Adhesive composition with improved adhesive strength and heat seal performance

Abstract

An adhesive composition is provided that includes (A) an acrylic emulsion polymer and (B) a vinyl aromatic monomer-maleic anhydride copolymer, the vinyl aromatic monomer-maleic anhydride copolymer being present in an amount of 0.1% to 6.5% by weight based on the total solids weight of the adhesive composition, the adhesive composition providing improved performance with respect to adhesive strength and / or heat seal performance.

Description

[Technical Field]

[0001] The present disclosure relates to adhesive compositions. More particularly, the present disclosure relates to adhesive compositions, articles comprising the same, and methods for making the articles. The adhesive compositions provide improved performance in terms of adhesive strength and / or heat seal performance. [Background technology]

[0002] Adhesive compositions are useful for a wide variety of purposes. For example, adhesive compositions are used to bond substrates such as polyethylene, polypropylene, polyester, polyamide, metal, paper, or cellophane together to form composite films, i.e., laminates. The use of adhesives in a variety of lamination end uses is generally known. For example, adhesives can be used in the production of film / film and film / foil laminates used in the packaging industry, particularly for food packaging. Adhesives used in lamination applications, i.e., "laminating adhesives," can generally be classified into three categories: solvent-based, water-based, and solventless.

[0003] Many water-based laminating adhesives have been developed for film / film (foil) lamination for several years. However, water-based laminating adhesives are also limited by performance drawbacks for wider applications. Prior art water-based laminating adhesives tend to exhibit low adhesive strength and / or poor heat seal performance for foil-based laminate structures. Therefore, it is desirable to develop adhesive compositions with improved performance in terms of adhesive strength and / or heat seal performance. Summary of the Invention

[0004] In one aspect, the present disclosure provides a method for manufacturing a semiconductor device comprising: (A) an acrylic emulsion polymer; (B) a vinyl aromatic monomer-maleic anhydride copolymer; (B) The vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt % to 6.5 wt % based on the total solids weight of the adhesive composition.

[0005] In a further aspect, the present disclosure provides a method for producing a laminate using the adhesive composition described, (a) providing an adhesive composition as described above; (b) applying the adhesive composition to a first portion of a surface of a substrate to form a layer of the adhesive composition; (d) contacting a second portion of the surface of the substrate with the layer of adhesive composition such that the layer of adhesive composition is sandwiched between the first portion and the second portion; (e) drying the adhesive composition or allowing it to dry.

[0006] In a further aspect, the present disclosure provides laminates prepared by using the laminate manufacturing methods described herein.

[0007] In a further aspect, the present disclosure provides a laminate comprising a first portion on a surface of a substrate, a layer of an adhesive composition described herein, and a second portion on a surface of the same or a different substrate, wherein the layer of adhesive composition is sandwiched between and in contact with the first and second portions.

[0008] In a further aspect, the present disclosure provides the use of a vinyl aromatic monomer-maleic anhydride copolymer to improve the adhesive strength and / or heat seal performance of an adhesive composition comprising an acrylic emulsion polymer. Preferably, the vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt % to 6 wt %, based on the total solids weight of the adhesive composition. DETAILED DESCRIPTION OF THE INVENTION

[0009] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Additionally, all publications, patent applications, patents, and other references mentioned herein are incorporated by reference.

[0010] As disclosed herein, "and / or" means "and, or alternatively." All ranges are inclusive of the endpoints unless otherwise indicated.

[0011] As disclosed herein, all percentages referred to herein are by weight and by temperature in °C unless otherwise specified.

[0012] As used herein, an "aqueous" composition or dispersion means that the particles are dispersed in an aqueous medium. By "aqueous medium" herein is meant water and 0-30% by weight based on the weight of the medium of a water-miscible compound such as, for example, an alcohol, glycol, glycol ether, glycol ester, or mixtures thereof.

[0013] As used herein, "glass transition temperature" or "Tg" can be measured by various techniques, including, for example, differential scanning calorimetry ("DSC") or calculation using the Fox equation. The T reported herein g The specific values ​​of T are calculated using the Fox equation (T.G. Fox, Bull. Am. Phys. Soc., Volume 1, Issue No. 3, page 123 (1956)). For example, the T of a copolymer of monomers M1 and M2 is g To calculate

number

[0014] A "structural unit," also known as a "polymerized unit," of a specified monomer refers to the remainder of the monomer after polymerization, i.e., the polymerized monomer or the polymerized form of the monomer. For example, the structural unit of methyl methacrylate is: [ka] where the dotted lines represent the points of attachment of the structural units to the polymer backbone.

