Light source module, detection device, and terminal device

Abstract

The present application discloses a light source module, a detection device, and a terminal device that solve the problem that the temperature instability of the light source in the light source module of the prior art causes the central wavelength of the transmitted optical signal to shift. The light source module and the device can be applied to fields such as autonomous driving, intelligent driving, or optical display. The light source module includes a light source component configured to transmit an optical signal, a cooling component stacked with the light source component, and a storage structure including at least one first sidewall, the at least one first sidewall accommodating at least a part of the cooling component. The heat of the light source component can be cooled by using the cooling component, and the heat conduction to the light source component can be further weakened or blocked (in other words, stopped) by using the storage component. Thus, the light source component can remain in a stable temperature range, and the light source component can further maintain a stable central wavelength and a stable light emission power.

Description

[Technical Field]

[0001] The present application relates to the field of sensor technology, in particular to light source modules, detection devices, and terminal devices. [Background technology]

[0002] With the development of laser technology, devices using laser technology, such as lidar devices and head-up devices (HUDs), are becoming increasingly widespread. Devices using laser technology include laser light sources. As temperature changes, the central wavelength of a laser light source changes. The central wavelength is the wavelength corresponding to the center position of the full width at half maximum (FWHM) of the spectrum obtained through measurement of a laser light source at a specific temperature and rated power. FWHM, also known as full width at half maximum, half width, half peak width, or half height width, is the peak width at half the height of the spectral peak, i.e., the corresponding wavelength difference obtained when the intensity on both sides of the spectral peak decreases to half of the peak value. In a scenario, the temperature of a laser light source increases over time during operation. When the temperature of the laser light source increases, the central wavelength of the optical signal transmitted by the laser light source shifts toward longer wavelengths. When the temperature of the laser light source decreases, the central wavelength of the optical signal transmitted by the laser light source shifts toward shorter wavelengths. In addition, as the temperature increases, the luminous power output by the laser light source decreases. Therefore, in order to obtain a stable center wavelength and light emission power, it is important to improve the temperature stability of the laser light source during the packaging process. Especially when the laser light source is applied to a scenario with frequent temperature changes, there are even higher requirements for the temperature stability and reliability of the laser light source.

[0003] Therefore, how to improve the temperature stability of laser light sources is a technical problem that needs to be urgently solved. Summary of the Invention

[0004] The present application provides a light source module, a detection device, and a terminal device for improving the temperature stability of a light source component in the light source module.

[0005] According to a first aspect, the present application provides a light source module. The light source module includes a light source component, a cooling component, and a storage structure. The storage structure includes at least one first sidewall that accommodates at least a portion of the cooling component. The cooling component is stacked over the light source component.

[0006] It should be noted that the light source module may also be referred to as an optical module, a laser transmission module, etc.

[0007] Based on the light source module, the heat of the light source component can be cooled by using a cooling component, and the heat conduction to the light source component can be further weakened or blocked (in other words, stopped) by using a storage component, so that the light source component can stay in a stable temperature range, and the light source component can further maintain a stable center wavelength and a stable light emission power.

[0008] Specifically, during an operation process of a device in which the light source module is disposed, the light source component is configured to transmit an optical signal, and the cooling component is configured to conduct heat from the light source component. The heat from the light source component may include, but is not limited to, heat generated by operation of the light source component, heat from the environment in which the light source component is disposed, and / or heat generated by a structure surrounding the light source component. The first sidewall is configured to attenuate or block heat conducted to the light source component. The heat conducted to the light source component includes at least a portion of the return heat of the light source component.

[0009] In one possible implementation, the containment structure further includes a bottom plate, the bottom plate being in contact with the first end of the first side wall. Optionally, the bottom plate and the first side wall may be in direct contact or indirect contact.

[0010] The first sidewall may be supported by a base plate, and the base plate and the first sidewall may together form a structure that encloses at least a portion of the cooling component.

[0011] In a possible implementation, the thermal conductivity of the material of the bottom plate is higher than the thermal conductivity of the material of the first sidewall.

[0012] The first side wall formed by a material with low thermal conductivity can effectively weaken or block heat conduction to the light source component, and the bottom plate formed by using a material with high thermal conductivity can further conduct the heat of the light source component outward, that is, can improve the heat dissipation effect of the light source component.

[0013] Specifically, the thermal conductivity of the material of the first sidewall is less than a second threshold, where the second threshold is related to the cooling range of the cooling component and the heat returned by the first sidewall. It can also be understood that the thermal conductivity of the material of the first sidewall can reduce the heat conducted to the light source component as much as possible. Even if a small amount of heat is conducted to the light source component, effective temperature control can be achieved by re-cooling the cooling component. Therefore, the light source component is within a stable temperature range.

[0014] Furthermore, optionally, the material of the first side wall may be a thermal insulating material and / or the material of the bottom plate may be a thermally conductive material.

[0015] The first side wall is formed by using a heat insulating material, which can effectively block or weaken the heat conducted to the light source component, and the heat of the light source component can be effectively dissipated through the bottom plate formed by a heat conducting material.

[0016] For example, the material of the first sidewall may include any one of glass or acrylic, or a combination of the two. The material of the bottom plate may include, but is not limited to, Kovar alloy, tungsten copper alloy, Invar, copper, etc.

[0017] In a possible implementation, the first side wall is of a "strip" type, an "L" type (including an "L-shaped" type), etc. It can be appreciated that when the first side wall is of a "strip" type, the structure of the first side wall is easy to manufacture, thereby simplifying packaging of the light source module.

[0018] Two exemplary manners of connection between the second end of the first sidewall and the light source component are described below.

[0019] Mode 1: The second end of the first side wall is connected to the light source component by using a structural adhesive, and the second end of the first side wall is opposite to the first end of the first side wall.

[0020] The first sidewall and the light source component are connected by using a structural adhesive, which helps to improve the strength of the light source module and can further increase the heat of the light source component being transferred to the outside of the light source component.

[0021] Mode 2: The second end of the first side wall is also connected to the light source component through welding.

[0022] By welding the second end of the first side wall to the light source component, the strength of the light source module is improved.

[0023] In a possible implementation, the containment structure further includes at least one second sidewall, the at least one second sidewall including at least a portion of the first sidewall. Further, optionally, the at least one second sidewall can further house at least a portion of the light source component.

[0024] The second sidewall serves to further reduce heat conduction to the light source component. Additionally, the second sidewall may be used to surround at least a portion of the first sidewall, further surrounding at least a portion of the light source component.

[0025] Furthermore, optionally, the second sidewall may be taller than the light source component or may be the same height as the light source component, in this manner the second sidewall may also accommodate the light source component.

[0026] In a possible implementation, the bottom plate and the second side wall are integrally formed.

[0027] Based on this, the structure obtained through the integration of the bottom plate and the second sidewall may be referred to as a package housing. The first sidewall, the cooling component, and the light source component may be packaged in the package housing.

[0028] In a possible implementation, the second sidewall is higher than the first sidewall.

[0029] When the second sidewall is set to be higher than the first sidewall, the second sidewall can accommodate as much of the first sidewall as possible. When the light source module further includes a shielding cover, the second sidewall helps to prevent the shielding cover from contacting the light source component.

[0030] Further, optionally, the shielding cover is electrically connected to the bottom plate or the second side wall. In this way, electromagnetic radiation can be blocked for the light source module.

[0031] In a possible implementation, a thermally conductive adhesive is filled between the base plate and the support component, the support component being configured to support the light source module, and / or a thermally conductive adhesive is filled between the base plate and the cooling component.

[0032] The thermally conductive adhesive is filled between the bottom plate and the supporting component and / or between the bottom plate and the cooling component, which helps to further improve the heat dissipation effect of the light source component.

