Conveyor

Abstract

To transport substrates without directly touching the treated area while improving retention.SOLUTION: A transport unit 1 has a holding surface 31 that holds and transports the backside of a substrate. The transport unit 1 has a holding pad 3 that contacts the annular convexity of the back surface of the substrate and forms a water-filled space between the back surface of the substrate and the holding surface, a moving unit 2 that moves the holding pad 3 in a direction approaching or separating from the back surface, a water supply unit 4 that supplies water to the space, and a suction unit 5 that suctions water filled in the space to improve the force for holding the substrate. The transport unit 1 holds and transports the substrate with the holding pad 3 via the water.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a transfer device for transferring a substrate. Place Regarding. [Background technology]

[0002] In a substrate processing unit, when transporting a substrate, it is required to transport the substrate without touching the processed surface or the area where a device is formed, in order to prevent foreign matter from adhering to the substrate or scratching the substrate.

[0003] For this reason, methods have been developed such as a non-contact transport method that uses the Bernoulli effect, and an edge clamp method that transports by clamping only the outer periphery of the substrate. However, the holding force of the non-contact transport using the Bernoulli effect is weak, and the edge clamp method has the problem of bending the substrate as the substrate size increases.

[0004] Furthermore, in order to transport the substrate without touching the processed surface or the area where devices are formed, a transport device has been developed that provides a gap between the substrate and a holding pad, places a layer of water in this gap, and transports the substrate by holding it on the holding pad using the surface tension of the water (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-252877 Summary of the Invention [Problem to be solved by the invention]

[0006] Furthermore, in an apparatus that has a mechanism for cleaning by rotating a sponge while holding the substrate with a transport unit and pressing it against the opposite surface, a strong holding force is required. However, in transport apparatuses that use a transport pad that utilizes the Bernoulli effect, an edge clamp system, or that hold and transport the substrate on a holding pad using the surface tension of water, the held substrate rotates as the cleaning sponge rotates, which has been a problem, making it impossible to clean the substrate properly.

[0007] Furthermore, with the edge clamping method, the clamping parts get in the way, making it impossible to clean the entire outer periphery of the substrate.

[0008] An object of the present invention is to provide a transfer device capable of transferring a substrate without directly touching the processed area while improving the holding force. Place The purpose is to provide. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems and achieve the object, the transport device of the present invention is a transport device having a holding surface that holds and transports a held surface of a substrate, and includes a holding pad that contacts the outer periphery of the held surface of the substrate or a side surface of the substrate and forms a space filled with water between the held surface of the substrate and the holding surface, a movement unit that moves the holding pad in a direction toward or away from the held surface, a water supply unit that supplies water to the space, and a suction unit that sucks the water filled in the space and improves the force of holding the substrate, and the substrate is held and transported by the holding pad via the water. The suction unit further includes a suction pump connected to the suction source, the space, and the space, and including a control means for sucking a predetermined amount of water filled in the space. It is characterized by:

[0010] Applicable Controls the amount of water filled in the space to be sucked in. The means is, Opening and closing Valve is also good.

[0011] In the conveying device, the moving unit has an arm connected to the holding pad via a suction pump and a lifting unit that raises and lowers the arm, and the suction unit may drive the suction pump as the arm rises and lowers, thereby sucking up the water filled in the space.

[0012] In the transport device, the held surface of the substrate held by the holding pad may have a recess formed in the center and a protrusion surrounding the recess, and the holding pad may be in contact with the protrusion.

[0013] In the transport device, the holding pad has a holding surface facing the held surface, and the holding surface has a second recess formed in the center and a second convex portion surrounding the second recess, and the second convex portion may contact the outer periphery of the held surface of the substrate or the side of the substrate to form a space for supplying water between the holding surface and the substrate.

[0014] The transport device may further include an ultrasonic vibrator that applies vibrations to the water.

[0015] In the transport device, the outer periphery of the holding pad may have one or more suction holes that communicate with a suction source and that suction-hold the outer periphery of the held surface. [Effects of the Invention]

[0017] The present invention has the advantage that the substrate can be transported without directly touching the processed area while improving the holding force. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device including a carry-out unit that is a transport device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing a substrate to be processed by the processing apparatus shown in FIG. [Figure 3] FIG. 3 is a perspective view showing the substrate shown in FIG. 2 after processing. [Figure 4] FIG. 4 is a side view, partially in section, schematically illustrating an example of the configuration of the carry-out unit, which is the transport device according to the first embodiment. [Figure 5] 5 is a plan view of the holding pad of the discharge unit shown in FIG. 4. FIG. [Figure 6] 6 is a perspective view of a holding pad of the discharge unit shown in FIG. 5. FIG. [Figure 7] FIG. 7 is a flowchart showing the flow of the substrate transport method according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional view that schematically shows a state in which the holding pad is positioned above the substrate in the holding pad contact step of the substrate transport method shown in FIG. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a state in which the holding pad shown in FIG. 8 is lowered to come into contact with the annular convex portion of the substrate. [Figure 10] FIG. 10 is a cross-sectional view schematically showing a water supplying step of the substrate transport method shown in FIG. [Figure 11] FIG. 11 is a cross-sectional view schematically showing the suction step of the substrate transport method shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view schematically showing the substrate etc. after the transfer step of the substrate transfer method shown in FIG. [Figure 13] FIG. 13 is a flowchart showing the flow of the substrate transport method according to the second embodiment. [Figure 14] FIG. 14 is a cross-sectional view schematically showing the water supplying step of the substrate transport method shown in FIG. [Figure 15] 15 is a cross-sectional view schematically showing a state in which the holding pad positioned above the substrate is lowered in the holding pad contact step of the substrate transport method shown in FIG. 13. FIG. [Figure 16] FIG. 16 is a cross-sectional view that schematically shows a state in which the holding pad shown in FIG. 15 is lowered to come into contact with the annular convex portion of the substrate. [Figure 17] FIG. 17 is a cross-sectional view schematically showing the suction step of the substrate transport method shown in FIG. [Figure 18] FIG. 18 is a cross-sectional view schematically showing the substrate etc. after the transfer step of the substrate transfer method shown in FIG. [Figure 19] FIG. 19 is a perspective view showing a main part of a carry-out unit according to the first embodiment and the first modification of the second embodiment. [Figure 20] FIG. 20 is a cross-sectional view taken along the line XX-XX in FIG. [Figure 21] FIG. 21 is a cross-sectional view schematically showing a state after both the holding pad contact step and the water supply step in the substrate transport method according to the first embodiment and the first modification of the second embodiment. [Figure 22] FIG. 22 is a cross-sectional view schematically showing a state in which the piston of the suction pump is lowered in the suction step of the substrate transport method according to the first embodiment and the first modification of the second embodiment. [Figure 23] FIG. 23 is a cross-sectional view schematically showing a state in which the piston of the suction pump shown in FIG. 22 is raised to suck in water from within the space. [Figure 24] FIG. 24 is a cross-sectional view schematically showing a carry-out unit according to Modification 2 of the first and second embodiments. [Figure 25] FIG. 25 is a cross-sectional view schematically showing a carry-out unit according to Modification 3 of the first and second embodiments. [Figure 26] FIG. 26 is a cross-sectional view schematically showing a carry-out unit according to Modification 4 of the first and second embodiments. [Figure 27] FIG. 27 is a perspective view of a holding pad of a carry-out unit according to Modification 5 of the first and second embodiments. [Figure 28] FIG. 28 is a cross-sectional view schematically showing a carry-out unit according to Modification 5 of the first and second embodiments. [Figure 29] FIG. 29 is a cross-sectional view schematically showing a carry-out unit according to Modification 6 of the first and second embodiments. [Figure 30] FIG. 30 is a cross-sectional view schematically showing a carry-out unit according to Modification 7 of the first and second embodiments. [Figure 31]31 is a perspective view of the elastic member of the discharge unit shown in FIG. 30 as seen from below. DETAILED DESCRIPTION OF THE INVENTION

[0019] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0020] [Embodiment 1] A carry-out unit 1, which is a transport device according to a first embodiment of the present invention, will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of a processing device including a carry-out unit, which is a transport device according to the first embodiment. FIG. 2 is a perspective view showing a substrate to be processed by the processing device shown in FIG. 1. FIG. 3 is a perspective view showing the substrate shown in FIG. 2 after processing. FIG. 4 is a side view, partially in cross section, schematically showing an example of the configuration of the carry-out unit, which is a transport device according to the first embodiment. FIG. 5 is a plan view of a holding pad of the carry-out unit shown in FIG. 4. FIG. 6 is a perspective view of the holding pad of the carry-out unit shown in FIG. 5.

