Component mounting system and component mounting method

Abstract

To provide a component mounting system capable of appropriately managing abnormalities in component mounting equipment, and a component mounting method.SOLUTION: The component mounting method includes the steps of: calculating a correction value when mounting a component on a substrate based on substrate inspection information including misalignment information of a component mounted on the substrate; calculating a correction value when mounting on the substrate; mounting a component on a substrate based on a correction value; setting a management range relevant to the misalignment information based on the substrate inspection information (ST6); and determining the presence or absence of signs of abnormality related to component mounting work based on the misalignment information and the management range (ST7).SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a component mounting system and a component mounting method for mounting components on a board. [Background technology]

[0002] A known component mounting system for mounting components on a board includes an inspection device that inspects the mounting state, such as misalignment of components mounted on a board, by the component mounting device, and manages fluctuations in the state of the component mounting device based on the inspection results of the inspection device (for example, Patent Document 1).The system described in Patent Document 1 statistically processes the inspection results of the inspection device, and discloses that if the variance value of the mounting state falls outside a predetermined range for determining what to do, a calibration process is executed in the component mounting device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 004733 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technologies including Patent Document 1, the range of action determination is determined empirically by the administrator, so there is no guarantee that the range will be optimal, and it is also not possible to detect fluctuations in the condition of the component mounting device within the range of action determination, so there is room for further improvement in terms of capturing signs of abnormalities and appropriately managing the component mounting device.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting system and a component mounting method that are capable of appropriately managing abnormalities in a component mounting device. [Means for solving the problem]

[0006] The component mounting system of the present invention includes: a correction value calculation unit that calculates a correction value when mounting a component on a substrate based on substrate inspection information including at least positional deviation information of the component mounted on the substrate; and a component mounting unit that mounts the component on the substrate based on the correction value. a calculation unit that calculates an evaluation value that represents the mounting accuracy at the time of mounting by the component mounting unit based on the board inspection information; and The device is equipped with a setting unit that sets a management range for the misalignment information based on the board inspection information, and a judgment unit that judges whether there are any signs of abnormality related to the component mounting work based on the misalignment information and the management range.

[0007] A component mounting method of the present invention includes: calculating a correction value for mounting a component on a board based on board inspection information including at least positional deviation information of the component mounted on the board; mounting the component on the board based on the correction value; Based on the board inspection information, an evaluation value representing the mounting accuracy at the time of mounting is calculated, and the evaluation value of a predetermined number of boards acquired after the evaluation value reaches a predetermined value or more is A control range for the misalignment information is set based on the board inspection information, and the presence or absence of a sign of an abnormality in the component mounting work is determined based on the misalignment information and the control range. [Effects of the Invention]

[0008] According to the present invention, abnormalities in component mounting devices can be appropriately managed. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a plan view showing a configuration of a main part of a component mounting device provided in a component mounting system according to an embodiment of the present invention. [Figure 3] FIG. 1 is a side view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; [Figure 4] FIG. 1 is a diagram illustrating the configuration of a mounting head and a component supply unit of a component mounting device according to an embodiment of the present invention; [Figure 5] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting system according to an embodiment of the present invention. [Figure 6] FIG. 10 is an explanatory diagram of the amount of component positional deviation calculated by the inspection device according to an embodiment of the present invention. [Figure 7] 1A and 1B are plan and side views showing examples of shapes of components mounted on a board by a component mounting apparatus according to an embodiment of the present invention; [Figure 8] FIG. 1A is an explanatory diagram of the relationship between the standard deviation of the amount of misalignment and the reference width calculated in a component mounting system according to an embodiment of the present invention; FIG. 1B is an explanatory diagram of the control range; [Figure 9] 1 is a flow diagram of a component mounting method in a component mounting system according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, component mounting device, and inspection device. Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIG. 2 and some of the drawings described below, two axes perpendicular to each other in a horizontal plane are shown: the X-axis (left-right direction in FIG. 2) in the substrate transport direction, and the Y-axis (up-down direction in FIG. 2) perpendicular to the substrate transport direction. In FIG. 3 and some of the drawings described below, the Z-axis (up-down direction in FIG. 3) is shown as the height direction perpendicular to the horizontal plane. In FIG. 4 and some of the drawings described below, the θ-direction is shown, which is the direction of rotation around the Z-axis.

[0011] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of mounting components on a board to produce a mounted board. Component mounting system 1 is equipped with solder printing device M1, component mounting devices M2 and M3, and inspection device M4. These devices are connected to management computer 3 via communication network 2. Note that the number of component mounting devices M2 and M3 equipped in component mounting system 1 is not limited to two, and may be one, three, or more.

[0012] The solder printing device M1 screen-prints cream solder for component bonding onto the substrate to be mounted. The component mounting devices M2 and M3 perform a component mounting operation in which the component mounting unit 12 picks up components from the component supply unit 7, transfers them, and mounts them onto the substrate 6 on which the cream solder for component bonding has been printed (see FIG. 2). The inspection device M4 uses an inspection camera 32 (see FIG. 5) to inspect the mounting status of the components on the substrate 6 on which the components have been mounted by the component mounting devices M2 and M3, and detects any deviations from the correct positions of the components. In addition to its line management function, the management computer 3 has the function of setting a management range based on the component deviation information acquired by the inspection device M4 and detecting signs of abnormalities in the component mounting devices M2 and M3.