[0033] It should be noted that the support component may be a component specialized for supporting and dissipating heat from the light source module, such as a thermally conductive support or a heat sink, or may be another structure surrounding the light source module that is capable of supporting and dissipating heat from the light source module.

[0034] In yet another possible implementation, the base plate includes an opening through which the cooling component is in contact with the support component. Furthermore, the cooling component can be in direct or indirect contact with the support component. For example, a thermally conductive adhesive is filled between the cooling component and the support component.

[0035] The cooling component is in contact with the support component, so the cooling component can directly conduct the heat of the light source component outward. In this way, the heat dissipation path is shorter and the heat of the light source component can be effectively conducted outward from the light source component.

[0036] Additionally, optionally, a structural adhesive is filled between the non-opening area of ​​the base plate and the support component.

[0037] By filling the non-opening area of ​​the base plate with a structural adhesive between the support component and the base plate, the strength of the light source module is improved.

[0038] In a possible implementation, the light source component includes a light source and a substrate, where the substrate drives the light source and transmits the optical signal.

[0039] In a possible implementation, the difference between any two of the coefficient of thermal expansion of the substrate, the coefficient of thermal expansion of the second sidewall, and the coefficient of thermal expansion of the first sidewall is less than a first threshold. Herein, the difference is limited to less than the first threshold, thereby matching the three coefficients of thermal expansion. For example, the first threshold may be 10 parts per million (ppm), where 1 ppm is 1 part per million.

[0040] In this manner, it can be ensured that the coefficients of thermal expansion of the first sidewall, the second sidewall, and the substrate are matched, which helps to avoid problems such as fracture or warping, which occur at different temperatures and are caused by differences between the coefficients of thermal expansion of the first sidewall, the substrate, and the second sidewall.

[0041] In a possible implementation, the light source comprises a laser diode, which has advantages such as high efficiency, small size, and long lifetime.

[0042] According to a second aspect, the present application provides a detection device, the detection device including the light source module of the first aspect or any one of the implementations of the first aspect.

[0043] In a possible implementation, the detection device may further include a receiving module configured to receive an echo signal corresponding to the optical signal, in which case the echo signal is used to obtain association information of the target detected by the detection device.

[0044] For example, the detection device may be a LIDAR device. Further, optionally, the target association information may include, but is not limited to, target range information, target direction, target speed, and / or target grayscale information.

[0045] In another possible implementation, the detection device may further include an image acquisition module configured to acquire image information.

[0046] For example, the detection device may be a fusion sensor, which is a sensor that combines the functions of a lidar device and a camera.

[0047] According to a third aspect, the present application provides a terminal device, the terminal device including the detection device of the second aspect or any one of the implementations of the second aspect.

[0048] Furthermore, optionally, the terminal device may further include a processor configured to plan a driving route based on the association information and / or image information of the target.

[0049] In possible implementations, the terminal device may include, but is not limited to, a vehicle (e.g., an unmanned vehicle, an intelligent vehicle, an electric vehicle, or a digital vehicle), a robot, a surveying / mapping device, an unmanned aerial vehicle, a smart home device (e.g., a robot vacuum cleaner), a smart manufacturing device (e.g., an industrial device), a smart transportation device (e.g., an automated guided vehicle (AGV), an unmanned transport vehicle, or a truck), etc.

[0050] According to a fourth aspect, the present application provides an optical display device, the optical display device including the light source module of the first aspect or any one of the implementations of the first aspect.

[0051] For example, optical display devices may include, but are not limited to, in-vehicle displays, head-up devices (HUDs), near eye display (NED) devices, projectors, and smart home devices (e.g., smart desk lamps, sound systems, smart lighting systems, appliance control systems, home background music, home theater systems, intercom systems, or video surveillance). [Brief explanation of the drawings]

[0052] [Figure 1a] 1 is a schematic diagram of a possible application scenario according to the present application; [Figure 1b]FIG. 1 is a schematic diagram of another possible application scenario according to the present application. [Figure 1c] FIG. 1 is a schematic diagram of yet another possible application scenario according to the present application. [Figure 1d] FIG. 1 is a schematic diagram of yet another possible application scenario according to the present application. [Figure 1e] FIG. 1 is a schematic diagram of yet another possible application scenario according to the present application. [Figure 1f] 1 is a schematic diagram of a further possible application scenario according to the present application; [Figure 2] 1 is a schematic diagram of the structure of a light source module according to the present application; [Figure 3] 1 is a schematic diagram of the cooling principle of a TEC according to the present application; [Figure 4a] 1 is a schematic diagram of the structure of a containment structure according to the present application; [Figure 4b] 1 is a schematic diagram of the structure of another containment structure according to the present application; [Figure 4c] 10 is a schematic diagram of the structure of yet another containment structure according to the present application. [Figure 4d] 10 is a schematic diagram of the structure of yet another containment structure according to the present application. [Figure 4e] 10 is a schematic diagram of yet another containment structure according to the present application; [Figure 4f] 1 is a schematic diagram of the structure of a further containment structure according to the present application; [Figure 4g] 10 is a schematic diagram of a structure of yet a further containment structure according to the present application; [Figure 5a] 2 is a schematic diagram of the positional relationship between a first side wall and a bottom plate according to the present application; FIG. [Figure 5b] 1 is a schematic diagram of the positional relationship between a first side wall, a light source module, and a bottom plate according to the present application; [Figure 5c] 10 is a schematic diagram of another positional relationship between a first side wall, a light source module, and a bottom plate according to the present application. [Figure 6a] 1 is a schematic diagram of the positional relationship between the base plate and the cooling component according to the present application. [Figure 6b]10 is a schematic diagram of yet another positional relationship between a base plate and a cooling component according to the present application. [Figure 7a] 10 is a schematic diagram of a structure of yet a further containment structure according to the present application; [Figure 7b] 10 is a schematic diagram of a structure of a still further containment structure according to the present application. [Figure 8] 1 is a schematic diagram of the construction of a shielding cover and containment structure according to the present application; [Figure 9] 1 is a schematic diagram of the structure of another light source module according to the present application; [Figure 10] 10 is a schematic diagram of the structure of yet another light source module according to the present application; [Figure 11] FIG. 1 is a schematic diagram of the structure of a lidar device according to an embodiment of the present application. [Figure 12] FIG. 1 is an exemplary functional block diagram of a vehicle according to the present application. DETAILED DESCRIPTION OF THE INVENTION

[0053] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0054] Some terms in this application are described below. Please note that these descriptions are intended to facilitate understanding by those skilled in the art, but do not constitute a limitation on the scope of protection claimed in this application.

[0055] 1. Thermal conductivity

[0056] Thermal conductivity, also known as the thermal conductivity coefficient or thermal conductivity, is a physical quantity that indicates the heat conduction ability of a substance.

[0057] 2. Coefficient of thermal expansion (CTE)

[0058] The coefficient of thermal expansion is a physical quantity that indicates the degree of thermal expansion of a substance, and usually refers to the relative change in length or size of an object of unit length or unit size when the temperature rises by 1°C.

[0059] 3.Insulation materials

[0060] Thermal insulation materials are materials that are capable of blocking or reducing the transfer of heat, also called thermal barrier materials.

[0061] Above we have described some terms used in this application, and below we will describe possible application scenarios of this application.

[0062] It should be noted that the light source module in this application may also be referred to as an optical module, a laser transmission module, etc. All modules including functional components and structures in this application fall within the scope of protection of this application. It can be understood that the light source module is merely an exemplary term.

