TRANSPORTATION APPARATUS, TRANSPORTATION METHOD, LITHOGRAPHIC APPARATUS, LITHOGRAPHIC SYSTEM, AND ARTICLE MANUFACTURING METHOD

Abstract

To provide a conveyance device which can reduce particles around a holding part.SOLUTION: A substrate conveyance device 10 includes: a holding member that holds and conveys an object using a holding part that comes into contact with the object; at least one suction port that is arranged around the holding part; and a flow path that connects the suction port to the exterior of the conveyance device. The holding member 18 holds a substrate 1 for conveying the substrate 1 in a substrate conveyance area 220. The substrate 1 is held by the holding part 13 by means such as vacuum suction or Coulomb force fixation with application of the voltage. An exhaust flow path 15 is a flow path for suctioning the atmosphere around the holding part 13 and is independent of a vacuum flow path 14 that communicates to the holding part 13. By making the exhaust flow path 15 independent of the vacuum flow path 14, the risk of failure can be reduced. The suction port 12 suctions particles deposited on the holding member 18 and discharges them to the exterior of the substrate conveyance device 10.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a transport apparatus, a transport method, a lithography apparatus, a lithography system, and an article manufacturing method. [Background technology]

[0002] Lithography apparatuses such as exposure apparatuses used in the manufacture of semiconductor devices, liquid crystal display devices, and the like can include a substrate transport apparatus that transports substrates. The substrate transport apparatus is equipped with a holding member that transfers the substrate. The holding member generally has the function of holding the substrate by vacuum suction.

[0003] Particles accumulate on the holding member due to repeated transfer of substrates, and these particles may become airborne and adhere to the substrate. Patent Document 1 proposes a method for reducing particle adhesion to the substrate by reducing the excess part of the holding member, thereby reducing the area on which particles accumulate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-194668 Summary of the Invention [Problem to be solved by the invention]

[0005] However, conventional substrate transport devices have a problem in that particles generated by contact between the substrate and the holder accumulate around the holder of the holding member, float, and then adhere to the substrate.

[0006] Therefore, an exemplary object of the present invention is to provide a transport device that can reduce particles around a holder. [Means for solving the problem]

[0007] In order to solve the above problems, a conveying device according to one aspect of the present invention comprises: board A conveying device for conveying a shaped object, A holding member that holds and transports the object with a holding portion that comes into contact with the object. and , A control unit; and The holding member has at least one suction port disposed around the holding portion; The suction port is Place a flow path communicating with an external exhaust source; 、 the control unit starts suction by the suction port at a timing when the holding member holding the object descends or a timing just before the holding member descends, and stops suction by the suction port after the holding member and the object are separated. It is characterized by: [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide a transfer device that can reduce particles around a holder. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view of a cluster processing apparatus according to a first embodiment. [Figure 2] 1 is a schematic view of a substrate transport device according to a first embodiment. [Figure 3] 2 is a schematic diagram showing the configuration of a holding section and its surroundings according to the first embodiment. FIG. [Figure 4] 10A and 10B are schematic diagrams of other configuration examples of the holding unit. [Figure 5] FIG. 10 is a schematic diagram of yet another configuration example of the holding portion. [Figure 6] 10A to 10C are diagrams illustrating a sequence of receiving or transferring a substrate. [Figure 7] 5A to 5C are diagrams illustrating a suction sequence when receiving or transferring a substrate according to the first embodiment. [Figure 8] FIG. 10 is a schematic view of an original transport device according to a second embodiment. [Figure 9] FIG. 10 is a diagram illustrating a sequence for receiving or passing a type. [Figure 10] 10A to 10C are diagrams illustrating a suction sequence when receiving or transferring an original according to the second embodiment. [Figure 11] FIG. 10 is a schematic view of a substrate transport device according to a third embodiment. [Figure 12] FIG. 1 is a schematic view showing the configuration of an imprint apparatus to which a substrate transport device is applied. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same members or elements are designated by the same reference numerals, and redundant explanations will be omitted.

