Cleaning system and method of use

Abstract

To provide a method for cleaning residual contaminated substances in an internal passage of a component.SOLUTION: A cleaning system 300 includes a first sub-chamber 310, a second sub-chamber 308 and a third sub-chamber 306. A first dividing member 314 is positioned between the first sub-chamber 310 and the second sub-chamber 308. A second dividing member 312 is positioned between the second sub-chamber 308 and the third sub-chamber 306. A vacuum system 304 is coupled to the third sub-chamber to generate a vacuum pressure that is lower than a pressure of the first sub-chamber 310 in the third sub-chamber 306 to create a pressure differential to induce a pressurized flow of a first cleaning medium flowing from the first sub-chamber 310 to the third sub-chamber 306 through an internal passage of a component 316 positioned in the second sub-chamber 308.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] Aspects of the present disclosure relate to cleaning internal passages within industrial equipment and parts and assemblies that may be manufactured using industrial equipment. [Background technology]

[0002] Various types of industrial equipment are used in the manufacture and assembly of parts in many industries. Such industrial equipment includes, for example, engineering components having one or more internal passages. Furthermore, parts manufactured using such industrial equipment or other techniques may also contain one or more internal passages. Contaminants can accumulate in the internal passages of various components, as well as parts manufactured and assembled using industrial equipment. Removal of buildup within these internal passages can be difficult depending on the location of the buildup. Additionally, cleaning methods used to remove buildup can leave behind residues that can harm the subsequent use of the industrial equipment and various components. Therefore, a better method for cleaning internal passages is needed. Summary of the Invention

[0003] The present disclosure provides a cleaning system. In one aspect, the cleaning system includes a cleaning chamber including a first subchamber configured to hold a first cleaning medium, a second subchamber adjacent to the first subchamber, and a first partition member positioned between the first and second subchambers and having a first opening. The cleaning chamber further includes a third subchamber adjacent to the second subchamber and configured to receive the first cleaning medium, and a second partition member positioned between the second and third subchambers and having a second opening, the first and second openings configured to form a fluid path through the second subchamber. The cleaning system further includes a vacuum system coupled to the third subchamber, the vacuum system configured to induce a pressurized flow of the first cleaning medium from the first subchamber to the third subchamber by generating a pressure in the third subchamber that is lower than the pressure in the first subchamber. The cleaning system further includes a filtration system coupled to the first subchamber and the third subchamber, the filtration system configured to remove and filter the first cleaning medium from the third subchamber and return the first cleaning medium to the first subchamber.

[0004] In one aspect, in combination with any of the cleaning systems described above or below, the cleaning system further includes a first connection mechanism removably connected to the first partition member via a first through hole of the plurality of first through holes, and a second connection mechanism removably connected to the second partition member via a second through hole of the plurality of second through holes.

[0005] In one aspect, in combination with any example cleaning system above or below, the cleaning system further includes a component disposed in the second subchamber, the component including a first end of the component removably coupled to the first coupling mechanism, a second end of the component removably coupled to the second coupling mechanism, an outer surface, and an inner surface, the inner surface defining at least one internal passage extending from the first end of the component to the second end of the component.

[0006] In one aspect, in combination with any example cleaning system above or below, wherein the cleaning system includes at least one of the first and second coupling mechanisms, a press-fit mechanism, a clamp, an adhesive, or a magnetic chuck.

[0007] In one aspect, in combination with any example cleaning system above or below, the cleaning system further includes a temperature control device coupled to the first subchamber, the temperature control device configured to regulate the temperature of the first subchamber.

[0008] In one aspect, in combination with any of the cleaning systems described above or below, the cleaning system further includes a first container coupled to the first subchamber, the first container having the first cleaning medium therein and configured to deliver the first cleaning medium to the first subchamber.

[0009] In one aspect, in combination with any of the cleaning systems described above or below, the cleaning system further includes a second container coupled to the second subchamber, the second container having the second cleaning medium therein and configured to deliver the second cleaning medium to the second subchamber.

[0010] The present disclosure provides a cleaning system. In one aspect, the cleaning system includes a plurality of cleaning chambers. Each cleaning chamber in the plurality of cleaning chambers includes: a first subchamber configured to hold a first cleaning medium; an agitator coupled to the first subchamber configured to induce and maintain a rotational speed of the first cleaning medium; a second subchamber adjacent to the first subchamber; a first partition member positioned between the first and second subchambers and having a plurality of first openings; a third subchamber adjacent to the second subchamber and configured to receive the first cleaning medium; and a second partition member positioned between the second and third subchambers and having a plurality of second openings, wherein each first opening in the plurality of first openings and each second opening in the plurality of second openings are configured to form a fluid pathway through the second subchamber. The cleaning system includes a vacuum system connected to the third subchamber of each cleaning chamber in the plurality of cleaning chambers, the vacuum system configured to induce a pressurized flow of the first cleaning medium from the first subchamber to the third subchamber by generating a pressure in the third subchamber that is lower than the pressure of the first subchamber, and the cleaning system includes a filtration system connected to the first subchamber and the third subchamber of each cleaning chamber in the plurality of cleaning chambers, the filtration system configured to remove and filter the first cleaning medium from the third subchamber of each cleaning chamber and return the filtered first cleaning medium to the first subchamber of each cleaning chamber.

[0011] In one aspect, in combination with any example cleaning system described above or below, the cleaning system further includes a first coupling mechanism removably coupled to the first partition member via an opening among a plurality of first openings, and a second coupling mechanism removably coupled to the second partition member via a second opening among a plurality of second openings.

[0012] In one aspect, in combination with any example cleaning system above or below, the cleaning system further includes a component disposed in the second subchamber of at least one cleaning chamber of the plurality of cleaning chambers, the component including a first end of the component removably coupled to the first coupling mechanism, a second end of the component removably coupled to the second coupling mechanism, an exterior surface, and an interior surface, the interior surface defining at least one internal passageway extending from the first end of the component to the second end of the component.

[0013] In one aspect, in combination with any of the examples of the cleaning system above or below, the cleaning system further includes a first container coupled to the first subchamber of each cleaning chamber, the first container containing the first cleaning medium and configured to deliver the first cleaning medium to the first subchamber.

[0014] In one aspect, in combination with any example cleaning system above or below, the cleaning system further includes a second container coupled to the second subchamber of each cleaning chamber, the second container containing a second cleaning medium and configured to deliver the second cleaning medium to the second subchamber.

[0015] In one aspect, in combination with any example cleaning system above or below, the cleaning system further comprises at least one pressure sensor coupled to the first subchamber, the second subchamber, or the third subchamber.

[0016] The present disclosure provides a method of using a cleaning system. In one aspect, the method of using a cleaning system includes executing a cleaning program, the cleaning program including generating and initiating a first pressure cycle in the cleaning program, with a first cleaning medium in a first subchamber of a cleaning chamber and the first subchamber having a first pressure, and activating a vacuum system coupled to a third subchamber of the cleaning chamber during the first pressure cycle to establish a second pressure in the third subchamber, the second pressure being lower than the first pressure, the third subchamber being separated from the first subchamber by a second subchamber, a component being disposed in the second subchamber, the component having an outer surface and an inner surface, the inner surface comprising at least one and a second pressure cycle, wherein the second pressure cycle is responsive to the second pressure being less than the first pressure cycle, to remove contaminants from the at least one internal passage of the component by forming a first pressurized flow of the first cleaning medium from the first subchamber through the at least one internal passage of the component and to the third subchamber, and deactivating the vacuum system during the first pressure cycle, wherein the first pressurized flow of the first cleaning medium is absent from the second subchamber when the vacuum system is deactivated.

[0017] In one aspect, in combination with any example cleaning method described above or below, a method of using the cleaning system further includes executing a first filtration cycle included in the cleaning program, wherein the first filtration cycle delivers the first cleaning medium from the third subchamber to a filtration system connected to the third subchamber and the first subchamber, the filtration system removes the contaminants from the first cleaning medium to form a filtered first cleaning medium, and delivers the filtered first cleaning medium to the first subchamber through the filtration system.

[0018] In one aspect, in a method of using the cleaning system in combination with any example cleaning method above or below, the cleaning program includes performing multiple filtration cycles before shutting down the vacuum system.

[0019] In one aspect, a method of using the cleaning system in combination with any example cleaning method above or below further includes, after the first filtration cycle, creating a rotational velocity of the filtered first cleaning medium during a second pressure cycle with the first subchamber at the first pressure; during the second pressure cycle, with the component removably coupled to the first subchamber via the first coupling mechanism and to the third subchamber via the second coupling mechanism, activating the vacuum system to establish a third pressure in the third subchamber, the third pressure being lower than the first pressure; and during the second pressure cycle, creating a second pressurized flow of the first cleaning medium from the first subchamber through the at least one internal passage of the component and into the third subchamber in response to the third pressure being lower than the first pressure, thereby removing a plurality of contaminants from the at least one internal passage of the component.

[0020] In one aspect, the method of using the cleaning system in combination with any example cleaning method described above or below further comprises, when executing the cleaning program, disposing a second cleaning medium in the second sub-chamber to remove contaminants from the exterior surface of the component.

[0021] In one embodiment, in a method of using the cleaning system in combination with any example cleaning method described above or below, the first pressure is approximately atmospheric pressure and the second pressure is from about 0.01 Pascals (Pa) to about 1 Pa.

[0022] In one aspect, in a method of using the cleaning system in combination with any example cleaning method above or below, the first cleaning medium is selected from the group consisting of a surfactant, a degreasing liquid, a degreasing gas, ambient air, nitrogen, CO2, and combinations thereof.

[0023] In one embodiment, in a method of using the cleaning system in combination with any example cleaning method above or below, the first cleaning medium comprises a plurality of particles having an average particle size of about 0.5 mm to about 3 mm.

[0024] In one aspect, in a method of using the cleaning system in combination with any example cleaning method above or below, the plurality of particles is selected from the group consisting of polymer particles, ceramic particles, glass particles, and combinations thereof.

