Electronic components and their mounting boards

Abstract

To provide an electronic component and a mounting substrate thereof that can increase the mounting density in a limited space and secure a sufficient insulation distance between left and right metal frames to ensure insulation in a multilayer capacitor using a metal frame.SOLUTION: An electronic component and a mounting substrate thereof according to the present invention includes a main body, first and second external electrodes formed at both ends of the main body in a first direction, respectively, a first metal frame including a first support portion joined to the first external electrode and a first mounting portion extending in the first direction toward the second external electrode at the lower end of the first support portion, and a second metal frame including a second support portion joined to the second external electrode and a second mounting portion extending in the same direction as the first support portion at the lower end of the second support portion.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an electronic component and a mounting board for the electronic component. [Background technology]

[0002] Stacked capacitors are used in a variety of electronic devices because they are small in size yet can achieve high capacitance.

[0003] Recently, with the rapid rise of environmentally friendly vehicles and electric vehicles, the number of power drive systems in automobiles is increasing, which has led to an increase in demand for stacked capacitors required for automobiles.

[0004] For use as an automobile part, high levels of thermal reliability, electrical reliability, and mechanical reliability are required, and therefore the performance required of multilayer capacitors is gradually becoming more sophisticated.

[0005] Therefore, there is a demand for a multilayer capacitor structure that is highly resistant to vibration and deformation.

[0006] As a method for improving durability against such vibration and deformation, electronic components have been disclosed that use a metal frame to mount a multilayer capacitor at a fixed distance from a substrate.

[0007] However, in the case of electronic components using conventional metal frames, the mounting density in a limited space is low, and the insulation distance between the left and right metal frames is not sufficiently secured, resulting in a problem of reduced insulation. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Patent No. 5664574 specification [Patent Document 2] Japanese Patent Application Publication No. 2019-009359

Summary of the Invention

Problems to be Solved by the Invention

[0009] An object of the present invention is to provide an electronic component and a mounting substrate thereof that can increase the mounting density in a limited space and ensure sufficient insulation distance between the left and right metal frames to ensure insulation in a multilayer capacitor using a metal frame.

Means for Solving the Problems

[0010] One aspect of the present invention provides an electronic component including a main body, first and second external electrodes respectively formed at both ends of the main body in a first direction, a first support portion joined to the first external electrode, and a first mounting portion extending in the first direction toward the second external electrode at the lower end of the first support portion, a second support portion joined to the second external electrode, and a second metal frame including a second mounting portion extending in the same direction as the first support portion at the lower end of the second support portion.

[0011] In one embodiment of the present invention, when the shortest distance between the first and second external electrodes is defined as d1 and the shortest distance between the first and second mounting portions is defined as d2, d1 < d2 can be satisfied.

[0012] In one embodiment of the present invention, the main body may include a dielectric layer, and first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween and one end of each being connected to the first and second external electrodes respectively and exposed on both surfaces of the main body in the first direction.

[0013] In one embodiment of the present invention, the first and second external electrodes may each include first and second heads formed on both surfaces of the main body in the first direction, and first and second band portions respectively extending from the first and second heads to a part of the upper and lower surfaces and a part of both side surfaces of the main body.

[0014] In one embodiment of the present invention, the first and second metal frames may have the first and second support portions joined to the first and second heads of the first and second external electrodes, respectively, and the first and second mounting portions spaced apart from the main body and the first and second band portions.

[0015] In one embodiment of the present invention, the semiconductor device may further include a first conductive bonding layer disposed between the first external electrode and the first support, and a second conductive bonding layer disposed between the second external electrode and the second support.

[0016] In one embodiment of the present invention, the semiconductor device may further include first and second plating layers formed on the surfaces of the first and second external electrodes, respectively, and the first and second plating layers may include first and second nickel plating layers covering the first and second external electrodes, respectively, and first and second tin plating layers covering the first and second nickel plating layers, respectively.

