Electronic Components

Abstract

An electronic component (100) comprises: an insulator (10); an inductor (L1) that is configured in the insulator (10) and has a conductor pattern (K2); and a first external electrode (31) electrically connected to the conductor pattern (K2). The insulator (10) has a first main surface (11), a second main surface (12) opposite the first main surface (11), and a first side surface (21), a second side surface (22), a third side surface (23), and a fourth side surface (24) that connect the first main surface (11) and the second main surface (12). The first external electrode (31) includes a first electrode (31a) provided along the first main surface (11), and a second electrode (31b) provided along the first side surface (21). The electronic component (100) further comprises an internal conductor (SL1) that is provided in the insulator (10) and electrically connects the first electrode (31a) and the second electrode (31b).

Description

[Technical Field]

[0001] The present disclosure relates to electronic components. [Background technology]

[0002] Conventionally, small chip-type electronic components have been known in which an inductor (coil) is provided inside an insulator formed by laminating multiple insulator layers. For example, Japanese Patent Laid-Open Publication No. 9-246046 (Patent Document 1) discloses a multilayer inductor that includes a laminate in which multiple magnetic sheets, each having a coil conductor provided thereon, are stacked, and external electrodes to which the coil conductor provided in the laminate is connected. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 9-246046 Summary of the Invention [Problem to be solved by the invention]

[0004] The electronic component disclosed in Patent Document 1 has, as external electrodes, a back electrode provided along the mounting surface to be placed on a mounting board and a side electrode provided along the side of an insulator, and the back electrode and the side electrode are electrically connected. However, if the electrical connection between the back electrode and the side electrode is broken due to a malfunction, there is a risk of problems such as a significant change in the electrical characteristics of the electronic component.

[0005] Therefore, an object of the present disclosure is to provide an electronic component that can suppress changes in electrical characteristics due to disconnection of external electrodes. [Means for solving the problem]

[0006] An electronic component according to one embodiment of the present disclosure includes an insulator, an inductor, and an external electrode. The inductor is configured within the insulator and has a first conductor pattern. The external electrode is electrically connected to the first conductor pattern. The insulator has a first main surface, a second main surface opposite the first main surface, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first and second main surfaces. The first side surface faces the second side surface. The third side surface faces the fourth side surface. The external electrode has a first electrode provided along the first main surface and a second electrode provided along the first side surface. The axis of a coil formed by the inductor is perpendicular to the first main surface. The electronic component includes an internal conductor provided within the insulator and electrically connecting the first electrode and the second electrode. The internal conductor is connected to the first electrode through the via conductor, and is formed from the connection portion of the via conductor to the second electrode. The internal conductor overlaps the first conductive pattern when viewed from the second principal surface side. [Effects of the Invention]

[0007] According to one embodiment of the present disclosure, even if the electrical connection between the first electrode provided along the first main surface and the second electrode provided along the first side surface is severed, the internal conductor provided within the insulator can maintain the electrical connection between the first electrode and the second electrode, thereby suppressing changes in electrical characteristics due to disconnection of the external electrode. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an electronic component according to a first embodiment. [Figure 2] 2 is a cross-sectional view showing a configuration inside an insulator of the electronic component according to the first embodiment. FIG. [Figure 3] 1 is an exploded plan view showing the configuration of an electronic component according to a first embodiment. [Figure 4] 3A and 3B are a cross-sectional view and an equivalent circuit diagram showing electrical connections of first external electrodes of the electronic component according to the first embodiment. [Figure 5] 3A and 3B are a cross-sectional view and an equivalent circuit diagram showing electrical connections of first external electrodes of the electronic component according to the first embodiment. [Figure 6] 3A and 3B are diagrams illustrating magnetic field coupling in the electronic component according to the first embodiment. [Figure 7] FIG. 4 is a diagram showing a comparison result of inductance values ​​between the electronic component according to the first embodiment and an electronic component according to a comparative example. [Figure 8] 10A and 10B are a cross-sectional view and an equivalent circuit diagram showing a configuration inside an insulator of an electronic component according to a second embodiment. [Figure 9] FIG. 10 is an exploded plan view showing the configuration of an electronic component according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view showing a configuration inside an insulator of an electronic component according to a third embodiment. [Figure 11] FIG. 10 is an exploded plan view showing the configuration of an electronic component according to a third embodiment. [Figure 12] FIG. 10 is an equivalent circuit diagram of an electronic component according to a third embodiment. [Figure 13] FIG. 10 is a perspective view of an electronic component according to a fourth embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing a configuration inside an insulator of an electronic component according to a fourth embodiment. [Figure 15] FIG. 10 is an exploded plan view showing the configuration of an electronic component according to a fourth embodiment. [Figure 16] FIG. 10 is an equivalent circuit diagram of an electronic component according to a fourth embodiment. [Figure 17] 10A and 10B are diagrams for explaining misalignment of conductor patterns of an electronic component according to a comparative example. [Figure 18] 10A and 10B are diagrams illustrating misalignment of conductor patterns of an electronic component according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a filter device according to an embodiment will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0010] (Embodiment 1) An electronic component 100 according to a first embodiment will be described with reference to Figures 1 to 7. Figure 1 is a perspective view of the electronic component 100 according to the first embodiment. In Figure 1, the short side direction of the electronic component 100 is the X direction, the long side direction is the Y direction, and the height direction is the Z direction.

[0011] Electronic component 100 according to the first embodiment is a small chip-type coil having at least one conductive pattern. Electronic component 100 includes rectangular parallelepiped insulator 10 formed by stacking multiple insulating substrates (insulator layers) on each of which at least one conductive pattern is formed. The insulating substrates are stacked in the Z direction, and the arrow in FIG. 1 indicates the upward direction. The insulating substrates are made of, for example, an insulating material containing borosilicate glass as a main component, or an insulating resin such as alumina, zirconia, and polyimide resin. Furthermore, in insulator 10, the interfaces between the multiple insulating substrates may not be clearly defined due to processes such as baking or curing.

[0012] The insulator 10 has a first main surface 11, a second main surface 12 opposite to the first main surface 11, and a first side surface 21, a second side surface 22, a third side surface 23, and a fourth side surface 24 connecting the first main surface 11 and the second main surface 12.

[0013] 1, first main surface 11 is located below second main surface 12 in the Z direction. First main surface 11 is a mounting surface that is placed on a mounting board, and when electronic component 100 is mounted on the mounting board, first main surface 11 faces the mounting board. In the first embodiment, first main surface 11 is also referred to as a bottom surface or a back surface, and second main surface 12 is also referred to as a top surface.

[0014] The first side surface 21 and the second side surface 22 are provided in the longitudinal direction (Y direction) of the insulator 10. The first side surface 21 faces the second side surface 22. The third side surface 23 and the fourth side surface 24 are provided in the lateral direction (X direction) of the insulator 10. The third side surface 23 faces the fourth side surface 24.

[0015] The electronic component 100 includes a first external electrode 31 and a second external electrode 32 that are electrically connected to at least one conductive pattern provided inside the insulator 10. The first external electrode 31 is provided closer to the third side surface 23 than the second external electrode 32 in the longitudinal direction (Y direction) of the insulator 10. The second external electrode 32 is provided closer to the fourth side surface 24 than the first external electrode 31 in the longitudinal direction (Y direction) of the insulator 10.

[0016] The first external electrode 31 and the second external electrode 32 are not limited to the first main surface 11, which is the bottom surface of the insulator 10, but electrodes (e.g., electrode surfaces) are also formed on the first side surface 21 and the second side surface 22 connecting the first main surface 11 and the second main surface 12.

[0017] Specifically, the first external electrode 31 has a first electrode 31a provided along the first main surface 11, a second electrode 31b provided along the first side surface 21, and a third electrode 31c provided along the second side surface 22. The second electrode 31b and the third electrode 31c are electrically connected to the first electrode 31a through a path along the outer periphery of the insulator 10. That is, the first electrode 31a, the second electrode 31b, and the third electrode 31c are designed to be at the same potential by being electrically connected through a path along the outer periphery of the insulator 10.

