electronic equipment

Abstract

To provide an electronic apparatus with high reliability.SOLUTION: In an electronic apparatus that includes a bendable display device and can be folded in half, a first space is provided near a hinge connecting two housings, and a part of the display device is housed in a second space when the electronic apparatus is folded. Thus, the excessive bending of the display device can be prevented and the reliability can be increased. By providing the display device on a side surface of the housing, the visibility is increased. The side surface of the housing preferably has a curved surface. By using the display device including a first pixel reflecting visible light and a second pixel emitting visible light, the visibility of the electronic apparatus is increased and the consumption power is reduced.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] One embodiment of the invention disclosed in this specification, etc. relates to an object, a method, or a manufacturing method. One aspect of the invention disclosed in this specification is a process, a machine, a manufacture, or Composition of matter, especially for display devices or electronic devices do.

[0002] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. This refers to a general category of display devices (liquid crystal display devices, light-emitting display devices, etc.), projection devices, lighting devices, electrical Optical devices, power storage devices, memory devices, semiconductor circuits, imaging devices, and electronic devices are all semiconductor devices. It can be said that it has a position. [Background technology]

[0003] In recent years, portable electronic devices such as mobile phones, smartphones, and tablet-type information terminals have become increasingly popular. In addition, electronic devices are becoming more compact to make them more portable. On the other hand, the amount of information handled by electronic devices is on the rise. Therefore, there is a demand for larger display areas to display information.

[0004] To meet such demands, foldable electronic devices have been proposed. Patent Document 1 has two display units that can be folded so that the two display units face each other when not in use. Electronic devices that include this have been proposed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 5-289619 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the electronic device proposed in Patent Document 1 has two independent display units. Since the images are split into two parts, it is not possible to display a single image as a whole. Although it is possible to split the display into two displays, the two displays are located apart. , there is a problem that visibility is reduced.

[0007] An object of one embodiment of the present invention is to provide a display device, an electronic device, or the like with good visibility. Alternatively, the object is to provide a display device or electronic device with good display quality. Alternatively, the task is to provide highly reliable display devices or electronic devices. Another object of the present invention is to provide a novel display device or electronic device. This is the end.

[0008] The description of these problems does not preclude the existence of other problems. It is not necessary for the present invention to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0009] One aspect of the present invention is a display device having a first housing, a second housing, a hinge, a space, and a display device. The first and second housings are connected via a hinge, and the space is provided near the hinge. The display device has a first area overlapping the first housing and a second area overlapping the second housing. a third region overlapping the space; and a fourth region overlapping at least a portion of the side surface of the first housing. and an electronic device characterized by having:

[0010] Alternatively, one aspect of the present invention is a display device including a first housing, a second housing, a first hinge, and a second hinge. The first housing and the second housing are connected via a first hinge. The first housing and the second housing are connected via a second hinge, and the space is The display device has an area sandwiched between the first hinge and the second hinge, and the first housing overlaps the first hinge. a second area overlapping with the second housing; a third area overlapping with the space; and a third area overlapping with the first housing. and a fourth region overlapping at least a portion of the side surface. .

[0011] The electronic device has a fifth region that overlaps with at least a part of the side surface of the second housing. Good too.

[0012] The display device is flexible. The angle between the first region and the second region is 0 degrees or more and 80 degrees or less. When the distance is less than 1 / 2 mm, at least a part of the third region is accommodated in the space, thereby preventing damage to the display device. The inner diameter of the space is preferably 1 mm or more and 50 mm or less.

[0013] The display device has a first pixel and a second pixel, and the first pixel reflects visible light. It is preferable that the first pixel has a function of emitting visible light, and the second pixel has a function of emitting visible light.

[0014] The electronic device has a function of maintaining the relative angle between the first area and the second area at 160°±15°. Alternatively, the electronic device may have a function of controlling the relative positions of the first and second regions. It is preferable that the angle be maintained at 120°±15°. [Effects of the Invention]

[0015] According to one embodiment of the present invention, a display device, an electronic device, or the like having good visibility can be provided. Alternatively, a display device or electronic device having good display quality can be provided. It is possible to provide a novel display device or electronic device. etc. can be provided.

[0016] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have all of these effects. Effects other than these may be included in the description, This is self-evident from the description, drawings, claims, etc. From any description, it is possible to extract effects other than these. [Brief explanation of the drawings]

[0017] [Figure 1] 1A to 1C illustrate electronic devices. [Figure 2] 1A to 1C illustrate electronic devices. [Figure 3] 1A to 1C illustrate examples of use of electronic devices. [Figure 4] 1A to 1C illustrate electronic devices. [Figure 5] 1A to 1C illustrate electronic devices. [Figure 6] 1A to 1C illustrate electronic devices. [Figure 7] 1A to 1C illustrate electronic devices. [Figure 8] 1A to 1C illustrate electronic devices. [Figure 9] FIG. 1 is a block diagram illustrating an example of the configuration of an electronic device. [Figure 10] 1A to 1C illustrate electronic devices. [Figure 11] 1A to 1C illustrate electronic devices. [Figure 12] 1A to 1C illustrate electronic devices. [Figure 13] 1A to 1C illustrate electronic devices. [Figure 14] 1A and 1B illustrate a configuration example of a display device. [Figure 15] FIG. 2 is a diagram illustrating an example of a circuit configuration of a pixel. [Figure 16] 2A and 2B are diagrams for explaining an example of a circuit configuration and a planar configuration of a pixel. [Figure 17] 1A to 1C are diagrams illustrating examples of use of an electronic device for each display mode. [Figure 18] 1A and 1B are a schematic diagram and a state transition diagram illustrating a configuration example of a display device. [Figure 19] 10 is a graph illustrating the evaluation results of the display device. [Figure 20] 1A and 1B are a circuit diagram and a timing chart illustrating a configuration example of a display device. [Figure 21] 1A and 1B illustrate a configuration example of a display device. [Figure 22] 1A and 1B illustrate a configuration example of a display device. [Figure 23] 1A and 1B illustrate a configuration example of a display device. [Figure 24] 1A and 1B illustrate a configuration example of a display device. [Figure 25] 1A to 1C illustrate examples of electronic devices. [Figure 26] FIG. 10 is a diagram illustrating the measurement results of the XRD spectrum of a sample. [Figure 27] TEM image of the sample and a diagram explaining the electron beam diffraction pattern. [Figure 28] FIG. 1 is a diagram illustrating EDX mapping of a sample. DETAILED DESCRIPTION OF THE INVENTION

[0018] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention may be modified in various forms and details without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. It should be noted that the following description of the invention is not intended to be limiting. In this case, the same parts or parts having similar functions are designated by the same reference numerals in different drawings. The following explanations may be omitted.

[0019] In addition, the position, size, range, etc. of each component shown in the drawings are for the purpose of facilitating understanding of the invention. Therefore, the actual location, size, range, etc. may not be shown. The invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings. For example, in the actual manufacturing process, layers and resist masks are formed by processes such as etching. Although it may be omitted unintentionally, it is recommended to omit it to make the invention easier to understand. be.

[0020] In addition, in particular, top views (also called "plan views") and perspective views are used to make the invention easier to understand. In order to avoid this, some components may be omitted. may be omitted.

[0021] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. It does not indicate any order or ranking, such as the order of processes or stacking. In addition, even if a term is not accompanied by an ordinal number in this specification, etc., it is to be understood that the constituent elements may be confused. In order to avoid this, ordinal numbers may be used in the claims. The ordinal numbers used in the description may differ from those used in the claims. Furthermore, even if a term is given an ordinal number in this specification, etc., it may be included in the claims, etc. In some cases, the ordinal number may be omitted.

[0022] In addition, the terms "electrode" and "wiring" used in this specification and the like do not limit the functionality of these components. For example, an "electrode" may be used as part of a "wiring." Furthermore, the terms "electrode" and "wiring" are used interchangeably to refer to the plural "electrodes" and "wirings." This also includes cases where the "line" is installed as an integral part.

[0023] In this specification, the terms "above" and "below" refer to the positional relationship of components directly above or below each other. For example, "electrode on insulating layer A" is not limited to being below and in direct contact with the insulating layer A. If the expression is "B", electrode B does not need to be directly on insulating layer A, The inclusion of other components between the edge layer A and the electrode B is not excluded.

[0024] In this specification, unless otherwise specified, "parallel" means that two lines are -1 This refers to the state in which the object is arranged at an angle of 0° to 10°. Therefore, the angle is between -5° and 5°. In addition, unless otherwise specified, "almost parallel" means that the two lines are -3 It refers to a state in which the object is arranged at an angle between 0° and 30°. Unless otherwise specified, this means that two straight lines are arranged at an angle of 80° or more and 100° or less. Therefore, it also includes the case where the angle is between 85° and 95°. " means that two straight lines are arranged at an angle of 60° or more and 120° or less, unless otherwise specified. This refers to the state in which something is done.

[0025] In this specification, the terms "identical," "same," and "equal" are used to refer to counting values ​​and measurement values. " or "uniform" (including their synonyms) unless expressly stated otherwise. The calculations are subject to a margin of error of plus or minus 20%.

[0026] (Embodiment 1) Structural examples of electronic devices of one embodiment of the present invention will be described with reference to the drawings. Arrows indicating the X, Y, and Z directions may be used. The directions are perpendicular to each other.

[0027] <Example of electronic device configuration> 1(A) and 2(A) are perspective views showing the appearance of the electronic device 100. 2B is a cross-sectional view of the portion indicated by the dashed line A1-A2 in FIG. 1A. 1(A) is a cross-sectional view of the portion indicated by the dashed line A1-A2 in FIG. 2(B) is a cross-sectional view of the electronic device 100 as seen from the Y direction.

[0028] The electronic device 100 includes a housing 101a, a housing 101b, a fastener 102, a hinge 103a, a hinge The display device 103 includes a display 103b, an area 105 (first space), and a display device 110.

[0029] In this specification, the housing 101a and the housing 101b are collectively referred to as the "housing 101." In addition, in this specification and the like, the hinge 103a and the hinge 103b are collectively referred to as It is sometimes called "hinge 103."

[0030] The housing 101a and the housing 101b are connected via a hinge 103a. The body 101a and the housing 101b are connected via a hinge 103b. The relative angle between the housing 101a and the housing 101b can be changed with the hinge 103 as a fulcrum. Specifically, the housing 101a and the housing 101b are connected by a hinge 103a and a hinge 103b. It can rotate around the imaginary line connecting 3b, and change the relative angle between them. That is, the hinge 103 functions as a rotation axis.

[0031] The housing 101a and the housing 101b are connected via a structure 106 (see FIG. 1 (See (B).) The structure 106 is made of a material having elasticity. For example, The rate is 1×10 5 Pa or higher, 5×10 7 For example, the structure 106 and the material For this purpose, a material having elasticity such as rubber may be used.

[0032] The electronic device 100 also has a region 105 near the hinge 103. The region 105 is , a housing 101 a, a housing 101 b, a structure 106, and a display device 110. The region 105 includes the region sandwiched between the hinges 103a and 103b. Alternatively, the region 105 may include a region sandwiched between the hinges 103a and 103b. be.

[0033] The display device 110 is flexible. The display device 110 has a surface that overlaps with the housing 101a. display area 111a, display area 111b overlapping with housing 101b, and display area 111b overlapping with area 105. It has a display area 111c.

[0034] In the display area 111c of the display device 110, the length of the area 105 in the Y direction is The length of the display device 10 in the Y direction is set to be equal to or greater than the length of the display area 111c in the Y direction. In other words, the area 105 has a region where the area 10 completely overlaps the area 105 in the Y direction. along the display device 110.

[0035] When the relative angle between the housing 101a and the housing 101b changes, the display area 111c bends or In other words, the display area 111c is bent or extended, The angle θ, which is the relative angle between the display area 111a and the display area 111b, can be changed. When the angle θ is changed, the shape of the region 105 is changed. 1 is a perspective view showing the appearance of the electronic device 100 in which the electronic device 100 is integrated.

[0036] In the electronic device 100 according to the present embodiment, the display area 111c is bent to form a curved surface. On the other hand, the display area 111a and the display area 111b remain almost flat and do not change shape. In this specification, a surface whose shape does not change (for example, a surface that remains flat) is referred to as " Therefore, the display area 111a and the display area 111b are sometimes called "facing". be.

[0037] In addition, at least one of the hinges 103a and 103b is temporarily fixed at a specific angle. A hinge (also called a "click hinge") that has a mechanism that can maintain the angle θ It is preferable to use

[0038] For example, as shown in FIG. 2(B), the angle θ is temporarily held at each of the angles θ1 and θ2. The angle θ1 and angle θ2 are set according to the purpose or use. For example, the angle θ1 is set to about 160° and the angle θ2 is set to 120°. The term "near 160°" includes the range of 160°±15°. The angle θ1 should be equal to or greater than 145° and less than 175°. This includes the range of 20°±15°. In other words, the angle θ2 is equal to or greater than 105° and less than 135°. That's fine.

[0039] 3(A) and 3(B) show how a user 151 uses the electronic device 100. FIG. 3A shows a case where a user 151 holds the electronic device 100 with the housing 101a and the housing 101b positioned vertically. FIG. 3(B) shows a state where a user 151 is using the electronic The device 100 is shown in use with the housing 101a and the housing 101b aligned horizontally. By using a click hinge for the hinge 103, the electronic device 100 can be easily opened and closed. Even if the lens is used in various orientations, the angle θ can be kept constant.

[0040] In addition, by using a click hinge for the hinge 103, the user 151 can adjust the angle θ by himself. Since there is no need to keep the temperature constant, fatigue during use of the electronic device 100 can be reduced. This can improve the operability of the electronic device 100. In addition, the visibility of the electronic device 100 can be improved. It is possible.

[0041] In addition, an angle θ is set at any angle to at least one of the hinges 103a and 103b. A hinge with a mechanism that can temporarily hold the hinge in place (also called a "torque hinge") is used. By using a torque hinge, the user 151 can maintain the angle θ at any angle. It can be held.

[0042] 4(A) and 4(B) are perspective views showing the appearance of the electronic device 100. 4(A) and 4(B) are cross-sectional views of the area indicated by the dashed line B1-B2. FIG. 4C is a cross-sectional view of the electronic device 100 when viewed from the Y direction.

[0043] FIG. 4A shows a display area 111a and a display area 111b of the display device 110 facing each other. 1 is a perspective view of the electronic device 100 in a state where the housing 101a and the housing 101b are stacked together. This state is also called a closed state of the electronic device 100. 1 shows a state in which the housing 101a and the housing 101b are fixed together with a fastener 102.

[0044] Depending on the purpose, the fastener 102 may not be provided. At least one of the hinges 103a and 103b is provided with the click hinge or torque hinge. By using a swivel, the fastener 102 may be omitted. The productivity of the electronic device 100 can be improved.

[0045] When the electronic device 100 is closed, the electronic device 100 is sandwiched between the housing 101a and the housing 101b. The area 107 is formed by the area 105 and the display device 1. In addition, in the area 107, the housing 101a is connected to the housing 101b. The distance K, which is the maximum distance from the housing 101a that overlaps the display area 111a to the display area 111a, is This is larger than the distance J to the housing 101b that overlaps with the housing 11b (see FIG. 4(C)).

[0046] When the electronic device 100 is closed, the display device 110 is bent inward. When the device 100 is closed, the display area 111a and the display area 111b of the display device 110 overlap. At this time, the radius of curvature R of the bent portion is If it is too small, the display area 111c may be damaged, causing defects such as cracks. Therefore, if the radius of curvature R is too small, the display quality of the display device 110 may be reduced and This may cause a loss of functionality of the display device 110. There may be cases like this.

[0047] In the electronic device 100 according to one embodiment of the present invention, the region 105 is deformed as the angle θ decreases. The curved portion of the display area 111c approaches the structure 106. The radius of curvature R of the curved portion is The area 105 is smallest when the electronic device 100 is closed. It is possible to prevent the radius R from becoming too small. For example, the display area 111c may be provided in the area 105. A cushioning material may be provided to support the curved portion.

[0048] The radius of curvature R is preferably 1 mm or more and 50 mm or less, and more preferably 5 mm or more and 50 mm or less. When the electronic device 100 is in a closed state, the radius of curvature R is set to 1 mm or more, and further set to 5 mm or more. By doing so, damage to the bending portion is reduced, and the display quality and and / or reliability can be improved.