[0025] In one embodiment, in a method of using the cleaning system in combination with any example cleaning method above or below, the first pressurized flow is a linear flow.

[0026] In one aspect, a method of using the cleaning system in combination with any example cleaning method described above or below further comprises agitating the first cleaning medium during the first pressure cycle to establish a rotational speed of the first cleaning medium, wherein the first pressurized flow formed by the first cleaning medium having the rotational speed is a vortex flow. [Brief explanation of the drawings]

[0027] So that the above-recited features can be understood in detail, a more particular description of the foregoing summary can be rendered by reference to illustrative embodiments, some of which are illustrated in the accompanying drawings.

[0028] [Figure 1] FIG. 1 illustrates an example flowchart of a method for using a cleaning system according to aspects of the present disclosure. [Figure 2] FIG. 10 illustrates another example of a flowchart of a method for using a cleaning system according to aspects of the present disclosure. [Figure 3] FIG. 1 illustrates a cleaning system according to various aspects of the present disclosure. [Figure 4] FIG. 1 illustrates an example of a vacuum system according to various aspects of the present disclosure. [Figure 5] FIG. 1 illustrates a cleaning system according to an aspect of the present disclosure. [Figure 6] FIG. 1 illustrates a portion of a cleaning system according to aspects of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0029] The present disclosure relates to cleaning systems and methods that utilize a pressure differential to create one or more pressurized streams. Components used in various types of industrial equipment, as well as parts and assemblies (collectively referred to herein as "components") manufactured using industrial equipment or other methods or equipment, may contain internal passageways. As used herein, "industrial equipment" refers to various types of machinery used to create, assemble, clean, inspect, or manufacture components, such as aerospace components. These components include, for example, mechanical, electrical, or electromagnetic components. Components such as pipes, hoses, conduits, joints, and other connectors or channels may each contain one or more internal passageways. Contaminants can accumulate in the internal passageways of components, making them difficult to clean. Contaminants, as used herein, may be solid, liquid, or colloidal, and may include, for example, various processing agents such as degreasers and other solvents used on industrial equipment, as well as dirt, dust, animals (e.g., insects), plants, metal chips from machining, or other foreign-object-debris (FOD) or unwanted elements that may adversely affect the functionality of components by clogging or contaminating them.

[0030] Current methods for cleaning internal passages can be inadequate because the passages may be small, narrow, or narrow in cross section, may vary in cross-sectional size or geometry, or may have twists, kinks, turns, or other unique shapes or corners. Additionally, current cleaning methods can be very laborious and time-consuming due to the combination of contaminant buildup and the geometry of the internal passages. Furthermore, currently used cleaning methods can leave residual contaminants that were not removed, or even retain cleaning media that was used as part of the cleaning process.

[0031] The systems and methods described herein can be used to clean components having one or more internal passages with varying cross-sectional shapes and geometries without leaving residue. The systems and methods described herein utilize the increased force generated by creating and controlling a pressurized flow in response to a pressure differential between two environments. The pressurized flow can be introduced into one or more internal passages multiple times. As used herein, a "pressurized flow" refers to a flow of one or more materials along a path established based on at least a pressure differential between a first environment, such as a subchamber, and a second environment, such as another subchamber. The one or more materials can include, for example, a cleaning medium. The pressurized flow can be used to transport fluids and solids, or a mixture of cleaning media, along a path that may be configured, for example, through one or more internal passages of a component. As used herein, "fluid" includes liquid or gas phase materials, including gas bubbles. The cleaning medium can be, for example, a single-phase or multi-phase medium of various configurations. A single layer media is, for example, one of a water (H2O) cleaning medium, a gas, a solvent, a solid, such as particulate matter, that may be used alone to remove contaminants from an internal passageway. A multilayer media may include 1) water and a solvent vapor, 2) a solvent liquid and a solvent vapor, 3) water, a solvent, and a plurality of particles, or any combination thereof. In some embodiments, multiple bubbles may be introduced into a single layer or multilayer cleaning media. In other words, a colloid or dispersion mixture (multilayer media) may be used as the cleaning medium.

[0032] The pressurized flow can be configured in various forms, such as linear flow or vortex flow. A "linear" flow, for example, refers to a flow of cleaning medium substantially along the central axis of a component's internal passageway. In contrast, a "vortex flow," as used herein, refers to a pressurized flow of cleaning medium having a rotational velocity. As used herein, the "rotational velocity" of a medium, such as a cleaning medium, means that the cleaning medium has a circular velocity and a pressure differential creates a vortex flow in one or more fluid paths. Thus, a vortex flow includes a pressurized flow of cleaning medium through an internal passageway along a helical path. The vortex flow travels along the central axis of a component's internal passageway, rotating at an angle relative to the central axis. In this example, the rotational velocity of the cleaning medium creating the vortex flow is maintained or increased as the cleaning medium is pumped along the internal passageway. In some embodiments, the cleaning medium rotates, for example, at an angle of 30°, 60°, or 90° relative to the central axis of the internal passageway. The cleaning methods described herein allow the pressurized flow to navigate complex components relatively easily compared to current cleaning methods, allowing cleaning of tubular structures with many bends, for example. Additionally, the pressurized flow of cleaning medium does not leave behind residue that could cause fire hazards, equipment contamination, or other performance issues when the component is returned to service after cleaning. The systems and methods described herein can be used to control the formation and direction of the pressurized flow due to the pressure differential between the first and second environments, thereby removing contaminants without leaving behind unwanted residue. Therefore, the systems and methods described herein provide higher cleaning rates and improved cleaning efficiency compared to current cleaning methods.

[0033] The cleaning systems described herein include at least one cleaning chamber divided into multiple subchambers, and such a combination of subchambers can be referred to as a "subchamber stack," as described in more detail below. In one embodiment, components are coupled to the cleaning chamber using multiple coupling mechanisms. As used herein, a "coupling mechanism" refers to a device configured to secure two or more elements of the system to one another. The cleaning chamber is configured such that each of the two or more subchambers is independently pressure-controlled. In some embodiments, the two or more subchambers are independently temperature-controlled. The first subchamber of the cleaning chamber can contain multiple cleaning media therein. Depending on the embodiment, the cleaning media can include liquids, gases, and / or solids. In some embodiments, two or more cleaning media can be disposed in the first subchamber, e.g., used simultaneously, as described in the multiphase media example above. The first subchamber and the third subchamber are separated by a second subchamber, and the combination of these three subchambers can be referred to as a "subchamber stack." The component is fluidly coupled to the first subchamber by a first coupling mechanism and to the third subchamber by a second coupling mechanism. As used herein, "fluidly coupled" refers to a system structure in which two or more subchambers are connected by a pathway that allows for the movement of gases and / or fluids between and within the subchambers.

[0034] In one embodiment, the component includes at least one internal passageway. The internal passageway is fluidly connected between the first subchamber and the third subchamber. The component can be removably connected to each of the first and second connection mechanisms. As used herein, "removably connected" refers to a connection between two or more elements, such as a connection mechanism and a component, that can be subsequently released without damaging either element. Connecting the component to the cleaning system via each of the first and second connection mechanisms forms a path along the internal passageway through which the cleaning medium travels to move from the first subchamber to the third subchamber. The component can be removably connected to one or both of the first and second connection mechanisms before or after the connection mechanisms are removably connected to each of the first and third subchambers. The component can be positioned within the second subchamber in a variety of ways. For example, one or more sides of the second subchamber may be provided with panels configured to open and close to allow the component to be positioned therein. In another example, a first partition member separating a first subchamber from a second subchamber may be configured to move, such as to open or close, to allow a component to be placed in the second subchamber. In yet another example, a second partition member separating a third subchamber from a second subchamber may be configured to move, such as to open or close, to allow a component to be placed in the second subchamber.

[0035] In this embodiment, the pressure in the first subchamber is greater than the pressure in the third subchamber. The pressure difference between the first and third subchambers creates a pressurized flow of cleaning medium that travels from the first subchamber to the third subchamber through the component's internal passages. As used herein, a "pressure cycle" refers to the activation and deactivation of at least one vacuum system in the cleaning system, thereby creating at least one pressurized flow of cleaning medium from the first subchamber to the third subchamber. Multiple pressurized flows can be created during a pressure cycle as the cleaning medium is filtered and new cleaning medium is introduced into the cleaning system. When the pressure cycle ends, the pressurized flows are stopped. The first pressure cycle uses one or more pressurized flows of cleaning medium to remove a first plurality of contaminants from the internal passages of the component as the cleaning medium passes from the first subchamber to the third subchamber. Once the cleaning medium reaches the third subchamber, it can be filtered and returned from the third subchamber through the filtration system to the first subchamber. The delivery of cleaning medium through the components in the second subchamber and back to the first subchamber through the filtration system is sometimes referred to herein as a "filtration cycle." The filtered cleaning medium can be used in a second cleaning cycle for that component or for additional components placed later in the system. In some embodiments, fresh cleaning medium can be added to the first subchamber during subsequent cleaning cycles after the second cleaning cycle. One or more filtration cycles can occur during a single pressure cycle. In some embodiments, a filtration cycle is not performed during a pressure cycle, and the used cleaning medium is removed using a waste container, as described below.

[0036] During the one or more pressure cycles, a pressure differential is maintained between the subchambers to continue the pressurized flow of cleaning medium. The systems described herein may include programmable logic that can be configured as one or more cleaning programs. In one embodiment, each cleaning program includes one or more pressure cycles. The programmable logic can be implemented using a graphical user interface (GUI). In another embodiment, each cleaning program includes one or more pressure cycles and one or more filtration cycles that occur during the one or more pressure cycles. In yet another embodiment, each cleaning program includes one or more pressure cycles and one or more filtration cycles that occur during or after the one or more pressure cycles. That is, the vacuum system may or may not be active during the filtration cycles, as the filtration system may have its own mechanism for removing the cleaning medium from the third subchamber while preventing the cleaning medium from returning to the internal passageway. <How to clean the internal passages>

[0037] FIG. 1 shows a flowchart of a method 100 of using a cleaning system according to an embodiment of the present disclosure. In step 102 of method 100, a component is removably placed and coupled to the cleaning system. The cleaning systems described in methods 100 and 200 below are, for example, cleaning systems 300 ( FIG. 3 ) or 500 ( FIG. 5 ), described below. Step 102 can be performed in various ways. In one example of step 102, the component is removably coupled to one or more coupling mechanisms before the coupling mechanisms are removably coupled to the cleaning system. In another example of step 102, coupling mechanisms are removably coupled to the cleaning system, and then a component is removably coupled to each of the coupling mechanisms. In yet another example of step 102, one coupling mechanism is coupled to the component before the component is coupled to the cleaning system, a second coupling mechanism is coupled to the system, and the component is coupled to the second coupling mechanism while the second coupling mechanism is coupled to the cleaning system. The cleaning system may have various inlets for placing components therein.

