Mode matching degree determination method, mode matching degree determination device, and mode matching degree determination program

Abstract

To provide a mode matching degree determination method capable of determining a degree of matching between modes with high precision under no influence of displacement of a structure.SOLUTION: A mode matching degree determination method includes processing to: acquire first mode data including data representing a physical quantity generated in an object 100 in a first mode; acquire second mode data including data corresponding to data included in the first mode data generated in the object 100 in a second mode different from the first mode; extract data from the first mode data; generate first array data which has the extracted data arrayed in predetermined order; extract data corresponding to data included in the first array data from the second mode data; generate second array data having the extracted data arrayed in order corresponding to the data included in the first array data; and then compare the first array data and second array data with each other to determine a degree of matching between the first mode and second mode.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mode matching degree determination method, a mode matching degree determination device, and a mode matching degree determination program. [Background technology]

[0002] A method for diagnosing changes such as deterioration or damage in a structure using Modal Assurance Criterion (MAC) values ​​is known (see, for example, Patent Document 1). The diagnostic device described in Patent Document 1 calculates the distribution of MAC values ​​related to reference-related information and comparison-related information, and diagnoses that there is a change in the structure when the difference between the calculated distributions is equal to or greater than a predetermined difference. The diagnostic device described in Patent Document 1 diagnoses whether a change has occurred in the structure based on the results of comparing the distribution of reference-related information with the distribution of comparison-related information, thereby improving the accuracy of diagnosing changes in the structure. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Re-tabled publication 2019 / 234832 Summary of the Invention [Problem to be solved by the invention]

[0004] The diagnostic device described in Patent Document 1 uses a displacement vector calculated from the physical quantities of the structure when calculating the MAC value, rather than physical quantities such as strain and stress occurring in the structure. The MAC value calculated from the displacement vector can determine the degree of agreement of the overall deformation state, but it is not easy to accurately detect local deformation of the structure and determine the degree of agreement of the structure's mode.

[0005] Therefore, an object of the present invention is to provide a mode coincidence determination method, a mode coincidence determination device, and a mode coincidence determination program that can accurately detect local deformation of a structure and determine the degree of mode coincidence with high accuracy. [Means for solving the problem]

[0006] The present invention, which solves the above-described problems, is summarized as a mode coincidence determination method, a mode coincidence determination device, and a mode coincidence determination program, which are described below. (1) acquiring first mode data including data indicating a physical quantity occurring in an object in a first mode; acquiring second mode data including data corresponding to data included in the first mode data generated on the object in a second mode different from the first mode; extracting a plurality of data from the first mode data, and generating first array data by arranging the extracted data in a predetermined order; extracting data corresponding to the data included in the first array data from the second mode data, and generating second array data by arranging the extracted data in an order corresponding to the data included in the first array data; comparing the first array data with the second array data to determine the degree of agreement between the first mode and the second mode; A mode matching determination method comprising: (2) performing a structural analysis process in a first mode of the object using the first model to generate first mode data; performing a structural analysis process in a second mode of the object using a second model different from the first model to generate second mode data; The mode matching determination method according to (1), further comprising the steps of: (3) The method further includes the steps of defining the first array data and the second array data as vectors, calculating the absolute value of the inner product of the first array data and the second array data, and calculating a degree of match index by normalizing the calculated absolute value by the magnitude of the first array data and the second array data, The mode matching degree determination method according to (1) or (2), wherein the process of determining the degree of matching includes a process of determining the degree of matching between the first mode and the second mode based on a matching degree index. (4) The mode coincidence determination method according to any one of (1) to (3), wherein the data indicating the physical quantity is data indicating at least one of strain and stress occurring in the object. (5) A mode consistency determination method according to (4), wherein each of the first array data and the second array data includes data indicating either a strain distribution of strain occurring in the object and strain components in a plurality of elements into which the object is divided, or a stress distribution of stress occurring in the object and stress components in a plurality of elements into which the object is divided. (6) A mode coincidence determination method according to (4) or (5), wherein each of the first array data and the second array data includes data indicating either a principal strain distribution of strains occurring in the object and the principal strain components and deflection angles in a plurality of elements into which the object is divided, or a principal stress distribution of stresses occurring in the object and the principal stress components and deflection angles in a plurality of elements into which the object is divided. (7) A mode coincidence determination method according to any one of (4) to (6), wherein each of the first array data and the second array data includes data indicating parameters calculated from at least one of the strain and stress occurring in the object, the principal strain of the strain occurring in the object, and the principal stress of the stress occurring in the object. (8) a first mode data acquisition unit that acquires first mode data including data indicating a physical quantity generated in the object in the first mode; a second mode data acquisition unit that acquires second mode data including data corresponding to data included in the first mode data that occurs on the object in a second mode different from the first mode; a first sequence data generating unit that extracts a plurality of data from the first mode data and generates first sequence data by arranging the extracted data in a predetermined order; a second sequence data generation unit that extracts data corresponding to the data included in the first sequence data from the second mode data and generates second sequence data by arranging the extracted data in an order corresponding to the data included in the first sequence data; a match determination unit that compares the first sequence data with the second sequence data to determine a match between the first mode and the second mode; A mode matching degree determination device comprising: (9) acquiring first mode data including data indicating a physical quantity occurring in the object in the first mode; acquiring second mode data including data corresponding to data included in the first mode data generated on the object in a second mode different from the first mode; extracting a plurality of data from the first mode data, and generating first array data by arranging the extracted data in a predetermined order; extracting data corresponding to the data included in the first array data from the second mode data, and generating second array data by arranging the extracted data in an order corresponding to the data included in the first array data; comparing the first array data with the second array data to determine the degree of agreement between the first mode and the second mode; A mode matching degree determination program that causes a computer to execute processing. [Effects of the Invention]

