Imaging unit

Abstract

The present disclosure provides an imaging unit in which wiring of a piezoelectric element and wiring of an imaging element can be integrated. The imaging unit (100) of the present disclosure comprises an outermost layer lens (1) (transparent body), a housing (2), a vibration body (3), a piezoelectric element (7), an inner layer lens (4) (lens), a fixing unit (5), an imaging element (8), an imaging control substrate (9) (first substrate), and a case (10). The vibration body (3) vibrates the outermost layer lens (1) held by the housing (2). The piezoelectric element (7) is provided on at least one surface of the vibration body (3). The case (10) is coupled to the housing (2) and contains at least the imaging element (8) and the imaging control substrate (9). Wiring (6) electrically connected to the piezoelectric element (7) is led out from inside the housing (2) so as to pass through a plane that includes the mounting surface of the imaging control substrate (9) to which the imaging element (8) is mounted.

Description

[Technical Field]

[0001] The present disclosure relates to an imaging unit. [Background technology]

[0002] Imaging units are installed in the front or rear of a vehicle, and images obtained by the imaging units are used to control safety devices and drive assistance controls. Because such imaging units are often installed outside the vehicle, foreign matter such as raindrops (water droplets), mud, and dust can adhere to the transparent bodies (protective covers and lenses) that cover the exterior. When foreign matter adheres to the transparent bodies, the foreign matter is reflected in the images obtained by the imaging unit, making it difficult to obtain clear images.

[0003] Therefore, the imaging unit described in JP 2017-170303 A (Patent Document 1) or U.S. Patent No. 9,454,003 (Patent Document 2) is provided with a vibrator that vibrates the light-transmitting body to remove foreign matter adhering to the surface of the light-transmitting body. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-170303 [Patent Document 2] U.S. Patent No. 9,454,003 Summary of the Invention [Problem to be solved by the invention]

[0005] In the imaging units described in Patent Document 1 or Patent Document 2, a piezoelectric element is provided on a vibrating body to vibrate a transparent body. Therefore, wiring is required to supply a control signal (AC signal) to drive the piezoelectric element. However, in the imaging unit described in Patent Document 1, the wiring is provided on the outside of the transparent body, so waterproofing is required for the wiring, making it difficult to integrate the wiring for the piezoelectric element and the wiring for the imaging element.

[0006] Furthermore, in the imaging unit described in Patent Document 2, a through-hole is provided in the housing and wiring is led out to the outside through the through-hole, which makes it easy for moisture, dust, etc. to get in. Furthermore, even in the imaging unit described in Patent Document 2, it is difficult to integrate the wiring of the piezoelectric element with the wiring of the imaging element inside the housing.

[0007] Therefore, an object of the present disclosure is to provide an imaging unit in which the wiring of the piezoelectric element and the wiring of the imaging element can be integrated. [Means for solving the problem]

[0008] An imaging unit according to one embodiment of the present disclosure includes a light-transmitting body, a housing, a vibrating body, a piezoelectric element, a lens, a fixing portion, an image sensor, a first substrate, and a case. The light-transmitting body transmits light of a predetermined wavelength. The housing holds the light-transmitting body. The vibrating body vibrates the light-transmitting body held in the housing. The piezoelectric element is provided on at least one surface of the vibrating body. The lens is provided in a position facing the light-transmitting body within the housing. The fixing portion fixes the lens at a portion of the housing that is a node of vibration caused by the vibrating body. The image sensor is disposed so that the light-transmitting body and the lens are in the field of view. The first substrate is electrically connected to the image sensor on a surface opposite the surface in the field of view. The case is joined to the housing and contains at least the image sensor and the first substrate. Wiring electrically connected to the piezoelectric element is drawn out from within the housing to pass through a plane including the mounting surface of the first substrate on which the image sensor is mounted. [Effects of the Invention]