[0018] Furthermore, the first external electrode 31 does not have electrodes along the second main surface 12, the third side surface 23, or the fourth side surface 24. That is, when the first external electrode 31 is viewed from the third side surface 23 side with the first main surface 11 facing downward (the mounting board side), the first external electrode 31 has a concave (U-shaped) or approximately concave (approximately U-shaped) shape. Strictly speaking, the end 310b of the second electrode 31b provided along the first side surface 21 and the end 310c of the third electrode 31c provided along the second side surface 22 overlap the second main surface 12, but the ends 310b and 310c are not directly connected to the conductor pattern within the insulator 10. The first external electrode 31 may be provided on the insulator 10 so that the ends 310b and 310c do not overlap the second main surface 12.

[0019] The second external electrode 32 has a fourth electrode 32a provided along the first main surface 11, a fifth electrode 32b provided along the first side surface 21, and a sixth electrode 32c provided along the second side surface 22. The fifth electrode 32b and the sixth electrode 32c are electrically connected to the fourth electrode 32a through a path along the outer periphery of the insulator 10. That is, the fourth electrode 32a, the fifth electrode 32b, and the sixth electrode 32c are electrically connected through a path along the outer periphery of the insulator 10, and thereby have the same potential.

[0020] Furthermore, the second external electrode 32 does not have electrodes along the second main surface 12, the third side surface 23, or the fourth side surface 24. That is, when the second external electrode 32 is viewed from the fourth side surface 24 with the first main surface 11 facing downward (the mounting board side), the second external electrode 32 has a concave (U-shaped) or approximately concave (approximately U-shaped) shape. Strictly speaking, the end 320b of the fifth electrode 32b provided along the first side surface 21 and the end 320c of the sixth electrode 32c provided along the second side surface 22 overlap the second main surface 12, but the ends 320b and 320c are not directly connected to the conductor pattern within the insulator 10. The second external electrode 32 may be provided on the insulator 10 so that the ends 320b and 320c do not overlap the second main surface 12.

[0021] The first external electrode 31 and the second external electrode 32 have electrodes on both the first side surface 21 and the second side surface 22, but the first external electrode 31 and the second external electrode 32 may have electrodes on only one of the first side surface 21 and the second side surface 22. In other words, the first external electrode 31 and the second external electrode 32 may have an L-shape or a substantially L-shape when viewed from the third side surface 23 side or the fourth side surface 24 side with the first main surface 11 facing downward (the mounting board side).

[0022] The first external electrode 31 and the second external electrode 32 may have electrodes on the third side surface 23 and the fourth side surface 24 .

[0023] FIG. 2 is a cross-sectional view showing the internal configuration of insulator 10 of electronic component 100 according to embodiment 1. FIG. 3 is an exploded plan view showing the internal configuration of electronic component 100 according to embodiment 1. As shown in FIGS. 2 and 3, electronic component 100 includes inductor L1 formed by conductor patterns K1 and K2 within insulator 10. Note that in electronic component 100 according to embodiment 1, conductor pattern K2 is an example of a "first conductor pattern" in the present disclosure. Conductor patterns K1 and K2 of inductor L1 are stacked parallel to first main surface 11 of insulator 10 and are electrically connected by via conductor V1.

[0024] 3, electronic component 100 includes insulating substrates N1 to N3 in this order from second main surface 12. Within insulator 10, conductor patterns and electrode patterns are formed on insulating substrates N1 to N3 by a printing method.

[0025] A conductor pattern K1 that forms part of the inductor L1 is formed on the insulating substrate N1. The conductor pattern K1 is formed so as to make approximately one full turn counterclockwise from the upper left side of the insulating substrate N1 in the figure. The starting end of the conductor pattern K1 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P1 that connects to the via conductor V1 is provided near the end of the conductor pattern K1.

[0026] A conductor pattern K2 that forms part of the inductor L1 is formed on the insulating substrate N2. The conductor pattern K2 is formed so as to make approximately one full turn counterclockwise from the center of the upper side of the insulating substrate N2 in the figure. A connection portion P2 that connects to the via conductor V1 is provided near the starting end of the conductor pattern K2. The end of the conductor pattern K2 is electrically connected to the fifth electrode 32b of the second external electrode 32.

[0027] In this way, the inductor L1 configures a coil by connecting the conductor pattern K1 and the conductor pattern K2 in series.

[0028] The inductor L1 is not limited to a coil formed by two conductor patterns, the conductor pattern K1 and the conductor pattern K2, but may be a coil formed by three or more conductor patterns.

[0029] In this way, within the insulator 10 of the electronic component 100, the conductor patterns K1 and K2 are electrically connected to the second electrode 31b of the first external electrode 31 and the fifth electrode 32b of the second external electrode 32 through the via conductors V1 and V2.

[0030] When forming an inductor conductor pattern across multiple layers, using only the first electrode 31a or the fourth electrode 32a on the first principal surface 11 requires providing via conductors across the multiple layers, which requires either reducing the size of the opening of the inductor L1 or increasing the size of the electronic component while leaving the opening of the inductor L1 unchanged. However, as in electronic component 100 according to embodiment 1, when electrodes are provided on the first side surface 21 and the second side surface 22 of insulator 10 in addition to the first electrode 31a and the fourth electrode 32a on the first principal surface 11, the inductor conductor pattern can be connected to the first side surface 21 and the second side surface 22 without using vias. This allows the conductor pattern to be formed to fill the entire outer frame of insulator 10 in electronic component 100. Furthermore, because the first side surface 21 and the second side surface 22 are at the same potential, the inductor conductor pattern can be connected to two locations on the side surfaces. Forming side electrodes in this manner makes it easier to adjust the length of the conductor pattern, improving the design flexibility of the conductor pattern.

[0031] As described above, the second electrode 31b and the third electrode 31c are electrically connected to the first electrode 31a via a path along the outer periphery of the insulator 10. However, if the electrical connection between the first electrode 31a and the second electrode 31b or the third electrode 31c is severed due to a malfunction, problems such as a significant change in the electrical characteristics of the electronic component 100 may occur.

[0032] Therefore, electronic component 100 according to the first embodiment further includes an internal conductor SL1 that is provided within insulator 10 and electrically connects first electrode 31a and second electrode 31b. In the present disclosure, internal conductor SL1 is a bypass conductor that connects first electrode 31a and second electrode 31b, but internal conductor SL1 does not have to be a bypass conductor as long as it is configured to electrically connect first electrode 31a and second electrode 31b.

[0033] The electronic component 100 according to the first embodiment further includes an internal conductor SL2 disposed within the insulator 10 and electrically connecting the fourth electrode 32a and the fifth electrode 32b. In the present disclosure, the internal conductor SL2 is a bypass conductor connecting the fourth electrode 32a and the fifth electrode 32b. However, the internal conductor SL2 does not have to be a bypass conductor as long as it is configured to electrically connect the fourth electrode 32a and the fifth electrode 32b. Hereinafter, the internal conductor SL1 will be mainly described with reference to FIGS. 4 and 5 in addition to FIG. 3, but the internal conductor SL2 also has a function similar to that of the internal conductor SL1.

[0034] 4 and 5 are a cross-sectional view and an equivalent circuit diagram showing the electrical connection of first external electrode 31 of electronic component 100 according to embodiment 1. Note that Fig. 4 and Fig. 5 are views of the A-A' cross section of electronic component 100 shown in Fig. 3, viewed in the Y direction from third side surface 23.

[0035] 3 to 5, the internal conductor SL1 is formed on the insulating substrate N3. The internal conductor SL1 is formed near the second electrode 31b and the third electrode 31c on the third side surface 23 side, extending from approximately the center of the insulating substrate N3 in the short side direction (X direction) to the second electrode 31b. The internal conductor SL1 also extends in the same direction (X direction) as a part of the conductor pattern K2 of the inductor L1. When the internal conductor SL1 is viewed in plan from the second main surface 12 side, the internal conductor SL1 is positioned so as to overlap a part of the conductor pattern K2 in the stacking direction (Z direction).