[0038] The component coupled to the cleaning system in step 102 may have accumulated contaminants in its internal passages. In some instances, the component may also have accumulated contaminants on its exterior surface that may be the same or different from the contaminants in the internal passages. Contaminants in the internal passages and / or on the exterior surface may render the component unusable or unsafe for its intended purpose. If the component is an aerospace component, these contaminants may render the aerospace component unusable because the contaminants may spread to other components in the assembly. Additionally or alternatively, the contaminants may act as ignition points during use or testing of the aerospace component. If the component is a component of industrial equipment, the contaminants may contaminate the industrial equipment as well as components manufactured, serviced, or otherwise developed by the industrial equipment. Exemplary industrial equipment includes coating equipment, casting equipment, injection molding equipment, cleaning equipment, food manufacturing and packaging equipment, and inspection equipment, which may use a variety of fluids, gases, solids, colloidal solutions, or other processing materials that can cause contamination. Additionally, the use of industrial equipment in manufacturing floor environments can lead to contamination of the internal passages and / or external surfaces of components.

[0039] In step 104, a cleaning program is executed to remove multiple contaminants from the internal passages of the component. As used herein, the cleaning program executed in step 104 may be stored on the cleaning system or on a remote server or other remote location accessible to the cleaning system via one or more remote technologies, such as cloud computing technologies. The cleaning program executed in step 104 may include one or more pressure cycles and one or more filtration cycles, as described above. Step 104 is described in more detail in FIG. 2.

[0040] In step 106, the cleaning program optionally removes contaminants from the exterior surface of the component. In one embodiment, step 104 is performed simultaneously with step 106. In another embodiment, step 104 is performed with some overlap with step 106. In yet another embodiment, step 104 is performed separately from step 106, for example, before or after step 106, so that the two steps do not overlap. Step 106 may include introducing one or more cleaning media into the chamber. The cleaning media used in step 106 may include one or more of a liquid, a gas, particles, or a combination thereof. The cleaning media used in step 106 may include a surfactant, water, ambient air, or a combination thereof. The cleaning media used in step 106 is, for example, the same as the cleaning media used in step 104. In other embodiments, the cleaning media used in step 106 is different from the cleaning media used in step 104. In yet another embodiment, the cleaning media used in step 106 includes the cleaning media used in step 104 in addition to one or more other cleaning media. The cleaning medium used in step 106 is introduced in one cycle and removed from the portion of the cleaning system where the component is located (referred to herein as a "subchamber"). In other embodiments, the cleaning medium used in step 106 can be introduced in multiple cleaning cycles, where the cleaning medium is removed and filtered after each cleaning cycle and reintroduced into the portion of the cleaning system where the component is located. In some embodiments, which can be combined with other embodiments described herein, the cleaning medium used in step 106 can be introduced in multiple cleaning cycles, where the cleaning medium is removed after each cleaning cycle and fresh cleaning medium is introduced for one or more subsequent cleaning cycles. In still other embodiments, the cleaning medium used in step 106 is a combination of filtered cleaning medium and fresh cleaning medium.

[0041] In step 108, the component is removed from the system after contaminants have been removed from the internal passages in step 104 and, optionally, from the exterior surfaces of the component in step 106. Various inspections and / or tests can be performed to verify that contaminants have been removed from the internal passages and exterior surfaces. After step 108, the component is reassembled into an aerospace assembly (or other assembly) or industrial equipment. In some embodiments, as described below, if two or more internal passages of a component are to be cleaned, one or more openings in those two or more internal passages may be blocked during method 100. In this embodiment, at least step 104 of method 100 cleans a first internal passage by forcing a cleaning medium through the first internal passage with a pressurized flow. Method 100 can then be repeated by blocking and unblocking various openings to direct the pressurized flow through one or more additional internal passages.

[0042] FIG. 2 illustrates a flowchart of a method 200 for using a cleaning system according to an embodiment of the present disclosure. Method 200 is an example of the execution of the cleaning program in step 104 of FIG. 1. In step 202 of method 200, a first pressure cycle is initiated. One pressure cycle is shown at 214 in FIG. 2. In step 202, a first pressure is established in a first subchamber. In one example, the first pressure in the first subchamber is approximately atmospheric pressure (1 atmosphere). In another example, the first pressure in the first subchamber is, for example, about 0.5 atmospheres to about 1.5 atmospheres. In yet another example, the first pressure in the first subchamber is, for example, about 0.8 atmospheres to about 1.2 atmospheres. In one embodiment, during the first pressure cycle of the cleaning program in method 200, optionally, a first rotational speed of a first cleaning medium is established in the first subchamber of the cleaning system in step 202. In one example, the first cleaning medium is agitated to generate a plurality of bubbles in the first cleaning medium. In another embodiment, when the first sub-chamber is at the first pressure in step 202, the first cleaning medium is disposed in the first sub-chamber, but no agitation / rotation occurs in the first sub-chamber.

[0043] The first cleaning medium may include one or more fluids, such as surfactants, degreasing liquids, degreasing gases, ambient air, nitrogen, CO2, or combinations thereof. As used herein, a "degreasing" material (liquid or gas) is a material capable of removing contaminants from internal passageways. As described above, the first cleaning medium may include one or more components in a single-phase or multi-phase configuration. In some embodiments, the first cleaning medium is non-carcinogenic, e.g., biodegradable, or has low or no hydrocarbon content. The first cleaning medium may be selected to be disposable into a waste system for use in other systems without further processing or pretreatment, without harming aquatic life. In some examples, the first cleaning medium may be selected to be free from the REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) authorized list. In other examples, the first cleaning medium may be selected and disposed of in a closed-loop system, where pretreatment is performed to neutralize and / or mitigate the environmental impact of the solvent prior to disposal.

[0044] In some examples, the first cleaning medium may be, for example, a plurality of particles or a multi-phase medium containing a plurality of particles. In one example, the plurality of particles may have an average particle size of about 0.5 mm to about 3.0 mm. In another example, the plurality of particles may have an average particle size of about 0.5 mm to about 1.0 mm. In yet another example, the plurality of particles may have an average particle size of about 0.8 mm to about 2.0 mm. As used herein, "about" means that a specified target measurement, minimum measurement, or maximum measurement is within ±5% of the measurement. The plurality of particles may include one or more of polymer particles, ceramic particles, glass particles, or polymer-coated glass or ceramic particles. The plurality of particles may comprise about 1% to about 50% by weight (wt.%) of the first cleaning medium. In another example, the plurality of particles may comprise about 2% to about 30% by weight of the first cleaning medium. In another example, the plurality of particles may comprise about 5% to about 20% by weight of the first cleaning medium. In yet another example, the plurality of particles may comprise about 10% to about 30% by weight of the first cleaning medium. The type, size, and weight percentage of particles in the cleaning medium may be selected to maintain (e.g., not damage) the coating and / or texture of the interior surface of the internal passage. In one embodiment, step 202 further includes establishing a rotational speed of the first cleaning medium. In one example, the rotational speed is about 1 meter / second (m / s) to about 50 m / s. In another example, the rotational speed is about 5 m / s to about 40 m / s. In yet another example, the rotational speed is about 10 m / s to about 30 m / s. The rotational speed can be established in either direction about the central axis of the cleaning system. In some examples, the rotational speed can be changed from a first direction to a second direction during execution of the cleaning program.

[0045] In step 204, during the first pressure cycle, a vacuum system of the cleaning system is activated to establish a second pressure in the third subchamber. The vacuum system may be coupled to the third subchamber of the cleaning system, which is separated from the first subchamber by the second subchamber, and the component is disposed in the second subchamber. The second pressure in the third subchamber is lower than the first pressure in the first subchamber, thereby establishing a pressure differential between the first and second subchambers. In various examples, the second pressure is between about 0.01 Pascals (Pa) and about 1 Pa. In other examples, the second pressure is between about 0.01 Pa and about 0.8 Pa. In other examples, the second pressure is between about 0.25 Pa and about 1 Pa. In step 206, the pressure differential between the first and third subchambers creates a first pressurized flow of the first cleaning medium. The first pressurized flow created in step 206 passes through at least one internal passage of the component and removes multiple contaminants during the first pressure cycle. In this manner, at least a portion of the first cleaning medium in the first subchamber is delivered to the third subchamber by pressurized flow during operation 206. That is, the pressure differential between the first and third subchambers and the fluid path formed by the components coupled to the subchambers direct the first cleaning medium from the first subchamber to the third subchamber along the internal passages of the components to remove contaminants from the components. As used herein, a "fluid path" refers to a passage configured to allow the fluid passage of a medium, such as a liquid, gas, solid, or combination thereof, without obstructions to the medium traveling through the passage. Additionally, the second pressure in the third subchamber prevents the first cleaning medium from falling back into the internal passages, which could recontaminate the internal passages.

[0046] In embodiments in which the first cleaning medium is agitated in step 202, this agitation, e.g., the rotational speed of the first cleaning medium, is maintained in step 204. Therefore, the pressurized flow created by the pressure difference between the first and second subchambers has a rotational speed based on the agitation of the first cleaning medium, and the pressurized flow can be referred to as a vortex, as described above. Each of the first, second, and third subchambers can be sealed from the adjacent environment (as described below in FIG. 3 ), thereby creating independent pressure, temperature, and chemical environments. As used herein, a "chemical environment" refers to a region, such as a subchamber, that includes ambient air and / or one or more cleaning media, each of which may have different chemical properties or compositions.