[0007] In one embodiment, the modal coincidence determination method can accurately detect local deformation of a structure and determine the modal coincidence with high accuracy. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a block diagram of a mode matching degree determination device according to a first embodiment. [Figure 2] 4 is a flowchart showing a mode coincidence determination process performed by the mode coincidence determination device shown in FIG. [Figure 3] FIG. 10 is a block diagram of a mode matching degree determination device according to a second embodiment. [Figure 4] 4 is a flowchart showing a mode coincidence determination process performed by the mode coincidence determination device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] The mode coincidence determination device according to the present invention will be described below with reference to the accompanying drawings, although the technical scope of the present invention is not limited to these embodiments.

[0010] (Configuration and Functions of the Mode Matching Degree Determination Device According to the First Embodiment) FIG. 1 is a block diagram of a mode matching degree determination device according to the first embodiment.

[0011] The mode coincidence determination device 1 includes a communication unit 11, a storage unit 12, an input unit 13, an output unit 14, and a processing unit 20. The communication unit 11, the storage unit 12, the input unit 13, the output unit 14, and the processing unit 20 are connected to one another via a bus 15.

[0012] The communication unit 11 has a wired communication interface circuit such as Ethernet (registered trademark), and communicates with an electric computer such as a server via a communication network such as the Internet or a local area network (LAN).

[0013] The storage unit 12 includes, for example, at least one of a semiconductor storage device, a magnetic tape device, a magnetic disk device, and an optical disk device. The storage unit 12 stores an operating system program, a driver program, an application program, data, and the like used for processing by the processing unit 20. For example, the storage unit 12 stores a mode agreement determination program and the like for causing the processing unit 20 to execute a mode agreement determination process for determining the agreement of deformation modes. The mode agreement determination program may be installed into the storage unit 12 from a computer-readable portable storage medium such as a CD-ROM or a DVD-ROM using a known setup program or the like.

[0014] The storage unit 12 stores numerical analysis data including at least data indicating the thickness, elastic modulus (e.g., Young's modulus), and size of each part of a vehicle body having multiple parts. The storage unit 12 also stores CAD model data and generation condition data used when generating the numerical analysis data, which is finite element model data. The storage unit 12 also stores material property data and vibration condition data used when calculating stiffness. The material property data is data indicating material properties such as Young's modulus, Poisson's ratio, density, thermal expansion coefficient, and yield stress, and the vibration condition data is data indicating multiple vibration frequencies applied to the structure.