[0017] Another aspect of the present invention provides an electronic component mounting board including the electronic component and a substrate having first and second land patterns spaced apart from each other on an upper surface thereof, wherein the electronic component is mounted such that first and second mounting portions of first and second metal frames are connected to the first and second land patterns of the substrate, respectively. [Effects of the Invention]

[0018] According to one embodiment of the present invention, the first and second mounting portions of the first and second metal frames are formed to extend in the same direction, thereby providing an advantage that the insulation distance can be further secured compared to a structure in which the first and second mounting portions both extend toward the inside of the main body, and that the mounting area can be reduced compared to a structure in which the first and second mounting portions both extend toward the outside of the main body. [Brief explanation of the drawings]

[0019] [Figure 1]1 is a perspective view schematically illustrating a multilayer capacitor applied to an embodiment of the present invention; [Figure 2] 2(a) and 2(b) are plan views showing first and second internal electrodes, respectively, applied to the multilayer capacitor of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] 2 is a perspective view schematically showing a state in which a metal frame is joined to the multilayer capacitor of FIG. 1. FIG. [Figure 5] FIG. 5 is a cross-sectional view taken along line II-II' in FIG. [Figure 6] 1 is a cross-sectional view schematically illustrating an electronic component mounted on a substrate according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0021] Also, throughout the specification, unless specifically stated to the contrary, "comprising" an element means that it can further include other elements, rather than excluding other elements.

[0022] To clearly explain the embodiments of the present invention, directions are defined as follows: X, Y, and Z shown in the drawings represent the length direction, width direction, and thickness direction of the multilayer capacitor and electronic component, respectively.

[0023] Here, the Z direction can be used in the present embodiment in the same concept as the stacking direction in which the dielectric layers are stacked.

[0024] FIG. 1 is a perspective view schematically showing a multilayer capacitor applied to one embodiment of the present invention, FIGS. 2(a) and 2(b) are plan views respectively showing first and second internal electrodes applied to the multilayer capacitor of FIG. 1, and FIG. 3 is a cross-sectional view taken along line II' of FIG.

[0025] First, the structure of a multilayer capacitor 100 applied to the electronic component of this embodiment will be described with reference to FIGS.

[0026] 1 to 3, the multilayer capacitor 100 of this embodiment includes a body 110 and first and second external electrodes 131 and 132 formed on both ends of the body 110 in an X direction defined as a first direction.

[0027] The main body 110 is formed by stacking a plurality of dielectric layers 111 in the Z direction and then firing them, and the boundaries between adjacent dielectric layers 111 of the main body 110 can be so integrated that they are difficult to see without using a scanning electron microscope (SEM).

[0028] The body 110 also includes a plurality of dielectric layers 111, and first and second internal electrodes 121 and 122 having different polarities and alternately arranged in the Z direction with the dielectric layers 111 sandwiched therebetween.

[0029] The body 110 may include an active region that contributes to forming the capacitance of the capacitor, and cover regions 112 and 113 that are provided above and below the active region in the Z direction as margins.

[0030] The main body 110 is not particularly limited in shape, but may be hexahedral, and may include first and second surfaces 1 and 2 facing each other in the Z direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the X direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and facing each other.

[0031] The dielectric layer 111 may include ceramic powder, for example, BaTiO3-based ceramic powder.

[0032] The BaTiO3 ceramic powder is a powder in which Ca, Zr, etc. are partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, but is not limited to this.

[0033] In addition to the ceramic powder, the dielectric layer 111 may contain a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like.

[0034] The ceramic additives may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), or aluminum (Al).

[0035] The first and second internal electrodes 121 and 122 are electrodes to which different polarities are applied, and can be formed on the dielectric layer 111 and stacked in the Z direction, and can be alternately arranged so as to face each other along the Z direction inside the body 110 with one dielectric layer 111 sandwiched between them.

[0036] In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0037] Meanwhile, in the present invention, a structure in which internal electrodes are stacked in the Z direction is illustrated and described, but the present invention is not limited to this and can also be applied to a structure in which internal electrodes are stacked in the Y direction, if necessary.

[0038] The first and second internal electrodes 121 and 122 may have one end exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0039] In this manner, the ends of the first and second internal electrodes 121 and 122 alternately exposed to the third and fourth surfaces 3 and 4 of the body 110 can be electrically connected to the first and second external electrodes 131 and 132, respectively, disposed at both ends of the body 110 in the X direction, as described below.

[0040] With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122.

[0041] At this time, the capacitance of the multilayer capacitor 100 is proportional to the overlapping area of ​​the first and second internal electrodes 121 and 122 that overlap each other along the Z direction in the active region.

[0042] Furthermore, the material for forming the first and second internal electrodes 121, 122 is not particularly limited, but may be a conductive paste made of one or more of a noble metal material, nickel (Ni), and copper (Cu).

[0043] In this case, the conductive paste may be printed by screen printing or gravure printing, but the present invention is not limited thereto.