[0009] According to the present disclosure, the imaging unit has wiring electrically connected to the piezoelectric element that is drawn out from inside the housing so as to pass through a plane that includes the mounting surface of the first substrate on which the imaging element is mounted, thereby making it possible to integrate the wiring of the piezoelectric element and the wiring of the imaging element. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a cross-sectional view of the imaging unit according to the first embodiment. [Figure 2] FIG. 2 is a plan view of wiring of the piezoelectric element according to the first embodiment. [Figure 3] 3 is a schematic diagram for explaining a method of assembling the imaging unit according to the first embodiment. FIG. [Figure 4] 3 is a schematic diagram for explaining a method of assembling the imaging unit according to the first embodiment. FIG. [Figure 5] FIG. 10 is a cross-sectional view of an imaging unit according to a second embodiment. [Figure 6] FIG. 10 is a plan view showing a notch provided in a connection portion. [Figure 7] FIG. 11 is a cross-sectional view of an imaging unit according to a third embodiment. [Figure 8] FIG. 10 is a perspective view of an imaging unit having a slit in the case for pulling out wires. [Figure 9] FIG. 10 is a cross-sectional view of an imaging unit according to a fourth embodiment. [Figure 10] FIG. 13 is a cross-sectional view of an imaging unit according to a modification of the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] An imaging unit according to an embodiment will be described in detail below with reference to the drawings. Note that the same reference numerals in the drawings indicate the same or corresponding parts. The imaging unit described below is, for example, applied to an in-vehicle device, and can vibrate a transparent body (e.g., the outermost lens) to remove foreign matter adhering to the surface of the transparent body. The imaging unit is not limited to in-vehicle applications. For example, the imaging unit can also be applied to security surveillance cameras, drones, etc.

[0012] (Embodiment 1) 1 is a cross-sectional view of an imaging unit 100 according to embodiment 1. The imaging unit 100 includes an outermost lens 1, a housing 2, a vibrating body 3, an inner lens 4, a fixing portion 5, a piezoelectric element 7, an imaging element 8, an imaging control board 9 (first board), a case 10, and a vibration control board 11 (second board).

[0013] The outermost lens 1 is a translucent body that transmits light of a predetermined wavelength (for example, a wavelength of visible light or a wavelength that can be captured by an imaging element), and is, for example, a convex meniscus lens. Note that the imaging unit 100 may use a transparent member such as a protective cover instead of the outermost lens 1. The protective cover is made of glass or a resin such as transparent plastic.

[0014] The edge of the outermost lens 1 is held by the edge of the housing 2. 2 In order to vibrate the outermost lens 1 held in the housing 2, a vibrating body 3 is provided at a position in contact with the outermost lens 1. The housing 2 and the vibrating body 3 may be integrated as in a third embodiment described later.

[0015] The vibrating body 3 has a cylindrical shape, and the inner lens 4 is disposed inside the cylinder. The vibrating body 3 has a connecting portion 31 that connects to the outermost lens 1 (translucent body) and a vibrating portion 32 that has the piezoelectric element 7. The connecting portion 31 converts the vibration of the piezoelectric element 7 and is crank-shaped. On the other hand, the vibrating portion 32 vibrates along with the vibration of the piezoelectric element 7 and is thicker than the thin connecting portion 31. The connecting portion 31 and the vibrating portion 32 may be formed integrally or separately. The piezoelectric element 7 is provided on the surface of the vibrating body 3 opposite the side that contacts the outermost lens 1. The piezoelectric element 7 has a hollow circular shape and vibrates, for example, by polarization in the thickness direction. The piezoelectric element 7 is made of lead zirconate titanate piezoelectric ceramic. However, other piezoelectric ceramics such as (K,Na)NbO3 may also be used. Furthermore, a piezoelectric single crystal such as LiTaO3 may also be used.

[0016] The piezoelectric element 7 has a first electrode 7a on the surface opposite to the surface in contact with the vibrating body 3, and a second electrode 7b on the surface in contact with the vibrating body 3. The first electrode 7a and the second electrode 7b are made of, for example, Ag. To drive the piezoelectric element 7, it is necessary to supply a control signal (AC signal) to the first electrode 7a and the second electrode 7b. For this reason, wiring 6 for supplying the control signal (AC signal) from a vibration control substrate 11 (described later) is connected to the piezoelectric element 7.

[0017] 2 is a plan view of the wiring 6 of the piezoelectric element 7 according to embodiment 1. The wiring 6 has a first electric wire 61 electrically connected to the first electrode 7a of the piezoelectric element 7 and a second electric wire 62 electrically connected to the vibrating body 3. Note that the second electric wire 62 is electrically connected to the second electrode 7b of the piezoelectric element 7 via the metallic vibrating body 3, as indicated by the dashed line in FIG.

[0018] Specifically, the wiring 6 is an FPC (Flexible Printed Circuit), which is formed by patterning flexible electrodes and electric wires on a flexible sheet, and has an electrode 61a at one end of the first electric wire 61 for electrical connection with the first electrode 7a, and an electrode 62a at one end of the second electric wire 62 for electrical connection with the vibrating body 3. In addition, the wiring 6 has an electrode 61b at the other end of the first electric wire 61 for electrical connection with the vibration control board 11, and an electrode 62b at the other end of the second electric wire 62 for electrical connection with the vibration control board 11.

