3D surveying method for components incorporated into structures
The method combines photographic image data and three-dimensional coordinate measurement to achieve millimeter-level accuracy in surveying architectural structures, addressing inefficiencies and accuracy issues in existing methods, enabling safe and cost-effective creation of replacement components.
Patent Information
- Application Number
- JP2023012302
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-01-30
- Publication Date
- 2025-11-12
- Estimated Expiration
- 2043-01-30
AI Technical Summary
Existing methods for measuring the size and shape of components in architectural structures like steel towers from a distance suffer from poor accuracy and inefficiency, especially when the structure is complex and components are hidden by other members, and current UAV-based solutions do not achieve millimeter-level precision required for replacement components.
A three-dimensional surveying method using a combination of photographic image data acquisition, three-dimensional coordinate measurement, and calibration to generate highly accurate point cloud data, selecting multiple reference points with varying heights and calibrating the data using at least three calibration points to achieve millimeter-level accuracy.
Enables safe, high-precision surveying of complex structures from the ground, reducing time and cost, and allowing for the creation of accurate blueprints for replacement components without the need for workers to climb the structures.
Smart Images

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Abstract
Citation Information
Patent Citations
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