Case-molded film capacitors

The case-molded film capacitor integrates an insulating component with a holding portion and insulating portions to reduce the number of components needed for insulation, enhancing assembly efficiency and reliability by preventing conductor-metal case contact.

JP7757229B2Active Publication Date: 2025-10-21NICHICON CORP
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Patent Information

Application Number
JP2022055174
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-03-30
Publication Date
2025-10-21
Estimated Expiration
2042-03-30

AI Technical Summary

Technical Problem

The increase in the number of different polarities in film capacitors leads to a proportional increase in the number of components required for insulation, complicating assembly and increasing manufacturing complexity.

Method used

A case-molded film capacitor design integrates an insulating component with a holding portion and insulating portions between conductors, reducing the number of components needed for insulation by forming an insulating component as an integrated part, thereby preventing conductors from contacting the metal case.

Benefits of technology

This design reduces the number of insulating components required, improving assembly efficiency and minimizing the number of molds needed, while ensuring reliable insulation between conductors and the metal case.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a case-mold film capacitor that suppresses an increase in the number of insulating parts used for insulation between multiple polarities.SOLUTION: In an insulating spacer 40, a first extension portion 45a of an assembled portion 45 that insulates a first bus bar 20 of one of the N pole or P pole and a second bus bar 30 of the other N pole or P pole is provided, stop portions 47A, 47B, and 47C are provided to insulate the first bus bar 20 and a metal case 60 used as a ground electrode are provided, and stop portions 46A, 46B, and 46C that insulate a second bus bar 30 and the metal case 60 used as a ground electrode are provided.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a case-molded film capacitor that provides insulation between multiple polarities. [Background technology]

[0002] In recent years, from the perspective of environmental protection, all electrical equipment is being controlled by inverter circuits, and efforts are being made to save energy and improve efficiency. In particular, in the automotive industry, hybrid electric vehicles (hereinafter referred to as "HEVs") and electric vehicles (hereinafter referred to as "EVs") that run on electric motors and gasoline engines have been introduced to the market, and the development of technologies related to energy saving and high efficiency is becoming more active.

[0003] Because the electric motors used in these HEVs and EVs have a high operating voltage range of several hundred volts, metallized film capacitor elements, which have high withstand voltage and low loss electrical properties, are attracting attention as capacitor elements used in connection with these electric motors, and there is also a noticeable trend toward metallized film capacitor elements with extremely long life spans due to the market demand for maintenance-free operation. Note that below, "metallized film capacitor elements" may also be referred to simply as "film capacitor elements."

[0004] For this reason, there has conventionally been case-molded film capacitors in which a metallized film capacitor element (film capacitor element) is resin-molded in a case together with a filled resin. Examples of case-molded film capacitors include a case, a film capacitor element, a P-pole bus bar connected at one end to an end-face electrode formed on one end face of the film capacitor element and having an external connection terminal at the other end, an N-pole bus bar connected at one end to an end-face electrode formed on the other end face of the film capacitor element and having an external connection terminal at the other end, a filled resin that is filled into the case while the film capacitor element is housed in the case, an inter-electrode insulating member disposed between the P-pole bus bar and the N-pole bus bar, and a peripheral insulating member disposed on the outer periphery of the P-pole bus bar and the N-pole bus bar (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-095627 Summary of the Invention [Problem to be solved by the invention]

[0006] However, since insulation is required between different polarities, there is a problem that if the number of different polarities increases, the number of components used for insulation between polarities increases proportionately.

[0007] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a case-molded film capacitor in which an increase in the number of components (insulating components) used for insulation between polarities is suppressed when the number of different polarities increases. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, the case-molded film capacitor of the present invention is characterized by comprising: a film capacitor element having a first end surface electrode corresponding to one of the polarities of the first or second pole on one end surface and a second end surface electrode corresponding to the other polarity on the other end surface; an insulating part that is an integrally molded product and has: a first conductor electrically connected to the first end surface electrode of the film capacitor element; a second conductor electrically connected to the second end surface electrode of the film capacitor element; a holding part that holds the film capacitor element; and a first insulating part arranged between the first conductor and the second conductor; a metal case that is open on one side and accommodates the film capacitor element, the insulating part, the first conductor, and the second conductor, and serves as an electrode of a third pole different from the first and second poles; and a filling resin part that is filled in the case and molds at least the film capacitor element.

[0009] This configuration integrates an insulating component having a holding portion for holding the film capacitor element and a first insulating portion disposed between the first conductor (connected to the first end-face electrode of the film capacitor element corresponding to one of the first or second poles) and the second conductor (connected to the second end-face electrode of the film capacitor element corresponding to the other of the first or second poles). This facilitates arranging the first conductor and the second conductor so that they do not come into contact with the metal case (the case that serves as the third pole), thereby isolating the first conductor and the second conductor from the metal case. This reduces the number of components (insulating components) required for insulation between polarities when the number of different polarities increases, and by reducing the number of components (insulating components), the efficiency of assembling the case-molded film capacitor is improved. Furthermore, by forming the insulating component as an integrated part, the number of molds required for manufacturing the insulating components is reduced.

[0010] The insulating component may also be provided with a second insulating portion that insulates the first conductor from the metal case, and a third insulating portion that insulates the second conductor from the metal case.

[0011] According to this configuration, an insulating component having a first insulating portion that insulates the first conductor from the second conductor is provided with a second insulating portion that insulates the first conductor from the metal case and a third insulating portion that insulates the second conductor from the metal case. In this way, the insulating component that insulates the first conductor from the second conductor can be used to insulate the first conductor from the metal case and the second conductor from the metal case. This ensures reliable insulation between the first conductor and the metal case, and also between the second conductor and the metal case. This reduces the number of components (insulating components) required for insulation between polarities when the number of different polarities increases. Furthermore, minimizing the increase in the number of components (insulating components) improves the efficiency of assembling the case-molded film capacitor.

[0012] The insulating component may also have a frame-shaped frame portion inside which the film capacitor element is arranged, a first insulating portion provided on the outer surface of a first side portion of the frame portion whose outer surface faces the opening surface of the opening of the metal case, a second insulating portion provided on a side of the frame portion other than the first side portion, and a third insulating portion provided on a side of the frame portion other than the first side portion.