[0019] The surface of the first electrode 7a of the piezoelectric element 7 and one surface of the vibrating body 3 are flush with each other so that the wiring 6 of the FPC can connect the first electrode 7a of the piezoelectric element 7 to the vibrating body 3. In other words, as shown in FIG. 1, the vibrating body 3 has a recess formed in the position where the piezoelectric element 7 is to be provided.

[0020] A control signal (AC signal) supplied from wiring 6 vibrates hollow circular piezoelectric element 7 in the radial direction (left-right direction in the figure), and this vibration is converted into vibration in the Z direction (up-down direction in the figure) at connection 31 of vibrating body 3, causing outermost lens 1 to vibrate in the optical axis direction. The portion of housing 2 that holds outermost lens 1 (connection 31) elastically deforms like a leaf spring to transmit the vibration of vibrating body 3 to outermost lens 1, with portions away from outermost lens 1 becoming vibration nodes. Here, vibration nodes are portions where the amplitude is approximately 1 / 50 or less of the maximum amplitude of vibrating body 3. Therefore, the vibration of vibrating body 3 causes the greatest displacement at the center of outermost lens 1, while the displacement is smaller in portions away from outermost lens 1.

[0021] 1, the hollow circular piezoelectric element 7 is provided on the bottom surface of the vibrating body 3, but a piezoelectric element may be provided on another surface separately. Also, a plurality of rectangular piezoelectric elements 7 may be provided concentrically on the bottom surface of the vibrating body 3.

[0022] In the imaging unit 100, the inner lens 4 is fixed by a fixing portion 5 at a portion of the housing 2 that is a vibration node, so that the vibration of the vibrating body 3 is not transmitted to the inner lens 4. Therefore, in the imaging unit 100, the vibration of the vibrating body 3 does not cause degradation of image quality. Furthermore, by fixing the inner lens 4 to a portion of the housing 2 that is a vibration node, the inner lens 4 does not attenuate the vibration of the vibrating body 3, and the ability to remove foreign matter adhering to the outermost lens 1 is not reduced.

[0023] The fixing portion 5 that fixes the inner layer lens 4 to the housing 2 preferably has a smaller mechanical quality factor Qm than the housing 2. By making the mechanical quality factor Qm of the fixing portion 5 smaller than that of the housing 2, it becomes more difficult for the vibration of the vibrating body 3 to be transmitted by the inner layer lens 4 via the fixing portion 5. Specifically, the fixing portion 5 is preferably made of resin.

[0024] The inner layer lens 4 has a structure in which multiple lenses are held by an inner layer lens barrel 4a. The inner layer lens barrel 4a is a holder for the inner layer lens 4. The multiple lenses that make up the inner layer lens 4 are held by the inner layer lens barrel 4a in an aligned state, so there is no need to adjust the alignment of each lens again when mounting them in the imaging unit 100.

[0025] The imaging unit 100 has an imaging element 8 arranged so that the outermost lens 1 and the inner lens 4 are in the field of view. The imaging element 8 is an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor, and is mounted on an imaging control board 9, which is an imaging element mounting board.

[0026] The imaging unit 100 is provided on the opposite side of the field of view from the imaging control board 9 and has a vibration control board 11 on which a control circuit 12 is mounted that supplies a control signal (AC signal) for the piezoelectric element 7. The imaging control board 9 and the vibration control board 11 are electrically connected via an inter-board connector 13. The control circuit 12 is a semiconductor element such as a general-purpose IC (Integrated Circuit) or ASIC (Application Specific Integrated Circuit) that generates a control signal (AC signal) for the piezoelectric element 7.

[0027] 1, the wiring 6 passes through a through-hole 5a provided in the fixing portion 5 and is drawn out from inside the housing 2 so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted. Furthermore, the wiring 6 is electrically connected to the vibration control board 11 on the surface opposite to the surface facing the imaging control board 9. Specifically, the wiring 6 drawn out from the through-hole 5a passes between the imaging control board 9 and the case 10, and between the vibration control board 11 and the case 10.

[0028] In the imaging unit 100, the wiring 6 is drawn out so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted from inside the housing 2, and therefore the wiring 6 and the wiring of the imaging element 8 can be integrated and drawn out to the outside of the case 10 from the terminal electrode 14 connected to the vibration control board 11. Furthermore, by drawing the wiring 6 of the piezoelectric element 7 out so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted from inside the housing 2 without providing a through hole in the housing 2, there is no need to perform waterproofing treatment for the wiring 6.