[0063] In a possible application scenario, the light source module in the present application may be integrated into a lidar device, and the lidar device may be installed in a vehicle. The vehicle may be, for example, an unmanned vehicle, an intelligent vehicle, an electric vehicle, or a digital vehicle. The lidar device may be deployed in various positions on the vehicle. For example, the lidar device may be deployed in any one or more of four directions—front, rear, left, and right—to capture information about the environment around the vehicle. FIG. 1a shows an example in which a lidar device is deployed in front of a vehicle. The lidar device may sense a sector-shaped area indicated by a dashed frame in FIG. 1a, which may be referred to as a lidar detection area. The principle of target detection using a lidar device is as follows: The lidar device transmits an optical signal in a specific direction. If a target is present in the detection area of ​​the lidar device, the target may reflect the received optical signal back to the lidar device (the reflected light may be referred to as an echo signal), and the lidar device then determines information about the target based on the echo signal. Based on the optical signals transmitted by the lidar device, the lidar device may acquire information (e.g., the distance to the target, the moving speed of the target, or the posture of the target) about the vehicle's latitude, longitude, speed, and direction, or about targets (e.g., other surrounding vehicles or obstacles) within a certain range, in real time or periodically. The lidar device or vehicle may determine the vehicle's position based on the acquired information and perform route planning, etc. For example, the vehicle's position may be determined based on the longitude and latitude, or the vehicle's driving direction and destination for a subsequent period may be determined based on the speed and direction, or the number and density of obstacles around the vehicle may be determined based on the distance to surrounding objects. Furthermore, optionally, unmanned, autonomous, assisted, intelligent driving, etc. of the vehicle may be performed based on the functions of an advanced driving assistance system (ADAS).

[0064] It should be noted that the lidar device installed in the vehicle in the above description is merely an example. For example, the lidar device may be installed in an unmanned aerial vehicle as an airborne radar. As another example, the lidar device may also be installed in a roadside unit (RSU) as a roadside traffic lidar device and may perform intelligent road-to-vehicle cooperative communication. As another example, the lidar device may be installed in an automated guided vehicle (AGV). An AGV is a transportation vehicle equipped with an automatic navigation device, such as an electromagnetic navigation device or an optical navigation device, and is capable of traveling along a predetermined navigation route and performing security protection and various transportation functions.

[0065] In another possible application scenario, the light source module in the present application may alternatively be integrated into a head-up device (HUD). See FIG. 1b. FIG. 1b is described using an example in which the HUD is installed in a vehicle. The HUD may project a formed image (called a HUD virtual image) into the driver's forward field of view. The image may be fused with real road surface information to enhance the driver's perception of the actual driving environment. For example, the HUD may superimpose a HUD virtual image conveying navigation information and / or instrument information (e.g., vehicle speed, rotational speed, temperature, and fuel amount) onto the real environment outside the vehicle, thereby allowing the driver to obtain an augmented reality visual effect. Specifically, the HUD may be applied to scenarios such as augmented reality (AR) navigation, adaptive driving, and lane departure warning. HUDs include, but are not limited to, windshield (W) HUDs, augmented reality head-up displays (AR-HUDs), etc.

[0066] In yet another possible implementation, the light source module in the present application can alternatively be integrated into an in-vehicle display. See Fig. 1c. The in-vehicle display can be installed on the seat back of the vehicle, at the passenger seat position, etc. The installation location of the in-vehicle display is not limited in the present application.

[0067] In yet another possible application scenario, the light source module in the present application may alternatively be integrated into a near eye display (NED) device. The NED device may be, for example, an AR device or a virtual reality (VR) device. The AR device may include, but is not limited to, AR glasses or an AR helmet, and the VR device may include, but is not limited to, VR glasses or a VR helmet. See FIG. 1d. AR glasses are used as an example. A user may wear an AR glasses device for gaming, video viewing, virtual meetings, video shopping, telemedicine, or remote training. Other scenarios are not listed herein.

[0068] In yet another possible application scenario, the light source module in this application can be integrated into a projector, see Fig. 1e, which can project an image onto a wall or a projection screen.

[0069] It should be understood that the above-mentioned possible application scenarios are merely examples, and the light source module can be applied to any scenario with high requirements for light source temperature stability. For example, the light source module provided in this application can be further applied to a display as a backlight source. See FIG. 1f. For example, the light source module can also be applied to a cosmetic medical device, etc.

[0070] As described in the background art, the central wavelength of the optical signal emitted by the light source in the existing light source module changes with temperature, and the light emission power of the light source decreases with increasing temperature.

[0071] In consideration of this, the present application provides a light source module, which can maintain the light source of the light source module in a stable temperature range, which helps to improve the stability of the light emission power of the light source module and the central wavelength of the transmitted optical signal.

[0072] Based on the foregoing, the light source module provided in the present application will be described in detail hereinafter with reference to FIGS.

[0073] 2 is a schematic diagram of a structure of a light source module according to an embodiment of the present application. The light source module may include a light source component 201, a cooling component 202, and a containment structure 203. The containment structure 203 includes at least one first sidewall 2031. The first sidewall 2031 contains at least a portion of the cooling component 202. It should be noted that "contains" in this application means that the first sidewall 2031 is disposed around (or outside of) the cooling component 202.

[0074] In a possible implementation, the light source component 201 and the cooling component 202 are stacked. 2It may also be understood that the contact between the light source component 201 and the cooling component 202 may be direct or indirect. For example, indirect contact may mean that a sandwich structure is disposed between the light source component 201 and the cooling component 202, or that a thermally conductive adhesive (also called thermal glue) is filled between them. The "contact" in the following description may also be understood as direct or indirect contact. Thermally conductive adhesives are also sometimes called thermal glue, thermally conductive silica gel, thermally conductive silicone rubber, thermally conductive silicone adhesive, or thermally conductive silicone. Organic silica gel is the main material of thermally conductive adhesives. Thermally conductive adhesives are obtained by mixing organic silica gel with added polymer materials such as fillers and thermally conductive materials. Thermally conductive adhesives have good thermal conductivity and electrical insulation properties.

[0075] In a possible implementation, the first side wall 2031 may be in contact with the cooling component 202, or there may be a certain gap between the first side wall 2031 and the cooling component 202. FIG. 2 shows an example in which there is a certain gap between the first side wall 2031 and the cooling component 202. It can be understood that a smaller gap between the first side wall 2031 and the cooling component 202 indicates a better effect of blocking heat conduction to the light source component 201 by the first side wall 2031. In other words, when the structure of the cooling component 202 is fixed, a larger width L of the first side wall 2031 indicates a better effect of blocking heat conduction to the light source component 201 by the first side wall 2031.

[0076] 2, it should be noted that the containment structure 203 includes two first side walls 2031, and the two first side walls 2031 are disposed on two sides of the cooling component 202. The number of first side walls 2031 included in the containment structure 203 is not limited in the present application.

[0077] Based on the above-mentioned light source module, the heat of the light source component can be cooled by using a cooling component, and the heat conduction to the light source component can be further weakened or blocked (in other words, stopped) by using a storage component, so that the light source component can stay in a stable temperature range, and the light source component can further maintain a stable center wavelength and a stable light emission power.

[0078] 2 are described individually to provide an example specific implementation. For ease of description, the light source components, cooling components, and containment structures hereinafter are not numbered.

[0079] 1. Light Source Component

[0080] In a possible implementation, the light source component may include a light source and a substrate. Specifically, the light source is disposed on the substrate, which may alternatively be understood as the light source and the substrate being stacked. The substrate drives the light source to emit an optical signal.

[0081] For example, the light source may be a semiconductor laser, which may include, but is not limited to, a laser diode (LD). Laser diodes have advantages such as high efficiency, small size, and long life. Specifically, for example, the light source may be a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), or a diode pumped solid state laser (DPSS). The substrate may be a ceramic substrate or a printed circuit board (PCB).