[0011] First Embodiment First, a lithography apparatus and a substrate transport apparatus according to a first embodiment of the present invention will be described. The processing apparatus according to this embodiment is a so-called cluster-type processing apparatus having multiple processing units. FIG. 1 is a schematic plan view showing the configuration of a cluster-type processing apparatus 200 according to the first embodiment and a processing system 100 including this cluster-type processing apparatus 200. In the following description, the directions orthogonal to each other in a plane along the surface of the substrate are defined as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis is defined as the Z-axis.

[0012] The processing system 100 (lithography system) includes a cluster processing apparatus 200, a preprocessing apparatus 300, and a control unit 400. The cluster processing apparatus 200 includes multiple (six in this embodiment, for example) processing units 210 (210A to 210F) and a substrate transfer apparatus 10. In this embodiment, each of the multiple processing units 210 performs, for example, an imprint process that forms a pattern of an imprint material on a substrate using a mold. Note that the processing units 210 may also perform lithography processes such as an exposure process that exposes the substrate to light to transfer a mask pattern onto the substrate, or a drawing process that irradiates the substrate with a charged particle beam to form a pattern on the substrate.

[0013] The substrate transfer apparatus 10 transfers a plate-shaped object such as a substrate 1 that has been pre-processed by a pre-processing apparatus 300 to each of a plurality of processing apparatuses 210. That is, the substrate transfer apparatus 10 transfers the object between a plurality of apparatuses. The substrate transfer apparatus 10 holds the substrate 1 and moves through a substrate transfer area 220 (transport path). The detailed configuration of the substrate transfer apparatus 10 will be described later.

[0014] The pretreatment device 300 performs pretreatment on the substrate 1 on which the imprint treatment is to be performed. The pretreatment performed by the pretreatment device 300 can include, for example, a process of forming an adhesion layer on the substrate 1 to improve adhesion between the substrate 1 and the imprint material supplied thereon.

[0015] The control unit 400 is configured by a computer having, for example, a CPU, a memory, etc., and controls each unit of the processing system 100.

[0016] FIG. 2 is a schematic diagram of a substrate transfer device 10 according to the first embodiment. A holding member 18 holds a substrate 1 for transferring the substrate 1 in a substrate transfer region 220. The substrate 1 is placed on the holding member 18 substantially horizontally with the surface to be processed facing the Z-axis direction according to the coordinates shown in FIG. 2(A). The substrate 1 is held by a holding unit 13 formed on the holding member 18 by means of vacuum suction or Coulomb force fixation using an applied voltage. Here, the holding unit 13 holds the substrate 1 by vacuum suction, as an example. FIG. 2(A) is a plan view, and FIG. 2(B) is a side view.

[0017] As shown in FIG. 2B, the holding portion 13 protrudes from the holding member 18. When the holding member 18 holds the substrate 1, only the holding portion 13 comes into contact with the substrate 1. In FIG. 2A, two holding portions 13 are shown, but the number may be one or more. A vacuum flow path 14 communicating with the holding portion 13 is connected to a vacuum source via an on-off valve 21. Meanwhile, a suction port 12 is disposed around the holding portion 13. An exhaust flow path 15 communicating with the suction port 12 is connected to an exhaust source via an on-off valve 22. The exhaust flow path 15 is a flow path for sucking in the atmosphere around the holding portion 13. Furthermore, the exhaust flow path 15 is independent from the vacuum flow path 14 communicating with the holding portion 13. Separating the exhaust flow path 15 from the vacuum flow path 14 reduces the risk of breakdown. The suction port 12 sucks in particles deposited on the holding member 18 and discharges them outside the substrate transfer device 10. The on-off valves 21 and 22 are controlled by a control unit 23. The control unit 23 controls each part of the substrate transfer apparatus 10, but the control unit 400 of the processing system 100 may be used as the control unit of the substrate transfer apparatus 10.

[0018] The configuration of the holding unit 13 of this embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic diagram showing the configuration of the holding unit 13 and its surroundings according to the first embodiment. In Fig. 3, there are six suction ports 12 per holding unit 13, but there may be one or more. The fewer the number of suction ports 12, the stronger the holding unit 13 will be, and the more the number of suction ports 12, the greater the particle suction effect.

