Manufacturing method for embossed transfer resin plate for thermocompression molding

Abstract

To provide a manufacturing method of an embossment transfer resin plate for a decorative plate hot-pressing mold having an uneven pattern on its surface, wherein the uneven pattern of an embossment mother die is adversely transferred without a crush of the uneven pattern in preparation of the embossment transfer resin plate even when a thermoplastic resin-made embossment mother die is used.SOLUTION: In preparation of an embossment transfer resin plate, heat insulation means 21 having a specific thickness is disposed between a back side (unevenness-free face) 20B of an embossment mother die 20 and a heating platen 25B, or hot pressing hardening is conducted only by pressure application from the back side (unevenness-free face) 20B of the embossment mother die 20, then the embossment mother die 20 and a protective film 24 are removed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an embossed resin plate for thermocompression molding. [Background technology]

[0002] It is generally known that the aesthetic appeal of a synthetic resin laminated decorative board can be enhanced by embossing the surface of the board. Embossing is usually performed using an embossing mold, and depending on the purpose, the embossing mold must meet the following requirements: (1) not deform during thermo-compression molding, i.e., heat resistance and resistance to pressure when heated; (2) the same mold can be used to make any number of pieces (congruence); (3) reproducibility when molding using the same mold; (4) ability to produce an exact replica (perfect transfer); (5) ability to withstand long-term use (durability); and (6) low cost. Traditionally, metal embossing molds have been widely used, but manufacturing the molds is time-consuming, and because the base material itself is made of metal, it is heavy and difficult to handle.In addition, if you want to produce a large number of decorative panels at once, you need a large number of molds, which creates cost issues (see, for example, Patent Document 1).

[0003] In order to solve the above problems with metal embossing molds, a method of producing a resin embossing mold is known (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2016-153167 [Patent Document 2] Japanese Patent Publication No. 8-164559 Summary of the Invention [Problem to be solved by the invention]

[0005] However, if the embossing mold is made of a material that is weak to heat and pressure, such as a thermoplastic resin, the embossed pattern will be crushed during thermo-compression molding and will not be able to be transferred, so it is necessary to use a room temperature curing resin for the resin to be molded, which is time-consuming and labor-intensive.

[0006] Therefore, the object of the present invention is to provide a method for manufacturing an embossed transfer resin plate for thermocompression molding of decorative panels, which has a textured pattern on its surface, and in which the textured pattern of the embossing mold is transferred in reverse without being crushed during production of the embossed transfer resin plate, even when a thermoplastic resin embossing mold is used, and to provide an embossed decorative panel with excellent reproducibility of the embossed textured pattern when the embossed transfer resin plate obtained by this manufacturing method is used as a pressing plate during embossing in the production of a decorative panel. [Means for solving the problem]

[0007] As a result of extensive research to achieve the above object, the inventors have found that the above problem can be solved by providing a heat insulating means of a specific thickness between the back side (the surface without texture) of the embossing matrix and the heating plate when producing an embossed transfer resin plate, or by applying pressure only from the back side (the surface without texture) of the embossing matrix to cure under heat and pressure, and then removing the embossing matrix and the protective film.The present invention was completed based on these findings and through further research.

[0008] That is, the present invention provides the following aspects.

[0009] Item 1. A method for producing an embossed transfer resin plate, characterized in that a resin-impregnated layer is provided on the front surface (surface having protrusions and recesses) of a thermoplastic resin embossing matrix, and a heat insulating means having a total thickness of 3 to 50 mm is provided between the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing matrix and a heating plate, and thermo-compression molding is performed by applying heat and pressure from both the front surface (surface having protrusions and recesses) and the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing matrix. Item 2. A method for producing an embossed transfer resin plate according to Item 1, characterized in that the front surface (surface having projections and recesses) of the thermoplastic resin embossing mold is provided with a resin-impregnated layer, and a heat insulating means having a total thickness of 3 to 50 mm is included between the back surface (surface without projections and recesses) of the thermoplastic resin embossing mold and the heating plate, the heat insulating means being one or more members selected from cushion paper, particle board, calcium silicate board, MDF, hardboard, insulation board, plywood, laminated wood, gypsum board, cement board, concrete board, volcanic glass multi-layer board, phenolic resin board, unsaturated polyester resin board, epoxy resin board, melamine resin board, and diallyl phthalate resin board. Item 3. A method for manufacturing an embossed transfer resin plate, characterized in that a resin-impregnated layer is provided on the front surface (surface having protrusions and recesses) of a thermoplastic resin embossing matrix, and heat and pressure are applied from the front surface (surface having protrusions and recesses) of the thermoplastic resin embossing matrix, and pressure is applied without heating from the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing matrix, thereby thermo-compression molding. Item 4. The method for producing an embossed transfer resin plate according to any one of Items 1 to 3, wherein the thermoplastic resin of the embossing matrix is ​​at least one resin selected from the group consisting of polyvinyl chloride, polypropylene, polystyrene, and polyethylene. Item 5. In the thermocompression molding, the pressure is 5 to 30 kgf / cm 2 4. The method for producing an embossed transfer resin plate according to any one of items 1 to 3, characterized in that: Item 6. The method for producing an embossed transfer resin plate according to any one of Items 1 to 3, wherein the temperature in the thermocompression molding is 120 to 190°C. Item 7. A method for producing an embossed decorative board, characterized in that the embossed transfer resin board obtained by the production method according to any one of items 1 to 3 is used as a pressing board. [Effects of the Invention]

[0010] According to the manufacturing method of the embossed transfer resin plate for thermocompression molding of decorative panels of the present invention, when an embossing mold made of thermoplastic resin is used, the concave-convex pattern is not crushed during the thermocompression molding process when producing the embossed transfer resin plate, and an embossed transfer resin plate is obtained in which the concave-convex pattern of the embossing mold is transferred inversely.When the embossed transfer resin plate obtained by this manufacturing method is used as a pressing plate when producing a decorative panel and embossed, an embossed decorative panel with excellent reproducibility of the embossed concave-convex pattern can be obtained. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing one embodiment of a method for producing an embossed transfer resin plate for thermal compression molding of decorative panels according to the present invention. [Figure 2] 1 is a schematic diagram showing another embodiment of the method for producing an embossed transfer resin plate for thermocompression molding of decorative panels according to the present invention. FIG. [Figure 3] 1 is an enlarged view of an embossing matrix in a method for producing an embossed transfer resin plate for thermocompression molding of decorative panels according to the present invention; FIG. [Figure 4] 1 is a schematic diagram showing one embodiment of a method for producing a decorative board having an embossed pattern on the surface of a resin-impregnated layer. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] The present invention relates to a method for producing an embossed transfer resin plate for thermocompression molding of decorative panels, in which the textured pattern of the mold is transferred in reverse, characterized by stacking several sheets of resin-impregnated paper of a specific composition, contacting the front surface (the textured surface) of an embossing mold made of thermoplastic resin and having a textured pattern on its surface with a protective film interposed therebetween as necessary, and either providing an insulating means of a specific thickness between the back side (the non-textured surface) of the embossing mold and a heating plate, or applying pressure only to the back side (the non-textured surface) of the embossing mold to thermocompress and harden it, and then removing the embossing mold and the protective film. More specifically, this is a method for producing an embossed resin plate, characterized in that a resin-impregnated layer is provided on the front surface (the surface having protrusions and recesses) of a thermoplastic resin embossing matrix, a heat insulating means of a specific thickness is provided between the back surface (the surface without protrusions and recesses) of the thermoplastic resin embossing matrix and the hot plate, and thermo-compression molding is performed by applying heat and pressure from both the front surface (the surface having protrusions and recesses) and the back surface (the surface without protrusions and recesses) of the thermoplastic resin embossing matrix. In another embodiment, this is a method for producing an embossed resin plate, characterized in that a resin-impregnated layer is provided on the front surface (the surface having protrusions and recesses) of the thermoplastic resin embossing matrix, and thermo-compression molding is performed by applying heat and pressure from the front surface (the surface having protrusions and recesses) of the thermoplastic resin embossing matrix and applying pressure without heating from the back surface (the surface without protrusions and recesses) of the thermoplastic resin embossing matrix.