[0082] It can be understood that a light source generates a large amount of heat during operation, which may cause a temperature change of the light source, or the temperature change of the light source may be caused by a temperature change of the environment of the light source module. At different temperatures, the center wavelength of the optical signal emitted by the light source is different. For example, at a temperature T1°C, the center wavelength of the optical signal emitted by the light source is λ1, and at a temperature T2°C, the center wavelength of the optical signal emitted by the light source is λ2, where λ1 and λ2 may be different. In order to stabilize the center wavelength of the optical signal output by the light source, effective heat dissipation must be performed in the light source.

[0083] 2. Cooling components

[0084] In a possible implementation, the cooling component can be, for example, a thermoelectric cooler (TEC). Thermoelectric coolers are based on the Peltier effect of semiconductor materials. The Peltier effect is a phenomenon in which, when a direct current flows through a dipole composed of two semiconductor materials, one end absorbs heat and the other end releases it. The semiconductor material of the TEC primarily comprises heavily doped N-type and P-type bismuth telluride.

[0085] Figure 3 is a schematic diagram of the cooling principle of a TEC according to the present application. The TEC includes a pair (set) of P-type and N-type semiconductors connected together by electrodes. The P-type and N-type semiconductor pair is sandwiched between two ceramic electrodes. When a current flows through the TEC, heat generated by the current is transferred from one side of the TEC to the other. In this case, a "hot" end and a "cold" end are formed on the TEC.

[0086] In a possible implementation, the "cold" end of the TEC is configured to contact the light source module and conduct heat generated by the light source module to the "cold" end of the TEC to dissipate heat from the light source module. Furthermore, the light source module can be in direct or indirect contact with the "cold" end of the TEC. For example, a thermally conductive adhesive or another sandwich structure capable of conducting heat is filled between the light source module and the "cold" end of the TEC.

[0087] It should be noted that the aforementioned TEC is a possible example of a cooling component. The specific structure of the cooling component is not limited in this application. Any structure capable of conducting heat of the light source component can be called a cooling component.

[0088] 3. Storage structure

[0089] In possible implementations, the containment structure can include at least one first sidewall that can house a portion of the cooling component and can be configured to attenuate or block heat transfer to the light source component.

[0090] Further, optionally, the first side wall may be of a "strip" type, which may also be referred to as a "line" type. Alternatively, the first side wall may be of an "L" type, in which case the "L" type may include, but is not limited to, a regular "L" type or an irregular "L" type (sometimes referred to as an "L-shaped" type), for example, an "L" type with a circular arc, etc. Alternatively, the first side wall may be of a "Π" type, etc. The specific shape of the first side wall is not limited in the present application. The structure of the "strip" type first side wall is easy to manufacture, which simplifies packaging of the light source module.

[0091] For example, the storage structure includes two first side walls. Specifically, the two "strip"-shaped first side walls may be parallel (see FIG. 4a), or the two first side walls may be perpendicular (see FIG. 4b). There may be a specific gap between the two perpendicular side walls, or the two side walls may be in contact. This is not limited in the present application. Alternatively, there may be a specific included angle between the two side walls (see FIG. 4c or FIG. 4d). Two side walls with a specific included angle between them may be in contact, or there may be a specific gap. This is not limited in the present application. Please note that the positional relationship between the two first side walls provided above is merely an example, and the positional relationship between the two first side walls is not limited in the present application.

[0092] For example, the storage structure includes two first side walls. Specifically, the two first side walls of the "L" or "L-shaped" shape may form a "square" shape with an opening (see FIG. 4e or FIG. 4f). The area of ​​the opening may be used for the passage of an optical signal, etc. As another example, the two first side walls of the "Π" shape may also form a "square" with an opening (see FIG. 4g).

[0093] It should be noted that the number of first side walls included in the containment structure is not limited in this application, and the above description is only a possible example in which the containment structure includes two first side walls.

[0094] For example, the first side wall may be of a "strip" type, and one first side wall may accommodate one side of the cooling component. For example, the first side wall may be of a "strip" type. Two first side walls may accommodate two sides of the cooling component, specifically, two opposing sides (see FIG. 4a or FIG. 4c) or two connected sides (see FIG. 4b or FIG. 4d).

[0095] To make it easier to describe the solution, an example will be used hereinafter in which the first side walls are of the "strip" type and the containment structure comprises two first side walls.

[0096] In a possible implementation, the storage structure further includes a bottom plate. FIG. 5a is a schematic diagram of the positional relationship between the first side wall and the bottom plate according to the present application. The bottom plate is in contact with the first ends of the two first side walls separately. It can be understood that the first side wall can be in direct contact with the bottom plate. Alternatively, the first side wall can be in indirect contact with the bottom plate. For example, a structural adhesive or another insulating sandwich structure can be filled between the bottom plate and the first side wall. Note that in an actual product design, the bottom plate may or may not belong to the light source module. If the bottom plate does not belong to the light source module, a structure similar to the bottom plate and matching the aforementioned light source module may exist in the product. The structure similar to the bottom plate may have other functions in addition to matching the light source module, and is also referred to herein as a "bottom plate." The light source module and the bottom plate may be collectively referred to as a light module. It should be noted that structural adhesives are typically adhesives characterized by high strength (e.g., compressive strength greater than 65 megapascals (MPa), steel-to-steel bond strength greater than 30 MPa, and shear strength greater than 18 MPa), high load capacity, resistance to aging, fatigue, and corrosion, and stable performance over an expected lifetime.

[0097] Further, optionally, the second end of the first side wall is connected to the light source component. For details, see FIG. 5b. In one possible embodiment, the second end of the first side wall is connected to the light source component using a structural adhesive, and the second end of the first side wall is opposite the first end of the first side wall. Based on this connection mode, the first side wall and the light source component are connected using a structural adhesive. This helps improve the strength of the light source module and can further increase the heat of the light source component that is transferred to the outside of the light source component. In another possible embodiment, the second end of the first side wall is connected to the light source component through welding. By welding the second end of the first side wall to the light source component, the strength of the light source module is improved.

[0098] In possible implementations, the first side wall may be a single-layer wall (as shown in FIG. 5b) or a multi-layer wall as shown in FIG. 5c. FIG. 5c shows an example in which the first side wall is a two-layer wall. It should be noted that the number of layers of the first side wall included in the containment structure is not limited in the present application. It can be understood that a larger number of layers of the first side wall indicates a thicker first side wall and a better effect of blocking heat conduction to the light source component by the first side wall.

[0099] In a possible implementation, the thermal conductivity of the material of the bottom plate is higher than that of the material of the first side wall. The first side wall formed of a material with low thermal conductivity can effectively weaken or block heat conduction to the light source component. Furthermore, the bottom plate formed by using a material with high thermal conductivity can further conduct heat from the light source component outward, i.e., can improve the heat dissipation effect of the light source component.

[0100] Furthermore, optionally, the thermal conductivity of the material of the first sidewall is smaller than a second threshold, where the second threshold is related to the cooling range of the cooler and the heat returned by the first sidewall. Furthermore, the second threshold must satisfy the requirement that the temperature control effect of the TEC does not exceed the target range due to the heat returned to the light source component through the first sidewall. It can also be understood that the thermal conductivity of the material of the first sidewall can reduce the heat conducted to the light source component as much as possible. Even if a small amount of heat is conducted to the light source component, effective temperature control can be achieved by re-cooling the cooling component. Therefore, the light source component is within a stable temperature range.

[0101] Specifically, the material of the first sidewall may be a thermal insulating material, and / or the material of the bottom plate may be a thermally conductive material. For example, the material of the first sidewall may include, but is not limited to, any one or a combination of glass or acrylic. The material of the bottom plate may include, but is not limited to, any one or a combination of Kovar alloy, tungsten copper alloy, Invar, copper, etc.