[0015] adhesive composition The adhesive composition according to the present disclosure comprises: (A) an acrylic emulsion polymer; and (B) a vinyl aromatic monomer-maleic anhydride copolymer, wherein the (B) vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt % to 6.5 wt %, based on the total solids weight of the adhesive composition.

[0016] The adhesive composition is preferably water-based.

[0017] More preferably, the adhesive composition is a one-component water-based adhesive composition.

[0018] Acrylic Emulsion Polymer The acrylic emulsion polymer of the present invention may also contain structural units of one or more ethylenically unsaturated ionic monomers. The term "ionic monomer" herein refers to a monomer having an ionic charge at a pH of 1 to 14. Examples of suitable ethylenically unsaturated ionic monomers include acid-containing monomers such as methacrylic acid, acrylic acid, itaconic acid, maleic acid, or fumaric acid; sodium styrene sulfonate (SSS), sodium vinyl sulfonate (SVS), 2-acrylamido-2-methylpropanesulfonic acid (AMPS), the sodium salt of 2-acrylamido-2-methyl-1-propanesulfonic acid, the ammonium salt of 2-acrylamido-2-methyl-1-propanesulfonic acid; sodium salts of allyl ether sulfonic acid; phosphoalkyl (meth)acrylates such as phosphoethyl (meth)acrylate, phosphopropyl (meth)acrylate, phosphobutyl (meth)acrylate, salts thereof, and mixtures thereof; CH═C(R p1 )-C(O)-O-(R p2 O) p -P(O)(OH)2[wherein, R p1 =H or CH3, R p2= alkyl and p = 1-10], for example SIPOMER PAM-100, SIPOMER PAM-200, and SIPO1MER PAM-300, all available from Solvay; α,β-ethylenically unsaturated carboxylic acids including phosphoethylene glycol (meth)acrylate, phosphodiethylene glycol (meth)acrylate, phosphotriethylene glycol (meth)acrylate, phosphopropylene glycol (meth)acrylate, phosphodipropylene glycol (meth)acrylate, phosphotripropylene glycol (meth)acrylate, allyl ether phosphate, phosphoalkoxy (meth)acrylates such as vinylphosphonic acid, salts thereof, or mixtures thereof. Preferred ethylenically unsaturated ionic monomers are phosphoethyl methacrylate (PEM), acrylic acid (AA), methacrylic acid (MAA), or mixtures thereof. The acrylic emulsion polymers of the present invention may comprise at least 0.1%, at least 0.3%, at least 0.5%, at least 0.75%, or even at least 1%, and simultaneously at most 8%, at most 7%, at most 6%, at most 5%, at most 4.5%, at most 4%, at most 3.8%, at most 3.5%, or even at most 3.3% by weight of ethylenically unsaturated ionic monomer structural units, based on the weight of the emulsion polymer.

