Display panel and manufacturing method thereof

Abstract

To provide a display panel, a manufacturing method for the same, and a display module to solve the problem of a display panel in a conventional art in which the reliability is low.SOLUTION: A display panel has a display region, and a frame region surrounding the display region. The display panel includes: a substrate; a plurality of light-emitting elements located on the substrate and located in the display region; a bank located on the substrate and located in the frame region and provided so as to surround the display region; and a sealing structure stacked on a side of the bank or the light-emitting element that is away from the substrate. The sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked. The first inorganic sealing layer is located on a side of the second inorganic sealing layer that is closer to the substrate. The second inorganic sealing layer is in direct contact with the bank by extending from the display region to the frame region.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to the field of display technology, and more particularly to a display panel and a manufacturing method thereof. [Background technology]

[0002] In recent years, the display panel industry has been developing rapidly with the rise of smart terminal products. However, in high temperature and humidity environments, the sealing edge of the display panel is prone to peeling, resulting in low product reliability. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of this, the embodiments of the present application solve the problem of low reliability of display panels. [Means for solving the problem]

[0004] A display panel according to a first aspect of the present application has a display area and a frame area surrounding the display area. The display panel includes a substrate, a plurality of light-emitting elements located on the substrate and in the display area, banks located on the substrate and in the frame area and surrounding the display area, and a sealing structure laminated on the banks and the light-emitting elements on the side away from the substrate. The sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer. The first inorganic sealing layer is located on the side of the second inorganic sealing layer closer to the substrate, and the second inorganic sealing layer extends from the display area to the frame area and directly contacts the banks.

[0005] According to the first aspect, in some embodiments, the bank includes an upper layer, the upper layer and the second inorganic sealing layer are in contact, and at least a portion of the material of the upper layer is an inorganic material.

[0006] In some embodiments based on the first aspect, the display panel further includes a first insulating layer stacked on the substrate and located in the display region. The first insulating layer surrounds the pixel opening, the light-emitting element is located in the pixel opening, and the upper layer and the first insulating layer are provided in the same layer. The first insulating layer and the upper layer are preferably made of the same material.

[0007] Based on the first aspect, in some embodiments, the display panel further includes an isolation structure stacked on one side of the substrate, the isolation structure surrounding the light-emitting element to form an isolation opening, and the light-emitting element located within the isolation opening. The isolation structure includes a first sub-portion and a second sub-portion, the first sub-portion being located on the side closer to the substrate than the second sub-portion, and the orthogonal projection of the first sub-portion on the substrate preferably falls within the range of the orthogonal projection of the second sub-portion on the substrate. The first sub-portion is preferably made of a conductive material, and the light-emitting element preferably includes a first electrode superposed and bonded to the first sub-portion. The light-emitting element preferably further includes a light-emitting layer and a second electrode, the second electrode, the light-emitting layer, and the first electrode being sequentially stacked in the direction from the substrate to the light-emitting element. The isolation structure further includes a third sub-portion, the third sub-portion being located on the side closer to the substrate than the first sub-portion, and the orthogonal projection of the first sub-portion on the substrate preferably falls within the range of the orthogonal projection of the third sub-portion on the substrate. The display panel preferably further includes a first insulating layer stacked on the substrate and positioned in the display region, the first insulating layer surrounding the pixel opening, the pixel opening communicating with the isolation opening, and the light-emitting element also positioned within the pixel opening.

[0008] Based on the first aspect, in some embodiments, the first inorganic sealing layer is located within the area surrounded by the bank. The first inorganic sealing layer includes a plurality of inorganic sealing portions, each of which corresponds to a light-emitting element. Preferably, the orthogonal projection of the inorganic sealing portion on the substrate covers the orthogonal projection of the light-emitting element on the substrate. The orthogonal projection of the first inorganic sealing layer on the substrate is preferably located within the orthogonal projection of the second inorganic sealing layer on the substrate. In the direction from the frame region to the display region, the first inorganic sealing layer is preferably contained within the second inorganic sealing layer. The display panel preferably further includes an isolation structure laminated on one side of the substrate. The isolation structure surrounds the light-emitting element to form an isolation opening, and the light-emitting element is preferably located within the isolation opening. The inorganic sealing portion is preferably located on the side of the light-emitting element away from the substrate and covers the sidewall of the isolation structure facing the isolation opening. The inorganic sealing portion preferably extends to the side of the isolation structure away from the substrate.

[0009] In some embodiments based on the first aspect, the sealing structure includes an organic sealing layer laminated between the first inorganic sealing layer and the second inorganic sealing layer, the organic sealing layer being terminated on a side closer to the display region of the bank. Preferably, the orthogonal projection of the organic sealing layer on the substrate covers the orthogonal projection of the plurality of light-emitting elements on the substrate.

[0010] Based on the first aspect, in some embodiments, the bank includes a first surface close to the substrate and a second surface away from the substrate, and an orthogonal projection of the second surface on the substrate is located within a range of an orthogonal projection of the first surface on the substrate.

[0011] In some embodiments based on the first aspect, the bank includes a first surface close to the substrate and a third surface excluding the first surface, and the third surface is a smooth surface. In the direction from the display area to the frame area, the cross section of the bank is preferably arc-shaped.

[0012] Based on the first aspect, in some embodiments, the display panel further includes a second insulating layer located between the substrate and the light-emitting element, the second insulating layer being in contact with a first surface of the bank that is closer to the substrate, and the material of the second insulating layer is an inorganic material or an organic material.

[0013] Based on the first aspect, in some embodiments, the bank further includes a pad layer laminated on the side of the upper layer closer to the substrate. The display panel further includes a second insulating layer located between the substrate and the light-emitting element, and the second insulating layer is preferably located in the display area, and the second insulating layer and the pad layer are provided in the same layer. The insulating layer and the pad layer are preferably made of the same material. The material of the pad layer preferably includes at least one of an organic material and an inorganic material. The upper layer preferably covers the side surface of the pad layer and the surface of the pad layer facing away from the substrate.

