Base tape and electronic components

Abstract

To provide a base tape having antistatic performance for protecting an electronic component, and an electronic component series in which the electronic component is stored in the base tape.SOLUTION: A base tape 10 has a rectangular parallelepiped storage part 20, the base tape 10 having a carbon layer on a surface layer 16a, the storage part 20 having a bottom surface part 30, a side wall part 31 and an opening 38, the side wall part 31 having an edge part 36 between the bottom surface part 30 and the opening 38 on any one surface of the side wall part 31, a discharge path part 34 being provided that inclines from the edge part 36 toward the opening 38. Further, an electronic component series 12 includes the base tape 10, an electronic component 14 stored in the storage part 20 of the base tape 10, and a cover tape 18 for covering the storage part 20.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a base tape and an electronic component string. [Background technology]

[0002] Conventionally, electronic component strings have been used to protect electronic components during storage, transportation, and installation, and to align and remove them for mounting on a printed circuit board. Electronic component strings are composed of electronic components, a base tape that houses the electronic components in a housing, and a cover tape that is provided to cover the electronic components.

[0003] Static electricity can destroy electronic components or cause mounting defects of electronic components. In order to protect electronic components from static electricity, Patent Document 1 discloses a method for preventing the electronic components housed in an electronic component train from becoming charged by providing a coating layer of conductive paint containing carbon black and inorganic filler on one side of a base tape made of a resin composition. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-21247 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with base tapes such as those described in Patent Document 1, pressure is applied perpendicular to the coating layer when molding the housing. This can cause the carbon black in the coating layer to tear, depending on the shape of the housing that houses the electronic component, resulting in variations in the carbon black shade in the coating layer. This variation in the carbon black shade can lead to insufficient antistatic performance from the coating layer. This is explained in more detail using Figure 9. Figure 9(a) is a cross-sectional view of the housing section of a conventional base tape taken at a position halfway along the short side, and Figure 9(b) is a cross-sectional view of the housing section of a conventional base tape taken at a position halfway along the long side. In Figures 9(a) and 9(b), the black areas represent the coating layer containing carbon black, and the white areas represent the coating layer where the carbon black has been torn. Comparing the long side (Figure 9(a)) and short side (Figure 9(b)) of the housing section reveals that the long side is subjected to stress when molding the housing section, causing the carbon black in the coating layer to tear, resulting in variations in the carbon black shade in the coating layer.

[0006] SUMMARY OF THE INVENTION Therefore, a primary object of the present invention is to provide a base tape having antistatic properties for protecting electronic components, and an electronic component string in which electronic components are housed in the base tape. [Means for solving the problem]

[0007] The base tape according to the present invention is a base tape having a rectangular parallelepiped accommodating section for accommodating a multilayer ceramic capacitor, the base tape having a layer structure having multiple layers, and when a layer where the base tape and the multilayer ceramic capacitor come into contact is defined as a first layer, the first layer comprises a carbon layer, the accommodating section has a bottom surface portion, side wall portions including multiple surfaces, and an opening, the side wall portions have an edge portion between the bottom surface portion and the opening on one side of the side wall portion, a flat portion is provided from the bottom surface portion to the edge portion, and a discharge path portion is provided that is inclined from the edge portion to the opening, the flat portion and the discharge path portion are surfaces, one side of the flat portion and one side of the discharge path portion are continuously connected via the edge portion, the length from the bottom surface portion to the edge portion is shorter than the height of the multilayer ceramic capacitor, and a ratio (A / L) of a length A of the long side of the accommodating section to a length L of the multilayer ceramic capacitor in the longitudinal direction is L ) is 1.02 or more and 1.05 or less.

[0008] The base tape according to the present invention has a carbon layer on the surface that comes into contact with electronic components, which provides good electrical conductivity and allows discharge through the carbon layer even if the electronic components are charged. Furthermore, by providing a discharge path in the housing section, the range in which the carbon layer is rolled in the vertical direction is narrowed, which prevents the carbon layer from being torn apart, thereby preventing a decrease in antistatic performance. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a base tape having antistatic properties for protecting electronic components, and an electronic component string in which electronic components are housed in the base tape.