[0015] The input unit 13 may be any device capable of inputting data, such as a touch panel or a keyboard. An operator using the mode coincidence determination device 1 can input letters, numbers, symbols, etc. using the input unit 13. When operated by the operator, the input unit 13 generates a signal corresponding to the operation. The generated signal is then supplied to the processing unit 20 as an instruction from the operator.

[0016] The output unit 14 may be any device capable of displaying video, images, etc., such as a liquid crystal display or an organic EL display. The output unit 14 displays video corresponding to video data supplied from the processing unit 20, images corresponding to image data, etc. The output unit 14 may also be an output device that prints video, images, text, etc. on a display medium such as paper.

[0017] The processing unit 20 has one or more processors and their peripheral circuits. The processing unit 20 is, for example, a CPU, and comprehensively controls the overall operation of the mode coincidence determination device 1. The processing unit 20 executes processing based on programs (driver programs, operating system programs, application programs, etc.) stored in the storage unit 12. The processing unit 20 can also execute multiple programs (application programs, etc.) in parallel.

[0018] The processing unit 20 includes a numerical analysis data generation unit 21, a vehicle body stiffness calculation unit 22, a target component stiffness calculation unit 23, a first deformation mode data acquisition unit 24, a second deformation mode data acquisition unit 25, a first array data generation unit 26, and a second array data generation unit 27. The processing unit 20 further includes a coincidence index calculation unit 28 and a coincidence determination unit 29. Each of these units is a functional module realized by a program executed by a processor included in the processing unit 20. Alternatively, each of these units may be implemented in the processing unit 20 as firmware.

[0019] (Mode coincidence determination process by the mode coincidence determination device according to the first embodiment) 2 is a flowchart showing a mode coincidence determination process performed by the mode coincidence determination device 1. The mode coincidence determination process shown in FIG. 2 is executed mainly by the processing unit 20 in cooperation with each element of the mode coincidence determination device 1, based on a control program stored in advance in the storage unit 12. The mode coincidence determination process described with reference to FIG. 2 is used for mode coincidence determination process in natural vibration analysis of a vehicle body, but the mode coincidence determination process according to the embodiment may also be used for natural vibration analysis other than natural vibration analysis of a vehicle body. Furthermore, the mode coincidence determination process according to the embodiment may also be used for analysis other than dynamic stiffness analysis, such as static stiffness analysis and springback analysis.

[0020] First, the numerical analysis data generation unit 21 generates numerical analysis data, which is finite element model data, based on the CAD model data and generation condition data stored in the storage unit 12 (S101), and stores the generated numerical analysis data in the storage unit 12. The numerical analysis data generation unit 21 generates the numerical analysis data by dividing the shapes of each of the multiple parts that form the vehicle body into multiple elements with specific shapes and sizes. The numerical analysis data generation unit 21 generates the numerical analysis data using an application program for generating finite element model data, such as HyperMesh by ALTAIR and ANSA by BETA CAE Systems. The numerical analysis data generation unit 21 may generate the numerical analysis data by dynamic stiffness analysis or static stiffness analysis.

[0021] Next, the vehicle body stiffness calculation unit 22 calculates vehicle body stiffness data, which is data indicating the overall stiffness of the vehicle body under predetermined boundary conditions, based on the numerical analysis data stored in the storage unit 12 (S102). The deformation mode of the parts in the process of S102, which collectively calculates the overall stiffness of the vehicle body, is also referred to as a first deformation mode. The vehicle body stiffness calculation unit 22 stores vehicle body stiffness information indicating the calculated vehicle body stiffness data in the storage unit 12. For example, the boundary conditions used when calculating the vehicle body stiffness data are conditions corresponding to the material property data and predetermined vibration frequencies included in the vibration condition data stored in the storage unit 12. The vehicle body stiffness calculation unit 22 generates the vehicle body stiffness information using an application program for finite element analysis, such as HyperForm manufactured by ALTAIR, Ansys LS-DYNA manufactured by JSOL Corporation, PAM-MEDYSA manufactured by ESI Japan, Inc., and Abaqus manufactured by CAE Solutions, Inc. The vehicle body stiffness data corresponding to the vehicle body stiffness information generated in the process of S102 includes first deformation mode data indicating strain of a target part, which is one of the parts that form the vehicle body. The first deformation mode data may include data indicating a strain distribution of strain occurring in the target part and strain components in each of a plurality of elements obtained by dividing the target part. The strain distribution of strain occurring in the target part indicates a distribution of absolute values ​​of strain occurring in the target part, and the strain components in each of a plurality of elements obtained by dividing the target part indicate components of a strain vector indicating strain occurring in the target part.