[0036] The internal conductor SL1 is electrically connected to the second electrode 31b. The internal conductor SL1 is provided with a connection portion P6 that is connected to a via conductor V3. The connection portion P6 of the internal conductor SL1 is connected to a connection portion P7 that is provided on the first electrode 31a by the via conductor V3.

[0037] As a result, the first electrode 31a and the second electrode 31b are electrically connected by a first path passing through the outer periphery of the insulator 10 (i.e., a path along the first main surface 11 and the first side surface 21), and are also electrically connected by a second path passing through the via conductor V3 and the internal conductor SL1 within the insulator 10.

[0038] 3, the internal conductor SL2 is formed on the insulating substrate N3. The internal conductor SL2 is formed near the fifth electrode 32b and the sixth electrode 32c on the fourth side surface 24 side, extending from approximately the center of the insulating substrate N3 in the short side direction (X direction) to the fifth electrode 32b. The internal conductor SL2 extends in the same direction (X direction) as a portion of the conductor pattern K2 of the inductor L1. When the internal conductor SL2 is viewed in plan from the second main surface 12 side, the internal conductor SL2 is positioned so as to overlap a portion of the conductor pattern K2 in the stacking direction (Z direction).

[0039] The internal conductor SL2 is electrically connected to the fifth electrode 32b. The internal conductor SL2 is provided with a connection portion P4 that is connected to a via conductor V2. The connection portion P4 of the internal conductor SL2 is connected to a connection portion P5 that is provided on the fourth electrode 32a by the via conductor V2.

[0040] As a result, the fourth electrode 32a and the fifth electrode 32b are electrically connected by a first path passing through the outer periphery of the insulator 10 (i.e., a path along the first main surface 11 and the first side surface 21), and are also electrically connected by a second path passing through the via conductor V2 and the internal conductor SL2 within the insulator 10.

[0041] As shown in FIG. 4A, a current IL flows in the conductor pattern K2. In a first path passing through the outer periphery of the insulator 10, a current IS1 flows from the first electrode 31a to the second electrode 31b along the outer periphery. In a second path passing through the internal conductor SL1 in the insulator 10, a current IS2 flows from the first electrode 31a to the second electrode 31b via the via conductor V3 and the internal conductor SL1. The current IS2 flowing through the internal conductor SL1 is parallel to and opposite to the current IL flowing through the portion of the conductor pattern K2 close to the internal conductor SL1, and the internal conductor SL1 and the conductor pattern K2 are magnetically coupled to each other (coupling coefficient k). Specifically, the internal conductor SL1 is magnetically coupled (depolarized coupled) to the conductor pattern K2 such that the polarity of the internal conductor SL1 and the polarity of the conductor pattern K2 are opposite.

[0042] Although not shown, in the first path passing through the outer periphery of the insulator 10, a current IS1' flows from the fifth electrode 32b to the fourth electrode 32a along the outer periphery. In the second path passing through the internal conductor SL2 in the insulator 10, a current IS2' flows from the fifth electrode 32b to the fourth electrode 32a via the internal conductor SL2 and the via conductor V2. The current IS2' flowing through the internal conductor SL2 is parallel to and opposite to the current IL flowing through a portion of the conductor pattern K2 that is close to the internal conductor SL2, and the internal conductor SL2 and the conductor pattern K2 are magnetically coupled to each other (coupling coefficient k). Specifically, the internal conductor SL2 is magnetically coupled (depolarized coupled) to the conductor pattern K2 such that the polarity of the internal conductor SL2 and the polarity of the conductor pattern K2 are opposite.

[0043] 4(B), electronic component 100 includes a first terminal T1 corresponding to a connection point of first external electrode 31 on the mounting substrate, a second terminal T2 corresponding to a connection point of second external electrode 32 on the mounting substrate, and an inductor L1 located between first terminal T1 and second terminal T2. Inductor L1 is connected to second terminal T2. Electronic component 100 also includes parasitic inductances ESL1 and ESL2 connected in parallel between first terminal T1 and inductor L1. Parasitic inductance ESL1 occurs in first electrode 31a and second electrode 31b through which current IS1 flows. Parasitic inductance ESL2 occurs in internal conductor SL1 through which current IS2 flows.

[0044] The conductor pattern K2 and the internal conductor SL1 of the inductor L1 are magnetically coupled to each other (coupling coefficient k). FIG. 6 is a diagram illustrating magnetic field coupling in the electronic component 100 according to the first embodiment. As shown in FIG. 6, a magnetic field ML is generated in the conductor pattern K2 by a current IL. Furthermore, a magnetic field MS is generated in the internal conductor SL1 by a current IS2 that flows parallel to and in the opposite direction to the current IL. The magnetic field coupling between the magnetic field ML generated in the conductor pattern K2 and the magnetic field MS generated in the internal conductor SL1 generates a mutual inductance M between the conductor pattern K2 and the internal conductor SL1. FIG. 4B shows an equivalent circuit diagram in which, taking into account the generated mutual inductance M, a mutual inductance −M is added to each of the conductor pattern K2 and the internal conductor SL1, and a mutual inductance +M is added between the parasitic inductance ESL1 and the inductor L1 and the parasitic inductance ESL2.

[0045] As described above, in the electronic component 100, the first electrode 31a and the second electrode 31b are electrically connected by a first path that passes through the outer periphery of the insulator 10, and are also electrically connected by a second path that passes through the internal conductor SL1 inside the insulator 10. As a result, even if the electrical connection between the first electrode 31a and the second electrode 31b is cut off along the first path that passes through the outer periphery of the insulator 10, as shown in Fig. 5 , the electrical connection between the first electrode 31a and the second electrode 31b is maintained along the second path that passes through the internal conductor SL1 inside the insulator 10, thereby suppressing changes in electrical characteristics due to disconnection of the first external electrode 31.

[0046] Changes in electrical characteristics will be described using an example with reference to FIG. 7. FIG. 7 is a diagram illustrating a comparison of inductance values ​​between electronic component 100 according to the first embodiment and an electronic component according to a comparative example. FIG. 7 illustrates characteristic changes when electronic component 100 according to the first embodiment is used as the electronic component according to the example, and characteristic changes when an electronic component according to the comparative example is used that has the same internal conductor SL1 as electronic component 100 according to the first embodiment but is not magnetically coupled. Here, we focus only on internal conductor SL1 and compare the parasitic inductances. However, internal conductor SL2 also provides the same effect as internal conductor SL1. The characteristic changes shown are those in the inductance value in the portion between first terminal T1 and inductor L1 (ESL portion S indicated by dashed lines in FIGS. 4B and 5B). In the comparative example, parasitic inductances ESL1 and ESL2 are 0.5 nH, and mutual inductance M is 0.1 nH.

[0047] As shown in FIG. 7, in the example, when the first electrode 31a and the second electrode 31b are electrically connected in the first path passing through the outer periphery of the insulator 10, the inductance value of the ESL portion S is 0.24 nH, whereas when the first electrode 31a and the second electrode 31b are disconnected, the inductance value of the ESL portion S is 0.40 nH, and the amount of change is 0.16 nH.

[0048] In the comparative example, when the first electrode 31a and the second electrode 31b are electrically connected in the first path passing through the outer periphery of the insulator 10, the inductance value of the ESL portion S is 0.25 nH, whereas when the first electrode 31a and the second electrode 31b are disconnected, the inductance value of the ESL portion S is 0.50 nH, and the amount of change is 0.25 nH.

