Curable composition, cured film using the same, optical filter, image display device, solid-state imaging device, and infrared sensor

Abstract

To provide a curable composition which can form a cured film having an excellent resistance to a solvent, to high temperature and high moisture, and to a heat cycle even when the composition is cured at low temperatures.SOLUTION: The curable composition includes: a near-infrared absorption dye (A); a radical polymerizable compound (B); a radical polymerization initiator (C); a thermal curable compound (D); and a hardening accelerator (E). The hardening accelerator (E) includes at least two types of imidazole compounds.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a curable composition and its use. [Background technology]

[0002] Video cameras, digital cameras, smartphones, and the like use solid-state imaging devices for color images, such as CCDs (charge-coupled devices) and CMOSs ​​(complementary metal-oxide semiconductors). The light-receiving sections of these solid-state imaging devices use silicon photodiodes that are sensitive to infrared light, so luminosity correction is required, and an infrared cut filter or the like is provided. The infrared cut filter is manufactured using, for example, a curable composition containing a near-infrared absorbing dye.

[0003] Near-infrared absorbing dyes generally have low heat resistance. Therefore, it is preferable to produce an infrared cut filter by curing a curable composition containing a near-infrared absorbing dye at a low temperature, for example, 130°C or lower. However, when curing is performed at a low temperature, the curing does not proceed sufficiently, resulting in problems such as deterioration of the solvent resistance of the cured film and resistance in a high-temperature, high-humidity environment. In addition, since infrared cut filters are used in environments with temperature differences, they are required to have heat cycle resistance.

[0004] For example, Patent Document 1 discloses a composition containing an infrared absorbing dye and a resin with a glass transition temperature of 150 to 300°C as a composition with improved heat resistance. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2019 / 058882 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in Patent Document 1, curing is carried out at 200° C., and the resistance of the cured film when cured at low temperatures is not sufficient.

[0007] An object of the present invention is to provide a curable composition that can form a cured film that has excellent solvent resistance, high temperature and humidity resistance, and heat cycle resistance even when cured at low temperature. [Means for solving the problem]

[0008] The present invention provides a curable composition comprising a near-infrared absorbing dye (A), a radical polymerizable compound (B), a radical polymerization initiator (C), a thermosetting compound (D), and a curing accelerator (E), The curable composition further comprises the curing accelerator (E) containing at least two imidazole compounds. [Effects of the Invention]

[0009] According to the present invention, there is provided a curable composition capable of forming a cured film having excellent solvent resistance, high-temperature / high-humidity resistance, and heat cycle resistance even when cured at low temperature. The present invention also provides a cured film, an optical filter, an image display device, a solid-state imaging device, and an infrared sensor. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor provided with a cured film. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments for carrying out the curable composition of the present invention will be described in detail. Note that the present invention is not limited to the following embodiments, and can be modified and carried out within a range that can solve the problems.

[0012] In this specification, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Furthermore, "CI" refers to the Color Index (CI; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of a compound in the present invention, for a low-molecular-weight compound whose molecular weight can be specified, the molecular weight is a calculated value (formula weight) or a molecular weight measured by ESI-MS (electrospray ionization mass spectrometry), and for a compound having a molecular weight distribution, the molecular weight is a weight-average molecular weight in terms of polystyrene measured by gel permeation chromatography using tetrahydrofuran as a solvent. A monomer is a compound that polymerizes to form a resin. A monomer is in an unreacted state, and a monomer unit is a monomer that forms a resin after polymerization.

[0013] <Curable composition> A curable composition according to one embodiment of the present invention is a curable composition comprising a near-infrared absorbing dye (A), a radical polymerizable compound (B), a radical polymerization initiator (C), a thermosetting compound (D), and a curing accelerator (E), The curing accelerator (E) is characterized in that it contains at least two imidazole compounds. The two imidazole compounds have different molecular structures, and therefore different reaction temperatures and rates. Therefore, the mechanism by which the curable composition having the above-mentioned configuration can solve the problems of the present invention is presumed to be as follows.

[0014] The imidazole compound first reacts with the thermosetting compound (first stage). After that, the reaction product of the imidazole compound and the thermosetting compound further reacts with the thermosetting compound and polymerizes (second stage). The reaction initiation temperature of the first stage and the reaction rate of the second stage differ depending on the structure of the imidazole compound. It is speculated that by combining an imidazole compound with a low reaction initiation temperature of the first stage and an imidazole compound with a fast reaction rate of the second stage, hardening proceeds even at low temperatures and resistance is improved.

[0015] Components that are or can be included in the curable composition of one embodiment will be described in detail below.

[0016] [Near-infrared absorbing dye (A)] The curable composition of the present invention contains a near-infrared absorbing dye (A).

[0017] The near-infrared absorbing colorant (A) is a compound having a maximum absorption in the wavelength range of 700 to 2,000 nm, and may be a pigment (also called a near-infrared absorbing pigment) or a dye (also called a near-infrared absorbing dye). A near-infrared absorbing pigment and a near-infrared absorbing dye may also be used in combination. From the viewpoints of heat resistance and light resistance, a near-infrared absorbing pigment is preferred. In this specification, the near-infrared absorbing pigment preferably has a solubility in 100 g of propylene glycol monomethyl ether acetate at 25° C. of less than 2 g, more preferably less than 1 g, and particularly preferably 0.5 g or less.

[0018] Examples of the near-infrared absorbing dye (A) include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, indigo compounds, immonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squarylium compounds, croconium compounds, etc. Among these, from the viewpoints of near-infrared absorbing ability, heat resistance, and light resistance, it is preferable to include at least one compound selected from the group consisting of naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds, and it is more preferable to include an indigo compound or a naphthalocyanine compound.

[0019] Cyanine compounds are disclosed in WO 2006 / 006573, WO 2010 / 073857, JP 2013-241598, JP 2016-113501, JP 2016-113504, etc.; phthalocyanine compounds are disclosed in JP 4-23868, JP 06-192584, JP 2000-63691, WO 2014 / 208514, etc. Naphthalocyanine compounds are disclosed in JP-A-11-152414, JP-A-2000-86919, JP-A-2009-29955, WO 2018 / 186490, etc.; indigo compounds are disclosed in JP-A-2012-224593, JP-A-2013-87233, JP-A-2013-230412, etc.; immonium compounds are disclosed in JP-A-2005-336150, JP-A-20 Anthraquinone compounds are disclosed in JP-A-62-903 and JP-A-1-172458, etc.; pyrrolopyrrole compounds are disclosed in JP-A-2009-263614, JP-A-2010-90313, JP-A-2011-068731, JP-A-2014-130348, WO 2015 / 166873, etc.; squari Examples of sodium compounds include those described in JP 2011-132361 A, JP 2016-142891 A, WO 2017 / 135359 A, WO 2018 / 225837 A, JP 2019-001987 A, WO 2020 / 054718 A, WO 2021 / 029195 A, and the like; examples of croconium compounds include those described in WO 2019 / 021767 A, and the like.

[0020] (Squarylium compounds) The squarylium compound is preferably a compound represented by the following general formula (4).

[0021] General formula (4) [ka]

[0022] In general formula (4), R 1 ~R 4each independently represents a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 10 , -COR 11 , -COOR 12 , -OCOR 13 , -NR 14 R 15 , -NHCOR 16 , -CONR 17 R 18 , -NHCONR 19 R 20 , -NHCOOR 21 , -SR 22 , -SO2R 23 , -SO2OR 24 , -NHSO2R 25 , -SO2NR 26 R 27 , -B(OR 28 )2, and -NHBR 29 R 30 Represents R 10 ~R 30 each independently represents a hydrogen atom, an alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 12 R 12 When -SO2OR is a hydrogen atom (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 24 R 24 When R is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may be dissociated (i.e., a sulfonate group) or may be in the form of a salt. 1 and R 2 , R 3 and R 4 may be bonded to each other to form a ring.

[0023] The "substituent" may be a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 100 , -COR 101 , -COOR 102, -OCOR 103 , -NR 104 R 105 , -NHCOR 106 , -CONR 107 R 108 , -NHCONR 109 R 110 , -NHCOOR 111 , -SR 112 , -SO2R 113 , -SO2OR 114 , -NHSO2R 115 or -SO2NR 116 R 117 Examples include: R 100 ~R 117 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 102 R 102 When -SO2OR is a hydrogen atom (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 114 R 114 When is a hydrogen atom (ie, a sulfo group), the hydrogen atom may be dissociated (ie, a sulfonate group) or may be in the form of a salt.

[0024] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The number of carbon atoms in the alkyl group is preferably 1 to 20, more preferably 1 to 12, and particularly preferably 1 to 8. The alkyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkenyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkenyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkynyl group may be linear, branched, or cyclic. The aryl group preferably has 6 to 25 carbon atoms, more preferably 6 to 15 carbon atoms, and particularly preferably 6 to 10 carbon atoms. The alkyl portion of the aralkyl group is the same as the alkyl group described above. The aryl portion of the aralkyl group is the same as the aryl group described above. The aralkyl group preferably has 7 to 40 carbon atoms, more preferably 7 to 30 carbon atoms, and particularly preferably 7 to 25 carbon atoms. The heteroaryl group is preferably a monocyclic ring or a fused ring, more preferably a monocyclic ring or a fused ring having 2 to 8 rings, and particularly preferably a monocyclic ring or a fused ring having 2 to 4 rings. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3. The heteroatoms constituting the ring of the heteroaryl group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The heteroaryl group is preferably a 5-membered or 6-membered ring. The number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and particularly preferably 3 to 12. The alkyl group, alkenyl group, alkynyl group, aryl group, heteroaryl group, and aralkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the "substituents" described above.

[0025] From the viewpoint of light resistance and heat resistance, the squarylium compound is more preferably a compound represented by the following general formula (5).

[0026] General formula (5) [ka]

[0027] In general formula (5), R 5 ~R 8 each independently represents a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 50 , -COR 51 , -COOR 52 , -OCOR 53 , -NR 54 R 55 , -NHCOR 56 , -CONR 57 R 58 , -NHCONR 59 R 60, -NHCOOR 61 , -SR 62 , -SO2R 63 , -SO2OR 64 , -NHSO2R 65 or -SO2NR 66 R 67 , -B(OR 68 )2, and -NHBR 69 R 70 Represents R 50 ~R 70 each independently represents a hydrogen atom, an alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 52 R 52 When -SO2OR is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 64 R 64 When R is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may be dissociated (i.e., a sulfonate group) or may be in the form of a salt. 5 and R 6 , R 7 and R 8 may be bonded to each other to form a ring.

[0028] The "substituent" has the same meaning as the "substituent" described above.

[0029] Specific examples of squarylium compounds are shown below, but the present invention is not limited to these.

[0030] [ka]

[0031] [ka]

[0032] (Pyrrolopyrrole compounds) The pyrrolopyrrole compound is preferably a compound represented by the following general formula (6).

[0033] General formula (6) [ka]

[0034] In general formula (6), R 1x and R 1y each independently represents an alkyl group, an aryl group, or a heteroaryl group; R 2 and R 3 each independently represents a hydrogen atom or a substituent, R 2 and R 3 may be bonded to each other to form a ring, R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR 4x R 4y or a metal atom, R 4 is R 1x , R 1y and R 3 may be covalently or coordinately bonded to at least one selected from the group consisting of R 4x R 4y each independently represents a substituent. General formula (6) is described in, for example, JP-A-2009-263614, JP-A-2011-68731, and WO 2015 / 166873.

[0035] R 1x and R 1y are each independently preferably an aryl group or a heteroaryl group, more preferably an aryl group. 1x and R 1y The alkyl group, aryl group, and heteroaryl group represented by may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 , -SOR 12 , -SO2R 13 etc. R 11 ~R 13each independently represents a hydrocarbon group or a heteroaryl group. Examples of the substituent include those described in paragraphs 0020 to 0022 of JP-A No. 2009-263614. Among them, examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 , -SOR 12 , -SO2R 13 is preferred. 1x and R 1y The group represented by the formula: is an alkoxy group having a branched alkyl group, or -OCOR 11 An aryl group having as a substituent a group represented by the following formula: embedded image is preferred. The branched alkyl group preferably has 3 to 30 carbon atoms, more preferably 3 to 20 carbon atoms.

[0036] R 2 and R 3 At least one of R is preferably an electron-withdrawing group. 2 represents an electron-withdrawing group, and R 3 represents a heteroaryl group. The heteroaryl group is preferably a 5-membered or 6-membered ring. The heteroaryl group is preferably a monocyclic or fused ring, preferably a monocyclic or fused ring having 2 to 8 rings, more preferably a monocyclic or fused ring having 2 to 4 rings. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3, more preferably 1 or 2. Examples of heteroatoms include nitrogen atoms, oxygen atoms, and sulfur atoms. The heteroaryl group preferably has one or more nitrogen atoms. The two R in general formula (6) 2 In addition, the two R 3 They may be the same or different.

[0037] R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, or -BR 4x R 4y is preferably a hydrogen atom, an alkyl group, an aryl group, or a group represented by -BR 4x R 4y A group represented by -BR 4x R 4yParticularly preferred is a group represented by R 4x R 4y The substituent represented by is preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group, or a heteroaryl group, more preferably an alkyl group, an aryl group, or a heteroaryl group, and particularly preferably an aryl group. These groups may further have a substituent. 4 They may be the same or different.

[0038] Specific examples of pyrrolopyrrole compounds are shown below. In the following structural formulas, Me represents a methyl group, and Ph represents a phenyl group. Examples of pyrrolopyrrole compounds include the compounds described in paragraphs 0016 to 0058 of JP 2009-263614 A, paragraphs 0037 to 0052 of JP 2011-68731 A, paragraphs 0014 to 0027 of JP 2014-130343 A, and paragraphs 0010 to 0033 of WO 2015 / 166873 A. However, the present invention is not limited thereto.

[0039] [ka]

[0040] (Naphthalocyanine compounds) The naphthalocyanine compound is preferably a compound represented by the following general formula (7).

[0041] General formula (7) [ka]

[0042] In general formula (7), X1~X8, Y lEach of Y8 independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfonic acid group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, a heterocyclic group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, an arylthio group which may have a substituent, a phthalimidomethyl group which may have a substituent, or a sulfamoyl group which may have a substituent. X1 to X8 may also be bonded to each other to form an aromatic ring which may have a substituent. However, any one or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 may be bonded to each other to form an aromatic ring which may have a substituent. Z is a polymer moiety containing a monomer unit represented by the following general formula (8) or a phosphorus compound moiety represented by the following general formula (9), and * is a bond to Al.

[0043] Examples of the "alkyl group" in the alkyl group which may have a substituent include a straight-chain or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, an n-hexyl group, an n-octyl group, a stearyl group, a 2-ethylhexyl group, etc. Examples of the "alkyl group having a substituent" include a trichloromethyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 2,2-dibromoethyl group, a 2,2,3,3-tetrafluoropropyl group, a 2-ethoxyethyl group, a 2-butoxyethyl group, a 2-nitropropyl group, a benzyl group, a 4-methylbenzyl group, a 4-tert-butylbenzyl group, a 4-methoxybenzyl group, a 4-nitrobenzyl group, a 2,4-dichlorobenzyl group, etc.