[0029] The imaging unit 100 is completed by adjusting the alignment between the imaging element 8 mounted on the imaging control board 9 and the inner lens 4, and then fixing the imaging control board 9 to the fixing portion 5 with adhesive and joining the case 10 and the housing 2. The part of the housing 2 that is joined to the case 10 is a part of the vibrating body. 3 3 and 4 are schematic diagrams for explaining a method of assembling the imaging unit 100 according to the first embodiment.

[0030] In Figure 3, when viewed from the inner layer lens 4, the direction of the outermost lens 1 is upward and the direction of the fixed portion 5 is downward, the lower side of the fixed portion 5 that fixes the inner layer lens barrel 4a has a recessed shape that roughly aligns with the position of the imaging element 8, as shown in Figure 3(a).

[0031] As shown in FIG. 3(b), the imaging control board 9 is fixed to the fixed part 5 with adhesive 15, using the recessed shape of the fixed part 5 as a guide. Note that a mechanism may be provided to adjust the position of the imaging control board 9 relative to the fixed part 5 by adjusting the thickness of the adhesive 15 so that the position of the imaging element 8 is aligned with the focal position of the inner lens 4. As shown in FIG. 4(a), the positions of the imaging control board 9 and the fixed part 5 are adjusted with the adhesive 15 applied, and the adhesive is applied at that position. 15 The adhesive is hardened by irradiating it with ultraviolet light, thereby fixing the position of the imaging control board 9 relative to the fixed part 5. The above-mentioned method is a general method for fixing the imaging control board 9 to the fixed part 5, but the present invention is not limited to this method and other methods may also be used.

[0032] The imaging control board 9 alone may be fixed to the fixed portion 5 first, and then the vibration control board 11 may be connected to the imaging control board 9, or the imaging control board 9 with the vibration control board 11 connected may be fixed to the fixed portion 5. After the imaging control board 9 and the vibration control board 11 are fixed to the fixed portion 5, the wiring 6 from the piezoelectric element 7 is connected to the vibration control board 11. One method for connecting the wiring 6 to the vibration control board 11 is to press the wiring 6 onto the vibration control board 11 with a conductive adhesive sheet, for example. Note that because the vibration control board 11 and the wiring 6 are electrically connected on the surface opposite to the surface facing the imaging control board 9, this work is easy even after the imaging control board 9 and the vibration control board 11 are fixed to the fixed portion 5.

[0033] Next, as shown in Fig. 4(b), terminal electrodes 14 are attached to the vibration control substrate 11, and the case 10 and housing 2 are joined together. The case 10 and housing 2 can be fixed together with screws, adhesive, or the like. By providing an O-ring or the like (not shown) between the case 10 and housing 2, the waterproof performance between the case 10 and housing 2 can be improved.

[0034] As described above, the imaging unit 100 according to the first embodiment includes the outermost lens 1 (translucent body), the housing 2, the vibrating body 3, the piezoelectric element 7, the inner lens 4 (lens), the fixing portion 5, the imaging element 8, the imaging control board 9 (first board), and the case 10. The outermost lens 1 transmits light of a predetermined wavelength. The housing 2 holds the outermost lens 1. The vibrating body 3 vibrates the outermost lens 1 held in the housing 2. The piezoelectric element 7 is provided on at least one surface of the vibrating body 3. The inner lens 4 is provided in a position facing the outermost lens 1 within the housing 2. The fixing portion 5 fixes the inner lens 4 to a portion of the housing 2 that is a node of the vibration caused by the vibrating body 3. The imaging element 8 is positioned so that the outermost lens 1 and the inner lens 4 are in the field of view. The imaging control board 9 is electrically connected to the imaging element 8 on the surface opposite the surface in the field of view. Case 10 is joined to housing 2 and contains at least image sensor 8 and imaging control board 9. Wiring 6 electrically connected to piezoelectric element 7 is drawn out from inside housing 2 so as to pass through a plane including the mounting surface of imaging control board 9 on which image sensor 8 is mounted.

[0035] As a result, in the imaging unit 100 of embodiment 1, the wiring 6 electrically connected to the piezoelectric element 7 is drawn out from inside the housing 2 so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted, making it possible to integrate the wiring 6 of the piezoelectric element 7 and the wiring of the imaging element 8.