[0014] A display panel according to a second aspect of the present application has a display area and a frame area surrounding the display area. The display panel includes a substrate, a plurality of light-emitting elements located on the substrate in the display area, and a sealing structure laminated on the light-emitting elements on the side away from the substrate. The sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer laminated on the substrate, the first inorganic sealing layer being located on the side of the second inorganic sealing layer closer to the substrate, and the orthographic projection of the first inorganic sealing layer on the substrate being within the range of the orthographic projection of the second inorganic sealing layer.

[0015] Based on the second aspect, in some embodiments, the display panel further includes an isolation structure, where the isolation structure and the light-emitting element are located on the same side of the substrate. The isolation structure surrounds the light-emitting element to form an isolation opening, where the light-emitting element is located within the isolation opening. The first inorganic sealing layer preferably includes multiple inorganic sealing portions, where the inorganic sealing portions correspond one-to-one to the light-emitting element. The inorganic sealing portion preferably is located on the side of the light-emitting element away from the substrate and covers the sidewall of the isolation structure facing the isolation opening. The inorganic sealing portion preferably extends to the side of the isolation structure away from the substrate. The display panel preferably further includes an organic sealing layer located between the first inorganic sealing layer and the second inorganic sealing layer. The orthographic projection of the organic sealing layer on the substrate preferably covers the orthographic projection of the multiple light-emitting elements on the substrate.

[0016] In some embodiments based on the second aspect, the display panel further includes a bank located in the frame region. The bank is located between the second inorganic sealing layer and the substrate and is in direct contact with the second inorganic sealing layer. The bank preferably surrounds the display region, and the first inorganic sealing layer is preferably located within the region surrounded by the bank.

[0017] A method for manufacturing a display panel according to a third aspect of the present application includes the steps of manufacturing a plurality of light-emitting elements and a bank surrounding the plurality of light-emitting elements on a substrate, and manufacturing a sealing structure on the side of the light-emitting elements and the bank away from the substrate to obtain a display panel, wherein the sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked together, the first inorganic sealing layer being located on the side of the second inorganic sealing layer closer to the substrate, and the second inorganic sealing layer being in direct contact with the bank.

[0018] According to the third aspect, in some embodiments, the step of fabricating an encapsulation structure on the side of the light-emitting element and the bank away from the substrate includes fabricating a first inorganic encapsulation material layer on the side of the light-emitting element away from the substrate and patterning the first inorganic encapsulation material layer to obtain a first inorganic encapsulation layer, and fabricating a second inorganic encapsulation layer on the side of the first inorganic encapsulation layer away from the substrate. The bank preferably includes an upper layer. The step of fabricating a plurality of light-emitting elements on the substrate includes sequentially fabricating a second electrode layer including a plurality of spaced-apart second electrodes, a light-emitting layer, and a first electrode layer on the substrate to form a plurality of light-emitting elements. The manufacturing method may further include fabricating a first insulating layer and an upper layer on the substrate in the same process after the step of fabricating the second electrode layer and before the step of fabricating the light-emitting layer, wherein the first insulating layer surrounds the light-emitting element to form a pixel opening, and the pixel opening exposes at least a portion of the second electrode. The manufacturing method may further include fabricating an isolation structure on the substrate, wherein the isolation structure surrounds the light-emitting element to form an isolation opening, and the light-emitting element is located in the isolation opening.

[0019] A display module according to a fourth aspect of the present application includes the display panel according to any one of the above embodiments. [Effects of the Invention]

[0020] According to the embodiment of the present application, the first inorganic encapsulation layer close to the substrate is contained within the area surrounded by the bank, so that the contact surface between the bank and the encapsulation structure is actually the contact surface between the upper layer and the second inorganic encapsulation layer, thereby reducing the number of interfaces at the encapsulation edge and the thickness of the film layer at the encapsulation edge, thereby improving the bonding strength of the interfaces, reducing the probability of delamination at the interfaces in high-temperature and high-humidity environments, and improving the reliability of the display panel. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1 is a schematic cross-sectional view of a display panel according to a related art. [Figure 2]1 is a schematic planar structure diagram of a display panel according to a first embodiment of the present application. [Figure 3] 3 is a schematic cross-sectional view of the display panel taken along line A1-A2 of FIG. 2. FIG. [Figure 4] 1(a) is a schematic cross-sectional view of a display panel according to a second embodiment of the present invention, and FIG. 1(b) is a schematic plan view of the display panel shown in FIG. [Figure 5] FIG. 10 is a schematic cross-sectional view of a display panel according to a third embodiment of the present application. [Figure 6] FIG. 10 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present application. [Figure 7] FIG. 10 is a schematic cross-sectional view of a display panel according to a fifth embodiment of the present application. [Figure 8] FIG. 10 is a schematic cross-sectional view of a display panel according to a sixth embodiment of the present application. [Figure 9] FIG. 10 is a schematic cross-sectional view of a display panel according to a seventh embodiment of the present application. [Figure 10] 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. [Figure 11] 1 is a structural schematic diagram of a display device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0022] Fig. 1 is a schematic cross-sectional view of a display panel according to related art. As shown in Fig. 1, the display panel has a display area AA and a frame area NA surrounding the display area AA. A bank 13 is provided in the frame area NA as a stopper for the organic sealing layer 142 to prevent overflow. A two-layer inorganic sealing layer 140 covers the organic sealing layer 142 and is superimposed and bonded to the bank 13.

[0023] As described in the background art, the display panel shown in FIG. 1 has low reliability.