[0022] Next, the target part stiffness calculation unit 23 selects a vibration frequency to be used when calculating the stiffness of the target part, which is one of the parts that form the vehicle body (S103). The target part stiffness calculation unit 23 selects one of the vibration frequencies included in the vibration condition data.

[0023] Next, the target part stiffness calculation unit 23 calculates target part stiffness data, which is data indicating the stiffness of the target part under predetermined boundary conditions, based on the numerical analysis data stored in the storage unit 12 (S104). The part deformation mode in the process of S104, which calculates the stiffness of the target part alone, is also referred to as the second deformation mode. The target part stiffness calculation unit 23 stores target part stiffness information indicating the calculated target part stiffness data in the storage unit 12 in association with the vibration frequency selected in the process of S103. The target part stiffness data corresponding to the target part stiffness information generated in the process of S104 includes second deformation mode data indicating strain in the target part. The second deformation mode data may include data indicating the strain distribution of strain occurring in the target part and the strain components in each of the multiple elements into which the target part is divided.

[0024] Next, the target component stiffness calculation unit 23 determines whether all vibration frequencies included in the vibration condition data stored in the storage unit 12 have been selected and the target component stiffness data has been calculated (S105). The target component stiffness calculation unit 23 performs natural vibration analysis at intervals of 1 Hz within a predetermined frequency range, for example, 0 Hz to 100 Hz and 200 Hz to 300 Hz. When the target component stiffness calculation unit 23 has performed natural vibration analysis at intervals of 1 Hz throughout the entire predetermined frequency range, the target component stiffness calculation unit 23 determines that all vibration frequencies have been selected and the target component stiffness data has been calculated (YES in S105). Note that the frequency ranges of the vibration frequencies included in the vibration condition data stored in the storage unit 12 are not limited to 0 Hz to 100 Hz and 200 Hz to 300 Hz, and the frequency interval is not limited to 1 Hz. The target component stiffness calculation unit 23 repeats the processes of S103 to S105 until it determines that all vibration frequencies have been selected and the target component stiffness data has been calculated (YES in S105).

[0025] When it is determined that the target part stiffness calculation unit 23 has selected all vibration frequencies and calculated the target part stiffness data (S105-YES), the first deformation mode data acquisition unit 24 acquires the first deformation mode data generated in the process of S102 (S106). Next, the second deformation mode data acquisition unit 25 acquires the multiple second deformation mode data generated in the process of S104 and stored in the storage unit 12 in association with the vibration frequencies selected in the process of S103 (S107).

[0026] Next, the first array data generation unit 26 extracts multiple data from the first deformation mode data obtained in the processing of S106, generates first array data φ1 by arranging the extracted data in a predetermined order (S108), and stores the generated first array data φ1 in the memory unit 12.

[0027] The element number is indicated by n, and the strain of the multiple elements into which the target part is divided is (ε xxn ,ε yyn ,ε zzn ,ε xyn ,ε yzn ,ε zxn ), the first array data φ1 is, for example, (ε xx1 ,ε yy1 ,ε zz1 ,ε xy1 ,ε yz1 ,ε zx1 ,ε xx2 ,ε yy2 ,ε zz2 ,ε xy2 ,ε yz2 ,ε zx2 ,……).