[0036] The imaging unit 100 preferably further includes a vibration control board 11 (second board) that is provided on the opposite side of the field of view from the imaging control board 9 and that mounts a control circuit 12 that supplies control signals to the piezoelectric elements 7, and that is electrically connected to the vibration control board 11 and the wiring 6. This allows the control circuit 12 that supplies control signals to the piezoelectric elements 7 to be integrated within the imaging unit 100. Of course, the imaging unit 100 may not include the vibration control board 11, and the control circuit 12 that supplies control signals to the piezoelectric elements 7 may be provided outside the imaging unit 100. Furthermore, regardless of whether the vibration control board 11 is provided, the wiring 6 may be connected to the imaging control board 9.

[0037] It is preferable that the wiring 6 is electrically connected to the vibration control board 11 on the surface opposite to the surface facing the imaging control board 9. This makes it easy to connect the wiring 6 to the vibration control board 11 even after the imaging control board 9 and the vibration control board 11 have been fixed to the fixed part 5. If the vibration control board 11 is not provided, it is preferable that the wiring 6 is electrically connected to the imaging control board 9 on the surface opposite to the surface on which the imaging element 8 is mounted. Even if the vibration control board 11 is provided, the wiring 6 may be electrically connected to the imaging control board 9 on the surface opposite to the surface on which the imaging element 8 is mounted, as long as the imaging control board 9 and the vibration control board 11 are not fixed to the fixed part 5 at the same time.

[0038] The fixed portion 5 preferably has a through hole 5a through which the wiring 6 passes. This allows the wiring 6 to be drawn out to the imaging control board 9 side without providing a through hole in the housing 2.

[0039] The imaging control board 9 is preferably bonded to the fixing portion 5 with an adhesive 15. This makes it possible to easily adjust the alignment between the imaging element 8 and the inner lens 4.

[0040] The wiring 6 has a first electric wire 61 electrically connected to the first electrode 7a of the piezoelectric element 7 and a second electric wire 62 electrically connected to the vibrating body 3, and it is preferable that the second electric wire 62 is electrically connected to the second electrode 7b of the piezoelectric element 7 that contacts the vibrating body 3 via the vibrating body 3. This allows a control signal (AC signal) to be supplied to the piezoelectric element 7 via the wiring 6.

[0041] (Embodiment 2) In the imaging unit 100 according to the first embodiment, the wiring 6 is drawn out from inside the housing 2 through a through-hole 5a provided in the fixing part 5 so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted. The configuration for drawing out the wiring 6 to the imaging control board 9 side is not limited to this. In the imaging unit according to the second embodiment, a configuration will be described in which the wiring 6 is drawn out to the imaging control board 9 side through a cutout provided in the housing.

[0042] FIG. 5 is a cross-sectional view of the imaging unit 100A according to the second embodiment. 5 In the imaging unit 100A shown in FIG. 1, the same components as those in the imaging unit 100 according to the first embodiment are denoted by the same reference numerals, and description thereof will not be repeated.

[0043] In the imaging unit 100A according to the second embodiment, the vibrating body 3a holds the outermost lens 1 and vibrates the outermost lens 1. In other words, the vibrating body 3a is configured by integrating the housing 2 and the vibrating body 3 shown in Fig. 1. Of course, in the imaging unit 100A as well, the housing 2 and the vibrating body 3 may be configured separately as shown in Fig. 1.

[0044] A piezoelectric element 7 is provided on the surface of the vibrating body 3a opposite to the side in contact with the outermost lens 1. The piezoelectric element 7 is hollow and circular, and vibrates by being polarized in the thickness direction, for example. The piezoelectric element 7 has a first electrode 7a on the surface opposite to the surface in contact with the vibrating body 3a, and a second electrode 7b on the surface in contact with the vibrating body 3a.

[0045] The wiring 6 branches into a first electric wire 61 electrically connected to the first electrode 7a of the piezoelectric element 7 and a second electric wire 62 electrically connected to the vibrating body 3a. The second electric wire 62 is electrically connected to the second electrode 7b of the piezoelectric element 7 via the vibrating body 3a.

[0046] When the piezoelectric element 7 vibrates in the optical axis direction in response to a control signal (AC signal) supplied from the wiring 6, the vibrating body 3a vibrates the outermost lens 1 in the optical axis direction. The vibration of the vibrating body 3a causes the greatest displacement at the center of the outermost lens 1, while the displacement of the connecting part 3b connecting the fixed part 5 away from the outermost lens 1 becomes smaller. The connecting part 3b is part of the vibrating body 3a, and is configured as part of the housing that connects to the end of the fixed part 5.