[0044] The first and second external electrodes 131 and 132 are provided with voltages of different polarities, are arranged at both ends of the body 110 in the X direction, and can be electrically connected to the exposed ends of the first and second internal electrodes 121 and 122, respectively.

[0045] The first external electrode 131 may include a first head portion 131a and a first band portion 131b.

[0046] The first head 131a is disposed on the third surface 3 of the main body 110 and contacts the end of the first internal electrode 121 exposed to the outside on the third surface 3 of the main body 110, thereby serving to physically and electrically connect the first internal electrode 121 and the first external electrode 131 to each other.

[0047] The first band portions 131b are portions that extend from the first head portion 131a to parts of the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110, respectively, in order to improve the fixing strength.

[0048] The second external electrode 132 may include a second head portion 132a and a second band portion 132b.

[0049] The second head 132a is disposed on the fourth surface 4 of the main body 110 and contacts the end of the second internal electrode 122 that is exposed to the outside on the fourth surface 4 of the main body 110, thereby serving to physically and electrically connect the second internal electrode 122 and the second external electrode 132 to each other.

[0050] The second band portion 132b is a portion that extends from the second head portion 132a to a portion of the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110, respectively, in order to improve the fixing strength.

[0051] In this embodiment, the first and second external electrodes 131, 132 are made of sintered electrodes containing at least one metal component selected from copper (Cu), nickel (Ni), etc., but do not contain any precious metals.

[0052] In addition, the first and second external electrodes 131 and 132 may be made of a sintered metal containing copper, and first and second plating layers may be further formed on the surfaces thereof.

[0053] In addition, the first and second plating layers may include first and second nickel plating layers covering the surfaces of the first and second external electrodes 131, 132, and first and second tin (Sn) plating layers covering the first and second nickel plating layers.

[0054] FIG. 4 is a perspective view showing a state in which a metal frame is joined to the multilayer capacitor of FIG. 1, and FIG. 5 is a cross-sectional view taken along line II-II' of FIG.

[0055] 4 and 5, an electronic component 101 of this embodiment includes a multilayer capacitor 100, and first and second metal frames 140 and 150 connected to first and second external electrodes 131 and 132 of the multilayer capacitor 100, respectively.

[0056] The first metal frame 140 includes a first support portion 141 and a first mounting portion 142 .

[0057] The first support portion 141 is formed perpendicular to the mounting surface and is joined to the first head portion 131a of the first external electrode 131, and is electrically and physically connected to the first head portion 131a of the first external electrode 131.

[0058] The first mounting portion 142 is a portion that extends in the X direction, which is the first direction, at the lower end of the first support portion 141 and is formed horizontally relative to the mounting surface, and serves as a connection terminal when mounted on a board.

[0059] In this case, the first mounting portion 142 extends toward the second external electrode 132 in the X direction.

[0060] The first mounting portion 142 is disposed so as to be spaced a predetermined distance from the lower surface of the multilayer capacitor 100 in the Z direction.

[0061] That is, the first mounting portion 142 is disposed to be spaced apart from the first surface 1 of the body 110 of the multilayer capacitor 100 and the lower first and second band portions 131b and 132b by a predetermined distance in the Z direction.

[0062] The second metal frame 150 includes a second support portion 151 and a second mounting portion 152.

[0063] The second support portion 151 is formed perpendicular to the mounting surface and is joined to the second head portion 132a of the second external electrode 132, and is electrically and physically connected to the second head portion 132a of the second external electrode 132.

[0064] The second mounting portion 152 is a portion that extends in the first direction, i.e., the X direction, at the lower end of the second support portion 151, faces the first mounting portion 151 in the X direction, and is formed horizontally relative to the mounting surface, and serves as a connection terminal when mounted on a substrate.

[0065] At this time, the second mounting portion 152 extends in the same direction as the first mounting portion 142 in the X direction.

[0066] The second mounting portion 152 is disposed so as to be spaced a predetermined distance from the lower surface of the multilayer capacitor 100 in the Z direction.

[0067] That is, the second mounting portion 152 is disposed to be spaced apart from the first surface 1 of the body 110 of the multilayer capacitor 100 and the lower first and second band portions 131b and 132b by a predetermined distance in the Z direction.

[0068] A first conductive bonding layer 161 may be disposed between the first external electrode 131 and the first support 141, and a second conductive bonding layer 162 may be disposed between the second external electrode 132 and the second support 151.

[0069] The first conductive adhesive layer 161 may be disposed between the first head 131 a of the first external electrode 131 and the first support portion 141 of the first metal frame 140 .