[0102] It should be noted that the materials of the first side wall and the bottom plate are only examples. The materials of the first side wall and the bottom plate are not limited in this application. Any material used by the bottom plate to conduct heat from the light source component outward, and / or a material used by the first side wall to weaken or block heat conduction to the light source component, shall fall within the protection scope of this application.

[0103] Depending on whether the bottom plate includes an opening or not, the following provides two possible positional relationships between the containment structure and the cooling component in different cases as examples.

[0104] Case 1: The bottom plate contains an opening.

[0105] 6a is a schematic diagram of the positional relationship between the bottom plate and the cooling component according to the present application. The bottom plate includes an opening for the cooling component to pass through. It can also be understood that the cooling component can contact the support component through the opening in the bottom plate. Furthermore, a thermally conductive adhesive is filled between the cooling component and the support component. Because the cooling component passes through the opening, the heat dissipation path can be shortened, which helps to improve the temperature stability of the light source component.

[0106] Case 2: There is no opening in the bottom plate.

[0107] 6b is a schematic diagram of another positional relationship between the base plate and the cooling component according to the present application. The base plate may be in contact with the cooling component. To further improve the heat dissipation effect of the light source component, a thermally conductive adhesive is filled between the base plate and the cooling component.

[0108] In a possible implementation, the containment structure further includes at least one second sidewall. The at least one second sidewall accommodates at least a portion of the first sidewall. See FIG. 7a. For example, the containment structure includes two second sidewalls. The containment structure includes two second sidewalls (second sidewall A and second sidewall B) and two first sidewalls (first sidewall A and first sidewall B). The second sidewall A accommodates the first sidewall A, and the second sidewall B accommodates the first sidewall B.

[0109] It should be noted that the first side wall may or may not be in contact with the second side wall. When the first side wall is not in contact with the second side wall, it can be understood that the heat returning through the second side wall is dissipated through the air. In this case, the first side wall further improves the effect of blocking heat conduction to the light source component.

[0110] 7b is a schematic diagram of another storage structure according to an embodiment of the present application. The storage structure may include a first side wall, a second side wall, and a bottom plate. A first end of the first side wall is in contact with the bottom plate, and a first end of the second side wall is also in contact with the bottom plate. In a possible implementation, the bottom plate and the second side wall may be integrally formed. The integral structure formed by the second side wall and the bottom plate may be referred to as a package housing, and the first side wall and the cooling component may be packaged in the package housing.

[0111] In a possible implementation, the second sidewall is taller than the first sidewall. Furthermore, the second sidewall may be taller than the light source component or may be the same height as the light source component, thereby the second sidewall may further include the light source component. It may also be understood that the light source component may be packaged in a package housing. See FIG. 8.

[0112] In possible implementations, the material of the second sidewall may include, but is not limited to, any one or any combination of Kovar alloy, tungsten copper alloy, Invar, copper, and the like.

[0113] In a possible implementation, there is a gap between the second sidewall and the substrate of the light source component, and the width of the gap is, for example, 0.5 millimeters (mm) or more. In this way, heat conduction to the light source component can be further blocked or weakened. In addition, the space required for thermal expansion of the substrate and the second sidewall is ensured.

[0114] In a possible implementation, the difference between any two of the coefficients of thermal expansion of the substrate of the light source component, the coefficient of thermal expansion of the second sidewall, and the coefficient of thermal expansion of the first sidewall is less than a first threshold. For example, the first threshold may be 10 ppm. For details, see the substrate displacement tolerance. In this manner, it can be ensured that the coefficients of thermal expansion of the first sidewall, the second sidewall, and the substrate are matched. This helps avoid problems such as fracture or warpage, which occur at different temperatures and are caused by differences between the coefficients of thermal expansion of the first sidewall, the substrate, and the second sidewall. Note that it is preferable that the coefficients of thermal expansion of the first sidewall, the substrate, and the second sidewall are close to each other.

[0115] Furthermore, optionally, the light source module may further include a shielding cover (see FIG. 8), which is electrically connected to the second end of the bottom plate or the second side wall. In this way, electromagnetic radiation can be blocked for the light source module.

[0116] In a possible implementation, a component that supports the light source module and dissipates heat from the light source component may be called a support component. The support component may be a component specialized for supporting the light source module and dissipating heat from the light source module, such as a thermally conductive support. Alternatively, the support component may be another structure surrounding the light source module that is capable of supporting the light source module and dissipating heat from the light source module. It may also be understood that the use of a support component can dissipate heat in the light source module, thereby ensuring that the light source is at a stable temperature.

[0117] Based on the above-mentioned Case 1, a thermally conductive adhesive is filled between the cooling component and the support component, and a structural adhesive is filled between the non-opening area of ​​the bottom plate and the support component. For details, see FIG. 6a. The thermally conductive adhesive is filled between the cooling component and the support component, so that the cooling component can effectively conduct heat from the light source component to the outside. The structural adhesive is filled between the non-opening area of ​​the bottom plate and the support component, which helps improve the strength of the light source module.

[0118] Based on the aforementioned Case 2, the thermal conductive adhesive may also be filled between the bottom plate and the supporting component (see FIG. 6b) to further improve the heat dissipation effect on the light source component.

[0119] In another possible implementation, the component used to dissipate the heat conducted by the light source component (in other words, to conduct the heat of the light source module to the outside of the light source module) may be a heat sink. A heat sink is any object capable of dissipating heat from the light source component, and the temperature of the heat sink does not change with the amount of heat transferred to the heat sink. The heat sink may include, but is not limited to, objects such as the air and the ground, or may be a copper pillar with high thermal conductivity.

[0120] Based on the above, the following provides two specific implementations of the above light source module, which can further understand the structure of the above light source module and the implementation process of the heat dissipation of the light source module. It should be noted that, unless there is a special description or logical contradiction, the above functional components and structures can be combined according to internal logical relationships to form other possible ion trap systems. The two specific implementations of the light source module provided below are merely examples.

[0121] 9 is a schematic diagram of the structure of another light source module according to an embodiment of the present application. This light source module may include a light source 901, a substrate 902, a cooling component 903, and a storage structure 904 (the identifier of which is not shown in the figure). For example, the storage structure 904 includes two first side walls 9041. Furthermore, the light source 901, the substrate 902, and the cooling component 903 are stacked. Furthermore, optionally, the storage structure 904 may further include a bottom plate 9042. The two first side walls 9041 and the bottom plate 9042 house the cooling component 903. Specifically, a first end of the first side wall 9041 is in contact with the bottom plate 9042 (this contact may be direct or indirect). A second end of the first side wall 9041 is connected to the substrate 902 by using a structural adhesive. A thermally conductive adhesive is filled between the cooling component 903 and the base plate 9042, and also between the base plate 9042 and the support component.

[0122] Furthermore, optionally, the storage structure 904 may further include a second side wall 9043, with a first end of the second side wall 9043 in contact with the bottom plate 9042. In an example, the two second side walls 9043 and the bottom plate 9042 are integrally formed, and the structure obtained through integration may be referred to as a package housing.

[0123] Furthermore, optionally, the light source module may further include a shielding cover 905 , which is electrically connected to a second end of the second side wall 9043 .

[0124] Please note that for a detailed description of the functional components and structures in Figure 9, please refer to the related description above, and the details will not be described here.

[0125] Based on the above-mentioned FIG. 9, the heat conduction direction of the light source 901 can be represented by an arrow. The heat conduction mainly includes heat conduction in the heat dissipation path and heat conduction in the return path. In the heat dissipation path, the heat of the light source 901 is transferred to the support component through the substrate 902, the cooling component 903, and the thermally conductive adhesive. The support component dissipates the heat from the light source module in all directions, and the heat conduction direction of part of the heat is the light source 901. 1 In the return path, heat conduction to the light source can be effectively blocked by the first side wall 9041. This helps to maintain the temperature stability of the light source. It can be understood that lower temperature heat in the return path indicates lower heat conduction to the light source and higher reliability of the light source module.