[0047] In the imaging unit 100A, a notch 2a for drawing out the wiring 6 is provided in the connection part 3b, which is subject to small displacement due to vibration of the vibrating body 3a. This allows the wiring 6 to be drawn out to the imaging control board 9 side without providing a through-hole in the vibrating body 3a. Fig. 6 is a plan view showing the notch 2a provided in the connection part 3b. Note that the notch 2a may be provided in the fixed part 5, rather than in the connection part 3b (the part of the housing that connects to the end of the fixed part 5) that connects the fixed part 5.

[0048] 5, the wiring 6 is drawn out through the cutout portion 2a from inside the vibrating body 3a constituting the housing so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted. Furthermore, the wiring 6 is electrically connected to the vibration control board 11 on the surface opposite to the surface facing the imaging control board 9. Note that a groove portion 10a is provided in the case 10 at a position corresponding to the imaging control board 9 so that the wiring can be easily drawn out to the vibration control board 11 side by passing between the imaging control board 9 and the case 10.

[0049] Furthermore, the vibration control board 11 is provided with a leaf spring 14a for electrical connection with the terminal electrode 14 provided on the case 10. By providing the leaf spring 14a on the vibration control board 11, the leaf spring 14a and the terminal electrode 14 can come into contact with each other and be electrically connected by simply joining the vibrating body 3a that constitutes the housing to the case 10.

[0050] In assembling the imaging unit 100A, first, the imaging control board 9, on which the imaging element 8 is mounted, is aligned and then attached to the fixing part 5, from which the wiring 6 is pulled out from the cutout part 2a. Next, the wiring 6 is passed between the imaging control board 9 and the vibration control board 11 and the case 10, and connected to the back surface of the vibration control board 11. Here, the back surface of the vibration control board 11 is the surface opposite to the surface facing the imaging control board 9.

[0051] Furthermore, the case 10 with the terminal electrodes 14 is attached to the vibrating body 3a. At this time, the leaf springs 14a are provided on the back surface of the vibration control substrate 11, and the leaf springs 14a and the terminal electrodes 14 come into contact with each other to establish electrical continuity. This makes it possible to integrate the wiring 6 of the piezoelectric element 7 and the wiring of the imaging element 8. Note that the leaf springs 14a may be provided at the tips of the terminal electrodes 14 instead of on the back surface of the vibration control substrate 11.

[0052] As described above, in the imaging unit 100A according to the second embodiment, the fixing portion 5 or the connecting portion 3b (the portion of the housing connected to the fixing portion 5) is provided with a cutout portion through which the wiring 6 passes. the law of nature There is a notch 2a. the law of nature The wiring 6 can be easily drawn out to the imaging control board 9 side through the notch 2a.

[0053] Furthermore, the case 10 preferably has a groove 10a through which the wires 6 pass, at a position corresponding to the imaging control board 9. This makes it easier to pull out the wires 6 to the vibration control board 11 side by passing the wires 6 through the groove 10a.

[0054] Furthermore, it is preferable that the housing and the vibrating body are integrally formed as vibrating body 3a, which eliminates the need to fabricate a separate housing and reduces manufacturing costs.

[0055] (Embodiment 3) In the first embodiment, a configuration has been described in which the wiring 6 drawn into the case 10 is electrically connected to the vibration control board 11 inside the case 10. However, when assembling a case in which an imaging control board and a vibration control board are already incorporated and a housing having a vibrating body by joining them together, it has been difficult to electrically connect the vibration control board inside the case to the wiring from the vibrating body.

[0056] Therefore, in the third embodiment, an imaging unit will be described in which the wiring from the vibrating body is temporarily pulled out to the outside of the case and the wiring from the vibrating body is electrically connected to the vibration control board outside the case. Fig. 7 is a cross-sectional view of an imaging unit 100B according to the third embodiment. In the imaging unit 100B shown in Fig. 7, the same components as those in the imaging unit 100 according to the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.

[0057] 7, in the imaging unit 100B, the wiring 6 is drawn into the housing 2 through a notch 2a provided in the housing 2, and then drawn out of the case 10 through a slit 10b provided in the case 10. The wiring 6 drawn out from the slit 10b is electrically connected to a terminal 10c provided on the outer surface of the case 10. The terminal 10c is electrically connected to the vibration control board 11 by a wiring 11a that passes through the inside of the case 10.

