Laser processing device, processing program generation device, laser processing method, and processing program generation program

Abstract

The laser processing apparatus includes a laser oscillator (12) that emits laser light (L), a processing head (14) that irradiates the laser light (L) onto a workpiece (50), a drive device (20) that can drive the processing head (14) in the directions of three mutually perpendicular axes, and an axis movement control unit (32) that controls the operation of the drive device (20) to move the position of the processing head (14) according to a processing program for irradiating the laser light (L) onto the workpiece (50) to process the workpiece (50), and the axis movement control unit (32) controls the drive device (20) to move the processing head (14) so ​​that the processing path, which is the movement path of the processing head (14) relative to the workpiece (50), becomes a spiral processing path during laser processing.

Description

[Technical Field]

[0001] The present disclosure relates to a laser processing device, a processing program generation device, a laser processing method, and a processing program generation program that irradiate a plate-shaped or tubular workpiece with a laser beam to cut it. [Background technology]

[0002] Patent Document 1 discloses a countersinking technique including multiple separation steps to create a cutting gap along a cutting line that partially follows the contour of a workpiece member to be produced from the workpiece, and at least one post-processing step to post-process the workpiece along at least a portion of the cutting gap while the workpiece member is not completely cut away. In the separation steps, the processing beam has a first power density calculated to separate the workpiece. The separation steps only partially cut the workpiece member, leaving it connected to the remaining workpiece via one or more joints. In one example, the post-processing step is performed multiple times by irradiating a processing beam along the same portion of the cutting gap with a second power density calculated not to separate the workpiece. In this case, the at least two post-processing steps may be performed with at least one of different post-processing lines and different processing beam power densities. In another example, the post-processing step may be performed multiple times to post-process the workpiece, or may be performed to post-process only along the portion of the cutting gap created by the immediately preceding separation step. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2022-523275 Summary of the Invention [Problem to be solved by the invention]

[0004] However, conventional countersinking techniques using a processing beam require a separation step in which a cutting gap is created using a processing beam with a first power density calculated to separate the workpieces, followed by multiple post-processing steps using a processing beam with a second power density calculated to prevent the workpieces from separating. This requires leaving a joint connecting the workpiece member to the remaining workpiece, which requires the workpiece member to be removed from the remaining workpiece. This requires additional work time to remove the joint, which results in an increase in takt time.

[0005] On the other hand, with conventional countersinking technology using a machining beam, it is necessary to check the machining process step by step to obtain the desired countersink angle, which leads to an increase in takt time.The same problem occurs when drilling holes in plate-shaped or tubular workpieces using conventional technology.

[0006] The present disclosure has been made in consideration of the above, and aims to provide a laser processing device that can shorten the takt time when drilling holes in a workpiece compared to conventional devices. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the present disclosure Laser processing equipment The machining head includes a laser oscillator that emits a laser beam, a machining head that irradiates the laser beam onto a workpiece, a drive unit that can drive the machining head in each direction of three mutually perpendicular axes, and an axis movement control unit that controls the operation of the drive unit to move the position of the machining head in accordance with a machining program that irradiates the workpiece with the laser beam and processes the workpiece. The laser processing apparatus of the present disclosure further includes an input unit, a spiral processing condition acquisition unit, and a program generation unit. The input unit accepts processing input conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece. The spiral processing condition acquisition unit references processing condition information including a plurality of processing conditions that associate processing content specifying conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral processing conditions that are conditions for performing laser processing along a spiral processing path defined for the processing content specifying conditions, and acquires spiral processing conditions that match the processing input conditions. The program generation unit generates a processing program for performing laser processing along a spiral processing path using the processing input conditions and the acquired spiral processing conditions. If the processing condition information does not include processing content specifying conditions that match the processing input conditions, the spiral processing condition acquisition unit acquires two different processing conditions from the processing condition information, performs linear interpolation between the two acquired processing conditions, and calculates spiral processing conditions for the processing input conditions. The program generation unit generates a processing program for performing laser processing along a spiral processing path using the processing input conditions and the calculated spiral processing conditions. The axis movement control section Control is performed based on the machining program generated by the program generation unit, During laser processing, the drive device is controlled to move the processing head so that the processing path, which is the movement path of the processing head relative to the workpiece, becomes a spiral processing path. [Effects of the Invention]

[0008] The laser processing device according to the present disclosure has the effect of being able to shorten the takt time when drilling holes in a workpiece compared to conventional devices. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically illustrating an example of the configuration of a laser processing device according to a first embodiment. [Figure 2] FIG. 1 is a diagram showing an example of a drive mechanism for a processing head in a laser processing device according to a first embodiment; [Figure 3] FIG. 1 is a diagram showing an example of a drive mechanism for a processing head in a laser processing device according to a first embodiment; [Figure 4] FIG. 1 is a diagram showing an example of a drive mechanism for a processing head in a laser processing device according to a first embodiment; [Figure 5] FIG. 1 is a diagram illustrating a joint in laser cutting processing according to the prior art. [Figure 6] FIG. 1 is a diagram illustrating countersinking according to a conventional technique. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 6, illustrating the countersinking process according to the prior art. [Figure 8] FIG. 1 is a diagram showing an example of a processing path in countersink processing by the laser processing device according to the first embodiment; [Figure 9] FIG. 1 is a diagram showing an example of a processing path in countersink processing by the laser processing device according to the first embodiment; [Figure 10] FIG. 10 is a diagram showing an example of a processing path of a processing head in countersink processing by the laser processing device according to the first embodiment; [Figure 11] FIG. 10 is a diagram showing an example of a processing path of a processing head in countersink processing by the laser processing device according to the first embodiment; [Figure 12] FIG. 1 is a diagram showing an example of the configuration of a processing program generation device used in the laser processing device according to the first embodiment. [Figure 13] FIG. 10 is a diagram showing an example of processing condition information. [Figure 14] Diagram showing types of countersink shapes [Figure 15]1 is a flowchart showing an example of a procedure of a laser processing method according to a first embodiment. [Figure 16] 1 is a flowchart showing an example of a procedure of a laser processing method according to a first embodiment. [Figure 17] FIG. 1 is a block diagram showing an example of the configuration of a computer system that realizes a control device for a laser processing device according to a first embodiment. [Figure 18] FIG. 10 is a diagram comparing the state of countersinking by the laser processing method according to the first embodiment with the state of countersinking by the conventional technology. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser processing apparatus, a processing program generating apparatus, a laser processing method, and a processing program generating program according to embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0011] Embodiment 1 FIG. 1 is a diagram schematically illustrating an example of the configuration of a laser processing apparatus according to embodiment 1. In FIG. 1, the X-axis, Y-axis, and Z-axis are three axes that are perpendicular to each other. In one example, the X-axis and Y-axis are two horizontal axes that are perpendicular to each other. The Z-axis is a vertical axis. For each of the X-axis, Y-axis, and Z-axis, the direction indicated by the arrow is the positive direction, and the direction opposite to the arrow is the negative direction.

[0012] The laser processing apparatus 1 includes a table 11, a laser oscillator 12, a fiber cable 13, a processing head 14, a processing nozzle 15, a processing gas supply unit 16, a gas pipe 17, a drive shaft 18, a motor 19, and a control device 30.

[0013] A plate-shaped or tubular workpiece 50 is placed on the table 11. The table 11 may have a function of fixing the workpiece 50. An example of the workpiece 50 is a steel plate.