[0049] In the electronic component according to the comparative example, when the electrical connection between the first electrode 31a and the second electrode 31b is severed, the only path within the ESL section S is ESL2, which increases the inductance value of the ESL section S. However, in electronic component 100 according to the first embodiment, the internal conductor SL1 and conductor pattern K2 (an example of a first conductor pattern) are magnetically coupled (depolarized coupled), which increases the amount of current IS2 flowing through ESL2 and increases the mutual inductance M, thereby making it possible to suppress the increase in the inductance value of the ESL section S, which is represented by ESL2-M. Therefore, electronic component 100 according to the example can suppress the amount of change in the inductance value of the ESL section S more than the comparative example.

[0050] In this way, in the electronic component 100 of embodiment 1, even if the electrical connection between the first electrode 31a and the second electrode 31b is severed, the internal conductor SL1 provided within the insulator 10 can maintain the electrical connection between the first electrode 31a and the second electrode 31b.Furthermore, by magnetically coupling the internal conductor SL2 and the conductor pattern K2, the mutual inductance increases in accordance with the increase in the current flowing through the internal conductor SL2 due to the disconnection, and therefore, changes in electrical characteristics due to the disconnection of the first external electrode 31 can be further suppressed.

[0051] The internal conductor SL1 is not limited to electrically connecting the first electrode 31a and the second electrode 31b, but may be provided within the insulator 10 so as to electrically connect the first electrode 31a and the third electrode 31c.

[0052] Furthermore, the internal conductor SL1 does not have to be positioned so as to overlap a portion of the conductor pattern K2 when viewed in a plan view from the second main surface 12 side, and the internal conductor SL1 may be positioned so as to be magnetically coupled with the conductor pattern K2.

[0053] Furthermore, the current IS2 flowing through the internal conductor SL1 does not have to be parallel to the current IL flowing through the conductor pattern K2, and the internal conductor SL1 may be arranged so as to be deviated from parallel to the conductor pattern K2 so as to magnetically couple with it.

[0054] (Embodiment 2) 8 and 9, an electronic component 200 according to a second embodiment will be described. In the second embodiment, a small chip-type filter device in which an inductor L1 and a capacitor C1 are connected in series will be described as electronic component 200. Note that, in electronic component 200 according to the second embodiment, only the configurations that are different from electronic component 100 according to the first embodiment will be mainly described; the same components as those in electronic component 100 according to the first embodiment will be denoted by the same reference numerals in electronic component 200 according to the second embodiment, and descriptions thereof will be omitted.

[0055] FIG. 8 is a cross-sectional view and an equivalent circuit diagram showing the internal configuration of insulator 10 of electronic component 200 according to embodiment 2. FIG. 9 is an exploded plan view showing the internal configuration of electronic component 200 according to embodiment 2. As shown in FIGS. 8 and 9, electronic component 200 includes, within insulator 10, an inductor L1 formed by conductor patterns K1 and K2, and a capacitor C1 formed by electrode patterns K3 and K4. In insulator 10, inductor L1 and capacitor C1 are connected in series, thereby forming a series resonant circuit in electronic component 200. In electronic component 200 according to embodiment 2, conductor pattern K2 is an example of a "first conductor pattern" in the present disclosure.

[0056] The electrode patterns K3 and K4 of the capacitor C1 are stacked below the conductor patterns K1 and K2 of the inductor L1 in the Z direction with an insulating layer interposed between them. That is, the capacitor C1 is disposed closer to the first principal surface 11 than the inductor L1. When the capacitor C1 is viewed from the second principal surface 12 side in a plan view, the electrode patterns K3 and K4 of the capacitor C1 are disposed at positions that overlap with parts of the conductor patterns K1 and K2 in the stacking direction (Z direction).

[0057] As shown in FIG. 9, electronic component 200 further includes insulating substrate N4 between insulating substrate N2 and insulating substrate N3. An electrode pattern K4 constituting one electrode of capacitor C1 is formed on insulating substrate N4. When electrode pattern K4 is viewed from the second main surface 12 side, electrode pattern K4 is positioned so as to overlap with parts of conductor patterns K1 and K2 in the stacking direction (Z direction). That is, electrode pattern K4 is positioned so as to minimize the area overlapping with the opening of inductor L1 formed by conductor patterns K1 and K2. Electrode pattern K4 includes connection portion P8 connected to via conductor V4. That is, electrode pattern K4 is connected to connection portion P3 of conductor pattern K2 of inductor L1 by via conductor V4.

[0058] An electrode pattern K3 that constitutes the other electrode of the capacitor C1 is formed on the insulating substrate N3. When the electrode pattern K3 is viewed from the second main surface 12 side, the electrode pattern K3 is positioned so as to overlap with parts of the conductor patterns K1 and K2 in the stacking direction (Z direction). In other words, the electrode pattern K3 is positioned so as to reduce the area that overlaps with the opening of the inductor L1 formed by the conductor patterns K1 and K2. A connection portion P4 of the electrode pattern K3 is connected to a connection portion P5 that is provided on the fourth electrode 32a by a via conductor V2.

[0059] The electrode pattern K3 is electrically connected to the sixth electrode 32c of the second external electrode 32. The path connecting the connection portion P5 provided on the fourth electrode 32a to the sixth electrode 32c of the second external electrode 32 through the via conductor V2 and the electrode pattern K3 corresponds to the path connecting the connection portion P5 provided on the fourth electrode 32a to the fifth electrode 32b of the second external electrode 32 through the via conductor V2 and the internal conductor SL2 in the electronic component 100 according to the first embodiment.

[0060] In this way, the first electrode 31a and the second electrode 31b may be electrically connected by an internal conductor SL1 provided within the insulator 10, not only in a small chip component type coil including the inductor L1, but also in a small chip component type filter device that forms a resonant circuit such as the electronic component 200 of embodiment 2.

[0061] Specifically, in the electronic component 200, the internal conductor SL1 is formed on the same insulating substrate N3 as the electrode pattern K3 constituting the capacitor C1. The internal conductor SL1 is disposed at a position overlapping a portion of the conductor pattern K2 in the stacking direction (Z direction) and extends in the same direction (X direction) as a portion of the conductor pattern K2 of the inductor L1. The current flowing through the internal conductor SL1 is parallel to and opposite to the current flowing through the portion of the conductor pattern K2 that is close to the internal conductor SL1, and the internal conductor SL1 and the conductor pattern K2 are magnetically coupled (depolarized coupled) to each other.

[0062] As a result, even in a filter device that constitutes an LC series circuit, even if the electrical connection between the first electrode 31a and the second electrode 31b is severed in the first path that passes through the outer periphery of the insulator 10, the electrical connection between the first electrode 31a and the second electrode 31b is maintained in the second path that passes through the internal conductor SL1 within the insulator 10, thereby suppressing changes in electrical characteristics due to disconnection of the first external electrode 31.

[0063] In the case of a filter using series resonance, the series resonance frequency is designed as the pass frequency, so if the inductance value of the ESL section S changes due to the first path between the first electrode 31a and the second electrode 31b being disconnected, the pass band will deviate from the design. Therefore, by arranging the internal conductor SL1, it is possible to suppress the change in the inductance value related to the first external electrode 31, and therefore the change in the filter characteristics.

[0064] (Embodiment 3) 10 to 12, an electronic component 300 according to a third embodiment will be described. In the third embodiment, electronic component 300 is a small chip-type filter device in which inductor L12 and capacitor C11 are connected in series, and inductor L12, capacitor C11, and inductor L11 are connected in parallel. Regarding electronic component 300 according to the third embodiment, only the configurations that differ from electronic component 100 according to the first embodiment and electronic component 200 according to the second embodiment will be mainly described. The same components as those in electronic component 100 according to the first embodiment and electronic component 200 according to the second embodiment will be denoted by the same reference numerals in electronic component 300 according to the third embodiment, and descriptions thereof will be omitted.

