Glass ceramics and electronic components

Abstract

To provide a glass ceramic or the like having low relative permittivity ε and high strength.SOLUTION: A glass ceramic includes feldspar crystal phases, non-crystalline glass phases, Al2O3 phases, and SiO2 phases. The Al2O3 phases are bonded via the feldspar crystal phases.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to glass ceramics and electronic components. [Background technology]

[0002] Patent Document 1 describes an invention relating to a method for manufacturing a glass ceramic substrate. The glass ceramic contains a filler, some or all of which are flat particles.

[0003] Patent Document 2 describes an invention of a laminated inductor. A coil conductor is embedded in the laminated structure, and it is suitable for use in the high frequency range. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 09-71472 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-73536 Summary of the Invention [Problem to be solved by the invention]

[0005] An ideal inductor's impedance increases as the frequency increases. However, the impedance of an actual inductor decreases in the high frequency range in inverse proportion to the magnitude of its stray capacitance. The stray capacitance of an inductor is proportional to the dielectric constant of the inductor's material. Therefore, ceramics used in RF inductors, particularly those used in high frequency ranges, must have a low dielectric constant. It is also important that RF inductors have high strength. RF inductors for automotive applications in particular require even higher strength than RF inductors for other uses.

[0006] An object of the present invention is to provide a glass ceramic or the like having a low relative dielectric constant ε and high strength. [Means for solving the problem]

[0007] The glass ceramic according to the present invention is a glass ceramic comprising a feldspar crystalline phase, an amorphous glass phase, an Al2O3 phase, and an SiO2 phase, The Al2O3 phase is bonded via the feldspar crystalline phase.

[0008] The feldspar crystalline phase may contain primarily Sr.

[0009] The average aspect ratio of each Al2O3 filler constituting the Al2O3 phase may be 15 or more and 75 or less.

[0010] The average particle size of each SiO2 filler constituting the SiO2 phase may be 0.10 μm or more and 3.0 μm or less.

[0011] The value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase may be 0.10 or more and less than 1.00.

[0012] The area ratio of the Al2O3 phase may be 7.0% or more and 20.0% or less.

[0013] The area ratio of the SiO2 phase may be 10.0% or more and 30.0% or less.

[0014] An electronic component according to the present invention includes the above-described glass ceramic. [Brief explanation of the drawings]

[0015] [Figure 1] This is a STEM image of a cross section of glass ceramic. [Figure 2] 1 is a phase separation analysis image of a cross section of a glass ceramic. DETAILED DESCRIPTION OF THE INVENTION

[0016] Embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the components described below can be combined as appropriate.

[0017] The glass ceramic 1 of this embodiment is a glass ceramic including a feldspar crystalline phase 13, an amorphous glass phase 12, an Al2O3 phase 14, and an SiO2 phase 11. The Al2O3 phase 14 is bonded via the feldspar crystalline phase 13.

[0018] The feldspar crystal phase 13 is a phase mainly containing feldspar crystals. Feldspar crystals are crystals containing a Group 2 metal element (excluding Be), alumina, and silica, and are represented by the general formula M(Si,Al)4O8. M is a Group 2 metal element (excluding Be). M may be mainly Sr. When M is mainly Sr, it means that the content ratio of Sr is the highest on a mass basis among the elements contained as M in the feldspar crystals. Note that when it is simply stated that "the feldspar crystal phase 13 mainly contains Sr," it means that the content ratio of Sr is the highest on a mass basis among the elements contained as M in the feldspar crystals contained in the feldspar crystal phase 13.

[0019] The feldspar crystal phase 13 may contain metal oxides in addition to feldspar crystals. Examples of metal oxides include NaO, KO, ZrO, and AgO. The proportion of feldspar crystals in the feldspar crystal phase 13 is not particularly limited. For example, it may be 80 mass% or more.