[0010] The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the present invention, which proceeds with reference to the accompanying drawings. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view of a base tape according to an embodiment of the present invention. [Figure 2] 1 is a perspective view of an electronic component series according to an embodiment of the present invention; [Figure 3] 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention; [Figure 4] FIG. 2 is a diagram showing a multilayer ceramic capacitor inserted in part a of FIG. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] 1A is a cross-sectional view illustrating the conductive paths of the base tape according to one embodiment of the present invention, and FIG. 1B is a cross-sectional view illustrating the conductive paths of a conventional base tape. [Figure 8] FIG. 1 is a cross-sectional view showing an example of an apparatus for manufacturing a base tape according to an embodiment of the present invention. [Figure 9] 1A is a cross-sectional view of the conventional base tape at a position half the length of the short side of the housing portion, and FIG. 1B is a cross-sectional view of the conventional base tape at a position half the length of the long side of the housing portion. DETAILED DESCRIPTION OF THE INVENTION

[0012] A base tape 10 and an electronic component string 12 according to one embodiment of the present invention will be described below with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings will be denoted by the same reference numerals.

[0013] The height direction of the base tape 10 is the x direction, the longitudinal direction of the base tape 10 is the y direction, and the width direction (short-side direction) of the base tape 10 is the z direction. Therefore, the height direction of the electronic component series 12 is the same direction as the height direction x of the base tape 10, the longitudinal direction of the electronic component series 12 is the same direction as the longitudinal direction y of the base tape 10, and the width direction (short-side direction) of the electronic component series 12 is the same direction as the width direction (short-side direction) z direction of the base tape 10.

[0014] 1. Base tape A base tape 10 according to one embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a perspective view of the base tape according to one embodiment of the present invention.

[0015] The base tape 10 according to one embodiment of the present invention is long and includes a rectangular parallelepiped housing portion 20 for housing an electronic component 14. The base tape 10 according to one embodiment of the present invention also includes feed holes 22.

[0016] The electronic component 14 is, for example, a resistor, a capacitor, an inductor, a switch, a connector, a coil, etc. In this embodiment, a multilayer ceramic capacitor 14 will be described as an example of the electronic component 14. Note that, in this embodiment, the multilayer ceramic capacitor 14 will be described as an example of the electronic component 14, but the electronic component is not limited to a multilayer ceramic capacitor.

[0017] The multilayer ceramic capacitor 14 will be described with reference to Fig. 3. Fig. 3 is a perspective view of a multilayer ceramic capacitor according to one embodiment of the present invention.

[0018] The multilayer ceramic capacitor 14 includes a laminate 14a having a rectangular parallelepiped outer shape and a pair of external electrodes 14b provided on both ends of the laminate 14a.

[0019] The outer dimensions of the multilayer ceramic capacitor 14, including the pair of external electrodes 14b, are such that the dimension in the longitudinal direction L of the multilayer ceramic capacitor 14 is 0.25 mm or more and 0.6 mm or less, the dimension in the width direction W is 0.125 mm or more and 0.30 mm or less, and the dimension in the stacking direction T is 0.125 mm or more and 0.30 mm or less.

[0020] The accommodating sections 20 are arranged in a row at predetermined intervals along the longitudinal direction y of the base tape 10. The accommodating sections 20 are provided to accommodate the multilayer ceramic capacitors 14. The accommodating sections 20 are arranged biased to one side in the width direction z of the base tape 10. A substantially rectangular parallelepiped space is formed inside the accommodating section 20. The opening of the accommodating section 20 is substantially rectangular in plan view.

[0021] The feed holes 22 are arranged in a row at predetermined intervals along the longitudinal direction y of the base tape 10. The feed holes 22 are provided for automatic feeding by an automatic component feeder. The feed holes 22 engage with teeth provided on the automatic component feeder, allowing the base tape 10 to be automatically fed by the automatic component feeder.

[0022] The base tape 10 is made of resin or paper. It is particularly preferable that the base tape 10 is made of one of polystyrene, polyethylene terephthalate, polycarbonate, and polypropylene. By using such a material, the housing portion can be easily molded and work can be done in a clean room.