[0021] (substrate) The carry-out unit 1 according to the first embodiment constitutes a processing apparatus 100 shown in Fig. 1. In the first embodiment, the processing apparatus 100 is a grinding apparatus that grinds a substrate 200 shown in Fig. 2. The substrate 200, which is the object to be processed by the processing apparatus 100 shown in Fig. 1, is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with silicon, sapphire, gallium, or the like as a base material 201. As shown in Fig. 2, the substrate 200 has a device region 210 on a surface 202 of the base material 201, and a peripheral excess region 211 surrounding the device region 210.

[0022] The device region 210 has dividing lines 203 set in a grid pattern on the surface 202 of the substrate 201 and devices 204 formed in each region partitioned by the dividing lines 203 .

[0023] The device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), or a MEMS (Micro Electro Mechanical Systems). The peripheral excess region 211 surrounds the entire device region 210 and is a region on the surface 202 of the substrate 201 where no device 204 is formed.

[0024] Furthermore, in embodiment 1, before the substrate 200 is subjected to grinding processing by the processing apparatus 100, the thickness of the substrate 200 is constant across the device region 210 and the peripheral surplus region 211, and the surface 202 and the back surface 205 (corresponding to the held surface) on the back side of the surface 202 are formed to be in the same plane across the device region 210 and the peripheral surplus region 211.

[0025] In the first embodiment, the back surface 205 of the substrate 200 is ground by the processing apparatus 100 to form a circular recess 206 (corresponding to a recess) on the back surface 205 side of the device region 210, and an annular protrusion 207 (corresponding to a protrusion) that is thicker than the device region 210 is formed in the peripheral surplus region 211, as shown in FIG. 3 , resulting in a so-called TAIKO (registered trademark) wafer. The circular recess 206 is formed in a region that overlaps with the device region 210 on the back surface 205 in the thickness direction, and the annular protrusion 207 is formed in a region that overlaps with the peripheral surplus region 211 on the back surface 205 in the thickness direction. In this specification, the region that overlaps with the device region 210 on the back surface 205 in the thickness direction is referred to as the device region 210 on the back surface 205, and the region that overlaps with the peripheral surplus region 211 on the back surface 205 in the thickness direction is referred to as the peripheral surplus region 211 on the back surface 205.

[0026] As described above, the back surface 205 of the substrate 200 has a circular recess 206 formed in the center and an annular protrusion 207 surrounding the circular recess 206, and a step 208 is formed between the device region 210 and the peripheral surplus region 211. The front surface 202 of the substrate 200 is formed to be flush with the device region 210 and the peripheral surplus region 211. The bottom surface 209 of the circular recess 206 is an area that has been subjected to processing such as grinding by the processing device 100.

[0027] In the first embodiment, the back surface 205 of the substrate 200 is ground by the processing device 100 to form a circular recess 206 and an annular protrusion 207, and a metal film is formed on the bottom surface 209 of the circular recess 206 by plating or the like. After the metal film is formed on the bottom surface 209 of the circular recess 206, the substrate 200 is divided into individual devices 204 along the planned division lines 203 and cut along the outer edge of the circular recess 206 to separate a device region 210 and a peripheral excess region 211, i.e., the circular recess 206 and the annular protrusion 207 are separated.

[0028] (Processing equipment) Next, the processing apparatus 100 will be described. The processing apparatus 100 is a grinding apparatus that grinds the back surface of the substrate 200 to thin the substrate 200 to a predetermined finishing thickness. As shown in Fig. 1, the processing apparatus 100 includes an apparatus main body 101, a rough grinding unit 102, a finish grinding unit 103, a grinding feed unit 104, a turntable 105, a plurality of holding tables 106 (three in the first embodiment) installed on the turntable 105, a cassette 107, an alignment unit 108, a carry-in unit 109, a cleaning unit 110, a carry-in / out unit 111, a control unit 112, and an unloading unit 113 which is a transport device.

[0029] The turntable 105 is a disk-shaped table provided on the upper surface of the apparatus main body 101, and is rotatable around an axis parallel to the Z-axis direction in a horizontal plane, and is driven to rotate at a predetermined timing. On this turntable 105, for example, three holding tables 106 are arranged at equal intervals, for example, at a phase angle of 120 degrees. These three holding tables 106 have a holding table structure in which the holding surfaces are equipped with vacuum chucks connected to a suction source (not shown), and the front surface 202 side of the substrate 200 is placed on the holding surface and is sucked by the suction source, thereby suction-holding the substrate 200 on the holding surface.

[0030] During grinding, these holding tables 106 are rotated in a horizontal plane by a rotary drive mechanism around an axis parallel to the vertical direction, i.e., the Z-axis direction. As the turntable 105 rotates, the holding tables 106 are moved sequentially to the carry-in / out area 301, the rough grinding area 302, the finish grinding area 303, and again to the carry-in / out area 301.

[0031] The loading / unloading area 301 is an area where the substrate 200 is loaded onto and unloaded from the holding table 106, the rough grinding area 302 is an area where the rough grinding unit 102 rough-grinds (corresponding to grinding) the substrate 200 held on the holding table 106, and the finish grinding area 303 is an area where the finish grinding unit 103 finish-grinds (corresponding to grinding) the substrate 200 held on the holding table 106.

[0032] The rough grinding unit 102 is a grinding unit that is equipped with a rough grinding wheel 114 having annularly arranged rough grinding stones 113 for rough grinding, which roughly grind the device region 210 on the back surface 205 of the substrate 200 held on the holding surface of the holding table 106, and that roughly grinds the device region 210 on the back surface 205 of the substrate 200 held on the holding surface of the holding table 106 in the rough grinding region 302. The finish grinding unit 103 is equipped with a finish grinding wheel 116 having annularly arranged finish grinding stones 115 for finish grinding, which finish grind the device region 210 on the back surface 205 of the substrate 200 held on the holding surface of the holding table 106, and that finish grinds the device region 210 on the back surface 205 of the substrate 200 held on the holding surface of the holding table 106 in the finish grinding region 303.

[0033] In the grinding units 102, 103, the grinding wheels 114, 116 are rotated around their axes by the motor 118, and grinding water is supplied to the back surface of the substrate 200 held on the holding table 106 in the grinding areas 302, 303, while the grinding feed unit 104 moves the grinding wheels 113, 115 closer to the holding table 106 at a predetermined feed speed, thereby roughly grinding or finish-grinding the device area 210 on the back surface 205 of the substrate 200 and forming a circular recess 206 and an annular protrusion 207 on the back surface 205.

[0034] The grinding feed unit 104 moves the grinding units 102, 103 in the Z-axis direction to move the grinding units 102, 103 closer to and away from the holding table 106. In the first embodiment, the grinding feed unit 104 is mounted on an upright column 117 that stands from one end of the device body 101 in the Y-axis direction, which is parallel to the horizontal direction. The grinding feed unit 104 includes a well-known ball screw that is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and well-known guide rails that support the spindle housings of the grinding units 102, 103 so that they are movable in the Z-axis direction.

[0035] In embodiment 1, the rough grinding unit 102 and the finish grinding unit 103 are arranged such that the axes of the grinding wheels 114, 116, which are the centers of rotation, and the axes of the holding table 106, which are the centers of rotation, are parallel to each other and spaced apart horizontally, and the grinding wheels 113, 115 pass over the center of the back surface of the substrate 200 held on the holding table 106.

[0036] The cassette 107 is a container having multiple slots for accommodating multiple substrates 200. As shown in FIG. 2, the cassette 107 accommodates multiple substrates 200 before and after grinding. In the first embodiment, a pair of cassettes 107 are provided, each of which is installed on a cassette installation table. The cassette installation table raises and lowers the cassette 107 in the Z-axis direction. The alignment unit 108 is a table on which the substrate 200 removed from the cassette 107 is temporarily placed and its center is aligned.

[0037] The carry-in unit 109 has a suction pad that adsorbs the substrate 200. The carry-in unit 109 adsorbs and holds the substrate 200 before grinding, which has been aligned by the alignment unit 108, and carries it onto the holding table 106 located in the carry-in / out area 301. The cleaning unit 110 cleans the substrate 200 after grinding, and removes contamination such as grinding debris adhering to the ground back surface.