[0047] In one embodiment, after establishing the pressurized flow in step 206, the vacuum system may be shut off in step 212, as indicated by arrow 216, to terminate the first pressure cycle. In some embodiments, the first cleaning medium is removed from the third sub-chamber using a waste container after removing contaminants from the internal passages before shutting off the vacuum system in step 212. In this embodiment, fresh, unused first cleaning medium may be supplied to the first sub-chamber in step 218 to perform a subsequent pressure cycle (as indicated by arrow 214).

[0048] In another embodiment, a first filtration cycle is performed during the pressure cycle in step 208. In this embodiment, in step 208, the first cleaning medium is removed from the third subchamber and delivered to a filtration system. The filtration system is coupled to both the third subchamber and the first subchamber and configured to remove contaminants from the internal passages of the component to form a filtered first cleaning medium, which may be referred to as a "recycled" first cleaning medium. The filtered first cleaning medium can be used to filter again in one or more filtration cycles, as indicated by arrow 210. Thus, one or more filtration cycles 210 can be performed during a single pressure cycle 214. After each filtration cycle, the filtered first cleaning medium (alone or in combination with fresh first cleaning medium) is used to form the next pressurized flow. After one or more filtration cycles 210, the vacuum system can be shut off in step 212, as indicated by arrow 216, to terminate the first pressure cycle. In other embodiments, the filtered first cleaning medium (obtained by step 208 ) may be used in conjunction with fresh first cleaning medium introduced into the first sub-chamber in step 218 .

[0049] Thus, method 200 can perform one or more pressure cycles 214, with each pressure cycle 214 performing zero, one, or more filtration cycles 210. In one embodiment, each pressure cycle 214 creates and dissipates a pressurized flow based on a pressure differential and a rotational speed of the first cleaning medium to deliver the pressurized flow of the first cleaning medium to the internal passages of the component and remove multiple contaminants. In another embodiment, each pressure cycle 214 creates a linear flow based on a pressure differential when a rotational speed of the first cleaning medium is not established. The pressure in the first subchamber is the same, for example, between pressure cycles 214. In other embodiments, the pressure in the first subchamber can vary between pressure cycles 214 or during a single pressure cycle 214, including two or more filtration cycles 210. The pressure in the third subchamber is the same, for example, between pressure cycles 214. In other embodiments, the pressure in the third subchamber can vary between pressure cycles 214 or during a single pressure cycle 214, including two or more filtration cycles 210. Similarly, the rotational speed of the first cleaning medium optionally established in step 202 may vary during one pressure cycle 214 comprising one or more filtration cycles 210. In other embodiments, the rotational speed of the first cleaning medium optionally established in step 202 may vary between two or more pressure cycles 214, each comprising one or more filtration cycles 210.

[0050] In some embodiments, the component disposed in the second subchamber may include three or more openings. In this embodiment, the additional openings may be plugged, for example, before initiating the first pressure cycle. In other embodiments, the additional openings may be connected to additional internal passages of the component. Methods 100 and 200 may be used to remove contaminants from additional internal passages of the component by appropriately plugging and unplugging the openings to form a fluid path through one or more internal passages of the component. In still other embodiments, depending on the geometry of the internal passages, multiple contaminants may be removed simultaneously from two or more internal passages. <Single Sub-Chamber Stack Cleaning System>

[0051] 3 illustrates a cleaning system 300 according to various aspects of the present disclosure. The cleaning system 300 can be used in the methods 100 and 200 described above. A number of programmable logics, which can be configured as one or more cleaning programs executed by the cleaning system, can be stored in a non-transitory computer-readable medium, such as a data store 366. The data store 366 can be local to the cleaning system 300 or can be accessed remotely by a number of hardware components 368 included in the cleaning system 300. In another example, the cleaning system 300 can manually activate and enable the number of hardware components 368 using one or more buttons, switches, or other elements.

[0052] The cleaning system 300 includes a chamber 302 divided into multiple subchambers, including a first subchamber 310. The first subchamber 310 is separated from a second subchamber 308 via a first partition member 314. The first partition member 314 is configured to isolate adjacent subchambers. Isolation between adjacent subchambers can establish and maintain one or more different pressures, temperatures, or chemical environments. For example, the first subchamber 310 and the second subchamber 308 can have at least one of different pressures, temperatures, or chemical environments. The second subchamber 308 is separated from an adjacent third subchamber 306 by a second partition member 312. The combination of the first subchamber 310, the second subchamber 308, and the third subchamber 306 is sometimes referred to as a "subchamber stack."

[0053] The first partition member 314 includes at least one first opening 342, sometimes referred to as a first through-hole. The first opening 342 can be configured to receive a first coupling mechanism 322 that couples to a first end 324 of the component 316. The first coupling mechanism 322 can be disposed in the first opening 342 and coupled to the opening by one or more means described below. In one example, the component 316 shown in inset 316 of FIG. 3 has an outer surface 352, a first end 324 having a first end opening 354, a second end 320 having a second end opening 356, and an inner surface 360 ​​that defines an internal passageway 350. The internal passageway 350 can be of various sizes and cross-sectional shapes, including, for example, polygonal, circular, elliptical, triangular, or combinations of these shapes. In some embodiments, the internal passageway 350 can have various coatings, smoothness, porosity, or other features that are not damaged by the methods described herein.

[0054] The component 316 can be of various shapes and materials, including metals, alloys, polymers, ceramics, composites, or combinations of two or more materials. In various examples, the component 316 can have internal passageways 350 with various cross-sectional shapes. Examples of shapes include circular, oval, polygonal, and the like, or a combination of shapes. In some examples, the internal passageways 350 decrease in diameter, for example, from the first end 324 of the component 316 to the second end 320, or vice versa. In other examples, the diameter and / or cross-sectional shape varies in other ways along the length of the component 316. In some examples, the shape of the component 316 can include shapes or combinations of shapes, such as a straight tubular structure, a corkscrew-shaped structure with one or more turns, or a curved structure with one or more bends (e.g., an "S" bend). In still other examples, the component 316 can have three or more openings, which can form multiple internal passageways. Some of the internal passages may be connected to one another, while other internal passages may not be connected to additional internal passages. In some cases, component 316 is not part of cleaning system 300, such as when various features of cleaning system 300 are being tested or assembled, or when cleaning system 300 is shipped.

[0055] Each of the first partition member 314 and the second partition member 312 can be formed from various materials or combinations of materials, such as metals, alloys, ceramics, and polymers. The second partition member 312 includes a second opening 344, which may also be referred to as a second through-hole. The first opening 342 and the second opening 344 are configured to form a fluid path through the second subchamber 308, regardless of whether a component 316 is disposed within the second subchamber 308. The second opening 344 can be configured to receive a second coupling mechanism 318 configured to couple to the second end 320 of the component 316. The second coupling mechanism 318 can be disposed in the second opening 344 and coupled to the opening by one or more means described below. Each of the first coupling mechanism 322 and the second coupling mechanism 318 can be configured to couple to the component 316 as at least one of a press-fit mechanism, a clamp, an adhesive, a magnetic chuck, or a combination thereof. Thus, depending on the embodiment, each of the first and second coupling mechanisms 322 and 318 can employ the same or different mechanisms to removably couple to the component 316. Furthermore, each of the first and second coupling mechanisms 322 and 318 can be configured to couple to the first and second partition members 314 and 312, respectively, as at least one of a press-fit mechanism, a clamp, an adhesive, a magnetic chuck, or a combination thereof.

[0056] The component 316 is removably coupled to the second subchamber 308 via a first coupling mechanism 322 and a second coupling mechanism 318. This coupling can occur before or after one or both of the coupling mechanisms (318, 322) are coupled to their respective partition members (312, 314). The first coupling mechanism 322 is configured to form a seal with the first partition member 314. Part of the seal formed between the first partition member 314 and the first coupling mechanism 322 is formed by the first coupling mechanism 322 fitting into the first opening 342. Similarly, the second coupling mechanism 318 is configured to form a seal with the second partition member 312. Part of the seal formed between the second partition member 312 and the second coupling mechanism 318 is formed by the second coupling mechanism 318 fitting into the second opening 344. Each seal is formed to maintain isolation between the first subchamber 310 and the second subchamber 308, which in turn maintains isolation between the third subchamber 306. Similar to the first divider member 314, the second divider member 312 is configured to isolate adjacent subchambers, such that each of the third subchamber 306 and the second subchamber 308 may have one or more of a different pressure, temperature, or chemical environment than the adjacent chamber. Multiple sensors 364 may be coupled to the cleaning system 300. The multiple sensors 364 may include, for example, pressure (leak) sensors, temperature sensors, or other sensors, selected to ensure that the subchambers remain isolated so that a pressure differential sufficient to create at least a pressurized flow is created. Depending on the embodiment, one or more cleaning programs may be configured to determine whether a leak is present before, during, and after one or more pressure cycles of the cleaning system 300.

[0057] The second subchamber 308 may include an inlet on one or more sides for inserting and removing the component 316 into the second subchamber 308. Depending on the embodiment, the component 316 may be removed from the second subchamber 308 with or without removing one or both of the coupling mechanisms (318, 322) from the second subchamber. While a single component 316 is shown disposed in the second subchamber 308, in other embodiments, multiple components may be disposed in the second subchamber 308 and may be washed simultaneously.

[0058] In FIG. 3 , the first end 324 and the second end 320 are shown as both located along an axis 358. In other embodiments, the first end 324 and the second end 320 of the component may not be aligned along a common axis. Accordingly, the first and second coupling mechanisms 322 and 318 may be adjustable to accommodate ends of the component 316 that do not share a common axis and have different diameters and shapes. In some embodiments, which may be combined with other embodiments described herein, the first and second coupling mechanisms 322 and 318 may be adjustable to accommodate various pipe diameters. Additionally, the first and second coupling mechanisms 322 and 318 may be configured to quickly clamp and unclamp the first and second ends 324 and 320, respectively.