[0044] Examples of the "aryl group" of the aryl group which may have a substituent include a phenyl group, a naphthyl group, an anthryl group, and the like. Examples of the "substituted aryl group" include a p-methylphenyl group, a p-bromophenyl group, a p-nitrophenyl group, a p-methoxyphenyl group, a 2,4-dichlorophenyl group, a pentafluorophenyl group, a 2-aminophenyl group, a 2-methyl-4-chlorophenyl group, a 4-hydroxy-1-naphthyl group, a 6-methyl-2-naphthyl group, a 4,5,8-trichloro-2-naphthyl group, an anthraquinonyl group, and a 2-aminoanthraquinonyl group.

[0045] Examples of the "cycloalkyl group" of the cycloalkyl group which may have a substituent include a cyclopentyl group, a cyclohexyl group, an adamantyl group, and the like. Examples of the "substituted cycloalkyl group" include a 2,5-dimethylcyclopentyl group, a 4-tert-butylcyclohexyl group, and the like.

[0046] Examples of the "heterocyclic group" of the heterocyclic group which may have a substituent include a pyridyl group, a pyrazyl group, a piperidino group, a pyranyl group, a morpholino group, an acridinyl group, etc. Examples of the "heterocyclic group having a substituent" include a 3-methylpyridyl group, an N-methylpiperidyl group, an N-methylpyrrolyl group, etc.

[0047] Examples of the "alkoxyl group" in the alkoxyl group which may have a substituent include linear or branched alkoxyl groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, a 2,3-dimethyl-3-pentyloxy group, an n-hexyloxy group, an n-octyloxy group, a stearyloxy group, and a 2-ethylhexyloxy group. Examples of the "substituted alkoxyl group" include a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditrifluoromethylpropoxy group, a 2-ethoxyethoxy group, a 2-butoxyethoxy group, a 2-nitropropoxy group, and a benzyloxy group.

[0048] Examples of the "aryloxy group" of the aryloxy group which may have a substituent include a phenoxy group, a naphthoxy group, an anthryloxy group, etc. Examples of the "substituted aryloxy group" include a p-methylphenoxy group, a p-nitrophenoxy group, a p-methoxyphenoxy group, a 2,4-dichlorophenoxy group, a pentafluorophenoxy group, and a 2-methyl-4-chlorophenoxy group.

[0049] Examples of the "alkylthio group" of the alkylthio group which may have a substituent include a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, and an octadecylthio group. Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, and a phenylcarbonylaminoethylthio group.

[0050] Examples of the "arylthio group" of the arylthio group which may have a substituent include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, and a 9-anthrylthio group. Examples of the "substituted arylthio group" include a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, and a 2-hydroxyphenylthio group.

[0051] Examples of the substituent on the aromatic ring which may have a substituent include a halogen atom, a nitro group, a nitrile group, a carboxyl group, a sulfone group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, and an arylthio group which may have a substituent.

[0052] General formula (8) [ka]

[0053] In the general formula (8), X is -CONH-R 25 -,-COO-R 26 -, -CONH-R 27 -O-, -COO-R 28 -O-. R 25 ~R 28 represents an alkylene group or an arylene group in which carbon atoms may be linked by -O-, -CO-, -COO-, -OCO-, -CONH-, or -NHCO-. 31 represents a hydrogen atom or a methyl group. * represents a bond.

[0054] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Examples of the arylene group include a phenylene group, a naphthylene group, a biphenylene group, a terphenylene group, and an anthrylene group.

[0055] The monomer unit represented by general formula (8) can be obtained by polymerizing a monomer such as (2-(meth)acryloyloxyethyl) acid phosphate, (2-(meth)acryloyloxypropyl) acid phosphate, (2-(meth)acryloyloxyisopropyl) acid phosphate, etc. Alternatively, it can be obtained by copolymerizing a monomer other than these monomers (hereinafter also referred to as other monomers) in combination.

[0056] Examples of other monomers include (meth)acrylic acid esters, crotonate esters, vinyl esters, maleic acid diesters, fumaric acid diesters, itaconic acid diesters, (meth)acrylamides, vinyl ethers, vinyl alcohol esters, styrenes, (meth)acrylonitrile, acid group-containing monomers, and thermally crosslinkable group-containing monomers.

[0057] The weight average molecular weight of the polymer portion is preferably 5,000 to 20,000, and more preferably 8,000 to 15,000. Having an appropriate molecular weight improves the optical properties and heat resistance.

[0058] The glass transition temperature (Tg) of the polymer portion is preferably from −50 to 150° C., more preferably from 20 to 80° C. An appropriate Tg improves the optical properties.

[0059] General formula (9) [ka]

[0060] In general formula (9), R 29 and R 30 each independently represents a hydroxyl group, an alkyl group which may have a substituent, an aryl group which may have a substituent, an alkoxyl group which may have a substituent, or an aryloxy group which may have a substituent; R 29 and R 30 may be bonded to each other to form a ring. * is a bond.

[0061] Examples of the "alkyl group" of an alkyl group which may have a substituent, the "aryl group" of an aryl group which may have a substituent, the "alkoxyl group" of an alkoxyl group which may have a substituent, and the "aryloxy group" of an aryloxy group which may have a substituent are the same as those exemplified in the explanation of general formula (7) above.

[0062] General formula (9) is R 29 and R 30 At least one of R is preferably an aryl group which may have a substituent or an aryloxy group which may have a substituent, 29 and R 30 are more preferably an aryl group or an aryloxy group, and R 29 and R 30 However, it is more preferable that both are a phenyl group or a phenoxy group.

[0063] The naphthalocyanine compound is more preferably a compound represented by the following general formula (10).

[0064] General formula (10) [ka]

[0065] In general formula (10), Y9~Y 16 , R8~R 21 each independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfone group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, a heterocyclic group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, an arylthio group which may have a substituent, a phthalimidomethyl group which may have a substituent, or a sulfamoyl group which may have a substituent. Z is a polymer moiety containing a monomer unit represented by general formula (8) or a phosphorus compound moiety represented by general formula (9), and * is a bond to Al.

[0066] The alkyl group which may have a substituent, the aryl group which may have a substituent, the cycloalkyl group which may have a substituent, the heterocyclic group which may have a substituent, the alkoxyl group which may have a substituent, the aryloxy group which may have a substituent, the alkylthio group which may have a substituent, the arylthio group which may have a substituent, the phthalimidomethyl group which may have a substituent, and the sulfamoyl group which may have a substituent are as explained above in relation to general formula (7).

[0067] In general formula (10), Y9~Y 16 , R8~R 21 From the viewpoint of dispersibility and color properties, is preferably a hydrogen atom, a halogen atom, or an alkoxyl group which may have a substituent.

[0068] Specific examples of naphthalocyanine compounds are shown below, but the present invention is not limited to these.

[0069] [ka]

[0070] [ka]

[0071] (indigo compounds) The indigo compound is preferably a compound represented by the following general formula (11) and / or general formula (12).

[0072] [ka]

[0073] In the general formula (11) and the general formula (12), X1 to X 40 each independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxyl group, an optionally substituted aryloxy group, an optionally substituted arylalkyl group, an optionally substituted cycloalkyl group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an amino group, an optionally substituted alkylamino group, an optionally substituted arylamino group, a cyano group, a halogen atom, a nitro group, a hydroxyl group, -SO3H; -COOH; and monovalent to trivalent metal salts of these acidic groups; and alkylammonium salts. M represents a metal atom.

[0074] Examples of the "alkyl group" in the alkyl group which may have a substituent include a straight-chain or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, an n-hexyl group, an n-octyl group, a stearyl group, a 2-ethylhexyl group, etc. Examples of the "alkyl group having a substituent" include a trichloromethyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 2,2-dibromoethyl group, a 2,2,3,3-tetrafluoropropyl group, a 2-ethoxyethyl group, a 2-butoxyethyl group, a 2-nitropropyl group, a benzyl group, a 4-methylbenzyl group, a 4-tert-butylbenzyl group, a 4-methoxybenzyl group, a 4-nitrobenzyl group, a 2,4-dichlorobenzyl group, etc.

[0075] Examples of the "aryl group" of the aryl group which may have a substituent include a phenyl group, a naphthyl group, an anthryl group, and the like. Examples of the "substituted aryl group" include a p-methylphenyl group, a p-bromophenyl group, a p-nitrophenyl group, a p-methoxyphenyl group, a 2,4-dichlorophenyl group, a pentafluorophenyl group, a 2-aminophenyl group, a 2-methyl-4-chlorophenyl group, a 4-hydroxy-1-naphthyl group, a 6-methyl-2-naphthyl group, a 4,5,8-trichloro-2-naphthyl group, an anthraquinonyl group, and a 2-aminoanthraquinonyl group.

[0076] Examples of the "alkoxyl group" in the alkoxyl group which may have a substituent include linear or branched alkoxyl groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, a 2,3-dimethyl-3-pentyloxy group, an n-hexyloxy group, an n-octyloxy group, a stearyloxy group, and a 2-ethylhexyloxy group. Examples of the "substituted alkoxyl group" include a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditrifluoromethylpropoxy group, a 2-ethoxyethoxy group, a 2-butoxyethoxy group, a 2-nitropropoxy group, and a benzyloxy group.

[0077] Examples of the "aryloxy group" of the aryloxy group which may have a substituent include a phenoxy group, a naphthoxy group, an anthryloxy group, etc., and examples of the "aryloxy group having a substituent" include a p-methylphenoxy group, a p-nitrophenoxy group, a p-methoxyphenoxy group, a 2,4-dichlorophenoxy group, a pentafluorophenoxy group, a 2-methyl-4-chlorophenoxy group, etc.

[0078] Examples of the "arylalkyl group which may have a substituent" include a benzyl group, a 2-phenylpropan-yl group, a styryl group, a diphenylmethyl group, and a triphenylmethyl group.

[0079] Examples of the "cycloalkyl group" of the cycloalkyl group which may have a substituent include a cyclopentyl group, a cyclohexyl group, an adamantyl group, etc. Examples of the "cycloalkyl group having a substituent" include a 2,5-dimethylcyclopentyl group, a 4-tert-butylcyclohexyl group, etc.

[0080] Examples of the "alkylthio group" of the alkylthio group which may have a substituent include a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, and an octadecylthio group. Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, and a phenylcarbonylaminoethylthio group.

[0081] Examples of the "arylthio group" of the arylthio group which may have a substituent include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, and a 9-anthrylthio group. Examples of the "substituted arylthio group" include a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, and a 2-hydroxyphenylthio group.

[0082] Examples of the "alkylamino group" in the alkylamino group optionally having a substituent include a methylamino group, an ethylamino group, a propylamino group, a butylamino group, a pentylamino group, a hexylamino group, a heptylamino group, an octylamino group, a nonylamino group, a decylamino group, a dodecylamino group, an octadecylamino group, an isopropylamino group, an isopentylamino group, a sec-butylamino group, a tert-butylamino group, a sec-pentylamino group, a tert-pentylamino group, a tert-octylamino group, a neopentylamino group, a cyclopropylamino group, a cyclobutylamino group, a cyclopentylamino group, a cyclohexylamino group, a cycloheptylamino group, a cyclooctylamino group, a cyclododecylamino group, a 1-adamantamino group, and a 2-adamantamino group.

[0083] Examples of the "arylamino group" of the arylamino group which may have a substituent include an anilino group, a 1-naphthylamino group, a 2-naphthylamino group, an o-toluidino group, a m-toluidino group, a p-toluidino group, a 2-biphenylamino group, a 3-biphenylamino group, a 4-biphenylamino group, a 1-fluoreneamino group, a 2-fluoreneamino group, a 2-thiazoleamino group, and a p-terphenylamino group.

[0084] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine.

[0085] Examples of the acidic group include -SO3H and -COOH, and examples of monovalent to trivalent metal salts of these acidic groups include sodium salts, potassium salts, magnesium salts, calcium salts, iron salts, aluminum salts, etc. Examples of alkylammonium salts of acidic groups include ammonium salts of long-chain monoalkylamines such as octylamine, laurylamine, and stearylamine, and quaternary alkylammonium salts such as palmityltrimethylammonium, lauryltrimethylammonium, dilauryldimethylammonium, and distearyldimethylammonium salts.

[0086] Among the above substituents, X1 to X 40 Preferred substituents for include a hydrogen atom, a methyl group, a methoxy group, a fluorine atom, a chlorine atom, a bromine atom, and -SO3H.

[0087] M represents a metal atom. Examples of the metal atom include Zn, Co, Ni, Ru, Pt, Mn, Sn, Ti, and Ba. Among these, divalent metal atoms are preferred, and Zn, Co, and Ni are more preferred.

[0088] Specific examples of indigo compounds are shown below, but the present invention is not limited to these.

[0089] [ka]

[0090] [ka]

[0091] [ka]

[0092] [ka]

[0093] The near-infrared absorbing dye (A) can be used alone or in combination of two or more. When two or more types are used in combination, it is preferable to use at least two compounds with different maximum absorption wavelengths. This broadens the absorption spectrum waveform compared to when a single near-infrared absorbing dye (A) is used, allowing near-infrared light to be absorbed over a wide wavelength range.

[0094] From the viewpoint of near-infrared absorbing properties, the content of the near-infrared absorbing dye (A) is preferably from 0.5 to 70 mass %, more preferably from 1 to 50 mass %, based on 100 mass % of the nonvolatile content of the curable composition.

[0095] [Other near-infrared absorbing compounds] The curable composition of the present invention may contain a compound having near-infrared absorbing ability other than the near-infrared absorbing dye (A) (hereinafter also referred to as other near-infrared absorbing compounds). Examples of other near-infrared absorbing compounds include metal oxide particles or metal particles such as indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, cesium tungsten oxide, copper, nickel, silver, and gold.

[0096] [Radical polymerizable compound (B)] The curable composition of the present invention contains a radically polymerizable compound (B).

[0097] Examples of the radical polymerizable compound (B) include monomers and oligomers having a polymerizable unsaturated group. Examples of the polymerizable unsaturated group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. Examples of the radical polymerizable compound (B) include a lactone-modified radical polymerizable compound, a radical polymerizable compound having an acidic group, a radical polymerizable compound having a urethane bond, a radical polymerizable compound having a tertiary amine structure, a radical polymerizable compound having a dendrimer structure or a hyperbranched structure, and other radical polymerizable compounds.

[0098] (Lactone-modified radical polymerizable compound) The lactone-modified radical polymerizable compound is a compound having a lactone-modified structure in the molecule. The lactone-modified radical polymerizable compound can be obtained by esterifying a polyhydric alcohol such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaethylthritol, tripentaerythritol, glycerin, diglycerol, or trimetrolmelamine with (meth)acrylic acid and ε-caprolactone or another lactone compound.

[0099] Commercially available lactone-modified radical polymerizable compounds include, for example, KAYARAD DPCA-20, DPCA-30, and DPCA-60 manufactured by Nippon Kayaku Co., Ltd.