[0014] The laser oscillator 12 emits laser light L. The laser oscillator 12 is a light source that emits laser light L, such as a solid-state laser, a gas laser, or a semiconductor laser. The laser light L may be a continuous wave or a pulse wave.

[0015] The fiber cable 13 transmits the laser light L emitted from the laser oscillator 12 to the processing head 14.

[0016] The processing head 14 irradiates the workpiece 50 with the laser light L that has propagated through the fiber cable 13. Although not shown, the processing head 14 has inside it a collimating optical system that collimates the laser light L and a focusing lens that focuses the laser light L. The position at which the laser light L from the processing head 14 is incident on the workpiece 50 is called the processing point P. The processing point P is the position on the workpiece 50 where processing is being performed.

[0017] The processing nozzle 15 is provided at the end of the processing head 14 on the table 11 side, and sprays an assist gas G onto the workpiece 50 when the laser beam L is irradiated onto the workpiece 50. In one example, the processing nozzle 15 has an ejection port that ejects the assist gas G so as to surround the periphery of the emission position of the laser beam L from the processing head 14. In this example, a flow path 141 that guides the assist gas G to the processing nozzle 15 is provided inside the processing head 14. The assist gas G is used to remove molten material during processing and cool the workpiece 50 in an area including the processing point P of the workpiece 50, as well as to suppress or oxidize the workpiece 50. The type of assist gas G is selected depending on the purpose of use. When the purpose is to suppress oxidation of the workpiece 50, oxygen, air, or nitrogen is used as the assist gas G.

[0018] The processing gas supply unit 16 supplies the assist gas G to the processing nozzle 15 via a gas pipe 17. The processing gas supply unit 16 is a valve. The gas pipe 17 is connected between the processing gas supply unit 16 and the processing head 14 so that the assist gas G from the processing gas supply unit 16 is sprayed from the processing nozzle 15.

[0019] The drive shafts 18 are connected directly or indirectly to the machining head 14. In this example, although not shown, three drive shafts 18 are provided parallel to the X-axis, Y-axis, and Z-axis. Each drive shaft 18 is connected to a motor 19 and transmits force from the motor 19 directly or indirectly to the machining head 14.

[0020] The motor 19 is a motor such as a servo motor, and drives the drive shaft 18, which is the machining axis. In this example, although not shown, an X-axis motor, a Y-axis motor, and a Z-axis motor are connected to each of the three drive shafts 18 parallel to the X-axis, Y-axis, and Z-axis, respectively. This makes it possible to move the machining head 14 attached to the drive shaft 18 within the XY plane or XYZ space. The drive shafts 18 and motors 19 constitute a drive device 20 that can drive the machining head 14 in the directions of three mutually perpendicular axes.

[0021] 2 to 4 are diagrams illustrating an example of a drive mechanism for the machining head in the laser machining apparatus according to the first embodiment. FIG. 2 is a top view of the drive mechanism for the machining head 14, FIG. 3 is a side view of the drive mechanism for the machining head 14, and FIG. 4 is a front view of the drive mechanism for the machining head 14. Here, the front view is the state in which the machining head 14 is positioned on the near side of the paper in the YZ plane as shown in FIG. 4. The drive mechanism for the machining head 14 includes an X-axis drive unit 20X, a Y-axis drive unit 20Y, and a Z-axis drive unit 20Z. The machining head 14 is fixed to the Z-axis drive unit 20Z. The Z-axis drive unit 20Z is a device capable of driving the machining head 14 in the Z-axis direction and includes a drive shaft (not shown) parallel to the Z-axis and a Z-axis motor connected to this drive shaft. The Z-axis drive unit 20Z is supported by the Y-axis drive unit 20Y. The Y-axis drive unit 20Y is a device capable of driving the Z-axis drive unit 20Z in the Y-axis direction and has a drive shaft (not shown) parallel to the Y-axis and a Y-axis motor connected to this drive shaft. The Y-axis drive unit 20Y is supported by the X-axis drive unit 20X. The X-axis drive unit 20X is a device capable of driving the Y-axis drive unit 20Y in the X-axis direction and has a drive shaft (not shown) parallel to the X-axis and an X-axis motor connected to this drive shaft.

[0022] Returning to FIG. 1, the control device 30 includes a device control unit 31, an axis movement control unit 32, and a machining program generation unit 33.

[0023] The device control unit 31 controls the operation of the laser oscillator 12 and the processing gas supply unit 16 in accordance with a processing program generated by the processing program generation device 33. The processing program is a computer program that irradiates the workpiece 50 with laser light L to process the workpiece 50. The device control unit 31 generates a laser output command in accordance with the processing program and controls the laser oscillator 12 based on the laser output command. As a result, the laser light L having an output based on the laser output command is output at a timing based on the laser output command. The device control unit 31 generates a gas supply command in accordance with the processing program and controls the processing gas supply unit 16 based on the gas supply command. As a result, the assist gas G is supplied with a gas type and flow rate based on the gas supply command.

[0024] The axis movement control unit 32 controls the operation of the drive device 20 to move the position of the machining head 14 in accordance with the machining program generated by the machining program generation device 33. The axis movement control unit 32 generates axis commands in accordance with the machining program and controls the motors 19 based on the axis commands. The axis movement control unit 32 controls the drive of the motors 19 connected to the drive axes 18 of the X-axis, Y-axis, and Z-axis based on the axis commands, thereby driving the drive axes 18 and moving the machining head 14. In the first embodiment, the axis movement control unit 32 controls the motors 19 of the X-axis, Y-axis, and Z-axis so that the machining head 14 moves in a spiral.

[0025] The processing program generating device 33 acquires appropriate processing conditions from the stored processing conditions based on processing input information, which is information about countersinking or countersinking input by the operator of the laser processing device 1, and generates a processing program for moving the processing head 14 according to the acquired processing conditions. The configuration of the processing program generating device 33 will be described in detail later.

[0026] The laser processing apparatus 1 having such a configuration has the function of laser cutting the plate-shaped or tubular workpiece 50 by irradiating the workpiece 50 with continuous or pulsed laser light L. More specifically, the laser processing apparatus 1 according to the first embodiment performs laser cutting by irradiating a processing point P of the plate-shaped or tubular workpiece 50 with laser light L and injecting an assist gas G at the processing point P to separate the plate-shaped or tubular workpiece 50 into a workpiece and scrap material. As an example, the laser processing apparatus 1 according to the first embodiment is suitable for countersinking, which drills a conical hole so that the top surface of the screw head is below the top surface of the workpiece 50, and for countersinking, which sinks the screw head to a certain extent into the workpiece 50 and chamfers the periphery of the hole into a conical shape. Since both countersinking and countersinking are the same in that they drill a conical or truncated conical hole in the top surface of the workpiece 50, both will be referred to hereinafter as "countersinking."

[0027] Here, we will explain an overview of countersinking using laser cutting according to conventional technology. Figure 5 is a diagram illustrating a joint in conventional laser cutting. This diagram shows the processing state when drilling a circular hole in a workpiece 50 in a planar view. In typical laser cutting, a laser beam L is irradiated onto a plate-shaped or tubular workpiece 50, melting the workpiece 50 and forming a cut groove GR, thereby enabling processing of a desired shape. In the example of Figure 5, the processing head 14 moves from the pierce line PL along the processing path TP1 to form a cut groove GR in the workpiece 50. However, if a scrap 51 is completely cut from a plate-shaped or tubular workpiece 50 made of a thin plate, such as a 1 mm thick plate, the scrap 51 may rise due to the assist gas G sprayed during processing. When the processing head 14 moves to the next starting point, the raised scrap 51 may collide with the processing head 14. To prevent this, the cutting may be intentionally avoided from being performed on the plate-shaped or tubular workpiece 50. The portion connecting the scrap 51 and the workpiece 52 at this time is called a joint 53. In this specification, the processing path refers to the path along which the processing head 14 moves relative to the workpiece 50 placed on the table 11. The laser light L is irradiated along this processing path.