[0013] Next, the configuration of component mounting devices M2 and M3 will be described with reference to Figures 2 and 3. Figure 3 schematically shows a portion of component mounting devices M2 and M3 in Figure 2. Component mounting devices M2 and M3 have the function of performing mounting work, which involves mounting components supplied from a component supply unit onto a board 6. In Figure 2, a board transport mechanism 5 is arranged along the X-axis in the center of base 4. The board transport mechanism 5 transports the board 6 transported from upstream to the mounting work position, positions it, and holds it. In addition, the board transport mechanism 5 transports the board 6 downstream after the component mounting work has been completed.

[0014] Component supply units 7 are arranged on both sides (front side and rear side) of the board transport mechanism 5. Each component supply unit 7 has multiple tape feeders 8 arranged along the X axis. The tape feeders 8 feed a carrier tape, on which pockets for storing components D are formed, by pitch feeding in a direction (tape feed direction) from the outside of the component supply unit 7 toward the board transport mechanism 5, thereby supplying components D to a component suction position where the mounting head of the component mounting unit 12 will suction the components D.

[0015] 2 and 3, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the X-axis on the top surface of the base 4. Two beams 10 (on the front and rear sides), also equipped with linear drive mechanisms, are connected to the Y-axis table 9 so that they can move freely along the Y-axis. The beams 10 are arranged along the X-axis. A mounting head 11 is attached to each of the two beams 10 so that it can move freely along the X-axis. The mounting head 11 is equipped with multiple (eight in this example) suction units 11a that pick up and hold components D and can move up and down. A nozzle 11b that picks up and holds a component D is attached to the lower end of each suction unit 11a.

[0016] 2, by driving the Y-axis table 9 and the beam 10, the mounting head 11 moves in the horizontal direction (X-axis direction, Y-axis direction). As a result, the two mounting heads 11 pick up and remove components D from the component suction positions of the tape feeders 8 arranged in the corresponding component supply units 7 using the nozzles 11b, and mount them at the mounting points of the board 6 positioned by the board transport mechanism 5. In other words, the Y-axis table 9, the beam 10, and the mounting heads 11 constitute a component mounting unit 12 that mounts the components D on the board 6.

[0017] 2 and 3, a component recognition camera 13 is disposed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11, which has picked up a component D from the component supply unit 7, moves above the component recognition camera 13, the component recognition camera 13 captures an image of the component D held by the nozzle 11b, capturing an image of the holding state of the component D. A head camera 14 is attached to the plate 10a on which the mounting head 11 is attached. The head camera 14 moves integrally with the mounting head 11.

[0018] As the mounting head 11 moves, the head camera 14 moves above the board 6 positioned by the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board 6 to capture the position of the board 6. The head camera 14 also moves above the component suction position of the tape feeder 8, and captures an image of the component D accommodated on the carrier tape near the component suction position. When the mounting head 11 mounts components on the board 6, the mounting position is corrected taking into account the image of the component D captured by the component recognition camera 13 and the image of the board position captured by the head camera 14.

[0019] 2, a nozzle stocker 15 capable of accommodating a plurality of nozzles 11b is disposed next to the component recognition camera 13. When the mounting head 11 moves above the nozzle stocker 15 and performs a predetermined nozzle exchange operation, the nozzle 11b attached to the pickup unit 11a is accommodated in the nozzle stocker 15, and the nozzle 11b accommodated in the nozzle stocker 15 is attached to the pickup unit 11a. In other words, the nozzle 11b attached to the pickup unit 11a can be automatically exchanged. Each nozzle 11b is assigned a unique identification number, and it is possible to manage which pickup unit 11a of which mounting head 11 the nozzle 11b is attached to, or which nozzle stocker 15 the nozzle 11b is accommodated in.

[0020] Touch panels 16 operated by the workers are installed at the front and rear of the component mounting devices M2, M3 at positions where workers work. The touch panels 16 display various information on their display units, and the workers input data and operate the component mounting devices M2, M3 using operation buttons and the like displayed on the display units.

[0021] 3, a carriage 17 is set in the component supply unit 7, with a plurality of tape feeders 8 pre-installed on a feeder base 17a. A plurality of slots for installing the tape feeders 8 are formed in the feeder base 17a. The tape feeders 8 installed on the carriage 17 are managed based on the position of the installed slot and the position (front side, rear side) of the carriage 17 installed on the component mounting devices M2, M3. The carriage 17 holds a tape reel 19 that stores a carrier tape 18 holding components D in a wound state.

[0022] The carrier tape 18 pulled out from the tape reel 19 is pitch-fed to the component suction position by a tape feeding mechanism 8a built into the tape feeder 8. The tape feeding mechanism 8a pitch-fed the carrier tape 18 by a predetermined tape feed amount based on a command from the mounting control device 20 (see FIG. 5). The position of the component D supplied to the component suction position by the tape feeding mechanism 8a is corrected by a command from the mounting control device 20 based on the image of the component D at the component suction position captured by the head camera 14. That is, the tape feeding mechanism 8a feeds the carrier tape 18 by the correction value transmitted from the mounting control device 20 to correct the position of the component D, and then pitch-fed the carrier tape 18 by the predetermined tape feed amount.