[0100] (Radical polymerizable compound having an acidic group) Examples of radically polymerizable compounds having an acidic group include esters of dicarboxylic acids and free hydroxyl group-containing poly(meth)acrylates of polyhydric alcohols and (meth)acrylic acid; and esters of polycarboxylic acids and monohydroxyalkyl(meth)acrylates.

[0101] Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol.

[0102] Examples of the dicarboxylic acids include malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, itaconic acid, and the like.

[0103] Examples of the polycarboxylic acid include trimellitic acid and pyromellitic acid. Examples of monohydroxyalkyl (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, and 2-hydroxy-3-acryloyloxypropyl methacrylate.

[0104] Commercially available radically polymerizable compounds having an acidic group include Viscoat #2500P manufactured by Osaka Organic Chemical Industry Co., Ltd., and Aronix M-5300, M-5400, M-5700, M-510, M-520, and M-521 manufactured by Toagosei Co., Ltd.

[0105] (Radical polymerizable compound having a urethane bond) Examples of radically polymerizable compounds having a urethane bond include urethane (meth)acrylates obtained by reacting a hydroxyl group-containing (meth)acrylate with a polyfunctional isocyanate, and urethane (meth)acrylates obtained by reacting a polyhydric alcohol with a polyfunctional isocyanate and then reacting the resulting mixture with a hydroxyl group-containing (meth)acrylate.

[0106] Examples of the hydroxyl group-containing (meth)acrylate include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide (EO)-modified penta(meth)acrylate, dipentaerythritol propylene oxide (PO)-modified penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, glycerol acrylate methacrylate, glycerol dimethacrylate, 2-hydroxy-3-acryloylpropyl methacrylate, a reaction product of an epoxy group-containing compound and a carboxy(meth)acrylate, and a hydroxyl group-containing polyol polyacrylate.

[0107] Examples of the polyfunctional isocyanate include aromatic diisocyanates such as tolylene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate; aliphatic diisocyanates such as trimethylene diisocyanate, tetramethylene diisocyanate, and hexamethylene diisocyanate; alicyclic diisocyanate such as isophorone diisocyanate; and biuret derivatives, isocyanate nurate derivatives, and trimethylolpropane adducts thereof.

[0108] The radical polymerizable compound having a urethane bond may also have an acidic group. Examples of the acidic group include a sulfonic acid group, a carboxyl group, and a phosphate group. Among these, a carboxyl group is preferred.

[0109] The acidic group can be introduced into a radically polymerizable compound having a urethane bond by, for example, first reacting the hydroxyl group-containing (meth)acrylate with the polyfunctional isocyanate, and then adding a mercapto compound having a carboxyl group to the product.

[0110] Examples of the mercapto compound having a carboxyl group include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

[0111] Commercially available radically polymerizable compounds having a urethane bond include, for example, AH-600, UA-306H, UA-306T, UA-306I, UA-510H, and UF-8001G manufactured by Kyoeisha Chemical Co., Ltd., UA-1100H, U-6LPA, UA-33H, U-10HA, and U-15HA manufactured by Shin-Nakamura Chemical Co., Ltd., and EBECRYL1290 and KRM8452 manufactured by Daicel-Allnex Corporation.

[0112] (Radical polymerizable compound having a tertiary amine structure) Examples of the radical polymerizable compound having a tertiary amine structure include tris(acryloyloxyethyl)amine, tris(methacryloyloxyethyl)amine, tris(2-hydroxy-3-methacryloyloxypropyl)amine, and a Michael addition reaction product of a (meth)acrylate compound (X) and an amine compound (Y).

[0113] Examples of the (meth)acrylate compound (X) include glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and diglycerides thereof. Examples of the alkylene oxide-modified tri(meth)acrylate include lin tri(meth)acrylate, diglycerin tetra(meth)acrylate, trimethylolpropane alkylene oxide-modified tri- and tetra(meth)acrylate, ditrimethylolpropane alkylene oxide-modified tri- and tetra(meth)acrylate, pentaerythritol alkylene oxide-modified tri- and tetra(meth)acrylate, diglycerin alkylene oxide-modified tri- and tetra(meth)acrylate, and dipentaerythritol alkylene oxide-modified tetra-, penta-, and hexa(meth)acrylate. Examples of the alkyleneoxy unit in the alkylene oxide modification include ethyleneoxy, propyleneoxy, and butyleneoxy. The (meth)acrylate compound (X) also includes a (meth)acrylate compound having an acidic group.

[0114] The (meth)acrylate compound (X) can be used alone or in combination of two or more kinds.

[0115] Examples of the amine compound (Y) include primary amines such as n-propylamine, n-butylamine, n-hexylamine, benzylamine, aminocaproic acid, monoethanolamine, 2-(2-aminoethoxy)ethanol, o-aminophenol, m-aminophenol, and p-aminophenol; Examples of the secondary amines include dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, cyclohexylamine, morpholine, piperidine, 1-methylpiperazine, proline, N-merylethanolamine, N-acetylethanolamine, diethanolamine, 3-anilinephenol, and 4-anilinephenol.

[0116] The amine compound (Y) can be used alone or in combination of two or more kinds.

[0117] The method for producing the Michael addition reaction product of the (meth)acrylate compound (X) and the amine compound (Y) is not particularly limited, and known methods can be used, such as those described in International Publication No. 2006 / 075754, JP-A No. 2008-545859, and JP-A No. 2017-066347.

[0118] The radical polymerizable compound having a tertiary amine structure may have an acidic group and / or a hydroxyl group. Examples of methods for introducing the acidic group and / or the hydroxyl group include a method of using a compound having an acidic group and / or a hydroxyl group in the (meth)acrylate compound (X) or the amine compound (Y), and a method of adding an acid anhydride after a Michael addition reaction.

[0119] Commercially available radical polymerizable compounds having a tertiary amine structure include, for example, Aronix MT-3041 and 3042 manufactured by Toagosei Co., Ltd.

[0120] (Radical polymerizable compound having a dendrimer structure or a hyperbranched structure) A radical polymerizable compound having a dendrimer structure has a chemical structure that constitutes a core (hereinafter also referred to as the core part) and branches outward in a regular pattern, with polymerizable unsaturated groups at the ends of the branches. The hyperbranched structure has a chemical structure in which the molecules are bonded together, and has a spherical, highly controlled chemical structure and molecular weight. The hyperbranched structure has a chemical structure similar to that of a dendrimer structure.

[0121] Commercially available radical polymerizable compounds having a dendrimer structure or a hyperbranched structure include, for example, Viscoat #1000LT (dendrimer structure, average number of acryloyl groups: 14) manufactured by Osaka Organic Chemical Industry Co., Ltd., Miramer SP-1106 (dendrimer structure, average number of acryloyl groups: 18) and Miramer SP-1108 (dendrimer structure, average number of acryloyl groups: 13) manufactured by Miwon Specialty Chemical Co., Ltd., CN2301 (hyperbranched structure, average number of acryloyl groups: 9), CN2302 (hyperbranched structure, average number of acryloyl groups: 16), CN2303 (hyperbranched structure, average number of acryloyl groups: 6), and CN2304 (hyperbranched structure, average number of acryloyl groups: 18) manufactured by SARTOMER Co., Ltd., and Eternal Examples include Etercure 6361-100 (hyperbranched structure, average number of acryloyl groups: 8), Etercure 6362-100 (hyperbranched structure, average number of acryloyl groups: 12), Etercure 6363 (hyperbranched structure, average number of acryloyl groups: 16), and Etercure DR-E522 (hyperbranched structure, average number of acryloyl groups: 15), all manufactured by Materials Corporation.

[0122] (Other radical polymerizable compounds) Other radical polymerizable compounds include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, β-carboxyethyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, isocyanuric acid EO-modified di(meth)acrylate, isocyanuric acid EO-modified tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, ) acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecanyl (meth)acrylate, (meth)acrylic acid ester of methylolated melamine, epoxy (meth)acrylate, various acrylic acid esters and methacrylic acid esters such as urethane acrylate, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-vinylformamide, acrylonitrile, and the like.

[0123] Other commercially available radical polymerizable compounds include, for example, KAYARAD R-128H, R526, PEG400DA, MAND, NPGDA, R-167, HX-220, R-551, R712, R-604, R-684, GPO-303, TMPTA, DPHA, DPEA-12, DPHA-2C, D-310, and D-330 manufactured by Nippon Kayaku Co., Ltd., and Aronix M-303, M-305, M-306, M-309, M-310, M-321, M-325, and M-330 manufactured by Toagosei Co., Ltd. -350, M-360, M-313, M-315, M-400, M-402, M-403, M-404, M-405, M-406, M-450, M-452, M-408, M-211B, M-101A, Viscoat #310HP, #335HP, #700, #295, #330, #360, #GPT, #400, #405 manufactured by Osaka Organic Chemical Industry Co., Ltd., and OGSOL manufactured by Osaka Gas Chemicals Co., Ltd. Examples of suitable acrylic acid esters include EA-0200, EA-0300, GA-5060P, and GA-2800, Miramer HR6060, 6100, and 6200 manufactured by Miwon Specialty Chemical Co., Ltd., NK Ester ABE-300, A-DOG, A-DCP, A-BPE-4, and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., and EBECRYL 40, 130, 140, and 145 manufactured by Daicel-Allnex Corporation.

[0124] The radical polymerizable compound (B) can be used alone or in combination of two or more kinds.

[0125] The content of the radically polymerizable compound (B) is preferably from 5 to 90 mass %, more preferably from 10 to 60 mass %, based on 100 mass % of the nonvolatile content of the curable composition.

[0126] [Radical polymerization initiator (C)] The curable composition of the present invention contains a radical polymerization initiator (C).

[0127] The radical polymerization initiator (C) is a compound that generates radicals by the action of light or heat, thereby initiating or accelerating the polymerization reaction of the radically polymerizable compound (B). The radical polymerization initiator that generates radicals by light (hereinafter also simply referred to as a photoradical polymerization initiator) is preferably a compound that generates radicals in response to light in the ultraviolet to visible region. The radical polymerization initiator that generates radicals by heat (hereinafter also simply referred to as a thermal radical polymerization initiator) may be a compound that generates radicals by the action of heat and light.

[0128] Examples of the photoradical polymerization initiator include acetophenone-based compounds such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, and 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; triazine-based compounds such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Oxime compounds such as 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)], or ethanol, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime); acylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; Examples include quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; and carbazole compounds.

[0129] Commercially available products include acetophenone compounds such as Omnirad 907, 369E, 379EG, 127, 184, 1173, and 2959 manufactured by IGM Resins, acylphosphine compounds such as Omnirad 819 and TPO manufactured by IGM Resins, oxime compounds such as IRGACURE OXE-01, 02, 03, and 04 manufactured by BASF Japan, N-1919, NCI-730, 831, and 930 manufactured by ADEKA, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, and 3057 manufactured by Changzhou Strong New Materials Co., Ltd., and IGM Examples include Omnirad 1312, 1314, and 1316 manufactured by Resins Co., Ltd., SPI-02, 03, 04, 05, 06, and 07 manufactured by Samyang Corporation, and DFI-020, 306, and EOX-01 manufactured by Daito Chemiks Co., Ltd. Further examples include compounds described in JP 2007-210991 A, JP 2009-179619 A, JP 2010-037223 A, JP 2010-215575 A, JP 2011-020998 A, WO 2015 / 036910, JP 2019-507108 A, JP 2019-528331 A, WO 2021 / 175855, etc.

[0130] Examples of the thermal radical polymerization initiator include benzopinacol, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-diphenoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetra(4-methylphenyl)ethane, 1,2-diphenoxy-1,1,2,2-tetra(4-methoxyphenyl)ethane, and 1,2-bis(trimethylsiloxy)-1,1,2,2-tetraphenyl Pinacol compounds such as ethane, 1,2-bis(triethylsiloxy)-1,1,2,2-tetraphenylethane, 1,2-bis(tert-butyldimethylsiloxy)-1,1,2,2-tetraphenylethane, 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1-hydroxy-2-triethylsiloxy-1,1,2,2-tetraphenylethane, and 1-hydroxy-2-tert-butyldimethylsiloxy-1,1,2,2-tetraphenylethane; azo compounds such as 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), dimethyl-2,2'-azobis(2-methylpropionate), 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis[N-(2-propenyl)2-methylpropionamide], 1-[(1-cyano-1-methylethyl)azo]formamide, 2,2'-azobis(N-butyl-2-methylpropionamide), and 2,2'-azobis(N-cyclohexyl-2-methylpropionamide); Examples of the organic peroxide include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)cyclohexane, 2,2-bis(tert-butylperoxy)butane, succinic peroxide, and benzoyl peroxide.

[0131] The radical polymerization initiator (C) can be used alone or in combination of two or more kinds.

[0132] The content of the radical polymerization initiator (C) is preferably from 0.5 to 20 mass %, more preferably from 1 to 10 mass %, based on 100 mass % of the nonvolatile content of the curable composition.

[0133] [Thermosetting compound (D)] The curable composition of the present invention contains a thermosetting compound (D), which crosslinks upon heating, improving the solvent resistance, high-temperature and high-humidity resistance, and heat cycle resistance of the cured film.

[0134] The thermosetting compound (D) may be a low molecular weight compound or a high molecular weight compound such as a resin. Examples of the thermosetting compound (D) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenol compounds. Among these, from the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance, epoxy compounds are preferred, and epoxy compounds are more preferred.

[0135] (epoxy compounds) Examples of epoxy compounds include polycondensates of bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkyl aldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), polycondensates of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene ... Examples of suitable epoxy resins include polymers of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (benzenedimethanol, α,α,α',α'-benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether epoxy resins obtained by glycidylating alcohols, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine epoxy resins, and glycidyl ester epoxy resins.

[0136] Commercially available epoxy compounds include, for example, Epicoat 807, 815, 825, 827, 828, 190P, and 191P manufactured by Yuka Shell Epoxy Co., Ltd., and TECHMORE manufactured by Mitsui Chemicals, Inc. VG3101L, EPPN-201, 501H, 502H, EOCN-102S, 103S, 104S, 1020 manufactured by Nippon Kayaku Co., Ltd., Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154 manufactured by Japan Epoxy Resins Co., Ltd., Celloxide 2021, EHPE-3150, Epolead GT401 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S manufactured by Nissan Chemical Industries, Ltd., and EPICLON manufactured by DIC Corporation Examples include 830, 840, 850, 860, 1050, 3050, 4050, N-660, N-670, N-740, N-770, N865, HP-7200, HP-4700, HP-4770, HP-5000, HP-6000, and HP-9500.

[0137] From the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance, the epoxy compound is preferably a compound having 2 to 50 epoxy groups in the molecule, more preferably a compound having 10 to 30 epoxy groups. Furthermore, the epoxy compound is preferably an epoxy compound having an aromatic ring and / or an aliphatic ring, more preferably an epoxy compound having an aliphatic ring. The epoxy group is preferably bonded to the aromatic ring and / or the aliphatic ring via a single bond or a linking group. Examples of the linking group include an alkyl group, an arylene group, -O-, -NR- (wherein R represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aryl group), -SO2-, -CO-, -O-, and -S-. In the case of a structure having an aliphatic ring, the epoxy group is more preferably bonded to the aliphatic ring via a single bond.