[0049] Also, once the angle θ becomes larger than approximately 180°, when the angle θ is next reduced, The bent portion of the display area 111c may move in a direction away from the structure 106. In this case, if the angle θ becomes even smaller, the display device 110 may be damaged. In order to reliably bring the bent portion of 1c and the structure 106 close to each other, the maximum value of the angle θ is less than 180°. Preferably, the angle is less than 175°, more preferably.

[0050] The display unit (display device 110) is bent inward to close the electronic device 100, thereby protecting the display unit. It is possible.

[0051] In addition, in an area where the housing 101 and the display device 110 do not overlap, at least It is preferable that a part of the display device 110 is higher than the surface of the display device 110. When the display device 110 is closed, the display area 111a and the display area 111b of the display device 110 are prevented from coming into contact with each other. As a result, the display quality and / or reliability of the display device 110 can be improved.

[0052] Furthermore, the structure 106 expands and contracts depending on the angle θ (see FIGS. 1(B), 2(B), and 4(C)). See C). When the electronic device 100 is in the closed state, the structure 106 is in the most extended state. The structure 106 is attached to the display device 110 so that the non-display surface of the display device 110 is not exposed to the outside. It has the function of protecting 10.

[0053] The cross-sectional shape of the region 107 when viewed from the Y direction may be circular or elliptical. It may be rectangular (see FIG. 5(A)). It may also have a tapered portion. (See Figure 5(B)).

[0054] In addition, in the cross-sectional shape of the housing 101a, the thickness T of the part overlapping with the display area 111a is The thickness may be made smaller (thinner) as it approaches the area 105. In the surface shape, the thickness T of the portion overlapping with the display area 111b becomes Alternatively, the distance J may be adjusted to become smaller (thinner) as the distance J approaches the region 105. The housing 101 may be made larger by being shaped like this (see FIG. 5(C)). This provides the effect of preventing the angle θ from becoming approximately 180° or more.

[0055] In some cases, when the electronic device 100 is closed, the display area of ​​the display device 110 The display area 111a may be structured so that at least a part of the display area 111b is in contact with the display area 111b (see FIG. 6(A)). Light. ).

[0056] In addition, depending on the size of the electronic device 100, the required radius of curvature R is determined by the distance J alone. If it is possible to secure the required space, the area 105 may be omitted (see FIG. 6(B)).

[0057] 7A is a perspective view showing the appearance of the electronic device 100A. 1 is a cross-sectional view of the area indicated by the dashed dotted line C1-C2 in FIG. 1 as viewed from the Y direction.

[0058] The electronic device 100A has a similar configuration to the electronic device 100, but the structure 106 is different. The electronic device 100A has a bellows-shaped structure 106. By making the structure 106 bellows-shaped, This allows the structure 106 to be made of a material that is less likely to stretch.

[0059] 8(A) is a perspective view showing the appearance of the electronic device 100B. 8(C) is a cross-sectional view of the portion indicated by the dashed line D1-D2 in FIG. 8(C) as viewed from the Y direction. 1 is a cross-sectional view showing the electronic device 100B in an open state.

[0060] The electronic device 100B has a similar configuration to the electronic device 100, but when the electronic device 100B is opened, The structure 106 is provided so that it deforms when the structure 106 is in the closed state. When the electronic device 100B is in the closed state, the structure 106 is sandwiched between the housings 101a and 101b. It should be noted that a structure 106 may be provided as in the electronic device 100.

[0061] As the electronic device 100B opens, the structure 106 protrudes toward the display device 110. FIG. 8C shows the state in which the deformed structure 106 comes into contact with the display device 110. Therefore, when the structure 106 is deformed, the display area 11 of the display device 110 When a touch sensor or the like is provided on the display device 110, Alternatively, when a touch sensor or the like is provided on the display device 110 itself, the structure 106 Since the display area 111c of the device 110 can be supported, touch input in the display area 111c can be It is possible to easily reduce the force, etc.

[0062] [Other hardware configuration examples] An example of the hardware configuration applicable to the electronic device 100 will be described below. 1 is a block diagram showing an example of a configuration applicable to the electronic device 100. FIG.

[0063] In the drawings attached to this specification, the components are classified by function and are shown as independent blocks. Although the block diagram is shown as a block, the actual components are not completely separated by function. It is difficult to do this, and one component may be involved in multiple functions, or one function may involve multiple components. It may also be related to.

[0064] The configuration of the electronic device 100 illustrated in FIG. 9 is an example, and it is not necessary to include all of the components. The electronic device 100 only needs to include the necessary components among the components shown in FIG. Furthermore, the device may have components other than those shown in FIG.

[0065] The electronic device 100 includes a display device 110, a computing device 161, a touch sensor 176, a storage device 1 63, display control device 164, touch sensor controller 177, battery controller 171, power receiving unit 172, battery 179, sound controller 169, voice input device 1 74, audio output device 173, communication device 162, antenna 181, attitude detection unit 165, external an interface 168, an imaging device 175, a vibration device 166, a sensor module 167, etc.

[0066] Storage device 163, display control device 164, touch sensor controller 177, battery controller controller 171, sound controller 169, communication device 162, attitude detection unit 165, External interface 168, imaging device 175, vibration device 166, sensor module 16 7 and the like are connected to the arithmetic unit 161 via a bus line 145.

[0067] The touch sensor 176 may be provided on top of the display device 110. The display device 110 may be provided with the functions of 6.

[0068] The arithmetic unit 161 is, for example, a central processing unit (CPU). The arithmetic unit 161 can function as, for example, a touch sensor. Controller 177, Battery Controller 171, Sound Controller 169, Communication device 162, a posture detection unit 165, an external interface 168, an imaging device 175, a vibration device The controller 164 has a function to control each component such as the device 166, the sensor module 167, etc. The device 161 may be provided with functions such as a storage device 163 and a display control device 164. stomach.

[0069] Signals are transmitted between the arithmetic unit 161 and each component via a bus line 145. The arithmetic unit 161 receives inputs from the components connected via the bus line 145. It has functions to process the signals that are input and to generate the signals that are output to each component. and can comprehensively control each component connected to the bus line 145. .

[0070] Note that a channel is formed in the arithmetic unit 161 or an IC included in another component. An extremely low off-state current is achieved by using an oxide semiconductor, a type of metal oxide, for the semiconductor layer. Since the off-state current of the transistor is extremely low, Therefore, the transistor functions as a memory element to store the charge (data) flowing into the capacitor element. By using it as a switch to keep data, it is possible to ensure long-term data retention. By using this characteristic in the registers and cache memory of the arithmetic unit 161, The arithmetic unit 161 is operated only when necessary, and in other cases, the information of the immediately preceding processing is stored in the memory element. By evacuating the power to a remote computer, normally-off computing becomes possible, and electronic devices 100 can achieve low power consumption.

[0071] The arithmetic unit 161 interprets and executes instructions from various programs using a processor. It processes various data and controls programs. may be stored in a memory area of ​​the processor or may be stored in the storage device 163. It may also be used.

[0072] The arithmetic unit 161 may include a CPU as well as a DSP (Digital Signal Processor). processor), GPU (Graphics Processing Unit), etc. Other microprocessors may be used alone or in combination. The microprocessor is implemented as an FPGA (Field Programmable Gate Array rray) and FPAA (Field Programmable Analog Arr Programmable Logic Devices (PLDs) such as The configuration may be realized by the above.

[0073] The computing device 161 may have a main memory. The main memory may include RAM (Random Access Memory). volatile memory such as ROM (Read-Only Access Memory) and The configuration may include a nonvolatile memory such as a nonvolatile memory.

[0074] The RAM provided in the main memory is, for example, DRAM (Dynamic Random Access Memory). The virtual memory (VM) is used as the working space of the arithmetic unit 161. The memory space is allocated and used automatically. Operating systems, application programs, program modules, program data, etc. These data and programs loaded into RAM are then executed. RAM and program modules are directly accessed and operated by the processing unit 161.

[0075] On the other hand, ROM has a BIOS (Basic Input / Output) that does not require rewriting. It can store the ROM, such as the ROM (System), firmware, etc. ROM and OTPROM (One Time Programmable Read Only Memory) Only Memory), EPROM (Erasable Programmability) EPROM can be used. UV-EPROM (Ultra-Vision), which allows data to be erased by exposure to ultraviolet light. olet Erasable Programmable Read Only Mem ory), EEPROM (Electrically Erasable Program memory, and flash memory. do.

[0076] The storage device 163 may be, for example, a flash memory or an MRAM (Magnetores istive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistive RAM), FeRAM (F storage devices that use nonvolatile memory elements such as volatile random access memory (RAM); Or DRAM (Dynamic RAM) or SRAM (Static RAM) A storage device using a volatile storage element may also be used. Hard Disk Drive (HDD) and Solid State Drive (So A recording media drive such as a SSD (SSD) may also be used. .

[0077] In addition, a removable HDD or SS can be connected via an external interface 168. storage devices such as D, flash memory, Blu-ray discs, DVDs, and other recording media A media drive can also be used as the storage device 163. A storage device that is not built into the electronic device 100 but is placed outside the electronic device 100 is referred to as a storage device 163. In this case, the external interface 168 may be connected to the The communication device 162 may be configured to exchange data wirelessly.

[0078] The display control device 164 is connected to the arithmetic device 161 via a bus line 145. The display control unit 164 is connected to the display device 110. In response to a drawing instruction input from 161, the display device 110 is controlled to display a corresponding image. It has the function of displaying a specific image.

[0079] The touch sensor 176 is connected to a touch sensor controller 177. The controller 177 is connected to the arithmetic unit 161 via the bus line 145 .

[0080] The touch sensor controller 177 receives signals from the arithmetic unit 161 via the bus line 145. In response to requests from the touch sensor 176, the touch sensor 176 is controlled. , and output to the arithmetic unit 161 via the bus line 145. The touch sensor controller 177 has a function of calculating touch position information from the signal. Alternatively, the calculation may be performed by the arithmetic unit 161.

[0081] The touch sensor 176 also operates based on a signal supplied from the touch sensor controller 177. It detects the approach or contact of a sensing object such as a finger or stylus and The position information can be output to the touch sensor controller 177.

[0082] The touch sensor 176 and the touch sensor controller 177 are also It is preferable that the device has a function of acquiring the distance in the height direction to the detection object. It is preferable that the sensor has a function of acquiring the magnitude of the pressure applied to the detection surface. It is preferable that the device has a function of acquiring the size of the area where the body is in contact with the detection surface.

[0083] The touch sensor 176 is a module having a touch sensor that is placed on the display surface side of the display panel. In this case, the module having the touch sensor may be configured to include a It is preferable that at least a part of the display panel is flexible and can be bent along the display panel. The module equipped with the touch sensor and the display panel can be bonded together with adhesive or the like. A polarizing plate or a buffer material (separator) may be provided between them. The thickness of the module is preferably equal to or less than the thickness of the display panel.

[0084] The touch sensor 176 may be a touch panel in which the display device and the touch sensor are integrated. For example, it can be an on-cell type touch panel or an in-cell type touch panel. On-cell or in-cell touch panels are preferred because they are thin and lightweight. Furthermore, on-cell or in-cell touch panels can reduce the number of components. Therefore, costs can be reduced.

[0085] The touch sensor 176 detects the approach or contact of a detection target such as a finger. Various sensors can be used, such as capacitance type, resistive film type, and ultrasonic surface acoustic wave type. , acoustic wave matching, infrared, electromagnetic induction, optical, and other methods are used. In addition, optical sensors using photoelectric conversion elements and pressure-sensitive sensors can be used. Alternatively, two or more different types of sensors may be used. Alternatively, two or more sensors of the same type may be provided.

[0086] For example, a capacitive touch sensor includes a pair of conductive layers. When the object to be detected touches, presses, or approaches the pair of conductive layers, The change in the magnitude of the capacitance between the pair of conductive layers can be utilized for detection.

[0087] The capacitance type includes a surface capacitance type and a projected capacitance type. The capacitance type is classified into a self-capacitance type, a mutual capacitance type, and the like, mainly depending on the driving method. The mutual capacitance method is preferable because it facilitates simultaneous multipoint detection.

[0088] The battery controller 171 can manage the charging state of the battery 179. The battery controller 171 supplies power from the battery 179 to each component. The power receiving unit 172 receives power supplied from an external source and charges the battery 179. The battery controller 171 controls the power reception depending on the charge state of the battery 179. The operation of the unit 172 can be controlled by the controller 172.

[0089] The battery 179 includes, for example, one or more primary batteries or secondary batteries. Examples of secondary batteries that can be used include lithium ion secondary batteries and lithium ion batteries. In addition to such batteries, the battery 179 may also include A protection circuit may be provided to prevent overcharging and overdischarging of the battery.

[0090] When used indoors, an alternating current (AC) power supply may be used as the external power source. When the electronic device 100 is used separately from an external power source, the charge / discharge capacity is large and the charge / discharge time is long. A battery 179 that can power the electronic device 100 for a long period of time is desirable. When charging the electronic device 100, a charger capable of supplying power to the electronic device 100 may be used. When using the USB (Universal Serial Bus) connector or AC adapter, Charging can be performed using a wired method, or by using electric field coupling, electromagnetic induction, or electromagnetic resonance (electromagnetic The charging may be performed by a wireless power supply method such as a resonant coupling method.

[0091] The battery controller 171 includes, for example, a battery management unit (BMU). The BMU collects data on the battery cell voltage and temperature, and detects overcharge and overdischarge. Monitoring, cell balancer control, battery deterioration status management, remaining battery level (State Of Charge It calculates the SOC (state of charge), controls fault detection, etc.

[0092] The battery controller 171 receives power from a battery 179 via a power supply line (not shown). The battery controller 171 controls the power supply to each component. The power converter may have a configuration including, for example, a power converter, an inverter, a protection circuit, etc. It is possible.

[0093] The housing 101 in which the battery 179 is incorporated is flexible and can be bent when used. In some configurations, at least a portion of the battery 179 may also be flexible. A secondary battery that can be used for the battery 179 is, for example, a lithium ion secondary battery. and lithium ion polymer secondary batteries. To achieve this, it is advisable to use a laminated bag for the battery outer container.

[0094] The film used for laminated bags is a metal film (aluminum, stainless steel, nickel steel) etc.), plastic film made of organic materials, organic materials (organic resins and fibers etc.) and inorganic materials Hybrid material films containing organic materials (ceramics, etc.), carbon-containing inorganic films ( a single layer film selected from the group consisting of carbon film, graphite film, etc. A laminated film consisting of multiple layers is used. Metallic films are easy to emboss, and By forming a concave or convex portion through boss processing, the surface area of ​​the film exposed to the outside air increases. Therefore, it has excellent heat dissipation effect.

[0095] In particular, as a laminated bag, a metal film with concave and convex parts formed by embossing is used. When a laminated bag having such a structure is used, the strain caused by the stress applied to the laminated bag is reduced. As a result, the laminated bag does not tear when the secondary battery is bent. This is preferable because it can effectively reduce problems such as cracking.

[0096] Furthermore, it is preferable that the battery controller 171 has a power consumption reduction function. For example, as a power saving function, the electronic device 100 may detect that there is no input for a certain period of time and perform an operation. The clock frequency of the computing device 161 is reduced or the clock input is stopped. 161 itself, the auxiliary memory, and each component. This can be achieved by reducing the amount of power supplied to the power source, thereby reducing power consumption. The functions can be performed by the battery controller 171 alone or in conjunction with the computing device 161. It can be executed.

[0097] The audio input device 174 includes, for example, a microphone and an audio input connector. The audio output device 173 includes, for example, a speaker and an audio output connector. 174 and the audio output device 173 are connected to the sound controller 169, respectively. The audio input device 174 is connected to the arithmetic unit 161 via the line 145. The voice data is converted into a digital signal in the sound controller 169. The sound is processed by the sound controller 169 and the arithmetic unit 161. 69 generates an audio signal audible to the user in response to a command from the computing device 161, and outputs the audio signal. The audio output device 173 has an audio output connector to which an earphone is connected. You can connect audio output devices such as a microphone, headphones, or headset, and connect the sound controller to the device. The sound generated by the controller 169 is output.

[0098] The communication device 162 can perform communication via an antenna 181. For example, the computing device 1 61 to connect the electronic device 100 to a computer network. The Wo The World Wide Web (WWW) is based on the Internet, intranets, and Xtranet, PAN (Personal Area Network), LAN (L ocal Area Network), CAN(Campus Area Network), CAN(Campus Area Network) rk), MAN (Metropolitan Area Network), WAN (W ide Area Network), GAN (Global Area Network) k) The electronic device 100 can be connected to a computer network such as In addition, when multiple communication methods are used, the antenna 181 is There may be multiple of them depending on the law.