[0024] Through extensive research, the inventors have found that the bank 13 in related art is typically an organic material layer. In this case, the contact between the bank 13 and the inorganic sealing layer 140 is between an organic surface and an inorganic surface, resulting in poor interfacial adhesion and making the film layer interface prone to peeling in high-temperature, high-humidity environments. Furthermore, the sealing edge includes the interface between the bank 13 and one inorganic sealing layer 140 and the interface between two inorganic sealing layers 140, and the multiple interfaces increase the likelihood of the film layer interface separating. Peeling between the interfaces of adjacent film layers creates a path for water and oxygen to penetrate, reducing product reliability.

[0025] In view of this, the embodiments of the present application provide a display panel, a manufacturing method thereof, and a display module, in which the inorganic sealing layer 140 farthest from the substrate 11 of the two inorganic sealing layers 140 is in direct contact with the bank 13, thereby reducing the number of interfaces at the sealing edge and making the sealing edge thinner, thereby reducing the probability of delamination and improving the reliability of the display panel.

[0026] The technical solutions in the embodiments of the present application will be described below clearly and completely in conjunction with the drawings in the embodiments of the present application. Needless to say, the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments that a person skilled in the art can obtain without creative work fall within the scope of protection of the present application.

[0027] In the drawings, the dimensions of layers and regions may be exaggerated for clarity. When a structure is described as being "on" or "under" another structure, the structure may be directly on or directly under the other structure, or there may be intermediate structures therebetween. Similar features are always labeled with similar reference numerals. A structure, as used herein, may include any one of a film layer, a component, an element, a member, and an assembly.

[0028] It should be noted that when a structure is described as being "connected" to another structure, the structure may be directly connected to the other structure, or may be indirectly connected via one or more intermediate structures therebetween.

[0029] Fig. 2 is a schematic planar structure diagram of a display panel according to a first embodiment of the present application. Fig. 3 is a schematic cross-sectional structure diagram of the display panel taken along line A1-A2 shown in Fig. 2. As shown in Figs. 2 and 3, the display panel has a display area AA and a frame area NA surrounding the display area AA.

[0030] The display panel includes a substrate 11, a plurality of light-emitting elements 12, a bank 13, and a sealing structure 14.

[0031] Here, the substrate 11 may be a base substrate or an array substrate. The base substrate may be a flexible base substrate such as a polyimide film, or a rigid substrate such as a glass substrate or a silicon substrate. The array substrate refers to a substrate including a base substrate and pixel circuits formed on the base substrate. The pixel circuits are connected one-to-one with the light-emitting elements 12 and drive the light-emitting elements 12 to emit light.

[0032] The light-emitting element 12 is located on the substrate 11 and in the display area AA. The light-emitting element 12 is, for example, an organic light-emitting diode. The light-emitting element 12 includes a first electrode 121, a light-emitting unit 122, and a second electrode 123, which are sequentially stacked in a direction approaching the substrate 11. For example, the first electrode 121 is a cathode, and the second electrode 123 is an anode.

[0033] The bank 13 is located on the substrate 11, in the frame area NA, and surrounds the display area AA. The bank 13 may have a single-layer structure or a multi-layer laminated structure.

[0034] The sealing structure 14 is laminated on the side of the bank 13 and the light-emitting element 12 that faces away from the substrate 11. The sealing structure 14 is a thin-film sealing structure and includes a first inorganic sealing layer 141 and a second inorganic sealing layer 143. The orthogonal projection of the first inorganic sealing layer 141 on the substrate 11 is located within the range of the orthogonal projection of the second inorganic sealing layer 143 on the substrate 11. The first inorganic sealing layer 141 is located within the area surrounded by the bank 13; that is, the first inorganic sealing layer 141 is contained within the second inorganic sealing layer 143. The second inorganic sealing layer 143 extends from the display region AA to the frame region NA and is in direct contact with the bank 13. "Direct contact" means that there is no other structure between the second inorganic sealing layer 143 and the bank 13.

[0035] In one embodiment, the sealing structure 14 further includes an organic sealing layer 142 laminated on the side of the first inorganic sealing layer 141 that faces away from the substrate 11. The orthogonal projection of the organic sealing layer 142 on the substrate 11 covers the orthogonal projection of the plurality of light-emitting elements 12 on the substrate 11, and the edge of the organic sealing layer 142 is discontinued on the side of the bank 13 that is closer to the display area AA. In other words, the bank 13 acts as a stopper for the organic sealing layer 142 to prevent the organic sealing material from overflowing outside the substrate 11 during the manufacturing process of the organic sealing layer 142.

[0036] In the display panel according to this embodiment, the second inorganic sealing layer 143 and the bank 13 are in direct contact with each other, thereby reducing the number of boundary surfaces at the sealing edge and making the sealing edge thinner, thereby reducing the probability of delamination and improving the reliability of the display panel.

[0037] FIG. 4(a) is a schematic cross-sectional view of a display panel according to a second embodiment of the present invention. FIG. 4(b) is a schematic planar view of the display panel shown in FIG. 4(a). The cross-sectional view shown in FIG. 4(a) corresponds to the cross-sectional line B1-B2 in FIG. 4(b), and FIG. 4(b) shows only some of the film layers in the display panel shown in FIG. 4(a). As shown in FIGS. 4(a) and 4(b), the display panel according to this embodiment differs from the display panel shown in FIG. 3 in the following ways: The first inorganic sealing layer 141 includes a plurality of inorganic sealing portions 1410, the inorganic sealing portions 1410 correspond one-to-one to the light-emitting elements 12, and the orthographic projection of the inorganic sealing portions 1410 on the substrate 11 covers the orthographic projection of the light-emitting elements 12 on the substrate 11.