[0065] FIG. 10 is a cross-sectional view showing the internal configuration of insulator 10 of electronic component 300 according to embodiment 3. FIG. 11 is an exploded plan view showing the internal configuration of electronic component 300 according to embodiment 3. As shown in FIGS. 10 and 11, electronic component 300 includes, within insulator 10, inductor L11 configured by conductor patterns K11 to K14, inductor L12 configured by conductor patterns K15 to K18, and capacitor C11 configured by electrode patterns K19 and K20. Within insulator 10, inductor L12 and capacitor C11 are connected in series, and inductor L12 and capacitor C11 are connected in parallel with inductor L11, thereby forming a resonant circuit in electronic component 300. In electronic component 300 according to embodiment 3, conductor pattern K18 is an example of a "first conductor pattern" in the present disclosure. In electronic component 300 according to embodiment 3, inductor L12 is an example of an "inductor" in the present disclosure, and inductor L11 is an example of an "other inductor" in the present disclosure.

[0066] The conductor patterns K11 to K14 of the inductor L11 are stacked in parallel to the first main surface 11 of the insulator 10 and are electrically connected by a plurality of via conductors. The conductor patterns K15 to K18 of the inductor L12 are stacked in parallel to the first main surface 11 of the insulator 10 and are electrically connected by a plurality of via conductors. The inductor L11 is arranged closer to the second main surface 12 than the inductor L12.

[0067] The conductor patterns K15 to K18 of the inductor L12 are stacked below the conductor patterns K11 to K14 of the inductor L11 in the Z direction, with an insulating layer interposed between them. That is, the inductor L12 is arranged closer to the first main surface 11 than the inductor L11. The electrode patterns K19 and K20 of the capacitor C11 are stacked below the conductor patterns K15 to K18 of the inductor L12 in the Z direction, with an insulating layer interposed between them. That is, the capacitor C11 is arranged closer to the first main surface 11 than the inductors L11 and L12.

[0068] Specifically, electronic component 300 includes insulating substrates N1 to N20 in this order from second main surface 12. Within insulator 10, conductor patterns and electrode patterns are formed on insulating substrates N1 to N20 by a printing method.

[0069] A conductor pattern K11 that forms part of the inductor L11 is formed on the insulating substrate N11. The conductor pattern K11 is formed clockwise from the upper left side of the insulating substrate N11 in the figure, circulating approximately three-quarters of the way around. The starting end of the conductor pattern K11 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P11 that connects to the via conductor V11A and a connection portion P12 that connects to the via conductor V11B are provided near the end of the conductor pattern K11.

[0070] A conductor pattern K12 that forms part of the inductor L11 is formed on the insulating substrate N12. The conductor pattern K12 is formed clockwise from the upper left side of the insulating substrate N12 in the figure, circulating approximately three-quarters of the way around. The starting end of the conductor pattern K12 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P13 that connects to the via conductors V11A and V12A and a connection portion P14 that connects to the via conductors V11B and V12B are provided near the ending end of the conductor pattern K12.

[0071] A conductor pattern K13 that forms part of the inductor L11 is formed on the insulating substrate N13. The conductor pattern K13 is formed clockwise from the lower right side of the insulating substrate N13 in the figure, wrapping around approximately three-quarters of the way around. Near the starting end of the conductor pattern K13, a connection portion P15 that connects to the via conductors V12A and V13A and a connection portion P15 that connects to the via conductors V12B and V13B are provided. The end of the conductor pattern K13 is electrically connected to the fifth electrode 32b of the second external electrode 32.

[0072] A conductor pattern K14 that forms part of the inductor L11 is formed on the insulating substrate N14. The conductor pattern K14 is formed clockwise from the lower right side of the insulating substrate N14 in the figure, wrapping around approximately three-quarters of the way around. A connection portion P17 that connects to the via conductor V13A and a connection portion P18 that connects to the via conductor V13B are provided near the starting end of the conductor pattern K14. The end of the conductor pattern K14 is electrically connected to the fifth electrode 32b of the second external electrode 32.

[0073] In this way, the inductor L11 forms a coil by connecting the conductor patterns K11 and K12 in parallel, connecting the conductor patterns K13 and K14 in parallel, and further connecting the conductor patterns K11, K12 and the conductor patterns K13, K14 in series.

[0074] A conductor pattern K15 that forms part of the inductor L12 is formed on the insulating substrate N15. The conductor pattern K15 is formed so as to make approximately one full turn counterclockwise from the upper left side of the insulating substrate N15 in the figure. The starting end of the conductor pattern K15 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P19 that connects to the via conductor V14 is provided near the end of the conductor pattern K15.

[0075] A conductor pattern K16 that forms part of the inductor L12 is formed on the insulating substrate N16. The conductor pattern K16 is formed so as to make approximately one full turn counterclockwise from the upper left side of the insulating substrate N16 in the figure. The starting end of the conductor pattern K16 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P20 that connects to the via conductors V14 and V15 is provided near the ending end of the conductor pattern K16.

[0076] A conductor pattern K17 that forms part of the inductor L12 is formed on the insulating substrate N17. The conductor pattern K17 is formed so as to make approximately one full turn counterclockwise from the top of the insulating substrate N17 in the drawing. A connection portion P21 that connects to the via conductors V15 and V16A is provided near the starting end of the conductor pattern K17. A connection portion P22 that connects to the via conductor V16B is provided near the ending end of the conductor pattern K17.

[0077] A conductor pattern K18 that forms part of the inductor L12 is formed on the insulating substrate N18. The conductor pattern K18 is formed so as to make approximately one full turn counterclockwise from the top of the insulating substrate N18 in the figure. A connection portion P23 that connects to the via conductor V16A is provided near the starting end of the conductor pattern K18. A connection portion P24 that connects to the via conductors V16B and V17 is provided near the ending end of the conductor pattern K18.

[0078] In this way, inductor L12, conductor patterns K15 and K16 are connected in parallel, conductor patterns K17 and K18 are connected in parallel, and further, conductor patterns K15, K16 and conductor patterns K17, K18 are connected in series to form a coil.

[0079] An electrode pattern K19 that constitutes one electrode of the capacitor C11 is formed on the insulating substrate N19. When the electrode pattern K19 is viewed from the second principal surface 12 side, the electrode pattern K19 is positioned so as to overlap with parts of the conductor patterns K17 and K18 in the stacking direction (Z direction). That is, the electrode pattern K19 is positioned so as to reduce the area that overlaps with the opening of the inductor L12 formed by the conductor patterns K17 and K18. The electrode pattern K19 is provided with a connection portion P25 that is connected to the via conductor V17. That is, the electrode pattern K19 is connected to the connection portion P24 of the conductor pattern K18 of the inductor L12 by the via conductor V17.

[0080] An electrode pattern K20 that constitutes the other electrode of the capacitor C11 is formed on the insulating substrate N20. When the electrode pattern K20 is viewed from the second main surface 12 side, the electrode pattern K20 is disposed at a position that overlaps with a portion of the conductor patterns K17 and K18 in the stacking direction (Z direction). That is, the electrode pattern K20 is disposed at a position that minimizes the area that overlaps with the opening of the inductor L11 formed by the conductor patterns K17 and K18. The electrode pattern K20 is provided with a connection portion P26 that is connected to the via conductor V18. The connection portion P26 of the electrode pattern K20 is connected to the connection portion P28 that is provided on the fourth electrode 32a by the via conductor V18. The electrode pattern K20 is electrically connected to the fifth electrode 32b and the sixth electrode 32c of the second external electrode 32.

[0081] In this way, even in a small chip component type filter device that forms a resonant circuit such as the electronic component 300 of embodiment 3, the first electrode 31a and the second electrode 31b may be electrically connected by an internal conductor SL1 provided within the insulator 10.

[0082] Specifically, in the electronic component 300, the internal conductor SL1 is formed on the same insulating substrate N20 as the electrode pattern K20 constituting the capacitor C11. The internal conductor SL1 is positioned so as to overlap a portion of the conductor pattern K18 in the stacking direction (Z direction), and extends in the same direction (X direction) as a portion of the conductor pattern K18 of the inductor L12. The current flowing through the internal conductor SL1 is parallel to and opposite to the current flowing through a portion of the conductor pattern K18 that is close to the internal conductor SL1, and the internal conductor SL1 and the conductor pattern K18 are magnetically coupled (depolarized coupled) to each other.