[0028] In the example of FIG. 5, when a circular hole is drilled in a workpiece 50, a pierce line PL is formed by processing using the laser processing device 1 from a predetermined position on the hole to a position that will become the outline of the hole. When the position that will become the outline of the hole is reached, a cutting groove GR is formed along a circular processing path TP1. At this time, the end point of the processing path TP1 is set so that the cutting groove GR along the processing path TP1 does not form a closed circle in the workpiece 52. In other words, no cutting groove GR is formed between the intersection of the pierce line PL and the processing path TP1 and the end point of the processing path TP1, and the workpiece 52 and the scrap 51 are connected. This part is a joint 53. The provision of this joint 53 prevents the scrap 51 from rising up even when assist gas G is ejected during processing.

[0029] The laser processing apparatus 1 can perform countersinking to create a countersink, in addition to laser cutting to separate a normal workpiece 52 from scrap 51. FIGS. 6 and 7 are diagrams illustrating countersinking according to conventional techniques. FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. 6. FIG. 6 is a diagram illustrating an example of a processing path TP2 in countersinking. First, as shown in FIG. 6, a laser cutting process is performed to form a circular hole in the workpiece 50. That is, similar to FIG. 5, laser light L is irradiated along the circular processing path TP2 from a pierce line PL formed in the area that will become the scrap 51, and laser processing is performed to leave a joint 53. In the laser cutting process, laser light L is used with a power density that can cut the workpiece 50 in one laser cutting process.

[0030] 7, a post-process is performed in which the laser beam L with reduced power density is again irradiated along processing path TP2a along processing path TP2 to form a countersink with side surfaces that are inclined at an angle that is not perpendicular to the top surface of the workpiece 50. In the post-process, the power density of the laser beam L is reduced compared to that in the laser cutting process, so the workpiece 50 is processed without being cut. The amount of deviation between the processing path TP2 in the laser cutting process and the processing path TP2a in the post-process at this time is called the beam offset amount.

[0031] In both the laser cutting process shown in Figure 5 and the countersinking process shown in Figures 6 and 7, a joint 53 is used. This requires the work of separating the workpiece 52 from the scrap material 51 after the process is complete, i.e., the work of removing the joint 53, which increases the takt time. Furthermore, in the case of the countersinking process shown in Figures 6 and 7, obtaining the desired countersink angle in a subsequent process requires fine-tuning the processing conditions and trial and error, which requires sequential processing checks. This also increases the takt time.

[0032] To solve these problems in the conventional technology, the laser processing apparatus 1 according to the first embodiment performs countersinking along a spiral processing path across the area where the countersink is to be formed. FIGS. 8 and 9 are diagrams showing examples of processing paths used in countersinking with the laser processing apparatus according to the first embodiment. FIG. 8 shows a counterclockwise spiral processing path TP3 used when forming a countersink in the workpiece 50. FIG. 9 shows a clockwise spiral processing path TP4 used when forming a countersink in the workpiece 50. In both FIGS. 8 and 9, the processing paths TP3 and TP4 extend from the center of the hole to its outer periphery. Alternatively, the counterclockwise spiral processing path TP3 in FIG. 8 and the clockwise spiral processing path TP4 in FIG. 9 may be continuously combined. In this case, the order of the counterclockwise spiral processing path TP3 and the clockwise spiral processing path TP4 can be selected arbitrarily. In this way, when performing countersink machining using the laser machining apparatus 1 of embodiment 1, the direction perpendicular to the loading surface of the table 11 on which the workpiece 50 is placed is defined as the Z-axis direction, and the path of the spiral machining path within a plane perpendicular to the Z-axis direction can be any of a clockwise path, a counterclockwise path, and a path that is a continuous combination of a clockwise path and a counterclockwise path.

[0033] 10 and 11 are diagrams showing an example of a machining path of the machining head in countersink machining using the laser machining apparatus according to the first embodiment. In FIG. 10, (a) is a top view, i.e., showing the relationship between the workpiece 50 and the machining path TP5 in the XY plane, and (b) is a side view, i.e., showing the relationship between the workpiece 50 and the machining path TP5 in the ZX plane. The machining path TP5 is the path along which the emission position of the laser light L from the machining head 14 moves during machining. FIG. 10 shows a case in which the machining path TP5 is a circular spiral path within a plane, i.e., a path within the XY plane with no movement in the Z-axis direction. When machining is performed using this machining path TP5, holes of the same depth are formed.

[0034] 11, (a) is a top view, i.e., showing the relationship between the workpiece 50 and the processing path TP6 in the XY plane, and (b) is a side view, i.e., showing the relationship between the workpiece 50 and the processing path TP6 in the ZX plane. The processing path TP6 is the path of movement of the emission position of the laser light L of the processing head 14 during processing. Fig. 11 shows the case where the processing path TP6 is a three-dimensional path, i.e., a spiral path that also moves in the Z-axis direction in synchronization with a circular spiral path described by rotation around a certain point in the XY plane.

[0035] 11 is a path that runs from the center to the outer periphery in the XY plane, and in the Z-axis direction, it is a path that gradually moves away from the workpiece 50. Note that here, the machining path TP6 is a counterclockwise spiral path, but it may also be a clockwise path.

[0036] As shown in FIG. 11, machining is performed by raising or lowering the Z-axis of the machining head 14 in synchronization with the axial rotation. By machining using a single machining condition to create a spiral machining path TP6, a path is also created in the Z-axis direction, making it easier to remove the molten material. In the conventional technology shown in FIGS. 5 to 7, a joint 53 was required to change the machining conditions, such as when performing a post-process after a laser cutting process. However, in the first embodiment, countersinking can be performed by using a single machining condition along the spiral machining path TP3-TP6. In other words, because the portion to be countersinked is machined using the spiral machining path TP3-TP6, scrap material 51 is discarded as waste during machining, leaving only the processed product 52. As a result, the joint 53 required in the conventional technology is unnecessary.

[0037] The machining path TP6 shown in FIG. 11 is just one example. In one example, it may be a spiral machining path descending in the negative direction of the Z axis. In another example, it may be a path that continuously combines a spiral machining path descending in the negative direction of the Z axis and a spiral machining path TP6 ascending in the positive direction of the Z axis in FIG. 11. In this case, the order of the descending spiral machining path and the ascending spiral machining path TP6 can be selected arbitrarily. That is, in the first embodiment, the direction perpendicular to the mounting surface of the table 11 on which the workpiece 50 is placed is defined as the Z axis direction, and the path in the Z axis direction of the spiral machining path can be any of an ascending path, a descending path, and a path that continuously combines an ascending path and a descending path.

[0038] As described above, in the first embodiment, a countersink is formed by performing laser processing along a spiral processing path. In order to perform laser processing to form such a countersink, the laser processing apparatus 1 according to the first embodiment has a function of generating a processing program that results in a spiral processing path from processing conditions for forming the countersink. The processing program generation device 33 of the laser processing apparatus 1 according to the first embodiment will be described below.