[0038] The carry-in / out unit 111 takes out the substrate 200 before grinding from the cassette 107 and transports the substrate 200 to the alignment unit 108, and also takes out the substrate 200 after grinding from the cleaning unit 110 and transports it to the cassette 107. The carry-in / out unit 111 is, for example, a robot pick equipped with a U-shaped hand 119, and transports the substrate 200 by suction and holding it with the U-shaped hand 119.

[0039] The control unit 112 controls each of the above-mentioned constituent units that make up the processing apparatus 100. In other words, the control unit 112 causes the processing apparatus 100 to execute processing operations on the substrate 200. The control unit 112 is a computer that includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device.

[0040] The arithmetic processing device of the control unit 112 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the machining apparatus 100 to the above-mentioned components of the machining apparatus 100 via the input / output interface device. The control unit 112 is also connected to a display unit configured with a liquid crystal display device or the like that displays the status and images of the machining operation, an input unit used by the operator to register machining content information, and a notification unit that notifies the operator. The input unit is configured with at least one of a touch panel provided on the display unit and a keyboard, etc. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0041] (Export unit) In the first embodiment, the unloading unit 1 suction-holds the back surface 205 of the substrate 200, which is the processed area on the holding surface of the holding table 106 located in the loading / unloading area 301 after grinding, and transports the substrate 200 to the cleaning unit 110. As shown in FIG. 4 , the unloading unit 1 includes a moving unit 2, a holding pad 3, a water supply unit 4, and a suction unit 5.

[0042] 1 , in the X-axis direction, which is parallel to the horizontal direction, the Y-axis direction, which is parallel to the horizontal direction and orthogonal to the X-axis direction, and the Z-axis direction, which is orthogonal to both the X-axis direction and the Y-axis direction and parallel to the vertical direction. In the first embodiment, the moving unit 2 moves the holding pad 3 in a direction approaching or moving away from the substrate 200 held by the holding table 106 located in the loading / unloading area 301. By moving the holding pad 3 along the Z-axis direction, the moving unit 2 moves the holding pad 3 in a direction approaching or moving away from the substrate 200 held by the holding table 106 located in the loading / unloading area 301, and also moves the holding pad 3 horizontally from the holding table 106 located in the loading / unloading area 301 toward the cleaning unit 110.

[0043] 4, the moving unit 2 includes a transfer arm 21 (corresponding to an arm) having a holding pad 3 attached to one end thereof, a rotation shaft 22 whose upper end is attached to the other end of the transfer arm 21 and which is parallel to the Z-axis direction, an elevation unit 23 which connects the lower end of the rotation shaft 22 and raises and lowers the transfer arm 21, and a swivel unit 24 which rotates the elevation unit 23 about an axis parallel to the Z-axis direction. The transfer arm 21 is made of an appropriate metal material, and one end thereof is attached to the holding pad 3 by, for example, a fastening bolt (not shown).

[0044] The lifting unit 23 is formed of, for example, an air cylinder, and is connected to a rotary shaft 22 attached to the other end of the transfer arm 21, and moves the transfer arm 21 up and down along the Z-axis direction via the rotary shaft 22. The turning unit 24 includes a pulse motor that can rotate forward and backward, and turns the transfer arm 21 about the rotary shaft 22 via the lifting unit 23 and the rotary shaft 22. Therefore, the lifting unit 23 and the turning unit 24 can position the holding pad 3 attached to one end of the transfer arm 21 above the back surface 205 of the substrate 200 placed on the holding surface of the holding table 106 located in the loading / unloading area 301.

[0045] As shown in FIGS. 5 and 6 , the holding pad 3 is formed in the shape of a thick disk whose outer diameter is equal to or greater than the outer diameter of the substrate 200. In the first embodiment, the outer diameter of the holding pad 3 is equal to the outer diameter of the substrate 200, but it may be formed to be larger than the outer diameter of the substrate 200. Having the holding pad 3 larger than the outer diameter of the substrate 200 has the advantage of making it easier to seal the space 220 between the holding pad 3 and the back surface 205 (the surface to be held) even if the transfer arm 21 is misaligned, thereby enabling the holding pad 3 to exert its holding force. The holding pad 3 is formed to a uniform thickness, and in the first embodiment, is made of a hard resin such as PEEK. In the present invention, the holding pad 3 may be made of a highly hydrophilic material such as titanium oxide, glass, or aluminum.

[0046] The holding pad 3 also has a holding surface 31 that faces the back surface 205 of the substrate 200 on the holding surface of the holding table 106 located in the carry-in / out area 301 and holds and transports the back surface 205 of the substrate 200. In the first embodiment, the holding surface 31 is the lower surface of the substrate 200. When the holding surface 31 of the holding pad 3 comes into contact with the upper surface of the annular convex portion 207 of the substrate 200, it maintains a liquid-tight seal between the holding surface 31 and the upper surface of the annular convex portion 207. In the present invention, the holding surface 31 of the holding pad 3 may be coated with an elastic resin such as rubber to maintain a more liquid-tight seal between the holding surface 31 and the back surface 205 of the substrate 200. As described above, since the holding pad 3 has the holding surface 31 that holds the back surface 205 of the substrate 200, the back surface 205 of the substrate 200 is the surface to be held by the holding pad 3 of the substrate 200.

[0047] The holding pad 3 is positioned by the moving unit 2 above the back surface 205 of the substrate 200 on the holding surface of the holding table 106 located in the loading / unloading area 301, and then lowers to contact the upper surface of the annular convex portion 207, which is the outer periphery of the back surface 205 of the substrate 200 on the holding surface of the holding table 106, and forms a space 220 (shown in Figure 9) between the holding pad 3 and the bottom surface 209 of the circular concave portion 206 on the back surface 205 of the substrate 200, into which water 6 (shown in Figure 10) is filled.

[0048] The water supply unit 4 supplies water 6 to the space 220. As shown in FIG. 4, the water supply unit 4 includes a supply hole 41, a water supply source 42, a supply pipe 43, and an on-off valve 44. The supply hole 41 is a hole that penetrates the holding pad 3 in the Z-axis direction. In the first embodiment, as shown in FIG. 5, a plurality of supply holes 41 (three in the first embodiment) are provided at the center of the holding pad 3 and at the outer edge of the holding pad 3, spaced apart in the circumferential direction.

[0049] The water supply source 42 supplies water 6 (pure water in the first embodiment) to the space 220 described above via the supply holes 41, etc. The supply pipe 43 is a cylindrical pipe, and in the first embodiment is made of a flexible resin, etc. In the first embodiment, the supply pipe 43 includes a plurality of branch pipes 431, one end of which is connected to each of the supply holes 41 and the other ends of which are connected to one another, and a single trunk pipe 432, the other ends of which are connected to the water supply source 42 and the branch pipes 431. In the first embodiment, one end of the branch pipe 341 of the supply pipe 43 is attached to the upper surface 32 on the back side of the holding surface 31 of the holding pad 3.

[0050] On-off valve 44 is provided in main pipe 432, and when open, supplies water 6 from water supply source 42 to space 220, and when closed, stops the supply of water 6 from water supply source 42 to space 220. Water supply unit 4 fills space 220 with water 6 while holding surface 31 of holding pad 3 is in contact with annular convex portion 207 of substrate 200, so that substrate 200 is held on holding surface 31 of holding pad 3 by the surface tension of water 6 filled in space 220, without holding surface 31 coming into contact with bottom surface 209 of circular recess 206.

[0051] The suction unit 5 sucks the water 6 filled in the space 220, thereby improving the force holding the substrate 200. The suction unit 5 includes a suction pump 51 including an on-off valve that sucks a fixed amount. The suction pump 51 including an on-off valve that sucks a fixed amount is connected to a suction source 53 and the space 220 through a through-hole 52 that penetrates the holding pad 3, and sucks the water 6 filled in the space 220. In the first embodiment, the suction pump 51 including an on-off valve that sucks a fixed amount is a so-called constant discharge pump (also called a suck valve) that sucks a predetermined amount of water 6 from the space 220 by being sucked by the suction source 53 and stops sucking the water 6 when the predetermined amount of water 6 has been sucked from the space 220. If too much water 6 filled in the space 220 is sucked, the substrate 200 will bend. Therefore, it is necessary to select a suction pump 51 that is suitable for the size of the substrate 200 and the depth and diameter of the circular recess 206.

[0052] In the first embodiment, the suction pump 51 is attached to the upper surface 32 of the holding pad 3. In the first embodiment, as shown in Figures 5 and 6, the suction pump 51 is provided between the center of the upper surface 32 of the holding pad 3 and the supply holes 41 provided on the outer edge, and a plurality of suction pumps 51 (three in the first embodiment) are provided at intervals in the circumferential direction of the holding pad 3. That is, in the first embodiment, the suction unit 5 is provided with a plurality of suction pumps 51 (three in the first embodiment). By providing a plurality of suction pumps 51 at intervals, suction is performed evenly at a plurality of locations, which has the effect of minimizing the risk of the substrate 200 being unevenly sucked and deformed when suctioned, and attracting it to the holding pad 3.

