Conductive polymer layer for charge dissipation

Abstract

A conductive polymer layer on an electrostatic chuck. The conductive polymer layer includes a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer facilitates charge dissipation by the conductive polymer layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymer layer to be photopatterned. The degree to which the conductive polymer layer is conductive and photosensitive may be adjusted by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Description

[Technical Field]

[0001] SUMMARY The present disclosure relates to conductive polymer layers useful for charge dissipation and related methods. [Background technology]

[0002] Semiconductor processes use electrically insulating materials that are susceptible to static charge buildup on their surfaces, which can slow down the process, damage components, or cause damage. Summary of the Invention

[0003] Some embodiments relate to an apparatus comprising an electrostatic chuck and a conductive polymer layer on the electrostatic chuck, hi some embodiments, the conductive polymer layer comprises a conductive polymer and a photosensitive polymer.

[0004] In some embodiments, the electrostatic chuck is configured to secure the substrate by application of an electrostatic force.

[0005] In some embodiments, the conductive polymer layer comprises 10 12 It has a sheet resistance of ohms / square or less.

[0006] In some embodiments, the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0007] In some embodiments, the photosensitive polymer comprises at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof.

[0008] In some embodiments, the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0009] In some embodiments, the conductive polymer layer comprises a cross-linked photodefinable polymer. In some embodiments, the conductive polymer layer comprises a photopatternable surface.

[0010] In some embodiments, the conductive polymer layer is free of metal contaminants.

[0011] In some embodiments, the metal contaminants comprise at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

[0012] Some embodiments relate to an electrostatic chuck comprising a conductive polymer layer on the electrostatic chuck, hi some embodiments, the conductive polymer layer comprises a conductive polymer and a photosensitive polymer.

[0013] In some embodiments, the conductive polymer layer comprises 10 12 It has a sheet resistance of ohms / square or less.

[0014] In some embodiments, the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0015] In some embodiments, the photosensitive polymer comprises at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof.

[0016] In some embodiments, the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0017] In some embodiments, the conductive polymer layer comprises a cross-linked photodefinable polymer. In some embodiments, the conductive polymer layer comprises a photopatternable surface.

[0018] In some embodiments, the conductive polymer layer is free of metal contaminants.

[0019] In some embodiments, the metal contaminants comprise at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

[0020] Some embodiments relate to methods that include one or more of the following steps: obtaining a solution that includes a conductive polymer and a photosensitive polymer; depositing the solution on at least a portion of a surface of an electrostatic chuck; applying a photolithographic mask to define an exposed portion of the solution and an unexposed portion of the solution; exposing the solution to light to harden the exposed portion of the solution; developing the solution to remove the unexposed portion of the solution; and heating the solution to a temperature sufficient to remove at least a portion of the solvent from the solution.

[0021] In some embodiments, the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0022] In some embodiments, the solution does not include at least one of the following metals: chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

[0023] Some embodiments are described herein, by way of example only, with reference to the accompanying drawings. With particular reference now to the drawings in detail, it is emphasized that the illustrated embodiments are by way of example and are intended to be illustrative of embodiments of the present disclosure. In this regard, the description taken together with the drawings will make apparent to those skilled in the art how embodiments of the present disclosure may be practiced. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a flowchart of a non-limiting embodiment of a method for preparing a conductive polymer layer, according to some embodiments. [Figure 2] 1 is a cross-sectional view of a non-limiting embodiment of a device, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0025] Among the benefits and improvements disclosed, other objects and advantages of the present disclosure will become apparent from the following description taken in conjunction with the accompanying drawings. While detailed embodiments of the present disclosure are disclosed herein, it should be understood that the embodiments of the present disclosure are merely exemplary of the present disclosure, which may be embodied in various forms. Moreover, each of the examples provided with respect to the various embodiments of the present disclosure is intended to be illustrative and not limiting.

[0026] All prior patents and publications referenced herein are incorporated by reference in their entirety.

