How to remove chips in skiving

Abstract

To provide a chip removal method in skiving by which chips can be efficiently removed even when a shape of an inner peripheral surface of a work-piece is complicated, and improvement of work-piece process accuracy and elongation of tool service life can be achieved.SOLUTION: A chip removal method in skiving comprises: machining, using a skiving cutter 110, a work-piece 200; and, when separating the skiving cutter 110 from the work-piece after machining, ejecting a fluid 404 (or coolant 402) to a place (groove 204 or gap G) where chips remain.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for removing chips in skiving. [Background technology]

[0002] Skiving is a well-known machining method for creating gears. Skiving is performed by synchronizing the rotation of the skiving cutter, a cutting tool, with the rotation of the workpiece, which is the object to be machined, while tilting the rotation axis of the skiving cutter (cutter axis) relative to the rotation axis of the workpiece (work axis). This creates a difference between the rotation direction of the workpiece and that of the skiving cutter, causing "slip" when the skiving cutter interferes with the workpiece. This slip is used to remove the interfering parts from the workpiece, and to machine tooth grooves and other features into the workpiece.

[0003] In skiving, chips are generated when a workpiece is cut with a skiving cutter. If these chips adhere to the skiving cutter or the surface of the workpiece, the skiving cutter will get caught in the chips when the skiving cutter is brought into contact with the workpiece again to cut it, resulting in problems such as a decrease in machining accuracy. Therefore, for example, Patent Document 1 discloses a tooth groove machining device that can remove the chips generated during machining.

[0004] In the tooth groove machining device disclosed in Patent Document 1, the control device sets the rotational speed of the workpiece W slower than a reference rotational speed during the return feed operation, and also sets the feed speed for returning the tool T to the fourth position P4 slower than the reference feed speed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-13963 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 1, centrifugal force is reduced by slowing down the rotational speed of the workpiece (machined object). As a result, chips that have been pressed against the inner peripheral surface of the workpiece by centrifugal force are separated from the inner peripheral surface of the workpiece. The chips then fall due to gravity and are removed from the inner peripheral surface of the workpiece. However, with the method of Patent Document 1, if the shape of the inner peripheral surface of the workpiece is complex, for example, if grooves are formed in advance on the inner peripheral surface of the workpiece, chips that have entered the grooves will not fall. For this reason, the technology of Patent Document 1 cannot efficiently remove chips depending on the shape of the inner peripheral surface of the workpiece, and there is room for further improvement.

[0007] In view of these problems, the present invention aims to provide a chip removal method for skiving that can efficiently remove chips even when the shape of the inner peripheral surface of the workpiece is complex, thereby improving the machining accuracy of the workpiece and extending the life of the tool. [Means for solving the problem]

[0008] In order to solve the above problems, a typical configuration of the method for removing chips in skiving according to the present invention is characterized in that a skiving cutter is used to perform machining on a workpiece, and after machining, a fluid is sprayed onto the location where the chips accumulate when the skiving cutter moves away from the workpiece.

[0009] The fluid may be sprayed from the center of the skiving cutter. Alternatively, the fluid may be a coolant sprayed from behind the cutting edge of the skiving cutter toward the cutting edge of the skiving cutter.

[0010] The location where the chips accumulate on the workpiece may be a circumferential groove formed in advance on the inner peripheral surface of the workpiece, or may be a gap between the workpiece and a chuck that grips the workpiece. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a chip removal method for skiving that can efficiently remove chips even when the shape of the inner surface of the workpiece is complex, thereby improving the machining accuracy of the workpiece and extending the life of the tool. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram illustrating a skiving device and a workpiece. [Figure 2] 1A to 1C are diagrams illustrating a first embodiment of a chip removing method according to the present invention. [Figure 3] 5A to 5C are diagrams illustrating a second embodiment of the chip removing method of the present invention. [Figure 4] 10A to 10C are diagrams illustrating a third embodiment of the chip removing method of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Dimensions, materials, and other specific values ​​shown in the embodiments are merely examples for facilitating understanding of the invention and, unless otherwise specified, do not limit the present invention. In this specification and drawings, elements having substantially the same functions and configurations are designated by the same reference numerals to avoid redundant explanation, and elements not directly related to the present invention are not shown or described.