[0013] According to this, by providing the second insulating portion and the third insulating portion on, for example, the same side other than the first side on which the first insulating portion is provided, it is possible to prevent the first insulating portion from interfering with the second insulating portion and the third insulating portion, and the second insulating portion and the third insulating portion from interfering with the first insulating portion when assembling the case-molded film capacitor.

[0014] The second insulating portion may be provided on a second side portion of the frame portion opposite the first side portion, and may have a first extending portion extending from the second side portion to the outside of the frame portion in a direction from one opening surface of the frame portion toward the other opening surface, and a second extending portion bending at a portion of the first extending portion opposite the second side portion and extending from the opposite portion of the first extending portion in a direction from the second side portion toward the first side portion; and the third insulating portion may be provided on the second side portion, and may have a third extending portion extending from the second side portion to the outside of the frame portion in a direction from the other opening surface of the frame portion toward the one opening surface, and a fourth extending portion bending at a portion of the third extending portion opposite the second side portion and extending from the opposite portion of the third extending portion in a direction from the second side portion toward the first side portion.

[0015] According to this, the thickness of the second extension portion in the direction from one opening surface of the frame portion toward the other opening surface allows for insulation between the first conductor and the metal case while providing clearances between the film capacitor element or the first conductor and the metal case, ensuring the thickness of the filled resin portion. Similarly, the thickness of the fourth extension portion in the direction from the other opening surface of the frame portion toward the one opening surface allows for insulation between the second conductor and the metal case while providing clearances between the film capacitor element or the second conductor and the metal case, ensuring the thickness of the filled resin portion. [Effects of the Invention]

[0016] According to the present invention, by forming an insulating component having a holding portion for holding a film capacitor element and a first insulating portion disposed between the first conductor and the second conductor into an integrally molded product, it becomes easy to arrange the first conductor and the second conductor so that they do not come into contact with the metal case, and the first conductor and the second conductor can be insulated from the metal case. This prevents an increase in the number of components (insulating components) used for insulation between polarities when the number of different polarities increases, and by preventing an increase in the number of components (insulating components), the efficiency of assembling the case-molded film capacitor can be improved. Furthermore, by forming the insulating component into an integrally molded product, an increase in the number of molds required for manufacturing the insulating components can be prevented. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is an exploded perspective view of a case-molded film capacitor according to a first embodiment of the present invention. FIG. [Figure 2] 2A to 2C are diagrams illustrating a manufacturing process for the case molded film capacitor of FIG. 1. [Figure 3] 3A to 3C are diagrams showing the manufacturing process of the case molded film capacitor following FIG. 2. [Figure 4] 4A to 4C are diagrams showing the manufacturing process of the case molded film capacitor following FIG. 3. [Figure 5] 5A to 5C are diagrams showing the manufacturing process of the case molded film capacitor following FIG. 4. [Figure 6] 5A to 5C are diagrams showing the manufacturing process of the case molded film capacitor following FIG. 4. [Figure 7] FIG. 2 is a front view (plan view when viewed from the y-axis negative side to the y-axis positive side) of the wiring unit that constitutes the case-molded film capacitor in FIG. 1, and the metal case that constitutes the case-molded film capacitor is shown by a dotted line. [Figure 8] FIG. 2 is a right-side view (a plan view when viewed from the x-axis positive side to the x-axis negative side) of the wiring unit that constitutes the case-molded film capacitor in FIG. 1, and the metal case that constitutes the case-molded film capacitor is shown by a dotted line. [Figure 9] 10(a) is a perspective view of a case-molded film capacitor according to a second embodiment of the present invention, in which a connection unit is held by an insulating spacer, and FIG. 10(b) is a perspective view of the insulating spacer. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] First Embodiment A first embodiment of the present invention will be described in detail below with reference to FIGS.

[0020] 1. Structure of case-molded film capacitors The structure of a case-molded film capacitor according to a first embodiment of the present invention will be described with reference to Figures 1 to 8. The x-axis, y-axis, and z-axis in Figures 1 to 8 are the same, and when the case-molded film capacitor is completed, the outer surface of side portion 63 of metal case 60 is the xz plane, and the opening surface of opening 60A of metal case 60 is the xy plane.

[0021] As shown in FIG. 1, the case-molded film capacitor 1 according to the first embodiment of the present invention comprises a plurality of metallized film capacitor elements (corresponding to the "film capacitor elements" of the present invention; in this embodiment, four metallized film capacitor elements 10A, 10B, 10C, and 10D), a first bus bar (corresponding to the "first conductor" of the present invention) 20, a second bus bar (corresponding to the "second conductor" of the present invention) 30, an insulating spacer (corresponding to the "insulating component" of the present invention) 40, a filled resin portion 50, and a metal case 60.

[0022] In the following, the state in which four metalized film capacitor elements 10A, 10B, 10C, and 10D, first bus bar 20, second bus bar 30, and insulating spacer 40 are assembled, and end surface electrodes 12A, 12B, 12C, and 12D of metalized film capacitor elements 10A, 10B, 10C, and 10D are soldered to first bus bar 20, and end surface electrodes 13A, 13B, 13C, and 13D of metalized film capacitor elements 10A, 10B, 10C, and 10D are soldered to second bus bar 30 will be referred to as wiring unit 2 as appropriate.

[0023] Metallized film capacitor elements 10A, 10B, 10C, and 10D are formed by stacking two metallized films, each having aluminum vapor-deposited on a dielectric film, rolling or laminating the stacked metallized films, and pressing them flat. While metallized film capacitor elements 10A, 10B, 10C, and 10D of the present embodiment are described as being formed from a metallized film having aluminum vapor-deposited on a dielectric film, the present invention is not limited thereto and may be formed from a metallized film having another metal vapor-deposited thereon, such as zinc or magnesium, or from a metallized film having multiple of these metals vapor-deposited thereon, or from a metallized film having an alloy of these metals vapor-deposited thereon.