[0083] 12 is an equivalent circuit diagram of an electronic component according to a third embodiment. As shown in FIG. 12, electronic component 300 according to the third embodiment includes a first terminal T1, an ESL section S connected to first terminal T1, an inductor L12 connected to ESL section S, a capacitor C11 connected in series with inductor L12, and a second terminal T2 connected to capacitor C11. Electronic component 300 further includes inductor L11 connected in parallel with inductor L12 and capacitor C11. ESL section S includes parasitic inductances ESL1 and ESL2 connected in parallel. Note that first terminal T1 corresponds to a connection point of first external electrode 31 on the mounting substrate, and second terminal T2 corresponds to a connection point of second external electrode 32 on the mounting substrate.

[0084] The inductors L11 and L12 are magnetically coupled to each other, and the conductor pattern K18 of the inductor L12 is magnetically coupled to the internal conductor SL1.

[0085] As described above, in electronic component 300 according to the third embodiment, first electrode 31a and second electrode 31b are electrically connected by a first path that passes through the outer periphery of insulator 10, and are also electrically connected by a second path that passes through internal conductor SL1 within insulator 10. As a result, even in a small chip component-type filter device that forms a resonant circuit such as electronic component 300 according to the third embodiment, even if the electrical connection between first electrode 31a and second electrode 31b is severed along the first path that passes through the outer periphery of insulator 10, the electrical connection between first electrode 31a and second electrode 31b is maintained along the second path that passes through internal conductor SL1 within insulator 10, thereby suppressing changes in electrical characteristics due to disconnection of first external electrode 31.

[0086] (Fourth embodiment) 13 to 18, an electronic component 400 according to the fourth embodiment will be described. Note that, in electronic component 400 according to the fourth embodiment, only the configurations that are different from electronic component 100 according to the first embodiment, electronic component 200 according to the second embodiment, and electronic component 300 according to the third embodiment will be mainly described, and the same configurations as those in electronic component 100 according to the first embodiment, electronic component 200 according to the second embodiment, and electronic component 300 according to the third embodiment will be assigned the same reference numerals in electronic component 400 according to the fourth embodiment, and descriptions thereof will be omitted.

[0087] Fig. 13 is a perspective view of electronic component 400 according to embodiment 4. Note that the first external electrode 31 and the second external electrode 32 included in electronic component 400 according to embodiment 4 shown in Fig. 13 and the first external electrode 31 and the second external electrode 32 included in electronic component 100 according to embodiment 1 shown in Fig. 1 are arranged at symmetrical positions in the Y direction.

[0088] 13, the first external electrode 31 is provided closer to the fourth side surface 24 than the second external electrode 32 in the longitudinal direction (Y direction) of the insulator 10. The second external electrode 32 is provided closer to the third side surface 23 than the first external electrode 31 in the longitudinal direction (Y direction) of the insulator 10.

[0089] The first external electrode 31 has a first electrode 31a provided along the first main surface 11, a second electrode 31b provided along the first side surface 21, and a third electrode 31c provided along the second side surface 22. The second external electrode 32 has a fourth electrode 32a provided along the first main surface 11, a fifth electrode 32b provided along the first side surface 21, and a sixth electrode 32c provided along the second side surface 22.

[0090] Fig. 14 is a cross-sectional view showing the internal configuration of insulator 10 of electronic component 400 according to embodiment 4. Fig. 15 is an exploded plan view showing the configuration of electronic component 400 according to embodiment 4. As shown in Figs. 13 to 15, electronic component 400 is a small chip-type filter device in which inductor L22 and capacitor C21 are connected in series, and inductor L22 and capacitor C21 are connected in parallel with inductor L21.

[0091] Specifically, electronic component 400 includes, within insulator 10, inductor L21 configured by conductor patterns K41 to K43, inductor L22 configured by conductor patterns K44 and K45, and capacitor C21 configured by electrode patterns K46 and K47. Within insulator 10, inductor L22 and capacitor C21 are connected in series, and inductor L22 and capacitor C21 are connected in parallel with inductor L21, thereby forming a resonant circuit in electronic component 400. Note that, in electronic component 400 according to embodiment 4, conductor pattern K45 is an example of a "first conductor pattern" in the present disclosure. Also, in electronic component 400 according to embodiment 4, inductor L22 is an example of an "inductor" in the present disclosure, and inductor L21 is an example of an "other inductor" in the present disclosure.

[0092] The conductor patterns K41 to K43 of the inductor L21 are stacked in parallel to the first main surface 11 of the insulator 10 and are electrically connected by a plurality of via conductors. The conductor patterns K44 and K45 of the inductor L22 are stacked in parallel to the first main surface 11 of the insulator 10 and are electrically connected by a plurality of via conductors. The inductor L21 is arranged closer to the second main surface 12 than the inductor L22.

[0093] The conductor patterns K44 and K45 of the inductor L22 are stacked below the conductor patterns K41 to K43 of the inductor L21 in the Z direction with an insulating layer interposed between them. That is, the inductor L22 is arranged closer to the first main surface 11 than the inductor L21. The electrode patterns K46 and K47 of the capacitor C21 are stacked below the conductor patterns K44 and K45 of the inductor L22 in the Z direction with an insulating layer interposed between them. That is, the capacitor C21 is arranged closer to the first main surface 11 than the inductors L21 and L22.

[0094] Specifically, electronic component 400 includes insulating substrates N41 to N49 in this order from second main surface 12. Within insulator 10, conductor patterns and electrode patterns are formed on insulating substrates N41 to N49 by a printing method.

[0095] A conductor pattern K41 that forms part of the inductor L21 is formed on the insulating substrate N41. The conductor pattern K41 is formed clockwise from the upper left side of the insulating substrate N41 in the figure, circulating approximately three-quarters of the way around. The starting end of the conductor pattern K41 is electrically connected to the fifth electrode 32b of the second external electrode 32. A connection portion P41 that connects to the via conductor V41 is provided near the end of the conductor pattern K41.

[0096] A conductor pattern K42 that forms part of the inductor L21 is formed on the insulating substrate N42. The conductor pattern K42 is formed clockwise from the lower left side of the insulating substrate N42 in the figure, circulating approximately three-quarters of the way around. A connection portion P42 that connects to the via conductor V41 is provided near the starting end of the conductor pattern K42. A connection portion P43 that connects to the via conductor V42 is provided near the ending end of the conductor pattern K42.

[0097] A conductor pattern K43 that forms part of the inductor L21 is formed on the insulating substrate N43. The conductor pattern K43 is formed counterclockwise from the lower right side of the insulating substrate N43 in the figure, wrapping around approximately three-quarters of the way around. A connection portion P44 that connects to the via conductor V42 is provided near the starting end of the conductor pattern K43. The end of the conductor pattern K43 is electrically connected to the second electrode 31b of the second external electrode 32.

[0098] In this way, the inductor L21 configures a coil by connecting the conductor patterns K41, K42, and K43 in series.

[0099] A conductor pattern K44 that forms part of the inductor L22 is formed on the insulating substrate N44. The conductor pattern K44 is formed clockwise from the upper right side of the insulating substrate N44 in the figure, extending approximately three-quarters of the way around. The starting end of the conductor pattern K44 is electrically connected to the second electrode 31b of the first external electrode 31. A connection portion P45 that connects to the via conductor V43 is provided near the ending end of the conductor pattern K44.