[0053] (Substrate transport method) Next, a substrate transport method according to embodiment 1 will be described. Fig. 7 is a flowchart showing the flow of the substrate transport method according to embodiment 1. The substrate transport method is a method in which the back surface 205 of the substrate 200 is held by the holding surface 31 of the holding pad 3 and transported. In embodiment 1, the substrate transport method is a method in which the aforementioned carry-out unit 1 holds the back surface 205 of the substrate 200 after grinding on the holding surface 31 of the holding table 106 located in the carry-in / out area 301 by the holding surface 31 of the holding pad 3 and transports the substrate to the cleaning unit 110.

[0054] As shown in FIG. 7, the substrate transport method according to the first embodiment includes a holding pad contact step 1001, a water supply step 1002, a suction step 1003, and a transport step 1004.

[0055] (Holding pad contact step) Figure 8 is a cross-sectional view schematically showing a state in which the holding pad is positioned above the substrate in the holding pad contact step of the substrate transport method shown in Figure 7. Figure 9 is a cross-sectional view schematically showing a state in which the holding pad shown in Figure 8 is lowered to contact the annular convex portion of the substrate. The holding pad contact step 1001 is a step in which the annular convex portion 207 on the back surface 205 of the substrate 200 and the holding surface 31 of the holding pad 3 are brought into contact with each other to form a space 220 to be filled with water 6.

[0056] In holding pad contact step 1001, control unit 112 stops suction holding of holding table 106, which is located in load / unload area 301 and holds substrate 200 that has been ground. In holding pad contact step 1001, control unit 112 controls moving unit 2 of unloading unit 1 to raise holding pad 3, and positions holding pad 3 in the raised state above substrate 200 on the holding surface of holding table 106, which is located in the load / unload area, as shown in FIG.

[0057] In the holding pad contact step 1001, the control unit 112 controls the moving unit 2 of the unloading unit 1 to lower the holding pad 3, and as shown in Figure 9, brings the holding surface 31 of the holding pad 3 into contact with the annular protrusion 207 of the substrate 200 on the holding surface of the holding table 106 located in the loading / unloading area, thereby maintaining a liquid-tight seal between the holding surface 31 of the holding pad 3 and the upper surface of the annular protrusion 207 of the substrate 200, thereby forming the aforementioned space 220.

[0058] (Water supply step) Fig. 10 is a cross-sectional view schematically showing the water supplying step of the substrate transport method shown in Fig. 7. The water supplying step 1002 is a step of supplying water 6 to the rear surface 205 of the substrate 200. In the first embodiment, the water supplying step 1002 is a step of filling the space 220 with water 6 after the support pad contact step 1001.

[0059] In the first embodiment, in the water supplying step 1002, the control unit 112 opens the on-off valve 44, and fills the space 220 formed between the bottom surface 209 of the circular recess 206 on the rear surface 205 and the holding surface 31 of the holding pad 3 with water 6, as shown in Fig. 10. In the first embodiment, in the water supplying step 1002, once the space 220 is filled with water 6, the control unit 112 closes the on-off valve 44. Then, the substrate 200 is held on the holding pad 3 by the surface tension of the water 6 filled in the space 220.

[0060] (Suction step) Fig. 11 is a cross-sectional view schematically showing the suction step of the substrate transport method shown in Fig. 7. The suction step 1003 is a step for sucking the water 6 filled in the space 220 to improve the force with which the holding pad 3 holds the substrate 200.

[0061] In the suction step 1003, the control unit 112 drives the suction pumps 51, causing each suction pump 51 to suck in a predetermined amount of water 6 filled in the space 220 and discharge it into the water supply source 42. As a result, the pressure of the water 6 filled in the space 220 becomes lower than the pressure outside the space 220, and the pressure difference between the inside and outside of the space 220 presses the substrate 200 against the holding surface 31 of the holding pad 3, causing the holding surface 31 of the holding pad 3 to come into close contact with the upper surface of the annular protrusion 207 of the substrate 200, thereby improving the force with which the holding pad 3 holds the substrate 200.

[0062] (Transport step) Fig. 12 is a cross-sectional view schematically showing the substrate etc. after the transport step of the substrate transport method shown in Fig. 7. Transport step 1004 is a step of transporting the substrate 200 held on the holding surface 31 of the holding pad 3 after the suction step 1003.

[0063] In the first embodiment, in the transport step 1004, the control unit 112 controls the moving unit 2 to raise the holding pad 3, and then rotates the transport arm 21 about the rotation axis 22, so that the unloading unit 1 transports the substrate 200 held by the holding pad 3 to the cleaning unit 110. In this manner, the unloading unit 1 transports the substrate 200 while holding it with the holding pad 3 via the water 6 filled in the space 220. This allows the unloading unit 1 to transport the substrate 200 without the holding pad 3 coming into contact with the bottom surface 209 of the circular recess 206 of the substrate 200, thereby preventing scratches on the bottom surface 209 of the circular recess 206 of the substrate 200 and preventing foreign matter from adhering to the bottom surface 209. Therefore, the unloading unit 1 can prevent a decrease in the flexural strength of the device 204 due to scratches on the bottom surface 209 of the circular recess 206 of the substrate 200.

[0064] 12, the cleaning brush 120 rotating around the axis of the holding pad 3 comes into contact with the surface 202 of the substrate 200 transported to the cleaning unit 110, and the surface 202 and the like are cleaned by the cleaning unit 110. After cleaning, the substrate 200 is transported to the cassette 107 by the carry-in / out unit 111 and stored in the cassette 107.

[0065] As described above, the carry-out unit 1 according to the first embodiment transports the substrate 200 while holding it on the holding pad 3 due to the surface tension of the water 6 filled in the space 220, and is equipped with the suction pump 51 that sucks the water 6 filled in the space 220 to increase the force with which the holding pad 3 holds the substrate 200, so that the annular convex portion 207 on the back surface 205 of the substrate 200 is brought into close contact with the holding surface 31 of the holding pad 3 and the substrate 200 can be held and transported. Furthermore, the carry-out unit 1 according to the first embodiment transports the substrate 200 while holding it on the holding pad 3 due to the surface tension of the water 6 filled in the space 220, so the substrate 200 can be transported without the holding surface 31 of the holding pad 3 coming into contact with the bottom surface 209 of the circular recess 206 of the substrate 200.

[0066] As a result, the carry-out unit 1 according to the first embodiment has an advantage that the substrate 200 can be transported without directly touching the bottom surface 209 of the circular recess 206 that has been subjected to processing such as grinding, while improving the holding force.

[0067] Furthermore, the unloading unit 1 according to the first embodiment transports the substrate 200 while holding it on the holding pad 3 by the surface tension of the water 6 filled in the space 220, and is equipped with a suction pump 51 that sucks up the water 6 filled in the space 220 to improve the force with which the holding pad 3 holds the substrate 200. Therefore, by creating a negative pressure in the space 220 below atmospheric pressure through suction, a force is generated that presses the substrate 200 against the holding pad 3 due to atmospheric pressure, and the holding force for holding the substrate 200 can be improved beyond the holding force in non-contact transport due to the Bernoulli effect.

[0068] As a result, the unloading unit 1 according to the first embodiment has an improved holding force compared to that of non-contact transport using the Bernoulli effect, and further has the effect of being able to transport the substrate 200 without directly touching the bottom surface 209 of the circular recess 206, which has been subjected to processing such as grinding.

[0069] Furthermore, the carry-out unit 1 according to the first embodiment can improve the holding force for holding the substrate 200 compared to the holding force of non-contact transport using the Bernoulli effect, so even when the cleaning brush 120 is brought into contact with the surface 202 of the substrate 200 to clean the surface 202 of the substrate 200, the substrate 200 can be prevented from rotating along with the cleaning brush 120. The carry-out unit 1 according to the first embodiment holds the substrate 200 by bringing the annular protrusion 207 into close contact with the holding surface 31 of the holding pad 3, so that the holding pad 3 can be prevented from interfering with the cleaning operation of the cleaning brush 120. Furthermore, because the space between the holding pad 3 and the substrate 200 is filled with water 6, the risk of the substrate 200 bending or cracking is reduced even when the cleaning brush 120 is pressed against it.