[0099] The communication device 162 is provided with, for example, a high frequency circuit (RF circuit) for transmitting and receiving RF signals. High-frequency circuits are used to communicate electromagnetic signals and electrical signals in the frequency bands specified by the laws of each country. and converts the electromagnetic signals into one another and communicates wirelessly with other communication devices using the electromagnetic signals. A practical frequency band generally used is from several tens of kHz to several tens of GHz. The high frequency circuit connected to the antenna 181 includes a high frequency circuit section that supports multiple frequency bands. The high frequency circuit section includes an amplifier, a mixer, a filter, a DSP, an RF transceiver, When wireless communication is performed, a communication protocol or a communication Communication technologies include LTE (Long Term Evolution), GSM (Global System for Mobile Communications), al System for Mobile Communication: Registered trademark) ,EDGE(Enhanced Data Rates for GSM Evolut ion), CDMA2000(Code Division Multiple Acc ess 2000), WCDMA (Wideband Code Division M MultiPass Access (registered trademark) or Wi-Fi (registered trademark) IEEE standards such as Bluetooth (registered trademark), ZigBee (registered trademark), etc. Standardized communication specifications can be used.

[0100] The communication device 162 may also have a function of connecting the electronic device 100 to a telephone line. When making a call through a telephone line, the communication device 162 receives a command from the arithmetic device 161. In response to the signal, the electronic device 100 is controlled to connect to a telephone line. Call the phone line.

[0101] The communication device 162 receives broadcast waves via an antenna 181 and outputs the signals to the display device 110. For example, the tuner may include a demodulation circuit and a configuration including an AD conversion circuit (analog-to-digital conversion circuit), a decoder circuit, etc. The demodulation circuit has a function of demodulating a signal input from the antenna 181. The AD conversion circuit also has the function of converting the demodulated analog signal into a digital signal. The decoder circuit also decodes the video data contained in the digital signal and controls the display. It has the function of generating a signal to be transmitted to device 164.

[0102] The decoder may also have a dividing circuit and a plurality of processors. It has the function of dividing the input video data spatially and temporally and outputting it to each processor. The processors decode the input video data and send it to the display control device 164. In this way, as a decoder, multiple processors are used to generate the signal to be transmitted. By applying a configuration that processes multiple signals in parallel, it is possible to decode video data with an extremely large amount of information. In particular, when displaying images with a resolution exceeding full high definition, The decoder circuit that decodes the compressed data is a processor with extremely high processing speed. For example, the decoder circuit has four or more, preferably eight or more. More preferably, the configuration includes a plurality of processors capable of parallel processing of 16 or more. The decoder is also preferably configured to separate the video signal contained in the input signal from the other signals. It may also have a circuit for separating the information (text information, program information, authentication information, etc.).

[0103] The broadcasting waves that can be received by the antenna 181 are terrestrial waves or satellite waves. In addition, broadcasting waves that can be received by the antenna 181 include analog There are broadcasts, digital broadcasts, video and audio broadcasts, and audio-only broadcasts. For example, UHF band (approximately 300MHz to 3GHz) or VHF band (30MHz to 300M It is possible to receive broadcast radio waves transmitted in a specific frequency band of 100 Hz. For example, by using multiple data received in multiple frequency bands, the transfer rate can be increased. This allows you to see more information than ever before, even beyond full HD. The display device 110 can display an image having a resolution of, for example, 4K2K, It can display images with resolutions of 8K4K, 16K8K, or higher. .

[0104] The tuner was also transmitted via data transmission technology over a computer network. A signal to be transmitted to the display control device 164 may be generated using broadcast data. At this time, if the received signal is a digital signal, the tuner will have a demodulation circuit and an A -D conversion circuit may not be included.

[0105] The posture detection unit 165 has a function of detecting the tilt and posture of the electronic device 100. For example, The momentum detection unit 165 may include an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, a jack A color sensor or the like can be used. In addition, a combination of these sensors can also be used. good.

[0106] The external interface 168 may be, for example, one or more buttons provided on the housing 101. External ports to which you can connect input components such as switches (also called chassis switches) The external interface 168 is connected to the computer via the bus line 145. The housing switch is connected to the device 161. There are buttons for adjusting the volume, a button for taking pictures with the camera, etc.

[0107] The external interface 168 has an external port, for example, a computer or a processor. The printer can be connected to an external device via a cable. There are also external ports such as a USB port and a LAN (Local Area Network) port. Network connection terminal, digital broadcast reception terminal, AC adapter connection terminal In addition to wired communication, optical communication using infrared light, visible light, ultraviolet light, etc. may also be used. A configuration may be adopted in which a transceiver for communication is provided.

[0108] The imaging device 175 is connected to the arithmetic unit 161 via a bus line 145. When the switch provided in the The imaging device 175 can capture still images or videos. For example, lamps such as xenon lamps, light emitting devices such as LEDs and organic EL devices, etc. Alternatively, the display device 110 and the display device The light emitted by 110 may be used, in which case not only white light but also various colors of light can be captured. It may also be used as a light source for

[0109] The vibration device 166 includes a vibration element that vibrates the electronic device 100 and a vibration controller that controls the vibration element. The vibration element includes a vibration motor (eccentric motor), a resonance actuator, and Elements that can convert electric or magnetic signals into vibrations, such as magnetostrictive elements and piezoelectric elements A child can be used.

[0110] The vibration device 166 controls the frequency and amplitude of the vibration of the vibration element in response to an instruction from the arithmetic unit 161. By controlling the vibration period, the electronic device 100 can be vibrated in various vibration patterns. For example, vibrations linked to the operation of a housing switch, etc., electronic device 1 Vibration linked to the startup of 00, linked to video and audio played in video playback applications vibrations linked to the arrival of e-mails, vibrations linked to input operations to the touch sensor 176, Various vibration patterns based on the actions performed in various applications, such as vibrations generated by the The vibrations can be emitted by a vibration device 166.

[0111] The sensor module 167 includes a sensor unit and a sensor controller. The controller supplies power to the sensor unit from a battery 179 or the like. The controller receives input from the sensor unit, converts it into a control signal, and transmits it on the bus line 145 The sensor controller outputs the signal to the arithmetic unit 161 via the The sensor control may be performed, or the sensor unit may be calibrated. The controller may be configured to include a plurality of controllers for controlling the sensor units.

[0112] The sensor module 167 receives, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, power, radiation Various sensors that have the function of measuring line, flow rate, humidity, gradient, vibration, smell or infrared It may also be configured to include:

[0113] This embodiment mode can be implemented by appropriately combining with the configurations described in other embodiment modes. It is possible.

[0114] (Embodiment 2) In this embodiment, an electronic device 100C, which is a modified example of the electronic device 100, will be described with reference to the drawings. The configurations of the electronic device 100A and the electronic device 100B will be described below. C. To reduce the repetition of the explanation, the following mainly describes the electronic device 100 and the 10 to 13 are perspective views showing the appearance of the electronic device 100C. do.

[0115] In FIG. 10(A), the electronic device 100C is opened vertically so that the housing 101a faces upward. 10B and 10C show the electronic device 100 in a closed state. It shows C.

[0116] As shown in FIGS. 10A and 10B, a part of the display device 110 is provided with a housing 101a. A display area 111d may be provided along the upper side of the display area 111a. As shown in the figure, a display area 111j overlapping the rear surface of the housing 101a is provided in a part of the display device 110. It may be provided.

[0117] As shown in FIG. 11(A), a part of the display device 110 is provided on the right side surface of the housing 101a. 11B, a display area 111e may be provided that overlaps the display area 111a. A display area 111f is provided in a part of the display device 110, overlapping along the left side surface of the housing 101a. It is okay to do so.

[0118] 12A, a part of the display device 110 is provided on the right side surface of the housing 101b. 12B, a display area 111g may be provided so as to overlap the display area 111g. A display area 111h is provided in a part of the display device 110, overlapping along the left side surface of the housing 101b. It is okay to do so.

[0119] As shown in FIG. 13A, a part of the display device 110 is provided with a lower side surface of the housing 101b. It is also possible to provide overlapping display areas 111i along the same line.

[0120] 13B, the display device 110 has a display area 111d and a display area 111 e, display area 111f, display area 111g, display area 111h, and display area 111i By providing a display unit on at least one of the side surfaces of the electronic device 100C, Even when child device 100C is closed, the user can know the necessary information.

[0121] In addition, the display area 111d, the display area 111e, the display area 111f, the display area 111g, The side surface of the housing 101 that overlaps with the display area 111h and / or the display area 111i is curved. It is preferable that it has.

[0122] In addition, in the display device 110, the display area 111a, the display area 111b, and the display area 111c , and / or the display area 111j is an area where hybrid display is possible (hybrid display device), and display area 111d, display area 111e, display area 111f, and display area 111 g, the display area 111h, and / or the display area 111i are areas where only EL display is possible ( It may be an area where only liquid crystal display is possible (EL display device), or an area where only liquid crystal display is possible (liquid crystal display device).

[0123] Hybrid display is possible in areas where only EL display is possible and areas where only LCD display is possible. For example, the thickness of the display device 110 can be reduced compared to the area of ​​the display device. In the liquid crystal display device, the use of a polarizing plate is not essential, so the display device can be easily made thin. For example, by using a liquid crystal element operating in guest-host mode, a polarizing plate is not required. By reducing the thickness of the display device 110, the display Therefore, the display device 110 can be easily bent along the side. It becomes easier.

[0124] This embodiment mode can be implemented by appropriately combining with the configurations described in other embodiment modes. It is possible.

[0125] (Embodiment 3) In this embodiment, an example of the configuration of the display device 110 will be described.

[0126] The display device 110 can take a variety of forms or have a variety of display elements. An example of a display element is an EL (electroluminescence) element (organic EL element, Inorganic EL elements, or EL elements containing organic and inorganic materials), LEDs (white LEDs, red color LED, green LED, blue LED, etc.), transistor (transistor that emits light according to the current Electron emitter, liquid crystal element, electronic ink, electrophoretic element, GLV (grating using MEMS (microelectromechanical systems) Display element, DMD (Digital Micromirror Device), DMS (Digital Micromirror shutter), MIRASOL (registered trademark), IMOD (Interferometric Modulation modulation element, shutter-type MEMS display element, optical interference-type MEMS display element, electrowetting element, piezoelectric ceramic display, carbon nanotube Display elements that use a probe, etc., which use electrical or magnetic effects to improve contrast, brightness, and reflection. Some display devices have display media with variable reflectance, transmittance, etc. A kit may also be used.

[0127] An example of a display device using an EL element is an EL display device. One example of such a display device is a field emission display (FED). on Display) or surface conduction electron emission device display (SED) e-conduction Electron-emitter Display) etc. An example of a display device using quantum dots is a quantum dot display device.

[0128] An example of a display device using a liquid crystal element is a liquid crystal display device (transmissive liquid crystal display device, semi-transmissive liquid crystal display device, etc.). LCDs, reflective LCDs, direct-view LCDs, projection LCDs, etc. Display devices using electronic ink, electronic liquid powder (registered trademark), or electrophoretic elements An example is electronic paper. Also, display devices are PDPs (Plasma Diodes). The display device may be a retinal scanning projection device. Alternatively, the display device may be a display device using micro LEDs.

[0129] In order to realize a semi-transmissive liquid crystal display device or a reflective liquid crystal display device, a part of the pixel electrode Alternatively, all of the pixel electrodes may function as reflective electrodes. may be partly or entirely made of aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This further reduces power consumption.

[0130] When using an LED, graphene or graphene is placed under the LED electrode or nitride semiconductor. Graphene and graphite can be arranged in layers to form a multilayer film. In this way, by providing graphene or graphite, it is possible to form a nitride layer on the graphene or graphite. Semiconductors, such as n-type GaN semiconductor layers having crystallinity, can be easily formed. Furthermore, a p-type GaN semiconductor layer having crystals is formed on top of that to form an LED. It is possible to combine graphene or graphite with a crystalline n-type GaN semiconductor layer. An AlN layer may be provided between the GaN layer and the LED. However, by providing graphene, the GaN semiconductor of the LED The layer can also be deposited by sputtering.

[0131] The display device 110 may be a reflective display element or a light-emitting display element (also called a "light-emitting element"). ) and capable of displaying in both reflective and luminous modes. It is also possible to use

[0132] A configuration example of the display device 110 will be described. FIG. 14A shows a configuration example of the display device 110. The display device 110 includes a display area 231, a circuit 232, and a It has a path 233.

[0133] The display area 231 includes a plurality of pixels 230 arranged in a matrix, a plurality of wirings G1, a plurality of Wiring G2, multiple wiring ANO, multiple wiring CSCOM, multiple wiring S1 and multiple wiring The wiring G1, the wiring G2, the wiring ANO, and the wiring CSCOM are arranged in the direction R. The lined pixels 230 are electrically connected to the circuit 232. The wirings S1 and S2 are A plurality of pixels 230 arranged in a direction C are electrically connected to a circuit 233 .

[0134] Although FIG. 14A shows a configuration including one circuit 232 and one circuit 233, A circuit 232 and a circuit 233 for driving the liquid crystal element, and an EL element (a light-emitting element using an EL material) Alternatively, a circuit 232 and a circuit 233 for driving the transistors (elements) may be provided separately.

[0135] In addition, a part or the whole of the circuit 232 and the circuit 233 may be formed on another substrate. For example, a part of the circuit 232 and the circuit 233, or The entire display device 110 may be formed using a single crystal substrate and electrically connected to the display device 110 .

[0136] The pixel 230 is made up of a reflective liquid crystal element that functions as a reflective display element and a light-emitting element. In the pixel 230, the liquid crystal element and the EL element function as a It has an overlapping portion.

[0137] Pixels 230 that emit or reflect red light, pixels 230 that emit or reflect green light, and the blue light emitting or reflecting pixels 230 are grouped together to function as one pixel; Achieving full color display by controlling the light emission (reflection brightness) of each pixel Therefore, each of the three pixels functions as a sub-pixel. The sub-pixels of each pixel have different transmittance, reflectance, or emission characteristics for red, green, or blue light. The color of light controlled by each of the three sub-pixels is a combination of red, green, and blue. The colors are not limited to a combination, but may be cyan, magenta, and yellow.

[0138] Alternatively, four sub-pixels may be combined to function as one pixel. For example, red light, green light, A subpixel for controlling white light may be added to the three subpixels for controlling colored light and blue light, respectively. By adding a sub-pixel that controls white light, the brightness of the display area can be increased. By increasing the number of sub-pixels that function as one pixel, red, green, blue, cyan, magenta, and By appropriately combining sub-pixels that control yellow and other colors, the reproducible color gamut can be expanded. It can be done.

[0139] In addition, when multiple pixels are arranged in a 1920 x 1080 matrix, a so-called full high-definition Resolution of vision (also known as "2K resolution," "2K1K," or "2K") It is possible to realize a display device 110 capable of displaying at 3840 degrees. When arranged in a matrix of 2160 pixels, it becomes what is known as ultra high definition (4K resolution). ", "4K2K", or "4K" resolution. 110 can be realized. For example, the pixels can be arranged in a 7680 x 4320 matrix. When arranged in a similar way, it becomes what is known as super high definition ("8K resolution", "8K4K", or It is possible to realize a display device 110 capable of displaying at a resolution of 1080p (also called "8K"). By increasing the number of pixels, it is possible to realize a display device 110 capable of displaying at a resolution of 16K or 32K. It is also possible to manifest it.

[0140] FIG. 14B1 shows a configuration example of the electrode 245 of the pixel 230. The electrode 245 functions as a reflective electrode for the liquid crystal element 230. The electrode 245 also has an opening 451. It is provided.

[0141] In FIG. 14(B1), the light emitting element 370 located in the area overlapping with the electrode 245 is shown by a broken line. The light emitting element 370 is arranged so as to overlap with the opening 451 of the electrode 245. As a result, light emitted from the light emitting element 370 is emitted through the opening 451 to the display surface side.

[0142] In FIG. 14(B1), pixels 230 adjacent in the direction R correspond to different luminescent colors. At this time, as shown in FIG. 14(B1), the openings are formed in two pixels adjacent to each other in the direction R. 451 are preferably provided at different positions on the electrodes 245 so that they are not arranged in a line. This allows the two light emitting elements 370 to be spaced apart, and the light emitted by the light emitting elements 370 This phenomenon occurs when light from a pixel enters the colored layer of an adjacent pixel 230 (also known as "crosstalk"). In addition, by arranging two adjacent light emitting elements 370 apart from each other, Therefore, when the EL layer of the light emitting element 370 is separately formed by using a shadow mask or the like, Even if the display device is a high-resolution display, it is possible to realize a high-resolution display.