[0058] The case 10 provided with the slits 10b and terminals 10c is manufactured, for example, by insert molding. The vibration control board 11 and the imaging control board 9 are assembled into the manufactured case 10, and the vibration control board 11 is electrically connected to the terminal electrodes 14 and the like. The wiring 6 from the vibrating body 3 is led out of the case 10 through the slits 10b. After adjusting the alignment between the imaging element 8 and the inner lens 4 as necessary, the case 10 and the housing 2 having the vibrating body 3 are joined with an adhesive.

[0059] Fig. 8 is a perspective view of an imaging unit 100B in which a slit 10b for drawing out a wire 6 is provided in the case 10. For clarity, the housing 2 has been removed from the imaging unit 100B shown in Fig. 8. The wire 6 drawn out to the outside of the case 10 is electrically connected to a terminal 10c provided on the outer surface of the case 10 by crimping or other methods. Because the connection portion between the wire 6 and the terminal 10c is outside the case 10, this portion is covered with a lid or resin for waterproofing.

[0060] As described above, in the imaging unit 100B according to the third embodiment, the case 10 has a slit 10b through which the wiring 6 is drawn out of the case 10, and a terminal 10c that electrically connects to the wiring 6 drawn out from the slit 10b. This allows for alignment adjustment between the imaging control board 9 pre-installed in the case 10 and the inner lens 4 without having to worry about the routing of the wiring 6 from the vibrating body 3. Furthermore, by covering the connection between the wiring 6 and the terminal 10c, including the slit 10b, with a lid or the like, a leak path due to the slit 10b is not formed, allowing for waterproofing with high airtight and liquid tightness.

[0061] (Fourth embodiment) In the imaging unit 100 according to the first embodiment, the wiring 6 is drawn out from inside the housing 2 through the through-hole 5a provided in the fixing part 5 so as to pass through a plane including the mounting surface of the imaging control board 9 on which the imaging element 8 is mounted. In the imaging unit according to the fourth embodiment, a configuration will be described in which the wiring 6 is not drawn out directly so as to pass through the plane including the mounting surface of the imaging control board 9, but is drawn out indirectly using a connector.

[0062] Fig. 9 is a cross-sectional view of an imaging unit 100C according to embodiment 4. In imaging unit 100C shown in Fig. 9, the same components as those in imaging unit 100 according to embodiment 1 are denoted by the same reference numerals, and description thereof will not be repeated.

[0063] In the imaging unit 100C, the imaging control board 9 has a spring connector 16 (first connector) electrically connected to the wiring 6, and an inter-board connector 13 (second connector) electrically connected to the vibration control board 11. The wiring 6 is drawn out via the spring connector 16 and the inter-board connector 13 so as to pass through a plane including the mounting surface of the imaging control board 9, and is electrically connected to the vibration control board 11.

[0064] A leaf-spring-shaped spring connector 16 is provided on the imaging control board 9 on which the imaging element 8 is mounted, and the wiring 6 drawn to the back surface of the fixed part 5 or the inner lens barrel 4a is brought into contact with the spring connector 16 for electrical connection. Here, the back surface of the fixed part 5 or the inner lens barrel 4a refers to the surface facing the imaging control board 9. The spring connector 16 is electrically connected to the inter-board connector 13 via a through-hole provided in the imaging control board 9. Therefore, the piezoelectric element 7 is electrically connected to the vibration control board 11 via the wiring 6, the spring connector 16, and the inter-board connector 13.

[0065] Next, Fig. 10 is a cross-sectional view of an imaging unit 100D according to a modified example of embodiment 4. In imaging unit 100D shown in Fig. 10, the same components as those in imaging unit 100 according to embodiment 1 are denoted by the same reference numerals, and description thereof will not be repeated.

[0066] In the imaging unit 100D, the imaging control board 9 has a through-hole connector 17 (first connector) electrically connected to the wiring 6, and an inter-board connector 13 (second connector) electrically connected to the vibration control board 11. The wiring 6 is drawn out via the through-hole connector 17 and the inter-board connector 13 so as to pass through a plane including the mounting surface of the imaging control board 9, and is electrically connected to the vibration control board 11.

[0067] A through-hole is provided in the imaging control board 9 on which the imaging element 8 is mounted, and a needle-shaped through-hole connector 17 is passed through the through-hole to bring the wiring 6 drawn out to the rear surface of the fixed part 5 or the inner lens barrel 4a into contact with the through-hole connector 17 for electrical connection. The through-hole connector 17 is also electrically connected to the inter-board connector 13 via a through-hole provided in the imaging control board 9. Therefore, the piezoelectric element 7 is connected to the vibration control board 11 via the wiring 6, the through-hole connector 17, and the inter-board connector 13. Electrically is connected.