[0059] First subchamber 310 and third subchamber 306 are each shown in FIG. 3 as being substantially rectangular and having a substantially similar volume. Second subchamber 308 is also shown as being rectangular and having a larger size and volume. In other embodiments, the shape and volume of each of first subchamber 310, second subchamber 308, and third subchamber 306 can vary. In still other embodiments, second subchamber 308 can be configured in various ways to avoid being a completely closed subchamber. This may be desirable, for example, when cleaning of exterior surface 352 of component 316 is performed using tools and / or cleaning media or methods that are easier to perform with the area shown in FIG. 3 where second subchamber 308 is open or partially open.

[0060] A first cleaning medium (not shown here) can be provided in a first container 340. The first container 340 is coupled to the first subchamber 310 for introducing the first cleaning medium into the first subchamber 310. An agitator 330 is optionally coupled to the first subchamber 310. The agitator 330 can be, for example, a cyclone generator optionally configured to establish a rotational speed 362 of the first cleaning medium within the first subchamber 310. In other embodiments, the agitator 330 can additionally or alternatively be configured to introduce a plurality of gas bubbles into the first cleaning medium. The agitator 330 can be configured to extend from the lower surface 310B of the first subchamber 310 or from the upper surface 310A of the first subchamber 310. Depending on the embodiment, the agitator 330 can include, for example, one or more propellers, tubes, or other elements configured to perform the function of an agitator, such as the agitator 330 described later in this specification in FIG. 5.

[0061] The first temperature controller 326 may be coupled to the first container 340 and / or the first sub-chamber 310 and configured to control the temperature of the first cleaning medium in the first container 340. In one example, the temperature of the first cleaning medium in the first container 340 is, for example, about 15°C to about 100°C. In another example, the temperature of the first cleaning medium in the first container 340 is, for example, about 35°C to about 80°C. In yet another example, the temperature of the first cleaning medium in the first container 340 is, for example, about 15°C to about 40°C. In another example, the first temperature controller may alternatively or additionally be configured to control the temperature of the first sub-chamber 310. In this example, the temperature of the first sub-chamber 310 is, for example, about 15°C to about 40°C. In one example, the temperature of the first cleaning medium in the first container 340 is substantially the same as the temperature of the first sub-chamber 310 (e.g., within 5%, 3%, or 1%, depending on the example). In another example, the temperature of the first cleaning medium in the first container 340 differs from the temperature of the first sub-chamber 310 (e.g., by 5% or more).

[0062] A second container 338 may be coupled to the second subchamber 308. The second container 338 contains a plurality of second cleaning media used to clean the exterior surface 352 of the component 316 as described above in the method 100. The second cleaning medium may be provided from the second container 338, for example, as a liquid, a spray, a mist, or condensed vapor from a boiling pool of liquid. The second container 338 may be configured to deliver the second cleaning medium to the second subchamber 308. A second temperature controller 348 may be coupled to the second subchamber 308 and / or the second container 338. The second temperature controller 348 may be configured to control one or both of the temperature of the plurality of second cleaning media in the second container 338 or the temperature of the second subchamber 308. In one example, the temperature of the second cleaning medium in the second container 338 is, for example, about 15°C to about 100°C. In another example, the temperature of the second cleaning medium in the second container 338 is, for example, about 15° C. to about 40° C. In yet another example, the temperature of the second cleaning medium in the second container 338 is, for example, about 45° C. to about 80° C.

[0063] Next, regarding the temperature of the second sub-chamber 308, in one example, the temperature is, for example, about 15°C to about 100°C. In another example, the temperature of the second sub-chamber is, for example, about 15°C to about 40°C. In yet another example, the temperature of the second sub-chamber is, for example, about 35°C to about 80°C. In one example, the temperature of the second cleaning medium in the second container 338 is substantially the same as the temperature of the second sub-chamber 308 (for example, within 5%, 3%, or 1%, depending on the embodiment). In another example, the temperature of the second cleaning medium in the second container 338 is different from the temperature of the second sub-chamber 308 (for example, by 5% or more).

[0064] A vacuum system 304 is coupled to the third subchamber 306. The vacuum system 304 can be configured in various ways, as detailed in FIG. 4 . The vacuum system 304 is configured to establish a vacuum pressure within the third subchamber 306. The pressure established in the third subchamber 306 can be lower than the pressure in the first subchamber, and this pressure differential can create a pressurized flow of the first cleaning medium through the component 316 in the second subchamber 308. Note that even if the component 316 is not located in the second subchamber 308, a fluid path can exist within the second subchamber 308, and a pressurized flow can be created in response to the pressure differential. In such an example, the fluid path created by the pressure differential can extend along the central axis of the second subchamber 308. The resulting pressurized flow can then be used to clean or coat the second subchamber 308. In another example where no component 316 is connected to the cleaning system 300, agitation, e.g., rotational speed, of the first cleaning medium in the first sub-chamber 310 can be used to create a vortex to clean or coat the second sub-chamber 308.

[0065] A waste container 346 is coupled to the third subchamber 306 and configured to remove the first cleaning medium from the third subchamber 306. The first cleaning medium can be removed from the third subchamber 306 after a pressure cycle is completed. In another embodiment, the first cleaning medium can be removed from the third subchamber 306 during one or more pressure cycles. A filtration system 334 is coupled to the first subchamber 310 and the third subchamber 306. The filtration system 334 includes one or more first conduits 336A coupled to the third subchamber 306 and at least one filter 332. The waste container 346 can be configured to permanently remove unfiltered first cleaning medium. For example, the first cleaning medium in the third subchamber 306 may contain contaminants removed from the internal passages of the component 316, but is removed from the system 300 when the vacuum system 304 is turned off to prevent it from falling back into the component 316 and contaminating it. When the filtration system 334 is used, one or more first conduits 336A remove the used first cleaning medium from the third subchamber 306. At least one filter 332 is connected to the one or more first conduits 336A and one or more second conduits 336B, which are further connected to the first subchamber 310. In some examples, the at least one filter 332 can be multiple filters of various materials, dimensions, and / or pore sizes. Examples of these materials include various ceramic and composite materials. In one example, the used first cleaning medium is passed from the third subchamber 306 through the at least one filter 332, which removes contaminants removed by the first cleaning medium from the internal passages of the component 316. The filtered first cleaning medium is then returned to the first subchamber 310 via one or more second conduits 336B. The filtered first cleaning medium may also be referred to as a "recycled" first cleaning medium. In one embodiment, for example, the filtered first cleaning medium is used alone to form the pressurized flow.In another embodiment, for example, filtered first cleaning medium is used in combination with fresh, unused cleaning medium from first container 340 to form one or more pressurized flows through internal passageway 350 during one or more pressure cycles.

[0066] Thus, cleaning system 300 can be used to clean one or more internal passages 350 of component 316. Cleaning system 300 can generate multiple pressurized flows through internal passage 350 of component 316 during pressure cycles while vacuum system 304 is activated. During each pressurized flow, a first cleaning medium is introduced into internal passage 350. Each pressure cycle can include, for example, one or more filtration cycles during which the first cleaning medium is passed from third subchamber 306 through filtration system 334 and back into first subchamber 310. In this manner, cleaning system 300 removes contaminants and the first cleaning medium from internal passage 350, allowing component 316 to be installed back into industrial equipment, aerospace assemblies, or other assemblies. <Vacuum system>

[0067] FIG. 4 illustrates an exemplary vacuum system 400 according to various embodiments of the present disclosure. This exemplary vacuum system 400 may be similar to, for example, the vacuum system 304 in FIG. 3 and may be configured to establish a pressure in the third sub-chamber 306. In this example, the vacuum system 400 includes a vacuum pump 402 coupled to a buffer chamber 404. The vacuum pump 402 is configured to establish a pressure in at least one sub-chamber of the cleaning chamber 302. The pressure established by the vacuum pump 402 may be, for example, from about 0.01 Pascal (Pa) to about 1 Pa. The buffer chamber 404 may be configured to adjust the pressure established by the vacuum pump 402 via a valve 406 coupled to both the buffer chamber 404 and the cleaning chamber 302. In some examples, the valve 406 may be directly or indirectly coupled to the third sub-chamber 306 of the cleaning chamber 302. <Multiple subchamber stack cleaning system>

[0068] 5 illustrates a cleaning system 500 according to an embodiment of the present disclosure. Programmable logic, which may be configured as one or more cleaning programs executed by the cleaning system 500, may be stored in a non-transitory computer-readable medium, such as a data store 542. The data store 542 may be local to the cleaning system 500 or may be accessed remotely by hardware components 544 included in the cleaning system 500. In another example, the cleaning system 500 may manually activate and enable the hardware components 544 using one or more buttons, switches, or other elements.

[0069] The cleaning system 500 includes a cleaning chamber 518 divided into multiple subchambers forming a subchamber stack. Each subchamber stack of the cleaning system 500 is configured to hold multiple components. The cleaning system 500 may be configured to remove contaminants from one or more internal passages of the components by executing one or more cleaning programs. The cleaning system 500 may also be configured to remove contaminants from one or more external surfaces of the components. In the cleaning system 500, each cleaning chamber in the multiple cleaning chambers 518 includes a first subchamber 506, a second subchamber 504, and a third subchamber 502. Each of these subchambers (506, 504, 502) may be further divided to form multiple subchamber stacks, each configured to clean at least one component in one or more of the following ways: simultaneously, overlapping, and / or sequentially.