[0143] Alternatively, an arrangement such as that shown in FIG. 14(B2) may be used.

[0144] If the ratio of the total area of ​​the openings 451 to the total area of ​​the non-openings is too large, it is difficult to obtain a satisfactory image using a liquid crystal element. In addition, the ratio of the total area of ​​the openings 451 to the total area of ​​the non-openings is If the value is too small, the display using the light emitting element 370 will be too dark.

[0145] Furthermore, if the area of ​​the opening 451 provided in the electrode 245 functioning as a reflective electrode is too small, the light This reduces the efficiency of light that can be extracted from the light emitted by the optical element 370.

[0146] The shape of the opening 451 may be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. It may also be in the form of thin stripes, slits, or a checkered pattern. The apertures 451 may be arranged close to adjacent pixels. Preferably, the apertures 451 are arranged so that they display the same color. This arrangement makes it possible to suppress crosstalk.

[0147] Also, as shown in FIGS. 14(B3) and (B4), in the area where the electrode 245 is not provided, The light emitting region of the light emitting element 370 may be located. The light is emitted toward the display surface.

[0148] In FIG. 14(B3), in two pixels 230 adjacent to each other in the direction indicated by the arrow R, In FIG. 14(B4), two adjacent ones of the 370 are arranged in the direction indicated by the arrow R. In each pixel 230, the light emitting elements 370 are arranged in a line.

[0149] In the configuration of FIG. 14(B3), the light-emitting elements 370 of two adjacent pixels 230 are spaced apart from each other. Therefore, as described above, it is possible to suppress crosstalk and achieve high definition. 14(B4), the electrode 245 is provided on the side of the light emitting element 370 parallel to the arrow C. Since the electrode 245 is not positioned, the light from the light emitting element 370 can be prevented from being blocked by the electrode 245, and high visibility can be achieved. It is possible to achieve field angle characteristics.

[0150] The circuit 232 can be implemented using various sequential circuits such as a shift register. A transistor, a capacitor, or the like can be used for the circuit 232. The transistor can be formed in the same process as the transistor included in the pixel 230.

[0151] The circuit 233 is electrically connected to the wiring S1. For example, an integrated circuit is used for the circuit 233. Specifically, the circuit 233 may include an integrated circuit formed on a silicon substrate. can be used.

[0152] For example, COG (Chip on Glass) or COF (Chip on Fiber) The circuit 233 is mounted on the pad electrically connected to the pixel 230 using a method such as a pixel electrode mounting method. Specifically, an integrated circuit can be mounted on the pad using an anisotropic conductive film.

[0153] <Circuit configuration example of pixel 230> FIG. 15 is a diagram showing an example of the circuit configuration of the pixel 230. In FIG. 15, two adjacent pixels 2 It shows 30.

[0154] The pixel 230 includes a switch SW1, a capacitance element C1, a liquid crystal element 350, a switch SW2, a transistor The pixel 230 includes a transistor M, a capacitance element C2, and a light emitting element 370. Wire G1, wire G2, wire ANO, wire CSCOM, wire S1, and wire S2 are electrically 15, the wiring VCOM electrically connected to the liquid crystal element 350 is 1 and a wiring VCOM2 electrically connecting to the light emitting element 370.

[0155] FIG. 15 shows an example in which transistors are used for the switches SW1 and SW2. It shows.

[0156] The switch SW1 has a gate connected to the wiring G1 and a source or drain connected to the wiring S 1, and the other of the source or drain is connected to one electrode of the capacitance element C1 and the liquid crystal element The other electrode of the capacitance element C1 is connected to the wiring CSCOM. The other electrode of the liquid crystal element 350 is connected to the wiring VCOM1.

[0157] The switch SW2 has a gate connected to the wiring G2 and a source or drain connected to the wiring S 2, and the other of the source or drain is connected to one electrode of the capacitance element C2, The other electrode of the capacitance element C2 is connected to the source of the transistor M. The transistor M is connected to one of the source and drain terminals and the wiring ANO. Alternatively, the other of the drains is connected to one of the electrodes of the light-emitting element 370. The other electrode of the second electrode is connected to the wiring VCOM2.

[0158] In FIG. 15, a transistor M has two gates that sandwich a semiconductor, and these are connected. This increases the current that the transistor M can pass. This can be done.

[0159] A signal that controls the switch SW1 to be in a conductive or non-conductive state is applied to the wiring G1. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the alignment state of the liquid crystal in the element 350 can be applied. M can be given a predetermined potential.

[0160] A signal that controls the switch SW2 to be in a conductive state or a non-conductive state is applied to the wiring G2. A potential difference that causes the light emitting element 370 to emit light is generated between the wiring VCOM2 and the wiring ANO. The wiring S2 can be connected to a potential that controls the conduction state of the transistor M. A signal to control the

[0161] In the pixel 230 shown in FIG. 15, when a reflective mode display is performed, the wiring G1 and the wiring G2 are The liquid crystal element 350 is driven by a signal applied to the line S1 and displays the image by optical modulation. In addition, when displaying in the light emitting mode, the voltage applied to the wiring G2 and the wiring S2 is The light emitting element 370 can be driven by a signal to emit light for display. When driving with a mode, the voltages given to the wiring G1, the wiring G2, the wiring S1 and the wiring S2 are It can be driven by a signal.

[0162] In FIG. 15, one pixel 230 includes one liquid crystal element 350 and one light emitting element 370. 16A shows an example in which one pixel 230 has one The liquid crystal element 350 and four light-emitting elements 370 (light-emitting element 370r, light-emitting element 370g, light-emitting element 16A shows an example in which the pixel 23 has a light emitting element 370b and a light emitting element 370w. Unlike FIG. 15, pixel 0 is capable of displaying full color with one pixel.

[0163] In FIG. 16A, in addition to the example of FIG. 15, a line G3 and a line S3 are connected to the pixel 230. are.

[0164] In the example shown in FIG. 16(A), for example, four light emitting elements 370 are arranged to emit red (R), green (G), and blue light. Light-emitting elements that emit green (G), blue (B), and white (W) colors can be used. A reflective liquid crystal element that exhibits white color can be used as the liquid crystal element 350. In the case of display in reflective mode, white color with high reflectivity can be displayed. When display is performed in the light-emitting mode, display with high color rendering properties can be performed with low power consumption.

[0165] 16B shows an example of the configuration of the pixel 230. The pixel 230 has an electrode 245 The light emitting element 370w overlaps with the opening of the electrode 245, and the light emitting element 370w is disposed around the electrode 245. The light emitting element 370r, the light emitting element 370g, and the light emitting element 370b. The light emitting element 370g and the light emitting element 370b preferably have approximately the same light emitting area. .

[0166] <Display mode> The display device 110 can be operated in three display modes: a first display mode (m Mode 1) is a display mode in which an image is displayed as a reflective liquid crystal display device. The display mode (mode 2) is a display mode in which an image is displayed as a light-emitting display device. The display mode (mode3) operates the first and second display modes simultaneously. This is a display mode.

[0167] [First display mode] The first display mode does not require a light source, and therefore is a display mode with extremely low power consumption. For example, this is particularly effective when the illuminance of external light is sufficiently high and the external light is white light or light close to white light. The first display mode is effective in an environment where the illuminance is greater than about 300 lx, for example. This is especially effective when used in daylight. However, depending on the purpose or use, the illuminance may be Even in an environment of less than about 300 lx, the display device 110 can be operated in the first display mode. There may be cases where this is done.

[0168] The first display mode is a display mode suitable for displaying text information such as books and documents. Because reflected light is used to display images, it is easy on the eyes and reduces eye fatigue. This has the effect of making it difficult to

[0169] FIG. 17(A1) shows the electronic device 910 being used outdoors during the day. In 7(A1), the display device of the electronic device 910 operates in the first display mode. The electronic device 910 is, for example, a mobile information terminal such as a smartphone. The display device 110 includes a display device 110 according to an embodiment of the present invention.

[0170] FIG. 17(A2) shows incident light 901 incident on the display device 110 of the electronic device 910 and the 9 shows reflected light 902 reflected by the device 110.

[0171] [Second display mode] The second display mode is extremely vivid (high contrast) regardless of the illuminance or chromaticity of the external light. This is a display mode that can display images with high color reproducibility. The second display mode is effective when the illuminance of external light is low, such as when the illuminance is 5000. It is particularly effective when used in an environment of less than about lx. Therefore, even in an environment where the illuminance is greater than about 5000 lx, the display device 110 can be used as the second In addition, when the illuminance of external light is low, a bright display may be displayed. To prevent this, the second display mode is It is preferable to display the image with reduced brightness. This not only reduces glare but also The second display mode provides vivid images and smooth video. This mode is suitable for displaying

[0172] FIG. 17(B1) shows a state in which the electronic device 910 is being used outdoors at night. 17(B), an electronic device 920 is an electronic device used for digital signage. In 1), the display devices of the electronic device 910 and the electronic device 920 operate in the second display mode. The electronic device 920 includes the display device 110 of one embodiment of the present invention.

[0173] FIG. 17B2 shows a diagram of light emission 903 emitted from the display device 110 of the electronic device 910 and an electronic Light emission 903 is shown emanating from display device 110 of device 920.

[0174] [Third display mode] The third display mode is a combination of the reflected light in the first display mode and the emitted light in the second display mode. This is a display mode that uses both. For example, the maximum reflected brightness in the first display mode is When it becomes necessary to emit the above light from the display device 110, the required amount of light is output to the second display model. In addition, for example, the reflected light in the first display mode and the The light emitted by the second display mode is mixed to produce one color. It is possible.

[0175] The third display mode provides a more vivid display than the first display mode, while maintaining the same brightness as the second display mode. For example, under indoor lighting, in the morning or evening, This is effective when the illuminance of external light is relatively low or when the chromaticity of external light is not white.

[0176] The third display mode is particularly effective when used in an environment with an illuminance of less than 5000 lx. However, depending on the purpose or use, the lighting may be higher than 5000lx. Even if the display device 110 is in the third display mode, there may be cases where the display device 110 is operated in the third display mode.

[0177] FIG. 17(C1) shows a state in which an electronic device 910 is being used indoors. The electronic device 930 inside is an electronic device that can function as a television or monitor. The electronic device 940 in the figure is a notebook personal computer. In the above, the display devices of the electronic devices 910, 930, and 940 are The electronic device 930 and the electronic device 940 operate in three display modes. The display device 110 has an embodiment.

[0178] FIG. 17(C2) shows the light emitted from the display device 110 of the electronic device 910. Incident light 901 incident on the display device 110 of the electronic device 910 and the display device 110 of the electronic device 910 10 shows reflected light 902 reflected from the display device 110 of the electronic device 930. emitted light 903, incident light 901 incident on the display device 110 of the electronic device 930, and The electronic device 94 and the display device 110 of the electronic device 930 are shown as reflected light 902. The display device 110 of the number 0 can function in the same way as the other display devices 110.

[0179] The display using the third display mode can also be called a hybrid display mode. A multi-color display is a display that uses both reflected light and self-luminous light on a single panel to change color or light intensity. This is a method of displaying characters or images by using two complementary display modes. This means that light from multiple display elements in the same pixel or the same subpixel is used to It is a method of displaying text and / or images. However, it is a hybrid display. Display device (also called "hybrid display device" or "hybrid display") When viewed locally, it is a pixel or sub-pixel displayed using any one of a plurality of display elements. and a pixel or sub-pixel displayed using two or more of the plurality of display elements. .

[0180] In this specification, the term "a device that satisfies one or more of the above-mentioned expressions" is used. This is called a hybrid display.

[0181] A hybrid display has multiple display elements in the same pixel or subpixel. The plurality of display elements may include, for example, reflective elements that reflect light and transparent elements that emit light. The reflective element and the self-luminous element are controlled independently. The hybrid display can utilize both reflective and self-luminous light in the display area. It has the function of displaying characters and / or images using either or both of the above.

[0182] <Specific examples of the first to third display modes> Here, specific examples of the first to third display modes described above will be explained with reference to FIGS. This will be explained with reference to FIG.

[0183] In the following, the first to third display modes are automatically switched depending on the illuminance. In addition, when the display device is automatically switched depending on the illuminance, for example, an illuminance sensor is provided. By providing an illuminance sensor or the like, the display mode can be switched based on information from the illuminance sensor.

[0184] 18(A), 18(B), and 18(C) show the display device of the present embodiment. 1 is a schematic diagram of a pixel for explaining a display mode. FIG.

[0185] In FIG. 18(A), FIG. 18(B), and FIG. 18(C), a first display element 501, a second display element 502, and a A display element 502, an opening 503, reflected light 504 reflected from the first display element 501, and and transmitted light 505 emitted from the second display element 502 through the opening 503. Note that FIG. 18(A) is a diagram for explaining the first display mode, and FIG. 18(B) is a diagram for explaining the second display mode. FIG. 18(C) is a diagram illustrating the second display mode, and FIG. 18(D) is a diagram illustrating the third display mode. do.

[0186] In addition, in FIG. 18(A), FIG. 18(B), and FIG. 18(C), the first display element 501 and In this case, a reflective liquid crystal element is used, and a light emitting element is used as the second display element 502. do.

[0187] In the first display mode shown in FIG. 18(A), a reflective liquid crystal display (LCD) is used as the first display element 501. By driving the element, the intensity of the reflected light can be adjusted to display gradations.

[0188] In the second display mode shown in FIG. 18B, the light emitting element of the second display element 502 The intensity can be adjusted to display a gray scale. The light passes through the opening 503 and is extracted to the outside as transmitted light 505 .

[0189] The third display mode shown in FIG. 18(C) is a combination of the first display mode and the second display mode. For example, the first display element 501 is a reflective type The intensity of the reflected light 504 is adjusted by the reflective electrode of the liquid crystal element in the liquid crystal layer to display gradations. In addition, the second display element 502 is driven within the same period as the first display element 501 is driven. The light emission intensity of the light emitting element, in this case the intensity of transmitted light 505, is adjusted to perform gray scale display.

[0190] <State transitions of the first to third display modes> Next, the state transitions of the first to third display modes will be explained with reference to FIG. 18(D). FIG. 18(D) shows the first, second, and third display modes. 18(D) is a state transition diagram. State C1 corresponds to the first display mode, and state C2 corresponds to the second display mode. corresponds to the second display mode, and state C3 corresponds to the third display mode.

[0191] As shown in FIG. 18(D), the state C1 to the state C3 are selected depending on the illuminance. For example, when the illuminance is high, such as outdoors, the display mode can be set to C1. Also, when the illuminance decreases, such as when moving from outdoors to indoors, the state changes from C1 to C2. The state changes to state C2. Also, even outdoors, the illuminance is low and the gradation display by the reflected light is insufficient. If not, the state C1 transitions to the state C3. Of course, the state C3 transitions to the state C1. transition from state C2 to state C3, from state C3 to state C2, or from state C A transition from 2 to state C1 also occurs.

[0192] In FIG. 18(D), the sun symbol is used as the image of the first display mode, and the The image for the display mode is the moon symbol, and the image for the third display mode is the cloud symbol. The symbols for each are shown.

[0193] As shown in FIG. 18(D), there is no change in illuminance in states C1 to C3. If the change in illuminance is small or the change in illuminance is small, the original state is maintained without transitioning to another state. Just do that.

[0194] As described above, by configuring the display mode to be switched depending on the illuminance, power consumption is relatively low. Reducing the frequency of gray scale display in transmissive liquid crystal devices that require a light source such as a large backlight Therefore, the power consumption of the display device can be reduced. , depending on the remaining battery capacity, the content being displayed, or the ambient light level. In the above explanation, the display mode can be changed depending on the illuminance. Although the example shows a case where the display mode is automatically switched, the present invention is not limited to this. You may switch modes.

[0195] <Evaluation of hybrid displays> Next, we compared the hybrid display and a commercially available OLED display under ambient light. In this evaluation, the display of the hybrid display was As shown in FIG. 18(D), the first to third display modes are selected according to the illuminance of external light. I switched appropriately.

[0196] The results of the luminance evaluation are shown in Figure 19(A). In Figure 19(A), the horizontal axis represents the illuminance of external light [lx]. , the vertical axis is the display luminance [cd / m 2 Here, the standard for the illuminance of external light is 0. 1lx: moonlight, 1000lx: indoors, 10000lx: shade on a sunny day, 100000 lx: Under midsummer sunlight, it becomes about the same.