[0038] In this embodiment, the display panel further includes an isolation structure 16 laminated on one side of the substrate 11. The isolation structure 16 defines an isolation opening Q, and the light-emitting element 12 is located within the isolation opening Q. The cross-sectional shape of the isolation structure 16 in the direction from the display area AA to the frame area NA is an inverted trapezoid or a square U shape. In this manner, the isolation structure 16 can isolate film layers deposited on the side of the isolation structure 16 away from the substrate, for example, isolating the light-emitting layer and the first electrode layer to obtain the light-emitting unit 122 and the first electrode 121, respectively.

[0039] Illustratively, the inorganic encapsulant 1410 is located on the side of the light-emitting element 12 that faces away from the substrate 11 and covers the sidewall facing the isolation opening of the isolation structure 16. In a further embodiment, the inorganic encapsulant 1410 further extends to the side of the isolation structure 16 that faces away from the substrate 11.

[0040] Illustratively, the isolation structure 16 includes a first sub-portion 161 and a second sub-portion 162, where the first sub-portion 161 is located closer to the substrate 11 than the second sub-portion 162, and the orthogonal projection of the first sub-portion 161 on the substrate 11 is located within the range of the orthogonal projection of the second sub-portion 162 on the substrate 11. In this way, the first sub-portion 161 and the second sub-portion 162 are combined as the isolation structure 16 having an inverted trapezoidal cross section.

[0041] The material of the first sub-portion 161 is a conductive material, the light emitting element 12 includes a first electrode 121, and the first electrode 121 and the first sub-portion 161 are overlapped and joined.

[0042] The first sub-portion 161 may be an independent film layer with no internal physical interface. The first sub-portion 161 may also be composed of at least two film layers stacked together. For example, the two film layers may be made of molybdenum and aluminum, respectively, with the conductive film layer made of molybdenum positioned between the base and the conductive film layer made of aluminum. The second sub-portion 162 may be a non-conductive material film layer, such as an inorganic film layer, or a conductive film layer made of titanium.

[0043] The isolation structure 16 may further include a third sub-portion 163, which is located on a side of the first sub-portion 161 closer to the substrate 11, and the orthogonal projection of the first sub-portion 161 on the substrate 11 is located within the range of the orthogonal projection of the third sub-portion 163 on the substrate 11. Illustratively, the first sub-portion 161 is a separate film layer made of aluminum, and the third sub-portion 163 is a separate film layer made of molybdenum, and the orthogonal projection of the aluminum film layer on the substrate 11 is located within the range of the orthogonal projection of the molybdenum film layer on the substrate 11. In this manner, the second sub-portion 162, the first sub-portion 161, and the third sub-portion 163 are combined as the isolation structure 16 having a U-shaped cross section. The patent applications PCT / CN2023 / 134518, CN202311499823.9, CN202310707209.0, CN202311346196.5, CN202310692671.8, and CN202311091555.7 describe the relevant contents of the isolation structure and the sealing layer, and the isolation structure and the sealing layer of the present application can be referred to the above patent documents.

[0044] According to the display panel of this embodiment, since the isolation structure 16 is present, the normal manufacturing process thereof includes a process of patterning the first inorganic sealing layer 141. Therefore, in this embodiment, there is no need to add a separate process to fit the first inorganic sealing layer 141 within the second inorganic sealing layer 143, which makes the present embodiment more applicable.

[0045] FIG. 5 is a schematic cross-sectional view of a display panel according to a third embodiment of the present invention. As shown in FIG. 5, the display panel according to this embodiment differs from any of the display panels according to the above-described embodiments in the following respects. In this embodiment, taking the display panel shown in FIG. 5 as an example, the bank 13 includes a first surface S1 close to the substrate 11, a second surface S2 away from the substrate 11, and a side surface connecting the first surface S1 and the second surface S2. The orthogonal projection of the first surface S1 on the substrate 11 is located within the range of the orthogonal projection of the second surface S2 on the substrate 11, and the included angle between the side surface and the first surface S1 is an acute angle. For example, the acute angle is 30° or more and 75° or less. Exemplarily, the cross-sectional shape of the bank 13 in the direction from the display area AA to the frame area NA is an isosceles trapezoid.

[0046] According to the display panel of this embodiment, it is possible to ensure that the second inorganic sealing layer 143 is continuous without being cut at the bank 13, thereby extending the sealing path and improving the sealing effect.

[0047] FIG. 6 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present application. As shown in FIG. 6, the display panel according to this embodiment differs from any of the display panels according to the above-described embodiments in the following respects. In this embodiment, taking the display panel shown in FIG. 5 as an example, the transition between the second surface S2 and the side surface of the bank 13 is smooth, i.e., no corners are formed at the connection points between the second surface S2 and the side surface. This connects the second surface S2 and the side surface to form a completely smooth surface, referred to as a third surface S3 as shown in FIG. 6. In this case, the bank 13 has a first surface S1 close to the substrate 11 and a third surface S3 excluding the first surface S1, and the third surface S3 is a smooth surface. For example, the cross section of the bank 13 is arc-shaped in the direction from the display area AA to the frame area NA.

[0048] According to the display panel of this embodiment, the bank 13 includes a first surface S1 close to the substrate 11 and a third surface S3 excluding the first surface S1, and the third surface S3 is configured to be a smooth surface, thereby ensuring that the second inorganic sealing layer 143 is continuous without being cut in the bank 13. This extends the sealing path and improves the sealing effect.