[0013] [Resin-impregnated layer used for embossed transfer resin plate] The embossed transfer resin plate is made of a resin-impregnated layer containing resin-impregnated paper, and the resin-impregnated layer contains at least the impregnated substrate and a thermosetting resin composition (or a cured product thereof) impregnated into the impregnated substrate.

[0014] The resin-impregnated layer may be a single layer or multiple layers (laminate). The resin-impregnated layer may have a single layer of a thermosetting resin composition, or may have multiple layers of different thermosetting resin compositions (multilaminate).

[0015] The impregnated substrate is not particularly limited as long as it can be impregnated with the thermosetting resin composition described below, but examples include impregnated paper cloth such as titanium paper, tissue paper, reinforced paper, kraft paper, and cellulose paper; woven or nonwoven fabrics such as polyester, rayon, acrylic, and vinylon; and glass nonwoven fabric. The impregnated paper cloth may be printed. The impregnated substrate may be single-layered or multi-layered.

[0016] The amount of the thermosetting resin composition to be impregnated into the impregnated substrate is 10 to 500 g / m per area of ​​the impregnated substrate. 2 is preferable, and more preferably 100 to 300 g / m 2 The impregnation amount is 10 g / m 2 When the impregnation amount is 500 g / m or more, the impregnation amount is sufficient and the strength of the resin plate is good. 2 If it is less than this, costs can be reduced.

[0017] The thickness of the resin-impregnated layer is not particularly limited, but is, for example, 10 to 200 μm, and preferably 20 to 100 μm. If the thickness is 10 μm or more, defects such as poor flow during thermocompression molding can be suppressed. If the thickness is 200 μm or less, warping of the molded product due to resin shrinkage can be suppressed.

[0018] The resin-impregnated layer can be produced by known or conventional methods, for example, as follows. First, a thermosetting resin composition is prepared. The thermosetting resin composition is obtained by mixing an unsaturated polyester resin with various components described below as necessary. When the thermosetting resin composition has a low viscosity, the impregnated substrate can be immersed in a bath of the thermosetting resin composition for impregnation. When the thermosetting resin composition is a high-viscosity liquid or solid, the thermosetting resin composition is diluted or dissolved in an appropriate organic solvent, such as acetone, toluene, or methyl ethyl ketone, to obtain a resin liquid with an appropriate viscosity. The impregnated substrate is then immersed in the resin liquid and dried to volatilize the solvent. The impregnation temperature is, for example, 10 to 35°C, preferably 20 to 30°C. While the method of immersing the impregnated substrate in a bath of the thermosetting resin composition has been described, the impregnation can also be performed by applying the thermosetting resin composition to the surface of the impregnated substrate and leaving it to soak in. The thermosetting resin composition can be produced by curing the thermosetting resin composition through thermocompression molding using a method that will be described in detail later in the section on the method for producing an embossed transfer resin plate.

[0019] [Thermosetting resin composition used in resin-impregnated paper] The thermosetting resin composition of the present invention includes both a resin composition having thermosetting properties (thermosetting resin composition) and a composition containing a resin obtained by curing the thermosetting resin (such as an unsaturated polyester resin prepolymer) in the thermosetting resin composition (thermocured resin composition). That is, the resin-impregnated layer may be in a state in which the thermosetting resin composition is impregnated into an impregnated substrate (a layer before thermosetting, a prepreg), or in a state in which the thermosetting resin in the composition is cured (a layer after thermosetting).

[0020] The thermosetting resin composition of the present invention contains at least an unsaturated polyester resin.

[0021] The unsaturated polyester resin may be in a liquid state or a solid state at room temperature, and one or more kinds of the unsaturated polyester resins may be used.

[0022] The unsaturated polyester resin may be a compound containing a structural unit derived from a polybasic unsaturated acid and a structural unit derived from a polyhydric alcohol. The unsaturated polyester resin may further contain a structural unit derived from a polybasic saturated acid. The unsaturated acid, saturated acid, and polyhydric alcohol may each be used alone or in combination of two or more.

[0023] Examples of the polybasic unsaturated acid include maleic acid, fumaric acid, itaconic acid, and phthalic acid monomers (orthophthalic acid, isophthalic acid, and terephthalic acid). Among these, the unsaturated acid preferably contains a phthalic acid monomer. It is also preferable that the unsaturated acid contains maleic acid.

[0024] Examples of the polyhydric alcohol component include ethylene glycol, propylene glycol, neopentyl glycol, diethylene glycol, and hydrogenated bisphenol A. Of these, the polyhydric alcohol component preferably contains propylene glycol, ethylene glycol, and / or hydrogenated bisphenol A.

[0025] Alternatively, the unsaturated polyester resin may be an air-curable unsaturated polyester resin, such as a polyester resin containing a structural unit derived from an aliphatic cyclic unsaturated acid such as tetrahydrophthalic acid, 3,6-endomethylenetetrahydrophthalic acid, or methyl-3,6-endomethylenetetrahydrophthalic acid as the unsaturated acid, and a structural unit derived from allyl glycidyl ether as the polyhydric alcohol.

[0026] The number average molecular weight (Mn) of the unsaturated polyester resin is 500 to 2800, preferably 800 to 2200. When the number average molecular weight is 500 or more, the fluidity of the resin composition can be maintained, and the impregnation into the impregnation substrate is excellent. When the number average molecular weight is 2800 or less, the viscosity is reduced, and the handling is excellent. The number average molecular weight is a value obtained by GPC measurement.

[0027] The weight average molecular weight (Mw) of the unsaturated polyester resin is not particularly limited, but is preferably 2500 to 7000, more preferably 3500 to 5500. When the weight average molecular weight is 2500 or more, the fluidity of the resin composition can be maintained, and the impregnation into the impregnation substrate is superior. When the weight average molecular weight is 7000 or less, the viscosity is reduced, and handling is superior. The weight average molecular weight is a value obtained by GPC measurement.

[0028] The molecular weight dispersity (Mw / Mn) of the unsaturated polyester resin is not particularly limited, but is preferably 1.5 to 4.5, and more preferably 2.0 to 4.0.

[0029] The acid value of the unsaturated polyester resin is not particularly limited, but is preferably 5 to 30 KOH mg / g, and more preferably 10 to 25 KOH mg / g.

[0030] The content of the unsaturated polyester resin in the thermosetting resin composition of the present invention is preferably 10 to 60 mass %, more preferably 15 to 50 mass %, and even more preferably 20 to 40 mass %, relative to the total amount (100 mass %) of the thermosetting resin composition. When the content is 10 mass % or more, a resin-impregnated layer having sufficient strength can be obtained by thermocompression molding.

[0031] The thermosetting resin composition of the present invention may contain a monomer constituting an unsaturated polyester resin or an oligomer of the monomer (e.g., a polymer of two or three units), for example, a monomer that is a constituent unit of an unsaturated polyester resin.

[0032] The thermosetting resin composition of the present invention preferably contains a polymerization initiator (curing agent). Use of the polymerization initiator increases the curing rate compared to polymerization of the unsaturated polyester resin alone, allowing a resin-impregnated layer with a sufficient degree of curing to be obtained in a short time by thermocompression molding. Examples of the polymerization initiator include organic peroxide-based curing agents such as benzoyl peroxide, tertiary butyl perbenzoate, methyl ethyl ketone peroxide, and dicumyl peroxide.

[0033] The content of the polymerization initiator is preferably 2 to 10 parts by mass, more preferably 4 to 8 parts by mass, relative to 100 parts by mass of the unsaturated polyester resin.

[0034] The thermosetting resin composition of the present invention may contain other components in addition to the above-mentioned components. Examples of the other components include thermosetting resins such as diallyl phthalate resins (excluding unsaturated polyester resins), flame retardants such as aluminum hydroxide, curing catalysts, curing accelerators, polymerization inhibitors, mold release agents, fillers such as silica, plasticizers, dispersants, thickeners, viscosity modifiers, colorants (pigments, dyes, etc.), defoamers, preservatives, UV absorbers, depleting agents, antibacterial agents, leveling agents, and silane coupling agents. Only one of the above other components may be used, or two or more may be used.

[0035] The inclusion of the polymerization inhibitor can adjust the reaction rate of the unsaturated polyester resin and improve molding stability. Known or conventional polymerization inhibitors can be used, including hydroquinones such as hydroquinone, methylhydroquinone, p-tert-butylcatechol, and mono-tert-butylhydroquinone; phenols such as hydroquinone monomethyl ether and di-tert-butyl-p-cresol; quinones such as benzoquinone, p-benzoquinone, naphthoquinone, and p-toluquinone; copper salts such as di-tert-butylhydroxytoluene, 2,6-di-tert-butyl-4-methylphenol, and copper naphthenate; and phenothiazine. The polymerization inhibitors may be used singly or in combination of two or more.