[0138] The epoxy equivalent of the epoxy compound is preferably 50 to 400 g / eg, more preferably 100 to 200 g / eg. The epoxy equivalent is defined as the mass of an epoxy compound containing one equivalent of epoxy groups.

[0139] Examples of epoxy compounds having an aliphatic ring include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-metadioxane, bis(3, 4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl carboxylate, methylene bis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylene bis(3,4-epoxycyclohexane carboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, and the like.

[0140] The epoxy compound having an aliphatic ring preferably contains a compound represented by the following general formula (3) from the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance.

[0141] General formula (3) [ka]

[0142] In the general formula (3), R represents a group obtained by removing m hydroxyl groups from an m-hydric alcohol, m represents an integer of 1 to 6, and n represents an integer of 1 to 30.

[0143] R represents a group obtained by removing m hydroxyl groups from an m-hydric alcohol. The group obtained by removing m hydroxyl groups from an m-hydric alcohol is preferably an alkyl group having 2 to 20 carbon atoms, and may be linear, branched, or cyclic, or a combination of these. Examples of the alkyl group having 2 to 20 carbon atoms include ethyl, methyl, propyl, isopropyl, 2,2-dimethylpropyl, butyl, isobutyl, tert-butyl, 3,3-dimethylbutyl, pentyl, isopentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, hexadecyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, and cyclohexylmethyl. Among these, branched alkyl groups having 3 to 12 carbon atoms are more preferred.

[0144] m represents an integer of 1 to 6, and n represents an integer of 1 to 30. When m is 2 or more, n in each of the groups in parentheses in general formula (3) may be the same or different.

[0145] Specific examples of the compound represented by general formula (3) include 1,2-epoxy-4-(2-oxiranyl)cyclohexane adducts of 2,2-bis(hydroxymethyl)-1-butanol. Commercially available products include EHPE-3150 and EHPE-3150CE manufactured by Daicel Corporation.

[0146] The epoxy compounds can be used alone or in combination of two or more.

[0147] The content of the epoxy compound is preferably 1 to 20 mass %, more preferably 5 to 15 mass %, based on 100 mass % of the nonvolatile content of the curable composition, from the viewpoints of solvent resistance during low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance.

[0148] (Oxetane compounds) The oxetane compound is a known compound having an oxetane group, and examples of the oxetane compound include monofunctional oxetane compounds, bifunctional oxetane compounds, and trifunctional or higher functional oxetane compounds.

[0149] Examples of monofunctional oxetane compounds include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, and 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane.

[0150] Examples of commercially available products include OXE-10,30 manufactured by Osaka Organic Chemical Industry Co., Ltd. and OXT-101,212 manufactured by Toagosei Co., Ltd.

[0151] Examples of the bifunctional oxetane compound include 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3- Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethyleneglycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenylbis(3-ethyl- 3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F(3-ethyl-3-oxetanylmethyl) ether, and the like.

[0152] Examples of commercially available products include OXBP and OXTP manufactured by Ube Industries, Ltd., and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0153] Examples of trifunctional or higher oxetane compounds include pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and caprolactone-modified dipentaerythritol. Examples of such polymers include erythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing an oxetane group (for example, the oxetane-modified phenol novolac resin described in Japanese Patent No. 3783462), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the above-mentioned OXE-30.

[0154] The content of the oxetane compound is preferably 1 to 20 mass %, more preferably 5 to 15 mass %, based on 100 mass % of the nonvolatile content of the curable composition, from the viewpoints of solvent resistance during low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance.

[0155] (melamine compounds) The melamine compound is a compound having a melamine ring structure, and is preferably a compound having a methylol group.

[0156] Examples of commercially available products include Nikalac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417, and MX-410 manufactured by Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, and 370 manufactured by Nippon Cytec Industries Co., Ltd.

[0157] The content of the melamine compound is preferably 0.01 to 10 mass %, more preferably 0.1 to 5 mass %, based on 100 mass % of the nonvolatile content of the curable composition, from the viewpoints of solvent resistance during low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance.

[0158] The thermosetting compound (D) can be used alone or in combination of two or more kinds.

[0159] [Curing accelerator (E)] The curable composition of the present invention contains at least two imidazole compounds as the curing accelerator (E).

[0160] Examples of the imidazole compound include imidazole, 1-methylimidazole, 2-methylimidazole, 1-ethylimidazole, 2-ethylimidazole, 2-butylimidazole, 1-propylimidazole, 2-isopropylimidazole, 1-benzylimidazole, 1-benzyl-2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-phenylimidazole, 2-phenylimidazole, 4-phenylimidazole, 4-methyl-2-phenylimidazole, 1,2-dimethylimidazole, 2,4-dimethylimidazole, and 2-ethyl-4-methylimidazole. azole, 2,4-diphenylimidazole, 1-benzyl-4-methylimidazole, 2-hydroxymethylimidazole, 2-methyl-4-hydroxymethylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-propylimidazole, 1-benzyl-2-isopropylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-phenyl-4-(4-methylphenyl)imidazole, 1-benzyl-5-hydroxymethylimidazole, 1-cyanomethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and the like.

[0161] (Compound represented by general formula (1)) From the viewpoint of low-temperature curing, the curable composition of the present invention preferably contains at least a compound represented by general formula (1) as an imidazole compound. In compounds represented by general formula (1) in which the nitrogen at position 1 is substituted with a benzyl group, the first-stage reaction with the thermosetting compound (D) begins at low temperatures. This mechanism is thought to be due to the fact that, when the nitrogen at position 1 is not substituted with a benzyl group, the 1-position is a secondary amine and the 3-position is a tertiary amine. However, in reality, the hydrogen bonded to the nitrogen at position 1 forms a resonance structure with the nitrogen at position 3, making them equivalent. This inhibits the reaction between the thermosetting compound (D) and the tertiary amine, and the reaction only occurs at high temperatures. In contrast, when the 1-position is substituted with a benzyl group, this resonance disappears, resulting in a structure with two tertiary amines. This is thought to allow the thermosetting compound (D) to react with the tertiary amine even at low temperatures, initiating the crosslinking reaction between the curable compounds (D).

[0162] General formula (1) [ka]

[0163] (In general formula (1), X1 to X3 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms.)

[0164] The alkyl group having 1 to 20 carbon atoms may be linear, branched, or cyclic, or may be a combination of any of these, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, an undecyl group, a dodecyl group, a hexadecyl group, a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, a cyclohexylmethyl group, and a cyclohexylmethyl group. Examples of the aryl group having 6 to 30 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, and an anthryl group. Examples of the arylalkyl group having 7 to 30 carbon atoms include a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, and a phenylethyl group.

[0165] From the viewpoint of solvent resistance, high temperature and humidity resistance, and heat cycle resistance, X1 is preferably one selected from the group consisting of a methyl group, an ethyl group, and a phenyl group.

[0166] From the viewpoint of reactivity, X2 and X3 are preferably one selected from the group consisting of a hydrogen atom, a methyl group, and an ethyl group.

[0167] Examples of the compound represented by general formula (1) include 1-benzylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-4-methylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-propylimidazole, 1-benzyl-2-isopropylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-phenyl-4-(4-methylphenyl)imidazole, etc. Among these, 1-benzyl-2-methylimidazole and 1-benzyl-2-phenylimidazole are preferred from the viewpoint of low-temperature curing.

[0168] The compounds represented by general formula (1) can be used alone or in combination of two or more.

[0169] The content of the compound represented by general formula (1) is preferably 50% by mass or more, and more preferably 70% by mass or more, based on 100% by mass of the curing accelerator (E).

[0170] (Compound represented by general formula (2)) From the viewpoint of low-temperature curing, the curable composition of the present invention preferably contains a compound represented by the following general formula (2) as an imidazole compound. The compound represented by general formula (2) has a different reaction mechanism from the compound represented by general formula (1), and once reacted, the subsequent reaction rate with the thermosetting compound (D) is high, and it is presumed that a cured film having high solvent resistance, high-temperature / high-humidity resistance, and heat cycle resistance can be obtained.

[0171] General formula (2) [ka] (In general formula (2), X4 to X6 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms.)

[0172] The alkyl group having 1 to 20 carbon atoms may be linear, branched, or cyclic, or may be a combination of any of these, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, an octyl group, an isooctyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, an undecyl group, a dodecyl group, a hexadecyl group, a cyclopentyl group, a cyclopentylmethyl group, a cyclohexyl group, a cyclohexylmethyl group, and a cyclohexylmethyl group. Examples of the aryl group having 6 to 30 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, and an anthryl group. Examples of the arylalkyl group having 7 to 30 carbon atoms include a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, and a phenylethyl group.

[0173] From the viewpoint of solvent resistance, high temperature and humidity resistance, and heat cycle resistance, X4 is preferably one selected from the group consisting of a methyl group, an ethyl group, and a phenyl group.

[0174] From the viewpoint of reactivity, X5 and X6 are preferably one selected from the group consisting of a hydrogen atom, a methyl group, and an ethyl group.

[0175] Examples of the compound represented by general formula (2) include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-butylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2-phenylimidazole, 4-phenylimidazole, 4-methyl-2-phenylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2,4-diphenylimidazole, etc. Among these, 2-methylimidazole and 2-phenylimidazole are preferred.

[0176] The compounds represented by general formula (2) can be used alone or in combination of two or more.

[0177] The content of the compound represented by general formula (2) is preferably 0.5% by mass or more, more preferably 1% by mass or more, based on 100% by mass of the curing accelerator (E).

[0178] From the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance, the curable composition of the present invention more preferably contains, as imidazole compounds, a compound represented by general formula (1) and a compound represented by general formula (2).

[0179] In the curable composition of the present invention, from the viewpoints of solvent resistance, high temperature and humidity resistance, and heat cycle resistance in low temperature curing, the mass ratio of the compound represented by general formula (1) to the compound represented by general formula (2) is preferably 99.5:0.5 to 50:50, and more preferably 99:1 to 70:30. The total amount of the compound represented by general formula (1) and the compound represented by general formula (2) is preferably 70% by mass or more in 100% by mass of the curing accelerator (E).

[0180] The content of the curing accelerator (E) is preferably from 1 to 20 parts by mass, more preferably from 1.5 to 15 parts by mass, based on 100 parts by mass of the thermosetting compound (D).

[0181] Colorant (F) The curable composition of the present invention may contain a colorant (F), which makes it possible to control the transmittance of the optical filter in each wavelength region, thereby improving color separation.

[0182] Examples of the colorant (F) include pigments and dyes, and from the viewpoints of light resistance, heat resistance, and solvent resistance, pigments are preferred, and organic pigments are preferred.

[0183] (pigment) The pigment is preferably a compound classified as a pigment in the Color Index. Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, JP 2014-134712 A, and the pigments described in Japanese Patent No. 6368844. Among these, from the viewpoints of heat resistance, light fastness, and transmittance, CI Pigment Red 48:1,122,177,224,242,269,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are preferred, and CI Pigment Red 177,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are more preferred.

[0184] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0185] Yellow pigments include, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 178, 179, 180, 181, 182, 183, 184, 185, 186, 187, 188, 189, 190, 1,152, 153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,192,193,194,196,198,199,213,214,231,233, JP 2012-226110 A, JP 2017-171912 A, JP 2017-171913 A, JP 2017-171914 A, JP 2017-171915 A, and the like. Among these, CI Pigment Yellows 138, 139, 150, 185, 231, and 233, and the pigments described in JP-A-2012-226110 are preferred.

[0186] Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63. Among these, CI Pigment Green 36, 58, 59, 62, and 63 are preferred.

[0187] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0188] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, CI Pigment Violet 19 and 23 are preferred.

[0189] Specific examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, 31, and 32. Other examples include compounds described in JP-A Nos. 2010-534726, 2012-515233, and 2012-515234, JP-A Nos. 1-170601, and 2-34664.

[0190] When the curable composition of the present invention is used in a near-infrared transmission filter, it preferably contains a colorant (F) that transmits infrared light and blocks visible light. For example, it is preferable that the colorant (F) contains two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments, and purple pigments to exhibit a black color, or contains a black pigment.

[0191] Examples of combinations containing two or more pigments and exhibiting black color include the following. (1) Contains yellow pigment and purple pigment. (2) Contains red pigment, yellow pigment, and purple pigment. (3) Contains red pigment, yellow pigment, and blue pigment. (4) Contains red pigment, yellow pigment, and green pigment. (5) Contains yellow pigment, blue pigment, and purple pigment. (6) Contains red pigment, yellow pigment, blue pigment, and purple pigment. (7) Contains yellow pigment, blue pigment, green pigment, and purple pigment.

[0192] An example of the above embodiment (1) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (2) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296, the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (3) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296, the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6. An example of the embodiment (4) above is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; and the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63. An example of the above embodiment (5) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (6) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (7) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63; and the purple pigment contains CI Pigment Violet 23.

[0193] Table 1 shows the preferred mass ratio (mass %) of each pigment in each embodiment.

[0194] [Table 1]

[0195] The colorant (F) may also be an inorganic pigment, such as titanium oxide, barium sulfate, zinc oxide, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron (III) oxide), cadmium red, ultramarine, iron blue, chromium oxide green, cobalt green, umber, or synthetic iron black.

[0196] (dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, etc. Also included are derivatives of these dyes and lake pigments obtained by converting dyes into lakes.

[0197] The acid dye preferably has an acidic group such as a sulfonic acid or carboxylic acid. Also preferred are salt-forming compounds that are salts of an acid dye with a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound. Also preferred are salt-forming compounds that are salts of an acid dye with a resin component having these functional groups. Furthermore, by modifying the salt-forming compound into a sulfonamidized sulfonic acid amide compound, a curable composition with excellent resistance (light resistance, solvent resistance) can be easily obtained. In addition, a salt-forming compound of an acid dye and a compound having an onium salt group is also preferred because it has excellent resistance (light resistance, solvent resistance). The compound having an onium salt group is preferably a resin having a cationic group.

[0198] Although basic dyes can be used as they are, salt-forming compounds that form salts with organic acids, perchloric acid, or metal salts thereof are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in the salt-forming compounds of basic dyes, the anion component that acts as a counterion is preferably an organic sulfonic acid, organic sulfuric acid, a fluorine-containing phosphorus anion compound, a fluorine-containing boron anion compound, a cyano-containing nitrogen anion compound, an anion compound having a conjugate base of an organic acid with a halogenated hydrocarbon group, or a salt-forming compound formed with an acid dye. Furthermore, the resistance of salt-forming compounds is further improved when the salt-forming compound contains a polymerizable unsaturated group in the molecule.

[0199] The chemical structure of the dye may be, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), azido dyes, ... Examples of the dye structure include dyes derived from dyes selected from the group consisting of quinone dyes, polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0200] Among these, from the viewpoint of color properties such as hue, color separation ability, and color unevenness, a dye structure derived from a dye selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a dye structure derived from a dye selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes is more preferred.

[0201] The colorant (F) can be used alone or in combination of two or more kinds.

[0202] The content of the colorant (F) is preferably 5% by mass or less, more preferably 0.5 to 3% by mass, based on 100% by mass of the nonvolatile content of the curable composition.