[0197] As shown in Figure 19(A), commercially available OLED displays have a luminance of approximately 500 cd / m 2 Outdoors (for example, when the illuminance is 10,000 lx or more), the brightness is insufficient and visibility is poor. In contrast, hybrid displays use reflective liquid crystal elements outdoors. By switching to the first display mode, it is possible to obtain brightness proportional to the intensity of external light. This allows the hybrid display to achieve sufficient brightness even outdoors, making it superior to commercially available OL It has better outdoor visibility than ED displays.

[0198] Next, we compared the hybrid display and a commercially available OLED display under ambient light. In this evaluation, the power consumption of commercially available OLED displays was evaluated. The hybrid display used had an automatic dimming function. The power consumption required to achieve the same brightness as the D display was calculated.

[0199] The results of the evaluation of power consumption are shown in Figure 19(B). In Figure 19(B), the horizontal axis represents the illuminance of external light [lx]. The vertical axis is the power consumption of the display [arb.units]. The maximum power consumption of an LED display is set to 1.

[0200] As shown in FIG. 19(B), the hybrid display can be in the first display mode or the third display mode. By switching to this display mode, the brightness of the light-emitting element is reduced by the amount of the reflective liquid crystal element used. This allows for lowering the brightness and reducing power consumption. By reducing the power consumption of the light-emitting element in the hybrid display, the power consumption of the entire display can be reduced. can be made smaller.

[0201] Furthermore, when outdoors, you can switch the hybrid display to the first display mode. Since sufficient brightness can be obtained with only the reflective liquid crystal element, there is no need to use a light emitting element. This eliminates the power consumption of the light emitting elements in the hybrid display, The power consumption of the entire hybrid display can be significantly reduced.

[0202] <Operation mode> Next, the operation modes that can be performed by the first display element will be described with reference to FIG. .

[0203] In the following, we will assume that the frame rate is normal (typically 60Hz or higher and 240Hz or lower). There are two operating modes: Normal mode, which operates at a low frame rate, and This section explains the IDS (Idle Stop) driving mode and the IDS (Idle Stop) driving mode.

[0204] In the IDS drive mode, after the image data writing process is executed, the image data is written. This refers to a driving method that stops the switching of image data. By extending the interval between writing of image data, the time required to write image data during that time can be reduced. The IDS drive mode can reduce power consumption by the amount of power consumed. The frame frequency can be set to about 1 / 100 to 1 / 10 of the normal frame rate. The video signal is the same between frames. Therefore, the IDS driving mode can display a still image. This is particularly effective when displaying images using IDS driving, which reduces power consumption. This reduces noise, suppresses screen flicker, and reduces eye strain.

[0205] Figure 20(A), Figure 20(B), and Figure 20(C) show the normal driving mode and the IDS driving mode. 20A is a circuit diagram and a timing chart for explaining the first A display element 501 (here, a reflective liquid crystal element) and a first display element 501 electrically connected to the first display element 501 20(A) and the pixel circuit 506 shown in FIG. The signal line SL, the gate line GL, and the transistors connected to the signal line SL and the gate line GL are The transistor M1 and the capacitance element Cs connected to the transistor M1 LC The figure illustrates the above.

[0206] The transistor M1 is a transistor having a metal oxide in the semiconductor layer where the channel is formed. It is preferable to use a transistor. Metal oxides are used for amplification, rectification, and switching. When the metal oxide has at least one of the functions, the metal oxide is called a metal oxide semiconductor. oxide semiconductor) or oxide sem The following are representative examples of transistors: As an example, a transistor using an oxide semiconductor in the semiconductor layer where the channel is formed ("OS transistor") The OS transistor is also called a "lead transistor" when it is off. Because the off-state current (off-current) of the OS transistor is extremely low, the liquid crystal The pixel electrodes of the element can hold charge.

[0207] In the circuit diagram shown in FIG. 20(A), the liquid crystal element LC is a leak path for the data D1. Therefore, to perform IDS driving properly, the resistivity of the liquid crystal element LC must be set to 1.0×10 14 It is preferable to set it to Ω·cm or more.

[0208] The channel formation region of the OS transistor is formed of, for example, In—Ga—Zn oxide. In addition, the In-Ga-Zn oxide can be suitably used. The typical composition is In:Ga:Zn=4:2:4.1 [atomic ratio]. It can be used.

[0209] FIG. 20B shows the voltages applied to the signal line SL and the gate line GL in the normal drive mode. 1 is a timing chart showing the waveforms of signals output from the normal driving mode. The period T1 to T3 is shown in FIG. 20(B). An operation of applying a scanning signal to the gate line GL during a frame period and writing data D1 from the signal line SL. This operation is performed when writing the same data D1 during the periods T1 to T3 or when writing different data D1. The same applies to writing data that is different from the above.

[0210] On the other hand, FIG. 20C shows the signal line SL and the gate line GL in the IDS drive mode. 1 is a timing chart showing the waveform of a signal applied to the IDS drive. One frame period is represented by the period T1, and the data The write period is T W , the data retention period is period T RET The IDS driving mode is , period T W A scanning signal is applied to the gate line GL, data D1 is written to the signal line SL, and during the period T RET The gate line GL is fixed to a low level voltage, and the transistor M1 is in a non-conducting state. The data D1 that was written once is held. For example, the frequency may be set to 0.1 Hz or more and less than 60 Hz.

[0211] The IDS driving mode can be combined with the first or third display mode described above. This is effective because it allows for further reduction in power consumption.

[0212] As described above, the display device of this embodiment can switch between the first to third display modes. Therefore, it is highly visible and useful regardless of the surrounding brightness. A highly convenient display device or an all-weather display device can be realized.

[0213] The display device shown in this embodiment mode includes a first pixel having a first display element and a second pixel having a second display element. It is preferable that the first pixel and the second pixel have a display element. It is preferable that the pixels are arranged in a matrix.

[0214] The first pixel and the second pixel may each have one or more sub-pixels. The display device shown in this embodiment performs full-color display in the first pixel and full-color display in the second pixel. Alternatively, the display device shown in this embodiment can be configured to display full color. The device displays black and white or grayscale on the first pixel and full color on the second pixel. The first pixel may be configured to display black and white or gray. The scale display is suitable for displaying information that does not require color, such as document information. is doing.

[0215] Furthermore, the display device of one embodiment of the present invention can reproduce color gamuts conforming to various standards. For example, PAL (Phase Alternating Line) used in television broadcasting Standards and NTSC (National Television System Com Mitee standard, personal computers, digital cameras, printers and other electronic devices The sRGB (standard RGB) standard is widely used in display devices for electronic equipment. and Adobe RGB standard, HDTV (High Definition Television) ITU-R BT.709 (International Television System ational Telecommunication Union Radiocom munication Sector Broadcasting Service(T 709) standard, and DCI-P3 (Digital Cinema) standard used in digital cinema projection. igital Cinema Initiatives P3) standard, UHDTV (Ul tra High Definition Television, Super Hi-Vision ITU-R BT.2020 (REC.2020 (Recommendation)) It is possible to reproduce color gamuts such as the HDMI 2.0 (2020) standard.

[0216] This embodiment mode can be implemented by appropriately combining with the configurations described in other embodiment modes. It is possible.

[0217] (Fourth embodiment) In this embodiment, an example of the device structure of the display device 110 will be described with reference to the drawings.

[0218] 21(A) and 21(B) are perspective views showing an example of the appearance of the display device 110. The display device 110 shown in FIG. 21(A) and FIG. 21(B) uses an FPC ( A Flexible Printed Circuit (FPC) 372 is connected. The display device 110 shown in FIGS. 21(A) and 21(B) includes a substrate 351 and a substrate 361. In addition, a display area 2 is formed between the substrate 351 and the substrate 361. 31, circuit 232, and circuit 233.

[0219] As described above, the display area 231 has a plurality of pixels 230 arranged in a matrix. The circuit 232 can be, for example, a scanning line driver circuit. For example, a signal line driver circuit can be used. The circuits are sometimes collectively referred to as the "drive circuit."

[0220] As shown in FIG. 21B, the circuit 232 is a circuit 232a for a liquid crystal element and a light-emitting element. The circuit 233 may be provided separately as a circuit for a liquid crystal element and a circuit for a light emitting element. It may be provided separately in the circuit for the optical element.

[0221] Alternatively, a touch sensor 176 may be provided on the substrate 361. For example, a sheet-like electrostatic A capacitive touch sensor 176 may be provided over the display area 231. A touch sensor 176 may be provided between the touch panel 61 and the substrate 351.

[0222] The circuit 232 and the circuit 233 are configured by a plurality of transistors 201. 232 and circuit 233 transmit the signal supplied via FPC 372 to the display area 231. The signal has the function of determining which pixel 230 the signal is to be supplied to.

[0223] [Configuration example 1] FIG. 22 shows a part of the area including the FPC 372, the circuit 23, and the display device 110 shown in FIG. 3 and a part of the area including the display area 231 are cut off. An example of a cross section is shown.

[0224] The display device 110 shown in FIG. 22 includes a transistor 201 between a substrate 351 and a substrate 361. Transistor 203, transistor 205, transistor 206, liquid crystal element 180, light emission The element 170, the insulating layer 220, the colored layer 131, the colored layer 134, etc. are included. The layer 220 is bonded to the substrate 351 via the adhesive layer 141. It is glued via 42.

[0225] The substrate 361 is provided with a colored layer 131, a light-shielding layer 132, an insulating layer 121, and a liquid crystal element 180. An electrode 137 that functions as a common electrode, an alignment film 133b, an insulating layer 138, etc. are provided. The outer surface of the substrate 361 has a polarizer 135. The insulating layer 121 acts as a planarizing layer. The insulating layer 121 can make the surface of the electrode 137 approximately flat. Therefore, the alignment state of the liquid crystal 136 can be made uniform. It functions as a spacer to hold the cap in place. When the insulating layer 138 transmits visible light, Alternatively, the insulating layer 138 may be disposed so as to overlap the display area of ​​the liquid crystal element 180 .

[0226] The liquid crystal element 180 is a reflective liquid crystal element. The liquid crystal element 180 is made up of an electrode 245a, a liquid crystal 13 6, electrode 137 has a laminated structure. An electrode 245b that reflects visible light is provided. The electrode 245b has an opening 451. The electrode 245a and the electrode 137 transmit visible light. An alignment film 133a is provided between the liquid crystal 136 and the electrode 137. It is being done.

[0227] In the liquid crystal element 180, the electrode 245b has a function of reflecting visible light, and the electrode 137 has a function of reflecting visible light. The light incident from the substrate 361 side is polarized by the polarizing plate 135. The light is then transmitted through the electrode 137 and the liquid crystal 136, and is reflected by the electrode 245b. and electrode 137 again, and reaches the polarizing plate 135. At this time, the electrode 245b and the electrode The orientation of the liquid crystal can be controlled by applying a voltage between the electrodes 137, and the optical modulation of light can be controlled. That is, the intensity of the light emitted through the polarizing plate 135 can be controlled. The light outside the specific wavelength range is absorbed by the colored layer 131, and is extracted. The light emitted is, for example, red light.

[0228] As shown in FIG. 22, the opening 451 is provided with an electrode 245a that transmits visible light. This is preferable. In the region overlapping with the opening 451, the same as in the other region, Since the liquid crystal 136 is oriented, poor alignment of the liquid crystal occurs at the boundary between these regions, resulting in unintended It can prevent light from leaking.

[0229] Examples of conductive materials that transmit visible light include indium (In), zinc (Zn), and tin. It is preferable to use a material containing one selected from the group consisting of indium oxide (Sn). , Indium Tin Oxide (ITO), Indium Zinc Oxide, Indium Oxide with Tungsten Oxide, Indium Oxide with Tungsten Oxide Zinc oxide, indium oxide with titanium oxide, indium tin oxide with titanium oxide , indium tin oxide with silicon oxide (ITSO), zinc oxide, oxide with gallium Zinc, etc. A film containing graphene can also be used. The film containing graphene oxide can be formed, for example, by reducing a film containing graphene oxide.

[0230] Examples of conductive materials that reflect visible light include aluminum, silver, and metals thereof. Other examples include alloys containing gold, platinum, nickel, tungsten, and chromium. , molybdenum, iron, cobalt, copper, palladium, or other metallic materials, or these metals In addition, the above metal materials or alloys may contain lanthanum, nickel, or the like. Odum, germanium, etc. may be added. Alloys of aluminum and titanium, Aluminum and nickel alloy, aluminum and neodymium alloy, aluminum, nickel and lanthanum alloys (Al-Ni-La), Silver-copper alloy, silver-palladium-copper alloy (also known as Ag-Pd-Cu, APC) Alternatively, an alloy containing silver, such as an alloy of silver and magnesium, may be used.

[0231] At the connection portion 207, the electrode 245b is connected to the transistor 206 via the conductive layer 221b. The transistor 206 is electrically connected to the conductive layer 222a of the liquid crystal element 1. It has the function of controlling the drive of 80.

[0232] A connecting portion 252 is provided in a portion of the area where the adhesive layer 141 is provided. 2, a conductive layer obtained by processing the same conductive film as the electrode 245a and one of the electrodes 137 The part is electrically connected by the connector 243. A signal or a voltage is input to the electrode 137 from the FPC 372 connected to the substrate 351 side. The voltage can be supplied via connection 252.

[0233] The connectors 243 may be, for example, conductive particles. The surface of particles such as organic resin or silica coated with a metal material can be used. It is preferable to use nickel or gold as the metal material, as this can reduce the contact resistance. It uses particles coated with layers of two or more metal materials, such as nickel coated with gold. It is preferable that the connector 243 is made of a material that undergoes elastic or plastic deformation. In this case, the connectors 243, which are conductive particles, are preferably arranged as shown in FIG. In this way, the connector 243 and the electrical This increases the contact area with the conductive layer that is directly connected, reducing contact resistance and preventing connection failures. The occurrence of defects can be suppressed.

[0234] The connector 243 is preferably disposed so as to be covered with the adhesive layer 141. For example, The connecting bodies 243 may be dispersed in the previous adhesive layer 141 .

[0235] The light emitting element 170 may be, for example, an OLED (Organic Light Emitting Diode). g Diode), LED(Light Emitting Diode), QLED( Self-luminous, such as quantum-dot light-emitting diodes The light emitting element can be used.

[0236] Instead of the light-emitting display element, a transmissive liquid crystal element may be used. When using it, the characteristics of the colored layer and backlight are adjusted to obtain peak wavelength, half width, etc. Which should be set?

[0237] The light-emitting element 170 described in this embodiment is a bottom-emission light-emitting element. The element 170 is formed by stacking an electrode 191, an EL layer 192, and an electrode 193 in this order from the insulating layer 220 side. The electrode 191 is connected to the insulating layer 214 through an opening formed in the insulating layer 214. The transistor 205 is connected to the conductive layer 222b. The insulating layer 216 covers the end of the electrode 191. The electrode 193 contains a material that reflects visible light, and the electrode 191 contains a material that transmits visible light. An insulating layer 194 is provided to cover the electrode 193. The light emitted from the light-emitting element 170 is , the colored layer 134, the insulating layer 220, the opening 451, the electrode 245a, etc., to the substrate 361 side. It is ejected.

[0238] The light emitting element 170 emits white light. The liquid crystal element 180 and the light emitting element 170 form a pixel. Therefore, by changing the color of the colored layer, various colors can be displayed. A color display can be performed by using the liquid crystal element 180 and the colored layer. The liquid crystal display device 10 can display colors by using the light-emitting element 170 and colored layers.

[0239] A coloring element that is combined with the light emitting element 170 and the liquid crystal element 180 to realize a color display. The layer colors are not only a combination of red, green, and blue, but also a combination of yellow, cyan, and magenta. For example, the colors of the colored layers combined with the light emitting elements 170 may be red, green, and blue, and the liquid crystal The color of the color layer combined with the element 180 may be cyan, magenta, or yellow. The color of the colored layer may be appropriately selected depending on the purpose or application.

[0240] Transistor 201, transistor 203, transistor 205, and transistor 2 06 are all formed on the surface of the insulating layer 220 facing the substrate 351. The resistor can be fabricated using the same process.

[0241] The transistor 203 is a transistor (switching The transistor 205 is a light-emitting transistor. This is a transistor (also called a drive transistor) that controls the current flowing through the element 170.

[0242] On the substrate 351 side of the insulating layer 220, there are insulating layers 211, 212, 213, and The insulating layer 211 has a portion that is the gate of each transistor. The insulating layer 212 functions as a gate insulating layer. The insulating layer 212 is provided to cover the transistor 206 and the like. The insulating layer 213 is provided to cover the transistor 205 and the like. The number of insulating layers covering the transistor is not limited, and a single layer may be used. There may be one or more layers.