[0024] A first end surface electrode 12A is formed on one end surface of the metallized film capacitor element 10A by spraying a metal such as zinc, and a second end surface electrode 13A is formed on the other end surface by spraying a metal such as zinc (see Figures 3 and 5).

[0025] Metallized film capacitor elements 10B, 10C, and 10D have a structure similar to that of metallized film capacitor element 10A, and include first end surface electrodes 12B, 12C, and 12D formed on one end surface of metallized film capacitor elements 10B, 10C, and 10D, and second end surface electrodes 13B, 13C, and 13D formed on the other end surface (see Figures 3 and 5).

[0026] The metallized film capacitor elements 10A, 10B, 10C, and 10D correspond to the "film capacitor elements" of the present invention, the first end surface electrodes 12A, 12B, 12C, and 12D correspond to the "first end surface electrodes" of the present invention, and the second end surface electrodes 13A, 13B, 13C, and 13D correspond to the "second end surface electrodes" of the present invention.

[0027] The four metallized film capacitor elements 10A, 10B, 10C, and 10D are arranged vertically and horizontally so that the peripheral surfaces of adjacent metallized film capacitor elements face each other (arranged in a 2-row, 2-column matrix), and in this state, a first bus bar 20 is electrically connected to first end surface electrodes 12A, 12B, 12C, and 12D of the four metallized film capacitor elements 10A, 10B, 10C, and 10D, and a second bus bar 30 is electrically connected to second end surface electrodes 13A, 13B, 13C, and 13D. The first bus bar 20 is formed of a conductive material such as copper, and the second bus bar 30 is also formed of a conductive material such as copper.

[0028] In this embodiment, the first end surface electrodes 12A, 12B, 12C, and 12D are P poles (corresponding to the "first pole" of the present invention), and the second end surface electrodes 13A, 13B, 13C, and 13D are N poles (corresponding to the "second pole" of the present invention). In this case, the first bus bar 20 is the P pole and the second bus bar 30 is the N pole. Alternatively, the first end surface electrodes 12A, 12B, 12C, and 12D may be the N pole and the second end surface electrodes 13A, 13B, 13C, and 13D may be the P pole, in which case the first bus bar is the N pole and the second bus bar is the P pole.

[0029] As described above, the first bus bar 20 and the second bus bar 30 are made of a conductive material such as copper, and have the following shapes.

[0030] The first bus bar 20 is provided with flat end surface electrode contact portions 21 that come into contact with the first end surface electrodes 12A, 12B, 12C, and 12D of the four metalized film capacitor elements 10A, 10B, 10C, and 10D when the case-molded film capacitor 1 is assembled. In this embodiment, as shown in Fig. 5(a) , the end surface electrode contact portions 21 of the first bus bar 20 are soldered to the first end surface electrodes 12A, 12B, 12C, and 12D of the four metalized film capacitor elements 10A, 10B, 10C, and 10D, respectively, with solder 20A, thereby electrically connecting the first bus bar 20 to the first end surface electrodes 12A, 12B, 12C, and 12D of the four metalized film capacitor elements 10A, 10B, 10C, and 10D.

[0031] The first bus bar 20 is provided with an assembly portion 22, which is to be assembled to a later-described assembly receiving portion 45 of the insulating spacer 40, on one side of the flat end surface electrode contact portion 21 (the side facing the opening 60A of the metal case 60 when the case-molded film capacitor 1 is assembled: the side facing the z-axis positive side in FIG. 1 ). The assembly portion 22 has a substantially L-shaped cross section when viewed in the x-z cross section of FIG. 1 with the z-axis positive side on the top and the x-axis positive side on the right, and is formed to include a first extending portion 22a in the shape of a rectangular flat plate extending in the negative direction of the x-axis in FIG. 1 from the side of the first extending portion 22a opposite the end surface electrode contact portion 21.

[0032] The first bus bar 20 is provided with an external electrode terminal 23 that is electrically connected to an external device and extends in the positive direction of the x-axis in Fig. 1 from a portion of the second extending portion 22b of the assembly portion 22 opposite to the first extending portion 22a. In this embodiment, the external electrode terminal 23 of the first bus bar 20 is an external electrode terminal on the P-pole side.

[0033] As described above, the second bus bar 30 is made of a conductive material such as copper, and has the following shape.

[0034] The second bus bar 30 is provided with flat end surface electrode contact portions 31 that come into contact with the second end surface electrodes 13A, 13B, 13C, and 13D of the four metalized film capacitor elements 10A, 10B, 10C, and 10D when the case-molded film capacitor 1 is assembled. In this embodiment, as shown in Fig. 5(b), the end surface electrode contact portions 31 of the second bus bar 30 are soldered to the second end surface electrodes 13A, 13B, 13C, and 13D of the four metalized film capacitor elements 10A, 10B, 10C, and 10D, respectively, by soldering them with solder 30A.

[0035] The second bus bar 30 is provided with an assembly portion 32, which is to be assembled to a later-described assembly receiving portion 45 of the insulating spacer 40, on one side of the flat end surface electrode contact portion 31 (the side facing the opening 60A of the metal case 60 when the case-molded film capacitor 1 is assembled; the side facing the z-axis positive side in FIG. 1 ). The assembly portion 32 has a generally L-shaped cross section when viewed in the x-z cross section of FIG. 1 with the x-axis negative side on the top and the z-axis positive side on the right, and is formed to include a first extending portion 32a in the form of a rectangular flat plate extending in the positive direction of the x-axis in FIG. 1 from the side of the first extending portion 32a opposite the end surface electrode contact portion 31.

[0036] The second busbar 30 is provided with an external electrode terminal 33 that extends in the positive direction of the x-axis in Fig. 1 from a portion of the second extending portion 32b of the assembly portion 32 opposite to the first extending portion 32a, and that is electrically connected to an external device. In this embodiment, the external electrode terminal 33 of the second busbar 30 is an external electrode terminal on the N-pole side.

[0037] The insulating spacer 40 is made of a resin such as polyphenylene sulfide (PPS) or polybutylene terephthalate, and has insulating properties. In this embodiment, the insulating spacer 40 is an integrally molded product. The insulating spacer 40 corresponds to the "insulating part" of the present invention.