[0019] The acrylic emulsion polymers of the present invention may contain structural units of (b) one or more ethylenically unsaturated nonionic monomers, which may be monoethylenically or polyethylenically unsaturated monomers. The term "nonionic monomer" herein refers to a monomer that does not have an ionic charge at pH 1 to pH 14. Suitable monoethylenically unsaturated nonionic monomers include, for example, vinyl aromatic monomers, C1 to C6 20 Examples of the alkyl (meth)acrylate include C1 to C6 alkyl (meth)acrylate, acrylonitrile (AN), (meth)acrylamide, and mixtures thereof. 20 -Alkyl (meth)acrylate refers to an alkyl ester of (meth)acrylic acid containing an alkyl having 1 to 20 carbon atoms. 20The alkyl(meth)acrylates include C1 to C3 alkyl(meth)acrylates, cycloalkyl(meth)acrylates, and C4 to C alkyl(meth)acrylates different from cycloalkyl(meth)acrylates. 20-Alkyl (meth)acrylates may be mentioned. Examples of suitable alkyl (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate; cycloalkyl (meth)acrylates such as cyclohexyl (meth)acrylate, methylcyclohexyl (meth)acrylate, dihydrodicyclopentadienyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, and t-butyl (meth)cyclohexyl acrylate; hydroxy-functional alkyl (meth)acrylates such as hydroxyethyl methacrylate and hydroxypropyl methacrylate; glycidyl (meth)acrylate; or mixtures thereof. Vinyl aromatic monomers may include substituted styrenes such as styrene, α-methylstyrene, trans-β-methylstyrene, 2,4-dimethylstyrene, ethylstyrene, butylstyrene, and p-methoxystyrene; o-, m-, and p-methoxystyrene; and p-trifluoromethylstyrene; or mixtures thereof. Preferred monoethylenically unsaturated nonionic monomers include methyl methacrylate, styrene, cyclohexyl methacrylate, 2-ethylhexyl acrylate, butyl acrylate, or mixtures thereof. Preferred monoethylenically unsaturated nonionic monomers include methyl methacrylate, methyl acrylate, styrene, butyl methacrylate, butyl acrylate, or mixtures thereof. The content of the structural unit of the ethylenically unsaturated nonionic monomer can be adjusted so that the resulting emulsion polymer has a desired Hansen solubility parameter.For example, the emulsion polymer may comprise structural units of butyl acrylate in an amount of preferably 35% by weight or more, 36% by weight or more, or even 37% by weight or more, and simultaneously 45% by weight or less, 44% by weight or less, or even 43% by weight or less, and structural units of styrene in an amount of 30% by weight or more, 31% by weight or more, 32% by weight or more, 33% by weight or more, or even 34% by weight or more, and simultaneously 50% by weight or less, 49% by weight or less, 48% by weight or less, 46% by weight or less, or even 45% by weight or less, based on the weight of the emulsion polymer. Alternatively, the emulsion polymer may contain 2-ethylhexyl acrylate structural units in an amount preferably of at least 30%, at least 31%, or even at least 32% by weight, and simultaneously at most 40%, at most 39%, or even at most 38% by weight, based on the weight of the emulsion polymer, and styrene structural units in an amount of at least 30%, at least 31%, at least 32%, at least 33%, or even at least 34% by weight, and simultaneously at most 39.5%, at most 39%, at most 38%, or even at most 37% by weight, based on the weight of the emulsion polymer. The emulsion polymer may contain less than 19% by weight of acrylonitrile structural units, for example, less than 15%, less than 10%, less than 5%, less than 1%, or even 0% by weight of acrylonitrile structural units, based on the weight of the emulsion polymer. Multiethylenically unsaturated nonionic monomers useful in the present invention include di-, tri-, tetra-, or higher polyfunctional ethylenically unsaturated monomers. Suitable multi-ethylenically unsaturated monomers include, for example, allyl (meth)acrylate, divinylbenzene, ethylene glycol dimethacrylate, butylene glycol dimethacrylate, or mixtures thereof. The emulsion polymer may contain 0 to 3.0 wt %, 0.05 to 0.8 wt %, or 0.1 to 0.5 wt % of structural units of the multi-ethylenically unsaturated nonionic monomer, based on the weight of the emulsion polymer.

[0020] The acrylic emulsion polymer is formulated to contain, based on the weight of the emulsion polymer: 30% to 50% by weight of vinyl aromatic monomer structural units; 50% to 70% by weight of C1 to C 20 - alkyl (meth)acrylate structural units, and 0.1% by weight to 8% by weight of structural units of (meth)acrylic acid.

[0021] Alternatively, the acrylic emulsion polymer may comprise, based on the weight of the emulsion polymer: 30% by weight to 50% by weight of styrene structural units; 50% by weight to 70% by weight of butyl acrylate structural units; and 0.1% by weight to 8% by weight of structural units of acrylic acid.

[0022] The total concentration of structural units in the acrylic emulsion polymer is equal to 100%. The type and concentration of the above monomers can be adjusted to achieve the glass transition temperature (T g The acrylic emulsion polymer may be selected to provide an emulsion polymer having a T in the range of -20 to 60°C, -15 to 50°C, -10 to 30°C, or -5 to 20°C. g The emulsion polymer may have the following T g The value can be measured by a variety of techniques, including differential scanning calorimetry (DSC), or calculated by using the Fox equation.

[0023] The acrylic emulsion polymers useful in the present invention can be prepared by free-radical polymerization, preferably emulsion polymerization, of the monomers described above. The total weight concentration of the monomers used to prepare the acrylic copolymer is equal to 100%. The monomers can be added neat, as an emulsion in water, or in one or more portions or continuously, linearly or non-linearly, over the reaction period to prepare the acrylic copolymer. Suitable temperatures for the polymerization process can be below 100°C, in the range of 30-95°C, or in the range of 50-90°C.

[0024] Free radical initiators can be used in the process for preparing emulsion polymers. The polymerization process can be thermally initiated or redox initiated emulsion polymerization. Examples of suitable free radical initiators include hydrogen peroxide, t-butyl hydroperoxide, cumene hydroperoxide, ammonium and / or alkali metal persulfates, sodium perborate, superphosphate, and their salts; potassium permanganate, and ammonium or alkali metal salts of peroxydisulfate. Free radical initiators can typically be used at concentrations of 0.01% to 3.0% by weight, based on the total weight of the monomers used to prepare the emulsion polymer. Redox systems containing the above initiators combined with a suitable reducing agent can be used in the polymerization process. Examples of suitable reducing agents include sodium formaldehyde sulfoxylate, ascorbic acid, isoascorbic acid, alkali metal and ammonium salts of sulfur-containing acids (such as sulfites, bisulfites, thiosulfates, hydrosulfites, sulfides, hydrogen sulfides, or dithionites, formadinesulfinic acid, acetonate bisulfite, glycolic acid, hydroxymethanesulfonic acid, glyoxylic acid hydrate, lactic acid, glyceric acid, malic acid, and tartaric acid), and salts of the aforementioned acids. Metal salts of iron, copper, manganese, silver, platinum, vanadium, nickel, chromium, palladium, or cobalt may also be used to catalyze the redox reaction. Chelating agents for the metals may optionally be used.