[0014] (First embodiment) Fig. 1 is a diagram illustrating a skiving apparatus 100 and a workpiece 200. Fig. 1 illustrates the skiving apparatus 100 and the workpiece 200 at the start of processing. The skiving apparatus 100 shown in Fig. 1 is a cutting tool that rotates a skiving cutter 110 to perform skiving on the workpiece 200.

[0015] The skiving cutter 110 is held at the tip of a holder 120 and is attached to a tool shaft 130 via the holder 120. The workpiece 200 is machined while rotating in synchronization with the skiving cutter 110.

[0016] The tool shaft 130 of the skiving device 100 is provided with coolant outlets 140 around the holder 120, which spray coolant 402 from behind the cutting edge of the skiving cutter 110. In the skiving device 100 of this embodiment, a fluid outlet 150 is provided at the center of the skiving cutter 110 (approximately the center of the cylindrical skiving cutter 110) to spray a fluid 404 onto the workpiece 200. In this embodiment, a circumferential groove 204 is formed in advance on the inner peripheral surface 202 of the workpiece 200.

[0017] 2A and 2B are diagrams illustrating a first embodiment of the chip removal method of the present invention. In Fig. 2A, the skiving cutter 110 is fed in the Y-axis direction relative to the workpiece 200, and the inner peripheral surface 202 of the workpiece 200 is skived. At this time, the skiving cutter 110 and the workpiece 200 rotate synchronously as described above.

[0018] When skiving the workpiece 200, chips 206 are generated as the inner peripheral surface 202 of the workpiece 200 is cut. If these chips 206 adhere to the surface of the skiving cutter 110 or the inner peripheral surface 202 of the workpiece 200, they will become caught during machining. To prevent these chips 206 from becoming caught, coolant 402 is sprayed from the coolant outlet 140 toward the skiving cutter 110 during skiving.

[0019] As described above, by spraying the coolant 402, it is possible to remove the chips 206 adhering to the surface of the skiving cutter 110 and the inner peripheral surface 202 of the workpiece 200. However, when grooves 204 are formed on the inner peripheral surface 202 of the workpiece 200 as shown in Fig. 2(a), it has been difficult to efficiently remove the chips 206 that have entered and remained in the grooves 204 simply by spraying the coolant 402 during machining.

[0020] Therefore, in the chip removal method of the first embodiment, when the skiving cutter 110 shown in Fig. 2(a) is returned in the Y-axis direction (moved away from the workpiece 200) as shown in Fig. 2(b), a fluid 404 is ejected from the fluid ejection port 150 at the center of the skiving cutter 110 toward the groove 204 where the chips 206 are retained. As a result, the chips 206 retained in the groove 204 are pushed out of the groove 204 by the force of the fluid 404.

[0021] As the fluid 404, the liquid of the coolant 402 may be used, or a gas-liquid two-phase liquid such as carbonated water, water, low viscosity oil, or the like may be used.

[0022] When returning the skiving cutter 110 in the Y-axis direction, the returning of the skiving cutter 110 may be stopped at the position where the fluid 404 or coolant 402 is most concentratedly sprayed onto the location where the chips 206 are accumulated. This makes it possible to remove the accumulated chips 206 more efficiently.

[0023] As described above, according to the chip removal method of the first embodiment, chips 206 can be efficiently removed even when the inner peripheral surface 202 of the workpiece 200 has a complex shape. This makes it possible to improve the machining accuracy of the workpiece 200 and extend the life of the tool. Furthermore, according to the chip removal method of the first embodiment, chips 206 on the inner peripheral surface 202 of the workpiece 200 can be efficiently removed without changing the rotation speed of the workpiece 200, i.e., without slowing down the rotation speed.

[0024] The fluid may be a gas, a liquid, or a gas-liquid mixture. FIG. 2(b) also shows the X-axis (horizontal axis), Y-axis (vertical axis), and B-axis (rotation axis) of the skiving device 100. The skiving device 100 moves along the Y-axis before and after skiving. In the chip removal method of the first embodiment described above, the skiving device 100 ejects fluid 404 when moving in the Y-axis direction during return, but the B-axis is fixed at this time.