[0020] The amorphous glass phase 12 is a phase consisting of glass that does not contain crystals. There are no particular limitations on the composition of the glass contained in the amorphous glass phase 12. For example, the amorphous glass phase 12 may contain 70 mass% or more of M oxide, Si oxide, Al oxide, and B oxide in total.

[0021] The Al2O3 phase 14 is a phase that mainly contains Al2O3 (alumina) crystals. There is no particular limit to the proportion of Al2O3 in the Al2O3 phase 14. For example, it may be 97 mass% or more. The SiO2 phase 11 is a phase that mainly contains SiO2 (silicon dioxide). There is no particular limit to the proportion of SiO2 in the SiO2 phase 11. For example, it may be 97 mass% or more.

[0022] A plurality of Al2O3 phases 14 are bonded via the feldspar crystalline phase 13. It is not necessary that all of the Al2O3 phases 14 are bonded via the feldspar crystalline phase 13. It is sufficient that at least one set of Al2O3 phases 14 is bonded via the feldspar crystalline phase 13. Furthermore, 25% or more of the Al2O3 phases 14 in terms of number may be bonded to other Al2O3 phases 14 via the feldspar crystalline phase 13.

[0023] The glass ceramic of this embodiment has the above-described structure, and thus has a low relative dielectric constant ε and high strength.

[0024] Glass-ceramics containing a large amount of amorphous phases, such as the SiO2 phase 11 and the amorphous glass phase 12, tend to have a low relative dielectric constant ε. Phase Glass ceramics with a high content are prone to cracking and weakening.

[0025] Although the inclusion of a crystalline phase such as the Al2O3 phase 14 increases the relative dielectric constant ε, the strength is not sufficiently improved. However, the present inventors have found that the glass ceramic does not contain the Al2O3 phase 14 In addition to the above, it has a feldspar crystalline phase 13, and the Al2O3 phase 14 is bonded via the feldspar crystalline phase 13, thereby forming a glass ceramic with a low relative dielectric constant ε and high strength.

[0026] The microstructure of the glass ceramic can be confirmed by observing a cross section of the glass ceramic using STEM-EDS or the like, followed by phase separation analysis. Figure 1 shows an image obtained by observing a cross section of the glass ceramic of this embodiment using STEM (hereinafter, sometimes simply referred to as a STEM image). Figure 2 also shows an image obtained by performing RGB image phase analysis as a phase separation analysis on the same observation area as in Figure 1 (hereinafter, sometimes simply referred to as a phase separation analysis image). There are no particular limitations on the size of the observation area or the magnification of the image, as long as it is large enough to observe the microstructure of the glass ceramic. For example, the size of the observation area is 200 μm 2 The magnification of the image should be 5000 times or more. Multiple observation ranges may be set. The total size of the multiple observation ranges must be 200 μm. 2 Anything above that is fine.

[0027] As shown in Figures 1 and 2, glass ceramic 1 contains a feldspar crystalline phase 13, an amorphous glass phase 12, an Al2O3 phase 14, and an SiO2 phase 11. The boundary between the feldspar crystalline phase 13 and the Al2O3 phase 14 is not clear in the STEM image of Figure 1. However, by combining the STEM image of Figure 1 with the phase separation analysis image of Figure 2, the boundary between the feldspar crystalline phase 13 and the Al2O3 phase 14 becomes clear. The feldspar crystalline phase 13 and / or the amorphous glass phase 12 are present around the Al2O3 phase 14. At least one pair of the Al2O3 phase 14 is bonded via the feldspar crystalline phase 13.

[0028] Furthermore, to identify each phase, an electron beam may be irradiated onto each phase to measure the electron beam diffraction pattern. When measuring the electron beam diffraction pattern of the amorphous glass phase 12, only a halo pattern derived from the amorphous material is obtained, and no spots derived from the crystals are observed. In contrast, when measuring the electron beam diffraction pattern of the feldspar crystal phase 13 and the Al2O3 phase 14, many spots derived from the crystals are observed. When measuring the electron beam diffraction pattern of the SiO2 phase 11, a halo pattern derived from the amorphous material and / or spots derived from the crystals are observed.