[0039] 12 is a diagram showing an example of the configuration of a processing program generation device used in the laser processing apparatus according to Embodiment 1. The processing program generation device 33 includes an input unit 321, a processing condition storage unit 322, a processing program storage unit 323, a macro template data storage unit 324, a spiral processing condition acquisition unit 325, a program generation unit 326, and an output unit 327.

[0040] The input unit 321 is an interface that accepts data input to the processing program generation device 33. An example of the input unit 321 is an input interface that accepts direct input from the operator of the laser processing apparatus 1, such as a keyboard or a mouse. Alternatively, the input unit 321 may be a communication interface that accepts data from another information processing device via a communication line. The input unit 321 may also be a storage medium interface that can read a portable storage medium, such as a semiconductor memory, that stores data. The data input from the input unit 321 are processing input conditions that include processing conditions when laser processing is performed along a spiral processing path by the laser processing apparatus 1. The processing input conditions are conditions that specify the characteristics of the workpiece 50 and the countersink to be formed in the workpiece 50. Examples of the characteristics of the workpiece 50 include the material and the plate thickness. The characteristics of the countersink include the processing shape, the screw size, the countersink depth, and the countersink angle. The processing input conditions, for example, include the processing shape, the screw size, the countersink depth, the material, the plate thickness, and the countersink angle.

[0041] The machining condition storage unit 322 stores machining condition information when performing laser machining along a spiral machining path. FIG. 13 is a diagram showing an example of the machining condition information. The machining condition information includes machining content specifying conditions and spiral machining conditions. The machining content specifying conditions are information that specifies the characteristics of the workpiece 50 and the countersink to be formed in the workpiece 50. It is desirable that the machining content specifying conditions have the same content as the machining input conditions. FIG. 13 shows an example in which the machining content specifying conditions are information that includes the machining shape, screw size, countersink depth, material, plate thickness, and countersink angle.

[0042] The machining shape refers to the shape of a countersink machined by laser machining. FIG. 14 illustrates various types of countersink shapes. Countersink shapes are classified by the cross-sectional shape of the countersink. FIG. 14(a) illustrates the cross-sectional shape of a Y-shaped countersink 55Y, and FIG. 14(b) illustrates the cross-sectional shape of a V-shaped countersink 55V. As shown in FIG. 14(a), the Y-shaped countersink 55Y can be defined as a hole whose cross-sectional shape is such that, from the top surface of the workpiece 50 to a certain depth that is not the bottom surface, the side surfaces intersect with the top surface at an angle that is not perpendicular to the top surface, and from the certain depth to the bottom surface, the side surfaces are perpendicular to the bottom surface and have a constant diameter. As shown in FIG. 14(b), the V-shaped countersink 55V can be defined as a hole whose cross-sectional shape is such that, from the top surface of the workpiece 50 to the bottom surface, the side surfaces intersect with the top surface at an angle that is not perpendicular to the top surface. Returning to FIG. 13, when a Y-shaped countersink 55Y is machined, "Y" is input as the machining shape, and when a V-shaped countersink 55V is machined, "V" is input.

[0043] The screw size is the size of the screw that will be threaded into the countersink that will be formed. In one example, once the screw size is determined, the size of the countersink that will correspond to the screw head is also determined. The countersink depth is the depth of the countersink that will be formed by laser processing. The material is the material that constitutes the workpiece 50. The plate thickness is the thickness of the workpiece 50. The countersink angle is the angle between the opposing side surfaces that constitute the countersink in a cross section that passes through the center of the countersink when viewed from the direction in which the countersink is formed, as shown in Figure 14.

[0044] The spiral machining conditions are conditions for performing laser machining along a spiral machining path determined for the machining content-specific conditions. In other words, the spiral machining conditions are laser machining conditions for performing countersink machining, specified by the machining content-specific conditions, on a workpiece 50 specified by the machining content-specific conditions, i.e., for performing countersink machining along a spiral machining path. An example of the spiral machining conditions is information including output, frequency, duty, machining speed, gas type, gas pressure, focus, nozzle height, beam focus diameter, and Z-axis elevation distance, as shown in FIG. 13 . The duty is denoted as “Duty” in FIG. 13 .

[0045] The output is the output value of the laser light L. The frequency is the output frequency of the laser light L. The duty is the ratio between the on time and off time of the pulse wave of the laser light L, which continues at a specific cycle. The processing speed is the processing speed of the workpiece 50. The processing speed is the distance processed per unit time. The unit of the processing speed is mm / min. The gas type is the type of assist gas G. The gas pressure is the pressure of the assist gas G. The focal point is the position of the focal point of the laser light L when the position of the top surface of the workpiece 50 placed on the table 11 is set as the reference, i.e., 0 mm. The nozzle height is the distance in the Z-axis direction between the top surface of the workpiece 50 and the tip of the processing nozzle 15 on the table 11 side. The beam focal diameter is the beam diameter at the focal position. The Z-axis elevation distance is the elevation distance in the Z-axis direction in which the processing nozzle 15 moves during processing, i.e., parallel to the processing depth direction.

[0046] One machining content specifying condition and one spiral machining condition associated with this machining content specifying condition correspond to a machining condition. In other words, in Fig. 13, the combination of a machining content specifying condition and a spiral machining condition in one row becomes a machining condition. Then, a set of machining conditions collected for each different machining content specifying condition becomes machining condition information.

[0047] In the processing conditions, the Z-axis elevation distance may be increased to increase the beam diameter on the surface of the workpiece 50. Furthermore, when the Z-axis elevation distance is large, the focal point may be set to a negative value in order to obtain the same beam diameter as when the Z-axis elevation distance is small. The spiral processing conditions shown in Fig. 13 are, in one example, appropriate, and preferably optimal, processing conditions determined in advance through experiments when laser processing the workpiece 50 specified by the processing content specific conditions to form a countersink specified by the processing content specific conditions using a spiral processing path.

[0048] The shape of the spiral machining path is determined by the machining conditions exemplified in Fig. 13. That is, the machining conditions include items that allow the formation of a spiral machining path. The machining conditions also include an item that indicates whether the shape of the countersink is V-shaped or Y-shaped. Whether or not the Y-shaped countersink 55Y has a portion with a constant diameter is determined from the values ​​of the machining shape, thread size, and countersink depth items in the machining condition information in Fig. 13.

[0049] 12, the processing program storage unit 323 stores a processing program for the base, which is a computer program that includes the processing position for the countersinking and does not describe a spiral processing path. The processing program for the base is, for example, a numerical control (NC) program. For example, the processing program for the base is created in advance by an operator who performs the countersinking using the laser processing device 1.

[0050] The macro template data storage unit 324 stores macro template data, which is a computer program with preset machining procedures for performing machining along a spiral machining path. The macro template data is a program that defines the movement of the machining head 14 along the spiral machining path using parameters included in the machining input conditions and spiral machining conditions. In other words, the macro template data can be considered a program that expresses the position of the machining head 14 along the spiral machining path using parameters included in the machining input conditions and spiral machining conditions. Then, by substituting the values ​​of the parameters included in the machining input conditions and spiral machining conditions corresponding to each parameter of the macro template data, a macro is generated, which is a program that forms a countersink having the size and shape specified by the machining input conditions. In the macro template data, the spiral machining path is expressed using G2 or G3 codes, which are rotation correction commands.

[0051] When forming a countersink, a piercing command is required to drill a pierce hole at the position where the countersink is to be formed before laser processing along the spiral processing path. The piercing command may be written before the processing block in the macro template data that describes the laser processing along the spiral processing path, or the piercing command may not be written in the macro template data, and may be written immediately before registering the macro for the underlying processing program.