[0025] (Second embodiment) 3 is a diagram illustrating a second embodiment of the chip removal method of the present invention. In the following embodiments, the same components as those in the previously described embodiments are denoted by the same reference numerals, and description thereof will be omitted. In the chip removal method of the first embodiment, a configuration is illustrated in which a fluid 404 is ejected from the fluid ejection port 150 at the center of the skiving device 100 onto the grooves 204 (places where chips 206 accumulate) in the inner peripheral surface 202 of the workpiece 200 when the skiving cutter 110 returns.

[0026] In contrast to this, in the chip removal method of the second embodiment, coolant 402 is sprayed from the coolant outlet 140 of the skiving device 100 onto the grooves 204 (places where chips 206 accumulate) in the inner peripheral surface 202 of the workpiece when the skiving cutter 110 returns. In detail, in Fig. 3(a), the skiving cutter 110 is fed toward the workpiece 200 in the same manner as in Fig. 2(a), and the inner peripheral surface 202 of the workpiece 200 is skived.

[0027] 3(b), when the skiving cutter 110 is returned, coolant 402 as fluid 404 is sprayed toward the grooves 204 where the chips 206 are accumulated. Even with this configuration, the chips 206 accumulated in the grooves 204 of the workpiece 200 are pushed out of the grooves 204 by the force of the fluid 404, so that the chips 206 accumulated in the grooves 204 can be efficiently removed.

[0028] In particular, in the chip removal method of the second embodiment, the skiving cutter 110 is rotated in the B-axis direction when returning in the Y-axis direction. This makes it possible to suitably remove chips 206 remaining in the grooves 204, etc., even if the skiving device 100 is not provided with a fluid ejection port 150. Furthermore, by using the coolant 402 as the ejected fluid 404, it is also possible to eliminate the need to supply a fluid other than the coolant 402.

[0029] (Third embodiment) 4 is a diagram illustrating a third embodiment of the chip removal method of the present invention. In the first and second embodiments, the removal of chips 206 that have accumulated in grooves 204 formed in the inner peripheral surface 202 of the workpiece 200 is illustrated. In contrast, in the third embodiment, chips 206 that have accumulated in the gap G between the workpiece 200 and the chuck 300 that holds it are removed.

[0030] 4(a), the chuck 300 is configured to include a chuck body 302, a plurality of jaws 304 held by the chuck body, and a plurality of reference metals 306. The workpiece 200 is positioned by the reference metals 306, and then the jaws 304 close toward the workpiece 200, thereby gripping the workpiece 200 in the chuck 300. At this time, a gap G is generated between the workpiece 200 and the chuck 300, and chips 206 generated during skiving may become trapped in this gap G.

[0031] Therefore, in the chip removal method of the third embodiment, when the skiving cutter 110 is returned, a fluid 404 is ejected from the fluid ejection port 150 at the center of the skiving cutter 110 toward the "gap G between the workpiece 200 and the chuck 300," where the chips 206 accumulate, as shown in Fig. 4(b). As a result, the chips 206 accumulated in the gap G are removed by the force of the fluid 404, and the same effect as the chip removal method of the first embodiment can be obtained.

[0032] While the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these examples. It is clear that those skilled in the art can conceive of various modifications and alterations within the scope of the claims, and it is understood that these modifications and alterations also fall within the technical scope of the present invention. [Industrial Applicability]

[0033] The present invention can be used as a chip removal method in skiving. [Explanation of symbols]

[0034] 100...skiving processing device, 110...skiving cutter, 120...holder, 130...tool shaft, 140...coolant outlet, 150...fluid outlet, 200...workpiece, 202...inner surface, 204...groove, 206...chips, 300...chuck, 302...chuck body, 304...jaw, 306...reference plate, 402...coolant, 404...fluid

Claims

1. The workpiece is machined using a skiving cutter. A method for removing chips in skiving, characterized in that, after processing, when the skiving cutter moves away from the workpiece, a fluid is sprayed into a gap between the workpiece and a chuck that holds the workpiece.

2. The method for removing chips in skiving according to claim 1, wherein the fluid is sprayed from the center of the skiving cutter.

3. The method for removing chips in skiving according to claim 1, characterized in that the fluid is a coolant that is sprayed from behind the cutting edge of the skiving cutter toward the cutting edge of the skiving cutter.

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