[0027] Throughout this specification and the claims, the following terms have the meanings expressly associated therewith, unless the context clearly dictates otherwise. As used herein, the phrases "in one embodiment," "in an embodiment," and "in some embodiments" do not necessarily refer to the same embodiment, but may. Additionally, as used herein, the phrases "in another embodiment" and "in some other embodiments" do not necessarily refer to different embodiments, but may. It is intended that all embodiments of the present disclosure be combinable without departing from the scope or spirit of the disclosure.

[0028] As used herein, the term "based on" is not exclusive and may be based on additional unrecited factors unless the context clearly dictates otherwise. Furthermore, throughout this specification, the meanings of "a," "an," and "the" include plural referents. The meaning of "in" includes "in" and "on."

[0029] Some embodiments relate to polymer layers useful for electrostatic chuck applications. In some embodiments, a conductive polymer is combined with a photosensitive polymer to obtain a polymer layer that is both conductive and photosensitive. The conductivity of the conductive polymer facilitates electrostatic charge dissipation by the polymer layer, while the photosensitivity of the photosensitive polymer allows the surface of the polymer layer to be photopatterned. The degree to which the polymer layer is conductive and photosensitive can be adjusted by varying the relative amounts of the conductive polymer and the photosensitive polymer. Various other properties of the polymer layer can also be adjusted by varying the relative amounts of the conductive polymer and the photosensitive polymer, and optionally by incorporating other materials.

[0030] Some embodiments relate to an apparatus comprising a conductive polymer layer on an electrostatic chuck. In some embodiments, the conductive polymer layer comprises at least one of a conductive polymer material, a photosensitive polymer material (e.g., a cross-linked or non-cross-linked photosensitive polymer), or any combination thereof. In some embodiments, the conductive polymer layer has a patterned surface (e.g., a photo-patterned surface). In some of these embodiments, the photosensitive polymer material comprises a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer has a non-patterned surface (e.g., a non-photo-patterned surface). In some of these embodiments, the photosensitive polymer material comprises a non-cross-linked photosensitive polymer.

[0031] Some embodiments relate to an electrostatic chuck comprising a conductive polymer layer on a surface of the electrostatic chuck. In some embodiments, the conductive polymer layer comprises at least one of a conductive polymer material, a photosensitive polymer material (e.g., a cross-linked or non-cross-linked photosensitive polymer), or any combination thereof. In some embodiments, the conductive polymer layer has a patterned surface (e.g., a photo-patterned surface). In some of these embodiments, the photosensitive polymer material comprises a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer has a non-patterned surface (e.g., a non-photo-patterned surface). In some of these embodiments, the photosensitive polymer material comprises a non-cross-linked photosensitive polymer.

[0032] The electrostatic chuck may be configured to secure a substrate to the conductive polymer layer by application of an electrostatic force. The electrostatic force may be sufficient to secure the substrate to the surface of the conductive polymer layer. That is, in some embodiments, the substrate may be secured to the conductive polymer layer by the electrostatic chuck without application of any mechanical force, such as, but not limited to, a mechanical clamp. In some embodiments, a mechanical force is applied to secure the substrate (e.g., by a mechanical clamp). The substrate secured to the conductive polymer layer is not particularly limited and may include, but is not limited to, a wafer, a workpiece, or any combination thereof. In some embodiments, the substrate comprises a semiconductor wafer. In some embodiments, the substrate comprises a silicon wafer. It will be understood that other substrates may be used herein without departing from the scope of the present disclosure.

