Detecting the temperature of system components

Abstract

A method for detecting the temperature of a component of a support system for semiconductor processing equipment is provided, the method including the steps of: attaching a radio frequency identification tag having a serial number to the component; reading the radio frequency identification tag with a reader, the reader configured to read the serial number of the radio frequency identification tag and identify a resonant frequency of the radio frequency identification tag; and converting the resonant frequency of the radio frequency identification tag into a temperature of the radio frequency identification tag.

Description

[Technical Field]

[0001] The present invention relates to a method for detecting the temperature of a component of a support system of a process pipe of a semiconductor processing equipment, a reading device for detecting the temperature of a component of a support system of a semiconductor processing equipment, a radio frequency identification tag for detecting the temperature of a component of a support system of a semiconductor processing equipment, one or more programs, and a machine-readable storage medium. [Background technology]

[0002] Piping to or from semiconductor equipment for various processes and applications can experience deposit buildup that adversely affects the operation of the pipe. Such semiconductor equipment can include semiconductor manufacturing equipment. Deposits can build up as a result of condensation at cold spots. Monitoring temperature at multiple points along the pipe can help identify cold spots, i.e., when the temperature of the fluid in the pipe is below an optimal level to minimize condensation or deposit formation.

[0003] Additionally, when heating a pipe, for example, to prevent condensation from forming inside the pipe, it is important to ensure that the pipe does not get too hot and exceed the safe operating temperature of the pipe contents, pipe material, heating components, and any insulating materials. Monitoring the temperature at multiple points along the pipe can help identify hot spots, which may be caused by a faulty heater or an exothermic reaction in the pipe. Such hot spots can cause equipment failure. Identifying hot spots can be used to take remedial action, such as shutting down the heater, shutting down the process, or activating a quench function.

[0004] Similarly, vacuum pumps and abatement systems for semiconductor processing equipment can be part of an integrated system for semiconductor manufacturing. Such systems typically require a power supply system that provides electrical power at high voltage to individual modules of the system. Such integrated systems are becoming increasingly complex and compact, making access for repair and maintenance activities more limited. As a result, sophisticated, integrated high-voltage electrical assemblies are occupying less space and are being relocated to areas where system maintenance access is significantly reduced. Power supply system failures can result in costly downtime of the equipment they power, such as semiconductor processing equipment. Early signs of failure in such electrical systems can be determined by detecting temperature increases in components of the power supply system.

[0005] Generally, electrical temperature sensors can be used to monitor the temperature of components such as process pipes in semiconductor equipment. This may include a thermocouple connected to an appropriate detection circuit. However, each such thermocouple is a relatively expensive device. Furthermore, each thermocouple requires additional wiring and control circuitry, the complexity of which increases installation costs. These factors make it unsuitable to install a large number of such electrical temperature sensors. Furthermore, if insulating and / or heating jackets are applied to the pipes, they may interfere with the sensor placement and wiring. In power supply systems, such wiring must be sufficiently insulated and protected from high-voltage components.

[0006] Alternative electronic temperature sensing devices can use thermistors, resistance temperature detectors (RTDs), and infrared sensors, some of which may be less expensive than thermocouples, but still require the added expense of cumbersome wiring and / or communication circuitry.

[0007] It is also possible to sense temperature with mechanical switch indicators such as thermostats or capillary probes, however these generally provide only low resolution measurements and pose additional problems for monitoring and relaying to monitoring devices. Summary of the Invention [Problem to be solved by the invention]

[0008] What is needed is an improved arrangement for measuring the temperature of components of support systems for semiconductor processing equipment, such as process piping and power supply systems. [Means for solving the problem]

[0009] Radio frequency identification (RFID) tags have been found to have a resonant frequency response that is temperature dependent. This specification describes a cost-effective method of detecting the temperature of a component, such as a pipe, by adding RFID tags on the pipe itself along its length. A reader with resonant frequency detection can scan the component to determine the temperature of the RFID tag attached to it. This provides a cost-effective method of monitoring multiple components in a system, each component having an RFID tag attached to it.

[0010] A method for detecting the temperature of a component of a support system for semiconductor processing equipment is provided, the method including the steps of: attaching a radio frequency identification tag having a serial number to a pipe; reading the radio frequency identification tag with a reader, the reader configured to read the serial number of the radio frequency identification tag and identify a resonant frequency of the radio frequency identification tag; and converting the resonant frequency of the radio frequency identification tag into a temperature of the radio frequency identification tag.

[0011] The components of the support system for the semiconductor processing equipment can include process pipes of the semiconductor processing equipment. The components of the support system for the semiconductor processing equipment can include a power supply system for providing electrical power.

