Measuring jig

Abstract

To provide a measuring jig capable of measuring a high-frequency impedance in a thickness direction of a film-like member.SOLUTION: A measuring jig 10 used for measuring a high-frequency impedance in a thickness direction of a film-like member includes: a measuring substrate 11 connected to a ground conductor 11d and including an earthing conductor 11c on which a measurement object DUT as an object of measuring the impedance is earthed and a transmission line 11b through which an electric signal is transmitted; a laminating conductor 12 laminated on the measurement object DUT earthed on the earthing conductor 11c; and a connection line 13 for connecting the transmission line 11b and the laminating conductor 12.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a measuring jig used to measure high frequency impedance in the thickness direction of a film-like member. [Background technology]

[0002] A known conventional jig for measuring high-frequency impedance in the GHz band is one in which a gap is created by removing a portion of the conductor from one of a pair of lines mounted on a substrate, and the device under test, the impedance of which is to be measured, is placed across the gap, and the high-frequency impedance is measured based on the mode conversion characteristics of the signal obtained by a network analyzer (see, for example, Patent Document 1).

[0003] Incidentally, when attaching electronic components such as semiconductor chips to a printed circuit board or stacking semiconductor chips, a film-like adhesive is used to form a uniform adhesive layer, thereby improving the quality of the printed circuit board and electronic components and reducing their thickness.

[0004] Furthermore, printed circuit boards use conductive film adhesives to bond electronic components, stabilizing the ground and making them less susceptible to noise. For this reason, the film adhesives used in printed circuit boards are required to have low impedance in the thickness direction. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-151211 Summary of the Invention [Problem to be solved by the invention]

[0006] However, while conventional measuring jigs can measure high-frequency impedance in the direction from one end to the other of a component placed along a line, they cannot measure high-frequency impedance in the thickness direction of a film-like component. For this reason, there is a demand in the development and manufacturing of film-like adhesives for devices and methods that enable measurement of high-frequency impedance in the thickness direction of a film-like component.

[0007] An object of the present invention is to provide a measuring jig capable of measuring high frequency impedance in the thickness direction of a film-like member. [Means for solving the problem]

[0008] The measuring jig of the present invention is a measuring jig used to measure high-frequency impedance in the thickness direction of a film-like member, and includes a measuring board having a grounding conductor connected to a ground conductor to ground an object under test whose impedance is to be measured, and a transmission line through which an electrical signal is transmitted, a lamination conductor laminated on the object under test which is grounded to the ground conductor, and a connecting line connecting the transmission line and the lamination conductor.

[0009] In addition, in the measuring jig of the present invention, the ground conductor is arranged on the surface of the measuring board opposite to the surface on which the ground conductor is arranged, and the measuring board has a via that connects the ground conductor and the ground conductor.

[0010] In the measuring jig according to the present invention, the connection line is formed in a strip shape.

[0011] In the measuring jig according to the present invention, the end of the connection line on the lamination conductor side is connected to the center of the lamination conductor.

[0012] In the measuring jig according to the present invention, the lamination conductor is formed to be larger than the size of the object to be measured. [Effects of the Invention]

[0013] According to the present invention, by placing a film-shaped object to be measured between a grounding conductor and a stacking conductor, it is possible to measure the impedance in the thickness direction of the film-shaped object to be measured. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view of a measuring jig according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a side cross-sectional view of the measuring jig according to the first embodiment of the present invention. [Figure 3] FIG. 3 is a schematic diagram illustrating a method for eliminating the influence of connectors and lines of a test board according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram illustrating the elimination of the influence of the measurement jig using measurement data of the open measurement board and the short measurement board according to the first embodiment of the present invention. [Figure 5] FIG. 5 is a side cross-sectional view of the open measurement board according to the first embodiment of the present invention. [Figure 6] FIG. 6 is a side cross-sectional view of the short circuit measuring board according to the first embodiment of the present invention. [Figure 7] FIG. 7 is a perspective view of a measuring jig according to a second embodiment of the present invention. [Figure 8] FIG. 8 is a perspective view of a measuring jig according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] First Embodiment Figures 1 to 6 show a first embodiment of the present invention. Figure 1 is a perspective view of a measurement jig, Figure 2 is a side cross-sectional view of the measurement jig, Figure 3 is a schematic diagram explaining a method for eliminating the influence of connectors and lines on a test board, Figure 4 is a diagram explaining elimination of the influence of the measurement jig using measurement data from a short measurement board and an open measurement board, Figure 5 is a side cross-sectional view of the open measurement board, and Figure 6 is a side cross-sectional view of the short measurement board.