[0203] (Micronization of organic pigments) The organic pigment is preferably used in a finely divided state. The method of finely dividing is not particularly limited, and for example, wet milling, dry milling, or solution precipitation can be used. Among these, salt milling treatment using a kneader method, which is a type of wet milling, is preferred. The average primary particle diameter of the finely divided pigment determined by TEM (transmission electron microscope) is preferably 5 to 90 nm. From the viewpoints of dispersibility and contrast ratio, the average primary particle diameter is more preferably 10 to 70 nm.

[0204] Salt milling is a process in which a mixture of a pigment, a water-soluble inorganic salt, and a water-soluble organic solvent is mechanically kneaded under heat using a kneader, two-roll mill, three-roll mill, ball mill, attritor, sand mill, or other kneading machine, and then the water-soluble inorganic salt and water-soluble organic solvent are removed by washing with water. The water-soluble inorganic salt acts as a crushing aid, and the high hardness of the inorganic salt is used to crush the pigment during salt milling. Optimizing the conditions for salt milling a pigment can produce a pigment with an extremely fine primary particle size, a narrow distribution, and a sharp particle size distribution.

[0205] Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, and sodium sulfate, with sodium chloride (table salt) being preferred from the standpoint of cost. From the standpoint of both treatment efficiency and production efficiency, the amount of water-soluble inorganic salt used is preferably 50 to 2,000 parts by mass, and more preferably 300 to 1,000 parts by mass, per 100 parts by mass of the pigment.

[0206] The water-soluble organic solvent functions to moisten the pigment and water-soluble inorganic salt. It is not particularly limited as long as it is soluble (miscible) in water and does not substantially dissolve the inorganic salt used. However, since the temperature rises during salt milling and the solvent becomes prone to evaporation, a high-boiling solvent with a boiling point of 120°C or higher is preferred for safety reasons. Examples of water-soluble organic solvents that can be used include 2-methoxyethanol, 2-butoxyethanol, 2-(isopentyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and liquid polypropylene glycol. The amount of water-soluble organic solvent used is preferably 5 to 1,000 parts by weight, more preferably 50 to 500 parts by weight, per 100 parts by weight of the pigment.

[0207] A resin may be added to the salt milling treatment as needed. The type of resin is not particularly limited, and examples include natural resins, modified natural resins, synthetic resins, and synthetic resins modified with natural resins. Among these, resins that are solid at room temperature and insoluble in water are preferred, and those that are partially soluble in the organic solvents are preferred. The amount of resin added is preferably 2 to 200 parts by mass per 100 parts by mass of the pigment.

[0208] [Resin (G)] The curable composition of the present invention may contain a resin (G).

[0209] Resin (G) is used, for example, for the purpose of dispersing particles such as near-infrared absorbing dye (A) in the curable composition or for the purpose of imparting resistance to the cured film. Resin (G) used primarily to disperse particles such as near-infrared absorbing dye (A) is also called a dispersion resin, and resin (G) used to impart resistance to the cured film is also called a binder resin. However, these uses of resin (G) are merely examples, and resin (G) can also be used for other purposes.

[0210] (Resin (G1)) From the viewpoints of solvent resistance, high-temperature and high-humidity resistance, and heat cycle resistance in low-temperature curing, the resin (G) preferably contains a resin (G1) (hereinafter simply referred to as resin (G1)) having a blocked isocyanate group-containing monomer unit (g1) and an acidic group-containing monomer unit (g2) as a binder resin, which allows for more rapid curing even at low temperatures and improves the resistance of the cured film.

[0211] The resin (G1) can be produced by any known method without any particular limitation, for example, by copolymerizing a monomer that forms a blocked isocyanate group-containing monomer unit (g1), a monomer that forms an acidic group-containing monomer unit (g2), and optionally other monomers copolymerizable therewith.

[0212] [Blocked isocyanate group-containing monomer unit (g1)] A blocked isocyanate group-containing monomer is a monomer in which the isocyanate group of an isocyanate group-containing monomer is protected with a compound that is released by heat (hereinafter also referred to as a blocking agent).

[0213] Examples of isocyanate group-containing monomers include 2-isocyanatoethyl (meth)acrylate, 2-isocyanatopropyl (meth)acrylate, 3-isocyanatopropyl (meth)acrylate, 2-isocyanato-1-methylethyl (meth)acrylate, 2-isocyanato-1,1-dimethylethyl (meth)acrylate, 4-isocyanatocyclohexyl (meth)acrylate, and methacryloyl isocyanate. Equimolar reaction products of 2-hydroxyalkyl (meth)acrylate and diisocyanate compounds can also be used. Among these, 2-isocyanatoethyl (meth)acrylate and 2-isocyanatopropyl (meth)acrylate are preferred.

[0214] Examples of the blocking agent include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, imide compounds, urea compounds, imine compounds, and bisulfite compounds.

[0215] Examples of the oxime compound include formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, methyl isobutyl ketoxime, cyclohexanone oxime, and benzophenone oxime, with methyl ethyl ketoxime being preferred. Examples of lactam compounds include ε-caprolactam, δ-valerolactam, γ-butyrolactam, and β-propiolactam. Examples of phenolic compounds include phenol, cresol, 2,6-xylenol, 3,5-xylenol, ethylphenol, p-tert-butylphenol, nonylphenol, methyl 2-hydroxybenzoate, methyl 4-hydroxybenzoate, p-naphthol, and p-nitrophenol, with 3,5-xylenol, methyl 2-hydroxybenzoate, and methyl 4-hydroxybenzoate being preferred. Examples of the alcohol compound include methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, phenyl cellosolve, and furfuryl alcohol. Examples of the amine compound include diphenylamine, phenylnaphthylamine, aniline, and carbazole. Examples of the active methylene compound include dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, and acetylacetone, with diethyl malonate being preferred. Examples of the pyrazole compound include pyrazole, methylpyrazole, and 3,5-dimethylpyrazole, with 3,5-dimethylpyrazole being preferred. Examples of the mercaptan compound include butyl mercaptan, thiophenol, and tert-dodecyl mercaptan. Examples of the imidazole compound include imidazole, 2-methylimidazole, 2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole. Examples of the imide compound include succinimide, maleimide, maleimide, and phthalimide. Examples of the urea compound include urea, thiourea, and ethylene urea. Examples of the imine compound include ethyleneimine and polyethyleneimine. Examples of bisulfite compounds include sodium bisulfite, potassium bisulfite, etc. These blocking agents can be used alone or in combination of two or more.

[0216] The blocking agent is preferably at least one selected from the group consisting of oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds, and from the viewpoint of protection reactions and deprotection reactions, more preferably at least one selected from the group consisting of oxime compounds, phenol compounds, active methylene compounds, and pyrazole compounds.

[0217] Examples of the blocked isocyanate group-containing monomer include the following compounds, but the present invention is not limited to these.

[0218] [ka]

[0219] Commercially available blocked isocyanate group-containing monomers include Karenz MOI-DEM (blocking agent desorption temperature: 85 to 95°C), MOI-BP (blocking agent desorption temperature: 105 to 115°C), and MOI-BM (blocking agent desorption temperature: 125 to 135°C), all manufactured by Showa Denko K.K.

[0220] From the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance, the content of the blocked isocyanate group-containing monomer unit (g1) is preferably 1 to 50 mol %, and more preferably 5 to 40 mol %, of all structural units of the resin (G1).

[0221] [Acidic group-containing monomer unit (g2)] Examples of the acidic group of the acidic group-containing monomer include a carboxyl group, a sulfonic acid group, a phosphoric acid group, etc. Among these, a carboxyl group is preferred.

[0222] Examples of the acidic group-containing monomer include (meth)acrylic acid, crotonic acid, propiolic acid, cinnamic acid, itaconic acid, itaconic anhydride, maleic acid, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, maleic anhydride, fumaric acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, 2-acryloyloxyethylhexylhydrophthalic acid, p-styrenesulfonic acid, vinylsulfonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidosulfonic acid, and 2-(meth)acryloyloxyethyl acid phosphate.

[0223] The content of the acidic group-containing monomer unit (g2) is preferably from 1 to 50 mol %, and more preferably from 5 to 40 mol %, of all the structural units of the resin (G1).

[0224] Resin (G1) may contain monomer units other than the blocked isocyanate group-containing monomer unit (g1) and the acidic group-containing monomer unit (g2), such as hydroxyl group-containing monomer units (g3), epoxy group-containing monomer units (g4), polymerizable unsaturated group-containing monomer units (g5), alicyclic hydrocarbon-containing monomer units (g6), monomer units (g7) represented by general formula (13), and other monomer units (g8).

[0225] General formula (13) [ka]

[0226] In general formula (13), R1 represents a hydrogen atom or a methyl group. R2 represents an alkylene group having 2 or 3 carbon atoms. n represents an integer of 1 to 15. When n is 2 or greater, multiple R2s may be the same or different.

[0227] [Hydroxyl group-containing monomer unit (g3)] Examples of hydroxyl group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-hydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 2-acryloyloxyethyl-2-hydroxyethyl phthalate.

[0228] [Epoxy group-containing monomer unit (g4)] Examples of epoxy group-containing monomers include oxiranyl(meth)acrylate, glycidyl(meth)acrylate, 2-methylglycidyl(meth)acrylate, 2-ethylglycidyl(meth)acrylate, 2-oxiranylethyl(meth)acrylate, 2-glycidyloxyethyl(meth)acrylate, 3,4-epoxycyclohexyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl(meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl(meth)acrylate, and 3-(3,4-epoxycyclohexylmethyloxy)propyl(meth)acrylate.

[0229] [Polymerizable unsaturated group-containing monomer unit (g5)] The resin (G1) can contain the polymerizable unsaturated group-containing monomer unit (g5) by, for example, the following methods (i) to (iii).

[0230] <Method (i)> There is a method (i) in which an acidic group of an acidic group-containing monomer is added to an epoxy group of an epoxy group-containing monomer unit (g4) contained in the resin (G1).

[0231] <Method (ii)> There is a method (ii) in which an epoxy group of an epoxy group-containing monomer is added to an acid group of an acid group-containing monomer unit (g2) contained in the resin (G1).

[0232] Furthermore, a unit obtained by further reacting an acid anhydride with the hydroxyl group generated by the reaction of the method (i) or (ii) is also useful as the polymerizable unsaturated group-containing monomer unit (g5).

[0233] Examples of the acid anhydride include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and maleic anhydride.

[0234] <Method (iii)> There is a method (iii) in which the hydroxyl group of the hydroxyl group-containing monomer unit (g3) contained in the resin (G1) is reacted with the isocyanate group of an isocyanate group-containing monomer.

[0235] Examples of the isocyanate group-containing monomer include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, and 1,1-bis[methacryloyloxy]ethyl isocyanate.

[0236] [Alicyclic hydrocarbon-containing monomer unit (g6)] Examples of the alicyclic hydrocarbon-containing monomer include isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and adamantyl (meth)acrylate.

[0237] [Monomer unit (g7) represented by general formula (13)] Examples of the monomer represented by the general formula (13) include ethylene oxide (EO) or propylene oxide (PO) modified (meth)acrylate of paracumylphenol.

[0238] [Other monomer units (g8)] Examples of the monomers forming the other monomer units (g8) include acrylic acid esters such as ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, EO- or PO-modified (meth)acrylate of phenol, EO- or PO-modified (meth)acrylate of nonylphenol, dimethylaminoethyl (meth)acrylate, and diethylaminoethyl (meth)acrylate; Aromatic vinyl compounds such as styrene, α-methylstyrene, p-vinyltoluene, p-chlorostyrene, and vinylnaphthalene; (meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; vinyl fatty acid vinyl compounds such as vinyl acetate or vinyl propionate; Phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimidoethane, 1,6-bismaleimidohexane, 3-maleimidopropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide N-substituted maleimides such as N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-3-maleimidopropionate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidohexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, and 9-maleimidoacridine; Examples include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, etc. These monomers can be used alone or in combination of two or more.

[0239] The resin (G1) can be used alone or in combination of two or more kinds.

[0240] The weight average molecular weight (Mw) of the resin (G1) is preferably from 3,000 to 50,000, more preferably from 4,000 to 40,000.

[0241] The acid value of the resin (G1) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g.

[0242] The content of resin (G1) is preferably 5% by mass or more, more preferably 10 to 100% by mass, of 100% by mass of resin (G), from the viewpoints of solvent resistance during low-temperature curing and resistance to high temperatures and humidity.

[0243] (Resin (G2)) It is also preferable that the resin (G) does not have the blocked isocyanate group-containing monomer unit (g1) described above as a binder resin, but contains a resin (G2) (hereinafter also simply referred to as resin (G2)) that has at least one monomer unit selected from the group consisting of an alicyclic hydrocarbon-containing monomer unit (g6) and a monomer unit (g7) represented by general formula (13), and a polymerizable unsaturated group-containing monomer unit (g5).

[0244] Resin (G2) may contain monomer units other than the above-mentioned (g5), (g6), and (g7), such as the above-mentioned (g2) to (g4), and (g8).

[0245] The resin (G2) can be used alone or in combination of two or more kinds.

[0246] The weight average molecular weight (Mw) of the resin (G2) is preferably from 3,000 to 50,000, more preferably from 4,000 to 40,000.

[0247] The acid value of the resin (G2) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g.

[0248] The content of resin (G2) is preferably 5% by mass or more, more preferably 10 to 100% by mass, of 100% by mass of resin (G) from the viewpoints of solvent resistance in low-temperature curing, high-temperature and high-humidity resistance, and heat cycle resistance.

[0249] (Resin (G3)) From the viewpoint of dispersibility of the near-infrared absorbing dye (A), the resin (G) preferably contains a resin (G3) as a dispersing resin.

[0250] The resin (G3) is preferably a resin having an adsorptive group that has a high affinity for particles of the near-infrared absorbing dye (A). The adsorptive group preferably has at least one of a basic group and an acidic group.

[0251] Examples of the basic group include a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a group containing a nitrogen atom such as a nitrogen-containing heterocycle.

[0252] Examples of the acidic group include a carboxyl group, a phosphoric acid group, and a sulfonic acid group.

[0253] Examples of resin types for the resin (G3) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl group-containing polycarboxylic acid esters, modified products thereof, amides formed by the reaction of poly(lower alkylene imines) with polyesters having free carboxyl groups and salts thereof, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyesters, modified polyacrylates, ethylene oxide / propylene oxide adducts, and phosphate esters.

[0254] Examples of the structure of the resin (G3) include a random structure, a block structure, a graft structure, a comb structure, and a star structure, etc. Among these, the block structure or the comb structure is preferred from the viewpoint of dispersion stability.