[0036] The content of the polymerization inhibitor is preferably 0.005 to 0.5 parts by mass, more preferably 0.05 to 0.3 parts by mass, and even more preferably 0.8 to 0.2 parts by mass, relative to 100 parts by mass of the unsaturated polyester resin. When the content is within the above range, the molding stability of the embossed transfer resin plate is superior.

[0037] [Embossed transfer resin plate] An embossed transfer resin plate can be produced using the resin-impregnated paper and an embossing mold. The embossed transfer resin plate of the present invention can be obtained by stacking several sheets of the resin-impregnated paper, placing the front surface (the surface with the texture) of an embossing mold made of a thermoplastic resin and having a textured surface on top of the stack via a protective film, and then either providing a heat insulating means of a specific thickness between the back surface (the surface without the texture) of the embossing mold and the heating plate, or by applying pressure only from the back surface (the surface without the texture) of the embossing mold to cure under heat and pressure, and then removing the embossing mold and the protective film. In this invention, the "front surface" of the embossing mold refers to the surface having the textured surface, and the "back surface" of the embossing mold refers to the surface without the textured surface.

[0038] An embossed transfer resin plate having a resin-impregnated layer produced using the thermosetting resin composition of the present invention has excellent reproducibility of a concave-convex pattern when embossed using an embossing matrix.

[0039] The embossed transfer resin plate of the present invention may have other layers in addition to the resin-impregnated layer described above. Examples of such other layers include a protective film 24 for protecting the surface of the resin-impregnated layer, and tissue paper between the circulation plate 23 and the resin-impregnated layer 22. After the embossed transfer resin plate is manufactured, the protective film 24 is preferably peeled off before use in the production of a decorative plate, as described below.

[0040] The protective film may be any known or conventional film used for decorative panels, such as a plastic film such as polyethylene terephthalate film (PET film), polypropylene film, or polybutylene terephthalate film (PBT film) that has been subjected to a release treatment, or a low-adhesion film. The protective film 24 is peeled off when the decorative panel is manufactured using the embossed transfer resin plate 50' as a pressing plate.

[0041] [Method of manufacturing embossed transfer resin plate] An embodiment of the method for producing the embossed transfer resin plate will be described with reference to Figures 1 and 3. First, resin-impregnated paper is produced in the same manner as described above (paragraph 0018).

[0042] Next, as shown in Figure 1, the following are placed: a circulation plate 23, heat insulating means 21, embossing mold 20 (front side of embossing mold 20; embossing mold 20A faces resin-impregnated layer 22), protective film 24, resin-impregnated layer 22 (several layers of the resin-impregnated paper prepared above), and circulation plate 23.

[0043] Next, a press is used to apply heat and pressure from above and below the laminate including the resin-impregnated layer 22 using hot plates 25A and 25B to perform thermocompression molding, thereby curing the resin-impregnated layer 22 to form a thermo-cured resin-impregnated layer 22', and obtaining an embossed transfer resin plate 50' having an embossed pattern on its surface. As described above, the thermocompression molding method is preferably a laminate thermocompression molding method, in which the resin-impregnated layer 22 and the embossing matrix 20 are overlapped and placed in a mold for thermocompression curing.

[0044] The above-mentioned thermocompression molding is carried out at a pressure of, for example, 5 to 30 kgf / cm 2 is preferable, and 10 to 25 kgf / cm 2 More preferably, 12 to 20 kgf / cm 2 This can be most preferably done.

[0045] The above-mentioned thermocompression molding can be carried out at a temperature of preferably 120 to 190°C, more preferably 130 to 170°C, and most preferably 140 to 160°C.

[0046] The above thermocompression molding can be carried out preferably for 30 seconds to 20 minutes, more preferably for 45 seconds to 18 minutes, and most preferably for 60 seconds to 15 minutes.

[0047] The embossed transfer resin plate 50' obtained after thermocompression molding includes a layer formed by laminating the protective film 24 provided on the embossing matrix 20 and the thermoset resin-impregnated layer 22'. Thereafter, the protective film 24 is removed, and the embossed transfer resin plate 50' is obtained.

[0048] Another embodiment of the method for producing the embossed transfer resin plate will be described with reference to Figures 2 and 3. First, resin-impregnated paper is produced in the same manner as described above (paragraph 0018).

[0049] Next, as shown in Figure 2, the rotating plate 23, the embossing mold 20 (the front side of the embossing mold 20; the embossing mold 20A faces the resin-impregnated layer 22), the protective film 24, the resin-impregnated layer 22 (several layers of the above-mentioned resin-impregnated paper), and the rotating plate 23 are placed.

[0050] Next, a press is used to apply heat and pressure from above and below the laminate including the resin-impregnated layer 22, thereby performing thermocompression molding. During this process, the heater of the heating platen 25A is turned on to apply heat and pressure, while the heater of the heating platen 25B' is not turned on and only applies pressure. The resin-impregnated layer 22 is cured to form a thermoset resin-impregnated layer 22', thereby obtaining an embossed transfer resin plate 50' having an embossed pattern on its surface. Thus, the preferred method of thermocompression molding is the laminate thermocompression molding method, in which the resin-impregnated layer 22 and the embossing matrix 20 are overlapped and placed in a mold for thermocompression curing.

[0051] The above-mentioned thermocompression molding is carried out at a pressure of, for example, 5 to 30 kgf / cm 2 is preferable, and 10 to 25 kgf / cm 2 More preferably, 12 to 20 kgf / cm 2 This can be most preferably done.

[0052] The above thermocompression molding can be carried out on the hot platen 25A at a temperature of preferably 120 to 190° C., more preferably 130 to 170° C., and most preferably 140 to 160° C. It is preferable that the hot platen 25B′ is not heated.

[0053] The above thermocompression molding can be carried out preferably for 30 seconds to 20 minutes, more preferably for 45 seconds to 18 minutes, and most preferably for 60 seconds to 15 minutes.

[0054] The embossed transfer resin plate 50' obtained after thermocompression molding includes a layer formed by laminating the protective film 24 provided on the embossing matrix 20 and the thermoset resin-impregnated layer 22'. Thereafter, the protective film 24 is removed, and the embossed transfer resin plate 50' is obtained.

[0055] The materials used for the heat insulating means 21 can be ordinary materials that can withstand thermocompression molding, such as cushion paper, particle board, MDF, hardboard, insulation board, plywood, laminated lumber, gypsum board, cement board, concrete board, calcium silicate board, volcanic vitreous multilayer board, phenolic resin board, unsaturated polyester resin board, epoxy resin board, melamine resin board, and diallyl phthalate resin board. Preferred materials are cushion paper, particle board, calcium silicate board, MDF, hardboard, insulation board, plywood, laminated lumber, volcanic vitreous multilayer board, phenolic resin board, unsaturated polyester resin board, epoxy resin board, melamine resin board, and diallyl phthalate resin board, and more preferred materials are cushion paper, particle board, calcium silicate board, MDF, hardboard, insulation board, plywood, laminated lumber, and volcanic vitreous multilayer board. Among these, cushion paper, particle board, and calcium silicate board are most preferred from the standpoints of ease of handling and availability.

[0056] The material used for the heat insulating means 21 preferably has low thermal conductivity. That is, it is preferable for the material to maintain rigidity (not become soft) at temperatures between 120 and 190°C. Specifically, the range of thermal conductivity is preferably 0.01 to 4, more preferably 0.02 to 3, and even more preferably 0.03 to 2. Of these, from the viewpoints of heat insulating properties and ease of material availability, a range of 0.03 to 2 is most preferable.

[0057] The thickness of the entire member used for the heat insulating means 21 is not limited as long as it exhibits heat insulating properties, but a thickness of, for example, 3 to 50 mm is preferably used. It is more preferably 3.5 to 40 mm, and even more preferably 4 to 30 mm. Of these, from the viewpoint of ease of handling, 4 to 30 mm is most preferable.