[0016] The measuring jig 10 of this embodiment is used to measure the high-frequency impedance in the thickness direction of a film-like member as a DUT, such as a conductive film-like adhesive for connecting a printed circuit board and a semiconductor chip.

[0017] Here, the DUT is a material used in circuits for transmitting electrical signals used in high-speed communications, for example, at frequencies of 1 GHz or higher, and is a rectangular film-like member having, for example, a thickness of 15 μm or more and an impedance of 1 Ω or less in the thickness direction.

[0018] As shown in Figures 1 and 2, the measurement jig 10 includes a measurement board 11 on whose upper surface the DUT is placed, a stacking conductor 12 that is stacked on the upper surface of the DUT placed on the upper surface of the measurement board 11, and a connection line 13 that connects a line, described later, arranged on the upper surface of the measurement board 11 to the stacking conductor 12.

[0019] As shown in FIG. 2, the measurement board 11 has a base material 11a, a transmission line 11b arranged on the upper surface of the base material 11a and through which an electrical signal is transmitted, a grounding conductor 11c arranged on the upper surface of the base material 11a and through which the device under test (DUT) is grounded, a grounding conductor 11d provided on the lower surface of the base material 11a, and a plurality of vias 11e connecting the grounding conductor 11c and the grounding conductor 11d.

[0020] The base material 11a is, for example, a rectangular plate-like member formed by solidifying a cloth made of glass fiber with resin.

[0021] The transmission line 11b is made of copper foil or the like and extends linearly on the upper surface of the base material 11a. As shown in Fig. 3, connectors 11b1 are connected to both ends of the transmission line 11b to connect ports of a network analyzer serving as a measuring device.

[0022] The ground conductor 11c is made of copper foil or the like formed in a rectangular shape and is disposed on the upper surface of the base material 11a at a distance from the transmission line 11b. The ground conductor 11c is rectangular with each side larger than the side of the device under test (DUT). The size of each side of the ground conductor 11c may be the same as the size of each side of the device under test (M).

[0023] The ground conductor 11d is made of copper foil or the like and is disposed over the entire lower surface of the base material 11a.

[0024] The plurality of vias 11e each penetrate the substrate 11a in the thickness direction, and connect the ground conductor 11c and the ground conductor 11d.

[0025] The lamination conductor 12 is made of a rectangular copper foil or the like, and the size of each side of the lamination conductor 12 is approximately the same as the size of each side of the DUT.

[0026] The connection line 13 is made of, for example, a rod-shaped member made of copper, one end of which is connected to the middle part of the transmission line 11b by wire bonding, and the other end of which is connected to the lamination conductor 12 by wire bonding.

[0027] In the measurement jig 10 configured as described above, the device under test (DUT) is placed between the grounding conductor 11c of the measurement board 11 and the laminated conductor 12, and port 1 and port 2 of the network analyzer are connected to the connectors 11b1 on both ends of the transmission line 11b of the measurement board 11, respectively, to form a circuit for measuring impedance using the shunt-through method.

[0028] In the shunt-through method, the characteristics of the circuit (such as S parameters) are measured by outputting an electrical signal for measurement from the signal source of the network analyzer, and the impedance is calculated based on the measured circuit characteristics.

[0029] At this time, the calculated impedance includes the influence of the impedance of the transmission line 11b and the connector 11b1. Therefore, as shown in FIG. 3, the impedance Z is calculated by canceling the circuit characteristics of the transmission line 11b and the connector 11b1 in advance, and removing the influence of the transmission line 11b and the connector 11b1 of the measuring jig 10. meas Get.

[0030] Also, the obtained impedance Z meas includes the effects of the ground conductor 11c, via 11e, lamination conductor 12, and connection line 13. Therefore, the accurate impedance Z of the DUT is DUT To obtain the above, the influences of the ground conductor 11c, the via 11e, the lamination conductor 12, and the connection line 13 are removed using the following method.

[0031] First, as shown in FIG. 5, an impedance Z оpen 6, the impedance Z is measured by the shunt-through method using a short circuit measurement board 10b on which a good conductor C with high electrical conductivity and low electrical resistance is arranged instead of the DUT. shоrt Here, the impedance Z of the open test jig 10a is measured. оpen Based on this, the admittance Y of the open measurement jig 10a is оpen Get (Y оpen =1 / Z оpen ).

[0032] Next, we add the impedance Z meas、 Impedance Z shоrt and admittance Yоpen By substituting the above, the impedance Z of the DUT is DUT Calculate.