[0052] Furthermore, in macro template data for executing Y-shaped countersink machining, a processing block describing laser machining processing for forming a hole of constant diameter below the countersink may be included before or after a processing block describing laser machining processing along a spiral machining path, or the macro template data may not describe a processing block for forming a hole of constant diameter below the countersink, and the underlying machining program may describe a processing block for forming a hole of constant diameter below the countersink. In one example, the macro template data is stored in the macro template data storage unit 324 for each machining shape.

[0053] The spiral machining condition acquisition unit 325 refers to machining condition information including a plurality of machining content specifying conditions and spiral machining conditions defined for each of the plurality of machining content specifying conditions, and acquires from the machining condition information the spiral machining conditions associated with the machining content specifying conditions that match the machining input conditions.

[0054] Furthermore, when the machining condition information does not contain machining content specifying conditions that match the machining input conditions, the spiral machining condition acquisition unit 325 acquires two different machining conditions from the machining condition information, performs linear interpolation between the two acquired machining conditions, and calculates spiral machining conditions for the machining input conditions. In one example, the spiral machining condition acquisition unit 325 acquires two machining input conditions whose countersink angles differ from those of the machining input conditions. At this time, it is desirable to acquire two machining conditions whose countersink angles are closest to the countersink angle entered in the machining input conditions. It is also desirable that the machining content specifying conditions other than the countersink angle match or are close to the machining input conditions. In one example, it is desirable to acquire machining conditions whose machining shape is the same.

[0055] A specific example of linear interpolation for machining conditions will be described. When machining input conditions in which the countersink angle is 40° are input, FIG. 13 does not include machining conditions in which the countersink angle is 40°. In this case, the first machining condition in FIG. 13 in which the countersink angle is 30° and the second machining condition in which the countersink angle is 45° are obtained. Then, assuming that there is a linear relationship between the countersink angle and each item of the spiral machining conditions, the value of the machining item of the spiral machining conditions when the countersink angle is 40° is calculated.

[0056] The program generation unit 326 generates a processing program for performing laser processing along a spiral processing path using the acquired or calculated spiral processing conditions. Specifically, the program generation unit 326 acquires macro template data from the macro template data storage unit 324. The macro template data is a program for performing laser processing in which commands for moving the processing head 14 along the spiral processing path are expressed using the processing input conditions and items of the spiral processing conditions in the processing condition information as parameters. The program generation unit 326 generates a macro by inputting values ​​of corresponding items of the processing input conditions and the spiral processing conditions acquired or calculated by the spiral processing condition acquisition unit 325 into the parameters of the acquired macro template data.

[0057] The program generation unit 326 acquires a base machining program corresponding to the machining input conditions from the machining program storage unit 323, and registers the generated macro in the acquired base machining program to generate a machining program. In one example, the macro is registered at the machining position of a countersink in the base machining program. As a result, when the machining program is executed and the countersink machining position is read, the macro registered at the machining position is executed, and countersink machining is performed using the spiral machining path registered in the macro.

[0058] The output unit 327 outputs the machining program generated by the program generation unit 326 to the device control unit 31 and the axis movement control unit 32. The device control unit 31 controls the operations of the laser oscillator 12 and the machining gas supply unit 16 in accordance with the machining program. The axis movement control unit 32 controls the drive unit 20 so that the machining head 14 moves along a spiral machining path in accordance with the machining program.

[0059] Next, a laser processing method using the laser processing apparatus 1 configured as described above will be described. The laser processing method according to the first embodiment is basically a method of irradiating the workpiece 50 with laser light L emitted from the laser oscillator 12 from a processing head 14 that is movable in the directions of three mutually perpendicular axes, thereby performing countersinking on the workpiece 50. The laser processing method according to the first embodiment irradiates the workpiece 50 with laser light L by moving the processing head 14 so that the processing path, which is the movement path of the processing head 14 relative to the workpiece 50, becomes a spiral processing path. The specific contents of this laser processing method will be described below using a flowchart.

[0060] 15 and 16 are flowcharts showing an example of the procedure of the laser processing method according to the first embodiment. First, the input unit 321 accepts input of processing input conditions by the operator (step S11). In this case, the processing input conditions include the processing shape, screw size, countersink depth, material, plate thickness, and countersink angle. The processing shape is information specifying whether it is a Y-shape or a V-shape. The screw size and countersink depth are information specifying the size and depth of the countersink to be formed, respectively. The material and plate thickness are information specifying the workpiece 50. The countersink angle is information specifying the angle of the countersink to be formed. In other words, the processing input conditions can be said to be information specifying the size and shape of the countersink to be formed and the characteristics of the material of the workpiece 50.

[0061] Next, the spiral processing condition acquisition unit 325 searches the processing condition memory unit 322 for processing content specification conditions that match the input processing input conditions (step S12), and determines whether the processing content specification conditions that match the processing input conditions are in the processing condition memory unit 322 (step S13).

[0062] If the machining condition storage unit 322 contains machining content specifying conditions that match the machining input conditions (Yes in step S13), the spiral machining condition acquisition unit 325 acquires the spiral machining conditions corresponding to the machining content specifying conditions that match the machining input conditions from the machining condition storage unit 322 (step S14). In this case, the spiral machining conditions include the output, frequency, duty, machining speed, gas type, gas pressure, focus, nozzle height, beam focus diameter, and Z-axis elevation distance.

[0063] On the other hand, if the machining condition storage unit 322 does not contain any machining content specifying conditions that match the machining input conditions (No in step S13), the spiral machining condition acquisition unit 325 acquires two different machining conditions from the machining condition storage unit 322 (step S15). At this time, it is desirable that the spiral machining condition acquisition unit 325 acquires machining conditions with different countersink angles. Next, the spiral machining condition acquisition unit 325 performs linear interpolation using the two acquired machining conditions to calculate the spiral machining conditions that correspond to the machining input conditions (step S16).

[0064] Thereafter, or after step S14, the program generation unit 326 acquires the base machining program from the machining program storage unit 323 (step S17), and acquires the machining positions of the countersinks from the base machining program (step S18). In addition, the program generation unit 326 acquires macro template data from the macro template data storage unit 324 (step S19).

[0065] The program generation unit 326 inputs the acquired or calculated spiral machining conditions into parameters using the machining input conditions and spiral machining conditions defined in the macro template data, and generates a macro corresponding to the machining input conditions (step S20).The program generation unit 326 then generates a machining program corresponding to the machining input conditions registered in the machining position of the countersink in the machining program for the base material using the generated macro (step S21).The output unit 327 outputs the machining program with the registered macro to the device control unit 31 and the axis movement control unit 32 (step S22).

[0066] Thereafter, the device control unit 31 and the axis movement control unit 32 execute the countersinking process in accordance with the machining program in which the macro is registered (step S23). At this time, the machining program is executed sequentially, and when the processing position in the machining program reaches the countersinking process position, the registered macro is executed, and the countersinking process is performed by laser machining along the spiral machining path by the macro. Also, during countersinking, after the workpiece 50 is drilled by piercing, the countersinking process is performed along the spiral machining path. When the countersinking process is completed, the process ends.

[0067] Steps S11 to S22 show the procedure for generating a machining program, and correspond to a machining program generation method.