[0243] At least one insulating layer covering each transistor is designed to prevent impurities such as water and hydrogen from diffusing. It is preferable to use a material that can make the insulating layer function as a barrier film. By adopting such a structure, impurities are prevented from diffusing into the transistor from the outside. This makes it possible to effectively suppress the above-mentioned problems, thereby realizing a highly reliable display device.

[0244] Transistor 201, transistor 203, transistor 205, and transistor 2 06 is a conductive layer 221a functioning as a gate, an insulating layer 2106 functioning as a gate insulating layer, 1. Conductive layers 222a and 222b functioning as a source and a drain; and 234. In this example, the same conductive film is processed into a plurality of layers. The same hatching pattern is used.

[0245] The transistors 201 and 205 are connected to the transistors 203 and 205. In addition to the structure of the gate 206, the semiconductor device has a conductive layer 223 that functions as a gate.

[0246] The transistor 201 and the transistor 205 have two semiconductor layers in which channels are formed. The transistor is sandwiched between two gates. The threshold voltage of the transistor can be controlled by connecting the two gates and applying the same signal to them. Such a transistor may be driven by supplying a It is possible to increase the field effect mobility compared to conventional transistors, and increase the on-current. As a result, a circuit capable of high-speed operation can be fabricated. By using a transistor with a large on-current, it is possible to reduce the area occupied by the Even if the number of wires increases when the display device is made larger or higher resolution, This makes it possible to reduce signal delays and suppress display unevenness.

[0247] Alternatively, a potential for controlling the threshold voltage is applied to one of the two gates, and a drive voltage is applied to the other. By applying a potential for the transistor, the threshold voltage of the transistor can be controlled.

[0248] There is no limitation on the structure of the transistors included in the display device. The transistors in the display area 231 may have the same structure or different structures. The plurality of transistors included in the circuit 233 may all have the same structure. The display area 231 may have the following structures: The multiple transistors may all have the same structure, or may be a combination of two or more types of structures. It may also be used.

[0249] The conductive layer 223 is preferably made of a conductive material containing an oxide. When forming the conductive film, the insulating layer 212 is formed in an oxygen-containing atmosphere. The ratio of oxygen gas in the deposition gas is set to a range of 90% to 100%. The oxygen supplied to the insulating layer 212 is preferably supplied to the semiconductor layer 23 by a subsequent heat treatment. 4, oxygen vacancies in the semiconductor layer 234 can be reduced.

[0250] In particular, it is preferable to use a low-resistance oxide semiconductor for the conductive layer 223. It is preferable to use an insulating film that releases hydrogen, such as a silicon nitride film, for the insulating layer 213. During the formation of the insulating layer 213 or by a subsequent heat treatment, hydrogen is provided in the conductive layer 223. This effectively reduces the electrical resistance of the conductive layer 223.

[0251] The colored layer 134 is provided in contact with the insulating layer 213. It's covered.

[0252] A connection portion 204 is provided in the area where the substrate 351 and the substrate 361 do not overlap. In 204, the wiring 365 is electrically connected to the FPC 372 via the connection layer 242. The connection part 204 has the same structure as the connection part 207. The upper surface of the connection part 204 is The conductive layer obtained by processing the same conductive film as 245a is exposed. 204 and the FPC 372 can be electrically connected via a connection layer 242.

[0253] The polarizing plate 135 disposed on the outer surface of the substrate 361 may be a linear polarizing plate, but a circular polarizing plate may also be used. A circular polarizer can also be used. For example, a linear polarizer and a quarter-wave retarder can be used. This can suppress reflection of external light. In addition, depending on the type of polarizer, the cell gap, orientation, The desired contrast can be achieved by adjusting the driving voltage and the like.

[0254] In addition, functional members such as various optical members can be disposed on the outside of the substrate 361. Optical components include polarizing plates, retardation plates, light diffusion layers (such as diffusion films), anti-reflection layers, and By using an anti-reflection layer, the surface of the display device can be The reflectance of external light from the optical member is preferably less than 1%, and more preferably less than 0.3%. Functional components include an antistatic layer that prevents dust from adhering, and water-repellent properties that make it difficult for dirt to adhere. and a hard coat layer that prevents scratches from occurring during use.

[0255] The liquid crystal element 180 may be, for example, a vertical alignment (VA) liquid crystal element. A liquid crystal element in which the MV mode is applied can be used. A (Multi-Domain Vertical Alignment) mode, PV A(Patterned Vertical Alignment) mode, ASV(A Advanced Super View mode can be used.

[0256] The liquid crystal element 180 can be a liquid crystal element to which various modes are applied. For example, In addition to the VA mode, there are also TN (Twisted Nematic) and IPS (In- Plane-Switching mode, FFS (Fringe Field Switching) mode tching) mode, ASM(Axially Symmetric aligned) Micro-cell mode, OCB (Optically Compensated) d Birefringence mode, FLC (Ferroelectric Li quid Crystal) mode, AFLC(AntiFerroelectric) mode Liquid crystal element that applies liquid crystal mode, guest-host mode, etc. can be used.

[0257] A liquid crystal element is an element that controls the transmission or non-transmission of light by the optical modulation action of liquid crystals. The optical modulation effect of liquid crystals is determined by the electric field applied to the liquid crystal (horizontal electric field, vertical electric field or oblique electric field). The liquid crystal used in the liquid crystal element is thermotropic. Low molecular weight liquid crystal, high molecular weight liquid crystal, polymer dispersed liquid crystal (PDLC) Dispersed Liquid Crystal), ferroelectric liquid crystal, antiferroelectric liquid crystal, etc. These liquid crystal materials can be used in various phases, such as cholesteric phase, smectic phase, etc. These phases include cubic phase, chiral nematic phase, and isotropic phase.

[0258] The liquid crystal material may be either a positive type liquid crystal or a negative type liquid crystal. The optimum liquid crystal material should be selected depending on the mode and design.

[0259] An alignment film can be provided to control the alignment of the liquid crystal. In this case, a liquid crystal that exhibits a blue phase without using an alignment film may be used. When the temperature of cholesteric liquid crystal is increased, the phase immediately transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range, so the temperature range needs to be improved. To achieve this, a liquid crystal composition containing several weight percent or more of a chiral agent is used. A liquid crystal composition containing a liquid crystal exhibiting the above formula and a chiral agent has a short response time and is optically isotropic. Furthermore, a liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent does not require alignment treatment, The viewing angle dependency is small. Also, since there is no need to provide an alignment film, rubbing treatment is also unnecessary. Therefore, electrostatic damage caused by the rubbing process can be prevented. This can reduce defects and damage to the liquid crystal display device.

[0260] When a reflective liquid crystal element is used, a polarizing plate 135 is provided on the display surface side. In addition, it is preferable to place a light diffusion plate on the display surface side, since this improves visibility.

[0261] If a guest-host mode liquid crystal element is used, the polarizing plate 135 can be eliminated. Cut.

[0262] A front light may be provided outside the polarizing plate 135. The front light may be: It is preferable to use an edge-lit front light. Using a front light with a lit diode reduces power consumption. This is preferable.

[0263] The adhesive layer may be a photo-curable adhesive such as an ultraviolet curable adhesive, a reaction-curable adhesive, or a heat-curable adhesive. Various curing adhesives such as elastomeric adhesives and anaerobic adhesives can be used. epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide Resin, PVC (Polyvinyl Chloride) Resin, PVB (Polyvinyl Butyral) Resin, EV A (ethylene vinyl acetate) resins, etc. In particular, epoxy resins, etc., which have high moisture permeability, A material with low viscosity is preferable. Two-component resin may also be used. An adhesive sheet or the like may also be used. It's fine.

[0264] The connection layer 242 is made of an anisotropic conductive film (ACF). Conductive Film), Anisotropic Conductive Paste (ACP) Conductive Paste) can be used.

[0265] The light emitting element 170 may be a top emission type, a bottom emission type, a dual emission type, or a The electrode on the light extraction side uses a conductive film that transmits visible light. For the electrode on the side from which light is not extracted, it is preferable to use a conductive film that reflects visible light.

[0266] The EL layer 192 has at least a light-emitting layer. The EL layer 192 has a positive electrode as a layer other than the light-emitting layer. Highly hole-injecting materials, highly hole-transporting materials, hole-blocking materials, highly electron-transporting materials a material with high electron injection properties or a bipolar material (a material with high electron transport properties and hole transport properties) The layer may further include a layer containing a material such as a fluorine-containing material.

[0267] The light emitting element 170 emits light in a variety of colors, including white, red, green, blue, and shimmer, depending on the material that makes up the EL layer 192. It can be changed to brown, magenta, or yellow.

[0268] As a method for realizing a color display, a light emitting element 170 that emits white light and a colored layer are combined. and a method in which light emitting elements 170 that emit different colors of light are provided for each sub-pixel. In other words, the latter method requires a EL layer for each subpixel. Since it is necessary to separately produce 192, this method is less productive than the former method. The method can obtain a luminescent color with higher color purity than the former method. By providing the light emitting element 170 with a microcavity structure, color purity can be further improved. It is possible.

[0269] The EL layer 192 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 192 may each be formed by a vapor deposition method (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0270] The EL layer 192 may include inorganic compounds such as quantum dots. When used in the light-emitting layer, it can also function as a light-emitting material.

[0271] [substrate] There is no particular limitation on the materials used for the substrate 351 and the substrate 361. The decision should be made taking into consideration the presence or absence of barium and the heat resistance required to withstand heat treatment. Glass substrates such as borosilicate glass and aluminoborosilicate glass, ceramic substrates, and quartz The substrate 271 may be a semiconductor substrate, a sapphire substrate, or the like. , flexible substrates, laminated films, base films, etc. good.

[0272] The semiconductor substrate may be a semiconductor made of silicon or germanium. Substrate, or silicon carbide, silicon germanium, gallium arsenide, indium phosphide, There are also compound semiconductor substrates made of zinc oxide or gallium oxide. The solid substrate may be a single crystal semiconductor or a polycrystalline semiconductor.

[0273] In order to increase the flexibility of the display device 110, the substrate 351 and the substrate 361 are made of flexible substrates. It is preferable to use a plate (flexible substrate), a laminated film, a base film, etc. stomach.

[0274] Examples of materials for flexible substrates, laminating films, and base films include polyethylene. polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether Polypropylene (PES), Polytetrafluoroethylene (PTFE), Polypropylene, Poly Ester, polyvinyl fluoride, polyvinyl chloride, polyolefin, polyamide (nylon , aramid, etc.), polyimide, polycarbonate, aramid, epoxy resin, acrylic Resins and the like can be used.

[0275] By using the above materials for the substrate, a lightweight display device can be provided. By using the above materials as the substrate, it is possible to provide a display device that is resistant to impacts. Furthermore, by using the above material as the substrate, it is possible to provide a display device that is less susceptible to damage. can be done.

[0276] The lower the linear expansion coefficient of the flexible substrate used for the substrate 351 and the substrate 361, the less deformation caused by the environment. The flexible substrate used for the substrate 351 and the substrate 361 is preferably a wire substrate. Expansion rate is 1×10 -3 / K or less, 5×10 -5 / K or less, or 1×10 -5 / K or less Aramid is particularly suitable as a flexible substrate because of its low linear expansion coefficient. It is suitable.

[0277] [Conductive layer] In addition to the gate, source, and drain of the transistor, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, and the like. , nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten These materials include metals such as tin and tin alloys, and alloys that contain these as their main components. The film containing the compound can be used as a single layer or as a laminate structure.

[0278] Examples of the light-transmitting conductive material include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as gallium zinc oxide, zinc oxide, and gallium-doped zinc oxide or gallium-doped zinc oxide Alternatively, gold, silver, platinum, magnesium, nickel, titanium Gold, such as copper, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium Metallic materials and alloy materials containing such metallic materials can be used. Alternatively, nitrided metallic materials can be used. It is also possible to use a metal material, an alloy material (or the like). When using a material such as a nitride, it is sufficient to make it thin enough to have light transmission properties. For example, a laminated film of an alloy of silver and magnesium and an indium alloy can be used as the conductive layer. It is preferable to use a laminated film of tungsten oxide or the like, since this can increase the conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive layers of the display element. The conductive layer may also be used as a pixel electrode or a common electrode.

[0279] [Insulating layer] Examples of insulating materials that can be used for each insulating layer include acrylic resin and epoxy resin. Resin materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, Examples of the insulating material include inorganic insulating materials such as aluminum oxide.

[0280] [Colored layer] Materials that can be used for the coloring layer include metal materials, resin materials, pigments, and dyes. Examples of such materials include resin materials.

[0281] [Light blocking layer] Materials that can be used for the light-shielding layer include carbon black, titanium black, gold, Examples of the light-shielding layer include metals, metal oxides, and composite oxides including solid solutions of multiple metal oxides. The film may be a film containing a resin material, or may be a thin film made of an inorganic material such as a metal. For example, a laminated film of a film containing a material of a colored layer may be used as the light-shielding layer. A film containing a material used for a color layer that transmits light of a certain color and a material used for a color layer that transmits light of another color are used. By using the same material for the colored layer and the light-shielding layer, This is preferable because it allows the equipment to be standardized and the process to be simplified.

[0282] [Configuration example 2] The display device 110A shown in FIG. 23 includes a transistor 201, a transistor 203, and a transistor 205 and 206, and transistors 281 and 282 are not included. 84, transistor 285, and transistor 286. Different from 0.

[0283] 23, the positions of the insulating layer 138 and the connecting portion 207 are also different from those in FIG. The insulating layer 138 is disposed on the edge of the colored layer 131. The insulating layer 138 is disposed so as to overlap the end of the light-shielding layer 132. As shown, the insulating layer is disposed in a portion that does not overlap with the display area (a portion that overlaps with the light-shielding layer 132). Good too.

[0284] The display device has two transistors, such as transistor 284 and transistor 285. The transistors may be partially stacked, thereby reducing the area occupied by the pixel circuit. Since it is possible to reduce the size, the definition can be increased. The area can be increased, and the aperture ratio can be improved. The light emitting element 170 has a high aperture ratio. This allows the current density required to obtain the required brightness to be reduced, thereby improving reliability.

[0285] The transistor 281, the transistor 284, and the transistor 286 are connected to the conductive layer 221. a, an insulating layer 211, a semiconductor layer 234, a conductive layer 222a, and a conductive layer 222b. The conductive layer 221a overlaps with the semiconductor layer 234 with the insulating layer 211 interposed therebetween. The conductive layer 222b is electrically connected to the semiconductor layer 234. The conductive layer 223 is provided.

[0286] The transistor 285 includes a conductive layer 222b, an insulating layer 217, a semiconductor layer 261, and a conductive layer 223. , insulating layer 212, insulating layer 213, conductive layer 263a, and conductive layer 263b. The layer 222b overlaps with the semiconductor layer 261 via the insulating layer 217. The conductive layer 263a and the insulating layer 212 overlap with the semiconductor layer 261 through the insulating layer 213. The layer 263b is electrically connected to the semiconductor layer 261.

[0287] The conductive layer 221a functions as a gate. The insulating layer 211 functions as a gate insulating layer. The conductive layer 222a functions as either a source or a drain. The conductive layer 222b included in the transistor 222 functions as the other of the source and the drain.

[0288] The conductive layer 222b shared by the transistors 284 and 285 is The portion that functions as the other of the source or drain of the transistor 284 and the gate of the transistor 285 The insulating layer 217, the insulating layer 212, and the insulating layer 213 have a portion that functions as a gate. One of the conductive layer 263a and the conductive layer 263b functions as a gate insulating layer. The conductive layer 221 functions as a gate and the other functions as a drain. do.

[0289] [Configuration Example 3] FIG. 24A shows a cross-sectional view of the display unit of the display device 110B.

[0290] The display device 110B differs from the display device 110 in that it does not have the colored layer 131. The other configuration is the same as that of the display device 110, and therefore detailed description thereof will be omitted.

[0291] The liquid crystal element 180 exhibits a white color. The liquid crystal display 180 can be used to display black and white or gray scale images.

[0292] [Configuration Example 4] In the display device 110C shown in FIG. 24(B), the EL layer 192 is painted for each luminescent color. The display device 110B differs from the display device 110B in that it does not have the colored layer 134. Since this is the same as the display device 110B, detailed description thereof will be omitted.