[0012] Also provided is a method for detecting the temperature of a process pipe in a semiconductor device, the method comprising the steps of: attaching a radio frequency identification tag having a serial number to the process pipe; reading the radio frequency identification tag with a reader, the reader configured to read the serial number of the radio frequency identification tag and identify a resonant frequency of the radio frequency identification tag; and converting the resonant frequency of the radio frequency identification tag into a temperature of the radio frequency identification tag.

[0013] Further provided is a method for detecting the temperature of a component of an electrical power supply system having a bus bar and a plurality of electrical modules connected to the bus bar, the method comprising the steps of: attaching a radio frequency identification tag having a serial number to the component; reading the radio frequency identification tag with a reader, the reader configured to read the serial number of the radio frequency identification tag and identify a resonant frequency of the radio frequency identification tag; and converting the resonant frequency of the radio frequency identification tag into a temperature of the radio frequency identification tag.

[0014] In some implementations, multiple RFID tags will be installed. Thus, the method may further include recording the serial number and installation location of the radio frequency identification tag in a database when the radio frequency identification tag is affixed to the component, and thereafter, when a temperature reading is obtained, the location of the temperature reading is determined by looking up the serial number of the radio frequency identification tag in the database.

[0015] Additionally, a reader for detecting the temperature of a component of a support system for semiconductor processing equipment is provided, the reader comprising a transmitter, a receiver, and a processor. The transmitter is configured to transmit a signal to a radio frequency identification tag attached to the component, the radio frequency identification tag having a serial number. The receiver is configured to receive the serial number of the radio frequency identification tag. The reader is further configured to identify a resonant frequency of the radio frequency identification tag.

[0016] The reader may include a long read antenna disposed along the length of the component, the long read antenna being connectable to at least one of a transmitter and a receiver.

[0017] The component and the RFID tag are in thermodynamic equilibrium such that the temperature of the component can be determined to be the same as the temperature of the radio frequency identification tag.

[0018] Identifying the resonant frequency of the radio frequency identification tag may include transmitting a series of different frequency signals to the radio frequency identification tag and determining the signal strength of the signal received from the radio frequency identification chip for each different frequency signal, which is preferred for passive RFID tags.

[0019] Identifying the resonant frequency of the radio frequency identification tag can include detecting the frequency of a signal received from the radio frequency identification chip, which is suitable for RFID tags that include a battery, such as active RFID tags, and battery-assisted passive RFID tags.

[0020] Further provided is a radio frequency identification tag for detecting the temperature of a component of a support system for semiconductor processing equipment, the radio frequency identification tag comprising an antenna configured to be placed in thermal communication with the component, a case, and an electrically insulating pad, the electrically insulating pad separating the antenna from the component, and an electrical component configured to be electrically coupled to the antenna and remote from the component.

[0021] Further provided is a radio frequency identification tag for detecting the temperature of a process pipe of a semiconductor device, the radio frequency identification tag comprising an antenna configured to be placed in thermal communication with the process pipe, and an electrically insulating pad, the electrically insulating pad separating the antenna from the process pipe, and an electrical component configured to be electrically coupled to the antenna and remote from the process pipe.

[0022] Further provided is a radio frequency identification tag for detecting the temperature of a component of a power supply system, the radio frequency identification tag comprising an antenna configured to be placed in thermal communication with the component, and an electrically insulating pad, the electrically insulating pad separating the antenna from the component, and an electrical component configured to be electrically coupled to the antenna and remote from the component.

[0023] The antenna, the electrical insulating pad, and the electrical components can be housed in a case. The case can be a polyimide case. The electrical insulating pad can be a thermally conductive electrical insulator. The electrical insulating pad can provide good thermal conductivity between the components and the electrical components of the radio frequency identification tag.

[0024] The electrical component can be separated from the antenna by a communication line. The electrical component can be located within the tail of the RFID tag.

[0025] The insulating pad can be an electrically insulating, thermally conductive pad. Such pads can be made of silicone rubber or epoxy compounds filled with boron nitride or aluminum nitride. Illustratively, aluminum nitride has a thermal conductivity of up to 285 W / mK, but is a semiconductor. This compares favorably with well-known metallic thermal conductors such as copper, which has a thermal conductivity of 385 W / mK.

[0026] The RFID tag can be built into a heating pad, and the heating pad is arranged to be fixed to the exhaust pipe. The heating pad can be an electrically insulating pad. The electrically insulating pad can be part of the heating pad, and the heating pad includes a heating element. The heating element can include an electric heating wire. The antenna and the electrical components can be housed in a case. The case can be a polyimide case.

[0027] The radio frequency identification tag may further comprise an adhesive pad for attaching the insulating pad to the component. The adhesive pad may comprise a thermal adhesive tape. For example, 3M® 8810 Thermally Conductive Adhesive Transfer Tape is designed to provide a preferential thermal transfer path between a heat-generating component and the part to which it is attached.