[0025] A chain transfer agent can be used in the process of preparing the emulsion polymer. Examples of suitable chain transfer agents include 3-mercaptopropionic acid, methyl mercaptopropionate, butyl mercaptopropionate, n-dodecyl mercaptan, benzenethiol, alkyl mercaptan azelate, or mixtures thereof. The chain transfer agent can be used in an amount effective to control the molecular weight of the emulsion polymer. The chain transfer agent can be present in an amount of 0% to 3%, 0.01% to 1%, or 0.1% to 0.3% by weight, based on the total weight of the monomers used to prepare the emulsion polymer.

[0026] Surfactants can be used in the process of preparing emulsion polymers. The surfactants may be added before, during, or after the polymerization of the monomers or combinations thereof. Examples of suitable additional surfactants include alkali metal or ammonium salts of alkyl, aryl, or alkylaryl sulfates, sulfonates, or phosphates; alkylsulfonic acids; sulfosuccinates; fatty acids; polymerizable surfactants; ethoxylated alcohols or phenols; and mixtures thereof. The additional surfactant should be used in an amount that does not impair the performance of the aqueous polymer dispersion, for example, 0% to 1.5%, 0.1% to 1%, 0.2% to 0.8%, or 0.3% to 0.6% by weight, based on the dry weight of the emulsion polymer.

[0027] The pH value of the resulting aqueous emulsion polymer dispersion can be controlled by neutralization to at least 5, for example, 6 to 10 or 6.5 to 9. Neutralization can be carried out by adding one or more bases that can result in partial or complete neutralization of the ionic or potential ionic groups of the multi-stage polymer particles. Examples of suitable bases include ammonia; alkali metal or alkaline earth metal compounds such as sodium hydroxide, potassium hydroxide, calcium hydroxide, zinc oxide, magnesium oxide, sodium carbonate, and the like; primary, secondary, and tertiary amines such as triethylamine, ethylamine, propylamine, monoisopropylamine, monobutylamine, hexylamine, ethanolamine, diethylamine, dimethylamine, di-n-propylamine, tributylamine, triethanolamine, dimethoxyethylamine, 2-ethoxyethylamine, 3-ethoxypropylamine, dimethylethanolamine, diisopropanolamine, morpholine, ethylenediamine, 2-diethylaminoethylamine, 2,3-diaminopropane, 1,2-propylenediamine, neopentanediamine, dimethylaminopropylamine, hexamethylenediamine, 4,9-dioxadodecane-1,12-diamine, polyethyleneimine, or polyvinylamine; aluminum hydroxide, or mixtures thereof.

[0028] The emulsion polymers useful in the present invention may have a particle size of 50 nanometers (nm) to 500 nm, 80 nm to 200 nm, or 90 nm to 150 nm. Particle size herein refers to Z-average size and can be measured by a Brookhaven BI-90 Plus Particle Size Analyzer.

[0029] Vinyl aromatic monomer-maleic anhydride copolymer The vinyl aromatic monomer-maleic anhydride copolymer of the present disclosure may comprise (a) structural units of one or more vinyl aromatic monomers. The vinyl aromatic monomers may include substituted styrenes such as styrene, α-methylstyrene, trans-β-methylstyrene, 2,4-dimethylstyrene, ethylstyrene, butylstyrene, and p-methoxystyrene; o-, m-, and p-methoxystyrene; and p-trifluoromethylstyrene; or mixtures thereof. The vinyl aromatic monomer-maleic anhydride copolymer of the present disclosure may comprise structural units of vinyl aromatic monomers in an amount of 20% by weight or more, 30% by weight or more, or even 40% by weight or more, and simultaneously 99% by weight or less, 90% by weight or less, 80% by weight or less, 70% by weight or less, or even 60% by weight or less, based on the weight of the vinyl aromatic monomer-maleic anhydride copolymer.