[0058] The heat insulating means 21 may be a single layer or multiple layers (laminate). The heat insulating means may be a layer of a single material, or may have multiple layers of different materials (multi-laminate). When the heat insulating means 21 has multiple layers of different materials, there is no limitation on the order in which the layers of each material are placed, and any order is acceptable.

[0059] The embossing matrix 20 can be any known or conventional material used for commonly available embossed wallpaper sheets or embossed floor tiles. These are inexpensive, and various types of embossing are available commercially. Examples include floor tiles from Sangetsu Corporation, 1811 from Earth Werks, and repair wallpaper from Asahi Pen Co., Ltd. Among these, floor tiles from Sangetsu Corporation are the most preferred due to the wide variety of embossing options available.

[0060] The embossing die 20 may be made of commonly used thermoplastic resins such as polyvinyl chloride, polypropylene, polystyrene, polyethylene, AS resin, ABS resin, acrylic resin, methacrylic resin, PET resin, PVA resin, polyvinylidene chloride, and polyvinylidene fluoride. Among these, polyvinyl chloride, polypropylene, polystyrene, and polyethylene are preferred from the standpoint of cost and availability, with polyvinyl chloride being most preferred.

[0061] As described above, the embossed transfer resin plate 50' having a resin-impregnated layer 22' obtained using the thermosetting resin composition of the present invention has excellent reproducibility of the embossed pattern of the master mold, and after peeling off the protective film 24, can be used as a pressing plate when producing the decorative plate described below.

[0062] Next, an embossed decorative board manufactured using the above-mentioned embossed transfer resin board 50' as a pressing board will be described. The embossed decorative board of the present invention comprises a decorative sheet impregnated with a decorative board composition and a substrate.

[0063] [Resin composition for decorative panels] In the decorative sheet used for the embossed decorative board manufactured using the embossed transfer resin plate 50' of the present invention as a pressing plate, the resin composition for the decorative board impregnated into the decorative sheet contains at least a diallyl phthalate resin, an unsaturated polyester resin, and aluminum hydroxide.

[0064] The diallyl phthalate resin is a prepolymer having an allyl group in the molecule, and is a thermosetting resin (thermosetting resin).

[0065] The diallyl phthalate resin contains at least a constituent unit derived from a diallyl phthalate monomer. Examples of the diallyl phthalate monomer include diallyl orthophthalate, diallyl isophthalate, and diallyl terephthalate. The diallyl phthalate monomer may be used alone or in combination of two or more. The diallyl phthalate resin may be used alone or in combination of two or more. The weight average molecular weight of the diallyl phthalate resin measured by GPC method is preferably 10,000 to 50,000.

[0066] The unsaturated polyester resin may be in a liquid state or a solid state at room temperature, and one or more kinds of the unsaturated polyester resins may be used.

[0067] The unsaturated polyester resin may be a compound containing a structural unit derived from a polybasic unsaturated acid and a structural unit derived from a polyhydric alcohol. The unsaturated polyester resin may further contain a structural unit derived from a polybasic saturated acid. The unsaturated acid, saturated acid, and polyhydric alcohol may each be used alone or in combination of two or more.

[0068] Examples of the polybasic unsaturated acid include maleic acid, fumaric acid, itaconic acid, and phthalic acid monomers (orthophthalic acid, isophthalic acid, and terephthalic acid). Among these, the unsaturated acid preferably contains a phthalic acid monomer. It is also preferable that the unsaturated acid contains maleic acid.

[0069] Examples of the polyhydric alcohol component include ethylene glycol, propylene glycol, neopentyl glycol, diethylene glycol, and hydrogenated bisphenol A. Of these, the polyhydric alcohol component preferably contains propylene glycol, ethylene glycol, and / or hydrogenated bisphenol A.

[0070] Alternatively, the unsaturated polyester resin may be an air-curable unsaturated polyester resin, such as a polyester resin containing a structural unit derived from an aliphatic cyclic unsaturated acid such as tetrahydrophthalic acid, 3,6-endomethylenetetrahydrophthalic acid, or methyl-3,6-endomethylenetetrahydrophthalic acid as the unsaturated acid, and a structural unit derived from allyl glycidyl ether as the polyhydric alcohol.

[0071] The number-average molecular weight (Mn) of the unsaturated polyester resin is 500 to 2800, preferably 800 to 2200. A number-average molecular weight of 500 or more allows the fluidity of the resin composition to be maintained, resulting in excellent impregnation into the impregnated substrate. A number-average molecular weight of 2800 or less allows the resin composition to have high fluidity when an embossed resin transfer plate (pressing plate) having a textured pattern is superimposed on the resin-impregnated layer, and the curing rate is relatively slow, promoting the migration of the color pigment and providing excellent synchronization. Furthermore, the number-average molecular weight is more preferably 1600 to 2200, from the viewpoint of further promoting the flow of the color pigment during embossing and providing excellent synchronization. The number-average molecular weight is a value obtained by GPC measurement.

[0072] The weight-average molecular weight (Mw) of the unsaturated polyester resin is not particularly limited, but is preferably 2500 to 7000, more preferably 3500 to 5500. When the weight-average molecular weight is 2500 or more, the fluidity of the resin composition can be maintained, resulting in superior impregnation into the impregnated substrate. When the weight-average molecular weight is 7000 or less, the fluidity of the resin composition is high when an embossed transfer resin plate (pressing plate) having a textured pattern is superimposed on the resin-impregnated layer, and the curing rate is relatively slow, which promotes migration of the color pigment and tends to result in superior synchronization. The weight-average molecular weight is a value obtained by GPC measurement.

[0073] The molecular weight dispersity (Mw / Mn) of the unsaturated polyester resin is not particularly limited, but is preferably 1.5 to 4.5, and more preferably 2.0 to 4.0.

[0074] The acid value of the unsaturated polyester resin is not particularly limited, but is preferably 5 to 30 KOH mg / g, and more preferably 10 to 25 KOH mg / g.

[0075] The mass ratio of the diallyl phthalate resin to the unsaturated polyester resin (former:latter) in the resin composition for decorative sheets is preferably 20:80 to 90:10, more preferably 30:70 to 70:30, and from the viewpoint of even better non-flammability, still more preferably 30:70 to 40:60.

[0076] The total content of the diallyl phthalate resin and the unsaturated polyester resin in the resin composition for decorative boards is preferably 20 to 90% by mass, more preferably 30 to 85% by mass, and even more preferably 40 to 80% by mass, relative to the total amount (100% by mass) of the resin composition for decorative boards. When the content is 20% by mass or more, a resin-impregnated layer having sufficient strength can be obtained by thermocompression molding.

[0077] The resin composition for decorative sheets may contain a monomer constituting a diallyl phthalate resin or an unsaturated polyester resin, or an oligomer of the monomer (e.g., a polymer of two or three units). For example, it may contain the diallyl phthalate monomer, which is a constituent unit of the diallyl phthalate resin.

[0078] The resin composition for decorative boards contains aluminum hydroxide. By including aluminum hydroxide, the embossed decorative board is non-flammable. The shape of the aluminum hydroxide is not particularly limited, and examples include cylindrical, needle-like, and spherical shapes. Only one type of aluminum hydroxide may be used, or two or more types may be used.

[0079] The average particle size of aluminum hydroxide in the resin composition for decorative laminates is 3 μm or less, preferably 2 μm or less, and more preferably 1.5 μm or less. It is believed that the average particle size of 3 μm or less prevents the migration of color pigments in the thinner portions of the resin composition when an embossed transfer resin plate (pressing plate) having a textured pattern is superimposed on the resin-impregnated layer, resulting in excellent synchronization. Furthermore, the composition also has excellent transparency. The average particle size is, for example, 0.2 μm or more, and may be 0.3 μm or more, or 0.5 μm or more. The average particle size can be measured using a laser diffraction / scattering particle size distribution analyzer, or it can be measured from an electron microscope photograph, or it can be calculated from the electron microscope photograph using an image processing device. Generally, the average particle size is measured by laser diffraction.

[0080] The aluminum hydroxide may be surface-treated. By performing the surface treatment, the dispersibility in the resin composition for decorative sheets is improved. Examples of the surface treatment compound include a silane coupling agent and a titanium coupling agent.