[0038] The insulating spacer 40 is provided with a rectangular frame portion (corresponding to the "retaining portion" of the present invention) 40A configured to include four side portions 41, 42, 43, and 44. When the case-molded film capacitor 1 is assembled, the side portion 41 corresponds to the "first side" of the present invention, and its outer side faces the opening surface of the opening 60A of the metal case 60, the side portion 42 faces the bottom surface of the metal case 60 (opposite the side portion 41, and the side portion 42 corresponds to the "second side" of the present invention), and the sides 43 and 44 face the sides 63 and 64 of the metal case 60.

[0039] Four metallized film capacitor elements 10A, 10B, 10C, and 10D are arranged inside frame 40A (see Figures 3(b), (c), and 4, etc.). In this embodiment, as described above, the four metallized film capacitor elements 10A, 10B, 10C, and 10D are arranged vertically and horizontally so that the peripheral surfaces of adjacent metallized film capacitor elements face each other (arranged in a matrix of 2 rows and 2 columns). The arrangement of the metallized film capacitor elements is not limited to 2 rows and 2 columns, and may be, for example, 1 row and 4 columns or 3 rows and 2 columns.

[0040] 1 of side portion 41, mounting portion 22 of first bus bar 20 is mounted, and mounting portion 32 of second bus bar 30 is mounted on mounting portion 45. Mounting portion 45 has a substantially L-shaped cross section when viewed in the x-z cross section of FIG. 1 with the x-axis positive side on the top and the z-axis negative side on the right. Mounting portion 45 has a substantially L-shaped cross section, and includes first extending portion 45a (corresponding to the "first insulating portion" of the present invention) extending in the positive direction of the z-axis in FIG. 1 from side portion 41, second extending portion 45b extending in the positive direction of the x-axis in FIG. 1 from the part of first extending portion 45a opposite side 41, and a y-axis of first extending portion 45a. It is formed to include a first positioning portion 45c that protrudes in both the positive and negative directions of the x-axis from the end on the negative side of the axis and protrudes in both the positive and negative directions of the z-axis from the end on the negative side of the y-axis of the second extending portion 45b, and a second positioning portion 45d that protrudes in both the positive and negative directions of the x-axis from the end on the positive side of the y-axis of the first extending portion 45a and protrudes in both the positive and negative directions of the z-axis from the end on the positive side of the y-axis of the second extending portion 45b.

[0041] When the case-molded film capacitor 1 is assembled, the mounting portion 22 of the first bus bar 20 fits exactly into the space formed by the side portion 41 of the frame portion 40A of the insulating spacer 40 and the mounted portion 45 of the insulating spacer 40, and the surface of the second extending portion 22b of the mounting portion 22 of the first bus bar 20 on the negative side of the x-axis in Figure 1 contacts the surface of the first extending portion 45a of the mounted portion 45 of the insulating spacer 40 on the positive side of the x-axis in Figure 1.

[0042] When the case-molded film capacitor 1 is assembled, the mounting portion 32 of the second busbar 30 fits exactly inside the side portion 41 of the frame portion 40A of the insulating spacer 40 and the outside of the mounted portion 45, and the surface of the second extending portion 32b of the mounting portion 32 of the second busbar 30 on the positive side of the x-axis in Figure 1 contacts the surface of the first extending portion 45a of the mounted portion 45 of the insulating spacer 40 on the negative side of the x-axis in Figure 1.

[0043] Therefore, when the case-molded film capacitor 1 is assembled, the second extension portion 22b of the assembly portion 22 of the first busbar 20 and the second extension portion 32b of the assembly portion 32 of the second busbar 30 overlap in a planar view viewed from the positive side of the x-axis to the negative side of the x-axis in Figure 1, and in this overlapping portion, the first extension portion 45a of the assembly receiving portion 45 of the insulating spacer 40 is positioned between the second extension portion 22b of the assembly portion 22 of the first busbar 20 and the second extension portion 32b of the assembly portion 32 of the second busbar 30. The first extension portion 45a of the mounting portion 45 of the insulating spacer 40 arranged in this manner acts to insulate the first bus bar 20 (the second extension portion 22b of the mounting portion 22 of the first bus bar 20) from the second bus bar 30 (the second extension portion 32b of the mounting portion 32 of the second bus bar 30).

[0044] The first positioning portion 45c and the second positioning portion 45d of the insulating spacer 40 are used to position the first bus bar 20 and the second bus bar 30 when attaching the first bus bar 20 and the second bus bar 30 to the insulating spacer 40.

[0045] Side portion 42 opposite side portion 41 is provided with stopper portions (corresponding to the "third insulating portion" of the present invention) 46A, 46B, and 46C on the surface of side portion 42 facing the negative side of the x-axis in Fig. 2, and with stopper portions (corresponding to the "second insulating portion" of the present invention) 47A, 47B, and 47C on the surface of side portion 42 facing the positive side of the x-axis in Fig. 2. Stopper portions 46A and 46B and stopper portion 47C are used to fix metalized film capacitor element 10B to frame portion 40A of insulating spacer 40, and stopper portions 46C and 47A and 47B are used to fix metalized film capacitor element 10C to the inside of frame portion 40A of insulating spacer 40.

[0046] Preferably, fastening portions 47A and 47B are formed so that the midpoint in the y-axis direction between them coincides with the midpoint of metallized film capacitor element 10C in the y-axis direction, and fastening portion 46C is formed so that the midpoint in the y-axis direction of fastening portion 46C coincides with the midpoint of metallized film capacitor element 10C in the y-axis direction. Furthermore, preferably, fastening portions 46A and 46B are formed so that the midpoint in the y-axis direction between them coincides with the midpoint of metallized film capacitor element 10B in the y-axis direction, and fastening portion 47C is formed so that the midpoint in the y-axis direction of fastening portion 47C coincides with the midpoint of metallized film capacitor element 10B in the y-axis direction. However, the formation positions of fastening portions 47A, 47B, and 46C and the formation positions of fastening portions 46A, 46B, and 47C are not limited to those described above, as long as metallized film capacitor elements 10C and 10B are held in place.

