Resin composition and prepreg, use

Abstract

The present invention relates to a resin composition, a prepreg, and its use. The resin composition contains, as components by weight, 50-150 parts of modified epoxy resin, 40-120 parts of modified benzoxazine resin, 20-100 parts of bismaleimide resin, 0.1-15 parts of initiator, and 150-550 parts of inorganic filler, the structural formula of the modified epoxy resin is formula (1-1), and the modified benzoxazine resin is a base benzoxazine resin whose terminal group is modified with a double bond. In the above resin composition, the polybutadiene-modified epoxy resin forms an interpenetrating polymer network with the bismaleimide resin, and finally, a resin composition having a low dielectric constant, low dielectric loss, and low linear expansion coefficient can be obtained. TIFF2025504305000018.tif53170

Description

[Technical Field]

[0001] The present invention relates to the field of polymeric materials, in particular to resin compositions and prepregs, and uses. [Background technology]

[0002] With the continuous development of miniaturization, multi-functionality, and continuous improvement in operating speed of electronic products, continuous improvement in chip integration and continuous progress in chip packaging technology are required, which places higher requirements on the performance of substrate materials for mounting semiconductor devices, especially on the performance of substrate materials, such as dielectric properties.

[0003] Adding cyanate ester to the resin material of conventional circuit boards reduces the dielectric properties, but also reduces the humidity and heat resistance and increases the linear expansion coefficient. If the difference in thermal expansion coefficient between the semiconductor element and the board is too large, the board is prone to warping under heat-exposed conditions, which can lead to serious problems such as poor connections between the semiconductor element and the board and between the board and the printed circuit board. Summary of the Invention [Problem to be solved by the invention]

[0004] Based on this, a main object of the present invention is to provide a resin composition, a prepreg, and a use thereof that have a low dielectric constant, a low dielectric loss, and a low coefficient of linear expansion. [Means for solving the problem]

[0005] The present invention comprises, as components in parts by weight: 50 to 150 parts of modified epoxy resin, 40 to 120 parts modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of inorganic filler, The structural formula of the modified epoxy resin is formula (1-1): [ka] and M and N are both positive integers, and M+N=15 to 50; the number average molecular weight of the modified epoxy resin is 1,000 to 10,000; The modified benzoxazine resin is selected from base benzoxazine resins whose terminal groups are modified with double bonds.

[0006] In one embodiment, the bismaleimide resin is at least one selected from the group consisting of 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N-(2,3-dimethylphenyl)maleimide, N-phenylmaleimide, 1,6-di(maleimide)hexane, N,N-(4-methyl-1,3-phenylene)bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.

[0007] In one embodiment, the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

[0008] In one embodiment, in the structural formula of the modified epoxy resin, M is 3 to 8, N is 5 to 15, and the number average molecular weight of the modified epoxy resin is 1,000 to 4,000.

[0009] In one embodiment, the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

[0010] In one embodiment, the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

[0011] In one embodiment, the resin composition further comprises 20 to 80 parts of a non-halogen flame retardant.

[0012] In one embodiment, the non-halogen flame retardant is at least one selected from the compounds represented by structural formulas (2-1) to (2-4). [ka]

[0013] The present invention further provides a prepreg comprising a substrate and a resin material carried on the substrate, wherein the resin material is the above-described resin composition.

[0014] Furthermore, the present invention further provides the use of the above prepreg in the manufacture of a laminate, a copper-clad laminate or a wiring board. [Effects of the Invention]

[0015] In the resin composition, the polybutadiene-modified epoxy resin and the bismaleimide resin form an interpenetrating polymer network. The polybutadiene-modified epoxy resin reacts with the bismaleimide resin through the initiator, and the polybutadiene-modified epoxy resin reacts with the double-bond-modified benzoxazine. Through the interaction between the three resins, the bismaleimide resin overcomes the problems of the polybutadiene-modified epoxy resin's lack of heat resistance, rigidity, and strength, the polybutadiene-modified epoxy resin overcomes the problem of the bismaleimide resin's lack of dielectric properties, and the bismaleimide resin and the double-bond-modified benzoxazine form a bismaleimide-benzoxazine structure, thereby overcoming the problem of the bismaleimide resin's high linear expansion coefficient. Finally, a resin composition with low dielectric constant, low dielectric loss, and low linear expansion coefficient is obtained. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention may be embodied in many different forms and is not limited to the embodiments set forth herein. On the contrary, the purpose of providing these embodiments is to provide a more complete and comprehensive understanding of the present disclosure. Of course, these are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeatedly refer to numerals and / or letters in different examples. This repetition is for purposes of brevity and clarity and does not, in itself, indicate a relationship between the various embodiments and / or settings discussed.