[0070] The substrate transport method according to embodiment 1 has the advantage that the substrate 200 can be transported without directly touching the bottom surface 209 of the circular recess 206, which has been subjected to processing such as grinding, while improving the holding force, because the aforementioned unloading unit 1 transports the substrate 200.

[0071] [Embodiment 2] A substrate transport method according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 13 is a flowchart showing the flow of the substrate transport method according to the second embodiment. FIG. 14 is a cross-sectional view schematically showing the water supply step of the substrate transport method shown in FIG. 13. FIG. 15 is a cross-sectional view schematically showing the state in which the holding pad positioned above the substrate is lowered in the holding pad contact step of the substrate transport method shown in FIG. 13. FIG. 16 is a cross-sectional view schematically showing the state in which the holding pad shown in FIG. 15 is lowered and brought into contact with the annular convex portion of the substrate. FIG. 17 is a cross-sectional view schematically showing the suction step of the substrate transport method shown in FIG. 13. FIG. 18 is a cross-sectional view schematically showing the substrate and other components after the transport step of the substrate transport method shown in FIG. 13. Note that in FIGS. 13, 14, 15, 16, 17, and 18, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.

[0072] In the second embodiment, the substrate transport method is the same as in the first embodiment, in which the unloading unit 1 holds the back surface 205 of the ground substrate 200 on the holding surface 31 of the holding table 106 located in the loading / unloading area 301 with the holding surface 31 of the holding pad 3, and transports the substrate to the cleaning unit 110. As shown in Figure 13, the substrate transport method according to the second embodiment includes a water supplying step 1002-2, a holding pad contacting step 1001-2, a suction step 1003, and a transporting step 1004, and is the same as that of the first embodiment except that the holding pad contacting step 1001-2 is performed after the water supplying step 1002-2. Thus, in the present invention, the substrate transport method may perform either the water supplying steps 1002 and 1002-2 or the holding pad contacting steps 1001 and 1001-2 first.

[0073] In the second embodiment, the water supplying step 1002-2 is a step of supplying water 6 to the back surface 205 of the substrate 200, as in the first embodiment. In the second embodiment, the water supplying step 1002-2 is a step of filling the circular recess 206, i.e., the space 220, with water 6 before the holding pad contacting step 1001-2. In the second embodiment, in the water supplying step 1002-2, the control unit 112 stops suction holding of the holding table 106, which is located in the loading / unloading area 301 and holds the substrate 200 that has been ground. In the water supplying step 1002-2, the control unit 112 controls the moving unit 2 of the unloading unit 1 to lift the holding pad 3, and position the lifted holding pad 3 above the substrate 200 on the holding surface of the holding table 106, which is located in the loading / unloading area, as shown in FIG.

[0074] In the second embodiment, in the water supply step 1002-2, the control unit 112 opens the on-off valve 44 to fill the water 6 inside the circular recess 206 on the back surface 205, as shown in Fig. 14. In the second embodiment, in the water supply step 1002-2, once the water 6 has been filled into the circular recess 206, the control unit 112 closes the on-off valve 44.

[0075] In the second embodiment, the holding pad contact step 1001-2 is a step in which the annular convex portion 207 on the rear surface 205 of the substrate 200 is brought into contact with the holding surface 31 of the holding pad 3 to form a space 220 filled with water 6, as in the first embodiment. In the second embodiment, in the holding pad contact step 1001-2, the control unit 112 controls the moving unit 2 of the carry-out unit 1 to lower the holding pad 3 as shown by the arrow in FIG.

[0076] 16 , in holding pad contact step 1001-2, control unit 112 brings holding surface 31 of holding pad 3 into contact with annular convex portion 207 of substrate 200 on the holding surface of holding table 106 located in the loading / unloading area, thereby maintaining a liquid-tight seal between holding surface 31 of holding pad 3 and annular convex portion 207 of substrate 200, thereby forming the aforementioned space 220. Then, substrate 200 is held by holding pad 3 due to the surface tension of water 6 filled in space 220.

[0077] In embodiment 2, after the holding pad contact step 1001-2, the control unit 112 sequentially performs the suction step 1003 and the transport step 1004 shown in FIG. 17, as in embodiment 1, and in embodiment 2, the substrate 200 transported to the cleaning unit 110 has its surface 202 and the like cleaned by the cleaning brush 120 of the cleaning unit 110, as shown in FIG. 18, as in embodiment 1.

[0078] As in the first embodiment, the substrate transport method according to the second embodiment has the advantage that the substrate 200 can be transported without directly touching the bottom surface 209 of the circular recess 206, which has been subjected to processing such as grinding, while improving the holding force, because the substrate 200 is transported by the aforementioned unloading unit 1.

[0079] [Variation 1] A carry-out unit 1-1 and a substrate transport method according to Modification 1 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 19 is a perspective view showing a main part of a carry-out unit according to Modification 1 of Embodiment 1 and Embodiment 2. FIG. 20 is a cross-sectional view taken along line XX-XX in FIG. 19. FIG. 21 is a cross-sectional view schematically showing a state after both the holding pad contact step and the water supply step of the substrate transport method according to Modification 1 of Embodiment 1 and Embodiment 2. FIG. 22 is a cross-sectional view schematically showing a state in which the piston of the suction pump has been lowered in the suction step of the substrate transport method according to Modification 1 of Embodiment 1 and Embodiment 2. FIG. 23 is a cross-sectional view schematically showing a state in which the piston of the suction pump shown in FIG. 22 has been raised to suck in water from the space. Note that in FIGS. 19, 20, 21, 22, and 23, the same parts as those in Embodiment 1 are designated by the same reference numerals, and their description will be omitted.

[0080] 19 , in the carry-out unit 1-1 according to the first modification, the transport arm 21 of the moving unit 2 is connected to the holding pad 3 via the suction pump 51-1 of the suction unit 5 and a circular intermediate member 25. One end of the transport arm 21 is attached to the intermediate member 25. That is, in the carry-out unit 1-1 according to the first modification, the moving unit 2 has the transport arm 21 connected to the holding pad 3 via the suction pump 51-1, and the intermediate member 25 connected to the suction pump 51-1 and the transport arm 21, and the suction pump 51-1 of the suction unit 5 is attached to the holding pad 3.

[0081] As shown in FIG. 20, the suction pump 51-1 of the suction unit 5 of the unloading unit 1-1 according to the first modified example includes a cylindrical cylinder 511 attached to the upper surface 32 of the holding pad 3, a piston 512 that is movable in the Z-axis direction within the cylinder 511, and a piston rod 513 that has its lower end attached to the piston 512 and its upper end attached to the intermediate member 25 and that moves in the Z-axis direction together with the piston 512.

[0082] Cylinder 511 is formed in a cylindrical shape, and the inside thereof communicates with through-hole 52 and space 220. In embodiment 1, cylinder 511 is attached to upper surface 32 of holding pad 3 with screws 514. Piston 512 is provided on its outer circumferential surface with O-ring 515 that maintains a liquid-tight seal between the piston and the inner surface of cylinder 511.

[0083] One end of the piston rod 513 is formed integrally with the piston 512, and the other end is attached to the intermediate member 25 through a through-hole 516 provided at the upper end of the cylinder 511. In the first embodiment, the piston rod 513 is attached to the intermediate member 25 by a screw 517.

[0084] In addition, in the first modification, the suction unit 5 is provided between the cylinder 511 of the suction pump 51-1 and the upper surface of the holding pad 3, and includes an annular seal member 518 that keeps the gap liquid-tight.

[0085] After both the holding pad contact steps 1001, 1001-2 and the water supply steps 1002, 1002-1 of the substrate transport method according to variant 1, as shown in FIG. 21, the holding pad 3 comes into contact with the annular protrusion 207 of the substrate 200 to form a space 220, which is filled with water 6, and the piston 512 of the suction pump 51-1 is positioned at the upper end of the cylinder 511.

[0086] In suction step 1003 of the substrate transport method according to Modification 1, the control unit 112 controls the moving unit 2 to further lower the transport arm 21, and to lower the intermediate member 25 and the piston 512 of the suction pump 51-1, as shown in FIG. 22 , while the holding pad 3 remains in contact with the annular protrusion 207 of the substrate 200. In suction step 1003 of the substrate transport method according to Modification 1, the piston 512 of the suction pump 51-1 is lowered to exhaust the air inside the cylinder 511 to the outside of the cylinder 511, thereby removing the air from the cylinder 511. Note that the gap between the holding pad 3 and the upper surface of the annular protrusion 207 of the substrate 200 is not completely sealed at this stage, so the air inside the cylinder 511 is exhausted outside the space 220 through the gap.