[0081] As the above-mentioned silane coupling agent, the organic silicon compound having two or three alkoxy groups in the molecule can be mentioned.As the above-mentioned organic silicon compound, for example, can be mentioned vinyl silanes such as vinyl triethoxysilane, vinyl trimethoxysilane, vinyl tris (β-methoxyethoxy) silane; epoxy silanes such as β- (3,4-epoxycyclohexyl) ethyl trimethoxysilane, γ-glycidoxypropyl trimethoxysilane; amino silanes such as γ-aminopropyl triethoxysilane, N-β- (aminoethyl) -γ-aminopropyl methyl dimethoxysilane; γ-mercaptopropyl trimethoxysilane; γ-chloropropyl trimethoxysilane.

[0082] The content of aluminum hydroxide is preferably 5 to 90 parts by mass per 100 parts by mass of the total of the diallyl phthalate resin and the unsaturated polyester resin. When the content is 5 parts by mass or more, the non-flammability is more excellent. From the viewpoint of improving the synchronization when embossing, the content is more preferably 7 to 50 parts by mass, and even more preferably 10 to 40 parts by mass.

[0083] The resin composition for decorative sheets may contain a crosslinking agent for crosslinking the diallyl phthalate resin or the unsaturated polyester resin. The use of a crosslinking agent can improve the hardness of the resin-impregnated layer after heat curing, resulting in better release properties, image clarity, and gloss. Examples of the crosslinking agent include polyfunctional compounds such as polyfunctional monomers having at least two polymerizable functional groups with unsaturated carbon-carbon double bonds, such as (meth)acryloyl groups or vinyl groups, and polymers of such polyfunctional monomers. The crosslinking agents may be used alone or in combination of two or more.

[0084] Examples of the polyfunctional monomer include polyfunctional (meth)acrylates such as hexanediol di(meth)acrylate, dodecanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, butyl di(meth)acrylate, and hexyl di(meth)acrylate. Of the polyfunctional compounds, poly(meth)acrylates of dipentaerythritol having three or more (meth)acryloyl groups in the molecule are preferred.

[0085] The content of the crosslinking agent is preferably 0.6 to 20 parts by mass, more preferably 1 to 16 parts by mass, per 100 parts by mass of the total of the diallyl phthalate resin and the unsaturated polyester resin. When the content is within the above range, the hardness of the resin-impregnated layer after heat curing becomes more appropriate.

[0086] The decorative laminate resin composition preferably contains a polymerization initiator (curing agent). The use of the polymerization initiator increases the curing rate compared to the polymerization of diallyl phthalate resin or unsaturated polyester resin alone, allowing a resin-impregnated layer with a sufficient degree of curing to be obtained in a short time by thermocompression molding. Examples of the polymerization initiator include organic peroxide-based curing agents such as benzoyl peroxide, tertiary butyl perbenzoate, methyl ethyl ketone peroxide, and dicumyl peroxide.

[0087] The content of the polymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the total of the diallyl phthalate resin and the unsaturated polyester resin.

[0088] The resin composition for decorative laminates may contain other components in addition to the above components. Examples of the other components include thermosetting resins other than diallyl phthalate resins and unsaturated polyester resins, flame retardants other than aluminum hydroxide, curing catalysts, curing accelerators, polymerization inhibitors, release agents, fillers such as silica, plasticizers, dispersants, thickeners, viscosity modifiers, colorants (pigments, dyes, etc.), defoamers, preservatives, UV absorbers, depleting agents, antibacterial agents, leveling agents, and silane coupling agents. Only one of the above other components may be used, or two or more may be used.

[0089] In order to provide excellent conformability when embossed, the resin composition for decorative laminates preferably contains a coloring pigment. Known or commonly used coloring pigments can be used, with pearl pigments being preferred. The content of the coloring pigment is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the diallyl phthalate resin and the unsaturated polyester resin combined.

[0090] Examples of other flame retardants besides the aluminum hydroxide include metal oxides such as magnesium hydroxide. When the resin composition for decorative sheets is intended to have excellent conformability when embossed, it is preferable to include other flame retardants in addition to aluminum hydroxide, from the viewpoint of achieving excellent conformability while also ensuring sufficient non-flammability. The other flame retardants may be used alone or in combination of two or more.

[0091] The average particle size of the other flame retardants is preferably 4 μm or less, more preferably 3 μm or less, and even more preferably 2 μm or less, from the viewpoint of achieving better synchronization without inhibiting the movement of the color pigment in the thinner portions of the resin composition when an embossed transfer resin plate (pressing plate) having a concave-convex shape is superimposed on the resin-impregnated layer. The average particle size is, for example, 0.2 μm or more, and may be 0.3 μm or more, or 0.5 μm or more. The average particle size of the other flame retardants is determined by the same method as the average particle size of aluminum hydroxide.

[0092] The content of the other flame retardants is appropriately set depending on the content of all the flame retardants in the resin composition for decorative boards. The content of the flame retardants in the resin composition for decorative boards is preferably 10 to 90 parts by mass, more preferably 20 to 70 parts by mass, and even more preferably 30 to 60 parts by mass, per 100 parts by mass of the diallyl phthalate resin and the unsaturated polyester resin combined.

[0093] The inclusion of the above-mentioned release agent improves the releasability from the embossed transfer resin plate (pressure plate). Examples of the release agent include fluorine-based release agents, silicone-based release agents, and wax-based release agents. The above-mentioned release agents may be used alone or in combination of two or more.

[0094] The content of the release agent is preferably 0.1 to 8 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the total of the diallyl phthalate resin and the unsaturated polyester resin. When the content is 0.1 part by mass or more, the release property from the embossed transfer resin plate (pressing plate) becomes better. When the content is 8 parts by mass or less, the adhesion between the resin-impregnated layer and the substrate in the embossed decorative board becomes good.

[0095] The inclusion of the polymerization inhibitor can adjust the reaction rate of the diallyl phthalate resin and the unsaturated polyester resin, improving molding stability. Known or conventional polymerization inhibitors can be used, including hydroquinones such as hydroquinone, methylhydroquinone, p-tert-butylcatechol, and mono-tert-butylhydroquinone; phenols such as hydroquinone monomethyl ether and di-tert-butyl-p-cresol; quinones such as benzoquinone, p-benzoquinone, naphthoquinone, and p-toluquinone; copper salts such as di-tert-butylhydroxytoluene, 2,6-di-tert-butyl-4-methylphenol, and copper naphthenate; and phenothiazine. The polymerization inhibitors may be used singly or in combination of two or more.

[0096] The content of the polymerization inhibitor is preferably 0.005 to 0.5 parts by mass, more preferably 0.05 to 0.3 parts by mass, and even more preferably 0.8 to 0.15 parts by mass, per 100 parts by mass of the total of the diallyl phthalate resin and the unsaturated polyester resin. When the content is within the above range, the molding stability of the embossed decorative sheet is superior.

[0097] The viscosity (rotation speed: 6 rpm) of the resin composition for decorative boards in an acetone solution having a solids content of 50% by mass at 20°C is preferably 110 to 800 mPa·s, more preferably 150 to 700 mPa·s. The viscosity (rotation speed: 60 rpm) of the resin composition for decorative boards in an acetone solution having a solids content of 50% by mass at 20°C is preferably 30 to 200 mPa·s, more preferably 40 to 120 mPa·s. The above viscosity is a value measured using a Brookfield viscometer for a solution obtained by adding acetone to the resin composition for decorative boards until the solids concentration reaches 50% by mass.

[0098] The thixotropic index (TI) of the resin composition for decorative laminate in an acetone solution with a solid content of 50% by mass at 20°C is preferably 3 to 8, more preferably 4 to 7. When the TI is 3 or more, the thixotropy is high and the impregnation into the impregnated substrate is superior. When the TI is 8 or less, the resin composition has appropriate fluidity when impregnated into the impregnated substrate and the impregnation into the impregnated substrate is superior. The TI is a value calculated based on the viscosity of the acetone solution with a solid content of 50% by mass at 20°C, as [viscosity (6 rpm) / viscosity (60 rpm)].

[0099] [Decorative sheet] The resin composition for decorative boards can be used to produce decorative sheets and embossed decorative boards. Examples of the decorative sheets include those comprising an impregnated base material and a resin-impregnated layer containing a thermosetting resin composition impregnated into the impregnated base material, wherein the thermosetting resin composition is the resin composition for decorative boards or a cured product thereof.