[0017] Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply a relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature qualified as "first" or "second" may explicitly or implicitly include at least one of the feature. In the present description, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc. In the present description, unless otherwise clearly and specifically limited, "several" means at least one, e.g., one, two, etc.

[0018] As used herein, the terms "preferably," "more preferably," and the like refer to embodiments of the present invention that may offer certain advantages, under certain circumstances. However, other embodiments may be preferred, under the same or different conditions. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, and is not intended to exclude other embodiments from the scope of the invention.

[0019] When a range of values ​​is disclosed herein, it is understood that the range is continuous and includes the minimum and maximum values ​​within the range, as well as every value between the minimum and maximum values. Furthermore, when a range is expressed as an integer, it includes every integer between the minimum and maximum values ​​within the range. Furthermore, when multiple ranges are used to describe a feature or characteristic, they may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to encompass any and all subranges subsumed therein.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein are for the purpose of describing particular examples only and are not intended to be limiting of the present invention. As used herein, the term "and / or" includes any and all combinations of one or more associated items.

[0021] The present invention comprises, as components in parts by weight: 50 to 150 parts of modified epoxy resin, 40 to 120 parts modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of inorganic filler, The structural formula of the modified epoxy resin is formula (1-1): [ka] wherein M and N are both positive integers, and M+N=15 to 50; and the number average molecular weight of the modified epoxy resin is 1,000 to 10,000. The modified benzoxazine resin provides a resin composition in which the base benzoxazine resin is modified at the end groups with double bonds.

[0022] In one specific example, in the structural formula of the modified epoxy resin, M is 3 to 8, N is 5 to 15, and the number average molecular weight of the modified epoxy resin is 1,000 to 4,000.

[0023] The number average molecular weight may be a value measured by a conventional molecular weight measurement method, and may be a value measured by gel permeation chromatography (GPC), but is not limited to these.

[0024] In one specific example, the bismaleimide resin is at least one selected from the group consisting of 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N-(2,3-dimethylphenyl)maleimide, N-phenylmaleimide, 1,6-di(maleimide)hexane, N,N-(4-methyl-1,3-phenylene)bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.

[0025] Furthermore, the bismaleimide resin is at least one selected from the group consisting of biphenyl bismaleimide resin, polyphenylmethane maleimide, and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane.

[0026] Specific examples of the bismaleimide resin include bismaleimide resins manufactured by Daiwakasei Corporation under the trade names BMI-70, BMI-80, BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000, BMI-3000H, BMI-4000H, BMI-5000, BMI-5100, BMI-7000, and BMI-7000H.

[0027] Preferably, the bismaleimide resin is BMI-2300, the structural formula of which is: [ka] The bismaleimide resin is BMI-5100, and its structural formula is [ka] The bismaleimide resin is MIR-3000 manufactured by Nippon Kayaku Co., Ltd., and its structural formula is: [ka] is.

[0028] In one specific example, the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

[0029] Preferably, the modified benzoxazine resin is an allyl-modified BPA-type benzoxazine resin, and its structural formula may be, but is not limited to, the following structural formula: [ka] or [ka]

[0030] In one embodiment, the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

[0031] In one embodiment, the resin composition further comprises 20 to 80 parts of a non-halogen flame retardant.

[0032] In one specific example, the non-halogen flame retardant is at least one selected from the compounds represented by structural formulas (2-1) to (2-4). [ka]

[0033] Preferably, the non-halogen flame retardant has the structural formula (2-1).

[0034] In one specific example, the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

[0035] The shape of the inorganic filler may be, but is not limited to, spherical, fibrous, plate-like, granular, flake-like, or whisker-like.

[0036] In the resin composition, the polybutadiene-modified epoxy resin and the bismaleimide resin form an interpenetrating polymer network. The polybutadiene-modified epoxy resin reacts with the bismaleimide resin through the initiator, and the polybutadiene-modified epoxy resin reacts with the double-bond-modified benzoxazine. Through the interaction between the three resins, the bismaleimide resin overcomes the problems of the polybutadiene-modified epoxy resin's lack of heat resistance, rigidity, and strength, the polybutadiene-modified epoxy resin overcomes the problem of the bismaleimide resin's lack of dielectric properties, and the bismaleimide resin and the double-bond-modified benzoxazine form a bismaleimide-benzoxazine structure, thereby overcoming the problem of the bismaleimide resin's high linear expansion coefficient. Finally, a resin composition with low dielectric constant, low dielectric loss, and low linear expansion coefficient is obtained.