[0028] The radio frequency identification tag may be one of a passive tag, an active tag, and a battery-assisted passive tag.

[0029] The electrical component may include a memory that stores a serial number, which is transmitted from the radio frequency identification tag when the radio frequency identification tag is interrogated.

[0030] When the radio frequency identification tag is installed, the serial number and installation location of the radio frequency identification tag are recorded so that when a temperature reading is subsequently taken, the location of the temperature reading can be determined.

[0031] The electrical insulating pad can provide good thermal conductivity between the component and the electrical components of the radio frequency identification tag. The radio frequency identification tag can further comprise a thermal insulating layer, which separates the electrical components of the radio frequency identification tag from the antenna, the electrical insulating pad, and the component.

[0032] Additionally, one or more programs are provided that, when executed by a computer system or one or more processors, are configured to cause the computer system or one or more processors to operate in accordance with the methods described herein.

[0033] Additionally, a machine-readable storage medium storing at least one of the one or more programs described herein is provided. [Brief explanation of the drawings]

[0034] [Figure 1]1 illustrates an exemplary component whose temperature is to be determined. [Figure 2A] 1 shows a radio frequency identification tag that detects the temperature of a component. [Figure 2B] 1 shows a radio frequency identification tag that detects the temperature of a component. [Figure 2C] 1 shows a radio frequency identification tag that detects the temperature of a component. [Figure 3A] 1 illustrates different uses of RFID tags as described herein. [Figure 3B] 1 illustrates different uses of RFID tags as described herein. [Figure 3C] 1 illustrates different uses of RFID tags as described herein. [Figure 4] 1 illustrates a method for detecting the temperature of a component. [Figure 5] 1 shows a reader for detecting the temperature of a component. [Figure 6] 1 is a schematic diagram (not to scale) illustrating a power supply system including a temperature sensing arrangement as described herein; [Figure 7] 1 is a schematic diagram (not to scale) showing a detailed view of a bus bar incorporating multiple RFID tags as described herein. DETAILED DESCRIPTION OF THE INVENTION

[0035] All drawings are for illustrative purposes and are not to scale.

[0036] An RFID tag contains at least two components: an integrated circuit that stores and processes information and modulates and demodulates radio frequency (RF) signals, and an antenna that transmits and receives the signals. Tag information is stored in non-volatile memory that is part of the integrated circuit. A reader transmits a coded radio signal to interrogate the tag. The RFID tag receives the message and then responds with a unique serial number. Because the tags have individual serial numbers, the RFID system design can distinguish between tags that may be within range of the RFID reader's antenna and simultaneously read the tags.

[0037] A radio frequency identification tag comprises an integrated circuit electrically connected to an antenna, the integrated circuit including a memory component for storing information such as a serial number, and communication circuitry for sending and receiving radio signals.

[0038] Radio frequency identification tags are powered in a variety of ways. Passive tags include a means of collecting DC power from an incident reader signal that powers the RFID tag and transmitter. Active tags include a power source, typically an on-board battery, and periodically transmit an ID signal. Battery-assisted passive tags include a small battery, but the RFID tag is activated when it receives an interrogation signal from an RFID reader. The battery and chip are electrical components of the RFID tag and are referred to herein as electrical parts. These electrical parts are the only electrical parts other than the antenna.

[0039] The information stored on a radio frequency identification tag is typically a unique serial number that is transmitted by the radio frequency identification tag when it is interrogated. The serial number is stored in a memory component of the chip.

[0040] FIG. 1 illustrates an exemplary component whose temperature is to be determined. In this example, the component is a process pipe 110 that routes hot gas from left to right. Such a pipe is an example of a component of a support system for semiconductor processing equipment. The hot gas contains vapor that causes condensation deposits 115 to form within the pipe 110. In the illustrated example, condensation 115 tends to build up after the second bend in the pipe 110. Such a pipe can route supply gas to the semiconductor processing equipment or route spent gas away from the semiconductor processing equipment. Such spent gas can be disposed of by an abatement system. In this context, "semiconductor processing equipment" refers to equipment suitable for processing semiconductor materials, such as wafers, to produce semiconductor devices, such as transistors, memories, or processors. Another example of a component of a support system for semiconductor processing equipment is a bus bar in a power supply system.

[0041] 2A shows a radio frequency identification tag 200 that detects the temperature of a component 210. The component 210 may be a pipe. The component 210 may be a busbar interconnect. The radio frequency identification tag 200 includes an antenna 220, a polyimide case 230, and an insulating pad 240. The insulating pad 240 separates the antenna 220 from the component 210.

[0042] Antenna 220 is part of the RFID tag's electronics layer, which contains the RFID tag's integrated circuit, which is not shown separately in FIG.

