal plating phase 101 can be distinguished. Next, the abrasive grains 102 have an angular shape, whereas the filler 103 has an irregular shape, and therefore the two can be distinguished.

[0038] Furthermore, the average particle size of the filler 103 is preferably equal to or smaller than the average particle size of the abrasive grains 102. If the average particle size of the filler 103 is equal to or smaller than the average particle size of the abrasive grains 102, the excellent sharpness provided by the abrasive grains 102 is maintained while the self-sharpening action of the abrasive grains 102 is reliably obtained by the filler 103, thereby further suppressing chipping.

[0039] So far, we have described the metal plating phase 101, the abrasive grains 102, and the filler 103. In the electroformed blade 1 according to this embodiment, the outer surface 11 and side surfaces function as cutting edges. Specifically, a spindle of a processing device is inserted into the through-hole 13 via a flange (not shown), and the electroformed blade 1 is fixed to the spindle. The spindle rotates about the central axis O, and the outer surface 11 of the rotating electroformed blade 1 comes into contact with the workpiece, thereby processing the workpiece. Furthermore, if the electroformed blade 1 according to this embodiment is a hub-equipped blade fixed to a base metal during electroforming, the electroformed blade 1 is fixed to the spindle via this base metal, and the spindle rotates about the central axis O. The outer surface 11 of the rotating electroformed blade 1 comes into contact with the workpiece, thereby processing the workpiece.

[0040] The electroformed blade 1 according to this embodiment is suitable for precisely machining workpieces made of hard and brittle materials such as glass, quartz, and ceramics, as well as semiconductor silicon, compound wafers, and various electronic component materials. Specifically, the electroformed blade 1 according to this embodiment is suitable for groove machining, which forms grooves in the workpiece, and for cutting the workpiece into individual pieces. Note that the workpiece is not limited to glass, quartz, and ceramics, and may be made of other materials.

[0041] As described above, according to this embodiment, the mechanical strength of the electroformed blade 1 is ensured, which prevents the electroformed blade 1 from meandering when processing a workpiece. Furthermore, because the abrasive grains 102 have excellent self-sharpening properties, the electroformed blade 1 according to this embodiment has excellent cutting performance. As a result, the processing quality can be improved.

[0042] <Method of manufacturing electroformed blade 1> Next, an example of a method for manufacturing an electroformed blade according to this embodiment will be described. The electroformed blade 1 according to this embodiment is manufactured by a known electroforming method. The method for manufacturing the electroformed blade 1 according to this embodiment includes, for example, a plating step, an etching step, and an inner and outer diameter adjustment step.

[0043] In the plating process, abrasive grains having the above average particle size and filler are dispersed in a nickel-based plating solution. The dispersion of the abrasive grains and filler is achieved by attaching a circular annular base metal, which serves as a cathode, to the tip of a rotatable shaft and rotating the shaft around its central axis to rotate the base metal. The plating solution is, for example, a sulfamic acid bath. The circular annular base metal, which serves as a cathode, and an anode are immersed in the plating solution containing the dispersed abrasive grains and filler. A voltage is applied between the cathode and anode to deposit a metal plating layer of a predetermined thickness on the surface of the base metal while incorporating the abrasive grains and filler. This metal plating layer is then peeled off from the base metal to produce a metal plating layer (intermediate material) incorporating the abrasive grains and filler. If the electroformed blade 1 is to be a hub-equipped blade (described later), a predetermined area of ​​the base metal may be masked, and the metal plating layer incorporating the abrasive grains and filler may be deposited in areas other than the masked area.

[0044] In the etching step, at least the side surface of the intermediate material that has been in contact with the cathode is etched to cause abrasive grains to protrude from the side surface. The etching may be performed using, for example, nitric acid as an etchant.

[0045] In the inner and outer diameter adjusting step, the inner and outer diameters of the intermediate material after the etching step are processed by a known method so as to have predetermined dimensions. [Example]

[0046] The present invention will be described in more detail below with reference to examples, although the present invention is not limited to these examples.

[0047] First, abrasive grains and filler were dispersed in a sulfamic acid bath. The abrasive grains used were synthetic diamond, cBN, natural diamond, and a mixture of synthetic diamond with at least one of hBN and SiC. The average grain size of the abrasive grains was 9 μm. The filler used was PTFE (product name Metaflon, model number FKY-2-A) manufactured by Uemura Kogyo Co., Ltd. The average grain size of the PTFE was 8 μm. The temperature of the plating solution was set to 50°C. A circular ring-shaped base metal serving as the cathode and an anode were immersed in the plating solution with the abrasive grains and filler dispersed, and a voltage was applied between the cathode and anode. The current density at this time was 5 A / cm 3 The voltage was applied for 80 minutes. The plated sheet formed on the base metal was then peeled off from the base metal. Both sides of the intermediate material peeled off from the base metal were etched using nitric acid as an etchant. The inner and outer diameters of the intermediate material after the etching process were then adjusted by machining. As a result of the above, an electroformed blade with an outer diameter of 55 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.08 mm was manufactured.