[0029] The glass ceramic may contain negligibly small amounts of phases other than the four phases of the feldspar crystalline phase 13, the amorphous glass phase 12, the Al2O3 phase 14, and the SiO2 phase 11. For example, the area ratio of phases other than the above may be 5% or less (including 0).

[0030] The glass ceramic may contain pores. However, the fewer pores the glass ceramic has, the denser it is, and having fewer pores is particularly preferable from the perspective of improving strength. For example, the area ratio of pores may be 5% or less (including 0).

[0031] The average aspect ratio of each Al2O3 filler constituting the Al2O3 phase 14 may be 15 or more and 75 or less. When the average aspect ratio of the Al2O3 filler is within the above range, the strength of the glass ceramic is likely to be improved compared to when the average aspect ratio of the Al2O3 filler is small. However, when the average aspect ratio of the Al2O3 filler exceeds 75, the sinterability is likely to decrease, voids are likely to increase, and the strength is likely to decrease.

[0032] The average aspect ratio of the Al2O3 filler can be calculated by measuring the aspect ratio of each Al2O3 phase 14 in a phase separation analysis image and averaging the results.

[0033] The average particle size of each SiO2 filler constituting the SiO2 phase 11 may be 0.10 μm or more and 3.0 μm or less. The smaller the average particle size of the SiO2 filler, the more likely it is that the sinterability will be reduced. Furthermore, it becomes more difficult for the Al2O3 phase 14 to bond via the feldspar crystal phase 13. The larger the average particle size of the SiO2 filler, the more likely it is that the surface roughness will be increased, especially when a sheet made of glass ceramic is produced.

[0034] The average particle size of the SiO2 filler can be calculated by measuring and averaging the equivalent circle diameter of each SiO2 phase 11 in a phase separation analysis image. The equivalent circle diameter of the SiO2 phase 11 means the diameter of a circle having the same area as the projected area of ​​the SiO2 phase 11.

[0035] The amorphous glass phase 12 and the feldspar crystalline phase 13 are phases mainly composed of glass components. In the glass ceramic of this embodiment, SiO2 filler and Al2O3 filler are dispersed in the glass component.

[0036] The value obtained by dividing the area ratio of the feldspar crystalline phase 13 by the area ratio of the amorphous glass phase 12 may be 0.10 or more and less than 1.00. The smaller the value obtained by dividing the area ratio of the feldspar crystalline phase 13 by the area ratio of the amorphous glass phase 12, the more difficult it becomes for the Al2O3 phase 14 to be bonded via the feldspar crystalline phase 13. The larger the value obtained by dividing the area ratio of the feldspar crystalline phase 13 by the area ratio of the amorphous glass phase 12, the more likely it is that the strength will be improved, but the relative dielectric constant ε will also be higher.

[0037] The area ratio of the Al2O3 phase 14 may be 7.0% or more and 20.0% or less. The smaller the area ratio of the Al2O3 phase 14, the more difficult it is for the Al2O3 phase 14 to bond via the feldspar crystalline phase 13.

[0038] The area ratio of the SiO2 phase 11 may be 10.0% or more and 30.0% or less. The smaller the area ratio of the SiO2 phase 11, the higher the relative dielectric constant tends to be. The larger the area ratio of the SiO2 phase 11, the lower the sinterability tends to be. Furthermore, the Al2O3 phase 14 becomes less likely to bond via the feldspar crystalline phase 13.

[0039] The area ratio of each phase can be calculated by image analysis of the phase separation analysis image.

[0040] Hereinafter, a method for producing a glass ceramic according to this embodiment, particularly a method for producing a glass ceramic body (glass ceramic sintered body), will be described.