[0043] FIG. 2A further shows adhesive pad 250, which adheres / attaches insulating pad 240 to component 210. Adhesive pad 250 is a thermal adhesive tape, an example of which is 3M® 8810 Thermally Conductive Adhesive Transfer Tape. Such tape is designed to provide a preferential heat transfer path between a heat-generating component and a heat sink or other cooling device, such as a fan, heat spreader, or heat pipe. Adhesive pad 250 is optional, as RFID tag 200 can be held in place by other means, such as a strap, or incorporated into another part secured to the component, such as an insulating jacket. For example, the RFID tag can be embedded in a heating pad, which is then positioned to be secured to component 210.

[0044] The insulating pad 240 is an electrical insulator that improves the operation of the antenna 220 and provides good thermal conductivity between the antenna 220 and the component 210 in the electronics layer of the radio frequency identification tag.

[0045] The insulating pad 240 is an electrically insulating and thermally conductive pad. The insulating pad 240 increases the separation distance between the antenna 220 and the component 210. In some implementations, the component 210 is made of metal and is therefore electrically conductive. An advantage of the insulating pad 240 is that it improves the radio operation of the antenna 220 when the RFID tag 200 is attached to the metal part 210.

[0046] The insulating pad 240 is formed of silicone rubber containing zinc oxide fillers to increase thermal conductivity. Alternatively, the insulating pad 240 includes an epoxy compound filled with boron nitride or aluminum nitride. Illustratively, aluminum nitride has a thermal conductivity of up to 285 W / mK, but is a semiconductor. This compares favorably with well-known metallic thermal conductors such as copper, which has a thermal conductivity of 385 W / mK.

[0047] 2B shows another configuration of RFID tag 202 for detecting the temperature of component 210. RFID tag 202 includes an electrically insulating pad 240, an antenna 222, an electrically insulating pad 260, a connecting wire 270, and an electrical component 224. Antenna 222 and electrical component 224 are electrically connected by connecting wire 270. RFID tag 202 includes a separate antenna and electrical component, such that the antenna is in thermal communication with component 210 and electrical component 224 is separated from antenna 222 and component 210 by thermal insulation. Thus, during operation, electrical component 224 of RFID tag 202 tends to be at a lower temperature than component 210. This can improve the operating temperature range and / or lifespan of RFID tag 202.

[0048] FIG. 2C illustrates another configuration of an RFID tag 204 for detecting the temperature of a component 210. The RFID tag 204 includes an electrically insulating pad 240, an antenna 222, a connecting wire 270, and an electrical component 224. The antenna 222 and the electrical component 224 are electrically connected by the connecting wire 270. The RFID tag 204 includes a separate antenna and electrical component, such that the antenna is in thermal communication with the component 210 and the electrical component 224 is separated from the antenna 222 by the length of the connecting wire 270. The connecting wire 270 and the electrical component 224 represent a tail of the RFID tag 204. The tail allows the electrical component to be spatially separated from the component 210. In use, the electrical component 224 can be placed in a lower temperature environment, such as ambient temperature. Thus, during operation, the electrical component 224 of the RFID tag 204 tends to be at a lower temperature than the component 210. This can improve the operating temperature range and / or lifespan of the RFID tag 204.

[0049] FIG. 3A shows two RFID tags 300 attached to a pipe 310 at different locations. FIG. 3B shows the RFID tag 300 attached to the pipe 310 with insulation 380 attached above the RFID tag 300. The insulation preferably additionally covers the RFID tag 300 to ensure accurate temperature readings of the pipe 310. FIG. 3C shows the RFID tag 300 as part of a heating jacket 390, which is attached to the pipe 310 and thus holds the RFID tag 300 against the pipe 310. To ensure accurate temperature readings, the heating element within the heating jacket is preferably not attached between the RFID tag and the pipe 310 or on the RFID tag 300 adjacent to the polyimide casing 230 and internal electronic component layers. The pipe 310 may be an exhaust pipe from a semiconductor processing equipment.

[0050] If the RFID tag 300 is covered by a jacket, indicia such as a mark, color patch, or sticker can be provided on the exterior surface of the jacket to make the installed RFID tag easier to find after installation.

[0051] 4 shows a method 400 for detecting the temperature of a component. The method 400 includes step 420 of attaching a radio frequency identification tag having a serial number S2 to the component, step 430 of reading the radio frequency identification tag S3 with a reader configured to read the serial number of the radio frequency identification tag and identify a resonant frequency of the radio frequency identification tag, and step 440 of converting the resonant frequency of the radio frequency identification tag S4 into a temperature of the radio frequency identification tag.