[0087] In the suction step 1003 of the substrate transport method according to the first modification, when the piston 512 of the suction pump 51-1 is positioned at the lower end of the cylinder 511 as shown in Fig. 22, the control unit 112 controls the moving unit 2 to raise the transport arm 21, and thereby raise the intermediate member 25 and the piston 512 of the suction pump 51-1, as shown in Fig. 23. Then, the suction pump 51-1 sucks the water 6 filled in the space 220, and the pressure of the water 6 filled in the space 220 becomes lower than the pressure outside the space 220. The pressure difference between the inside and outside of the space 220 presses the substrate 200 against the holding surface 31 of the holding pad 3, and the holding surface 31 of the holding pad 3 and the annular convex portion 207 of the substrate 200 come into close contact with each other, thereby improving the force with which the holding pad 3 holds the substrate 200.

[0088] In the substrate transport method in which the unloading unit 1-1 transports the substrate 200 according to the first modification, after the piston 512 of the suction pump 51-1 is positioned at the top dead center in the cylinder 511 in the suction step 1003, the control unit 112 continues to control the moving unit 20 to continue raising the transport arm 21, thereby performing the transport step 1004. Thus, in the first modification, the suction unit 5 drives the suction pump 51-1 in accordance with the raising and lowering of the transport arm 21, and sucks the water 6 filled in the space 220.

[0089] The unloading unit 1-1 according to the first modification holds the substrate 200 on the holding pad 3 by the surface tension of the water 6 filled in the space 220, and is equipped with a suction pump 51-1 that sucks up the water 6 filled in the space 220 to improve the holding force of the holding pad 3 for the substrate 200. As a result, similar to the first embodiment, etc., the effect is achieved that the holding force is improved while the substrate 200 can be transported without directly touching the bottom surface 209 of the circular recess 206 that has been subjected to processing such as grinding.

[0090] Furthermore, in the carry-out unit 1-1 according to the first modification, the suction pump 51-1 sucks the water 6 filled in the space 220 as the transfer arm 21 moves up and down, so the suction pump 51-1 can be linked to the operation of the moving unit 2 to suck the water 6 in the space 220. If too much water 6 filled in the space 220 is sucked, the substrate 200 will bend, so the amount of suction needs to be adjusted depending on the size of the substrate 200 and the depth and diameter of the circular recess 206. However, in the first modification, the amount of water 6 to be sucked can be adjusted by adjusting the amount by which the transfer arm 21 is raised, so even if the size of the substrate 200 or the depth or diameter of the circular recess 206 changes, the amount of water 6 to be sucked can be easily adjusted without having to replace the suction pump 51-1.

[0091] [Variation 2] A carry-out unit 1-2 according to Modification 2 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 24 is a cross-sectional view schematically showing a carry-out unit according to Modification 2 of Embodiment 1 and Embodiment 2. In Fig. 24, the same parts as those in Embodiment 1 are denoted by the same reference numerals, and their description will be omitted.

[0092] As shown in Figure 24, in the unloading unit 1-2 of variant example 2, the outer diameter of the holding pad 3-2 is formed to be larger than the outer diameter of the substrate 200, and the holding surface 31 of the holding pad 3-2 has a second recess 33 formed in the center and whose outer edge contacts the upper surface of the annular protrusion 207 of the substrate 200, and a second protrusion 34 surrounding the second recess 33 and formed to protrude further toward the holding table 106 located in the loading / unloading area 301 than the second recess 33.

[0093] In the holding pad contact steps 1001 and 1001-2, the outer edge of the second recess 33 on the holding surface 31 of the carry-out unit 1-2 according to Modification 2 comes into contact with the upper surface of the annular protrusion 207 on the back surface 205 of the substrate 200, and the second protrusion 34 comes into contact with the outer surface 212 (corresponding to the side) of the substrate 200, thereby forming the aforementioned space 220 through which water 6 is supplied between the holding surface 31 and the substrate 200. Note that the holding pad 3-2 of the carry-out unit 1-2 according to Modification 2 is provided with an O-ring 35 that comes into contact with the outer surface 212 of the substrate 200 on the inner surface of the second protrusion 34 to maintain a liquid-tight seal between the inner surface of the second protrusion 34 and the outer surface 212. In Modification 2, the O-ring 35 is made of an elastic resin such as rubber.

[0094] The carry-out unit 1-2 according to the second modification holds the substrate 200 on the holding pad 3-2 by the surface tension of the water 6 filled in the space 220, and includes a suction pump 51 that sucks the water 6 filled in the space 220. This allows the annular convex portion 207 on the back surface 205 of the substrate 200 to be brought into close contact with the second concave portion 33 of the holding surface 31, thereby achieving the effect of improving the holding force while allowing the substrate 200 to be transported without directly touching the bottom surface 209 of the circular concave portion 206 that has been subjected to processing such as grinding, as in the first embodiment. Furthermore, the carry-out unit 1-2 according to the second modification holds the substrate 200 by the outer edge of the second concave portion 33 of the holding surface 31 contacting the upper surface of the annular convex portion 207 on the back surface 205 of the substrate 200 and the second convex portion 34 contacting the outer surface 212 (corresponding to the side surface) of the substrate 200, thereby preventing the held substrate 200 from shifting sideways relative to the holding pad 3.

[0095] [Variation 3] A carry-out unit 1-3 according to Modification 3 of Embodiments 1 and 2 of the present invention will be described with reference to the drawings. Fig. 25 is a cross-sectional view schematically showing a carry-out unit according to Modification 3 of Embodiments 1 and 2. In Fig. 25, the same parts as those in Embodiment 1 are denoted by the same reference numerals, and their description will be omitted.

[0096] The carry-out unit 1-3 according to the third modification holds and transports a substrate 200 in which the thickness of the base material 201 is constant across the device region 210 and the peripheral excess region 211 and both the front surface 202 and the back surface 205 of the base material 201 are flat. As shown in Fig. 25 , the carry-out unit 1-3 according to the third modification has a holding pad 3-3 whose outer diameter is equal to the outer diameter of the substrate 200, and a holding surface 31 of the holding pad 3-3 which has a second recess 33 formed in the center and facing the central portion of the substrate 200 with a gap therebetween, and a second protrusion 34 which surrounds the second recess 33 and is formed protruding further toward the holding table 106 located in the carry-in / out region 301 than the second recess 33 and comes into contact with the outer periphery of the back surface 205 of the substrate 200.

[0097] In the holding pad contact steps 1001, 1001-2, the second convex portion 34 of the holding surface 31 of the carrying-out unit 1-3 according to Modification 3 comes into contact with the outer periphery of the upper surface of the back surface 205 of the substrate 200, thereby forming the aforementioned space 220 for supplying water 6 between the holding surface 31 and the substrate 200. The holding pad 3-3 of the carrying-out unit 1-3 according to Modification 3 is provided with an O-ring 36 that comes into contact with the outer periphery of the substrate 200 on the second convex portion 34 to maintain a liquid-tight seal between the second convex portion 34 and the outer periphery of the substrate 200. In Modification 3, the O-ring 36 is made of an elastic resin such as rubber.

[0098] The unloading unit 1-3 according to the third modification holds the substrate 200 on the holding pad 3 by the surface tension of the water 6 filled in the space 220, and is equipped with a suction pump 51 that sucks up the water 6 filled in the space 220. This allows the outer periphery of the back surface 205 of the substrate 200 to be brought into close contact with the second convex portion 34 of the holding surface 31, and as with the first embodiment, etc., has the effect of improving the holding force while transporting the substrate 200 without directly touching the bottom surface 209 of the circular recess 206 that has been subjected to processing such as grinding.

[0099] [Variation 4] A carry-out unit 1-4 according to Modification 4 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 26 is a cross-sectional view schematically showing a carry-out unit according to Modification 4 of Embodiment 1 and Embodiment 2. In Fig. 26, the same parts as those in Embodiment 1 are denoted by the same reference numerals, and their description will be omitted.

[0100] The carry-out unit 1-4 according to the fourth modification holds and transports a substrate 200 in which the thickness of the base material 201 is constant across the device region 210 and the peripheral excess region 211 and both the front surface 202 and the back surface 205 of the base material 201 are flat. As shown in Fig. 26 , the carry-out unit 1-4 according to the fourth modification has a holding pad 3-4 whose outer diameter is larger than that of the substrate 200, and a holding surface 31 of the holding pad 3-4 which has a second recess 33 formed in the center and facing the back surface 205 of the substrate 200 with a gap therebetween, and a second protrusion 34 which surrounds the second recess 33 and is formed to protrude further toward the holding table 106 located in the carry-in / out region 301 than the second recess 33.