[0030] The vinyl aromatic monomer-maleic anhydride copolymer of the present disclosure may comprise (b) structural units of maleic anhydride. The vinyl aromatic monomer-maleic anhydride copolymer of the present invention may comprise 5% or more, 10% or more, 20% or more, 30% or more, or even 40% or more by weight, and simultaneously 80% or less, 70% or less, or even 60% or less by weight, of structural units of maleic anhydride, based on the weight of the vinyl aromatic monomer-maleic anhydride copolymer.

[0031] The vinyl aromatic monomer-maleic anhydride copolymers of the present disclosure can be imidized with an amine (e.g., ammonia or dimethylpropylene diamine). The degree of imidization of the copolymer can be 50 to 100%. These imidized vinyl aromatic monomer-maleic anhydride copolymers are also commercially available from Cray Valley under the designations SMA X10000i, SMA X2000i, SMA X3000i, SMA X4000i, and SMA 3000H.

[0032] The preferred vinyl aromatic monomer-maleic anhydride copolymer of the present invention is a copolymer of styrene and maleic anhydride (SMA), preferably having a ratio of styrene to maleic anhydride of 1 / 1 to 6 / 1, preferably 2 / 1 to 4 / 1.

[0033] The number molecular weight of the vinyl aromatic monomer-maleic anhydride copolymer is 500 to 20,000, preferably 2,000 to 5,000.

[0034] The vinyl aromatic monomer-maleic anhydride copolymers can be prepared by any known method, for example according to the method described in US Pat. No. 3,444,151 A.

[0035] The vinyl aromatic monomer-maleic anhydride copolymer (B) is present in an amount of 0.1 wt.% or more, 0.5 wt.% or more, 0.8 wt.% or more, 1.0 wt.% or more, 1.2 wt.% or more, 1.5 wt.% or more, and simultaneously 6.5 wt.% or less, 6.0 wt.% or less, or 5.5 wt.% or less, 5.0 wt.% or less, 4.5 wt.% or less, based on the total solids weight of the adhesive composition.

[0036] Optional Ingredients Adhesive compositions according to the present disclosure may optionally include one or more components selected from the group consisting of isocyanate crosslinkers, rheology modifiers, antifoaming agents, silanes, and other additives.

[0037] Isocyanate Crosslinker Adhesive compositions according to the present disclosure may optionally include an isocyanate crosslinker, such as isocyanate monomers, polyisocyanates, isocyanate adducts, and mixtures thereof, or carbodiimides.

[0038] In the adhesive compositions of the present disclosure, the isocyanate crosslinker(s) may be present in an amount of 0.1 wt % to 20 wt %, preferably 1 wt % to 15 wt %, more preferably 1 wt % to 8 wt %, and even more preferably 3 wt % to 7 wt %, based on the total solids weight of the adhesive composition.

[0039] Rheology Modifiers The adhesive composition according to the present disclosure may further comprise a rheology modifier, which may include, but is not limited to, nonionic urethane polymers, cellulose, cellulose ethers, polyethylene glycol, starch ethers, polyvinyl alcohol, polyimides, gums, flours, and mixtures thereof. The rheology modifier is preferably selected from non-associative thickeners such as cellulose ethers.

[0040] The rheology modifier may generally be present in an amount of 0.1 wt % to 5.0 wt %, 0.2 wt % to 3 wt %, or 0.5 wt % to 2.0 wt %, or 0.4 wt % to 1.0 wt %, based on the total solids weight of the adhesive composition.

[0041] Antifoaming agents The adhesive composition according to the present disclosure may further comprise one or more antifoaming agents. As used herein, "antifoaming agent" refers to a chemical additive that reduces and prevents foam formation. The antifoaming agent may be a silicone-based antifoaming agent, a mineral oil-based antifoaming agent, an ethylene oxide / propylene oxide-based antifoaming agent, or a mixture thereof. Suitable commercially available antifoaming agents include, for example, TEGO Airex 902W and TEGO Foamex 1488 polyether siloxane copolymer emulsions, both available from TEGO; BYK-024 silicone modifier available from BYK; NOPCO NXZ modifier available from NOPCO; or a mixture thereof. The antifoaming agent may generally be present in an amount of 0.01 wt. % to 2 wt. %, 0.02 wt. % to 1.5 wt. %, 0.04 wt. % to 0.5 wt. %, or 0.04 wt. % to 0.1 wt. % based on the total solids weight of the adhesive composition.

[0042] Silane In some applications, adhesive compositions with high viscosity (e.g., >20,000 cP) and high solids content (e.g., >70%) are required. In these cases, the loading of NCO crosslinker is limited to provide sufficient pot life, and silanes are used as additives to supplement the NCO crosslinker, thus providing both sufficient pot life and adhesive performance. The silanes according to the present disclosure may be epoxy-functional silanes.