[0070] In addition, the first conductive bonding layer 161 may be formed to contain the same metal component as the metal component of the first head portion 131a of the first external electrode 131 as a main component.

[0071] The second conductive adhesive layer 162 may be disposed between the second head 132 a of the second external electrode 132 and the second support portion 151 of the second metal frame 150 .

[0072] In addition, the second conductive bonding layer 162 may be formed to contain the same metal component as the metal component of the second head portion 132a of the second external electrode 132 as a main component.

[0073] FIG. 6 is a cross-sectional view schematically showing an electronic component according to an embodiment of the present invention mounted on a substrate.

[0074] Referring to FIG. 6, the mounting board according to this embodiment includes a substrate 210, and first and second land patterns 221 and 222 arranged on an upper surface of the substrate 210 to be spaced apart from each other.

[0075] In this case, the electronic component 101 is mounted on the substrate 210 by connecting the first and second mounting portions 142, 152 of the first and second metal frames 140, 150 in a state where they are positioned so as to be in contact with the first and second land patterns 221, 222, respectively, and can be joined to each other by solders 231, 232 to be electrically and physically connected.

[0076] With conventional multilayer capacitors, the solder used during board mounting causes direct contact between the capacitor body and the board, meaning that heat and mechanical deformation generated by the board are transferred directly to the multilayer capacitor, making it difficult to ensure a high level of reliability.

[0077] However, in this embodiment, the first and second metal frames are bonded to both sides of the multilayer capacitor in the X direction to ensure a gap between the multilayer capacitor and the mounting substrate, thereby preventing stress from the substrate from being directly transmitted to the multilayer capacitor, thereby improving reliability.

[0078] In addition, in the conventional electronic component having a structure in which a metal frame is bonded, the mounting area of ​​the metal frame is formed larger than the mounting area of ​​the external electrodes of a general multilayer capacitor in order to support the upper stacked capacitor and to be stably mounted on the substrate.

[0079] However, when the mounting area of ​​the metal frame increases in this way, the distance between the terminals on both sides, i.e., the creepage distance for insulation, decreases, which can cause problems in high-voltage applications such as automobiles.

[0080] Therefore, a method has been disclosed for reducing the area of ​​the mounting portion of the metal frame in order to ensure the creepage distance of the electronic components joined by the metal frame.

[0081] However, in this case, since the first and second mounting portions of the first and second metal frames are in opposite directions and extend both inside the capacitor body, the insulation distance d2 between both ends of the first and second mounting portions is smaller than the insulation distance d1 between the first and second external electrodes of the multilayer capacitor.

[0082] As a result, the mounting and fixing strength of the multilayer capacitor decreases, and the electronic components mounted on the board are more likely to fall over.

[0083] In another prior art, the first and second mounting portions of the first and second metal frames are both extended outward from the capacitor body to ensure a creepage distance.

[0084] However, in this case, the insulation distance between both ends of the first and second mounting parts becomes longer than the insulation distance between the first and second external electrodes of the multilayer capacitor, and the total length of the electronic component increases by the sum of the length of the multilayer capacitor and the length of the extended mounting part of the metal frame, resulting in a problem of a significant increase in the area required for mounting.

[0085] On the one hand, according to an embodiment of the present invention, the first and second mounting portions 142 and 152 of the first and second metal frames 140 and 150 extend in the same direction.

[0086] At this time, when defining the shortest distance between the first and second external electrodes 131 and 132 as d1 and the shortest distance between the first and second mounting portions 142 and 152 as d2, d1 < d2 can be satisfied.

[0087] Therefore, it is possible to secure an insulation distance between the two-sided metal frames rather than when the first and second mounting portions 142 and 152 both extend inside the main body 110 of the multilayer capacitor 100, and by reducing the mounting area rather than when the first and second mounting portions 142 and 152 both extend outside the main body 110 of the multilayer capacitor 100, it is possible to improve the mounting density in a limited space.

[0088] As described above, the embodiments of the present invention have been described in detail. However, the scope of the present invention is not limited thereto, and it is obvious to those having ordinary knowledge in the art that various modifications and variations are possible within the scope not departing from the technical idea of the present invention described in the claims.