[0023] Next, the configuration of the mounting head 11 will be described with reference to Figure 4. The mounting head 11 is equipped with multiple suction units 11a, and each suction unit 11a is equipped with a drive mechanism (not shown). By driving the drive mechanism, a shaft 11c having a nozzle 11b attached to its lower end moves up and down (arrow a), and the shaft 11c rotates, causing the nozzle 11b to rotate in the θ direction around the nozzle axis AN (arrow b). Each suction unit 11a is equipped with a height measurement unit 11d, which is a sensor that measures the height of the shaft 11c. The measurement results by the height measurement unit 11d are sent to the mounting control device 20.

[0024] The height measurement unit 11d is configured, for example, by an encoder (not shown) that measures the height position of the shaft 11c. The height measurement unit 11d also has a contact detection function that detects when the attached nozzle 11b comes into contact with the substrate 6 or the like. The contact detection function is configured by a thrust measurement unit (not shown) that measures the downward thrust (torque) generated by the drive mechanism, a load cell (not shown) that measures the pressure transmitted from the shaft 11c, and the like. The nozzle 11b is lowered above the substrate 6, and the height position of the nozzle 11b (the amount of descent of the nozzle 11b during the component mounting operation) can be corrected based on the height at which the nozzle 11b comes into contact with the substrate 6 measured by the height measurement unit 11d.

[0025] In FIG. 4, the nozzles 11b attached to each suction unit 11a are connected to a vacuum supply unit (not shown) and an air supply unit (not shown) via switching valves (not shown) controlled by the mounting control device 20. By switching the switching valve to the vacuum supply unit side, a vacuum suction force is generated at the tip of the nozzle 11b. By switching the switching valve to the air supply unit side, air is ejected from the tip of the nozzle 11b. When holding a component D, the switching valve is switched to the vacuum supply unit side, and a vacuum suction force is supplied to the nozzle 11b. When releasing the held component D from the nozzle 11b or removing foreign matter accumulated in the nozzle 11b, the switching valve is switched to the air supply unit side, and air is supplied to the nozzle 11b.

[0026] Each suction unit 11a is provided with a flow meter 11e, which is a sensor that measures the amount of air sucked from the nozzle 11b. The measurement results from the flow meter 11e are sent to the mounting control device 20. If the flow meter 11e detects that the inflow of air does not stop even after the nozzle 11b has performed an operation to hold a component D, it is determined that a suction failure, in which the nozzle 11b did not properly hold the component D, or a component drop, in which the component D was dropped, has occurred. Furthermore, by switching the switching valve to the vacuum supply unit side when the nozzle 11b is not holding a component D and measuring the amount of air inflow with the flow meter 11e, it is possible to detect clogging of the nozzle 11b with foreign matter. In other words, if the air flow rate is lower than a predetermined value, it is determined that foreign matter has clogged the nozzle 11b or the filter.

[0027] Next, the configuration of the control system of component mounting system 1 will be described with reference to Figure 5. Here, of the functions possessed by component mounting system 1, the description will focus on the function of managing abnormalities in component mounting devices M2 and M3 based on positional deviation information of components D mounted on board 6. Management computer 3, component mounting devices M2 and M3, and inspection device M4 are interconnected via communication network 2. Component mounting devices M2 and M3 each include a mounting control device 20, a board conveying mechanism 5, a tape feeder 8, a component mounting unit 12, a component recognition camera 13, a head camera 14, and a touch panel 16. Mounting control device 20 includes a mounting memory unit 21, a mounting control unit 22, a state inspection control unit 23, and a mounting communication unit 24.

[0028] The mounting communication unit 24 transmits and receives data to and from the inspection device M4 and the management computer 3 via the communication network 2. The mounting storage unit 21 is a storage device that stores mounting data 21a, correction value information 21b, and the like. The mounting data 21a includes information such as the production model name (board name) of the mounting board, the type (component name) of the component D to be mounted on the board 6, the mounting position (XY coordinates), the mounting direction (θ direction), the mounting position of the tape feeder 8 that supplies the component D, and the mounting position of the nozzle 11b. The correction value information 21b stores a correction value that is calculated by the inspection device M4 after capturing an image of the component D mounted on the board 6 and is transmitted from the inspection device M4 when mounting the component D on the board 6.

[0029] 5, mounting control unit 22 controls tape feeder 8, component mounting unit 12, component recognition camera 13, and head camera 14 based on information such as the mounting position and mounting direction included in mounting data 21a and the correction value included in correction value information 21b, to mount component D on board 6. As a result, component mounting unit 12 corrects the position of mounting head 11 based on the correction value included in correction value information 21b and the position of component D held by nozzle 11b imaged by component recognition camera 13, and mounts component D on board 6.