[0023] The base tape 10 also has a carbon layer on the layer (surface layer) 16a that comes into contact with the multilayer ceramic capacitor 14. As a result, even if the multilayer ceramic capacitor 14 is charged, it can discharge static electricity because it is in contact with the carbon layer, which has good conductivity. Furthermore, the base tape 10 preferably has a layered structure having multiple layers, and when the layer that comes into contact with the multilayer ceramic capacitor 14 is the first layer 16a, it is preferable that the first layer 16a has a carbon layer. By providing a carbon layer on the first layer 16a that comes into contact with the multilayer ceramic capacitor 14, conductivity is improved and antistatic performance can be achieved.

[0024] The accommodating section 20 will be described in more detail with reference to Figs. 4 to 7. Fig. 4 is a diagram showing a multilayer ceramic capacitor inserted in part a of Fig. 1. Fig. 5 is a cross-sectional view taken along line VV in Fig. 4. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 4. Fig. 7(a) is a cross-sectional view illustrating the conductive paths of a base tape according to one embodiment of the present invention. Fig. 7(b) is a cross-sectional view illustrating the conductive paths of a conventional base tape.

[0025] 4 to 6, the accommodation section 20 has a bottom surface 30, sidewalls 31, and an opening 38. The sidewalls 31 have an edge 36 between the bottom surface 30 and the opening 38 on one surface of the sidewalls 31, and a discharge path 34 that slopes from the edge 36 toward the opening 38. The sidewalls 31 are composed of a flat surface 32 that is a surface from the bottom surface 30 to the edge 36 on one surface of the sidewalls 31, and the discharge path 34 that slopes from the edge 36 toward the opening 38.

[0026] The bottom surface portion 30 is rectangular in plan view. The bottom surface portion 30 is the portion on which the multilayer ceramic capacitor 14 is placed. The side wall portion 31 is connected to the bottom surface portion 30 and extends toward the opening 38 to form the side wall of the accommodating portion 20. The opening 38 is rectangular in plan view. The short sides of the opening 38 of the accommodating portion 20 are designated 38a and 38c, and the long sides are designated 38b and 38d. The side wall portion 31 connected to the side 38a of the opening 38 is designated as the first side wall portion 31a, the side wall portion 31 connected to the side 38b of the opening 38 is designated as the second side wall portion 31b, the side wall portion 31 connected to the side 38c of the opening 38 is designated as the third side wall portion 31c, and the side wall portion 31 connected to the side 38d of the opening 38 is designated as the fourth side wall portion 31d. The side wall portion 31 is composed of a first side wall portion 31a, a second side wall portion 31b, a third side wall portion 31c, and a fourth side wall portion 31d.

[0027] In this embodiment of the present invention, discharge paths 34 are provided on four surfaces of the side wall 31. The flat surface 32, discharge path 34, and edge 36 provided on the first side wall 31a are referred to as the first flat surface 32a, first discharge path 34a, and first edge 36a. The flat surface 32, discharge path 34, and edge 36 provided on the second side wall 31b are referred to as the second flat surface 32b, second discharge path 34b, and second edge 36b. The flat surface 32, discharge path 34, and edge 36 provided on the third side wall 31c are referred to as the third flat surface 32c, third discharge path 34c, and third edge 36c. The flat surface 32, discharge path 34, and edge 36 provided on the fourth side wall 31d are referred to as the fourth flat surface 32d, fourth discharge path 34d, and fourth edge 36d. Therefore, the flat portion 32 is composed of a first flat portion 32a, a second flat portion 32b, a third flat portion 32c, and a fourth flat portion 32d. The discharge path portion 34 is composed of a first discharge path portion 34a, a second discharge path portion 34b, a third discharge path portion 34c, and a fourth discharge path portion 34d. The edge portion 36 is composed of a first edge portion 36a, a second edge portion 36b, a third edge portion 36c, and a fourth edge portion 36d.