[0068] In the above description, the macro template data storage unit 324 may store one macro template data corresponding to all the machining conditions stored in the machining condition storage unit 322, or may store multiple types of macro template data. In the latter case, the macro template data storage unit 324 may store macro template data for each machining shape, or may store macro template data for each type classified by other criteria.

[0069] Next, a hardware configuration for realizing the control device 30 of the laser processing apparatus 1 according to the first embodiment will be described. The control device 30 functions as the control device 30 when a computer system executes a program, which is a computer program describing the processing to be performed by the control device 30, on the computer system. FIG. 17 is a block diagram showing an example of the configuration of a computer system for realizing the control device of the laser processing apparatus according to the first embodiment. As shown in FIG. 17, this computer system includes a control unit 901, an input unit 902, a storage unit 903, a display unit 904, a communication unit 905, and an output unit 906, which are connected via a system bus 907.

[0070] In FIG. 17 , the control unit 901 is, for example, a processor such as a CPU (Central Processing Unit) that executes a program describing the processing in the control device 30. The input unit 902 is, for example, composed of a keyboard, a mouse, etc., and is used by an operator of the computer system to input various information. The memory unit 903 includes various types of memory such as RAM (Random Access Memory) and ROM (Read Only Memory) and a storage device such as a hard disk, and stores programs to be executed by the control unit 901, necessary data obtained during processing, etc. The memory unit 903 is also used as a temporary storage area for programs. The display unit 904 is, for example, composed of a display, a liquid crystal display panel, etc., and displays various screens to the operator of the computer system. For example, the input unit 902 and the display unit 904 may be configured as a touch panel integrally formed with each other. The communication unit 905 is a receiver and a transmitter that perform communication processing. The output unit 906 is, for example, a printer, a speaker, etc. Note that FIG. 17 is just an example, and the configuration of the computer system is not limited to the example of FIG.

[0071] Here, an example of the operation of the computer system until the program is ready to be executed will be described. In the computer system having the above configuration, for example, a program is installed in storage unit 903 from a CD-ROM or DVD-ROM inserted in a CD (Compact Disc)-ROM drive or DVD (Digital Versatile Disc)-ROM drive (not shown). Then, when the program is executed, the program read from storage unit 903 is stored in the main storage area of ​​storage unit 903. In this state, control unit 901 executes processing as control device 30 in accordance with the program stored in storage unit 903.

[0072] In the above description, a program describing the processing in the control device 30 is provided using a CD-ROM or DVD-ROM as a recording medium, but this is not limited to this. Depending on the configuration of the computer system, the capacity of the program to be provided, etc., it is also possible to use a program provided via a transmission medium such as the Internet via the communication unit 905.

[0073] The device control unit 31 and axis movement control unit 32 shown in FIG. 1, and the spiral machining condition acquisition unit 325 and program generation unit 326 of the machining program generation device 33 shown in FIG. 12 are realized by the control unit 901 shown in FIG. 17 executing the programs stored in the memory unit 903 shown in FIG. 17. The device control unit 31 and axis movement control unit 32 shown in FIG. 1, and the spiral machining condition acquisition unit 325 and program generation unit 326 of the machining program generation device 33 shown in FIG. 12 are realized by the memory unit 903 shown in FIG. 17. The input unit 321 of the machining program generation device 33 shown in FIG. 12 is realized by the input unit 902 shown in FIG. 17. The output unit 327 of the machining program generation device 33 shown in FIG. 12 is realized by the communication unit 905 shown in FIG. 17. The machining condition storage unit 322, machining program storage unit 323, and macro template data storage unit 324 shown in FIG. 12 are realized by the storage unit 903 shown in FIG. 17.

[0074] 1 shows an example in which the machining program generating device 33 is included in the control device 30, but it may be realized by an external computer system separate from the control device 30. In this case, the computer system constituting the machining program generating device 33 has, for example, the configuration shown in FIG.

[0075] Next, the effects of the laser processing apparatus 1 according to the first embodiment compared with the conventional technology will be described. FIG. 18 is a diagram comparing the countersink processing performed by the laser processing method according to the first embodiment with the countersink processing performed by the conventional technology. In the countersink processing performed by the conventional laser cutting process, first, as shown in step S31, laser cutting is performed by irradiating the workpiece 50 with laser light L of a first power density along a circular processing path with a portion missing, as shown in step S32. As a result, a joint 53 is left between the workpiece 52 and the scrap 51, as shown in step S32. At this time, the workpiece 50 is cut by a single irradiation of the laser light L. Furthermore, the size of the circular scrap 51 formed at this time is approximately the same as the diameter of the smallest part of the countersink to be formed.

[0076] Next, as shown in step S33, the cut portion is irradiated with laser light L of a second power density to perform countersinking. At this time, it is sequentially confirmed whether the countersink angle is appropriate. Then, once a countersink with the desired countersink angle is formed, as shown in step S34, joint 53 connecting workpiece 52 and scrap material 51 is removed, and workpiece 52 with a countersink is obtained.

[0077] On the other hand, in the countersinking process according to the first embodiment, as shown in step S23, the countersinking process is performed by irradiating the workpiece 50 with laser light L along a spiral processing path. By performing laser processing along the spiral processing path, in the portion corresponding to the scrap material 51 of the conventional technology, the scrap material 51 becomes processing waste and is discharged during processing, leaving only the processed product 52. As a result, when the countersinking process is completed, a countersink is formed in the portion that was the processing path.

[0078] As described above, in the conventional countersinking process, when forming a workpiece 52 having a countersink, the following steps are performed: cutting the workpiece 50 with laser light L at a first power density while leaving the joint 53; countersinking the workpiece 50 with laser light L at a second power density; and removing the joint 53. In contrast, in the countersinking process according to the first embodiment, the countersink can be formed in the workpiece 50 in a single step. In other words, in the countersinking process according to the first embodiment, it is not necessary to change the power density of the laser light L between the start and end of the countersink formation. In other words, unlike the conventional countersinking process, it is not necessary to switch the power density of the laser light L to perform the laser cutting process and the countersinking process. In this way, in the countersinking process according to the first embodiment, the laser cutting process and the countersinking process can be performed simultaneously on the workpiece 50.

[0079] Furthermore, in the countersink machining according to the first embodiment, there is no need to provide joint 53, and therefore there is no need to remove joint 53. In other words, there is no need for the work time involved in removing joint 53. As a result, with the laser machining apparatus 1 and the laser machining method according to the first embodiment, the processing in the countersink machining can be simplified compared to the conventional method, and therefore the takt time can be reduced compared to the conventional method.

[0080] Furthermore, in conventional countersink machining, it is necessary to check the countersink angle after each machining operation, which increases the takt time. However, the laser machining apparatus 1 and laser machining method according to the first embodiment use macro template data, which is a program containing movement commands along a spiral machining path using parameters representing machining input conditions and spiral machining conditions when machining a countersink along a spiral machining path. This macro template data can also include a parameter for the countersink angle. Therefore, by substituting the values ​​of the machining input conditions and spiral machining conditions into the parameters of the macro template data, a macro for countersink machining according to the machining input data is generated. By registering this macro in the machining program for the base material, the laser machining apparatus 1 can perform laser machining according to the machining conditions and form a countersink with the countersink angle specified by the machining input conditions. As a result, it is no longer necessary to check the countersink angle each time a countersink is machined, as in the conventional method, thereby reducing the takt time during countersink machining.

[0081] Furthermore, when processing input conditions are input, the spiral processing condition acquisition unit 325 acquires or calculates spiral processing conditions according to the processing input conditions, and the program generation unit 326 generates a macro, which is a program for forming a countersink having a shape that satisfies the processing input conditions. This allows even an operator who is not familiar with creating processing programs for the laser processing device 1 to form a desired countersink simply by inputting the processing input conditions.