[0049] FIG. 7 is a schematic cross-sectional view of a display panel according to a fifth embodiment of the present application. As shown in FIG. 7, the display panel according to this embodiment differs from any of the display panels according to the above-described embodiments in the following respects. In this embodiment, taking the display panel shown in FIG. 7 as an example, the display panel further includes a second insulating layer 17 located between the substrate 11 and the light-emitting element 12. The first surface S1 of the bank 13, which is closest to the substrate 11, contacts the second insulating layer 17, and the material of the second insulating layer 17 is an inorganic material or an organic material. Preferably, the material of the second insulating layer 17 is an inorganic material. In this way, the contact between the bank 13 and the second insulating layer 17 is inorganic surface-to-inorganic surface contact, which improves the bonding strength at the interface and further enhances the sealing effect.

[0050] In one embodiment, the display panel further includes a pixel circuit 18 located between the second insulating layer 17 and the substrate 11, and the pixel circuit 18 is electrically connected to the light-emitting element 12 by a conductive via hole passing through the second insulating layer 17. The pixel circuit 18 may be a 7T1C pixel circuit, an 8T1C pixel circuit, etc.

[0051] FIG. 8 is a cross-sectional structural schematic diagram of a display panel according to a sixth embodiment of the present application. As shown in FIG. 8, the display panel according to this embodiment differs from any one of the display panels according to the above-described embodiments in the following respects. In this embodiment, taking the display panel shown in FIG. 8 as an example, the bank 13 includes an upper layer 131, at least a portion of which is made of an inorganic material. For example, the entire upper layer 131 is made of an inorganic material. Alternatively, for example, in the direction from the display area AA to the frame area NA, the upper layer 131 includes inorganic material portions and organic material portions that are alternately arranged. A second inorganic sealing layer 143 contacts the upper layer 131 of the bank 13.

[0052] In the display panel according to this embodiment, the contact surface between the bank 13 and the sealing structure 14 is actually the contact surface between the upper layer 131 and the second inorganic sealing layer 143. Furthermore, by using an inorganic material for the upper layer 131, the contact between the upper layer 131 and the second inorganic sealing layer 143 becomes contact between inorganic surfaces, improving the bonding strength of the interface, reducing the probability of delamination occurring at the interface in a high-temperature, high-humidity environment, and improving the reliability of the display panel.

[0053] In one embodiment, the display panel further includes a first insulating layer 15 stacked on the substrate 11 and located in the display area AA. The first insulating layer 15 defines a pixel opening, the light-emitting element 12 is located in the pixel opening, and the upper layer 131 and the first insulating layer 15 are provided in the same layer.

[0054] The first insulating layer 15 is, for example, a pixel definition layer, and the material of the pixel definition layer is the same as the material of the upper layer 131. In this case, the pixel definition layer and the upper layer 131 can be manufactured in the same process, simplifying the manufacturing process.

[0055] In one embodiment, the bank 13 further includes a protruding layer 132 laminated on the side of the upper layer 131 closer to the substrate 11. The protruding layer 132 may be an independent film layer with no internal physical interface. The protruding layer 132 may have a multi-layer laminate structure. The material of the protruding layer 132 includes at least one of an organic material and an inorganic material. The protruding layer 132 can be used as a height adjustment layer for the bank 13. By rationally setting the height of the protruding layer 132, a desired height of the bank 132 can be obtained, thereby ensuring the stopper effect of the bank 132.

[0056] In one embodiment, the display panel further includes a second insulating layer 17 located between the substrate 11 and the light-emitting element 12. The second insulating layer 17 is located in the display area AA, and the second insulating layer 17 and the padding layer 132 are provided in the same layer. In this way, an increase in the thickness of the display panel due to the padding layer 132 can be avoided, which is advantageous for making the product thinner. For example, the second insulating layer 17 and the padding layer 132 are made of the same material. In this case, the second insulating layer 17 and the padding layer 132 can be manufactured in the same process, simplifying the process.

[0057] FIG. 9 is a schematic cross-sectional view of a display panel according to a seventh embodiment of the present invention. As shown in FIG. 9, the display panel according to this embodiment differs from the display panel shown in FIG. 8 in the following ways: The protruding layer 132 includes a fourth surface S4 close to the substrate 11, and the upper layer 131 covers the entire surface of the protruding layer 132 except for the fourth surface S4. The advantages of this arrangement are as follows: The only contact surface between the bank 13 and the second inorganic sealing layer 143 is the contact surface between the upper layer 131 and the second inorganic sealing layer 143. Therefore, even if the protruding layer 132 is made of an organic material, the bonding strength at the interface between the bank 13 and the second inorganic sealing layer 143 is not adversely affected.

[0058] The present application further provides another display panel. As shown in FIGS. 4(a) and 4(b), the display panel has a display area AA and a frame area NA surrounding the display area AA. The display panel includes a substrate 11, a plurality of light-emitting elements 12, a bank 13, and a sealing structure 14. The light-emitting elements 12 are located on the substrate 11 and in the display area AA. The bank 13 is located on the substrate 11 and in the frame area NA, surrounding the light-emitting elements 12. The sealing structure 14 is stacked on the banks 13 and the light-emitting elements 12 on the side away from the substrate 11. The sealing structure 14 includes a first inorganic sealing layer 141 and a second inorganic sealing layer 143 stacked together, with the first inorganic sealing layer 141 located on the side of the second inorganic sealing layer 143 closer to the substrate 11. In the direction from the frame area NA to the display area AA, the first inorganic sealing layer 141 is contained within the second inorganic sealing layer 143, i.e., the orthogonal projection of the first inorganic sealing layer 141 on the substrate 11 is located within the range of the orthogonal projection of the second inorganic sealing layer 143 on the substrate 11, there is a distance between the edge of the orthogonal projection of the first inorganic sealing layer 141 on the substrate 11 and the edge of the orthogonal projection of the second inorganic sealing layer 143 on the substrate 11, and the orthogonal projection area of ​​the first inorganic sealing layer 141 on the substrate 11 is smaller than the orthogonal projection area of ​​the second inorganic sealing layer 143 on the substrate 11. In this case, the first inorganic sealing layer 141 is located within the annular area surrounded by the banks 13, and the orthogonal projection of the second inorganic sealing layer 143 on the substrate 11 covers the orthogonal projection of the banks 13 on the substrate 11.