[0028] The discharge path portion 34 is a portion that forms a path for discharging static electricity that has accumulated in the multilayer ceramic capacitor 14 via the carbon layer of the first layer 16a when the flat portion 32 or the edge portion 36 comes into contact with the external electrode 14b of the multilayer ceramic capacitor 14.

[0029] The conductive paths when the housing section 20 of the base tape 10 is provided with a discharge path section 34 and when the housing section 20 of the base tape 10 is not provided with a discharge path section 34 will be described with reference to Fig. 7. As shown in Fig. 7, the conductive path is shorter when the housing section 20 of the base tape 10 is provided with a discharge path section 34 (Fig. 7(a)) than when the housing section 20 of the base tape 10 is not provided with a discharge path section 34 (Fig. 7(b)). Therefore, by providing the discharge path section 34, the base tape 10 can better exhibit antistatic performance.

[0030] Furthermore, if the carbon layer of the first layer 16a is rolled in a direction perpendicular to the first layer 16a when the housing portion 20 is formed, the carbon layer of the first layer 16a will be torn, but the discharge path portion 34 is provided at an angle, which reduces the stress on the discharge path portion 34. Therefore, the range that is rolled in a direction perpendicular to the first layer 16a is narrowed, which makes it possible to prevent the carbon layer of the first layer 16a from being torn at the discharge path portion 34 and the edge portion 36.

[0031] Furthermore, the angle θ between the flat portion 32 and the discharge path portion 34 is preferably 95 degrees or more and 175 degrees or less. By providing the discharge path portion 34 in this manner, the opening area is formed to increase from the edge portion 36 toward the opening 38, making it easier to insert and remove the multilayer ceramic capacitor 14.

[0032] The discharge path portion 34 may be provided on any one of the four side wall portions 31 of the accommodation portion 20, or may be provided on all four side wall portions 31 of the accommodation portion 20. In particular, it is preferable that the discharge path portion 34 is provided on the side wall portions 31a, 31c on the short sides 38a, 38c of the opening 38 of the accommodation portion 20. Providing the discharge path portion 34 on the side wall portions 31a, 31c on the short sides 38a, 38c of the opening 38 of the accommodation portion 20 can prevent breakage of the carbon layer of the first layer 16a more effectively than providing the discharge path portion 34 on the side wall portions 31b, 31d on the long sides 38b, 38d of the opening 38 of the accommodation portion 20.

[0033] The length from the bottom surface 30 of the housing portion 20 to the opening 38 is defined as C1, and the length from the bottom surface 30 of the housing portion 20 to the edge 36 is defined as C2. The length C2 from the bottom surface 30 of the housing portion 20 to the edge 36 is shorter than the length C1 from the bottom surface 30 of the housing portion 20 to the opening 38. Furthermore, the length C2 from the bottom surface 30 to the edge 36 is preferably 0.5 to 0.8 times the height direction length T of the multilayer ceramic capacitor 14. By setting the length from the bottom surface 30 to the edge 36 in this manner, the multilayer ceramic capacitor 14 can be reliably brought into contact with the carbon layer of the first layer 16a of the base tape 10.

[0034] The length of the accommodating portion 20 in the longitudinal direction (the same direction as the width direction z of the base tape 10) is defined as A. The length A of the accommodating portion 20 in the longitudinal direction is preferably 1.02 to 1.30 times the length L of the multilayer ceramic capacitor 14 in the longitudinal direction. By setting the length A of the accommodating portion 20 in this manner, the multilayer ceramic capacitor 14 can be reliably brought into contact with the carbon layer of the first layer 16a of the base tape 10.

[0035] Furthermore, the length of the accommodating section 20 in the short-side direction (the same direction as the longitudinal direction y of the base tape 10) is defined as B. The short-side length B of the accommodating section 20 is preferably 1.02 to 1.30 times the width direction length W of the multilayer ceramic capacitor 14. By setting the short-side length B of the accommodating section 20 in this manner, the multilayer ceramic capacitor 14 can be reliably brought into contact with the carbon layer of the first layer 16a of the base tape 10.