[0293] The light emitting element 170 to which the color-coded method is applied has at least one layer constituting the EL layer 192. It is sufficient if only one layer (typically the light-emitting layer) is painted separately, and all of the layers that make up the EL layer are It may be painted differently.

[0294] [Transistor] In one embodiment of the present invention, the structure of a transistor included in a display device is not particularly limited. For example, a planar type transistor or a staggered type transistor may be used. Alternatively, a top gate structure or a bottom gate structure may be used. Alternatively, gate electrodes may be provided above and below the channel. may be provided.

[0295] When one of the gate electrodes provided above and below the channel is referred to as a "gate electrode," the other The gate electrode on one side of the channel is called the "back gate electrode." When the gate is called the "gate," the other is called the "back gate." It is sometimes called a "front gate electrode." Similarly, the gate is sometimes called a "front gate." This is sometimes the case.

[0296] By providing a gate electrode and a back gate electrode, the semiconductor layer of the transistor is The electric field generated from the back gate electrode and the electric field generated from the back gate electrode can electrically surround the The electric field generated by the gate electrode and back gate electrode forms a channel. The structure of a transistor that electrically surrounds the semiconductor layer is called a surrounded channel. This can be called an l (S-channel) structure.

[0297] The back gate electrode can function in the same way as the gate electrode. The potential may be the same as that of the gate electrode, or may be the ground potential or any other potential. By changing the potential of the back gate electrode independently of the gate electrode, The threshold voltage of the transistor can be changed.

[0298] By providing a gate electrode and a back gate electrode, and by setting both to the same potential, In the conductor layer, the area in which carriers flow is larger in the film thickness direction, so As a result, the on-current of the transistor increases and the field effect The mobility increases.

[0299] Therefore, the transistor is designed to have a large on-current relative to the area it occupies. In other words, the area occupied by the transistor can be reduced relative to the required on-current. Therefore, a highly integrated semiconductor device can be realized.

[0300] In addition, since the gate electrode and back gate electrode are formed from a conductive layer, they can be The function of preventing the electric field generated from acting on the semiconductor layer where the channel is formed (especially static electricity In plan view, the back gate electrode is The back gate electrode is formed larger than the semiconductor layer, and the semiconductor layer is covered with the back gate electrode, improving the electric field shielding function. It can be done.

[0301] The gate electrode and back gate electrode each have the function of shielding an external electric field. Therefore, charges such as charged particles generated above and below the transistor form a channel in the semiconductor layer. As a result, stress tests (e.g., applying a negative voltage to the gate) BT (Negative Gate Bias-Temperature) stress test (also called "NBT" or "NBTS")) deterioration is suppressed. The back gate electrode blocks the electric field generated by the drain electrode from acting on the semiconductor layer. Therefore, the rise voltage of the on-current caused by the fluctuation of the drain voltage can be This effect can be suppressed by the gate electrode and the back gate electrode. This is particularly noticeable when a potential is applied to the

[0302] In addition, a transistor having a back gate electrode is a PGBT in which a positive voltage is applied to the gate. (Positive Gate Bias-Temperature) Stress Test (" The variation in threshold voltage before and after the PBT or PBTS process is also due to the backgain. It is smaller than a transistor without a gate electrode.

[0303] Note that BT stress tests such as NGBT and PGBT are types of accelerated tests and are used for long periods of time. It is possible to quickly evaluate the change in transistor characteristics (aging) that occurs during use. In particular, the amount of change in the threshold voltage of a transistor before and after the BT stress test is This is an important index for investigating the reliability of the device. The smaller the amount of variation, the more reliable the transistor.

[0304] In addition, by providing a gate electrode and a back gate electrode and setting both to the same potential, This reduces the amount of fluctuation in the high voltage. At the same time, the fluctuation is reduced.

[0305] In addition, when light is incident from the back gate electrode side, the back gate electrode is By forming the semiconductor layer from a conductive film, light is prevented from entering the semiconductor layer from the back gate electrode side. This prevents light degradation of the semiconductor layer and shifts the threshold voltage of the transistor. This can prevent deterioration of electrical characteristics such as

[0306] [Semiconductor materials] The crystallinity of the semiconductor material used in the transistor is not particularly limited, and amorphous semiconductor Semiconductors with crystallinity (microcrystalline semiconductors, polycrystalline semiconductors, single crystal semiconductors, or partially When a semiconductor having crystallinity is used, This is preferable because it can suppress the deterioration of the transistor characteristics.

[0307] For example, amorphous silicon and microcrystalline germanium are used as semiconductor materials for transistors. Silicon carbide, gallium arsenide, metal oxides, nitride semiconductors, etc. can also be used. Compound semiconductors such as conductors, organic semiconductors, etc. can be used.

[0308] In addition, an oxide semiconductor, which is a type of metal oxide, is used as the semiconductor material for the transistor. Typically, an oxide semiconductor containing indium or the like can be used.

[0309] In particular, semiconductor materials with a wider band gap and lower carrier density than silicon are used. This reduces the current flowing between the source and drain of the transistor when it is off. Therefore, it is preferable.

[0310] The semiconductor layer may be, for example, at least indium, zinc, and M (aluminum, titanium, gallium). Sm, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium It includes a film expressed as In-M-Zn oxide containing metals such as aluminum or hafnium. Furthermore, it is preferable to reduce variations in electrical characteristics of transistors using the oxide semiconductor. Therefore, it is preferable to include a stabilizer therewith.

[0311] The stabilizer includes the metals listed above under M, such as gallium, tin, hafnium, etc. Other stabilizers include sulphur, aluminium and zirconium. , the lanthanides lanthanum, cerium, praseodymium, neodymium, samarium, Uropium, gadolinium, terbium, dysprosium, holmium, erbium, Examples include rhenium, ytterbium, and lutetium.

[0312] Examples of oxide semiconductors that form the semiconductor layer include In-Ga-Zn oxides, In-A l-Zn oxide, In-Sn-Zn oxide, In-Hf-Zn oxide, In-La -Zn-based oxides, In-Ce-Zn-based oxides, In-Pr-Zn-based oxides, In-Nd- Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn-based oxide, In-Gd-Z n-based oxides, In-Tb-Zn-based oxides, In-Dy-Zn-based oxides, In-Ho-Zn In-Er-Zn oxide, In-Tm-Zn oxide, In-Yb-Zn oxide Oxide, In-Lu-Zn ​​oxide, In-Sn-Ga-Zn oxide, In-Hf-G a-Zn oxide, In-Al-Ga-Zn oxide, In-Sn-Al-Zn oxide In-Sn-Hf-Zn oxides and In-Hf-Al-Zn oxides can be used. Cut.

[0313] Here, the In-Ga-Zn oxide is a material containing In, Ga, and Zn as main components. It means oxide, and the ratio of In, Ga, and Zn does not matter. Other metal elements may also be included.

[0314] This embodiment mode can be implemented by appropriately combining with the configurations described in other embodiment modes. It is possible.

[0315] (Embodiment 5) Examples of electronic devices that can use the display device according to one embodiment of the present invention include televisions and monitors. Any display device, personal computer, image storage device or image reproduction device with recording medium Devices, mobile phones, portable game consoles, portable data terminals, e-book terminals, video cameras , cameras such as digital still cameras, goggle-type displays (head-mounted displays) Ray), navigation systems, sound reproduction devices (car audio, digital audio players, etc.), copiers, facsimiles, printers, printer-combined machines, automated teller machines Examples include ATMs and vending machines.

[0316] FIG. 25(A) shows a portable game machine, which includes a housing 5311a, a housing 5311b, a hinge 531 3a, a hinge 5313b, a display unit 5314, operation keys 5315, a camera 5316, etc. The display device of one embodiment of the present invention can be used for the display portion 5314. The hinge 5313a and the hinge 5313b are flexible and can be folded around the hinge 5313a and the hinge 5313b. In addition, a touch sensor is provided on the display portion 5314, and a stylus 5317 or the like can be used. The display device of one embodiment of the present invention is used for the display portion 5314. By doing so, portability can be enhanced. Also, visibility can be enhanced. Also, power consumption can be reduced.

[0317] FIG. 25(B) is a tablet personal computer, and includes a housing 5301a, a housing 5 301b, a display unit 5303, an optical sensor 5304, a switch 5306, etc. The display unit 5 303 is supported by the housing 5301a and the housing 5301b. And, since the display unit 5303 is formed using a flexible substrate, it has the function of being able to bend its shape flexibly. By changing the angle between the housing 5301a and the housing 5301b at the hinges 53 07a and 5307b, the display unit 5303 can be folded so that the housing 5301a and the housing 5301b overlap. Although not shown, an open / close sensor may be incorporated and the change in the above angle may be used as information on usage conditions in the display unit 5303, which is also good. By using the display device according to one aspect of the present invention for the display unit 5303, portability can be enhanced. Also, visibility can be enhanced. Also, power consumption can be reduced.

[0318] This embodiment can be implemented in appropriate combination with the configurations described in other embodiments and the like.

[0319] (Embodiment 6) <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cloud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0320] In this specification and the like, a metal oxide refers to a metal in a broad expression.​​​​​​​ Metal oxides are oxides. Metal oxides are oxide insulators and oxide conductors (including transparent oxide conductors). , oxide semiconductors (also called "OS"), For example, when a metal oxide is used in the active layer of a transistor, the metal oxide In other words, when describing an OS FET, In other words, the transistor can be a transistor including a metal oxide or an oxide semiconductor.

[0321] In this specification, the metal oxide has a region having a function of a conductor and a region having a function of a dielectric. When the metal oxide as a whole functions as a semiconductor, it is called a CAC (Cloud-Acid-Conducting Coupling) phenomenon. Aligned Composite)-OS(Oxide Semiconducto r), or CAC-metal oxide.

[0322] In other words, CAC-OS is a type of oxide semiconductor in which the elements constituting the oxide semiconductor are separated by a distance of 0.5 nm or more. 0 nm or less, preferably 0.5 nm to 3 nm or less, or the size thereof is unevenly distributed. In the following, in the oxide semiconductor, one or more The element is unevenly distributed, and the region containing the element has an area of ​​0.5 nm to 10 nm, preferably 0 A mixture of particles with sizes between 0.5nm and 3nm or close to that size is called a mosaic, or Also called patchy.

[0323] The physical properties of the region where a specific element is unevenly distributed are determined by the properties of the element. For example, In this region, elements that tend to be insulating among the elements that make up metal oxides are concentrated. On the other hand, among the elements that make up metal oxides, the The region where the element with the tendency is unevenly distributed becomes a conductive region. The regions are mixed in a mosaic pattern, and the material functions as a semiconductor.

[0324] That is, the metal oxide in one embodiment of the present invention is a matrix in which materials with different physical properties are mixed. matrix composite, or metal matrix composite (metal matrix composite).

[0325] Note that the oxide semiconductor preferably contains at least indium. In addition to these, it is preferable to contain an element M (M is gallium, aluminum, etc.). Aluminum, Silicon, Boron, Yttrium, Copper, Vanadium, Beryllium, Titanium, Iron , nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium , hafnium, tantalum, tungsten, magnesium, or The compound may contain one or more types of hydroxybenzoates.

[0326] For example, CAC-OS made of In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OS) α-Zn oxide may be specifically referred to as CAC-IGZO. (Hereinafter, InO X1 (X1 is a real number greater than 0) or indium zinc oxide compound (hereinafter referred to as In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (hereinafter referred to as GaO X3 (X3 is a real number greater than 0) . ), or gallium zinc oxide (Ga X4 Zn Y4 OZ4 (X4, Y4, and Z4 is a real number greater than 0.) The material is separated into two parts, forming a mosaic pattern. Mosaic InO X1 , or In X2 Zn Y2 O Z2 is uniformly distributed in the film This is a cloud-like configuration (hereinafter also referred to as "cloud-like").

[0327] In other words, CAC-OS is X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 A composite oxide semiconductor having a structure in which a region in which In this specification, for example, the atomic ratio of In to the element M in the first region is is greater than the atomic ratio of In to the element M in the second region. Compared to region 2, the concentration of In is higher.

[0328] IGZO is a common name and refers to a compound of In, Ga, Zn, and O. A typical example is InGaO3(ZnO) m1 (m1 is a natural number), or In ( 1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number) Examples of such crystalline compounds include:

[0329] The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a structure in which multiple IGZO nanocrystals have a c-axis orientation and are aligned in the ab plane. is a non-oriented connected crystal structure.

[0330] On the one hand, CAC-OS relates to the material composition of an oxide semiconductor. CAC-OS refers to a material composition containing In, G a, Zn, and O, in which nanoparticle-like regions with Ga as the main component are observed in part, and nanoparticle-like regions with In as the main component are observed in part, each being randomly dispersed in a mosaic pattern. Therefore, in CAC-OS, the crystal structure is a secondary element.

[0331] Note that CAC-OS does not include a laminated structure of two or more types of films with different compositions. For example, a structure composed of two layers, a film with In as the main component and a film with Ga as the main component, is not included.

[0332] Note that in some cases, no clear boundary can be observed between the region where GaO X3 is the main component and the region where In X2 Zn Y2 O Z2 , or InO X1 is the main component.

[0333] Note that when one or more selected from aluminum, silicon, boron, yttrium, copper, vanadium dium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum , lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium ium, etc. are included instead of gallium, CAC-OS refers to a structure in which nanoparticle-like regions with the element as the main component are observed in part, and nanoparticle-like regions with In as the main component are observed in part, each being randomly dispersed in a mosaic pattern.

[0334] <Analysis of CAC-OS> Subsequently, as a result of measuring the oxide semiconductor formed on the substrate using various measurement methods ​​​This article explains:

[0335] [Sample configuration and preparation method] Nine samples according to one embodiment of the present invention are described below. Each sample is The substrate temperature and oxygen gas flow rate ratio during film formation of the nitride semiconductor are varied. The sample has a structure including a substrate and an oxide semiconductor on the substrate.

[0336] The method for preparing each sample will be explained below.

[0337] First, a glass substrate is used as the substrate. Then, a sputtering device is used to deposit the glass A 100 nm thick In-Ga-Zn oxide film was formed on the substrate as an oxide semiconductor. The film conditions were a pressure in the chamber of 0.6 Pa, and an oxide target ( In:Ga:Zn=4:2:4.1 [atomic ratio]) is used. An AC power of 2500 W is supplied to an oxide target placed inside the furnace.

[0338] As a condition for forming an oxide film, the substrate temperature is set to a temperature at which the substrate is not intentionally heated (hereinafter, Also called room temperature or RT.) 130 °C, or 170 °C. Also, Ar and oxygen The flow rate ratio of oxygen gas to the mixed gas (hereinafter also referred to as oxygen gas flow rate ratio) is 10%, Nine samples are prepared by setting the ratio at 30% or 100%.

[0339] [X-ray diffraction analysis] In this section, X-ray diffraction (XRD) was performed on nine samples. The results of the measurements will be explained below. The XRD equipment used was a Bruker D 8 ADVANCE was used. The conditions were θ / 2 In θ scan, the scanning range is 15° to 50°, and the step width is 0.02 deg. g., and the scanning speed was 3.0 deg. / min.

[0340] FIG. 26 shows the results of measuring the XRD spectrum using the out-of-plane method. In addition, in FIG. 26, the upper part shows the measurement results for a sample where the substrate temperature during film formation was 170°C. As a result, the middle row shows the measurement results for a sample with a substrate temperature of 130°C during film formation, and the bottom row shows the measurement results for a sample with a substrate temperature of 130°C during film formation. The left column shows the measurement results for samples with a substrate temperature of RT. The center column shows the measurement results for the sample with a flow rate ratio of 10%. The center column shows the measurement results for the sample with a flow rate ratio of 3%. The right column shows the measurement results for the sample with a 0% oxygen gas flow rate, and the right column shows the measurement results for the sample with a 100% oxygen gas flow rate. The measurement results are shown below.

[0341] The XRD spectrum shown in FIG. 26 shows that the increase in the substrate temperature during film formation or the decrease in the amount of oxygen during film formation Increasing the gas flow rate ratio increases the peak intensity around 2θ=31°. The peak at 2θ=31° indicates that the c-axis is oriented in the direction approximately perpendicular to the surface on which the film is formed or the upper surface. crystalline IGZO compound (CAAC(c-axis aligned crystall It is also called ine)-IGZO. ) is known to be derived from the fact that

[0342] In addition, the XRD spectrum shown in FIG. 26 shows that the substrate temperature during film formation was low or the oxygen gas flow The smaller the ratio of the amount of SiO2, the less clear the peak. Alternatively, the sample with a small oxygen gas flow rate may have ab-plane and c-axis orientations in the measurement area. It turns out that it cannot be seen.