[0043] The epoxy-functional silane compounds useful in the present invention are typically saturated alkoxylated silanes having an epoxy group. The epoxy-functional silane compounds may have at least one hydrolyzable silane group. Preferred epoxy-functional silane compounds have the general formula (I): [ka] In the formula, each R 3 represents an alkyl group having 1 to 6 carbon atoms; each OR 3 groups independently represent alkoxy groups having 1 to 6 carbon atoms, including, for example, methoxy, ethoxy, or combinations thereof; R 4 represents a divalent organic group having a molecular weight of 200 or less, and preferably R 4 is C1-C 10 , C1-C5, or C1-C3 alkylene group; R 5 represents a hydrogen atom or an alkyl, aryl, or aralkyl group having 1 to 20 carbon atoms, and q is 1, 2, or 3. Examples of suitable epoxy-functional silane compounds include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropylmethyldimethoxysilane, or mixtures thereof. Commercially available epoxy-functional silane compounds may include Silquest A-187 gamma-glycidoxypropyltrimethoxysilane from Momentive Performance Materials Inc.

[0044] The epoxy functional silanes useful in the present disclosure can be present in a total amount of greater than or equal to zero, greater than or equal to 0.05%, greater than or equal to 0.1%, greater than or equal to 0.15%, greater than or equal to 0.2%, greater than or equal to 0.25%, greater than or equal to 0.3%, or even greater than or equal to 0.35% by weight of the total solids of the adhesive composition, and at the same time less than or equal to 5%, less than or equal to 4%, less than or equal to 3%, less than or equal to 2.5%, less than or equal to 2%, less than or equal to 1.5%, less than or equal to 1.2%, less than or equal to 1%, less than or equal to 0.8%, or even less than or equal to 0.5% by weight.

[0045] Other additives In addition to the above-mentioned components, the adhesive composition of the present invention may further comprise any one or combination of the following additives: dispersants, buffers, neutralizing agents, wetting agents, mildewcides, biocides, colorants, flow agents, antioxidants, plasticizers, leveling agents, thixotropic agents, adhesion promoters, and grind vehicles. When present, these additives may be present in a combined amount of 0% to 5%, or 0.1% to 3%, or 0.5% to 1.5% by weight, based on the total solids weight of the adhesive composition.

[0046] The adhesive composition of the present invention can be prepared using techniques known in the adhesives art, including mixing an acrylic emulsion polymer with a vinyl aromatic monomer-maleic anhydride copolymer and the other optional ingredients described above. The components in the adhesive composition can be mixed in any order to provide the adhesive composition of the present invention. Also, any of the optional ingredients described above can be added to the composition during or before mixing to form the adhesive composition.

[0047] The present disclosure also provides a method for producing a laminate by using the adhesive composition described herein, comprising: (a) providing an adhesive composition as described above; (b) applying the adhesive composition to a first portion of a surface of a substrate to form a layer of the adhesive composition; (c) contacting a second portion of the surface of the substrate with the layer of adhesive composition such that the layer of adhesive composition is sandwiched between the first portion and the second portion; (d) drying the adhesive composition or allowing it to dry.

[0048] In some embodiments, the method can include applying an adhesive composition onto a first portion of a surface of a substrate (e.g., a film) to form a layer of the adhesive composition. As used herein, "a first portion of a surface of a substrate" can refer to a portion or the entire surface. In some embodiments, the first portion of the surface can be a portion or the entire surface. In some embodiments, the coating weight of the adhesive composition can be 0.5 to 5.0 g / m 2 , 0.5 to 4.0 g / m 2 , 0.5 to 3.0 g / m 2 , 0.5 to 2.0 g / m 2 , 0.5 to 1.0 g / m 2 , 0.8~4.0g / m 2 , 0.8~3.0g / m 2 , 1.0~3.0g / m 2 , 1.5~3.0g / m 2 , or 1.5 to 2.0 g / m 2 In some embodiments, the substrate may be made of a material selected from the group consisting of polyethylene, polypropylene, polyester, polyamide, metal, paper, cellophane, and combinations thereof. In some embodiments, the substrate may be in the form of a film.

[0049] "Film" may refer to a layer of material having a thickness of 0.5 mm or less. In some embodiments, a film can be a structure having one dimension of 0.5 mm or less and two other dimensions of 1 cm or more. In some embodiments, the polymer film is a film made from a polymer or a mixture of polymers. In some embodiments, the layer of adhesive composition applied to the film has a thickness of 1 to 5 μm. Suitable films include paper, woven and nonwoven fabrics, metal foils, polymers, and metal-coated polymers. The film optionally has a surface on which an image is printed with ink. The ink may be in contact with the adhesive composition. In some embodiments, the film is a polymer film or a metal-coated polymer film, more preferably a polymer film. The polymer film may be a PE or PET film.