[0047] The stop portion 46A has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the positive x-axis side on the top and the positive z-axis side on the right, and is formed to include a first extension portion 46A1 extending in the negative direction of the x-axis in Figure 2 from the surface of the side portion 42 on the negative x-axis side in Figure 2, and a second extension portion 46A2 extending in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 46A1 opposite the side portion 42.

[0048] The stop portion 46B has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the positive x-axis side on the top and the positive z-axis side on the right, and is formed to include a first extension portion 46B1 extending in the negative direction of the x-axis in Figure 2 from the surface of the side portion 43 on the negative x-axis side in Figure 2, and a second extension portion 46B2 extending in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 46B1 opposite the side portion 43.

[0049] The stop portion 46C has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the positive x-axis side on the top and the positive z-axis side on the right, and is formed to include a first extension portion 46C1 that extends in the negative direction of the x-axis in Figure 2 from the surface of the side portion 42 on the negative x-axis side in Figure 2, and a second extension portion 46C2 that extends in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 46C1 opposite the side portion 42.

[0050] The thickness of second extending portions 46A2, 46B2, 46C2 of fastening portions 46A, 46B, 46C in the x-axis direction in Figures 4 and 7 is greater than the thickness of end face electrode contact portion 31 of second bus bar 30 in the x-axis direction in Figures 4 and 7 (see Figure 7). Note that Figure 7 is a front view (plan view when viewed from the y-axis negative side to the y-axis positive side) of connection unit 2 that constitutes case-molded film capacitor 1 in Figure 1, and the metal case that constitutes the case-molded film capacitor is indicated by a dotted line. By setting the thicknesses in this manner, when the case-molded film capacitor 1 is assembled, a clearance is created between the end surface electrode contact portion 31 of the second bus bar 30 and the metal case 60 (see Figure 7), and the fastening portions 46A, 46B, 46C (second extension portions 46A2, 46B2, 46C2 of the fastening portions 46A, 46B, 46C) act to insulate the second bus bar 30 (end surface electrode contact portion 31 of the second bus bar 30) from the metal case 60.

[0051] In addition, the thickness of the filled resin portion 50 in the x-axis direction can be ensured by the clearance formed by the second extension portions 46A2, 46B2, 46C2 of the fastening portions 46A, 46B, 46C between the end face electrode contact portion 31 of the second bus bar 30 and the metalized film capacitor elements 10A, 10B, 10C, 10D and the metal case 60.

[0052] The stop portion 47A has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the negative side of the x-axis on the top and the positive side of the z-axis on the right, and is formed to include a first extension portion 47A1 extending in the positive direction of the x-axis in Figure 2 from the surface of the side portion 42 on the positive side of the x-axis in Figure 2, and a second extension portion 47A2 extending in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 47A1 opposite the side portion 42.

[0053] The stop portion 47B has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the negative side of the x-axis on the top and the positive side of the z-axis on the right, and is formed to include a first extension portion 47B1 extending in the positive direction of the x-axis in Figure 2 from the surface of the side portion 42 on the positive side of the x-axis in Figure 2, and a second extension portion 47B2 extending in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 47B1 opposite the side portion 42.

[0054] The stop portion 47C has a cross-sectional shape that is approximately L-shaped when viewed in the x-z cross section of Figure 2 with the negative side of the x-axis on the top and the positive side of the z-axis on the right, and is formed to include a first extension portion 47C1 extending in the positive direction of the x-axis in Figure 2 from the surface of the side portion 42 on the positive side of the x-axis in Figure 2, and a second extension portion 47C2 extending in the positive direction of the z-axis in Figure 2 from the part of the first extension portion 47C1 opposite the side portion 42.

[0055] 2 and 7, the thicknesses of the second extending portions 47A2, 47B2, 47C2 of the fastening portions 47A, 47B, 47C in the x-axis direction are greater than the thickness of the end surface electrode contact portion 21 of the first bus bar 20 in the x-axis direction in FIGS. 2 and 7 (see FIG. 7). By setting the thicknesses in this manner, a clearance is created between the end surface electrode contact portion 21 of the first bus bar 20 and the metal case 60 when the case-molded film capacitor 1 is assembled (see FIG. 7), and the fastening portions 47A, 47B, 47C (second extending portions 47A2, 47B2, 47C2 of the fastening portions 47A, 47B, 47C) act to insulate the first bus bar 20 (end surface electrode contact portion 21 of the first bus bar 20) from the metal case 60.

[0056] In addition, the thickness of the filled resin portion 50 in the x-axis direction can be ensured by the clearance formed by the second extension portions 47A2, 47B2, 47C2 of the fastening portions 47A, 47B, 47C between the end face electrode contact portion 21 of the first bus bar 20 and the metalized film capacitor elements 10A, 10B, 10C, 10D and the metal case 60.

[0057] In a plan view looking from the negative y-axis side to the positive x-axis side, the distance between the surfaces of second extending portions 47A2, 47B2, 47C2 of fastening portions 47A, 47B, 47C on the positive x-axis side and the surfaces of second extending portions 46A2, 46B2, 46C2 of fastening portions 46A, 46B, 46C on the negative x-axis side enables wiring connection unit 2 to be inserted into metal case 60, and is substantially the same as the distance between the inner wall surface of side portion 61 of metal case 60 and the inner wall surface of side portion 62 of metal case 60. In this way, fastening portions 46A, 46B, 46C and fastening portions 47A, 47B, 47C can be used to position wiring connection unit 2 within metal case 60.

[0058] The side portions 42, 43, and 44 of the frame portion 40A of the insulating spacer 40 act to insulate the metallized film capacitor elements 10A, 10B, 10C, and 10D, the first bus bar 20, and the second bus bar 30 from the metal case 60 when the case-molded filter capacitor 1 is assembled.

[0059] An engaging portion 48A protruding in the negative direction of the y-axis in Figures 1 and 2 is provided on the positive side of the z-axis in Figure 1 of the side portion 43 of the frame portion 40A of the insulating spacer 40, and an engaging portion 48B protruding in the positive direction of the y-axis in Figure 1 is provided on the positive side of the z-axis in Figures 1 and 2 of the side portion 44 of the frame portion 40A of the insulating spacer 40.