[0033] The conductive polymer layer may comprise a conductive polymer material. The conductive polymer material may comprise a polymer material that conducts electricity. In some embodiments, the conductive polymer material comprises at least one of a conductive monomer, a conductive oligomer, a conductive polymer, or any combination thereof. In some embodiments, the conductive polymer material comprises a conjugated polymer. In some embodiments, the conductive polymer material comprises a conductive polymer. In some embodiments, the conductive polymer material comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0034] The conductive polymer layer may comprise from 0.01% to 99.99% by weight of the conductive polymer material, based on the total weight of the conductive polymer layer, or any range or subrange therebetween. For example, in some embodiments, the conductive polymer layer comprises 0.01% to 99%, 1% to 99%, 10% to 99%, 20% to 99%, 30% to 99%, 40% to 99%, 50% to 99%, 60% to 99%, 70% to 99%, 80% to 99%, 90% to 99%, 0.01% to 90%, 0.01% to 80%, 0.01% to 70%, 0.01% to 60%, 0.01% to 50%, 0.01% to 40%, 0.01% to 30%, 0.01% to 20%, 0.01% to 10%, or any range or subrange therebetween, by weight based on the total weight of the conductive polymer layer. In some embodiments, the conductive polymer layer comprises 10% to 50%, 20% to 50%, 30% to 50%, 40% to 50%, 10% to 40%, 10% to 30%, 10% to 20%, or any range or subrange therebetween, by weight of conductive polymer material based on the total weight of the conductive polymer layer.

[0035] The conductive polymer layer may include a photosensitive polymer material. The photosensitive polymer material may include a polymer material that undergoes a change in properties or structure upon exposure to light. In some embodiments, the photosensitive polymer material includes at least one of a photosensitive monomer, a photosensitive oligomer, a photosensitive polymer, or any combination thereof. In some embodiments, the photosensitive polymer material includes a photosensitive polymer. In some embodiments, the photosensitive polymer layer includes a cross-linked photosensitive polymer. For example, in some embodiments, a photosensitive polymer material, such as a photosensitive monomer, a photosensitive oligomer, or any combination thereof, is exposed to light to obtain a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer has a photopatterned surface, the photosensitive polymer material includes a cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer includes a non-cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer material includes at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof.

[0036] The conductive polymer layer may comprise from 0.01% to 99.99% by weight of the photodefinable polymer material, based on the total weight of the conductive polymer layer, or any range or subrange therebetween. For example, in some embodiments, the conductive polymer layer comprises 0.01% to 99%, 1% to 99%, 10% to 99%, 20% to 99%, 30% to 99%, 40% to 99%, 50% to 99%, 60% to 99%, 70% to 99%, 80% to 99%, 90% to 99%, 0.01% to 90%, 0.01% to 80%, 0.01% to 70%, 0.01% to 60%, 0.01% to 50%, 0.01% to 40%, 0.01% to 30%, 0.01% to 20%, 0.01% to 10%, or any range or subrange therebetween, by weight based on the total weight of the conductive polymer layer. In some embodiments, the conductive polymer layer comprises 50%-90%, 50%-80%, 50%-70%, 50%-60%, 60%-90%, 70%-90%, 80%-90%, or any range or subrange therebetween, by weight of photosensitive polymer material based on the total weight of the conductive polymer layer.

[0037] The amounts of conductive polymer material and photosensitive polymer material present in the conductive polymer layer may be adjusted to achieve at least one of a desired sheet resistance, a desired Young's modulus, or any combination thereof. For example, the conductive polymer material and photosensitive polymer material may be present in amounts sufficient for the conductive polymer layer to have at least one of a desired sheet resistance, a desired Young's modulus, or any combination thereof.

[0038] The conductive polymer layer is 10 13 ohms / square or less, 10 12 ohms / square or less, 10 11 ohms / square or less, 10 10 ohms / square or less, 10 9 ohms / square or less, 10 8 ohms / square or less, 10 7 ohms / square or less, 10 6 ohms / square or less, or 10 5In some embodiments, the conductive polymer layer may have a sheet resistance of 10 ohms / square or less. 2 ~10 10 Ohms / square, 10 2 ~10 9 Ohms / square, 10 2 ~10 8 Ohms / square, 10 2 ~10 7 Ohms / square, 10 2 ~10 6 Ohms / square, 10 2 ~10 5 Ohms / square, 10 2 ~10 4 Ohms / square, 10 2 ~10 3 Ohms / square, 10 3 ~10 9 Ohms / square, 10 4 ~10 9 Ohms / square, 10 5 ~10 9 Ohms / square, 10 6 ~10 9 Ohms / square, 10 7 ~10 9 Ohms / square, 10 8 ~10 9 It may have a sheet resistance of ohms / square, or any range or subrange therebetween.