[0041] The glass ceramic body is obtained by mixing glass raw materials, SiO2 filler raw materials, and Al2O3 filler raw materials, and sintering the mixture through heat treatment.

[0042] As glass raw materials, crystallized glass and amorphous glass are prepared and mixed.

[0043] As the glass-ceramics, glass containing components that will become feldspar crystals during the heat treatment described below is prepared. Examples of components that will become feldspar crystals during the heat treatment described below include oxides of M, oxides of Si, and oxides of Al. The glass-ceramics may also contain other components. Feldspar crystals in the glass-ceramics The ingredients that become There are no particular restrictions on the glass components other than these. For example, various oxides such as an oxide of B may be contained as appropriate.

[0044] The amorphous glass is not particularly limited. For example, it may be glass containing an oxide appropriately selected from various oxides such as oxides of Si, B, and K, but not containing crystals. Most of the glass components contained in the crystallized glass may ultimately be contained in the feldspar crystalline phase 13, or most of the amorphous glass may ultimately be contained in the amorphous glass phase 12.

[0045] The amorphous glass may be mixed with the crystallized glass during the heat treatment described below. Further, oxides not contained in the amorphous glass may be contained in the amorphous glass phase 12.

[0046] When only amorphous glass is used as a glass raw material, it is difficult to form a feldspar crystalline phase 13. When only crystallized glass is used as a glass raw material, the content of the amorphous glass phase 12 tends to be small. By controlling the ratio of each raw material, the area ratio of each phase can be controlled. In particular, by controlling the ratio of crystallized glass to amorphous glass, the value obtained by dividing the area ratio of the feldspar crystalline phase 13 by the area ratio of the amorphous glass phase 12 can be controlled.

[0047] There are no particular restrictions on the particle size of the glass raw material, and for example, it may have a D90 of 1 to 5 μm as measured by a laser diffraction particle size distribution analyzer.

[0048] The Al2O3 filler raw material is preferably α-alumina, which has a relatively high melting point. This is to ensure that the glass ceramic after heat treatment contains the Al2O3 phase 14. The shape of the Al2O3 filler raw material may be particulate or plate-like. The average aspect ratio of the Al2O3 phase 14 can be controlled by controlling the shape of the Al2O3 filler raw material. For example, a particulate Al2O3 filler raw material results in a low aspect ratio, while a plate-like Al2O3 filler raw material results in a high aspect ratio. Although some of the Al2O3 contained in the Al2O3 filler raw material may react with M and Si and be incorporated into the feldspar crystalline phase 13, most of the Al2O3 contained in the Al2O3 filler raw material is contained in the Al2O3 phase 14. Furthermore, the higher the aspect ratio of the Al2O3 filler, the larger the surface area of ​​the Al2O3 phase 14 (the longer the perimeter in the STEM image), and the larger the area proportion of the feldspar crystalline phase 13 adjacent to the Al2O3 phase 14 tends to be.

[0049] Quartz glass (amorphous silica) can be used as the SiO2 filler raw material. The average particle size of the SiO2 phase 11 can be controlled by controlling the particle size of the SiO2 filler raw material. Although some of the SiO2 contained in the SiO2 filler raw material may be incorporated into the amorphous glass phase 12 or the feldspar crystalline phase 13 by heat treatment, most of the SiO2 contained in the SiO2 filler raw material is contained in the SiO2 phase 11.

[0050] Next, the mixed raw materials are wet-mixed with a solvent or the like commonly used in this technical field for 24 hours to obtain a raw material slurry. The solvent may be an alcohol commonly used in this technical field. There are no particular restrictions on the equipment used for wet mixing. For example, a ball mill may be used. The obtained raw material slurry is dried until the solvent is gone, to obtain a glass-ceramic material. There are no particular restrictions on the equipment used for drying. For example, a spray dryer may be used.