[0036] In the base tape 10 according to one embodiment of the present invention, the average thickness D1 of the first layer 16a of the discharge path portion 34 in the housing portion 20 is preferably greater than the average thickness D2 of the first layer 16a of the side wall portion 31. This ensures the conductivity of the first layer 16a of the discharge path portion 34.

[0037] Furthermore, in the base tape 10 according to one embodiment of the present invention, the total peeled area E1 of the first layer 16a of the discharge path portion 34 is preferably smaller than the total peeled area E2 of the first layer 16a of the side wall portion 31. Here, the total peeled area refers to the area of ​​the carbon layer, which is the first layer 16a, exposed on the target surface of the side wall portion 31. As a result, the area of ​​the carbon layer torn is smaller in the first layer 16a of the discharge path portion 34 than in the first layer 16a of the side wall portion 31, thereby ensuring the conductivity of the first layer 16a.

[0038] Furthermore, the base tape 10 according to one embodiment of the present invention may have a three-layer structure, for example, with the layer in contact with the multilayer ceramic capacitor 14 designated as the first layer 16a, the layer on the backside of the first layer 16a designated as the second layer 16b, and the layer on the backside of the second layer 16b designated as the third layer 16c. Preferably, the first layer 16a and the third layer 16c are made of polystyrene and carbon, and the second layer 16b is made of polystyrene. The inclusion of a carbon layer in the first layer 16a, which contacts the multilayer ceramic capacitor 14, improves conductivity and provides antistatic properties. Furthermore, the inclusion of a carbon layer in the first layer 16a and the third layer 16c allows the base sheet 10 to be manufactured without worrying about the front and back sides.

[0039] Furthermore, the discharge path 34 provided in the housing portion 20 of the base tape 10 according to one embodiment of the present invention is preferably provided on the sidewalls 31a and 31c on the short sides of the opening 38 of the housing portion 20. When forming the housing portion 20 of the base tape 10, the carbon layer of the first layer 16a may be stretched, possibly thinning or breaking. However, by forming the discharge path 34 on the sidewalls 31a and 31c on the short sides of the opening 38 of the housing portion 20, stress concentration in the vertical direction is suppressed, thereby increasing the area in which the carbon layer of the first layer 16a remains on the flat portion 32 and the edge portion 36. This increases the likelihood that the pair of external electrodes 14b of the multilayer ceramic capacitor 14 will come into contact with the carbon layer of the first layer 16a, thereby achieving antistatic performance.

[0040] When the base tape 10 according to one embodiment of the present invention is made of resin, it is molded by vacuum molding, pressure molding, press molding, or the like.

[0041] In this embodiment, the base tape 10 is made of resin, and a method for molding the base tape 10 by press molding will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view showing an example of an apparatus for manufacturing a base tape according to one embodiment of the present invention.

[0042] First, a polystyrene sheet (second layer 16b) is prepared. Next, a solvent in which polystyrene and carbon are mixed is applied to both sides of the polystyrene sheet (second layer 16b) to form the first layer 16a and the third layer 16c. Next, the polystyrene and the carbon-coated polystyrene sheet are placed between the upper mold 50 and the lower mold 52, and press molding is performed. Finally, the upper mold 50 and the lower mold 52 are removed. By repeating the above operation multiple times, the base tape 10 having the receiving portions 20 formed in a row is molded.

[0043] 2. Electronic Components An electronic component series 12 according to one embodiment of the present invention will be described with reference to Fig. 2. Fig. 2 is a perspective view showing an electronic component series according to one embodiment of the present invention.

[0044] An electronic component series 12 according to one embodiment of the present invention comprises the above-mentioned multilayer ceramic capacitor 14, the above-mentioned base tape 10 that houses the multilayer ceramic capacitor 14, and a cover tape 18 for covering the housing portion 20 of the base tape 10.

[0045] The cover tape 18 is attached to one side of the base tape 10 so as to cover the storage section 20 of the base tape 10. The cover tape 18 is also arranged so as not to block the feed holes 22 of the base tape 10.

[0046] The cover tape 18 is made of, for example, polyethylene terephthalate. By using a material with low electrical resistance, the cover tape 18 can be prevented from becoming charged.