[0255] Specifically, the resin (G3) is Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 209 manufactured by BYK Japan. 5, 2150, 2155, 2163, 2164, Anti-Terra-U203, 204, BYK-P104, P104S, 220S, Lactimon, Lactimon-WS, Bykumen, etc.; SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 240 manufactured by Lubrizol Japan 00, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000, 76500, etc., EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4070, 4071, 4072, 4073, 4074, 4075, 4076, 4077, 4078, 4079, 4080, 4081, 4082, 4083, 4084, 4085, 4086, 4087, 4088, 4089, 4090, 4091, 4092, 4093, 4094, 4095, 4096, 4097, 4098, 4099, 5000, 5001, 5002, 5003, 5004, 5005, 5006, 5007, 5008, 5009, 5100, 5109, 5200, 5210, 5211, 5212, 5213, 5214, 5215, 52 080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc., Aji Super PA111, PB711, PB821, PB822 manufactured by Ajinomoto Fine-Techno Co., Ltd.PB824, etc., JP 2008-029901 A, JP 2009-155406 A, JP 2010-185934 A, JP 2011-157416 A, WO 2008 / 007776, JP 2008-029901 A, JP 2009-155406 A, JP 2010-185 934, JP 2011-157416 A, JP 2012-255128 A, JP 2009-251481 A, JP 2007-23195 A, JP 1996-143651 A, JP 2017-206689 A, JP 2019-095548 A, and the like.

[0256] The resin (G3) can be used alone or in combination of two or more kinds.

[0257] From the viewpoint of dispersion stability, the content of the resin (G3) is preferably from 3 to 200 parts by mass, more preferably from 5 to 100 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0258] (Resin (G4)) Resin (G) can contain a resin other than resins (G1) to (G3) (hereinafter also simply referred to as resin (G4)).

[0259] The resin (G4) is not particularly limited, and known resins can be used, such as (meth)acrylic resins, styrene resins, styrene-(meth)acrylic resins, epoxy resins, urethane resins, polycarbonate resins, polyester resins, polyether resins, polyimide resins, polyamide-imide resins, and cyclic olefin resins, which can be used alone or in combination of two or more.

[0260] The resin (G) can be used alone or in combination of two or more kinds.

[0261] The weight average molecular weight (Mw) of the resin (G) is preferably from 3,000 to 50,000, more preferably from 4,000 to 40,000.

[0262] The content of the resin (G) is preferably from 5 to 70 mass %, more preferably from 10 to 60 mass %, based on 100 mass % of the nonvolatile content of the curable composition.

[0263] [Dye derivative (H)] The curable composition of the present invention may contain a dye derivative (H).

[0264] The dye derivative (H) is not particularly limited, and examples thereof include dye derivatives having an acidic group, a basic group, a neutral group, etc. in the organic dye residue. Examples of the dye derivative (H) include compounds having an acidic substituent such as a sulfo group, a carboxy group, or a phosphate group, and amine salts thereof, compounds having a basic substituent such as a sulfonamide group or a terminal tertiary amino group, and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group. Examples of organic dyes include diketopyrrolopyrrole compounds, anthraquinone compounds, quinacridone compounds, dioxazine compounds, perinone compounds, perylene compounds, thiazine indigo compounds, triazine compounds, benzimidazolone compounds, indole compounds such as benzoisoindole, isoindoline compounds, isoindolinone compounds, quinophthalone compounds, naphthol compounds, threne compounds, metal complex compounds, azo compounds such as azo, disazo, and polyazo, squarylium compounds, and phthalocyanine compounds.

[0265] Specifically, diketopyrrolopyrrole dye derivatives are described, for example, in JP 2001-220520 A, WO 2009 / 081930 A, WO 2011 / 052617 A, WO 2012 / 102399 A, JP 2017-156397 A, WO 2016 / 035695 A, and WO 2017 / 146092 A, and phthalocyanine dye derivatives are described, for example, in JP 2007-226161 A, WO 2016 / 163351 A, and JP 2017-165820 A. Anthraquinone dye derivatives are described, for example, in JP-A-63-264674, JP-A-09-272812, JP-A-10-245501, JP-A-10-265697, JP-A-2007-079094, and WO 2009 / 025325. Quinacridone dye derivatives are described, for example, in JP-A-48-54128, JP-A-03-9961, and JP-A-2000-273383. Dioxazine dye derivatives are described, for example, in JP-A- 2011-162662, thiazine indigo dye derivatives are described, for example, in JP-A-2007-314785, triazine dye derivatives are described, for example, in JP-A-61-246261, JP-A-11-199796, JP-A-2003-165922, JP-A-2003-168208, JP-A-2004-217842, and JP-A-2007-314681, benzoisoindole dye derivatives are described, for example, in JP-A-2009-57478, and quinophthalone dye derivatives are described, for example, in JP-A-2009-57478. Examples of naphthol-based dye derivatives include those described in JP-A-2003-167112, JP-A-2006-291194, JP-A-2008-31281, and JP-A-2012-226110; examples of azo-based dye derivatives include those described in JP-A-2001-172520 and JP-A-2012-172092; and examples of squarylium-based dye derivatives include those described in WO 2020 / 054718. In these documents, the dye derivative is sometimes referred to as a derivative, a pigment derivative, a dispersant, a pigment dispersant, or simply as a compound, but the compound having a substituent such as an acidic group, a basic group, or a neutral group in the organic dye residue is synonymous with the dye derivative.

[0266] The dye derivative (H) can be used alone or in combination of two or more kinds.

[0267] The content of the dye derivative (H) is preferably from 1 to 20 parts by mass, more preferably from 2 to 10 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0268] [Thiol-based chain transfer agents (I)] The curable composition of the present invention preferably contains a thiol-based chain transfer agent (I) from the viewpoints of hardness in low-temperature curing, resistance to high temperatures and humidity, and heat cycle resistance. When the thiol-based chain transfer agent (I) is used in combination with the radical polymerization initiator (C), it generates thiyl radicals that are resistant to polymerization inhibition by oxygen during radical polymerization, thereby improving the sensitivity of the curable composition.

[0269] The thiol chain transfer agent (I) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0270] Examples of polyfunctional thiols include hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthioglycolate, Examples of the thiopropionate include erythritol tetrakisthiopropionate, trimercaptopropionic acid tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Preferred examples include ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol tetrakisthiopropionate.

[0271] The thiol chain transfer agent (I) can be used alone or in combination of two or more kinds.

[0272] The content of the thiol chain transfer agent (I) is preferably from 0.1 to 2.0 mass %, more preferably from 0.2 to 1.5 mass %, based on 100 mass % of the nonvolatile content of the curable composition.

[0273] [Sensitizer (J)] The curable composition of the present invention may contain a sensitizer (J).

[0274] Examples of the sensitizer (J) include chalcone compounds, unsaturated ketones typified by dibenzalacetone, 1,2-diketone compounds typified by benzil and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, and polymethine dyes such as oxonol compounds, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. Examples of suitable compounds include compounds such as phthalocyanine compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalylporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organic ruthenium complexes, and benzophenone compounds. Among these, thioxanthone compounds and benzophenone compounds are preferred from the viewpoint of pattern formation.

[0275] (Thioxanthone compounds) Examples of thioxanthone compounds include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0276] (benzophenone compounds) Examples of benzophenone compounds include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-aminobenzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0277] The sensitizer (J) can be used alone or in combination of two or more kinds.

[0278] The content of the sensitizer (J) is preferably from 5 to 400 parts by mass, more preferably from 10 to 300 parts by mass, relative to 100 parts by mass of the radical polymerization initiator (C).

[0279] [Leveling agent (K)] The curable composition of the present invention may contain a leveling agent (K). This further improves the wettability and drying properties of the composition to the substrate during application. Examples of the leveling agent (K) include silicone surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

[0280] Examples of silicone surfactants include linear polymers formed from siloxane bonds and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0281] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, and 3570 manufactured by BYK-Chemie Co., Ltd., and FZ-7002 and 211 manufactured by Dow Corning Toray Co., Ltd. 0, 2122, 2123, 2191, 5609, and X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, and KP-341 manufactured by Shin-Etsu Chemical Co., Ltd.

[0282] Examples of the fluorine-based surfactant include a surfactant or leveling agent having a fluorocarbon chain.

[0283] Examples of commercially available products include Surflon S-242, 243, 420, 611, 651, and 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, and 576, R-40-LM, R-41, RS-72-K, and DS-21 manufactured by DIC Corporation; FC-4430 and 4432 manufactured by Sumitomo 3M Limited; EF-PP31N09, EF-PP33G1, and EF-PP32C1 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.; and Futergent 602A manufactured by Neos Corporation.

[0284] Examples of nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myrister ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylenedistyrenated phenyl ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, and sorbitan tristearate. sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitan tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkyl imidazoline, and the like.

[0285] Commercially available products include, for example, Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, and L manufactured by Kao Corporation. S-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodor SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW- L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amit 102, 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA Pluronic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R manufactured by ADEKA Corporation, and (meth)acrylic acid (co)polymer Polyflow No. 75, No. 90, No. 95 manufactured by Kyoeisha Chemical Co., Ltd.

[0286] Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride, and ethylene oxide adducts thereof.

[0287] Examples of commercially available products include Acetamine 24, Cortamine 24P, 60W, and 86P Concentrate, manufactured by Kao Corporation.

[0288] Examples of anionic surfactants include polyoxyethylene alkyl ether sulfates, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine styrene-acrylic acid copolymers, and polyoxyethylene alkyl ether phosphates.

[0289] Examples of commercially available products include Futergent 100 and 150 manufactured by Neos Corporation, and Adeka Hope YES-25, Adekacol TS-230E, PS-440E, and EC-8600 manufactured by ADEKA Corporation.

[0290] Examples of amphoteric surfactants include alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetic acid betaine; and alkylamine oxides such as lauryldimethylamine oxide.

[0291] Commercially available products include Anhithol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, ​​and 20N manufactured by Kao Corporation.

[0292] The leveling agent (K) can be used alone or in combination of two or more kinds.

[0293] The content of the leveling agent (K) is preferably 0.001 to 2.0 mass%, more preferably 0.005 to 1.0 mass%, based on 100 mass% of the nonvolatile content of the curable composition. When an appropriate amount is contained, the balance between the coatability and adhesion of the curable composition is further improved.

[0294] [Organic solvent (L)] The curable composition of the present invention may contain an organic solvent (L).

[0295] The organic solvent (L) is not particularly limited as long as it satisfies the solubility of each component of the curable composition of the present invention and the coatability, and known compounds can be used.

[0296] Examples of the organic solvent (L) include 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methyl- Methyl butyl acetate, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, toluene, o-chlorotoluene, benzene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, gamma -butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Examples of the alkyl esters include dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, and dibasic acid esters. Among these, from the viewpoints of resin solubility and coatability, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate, alcohols such as diacetone alcohol, and ketones such as cyclohexanone are preferred.

[0297] From an environmental viewpoint, the curable composition of the present invention preferably does not substantially contain organic solvents that are aromatic hydrocarbons (toluene, xylene, benzene, chlorobenzene, etc.) "Substantially not containing" means that the content of such organic solvents in the curable composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, and more preferably 10 ppm by mass or less.

[0298] The organic solvent (L) can be used alone or in combination of two or more kinds.

[0299] The content of the organic solvent (L) is preferably an amount such that the nonvolatile content of the curable composition is 5 to 60 mass %.

[0300] [Other ingredients] The curable composition of the present invention may contain other components in addition to those described above. Examples of the other components include a polymerization inhibitor, an ultraviolet absorber, an antioxidant, a storage stabilizer, and an adhesion improver. The content of the other components can be appropriately set within a range that does not impair the effects of the present invention.

[0301] [Method for producing curable composition] The curable composition of the present invention can be produced by, for example, adding a near-infrared absorbing dye (A), a resin (G), an organic solvent (L), etc., and carrying out a dispersion treatment to produce a dispersion. Then, a radical polymerizable compound (B), a radical polymerization initiator (C), a thermosetting compound (D), a curing accelerator (E), etc. are compounded and mixed with the dispersion. The timing of compounding each material is optional. The dispersion process can also be carried out multiple times.

[0302] Examples of dispersing machines for carrying out the dispersion treatment include a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, and an attritor.

[0303] The average dispersed particle size (secondary particle size) of the near-infrared absorbing dye (A) in the dispersion is preferably from 5 to 200 nm, more preferably from 10 to 200 nm. When the particle size is appropriate, a curable composition with high dispersion stability is easily obtained.

[0304] The average dispersed particle size (secondary particle size) is measured using, for example, Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power spectrum method), with particle permeability set to absorption mode, particle shape set to non-spherical, and the D50 particle size set to the average size. The dilution solvent used for measurement is the same organic solvent used for dispersion, and it is preferable to measure samples treated with ultrasound immediately after sample preparation, as this tends to provide results with little variation.

[0305] The curable composition is preferably subjected to removal of coarse particles of 5 μm or larger, preferably coarse particles of 1 μm or larger, and more preferably coarse particles of 0.5 μm or larger, as well as contaminated dust, by means of centrifugation, filtration through a sintered filter or membrane filter, etc. The curable composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0306] <Cured film> The cured film of the present invention is a cured product of the curable composition. Curing is performed by subjecting the film formed by coating to exposure, heating, or other treatments. The cured film may have a pattern or may be a film without a pattern (flat film).

[0307] [Method of manufacturing the cured film] The method for producing the cured film is not particularly limited, and known methods can be used. When a pattern is formed by photolithography, for example, the pattern can be produced by carrying out the steps of applying a curable composition onto a substrate to form a layer of the composition, exposing the layer to light in a pattern through a mask, developing the unexposed parts with an alkali to form a patterned cured film, and heat-treating (post-baking) the pattern. Furthermore, when a pattern is formed by a dry etching method, the pattern can be produced by, for example, carrying out the steps of applying a curable composition onto a substrate to form a layer of the composition, heating the layer to form a cured film, forming a patterned photoresist layer on the cured film, and dry etching the cured film using an etching gas while using the patterned photoresist layer as a mask. In the present invention, the preparation of the cured film is preferably carried out at a temperature of 130° C. or less throughout the entire process, and more preferably at a temperature of 110° C. or less.

[0308] A manufacturing method for forming a pattern by photolithography will be described in detail below.

[0309] (Process (1)) In the step (1) of forming a composition layer, the curable composition is applied to a substrate by a method such as rotary coating, roll coating, slit coating, casting coating, or inkjet coating, and then dried (pre-baked) at a temperature of 50 to 100°C for 10 to 120 seconds using an oven, a hot plate, or the like, as needed. Examples of the substrate include a glass substrate, a resin substrate, and a silicon substrate. Examples of the resin substrate include a polycarbonate substrate, a polyester substrate, an aromatic polyamide substrate, a polyamideimide substrate, and a polyimide substrate. An organic light-emitting layer may be formed on these substrates. For example, an imaging element such as a CCD or a CMOS may be formed on the surface of the silicon substrate. If necessary, an undercoat layer may be provided on the substrate to improve adhesion with upper layers, prevent diffusion of substances, and flatten the substrate surface. The thickness of the layer is preferably 0.05 to 10.0 μm, more preferably 0.3 to 5.0 μm.

[0310] (Process (2)) In the exposure step, the layer obtained in step (1) is exposed to light in a specific pattern through a mask using an exposure device such as a stepper, thereby obtaining a cured film. Examples of active energy rays used for exposure include ultraviolet rays such as g-rays (wavelength 436 nm), h-rays (wavelength 405 nm), and i-rays (wavelength 365 nm). Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). Furthermore, the exposure may be performed by continuous irradiation with light, or by repeating irradiation and pauses of light in short cycles (for example, milliseconds or less) (pulse exposure).