[0060] Outwardly protruding guides 48 are provided on the outer surfaces of side portions 44, 42 and 43 of frame portion 40A of insulating spacer 40 (see FIGS. 1, 5, etc.).

[0061] The metal case 60 is made of a conductive material such as die-cast aluminum or copper, and is used as a ground electrode (corresponding to the "third electrode" of the present invention) in this embodiment. The metal case 60 corresponds to the "metal case" of the present invention.

[0062] The metal case 60 is shaped like a rectangular box with an opening 60A on one side (the side facing the positive z-axis in Figure 1), and recessed guide grooves 65 are formed on the inner surfaces of the side 64, the inner surface of the bottom, and the inner surface of the side 63 of the metal case 60 at positions corresponding to the guides 48 formed to protrude on the outer surface of the side 44, the outer surface of the side 42, and the outer surface of the side 43 of the frame portion 40A of the insulating spacer 40 (see Figures 1 and 5).

[0063] 1, a notched fitted portion 66A is provided at the end of the side portion 63 of the metal case 60 on the positive side of the z axis, into which the fitting portion 48A of the insulating spacer 60 is fitted when the case-molded film capacitor is assembled. Also, a notched fitted portion 66B is provided at the end of the side portion 64 of the metal case 60 on the positive side of the z axis, into which the fitting portion 48B of the insulating spacer 60 is fitted when the case-molded film capacitor is assembled.

[0064] Filling resin portion 50 fills the empty space between metal case 60 and assembled metallized film capacitor elements 10A, 10B, 10C, and 10D, insulating spacer 40, first bus bar 20, and second bus bar 30, and is formed of, for example, epoxy resin. Note that filling resin portion 50 is not limited to epoxy resin and can be formed of various insulating materials used as sealing resins for electronic components. Note that FIG. 1 shows a schematic view of filling resin portion 50 when it has hardened; before hardening, the metal case 60 is filled with the resin in a liquid state.

[0065] Mating portions 48A, 48B of insulating spacer 40, which constitute completed wiring unit 2, are fitted into mating portions 66A, 66B of metal case 60, and wiring unit 2 is housed inside metal case 6. The upper limit position in the positive direction of the z-axis of metalized film capacitor elements 10A, 10D arranged within frame portion 40A of insulating spacer 40 is restricted by the surface on the negative side of the z-axis of side portion 41 of frame portion 40A of insulating spacer 40.

[0066] With the mating portions 48A, 48B of the insulating spacer 40 constituting the completed wiring unit 2 fitted into the mating portions 66A, 66B of the metal case 60 and the wiring unit 2 housed inside the metal case 6, the filling resin (liquid when injected) that forms the filled resin portion 50 is injected from the opening 60A of the metal case 60 to a position (position indicated by dotted line L2 in Figure 8) at least where the distance in the negative z-axis direction from the opening surface of the opening 60A of the metal case 60 (position indicated by dotted line L1 in Figure 8) is a first predetermined distance, in other words, to a position (position indicated by dotted line L2 in Figure 8) where the distance in the positive z-axis direction from the negative z-axis surface of the side portion 41 of the frame portion 40A of the insulating spacer 40 (position indicated by dotted line L3 in Figure 8) is a second predetermined distance. Note that Figure 8 is a right side view (a plan view when viewed from the positive side of the x-axis to the negative side of the x-axis) of the wiring unit 2 that constitutes the case-molded film capacitor 1 in Figure 1, and the metal case 60 that constitutes the case-molded film capacitor 1 is shown by a dotted line.

[0067] In this case, a filled resin portion 50 is formed on the upper part (positive direction of the z-axis) of the surface of the metallized film capacitor element 10A, 10D on the positive side of the z-axis (position indicated by dotted line L4 in Figure 8), with the resin thickness being at least the distance between the position of dotted line L4 in Figure 8 and dotted line L2 in Figure 8.

[0068] Since the upper limit position in the positive z-axis direction of the metallized film capacitor elements 10A, 10D arranged within the frame portion 40A of the insulating spacer 40 is restricted by the negative z-axis surface of the side portion 41 of the frame portion 40A of the insulating spacer 40 (the position indicated by the dotted line L3 in Figure 8), the resin thickness in the positive z-axis direction of the filled resin portion 50 can be ensured to be greater than the distance in the positive z-axis direction from the position indicated by the dotted line L3 in Figure 8 to the dotted line L2 in Figure 8.

[0069] Therefore, by setting the position (position shown by dotted line L2 in Figure 8) for injecting filled resin portion 50 so that the distance in the positive z-axis direction from the negative z-axis surface (position shown by dotted line L3 in Figure 8) of side portion 41 of frame portion 40A of insulating spacer 40 is the desired resin thickness, the resin thickness (the distance in the positive z-axis direction from the position shown by dotted line L4 in Figure 8 to the position shown by dotted line L2 in Figure 8) of filled resin portion 50 at the top (positive z-axis direction) of the positive z-axis surface (position shown by dotted line L4 in Figure 8) of the peripheral surface of metallized film capacitor element 10A, 10D can be ensured to be greater than the desired resin thickness.

[0070] 2. Manufacturing process for case-molded film capacitors A manufacturing process for the case molded film capacitor having the above-described structure will be described below with reference to FIGS.

[0071] As shown in Fig. 2(a), the insulating spacer 40 is attached to the first bus bar 20 from the negative side of the x-axis so that the attachment portion 22 of the first bus bar 20 fits into the space formed by the side portion 41 of the frame portion 40A of the insulating spacer 40 and the attachment portion 45 of the insulating spacer 40. This attached state is shown in Fig. 2(b). Fig. 2(c) shows the state in which the insulating spacer 40 is attached to the first bus bar 20, viewed from a different angle than Fig. 2(b).

[0072] As shown in Figure 3(a), metallized film capacitor elements 10A, 10B, 10C, and 10D are set from the negative side of the x-axis inside frame portion 40A of insulating spacer 40, which has insulating spacer 40 and first bus bar 20 assembled together. This set state is shown in Figure 3(b). Figure 3(c) is a view of metallized film capacitor elements 10A, 10B, 10C, and 10D set inside frame portion 40A, viewed from a different angle than Figure 3(b).