[0028] Next, the second array data generation unit 27 extracts multiple pieces of data from the second deformation mode data acquired in the process of S107, and generates second array data φ2 by arranging the extracted data in a predetermined order (S109). The second array data generation unit 27 associates the generated second array data φ2 with the corresponding vibration frequencies and stores it in the storage unit 12. The second array data generation unit 27 extracts data corresponding to the data included in the first array data from the second deformation mode data acquired in the process of S107, and arranges the extracted data in an order corresponding to the data included in the first array data, thereby generating second array data φ2. The second array data generation unit 27 generates second array data φ2 from each of the multiple second deformation mode data acquired in the process of S107.

[0029] Next, the coincidence index calculation unit 28 calculates a coincidence index L from one of the first sequence data φ1 generated in the process of S108 and the second sequence data φ2 generated in the process of S109 (S110).

[0030]

number

[0031] The coincidence index calculation unit 28 stores the calculated coincidence index L in the storage unit 12 in association with the corresponding natural vibration frequency.

[0032] Next, the coincidence index calculation unit 28 determines whether or not the coincidence indexes for all the second sequence data have been calculated (S111). The coincidence index calculation unit 28 repeats the processes of S110 and S111 until it determines that the coincidence indexes for all the second sequence data have been calculated (S111-YES).

[0033] When the coincidence index calculation unit 28 determines that it has calculated the coincidence indexes for all of the second sequence data (S111—YES), the coincidence determination unit 29 determines the coincidence between the first sequence data φ1 and the second sequence data φ2 (S112) and determines the deformation mode. The coincidence determination unit 29 compares the first sequence data φ1 and the second sequence data φ2 based on the coincidence index calculated in the process of S110, determines the coincidence between the first deformation mode and the second deformation mode, and determines the deformation mode based on the coincidence determination result. The coincidence determination unit 29 determines the vibration frequency associated with the largest coincidence index L among the coincidence indexes L calculated in the process of S110 as the deformation mode.

[0034] (Operational Effects of the Mode Matching Degree Determination Device According to the First Embodiment) The mode correspondence determination device 1 determines the mode correspondence based on the stress generated in the elements that form the target part, and therefore can accurately detect local deformations of the vehicle body, which is a structural body, and determine the mode correspondence with high accuracy for each of the parts that form the vehicle body.

[0035] (Configuration and Functions of the Mode Matching Degree Determination Device According to the Second Embodiment) FIG. 3 is a block diagram of a mode matching degree determination device according to the second embodiment.

[0036] The mode conformance determination device 2 differs from the mode conformance determination device 1 in that it has a processing unit 40 instead of processing unit 20. The mode conformance determination device 2 also differs from the mode conformance determination device 1 in that it has a conformance determination unit 41. The configurations and functions of the components of the mode conformance determination device 2 other than processing unit 40 and determination model 50 are the same as the configurations and functions of the components of the mode conformance determination device 1 that are assigned the same reference numerals, and therefore detailed description thereof will be omitted here.

[0037] The processing unit 40 differs from the processing unit 20 in that it has a coincidence determination unit 41 instead of the coincidence index calculation unit 28 and the coincidence determination unit 29. The configuration and functions of the processing unit 40 other than the coincidence determination unit 41 are the same as those of the processing unit 20, and therefore will not be described in detail here.

[0038] The judgment model 50 is a convolutional neural network such as AlexNet, ZFNet, SENet, ResNet, or GoogleNet, and learns the similarity between a pair of sequence data through supervised learning. The judgment model 50 uses well-known machine learning techniques such as deep learning to learn the relationship between the similarity between a pair of sequence data and a label. Deep learning is machine learning using a multilayer neural network consisting of an input layer, a middle layer, and an output layer. Each node in the input layer receives a feature vector of the sequence data. Each node in the middle layer outputs the sum of values ​​obtained by multiplying each feature vector output from each node in the input layer by a weight. The output layer also outputs the sum of values ​​obtained by multiplying each feature vector output from each node in the middle layer by a weight. The judgment model 50 adjusts each weight while learning to minimize the difference between the output value from the output layer and the label corresponding to the similarity between the pair of sequence data. The judgment model 50 outputs similarity information indicating the similarity between the input pair of sequence data. The similarity information output from the judgment model 50 is, for example, a number from 1 to 10.