[0047] An electronic component series 12 according to one embodiment of the present invention is manufactured by covering the accommodating section 20 of the base tape 10, into which the multilayer ceramic capacitor 14 is inserted, with a cover tape 18, and welding the base tape 10 and the cover tape 18 at welding sections 24 on both sides of the accommodating section 20 in the longitudinal direction y of the cover tape 18.

[0048] The electronic component string 12 according to the present invention can prevent misalignment of the multilayer ceramic capacitor 14 due to static electricity, thereby preventing mounting defects, particularly when the multilayer ceramic capacitor 14 is an ultra-small multilayer ceramic capacitor. If the multilayer ceramic capacitor 14 is charged, static electricity may be generated between the multilayer ceramic capacitor 14 and the nozzle of the automatic component feeder, causing misalignment when the automatic component feeder sucks it in. In particular, with ultra-small electronic components, even a slight misalignment can cause mounting defects. However, the electronic component string 12 according to the present invention has anti-static properties, making it possible to prevent mounting defects.

[0049] Furthermore, in the electronic component string 12 according to the present invention, the direction perpendicular to the short sides 38a, 38c of the opening 38 of the housing portion 20 of the base tape 10 is preferably the same as the longitudinal direction z of the housed multilayer ceramic capacitors 14. Forming the electronic component string 12 in this manner allows the manufacture of an electronic component string 12 in which the multilayer ceramic capacitors 14 are aligned, making it easier to use in an automatic component feeder. Furthermore, it is preferable that the external electrodes 14b are provided on both end faces 14a1, 14a2 of the laminate 14a of the multilayer ceramic capacitor 14 in the longitudinal direction z. When the discharge path portion 34 is provided on the short side of the opening 38 of the base tape 10, the external electrodes 14b are more likely to come into contact with the side wall portion 31 or the edge portion 36, thereby further enhancing antistatic performance.

[0050] Furthermore, it is preferable that the length C2 from the bottom surface 30 to the edge 36 of the housing portion 20 be shorter than the height T of the multilayer ceramic capacitor 14 housed in the housing portion 20. This makes it easier for the external electrodes 14b of the multilayer ceramic capacitor 14 to come into contact with the edge 36 of the housing portion 20, thereby further enhancing antistatic performance.

[0051] 3. Experimental Example A base tape 10 was produced according to the above-described base tape manufacturing method, and the percentage of defects was measured when inserting a multilayer ceramic capacitor 14 into the base tape 10 and when removing the multilayer ceramic capacitor 14 from the base tape 10. A defect that occurs when inserting the multilayer ceramic capacitor 14 into the base tape 10 occurs, for example, when static electricity causes the multilayer ceramic capacitor 14 to come off the housing portion 20 when inserting the multilayer ceramic capacitor 14 into the base tape 10. A defect that occurs when removing the multilayer ceramic capacitor 14 from the base tape 10 occurs, for example, when static electricity causes the multilayer ceramic capacitor 14 to be attracted to the cover tape 18.

[0052] The various parameters of the electronic component series 12 used in this experimental example were as follows: Multilayer ceramic capacitor size: L x W x T = 0.25 mm x 0.125 mm x 0.125 mm Discharge path arrangement: Discharge paths are formed on the four sides of the side wall Angle θ between the flat surface and the discharge path: 100 degrees Length from bottom to edge: 0.1 mm Number of times multilayer ceramic capacitors are inserted into the base tape: 100,000 times Number of times the multilayer ceramic capacitor is removed from the base tape: 100,000 times Peel strength (one side): 0.1N to 0.25N Electronic components: 10 reels of each sample

[0053] The measurement results are shown in Table 1. In Table 1, a defect rate of 0.2% or less was marked with a circle, and a defect rate of more than 0.2% was marked with an x.

[0054] [Table 1]

[0055] The ratio of the length A of the long side of the housing portion 20 to the length L of the multilayer ceramic capacitor 14 in the longitudinal direction (A / LBy setting the value of (a) to be 1.02 or more and 1.30 or less, defects that occur when inserting the multilayer ceramic capacitor 14 into the base tape 10 and defects that occur when removing the multilayer ceramic capacitor 14 from the base tape 10 can be prevented.