[0048] The Vickers hardness of the metal plating layer of each manufactured electroformed blade was measured as follows: In accordance with JIS Z 2244:2009, the metal plating layer 101 was measured at five points 1 mm from the cutting edge using a test force of 0.3 kgf and a holding time of 10 seconds, and the average value was taken as the Vickers hardness of the metal plating layer 101.

[0049] The superabrasive grain concentration, hBN content, SiC content, and filler co-deposition amount of each electroformed blade were measured using the following method. Specifically, the superabrasive grain concentration and hBN and SiC content in each electroformed blade were measured by component analysis using X-ray diffraction. Specifically, X-ray peaks were obtained using a Rigaku SmartLab fully automated multipurpose horizontal X-ray diffractometer under conditions of 45 kV tube voltage, 200 mA tube current, and a scan speed of 10° / min. The peak intensities of the lattice planes with the highest detected intensities for Ni, diamond, SiC, and BN were used to calculate the content of each component using the RIR (Reference Intensity Ratio) method.

[0050] The average particle size of the abrasive grains in each electroformed blade was measured using the Microtrac MT3300EXII-SDC laser diffraction / scattering analyzer. The sample was placed in water (25°C, pH 7), and the average particle size was measured based on the volumetric particle size distribution, assuming a transmittance of 1.81, a particle refractive index of 1.81, and a non-spherical shape. The solvent refractive index was 1.333, the measurement time was 30 seconds, and the average of two measurements was used as the measured value.

[0051] The maximum particle size of the filler particles in each electroformed blade was measured using the following method. Using a scanning electron microscope, images were taken of 10 fields of view at 2 mm intervals at a magnification of 500x, 1 mm from the cutting edge of each electroformed blade. In each image, the bright areas were determined to represent the metal plating phase, the angular areas in the dark areas were determined to represent abrasive grains, and the irregular areas in the dark areas were determined to represent filler. The equivalent circle diameter based on the filler area was calculated for each image, and the maximum particle size was calculated. A Keyence VHX-D500 digital microscope was used to calculate the equivalent circle diameter. The average particle size shown in Table 1 is the average particle size of the filler as raw material.

[0052] The average particle size of the filler in each electroformed blade was measured in the same manner as the average particle size of the abrasive grains.

[0053] Each electroformed blade was attached to a cutting device via a flange, and the maximum chipping size on the cut surface was measured after cutting 2 m of the workpiece. The workpiece was glass, 150 mm square and 0.7 mm thick. The flange diameter was 49.6 mm, and the rotation speed of the electroformed blade was 15,000 min -1 The feed rate of the electroformed blade was 5 mm / sec.

[0054] The maximum chipping size was used as an index of machining quality. The maximum chipping size was measured using the following method. Specifically, the workpiece was observed from the back side using an optical microscope, and the size of chippings generated by machining in the direction perpendicular to the cut surface was measured as the chipping size. If the maximum chipping size measured in this way was 50 μm or less, the machinability was judged to be extremely good (◎); if the maximum chipping size was greater than 50 μm but less than 100 μm, the machinability was judged to be good (◯); and if the maximum chipping size was greater than 100 μm or if the electroformed blade was damaged, the machinability was judged to be poor (×). The results are shown in Table 1.

[0055] [Table 1]

[0056] As shown in Table 1, good processability was achieved when the abrasive grains contained at least superabrasive grains, the concentration of the superabrasive grains was 25 to 50, the filler content was 10% by volume to 30% by volume relative to the volume of the electroplated blade 1, and the maximum particle size of the filler was 10.0 μm or less. [Explanation of symbols]

[0057] 1 Electroformed Blade 11 Exterior 12 Inner 13 Through hole 101 Metallic plating phase 102 Abrasive grain 103 Filler

Claims

1. An electroformed blade in the form of a circular thin plate, The electroformed blade comprises a metal plating phase, abrasive grains dispersed in the metal plating phase and harder than the metal plating phase, and a granular filler dispersed in the metal plating phase, containing a fluororesin and containing classified agglomerates, The abrasive grains contain superabrasive grains of one or more types selected from the group consisting of natural diamond grains, synthetic diamond grains, and cubic boron nitride grains, and the concentration of the superabrasive grains is 25 or more and 50 or less; the content of the filler is 10% by volume or more and 40% by volume or less relative to the volume of the electroformed blade, An electroformed blade, wherein the particle size of the largest agglomerated particle of the filler is 10.0 μm or less.

2. 2. The electroformed blade according to claim 1, wherein the metal plating phase has a Vickers hardness of 200 HV or more and 400 HV or less.

3. 3. The electroformed blade according to claim 1, wherein the abrasive grains contain hexagonal boron nitride particles, and the content of the hexagonal boron nitride particles relative to the volume of the electroformed blade is 1% by volume or more and 30% by volume or less.

4. An electroformed blade according to any one of claims 1 to 3, wherein the abrasive grains contain silicon carbide particles, and the content of the silicon carbide particles relative to the volume of the electroformed blade is 1 volume % or more and 30 volume % or less.

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