[0052] The step 440 of converting the detected resonant frequency to a temperature is performed using a lookup table. The lookup table is configured for each type of RFID tag and allows the detected resonant frequency to be converted to a temperature reading. Alternatively, each RFID tag is calibrated before installation to identify the relationship between temperature and resonant frequency for each specific RFID tag. This information is stored in the lookup table along with the RFID tag serial number. After installation, once the resonant frequency of the RFID tag is identified along with the serial number, the serial number is used to identify the relationship between resonant frequency and temperature for that given RFID tag.

[0053] In some implementations, multiple RFID tags will be installed, and the method may therefore further include recording 410 the serial number and location of the radio frequency identification tag in S1 in a database when the radio frequency identification tag is affixed to the component, and determining 450 the location of the temperature reading when a temperature reading is subsequently obtained (step 440) by looking up the serial number of the radio frequency identification tag in S5's database.

[0054] 5 shows a reader 500 for detecting the temperature of a component. The reader includes a transmitter 510, a receiver 515, and a processor 520. The transmitter 510 is configured to transmit a signal to a radio frequency identification tag having a serial number attached to the component. The reader 515 is configured to receive the serial number of the radio frequency identification tag. The processor 520 is configured to determine the resonant frequency of the radio frequency identification tag using the receiver 515. The processor 520 is further configured to convert the resonant frequency of the radio frequency identification tag into a temperature of the radio frequency identification tag.

[0055] The reading device 500 further comprises a user interface 540. The user interface 540 allows a user to input instructions into the reading device 500 and allows the reading device 500 to display information to the user. The user interface 540 may be a touchscreen interface. The processor 520 may be configured to receive instructions that, when executed, cause the processor 520 to perform the methods described above. The instructions may be stored in the memory 525.

[0056] If multiple RFID tags are installed, the reader 500 is configured to record the serial number and installation location of each radio frequency identification tag in the database 530. Thereafter, when a temperature reading is obtained, the processor 520 determines the location of the temperature reading by looking up the radio frequency identification tag's serial number in the database.

[0057] Generally, the component and the RFID tag are in thermodynamic equilibrium and the temperature of the component can be determined to be the same as the temperature of the radio frequency identification tag.

[0058] Identifying the resonant frequency of the radio frequency identification tag may include transmitting a series of different frequency signals to the radio frequency identification tag and determining the signal strength of the signal received from the radio frequency identification chip for each different frequency signal, which is preferred for passive RFID tags.

[0059] Identifying the resonant frequency of the radio frequency identification tag may include detecting the frequency of a signal received from the radio frequency identification chip, which is suitable for RFID tags that include a battery, such as active RFID tags, and battery-assisted passive RFID tags.

[0060] When the radio frequency identification tag is installed, the serial number and installation location of the radio frequency identification tag are recorded so that when a temperature reading is subsequently taken, the location of the temperature reading can be determined. Such information is preferably stored in a database. The database may be stored in the reading device.

[0061] The reading device can be a handheld device incorporating a transceiver that interrogates the RFID tag. Such reading devices are well suited to passive RFID tags, which must transmit a relatively strong signal and require a relatively nearby receiver to detect that transmission.

[0062] The reading device can be a centrally located device with multiple external antennas oriented to interrogate RFID tags at sub-locations of the facility. For example, a site can be divided into multiple regions, each with its own antenna that interrogates RFID tags therein. A centrally located reading device can then interrogate each region and then ascertain temperature readings from the multiple RFID tags therein.

[0063] The reading device may include at least one long reading antenna device, the long reading antenna being connected to at least one of the transmitter and the receiver. The long reading antenna device may include a reading antenna comprising a leaky coaxial cable. Such an antenna may read multiple RFID tags along its length. The long reading antenna device is positioned along the exhaust pipe being monitored near one or more RFID tags.

[0064] The use of antennas along the length of a single exhaust pipe allows for isolated readings with system-specific or pipe-specific microcircuits. Readings in this manner allow for rapid isolation of specific problem areas. Such a configuration also allows for response to thermal events in processing equipment fed into the exhaust pipe to ensure the safety of personnel and equipment during processing.

[0065] One or more programs are provided that, when executed by a computer system or one or more processors, are configured to cause the computer system or one or more processors to operate according to the methods described herein.

[0066] Further provided is a machine-readable storage medium storing at least one of the one or more programs described herein.

[0067] While the above examples involve measuring the temperature of pipes, the present invention may also be applied to power supply systems, including but not limited to bus bars. Also provided are methods for detecting thermal cycling in power supply system components, vacuum pumps and abatement systems for semiconductor processing equipment, and compressor systems for hydrocarbon processing.

[0068] 6 is a schematic diagram (not to scale) illustrating a power supply system 600 including a fault detection arrangement as described herein. System 600 comprises a bus bar 610, a plurality of electrical modules 630, a plurality of interconnection elements 640, and a plurality of RFID tags 660 as described herein.