[0039] The conductive polymer layer may have a Young's modulus of 3.5 gigapascals (GPa) or less, 3 gigapascals (GPa) or less, 2.5 gigapascals (GPa) or less, 2 gigapascals (GPa) or less, 1.5 gigapascals (GPa) or less, 1 gigapascal (GPa) or less, 0.5 gigapascals (GPa) or less, 0.1 gigapascals (GPa) or less, or 0.01 gigapascals (GPa) or less. In some embodiments, the conductive polymer layer has a resistance of 0.001 GPa to 1 GPa, 0.001 GPa to 0.9 GPa, 0.001 GPa to 0.8 GPa, 0.001 GPa to 0.7 GPa, 0.001 GPa to 0.6 GPa, 0.001 GPa to 0.5 GPa, 0.001 GPa to 0.4 GPa, 0.001 GPa to 0.3 GPa, 0.001 GPa to 0.2 GPa, +0.001 GPa to 0.1 GPa, 0.001 GPa to 0.01 GPa, 0.001 GPa to 3.5 GPa, 0.01 GPa to 3.5 GPa, 0.1 GPa The Young's modulus may be 0.001 GPa to 3.5 GPa, 1 GPa to 3.5 GPa, 1.5 GPa to 3.5 GPa, 2 GPa to 3.5 GPa, 2.5 GPa to 3.5 GPa, 3 GPa to 3.5 GPa, 0.001 GPa to 3 GPa, 0.001 GPa to 2.5 GPa, 0.001 GPa to 2 GPa, 0.001 GPa to 1.5 GPa, 0.001 GPa to 1 GPa, 0.001 GPa to 0.5 GPa, 0.001 GPa to 0.1 GPa, 0.001 GPa to 0.01 GPa, or any range or subrange therebetween.

[0040] The conductive polymer layer may comprise a conductive photo-patterned polymer layer. That is, in some embodiments, the conductive polymer layer comprises a conductive polymer material, e.g., a conductive polymer, and a photosensitive polymer material, e.g., a cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer is cross-linked such that the conductive polymer layer has a photo-patterned surface. In some embodiments, the conductive photo-patterned layer comprises a protrusion or a plurality of protrusions. The protrusion or surface of the conductive photo-patterned layer may define a substrate-contacting surface (e.g., a wafer-contacting surface). The protrusions may assume any geometric configuration. In some embodiments, for example, the protrusions form pillars, among other structures. In some embodiments, the protrusions have at least one dimension in the range of 1 μm to 100 μm, or any range or subrange therebetween.

[0041] The thickness of the conductive polymer layer may range from 1 μm to 50 μm. For example, in some embodiments, the thickness of the conductive polymer layer is in the range of 1 μm to 50 μm, 1 μm to 45 μm, 1 μm to 40 μm, 1 μm to 35 μm, 1 μm to 30 μm, 1 μm to 25 μm, 1 μm to 20 μm, 1 μm to 15 μm, 1 μm to 10 μm, 1 μm to 5 μm, 5 μm to 50 μm, 10 μm to 50 μm, 15 μm to 50 μm, 20 μm to 50 μm, 25 μm to 50 μm, 30 μm to 50 μm, 35 μm to 50 μm, 40 μm to 50 μm, 45 μm to 50 μm, or any range or subrange therebetween. In some embodiments, the thickness of the conductive polymer layer is in the range of 5 μm to 25 μm, 5 μm to 20 μm, 5 μm to 15 μm, or any range or subrange therebetween.