[0030] 5, inspection device M4 includes an inspection control device 30, a board conveying mechanism 31, an inspection camera 32, and an inspection camera moving mechanism 33. Inspection control device 30 includes an inspection memory unit 34, an inspection control unit 35, a recognition processing unit 36, a correction value calculation unit 37, and an inspection communication unit 38. The inspection communication unit 38 transmits and receives data to and from component mounting devices M2 and M3 and management computer 3 via communication network 2. Inspection memory unit 34 is a storage device that stores inspection data 34a and the like. Inspection data 34a includes the production model name of the mounted board (board name), the type of component (component name) mounted on board 6, the mounting position (XY coordinates), the mounting direction (θ direction), and a defect determination value.

[0031] The inspection control unit 35 controls the board transport mechanism 31 to transport the mounted board 6 transported from the upstream component mounting device M3 into the inspection work position, position it, and hold it there, and then transport the board 6 downstream after the inspection work has been completed. Furthermore, the inspection control unit 35 controls the inspection camera moving mechanism 33 based on the inspection data 34a to move the inspection camera 32 sequentially above the mounting position of the board 6 held at the inspection work position, and causes the inspection camera 32 to capture images of the components D mounted on the board 6.

[0032] 5, the recognition processing unit 36 ​​recognizes and processes the image captured by the inspection camera 32 to calculate the amounts of positional deviation ΔX, ΔY, and Δθ (see FIG. 6) of the component D mounted on the board 6 from the correct mounting position N. If the calculated amounts of positional deviation ΔX, ΔY, and Δθ exceed the defect determination values ​​included in the inspection data 34a, the recognition processing unit 36 ​​determines that the component D is defective. The recognition processing unit 36 ​​also creates, for each board 6, board inspection information 41b including information on the positional deviation (amounts of positional deviation ΔX, ΔY, and Δθ) of the component D mounted on the board 6 and the determination result of whether or not the mounting is defective, and transmits the information to the management computer 3. The management processing device 40 of the management computer 3 stores the received board inspection information 41b in the management storage unit 41.

[0033] 6, an example of a method by which the recognition processing unit 36 ​​calculates the amounts of positional deviation ΔX, ΔY, and Δθ of component D mounted on the board 6 from its normal mounting position N will be described. The inspection control unit 35 causes the inspection camera 32 to capture an image of the component D mounted on the board 6 at a position where the center of the image capture coincides with the normal mounting position N of the component D. The recognition processing unit 36 ​​detects the center position C of the mounted component D by performing recognition processing on the captured image. Then, the recognition processing unit 36 ​​calculates the amount of positional deviation ΔX in the X-axis direction and the amount of positional deviation ΔY in the Y-axis direction from the difference between the center position C and the mounting position N. Furthermore, the recognition processing unit 36 ​​calculates the tilt of the component D in the θ direction as the amount of positional deviation Δθ.

[0034] 5, the correction value calculation unit 37 calculates a correction value to be used when the component mounting devices M2 and M3 mount the component D on the board 6, based on the positional deviation amounts ΔX, ΔY, and Δθ of the component D calculated by the recognition processing unit 36. The correction value calculation unit 37 also creates correction value information 21b including the calculated correction value and transmits it to the component mounting devices M2 and M3. The mounting control devices 20 of the component mounting devices M2 and M3 store the received correction value information 21b in the mounting storage unit 21. In this way, the correction value calculation unit 37 calculates the correction value to be used when the component D is mounted on the board 6, based on the board inspection information 41b including at least the positional deviation information (positional deviation amounts ΔX, ΔY, and Δθ) of the component D mounted on the board 6.

[0035] 5, the management processing device 40 of the management computer 3 includes a management storage unit 41, a calculation unit 42, a setting unit 43, a determination unit 44, an input unit 45, a display unit 46, and a management communication unit 47. The input unit 45 is an input device such as a keyboard, a touch panel, or a mouse, and is used for inputting operation commands and data. The display unit 46 is a display device such as a liquid crystal panel, and displays various information such as various screens, including an operation screen for operation by the input unit 45. The management communication unit 47 is a communication interface, and transmits and receives signals and data to and from the component mounting devices M2 and M3 and the inspection device M4 via the communication network 2.

[0036] Management memory unit 41 is a storage device that stores production data 41a, board inspection information 41b, evaluation value information 41c, management range information 41d, judgment information 41e, etc. Production data 41a includes information such as the production model name of the mounted board (board name), the type (component name) of component D to be mounted on board 6, the size of component D, the mounting position (XY coordinates), the mounting direction (θ direction), information specifying component mounting devices M2 and M3 that mount component D, the mounting position of tape feeder 8 that supplies component D, and the mounting position of nozzle 11b.

[0037] 5, the calculation unit 42 calculates an evaluation value representing the mounting accuracy during mounting by the component mounting units 12 of the component mounting devices M2 and M3 based on the board inspection information 41b. The calculation unit 42 then compares the calculated evaluation value with a predetermined threshold to determine whether the mounting accuracy during mounting has exceeded a predetermined value, i.e., whether production has stabilized. Specifically, the calculation unit 42 calculates a standard deviation σ1 based on the positional deviation amounts ΔX, ΔY, and Δθ included in the board inspection information 41b for one board.