[0101] In the holding pad contact steps 1001, 1001-2 of the holding pad 3-4 of the carry-out unit 1-4 according to Modification 4, the second recess 33 of the holding surface 31 faces the back surface 205 of the substrate 200 with a gap therebetween, and the second protrusion 34 contacts the outer surface 212 of the substrate 200, thereby forming the aforementioned space 220 through which water 6 is supplied between the holding surface 31 and the substrate 200. Note that the holding pad 3-4 of the carry-out unit 1-4 according to Modification 4 is provided with an O-ring 35 on the inner surface of the second protrusion 34 that contacts the outer surface 212 of the substrate 200 to maintain a liquid-tight seal between the inner surface of the second protrusion 34 and the outer surface 212. In Modification 4, the O-ring 35 is made of an elastic resin such as rubber.

[0102] The carry-out unit 1-4 according to the fourth modification holds the substrate 200 on the holding pad 3-4 by the surface tension of the water 6 filled in the space 220, and includes a suction pump 51 that sucks the water 6 filled in the space 220. This allows the inner surface of the second protrusion 34 of the holding surface 31 to be tightly attached to the outer surface 212 of the substrate 200, and similarly to the first embodiment, etc., it has the effect of being able to transport the substrate 200 without directly touching the bottom surface 209 of the circular recess 206 that has been subjected to processing such as grinding, while suppressing deflection. Furthermore, the carry-out unit 1-4 according to the fourth modification holds the substrate 200 by contacting the second protrusion 34 with the outer surface 212 (corresponding to the side surface) of the substrate 200, so that the held substrate 200 can be prevented from shifting sideways relative to the holding pad 3.

[0103] [Variation 5] A carry-out unit 1-5 according to Modification 5 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 27 is a perspective view of a holding pad of the carry-out unit according to Modification 5 of Embodiment 1 and Embodiment 2. Fig. 28 is a cross-sectional view schematically showing the carry-out unit according to Modification 5 of Embodiment 1 and Embodiment 2. In Figs. 27 and 28, the same parts as those in Embodiment 1 are designated by the same reference numerals, and their description will be omitted.

[0104] 27 and 28, the carry-out unit 1-5 according to Modification 5 is the same as the above-described embodiments and modifications, except that it includes an ultrasonic vibrator 7 that applies vibrations to the water 6 filled between the holding pad 3 and the substrate 200. Note that although FIGS. 27 and 28 show the case where the holding pad 3 is the same as in Embodiments 1 and 2, in the present invention, the holding pads 3-2, 3-3, and 3-4 according to Modifications 2, 3, and 4 may also be used.

[0105] The unloading unit 1-5 according to Modification 5 holds the substrate 200 on the holding pad 3, as in the first and second embodiments. An ultrasonic vibrator 7 is installed on the holding pad 3. In the example shown in FIGS. 27 and 28, the ultrasonic vibrator 7 is attached to the bottom surface of a cylindrical member 71 that is attached to the center of the holding pad 3, is closed at the bottom, and has an opening at the top. The bottom surface of the cylindrical member 71 is located on the same plane as the holding surface 31. After the ultrasonic vibrator 7 is disposed on the top surface of the cylindrical member 71, the opening at the top is covered with a plate-like object 72 or the like. In the example shown in FIGS. 27 and 28, a voltage is applied to the ultrasonic vibrator 7 to vibrate while the holding pad 3 of the unloading unit 1-5 is transporting the substrate 200, and the ultrasonic vibrator 7 vibrates the water 6, thereby cleaning the back surface 205, which is the held surface of the substrate 200, and removing contaminants.

[0106] The carry-out unit 1-5 according to the fifth modification holds the substrate 200 on the holding pad 3 by the surface tension of the water 6 filled in the space 220, and includes a suction pump 51 that sucks the water 6 filled in the space 220, so that the substrate 200 can be held and transported by bringing the annular convex portion 207 on the back surface 205 of the substrate 200 into close contact with the holding surface 31 of the holding pad 3. Furthermore, the carry-out unit 1-5 according to the fifth modification holds the substrate 200 on the holding pad 3 by the surface tension of the water 6 filled in the space 220, so that the substrate 200 can be transported without the holding surface 31 of the holding pad 3 coming into contact with the bottom surface 209 of the circular recess 206 of the substrate 200.

[0107] Furthermore, the carry-out unit 1-5 according to the fifth modification vibrates the water 6 filled between the holding pad 3 and the substrate 200 during transport, thereby removing foreign matter and grinding debris adhering to the bottom surface 209, which is the surface to be ground. Furthermore, by cleaning the bottom surface 209, which is the surface to be ground, during transport, the carry-out unit 1-5 according to the fifth modification can reduce the cleaning of the substrate 200 that was conventionally performed in the cleaning unit 110 after transporting the substrate 200 that has been ground to the cleaning unit 110, or shorten the cleaning time of the substrate 200.

[0108] In particular, the carry-out unit 1-5 according to Modification 5 transports a substrate 200 that is a so-called TAIKO (registered trademark) wafer, which has a circular recess 206 formed in the center of the back surface 205 side and an annular convex portion 207 formed on the outer periphery surrounding the circular recess 206. As a result, the carry-out unit 1-5 according to Modification 5 has a problem in that contaminants such as foreign matter and grinding chips that accumulate at the boundary 213 between the annular convex portion 207 and the circular recess 206 are difficult to remove by conventional cleaning methods, but since it is equipped with the ultrasonic vibrator 7 that vibrates the water 6, it is possible to remove contaminants from the boundary 213.

[0109] [Variation 6] A carry-out unit 1-6 according to Modification 6 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 29 is a cross-sectional view that schematically shows a carry-out unit according to Modification 6 of Embodiment 1 and Embodiment 2. In Fig. 29, the same parts as those in Embodiment 1 etc. are denoted by the same reference numerals, and description thereof will be omitted.

[0110] 29, the carry-out unit 1-6 according to the sixth modification is the same as the fifth modification, except that an annular elastic member 37 having a predetermined thickness is provided around the entire periphery of the outer periphery 311 (corresponding to the outer periphery of the holding pad 3) of the holding surface 31 of the holding pad 3 that faces the annular protrusion 207 of the substrate 200. Note that while Fig. 29 shows the case where the holding pad 3 is the same as in the first and second embodiments, in the present invention, the holding pads 3-2, 3-3, and 3-4 according to the second, third, and fourth modifications may also be used.

[0111] The annular elastic member 37 is made of an elastic resin such as rubber. In the sixth modification, the outer diameter of the elastic member 37 is equal to the outer diameter of the holding pad 3 and the outer diameter of the substrate 200, and the inner diameter is equal to the inner diameter of the annular protrusion 207 of the substrate 200; however, the width of the elastic member 37 may be smaller or larger than the annular protrusion 207 as long as it can tightly contact the annular protrusion 207 and the holding pad 3. The carry-out unit 1-6 according to the sixth modification brings the annular protrusion 207 of the substrate 200 into tight contact with the elastic member 37 provided on the outer periphery 311, holds the substrate 200 on the holding pad 3, and vibrates the water 6 in the space 220 by the ultrasonic vibrator 7 during transport.

[0112] In addition to the effects of variant 5, the discharge unit 1-6 of variant 6 seals the space 220 filled with water 6 by bringing the annular convex portion 207, which is the outer periphery of the substrate 200, into contact with the annular elastic member 37, and the elastic member 37 increases the frictional resistance of the holding pad 3 against the substrate 200, preventing the holding pad 3 from shifting from the substrate 200, improving adhesion, and suppressing lateral shifting of the substrate 200 due to vibrations from the ultrasonic vibrator 7.

[0113] [Variation 7] A carry-out unit 1-7 according to Modification 7 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 30 is a cross-sectional view schematically showing a carry-out unit according to Modification 7 of Embodiment 1 and Embodiment 2. Fig. 31 is a perspective view of the elastic member of the carry-out unit shown in Fig. 30, viewed from below. In Figs. 30 and 31, the same parts as in Embodiment 1 are designated by the same reference numerals, and description thereof will be omitted.