[0042] In some embodiments, the conductive polymer layer is free of metal contaminants, which in some embodiments include, consist of, or consist essentially of at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

[0043] In some embodiments, the conductive polymer layer comprises 0.01% to 10% by weight of metal contaminants, based on the total weight of the conductive polymer layer, or any range or subrange therebetween. For example, in some embodiments, the conductive polymer layer comprises less than 10%, less than 9%, less than 8%, less than 7%, less than 6%, less than 5%, less than 4%, less than 3%, less than 2%, less than 1%, or less than 0.1% by weight of metal contaminants, based on the total weight of the conductive polymer layer. In some embodiments, the conductive polymer layer comprises 0.01% to 10%, 0.01% to 9%, 0.01% to 8%, 0.01% to 7%, 0.01% to 6%, 0.01% to 5%, 0.01% to 4%, 0.01% to 3%, 0.01% to 2%, 0.01% to 1%, 1% to 10%, 2% to 10%, 3% to 10%, 4% to 10%, 5% to 10%, 6% to 10%, 7% to 10%, 8% to 10%, 9% to 10%, or any range or subrange therebetween.

[0044] In some embodiments, the conductive polymer layer comprises at least one of an additive, a binder, a solvent, a dopant, a surfactant, or any combination thereof. In some embodiments, the additive is metal-free (e.g., metal contaminants as disclosed herein). In some embodiments, the binder is metal-free (e.g., metal contaminants as disclosed herein). In some embodiments, the solvent is metal-free (e.g., metal contaminants as disclosed herein). In some embodiments, the dopant is metal-free (e.g., metal contaminants as disclosed herein). In some embodiments, the surfactant is metal-free (e.g., metal contaminants as disclosed herein).

[0045] The conductive polymer layer may comprise from 0.01% to 99% by weight, based on the total weight of the conductive polymer layer, of at least one additive, binder, solvent, dopant, surfactant, or any combination thereof, or any range or subrange therebetween. For example, in some embodiments, the conductive polymer layer may include at least one of: an additive, a binder, a solvent, a dopant, a surfactant, or any combination thereof, in an amount by weight based on the total weight of the conductive polymer layer, of 0.01% to 99%, 1% to 99%, 10% to 99%, 20% to 99%, 30% to 99%, 40% to 99%, 50% to 99%, 60% to 99%, 70% to 99%, 80% to 99%, 90% to 99%, 0.01% to 90%, 0.01% to 80%, 0.01% to 70%, 0.01% to 60%, 0.01% to 50%, 0.01% to 40%, 0.01% to 30%, 0.01% to 20%, 0.01% to 10%, or any range or subrange therebetween. In some embodiments, the conductive polymer layer may comprise 50% to 90%, 50% to 80%, 50% to 70%, 50% to 60%, 60% to 90%, 70% to 90%, 80% to 90%, or any range or subrange therebetween, by weight based on the total weight of the conductive polymer layer, of at least one additive, binder, solvent, dopant, surfactant, or any combination thereof.

[0046] 1 is a flowchart of a non-limiting embodiment of a method 100 for preparing a conductive polymer layer, according to some embodiments. The conductive polymer layer may include any of the conductive polymer layers disclosed herein.

[0047] In step 102, a solution comprising a conductive polymer material and a photosensitive polymer material is obtained. In some embodiments, the solution comprises a homogeneous mixture of the conductive polymer material and the photosensitive polymer material. In some embodiments, the solution further comprises a solvent. In some embodiments, the solvent comprises at least one of gamma butyrolactone, propylene glycol methyl ether acetate, acetone, dodecane, cyclopentanone, or any combination thereof.

[0048] In step 104, the solution is deposited on at least a portion of the surface of the electrostatic chuck. Deposition may include coating (e.g., spray coating, sonicated spray coating, spin coating, or otherwise applied) at least a portion of the surface of the electrostatic chuck. In some embodiments, the solution is deposited on the surface of the electrostatic chuck to form a coating, layer, or film. In some embodiments, the solution deposited on the surface of the electrostatic chuck has a thickness of 0.1 μm to 1 mm, or any range or subrange therebetween. In some embodiments, the thickness of the solution deposited on the surface of the electrostatic chuck is 1 μm to 10 μm, 1 μm to 9 μm, 1 μm to 8 μm, 1 μm to 7 μm, 1 μm to 6 μm, 1 μm to 5 μm, 1 μm to 4 μm, 1 μm to 3 μm, 1 μm to 2 μm, 2 μm to 10 μm, 3 μm to 10 μm, 4 μm to 10 μm, 5 μm to 10 μm, 6 μm to 10 μm, 7 μm to 10 μm, 8 μm to 10 μm, 9 μm to 10 μm, or any range or subrange therebetween. In some embodiments, the solution is deposited to cover the entire surface of the electrostatic chuck.