[0033] Thus, the measuring jig 10 of this embodiment is a measuring jig 10 used to measure high-frequency impedance in the thickness direction of a film-like member, and includes a measuring board 11 having a grounding conductor 11c connected to a grounding conductor 11d and through which the DUT, the impedance of which is to be measured, is grounded, and a transmission line 11b through which an electrical signal is transmitted, a lamination conductor 12 laminated on the DUT, which is grounded to the grounding conductor 11c, and a connection line 13 connecting the transmission line 11b and the lamination conductor 12.

[0034] As a result, by disposing a film-shaped DUT between the grounding conductor 11c and the lamination conductor 12, the impedance Z DUT It is possible to measure

[0035] Furthermore, it is preferable that the ground conductor 11d is arranged on the surface of the measurement board 11 opposite to the surface on which the ground conductor 11c is arranged, and that the measurement board 11 has a via 11e that connects the ground conductor 11c and the ground conductor 11d.

[0036] As a result, by arranging the ground conductor 11c and the ground conductor 11d on one measurement board 11, it is possible to achieve miniaturization.

[0037] Second Embodiment 7 is a perspective view of a measuring jig showing a second embodiment of the present invention, in which the same components as those in the previous embodiment are denoted by the same reference numerals.

[0038] The connection line 13a of the measuring jig 10 of this embodiment is formed in the shape of a strip having a predetermined width and made of a conductor such as copper foil, and the end of the connection line 13a on the lamination conductor 12 side is connected to the center of the top surface of the lamination conductor 12.

[0039] In the measuring jig 10 configured as above, as in the first embodiment, the impedance Z DUT It is possible to obtain

[0040] As described above, according to the measuring jig 10 of this embodiment, similarly to the first embodiment, by placing the film-shaped DUT between the grounding conductor 11c and the lamination conductor 12, the impedance Z DUT It is possible to measure

[0041] Moreover, the connection line 13a is preferably formed in a strip shape.

[0042] This makes it possible to reduce the impedance in the connection line 13a, and the impedance Z DUT It is possible to accurately measure the above.

[0043] Moreover, it is preferable that the end of the connection line 13 a on the lamination conductor 12 side is connected to the center of the lamination conductor 12 .

[0044] This allows the electrical signal for measurement to be transmitted uniformly from the entire surface of the lamination conductor 12 to the DUT, so that the impedance Z DUT This makes it possible to measure more accurately.

[0045] Third Embodiment 8 is a perspective view of a measuring jig showing a third embodiment of the present invention, in which the same components as those in the previous embodiment are denoted by the same reference numerals.

[0046] The lamination conductor 12a of the measuring jig 10 of this embodiment is formed so that each side is larger than each side of the device under test DUT.

[0047] In the measuring jig 10 configured as above, as in the first embodiment, the impedance Z DUT It is possible to obtain

[0048] As described above, according to the measuring jig 10 of this embodiment, similarly to the first embodiment, by placing the film-shaped DUT between the grounding conductor 11c and the lamination conductor 12, the impedance Z DUT It is possible to measure

[0049] Furthermore, it is preferable that the lamination conductor 12 is formed to be larger than the device under test (DUT).

[0050] This allows the electrical signal for measurement to be transmitted reliably through the entire surface of the DUT, reducing the impedance Z DUT This makes it possible to measure more accurately.

[0051] In the above embodiment, a conductive film-like adhesive is shown as the DUT, but this is not limited to this. If it is required to measure impedance in the thickness direction, the DUT may be, for example, a conductive plate-like member with a thickness of 1 mm or more. [Explanation of symbols]

[0052] 10 Measuring jig 11 Measurement board 11b Transmission Line 11c Grounding conductor 11d Ground conductor 11e via 12, 12a Laminated conductor 13,13a connecting line DUT DUT

Claims

1. A measuring jig used to measure high-frequency impedance in the thickness direction of a film-like member, a measurement board having a grounding conductor connected to the grounding conductor, for grounding a device under test whose impedance is to be measured, and a transmission line through which an electrical signal is transmitted; a lamination conductor to be laminated on the device under test that is grounded to the ground conductor; a connection line that connects the transmission line and the lamination conductor; Measuring fixture.

2. the ground conductor is disposed on a surface of the measurement board opposite to a surface on which the ground conductor is disposed, The measurement board has a via that electrically connects the ground conductor and the ground conductor. The measuring jig according to claim 1 .

3. The connection line is formed in a strip shape. The measuring jig according to claim 1 or 2.

4. The end of the connection line on the lamination conductor side is connected to the center of the lamination conductor. The measuring jig according to claim 1 or 2.

5. The lamination conductor is formed to be larger than the size of the device under test. The measuring jig according to claim 1 or 2.

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