[0069] A plurality of electrical modules 630 are connected to the bus bar 610 by respective plurality of interconnection elements 640, and the bus bar 610, interconnection elements 640, and electrical modules 630 comprise a plurality of components.

[0070] Busbar 610 receives power from a power source and distributes this power to multiple modules 630. Interconnect components 640 provide electrical connections between each module 630 and busbar 640. Busbars provide a space-efficient power distribution system for complex electrical installations and are typically used where a compact solution is required.

[0071] Illustratively, semiconductor manufacturing facilities will use vacuum and abatement systems to provide vacuum for specific processes, such as etching or deposition. Such vacuums are typically maintained at pressures on the order of 1 millibar. Any gases produced from semiconductor processing pass through the abatement system. In such facilities, each pump may consume 1 kilowatt (kW) or more of power, each module 630 may include one or more pumps, and multiple modules 630 (e.g., 10 or 11 or more) may be connected to the bus bar 610. Thus, the bus bar 610 can be expected to transmit tens of kW of power within a small physical space. The bus bar 610 typically transmits power as three voltage phases and therefore includes at least three electrical conductors, each of which may be a copper rod or cable. The common voltage of the three-phase power supply is 480 volts.

[0072] A fault in the power supply system can be detected by an increase in the operating temperature of any one of the system's components. Such a component can include the interconnection element 640. An increase in the operating temperature of a component is often caused by an increase in the component's resistance. The component can be a power semiconductor device, such as an integrated gate bipolar transistor (IGBT), or a screw in a clamp housing that holds two conductors together. The increase in resistance can be the result of degradation of the power semiconductor device or a loosening of a coupling means, such as a clamp screw, that couples the two conductors together. In the case of a power semiconductor device, an increase in operating temperature can accelerate the aging or fatigue of the power semiconductor device. Similarly, an increase in the operating temperature of a loose physical coupling means can further loosen the physical coupling means when the coupling means is thermally cycled between high and relatively low temperatures in its respective operating and non-operating modes. In either case, an increase in the operating temperature of a component indicates a possible future failure of the component.

[0073] Conventional monitoring techniques for power supply systems utilize electrical temperature sensors, such as a combination of high voltage isolated infrared sensors and traditional thermocouples, which are placed at predetermined locations to allow measurements of critical components of the power supply system.

[0074] Thermal monitoring of electrical systems, such as power distribution systems, can provide real-time temperature data, allowing operators to maximize load efficiency and balance thermal stresses that could lead to catastrophic failures. Over time, switchgear contacts, busbars, and critical connection points develop hot spots that gradually corrode, causing increased electrical resistance. Even small increases in resistance can quickly become uncontrollable if left unchecked, as high resistance results in hot conductors, resulting in increased resistance.

[0075] Problems with such conventional monitoring techniques include, for example: a. The excessive size of each sensor does not contribute to the miniaturization and space saving requirements of the electrical system. b. Infrared sensors generally need to be placed approximately 20 mm away from the component under test and will not work if attached directly to the component, which tends to increase the volume of space occupied by the monitoring technology. c. Dust accumulation and contamination can affect the calibration of infrared sensors. d. Each sensor mounting bracket requires a large amount of space. e. Variations in the test material and finish of the monitored component, such as the same component type from different manufacturing batches, can affect its emissivity and affect the accuracy of infrared measurements. f. Each sensor typically needs to be individually wired, which leads to excessive wiring space requirements. Infrared sensors and thermocouples are generally electrical sensors that require their own electrical wiring. Multiple individual sensors require significant wiring complexity and control infrastructure. g. Electrical sensors require conductive wiring that must be isolated from any high voltage components, such as bus bars. Such wiring tends to need to be ruggedized to function safely in the high voltage environment of a power supply system.

[0076] Large electrical systems tend to have a large number of bolted connections. However, conventional techniques for temperature measurement are limited in the number of connections that can be monitored in real time, primarily due to the problems discussed above. Because of these limitations, there is only limited certainty that the monitoring will provide sufficient information to reduce operating costs by allowing longer service intervals and fewer visual inspections.

[0077] The above problems tend to be addressed by a system 600 such as that shown in Figure 6, which employs multiple RFID tags 660. Each RFID tag 660 has a unique serial number and is attached to a component of the power supply system.

[0078] 7 is a schematic diagram (not to scale) showing a detailed view of a power delivery system 700 comprising a bus bar incorporating multiple RFID tags 760. Interconnection elements 740 for two modules are shown attached to the bus bar 710. Nine RFID tags 760 are attached to each set of interconnection elements 740 at nine measurement points per set of interconnection elements 740. At each measurement point, an RFID tag 760 is connected to a component of the interconnection elements 740.