[0126] It should be noted that in the heat dissipation path, a thermally conductive adhesive is used to connect or bond the structures together to ensure good heat dissipation, and in the return path, a structural adhesive is used to connect or bond the structures together to ensure bond strength.

[0127] 10 is a schematic diagram of the structure of yet another light source module according to an embodiment of the present application. This light source module may include a light source 1001, a substrate 1002, a cooling component 1003, and a storage structure 1004 (the identifier of which is not shown in the figure). For example, the storage structure 1004 includes two first side walls 10041. Furthermore, the light source 1001, the substrate 1002, and the cooling component 1003 are stacked. Furthermore, optionally, the storage structure 1004 further includes a bottom plate 10042, which in this case includes an opening. The cooling component 1003 contacts the support component through the opening in the bottom plate 10042. Furthermore, optionally, a thermally conductive adhesive is filled between the support component and the cooling component 1003 passing through the opening in the bottom plate 10042. Furthermore, optionally, a structural adhesive is filled between the non-opening region of the bottom plate and the support component. A first end of the first sidewall 10041 is in contact with the bottom plate 10042, and a second end of the first sidewall 10041 is connected to the substrate 1002 by using a structural adhesive.

[0128] Furthermore, optionally, the storage structure 1004 may further include a second side wall 10043, a first end of which is in contact with the bottom plate 10042. In an example, the two second side walls 10043 and the bottom plate 10042 are integrally formed, and the structure obtained through integration may be referred to as a package housing.

[0129] Furthermore, optionally, the light source module may further include a shielding cover 1005 , which is electrically connected to a second end of the second side wall 10043 .

[0130] Please note that for a detailed description of the functional components and structures in Figure 10, please refer to the related description above, and the details will not be described here.

[0131] Based on the light source module shown in Fig. 10, the cooling component can directly conduct the heat of the light source to the supporting component by using thermally conductive adhesive. Because the heat dissipation path is short, the effect of conducting the heat of the light source to the supporting component can be further improved.

[0132] It should be understood that the shapes of the structural adhesive and the thermally conductive adhesive in the accompanying drawings in the foregoing embodiments are examples only, which are not limiting in the present application.

[0133] Based on the above-described structure and function principle of the light source module, the present application may further provide a detection device. The detection device may include any one of the light source modules in the above-described embodiments. In other words, the light source module provided in the embodiments of the present application may be used for all detection devices that need to control the temperature stability of the light source in the light source module.

[0134] In a possible implementation, the detection device may further include another module, e.g., a receiving module, configured to receive an echo signal corresponding to the optical signal, in which case the echo signal is used to obtain association information of the target detected by the detection device.

[0135] Example 1: The detection device may be a lidar device. FIG. 11 is a schematic diagram of a structure of a lidar device according to an embodiment of the present application. The lidar device may include a light source module 1101 and a receiving module 1102 in any one of the aforementioned embodiments. Optionally, the lidar device may further include a processing module 1103. The light source module 1101 is configured to transmit an optical signal to a detection area, where the optical signal is transmitted by a target in the detection area to obtain an echo signal. The receiving module 1102 is configured to receive the echo signal. Optionally, the receiving module 1102 may further be configured to perform optical-to-electrical conversion on the echo signal to obtain an electrical signal used to determine target association information. The receiving module 1102 further transmits the electrical signal to the processing module 1103. The processing module 1103 may determine target association information based on the received electrical signal. The target association information may include, but is not limited to, target distance information, target direction, target velocity, and / or target grayscale information.

[0136] In a possible implementation, the receiving module may include an optical receiving lens and may further include a detector. The optical receiving lens is used to collect as many echo signals as possible and transmit the collected echo signals to the detector. The optical receiving lens includes at least one lens. The lens in the optical receiving lens may be a single spherical lens or a combination of multiple spherical lenses (e.g., a combination of concave lenses, a combination of convex lenses, or a combination of convex and concave lenses), or a single aspherical lens or a combination of multiple aspherical lenses. The combination of multiple spherical and / or aspherical lenses helps improve the image quality of the lidar device and reduces aberrations in the lidar device. It may be understood that the convex and concave lenses may be of various types. For example, convex lenses include biconvex lenses, plano-convex lenses, and meniscus lenses, and concave lenses include biconcave lenses, plano-concave lenses, and meniscus lenses.

[0137] Furthermore, optionally, the lens material of the optical receiving lens may be an optical material such as glass, resin, or quartz. If the lens material is resin, the weight of the lidar device may be reduced. If the lens material is glass, the image quality of the lidar device may be further improved. Furthermore, to effectively suppress temperature drift, the optical lens includes at least one lens made of glass material.

[0138] In possible implementations, the detector may include, but is not limited to, a single-photon avalanche diode (SPAD) array, a digital silicon photomultiplier (SiPM) array, an avalanche photodiode (APD), etc.

[0139] In possible implementations, a processing module may include one or more processing units. A processing unit may be, for example, a central processing unit (CPU) or another general-purpose processor, a field programmable gate array (FPGA), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a controller, a digital signal processor (DSP), an application specific integrated circuit (ASIC), another programmable logic device, a transistor logic device, a hardware component, or any combination thereof. A general-purpose processor may be a microprocessor or any conventional processor. Separate processing units may be separate components or may be integrated into one or more processors.

[0140] It should be noted that the lidar device structures described above are merely examples. In other possible examples, the lidar device may include more, fewer, or different modules, and each module may include more, fewer, or different components.

[0141] Example 2: The detection device may be a fusion sensor. The fusion sensor may have the functions of the aforementioned lidar device and camera. In a possible implementation, the fusion sensor may further include an image acquisition module for acquiring image information.

[0142] It should be noted that the above two examples of the detection device are only used to facilitate the description of the solution, and the specific shape and name of the detection device are not limited in this application.

[0143] Based on the above-described structure and function principle of the detection device, the present application may further provide a terminal device, which may include the detection device in any one of the above-described embodiments. Optionally, the terminal device may further include a processor configured to plan a driving route based on the association information and / or image information of the target.

[0144] For example, the terminal device may include, but is not limited to, a vehicle (e.g., an unmanned vehicle, an intelligent vehicle, an electric vehicle, or a digital vehicle), a robot, a surveying / mapping device, an unmanned aerial vehicle, a smart home device (e.g., a robot vacuum cleaner), a smart manufacturing device (e.g., an industrial device), a smart transportation device (e.g., an automated guided vehicle (AGV), an unmanned transport vehicle, or a truck), a ship, etc.

[0145] In the following, a functional block diagram of a vehicle in which a detection device is installed (in other words, integrated with a detection device) will be described using a vehicle as an example. In the vehicle structure, the detection device is sometimes called a sensor system.

[0146] 12 is an exemplary functional block diagram of a vehicle according to the present application. Components coupled to or included in vehicle 1200 may include propulsion system 110, sensor system 120, control system 130, peripheral devices 140, power source 150, computer system 160, and user interface 170. The components of vehicle 1200 may be configured to interconnect with each other and / or with other components coupled to the various systems for operation. For example, power source 150 may provide power to all components of vehicle 1200. Computer system 160 may be configured to receive data from and control propulsion system 110, sensor system 120, control system 130, and peripheral devices 140. Computer system 160 may be further configured to display generated images on user interface 170 and receive input from user interface 170.

[0147] Propulsion system 110 powers the movement of vehicle 1200. Propulsion system 110 may include an engine / motor 114, an energy source 113, a transmission 112, and wheels / tires 111. In addition, propulsion system 110 may include additional or alternative components other than those shown in FIG. 11 , which is not particularly limited in this application.