[0059] In one embodiment, the display panel further includes an isolation structure 16, where the isolation structure 16 and the light-emitting element 12 are located on the same side of the substrate 11. The isolation structure 16 defines an isolation opening, where the light-emitting element 12 is located within the isolation opening.

[0060] In one embodiment, the first inorganic sealing layer 141 includes a plurality of inorganic sealing portions 1410, and the inorganic sealing portions 1410 and the light emitting elements 12 correspond to each other one by one.

[0061] In one embodiment, the inorganic encapsulant 1410 is located on the side of the light-emitting element 12 away from the substrate 11 and covers the sidewall of the isolation structure 16 facing the isolation opening.

[0062] In one embodiment, the inorganic encapsulant 1410 also extends to the side of the isolation structure 16 away from the substrate 11 .

[0063] In one embodiment, the display panel further includes an organic sealing layer 142 located between the first inorganic sealing layer 141 and the second inorganic sealing layer 143 .

[0064] In one embodiment, the orthogonal projection of the organic encapsulation layer 142 on the substrate 11 covers the orthogonal projection of the plurality of light emitting elements 12 on the substrate 11 .

[0065] In one embodiment, the display panel further includes a bank 13 located in the frame region NA. The bank 13 is located between the second inorganic sealing layer 143 and the substrate 11 and is in direct contact with the second inorganic sealing layer 143.

[0066] In one embodiment, the bank 13 surrounds the display area AA, and the first inorganic sealing layer 141 is located within the annular area surrounded by the bank 13 .

[0067] For technical details not described in this embodiment, please refer to the related description of the embodiment shown in FIGS. 4(a) and 4(b), and the description will be omitted here.

[0068] The present application further provides a method for manufacturing a display panel. Figure 10 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. As shown in Figure 10, the method 1000 for manufacturing a display panel includes the following steps:

[0069] In step S1010, a bank and a plurality of light-emitting elements are fabricated on a substrate, the bank surrounds the plurality of light-emitting elements, the bank includes an upper layer, and the material of the upper layer is an inorganic material.

[0070] 1 to 9, a plurality of light-emitting elements are formed by sequentially manufacturing a second electrode layer, a light-emitting layer, and a first electrode layer on a substrate 11. The second electrode layer includes a plurality of second electrodes 123 arranged at a distance from each other, and the stacked second electrodes 123, the light-emitting layer, and the first electrode layer constitute the light-emitting element 12.

[0071] In one embodiment, after the step of fabricating the second electrode layer and before the step of fabricating the light-emitting layer, the method further includes a step of fabricating a first insulating layer 15 on the substrate 11. The first insulating layer 15 defines a pixel opening, and the pixel opening at least partially exposes the second electrode 123.

[0072] In one embodiment, the manufacturing method further includes, after the step of manufacturing the second electrode layer and before the step of manufacturing the light-emitting layer, manufacturing a first insulating layer and an upper layer on the substrate in the same process, wherein the first insulating layer defines a pixel opening, and the pixel opening at least partially exposes the second electrode.

[0073] In one embodiment, the manufacturing method further includes fabricating an isolation structure on the substrate. Specifically, based on the above embodiment, after fabricating the first insulating layer 15 and before fabricating the light-emitting layer, an isolation structure 16 is fabricated on the side of the first insulating layer 15 away from the substrate 11. The isolation structure 16 defines an isolation opening, and the orthogonal projection of the isolation opening on the substrate 11 covers the orthogonal projection of the pixel opening on the substrate 11. Then, an emissive layer and a first electrode layer are sequentially deposited within the pixel opening. The emissive layer is cut at the edge of the isolation structure 16 to form the light-emitting unit 122. The first electrode layer is cut at the edge of the isolation structure 16 to form the first electrode 121. The second electrode 123, the light-emitting unit 122, and the first electrode 121 stacked within the same pixel opening constitute the light-emitting element 12.

[0074] For example, the bank 13 is manufactured at the same time as the first insulating layer 15 is manufactured, that is, the bank 13 and the first insulating layer 15 are manufactured in the same process.

[0075] In step S1020, an encapsulation structure is fabricated on the side of the light-emitting element and the bank away from the substrate to obtain a display panel. The encapsulation structure includes a first inorganic encapsulation layer and a second inorganic encapsulation layer stacked together, the first inorganic encapsulation layer being located on the side of the second inorganic encapsulation layer closer to the substrate, the first inorganic encapsulation layer being located within the annular region surrounded by the bank, and the second inorganic encapsulation layer being in direct contact with the upper layer.

[0076] For example, a first inorganic sealing layer 141, an organic sealing layer 142, and a second inorganic sealing layer 143 are sequentially formed on the side of the light-emitting element 12 and the bank 13 away from the substrate 11. The first inorganic sealing layer 141 is located within an annular region surrounded by the bank 13; for example, the first inorganic sealing layer 141 is located in the display region AA. The organic sealing layer 142 covers the first inorganic sealing layer 141 in the display region AA and ends on the side of the bank 13 closer to the display region AA. The second inorganic sealing layer 143 covers the organic sealing layer 142 and contacts the bank 13 in the frame region NA.