[0019] Another example of the holding unit 13 will be described with reference to Fig. 4. Fig. 4 is a schematic diagram of another example of the configuration of the holding unit 13. In Fig. 4, the suction port 12 has a recessed groove shape that surrounds the periphery of the holding unit 13. In other words, the suction port 12 has a groove shape that follows the outer periphery of the holding unit 13. With this configuration, the total area of ​​the openings of the suction port 12 is increased, thereby further enhancing the particle suction effect.

[0020] A more preferred example of the holding unit 13 will be described with reference to Fig. 5. Fig. 5 is a schematic diagram of yet another configuration example of the holding unit 13. In order to prevent particles generated when the substrate 1 and the holding unit 13 come into contact with or separate (separate from each other) from accumulating on the surface of the holding member 18, it is desirable that the suction port 12 be located within 10 mm from the outermost periphery of the holding unit 13. In other words, it is desirable that the dimension A from the end of the holding unit 13 to the suction port 12 be within 10 mm. With this configuration, the distance between the suction port 12 and the holding unit 13 becomes shorter, thereby further enhancing the particle suction effect.

[0021] FIG. 6 is a diagram illustrating a sequence for receiving or transferring a substrate. The operation of each part of the substrate transfer apparatus 10 in this sequence can be executed by the control unit 23. FIG. 6(A) shows the movement of the holding member 18 when the holding member 18 receives the substrate 1 from the cluster processing apparatus 200 or pre-processing apparatus 300 shown in FIG. 1. In S101 shown in FIG. 6(A), the holding member 18 moves to a position below the substrate 1 to receive the substrate 1 held on the mounting unit 33 of the cluster processing apparatus 200 or pre-processing apparatus 300. In S102, the holding member 18 rises, and the substrate 1 comes into contact with the mounting unit 13. Particles generated by this contact are sucked by the suction port 12. In S103, the holding member 18 rises further, and the reception of the substrate 1 from the mounting unit 33 is completed.

[0022] 6(B) shows the movement of the holding member 18 when the holding member 18 transfers the substrate 1 to the cluster processing apparatus 200 or the pre-processing apparatus 300 shown in FIG. 6(B). In S201 shown in FIG. 6(B), in order to transfer the substrate 1 to the mounting section 33 of the cluster processing apparatus 200 or the pre-processing apparatus 300, the substrate 1 held by the holding section 13 of the holding member 18 moves to a position above the mounting section 33. In S202, the holding member 18 descends, the substrate 1 comes into contact with the mounting section 33, and the holding section 13 and the substrate 1 are separated. At this time, particles generated by vibration, slight friction, etc. are sucked by the suction port 12. In S203, the holding member 18 descends further, and the transfer of the substrate 1 from the holding member 18 to the mounting section 33 is completed.

[0023] The suction operation by the suction port 12 of this embodiment will be described with reference to FIG. 7. FIG. 7 is a diagram illustrating a suction sequence during substrate receiving or transfer according to the first embodiment. FIG. 7(A) is a diagram illustrating an example of a suction sequence of the holder 13 and the suction port 12 when the holding member 18 receives the substrate 1 from the cluster-type processing apparatus 200 or the pre-processing apparatus 300 shown in FIG. 1. When receiving the substrate 1, particles are generated when the holding member 18 rises and the substrate 1 comes into contact with the holding member 13. Therefore, the suction port 12 must begin suction before the holding member 13 comes into contact with the substrate 1. For this reason, it is preferable to begin suction by the suction port 12 simultaneously with or before the holding member 18 rises in S102. In other words, it is preferable to begin suction by the suction port 12 at least before the holding member 13 comes into contact with the substrate 1. Then, suction by the suction port 12 is stopped when the holding member 18 is raised. FIG. 7(A) illustrates an example in which suction by the suction port 12 begins simultaneously with the holding member 18 rising in S102.

[0024] FIG. 7B is a diagram showing the suction sequence of the holding unit 13 and the suction port 12 when the holding member 18 transfers the substrate 1 to the cluster-type processing apparatus 200 or the pre-processing apparatus 300 shown in FIG. 1 . When transferring the substrate 1, the holding member 18 descends and the substrate 1 comes into contact with the mounting unit 33. When the holding member 18 separates from the substrate 1, particles are generated due to vibrations and slight friction. Therefore, the suction port 12 must start suction before the holding member 13 separates from the substrate 1. Therefore, it is preferable to start suction of the suction port 12 simultaneously with or before the descent of the holding member 18 in S202. In other words, it is preferable to start suction of the suction port 12 at least before the separation of the holding member 13 from the substrate 1. Then, suction of the suction port 12 is stopped when the descent is completed. FIG. 7B shows an example in which suction of the suction port 12 starts simultaneously with the descent of the holding member 18 in S202.