[0100] A conductor pattern K45 that forms part of the inductor L22 is formed on the insulating substrate N45. The conductor pattern K45 is formed clockwise from the top of the insulating substrate N45 in the figure, circulating approximately three-quarters of the way around. The conductor pattern K45 includes a linear conductor pattern K45a between the second electrode 31b and the third electrode 31c. A connection portion P46 that connects to the via conductor V43 is provided near the starting end of the conductor pattern K45. A connection portion P47 that connects to the via conductor V44 is provided near the ending end of the conductor pattern K45.

[0101] In this way, the inductor L22 forms a coil by connecting the conductor pattern K44 and the conductor pattern K45 in series.

[0102] An electrode pattern K46 that constitutes one electrode of the capacitor C21 is formed on the insulating substrate N46. When the electrode pattern K46 is viewed from the second principal surface 12 side, the electrode pattern K46 is positioned so as to minimize the area that overlaps with the openings of the inductors L21 and L22 in the stacking direction (Z direction). This allows a compact filter device (electronic component 400) to be realized without interfering with the magnetic fields generated by the inductors L21 and L22. The electrode pattern K46 is provided with a connection portion P48 that connects to the via conductor V44. That is, the electrode pattern K46 is connected to the connection portion P47 of the conductor pattern K45 of the inductor L22 by the via conductor V44.

[0103] An electrode pattern K47 that constitutes the other electrode of the capacitor C21 is formed on the insulating substrate N47. When the electrode pattern K47 is viewed from the second main surface 12 side, the electrode pattern K47 is provided at a position that overlaps with the electrode pattern K46 in the stacking direction (Z direction). The electrode pattern K47 is provided with a connection portion P49 that connects to the via conductor V45. The electrode pattern K47 is electrically connected to the fifth electrode 32b and the sixth electrode 32c of the second external electrode 32 via a wiring pattern K48. Note that the wiring pattern K48 is not limited to being a single wire that overlaps the electrode pattern K47, and may be formed of multiple wiring patterns.

[0104] Furthermore, in the electronic component 400, an internal conductor SL41 is formed on the same insulating substrate N47 as the electrode pattern K47 constituting the capacitor C21. The internal conductor SL41 includes an internal conductor SL41a and an internal conductor SL41b. The internal conductors SL41a and SL41b are electrically connected by partially overlapping each other. The internal conductor SL41b is provided with a connection portion P50 that is connected to the via conductor V46.

[0105] The internal conductor SL41a includes a linear conductor portion that connects the second electrode 31b and the third electrode 31c. The linear conductor portion of the internal conductor SL41a is formed of a single layer of conductor that extends in the same direction (X direction) as the linear conductor pattern K45a of the inductor L22. When the conductor pattern K45 and the internal conductor SL41a are viewed from the second main surface 12, the linear conductor portion of the internal conductor SL41a is positioned so as to overlap with the linear conductor pattern K45a of the conductor pattern K45. The current flowing through the internal conductor SL41 is parallel to and opposite to the current flowing through the portion of the conductor pattern K45 that is close to the internal conductor SL41a (the linear conductor pattern K45a). Therefore, the internal conductor SL41 and the conductor pattern K45 (the linear conductor pattern K45a) are magnetically coupled (depolarized coupled) to each other.

[0106] A wiring pattern K50 is formed on the insulating substrate N48. When the wiring pattern K50 is viewed from the second main surface 12 side, the wiring pattern K50 is disposed at a position overlapping a part of the electrode pattern K47 in the stacking direction (Z direction). The wiring pattern K50 is provided with a connection portion P51 connected to a via conductor V45. That is, the wiring pattern K50 is connected to a connection portion P49 of the electrode pattern K47 of the capacitor C21 by the via conductor V45. The wiring pattern K50 also has a connection portion P53 connected to a via conductor V48.

[0107] Furthermore, a wiring pattern K51 is formed on the insulating substrate N48. When the wiring pattern K51 is viewed from the second main surface 12 side, the wiring pattern K51 is provided at a position overlapping with the internal conductor SL41b in the stacking direction (Z direction). The wiring pattern K51 is provided with a connection portion P52 connected to the via conductor V46 and the via conductor V47. That is, the wiring pattern K51 is connected to the connection portion P50 of the internal conductor SL41b by the via conductor V46.

[0108] A wiring pattern K52 is formed on the insulating substrate N49. When the wiring pattern K52 is viewed from the second main surface 12 side, the wiring pattern K52 is disposed at a position overlapping a portion of the wiring pattern K50 in the stacking direction (Z direction). The wiring pattern K52 is provided with a connection portion P54 connected to the via conductor V48 and the via conductor V50. That is, the wiring pattern K52 is connected to the connection portion P53 of the wiring pattern K50 by the via conductor V48. The wiring pattern K52 is connected to the connection portion P57 provided on the fourth electrode 32a by the via conductor V50.

[0109] Furthermore, a wiring pattern K53 is formed on the insulating substrate N49. When the wiring pattern K53 is viewed from the second main surface 12 side, the wiring pattern K53 is disposed at a position overlapping a part of the wiring pattern K51 in the stacking direction (Z direction). The wiring pattern K53 is provided with a connection portion P55 connected to the via conductor V47 and the via conductor V49. That is, the wiring pattern K53 is connected to the connection portion P52 of the wiring pattern K51 by the via conductor V47. The wiring pattern K53 is connected to the connection portion P56 provided on the first electrode 31a by the via conductor V49.

[0110] 16 is an equivalent circuit diagram of an electronic component 400 according to the fourth embodiment. As shown in FIG. 16, the electronic component 400 according to the fourth embodiment includes a first terminal T1, an ESL section S connected to the first terminal T1, an inductor L22 connected to the ESL section S, a capacitor C21 connected in series with the inductor L22, and a second terminal T2 connected to the capacitor C21. The electronic component 400 further includes an inductor L21 connected in parallel with the inductor L22 and the capacitor C21. The ESL section S includes parasitic inductances ESL1 and ESL2 connected in parallel. The first terminal T1 corresponds to a connection point of the first external electrode 31 on the mounting substrate, and the second terminal T2 corresponds to a connection point of the second external electrode 32 on the mounting substrate.

[0111] The inductors L21 and L22 are magnetically coupled to each other, and the conductor pattern K45 and the internal conductor SL41 of the inductor L22 are magnetically coupled to each other.

[0112] As described above, in electronic component 400 according to the fourth embodiment, first electrode 31a and second electrode 31b are electrically connected by a first path that passes through the outer periphery of insulator 10, and are also electrically connected by a second path that passes through internal conductor SL41 within insulator 10. As a result, even in a small chip component-type filter device that forms a resonant circuit such as electronic component 400 according to the fourth embodiment, even if the electrical connection between first electrode 31a and second electrode 31b is severed by the first path that passes through the outer periphery of insulator 10, the electrical connection between first electrode 31a and second electrode 31b is maintained by the second path that passes through internal conductor SL41 within insulator 10, thereby suppressing changes in electrical characteristics due to disconnection of first external electrode 31.

[0113] Furthermore, in electronic component 400 according to embodiment 4, similar to electronic component 300 according to embodiment 3, internal conductor SL41 is connected to first electrode 31a provided on first main surface 11 and to second electrode 31b provided on first side surface 21. However, unlike electronic component 300, internal conductor SL41 is also connected to third electrode 31c provided on second side surface 22. Furthermore, internal conductor SL41 extends in the same direction (X direction) as conductor pattern K45 of inductor L22 and is positioned so as to overlap with conductor pattern K45 when conductor pattern K45 and internal conductor SL41 are viewed in plan from the second main surface 12. As shown in FIG. 15 , inductor L11 or inductor L12 is connected to second electrode 31b, a current flows in internal conductor SL41 from first electrode 31a via wiring pattern K53 and wiring pattern K51 and then via connection portion P50 to second electrode 31b. That is, in the internal conductor SL41, the current from the first electrode 31a flows toward the second electrode 31b without flowing toward the third electrode 31c. As a result, the current flowing through the internal conductor SL41 is parallel to and opposite to the current flowing through the straight conductor pattern K45a of the conductor pattern K45, and the internal conductor SL41 and the conductor pattern K45 are magnetically coupled (depolarized coupled) with each other.