[0077] In one embodiment, step S1020 specifically includes the steps of first manufacturing a first inorganic sealing material layer on the side of the light-emitting element 12 away from the substrate 11, patterning the first inorganic sealing material layer to obtain a first inorganic sealing layer 141, and then manufacturing a second inorganic sealing layer 143 on the side of the first inorganic sealing layer 141 away from the substrate 11. The orthogonal projection of the second inorganic sealing layer 143 on the substrate 11 covers the orthogonal projection of the first inorganic sealing layer 141 on the substrate 11. In this embodiment, the first inorganic sealing layer includes a plurality of inorganic sealing portions 1410, and the inorganic sealing portions 1410 correspond one-to-one to the light-emitting elements 12. Exemplarily, the inorganic sealing portion 1410 is located on the side of the light-emitting element 12 away from the substrate 11 and covers the sidewall facing the isolation opening of the isolation structure 16. In a further embodiment, the inorganic sealing portion 1410 further extends to the side of the isolation structure 16 away from the substrate 11.

[0078] According to the manufacturing method of the display panel of this embodiment, the contact surface between the bank 13 and the sealing structure 14 is actually the contact surface between the upper layer 131 and the second inorganic sealing layer 143. By using an inorganic material for the upper layer 131, the contact between the upper layer 131 and the second inorganic sealing layer 143 becomes contact between inorganic surfaces, which improves the bonding strength of the interface and reduces the probability of interlayer delamination occurring at the interface in a high-temperature, high-humidity environment, thereby improving the reliability of the display panel.

[0079] The present application further provides a display module including a display panel according to any one of the above embodiments.

[0080] The present application further provides a display device. Fig. 11 is a structural schematic diagram of a display device according to an embodiment of the present application. As shown in Fig. 11, the display device includes a display module 110 according to any one of the above embodiments.

[0081] A display device is a product that has an image display function. For example, a display device may be used to display still images, such as pictures or photographs. A display device may also be used to display moving images, such as videos.

[0082] The display device may be a laptop, a mobile phone, a handheld or portable computer, a camera, a video camera, an in-vehicle smart center console, a calculator, a smart watch, GPS navigation, electronic photography, an electronic sign or guide board, a projector, or the like.

[0083] The display device may also have functions such as photography, recording, fingerprint recognition, and face recognition, etc. Accordingly, the display device may further include at least one functional module for realizing the above functions, such as an under-display camera, an under-display fingerprint recognition sensor, etc.

[0084] Although the basic principles of the present application have been described above in connection with specific embodiments, the benefits, advantages, and effects described in the present application are merely examples and are not limiting. It should not be recognized that these benefits, advantages, and effects are necessarily possessed by each embodiment of the present application. Furthermore, the specific details disclosed above are for illustrative purposes and ease of understanding, and are not limiting. The details do not limit the application to be realized using the specific details.

[0085] The foregoing description has been presented for purposes of illustration and description, and is not intended to limit the embodiments of the present application to the precise form disclosed. While several exemplary aspects and embodiments have been discussed above, those skilled in the art will appreciate variations, modifications, variations, additions, and subcombinations thereof.

Claims

1. A display panel, a display area and a frame area surrounding the display area; The display panel includes: A substrate; a plurality of light-emitting elements located on the substrate and located in the display area; an isolation structure laminated on one side of the substrate; a bank located on the substrate and in the frame region so as to surround the display region; a sealing structure laminated on the bank and the light-emitting element on a side away from the substrate, the isolation structure defines an isolation opening, the light-emitting element is located in the isolation opening, the sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked together, the first inorganic sealing layer is located on a side of the second inorganic sealing layer that is closer to the substrate, the second inorganic sealing layer extends from the display region to the frame region and is in direct contact with the bank, the first inorganic sealing layer includes a plurality of inorganic sealing portions that are spaced apart from each other, and the inorganic sealing portions are located on a side of the light-emitting element that is farther from the substrate and extend to a side of the isolation structure that is farther from the substrate; A display panel characterized by:

2. the bank includes an upper layer, the upper layer contacting the second inorganic sealing layer, the upper layer being at least partially made of an inorganic material; a first insulating layer laminated on the substrate and positioned in the display area; the first insulating layer defines a pixel opening, the light emitting element is located within the pixel opening, the upper layer and the first insulating layer are provided in the same layer; the material of the first insulating layer and the material of the upper layer are the same; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3. The display device further includes a first insulating layer laminated on the substrate and located in the display area, the first insulating layer defining a pixel opening, the pixel opening communicating with the isolation opening, the light-emitting element located within the pixel opening and the isolation opening, the isolation structure includes a first sub-portion and a second sub-portion, the first sub-portion being located on a side of the second sub-portion closer to the substrate, and an orthogonal projection of the first sub-portion on the substrate being located within a range of an orthogonal projection of the second sub-portion on the substrate; the material of the first sub-portion is a conductive material, and the light-emitting element includes a first electrode overlapping and bonded to the first sub-portion; the light-emitting element further includes a light-emitting layer and a second electrode, and the second electrode, the light-emitting layer, and the first electrode are sequentially stacked in a direction from the substrate to the light-emitting element; the isolation structure further includes a third sub-portion, the third sub-portion being located on a side of the first sub-portion closer to the substrate, and an orthogonal projection of the first sub-portion on the substrate being located within a range of an orthogonal projection of the third sub-portion on the substrate; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

4. the first inorganic sealing layer is located within a region surrounded by the bank; an orthogonal projection of the first inorganic sealing layer on the substrate is located within a range of an orthogonal projection of the second inorganic sealing layer on the substrate; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

5. The inorganic sealing portion corresponds one-to-one to the light-emitting element, the orthogonal projection of the inorganic sealing portion on the substrate covers the orthogonal projection of the light-emitting element on the substrate, and the inorganic sealing portion covers the side wall of the isolation structure facing the isolation opening.