[0025] Furthermore, the suction port 12 may perform suction continuously regardless of whether the substrate 1 is being transferred. That is, instead of performing suction intermittently by switching the suction ON / OFF as described above, suction may be performed continuously without switching the suction ON / OFF. In this case, there is no need to provide the on / off valve 22.

[0026] Second Embodiment Next, a second embodiment will be described. Matters not mentioned in the second embodiment will follow the above-mentioned embodiment. FIG. 8 is a schematic diagram of an original transport device 50 according to the second embodiment. FIG. 8 is a diagram showing a state in which the original transport device 50 holds an original in one of the processing units 210 (210A to 210F) in FIG. 1 described in the first embodiment. The original transport device 50 according to this embodiment transports an original, such as a mold used in an imprint process, as a target object. Here, an example in which a mold 2 is transported as an original will be described. The original transport device 50 includes a holding unit 51 and a holding member 58 that hold the mold 2.

[0027] The mold 2 is placed on a holding member 58 in a substantially horizontal position with the pattern surface facing the Z axis according to the coordinates shown in Fig. 8(A). The mold 2 is fixed to a holding portion 51 formed on the holding member 58 by vacuum suction, Coulomb force fixation by applying a voltage, or other means. Fig. 8(A) is a plan view, and Fig. 8(B) is a side view.

[0028] As shown in FIG. 8(B), the holding portion 51 protrudes from the holding member 58, and when the holding member 58 holds the mold 2, only the holding portion 51 comes into contact with the mold 2. In FIG. 8(A), there are four holding portions 51, but this is not limited to this. A vacuum flow path 54 communicating with the holding portion 51 is connected to a vacuum source via an on-off valve 61. Meanwhile, a suction port 52 is disposed around the holding portion 51. An exhaust flow path 55 communicating with the suction port 52 is connected to the exhaust source via an on-off valve 62. Furthermore, the exhaust flow path 55 is independent from the vacuum flow path 54 communicating with the holding portion 51. The suction port 52 sucks in particles deposited on the holding member 58. The on-off valves 61 and 62 are controlled by a control unit 63.

[0029] In this embodiment, six suction ports 52 are provided for each holding part 51, but as in the first embodiment, there may be only one, or multiple suction ports. Furthermore, suction port 52 may be in the shape of a recessed groove surrounding the periphery of holding part 51. Furthermore, suction port 52 is preferably located within 10 mm from the outermost periphery of holding part 51 to prevent particles generated when mold 2 and holding part 51 come into contact with or separate (separate from each other) from accumulating on the surface of holding member 58.

[0030] FIG. 9 is a diagram illustrating the sequence for receiving or transferring the mold 2. The operation of each part of the original transport device 50 in this sequence can be executed by the control unit 63. FIG. 9(A) shows the movement of the holding member 58 when it receives the mold 2 held by the original mounting unit 73. In S301 shown in FIG. 9(A), the holding member 58 is moved to a position below the mold 2 in order to receive the mold 2 held by the original mounting unit 73. In S302, the holding member 58 is raised, and the mold 2 comes into contact with the holding unit 51. Particles generated by this contact are sucked by the suction port 52. In S303, the holding member 58 is further raised, and the reception of the mold 2 from the original mounting unit 73 is completed.

[0031] 9(B) shows the movement of the holding member 58 when the mold 2 held by the holding member 58 is transferred to the original plate placing unit 73. In S401 shown in FIG. 9(B), in order to transfer the mold 2 held by the holding member 58 to the original plate placing unit 73, the mold 2 held by the holding unit 51 of the holding member 58 is moved to a position above the original plate placing unit 73. In S402, the holding member 58 is lowered, the mold 2 comes into contact with the original plate placing unit 73, and the holding unit 51 and the mold 2 are separated. At this time, particles generated by vibration, slight friction, etc. are sucked by the suction port 52. In S403, the holding member 58 is further lowered, and the transfer of the mold 2 from the holding member 58 to the original plate placing unit 73 is completed.