[0037] Preferably, the resin composition contains, in parts by weight, 80 to 120 parts of modified epoxy resin, 40 to 110 parts of modified benzoxazine resin, 30 to 70 parts of bismaleimide resin, 0.1 to 5 parts of initiator, 40 to 70 parts of flame retardant, and Contains 150 to 450 parts of inorganic filler.

[0038] The method for producing the resin composition includes the following steps S10 to S20.

[0039] In step S10, a bismaleimide resin and a solvent are mixed to prepare a premixture.

[0040] In the above step, the bismaleimide resin and the solvent may be heated to a temperature of 40°C to 80°C in order to mix them thoroughly.

[0041] In step S20, the modified epoxy resin, the modified benzoxazine resin, the non-halogen flame retardant, the inorganic filler, the initiator and the solvent are added to the pre-mixture.

[0042] Furthermore, the solvent is at least one selected from the group consisting of methanol, ethanol, ethylene glycol monomethyl ether, acetone, butanone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2-ethoxyethyl acrylate, ethyl acetate, dimethylformamide, dimethylacetamide, and propylene glycol methyl ether.

[0043] Preferably, the solvent is acetone.

[0044] The present invention further provides a prepreg comprising a substrate and a resin material carried on the substrate, wherein the resin material is the above-described resin composition.

[0045] The resin composition is applied to a substrate and heated until semi-cured to obtain a prepreg material. The method for applying the resin composition to the substrate may be at least one of impregnation, roll pressing, molding, coating, bar coating, and spraying, but is not limited to these.

[0046] The loading step may be repeated multiple times as necessary, and multiple types of thermosetting resin compositions with different compositions and solid contents may be loaded repeatedly to finally adjust the composition and resin content to the desired one.

[0047] The heating conditions are a heating temperature of 80° C. to 200° C. for 1 minute to 20 minutes, and a semi-cured prepreg material, ie, a prepreg, can be obtained.

[0048] The heating conditions are preferably a baking temperature of 110°C to 190°C and a heating time of 2 minutes to 10 minutes.

[0049] In one embodiment, the substrate is at least one selected from the group consisting of glass fiber, carbon fiber, silicon carbide fiber, rock wool fiber, nylon, polyethylene fiber, aramid fiber, polyimide fiber, polyester fiber, and cotton fiber.

[0050] The substrate is preferably a glass cloth, and the type of the glass cloth may be, but is not limited to, E, NE, D, S, or T type, and a laminate having excellent mechanical strength can be obtained, and a glass cloth that has been flattened is particularly preferred. The flattening treatment is a process in which the glass cloth is continuously pressed with a press roll at an appropriate pressure to compress the yarns flat.

[0051] Furthermore, the present invention further provides the use of the above prepreg in the manufacture of a laminate, a copper-clad laminate or a wiring board.

[0052] The method for producing the laminated board includes a step of laminating at least one of the prepregs.

[0053] Furthermore, the lamination process parameters are temperature 170℃~250℃, pressure 10kgf / cm 2 ~30kgf / cm 2 The mixture is then hot-pressed for 60 to 120 minutes under a vacuum of less than 2 kPa.

[0054] In particular, during lamination, a metal copper foil can be attached to one or both sides of a plurality of the prepregs, i.e., a laminate, and then laminated to obtain a metal copper foil-clad laminate.

[0055] The thickness of the metal copper foil is 3 μm to 70 μm.

[0056] The laminate has a low dielectric constant, a low dielectric loss, and a low coefficient of linear expansion, and is widely used in semiconductor packages. [Example]

[0057] The resin composition and the method for producing the same of the present invention will be described in more detail below with reference to specific examples. In the following specific examples, all raw materials are commercially available unless otherwise specified.

[0058] Regarding the modified epoxy resins, JP-100 is a butadiene-modified epoxy resin with Mn=1300 manufactured by Soda Chemical Industries, JP-200 is a butadiene-modified epoxy resin with Mn=2200 manufactured by Soda Chemical Industries, PB4700 is a butadiene-modified epoxy resin with Mn=3100 manufactured by Daicel Corporation, and 901 is a BPA-type epoxy resin with Mn=1100 manufactured by Kosho Electronics Co., Ltd.

[0059] Regarding the modified benzoxazine resins, 5031 is an allyl benzoxazine manufactured by Kolon, CB6900 is a double bond modified benzoxazine manufactured by Kolon, and CB3170 is a BPA type benzoxazine manufactured by Kolon.