[0070] In one embodiment, the second subchamber 504 is divided into multiple second subchambers 504A, 504B, 504C, 504D, 504E, and 504F. Components can be placed in one or more of the multiple second subchambers 504A, 504B, 504C, 504D, 504E, and 504F for simultaneous, overlapping, and / or sequential cleaning using methods 100 and 200 described above. In some embodiments, the cleaning system 500 includes the first subchamber 506 subdivided into multiple first subchambers 506A, 506B, 506C, 506D, 506E, and 506F, for example. In this embodiment, a first partition member 522 separates each of the plurality of first subchambers 506A, 506B, 506C, 506D, 506E, and 506F from an adjacent second subchamber 504A, 504B, 504C, 504D, 504E, and 504F. Each of the plurality of first subchambers 506A, 506B, 506C, 506D, 506E, and 506F is separated from an adjacent first subchamber via, for example, a first plurality of partition members 524. Similarly, each of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, and 504F is separated from an adjacent second subchamber via a second plurality of partition members 526. Each of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, and 504F is separated from the corresponding third sub-chamber 502 via a second partition member 520.

[0071] The configuration of each of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, and 504F, particularly the configuration when a component is disposed therein, is described below in FIG. 6. In another embodiment, which may be combined with other embodiments described herein, the third subchamber 502 can be divided into a plurality of third subchambers 502A, 502B, 502C, 502D, 502E, and 502F using a third plurality of dividers 528. As noted above, each combination of subchambers configured to perform a cleaning program on a component can be referred to herein as a "subchamber stack." Thus, since each subchamber stack includes a first subchamber (506X, where X is A, B, C, D, E, or F), a second subchamber (504X), and a third subchamber (502X), the first subchamber stack of cleaning system 500 includes 506A, 504A, 502A, the second subchamber stack includes 506B, 504B, 502B, and so on.

[0072] A vacuum system 536 is coupled to the third subchamber 502 of the cleaning chamber 518. The vacuum system 536 may be similar to, for example, vacuum system 400 in Figure 4. In embodiments in which the third subchamber 502 is divided into multiple third subchambers 502A, 502B, 502C, 502D, 502E, and 502F using the multiple third partition members 528, the vacuum system 536 may be coupled to each of the multiple third subchambers 502A, 502B, 502C, 502D, 502E, and 502F. In embodiments in which the first subchamber 506 is divided into multiple first subchambers 506A, 506B, 506C, 506D, 506E, and 506F, an agitator (516A, 516B, 516C, 516D, 516E, and 516F) can optionally be coupled to each first subchamber. Each agitator (516A, 516B, 516C, 516D, 516E, and 516F) can be configured to generate a rotational velocity of the first cleaning medium. In other embodiments, each agitator (516A, 516B, 516C, 516D, 516E, and 516F) can additionally or alternatively be configured to agitate the first cleaning medium to induce a plurality of bubbles, depending on whether a linear flow or a vortex flow is desired. The first container 514 can be configured to hold the first cleaning medium. The first container 514 can be connected to one or more of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F. The first cleaning medium can be introduced from the first container 514 into each of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F. A first temperature controller 512 can be connected to the first container 514. The temperature of the first cleaning medium in the first container 514 is, for example, about 15°C to about 40°C. Additionally or alternatively, the first temperature controller 512 can be connected to one or more of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F to adjust the temperature thereof.

[0073] In some embodiments (not shown), a separate temperature controller is coupled to each of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F to individually control the temperature of the first cleaning medium and / or each of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F. The temperature of each of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F may be, for example, between about 15°C and about 40°C. Additionally, the temperature of at least one of the plurality of first sub-chambers 506A, 506B, 506C, 506D, 506E, and 506F may be different from the temperature of the other first sub-chambers of the plurality of first sub-chambers. In one example, the temperature of the first cleaning medium in the first container 514 is substantially the same as the temperature of one or more of the first sub-chambers 506A, 506B, 506C, 506D, 506E, 506F (e.g., within 5%, 3%, or 1%, depending on the example). In another example, the temperature of the first cleaning medium in the first container 514 is different from the temperature of one or more of the first sub-chambers 506A, 506B, 506C, 506D, 506E, 506F (e.g., by 5% or more).

[0074] The vacuum system 536 is configured to establish a pressure differential from the first plurality of sub-chambers 506A, 506B, 506C, 506D, 506E, 506F to the third sub-chamber 502 or plurality of third sub-chambers 502A, 502B, 502C, 502D, 502E, 502F to create one or more pressurized flows of the first cleaning medium, one or more of which may be vortex flows, as described above in FIG. 3. The plurality of leak, temperature, and / or other sensors 508 can be positioned in the system 500 in various ways to ensure that the sub-chambers remain fluidly isolated from one another, at least to create the pressure differential required to create the pressurized flows.

[0075] A second container 510 is coupled to each of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F. The second container 510 is configured to introduce a second cleaning medium into one or more of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F to clean exterior surfaces of components (not shown) disposed within the second sub-chambers. The second cleaning medium is provided from the second container 510, for example, as a liquid, a spray, a mist, or condensed vapor from a boiling pool of liquid. In some embodiments, a second temperature controller 530 is coupled to one or both of the second vessel 510 and one or more of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F to regulate the temperature of the second cleaning medium in the second vessel 510 or the temperature of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F.

[0076] In some embodiments (not shown), a separate temperature controller is coupled to each of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, 504F to individually control the temperature of the second cleaning medium and / or each of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, 504F. In one example, the temperature of the second cleaning medium in the second vessel 510 is substantially the same as the temperature of one or more of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, 504F (e.g., within 5%, 3%, or 1%, depending on the embodiment). In another example, the temperature of the second cleaning medium in the second vessel 510 is different from the temperature of one or more of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, 504F. (For example, a difference of 5% or more.)

[0077] FIG. 5 also illustrates an example of a filtration system 534. The exemplary filtration system 534 includes a first conduit 518A connected to the third subchamber 502 and at least one filter 532. The one or more first conduits 518A remove used first cleaning medium from the third subchamber 502. The at least one filter 532 is connected to the one or more first conduits 518A and one or more second conduits 518B. The second conduit 518B is further connected to each of the plurality of first subchambers 506A, 506B, 506C, 506D, 506E, and 506F. In some examples, the at least one filter 532 can be multiple filters of different materials, sizes, and / or pore sizes. The used first cleaning medium is passed through the at least one filter 532, which removes contaminants from the first cleaning medium. Contaminants in the first cleaning medium result from passing the first cleaning medium through internal passages of components (not shown) located in one or more of the second subchambers 504A, 504B, 504C, 504D, 504E, and 504F. The filtered first cleaning medium is returned to one or more of the first subchambers 506A, 506B, 506C, 506D, 506E, and 506F via one or more second conduits 518B. The filtered first cleaning medium, which may also be referred to as a “recycled” first cleaning medium, may be used alone or in combination with new, unused cleaning medium from the first vessel 514 during one or more pressure cycles. As described above, multiple pressurized streams may be generated during pressure cycles while the vacuum system 304 is activated.

[0078] In embodiments in which the third subchamber 502 is divided into multiple third subchambers 502A, 502B, 502C, 502D, 502E, and 502F, a separate filtration system 534 and / or a separate first conduit 518A may be coupled to each of the multiple third subchambers 502A, 502B, 502C, 502D, 502E, and 502F. Similarly, a separate second conduit 518B may be coupled to one or more of the multiple first subchambers 506A, 506B, 506C, 506D, 506E, and 506F. In one embodiment, the filtration system 534 may be configured to return filtered cleaning medium from a third subchamber of a particular subchamber stack to a first subchamber of the same stack, e.g., from 506A to 502A. In another example, the filtration system 534 can be configured to return the filtered cleaning medium from the third subchamber of a particular stack of subchambers to the first subchamber of another stack, for example, 506A to 502B, 502C, 502D, 502E, or 502F. Similar to the waste container 346 of FIG. 3, a waste container 540 can be coupled to one or more of the plurality of third subchambers 502A, 502B, 502C, 502D, 502E, 502F to permanently remove the first cleaning medium from the system.

[0079] In one embodiment, one or more cleaning programs associated with the cleaning system 500 can be executed simultaneously in each subchamber stack. In another embodiment, one or more cleaning programs associated with the cleaning system 500 can be executed independently in each subchamber stack without overlap. Such independent execution can occur sequentially in various orders or combinations of orders. In yet another embodiment, one or more cleaning programs associated with the cleaning system 500 can be executed in an overlapping manner, where execution of a first cleaning program in a first subchamber stack overlaps with a portion of execution of a second cleaning program in a second subchamber stack.

[0080] FIG. 6 illustrates a portion 600 of a cleaning system 500 according to an embodiment of the present disclosure. The portion 600 of the cleaning system 500 illustrated in FIG. 6 illustrates the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, and 504F in more detail. In FIG. 6, components (606A, 606B, 606C, 606D, 606E, and 606F) are disposed in each of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, and 504F. In other embodiments of the system 500, components are not disposed in all of the plurality of second subchambers 504A, 504B, 504C, 504D, 504E, and 504F. In some embodiments, no components are disposed in any of the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F, and a cleaning program can be executed to clean the plurality of second sub-chambers 504A, 504B, 504C, 504D, 504E, 504F.

[0081] 6, each component 606A, 606B, 606C, 606D, 606E, 606F has an outer surface, a first end 610A, 610B, 610C, 610D, 610E, 610F, and a second end 608A, 608B, 608C, 608D, 608E, 608F. Additionally, each component 606A, 606B, 606C, 606D, 606E, 606F has at least one internal passageway (not shown here but similar to internal passageway 350 in FIG. 3) extending from its respective first end 610A, 610B, 610C, 610D, 610E, 610F to its corresponding second end 608A, 608B, 608C, 608D, 608E, 608F. The respective internal passages of each component 606A, 606B, 606C, 606D, 606E, 606F thus define a path for pressurized flow, which may be, for example, a linear flow or a vortex flow, as described above.