[0032] The suction operation by the suction port 52 of this embodiment will be described with reference to FIG. 10 . FIG. 10 is a diagram illustrating the suction sequence when receiving or transferring an original according to the second embodiment. The suction sequence by the suction port 52 when receiving or transferring the mold 2 can be the same as that of the first embodiment. That is, it is preferable to start suction by the suction port 52 at least before the holding unit 51 and the mold 2 come into contact with or separate from each other. FIG. 10(A) is a diagram illustrating the suction sequence by the holding unit 51 and the suction port 52 when receiving the mold 2 held by the holding member 58 from the original mounting unit 73. When receiving the mold 2, particles are generated when the holding member 58 rises and the mold 2 comes into contact with the holding unit 51. Therefore, it is necessary for the suction port 52 to start suction before the holding unit 51 comes into contact with the mold 2. For this reason, suction by the suction port 52 starts simultaneously with or before the holding member 58 rises in S302, and stops when the rise is complete. FIG. 10A shows, as an example, a case in which suction by the suction port 12 starts before the holding member 58 is raised in S302.

[0033] 10(B) is a diagram showing the suction sequence of the holding unit 51 and the suction port 52 when the holding member 58 transfers the mold 2 to the master mounting unit 73. When transferring the mold 2, the holding member 58 descends in S402, bringing the mold 2 into contact with the master mounting unit 73. Since particles are generated due to vibrations and slight friction when the holding unit 51 and the mold 2 separate, it is necessary for the suction port 52 to start suction before the holding unit 51 separates from the mold 2. Therefore, the suction port 52 starts suction simultaneously with or before the descent of the holding member 58 in S402, and stops suction when the descent is complete. FIG. 10(B) shows, as an example, an example in which the suction port 52 starts suction before the holding member 58 descends in S402.

[0034] The suction port 52 may perform suction continuously regardless of whether the mold 2 is being transferred. That is, suction may be performed continuously without switching suction ON / OFF. In this case, there is no need to provide the on / off valve 62.

[0035] <Third embodiment> In the above-described embodiment, the exhaust flow path is configured to be independent of the vacuum flow path that communicates with the holding portion, but it is also possible to configure the exhaust flow path to communicate with the vacuum flow path.

[0036] FIG. 11 is a schematic diagram of a substrate transfer device 80 according to a third embodiment. FIG. 11(A) is a plan view, and FIG. 11(B) is a side view. A vacuum flow path 84 communicating with the holder 13 is connected to a vacuum / exhaust source via an on-off valve 21. An exhaust flow path 85 communicating with suction ports 12 disposed around the holder 13 is also connected to the vacuum / exhaust source via an on-off valve 22. The exhaust flow path 85 communicates with the vacuum flow path 84 communicating with the holder 13, and vacuum suction and suction by the suction ports 12 are controlled by opening and closing the on-off valves 21 and 22. The opening and closing of the on-off valves 21 and 22 is controlled by a control unit 23. By connecting the exhaust flow path 15 to the vacuum flow path 14, the configuration of the device can be simplified.

[0037] <Fourth embodiment> The above-described embodiment can also be applied to a lithography apparatus such as an imprint apparatus, an exposure apparatus, or a drawing apparatus that has only one processing unit. Fig. 12 is a schematic diagram showing the configuration of an imprint apparatus 500 to which the substrate transport apparatus 10 is applied.

[0038] The imprint apparatus 500 includes, for example, a curing unit 501, an imprint head 502 that holds the mold 2, a substrate stage 503 that holds the substrate, a supply unit 504, and an alignment measurement unit 505. The imprint apparatus 500 performs an imprint process that uses the mold 2 to form a pattern of the imprint material on the substrate.

[0039] The curing unit 501 includes, for example, a light source 506 and a plurality of optical systems 508 for adjusting ultraviolet light 507 emitted from the light source 506 into light suitable for imprinting.