[0049] In step 106, at least a portion of the solution on the surface of the electrostatic chuck is exposed to light. The solution may be exposed to light of any wavelength. For example, the solution may be exposed to at least one of gamma rays, X-rays, ultraviolet light, visible light, infrared light, radio waves, microwaves, or any combination thereof. The duration of exposure should be sufficient to cure the solution.

[0050] Although not shown, in some embodiments, the method further includes one or more of the following steps, which may be optionally performed between steps 106 and 108: applying a photolithographic mask to define exposed and unexposed portions of the solution, exposing the solution to light to harden the exposed portions of the solution, and developing the solution to remove at least a portion of the unexposed portions of the solution. In some of these embodiments, developing the solution forms a patterned surface in which the unexposed portions are removed and the exposed portions remain.

[0051] In step 108, the solution is heated to a temperature sufficient to remove at least a portion of the solvent from the solution. The temperature is not particularly limited, and may be, for example, but not limited to, a temperature in the range of 150°C to 400°C, or any subrange therebetween. The heating period is not particularly limited, but should be sufficient to complete, or at least partially complete, the process of removing the solvent from the solution. In some embodiments, the heating forms a conductive polymer layer. In some embodiments, the conductive polymer layer is a patterned conductive polymer layer (e.g., a photopatterned conductive polymer layer). In some embodiments, the conductive polymer layer is an unpatterned conductive polymer layer.

[0052] 2 is a cross-sectional view of a non-limiting embodiment of an apparatus 200 in accordance with some embodiments. As shown in FIG. 2, the apparatus 200 includes a conductive polymer layer 202 on an electrostatic chuck 204. The conductive polymer layer 202 may include a plurality of protrusions 208 that define a photo-patterned surface and define a substrate contact surface. In the illustrated embodiment, the electrostatic chuck 204 is configured to secure a substrate 206 to the conductive polymer layer 202 through application of an electrostatic force. The substrate 206 may include, for example, but is not limited to, a silicon wafer or other semiconductor substrate.

[0053] The electrostatic chuck 204 may include a dielectric layer 210 and an insulator layer 212. In some embodiments, the dielectric layer 210 has a first surface and a second surface opposite the first surface. In some embodiments, the first surface of the dielectric layer 210 is bonded to the conductive polymer layer 202. In some embodiments, the second surface of the dielectric layer 210 is bonded to the insulator layer 212.

[0054] The apparatus 200 may include an electrode 214. The electrode 214 may be disposed below the top surface of the electrostatic chuck 204. In some embodiments, the electrode 214 is coupled to an electrode pin 216 (e.g., optionally by a conductive epoxy, among other materials). In some embodiments, the electrode pin 216 extends from the electrode 214 through the insulator layer 212 as shown. It will be understood that other configurations of the electrode 214, dielectric layer 210, and insulator layer 212 may be utilized without departing from the scope of the present disclosure. Furthermore, it will be understood that the electrostatic chuck 204 may include other components without departing from the scope of the present disclosure.