[0082] Each of the first ends 610A, 610B, 610C, 610D, 610E, and 610F is removably coupled to a corresponding first coupling mechanism 614A, 614B, 614C, 614D, 614E, and 614F. Similarly, each of the second ends 608A, 608B, 608C, 608D, 608E, and 608F is removably coupled to a corresponding second coupling mechanism 612A, 612B, 612C, 612D, 612E, and 612F. The first partition member 522 has a plurality of first through-holes 616. At least a portion of each of the first coupling mechanisms 614A, 614B, 614C, 614D, 614E, and 614F is disposed in one of the plurality of through-holes 616. The second partition member 520 has a plurality of second through-holes 618, in which at least a portion of each of the second coupling mechanisms 612A, 612B, 612C, 612D, 612E, and 612F is disposed. A first seal is formed between each of the first coupling mechanisms 614A, 614B, 614C, 614D, 614E, and 614F and the plurality of first through-holes 616. Similarly, a second seal is formed between each of the second coupling mechanisms 612A, 612B, 612C, 612D, 612E, and 612F and the plurality of second through-holes 618. Therefore, due to the seals thus formed, each of the first sub-chamber 506, second sub-chamber 504, and third sub-chamber 502 maintains separate and / or distinct pressure, temperature, and / or chemical environments. As mentioned above, the chemical environment of each subchamber may vary and may include, for example, ambient air and / or one or more types of cleaning media that may differ in chemistry or composition, e.g., different subchambers may contain different types (compositions or phases) of cleaning media, filtered cleaning media, or fresh cleaning media.

[0083] In this manner, the systems and methods described herein efficiently and effectively remove contaminants from the internal passages and / or exterior surfaces of various types of components without leaving behind harmful residues. The cleaning methods described herein can be performed in a timely manner and more quickly than current cleaning methods, while achieving similar or better cleanliness than current methods. The methods and systems described herein further clean the components without adversely affecting the dimensional integrity, surface finish, and / or coating of the components described herein. The components can then be returned to an assembly, such as an industrial device or an aerospace assembly, and the industrial device or assembly can operate or be used without being adversely affected by contaminants in the internal passages or residue left in the internal passages by the cleaning medium.

[0084] This disclosure refers to various embodiments. However, the disclosure is not limited to the particular embodiments described. Rather, any combination of the above-described features and elements, whether related to different embodiments, is contemplated for implementing and practicing the teachings presented herein. Furthermore, when elements of an embodiment are described in the form of "at least one of A and B," it should be understood that embodiments including exclusively element A, embodiments including exclusively element B, and embodiments including elements A and B are respectively contemplated. Furthermore, while some embodiments may achieve advantages over other possible solutions or the prior art, the disclosure is not limited by whether a particular advantage is achieved by a given embodiment. Accordingly, the embodiments, features, and advantages disclosed herein are merely exemplary and should not be considered elements or limitations of the appended claims unless expressly recited in the claims. Similarly, references to the "invention" should not be construed as generalizations of the inventive subject matter disclosed herein, and should not be considered elements or limitations of the appended claims unless expressly recited in the claims.

[0085] As will be appreciated by one skilled in the art, aspects described herein may be embodied as a system, method, or computer program product. As such, aspects may take the form of entirely hardware aspects, entirely software aspects (including firmware, resident software, microcode, etc.), or combinations of software and hardware, all of which may be referred to generally herein as a "circuit," "module," or "system." Aspects described herein may also take the form of a computer program product embodied in one or more computer-readable storage medium(s) having computer-readable program code embodied thereon.

[0086] The program code embodied in a computer readable storage medium may be transmitted using any suitable medium including, for example, wireless, wired, fiber optic cable, RF, etc., or any suitable combination thereof.

[0087] Computer program code for carrying out the processes of aspects of the present disclosure may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" programming language or similar programming languages. The program code may run entirely on the user's computer, partially on the user's computer as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet Service Provider).

[0088] Aspects of the present disclosure are described with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products, depending on the aspect. Each block of these flowcharts and / or block diagrams, and combinations of blocks in these flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to configure a machine, and the instructions, executed by the processor of the computer or other programmable data processing device, may form means for performing the functions / acts described in the flowchart and / or block diagram blocks.

[0089] These computer program instructions may be stored on a computer-readable medium that can direct a computer, other programmable data processing device, or other device to function in a particular manner, creating an article of manufacture that includes instructions that implement the functions / acts described in the flowchart and / or block diagram blocks.

[0090] Computer program instructions may also be loaded into a computer, other programmable data processing apparatus, or other device and cause the computer, other programmable data processing apparatus, or other device to execute a series of processing steps, such that the instructions executed on the computer, other programmable data processing apparatus, or other device provide a process for performing the functions / acts described in the flowchart and / or block diagram blocks.

[0091] The flowcharts and block diagrams in the figures illustrate the structure, function, and processing of systems, methods, and computer program products according to various aspects of the present disclosure. In this regard, each block in the flowcharts or block diagrams may represent a module, segment, or portion of code, which is one or more executable instructions for performing a specific logical function. It should be noted that in some alternative implementations, the functions described in the blocks may be performed in an order different from that described in the figures. For example, two blocks shown as successive may in fact be executed substantially simultaneously, or the blocks may be executed in the reverse or different order, depending on the functionality involved. It should be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be realized by a special-purpose hardware-based system that performs the specified functions or operations, or by a combination of special-purpose hardware and computer instructions.

[0092] The present disclosure also includes embodiments according to the following appendices.

[0093] Appendix 1. A cleaning system (300), comprising: The cleaning system includes a cleaning chamber (302), the cleaning chamber comprising: a first sub-chamber (310) configured to hold a first cleaning medium; a second subchamber (308) adjacent to the first subchamber (310); a first partition member (314) positioned between the first sub-chamber (310) and the second sub-chamber (308) and having a first opening (342) formed therein; a third sub-chamber (306) adjacent to the second sub-chamber (308) and configured to receive the first cleaning medium; a second partition member (312) positioned between the second subchamber (308) and the third subchamber (306) and having a second opening (344) formed therein, wherein the first opening (342) and the second opening (314) are configured to form a fluid path through the second subchamber (308); the cleaning system includes a vacuum system (304) coupled to the third subchamber (306), the vacuum system (304) configured to induce a pressurized flow of the first cleaning medium from the first subchamber (310) to the third subchamber (306) by creating a pressure in the third subchamber (306) that is lower than a pressure in the first subchamber (310); The cleaning system includes a filtration system (334) coupled to the first subchamber (310) and the third subchamber (306), the filtration system (334) configured to remove and filter the first cleaning medium from the third subchamber (306) and return the first cleaning medium to the first subchamber (310).

[0094] Supplementary Note 2: A first connecting mechanism (322) detachably connected to the first partition member (314) through the first opening (342); 2. The cleaning system (300) of claim 1, further comprising: a second connection mechanism (318) removably connected to the second partition member (312) via the second opening (344).

[0095] Appendix 3. The method further includes a component (316) disposed in the second subchamber (308), the component (316) comprising: a first end (324) of the component (316) removably coupled to the first coupling mechanism (322); a second end (320) of the component (316) removably coupled to the second coupling mechanism (318); an outer surface (352); and an inner surface (360) defining at least one internal passage (350) extending from the first end (324) of the component (316) to the second end (320) of the component (316).

[0096] Appendix 4. The cleaning system (300) of Appendix 2, wherein each of the first coupling mechanism (322) and the second coupling mechanism (318) includes a press-fit mechanism, a clamp, an adhesive, a magnetic chuck, or a combination thereof.

[0097] Appendix 5. The cleaning system (300) of any one of Appendixes 1 to 4, further comprising a temperature control device (326) coupled to the first sub-chamber (310), the temperature control device (326) configured to regulate the temperature of the first sub-chamber (310).

[0098] Appendix 6. A cleaning system (300) according to any one of Appendixes 1 to 5, further comprising a first container (340) connected to the first subchamber (310), the first container (340) having the first cleaning medium therein and configured to deliver the first cleaning medium to the first subchamber (310).

[0099] Appendix 7. The cleaning system (300) of any one of Appendixes 1 to 6, further comprising a second container (338) connected to the second subchamber (308), the second container (338) having the second cleaning medium therein and configured to deliver the second cleaning medium to the second subchamber (308).

[0100] Appendix 8. A cleaning system (500), comprising: The cleaning system includes a plurality of cleaning chambers (518), each cleaning chamber in the plurality of cleaning chambers (518) comprising: a first sub-chamber (506) configured to hold a first cleaning medium; an agitator (516) coupled to the first subchamber (506) configured to induce and maintain a rotational speed of the first cleaning medium; a second subchamber (504) adjacent to the first subchamber (506); a first partition member (522) positioned between the first sub-chamber (506) and the second sub-chamber (504) and having a plurality of first openings formed therein; a third sub-chamber (502) adjacent to the second sub-chamber (504) and configured to receive the first cleaning medium; a second partition member (520) positioned between the second subchamber (504) and the third subchamber (502) and having a plurality of second openings (618) formed therein, wherein each first opening in the plurality of first openings and each second opening in the plurality of second openings are configured to form a fluid path through the second subchamber; the cleaning system includes a vacuum system (536) coupled to the third sub-chamber (502) of each cleaning chamber in the plurality of cleaning chambers (518), the vacuum system (536) configured to induce a pressurized flow of the first cleaning medium from the first sub-chamber (506) to the third sub-chamber (502) by creating a pressure in the third sub-chamber (502) that is lower than a pressure in the first sub-chamber (506); The cleaning system includes a filtration system (534) coupled to the first subchamber (506) and the third subchamber (502) of each cleaning chamber in the plurality of cleaning chambers (518), the filtration system (534) configured to remove and filter the first cleaning medium from the third subchamber (502) of each cleaning chamber and return the filtered first cleaning medium to the first subchamber (506) of each cleaning chamber.

[0101] Supplementary Note 9: A first coupling mechanism (614A-F) detachably coupled to the first partition member (522) via a first through-hole among the plurality of first through-holes (616); and The cleaning system of claim 8, further comprising a second connection mechanism (612A-F) removably connected to the second partition member (520) via a second through hole among the plurality of second through holes (618).

[0102] Clause 10. The method further includes a component (606A-F) disposed in the second sub-chamber (504) of at least one washing chamber of the plurality of washing chambers (518), the component comprising: a first end (610A-F) of the component removably coupled to the first coupling mechanism (614A-F); a second end (608A-F) of the component removably coupled to the second coupling mechanism (612A-F); an outer surface (352); and an inner surface (360) defining at least one internal passage (350) extending from the first end (610A-F) to the second end (608A-F) of the component (606A-F).