[0100] The decorative board resin composition is a thermosetting resin composition. The thermosetting resin composition includes both a resin composition having thermosetting properties (thermosetting resin composition) and a composition containing a resin obtained by curing the thermosetting resin in the thermosetting resin composition (such as a diallyl phthalate resin or an unsaturated polyester resin, which are prepolymers) (thermosetting resin composition). That is, the resin-impregnated layer includes a layer in which the thermosetting resin composition is impregnated into an impregnated substrate (a layer before thermosetting, a prepreg), and a layer in which the thermosetting resin in the composition is cured (a layer after thermosetting).

[0101] The resin-impregnated layer is a layer in which the resin composition for decorative boards or a cured product of the resin composition is impregnated into an impregnated substrate. The resin-impregnated layer may be a single layer or a multi-layer (laminate). The resin-impregnated layer may have a layer of a single resin composition for decorative boards, or may have layers of multiple different resin compositions for decorative boards (multi-laminate).

[0102] The impregnated substrate is not particularly limited as long as it can be impregnated with the resin composition for decorative laminates, but examples include impregnated paper cloth such as titanium paper, tissue paper, reinforced paper, kraft paper, and cellulose paper; and woven or nonwoven fabrics such as polyester, rayon, acrylic, and vinylon. The impregnated paper cloth may be printed. The impregnated substrate may be single-layered or multi-layered.

[0103] The amount of the thermosetting resin composition impregnated into the impregnated substrate is 10 to 500 g / m per area of ​​the impregnated substrate. 2 is preferable, and more preferably 100 to 300 g / m 2 The impregnation amount is 10 g / m 2 When the impregnation amount is 500 g / m or more, the impregnation amount is sufficient and the adhesion to the substrate is increased. 2 If it is less than this, costs can be reduced.

[0104] The thickness of the resin-impregnated layer is not particularly limited, but is, for example, 10 to 200 μm, and preferably 20 to 100 μm. If the thickness is 10 μm or more, defects such as poor flow during thermocompression molding can be suppressed. If the thickness is 200 μm or less, warping of the molded product due to resin shrinkage can be suppressed.

[0105] The resin-impregnated layer can be produced by known or conventional methods, for example, as follows. First, a resin composition for decorative laminates, which is a thermosetting composition, is prepared. The resin composition for decorative laminates is obtained by mixing a diallyl phthalate resin, an unsaturated polyester resin, and aluminum hydroxide with the various components described above, as necessary. If the resin composition for decorative laminates is low in viscosity, the impregnated substrate can be immersed in a bath of the resin composition for decorative laminates to impregnate it. If the resin composition for decorative laminates is a high-viscosity liquid or solid, the resin composition for decorative laminates is diluted or dissolved in an appropriate organic solvent, such as acetone, toluene, or methyl ethyl ketone, to obtain a resin liquid of appropriate viscosity. The impregnated substrate is then immersed in the resin composition and dried to volatilize the solvent. The impregnation temperature is, for example, 10 to 35°C, preferably 20 to 30°C. Although the method of immersing the impregnated substrate in the bath of the resin composition for decorative boards has been described, the impregnation may also be carried out by applying the resin composition for decorative boards to the surface of the impregnated substrate and leaving it to soak in. When the thermosetting resin composition is a cured product of the resin composition for decorative boards, the resin composition for decorative boards can be cured and produced by thermocompression molding using the method described in detail below in the method for producing an embossed decorative board.

[0106] [Decorative panel] The decorative sheet can be used to produce an embossed decorative board. The embossed decorative board includes, for example, a substrate and the decorative sheet provided on one side of the substrate. More specifically, the embossed decorative board has at least a laminated structure of a substrate and a decorative sheet including a resin-impregnated layer in which the impregnated substrate is impregnated with the resin composition for decorative boards.

[0107] In the embossed decorative board, the surface of the resin-impregnated layer (i.e., the surface opposite to the substrate) may have an embossed shape. A decorative board having a resin-impregnated layer produced using the resin composition for decorative boards of the present invention exhibits a harmonious shape according to the thickness of the resin-impregnated layer when embossed.

[0108] The embossed decorative laminate may have other layers in addition to the above-mentioned layers, such as a primer layer for improving adhesion between the resin-impregnated layer and the substrate, a core layer for imparting shape stability to the embossed decorative laminate, and a protective film for protecting the surface of the resin-impregnated layer.

[0109] One embodiment of the embossed decorative board is shown in Figure 4. The embossed decorative board 10 shown in Figure 4 comprises a substrate 1, a resin-impregnated layer 2', and a protective film 3. The resin-impregnated layer 2' is a layer in which an impregnated substrate is impregnated with a cured product of a resin composition for decorative boards, and is obtained by thermally curing the resin-impregnated layer 2.

[0110] The substrate may be a known or commonly used substrate used in embossed decorative laminates. The substrate may be an organic substrate or an inorganic substrate. Examples of the organic substrate include wood substrates such as veneer, plywood, laminated wood, particle board, medium-density fiberboard (MDF), high-moisture fiberboard, and kenaf board; fibrous substrates such as paperboard, woven fabric, nonwoven fabric, resin-impregnated paper, and resin-impregnated fabric; and synthetic resin substrates such as acrylic resin board, styrene resin board, ABS resin board, polycarbonate resin board, nylon resin board, polystyrene resin board, polypropylene resin board, polyester resin board, and glass fiber-reinforced plastic board. Examples of the inorganic substrate include metal plate substrates such as aluminum plates, stainless steel plates, duralumin plates, steel plates, and brass plates; and inorganic substrates such as magnesium oxide plates, aluminum hydroxide plates, aluminum oxide plates, silicon oxide plates, titanium oxide plates, magnesium chloride plates, calcium silicate plates, volcanic glass material plates, gypsum (calcium sulfate) plates, slag gypsum plates, limestone (calcium carbonate) plates, wood wool cement plates, slag cement plates, lightweight aerated concrete plates, and glass fiber reinforced concrete plates. The substrate may be a single layer or a laminate of the same or different layers. The substrate may also be subjected to an easy-adhesion treatment, such as a sealer treatment or a primer treatment, to improve adhesion to the resin-impregnated layer.

[0111] The thickness of the substrate is not particularly limited, but is preferably 3 to 50 mm, and more preferably 4 to 30 mm. If the thickness is 2 mm or more, the substrate has sufficient strength and is less likely to break. If the thickness is 50 mm or less, the substrate is lightweight and easy to handle.

[0112] The protective film can be any known or conventional film used for embossed decorative boards, such as a plastic film such as polyethylene terephthalate film (PET film), polypropylene film, or polybutylene terephthalate film (PBT film) that has been subjected to a release treatment, or a low-adhesion film. The protective film is peeled off when the embossed decorative board is used.

[0113] [Method of manufacturing embossed decorative panels] One embodiment of the method for manufacturing the decorative board will be described with reference to Figure 4. First, as described above, the thermosetting resin composition for decorative boards, prepared by diluting or dissolving with a solvent as needed, is impregnated into an impregnated substrate, and then, as needed, the solvent is evaporated by drying to produce a resin-impregnated layer 2 in which the thermosetting resin composition for decorative boards is impregnated into the impregnated substrate. Next, as needed, a releasable substrate such as a polyethylene film is laid on the resin-impregnated layer 2 to obtain a decorative sheet. When a releasable substrate is used, a small amount of volatile solvent may be used on the edge to temporarily adhere the releasable substrate to the decorative sheet.

[0114] Next, the decorative sheet is placed on the substrate 1 with the resin-impregnated layer 2 facing the substrate 1, and if a releasable substrate is present, the releasable substrate is peeled off, and the embossed transfer resin plate 50' is superimposed on the resin-impregnated layer 2 to obtain a laminate in which the embossed decorative plate 10 and the embossed transfer resin plate 50' are laminated. The surface of the embossed transfer resin plate 50' facing the resin-impregnated layer 2 has a shape for transferring a relief pattern.

[0115] Next, a press is used to apply heat and pressure from above and below the laminate including the embossed decorative sheet 10 to perform thermocompression molding, curing the resin-impregnated layer 2 to form a thermoset resin-impregnated layer 2', and obtaining a laminate in which the embossed decorative sheet 10' and the embossed transfer resin sheet 50' are laminated. As described above, the thermocompression molding method is preferably a lamination thermocompression molding method, in which the resin-impregnated layer 2 and the substrate 1 are overlapped, placed in a mold, and thermocompression cured. The thermocompression molding is preferably carried out at a pressure of, for example, 10 to 25 kgf / cm. 2 The heating can be preferably carried out at a temperature of 120 to 190° C. for 30 seconds to 15 minutes.