[0148] Sensor system 120 may include several sensors for sensing information about the environment of vehicle 1200. For example, the sensors of sensor system 120 may include, but are not limited to, a Global Positioning System (GPS) 126, an Inertial Measurement Unit (IMU) 125, a millimeter-wave radar 124, a lidar device 123, a camera 122, and a brake 121 used to correct the position and / or orientation of the sensors. Millimeter-wave radar 124 may sense targets in the environment surrounding vehicle 1200 using radio signals. In some embodiments, in addition to sensing targets, millimeter-wave radar 124 may also be used to sense the speed and / or direction of movement of the targets. Lidar device 123 may sense targets in the environment of vehicle 1200 by using a laser. In some embodiments, lidar device 123 may include one or more laser sources, a scanner, one or more detectors, and other system components. The camera 122 may be configured to capture multiple images of the environment surrounding the vehicle 1200. The camera 122 may be a static camera or a video camera.

[0149] Sensor system 120 may also include sensors of internal systems of vehicle 1200 being monitored (e.g., on-board air quality monitor, fuel gauge, oil temperature gauge). Sensor data from one or more of these sensors may be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). Such detection and identification is an important function for the safe operation of vehicle 1200. Sensor system 120 may also include other sensors, which are not particularly limited in this application.

[0150] The GPS 126 may be any sensor used to estimate the geographic position of the vehicle 1200. In this case, the GPS 126 may include a transceiver that estimates the position of the vehicle 1200 relative to the Earth based on satellite positioning data. In an example, the computer system 160 may be configured to estimate the road the vehicle 1200 is traveling on by using the GPS 126 while referring to map data. The IMU 125 may be configured to sense changes in the position and orientation of the vehicle 1200 based on inertial acceleration and any combination thereof. In some examples, the combination of sensors in the IMU 125 may include, for example, an accelerometer and a gyroscope. In addition, there are other possible combinations of sensors in the IMU 125.

[0151] Control system 130 controls the operation of vehicle 1200 and the components of vehicle 1200. Control system 130 may include various components, including steering unit 136, throttle 135, braking unit 134, sensor fusion algorithm 133, computer vision system 132, route control system 131, and obstacle avoidance system 137. Steering system 136 is operable to adjust the direction of travel of vehicle 1200. For example, in an embodiment, steering system 136 may be a steering wheel system. Throttle 135 is configured to control the operating speed of engine 114 to further control the speed of vehicle 1200. Control system 130 may additionally or alternatively include components other than those shown in FIG. 11 , which are not particularly limited in this application.

[0152] The brake unit 134 is used to control the deceleration of the vehicle 1200. The brake unit 134 may slow the wheels 111 using friction. In another embodiment, the brake unit 134 may convert the kinetic energy of the wheels 111 into electric current. The brake unit 134 may alternatively reduce the rotational speed of the wheels 111 in another manner to control the speed of the vehicle 1200. The computer vision system 132 may be operated to process and analyze images captured by the camera 122 to recognize targets and / or features in the environment surrounding the vehicle 1200. The targets and / or features may include traffic signals, road boundaries, and obstacles. The computer vision system 132 may use target recognition algorithms, structure from motion (SFM) algorithms, video tracking, and other computer vision technologies. In some embodiments, the computer vision system 132 may be configured to map the environment, track targets, estimate the speed of targets, etc. The route control system 131 is configured to determine a route for the vehicle 1200. In some embodiments, the route control system 131 31 may determine a route for vehicle 1200 based on data from sensor system 120, GPS 126, and one or more predetermined maps. Obstacle avoidance system 137 is configured to recognize, evaluate, and avoid or otherwise circumvent potential obstacles in the environment of vehicle 1200. In some cases, control system 130 may include additional or alternative components other than those shown and described, or some of the aforementioned components may not be included.

[0153] Peripheral device 140 may be configured to enable vehicle 1200 to interact with external sensors, another vehicle, and / or a user. Peripheral device 140 may include a wireless communication system 144, a touchscreen 143, a microphone 142, and / or a speaker 141. Peripheral device 140 may additionally or alternatively include components other than those shown in FIG. 11 , which is not particularly limited in this application.

[0154] In some embodiments, peripheral device 140 provides a means for a user of vehicle 1200 to interact with user interface 170. For example, touchscreen 143 may provide information to the user of vehicle 1200. User interface 170 may further operate touchscreen 143 to receive input from the user. In other cases, peripheral device 140 may provide a means for vehicle 1200 to communicate with other devices in the vehicle. For example, microphone 142 may receive sound (e.g., a voice command or another sound input) from the user of vehicle 1200. Similarly, speaker 141 may output sound to the user of vehicle 1200.

[0155] The wireless communication system 144 may communicate wirelessly with one or more devices directly or through a communication network. For example, the wireless communication system 144 may use a variety of communication technologies, including code division multiple access (CDMA), EVD, OThe wireless communication system 144 may use 3G cellular communications, such as global system for mobile communications (GSM) / general packet radio service (GPRS), or 4G cellular communications, e.g., long term evolution (LTE), or 5G cellular communications. The wireless communication system 144 may communicate with a wireless local area network (WLAN) through Wi-Fi. In some embodiments, the wireless communication system 144 may communicate directly with devices through an infrared link, Bluetooth, or ZigBee. Various vehicle communication systems, such as other wireless protocols, for example, the wireless communication system 144, may include one or more dedicated short range communications (DSRC) devices, which may include public and / or private data communications between vehicles and / or roadside stations.

[0156] Power source 150 may be configured to provide power to some or all of the components of vehicle 1200. As such, power source 150 may include, for example, rechargeable lithium-ion or lead-acid batteries. In some examples, one or more battery packs may be configured to provide the power. Other power source materials and configurations are possible. In some examples, power source 150 and energy source 113 may be implemented together, as in some all-electric vehicles. The components of vehicle 1200 may be configured to interconnect with other components internal and / or external to their respective systems. As such, the components and systems of vehicle 1200 may be communicatively linked together via a system bus, a network, and / or another connection mechanism.

[0157] Some or all of the functions of vehicle 1200 are controlled by computer system 160. Computer system 160 may include at least one processor 161. Processor 161 executes instructions 1631 stored on a non-transitory computer-readable medium, such as memory 163. Computer system 160 may be multiple computing devices that control individual components or subsystems of vehicle 1200 in a distributed manner.

[0158] Processor 161 may be any conventional processor, such as a central processing unit (CPU). Optionally, the processor may be a dedicated device, such as an application-specific integrated circuit (ASIC) or another hardware-based processor. While FIG. 12 functionally depicts the processor, memory, and other components of computer system 160 in the same block, those skilled in the art will understand that a processor, computer, or memory may actually include multiple processors, computers, or memories, which may or may not be housed in the same physical housing. For example, memory may be a hard disk drive or other storage medium located in a different housing than computer system 160. Thus, reference to a processor or computer is understood to include reference to a set of processors or computers or memories, which may or may not operate in parallel. Instead of using a single processor to perform the steps described herein, several components, such as a steering component and a deceleration component, may include respective processors. A processor performs only calculations related to the component's specific function.

[0159] In various aspects described herein, the processor may be located remotely from the vehicle and communicate wirelessly with the vehicle. In other aspects, some processes described herein are performed on a processor located within the vehicle, while others are performed by a remote processor, including performing the steps necessary for a single operation.

[0160] In some embodiments, memory 163 may include instructions 1631 (e.g., program logic) that may be executed by processor 161 to perform various functions of vehicle 1200, including those described above. Memory 163 may also include additional instructions, including instructions for transmitting data to, receiving data from, interacting with, and / or controlling one or more of propulsion system 110, sensor system 120, control system 130, and peripheral devices 140.