[0103] Appendix 11. A cleaning system described in any of Appendixes 8 to 10, further comprising a first container (514) connected to the first subchamber (506) of each cleaning chamber, the first container (514) containing the first cleaning medium and configured to deliver the first cleaning medium to the first subchamber (506).

[0104] Appendix 12. A cleaning system described in any of Appendixes 8 to 11, further comprising a second container (510) coupled to the second subchamber (504) of each cleaning chamber, the second container (514) containing a second cleaning medium and configured to deliver the second cleaning medium to the second subchamber (504).

[0105] Appendix 13. The cleaning system of any one of Appendixes 8 to 12, further comprising at least one pressure sensor (508) coupled to the first subchamber (506), the second subchamber (504), or the third subchamber (503).

[0106] Appendix 14. A method of using a cleaning system, comprising: and executing (104) a cleaning program, the cleaning program comprising: Initiating a first pressure cycle in the cleaning program (202) with a first cleaning medium in a first sub-chamber of the cleaning chamber and with the first sub-chamber at a first pressure; and during the first pressure cycle (214), activating a vacuum system coupled to a third subchamber of the cleaning chamber to establish a second pressure in the third subchamber (204), the second pressure being lower than the first pressure, the third subchamber being separated from the first subchamber by a second subchamber; a component disposed in the second subchamber, the component having an outer surface and an inner surface, the inner surface defining at least one internal passage; the component is removably coupled to the first sub-chamber by a first coupling mechanism and to the third sub-chamber by a second coupling mechanism; The method includes, in response to the second pressure being less than the first pressure during the first pressure cycle (214), forming (206) a first pressurized flow of the first cleaning medium from the first subchamber through the at least one internal passage of the component to the third subchamber, thereby removing a plurality of contaminants from the at least one internal passage of the component; and deactivating (212) the vacuum system during the first pressure cycle (214), wherein the first pressurized flow of the first cleaning medium is not present in the second sub-chamber when the vacuum system is deactivated.

[0107] Appendix 15. The method further includes performing a first filtration cycle (210) included in the cleaning program, the first filtration cycle comprising: delivering (208) the first cleaning medium from the third subchamber to a filtration system, the filtration system coupled to the third subchamber and the first subchamber, the filtration system removing the plurality of contaminants from the first cleaning medium to form a filtered first cleaning medium; 15. The method of claim 14, further comprising delivering the filtered first cleaning medium to the first subchamber via the filtration system (208).

[0108] Clause 16. The method of clause 14 or 15, wherein the cleaning program includes performing multiple filtration cycles (210) during a pressure cycle (214) before shutting down the vacuum system.

[0109] Addendum 17. After the first filtration cycle, creating a rotational velocity of the filtered first cleaning medium while the first subchamber is at the first pressure (202) during a second pressure cycle (214); During the second pressure cycle (214), while the component is removably coupled to the first subchamber via the first coupling mechanism and to the third subchamber via the second coupling mechanism, activating the vacuum system to establish a third pressure in the third subchamber (204), the third pressure being lower than the first pressure; and 16. The method of claim 14, further comprising, in response to the third pressure being lower than the first pressure during the second pressure cycle, forming (206) a second pressurized flow of the first cleaning medium from the first subchamber through the at least one internal passage of the component to the third subchamber, thereby removing a plurality of contaminants from the at least one internal passage of the component.

[0110] Addendum 18. The method of any of Addendums 14-17, further comprising disposing a second cleaning medium in the second subchamber during execution of the cleaning program to remove contaminants from the exterior surface of the component.

[0111] Appendix 19. The method according to any one of Appendixes 14 to 18, wherein the first pressure is substantially atmospheric pressure, and the second pressure is from about 0.01 Pascal (Pa) to about 1 Pa.

[0112] Appendix 20. The method of any one of Appendixes 14 to 19, wherein the first cleaning medium is selected from the group consisting of a surfactant, a degreasing liquid, a degreasing gas, ambient air, nitrogen, CO2, and combinations thereof.

[0113] Appendix 21. The method of any one of Appendixes 14 to 20, wherein the first cleaning medium comprises a plurality of particles having an average particle size of about 0.5 mm to about 3 mm.

[0114] Clause 22. The method of clause 21, wherein the plurality of particles is selected from the group consisting of polymer particles, ceramic particles, glass particles, and combinations thereof.

[0115] Addendum 23. The method of any one of Addendums 14 to 22, wherein the first pressurized flow is a linear flow.

[0116] Addendum 24. The method of any one of Addendums 14 to 23, further comprising agitating the first cleaning medium during the first pressure cycle (202) to establish a rotational speed of the first cleaning medium, wherein the first pressurized flow formed by the first cleaning medium having the rotational speed is a vortex flow.

[0117] While aspects of the present disclosure have been described above, other and further aspects of the disclosure may be devised without departing from the basic scope thereof, the scope of the present disclosure being determined by the claims that follow.

Claims

1. A cleaning system for cleaning internal passages and external surfaces of a component, comprising: The cleaning system includes a cleaning chamber, the cleaning chamber comprising: a first subchamber configured to hold a first cleaning medium; a second sub-chamber adjacent to the first sub-chamber; a first partition member positioned between the first sub-chamber and the second sub-chamber and having a first opening formed therein; a third sub-chamber adjacent to the second sub-chamber and configured to receive the first cleaning medium; a second partition member positioned between the second sub-chamber and the third sub-chamber and having a second opening formed therein, the first opening and the second opening being configured to form a fluid path through the second sub-chamber; the cleaning system further includes a first container coupled to the first subchamber, a second container coupled to the second subchamber, a vacuum system coupled to the third subchamber, and a filtration system coupled to the first subchamber and the third subchamber; the first container is configured to contain the first cleaning medium and deliver the first cleaning medium into the first sub-chamber; the second container is configured to contain a second cleaning medium and deliver the second cleaning medium into the second sub-chamber to clean an exterior surface of the component; the vacuum system is configured to create a pressure in the third subchamber that is lower than a pressure in the first subchamber to induce a pressurized flow of the first cleaning medium from the first subchamber through the internal passage of the component and into the third subchamber to clean the internal passage; the filtration system is configured to remove and filter the first cleaning medium from the third subchamber and return the first cleaning medium to the first subchamber; A cleaning system, wherein at least one of the first cleaning medium and the second cleaning medium comprises a plurality of particles.

2. A first coupling mechanism removably coupled to a first end of the component and removably coupled to the first partition member via the first opening; 10. The cleaning system of claim 1, further comprising: a second coupling mechanism removably coupled to a second end of the component and removably coupled to the second partition member through the second opening.

3. A cleaning system as described in claim 1, wherein the average particle size of the plurality of particles is 0.5 mm to 3 mm.

4. A cleaning system as described in claim 2 or 3, wherein the plurality of particles are selected from the group consisting of polymer particles, ceramic particles, glass particles, and combinations thereof.

5. 5. The cleaning system of claim 1, further comprising a temperature controller coupled to the first sub-chamber, the temperature controller configured to regulate a temperature of the first sub-chamber.

6. A cleaning system for cleaning the internal passages and external surfaces of each of a plurality of components, comprising: The cleaning system includes a plurality of cleaning chambers, each cleaning chamber in the plurality of cleaning chambers comprising: a first subchamber configured to hold a first cleaning medium; an agitator coupled to the first subchamber configured to induce and maintain a rotational velocity of the first cleaning medium; a second sub-chamber adjacent to the first sub-chamber; a first partition member positioned between the first sub-chamber and the second sub-chamber and having a plurality of first openings formed therein; a third sub-chamber adjacent to the second sub-chamber and configured to receive the first cleaning medium; a second partition member positioned between the second sub-chamber and the third sub-chamber and having a plurality of second openings formed therein, wherein each first opening in the plurality of first openings and each second opening in the plurality of second openings are configured to form a fluid path through the second sub-chamber; the cleaning system further includes, in each cleaning chamber of the plurality of cleaning chambers, a first container connected to the first subchamber, a second container connected to the second subchamber, a vacuum system connected to the third subchamber of each cleaning chamber, and a filtration system connected to the first subchamber and the third subchamber; the first container is configured to contain the first cleaning medium and deliver the first cleaning medium into the first sub-chamber of each cleaning chamber; the second container contains a second cleaning medium and is configured to deliver the second cleaning medium into the second sub-chamber of each cleaning chamber to clean an exterior surface of each component in the plurality of components; the vacuum system is configured to create a pressure in the third subchamber that is lower than a pressure in the first subchamber to induce a pressurized flow of the first cleaning medium from the first subchamber through the internal passages of each component and into the third subchamber to clean the internal passages; the cleaning system includes a filtration system coupled to the first subchamber and the third subchamber of each cleaning chamber in the plurality of cleaning chambers, the filtration system configured to remove and filter the first cleaning medium from the third subchamber of each cleaning chamber and return the filtered first cleaning medium to the first subchamber of each cleaning chamber; A cleaning system, wherein at least one of the first cleaning medium and the second cleaning medium comprises a plurality of particles.

7. A first coupling mechanism that is removably coupled to a first end of each component and is removably coupled to the first partition member via a first through hole of a plurality of first through holes; and 7. The cleaning system of claim 6, further comprising a second coupling mechanism removably coupled to a second end of each component and removably coupled to the second partition member via a second through hole of the plurality of second through holes.

8. A cleaning system as described in claim 6, wherein the average particle size of the plurality of particles is 0.5 mm to 3 mm.

9. A cleaning system as described in claim 7 or 8, wherein the plurality of particles are selected from the group consisting of polymer particles, ceramic particles, glass particles, and combinations thereof.

10. 10. The cleaning system of claim 6, further comprising a temperature controller coupled to the first sub-chamber of each cleaning chamber, the temperature controller configured to regulate the temperature of the first sub-chamber.

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