[0055] Aspects

[0056] Various aspects are described below, and it should be understood that any one or more of the features listed in the following aspects may be combined with any one or more of the other aspects. Aspect 1. An electrostatic chuck; A conductive polymer layer on an electrostatic chuck An apparatus comprising: The device, wherein the conductive polymer layer comprises a conductive polymer and a photosensitive polymer. Embodiment 2. The apparatus of embodiment 1, wherein the electrostatic chuck is configured to secure the substrate by application of an electrostatic force. Aspect 3. The conductive polymer layer is 10 12 A device according to any one of embodiments 1-2, having a sheet resistance of ohms per square or less. Embodiment 4. The device of any one of embodiments 1-3, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less. Embodiment 5. The device of any one of embodiments 1-4, wherein the conductive polymer layer comprises 0.01% to 99.99% by weight of the photosensitive polymer, based on the total weight of the conductive polymer layer. Embodiment 6. The device of any one of embodiments 1-5, wherein the photosensitive polymer comprises at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof. Embodiment 7. The device of any one of embodiments 1-6, wherein the photopolymer comprises a crosslinked photopolymer. Embodiment 8. The device of any one of embodiments 1-6, wherein the photosensitive polymer comprises a non-crosslinked photosensitive polymer. Embodiment 9. The device of any one of embodiments 1-8, wherein the conductive polymer layer comprises 0.01% to 99.99% conductive polymer by weight, based on the total weight of the conductive polymer layer. Embodiment 10. The device of any one of embodiments 1-9, wherein the conductive polymer comprises a conjugated polymer. Embodiment 11. The device of any one of embodiments 1-10, wherein the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof. Embodiment 12. The device of any one of embodiments 1-11, wherein the conductive polymer layer has a photopatterned surface. Embodiment 13. The apparatus of embodiment 12, wherein the photo-patterned surface defines a substrate-contacting surface. Embodiment 14. The device of embodiment 12, wherein the photo-patterned surface comprises protrusions. Embodiment 15. The device of embodiment 14, wherein the protrusions have at least one dimension in the range of 1 μm to 100 μm. Embodiment 16. The device of any one of embodiments 1 to 15, wherein the conductive polymer layer has a thickness of 1 μm to 50 μm. Embodiment 17. The device of any one of embodiments 1-16, wherein the conductive polymer layer is free of metal contaminants. Embodiment 18. The apparatus of embodiment 17, wherein the metal contaminants comprise at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof. Embodiment 19. The device of any one of embodiments 1-18, wherein the conductive polymer layer further comprises at least one of an additive, a binder, a solvent, a dopant, a surfactant, or any combination thereof. Embodiment 20. The device of embodiment 19, wherein the additives, binders, solvents, dopants, and surfactants are metal-free. Aspect 21. An electrostatic chuck, a conductive polymer layer on the electrostatic chuck; An electrostatic chuck, wherein the conductive polymer layer comprises a conductive polymer and a photosensitive polymer. Aspect 22. The conductive polymer layer comprises: 10 12 22. The electrostatic chuck of embodiment 21, having a sheet resistance of ohms per square or less. Embodiment 23. An electrostatic chuck according to any one of embodiments 21 to 22, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less. Embodiment 24. An electrostatic chuck according to any one of embodiments 21 to 23, wherein the conductive polymer layer comprises 0.01% to 99.99% by weight of the photosensitive polymer, based on the total weight of the conductive polymer layer. Embodiment 25. An electrostatic chuck according to any one of embodiments 21 to 24, wherein the photosensitive polymer comprises at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof. Embodiment 26. The electrostatic chuck of any one of embodiments 21 to 25, wherein the photosensitive polymer comprises a crosslinked photosensitive polymer. Embodiment 27. The electrostatic chuck of any one of embodiments 21 to 25, wherein the photosensitive polymer comprises a non-crosslinked photosensitive polymer. Embodiment 28. An electrostatic chuck according to any one of embodiments 21 to 27, wherein the conductive polymer layer comprises 0.01% to 99.99% by weight of the conductive polymer, based on the total weight of the conductive polymer layer. Embodiment 29. The electrostatic chuck of any one of embodiments 21 to 28, wherein the conductive polymer comprises a conjugated polymer. Embodiment 30. The electrostatic chuck of any one of embodiments 21 to 29, wherein the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof. Embodiment 31. An electrostatic chuck according to any one of embodiments 21 to 30, wherein the conductive polymer layer has a photopatterned surface. Embodiment 32. The electrostatic chuck of embodiment 31, wherein the photo-patterned surface defines a substrate contact surface. Embodiment 33. An electrostatic chuck according to embodiment 