5. The display panel according to claim 4.

6. the sealing structure further includes an organic sealing layer laminated between the first inorganic sealing layer and the second inorganic sealing layer, the organic sealing layer being interrupted on a side of the bank closer to a display area; an orthogonal projection of the organic sealing layer on the substrate covers an orthogonal projection of the plurality of light-emitting elements on the substrate; the display panel further includes a second insulating layer located between the substrate and the light-emitting element, a first surface of the bank close to the substrate contacts the second insulating layer, and the material of the second insulating layer is an inorganic material or an organic material.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

7. the bank includes a first surface close to the substrate and a second surface remote from the substrate, and an orthogonal projection of the second surface on the substrate is located within a range of an orthogonal projection of the first surface on the substrate; or the bank includes a first surface close to the substrate and a third surface other than the first surface, the third surface being a smooth surface, and the cross section of the bank in a direction from the display area to the frame area is arc-shaped; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

8. the bank further includes a padding layer stacked on a side of the upper layer closer to the substrate, the display panel further includes a second insulating layer located between the substrate and the light-emitting element, the second insulating layer being located in the display area, and the second insulating layer and the padding layer being provided in the same layer; the second insulating layer and the protruding layer are made of the same material; the upper layer covers a side surface of the raised layer and a surface of the raised layer facing away from the substrate; 3. The display panel according to claim 2.

9. A display panel, a display area and a frame area surrounding the display area; The display panel includes: A substrate; a plurality of light-emitting elements located on the substrate and located in the display area; an isolation structure laminated on one side of the substrate; a sealing structure laminated on a side of the light-emitting element away from the substrate, the isolation structure defines an isolation opening, the light-emitting element is located in the isolation opening, the sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked together, the first inorganic sealing layer is located on a side of the second inorganic sealing layer that is closer to the substrate, an orthogonal projection of the first inorganic sealing layer on the substrate is located within a range of an orthogonal projection of the second inorganic sealing layer on the substrate, the first inorganic sealing layer includes a plurality of inorganic sealing portions that are spaced apart from each other, and the inorganic sealing portions are located on a side of the light-emitting element that is farther from the substrate and extend to a side of the isolation structure that is farther from the substrate; A display panel characterized by:

10. A method for manufacturing a display panel, comprising: fabricating a plurality of light emitting elements on a substrate, a bank surrounding the plurality of light emitting elements, and an isolation structure stacked on one side of the substrate; and forming a sealing structure between the light-emitting element and the bank on a side away from the substrate to obtain the display panel; the isolation structure defines an isolation opening, the light-emitting element is located in the isolation opening, the sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked together, the first inorganic sealing layer is located on a side of the second inorganic sealing layer that is closer to the substrate, the second inorganic sealing layer is in direct contact with the bank, the first inorganic sealing layer includes a plurality of inorganic sealing portions that are spaced apart from each other, and the inorganic sealing portions are located on a side of the light-emitting element that is farther from the substrate and extend to a side of the isolation structure that is farther from the substrate; 10. A display panel manufacturing method comprising:

11. A display panel, a display area and a frame area surrounding the display area; The display panel includes: A substrate; a plurality of light-emitting elements located on the substrate and located in the display area; a bank located on the substrate and in the frame region so as to surround the display region; a sealing structure laminated on the bank and the light-emitting element on a side away from the substrate, the sealing structure includes a first inorganic sealing layer and a second inorganic sealing layer that are stacked together, the first inorganic sealing layer being located on a side of the second inorganic sealing layer that is closer to the substrate, and the second inorganic sealing layer extending from the display region to the frame region and in direct contact with the bank; The display panel further includes an isolation structure laminated on one side of the substrate, the isolation structure defining an isolation opening; the light-emitting element is located in the isolation opening; or the display panel further includes a first insulating layer stacked on the substrate and located in the display area, the first insulating layer defining a pixel opening, the pixel opening communicating with the isolation opening, the light-emitting element being located in the pixel opening and the isolation opening; the isolation structure includes a first sub-portion and a second sub-portion, the first sub-portion being located on a side of the second sub-portion closer to the substrate, and an orthogonal projection of the first sub-portion on the substrate being located within a range of an orthogonal projection of the second sub-portion on the substrate; the material of the first sub-portion is a conductive material, and the light-emitting element includes a first electrode overlapping and bonded to the first sub-portion; the light-emitting element further includes a light-emitting layer and a second electrode, and the second electrode, the light-emitting layer, and the first electrode are sequentially stacked in a direction from the substrate to the light-emitting element; the isolation structure further includes a third sub-portion, the third sub-portion being located on a side of the first sub-portion closer to the substrate, and an orthogonal projection of the first sub-portion on the substrate being located within a range of an orthogonal projection of the third sub-portion on the substrate; A display panel characterized by:

12. The bank includes an upper layer, the upper layer contacting the second inorganic sealing layer, the upper layer being at least partially made of an inorganic material; a first insulating layer laminated on the substrate and positioned in the display area; the first insulating layer defines a pixel opening, the light emitting element is located within the pixel opening, the upper layer and the first insulating layer are provided in the same layer; The material of the first insulating layer and the material of the upper layer are the same.

12. The display panel according to claim 11.

13. The first inorganic sealing layer is located within a region surrounded by the bank, an orthogonal projection of the first inorganic sealing layer on the substrate is located within a range of an orthogonal projection of the second inorganic sealing layer on the substrate; the first inorganic sealing layer includes a plurality of inorganic sealing portions arranged at a distance from each other, the inorganic sealing portions correspond one-to-one to the light-emitting elements, and orthogonal projections of the inorganic sealing portions on the substrate cover orthogonal projections of the light-emitting elements on the substrate; the display panel further includes an isolation structure stacked on one side of the substrate, the isolation structure defining an isolation opening, the light emitting device being positioned within the isolation opening, the inorganic encapsulant being positioned on a side of the light emitting device away from the substrate and covering a sidewall of the isolation structure facing the isolation opening; the inorganic sealing portion extends to a side of the isolation structure that is away from the substrate; 12. The display panel according to claim 11.

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