[0050] In some embodiments, the method can include contacting a second portion of a surface of a substrate (e.g., a film) with the layer of adhesive composition such that the layer of adhesive composition is sandwiched between the first and second portions to form a laminate. As used herein, a "second portion of a surface of a substrate" can refer to a portion or the entire surface. Generally, the second portion is different from the first portion, as described above. In some embodiments, the first portion and the second portion can be portions on the same or different surfaces. In some embodiments, the first portion and the second portion can be portions of the same or different surfaces of the same or different substrates. In some embodiments, the first portion of the surface can be a portion of the surface or the entire surface. In some embodiments, the second portion of the surface can be a portion of the surface or the entire surface.

[0051] In some embodiments, the method can include drying the adhesive composition or allowing the adhesive composition to dry. In some embodiments, the laminate can be pressed, for example, by passing it through nip rollers, which may or may not be heated. In some embodiments, the laminate can be heated (e.g., at a temperature of 30°C to 90°C, e.g., 30°C to 60°C) to accelerate the drying process.

[0052] In a further aspect, the present disclosure provides a laminate prepared by using the method for making a cured laminate described above.

[0053] In a further aspect, the present disclosure provides a laminate comprising a first portion on a surface of a substrate, a layer of an adhesive composition described herein, and a second portion on a surface of the same or a different substrate, wherein the layer of adhesive composition is sandwiched between and in contact with the first and second portions. [Example]

[0054] Next, some embodiments of the present invention will be described in the following examples, in which all parts and percentages are by weight unless otherwise specified. However, the scope of the present disclosure is not limited to the formulations shown in these examples. Rather, the examples simply relate to the invention of the present disclosure.

[0055] 1. Raw materials Information on the raw materials used in the examples is shown in Table 1 below: [Table 1]

[0056] 2. Preparation Procedure: Samples were prepared according to the formulations listed in Table 2. ROBOND™ L-80D and SMA-3000H were weighed and carefully mixed in a glass reactor, which was then placed in a water bath at 25°C. The rotor was turned on and the rotation speed was controlled at 50 RM, and the entire process was monitored. After 0.5 hours, the product was placed in a 100 mL HDPE bottle. [Table 2] Note: SMA-3000H (%) is measured as the dry weight of SMA-3000H relative to the total solids weight of the adhesive composition.

[0057] 3. Coating and lamination process: The coating and lamination process was carried out on an SDC Labo-Combi 400 machine. The lamination speed was maintained at 100 m / min during the entire lamination process. The coating weight was 1.8-2.0 g / m 2 The laminated film was then cured at room temperature (23 to 25°C) or in an oven before testing.

[0058] 4. Testing method: T-peel (90°) adhesive strength (hand-assisted T-peel) After drying, the laminated films were cut into 15 mm wide strips for T-peel testing on an Instron 5943 machine at a crosshead speed of 250 mm / min. Three strips were tested and an average value was obtained. During the test, the tail of the strip was pulled slightly with a finger to ensure that the tail remained at 90° to the peel direction.

[0059] Heat seal strength: The laminates were heat-sealed for 1 second in an HSG-C Heat-Sealing Machine available from Brugger Company at a sealing temperature of 140°C and a pressure of 300 N, then cooled and cut into 15 mm wide strips for heat seal strength testing using a 5940 Series Single Column Table Top System available from Instron Corporation at a crosshead speed of 250 mm / min. Three strips of each sample were tested and the average value was calculated. Results were reported in N / 15 mm.