[0040] The mold 2 is, for example, a mold having a rectangular outer periphery and a pattern area on the surface facing the substrate 1, in which a three-dimensional pattern of protrusions and recesses to be formed in the imprint material supplied onto the substrate 1 is formed. The mold 2 is made of a material that transmits ultraviolet light, such as quartz.

[0041] The imprint head 502 includes, for example, a mold chuck 509, a mold stage 510, and a mold shape correction mechanism 511. The mold chuck 509 holds the mold 2 by a mechanical holding means (not shown) such as vacuum or electrostatic suction. The mold chuck 509 is also held to the mold stage 510 by a mechanical holding means (not shown). The mold stage 510 is equipped with a drive system for positioning the distance between the mold 2 and the substrate 1 when bringing the mold 2 into contact with the substrate 1, and moves the mold 2 in the Z-axis direction. The drive system of the mold stage 510 may also have the function of moving the mold 2 not only in the Z-axis direction, but also in, for example, the X-axis direction, the Y-axis direction, and the θ direction (rotational directions around the X-axis, the Y-axis, and the Z-axis). The mold shape correction mechanism 511 is a mechanism for correcting the shape of the mold 2 and is installed at multiple locations surrounding the outer periphery of the mold.

[0042] The substrate stage 503 holds the substrate 1 and corrects (aligns) the translational shift between the mold 2 and the substrate 1 when the mold 2 and the substrate 1 are brought into contact with each other. The substrate stage 503 includes a substrate chuck 512. The substrate chuck 512 holds the substrate 1 using a substrate suction pad (substrate suction unit). The suction method may be vacuum suction, electrostatic suction, or other methods. The substrate stage 503 includes a drive system for driving the substrate in the X-axis and Y-axis directions to correct (align) the translational shift between the mold 2 and the substrate 1. The drive system for the X-axis and Y-axis directions may be composed of multiple drive systems, such as a coarse drive system and a fine drive system. The stage 503 may also include a drive system for adjusting the position in the Z-axis, a function for adjusting the position of the substrate 1 in the θ direction (rotation around the Z axis), and a tilt function for correcting the tilt of the substrate 1. The substrate stage 503 is one of multiple holders.

[0043] The substrate 1 can be a member made of glass, ceramics, metal, semiconductor, resin, or the like. If necessary, a layer made of a material other than the member may be formed on the surface of the member. The substrate 1 is, for example, a silicon wafer, a compound semiconductor wafer, or a quartz glass plate. A plurality of shot areas are formed on the substrate 1, and a pattern can be formed on the shot areas of the substrate 1 by repeating the imprint process for each shot area.

[0044] The supply unit 504 (dispenser) supplies the imprint material onto the substrate 1. The supply unit 504 has, for example, a discharge nozzle (not shown), and supplies the imprint material onto the substrate 1 from the discharge nozzle. In this embodiment, the imprint material is, for example, a resin that has the property of being cured by ultraviolet light. The amount of imprint material to be supplied may be determined based on the required thickness of the imprint material, the pattern density to be formed, etc.

[0045] The alignment measurement unit 505 is a measurement unit that detects alignment marks formed on the mold 2 and the substrate 1, and measures the positional deviation in the X-axis and Y-axis directions and the shape difference between the pattern formed on the substrate and the pattern area of ​​the mold.

[0046] The imprint apparatus 500 performs imprint processing on the substrate 1 transported by the substrate transport apparatus 10. The substrate transport apparatus 10 transports the substrate 1 and transfers the substrate 1 between the inside and outside of the imprint apparatus 500. The substrate transport apparatus 10 inserts the holding member 18 holding the substrate 1 into the inside of the imprint apparatus 500 and transfers the substrate 1 onto the substrate stage 503.

[0047] (Embodiment relating to an article manufacturing method) The method for manufacturing an article according to this embodiment is suitable for manufacturing articles such as semiconductor devices, display devices, and elements having microstructures. Examples of the article include electrical circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSIs, CCDs, image sensors, and FPGAs. Examples of molds include imprinting molds. The method for manufacturing an article according to this embodiment includes the steps of transferring a pattern from an original onto a substrate coated with a photosensitive agent using a lithography apparatus (such as an exposure apparatus, imprinting apparatus, or drawing apparatus) and processing the substrate to which the pattern has been transferred. Furthermore, this manufacturing method includes other well-known steps (such as oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, and packaging). The substrate may be made of glass, ceramics, metal, semiconductor, resin, or the like, and, if necessary, a member made of a material other than the substrate may be formed on its surface. Specific examples of the substrate include silicon wafers, compound semiconductor wafers, and quartz glass.