[0060] Regarding the bismaleimide resins, BMI-2300 is polyphenylmethane maleimide manufactured by Nippon Daiwa Kasei Co., Ltd., BMI-5100 is bis(3-ethyl-5-methyl-4-maleimidophenyl)methane manufactured by Nippon Daiwa Kasei Co., Ltd., and MIR-3000 is biphenyl bismaleimide manufactured by Nippon Kayaku Co., Ltd.

[0061] Regarding non-halogen flame retardants, GU304 is a double DPO type phosphorus-containing flame retardant, with a melting point of 320°C, P%=12%, and the molecular formula is as follows, manufactured by Kayi Co., Ltd. [ka] PX-200 is a resorcinol bis-dixylenyl phosphate, P%=9%, manufactured by Daihachi Co., Ltd.; SPB-100 is a phosphazene compound, P%=13%, manufactured by Otsuka Co., Ltd.; and SPV-100 is an allyl-modified phosphazene compound, P%=11%, manufactured by Otsuka Co., Ltd.

[0062] Regarding the inorganic filler, SC2300-SVJ is a double bond-treated spherical silica manufactured by Admatechs.

[0063] Regarding the initiator, PERBUTYLP is 1,3-bis(butylperoxyisopropyl)benzene, manufactured by NOF Corporation.

[0064] The compositions of the resin compositions according to the examples and comparative examples are as follows.

[0065] [Table 1]

[0066] [Table 2]

[0067] The resin compositions according to the above examples and comparative examples were produced as follows.

[0068] First, the bismaleimide resin was mixed with acetone as a solvent, and the premix was heated to 60°C and thoroughly stirred to fully dissolve the bismaleimide resin in the acetone, obtaining an acetone solution with a solids content of 40% by mass. The modified epoxy resin and modified benzoxazine resin were then added to the solution in the appropriate proportions and stirred for 2 hours to fully dissolve them. Finally, a halogen-free flame retardant, inorganic filler, initiator, and an appropriate amount of acetone were added and thoroughly dispersed using a bead mill to obtain a resin composition.

[0069] The method for producing the prepreg carrying the resin composition according to the above Examples and Comparative Examples is as follows.

[0070] The resin compositions prepared in each example and comparative example were impregnated into glass cloth (2116 cloth manufactured by Kowa Co., Ltd.) and dried by heating at 160°C for about 3 minutes to obtain prepregs. By adjusting the solid content of the resin composition, a prepreg with a mass ratio of 50% can be obtained.

[0071] The method for producing a copper clad laminate is as follows.

[0072] Eight prepregs corresponding to each of the obtained examples and comparative examples were stacked, and 35 μm copper foil was placed on both sides. The temperature was 220°C and the pressure was 25 kgf / cm 2The resulting laminate was heated and pressed under the above conditions for 2 hours to obtain a copper clad laminate having a thickness of approximately 0.9 mm.

[0073] [Performance test] 1. Peel strength is tested using a Tensilon tester in accordance with IPC-TM-650 2.4.8.

[0074] 2. The glass transition temperature (Tg) was measured using a dynamic mechanical analyzer (DMA) (DMA850 manufactured by TA Instruments) at a heating rate of 3°C / min. The test standard for glass transition temperature was the detection method specified in IPC-TM-650 2.4.25C and 24C of the Institute for Interconnecting and Packaging Electronic Circuits (IPC).

[0075] 3. Regarding the measurement of dielectric constant and dielectric loss, the dielectric constant (Dk) and dissipation factor (Df) are measured using an Agilent E5071C network analyzer according to the IPC-TM-650 2.5.5.13 standard at an operating frequency of 10 megahertz (GHz).

[0076] 4. For the 288°C soldering heat resistance test, the test piece is boiled in a PCT pressure cooker for 2 hours and then immersed in a 288°C soldering furnace for 6 minutes, and it is recorded whether the test piece explodes or not.

[0077] 5. Thermal expansion coefficient test and expansion coefficient in the X / Y / Z axis directions are measured using a TA Instrument type TA Q800 thermal expansion analyzer, the measurement temperature is 50℃~260℃, the heating rate is 10℃ / min, and the thermal expansion coefficient and expansion rate in each direction (X / Y / Z axis directions) of the test sample are measured.

[0078] 6. Regarding the flame retardancy test, the UL-94 standard is referred to, and the time until the sample automatically extinguishes after burning is measured using a Bunsen burner, methane gas and a stopwatch, and the flame retardancy level is determined based on this time.

[0079] 7. Regarding the elastic modulus, the elastic modulus is measured using a Tensilon in accordance with the GB / T 22315-2008 standard.

[0080] The performance of the copper clad laminates according to the above Examples and Comparative Examples is as follows.