[0060] 5. Performance evaluation results The bond strength (BS) and heat seal strength (HS) properties are summarized in Table 3. The results showed that the use of SMA-3000H improved the bond strength and heat seal strength of PET / PE and foil / PE. However, when the SMA-3000H content was increased to 5.08% by dry weight, the bond strength of PET / PE and foil / PE began to decrease. When the SMA-3000H content was further increased to 6.67%, the bond strength became even lower than the performance of the original ROBOND™ L-80D. [Table 3] The inventions described in the original claims of this application are set forth below. [1] An adhesive composition comprising: (A) an acrylic emulsion polymer; (B) a vinyl aromatic monomer-maleic anhydride copolymer; (B) an adhesive composition wherein the vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt % to 6.5 wt % based on the total solids weight of the adhesive composition. [2] The adhesive composition according to [1], wherein the acrylic emulsion polymer comprises (a) structural units of one or more ethylenically unsaturated ionic monomers, and (b) structural units of one or more ethylenically unsaturated nonionic monomers. [3] the acrylic emulsion polymer comprises, by weight based on the weight of the emulsion polymer: 30% to 50% by weight of vinyl aromatic monomer structural units; 50% to 70% by weight of C 1 ~C 20 - alkyl (meth)acrylate structural units, The adhesive composition according to [1], which contains 0.1% by weight to 8% by weight of structural units of (meth)acrylic acid. [4] The adhesive composition according to [1], wherein the vinyl aromatic monomer-maleic anhydride copolymer contains (a) structural units of one or more vinyl aromatic monomers and (b) structural units of maleic anhydride. [5] The adhesive composition of [1], wherein the vinyl aromatic monomer-maleic anhydride copolymer (B) is present in an amount of 0.5 wt. % or more and simultaneously 6.0 wt. % or less, based on the total solids weight of the adhesive composition. [6] The adhesive composition according to [1], wherein the adhesive composition is a one-component aqueous adhesive composition. [7] A method of forming a laminate using the adhesive composition described, comprising: (a) Providing the adhesive composition according to any one of [1] to [6]; (b) applying an adhesive composition to a first portion of a surface of a substrate to form a layer of the adhesive composition; (d) contacting a second portion of a surface of a substrate with the layer of adhesive composition such that the layer of adhesive composition is sandwiched between the first portion and the second portion; (e) drying or allowing the adhesive composition to dry. [8] A laminate prepared by using the method for producing a laminate described in [7]. [9] A laminate comprising a first portion on the surface of a substrate, a layer of the adhesive composition according to any one of [1] to [6], and a second portion on the surface of the same or a different substrate, wherein the layer of adhesive composition is sandwiched between the first portion and the second portion and is in contact with the first portion and the second portion.

[10] Use of a vinyl aromatic monomer-maleic anhydride copolymer to improve the adhesive strength and / or heat seal performance of an adhesive composition containing an acrylic emulsion polymer.

[11] The use according to

[10] , wherein the vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt % to 6 wt % based on the total solids weight of the adhesive composition.

Claims

1. An adhesive composition comprising: (A) an acrylic emulsion polymer; (B) a vinyl aromatic monomer-maleic anhydride copolymer; (B) a vinyl aromatic monomer-maleic anhydride copolymer is present in an amount of 0.1 wt. % to 6.5 wt. % based on the total solids weight of the adhesive composition; the acrylic emulsion polymer is a butyl (meth)acrylate / styrene / (meth)acrylic acid copolymer; Adhesive composition.

2. 10. The adhesive composition of claim 1, wherein the acrylic emulsion polymer comprises (a) structural units of one or more ethylenically unsaturated ionic monomers, and (b) structural units of one or more ethylenically unsaturated nonionic monomers.

3. the acrylic emulsion polymer comprises, by weight based on the weight of the emulsion polymer: 30% to 50% by weight of vinyl aromatic monomer structural units; 50% to 70% by weight of C １ ~C ２０ - alkyl (meth)acrylate structural units, 0.1% by weight to 8% by weight of structural units of (meth)acrylic acid.

4. 2. The adhesive composition of claim 1, wherein the vinyl aromatic monomer-maleic anhydride copolymer comprises (a) structural units of one or more vinyl aromatic monomers and (b) structural units of maleic anhydride.

5. 2. The adhesive composition of claim 1, wherein the vinyl aromatic monomer-maleic anhydride copolymer (B) is present in an amount of 0.5 wt. % or more and simultaneously 6.0 wt. % or less, based on the total solids weight of the adhesive composition.

6. The adhesive composition of claim 1 , wherein the adhesive composition is a one-component water-based adhesive composition.

7. A method of forming a laminate using the described adhesive composition, comprising: (a) providing the adhesive composition according to any one of claims 1 to 6; (b) applying an adhesive composition to a first portion of a surface of a substrate to form a layer of the adhesive composition; (d) contacting the second portion with the layer of adhesive composition such that the layer of adhesive composition is sandwiched between the first portion and a second portion of a surface of a substrate; (e) drying the adhesive composition.

8. A laminate prepared by using the method for manufacturing a laminate according to claim 7.

9. 7. A laminate comprising a first portion of a surface of a substrate, a layer of the adhesive composition according to any one of claims 1 to 6, and a second portion of a surface of the same or a different substrate, wherein the layer of adhesive composition is sandwiched between and in contact with the first and second portions.

10. A method for improving the adhesive strength and / or heat seal performance of an adhesive composition containing an acrylic emulsion polymer by using a vinyl aromatic monomer-maleic anhydride copolymer in an amount of 0.1 wt % to 6 wt % based on the total solids weight of the adhesive composition, comprising: The acrylic emulsion polymer is a butyl (meth)acrylate / styrene / (meth)acrylic acid copolymer. method.

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