Explanation of Reference Numerals

[0089] 100 Multilayer capacitor 101 Electronic component 110 Main body 111 Dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes 131a, 132a First and second heads 131b, 132b First and second band portions 140, 150 First and second metal frames 141, 151 First and second support portions 142, 152 First and second mounting portions 161, 162 First and second conductive bonding layers

Claims

1. An electronic component, the electronic component comprising: a main body having a first surface and a second surface facing each other in a thickness direction of the electronic component, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a length direction of the electronic component, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a width direction of the electronic component; first and second external electrodes formed at both ends of the body in a first direction, which is the length direction; a first metal frame including a first support portion joined to the first external electrode and a first mounting portion extending from a lower end of the first support portion in a first direction toward the second external electrode; a second metal frame including a second support portion joined to the second external electrode and a second mounting portion extending from a lower end of the second support portion in the same direction as the first mounting portion, the first mounting portion and the second mounting portion are spaced apart from the main body in the thickness direction; When the shortest distance between the first external electrode and the second external electrode is defined as d1 and the shortest distance between the first mounting portion and the second mounting portion is defined as d2, d1<d2 is satisfied. Electronic components.

2. 2. The electronic component of claim 1, wherein the main body includes a dielectric layer and first and second internal electrodes that are alternately arranged with the dielectric layer sandwiched therebetween and that are exposed on both sides of the main body in a first direction so that one end of each electrode is connected to the first and second external electrodes, respectively.

3. 3. The electronic component of claim 1, wherein the first and second external electrodes each include a first and second head portion formed on both sides of the body in a first direction, and a first and second band portion extending from the first and second head portions to portions of the upper and lower surfaces and both side surfaces of the body, respectively.

4. The first and second metal frames are the first and second support parts are joined to the first and second head parts of the first and second external electrodes, respectively; The electronic component according to claim 3 , wherein the first and second mounting portions are spaced apart from the main body and the first and second band portions.

5. 5. The electronic component according to claim 1, further comprising: a first conductive bonding layer disposed between the first external electrode and the first support; and a second conductive bonding layer disposed between the second external electrode and the second support.

6. The first and second external electrodes may further include first and second plating layers formed on the surfaces thereof, respectively; 6. The electronic component according to claim 1, wherein the first and second plating layers respectively include first and second nickel plating layers covering the first and second external electrodes, and first and second tin plating layers covering the first and second nickel plating layers, respectively.

7. an electronic component comprising: a body having a first surface and a second surface facing each other in a thickness direction of the electronic component; a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a longitudinal direction of the electronic component; and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a width direction of the electronic component; first and second external electrodes formed on both ends of the body in a first direction, which is the longitudinal direction; a first metal frame including a first support portion joined to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward a second external electrode in the first direction; and a second metal frame including a second support portion joined to the second external electrode and a second mounting portion extending from a lower end of the second support portion in the same direction as the first mounting portion; a substrate having first and second land patterns spaced apart from each other on an upper surface thereof; The first and second land patterns of the substrate are mounted to be connected to the first and second mounting portions of the first and second metal frames, respectively; the first mounting portion and the second mounting portion are spaced apart from the main body in the thickness direction; When the shortest distance between the first external electrode and the second external electrode is defined as d1 and the shortest distance between the first mounting portion and the second mounting portion is defined as d2, d1<d2 is satisfied. A mounting board for electronic components.

8. The electronic component is 8. The electronic component mounting substrate according to claim 7, wherein the main body includes a dielectric layer and first and second internal electrodes that are alternately arranged with the dielectric layer sandwiched therebetween and that are exposed on both sides of the main body in a first direction so that one end is connected to the first and second external electrodes, respectively.

9. The electronic component is 9. The electronic component mounting board according to claim 7, wherein the first and second external electrodes respectively include first and second head portions formed on both surfaces of the body in a first direction, and first and second band portions extending from the first and second head portions to portions of the upper and lower surfaces and portions of both side surfaces of the body, respectively.

10. The electronic component is 10. The mounting board for electronic components according to claim 9, wherein the first and second support portions are joined to the first and second head portions of the first and second external electrodes, respectively, and the first and second mounting portions are spaced apart from the main body and the first and second band portions.

11. The electronic component is a first conductive bonding layer disposed between the first external electrode and the first support; The electronic component mounting substrate according to claim 7 , further comprising: a second conductive bonding layer disposed between the second external electrode and the second support portion.

12. The electronic component is 12. The mounting board for electronic components according to claim 7, further comprising first and second plating layers formed on surfaces of the first and second external electrodes, respectively, the first and second plating layers comprising first and second nickel plating layers covering the first and second external electrodes, respectively, and first and second tin plating layers covering the first and second nickel plating layers, respectively.

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