[0311] (Step (3)) The cured film obtained in step (2) is subjected to an alkali development treatment, whereby the composition layer in the unexposed areas is dissolved in an alkaline aqueous solution, leaving only the cured areas, thereby obtaining a patterned cured film. Examples of the developer include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. The concentration of the developer is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11 to 13, more preferably 11.5 to 12.5. When used at an appropriate pH, it suppresses pattern roughening and peeling, and improves the remaining film rate after development.

[0312] Examples of the developing method include a dipping method, a spraying method, a puddling method, etc. The developing temperature is preferably 15 to 40° C. After the alkaline development, it is preferable to wash with pure water.

[0313] (Step (4)) In the heat treatment (post-baking), the patterned cured film obtained in step (3) is heated to sufficiently cure. The heating temperature for post-baking is preferably 130°C or lower, more preferably 110°C or lower. There is no particular lower limit to the heating temperature as long as it can promote curing, but a temperature of 50°C or higher is preferred. The heating time is preferably 5 minutes to 2 hours.

[0314] <Optical filters> The cured film of the present invention can be used for an optical filter. The optical filter is preferably, for example, an infrared cut filter or an infrared transmission filter. The optical filter of the present invention can be produced by the same method as for the cured film described above.

[0315] <Image display device> The cured film of the present invention can be used in image display devices. Examples of image display devices include liquid crystal displays and organic EL displays. The form in which the cured film is used in an image display device is not particularly limited, and the cured film can be used as a color filter, a black matrix, a light-shielding filter, an infrared-cut filter, or an infrared-transmitting filter. The configuration used for the image display device is not particularly limited as long as it functions as an image display device. For example, the configuration described in "Next Generation Liquid Crystal Display Technology" (by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994) can be mentioned. The definition of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Sasaki Akio, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Ibuki Nobuaki, published by Sangyo Tosho Co., Ltd. in 1989).

[0316] <Solid-state imaging element> The cured film of the present invention can be used in solid-state imaging devices. The solid-state imaging device may be configured in any manner, including, but not limited to, a substrate having multiple photodiodes and transfer electrodes made of polysilicon or the like that constitute the light-receiving area of ​​a solid-state imaging device (e.g., CCD image sensor, CMOS image sensor), a light-shielding film formed on the photodiodes and transfer electrodes with only the light-receiving portions of the photodiodes exposed, a device protective film made of silicon nitride or the like formed on the light-shielding film to cover the entire light-shielding film and the light-receiving portions of the photodiodes, and a filter on the device protective film. Furthermore, the device protective film may have a light-focusing means (e.g., a microlens, etc.; the same applies hereinafter) below the filter (closer to the substrate) on the device protective film, or a light-focusing means on the filter. The filter may also have a structure in which the cured film forming each color pixel is embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a low refractive index relative to the color pixels. An imaging device including the solid-state imaging element of the present invention can be used for various purposes, such as digital cameras, electronic devices with imaging functions (such as mobile phones and smartphones), vehicle-mounted cameras, surveillance cameras, and optical sensors.

[0317] <Infrared sensor> The cured film of the present invention can be used in an infrared sensor. Fig. 1 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor including the cured film of the present invention. The infrared sensor 300 shown in Fig. 1 includes a solid-state imaging element 310.

[0318] The imaging area provided on the solid-state imaging device 310 is configured by combining an infrared cut filter 311 and a color filter 312 . The infrared cut filter 311 transmits light in the visible light range (for example, light with a wavelength of 400 to 700 nm) and blocks light in the infrared range (for example, light with a wavelength of 800 to 1300 nm). The color filter 312 is a color filter formed with pixels that transmit and absorb light of specific wavelengths in the visible light range, and for example, a color filter formed with red (R), green (G), and blue (B) pixels is used.

[0319] Between the infrared transmission filter 313 and the solid-state imaging element 310, a resin film 314 that is capable of transmitting light of the wavelength that has passed through the infrared transmission filter 313 is disposed. The infrared transmission filter 313 is a filter that has visible light blocking properties and transmits infrared light of a specific wavelength, and contains the near-infrared absorbing dye (A) described above and two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments, and violet pigments as the colorant (F) (to exhibit black), or the cured film of the present invention containing a black pigment can be used. The infrared transmission filter 113 preferably blocks light with a wavelength of 400 to 830 nm and transmits light with a wavelength of 900 to 1,300 nm, for example.

[0320] A microlens 315 is disposed on the incident light side of the color filter 312 and the infrared transmission filter 313. A planarization film 316 is formed so as to cover the microlens 315.

[0321] In the embodiment shown in FIG. 1, the resin film 314 is disposed, but instead of the resin film 314, an infrared transmission filter 313 may be formed.

[0322] The cured film of the present invention can be used as a light-shielding film for the edge and / or side surfaces of the surface of the infrared cut filter 311, and when used on the inner wall of an infrared sensor, it can prevent internal reflection and / or the incidence of unwanted light into the light-receiving section, thereby improving sensitivity.

[0323] This infrared sensor can simultaneously capture image information, enabling motion sensing that recognizes the movement of an object. Furthermore, this infrared sensor can also acquire distance information, making it possible to capture images that include 3D information. Furthermore, this infrared sensor can also be used as a biometric authentication sensor. [Example]

[0324] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" means "parts by mass" and "%" means "% by mass." In the present invention, the nonvolatile content or nonvolatile content concentration refers to the mass remaining after leaving the sample to stand in an oven at 230°C for 30 minutes.

[0325] Before describing the examples, each measurement method will be explained.

[0326] The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH / g), and amine value (mgKOH / g) of the resin are measured as follows.

[0327] (average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with an RI detector. The instrument used was an HLC-8220GPC (Tosoh Corporation). Two separation columns were connected in series, and both columns were packed with "TSK-GEL SUPER HZM-N" packing. Measurements were performed at an oven temperature of 40°C, a tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1% by mass of the above eluent, and 20 microliters was injected. The molecular weight is expressed in terms of polystyrene.

[0328] (resin acid value) 80 ml of acetone and 10 ml of water were added to 0.5 to 1 g of resin solution, and the mixture was stirred to dissolve uniformly. The solution was titrated using an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) with a 0.1 mol / L KOH aqueous solution as the titrant to measure the acid value (mg KOH / g). The acid value per unit of nonvolatile content of the resin was calculated from the acid value of the resin solution and the concentration of nonvolatile content of the resin solution.

[0329] (Amine value of resin) The amine value of the resin is the total amine value (mgKOH / g) measured in accordance with the method of ASTM D 2074 and converted into nonvolatile content.

[0330] <Production of near-infrared absorbing dye (A)> (Near-infrared absorbing dye (A-1)) 400 parts of toluene were mixed with 40.0 parts of 1,8-diaminonaphthalene, 32.2 parts of 3,5-dimethylcyclohexanone, and 0.087 parts of p-toluenesulfonic acid monohydrate, and the mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 3 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was completed, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The resulting brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, and 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione was added. The mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 8 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was completed, the solvent was distilled off, and 200 parts of hexane was added to the resulting reaction mixture while stirring. The resulting black-brown precipitate was filtered off, washed successively with hexane, ethanol, and acetone, and dried under reduced pressure to obtain near-infrared absorbing dye (A-1) represented by the following chemical formula (14). 50 parts of the resulting near-infrared absorbing dye (A-1), 500 parts of sodium chloride, and 60 parts of diethylene glycol were placed in a stainless steel gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 12 hours. The kneaded mixture was then poured into warm water and stirred for 1 hour while heated to approximately 80°C to form a slurry. The mixture was then filtered and washed with water to remove the sodium chloride and diethylene glycol, and then dried overnight at 80°C and pulverized to obtain a finely divided near-infrared absorbing dye (A-1).

[0331] Chemical formula (14) [ka]

[0332] (Near-infrared absorbing dye (A-2)) In a reaction vessel, 26 parts of phthalonitrile, 143 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 34 parts of aluminum trichloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution was cooled to 30°C while stirring, and poured into a mixed solvent consisting of 5,000 parts of methanol and 10,000 parts of ion-exchanged water while stirring, yielding a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts of methanol and 4,000 parts of ion-exchanged water, and dried to obtain compound a. Next, in a reaction vessel, 140 parts of compound a was added to 1,500 parts of concentrated sulfuric acid in an ice bath, and the mixture was stirred for 1 hour. Subsequently, this sulfuric acid solution was poured into 1,000 parts of cold water at 3°C, and the resulting precipitate was filtered, washed with water, washed with a 2.5% aqueous sodium hydroxide solution, and washed with water again, and then dried to obtain compound b. Five parts of diphenyl phosphate were added to 200 parts of N-methylpyrrolidone, thoroughly stirred, and then heated to 50°C. 10 parts of compound b were gradually added to this solution, and the mixture was stirred at 90°C for 120 minutes. The end point of the reaction was confirmed, for example, by dropping the reaction solution onto filter paper and determining when no bleeding occurred. Subsequently, this reaction solution was poured into 2,000 parts of ion-exchanged water, and the resulting precipitate was filtered, washed with water, and dried to obtain a near-infrared absorbing dye (A-2), which is a mixture of compounds represented by the following chemical formula (15) (mixing ratio: n1:n2:n3:n4=7:19:59:15). The near-infrared absorbing dye (A-1) was pulverized in the same manner as in the near-infrared absorbing dye (A-1).

[0333] Chemical formula (15) [ka]

[0334] (Near-infrared absorbing dye (A-3)) According to the description in WO 2019 / 058882, a near-infrared absorbing dye (A-3) represented by the following chemical formula (16) was obtained. The near-infrared absorbing dye (A-1) was pulverized in the same manner as in the near-infrared absorbing dye (A-1).

[0335] Chemical formula (16) [ka]

[0336] (Near-infrared absorbing dye (A-4)) In a reaction vessel, 10.7 parts of aniline, 120 parts of bromobenzene, and 25.7 parts of diazabicyclooctane were added and stirred. Then, 95.2 parts of a 1 mol / L toluene solution of titanium tetrachloride was added dropwise. After the dropwise addition, 10.0 parts of indigo was added and refluxed for 10 hours. After the reaction was completed, methanol was added and the mixture was filtered to obtain a green powder. This was separated with dichloromethane and water, and the organic layer was concentrated to obtain 14.6 parts of compound c. In a reaction vessel, 13.5 parts of compound c, 9.0 parts of bis(2,4-pentanedionato)zinc(II), and 120 parts of tetrahydrofuran were mixed and stirred, and the mixture was heated to 40°C and stirred for 5 hours. The reaction solution was cooled to 30°C while still stirring, and then poured into 500 parts of methanol with stirring to obtain a blue slurry. This slurry was filtered, washed with 500 parts of methanol, then washed with 500 parts of ion-exchanged water, and dried to obtain a near-infrared absorbing dye (A-4), which is a mixture of compounds represented by the following chemical formula (17) (mixing ratio: dimer: trimer: tetramer = 81:17:2). The near-infrared absorbing dye (A-1) was pulverized in the same manner as in the near-infrared absorbing dye (A-1).

[0337] Chemical formula (17) [ka]

[0338] <Production of Resin (G)> (Resin (G1-1) solution) A flask equipped with a stirrer, dropping funnel, condenser, thermometer, and gas inlet tube was charged with 100 parts of propylene glycol monomethyl ether acetate (PGMAc), which was then stirred while purging with nitrogen and heated to 78 ° C. Next, a mixture of 25.2 parts of Karenz MOI-DEM (2-methyl-1-oxo-2-propenyl oxyethyl amino carbonyl 1,3-diethyl malonate manufactured by Showa Denko K.K.), 20.7 parts of methacrylic acid, 31.2 parts of 2-hydroxyethyl methacrylate, 37.5 parts of dicyclopentanyl methacrylate, and 27.0 parts of methyl methacrylate, and 12.0 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) (polymerization initiator) dissolved in 50 parts of PGMAc, was added dropwise from the dropping funnel to the flask. After the dropwise addition was completed, the mixture was stirred at 78°C for 3 hours. Thereafter, PGMAc was added so that the nonvolatile content became 40% by mass, thereby preparing a resin (G1-1) solution. The resin (G1-1) had an acid value of 74 mgKOH / g and a weight-average molecular weight of 8,000.

[0339] (Resin (G2-1) solution) 100 parts of PGMAc was placed in a separable four-neck flask equipped with a thermometer, a condenser, a nitrogen gas inlet tube, and a stirrer as a reaction vessel, and the vessel was heated to 120°C while nitrogen gas was injected into the vessel. At the same temperature, a mixture of 85.29 parts of glycidyl methacrylate, 66.01 parts of dicyclopentanyl methacrylate, and 10.42 parts of styrene, and a polymerization initiator prepared by dissolving 0.5 parts of azobisisobutyronitrile in PGMAc were added dropwise from the dropping tube over 2.5 hours to carry out a polymerization reaction. Next, the atmosphere in the flask was replaced with air, and 43.24 parts of acrylic acid, 0.3 parts of trisdimethylaminomethylphenol, and 0.3 parts of hydroquinone were added, followed by a reaction at 120°C for 5 hours, which allowed the epoxy group of glycidyl methacrylate to react with the carboxyl group of acrylic acid. Further, 52.64 parts of tetrahydrophthalic anhydride and 0.5 parts of triethylamine were added and reacted at 120°C for 4 hours. This caused an esterification reaction between the hydroxyl groups generated by glycidyl methacrylate and acrylic acid and tetrahydrophthalic anhydride. Subsequently, PGMAc was added to obtain a nonvolatile content of 40% by mass, thereby preparing a resin (G2-1) solution. The weight-average molecular weight (Mw) was 30,000, and the acid value was 77 mgKOH / g.

[0340] (Resin (G2-2) solution) A separable four-neck flask was fitted with a thermometer, a condenser, a nitrogen gas inlet tube, a dropping tube, and a stirrer. 207 parts of PGMAc was charged into the reaction vessel, which was then heated to 80°C and purged with nitrogen. A mixture of 20 parts of methacrylic acid, 8.5 parts of 2-hydroxyethyl methacrylate, 20 parts of paracumylphenol ethylene oxide-modified acrylate ("Aronix M110" manufactured by Toagosei Co., Ltd.), 20 parts of benzyl methacrylate, 25 parts of methyl methacrylate, and 1.33 parts of 2,2'-azobisisobutyronitrile was added dropwise over 2 hours. After the dropwise addition was completed, the reaction was continued for another 3 hours. Next, the nitrogen gas was stopped, and dry air was injected for 1 hour while stirring. After cooling to room temperature, a mixture of 6.5 parts of 2-methacryloyloxyethyl isocyanate (Karends MOI, manufactured by Showa Denko K.K.), 0.08 parts of dibutyltin laurate, and 6 parts of PGMAc was added dropwise at 70°C over 3 hours. After completion of the dropwise addition, the reaction was continued for another hour, and then PGMAc was added to adjust the nonvolatile content to 40% by mass to prepare a resin (G2-2) solution. The weight-average molecular weight (Mw) was 18,000, and the acid value was 130 mgKOH / g.