[0073] For example, when assembling the metallized film capacitor elements 10A, 10B, 10C, and 10D, the metallized film capacitor element 10B is set first, followed by the metallized film capacitor element 10C, then the metallized film capacitor element 10A, and finally the metallized film capacitor element 10D. In this state, the movement of the metallized film capacitor elements 10A, 10B, 10C, and 10D in the positive and negative directions of the y-axis and the z-axis is restricted by the frame portion 40A. The movement of the metallized film capacitor elements 10B and 10C in the positive and negative directions of the x-axis is restricted by the second extension portions 46A2, 46B2, and 46C2 of the stoppers 46A, 46B, and 46C. The movement of the metallized film capacitor elements 10A, 10B, 10C, and 10D in the positive direction of the x-axis is restricted by the end face electrode contact portion 21 of the first bus bar 20.

[0074] As shown in FIG. 4(a), the second bus bar 30 is assembled to the insulating spacer 40 from the negative side of the x-axis so that the assembly portion 32 of the second bus bar 30 is located outside the side portion 41 and the assembly receiving portion 45 of the frame portion 40A of the insulating spacer 40. This assembled state is shown in FIG. 4(b). FIG. 4(c) is a view of the second bus bar 30 assembled to the insulating spacer 40, viewed from a different angle than FIG. 4(b). Movement of the metallized film capacitor elements 10A, 10B, 10C, and 10D in the negative direction of the x-axis is restricted by the end face electrode contact portion 31 of the second bus bar 30.

[0075] As shown in Figure 5(a), end surface electrodes 12A, 12B, 12C, and 12D of metallized film capacitor elements 10A, 10B, 10C, and 10D are soldered to end surface electrode contact portions 21 of the first bus bar 20 with solder 20A, and as shown in Figure 5(b), end surface electrodes 13A, 13B, 13C, and 13D of metallized film capacitor elements 10A, 10B, 10C, and 10D are soldered to end surface electrode contact portions 31 of the second bus bar 30 with solder 30A. The wiring unit 2 is completed by assembling four metalized film capacitor elements 10A, 10B, 10C, and 10D, a first bus bar 20, a second bus bar 30, and an insulating spacer 40, soldering end surface electrodes 12A, 12B, 12C, and 12D of the metalized film capacitor elements 10A, 10B, 10C, and 10D to end surface electrode contact portion 21 of the first bus bar 20 with solder 20A, and soldering end surface electrodes 13A, 13B, 13C, and 13D of the metalized film capacitor elements 10A, 10B, 10C, and 10D to end surface electrode contact portion 31 of the second bus bar 30 with solder 30A.

[0076] As shown in Figure 6(a), from the positive side of the z-axis, the wiring unit 2 is housed in the metal case 60 by aligning the guide 48 formed on the outer surface of the frame portion 40A of the insulating spacer 40 with the guide groove 65 formed on the inner wall surface of the metal case 60.

[0077] As shown in FIG. 6(b), liquid epoxy resin is poured into opening 60A of metal case 60 and cured at a predetermined curing temperature, thereby completing case-molded film capacitor 1 shown in FIG. 6(c).

[0078] 3.Effects According to the above embodiment, the mounting member 45 is provided to insulate the first bus bar (the component connected to the first end surface electrodes 12A, 12B, 12C, and 12D of the metalized film capacitor elements 10A, 10B, 10C, and 10D corresponding to the P poles) from the second bus bar (the component connected to the second end surface electrodes 13A, 13B, 13C, and 13D of the metalized film capacitor elements 10A, 10B, 10C, and 10D corresponding to the N poles). The insulating spacer 40 having the first extending portion 45a is provided with second extending portions 47A2, 47B2, 47C2 of the stoppers 47A, 47B, 47C that insulate the first bus bar 20 from the metal case 60 (the metal case that serves as the ground electrode), and second extending portions 46A2, 46B2, 46C2 of the stoppers 46A, 46B, 46C that insulate the second bus bar 30 from the metal case 60 (the metal case that serves as the ground electrode). In this way, the insulating spacer 40 that insulates the first bus bar 20 from the second bus bar 30 can be used to insulate the first bus bar 20 from the metal case 40 and to insulate the second bus bar 30 from the metal case 40. Therefore, when the number of different polarities increases, it is possible to suppress an increase in the number of components (insulating components) used for insulation between polarities, and by suppressing an increase in the number of components (insulating components), it is possible to improve the efficiency of the assembly work of the case-molded film capacitor 1.

[0079] Furthermore, second extension portions 47A2, 47B2, 47C2 of fastening portions 47A, 47B, 47C that insulate the first bus bar 20 from the metal case 60 serving as the ground electrode are provided on side portion 42 of frame portion 40A of insulating spacer 40 other than side portion 41 where first extension portion 45a of mounting portion 45 that insulates the first bus bar 20 from the second bus bar 30 is formed, and second extension portions 46A2, 46B2, 46C2 of fastening portions 46A, 46B, 46C that insulate the second bus bar 30 from the metal case 60 serving as the ground electrode are provided, thereby preventing the portions from getting in the way of each other when assembling the case-molded film capacitor 1.

[0080] Furthermore, the thickness in the x-axis direction of second extension portions 47A2, 47B2, 47C2 of stoppers 47A, 47B, 47C formed on frame portion 40A of insulating spacer 40 enables insulation between first bus bar 20 and metal case 60, while providing clearance between metallized film capacitor elements 10A, 10B, 10C, 10D or first bus bar 20 and metal case 60, thereby ensuring the thickness of filled resin portion 50. Similarly, the thickness in the x-axis direction of second extension portions 46A2, 46B2, 46C2 of stoppers 46A, 46B, 46C formed on frame portion 40A of insulating spacer 40 enables insulation between second bus bar 30 and metal case 60, while providing clearance between metallized film capacitor elements 10A, 10B, 10C, 10D or second bus bar 30 and metal case 60, thereby ensuring the thickness of filled resin portion 50.