[0048] (Other embodiments) Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0049] 10,80 Substrate transport device 12,52 Suction port 13,51 Holding part 14,54,84 Vacuum channel 15,55,85 Exhaust flow path 18,58 Retaining member 23,63 Control section

Claims

1. A conveying device for conveying a plate-shaped object, a holding member that holds and transports the object with a holding portion that comes into contact with the object; a control unit; The holding member has at least one suction port disposed around the holding portion; a flow path that connects the suction port to an exhaust source outside the conveying device, The control unit starts suction by the suction port at the timing when the holding member holding the object descends or just before the holding member descends, and stops suction by the suction port after the holding member and the object are separated.

2. A conveying device for conveying a plate-shaped object, a holding member that holds and transports the object with a holding portion that comes into contact with the object; a control unit; The holding member has at least one suction port disposed around the holding portion; a flow path that connects the suction port to an exhaust source outside the conveying device, The control unit starts suction of the suction port before the object placed on the placement section comes into contact with the holding section as the holding member rises, and stops suction of the suction port when the object has been completely received by the holding section from the placement section.

3. 3. The conveying device according to claim 1, wherein the holding unit holds the object by vacuum suction.

4. 4. The conveying device according to claim 3, wherein the flow path is a flow path for sucking the atmosphere, and is independent of a flow path for vacuum-adsorbing the object.

5. 4. The conveying device according to claim 3, wherein the flow path is a flow path for sucking the atmosphere and includes a flow path that communicates with a flow path for vacuum-chucking the object.

6. 5. The transport device according to claim 1, wherein the suction port is a groove-shaped opening that extends along the outer periphery of the holding portion.

7. 6. The transfer device according to claim 1, wherein the suction port sucks particles deposited on the holding member.

8. 8. The transport device according to claim 1, wherein the holding member transports the object between a plurality of devices.

9. The transport apparatus according to claim 1 , wherein the object includes a substrate or a mold.

10. A conveying method for controlling a conveying device for conveying a plate-like object, the conveying device having a holding member that holds and conveys the object with a holding part that comes into contact with the object, The holding member has at least one suction port disposed around the holding portion; a flow path that connects the suction port to an exhaust source outside the conveying device, The transport method includes: a conveying step of holding and conveying the object with the holding unit that comes into contact with the object; a discharge step of sucking particles using at least one suction port arranged around the holder and discharging the particles to the outside of the transport device, A conveying method characterized in that, in the discharge process, suction by the suction port is started at the timing when the holding member holding the object descends or just before it descends, and suction by the suction port is stopped after the holding member and the object are separated.

11. A conveying method for controlling a conveying device for conveying a plate-shaped object, the conveying device having a holding member that holds and conveys the object with a holding part that comes into contact with the object, The holding member has at least one suction port disposed around the holding portion; a flow path that connects the suction port to an exhaust source outside the conveying device, The transport method includes: a conveying step of holding and conveying the object with the holding unit that comes into contact with the object; a discharge step of sucking particles using at least one suction port arranged around the holder and discharging the particles to the outside of the transport device, A conveying method characterized in that, in the discharge process, suction by the suction port is started before the object placed on the placement section comes into contact with the holding section as the holding member rises, and suction by the suction port is stopped when the object has been completely received by the holding section from the placement section.

12. A lithography apparatus, comprising: a processing section that forms a pattern on a plate-shaped object transported by the transport device according to any one of claims 1 to 9.

13. 1. A lithography system for forming a pattern on a plate-shaped object, comprising: a first processing device and a second processing device that perform processing on the object; a conveying device according to any one of claims 1 to 9, which conveys the object from the first processing device to the second processing device; 1. A lithography system comprising:

14. forming a pattern on the object using a lithographic apparatus according to claim 12; processing the object on which the pattern has been formed in the process; and producing an article from the treated object.

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