[0079] The coupling means between the RFID tag 760 and, for example, components of the interconnect element 740 can be provided by, for example, adhesive, tape, cable ties, or mechanical clips. Different coupling means can be used for different components depending on practical considerations and constraints such as available space and component geometry. For example, the attachment solution for the cable of each RFID tag 760 can be a simple adhesive pad that is bonded directly to a bus bar. Typically, each RFID tag 760 is held adjacent to and in contact with the component to be monitored. The above-described configuration provides an improved temperature detection configuration that can be added to the support system of semiconductor processing equipment.

[0080] For example, one of the larger cost additions to heating piping is the hardware required to obtain temperature readings and the number of reading points required. This specification presents a cost-effective method for detecting temperature using RFID tags embedded within the heater structure or affixed to the pipe itself along its length. A heater controller with a UHF RFID reader using resonant frequency detection is deployed to scan the entire line. The serial number of each RFID tag is then identified, and the corresponding temperature is determined from the resonant frequency. This provides a cost-effective method for monitoring the entire line, where alarm systems for heat events, line-length temperature continuity, and other analytical results can be determined. By correlating setpoints with resonant frequency ranges, the scan bandwidth can be narrowed to speed up the time to obtain all temperatures. For example, each RFID tag can be first scanned at a resonant frequency expected to provide a predicted temperature at that location. Thus, RFID tags described herein can be installed in every heater down the line, effectively making every heater a readable temperature point, greatly improving input-based indication, control, and other applications.

[0081] Use of the described system has several important advantages over the prior art. a. RFID tags can be attached directly to components such as bus bars and critical coupling means, maximizing flexibility in sensor location and minimizing the space requirements needed to accommodate sensors and fixtures. b. The radio measurements remain unaffected by factors other than the temperature of the component at the time of test, such as the surface finish or material of the component. c. The exact sensor location can be selected at the time of installation and is not limited by issues such as wire length that affect electrical sensors. d. The space savings of using RFID tags versus hardwired sensors allows for many more temperature measurement locations within a power delivery system, and even the possibility of redundant measurements with two spatially separated fiber Bragg gratings in different RFID tags assigned to measure the temperature of a single critical component. e. RFID tags are housed in an electrically insulating enclosure and do not require conductive wiring to a control device. RFID tags do not require insulated wires or additional insulation from electrical components, which means that there are fewer restrictions on sensor placement within a power supply system for RFID tags compared to hard-wired sensors.

[0082] The systems and methods described herein therefore provide design flexibility, meaning that many additional components that were not previously considered critical can be thermally monitored. The thermal monitoring systems and methods described above tend to enable fundamental changes to the maintenance domain of power supply systems such as those described herein. Furthermore, by being able to monitor the temperature of so many components, system operators can be confident that the electrical system is operating optimally and that any faults that begin to occur can be quickly detected as an increase in temperature in a particular component. This confidence allows system operators to reduce the amount of preventative maintenance and operate the system with longer service intervals. Thus, the systems and methods described herein reduce downtime and lower costs. Furthermore, the described systems and methods can be implemented with small space requirements, which is important in systems that require space-efficient power supplies in the form of bus bars.

[0083] There is further provided a vacuum pump and abatement system for semiconductor processing equipment that may include a power supply system as described herein.

[0084] There is further provided a compressor system for hydrocarbon processing that may be equipped with a power supply system as described herein.

[0085] The RFID tags described herein are designed to operate at temperatures up to 260°C, and for this reason, polyimide film is used to encapsulate the electronic components. In certain implementations, operation up to 200°C is acceptable; in these situations, the polyimide casing can be replaced with silicone. In other embodiments, materials other than polyimide and silicone are used for the RFID tag casing. Any electrically insulating material appropriate for the expected exhaust pipe temperatures and that allows radio frequencies to pass through the casing and into the RFID antenna can be used.

[0086] Using RFID tags and their temperature-dependent resonant frequency shift properties is a cost-effective way to monitor the temperature of components such as process pipes or power supply systems without the need for expensive analytical chips, wiring, and sensing devices.

[0087] Apparatus for detecting the temperature of components, implementing the above arrangements, and performing the method steps described herein can be provided by configuring or adapting any suitable apparatus, such as one or more computers or other processing devices or processors, and / or by providing additional modules. The apparatus can comprise a computer, a network of computers, or one or more processors that execute instructions and use data, including instructions and data in the form of one or more computer programs stored in or on a machine-readable storage medium, such as a computer memory, computer disk, ROM, PROM, etc., or any combination of the above or other storage media. The additional module can comprise a UHF antenna suitable for interrogating RFID tags as described herein.