[0039] (Mode coincidence determination process by the mode coincidence determination device according to the second embodiment) FIG. 4 is a flowchart showing a mode coincidence determination process performed by the mode coincidence determination device 2. The mode coincidence determination process shown in FIG. 4 is executed mainly by the processing unit 40 in cooperation with each element of the mode coincidence determination device 2, based on a control program previously stored in the storage unit 12. The mode coincidence determination process described with reference to FIG. 4 is a mode coincidence determination process for a natural vibration analysis of a vehicle body, but the mode coincidence determination process according to the embodiment may be used for natural vibration analyses other than natural vibration analysis of a vehicle body. The mode coincidence determination process described with reference to FIG. 4 may also be used for natural vibration analyses such as analysis in noise reduction technology and countermeasures against springback. The processes of S201 to S209 are similar to the processes of S101 to S109, and therefore will not be described in detail here.

[0040] When the process of S209 is completed, the coincidence determination unit 41 acquires the coincidence between the first sequence data φ1 and the second sequence data φ2 (S210). The coincidence determination unit 41 inputs the first sequence data φ1 and one of the second sequence data φ2 as a pair of sequence data to the determination model 50, and acquires the similarity information output from the determination model 50 as a coincidence index between the first sequence data φ1 and the second sequence data φ2. The coincidence determination unit 41 stores the acquired coincidence index in the storage unit 12 in association with the corresponding vibration frequency.

[0041] Next, the match determination unit 41 determines whether or not the match indexes for all the second sequence data have been acquired (S211). The match determination unit 41 repeats the processes of S210 and S211 until it determines that the match indexes for all the second sequence data have been acquired (S211-YES).

[0042] When the matching determination unit 41 determines that matching indices for all second sequence data have been acquired (S211—YES), it determines the degree of matching between the first sequence data φ1 and the second sequence data φ2 (S212) and determines the deformation mode. The matching determination unit 41 compares the first sequence data φ1 and the second sequence data φ2 based on the matching indices acquired in the process of S210, determines the degree of matching between the first deformation mode and the second deformation mode, and determines the deformation mode based on the result of the matching determination. The matching determination unit 41 determines, as the deformation mode, vibration by the vibration frequency associated with the largest matching index among the matching indices acquired in the process of S210.

[0043] (Modification of the mode matching degree determination device according to the embodiment) In the mode consistency determination devices 1 and 2, the first array data φ1 and the second array data φ2 used in calculating the consistency index L are generated by arranging data indicating strain occurring in the target part. However, in the mode consistency determination device according to the embodiment, the first array data φ1 and the second array data φ2 may be generated by arranging data indicating stress occurring in the target part instead of strain occurring in the target part. The first array data φ1 and the second array data φ2 may include data indicating the stress distribution of stress occurring in the target part and the stress components in each of the multiple elements obtained by dividing the target part. Furthermore, in the mode consistency determination device according to the embodiment, the first array data φ1 and the second array data φ2 may include data indicating both strain and stress occurring in the target part. For example, each of the first array data and the second array data may include data indicating the strain distribution, the stress distribution, and either the strain component or the stress component of each element.

[0044] In addition, in the mode coincidence determination device according to the embodiment, each of the first array data and the second array data may include data indicating principal strains and principal stresses instead of data indicating strains and stresses. For example, each of the first array data and the second array data may include any of data indicating principal strain distributions and principal stress distributions of strains occurring in the target part, and data indicating principal strain components, principal stress components, and deflection angles of each of multiple elements obtained by dividing the target part. Furthermore, each of the first array data and the second array data may include data indicating any of strains, stresses, principal strains, and principal stresses. Because principal strains and principal stresses are not affected by the rigid body displacement of the vehicle body, they can accurately determine the degree of mode coincidence, unlike MAC values ​​that use displacement vectors that depend on coordinates, even when the vehicle body is significantly displaced.