[0051] Next, the resulting glass ceramic material is granulated with a binder or the like commonly used in this technical field, and the granules are sized using a sieve. These granules are then pressure-molded into a green body. The green body is then heat-treated in air to obtain a glass ceramic body (sintered glass ceramic body).

[0052] The heat treatment incorporates some of the SiO2 contained in the SiO2 filler material into the amorphous glass. Furthermore, the heat treatment also produces feldspar crystals with Al2O3 as the core. Therefore, the feldspar crystalline phase 13 is generated around the Al2O3 phase 14, and the Al2O3 phase 14 is bonded via the feldspar crystalline phase 13.

[0053] The shorter the heat treatment time, the easier it is to reduce the value obtained by dividing the area ratio of the feldspar crystalline phase 13 by the area ratio of the amorphous glass phase 12. As a result, it becomes more difficult for the Al2O3 phase 14 to bond via the feldspar crystalline phase 13. By setting the heat treatment time to a sufficient length, the Al2O3 phase 14 bonds via the feldspar crystalline phase 13. As the heat treatment time becomes longer, the SiO2 phase 11 and the amorphous glass phase 12 decrease, and the feldspar crystalline phase 13 increases.

[0054] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0055] For example, a glass ceramic paste may be obtained by kneading a glass ceramic material with a binder and a solvent commonly used in this technical field. Then, a laminate consisting of glass ceramic and a conductor may be formed by alternately printing and laminating the glass ceramic paste and a conductor paste containing Ag or the like, followed by firing (printing method). Alternatively, a laminate consisting of glass ceramic and a conductor may be formed by preparing green sheets using the glass ceramic paste, printing an internal electrode paste on the surface of the green sheets, laminating them, and firing them (sheet method).

[0056] When the glass ceramic and the conductor are fired simultaneously as described above, metals contained in the conductor (e.g., Ag) may diffuse into the glass ceramic, and in this case, oxides of the metal contained in the conductor tend to be included in the amorphous glass phase 12 and the feldspar crystalline phase 13, particularly in the vicinity of the conductor.

[0057] The glass ceramic according to this embodiment may be used for any purpose, including electronic components, particularly RF inductors, and is particularly suitable for in-vehicle RF inductors, which require high strength. [Example]

[0058] The present invention will be described below in more detail with reference to examples, but the present invention is not limited to these examples.

[0059] (Experimental Example 1) Glass raw materials, SiO2 filler raw materials, and Al2O3 filler raw materials were prepared. As glass raw materials, crystallized glass and amorphous glass were prepared. These raw materials were then mixed in the mass ratios shown in Table 1.

[0060] The glass-ceramics prepared had a Si-Sr-Al composition (SiO2 content of 37-45 mass%, SrO content of 35-40 mass%, Al2O3 content of 5-15 mass%, and B2O3 content of 1-5 mass%).

[0061] As the amorphous glass, amorphous glass having a Si-BK composition (SiO2 content of 75 to 84 mass %, B2O3 content of 15 to 20 mass %, K2O content of 1 to 5 mass %) was prepared.

[0062] The average particle size of the SiO2 filler material was adjusted so that the average particle size of the SiO2 filler finally observed would be the value shown in Table 2. The average particle size of the Al2O3 filler material was set to 1 to 3 μm. Filler raw materials The aspect ratio of the Al2O3 filler was adjusted so that the average aspect ratio of the Al2O3 filler finally observed would be the value shown in Table 2.

[0063] Next, the mixed raw materials were wet-mixed with a solvent (99% methanol-denatured ethanol) in a ball mill (zirconia ball media) for 24 hours to obtain a raw material slurry, which was then dried in a dryer until the solvent was completely removed, yielding a glass-ceramic material.

[0064] Next, 2.5 parts by mass of an acrylic resin binder (Elvacite, manufactured by DuPont) was added to 100 parts by mass of the obtained glass ceramic material, and the mixture was granulated and sieved through a 20-mesh sieve to obtain granules. The granules were sieved under a pressure of 74 MPa (0.75 ton / cm). 2 The molded body was then heat-treated in air at 900°C for the time shown in Table 2 to obtain a sintered glass ceramic body.