[0056] As described above, although the embodiments of the present invention have been disclosed in the above description, the present invention is not limited thereto. In other words, various modifications can be made to the above-described embodiments in terms of mechanism, shape, material, quantity, position, arrangement, etc. without departing from the scope of the technical idea and purpose of the present invention, and these modifications are included in the present invention. [Explanation of symbols]

[0057] 10 Base Tape 12 Electronic Components 14 Multilayer ceramic capacitors (electronic components) 14a Laminate 14b Pair of external electrodes 16a First layer (surface layer) of base tape 16b Second layer of base tape 16c Base Tape 3rd Layer 18 Cover Tape 20 Storage section 22 sprocket holes 30 Bottom part 31a, 31b, 31c, 31d side wall section 32a, 32b, 32c, 32d flat section 34a, 34b, 34c, 34d Discharge path section 36a, 36b, 36c, 36d edges 38a, 38b, 38c, 38d opening 50 upper mold 52 Lower mold L: Length of the electronic component W Width of electronic component T Height dimension of electronic component A Length of the long side of the storage compartment B Length of the short side of the storage compartment C1 Length from the bottom of the storage compartment to the opening C2 Length from the bottom of the container to the edge D1 Thickness of the first layer of the discharge path D2 Thickness of the first layer of the sidewall E1 Total peeling area of ​​the first layer of the discharge path E2 Total peeled area of ​​the first layer of the sidewall x Height direction of base tape y Longitudinal direction of the base tape z Width direction of base tape (short direction)

Claims

1. A base tape having a rectangular parallelepiped housing portion for housing a multilayer ceramic capacitor, The base tape has a layer structure having multiple layers, When a layer where the base tape and the multilayer ceramic capacitor contact each other is defined as a first layer, the first layer is provided with a carbon layer, The storage section has a bottom surface, a sidewall including a plurality of surfaces, and an opening, the side wall portion has an edge portion between the bottom surface portion and the opening portion, a flat portion is provided from the bottom surface portion toward the edge portion, and a discharge path portion is provided that is inclined from the edge portion toward the opening portion, on any one surface of the side wall portion; the flat portion and the discharge path portion are surfaces, and one side of the flat portion and one side of the discharge path portion are continuously connected via the edge portion; a length from the bottom surface portion to the edge portion is shorter than a height of the multilayer ceramic capacitor; The ratio (A / L) of the length A of the long side of the housing portion to the length L of the multilayer ceramic capacitor in the longitudinal direction is 1.02 or more and 1.05 or less.

2. The base tape according to claim 1 , wherein the average thickness of the first layer of the discharge path portion is greater than the average thickness of the first layer of the side wall portion.

3. 3. The base tape according to claim 1, wherein a total peeled area of ​​the first layer of the discharge path portion is smaller than a total peeled area of ​​the first layer of the side wall portion.

4. The base tape has a three-layer structure, When a layer where the base tape and the multilayer ceramic capacitor contact is defined as a first layer, a back surface side of the first layer is defined as a second layer, and a back surface side of the second layer is defined as a third layer, the first layer and the third layer are made of polystyrene and carbon; 4. The base tape according to claim 1, wherein the second layer is made of polystyrene.

5. The base tape according to claim 1 , wherein the discharge path portion is provided on a side wall portion on a short side of the opening of the accommodating portion.

6. 6. An electronic component series comprising: the base tape according to claim 1; a multilayer ceramic capacitor accommodated in the accommodating portion of the base tape; and a cover tape for covering the accommodating portion.

7. 7. The electronic component series according to claim 6, wherein a direction perpendicular to a short side of the opening of the housing portion is the same as a longitudinal direction of the multilayer ceramic capacitor to be housed.

8. 8. The electronic component series according to claim 6, wherein external electrodes are provided on both longitudinal end surfaces of the multilayer ceramic capacitor.

9. 9. The electronic component series according to claim 6, wherein a length from the bottom surface of the housing portion to the edge portion is shorter than a height of the multilayer ceramic capacitor housed in the housing portion.

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