[0116] The laminate obtained after thermocompression molding includes an embossed decorative board 10' formed by laminating a substrate 1 and a thermoset resin-impregnated layer 2' provided on the substrate 1. Thereafter, the embossed transfer resin plate 50' is removed, yielding an embossed decorative board 10' having an embossed shape on the surface of the resin-impregnated layer 2'.

[0117] To produce an embossed decorative board 10' having an embossed pattern on the surface of the resin-impregnated layer 2', an embossed transfer resin plate 50' having a concave-convex pattern on the surface facing the resin-impregnated layer 2 is used. Then, as shown in FIG. 4, when the embossed transfer resin plate 50' is superimposed on the resin-impregnated layer 2, a concave-convex pattern corresponding to the concave-convex pattern is formed on the surface of the resin-impregnated layer 2. That is, the resin-impregnated layer 2 has a thick film portion 2a and a thin film portion 2b. When the concave-convex pattern is formed on the surface of the resin-impregnated layer 2, a higher pressure is applied to the region that will become the thin film portion 2b than to the region that will become the thick film portion 2a. If the resin-impregnated layer 2 contains a color pigment, the color pigment flows from the region that will become the thin film portion 2b to the region that will become the thick film portion 2a when pressure is applied. The small average particle diameter of the aluminum hydroxide allows the color pigment to flow smoothly without being hindered. As a result, the amount of color pigment per unit area in the thick film portion 2a of the resin-impregnated layer 2' is greater than the amount in the thin film portion 2b, achieving synchronization. Thereafter, the laminate is subjected to heat and pressure molding using a press to obtain an embossed decorative board 10' having an embossed pattern on the surface of the resin-impregnated layer 2'.

[0118] A protective film such as a PET film may then be laminated onto the surface of the resin-impregnated layer 2' of the embossed decorative board 10'. In this manner, the above-mentioned embossed decorative board can be manufactured.

[0119] As described above, the embossed decorative board having a resin-impregnated layer obtained using the resin composition for decorative boards of the present invention has excellent non-flammability due to the inclusion of aluminum hydroxide having an average particle size within a specific range. Furthermore, when a resin-impregnated layer is prepared by blending a color pigment into the resin composition for decorative boards and embossing the surface of the resin-impregnated layer, synchronization according to the thickness of the resin-impregnated layer is exhibited. [Example]

[0120] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0121] [Manufacturing Example 1] <Preparation of resin-impregnated paper 1 used for embossed transfer resin plate> A resin solution was prepared by dissolving 142 parts of unsaturated polyester, 160 parts of surface-treated aluminum hydroxide (trade name "BE043STM", manufactured by Nippon Light Metal Co., Ltd.), 40 parts of magnesium hydroxide (trade name "Magseeds W-H4", manufactured by Konoshima Chemical Co., Ltd.), 0.16 parts of hydroquinone (polymerization inhibitor, manufactured by Kawaguchi Chemical Co., Ltd.), 3 parts of benzoyl peroxide (manufactured by Kawaguchi Pharmaceutical Co., Ltd.), 3 parts of a polymerization initiator (trade name "Perhexa (registered trademark) C", manufactured by Yuka Sangyo Co., Ltd.), and 2 parts of dry silica (trade name "Reolosil (registered trademark), manufactured by Tokuyama Corporation) in acetone, and the resulting solution was concentrated to a concentration of 30 g / m. 2 impregnated into a glass nonwoven fabric (Grabest, model number "SAS-030", manufactured by Olivest Co., Ltd.) with 170 g / m 2 Resin-impregnated paper 1 was obtained for use in the embossed transfer resin plate.

[0122] <Preparation of embossed transfer resin plate 1> Example 1 On the transfer board, five sheets of cushion paper (5 mm thick for five sheets of cushion paper), PVC embossed tiles (manufactured by Earth Werks, model number "1811"), PBT film, 10 sheets of resin-impregnated paper 1 obtained in Production Example 1, tissue paper, and the transfer board were placed in this order. The PVC embossed tiles had an uneven shape, and were placed with the uneven side facing the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermo-compression molding. The thermo-compression molding was performed at a temperature of 150°C and a pressure of 11 kgf / cm. 2 The pressure was then released, and the laminate of the transfer board, cushion paper, PVC embossed tile, and decorative sheet was removed from the press and cooled to room temperature to obtain an embossed transfer resin plate 1.

[0123] <Preparation of decorative sheet 1 for evaluation decorative board> Diallyl orthophthalate prepolymer (methyl ethyl ketone 50% by mass solution viscosity (30°C) 96.5 mPa·s, manufactured by Osaka Soda Co., Ltd.) 38 parts by mass, unsaturated polyester (product name "DH-2000B", manufactured by DIC Material Co., Ltd.) 81 parts by mass, dipentaerythritol hexaacrylate 5 parts by mass, aluminum hydroxide (product name "BF013STM", average particle size 1 μm, surface treated, manufactured by Nippon Light Metal Co., Ltd.) 37.5 parts by mass, magnesium hydroxide (product name A resin composition solution was prepared by dissolving 12.5 parts by mass of 12.5% ​​by mass of Magseeds N-6 (average particle size 1.3 μm), 3 parts by mass of benzoyl peroxide, 1 part by mass of an internal release agent (trade name "Zelec UN" manufactured by DuPont), 0.05 parts by mass of hydroquinone (polymerization inhibitor), 3 parts by mass of finely powdered silica (trade name "Carplex" manufactured by Shionogi & Co., Ltd.), 3 parts by mass of a pearl pigment (trade name "Iriodin 520" manufactured by Merck) and 0.15 parts by mass of an antifoaming agent in 100 parts by mass of acetone. The resin composition solution at 25°C was added to a 60 g / m2 impregnation substrate. 2 After that, it was heated in a hot air circulating oven at 105°C for 90 seconds to volatilize the solvent, and a 160 g / m 2 A decorative sheet 1 made of impregnated paper (amount of impregnation per 100 parts by mass of printed pattern paper: 167 parts by mass) was obtained.

[0124] <Preparation of embossed decorative panel 1 for evaluation> A substrate (product name "Dailite", manufactured by Daiken Corporation, 3 mm thick, non-combustible material) was placed on the rotating plate, and the decorative sheet 1 was then placed on the substrate with the impregnated paper in contact with the substrate. Then, using a press machine, pressure was applied so that the hot platen on which the pressure plate was set faced the impregnated paper side and the other hot platen faced the rotating plate side, and heat was applied to perform thermo-compression molding. At this time, the embossed transfer resin plate obtained in <Preparation of embossed transfer resin plate 1> was used as the pressure plate. Note that the surface of the pressure plate facing the impregnated paper had an uneven shape formed to impart an embossed shape. The thermo-compression molding was performed at a temperature of 150°C and a pressure of 16 kgf / cm. 2 The pressure was then released, and the laminate of the transfer board, substrate, and decorative sheet was removed from the press and cooled to room temperature to obtain embossed decorative board 1 for evaluation.

[0125] <Preparation of embossed transfer resin plate 2> Example 2 A vinyl chloride embossed tile (manufactured by Earth Werks, model number "1811"), PBT film, 10 sheets of impregnated paper, tissue paper, and a vinyl chloride embossed tile were placed on the board in this order. The vinyl chloride embossed tile had a concave-convex shape, and was placed with the concave-convex side facing the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermo-compression molding. The thermo-compression molding was performed at a temperature of 150°C and a pressure of 11 kgf / cm. 2 The press was then performed for 15 minutes. At this time, the heating plate on the PVC embossed tile side was not heated, and only pressure was applied. After that, the pressure was released, and the laminate of the transfer plate, PVC embossed tile, and decorative sheet was removed from the press and cooled to room temperature to obtain the embossed transfer resin plate 2.

[0126] <Preparation of embossed decorative panel 2 for evaluation> A decorative sheet for evaluation decorative board was prepared in the same manner as in paragraph number 0123, and an embossed decorative board 2 for evaluation was obtained in the same manner as in Example 1, except that the embossed transfer resin board 2 obtained in Example 2 <Preparation of embossed transfer resin board 2> was used as the pressing plate.