[0343] [Electron microscope analysis] In this section, the samples were prepared at a substrate temperature of RT during film formation and an oxygen gas flow rate of 10%. ,HAADF(High-Angle Annular Dark Field)-ST EM(Scanning Transmission Electron Micros) The results of the observation and analysis using HAADF-S are described below (hereafter referred to as HAADF-S). Images obtained by TEM are also called TEM images.

[0344] Planar images obtained by HAADF-STEM (hereinafter also referred to as planar TEM images), and The results of image analysis of the cross-sectional images (hereinafter also referred to as cross-sectional TEM images) will be described below. The TEM images were observed using a spherical aberration correction function. The atomic resolution analytical electron microscope JEM-ARM200F manufactured by JEOL Ltd. was used for the photographs. The electron beam was irradiated at an acceleration voltage of 200 kV with a beam diameter of approximately 0.1 nmφ.

[0345] FIG. 27(A) shows the results of a sample prepared at a substrate temperature of RT during film formation and an oxygen gas flow rate of 10%. Fig. 27(B) shows the substrate temperature RT and oxygen gas concentration during film formation. This is a cross-sectional TEM image of a sample prepared at a flow rate ratio of 10%.

[0346] [Analysis of electron diffraction patterns] In this section, the sample was prepared at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. By irradiating an electron beam with a probe diameter of 1 nm (also called a nano-beam electron beam), The results of the X-ray diffraction pattern obtained will be explained below.

[0347] As shown in FIG. 27(A), the film was formed at a substrate temperature of RT and an oxygen gas flow rate of 10%. In the planar TEM image of the sample, black spots a1, a2, a3, a4, and The electron beam diffraction pattern shown in a5 is observed. While irradiating the light, move the light at a constant speed from the 0-second position to the 35-second position. The results for black point a1 are shown in Figure 27(C), the results for black point a2 are shown in Figure 27(D), and the results for black point a3 are shown in Figure 27( The results for black point a4 are shown in Figure 27(F), and the results for black point a5 are shown in Figure 27(G).

[0348] From Figure 27(C), Figure 27(D), Figure 27(E), Figure 27(F), and Figure 27(G), A bright area can be observed in a circular (ring-like) pattern. Several spots can be observed.

[0349] In addition, as shown in FIG. 27(B), when the substrate temperature during film formation is RT and the oxygen gas flow rate ratio is 10%, In the cross-sectional TEM image of the prepared sample, black spots b1, b2, b3, b4, and The electron diffraction patterns indicated by black spots b1 and b5 are shown in Figure 27(H). The results for black point b2 are shown in Figure 27(I), the results for black point b3 are shown in Figure 27(J), and the results for black point b4 are shown in Figure 27( The results for black point b5 are shown in Figure 27(L).

[0350] From Figure 27(H), Figure 27(I), Figure 27(J), Figure 27(K), and Figure 27(L), A ring-shaped area of ​​high brightness can be observed. Also, multiple spots can be observed in the ring-shaped area. can.

[0351] Here, for example, for a CAAC-OS having InGaZnO4 crystals, When an electron beam with a probe diameter of 300 nm is incident on the InGaZnO4 crystal, ) planes. It is clear that the film has a c-axis orientation, and the c-axis is oriented in a direction substantially perpendicular to the surface on which the film is formed or the upper surface. On the other hand, an electron beam with a probe diameter of 300 nm is incident perpendicularly to the sample surface. When the diffraction pattern is measured, a ring-shaped diffraction pattern is observed. It can be seen that the axes have no orientation.

[0352] In addition, oxide semiconductors having microcrystals (nano crystalline oxide semiconductor. Hereafter referred to as nc-OS.) For example, when electron diffraction is performed using an electron beam of 50 nm or more, a halo pattern is observed. In addition, a small probe diameter electron beam (e.g. When nanobeam electron diffraction is performed using a material with a thickness of less than 50 nm, bright spots are observed. In addition, when nanobeam electron diffraction is performed on nc-OS, a circular (ring-shaped) structure is observed. ) A bright area may be observed. In addition, multiple bright spots may be observed in a ring-shaped area. This may be the case.

[0353] The electron diffraction pattern of the sample prepared at the substrate temperature RT during film formation and with an oxygen gas flow rate of 10% The turn has a ring-shaped area of ​​high brightness and multiple bright spots in the ring area. The sample fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation was analyzed by electron beam diffraction. The pattern becomes nc-OS and has no orientation in the planar direction or cross-sectional direction. .

[0354] From the above, an oxide semiconductor formed at a low substrate temperature or a low oxygen gas flow rate ratio has the following properties: It is clearly different from both an oxide semiconductor film with an amorphous structure and an oxide semiconductor film with a single crystal structure. It can be assumed that it has the properties.

[0355] [Elemental analysis] In this article, we will discuss energy dispersive X-ray spectroscopy (EDX). EDX mapping was obtained and evaluated using X-ray spectroscopy. By this, the film was produced at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. The results of the elemental analysis of the sample are explained below. The EDX measurement was carried out using an elemental analyzer and The energy dispersive X-ray analyzer JED-2300T manufactured by JEOL Ltd. is used. A Si drift detector is used to detect the X-rays emitted from the sample.

[0356] In EDX measurement, each point in the analysis area of ​​the sample is irradiated with an electron beam, and the resulting The energy and frequency of characteristic X-rays of the material are measured, and an EDX spectrum corresponding to each point is obtained. In this embodiment, the peaks in the EDX spectrum at each point are determined as electron transitions to the L shell of the In atom. , electron transition to the K shell of Ga atom, electron transition to the K shell of Zn atom, and electron transition to the K shell of O atom The ratio of each atom at each point is calculated. By performing EDX analysis on a region, it is possible to obtain EDX mapping that shows the distribution of the ratio of each atom. This can be done.

[0357] Figure 28 shows the results of the sample fabricated at a substrate temperature of RT and an oxygen gas flow rate of 10% during film formation. FIG. 28(A) shows EDX mapping of Ga atoms ( The ratio of Ga atoms to all atoms is in the range of 1.18 to 18.64 [atomic%]. ) Figure 28(B) shows the EDX mapping of In atoms (the ratio of In atoms to all atoms). The ratio is in the range of 9.28 to 33.74 [atomic%]. C) EDX mapping of Zn atoms (ratio of Zn atoms to total atoms is 6.69 to 2.0). 4.99 [atomic%] range.) Also, Fig. 28(A) and Fig. 28(B) ), and Fig. 28(C) shows the results when the substrate temperature during film formation was RT and the oxygen gas flow rate ratio was 10%. The cross section of the prepared sample shows the same area. The more elements measured in the range, the brighter it becomes, and the less elements measured, the darker it becomes. The ratio of elements is shown by light and dark. The magnification of the EDX mapping shown in Figure 28 is 7.2 million. It's double.

[0358] In the EDX mapping shown in Figures 28(A), 28(B), and 28(C), the images show The relative distribution of light and dark is observed. The substrate temperature during film formation is RT, and the oxygen gas flow rate is 10%. In the sample prepared in step 1, it can be seen that each atom exists with its own distribution. , the area surrounded by the solid line and the area surrounded by the dashed line shown in Figures 28(A), 28(B), and 28(C) Pay attention to the range.

[0359] In Figure 28(A), the area enclosed by the solid line contains many relatively dark areas, and the area enclosed by the dashed line contains many relatively dark areas. , and contains many relatively bright areas. In addition, the area enclosed by the solid line in FIG. 28(B) is relatively The area surrounded by the dashed line contains many bright areas, while the area surrounded by the dashed line contains many relatively dark areas.

[0360] In other words, the area surrounded by the solid line is the area where the In atoms are relatively abundant, and the area surrounded by the dashed line is the area where the In atoms are relatively abundant. In FIG. 28(C), the area surrounded by the solid line is The right side is a relatively bright area, and the left side is a relatively dark area. The range is In X2 Zn Y2 O Z2 , or InO X1 This is the area where the main components are:

[0361] The area surrounded by the solid line is the area where the number of Ga atoms is relatively small, and the area surrounded by the dashed line is the area where the number of Ga atoms is relatively small. In Figure 28(C), the area surrounded by the dashed line is the upper left area. The area at the bottom right is a relatively bright area, and the area at the bottom right is a relatively dark area. The area enclosed by the line is GaO X3 , or Ga X4 Zn Y4 O Z4 In the area where the main components are be.

[0362] Also, from Figures 28(A), 28(B), and 28(C), the distribution of In atoms is The atoms are relatively uniformly distributed, and X1 The region where is the main component is In X2 Zn Y2 O Z2 It appears that they are connected to each other through the area where In this way, X2 Zn Y2 O Z2 , or InO X1 The area where is the main component is It is formed in a loud, spreading shape.

[0363] Thus, GaO X3 The region where In is the main component. X2 Zn Y2 O Z2 , or I nO X1 In-Ga-Zn The oxide can be referred to as CAC-OS.

[0364] The crystal structure of CAC-OS is an nc structure. The structure is IGZO, including single crystal, polycrystalline, and CAAC structures, in the electron diffraction pattern. In addition to the bright spot caused by the problem, there are several other bright spots. In addition to several bright spots, a ring-shaped area of ​​high brightness appears, indicating a crystal structure. The structure is defined.

[0365] Also, from Figures 28(A), 28(B), and 28(C), GaO X3 The main components are The region where In X2 Zn Y2 O Z2 , or InO X1 The size of the area where is the principal component The size of the grains observed is 0.5 nm to 10 nm, or 1 nm to 3 nm. Preferably, in EDX mapping, the diameter of the region where each element is the main component is 1 nm or more. The thickness should be 2 nm or less.

[0366] From the above, it can be seen that CAC-OS has a structure different from that of IGZO compounds in which metal elements are uniformly distributed. CAC-OS has properties different from those of IGZO compounds. X3 etc. The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 The area where is the principal component The phases are separated into two, and the regions containing each element as the main component are arranged in a mosaic pattern.

[0367] Here, In X2 Zn Y2 O Z2 , or InO X1The region where is the main component is GaO X3 This region has higher conductivity than the region where In is the main component. X2 Zn Y 2O Z2 , or InO X1 The carriers flow through the region where the main component is oxidized. Therefore, the conductivity of In is expressed as a semiconductor. X2 Zn Y2 O Z2 , or InO X The cloud-like distribution of the region where 1 is the main component in the oxide semiconductor results in a high field effect. Mobility (μ) can be achieved.

[0368] On the other hand, GaO X3 The region where the main components are In X2 Zn Y2 O Z2 , or InO X This region has higher insulating properties than the region where GaO is the main component. X3 etc. The distribution of the main component in the oxide semiconductor suppresses leakage current and provides good switching. Switching operation can be realized.

[0369] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation caused by In X2 Zn Y2 O Z2 , or InO X1 The conductivity caused by the This results in a high on-state current (I on ) and high field-effect mobility (μ) can be achieved. can.

[0370] Furthermore, semiconductor devices using CAC-OS are highly reliable. It is ideal for a variety of semiconductor devices, including displays.

[0371] This embodiment mode can be implemented by appropriately combining with the configurations described in other embodiment modes. It is possible. [Explanation of symbols]

[0372] 100 Electronic equipment 101 Case 102 Fasteners 103 Hinge 105 areas 106 Structure 110 Display device 121 Insulating layer 131 Colored layer 132 Light blocking layer 134 Colored layer 135 Polarizing Plate 136 LCD 137 Electrode 138 Insulating Layer 141 Adhesive layer 142 Adhesive layer 145 Bus Line 151 User 161 Arithmetic equipment 162 Communication equipment 163 Storage device 164 Display control device 165 Attitude detection unit 166 Vibration device 167 Sensor Module 168 External Interface 169 Sound Controller 170 Light-emitting element 171 Battery Controller 172 Power receiving unit 173 Audio output device 174 Voice Input Device 175 Imaging Device 176 Touch Sensor 177 Touch Sensor Controller 179 Battery 180 Liquid crystal element 181 Antenna 191 Electrode 192 EL layer 193 Electrode 194 Insulating Layer 201 Transistor 203 Transistor 204 Connection 205 Transistor 206 Transistor

Claims

1. A foldable electronic device, a first housing having a first portion and a second portion having a thickness smaller than that of the first portion; a second housing having a third portion and a fourth portion having a thickness smaller than that of the third portion; Hinge and a flexible display device; the first housing and the second housing are connected via the hinge, When the electronic device is in an open state, the display device a first display area overlapping with a first portion of the first housing; a second display area overlapping with the third portion of the second housing; a third display area overlapping each of the second portion and the fourth portion and curving when the electronic device is folded; When the electronic device is in an open state, a thickness of the second portion decreases toward the hinge, When the electronic device is in an open state, a thickness of the fourth portion decreases toward the hinge, In a cross-sectional view in a longitudinal direction of the display device when the electronic device is in an open state, the first housing has a first surface on the display device side and a second surface opposite to the first surface, In the cross-sectional view, the second housing has a third surface on the display device side and a fourth surface opposite to the third surface, the third display area overlaps with each of the first surface to the fourth surface in the cross-sectional view, An electronic device, wherein, in the cross-sectional view, a first space is provided between a portion of the first surface and a portion of the back surface of the third display area, and a second space is provided between a portion of the third surface and another portion of the back surface of the third display area.

2. A foldable electronic device, a first housing having a first portion and a second portion having a thickness smaller than that of the first portion; a second housing having a third portion and a fourth portion having a thickness smaller than that of the third portion; Hinge and a structure; a flexible display device; the first housing and the second housing are connected via the hinge, the structure is provided between the first housing and the second housing and has a region in contact with each of the first housing and the second housing; When the electronic device is in an open state, the display device a first display area overlapping with a first portion of the first housing; a second display area overlapping with the third portion of the second housing; a third display area that overlaps with each of the second portion, the fourth portion, and the structure and that curves when the electronic device is folded; When the electronic device is in an open state, a thickness of the second portion decreases toward the hinge, When the electronic device is in an open state, a thickness of the fourth portion decreases toward the hinge, In a cross-sectional view in a longitudinal direction of the display device when the electronic device is in an open state, the first housing has a first surface on the display device side and a second surface opposite to the first surface, In the cross-sectional view, the second housing has a third surface on the display device side and a fourth surface opposite to the third surface, the third display area overlaps with each of the first surface to the fourth surface in the cross-sectional view, In the cross-sectional view, a first space is provided between a part of the first surface and a part of a back surface of the third display area, and a second space is provided between a part of the third surface and another part of the back surface of the third display area, The structure has elasticity and has an area that comes into contact with a part of the back surface of the third display area when the electronic device is folded.

3. A foldable electronic device, a first housing; a second housing; Hinge and a flexible display device; the first housing and the second housing are connected via the hinge, the first housing has a first portion and a second portion; the second housing has a third portion and a fourth portion, When the electronic device is in an open state, a thickness of the second portion decreases toward the hinge, When the electronic device is in an open state, a thickness of the fourth portion decreases toward the hinge, When the electronic device is in an open state, the display device a first display area overlapping with a first portion of the first housing; a second display area overlapping with the third portion of the second housing; a third display area overlapping each of the second portion and the fourth portion and curving when the electronic device is folded; In a cross-sectional view in a longitudinal direction of the display device when the electronic device is in an open state, the first housing has a first surface on the display device side and a second surface opposite to the first surface, In the cross-sectional view, the second housing has a third surface on the display device side and a fourth surface opposite to the third surface, the third display area overlaps with each of the first surface to the fourth surface in the cross-sectional view, In the cross-sectional view, a first space is provided between a part of the first surface and a part of a back surface of the third display area, and a second space is provided between a part of the third surface and another part of the back surface of the third display area, When the electronic device is in a folded state, a distance from the first housing overlapping the first display area to the second housing overlapping the second display area increases as the distance approaches the hinge.

4. In any one of claims 1 to 3, An electronic device, wherein each of the first display area and the second display area is an area whose shape does not change when the electronic device is folded.

5. In any one of claims 1 to 4, An electronic device having a function of maintaining a relative angle between the first display area and the second display area at 160°±15°.

6. In any one of claims 1 to 4, An electronic device having a function of maintaining a relative angle between the first display area and the second display area at 120°±15°.

7. In any one of claims 1 to 6, An electronic device, wherein when the angle formed between the first display area and the second display area is greater than or equal to 0 degrees and less than 80 degrees, at least a portion of the third display area is located in the first space and the second space.

8. In any one of claims 1 to 7, The electronic device, wherein the inner diameters of the first space and the second space are 1 mm or more and 50 mm or less.

Images