[0068] As described above, in the imaging units 100C and 100D according to the fourth embodiment, the imaging control board 9 has the spring connector 16 or the through-hole connector 17 electrically connected to the wiring 6, and the inter-board connector 13 electrically connected to the vibration control board 11. The wiring 6 is drawn out via the spring connector 16 or the through-hole connector 17 and the inter-board connector 13 so as to pass through a plane including the mounting surface of the imaging control board 9, and is electrically connected to the vibration control board 11. This makes it possible to integrate the wiring 6 of the piezoelectric element 7 and the wiring of the imaging element 8 in the imaging units 100C and 100D.

[0069] (Other variations) The imaging units 100, 100A to 100D according to the above-described embodiments may include a camera, LiDAR, Radar, etc. Furthermore, a plurality of imaging units may be arranged side by side.

[0070] The imaging units 100, 100A to 100D according to the above-described embodiments are configured to incorporate the imaging control board 9 and the vibration control board 11 inside the case 10. However, the imaging units 100, 100A to 100D may be configured to provide only the imaging control board 9 inside the case 10 without providing the vibration control board 11. In this case, the control circuit 12 for the vibration control board 11 may be mounted on the imaging control board 9, making the vibration control board 11 unnecessary, or the vibration control board 11 may be provided outside the case 10.

[0071] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0072] 1 outermost lens, 2 housing, 3, 3a vibrating body, 4 inner lens, 4a inner lens barrel, 5 fixing portion, 6, 11a wiring, 7 piezoelectric element, 8 imaging element, 9 imaging control board, 10 case, 11 vibration control board, 12 control circuit, 13 inter-board connector, 14 terminal electrode, 16 spring connector, 17 through-hole connector, 100, 100A to 100D imaging unit.

Claims

1. a transparent body that transmits light of a predetermined wavelength; a housing for holding the light-transmitting body; a vibrator that vibrates the transparent body held by the housing; a piezoelectric element provided on at least one surface of the vibrating body; a lens provided in the housing at a position facing the light-transmitting body; a fixing portion that fixes the lens at a portion of the housing that serves as a node of vibration caused by the vibrating body; an imaging element disposed so that the light-transmitting body and the lens are in a field of view; a first substrate electrically connected to the imaging element on a surface opposite to the surface in the viewing direction; a case joined to the housing and containing at least the imaging element and the first substrate, An imaging unit, wherein wiring electrically connected to the piezoelectric element is drawn out from within the housing so as to pass through a plane including a mounting surface of the first substrate on which the imaging element is mounted.

2. a second substrate provided opposite the line of sight from the first substrate and having a control circuit mounted thereon that supplies a control signal to the piezoelectric element; The imaging unit according to claim 1 , wherein the second substrate and the wiring are electrically connected.

3. The imaging unit according to claim 2 , wherein the wiring is electrically connected to the second substrate on a surface opposite to a surface facing the first substrate.

4. The imaging unit according to claim 1 , wherein the wiring is electrically connected to the first substrate on a surface opposite to the mounting surface.

5. 5. The imaging unit according to claim 1, wherein the fixing portion has a through hole through which the wiring passes.

6. 5. The imaging unit according to claim 1, wherein the fixed portion or the portion of the housing connected to the fixed portion has a notch through which the wiring passes.

7. 5. The imaging unit according to claim 1, wherein the case has a groove through which the wiring passes, at a position corresponding to the first board.

8. The imaging unit according to any one of claims 1 to 4, wherein the case has a slit for pulling the wiring out of the case and a terminal for electrically connecting to the wiring pulled out from the slit.

9. 5. The imaging unit according to claim 1, wherein the first substrate is bonded to the fixing portion with an adhesive.

10. 5. The imaging unit according to claim 1, wherein the housing and the vibrating body are integrally formed.

11. the first substrate has a first connector electrically connected to the wiring and a second connector electrically connected to the second substrate; The imaging unit according to claim 2 , wherein the wiring is drawn out so as to pass through a plane including the mounting surface via the first connector and the second connector, and is electrically connected to the second board.

12. the wiring includes a first electric wire electrically connected to a first electrode of the piezoelectric element and a second electric wire electrically connected to the vibrating body, 5. The imaging unit according to claim 1, wherein the second electric wire is electrically connected to a second electrode of the piezoelectric element that is in contact with the vibrating body via the vibrating body.

13. The imaging unit according to any one of claims 1 to 4, wherein the wiring comprises a first electric wire electrically connected to a first electrode of the piezoelectric element and a second electric wire electrically connected to the vibrating body.

Images