[0038] At this time, the calculation unit 42 calculates the standard deviation σ1 for each of the component mounting devices M2 and M3, each component mounting unit 12, each mounting head 11, each nozzle 11b, and each tape feeder 8, which are components. The calculation unit 42 may also calculate the standard deviation σ1 for each mounting angle (0°, 90°, 180°, 270°, etc.) of the component D by the nozzle 11b. The calculation unit 42 then calculates a process capability index Cp (Cp=T / 6σ1) as an evaluation value from the reference width T calculated from the widths W1 and W2 (see FIG. 7) of the electrodes Db of the component D and the calculated standard deviation σ1.

[0039] That is, the calculation unit 42 calculates the process capability index Cp for each component. This makes it possible to confirm that production has stabilized (that mounting accuracy has exceeded a predetermined value) for each component. The calculation unit 42 stores the calculated process capability index Cp in the management storage unit 41 as evaluation value information 41c.

[0040] Here, widths W1 and W2 of electrodes Db of component D will be described with reference to FIG. 7. In FIG. 7, component D will be described using a chip component such as a resistor or capacitor as an example. FIG. 7(a) shows a plan view of component D mounted on substrate 6 as viewed from above, and FIG. 7(b) shows a side view of component D mounted on substrate 6 as viewed from the side. Component D has electrodes Db on both ends (left and right) of main body Da. Here, the width of electrode Db in the direction in which the two electrodes Db are aligned is defined as width W2, and the width of electrode Db in the direction perpendicular to the direction in which the two electrodes Db are aligned is defined as width W1.

[0041] When component D is mounted on substrate 6 with the two electrodes Db aligned in the X-axis direction of substrate 6, the reference width T (T = (2 / 3) × W2) for evaluating the amount of misalignment ΔX in the X-axis direction is calculated from the width W2 of electrodes Db. Also, the reference width T (T = (2 / 3) × W1) for evaluating the amount of misalignment ΔY in the Y-axis direction is calculated from the width W1 of electrodes Db.

[0042] 8(a) schematically shows the relationship between the probability density of the misalignment amounts ΔX, ΔY, and Δθ of component D, the standard deviation σ1, and the reference width T. The larger the process capability index Cp (Cp=T / 6σ1), which indicates the relationship between the reference width T and the standard deviation σ1 of the misalignment amounts ΔX, ΔY, and Δθ of component D, the higher the mounting accuracy and the more stable the production. For example, the calculation unit 42 determines that production is stable when the process capability index Cp is 1 or greater (a predetermined value). In other words, the predetermined value for determining whether production is stable is a value at a level at which mounting accuracy is determined to be good.

[0043] In this way, the calculation unit 42 calculates an evaluation value (process capability index Cp) based on the board inspection information 41b for each component related to the mounting work of the component mounting unit 12, based on the size (widths W1, W2) of the electrodes Db of the component D. That is, the evaluation value is the process capability index Cp calculated based on the size (widths W1, W2) of the electrodes Db and the standard deviation σ1 related to the positional deviation information (positional deviation amounts ΔX, ΔY, Δθ).

[0044] Furthermore, when the calculation unit 42 calculates an evaluation value (process capability index Cp) for each nozzle 11b as a component of the component mounting unit 12, the calculation unit 42 calculates the evaluation value for the nozzle 11b based on the component D with the smallest electrode Db size (widths W1, W2) among multiple types of components D held by the nozzle 11b. This makes it possible to appropriately determine whether production of the component mounting devices M2, M3 has stabilized. Hereinafter, the state in which the calculation unit 42 determines that production of the component mounting devices M2, M3 has stabilized is referred to as a "stable production state."

[0045] 5, the setting unit 43 sets control ranges (upper control limit UCL, lower control limit LCL) for the misalignment information (misalignment amounts ΔX, ΔY, Δθ) based on the board inspection information 41b. The control ranges are used to monitor whether the component mounting devices M2 and M3, which will be described later, are able to maintain a stable production state. The setting unit 43 sets the control ranges based on the board inspection information 41b for a predetermined number of boards 6 (e.g., 15 boards) on which components D are mounted after the component mounting devices M2 and M3 start producing mounted boards and the calculation unit 42 confirms that the stable production state has been reached. For example, the setting unit 43 sets the control range for each component based on the board inspection information 41b acquired after all of the evaluation values ​​(process capability index Cp) for each component have reached a predetermined value or greater.

[0046] Specifically, the setting unit 43 calculates the mean value μ2 and the standard deviation σ2 for each component element based on the misalignment amounts ΔX, ΔY, and Δθ included in the substrate inspection information 41b for a predetermined number of substrates. Then, the setting unit 43 calculates the upper control limit UCL (UCL = μ2 + 3 × σ2) and the lower control limit LCL (LCL = μ2 - 3 × σ2) from the calculated mean value μ2 and standard deviation σ2. That is, the setting unit 43 sets the control range (upper control limit UCL, lower control limit LCL) based on statistics including at least the mean value μ2 and the standard deviation σ2 based on the misalignment information (misalignment amounts ΔX, ΔY, Δθ). The setting unit 43 stores the set control range in the management storage unit 41 as control range information 41d.