[0082] Furthermore, in conventional countersink machining, a straight or curved pierce line is required to reach the circular machining path with a missing portion after piercing. However, in countersink machining according to the first embodiment, after piercing, the machining head 14 can be moved along the spiral machining path without using a pierce line. In this way, in countersink machining according to the first embodiment, the configuration of the machining program can be simplified compared to conventional techniques.

[0083] Furthermore, the machining program generated by the program generation unit 326 moves the machining head 14 along a spiral machining path. By irradiating the laser light L while moving the machining head 14 along the spiral machining path, machining waste is discharged along the machining path, resulting in the formation of a countersink. In other words, the laser machining apparatus 1 according to the first embodiment can generate a machining program that includes a machining path that does not include a joint 53.

[0084] As described above, the laser processing apparatus 1 according to the first embodiment includes the laser oscillator 12 that emits the laser beam L, the processing head 14 that irradiates the laser beam L onto the workpiece 50, the drive unit 20 that can drive the processing head 14 in each direction of three mutually perpendicular axes, and the axis movement control unit 32 that controls the operation of the drive unit 20 to move the position of the processing head 14 in accordance with a processing program that irradiates the workpiece 50 with the laser beam L to process the workpiece 50. Furthermore, the axis movement control unit 32 controls the drive unit 20 to move the processing head 14 during laser processing so that the processing path, which is the movement path of the processing head 14 relative to the workpiece 50, becomes a spiral processing path.

[0085] Furthermore, in the laser processing method according to the first embodiment, the workpiece 50 is processed by irradiating the laser light L emitted from the laser oscillator 12 from the processing head 14, which is movable in the directions of three mutually perpendicular axes, onto the workpiece 50. Then, the processing head 14 is moved so that the processing path, which is the movement path of the processing head 14 relative to the workpiece 50, becomes a spiral processing path, and the laser light L is irradiated onto the workpiece 50.

[0086] This has the effect of shortening the takt time compared to the conventional method when machining a countersink in the workpiece 50. In particular, since the laser machining does not form a joint 53 in the workpiece 50 and it is not necessary to remove the joint 53, the time required for post-processing can be reduced compared to the conventional technology.

[0087] Furthermore, in the laser processing apparatus 1 and laser processing method according to the first embodiment, spiral processing conditions corresponding to the processing content specifying conditions are determined in advance and stored as processing condition information. The spiral processing conditions are optimal conditions for forming a countersink specified by the processing content specifying conditions, which are determined in advance through experiments. Therefore, by obtaining spiral processing conditions corresponding to the processing content specifying conditions that match the processing content input conditions, there is also the effect of eliminating the need for time-consuming condition adjustments during laser processing.

[0088] The machining program generation device 33 according to the first embodiment is a device that generates a machining program for irradiating the workpiece 50 with laser light L while moving the machining head 14 along a spiral machining path, and includes an input unit 321, a spiral machining condition acquisition unit 325, and a program generation unit 326. The input unit 321 accepts machining input conditions that specify the characteristics of the workpiece 50 and the countersink to be formed in the workpiece 50. The spiral machining condition acquisition unit 325 references machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece 50 and the countersink to be formed in the workpiece 50 with spiral machining conditions that are conditions for performing laser machining along a spiral machining path, and acquires spiral machining conditions that match the machining content specifying conditions. The program generation unit 326 generates a machining program for performing laser machining along a spiral machining path using the machining input conditions and the acquired spiral machining conditions.

[0089] The machining program generation program according to the first embodiment is a program for generating a machining program for irradiating the workpiece 50 with laser light L while moving the machining head 14 along a spiral machining path. The machining program generation program causes a computer to execute an input step, a spiral machining condition acquisition step, and a program generation step. The input step accepts machining input conditions that specify the workpiece 50 and the characteristics of the countersink to be formed in the workpiece 50. The spiral machining condition acquisition step refers to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece 50 and the countersink to be formed in the workpiece 50 with spiral machining conditions that are conditions for performing laser machining along a spiral machining path, and acquires spiral machining conditions that correspond to the machining content specifying conditions that match the machining input conditions. The program generation step generates a machining program for performing laser machining along a spiral machining path using the machining input conditions and the acquired spiral machining conditions.

[0090] This has the effect of enabling the generation of a machining program that shortens the takt time compared to conventional methods when drilling holes in the workpiece 50. In addition, since a machining program that forms a countersink that satisfies the machining input conditions can be generated simply by inputting the machining input conditions, it has the effect that even an operator who is not skilled in creating machining programs can obtain a machining program that forms a countersink having a desired size and shape.

[0091] Furthermore, in the machining program generation device 33 and the machining program generation program according to the first embodiment, spiral machining conditions corresponding to the machining content specifying conditions are determined in advance and stored as machining condition information. The spiral machining conditions are optimal conditions for forming a countersink specified by the machining content specifying conditions, which are determined in advance through experiments. Therefore, by obtaining spiral machining conditions corresponding to the machining content specifying conditions that match the machining content input conditions, there is also the effect of eliminating the need for time-consuming condition adjustments by laser machining.

[0092] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, or different embodiments may be combined with each other. It is also possible to omit or modify parts of the configurations as long as they do not deviate from the gist of the invention. [Explanation of symbols]

[0093] 1 laser processing device, 11 table, 12 laser oscillator, 13 fiber cable, 14 processing head, 15 processing nozzle, 16 processing gas supply unit, 17 gas piping, 18 drive shaft, 19 motor, 20 drive unit, 20X X-axis drive unit, 20Y Y-axis drive unit, 20Z Z-axis drive unit, 30 control device, 31 device control unit, 32 axis movement control unit, 33 processing program generation device, 50 processing object, 51 scrap material, 52 processed product, 53 joint, 55V V-shaped countersink, 55Y Y-shaped countersink, 141 flow path, 321, 902 input unit, 322 processing condition memory unit, 323 processing program memory unit, 324 macro template data memory unit, 325 spiral processing condition acquisition unit, 326 program generation unit, 327, 906 output unit, 901 Control unit, 903 memory unit, 904 display unit, 905 communication unit, 907 system bus, G assist gas, L laser light, P processing point.

Claims

1. a laser oscillator that emits laser light; a processing head that irradiates the laser light onto an object to be processed; a driving device capable of driving the processing head in each direction of three axes perpendicular to each other; an axial movement control unit that controls the operation of the drive device to move the position of the machining head in accordance with a machining program for irradiating the workpiece with the laser light and machining the workpiece; an input unit that receives processing input conditions that specify features of the workpiece and a countersink to be formed in the workpiece; a spiral machining condition acquisition unit that refers to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along a spiral machining path defined for the machining content specifying conditions, and acquires the spiral machining conditions that are associated with the machining content specifying conditions that match the machining input conditions; a program generating unit that generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the acquired spiral machining conditions; Equipped with when the machining condition information does not contain the machining content specifying condition that matches the machining input condition, the spiral machining condition acquisition unit acquires two different machining conditions from the machining condition information, performs linear interpolation on the two acquired machining conditions, and calculates spiral machining conditions for the machining input condition; the program generation unit generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the calculated spiral machining conditions; The axis movement control unit performs control based on the processing program generated by the program generation unit, and controls the drive unit to move the processing head so that the processing path, which is the movement path of the processing head relative to the workpiece, becomes a spiral processing path during laser processing.