[0341] (Resin (G3-1) solution) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 40 parts of methyl methacrylate, 10 parts of n-butyl methacrylate, and 13.2 parts of tetramethylethylenediamine as a catalyst. The mixture was stirred at 50 °C for 1 hour under a nitrogen stream, and the system was then purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate as an initiator, 5.6 parts of cuprous chloride as a catalyst, and 100 parts of PGMAc were charged. The temperature was raised to 110 °C under a nitrogen stream to initiate polymerization of the first block (B block). After 4 hours of polymerization, a sample was taken of the polymerization solution and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion was 98% or higher. Next, 50 parts of PGMAc, 40 parts of dimethylaminoethyl methacrylate as a second block (A block) monomer, and 10 parts of methacryloyloxyethyl benzyl dimethyl ammonium chloride were added to the reactor. The reaction was continued at 110 °C under a nitrogen atmosphere with stirring. Two hours after addition, the polymerization solution was sampled and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion rate of the second block (A block) was 98% or higher. The reaction solution was then cooled to room temperature to terminate the polymerization. After cooling to room temperature, approximately 2 g of the solution was sampled and dried at 180 °C for 20 minutes to measure the nonvolatile content. PGMAc was added to obtain a nonvolatile content of 30% by mass, resulting in a resin (G3-1) solution. The weight-average molecular weight was 20,000, and the amine value was 169.8 mg KOH / g.

[0342] (Resin (G3-2) solution) A reaction vessel equipped with a gas inlet tube, thermometer, condenser, and stirrer was charged with 108 parts of 1-thioglycerol, 174 parts of pyromellitic anhydride, 650 parts of PGMAc, and 0.2 parts of monobutyltin oxide as a catalyst. The atmosphere was purged with nitrogen gas, and the reaction was carried out at 120 °C for 5 hours (Step 1). Measurement of the acid value confirmed that more than 95% of the acid anhydride was half-esterified. Next, 160 parts (based on nonvolatile content) of the compound obtained in Step 1, 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tert-butyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc were charged, and the reaction vessel was heated to 80 °C. 1.2 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) was added, and the reaction was carried out for 12 hours (Step 2). It was confirmed by measuring the nonvolatile content that 95% had reacted. Finally, 500 parts of a 50% PGMAc solution of the compound obtained in the second step, 27.0 parts of 2-methacryloyloxyethyl isocyanate (MOI), and 0.1 parts of hydroquinone were added, and IR showed a 2270 cm peak due to the isocyanate group. -1 The reaction was continued until the disappearance of the peak was confirmed (third step). After the disappearance of the peak was confirmed, the reaction solution was cooled, and PGMAc was added to the solution so that the nonvolatile content was 30% by mass, to prepare a resin (G3-2) solution. The weight-average molecular weight was 13,000, and the acid value was 68 mgKOH / g.

[0343] <Production of Colorant (F)> (Finely divided green pigment (F-1)) 100 parts of CI Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 70° C. This kneaded mixture was poured into 3,000 parts of warm water, and stirred for 1 hour with a high-speed mixer while heated to 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided green pigment (F-1).

[0344] (Finely divided red pigment (F-2)) 100 parts of CI Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 60°C. This kneaded mixture was added to 3,000 parts of warm water, and while heated to approximately 70°C, it was stirred for 1 hour using a high-speed mixer to form a slurry, which was then filtered and washed with water to remove the sodium chloride and diethylene glycol. After that, it was dried overnight at 80°C and pulverized to obtain a finely divided red pigment (F-2).

[0345] (Finely divided blue pigment (F-3)) 100 parts of CI Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 50° C. This kneaded mixture was added to 3,000 parts of warm water, and while heated to about 70° C., it was stirred in a high-speed mixer for about 1 hour to form a slurry, which was then filtered and washed repeatedly with water to remove the salt and solvent, dried at 80° C. for 24 hours, and pulverized to obtain a finely divided blue pigment (F-3).

[0346] (Finely divided yellow pigment (F-4)) 100 parts of CI Pigment Yellow 138, 800 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This kneaded mixture was added to 3,000 parts of warm water, and while heated to about 70° C., it was stirred in a high-speed mixer for about 1 hour to form a slurry, which was then filtered and washed repeatedly with water to remove the sodium chloride and diethylene glycol.The slurry was then dried overnight at 80° C. and pulverized to obtain a finely divided yellow pigment (F-4).

[0347] (Finely divided purple pigment (F-5)) 100 parts of CI Pigment Violet 23, 800 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This kneaded mixture was added to 3,000 parts of warm water, and while heated to about 70° C., it was stirred in a high-speed mixer for about 1 hour to form a slurry, which was then filtered and washed repeatedly with water to remove the sodium chloride and diethylene glycol.The slurry was then dried overnight at 80° C. and pulverized to obtain a finely divided purple pigment (F-5).

[0348] (Finely divided black pigment (F-6)) 100 parts of CI Pigment Black 32, 800 parts of pulverized sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This kneaded mixture was added to 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heated to about 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided black pigment (F-6).

[0349] <Preparation of Dispersion> (Dispersion 1) The following raw materials were mixed and stirred until uniform, then dispersed in an Eiger mill (Eiger Japan, "Mini Model M-250 MKII") using zirconia beads with a diameter of 0.5 mm for 3 hours, and then filtered through a filter with a pore size of 1.0 μm to produce Dispersion 1. The organic solvent (L-1) was PGMAc. Near-infrared absorbing dye (A-1): 15.0 parts Resin (G3-1) solution: 20.0 parts Organic solvent (L-1): 65.0 parts

[0350] (Dispersion 2~10) Dispersions 2 to 10 were prepared in the same manner as Dispersion 1, except that the raw materials and amounts shown in Table 2 were changed.

[0351] [Table 2]

[0352] <Production of Curable Composition> [Example 1] (Curable composition 1) The following raw materials were mixed and stirred, and the mixture was filtered through a filter with a pore size of 1.0 μm to obtain a curable composition 1. Dispersion 2: 35.0 parts Radical polymerizable compound (B-1): 5.0 parts Radical polymerization initiator (C-1): 0.5 parts Radical polymerization initiator (C-3): 0.2 parts Thermosetting compound (D-1): 2.0 parts Curing accelerator (E-1): 0.6 parts Curing accelerator (E-4): 0.02 parts Thiol chain transfer agent (I-1): 0.2 parts Resin (G1-1) solution: 12.0 parts Leveling agent (K): 1.0 part Organic solvent (L): 43.48 parts

[0353] [Examples 2 to 34, Comparative Example 1] (Curable composition 2-35) Curable compositions 2 to 35 were prepared in the same manner as in Example 1, except that the raw materials and amounts of curable composition 1 in Example 1 were changed to those shown in Tables 3-1 to 3-4.

[0354] [Table 3-1]

[0355] [Table 3-2]

[0356] [Table 3-3]

[0357] [Table 3-4]

[0358] The raw materials listed in Tables 3-1 to 3-4 are as follows:

[0359] [Radical polymerizable compound (B)] B-1: Aronix M-305 (manufactured by Toagosei) B-2: Aronix MT-3041 (manufactured by Toagosei) B-3: Aronix M-510 (manufactured by Toagosei)

[0360] [Radical polymerization initiator (C)] C-1: The following compound [ka]

[0361] C-2: Omnirad184 (manufactured by IGM Resins) C-3:TRONLY TR-PBG-345 (manufactured by Changzhou Strong New Materials Co., Ltd.) C-4: Benzopinacol (Tokyo Chemical Industry Co., Ltd.)

[0362] [Thermosetting compound (D)] D-1: EHPE-3150 (manufactured by Daicel Corporation, a compound represented by general formula (3), with approximately 15 epoxy groups and an epoxy equivalent of 170 to 190 g / eq) D-2: Epolead GT401 (manufactured by Daicel Corporation, an epoxy compound with an aliphatic ring, three epoxy groups, and an epoxy equivalent of 200-240 g / eq) D-3: EPICLON N-770 (DIC Corporation, epoxy compound with aromatic ring, 8 epoxy groups, epoxy equivalent weight 180-200g / eq) D-4: EPICLON HP-4700 (DIC Corporation, epoxy compound with aromatic ring, 4 epoxy groups, epoxy equivalent weight 155-170g / eq)

[0363] [Curing accelerator (E)] (Compound represented by general formula (1)) E-1: 10% PGMAc solution of 1-benzyl-2-methylimidazole E-2: 10% PGMAc solution of 1-benzyl-2-phenylimidazole E-3: 10% PGMAc solution of 1-benzylimidazole

[0364] (Compound represented by general formula (2)) E-4: 10% PGMAc solution of 2-methylimidazole E-5: 10% PGMAc solution of 2-phenylimidazole E-6: 10% PGMAc solution of imidazole

[0365] (Imidazole compounds other than compounds represented by general formulas (1) and (2)) E-7: 10% PGMAc solution of 1,2-dimethylimidazole E-8: 10% PGMAc solution of 1-cyanoethyl-2-ethyl-4-methylimidazole

[0366] [Thiol-based chain transfer agents (I)] I-1: Pentaerythritol tetrakis(3-mercaptopropionate) I-2: Pentaerythritol tetrakis(3-mercaptobutyrate)

[0367] [Leveling agent (K)] K-1: BYK-330 (manufactured by BYK-Chemie) K-2: Megafac F-554 (DIC) One part each of (K-1) and (K-2) was mixed and dissolved in 98 parts of PGMAc to prepare a mixed solution, which was used as a leveling agent (K).

[0368] [Organic solvent (L)] J-1: 30 parts of propylene glycol monomethyl ether acetate J-2: Cyclohexanone 30 parts J-3: 10 parts of ethyl 3-ethoxypropionate J-4: Propylene glycol monomethyl ether 10 parts J-5: Cyclohexanol acetate 10 parts J-6: Dipropylene glycol methyl ether acetate 10 parts The above (L-1) to (L-6) were mixed in the above-mentioned parts by mass to prepare the organic solvent (L).

[0369] <Evaluation of Curable Composition> The obtained curable compositions 1 to 35 (Examples 1 to 34, Comparative Example 1) were evaluated as follows. The evaluation results are shown in Table 4.

[0370] [Solvent resistance evaluation] The obtained curable composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, after cooling the substrate to room temperature, the substrate was heated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , 50mJ / cm 2 The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 100°C for 60 minutes to obtain an evaluation substrate. The obtained evaluation substrate was immersed in propylene glycol monomethyl ether acetate at room temperature for 15 minutes, then washed with ion-exchanged water and air-dried, and the 100 μm wide stripe pattern was observed using an optical microscope. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: No change in appearance or color. 4: Slight wrinkles, etc., occur, but there is no change in color. 3: Some wrinkles or other imperfections occur, but there is no change in color. 2: Wrinkles and other imperfections appear all over the surface, and the color fades slightly. 1: Peeling and fading occur.

[0371] [High temperature and humidity resistance evaluation (1): Adhesion] The obtained curable composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, after cooling the substrate to room temperature, the substrate was heated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , 50mJ / cm 2 After cooling the substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was then post-baked in a clean oven at 100°C for 60 minutes to obtain a substrate for evaluation. The resulting cured film was cut with a utility knife to form a 1 mm square grid pattern (100 squares) and stored for 3 hours at a temperature of 120°C and humidity of 100%. After storage, a transparent adhesive tape (CT-24 manufactured by Nichiban Co., Ltd.) was firmly pressed onto the film and peeled off in a direction of approximately 180°C. The state of the grid patterns was observed, and the number of peeled grid patterns was counted. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5:0 pieces 4: 1 or more, less than 5 3: 5 or more, less than 10 2: 10 or more, less than 15 1:15 pieces or more

[0372] [High temperature and humidity resistance evaluation (2): Foreign matter] The obtained curable composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dry film thickness was 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, an ultra-high pressure mercury lamp was used to apply the coating with an illuminance of 30 mW / cm. 2 , 50mJ / cm 2The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 100°C for 60 minutes, forming a stripe pattern on the substrate. The obtained substrate was stored for 200 hours under conditions of a temperature of 85°C and a humidity of 85%. After storage, the number of foreign particles on the pattern was counted using an optical microscope. The evaluation criteria are as follows, with 3 or more being practical. 5: Fewer than 5 foreign objects 4: 5 or more but less than 10 foreign objects 3: 10 or more but less than 15 foreign objects 2: The number of foreign objects is 15 or more but less than 20 1: 20 or more foreign objects

[0373] [Heat cycle resistance evaluation] The obtained curable composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dry film thickness was 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, after cooling the substrate to room temperature, the coating was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm through a photomask with a 100 μm stripe pattern. 2 , 50mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, washed with ion-exchanged water, air-dried, and post-baked in a clean oven at 100°C for 60 minutes to obtain an evaluation substrate. The obtained substrate was subjected to 500 cycles of temperature increase and decrease, with 10 minutes at -20°C and 10 minutes at 100°C, and the pattern was observed using an optical microscope. The evaluation criteria are as follows, with 3 or higher being practical. 5: No abnormalities in appearance after 500 cycles 4: Slight cracking and / or peeling occurs at 500 cycles 3: After 500 cycles, some cracks and / or peeling occurred 2: Cracks and / or peeling occurs after 200 cycles 1:100 cycles before cracking and / or peeling

[0374] [Table 4] [Explanation of symbols]

[0375] 300 Infrared Sensor 310 Solid-state imaging device 311 Infrared cut filter 312 Color Filter 313 Infrared transmission filter 314 Resin Film 315 Microlens 316 Flat membrane

Claims

1. A curable composition comprising a near-infrared absorbing dye (A), a radical polymerizable compound (B), a radical polymerization initiator (C), a thermosetting compound (D), and a curing accelerator (E), the curing accelerator (E) contains at least two imidazole compounds, The imidazole compound includes a compound represented by the following general formula (1) and a compound represented by the following general formula (2): The content of the compound represented by the general formula (1) is 50 mass% or more in 100 mass% of the curing accelerator (E). General formula (1) 【Chemistry 1】 (In general formula (1), X 1 to X 3 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms.) General formula (2) 【Chemistry 2】 (In general formula (2), X 4 represents one selected from the group consisting of a methyl group, an ethyl group, and a phenyl group, and X 5 and X 6 each independently represent one selected from the group consisting of a hydrogen atom, a methyl group, and an ethyl group.)

2. The curable composition according to claim 1 , wherein the thermosetting compound (D) comprises an epoxy compound having an aliphatic ring.

3. The curable composition according to claim 2 , wherein the epoxy compound having an aliphatic ring comprises a compound represented by the following general formula (3): General formula (3) 【Transformation 3】 (In general formula (3), R represents a group obtained by removing m hydroxyl groups from an m-hydric alcohol, m represents an integer of 1 to 6, and n represents an integer of 1 to 30.)

4. The curable composition according to any one of claims 1 to 3, further comprising a colorant (F).

5. A cured film which is a cured product of the curable composition according to any one of claims 1 to 4.

6. An optical filter comprising the cured film according to claim 5 .

7. An image display device comprising the cured film according to claim 5 .

8. A solid-state imaging device comprising the cured film according to claim 5 .

9. An infrared sensor comprising the cured film according to claim 5 .

Images