31, wherein the photo-patterned surface comprises protrusions. Embodiment 34. The electrostatic chuck of embodiment 33, wherein the protrusions have at least one dimension in the range of 1 μm to 100 μm. Embodiment 35. The electrostatic chuck of any one of embodiments 21 to 34, wherein the conductive polymer layer has a thickness of 1 μm to 50 μm. Embodiment 36. The electrostatic chuck of any one of embodiments 21 to 35, wherein the conductive polymer layer is free of metal contaminants. Embodiment 37. The electrostatic chuck of embodiment 36, wherein the metal contaminants comprise at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof. Embodiment 38. An electrostatic chuck according to any one of embodiments 21 to 37, wherein the conductive polymer layer further comprises at least one of an additive, a binder, a solvent, a dopant, a surfactant, or any combination thereof. Embodiment 39. The electrostatic chuck of embodiment 38, wherein the additives, binders, solvents, dopants, and surfactants are metal-free. Embodiment 40. Obtaining a solution containing a conductive polymer and a photosensitive polymer; depositing a solution on at least a portion of a surface of the electrostatic chuck; exposing at least a portion of the solution on the surface of the electrostatic chuck to light; and heating the solution to a temperature sufficient to remove at least a portion of the solvent from the solution; A method comprising: Embodiment 41. The method of embodiment 40, wherein the solution comprises a homogeneous mixture of the conductive polymer and the photosensitive polymer. Embodiment 42. The method of any one of embodiments 40-41, wherein the solvent comprises at least one of gamma butyrolactone, propylene glycol methyl ether acetate, acetone, dodecane, cyclopentanone, or any combination thereof. Embodiment 43. The method of any one of embodiments 40-42, wherein the depositing comprises spray coating. Embodiment 44. The method of any one of embodiments 40 to 43, wherein the deposited solution covers the entire surface of the electrostatic chuck. Embodiment 45. The method of any one of embodiments 40 to 44, wherein the exposing comprises exposing the solution to light of all wavelengths. Embodiment 46. Applying a photolithographic mask to define an exposed portion of the solution and an unexposed portion of the solution; exposing the solution to light to cure the exposed portion of the solution; and developing the solution to remove at least a portion of the unexposed portion of the solution. The method of any one of aspects 40 to 44, further comprising one or more of: Embodiment 47. The method of any one of embodiments 40 to 46, wherein the heating comprises heating to a temperature in the range of 150°C to 400°C. Embodiment 48. The method of any one of embodiments 40-47, wherein the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof. Embodiment 49. The method of any one of embodiments 40-48, wherein the solution does not include at least one of the following metals: chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof. It is to be understood that changes in detail may be made, particularly to the materials of construction utilized, and to the shape, size, and arrangement of parts, without departing from the scope of the present disclosure. The specification and described embodiments are exemplary, the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. Conductive polymer layer on electrostatic chuck An electrostatic chuck comprising: the conductive polymer layer comprises a conductive polymer and a photosensitive polymer; 1. An electrostatic chuck, wherein the conductive polymer comprises at least one of polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene vinylene, polypyrene, polyazulene, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polyaniline (PANI), polyacene, polythiophene (PT), polythiophene vinylene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylene) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

2. 10. The electrostatic chuck of claim 1, wherein the electrostatic chuck is configured to secure a substrate by application of an electrostatic force.

3. The conductive polymer layer is 10 １２ 10. The electrostatic chuck of claim 1, having a sheet resistance of no more than ohms per square.

4. 10. The electrostatic chuck of claim 1, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

5. 10. The electrostatic chuck of claim 1, wherein the photosensitive polymer comprises at least one of benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, polyimide, or any combination thereof.

6. 10. The electrostatic chuck of claim 1, wherein the photosensitive polymer is crosslinked such that the conductive polymer layer has a photopatternable surface.

7. 10. The electrostatic chuck of claim 1, wherein the conductive polymer layer is free of metallic contaminants.

8. 8. The electrostatic chuck of claim 7, wherein the metallic contaminants comprise at least one of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

9. A conductive polymer layer on an electrostatic chuck. An electrostatic chuck comprising: An electrostatic chuck, wherein the conductive polymer layer comprises a conductive polymer mixed with a photosensitive polymer.

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