[0047] 8(b), an example of the control ranges (upper control limit UCL, lower control limit LCL) set by the setting unit 43 will be described. In this example, the mean value μ2 is zero. That is, the center line CL is drawn at a position where the positional deviations ΔX, ΔY, and Δθ are zero. The upper control limit UCL is drawn upward from the center line CL at a position (+3σ2) that is three times the standard deviation σ2, and the lower control limit LCL is drawn downward from the center line CL at a position (-3σ2) that is three times the standard deviation σ2.

[0048] 5, the determination unit 44 determines whether the component mounting devices M2 and M3 are maintaining a stable production state based on the board inspection information 41b of the boards 6 on which the components D were mounted by the component mounting devices M2 and M3 after the setting unit 43 set the management range. Specifically, if the board inspection information 41b for one board contains five or more misalignment amounts ΔX, ΔY, and Δθ for each component, the determination unit 44 randomly extracts five pieces of data for each board 6 and calculates the average value μ3. If the determination unit 44 cannot extract five pieces of data from the board inspection information 41b for one board, the determination unit 44 randomly extracts five pieces of data from data including the board inspection information 41b for the board 6 produced previously. The determination unit 44 stores the calculated average value μ3 in the management storage unit 41 as determination information 41e.

[0049] Furthermore, the judgment unit 44 judges whether the component mounting devices M2, M3 are continuing a stable production state based on the multiple average values ​​μ3 calculated for each board 6 and the control range. That is, the judgment unit 44 judges whether there are signs of an abnormality related to the mounting work by the component mounting devices M2, M3. As a method for the judgment unit 44 to judge whether there are signs of an abnormality, for example, Shewhart's abnormality judgment can be used. In Shewhart's abnormality judgment, an abnormality is judged when a situation is detected in which the average value μ3 exceeds the upper control limit UCL or the lower control limit LCL, there are consecutive average values ​​μ3 on one side of the center line CL, or the average value μ3 shows a tendency to continuously increase or decrease, etc.

[0050] In this way, the judgment unit 44 judges whether or not there is a sign of abnormality in the mounting work of the component D by the component mounting devices M2 and M3 based on the misalignment information (misalignment amounts ΔX, ΔY, Δθ) and the control range (upper control limit UCL, lower control limit LCL). Note that, although the above description has been given of a method using the average value μ3 of the five misalignment amounts ΔX, ΔY, Δθ to judge whether or not there is a sign of abnormality, the method for judging whether or not there is a sign of abnormality is not limited to this. For example, a judgment method using the range R, which is the difference between the maximum and minimum values ​​of the five misalignment amounts ΔX, ΔY, Δθ, may also be used. In this case, the setting unit 43 sets a control range for the range R, and the judgment unit 44 calculates the range R for each board 6 and judges whether or not there is a sign of abnormality.

[0051] In this way, the setting unit 43 sets the control range (upper control limit UCL, lower control limit LCL) based on statistics including at least the mean value μ2 and standard deviation σ2 based on the misalignment information (misalignment amounts ΔX, ΔY, Δθ). The judgment unit 44 then judges whether or not there is a sign of an abnormality based on the statistics (mean value μ3, range R) within the control range. This makes it possible to detect signs of a transition from a stable production state to an abnormal state before the statistics exceed the control range and the component mounting devices M2 and M3 become defective and are shut down. Furthermore, the judgment unit 44 detects each component that may become defective, allowing appropriate measures to be taken, such as formulating a maintenance plan.

[0052] 5, when the judgment unit 44 determines that there is a sign of an abnormality, it causes the display unit 46 of the management computer 3 to display a message that a sign of an abnormality has been detected and information identifying the detected component. The judgment unit 44 may also cause the touch panel 16 of the component mounting device M2, M3 that has the component for which a sign of an abnormality has been detected to display that message. In this way, the display unit 46 and the touch panel 16 are notification units that notify the detection of a sign of an abnormality when it is determined that there is a sign of an abnormality.

[0053] Furthermore, the determination unit 44 transmits information identifying the component for which a sign of abnormality has been detected to the mounting control device 20 of the component mounting devices M2, M3 that has the component. Having received the information, the state inspection control unit 23 of the component mounting devices M2, M3 controls the various units and sensors of the component mounting devices M2, M3 to inspect the state of the component and take any necessary measures (automatic check).

[0054] For example, if a sign of an abnormality in nozzle 11b (component) is detected, state inspection control unit 23 causes component recognition camera 13 to capture an image of the tip of nozzle 11b in question, and checks for adhesion of foreign matter to the nozzle tip. Then, upon confirming adhesion of foreign matter to the nozzle tip, state inspection control unit 23 replaces nozzle 11b in question with nozzle 11b housed in nozzle stocker 15. Note that if there is no suitable nozzle 11b to replace in component mounting devices M2, M3, then nozzle 11b in question is manually cleaned or replaced with another nozzle 11b during a changeover operation to change the production model of mounted boards, etc.