[0081] Furthermore, by forming the insulating spacer 40 as an integrally molded product, it is possible to prevent an increase in the number of molds required for manufacturing the insulating spacer 40 .

[0082] Second Embodiment The second embodiment of the present invention will be described in detail below with reference to FIG.

[0083] In the case-molded film capacitor of the second embodiment, the insulating spacer 40 provided in the case-molded film capacitor 1 of the first embodiment is replaced with an insulating spacer 100 shown in Fig. 9. Note that the other components have the same configuration as the corresponding components provided in the case-molded film capacitor 1 of the first embodiment, and therefore description thereof will be omitted.

[0084] The insulating spacer 100 of the second embodiment has a configuration in which the retaining portions 46A, 46B, 46C and the retaining portions 47A, 47B, 47C are removed from the insulating spacer 40 of the first embodiment, and apart from this, the structure is the same as that of the insulating spacer 40 of the first embodiment, so further explanation will be omitted.

[0085] According to the second embodiment, insulating spacer 100 is integrally molded. This includes frame 40A for holding metalized film capacitor elements 10A, 10B, 10C, and 10D, and mounting portion 45 including first extension 45a disposed between first bus bar 20 and second bus bar 30 to insulate them. This allows for easy placement of first bus bar 20 and second bus bar 30 so that they do not come into contact with the metal case. This insulates first bus bar 20 and second bus bar 30 from metal case 60. This minimizes the need for additional insulating components for polarity isolation when the number of polarities increases. This minimizes the need for additional insulating components, thereby improving assembly efficiency for the case-molded film capacitor. Furthermore, by forming insulating spacer 100 as an integrally molded product, the number of molds required for manufacturing insulating spacer 100 is reduced.

[0086] Furthermore, similar to the insulating spacer 40, the insulating spacer 100 has a guide 48 provided on the frame portion 40A. Therefore, by aligning the guide 48 with the guide groove 65 of the metal case 60 and housing the wiring unit 2 in the metal case 60, it is possible to reliably prevent the first bus bar 20 and the second bus bar 30 from coming into contact with the metal case 60.

[0087] In addition, various design modifications can be made to the above-described configuration within the scope of the claims.

[0088] For example, in the above embodiment, the insulation of three poles (P pole, N pole, and ground electrode) is targeted, but this is not limited to this, and four poles or more (e.g., P pole (High), P pole (Low), N pole, and ground electrode) may be used.

[0089] Furthermore, in the above embodiment, the cross-sectional shape of the assembled portion 45 is approximately L-shaped, but this is not limited to this, and the cross-sectional shape of the assembled portion 45 is not limited to this as long as it has a shape that can insulate the first bus bar 20 and the second bus bar 30.

[0090] Furthermore, the contents described in the above embodiment and the contents described in the above modified examples may be combined as appropriate.

[0091] The present invention is widely applicable to case-molded film capacitors that provide insulation between multiple polarities. [Explanation of symbols]

[0092] 1: Case molded film capacitor 2: Wiring unit 10A, 10B, 10C, 10D: Metallized film capacitor elements 12A, 12B, 12C, 12D: First end surface electrodes 13A, 13B, 13C, 13D: second end surface electrodes 20: First bus bar (first conductor) 22: Assembly section 30: Second bus bar (second conductor) 32: Assembly section 40,100: Insulating spacer (insulating part) 40A: Frame 45: Mounting part 46A, 46B, 46C: Stopper 47A, 47B, 47C: Stopper 50: Filling resin part 60: Metal case

Claims

1. a film capacitor element having a first end surface electrode corresponding to one of the polarities of the first pole or the second pole provided on one end surface thereof, and a second end surface electrode corresponding to the other polarity provided on the other end surface thereof; a first conductor electrically connected to the first end surface electrode of the film capacitor element; a second conductor electrically connected to the second end surface electrode of the film capacitor element; an insulating component that is an integrally molded product and includes a holding portion that holds the film capacitor element and a first insulating portion that is disposed between the first conductor and the second conductor; a metal case having an opening on one side, accommodating the film capacitor element, the insulating component, the first conductor, and the second conductor, and serving as an electrode of a third pole different from the first pole and the second pole; a resin filling portion that is filled in the case and molds at least the film capacitor element; A case-molded film capacitor comprising:

2. The insulating component is provided with a second insulating portion that provides a clearance between the first conductor and the metal case to insulate the first conductor from the metal case, and a third insulating portion that provides a clearance between the second conductor and the metal case to insulate the second conductor from the metal case.

2. The case-molded film capacitor according to claim 1, wherein the case-molded film capacitor is a film capacitor having a thickness of 1000 nm or less.

3. The insulating component is a frame-shaped frame portion in which the film capacitor element is placed; the first insulating portion provided on an outer surface side of a first side portion of the frame portion, the outer surface side of which faces an opening surface of the opening of the metal case; the second insulating portion provided on a portion of the frame other than the first side portion; the third insulating portion provided on the frame portion other than the first side portion; have 3. The case-molded film capacitor according to claim 2.

4. the second insulating portion is provided on a second side portion of the frame portion opposite to the first side portion, and has a first extending portion extending from the second side portion to the outside of the frame portion in a direction from one opening surface of the frame portion toward the other opening surface, and a second extending portion bending at a portion of the first extending portion opposite to the second side portion and extending from the opposite portion of the first extending portion in a direction from the second side portion toward the first side portion, The third insulating portion is provided on the second side portion and has a third extending portion that extends from the second side portion to the outside of the frame portion in a direction from the other opening surface of the frame portion toward the one opening surface, and a fourth extending portion that bends at a portion of the third extending portion opposite to the second side portion and extends from the opposite portion of the third extending portion in a direction from the second side portion toward the first side portion.

4. The case-molded film capacitor according to claim 3.

Citation Information

Patent Citations

  • Case-molding capacitor

    JP2006253280A

  • Case mold type capacitor

    JP2014116446A

  • Case mold type capacitor and manufacturing method thereof

    JP2015095627A

  • Film capacitor

    JP2017112168A

  • Capacitor module

    JP2018182075A