[0065] Next, the microstructure and various properties of the obtained glass-ceramic sintered body were evaluated under the conditions shown below. The results are shown in Table 2.

[0066] [Fine structure] STEM images of the cross section of the glass-ceramic sintered body were taken using a STEM (JEM-2200FS). Furthermore, phase separation analysis was performed using RGB image phase analysis. The observation area was 7.5 μm × 7.5 μm, and the magnification was 7500x. Five different observation areas were set, and STEM images were taken and phase separation analysis was performed for each observation area. From the five STEM images and five phase separation analysis images obtained, the average particle size of the SiO2 filler, the average aspect ratio of the Al2O3 filler, and the area ratio of each phase were calculated. The area ratio of the feldspar crystalline phase was then divided by the area ratio of the amorphous glass phase to calculate the value.

[0067] We checked whether there were any areas where the Al2O3 phase was bonded via the feldspar crystal phase. If there were any areas where the Al2O3 phase was bonded via the feldspar crystal phase, it was judged as acceptable, and if there were no areas, it was judged as unacceptable.

[0068] In this example, the amorphous glass did not contain oxides of Sr or Al, but it was confirmed that the amorphous glass phase contained in the final glass-ceramic sintered body contained SrO and Al2O3.

[0069] [Relative permittivity ε] The relative dielectric constant ε (unitless) was measured by a resonance method (JIS R 1627) using a network analyzer (8510C manufactured by Hewlett-Packard Co.) In this example, a relative dielectric constant ε of 6.20 or less was considered good, and a relative dielectric constant ε of 6.00 or less was considered even better.

[0070] [Sinterability] The fracture surfaces of sintered glass ceramics were observed using FE-SEM. Cases where there were few voids and the densification was judged to be sufficient were rated as acceptable, while cases where there were many voids and the densification was judged to be insufficient were rated as unacceptable.

[0071] [Strength] The strength (bending strength) of the glass ceramic sintered body was measured by a three-point bending test using an INSTRON universal material testing machine 5543. The distance between the supporting points was 15 mm. A bending strength of 100 MPa or more was considered good.

[0072] [Table 1]

[0073] [Table 2]

[0074] Examples 1 to 4 and Comparative Example 1 are experimental examples in which the average particle size of the SiO2 filler was changed. Comparative Example 1, in which the average particle size of the SiO2 filler was small, did not have sufficient sinterability, and there were no locations where the Al2O3 phase was bonded via the feldspar crystal phase. As a result, the strength was reduced. In addition, Example 4, in which the average particle size of the SiO2 filler was large, had a surface roughness when processed into a sheet compared to the other Examples and Comparative Examples. Get bigger It was confirmed that...

[0075] Examples 5 and 6 and Comparative Example 2 are experimental examples in which the proportion of the SiO2 filler raw material in Example 2 was changed to change the area proportion of each phase without changing the value obtained by dividing the area proportion of the feldspar crystalline phase by the area proportion of the amorphous glass phase. Comparative Example 2, in which the proportion of the SiO2 filler raw material was too high, did not sinter well and there were no locations where the Al2O3 phase was bonded via the feldspar crystalline phase. As a result, the strength decreased.

[0076] Examples 7 and 8 and Comparative Example 3 are experimental examples in which the heat treatment time of Example 2 was changed to change the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase, while keeping the area ratios of the SiO2 phase and Al2O3 phase constant. In Comparative Example 3, in which the heat treatment time was too short, the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase decreased. As a result, there were no locations where the Al2O3 phase was bonded via the feldspar crystalline phase, and strength decreased.