[0114] As shown in Fig. 30, the carry-out unit 1-7 according to Modification 7 is the same as Modification 6, except that it has suction holes 8 communicating with a second suction source 81 (corresponding to a suction source) in annular elastic members 37 provided around the entire periphery of the outer periphery 311 of the holding surface 31 of the holding pad 3 that faces the annular convex portion 207 of the substrate 200. Note that Fig. 30 shows the case where the holding pad 3 is the same as in Embodiments 1 and 2, but in the present invention, it may also be the holding pads 3-2, 3-3, and 3-4 of Modifications 2, 3, and 4. The second suction source 81 is a suction source separate from the suction source 53 described above.

[0115] 31, the suction holes 8 are formed in the widthwise center of the elastic member 37, penetrating the elastic member 37 in the thickness direction, and are arranged at equal intervals in the circumferential direction of the elastic member 37. The suction holes 8 are connected to a second suction source 81 via holes (not shown) provided in the holding pad 3. The suction holes 8 are provided in the elastic member 37, and are therefore provided in the outer circumferential portion 311 of the holding surface 31 of the holding pad 3. In the present invention, it is sufficient that one or more suction holes 8 are provided.

[0116] The carry-out unit 1-7 according to the seventh modification adheres the annular convex portion 207 of the substrate 200 to the elastic member 37, and also sucks the suction holes 8 using the second suction source 81, thereby suction-holding the annular convex portion 207 of the back surface 205 of the substrate 200 to the elastic member 37. In this way, the suction holes 8 suck and hold the annular convex portion 207 of the substrate 200. The carry-out unit 1-7 according to the seventh modification vibrates the water 6 in the space 220 using the ultrasonic vibrator 7 during transport.

[0117] As in variant 6, the discharge unit 1-7 of variant 7 seals the space 220 filled with water 6 by bringing the annular convex portion 207, which is the outer periphery of the substrate 200, into contact with the annular elastic member 37, and the elastic member 37 increases the frictional resistance of the holding pad 3 against the substrate 200, preventing the holding pad 3 from shifting from the substrate 200, improving adhesion, and suppressing lateral shifting of the substrate 200 due to vibrations from the ultrasonic vibrator 7.

[0118] Furthermore, even if the substrate 200 having the circular recess 206 and the annular protrusion 207 formed thereon is warped, the carry-out unit 1-7 according to the seventh modification sucks and holds the annular protrusion 207 of the substrate 200 to the elastic member 37 through the suction holes 8, so that the elastic member 37 adheres to and tightly contacts the annular protrusion 207 of the substrate 200, thereby correcting (or alleviating) the warpage of the substrate 200. As a result, the carry-out unit 1-7 according to the seventh modification can also transport the warped substrate 200 having the circular recess 206 and the annular protrusion 207 formed thereon.

[0119] Furthermore, even if the substrate 200 having the circular recess 206 and the annular protrusion 207 formed thereon is warped, the carry-out unit 1-7 according to the seventh modification corrects (or reduces) the warpage, holds the substrate 200 on the holding pad 3, and vibrates the water 6 in the space 220 with the ultrasonic vibrator 7 during transport to clean the inner surfaces of the circular recess 206 and the annular protrusion 207. As a result, the carry-out unit 1-7 according to the seventh modification can suppress cracks on the rear surface 205 of the substrate 200 during cleaning.

[0120] In the present invention, the carry-out units 1-2 and 1-3 according to the second and third modifications may have a suction hole 8 in the O-ring 35, which is connected to the second suction source 81, similar to the seventh modification.

[0121] In the present invention, the discharge unit 1-7 according to the seventh modification may have the suction holes 8 in the outer periphery 311 of the holding surface 31 of the holding pad 3 without providing the elastic member 37.

[0122] In Modifications 5, 6, and 7, the ultrasonic vibrator 7 vibrates the water 6 while the substrate 200 is being transported. However, in the present invention, after the transport step in which the unloading units 1-5, 1-6, and 1-7 transport the substrate 200 from the holding table 106 to the cleaning unit 110 and the holding step in which the substrate 200 is placed on or sucked and held in the cleaning unit 110 are performed, the ultrasonic vibrator 7 provided on the holding pad 3 may be vibrated to vibrate the water 6 while the substrate 200 is placed on the holding table of the cleaning unit 110. This configuration also has the effect of improving the cleaning power compared to conventional cleaning, and further, since the substrate 200 is held in the cleaning unit 110, it is possible to more reliably prevent the substrate 200 from falling.

[0123] In the fifth, sixth and seventh variants, the substrate 200 is a TAIKO (registered trademark) wafer, but unlike the TAIKO (registered trademark) wafer, the circular recess 206 and the annular protrusion 207 are not formed, and the thickness of the base material 201 is constant throughout the device region 210 and the peripheral excess region 211, except for the unevenness of the pattern formed in the device region 210, and both the front surface 202 and the back surface 205 of the base material 201 are approximately flat, so the substrate 200 may be held and transported.

[0124] In addition, in the conveying units 1-2, 1-3, 1-4, 1-5, 1-6, and 1-7 according to the above-mentioned variants 2, 3, 4, 5, 6, and 7, the suction unit 5 is equipped with the same suction pump 51 as in embodiment 1, etc., but the suction unit 5 may also be equipped with the same suction pump 51-1 as in variant 1.

[0125] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, the processing apparatus 100 is not limited to the grinding apparatus described in the embodiment. It may also be various other apparatuses, such as a cutting apparatus that holds the substrate 200 on a chuck table and cuts it along the planned division line with a cutting blade, a laser processing apparatus that irradiates the substrate 200 with a laser beam having a wavelength that is transparent or absorbent to the substrate 200, a polishing apparatus that polishes the substrate 200, a bite cutting apparatus that cuts the substrate 200 with a bite, a plasma apparatus that performs plasma etching or the like on the substrate 200, a tape application apparatus that applies adhesive tape to the substrate 200, or an inspection apparatus that holds the substrate 200 with a transparent body and inspects the front surface 202 and back surface 205 of the substrate 200.

[0126] Furthermore, in the present invention, the substrate 200 is not limited to the wafer described in the embodiments, etc., but may also be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, or a substrate containing at least one of nickel and iron, etc. [Explanation of symbols]

[0127] 1, 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, 1-7 Unloading unit (transport device) 2 Mobile Units 3,3-2,3-3,3-4 Retaining pad 4 Water Supply Unit 5 Suction unit 6 water 7 Ultrasonic transducer 8 suction hole 21 Transfer arm (arm) 23 Lifting unit 31 Holding surface 33 Second recess 34 Second protrusion 51,51-1 Suction pump 53 Suction source 81 2nd suction source (suction source) 200 boards 205 Back side (held side) 206 Circular recess (recess) 207 Annular convex part (outer periphery, convex part) 209 Bottom (treated area) 212 External surface (side) 220 Space 311 Outer periphery 1001,1001-2 Retaining pad contact step 1002,1002-2 Water supply step 1003 Suction step

Claims

1. A transport device having a holding surface that holds and transports a substrate on a held surface, a holding pad that comes into contact with the outer periphery of the held surface of the substrate or a side surface of the substrate, and forms a space that is filled with water between the held surface of the substrate and the holding surface; a moving unit that moves the holding pad in a direction toward or away from the held surface; a water supply unit that supplies water to the space; a suction unit that sucks the water filled in the space and increases the force that holds the substrate, The substrate is transported through the water while being held by a holding pad, and The suction unit comprises: The conveying device further comprises a suction pump connected to the suction source, the space, and the suction pump including a control means for sucking a constant amount of water filled in the space.

2. A conveying device as described in claim 1, characterized in that the means for controlling the suction of a certain amount of water filled in the space is an opening / closing valve.

3. The mobile unit an arm connected to the holding pad via a suction pump; a lifting unit that lifts and lowers the arm, The suction unit comprises:

2. The conveying device according to claim 1, wherein the suction pump is driven as the arm moves up and down to suck the water filled in the space.

4. the held surface of the substrate that is held by the holding pad has a recess formed in the center and a protrusion surrounding the recess, 2. The transport device according to claim 1, wherein the support pad contacts the protrusion.

5. The holding pad is a holding surface facing the held surface; The holding surface is a second recess formed in the center; a second protrusion surrounding the second recess, The transport device according to claim 1, characterized in that the second convex portion contacts the outer periphery of the held surface of the substrate or the side of the substrate, forming a space for supplying water between the holding surface and the substrate.

6. The conveying device is 2. The conveying device according to claim 1, further comprising an ultrasonic vibrator for applying vibrations to the water.

7. 2. The conveying device according to claim 1, wherein the outer periphery of the holding pad has one or more suction holes that communicate with a suction source and that suck and hold the outer periphery of the held surface.

Images