[0055] Furthermore, if a sign of an abnormality in the nozzle 11b (component) is detected, the state inspection control unit 23 causes air to be sucked through the nozzle 11b and measures the amount of sucked air with the flow meter 11e. If the amount of sucked air is less than a predetermined amount, the state inspection control unit 23 determines that foreign matter has accumulated in the filter of the suction unit 11a to which the nozzle 11b is attached (filter clogging). The state inspection control unit 23 then switches the switching valve to the air supply unit side, causing air to be ejected from the nozzle 11b, thereby performing a procedure to clear the filter clogging. If the filter clogging cannot be cleared, the filter is replaced manually during a setup change or the like.

[0056] Furthermore, if a sign of an abnormality in nozzle 11b (component) is detected, state inspection control unit 23 uses height measurement unit 11d to measure the height position of nozzle 11b and correct the height position. Furthermore, if a sign of an abnormality in tape feeder 8 is detected, state inspection control unit 23 causes head camera 14 to capture an image of component D being supplied to the component suction position of tape feeder 8 and corrects the tape feed position of tape feed mechanism 8a. Note that if the tape feed position cannot be corrected, work such as replacing tape feeder 8 with another tape feeder 8 is performed during setup changeover work, etc.

[0057] In this way, the flow meter 11e, height measurement unit 11d, component recognition camera 13, and head camera 14 constitute a sensor S that inspects the status related to the mounting work of the component mounting unit 12. If it is determined that there is a sign of an abnormality, the sensor S automatically inspects the status related to the mounting work of the component mounting unit 12. Then, the status inspection control unit 23 automatically executes measures to resolve the signs of abnormality if possible. If the signs of abnormality cannot be automatically resolved, the worker will execute measures at the next opportunity for changeover work, etc.

[0058] Next, a component mounting method for detecting signs of abnormality in component mounting devices M2 and M3 while component mounting system 1 is producing mounted boards will be described with reference to the flow in Fig. 9. First, when production of mounted boards is started in component mounting system 1 (ST1), component mounting devices M2 and M3 continue to perform component mounting work to mount components D on board 6 based on correction values ​​calculated by inspection device M4, and inspection device M4 continues to perform board inspection work to obtain positional deviation information (positional deviation amounts ΔX, ΔY, Δθ) of components D on the mounted board.

[0059] When the management computer 3 acquires board inspection information 41b including misalignment information of components D on the first board 6 from the inspection device M4 (ST2), the calculation unit 42 then calculates an evaluation value (process capability index Cp) representing the mounting accuracy by the component mounter 12 for each component (ST3: evaluation value calculation step). Next, the calculation unit 42 determines whether all of the evaluation values ​​calculated for each component are equal to or greater than a predetermined value (process capability index Cp>1) (ST4: stable production determination step). If the evaluation values ​​are not equal to or greater than the predetermined value, that is, if it is determined that the component mounters M2 and M3 have not reached a stable production state (No in ST4), the process returns to (ST2), and the evaluation value calculation step (ST3) and stable production determination step (ST4) are executed based on the board inspection information 41b of the second board 6.

[0060] 9, when it is determined that the component mounting devices M2 and M3 have reached a stable production state (Yes in ST4), the management computer 3 acquires board inspection information 41b for a predetermined number of boards (e.g., 15 boards) after confirming the stable production state (ST5). Next, the setting unit 43 sets control ranges (upper control limit UCL, lower control limit LCL) for the misalignment information (misalignment amounts ΔX, ΔY, Δθ) based on the board inspection information 41b for the predetermined number of boards (ST6: control range setting step).

[0061] Once the control range has been set, the judgment unit 44 judges whether or not there is a sign of an abnormality in the mounting work of the component D based on the misalignment information (misalignment amounts ΔX, ΔY, Δθ) in the board inspection information 41b acquired after the control range was set and the set control range (upper control limit UCL, lower control limit LCL) (ST7: abnormality sign judgment step). If no sign of an abnormality is detected (No in ST7), the abnormality sign judgment step (ST7) is continued until the production of the mounted board is completed (No in ST8).

[0062] 9, when a sign of an abnormality is detected (Yes in ST7), the judgment unit 44 causes the display unit 46 of the management computer 3 or the touch panel 16 of the component mounting device M2, M3 in which the sign of an abnormality is detected to notify that a sign of an abnormality has been detected (ST9: sign notifying step). In addition, the judgment unit 44 notifies the component mounting device M2, M3 in which the sign of an abnormality is detected of information about the component in which the sign of an abnormality is detected.

[0063] Upon receiving the notification, the state inspection control unit 23 of the component mounting devices M2, M3 executes an automatic check corresponding to the component in which a sign of abnormality was detected and takes any possible measures (ST10: automatic check step). Thereafter, the state inspection control unit 23 reports the details of the automatic check and subsequent measures to the management computer 3. Note that the management computer 3 continues to execute the abnormality sign determination step (ST7) even while the sign notification step (ST9) and automatic check step (ST10) are being executed.