[0077] Comparative Example 4 is a comparative example in which the amount of glass-ceramics in Example 2 was increased and the amount of Al2O3 filler raw material was decreased. Examples 9 and 10 are examples in which the amounts of glass-ceramics and SiO2 filler raw material in Example 2 were decreased and the amount of Al2O3 filler raw material was increased. That is, Comparative Example 4 and Examples 9 and 10 are examples in which the composition was changed from Example 2 to change the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase. Furthermore, Example 11 is an example in which the heat treatment time in Example 10 was extended to increase the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase.

[0078] In Examples 2, 9 to 11 and Comparative Example 4, the dielectric constant ε increased and strength increased as the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase increased. In Comparative Example 4, the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase decreased. As a result, there were no locations where the Al2O3 phase was bonded via the feldspar crystalline phase, and strength decreased.

[0079] Examples 12 to 14 are examples in which the average aspect ratio of the Al2O3 filler raw material in Example 2 was changed to change the average aspect ratio of the Al2O3 filler. Examples 12 and 13, in which the average aspect ratio of the Al2O3 filler was 15 or more and 75 or less, showed particularly increased strength compared to Example 2, in which the average aspect ratio of the Al2O3 filler was less than 15. Furthermore, Example 14, in which the average aspect ratio of the Al2O3 filler exceeded 75, did not sinter well and showed reduced strength compared to Examples 12 and 13. However, Example 14 had a good relative dielectric constant ε and strength.

[0080] (Experimental Example 2) Experimental Examples 1 and 2 were carried out under the same conditions as in Example 2, except that the metal element mainly contained in the glass-ceramics of the glass raw materials of Example 2 was changed from Sr to Mg, Ca, or Ba. The results are shown in Table 3.

[0081] [Table 3]

[0082] By changing the metal element mainly contained in the glass-ceramics from Sr to Mg, Ca, or Ba, the metal element mainly contained in the feldspar crystal phase changed from Sr to Mg, Ca, or Ba.

[0083] Examples 21 to 23, in which the metal element mainly contained in the feldspar crystal phase was changed from Sr to Mg, Ca, or Ba, had good properties. Example 21, in which Mg was used, and Example 22, in which Ca was used, showed decreased strength compared to Example 2. Example 23, in which Ba was used, showed an increased relative dielectric constant ε compared to Example 2.

[0084] In all examples of Experimental Example 1 and Experimental Example 2, it was confirmed that 25% or more of the Al2O3 phase 14 in terms of number ratio was bonded to other Al2O3 phases 14 via the feldspar crystal phase 13. [Explanation of symbols]

[0085] 1...Glass ceramic 11...SiO2 phase 12...Amorphous glass phase 13... Feldspar crystalline phase 14…Al2O3 phase

Claims

1. Feldspar crystalline phase, amorphous glass phase, and Al 2 O 3 phase and SiO 2 and a glass-ceramic comprising a phase, The Al 2 O 3 phases are bonded via said feldspar crystalline phase; The glass ceramic has an average particle size of each SiO 2 filler constituting the SiO 2 phase of 0.30 μm or more and 2.5 μm or less.

2. 2. The glass-ceramic of claim 1, wherein the feldspar crystalline phase comprises predominantly Sr.

3. The Al 2 O 3 Each Al constituting the phase 2 O 3 3. The glass ceramic according to claim 1, wherein the filler has an average aspect ratio of 15 or more and 75 or less.

4. 4. The glass ceramic according to claim 1, wherein the value obtained by dividing the area ratio of the feldspar crystalline phase by the area ratio of the amorphous glass phase is 0.10 or more and less than 1.

00.

5. The Al 2 O 3 5. The glass ceramic according to claim 1, wherein the area ratio of the phase is 7.0% or more and 20.0% or less.

6. The SiO 2 6. The glass ceramic according to claim 1, wherein the area ratio of the phase is 10.0% or more and 30.0% or less.

7. An electronic component comprising the glass ceramic according to any one of claims 1 to 6.

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