[0161] Memory 163 may store data such as road maps, route information, data detected by sensors, vehicle position, vehicle direction, vehicle speed, other such vehicle data, and other information, in addition to instructions 1631. Such information may be used by vehicle 1200 and computer system 160 during operation of vehicle 1200 in autonomous, semi-autonomous, and / or manual modes.

[0162] User interface 170 is configured to provide information to or receive information from a user of vehicle 1200. Optionally, user interface 170 may be included in one or more input / output devices in the set of peripheral devices 140, such as wireless communication system 144, touchscreen 143, microphone 142, and speaker 141.

[0163] Computer system 160 may control functions of vehicle 1200 based on inputs received from various subsystems (e.g., propulsion system 110, sensor system 120, and control system 130) as well as from user interface 170. For example, computer system 160 may utilize inputs from control system 130 to control steering unit 136 to avoid obstacles detected by sensor system 120 and obstacle avoidance system 137. In some embodiments, computer system 160 is operable to provide control over many aspects of vehicle 1200 and its subsystems.

[0164] Optionally, one or more of the aforementioned components may be detached from or associated with vehicle 1200. For example, memory 163 may be partially or completely detached from vehicle 1200. The aforementioned components may be communicatively coupled in a wired and / or wireless manner.

[0165] It should be noted that the vehicle function framework shown in Figure 12 is merely an example. In other examples, vehicle 1200 may include more, fewer, or different systems, and each system may include more, fewer, or different components. Additionally, the systems and components shown may be combined or divided in any manner, and this is not particularly limited in this application.

[0166] Based on the above-described structure and function principle of the light source module, the present application may further provide an optical display device. The optical display device may include any one of the light source modules described above. In other words, the light source module provided in the embodiments of the present application may be used for all optical display devices that need to control the temperature stability of the light source in the light source module.

[0167] For example, optical display devices may include, but are not limited to, in-vehicle displays, HUDs, NED devices, projectors, and smart home devices (e.g., smart desk lamps, sound systems, smart lighting systems, appliance control systems, home background music, home theater systems, intercom systems, or video surveillance).

[0168] In the embodiments of the present application, unless otherwise stated or logically contradictory, the terms and / or descriptions between different embodiments are consistent and can be cross-referenced, and the technical features in different embodiments can be combined into a new embodiment based on their internal logical relationships.

[0169] In this application, "uniform" does not mean absolutely uniform and allows for tolerance of engineering error. "Perpendicular" does not mean absolutely perpendicular and allows for tolerance of engineering error. "Higher" does not mean absolutely higher and allows for tolerance of engineering error. "At least one" means one or more, and "multiple" means two or more. The term "and / or" describes an association relationship between associated objects and indicates that three relationships may exist. For example, "A and / or B" may indicate the cases "only A is present," "both A and B are present," and "only B is present," where A and B may be singular or plural. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of a single item or multiple items. For example, "at least one of a, b, or c" may refer to a, b, c, "a and b," "a and c," "b and c," or "a, b, and c," where a, b, and c may be singular or plural. In the description of this application, the character " / " typically indicates an "or" relationship between associated objects. In the mathematical formulas of this application, the character " / " typically indicates a "division by" relationship between associated objects. Additionally, in this application, the word "example" is used to provide an example, illustration, or description. Any embodiment or design scheme described as an "example" in this application should not be described as more preferred or having more advantages than another embodiment or design scheme. Alternatively, it may be understood that the word "example" is intended to present concepts in a concrete manner and does not constitute a limitation on this application.

[0170] It can be understood that various numbers in this application are used merely for distinction to facilitate description and are not intended to limit the scope of the embodiments of this application. It should be understood that the sequence numbers of the aforementioned processes do not imply an execution sequence. The execution sequence of those processes should be determined based on the functions and internal logic of those processes. Terms such as “first,” “second,” etc. are intended to distinguish between similar objects, but do not indicate a particular order or sequence. In addition, the terms “comprise,” “have,” and any variations thereof are intended to cover a non-exclusive inclusion, for example, including a series of steps or units. A method, system, product, or device that includes a list of steps or units is not necessarily limited to those explicitly listed steps and units, but rather may include other steps or units not explicitly listed or inherent to such process, method, product, or device.

[0171] Although the present application has been described with reference to specific features and embodiments thereof, it is apparent that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Correspondingly, this specification and the accompanying drawings are merely examples for describing the solutions defined by the appended claims, and any or all of the modifications, variations, combinations, or equivalents that cover the scope of the present application are to be considered.

[0172] It is apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit and scope of the present invention. This application is intended to cover such modifications and variations in the embodiments of the present application as long as they fall within the scope defined by the following claims and their equivalent technologies.

Claims

1. a light source component configured to transmit an optical signal; a cooling component stacked with the light source component; a containment structure including at least one first sidewall, the at least one first sidewall housing at least a portion of the cooling component; Equipped with the containment structure further includes a bottom plate, the bottom plate being in contact with the first end of the first side wall; a material of the first side wall is a thermal insulating material, a material of the bottom plate is a thermally conductive material, and a thermal conductivity of the material of the bottom plate is higher than a thermal conductivity of the material of the first side wall; the base plate includes an opening through which the cooling component is in contact with the support component; Light source module.

2. 2. The light source module of claim 1, wherein a second end of the first side wall is connected to the light source component by using a structural adhesive, and the second end of the first side wall is opposite the first end of the first side wall.

3. The light source module of claim 1 , wherein the storage structure further comprises at least one second side wall, the at least one second side wall accommodating at least a portion of the first side wall.

4. The light source module of claim 3 , wherein the at least one second sidewall further houses at least a portion of the light source component.

5. The light source module according to claim 3 , wherein the bottom plate and the second side wall are integrally formed.

6. The light source module according to claim 3 , wherein the second side wall is higher than the first side wall.

7. The light source module according to claim 1 , wherein the first side wall is of a "strip" type or an "L" type.

8. The light source module according to claim 3 , further comprising a shielding cover, the shielding cover being electrically connected to the bottom plate or the second side wall.

9. a thermally conductive adhesive is filled between the base plate and the support component, the support component being configured to support the light source module; and / or The light source module according to claim 1 , wherein a thermally conductive adhesive is filled between the base plate and the cooling component.

10. a structural adhesive is provided between the non-opening area of ​​the base plate and the support component; and / or 9. The light source module according to claim 1, wherein a thermally conductive adhesive is filled between the cooling component and the support component.

11. the light source component comprises a light source and a substrate; The light source module according to claim 1 , wherein the substrate is configured to drive the light source to transmit the optical signal.

12. 12. The light source module of claim 11, wherein the difference between any two of the coefficient of thermal expansion of the substrate, the coefficient of thermal expansion of the second sidewall, and the coefficient of thermal expansion of the first sidewall is less than a first threshold value.

13. 13. The light source module of claim 11, wherein the light source comprises a laser diode.

14. 14. The light source module of claim 1, wherein the material of the first sidewall comprises any one of glass or acrylic, or a combination of the two.

15. A detection device comprising a light source module according to any one of claims 1 to 14.

16. the detection device further comprises a receiving module; The detection device of claim 15 , wherein the receiving module is configured to receive echo signals corresponding to optical signals, the echo signals being used to obtain association information of targets detected by the detection device.

17. The detection device of claim 15 or 16, wherein the detection device is a lidar device.

18. the detection device further comprises an image acquisition module; 17. The detection device of claim 15 or 16, wherein the image acquisition module is configured to acquire image information.

19. The detection device of claim 18 , wherein the detection device is a fusion sensor.

20. A terminal device comprising a detection device according to any one of claims 15 to 19 and a processor, The terminal device, wherein the processor is configured to plan a driving route based on the association information and / or image information of the target.

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