[0064] As described above, in the component mounting method in component mounting system 1 of this embodiment, inspection device M4 calculates a correction value for component mounting devices M2 and M3 when mounting component D on board 6, based on board inspection information 41b including misalignment information (misalignment amounts ΔX, ΔY, Δθ) of component D mounted on board 6. Furthermore, component mounting devices M2 and M3 mount component D on board 6 based on the correction value. Then, management computer 3 sets a control range (upper control limit UCL, lower control limit LCL) for the misalignment information based on board inspection information 41b (ST6), and determines whether or not there is a sign of an abnormality related to the component mounting work based on the misalignment information and the control range (ST7). This allows for appropriate management of abnormalities in component mounting devices M2 and M3.

[0065] As described above, component mounting system 1 of the present embodiment includes correction value calculation unit 37 that calculates a correction value for mounting component D on board 6 based on board inspection information 41b including at least positional deviation information (positional deviation amounts ΔX, ΔY, Δθ) of component D mounted on board 6, component mounting unit 12 that mounts component D on board 6 based on the correction value, setting unit 43 that sets control ranges (upper control limit UCL, lower control limit LCL) for the positional deviation information based on board inspection information 41b, and determination unit 44 that determines whether or not there is a sign of abnormality in the mounting work of component D based on the positional deviation information and the control ranges. This makes it possible to appropriately manage abnormalities in component mounting devices M2 and M3.

[0066] In the above embodiment, the inspection device M4 is configured to calculate the correction value, but the component mounting system 1 of this embodiment is not limited to this configuration. For example, the management computer 3 may be provided with a correction value calculation unit 37, which calculates a correction value based on the board inspection information 41b and transmits it to the component mounting devices M2 and M3. Furthermore, the component mounting devices M2 and M3 may each be provided with a correction value calculation unit 37, which acquires the board inspection information 41b from the inspection device M4 and calculates a correction value. [Industrial Applicability]

[0067] The component mounting system and component mounting method of the present invention have the effect of being able to appropriately manage abnormalities in a component mounting device, and are useful in the field of mounting components onto a board. [Explanation of symbols]

[0068] 1. Component mounting system 3 Management Computer 6 PCB 8 Tape feeder (component) 11 Mounting head (component) 11b Nozzle (component) 11d Height measurement unit (sensor) 11e Flow meter (sensor) 12 Component mounting section 13 Part recognition camera (sensor) 14 Head camera (sensor) D parts Db electrode LCL Lower control limit (control range) M2, M3 Component mounting equipment (component) S sensor UCL Upper Control Limit (Control Range) W1, W2 width (size) ΔX, ΔY, Δθ Position deviation amount (position deviation information)

Claims

1. a correction value calculation unit that calculates a correction value when mounting a component on a board based on board inspection information that includes at least positional deviation information of the component mounted on the board; a component mounting unit that mounts the component on the board based on the correction value; a calculation unit that calculates an evaluation value representing the mounting accuracy at the time of mounting by the component mounting unit based on the board inspection information; a setting unit that sets a management range for the misalignment information based on the substrate inspection information of a predetermined number of substrates acquired after the evaluation value has reached a predetermined value or more; a determination unit that determines whether or not there is a sign of an abnormality related to the component mounting work based on the positional deviation information and the management range.

2. The component mounting system according to claim 1 , wherein the calculation unit calculates the evaluation value for each component element related to the mounting work of the component mounting unit based on the board inspection information.

3. The component mounting system according to claim 2 , wherein the setting unit sets the management range based on the board inspection information acquired after all of the evaluation values ​​for the respective components become equal to or greater than the predetermined value.

4. The component mounting system according to claim 1 , wherein the calculation unit calculates the evaluation value based on a size of an electrode of the component.

5. the component mounting unit has a nozzle used to hold a plurality of types of components, The component mounting system according to claim 4 , wherein the calculation unit calculates the evaluation value of the nozzle based on a component having the smallest electrode size among the plurality of types of components.

6. 6. The component mounting system according to claim 4, wherein the evaluation value is a process capability index calculated based on the size of the electrode and a standard deviation related to the positional deviation information.

7. The component mounting system according to claim 1 , wherein the predetermined value is a value at a level at which the mounting accuracy is judged to be good.

8. The component mounting system according to claim 1 , wherein the setting unit sets the management range based on statistics including at least an average value and a standard deviation based on the positional deviation information.

9. The component mounting system according to claim 8 , wherein the determining unit determines whether or not the sign exists based on the statistical amount within the management range.

10. The component mounting system according to claim 1 , further comprising a notification unit that notifies detection of the sign when it is determined that the sign exists.

11. a sensor for inspecting a state related to the mounting operation of the component mounting unit; The component mounting system according to claim 1 , wherein the sensor inspects the state when it is determined that the sign exists.

12. calculating a correction value for mounting the component on the board based on board inspection information including at least positional deviation information of the component mounted on the board; Mounting the component on the board based on the correction value; calculating an evaluation value representing mounting accuracy at the time of mounting based on the board inspection information; setting a management range for the positional deviation information based on the substrate inspection information of the predetermined number of substrates acquired after the evaluation value has reached a predetermined value or more; The component mounting method determines whether or not there is a sign of an abnormality in the component mounting work based on the positional deviation information and the management range.

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