[0088] It should be noted that some of the process steps shown above in the flowchart of Figure 4 may be omitted, or such process steps may be performed in a different order than that shown above in Figure 4. Furthermore, although all process steps are shown as separate, temporally consecutive steps for convenience and ease of understanding, some of the process steps may actually be performed simultaneously or with at least some degree of temporal overlap.

[0089] It should be noted that the above-described embodiments are illustrative rather than restrictive of the present invention, and that those skilled in the art can design many other embodiments without departing from the scope of the appended claims. The word "comprising" does not exclude the presence of elements or steps other than those listed in a claim, and the singular "a" or "an" does not exclude a plurality; a single processor or other unit may fulfill the functions of several units listed in a claim. Any reference signs in the claims shall not be construed as limiting their scope. [Explanation of symbols]

[0090] 110 Process Pipe 115 Sediment 200 RFID tags 202 RFID tags 204 RFID tags 210 Components 220 Antenna 222 Antenna 224 Electrical Components 230 Polyimide case 240 Electrical Insulation Pad 250 adhesive pads 260 Insulation Pad 270 connecting lines 300 RFID tags 310 Pipe 380 Heating Jacket 390 Heating Jacket 510 Transmitter 515 Receiver 520 processor 525 memory 530 databases 540 User Interface 600 Power Supply System 610 Busbar 630 Electrical Module 640 Interconnecting Elements 660 RFID tags 700 Power Supply System 710 Busbar 740 Interconnection Elements 760 RFID tags

Claims

1. A method for detecting the temperature of a process pipe (110; 310) of a semiconductor processing equipment, comprising: affixing a radio frequency identification tag (200; 202; 204; 300) having a serial number to the process pipe (110; 310), the radio frequency identification tag (200; 202; 204; 300) comprising an antenna (220; 222) disposed in thermal communication with the process pipe (110; 310), an electrically insulating pad (240) separating the antenna (220; 222) from the process pipe (110; 310), and a tag storing the serial number. a memory for storing the memory, an electrical component, and an electrical insulating layer (260), the electrical component including the memory and electrically coupled to and separated from the antenna (220; 222), the electrical insulating layer (260) separating the electrical component (224) of the radio frequency identification tag (200; 202; 204; 300) from the antenna (220; 222), the electrical insulating pad (240), and the process pipe (110; 310); reading the radio frequency identification tag (200; 202; 204; 300) with a reader (500), the reader (500) being configured to read the serial number of the radio frequency identification tag (200; 202; 204; 300) and identify the resonant frequency of the radio frequency identification tag (200; 202; 204; 300); converting the resonant frequency of the radio frequency identification tag (200; 202; 204; 300) into a temperature of the radio frequency identification tag (200; 202; 204; 300); Including, Furthermore, the method comprises: - when said radio frequency identification tag (200; 202; 204; 300) is attached to said process pipe (110; 310), recording said serial number and installation location of said radio frequency identification tag (200; 202; 204; 300) in a database; once a temperature reading is obtained, the location of said temperature reading is determined by looking up the serial number of said radio frequency identification tag (200; 202; 204; 300) in said database; A method comprising:

2. The method of claim 1 , wherein the process pipe (110; 310) is determined to be at the same temperature as the radio frequency identification tag (200; 202; 204; 300).

3. A process pipe of a semiconductor processing equipment comprising a radio frequency identification tag (200; 202; 204; 300) for detecting the temperature of the process pipe (110; 310), said radio frequency identification tag (200; 202; 204; 300) an antenna (220; 222) disposed in thermal communication with the process pipe (110; 310); an electrical isolation pad (240), said electrical isolation pad (240) separating said antenna (220; 222) from said process pipe (110; 310); a memory for storing a serial number; said serial number being transmitted by said radio frequency identification tag (200; 202; 204; 300) when said radio frequency identification tag (200; 202; 204; 300) is interrogated; the radio frequency identification tag (200; 202; 204; 300) comprises an electrical component, the electrical component including a memory, electrically coupled to and separated from the antenna (220; 222); The radio frequency identification tag (200; 202; 204; 300) further comprises an electrically insulating layer (260); the electrical insulating layer (260) separates the electrical components (224) of the radio frequency identification tag (200; 202; 204; 300) from the antenna (220; 222), the electrical insulating pad (240), and the process pipe (110; 310); Process pipe.

4. The antenna (220:222) and the electrical components (224) are housed in a case.

4. The process pipe of claim 3.

5. and further comprising an adhesive pad (250) for attaching the electrical insulating pad (240) to the process pipe (110; 310). The process pipe according to any one of claims 3 to 4.

6. The electrically insulating pad (240) is an electrical insulator and thermally conductive. A process pipe according to any one of claims 3 to 5.

7. The radio frequency identification tag (200; 202; 204; 300) The radio frequency identification tag of any one of claims 3 to 6, which is one of a passive tag, an active tag, and a battery-assisted passive tag.

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