[0045] In addition, in the mode coincidence determination device according to the embodiment, each of the first array data and the second array data may include data indicating a parameter calculated from at least one of the strain and stress and the principal strain and the principal stress, instead of data indicating the strain and the stress. For example, each of the first array data and the second array data may include data indicating any of the strain energy, the equivalent strain, and the equivalent stress. Furthermore, each of the first array data and the second array data may include data indicating any of the strain, the stress, the principal strain, and the principal stress, and the parameters calculated from the strain, the stress, the principal strain, and the principal stress.

[0046] Furthermore, in the mode coincidence determination device according to the embodiment, each of the first array data and the second array data may include data other than data indicating strain, stress, principal strain, and principal stress, as well as parameters calculated from the strain, stress, principal strain, and principal stress. For example, each of the first array data and the second array data may include state quantities including the temperature, pressure, volume, internal energy, and entropy inside the target component, as well as physical quantities including the electric field distribution inside the target component. The physical quantities included in the first array data and the second array data are physical quantities that can be defined by relative coordinates with the origin being any point inside the target component or multiple elements obtained by dividing the target component, and do not depend on absolute coordinates in the space in which the target component is located.

[0047] Furthermore, in the mode consistency determination device according to the embodiment, the target part is structurally analyzed using the finite element method, but in the mode consistency determination device according to the embodiment, the target part may be analyzed using numerical analysis other than the finite element method, such as the finite difference method and the finite volume method.

[0048] In addition, the mode consistency determination devices 1 and 2 calculate the first deformation mode data and the second deformation mode data using the finite element method, but at least one of the first deformation mode data and the second deformation mode data may be actually measured using a strain measuring device such as a strain gauge.

[0049] Furthermore, while the mode matching determination devices 1 and 2 determine the degree of matching of the deformation modes of the parts of the vehicle body, the mode matching determination device according to the embodiment may also determine the degree of matching of the deformation modes of a structure or an object that forms a structure.

[0050] Furthermore, although the mode matching determination devices 1 and 2 determine the degree of matching of the deformation modes of the components, the mode matching determination device according to the embodiment may also determine the matching of vibration modes other than the deformation modes, such as the thermal vibration mode of atoms in molecules and the vibration mode of electromagnetic waves propagating through a waveguide.

[0051] Furthermore, although the mode coincidence determination devices 1 and 2 generate mode data by performing natural vibration analysis on the vehicle body, the mode coincidence determination device according to the embodiment may also calculate mode data by performing dynamic stiffness analysis other than natural vibration analysis on a structure other than the vehicle body. For example, the mode coincidence determination device according to the embodiment may calculate mode data by performing vibration response analysis. [Explanation of symbols]

[0052] 1, 2 mode coincidence judgement device 20, 40 Processing section 21 Numerical analysis data generation section 22 Body rigidity calculation unit 23 Target part stiffness calculation unit 24 First deformation mode data acquisition unit 25 Second deformation mode data acquisition section 26 First array data generation unit 27 Second array data generation unit 28 Matching index calculation unit 29, 41 Matching degree determination section 30 Stiffness control processing section

Claims

1. A computer comprising: acquiring first mode data including a plurality of data representing physical quantities occurring in the object in a first mode; acquiring second mode data including a plurality of data indicating the physical quantity occurring in the object in a second mode different from the first mode; extracting two or more pieces of data from the plurality of pieces of data of the first mode data, and generating first array data by arranging the extracted two or more pieces of data in a predetermined order; extracting two or more pieces of data corresponding to the data included in the first array data from the plurality of pieces of data in the second mode data, and generating second array data by arranging the two or more pieces of extracted data in an order corresponding to the order in which the two or more pieces of data are arranged in the first array data; comparing the first array data with the second array data to determine the degree of agreement between the first mode and the second mode; performing a process including The computer performing a numerical analysis process on the object in a first mode using a first model to generate the first mode data; performing a numerical solution analysis process in a second mode of the object using a second model different from the first model to generate the second mode data; The mode matching degree determination method further comprises the steps of:

2. A mode consistency determination method as described in claim 1, wherein the data indicating the physical quantity is data indicating at least one of strain and stress occurring in the object.