2. a laser oscillator that emits laser light; a processing head that irradiates the laser light onto an object to be processed; a driving device capable of driving the processing head in each direction of three axes perpendicular to each other; an axial movement control unit that controls the operation of the drive device to move the position of the machining head in accordance with a machining program for irradiating the workpiece with the laser light and machining the workpiece; an input unit that accepts processing input conditions that specify characteristics of the workpiece, including a material and a plate thickness, and characteristics of a countersink to be formed in the workpiece, including a processing shape of the countersink, a screw size, a countersink depth, and a countersink angle; a spiral machining condition acquisition unit that refers to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along a spiral machining path defined for the machining content specifying conditions, and acquires the spiral machining conditions that are associated with the machining content specifying conditions that match the machining input conditions; a program generating unit that generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the acquired spiral machining conditions; Equipped with when the machining condition information does not contain the machining content specifying condition that matches the machining input condition, the spiral machining condition acquisition unit acquires two different machining conditions from the machining condition information, performs linear interpolation on the two acquired machining conditions, and calculates spiral machining conditions for the machining input condition; the program generation unit generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the calculated spiral machining conditions; The axis movement control unit performs control based on the processing program generated by the program generation unit, and controls the drive unit to move the processing head so that the processing path, which is the movement path of the processing head relative to the workpiece, becomes a spiral processing path during laser processing.

3. The laser processing apparatus of claim 1 or 2, characterized in that the program generation unit generates the processing program in which a macro is registered, which is generated by inputting values ​​of corresponding items of the processing input conditions and the spiral processing conditions acquired by the spiral processing condition acquisition unit into the parameters of macro template data, which is a program defined so that the processing head moves along the spiral processing path using items included in the processing input conditions and the spiral processing conditions as parameters.

4. 3. The laser processing device according to claim 1, wherein the processing input conditions and the processing content specifying conditions include an item indicating whether the shape of the countersink is a V-shape or a Y-shape.

5. The laser processing apparatus according to claim 1 or 2, characterized in that the direction perpendicular to the support surface of the table on which the workpiece is placed is defined as the Z-axis direction, and the path in the Z-axis direction of the spiral processing path is either an ascending path, a descending path, or a path that is a continuous combination of an ascending path and a descending path.

6. 3. The laser processing apparatus according to claim 1, wherein the direction perpendicular to the support surface of the table on which the workpiece is placed is defined as the Z-axis direction, and the path of the spiral processing path within the plane perpendicular to the Z-axis direction is either a clockwise path, a counterclockwise path, or a path that is a continuous combination of a clockwise path and a counterclockwise path.

7. The laser processing apparatus according to claim 1 or 2, characterized in that the direction perpendicular to the loading surface of the table on which the workpiece is placed is the Z-axis direction, and the path of the spiral processing path within a plane perpendicular to the Z-axis direction is a path from the center to the outer periphery.

8. A machining program generation device that generates a machining program for irradiating a workpiece with laser light while moving a machining head along a spiral machining path, an input unit that receives processing input conditions that specify features of the workpiece and a countersink to be formed in the workpiece; a spiral machining condition acquisition unit that refers to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along the spiral machining path, and acquires the spiral machining conditions that are associated with the machining content specifying conditions that match the machining input conditions; a program generating unit that generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the acquired spiral machining conditions; Equipped with when the machining condition information does not contain the machining content specifying condition that matches the machining input condition, the spiral machining condition acquisition unit acquires two different machining conditions from the machining condition information, performs linear interpolation on the two acquired machining conditions, and calculates spiral machining conditions for the machining input condition; The processing program generation device is characterized in that the program generation unit generates the processing program for performing the laser processing along the spiral processing path using the processing input conditions and the calculated spiral processing conditions.

9. A machining program generation device that generates a machining program for irradiating a workpiece with laser light while moving a machining head along a spiral machining path, an input unit that accepts processing input conditions that specify characteristics of the workpiece, including a material and a plate thickness, and characteristics of a countersink to be formed in the workpiece, including a processing shape of the countersink, a screw size, a countersink depth, and a countersink angle; a spiral machining condition acquisition unit that refers to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along the spiral machining path, and acquires the spiral machining conditions that are associated with the machining content specifying conditions that match the machining input conditions; a program generating unit that generates the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the acquired spiral machining conditions; Equipped with when the machining condition information does not contain the machining content specifying condition that matches the machining input condition, the spiral machining condition acquisition unit acquires two different machining conditions from the machining condition information, performs linear interpolation on the two acquired machining conditions, and calculates spiral machining conditions for the machining input condition; The processing program generation device is characterized in that the program generation unit generates the processing program for performing the laser processing along the spiral processing path using the processing input conditions and the calculated spiral processing conditions.

10. The machining program generation device according to claim 8 or 9, characterized in that the program generation unit generates the machining program in which a macro is registered, which is generated by inputting values ​​of corresponding items of the machining input conditions and the spiral machining conditions acquired by the spiral machining condition acquisition unit into the parameters of macro template data, which is a program defined so that the machining head moves along the spiral machining path using items included in the machining input conditions and the spiral machining conditions as parameters.

11. A laser processing method for processing an object by irradiating the object with laser light emitted from a laser oscillator from a processing head movable in directions of three mutually orthogonal axes, the method comprising: an input step of receiving machining input conditions that specify characteristics of the workpiece and a countersink to be formed in the workpiece; a spiral machining condition acquisition step of referring to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along a spiral machining path, and acquiring the spiral machining conditions that correspond to the machining content specifying conditions that match the machining input conditions; a program generation step of generating a processing program for performing the laser processing along the spiral processing path using the processing input conditions and the acquired spiral processing conditions; a processing step of irradiating the laser light onto the workpiece by moving the processing head in accordance with the processing program so that a processing path, which is a movement path of the processing head relative to the workpiece, becomes a spiral processing path; Including, In the spiral machining condition acquisition step, when the machining content specifying condition that matches the machining input condition is not present in the machining condition information, two different machining conditions are acquired from the machining condition information, linear interpolation is performed on the two acquired machining conditions, and spiral machining conditions for the machining input condition are calculated; A laser processing method characterized in that in the program generation step, the processing program for performing the laser processing along the spiral processing path is generated using the processing input conditions and the calculated spiral processing conditions.

12. A machining program generation program that generates a machining program for machining an object by irradiating the object with laser light while moving a machining head along a spiral machining path, On the computer, an input step of receiving machining input conditions that specify characteristics of the workpiece and a countersink to be formed in the workpiece; a spiral machining condition acquisition step of referring to machining condition information including a plurality of machining conditions that associate machining content specifying conditions that specify the characteristics of the workpiece and the countersink to be formed in the workpiece with spiral machining conditions that are conditions for performing laser machining along the spiral machining path, and acquiring the spiral machining conditions that correspond to the machining content specifying conditions that match the machining input conditions; a program generation step of generating the machining program for performing the laser machining along the spiral machining path using the machining input conditions and the acquired spiral machining conditions; Execute In the spiral machining condition acquisition step, when the machining content specifying condition that matches the machining input condition is not present in the machining condition information, two different machining conditions are acquired from the machining condition information, linear interpolation is performed on the two acquired machining conditions, and spiral machining conditions for the machining input condition are calculated; A processing program generation program characterized in that, in the program generation step, the processing program for performing the laser processing along the spiral processing path is generated using the processing input conditions and the calculated spiral processing conditions.

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