[0081] [Table 3]

[0082] [Table 4]

[0083] As can be seen from the performance of the copper-clad laminates according to the above examples and comparative examples, when the resin composition of Example 6 is used, a halogen-free cured product can be obtained that has a high glass transition temperature, a high flexural modulus, excellent dielectric properties, and a low XY linear expansion coefficient. The resin composition contains a polybutadiene-modified epoxy resin, a double-bond-modified benzoxazine resin, a bismaleimide resin, and a double DPO-type phosphorus-containing flame retardant.

[0084] In Comparative Examples 1, 2, and 3, the phosphorus-containing flame retardants in the resin compositions all react with the resin, resulting in a lower Tg and poor electrical properties for the cured product. In Comparative Example 4, the proportion of double DPO phosphorus-containing flame retardant in the resin composition was insufficient, resulting in the cured product meeting only the 94UL-V1 flame retardancy standard. In Example 5, the proportion of filler in the resin composition was insufficient, resulting in a low modulus of elasticity for the cured product. In Examples 6, 7, and 8, among the bismaleimide resins in the resin compositions, BMI-2300 had the smallest XY linear expansion coefficient. The copper-clad laminate produced using the resin composition of Example 6 exhibited a Tg of 265°C, a Peel of 7.5 lb / in, a Df of 0.0070 at 10 GHz, a modulus of elasticity of 30 GPa, and an XY linear expansion coefficient of 9.5 ppm / °C.

[0085] The technical features of the above-described embodiments can be combined in any manner, and for the sake of brevity, not all possible combinations of the technical features of the above-described embodiments are described, but all such combinations should be considered to fall within the scope of the present specification.

[0086] The above examples only describe some embodiments of the present invention, and are intended to facilitate a specific and detailed understanding of the technical solutions of the present invention, but should not be construed as limiting the scope of the claims of the present invention. Those skilled in the art may make various modifications and improvements to the present invention without departing from the spirit of the present invention, and these modifications and improvements also fall within the scope of the present invention. It should be understood that any technical solutions obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation based on the technical solutions provided by the present invention are within the scope of the claims attached to the present invention. Therefore, the patent protection scope of the present invention depends on the content of the appended claims, and the specification serves to explain the content of the claims.

Claims

1. In parts by weight, the ingredients are: 50 to 150 parts of modified epoxy resin, 40 to 120 parts of modified benzoxazine resin, 20 to 100 parts of bismaleimide resin, 50-80 parts of halogen-free flame retardant, 0.1 to 15 parts of an initiator, and Contains 150 to 550 parts of an inorganic filler; The structural formula of the modified epoxy resin is formula (1-1): 【Chemistry 1】 and M and N are both positive integers, and M+N=15 to 50; the number average molecular weight of the modified epoxy resin is 1,000 to 10,000; The modified benzoxazine resin is selected from base benzoxazine resins whose terminal groups are modified with double bonds, The resin composition, wherein the non-halogen flame retardant is a compound represented by structural formula (2-1): 【Chemistry 2】

2. The bismaleimide resin is 4,4'-diphenylmethane bismaleimide, N-2,6-dimethylphenylmaleimide, N- (2,3-dimethylphenyl) maleimide, N-phenylmaleimide, 1,6-di (maleimide) hexane, N,N- (4-methyl-1,3-phenylene) bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, N'-m-phenylene bismaleimide, diphenylmethane maleimide, biphenyl bismaleimide resin, polyphenylmethane maleimide and bis (3-ethyl-5-methyl-4-maleimidophenyl) methane It is at least one selected from the group consisting of, characterized in that the resin composition according to claim 1.

3. 2. The resin composition according to claim 1, wherein the base benzoxazine resin of the modified benzoxazine resin is at least one selected from the group consisting of BPA-type benzoxazine, BPF-type benzoxazine, ODA-type benzoxazine, and BPS-type benzoxazine.

4. 2. The resin composition according to claim 1, wherein, in the structural formula of the modified epoxy resin, M is 3 to 8, N is 5 to 15, and the number average molecular weight of the modified epoxy resin is 1,000 to 4,000.

5. The resin composition according to claim 1, wherein the initiator is at least one selected from the group consisting of bis(t-butylperoxy-m-isopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di-t-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne, benzoyl peroxide, chloranil, 2,4,6-tri-t-butylphenol, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

6. 2. The resin composition according to claim 1, wherein the inorganic filler is at least one selected from the group consisting of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

7. A prepreg comprising a substrate and a resin material supported on the substrate, wherein the resin material is the resin composition according to any one of claims 1 to 6.

8. 8. Use of the prepreg according to claim 7 in the manufacture of a laminate, a copper clad laminate or a wiring board.

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