3. A computer comprising: acquiring first mode data including a plurality of data representing physical quantities occurring in the object in a first mode; acquiring second mode data including a plurality of data indicating the physical quantity occurring in the object in a second mode different from the first mode; extracting two or more pieces of data from the plurality of pieces of data of the first mode data, and generating first array data by arranging the extracted two or more pieces of data in a predetermined order; extracting two or more pieces of data corresponding to the data included in the first array data from the plurality of pieces of data in the second mode data, and generating second array data by arranging the two or more pieces of extracted data in an order corresponding to the order in which the two or more pieces of data are arranged in the first array data; comparing the first array data with the second array data to determine a degree of agreement between the first mode and the second mode; A mode coincidence determination method, wherein the data indicating the physical quantity is data indicating at least one of a strain and a stress occurring in the object.

4. 4. The mode coincidence determination method according to claim 2, wherein each of the first array data and the second array data includes data indicating either a strain distribution of strain generated in the object and strain components in a plurality of elements obtained by dividing the object, or a stress distribution of stress generated in the object and stress components in a plurality of elements obtained by dividing the object.

5. 5. The mode coincidence determination method according to claim 2, wherein each of the first array data and the second array data includes data indicating either a principal strain distribution of strain generated in the object, and principal strain components and deflection angles in a plurality of elements obtained by dividing the object, or a principal stress distribution of stress generated in the object, and principal stress components and deflection angles in a plurality of elements obtained by dividing the object.

6. 6. The mode coincidence determination method according to claim 2, wherein each of the first array data and the second array data includes data indicating parameters calculated from at least one of strain and stress generated in the object, and principal strain of the strain generated in the object and principal stress of the stress generated in the object.

7. The method further includes the steps of: defining the first array data and the second array data as vectors; calculating the absolute value of the inner product of the first array data and the second array data; and calculating a degree of match index by normalizing the calculated absolute value by the magnitude of the first array data and the second array data; 7. The mode matching degree determination method according to claim 1, wherein the process of determining the degree of matching includes a process of determining the degree of matching between the first mode and the second mode based on the degree of matching index.

8. a first mode data acquisition unit that acquires first mode data including a plurality of data indicating physical quantities generated in the object in the first mode; a second mode data acquiring unit that acquires second mode data including a plurality of data indicating the physical quantity generated in the object in a second mode different from the first mode; a first sequence data generating unit that extracts two or more pieces of data from the plurality of pieces of data of the first mode data and generates first sequence data by arranging the extracted two or more pieces of data in a predetermined order; a second array data generation unit that extracts two or more pieces of data corresponding to the pieces of data included in the first array data from the plurality of pieces of data in the second mode data, and generates second array data by arranging the two or more pieces of extracted data in an order corresponding to the pieces of data included in the first array data; a coincidence determination unit that compares the first array data with the second array data to determine a coincidence between the first mode and the second mode; and 10. A mode coincidence determination device, wherein the data indicating the physical quantity is data indicating at least one of a strain and a stress occurring in the object.

9. acquiring first mode data including a plurality of data representing physical quantities occurring in the object in a first mode; acquiring second mode data including a plurality of data representing physical quantities occurring in the object in a second mode different from the first mode; extracting two or more pieces of data from the plurality of pieces of data of the first mode data, and generating first array data by arranging the extracted two or more pieces of data in a predetermined order; extracting two or more pieces of data corresponding to the data included in the first array data from the plurality of pieces of data in the second mode data, and generating second array data in which the extracted two or more pieces of data are arranged in an order corresponding to the order in which the two or more pieces of data are arranged in the first array data; comparing the first array data with the second array data to determine the degree of agreement between the first mode and the second mode; Have the computer execute the process, 10. A program for determining a degree of mode agreement, wherein the data indicating the physical quantity is data indicating at least one of a strain and a stress occurring in the object.

Images