[0114] As a result, even if the linear conductor pattern K45a of the conductor pattern K45 is misaligned in the X direction between the second electrode 31b provided on the first side surface 21 and the third electrode 31c provided on the second side surface 22, the area of ​​the portion where the internal conductor SL41 and the conductor pattern K45 overlap in the stacking direction (Z direction) does not change.

[0115] For example, Fig. 17 is a diagram illustrating misalignment of the conductor patterns of an electronic component according to a comparative example. As shown in Fig. 17, when the internal conductor SL41 is not connected to the third electrode 31c, if the conductor pattern K45 is misaligned in the X direction from the state shown in Fig. 17(A) to the state shown in Fig. 17(B), the area of ​​the portion where the internal conductor SL41 and the linear conductor pattern K45a of the conductor pattern K45 overlap in the stacking direction (Z direction) becomes smaller.

[0116] In contrast, Fig. 18 is a diagram illustrating misalignment of the conductor pattern K45 of the electronic component 400 according to the fourth embodiment. As shown in Fig. 18, when the internal conductor SL41 is connected to the third electrode 31c, even if the conductor pattern K45 is misaligned in the X direction from the state shown in Fig. 18(A) to the state shown in Fig. 18(B), the area of ​​the portion where the internal conductor SL41 and the linear conductor pattern K45a of the conductor pattern K45 overlap in the stacking direction (Z direction) is unlikely to change. This allows the electronic component 400 to maintain the magnetic field coupling (depolarization coupling) between the internal conductor SL41 and the conductor pattern K45 unchanged, thereby reliably suppressing changes in electrical characteristics due to disconnection of the first external electrode 31.

[0117] Furthermore, in the electronic component 400 according to the fourth embodiment, the internal conductor SL41 is connected to the second electrode 31b provided on the first side surface 21 and also to the third electrode 31c provided on the second side surface 22, so that heat can be dissipated not only to the first side surface 21 but also to the second side surface 22, thereby improving heat dissipation.

[0118] <Aspect> (Item 1) An electronic component according to one embodiment includes an insulator, an inductor configured within the insulator and having a first conductor pattern, and an external electrode electrically connected to the first conductor pattern. The insulator has a first main surface, a second main surface opposite the first main surface, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first and second main surfaces. The first side surface faces the second side surface. The third side surface faces the fourth side surface. The external electrode has a first electrode portion provided along the first main surface and a second electrode portion provided along the first side surface. The electronic component includes an internal conductor provided within the insulator and electrically connecting the first electrode portion and the second electrode portion.

[0119] (Item 2) In the electronic component described in item 1, the second electrode portion is electrically connected to the first electrode portion.

[0120] (Item 3) In the electronic component according to item 1 or 2, the internal conductor is magnetically coupled to the first conductor pattern.

[0121] (Item 4) In the electronic component described in any one of Items 1 to 3, the internal conductor has a portion where the current flowing through the internal conductor is opposite to the current flowing through the portion of the first conductor pattern that is closest to the internal conductor.

[0122] (Item 5) In the electronic component according to item 4, the adjacent portion of the first conductor pattern is parallel to the internal conductor.

[0123] (Item 6) In the electronic component according to any one of items 1 to 5, the internal conductor overlaps the first conductive pattern when viewed from the second main surface side.

[0124] (Item 7) In the electronic component according to any one of items 1 to 6, the external electrode further includes a third electrode portion provided along the second side surface and electrically connected to the first electrode portion.

[0125] (Item 8) In the electronic component according to item 7, the internal conductor further electrically connects the first electrode portion and the third electrode portion.

[0126] (Item 9) In the electronic component according to item 8, the internal conductor is made of a single layer of conductor that connects the second electrode and the third electrode.

[0127] (10) In the electronic component according to the 8th or 9th aspect, the internal conductor includes a linear conductor portion that connects the second electrode portion and the third electrode portion.

[0128] (Item 11) In the electronic component according to Item 10, the first conductor pattern includes a linear conductor pattern between the second electrode portion and the third electrode portion, and the linear conductor portion of the internal conductor overlaps with the linear conductor pattern of the first conductor pattern when viewed from the second principal surface side.

[0129] (Item 12) In the electronic component according to any one of items 1 to 11, the first main surface is a surface to be placed on a mounting board.

[0130] (Item 13) The electronic component according to any one of items 1 to 12 further comprises a capacitor connected in series with the inductor within the insulator.

[0131] (14th Item) In the electronic component according to the 13th item, one of the electrode patterns constituting the capacitor is formed on the same plane as part of the internal conductor.

[0132] (15) The electronic component according to the 13th or 14th aspect further comprises another inductor connected in parallel to the inductor within the insulator.

[0133] (16) In the electronic component according to the 15th aspect, the other inductor is magnetically coupled to the inductor.

[0134] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0135] 10 insulator, 11 first main surface, 12 second main surface, 21 first side surface, 22 second side surface, 23 third side surface, 24 fourth side surface, 31 first external electrode, 32 second external electrode, 31a first electrode, 31b second electrode, 31c third electrode, 32a fourth electrode, 32b fifth electrode, 32c sixth electrode, 100, 200, 300, 400 electronic components, 310b, 310c, 320b, 320c end portions, SL1, SL2 internal conductors.

Claims

1. An insulator; an inductor configured within the insulator and having a first conductor pattern; an external electrode electrically connected to the first conductor pattern; the insulator has a first main surface, a second main surface opposite to the first main surface, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first main surface and the second main surface, the first side surface faces the second side surface, the third side surface faces the fourth side surface, The external electrode is a first electrode provided along the first major surface; a second electrode provided along the first side surface, an axis of a coil formed by the inductor is perpendicular to the first principal surface; an internal conductor provided within the insulator and electrically connecting the first electrode and the second electrode; the internal conductor is connected to the first electrode through a via conductor and is formed from a connection portion of the via conductor to the second electrode; The internal conductor overlaps the first conductor pattern when viewed from the second principal surface side.

2. The electronic component according to claim 1 , wherein the second electrode is electrically connected to the first electrode through the internal conductor and the via conductor.

3. 3. The electronic component according to claim 1, wherein the internal conductor is magnetically coupled to the first conductor pattern.

4. 3. The electronic component according to claim 1, wherein the internal conductor has a portion in which a current flowing through the internal conductor is opposite to a current flowing through a portion of the first conductor pattern that is closest to the internal conductor.

5. The electronic component according to claim 4 , wherein the adjacent portion of the first conductor pattern is parallel to the inner conductor.

6. 3. The electronic component according to claim 1, wherein the external electrode further includes a third electrode provided along the second side surface and electrically connected to the first electrode.

7. The electronic component according to claim 6 , wherein the internal conductor further electrically connects the first electrode and the third electrode.

8. 8. The electronic component according to claim 7, wherein the internal conductor is formed of a single layer of conductor connecting the second electrode and the third electrode.

9. 8. The electronic component according to claim 7, wherein the internal conductor includes a linear conductor portion connecting the second electrode and the third electrode.

10. the first conductor pattern includes a linear conductor pattern that is linear between the second electrode and the third electrode, The electronic component according to claim 9 , wherein the linear conductor portion of the internal conductor overlaps with the linear conductor pattern of the first conductor pattern when viewed from the second principal surface side.

11. The electronic component according to claim 1 , wherein the first main surface is a surface to be placed on a mounting board.

12. 3. The electronic component according to claim 1, further comprising a capacitor connected in series with the inductor within the insulator.

13. 13. The electronic component according to claim 12, wherein one of the electrode patterns constituting the capacitor is formed on the same plane as a part of the internal conductor.

14. The electronic component according to claim 12 , further comprising another inductor connected in parallel with the inductor within the insulator.

15. The electronic component according to claim 14 , wherein the other inductor is magnetically coupled to the inductor.

Images