[0127] <Preparation of Embossed Transfer Resin Plate 3> Example 3 On the board, a 15 mm thick particle board (manufactured by Nippon Steel Texeng Co., Ltd.), a vinyl chloride embossed tile (manufactured by Earth Werks, model number "1811"), a PBT film, 10 sheets of resin-impregnated paper 1 obtained in Production Example 1, tissue paper, and the board were placed in this order. The vinyl chloride embossed tile had an uneven shape, and was placed so that the uneven side faced the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermocompression molding. The thermocompression molding was performed at a temperature of 150°C and a pressure of 11 kgf / cm. 2 After that, the pressure was released, and the laminate of the board, particle board, PVC embossed tile, and decorative sheet was taken out of the press and cooled to room temperature to obtain an embossed transfer resin plate 3.

[0128] <Production of embossed decorative panel 3 for evaluation> A decorative sheet for evaluation decorative board was prepared in the same manner as in paragraph 0123, and an embossed decorative board 3 for evaluation was obtained in the same manner as in Example 1, except that the embossed transfer resin board 3 obtained in Example 3 <Preparation of embossed transfer resin board 3> was used as the pressing plate.

[0129] <Preparation of Embossed Transfer Resin Plate 4> Example 4 On the board, a 12 mm thick 0.8 calcium silicate board (Hilac, manufactured by A&A Material Co., Ltd.), a vinyl vinyl embossed tile (manufactured by Earth Werks, model number "1811"), a PBT film, 10 sheets of resin-impregnated paper 1 obtained in Production Example 1, tissue paper, and the board were placed in this order. The vinyl vinyl embossed tile had an uneven shape, and was placed so that the uneven side faced the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermocompression molding. The thermocompression molding was performed at a temperature of 150°C and a pressure of 11 kgf / cm. 2 The pressure was then released, and the laminate of the migration board, calcium silicate board, PVC embossed tile, and decorative sheet was removed from the press and cooled to room temperature to obtain an embossed transfer resin board 4.

[0130] <Preparation of embossed decorative panel 4 for evaluation> A decorative sheet for evaluation decorative board was prepared in the same manner as in paragraph 0123, and an embossed decorative board 4 for evaluation was obtained in the same manner as in Example 1, except that the embossed transfer resin board 4 obtained in Example 4 <Preparation of embossed transfer resin board 4> was used as the pressing plate.

[0131] <Preparation of Embossed Transfer Resin Plate 5> Comparative Example 1 On the transfer board, a PVC embossed tile (manufactured by Earth Werks, model number "1811"), PBT film, 10 sheets of impregnated paper, tissue paper, and transfer board were placed in this order. At this time, no insulating means made of cushion paper was placed between the PVC embossed tile and the transfer board. The PVC embossed tile had an uneven shape, and was placed so that the uneven side faced the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermo-compression molding. The thermo-compression molding was performed at a temperature of 150°C and a pressure of 16 kgf / cm. 2 After that, the pressure was released, and the laminate of the transfer plate, the PVC embossed tile, and the decorative sheet was taken out of the press and cooled to room temperature to obtain an embossed transfer resin plate 5.

[0132] <Production of embossed decorative panel 5 for evaluation> A decorative sheet for evaluation decorative board was prepared in the same manner as in paragraph number 0123, and an embossed decorative board 5 for evaluation was obtained in the same manner as in Example 1, except that the embossed transfer resin board 5 obtained in Comparative Example 1 <Preparation of embossed transfer resin board 5> was used as the pressing plate.

[0133] <Preparation of Embossed Transfer Resin Plate 6> Comparative Example 2 On the board, 2.5 mm thick MDF (manufactured by Daiken Corporation), PVC embossed tiles (manufactured by Earth Werks, model number "1811"), PBT film, 10 sheets of resin-impregnated paper 1 obtained in Production Example 1, tissue paper, and board were placed in this order. The PVC embossed tiles had an uneven shape, and were placed so that the uneven side faced the PBT film. Then, pressure was applied using a press, and heat was applied to perform thermocompression molding. The thermocompression molding was performed at a temperature of 150°C and a pressure of 11 kgf / cm.2 The pressure was then released, and the laminate of the board, MDF, PVC embossed tile, and decorative sheet was removed from the press and cooled to room temperature to obtain an embossed transfer resin plate 6.

[0134] <Production of embossed decorative panel 6 for evaluation> A decorative sheet for evaluation decorative board was prepared in the same manner as in paragraph 0123, and an embossed decorative board 6 for evaluation was obtained in the same manner as in Example 1, except that the embossed transfer resin board 6 obtained in Comparative Example 2 <Preparation of embossed transfer resin board 6> was used as the pressing plate.

[0135] <Evaluation> The surface of the resin-impregnated layer of each of the decorative boards obtained in Examples 1 to 4 and Comparative Examples 1 and 2 was visually observed and evaluated according to the following criteria. The results are summarized in Table 1.

[0136] [Table 1] [Judgment criteria] ◯ (Good): There is a large difference in the shade of color between the recessed and protruding parts, and the color is clearly in harmony with the embossed shape. × (bad): The difference in color density between the recessed and protruding parts is small, and there is no sense of harmony with the embossed shape.

[0137] Examples 1, 3, and 4, in which the PVC embossing matrix was sufficiently insulated, and Example 2, in which pressure was only applied from the back surface (non-textured surface) of the PVC embossing matrix, were evaluated as having excellent synchronization. On the other hand, Comparative Example 1, in which no insulating means was provided for the PVC embossing matrix, and Comparative Example 2, in which the overall thickness of the insulating means members was thin and the PVC embossing matrix was insufficient in insulation, were evaluated as having poor synchronization because the embossing was crushed and the difference in shade was small. [Explanation of symbols]

[0138] 1 Base material 2 Resin-impregnated layer (before heat curing, prepreg) 2a Thick film part 2b Thin film part 2' Resin impregnated layer (heat cured) 10,10' embossed decorative panel 20 Embossing mold 20A Embossing mold front surface (uneven surface) 20B Back side of embossing mold (flat surface) 21 Thermal insulation measures 22 Resin-impregnated layer (before heat curing, prepreg) 22' Resin impregnated layer (heat cured) 23 Excursion board 24 Protective Film 25A,25B heating plate 25B' Heating platen (pressure only) 50 Embossed transfer resin plate (before heat curing, prepreg) 50' Embossed Transfer Resin Plate (Heat Cured)

Claims

1. A method for manufacturing an embossed transfer resin plate, characterized in that a resin-impregnated layer is provided on the front surface (surface having protrusions and recesses) of a thermoplastic resin embossing matrix, and a heat insulating means having a total thickness of 3 to 50 mm is provided between the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing matrix and a heating plate, and the thermoplastic resin embossing matrix is ​​subjected to thermo-compression molding by applying heat and pressure from both the front surface (surface having protrusions and recesses) and the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing matrix.

2. 2. The method for manufacturing an embossed transfer resin plate according to claim 1, characterized in that the front surface (surface having protrusions and recesses) of the thermoplastic resin embossing mold is provided with a resin-impregnated layer, and a heat insulating means having a total thickness of 3 to 50 mm is inserted between the back surface (surface without protrusions and recesses) of the thermoplastic resin embossing mold and the heating plate, the heat insulating means being one or more members selected from cushion paper, particle board, calcium silicate board, MDF, hardboard, insulation board, plywood, laminated wood, gypsum board, cement board, concrete board, volcanic glass multi-layer board, phenolic resin board, unsaturated polyester resin board, epoxy resin board, melamine resin board, and diallyl phthalate resin board.

3. 3. The method for producing an embossed transfer resin plate according to claim 1 or 2, wherein the thermoplastic resin of the embossing matrix is ​​at least one resin selected from the group consisting of polyvinyl chloride, polypropylene, polystyrene, and polyethylene.

4. In the heat and pressure molding, the pressure is 5 to 30 kgf / cm ２ The method for producing an embossed transfer resin plate according to claim 1 or 2, characterized in that:

5. 3. The method for producing an embossed transfer resin plate according to claim 1, wherein the temperature in the thermocompression molding is 120 to 190°C.

6. A method for manufacturing an embossed decorative panel, characterized in that an embossed transfer resin plate obtained by the manufacturing method described in claim 1 or 2 is used as a pressing plate.

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